WO2023116475A1 - 浸没式液冷装置及液冷系统 - Google Patents

浸没式液冷装置及液冷系统 Download PDF

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Publication number
WO2023116475A1
WO2023116475A1 PCT/CN2022/138119 CN2022138119W WO2023116475A1 WO 2023116475 A1 WO2023116475 A1 WO 2023116475A1 CN 2022138119 W CN2022138119 W CN 2022138119W WO 2023116475 A1 WO2023116475 A1 WO 2023116475A1
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WO
WIPO (PCT)
Prior art keywords
cooling
liquid
installation groove
heat exchange
submerged
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2022/138119
Other languages
English (en)
French (fr)
Inventor
王剑
林彬
吕智超
王世锋
王玉龙
王瑞东
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing ByteDance Network Technology Co Ltd
Original Assignee
Beijing ByteDance Network Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing ByteDance Network Technology Co Ltd filed Critical Beijing ByteDance Network Technology Co Ltd
Priority to KR1020247024249A priority Critical patent/KR102921763B1/ko
Priority to JP2024538240A priority patent/JP7601318B2/ja
Priority to EP22909790.2A priority patent/EP4440266A4/en
Publication of WO2023116475A1 publication Critical patent/WO2023116475A1/zh
Priority to US18/750,358 priority patent/US12328842B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/207—Thermal management, e.g. cabinet temperature control
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20281—Thermal management, e.g. liquid flow control
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades

Definitions

  • Embodiments of the present disclosure generally relate to the technical field of electronic device cooling, and more particularly, relate to an immersion type liquid cooling device and a liquid cooling system including the immersion type liquid cooling device.
  • next-generation information and communication technologies such as 5G, cloud computing, big data, and artificial intelligence, and the real economy
  • data centers are gradually expanding from serving some enterprises to serving the entire society, becoming a new infrastructure.
  • the power consumption of the fan is reduced to achieve energy saving.
  • the air is cooled first, and then the cold air exchanges heat with the CPU of the server to cool down. Due to the low heat transfer efficiency and heat flux density of air, air-cooled servers have problems such as high cooling energy consumption, high noise, and low equipment density.
  • liquid cooling technology In order to solve the heat dissipation problem of ultra-high power density IT equipment, data centers have begun to adopt liquid cooling technology, using working fluid as the intermediate heat transfer medium to transfer heat from the heat-generating area to a distant place for cooling.
  • the cooling efficiency of liquid cooling technology is significantly higher than that of air cooling, which can effectively solve the heat dissipation problem of high-density servers, reduce the energy consumption of the cooling system and reduce noise.
  • conventional immersion liquid cooling systems In current data centers using liquid cooling solutions, conventional immersion liquid cooling systems generally consist of large cabinets (usually about 3 meters in length) equipped with one or more sets of cooling liquid distribution units (CDU). The cold liquid distribution unit is arranged on the left and right sides of the cabinet. The inventors of the present application have found that this conventional immersion liquid cooling system has various problems.
  • the cabinets of conventional immersion liquid cooling systems are bulky and difficult to operate and maintain.
  • the operator can only stand at the front of the cabinet, but cannot stand on the left and right sides of the cabinet for maintenance, which is difficult to operate.
  • the systems applied to server immersion heat dissipation basically use horizontal cabinets with a length of about 2-3 meters, which will bring many difficulties in implementation and operation and maintenance.
  • the purpose of the present disclosure is to provide an immersion liquid cooling device and a liquid cooling system including the immersion liquid cooling device, so as to at least partly solve the above-mentioned problems in the prior art.
  • an immersion liquid cooling device comprising: a cabinet, the cabinet includes a cooling tank and an installation tank integrated on the outer wall of the cooling tank, the cooling tank is used to accommodate the Cooled electronic equipment and a first cooling liquid, the mounting groove is used to accommodate the first cooling liquid, the cooling groove is in fluid communication with the mounting groove via a through hole; and a heat exchange module is adapted to be inserted into
  • the heat exchange module includes a coolant circulation pipeline, a heat exchanger, and a coolant driving device, and the coolant circulation pipeline is in fluid communication with the heat exchanger for feeding to the The heat exchanger provides the second coolant, the heat exchanger is used to cool the first coolant outside the heat exchanger with the second coolant inside, and the coolant driving device is used to make the first coolant A coolant circulates between the mounting tank and the cooling tank.
  • the cabinets in the submerged liquid cooling device according to the embodiments of the present disclosure are small in volume and light in overall weight, which solves the problem of difficult deployment. Operators can perform maintenance on all sides of the liquid cooling device, which makes it very easy to maintain the components of the internal electronic equipment.
  • the cabinet is integrated with the heat exchange module, the whole system does not need to be equipped with an additional cold liquid distribution unit, which is very flexible and convenient.
  • the through holes include a first group of through holes and a second group of through holes, wherein when the heat exchange module is inserted into the installation groove, the cooling liquid driving device is close to The first group of through holes is used to drive the first cooling liquid in the installation groove into the cooling groove, and make the first cooling liquid in the cooling groove pass through the first cooling groove.
  • Two sets of through holes flow into the mounting slot.
  • the first set of through-holes are located near the bottom side of the mounting slot, and the second set of through-holes are located near the top side of the mounting slot.
  • most of the first cooling liquid in the installation tank can circulate into the cooling tank, which improves the heat dissipation performance of the liquid cooling device.
  • the coolant driving device when the heat exchange module is inserted into the installation groove, the coolant driving device is close to the bottom side of the installation groove, and the heat exchanger is located at the cooling
  • the liquid driving device is arranged above and adjacent to the cooling liquid driving device.
  • the coolant driving device includes a plurality of circulation pumps, wherein each circulation pump in the plurality of circulation pumps are respectively close to corresponding through holes in the first group of through holes.
  • a plurality of circulation pumps respectively drive the first cooling liquid into the corresponding through holes, which can further increase the circulation speed of the first cooling liquid between the installation groove and the cooling groove.
  • the cabinet further includes an external frame and a top cover, the external frame is arranged around the cooling slot and the installation slot, the top cover is rotatably connected to the external frame and can be closed Switching between a closed state of the cooling slot and an open state of opening the cooling slot.
  • the top cover by using the top cover to close the first cooling tank, leakage of the first cooling liquid in the cooling tank can be reduced, and external pollutants can be prevented from entering the cooling tank.
  • the top cover includes a frame and a transparent portion surrounded by the frame.
  • the electronic equipment in the cooling tank can be observed through the transparent part, and the operating status of the components of the electronic equipment can be known in time.
  • a first sealing ring is provided on the side of the top cover facing the cooling groove, wherein when the top cover is in the closed state, the top cover and the cooling The grooves are sealed by the first sealing ring.
  • the use of the first sealing ring can improve the sealing performance between the top cover and the cooling tank, and further reduce the leakage of the first cooling liquid in the cooling tank.
  • the cabinet further includes a hydraulic driving device connected between the outer frame and the top cover for driving the top cover between the closed state and the open state. switch between states.
  • hydraulic drive means can be used to conveniently open and close the top cover.
  • the hydraulic driving device includes a pair of hydraulic rods, one hydraulic rod of the pair of hydraulic rods is connected between the first side of the top cover and the outer frame, and the pair of hydraulic rods Another of the hydraulic rods is connected between a second side of the roof and the outer frame, the first and second sides of the roof being opposite sides.
  • the state switching of the top cover can be realized quickly and reliably through a pair of hydraulic rods arranged oppositely.
  • the immersion type liquid cooling device further includes a height matching bracket, and the height matching bracket is arranged under the cooling tank and supports the cooling tank.
  • the user can match the liquid cooling device with different height brackets according to the actual depth of the electronic equipment, which can greatly save the usage of the first cooling liquid and help achieve carbon neutrality.
  • the heat exchange module further includes a plurality of liquid blocks, wherein when the heat exchange module is inserted into the installation groove, the plurality of liquid blocks can at least partially submerged in the first cooling liquid in the mounting tank.
  • the volume of the first cooling liquid that can be displaced by the liquid block can reduce the amount of the first cooling liquid required in the cabinet, Lower overall costs.
  • the plurality of liquid blocks are disposed close to the top side of the installation groove.
  • channels for the first cooling liquid to flow are provided between adjacent liquid occupying blocks among the plurality of liquid occupying blocks.
  • the first cooling fluid may flow through channels occupying the fluid blocks, thereby forming a stable fluid path.
  • the heat exchange module further includes a support portion, wherein when the heat exchange module is inserted into the installation groove, the support portion is located outside the installation groove.
  • the cabinet can reliably support the heat exchange module through the support part, and the support part can prevent the leakage of the first cooling liquid in the installation groove.
  • a second sealing ring is provided on the side of the support portion facing the installation groove, wherein when the heat exchange module is inserted into the installation groove, the support The part and the installation groove are sealed by the second sealing ring.
  • the use of the second sealing ring can improve the sealing performance between the support portion and the installation groove, and further reduce the leakage of the first cooling liquid in the installation groove.
  • the height of the cabinet is in the range of 1000mm to 1100mm
  • the width of the cabinet is in the range of 750mm to 850mm
  • the length of the cabinet is in the range of 500mm to 800mm.
  • the height and width of the cabinet are substantially the same as those of a conventional cabinet, the length and thus volume of the cabinet is significantly reduced compared to that of a conventional cabinet.
  • the first cooling fluid includes fluorinated fluid or mineral oil
  • the second cooling fluid includes deionized water
  • the electronic device includes a server or a switch.
  • a liquid cooling system comprising a plurality of immersion liquid cooling devices arranged side by side, wherein each of the plurality of immersion liquid cooling devices is based on the present invention Any one of the submerged liquid cooling devices disclosed in the first aspect.
  • Fig. 1 and Fig. 2 show the structure diagram of the immersion type liquid cooling device according to an embodiment of the present disclosure, wherein in Fig. 1 the top cover is in a closed state, and in Fig. 2 the top cover is in an open state;
  • Fig. 3 shows a schematic structural view of the submerged liquid cooling device shown in Fig. 1, wherein the heat exchange module is in a withdrawn state;
  • Fig. 4 shows a schematic structural view of the submerged liquid cooling device shown in Fig. 1 viewed along another viewing angle;
  • Fig. 5 shows a top view of the submerged liquid cooling device shown in Fig. 2, wherein the top cover is not shown in order to show the first cooling liquid in the cooling tank;
  • Fig. 6 shows a top view of the submerged liquid cooling device shown in Fig. 2, wherein the top cover and the heat exchange module are not shown in order to show the cooling tank and the first cooling liquid in the installation tank;
  • Fig. 7 shows a schematic structural view of the outer wall of the cooling tank for integrating the installation tank according to an embodiment of the present disclosure
  • Fig. 8 shows a schematic structural diagram of a heat exchange module according to an embodiment of the present disclosure
  • Figure 9 shows a schematic flow path of the first cooling liquid
  • Fig. 13 shows a schematic structural diagram of a liquid cooling system according to an embodiment of the present disclosure.
  • the term “comprise” and its variants mean open inclusion, ie “including but not limited to”.
  • the term “or” means “and/or” unless otherwise stated.
  • the term “based on” means “based at least in part on”.
  • the terms “one example embodiment” and “one embodiment” mean “at least one example embodiment.”
  • the term “another embodiment” means “at least one further embodiment”.
  • the terms “first”, “second”, etc. may refer to different or the same object.
  • Embodiments of the present disclosure provide an immersion liquid cooling device with an internal heat exchanger and a liquid cooling system including the immersion liquid cooling device, so as to reduce the difficulty of operation and maintenance, reduce the complexity of the structure, enhance adaptability and save cooling liquid .
  • the principle of the present disclosure will be described with reference to FIGS. 1 to 13 .
  • FIG. 1 and FIG. 2 show a schematic structural diagram of an immersion liquid cooling device 100 according to an embodiment of the present disclosure, wherein in FIG. 1 the top cover 24 is in a closed state, and in FIG. 2 the top cover 24 is in an open state.
  • FIG. 3 shows a schematic structural view of the immersion liquid cooling device 100 shown in FIG. 1 , where the heat exchange module 3 is in a withdrawn state.
  • FIG. 4 shows a schematic structural view of the submerged liquid cooling device 100 shown in FIG. 1 viewed from another viewing angle.
  • Reference sign X in FIG. 1 indicates the length direction of the immersion type liquid cooling device 100
  • reference sign Y indicates the width direction of the immersion type liquid cooling device 100
  • reference sign Z indicates the height direction of the immersion type liquid cooling device 100 .
  • the submerged liquid cooling device 100 described here includes a cabinet 2 and a heat exchange module 3 .
  • the cabinet 2 includes an outer frame 23 , a cooling tank 21 , an installation slot 22 integrated on the outer wall 211 of the cooling tank 21 , and a top cover 24 .
  • the cooling tank 21 is used to accommodate the electronic equipment 4 to be cooled and the first cooling liquid 5 (refer to FIG. 5 and FIG. 6 ).
  • the installation groove 22 is used for accommodating the heat exchange module 3 and the first coolant 5 (see FIG. 6 ).
  • the cooling groove 21 is in fluid communication with the mounting groove 22 via the through hole 6 (see FIG. 7 ).
  • the heat exchange module 3 is suitable for being inserted into the installation groove 22 .
  • the outer frame 23 generally surrounds the cooling tank 21 and the installation tank 22 to provide mechanical support to the cooling tank 21 and the installation tank 22 to a certain extent.
  • the cooling slot 21 and the installation slot 22 can be installed on the outer frame 23 by welding or other methods.
  • the outer frame 23 can be formed by welding profiled square steel.
  • the outer frame 23 may also be manufactured using other processes or other materials, and the embodiments of the present disclosure are not strictly limited in this regard.
  • the cooling groove 21 and the installation groove 22 can be welded by stainless steel plates. In other embodiments, the cooling groove 21 and the installation groove 22 may be formed by other processes or using other materials, and the embodiments of the present disclosure are not strictly limited in this regard.
  • the top cover 24 is rotatably connected to the outer frame 23 and can be switched between a closed state that closes the cooling groove 21 and an open state that opens the cooling groove 21 .
  • FIG. 1 shows the top cover 24 in a closed state
  • FIG. 2 shows the top cover 24 in an open state.
  • the top cover 24 is closed, the leakage of the first cooling liquid 5 in the cooling tank 21 can be reduced, and external pollutants can be prevented from entering the cooling tank 21 .
  • the top cover 24 is in an open state, the operator can install or maintain the electronic equipment 4 in the cooling tank 21 and inject the first cooling liquid 5 into the cooling tank 21 .
  • the first cooling liquid 5 includes fluorinated liquid or mineral oil. In other embodiments, the first cooling liquid 5 may also be of other types, which are not strictly limited in the embodiments of the present disclosure.
  • the top cover 24 can be opened more than 90 degrees relative to the outer frame 23 .
  • a stopper (not shown) may be provided to limit the position of the top cover 24 .
  • the top cover 24 may be hinged to one side of the outer frame 23 .
  • the top cover 24 may be connected to the outer frame 23 in other ways, such as through shaft hole fit, etc., and the embodiments of the present disclosure are not strictly limited in this regard.
  • the top cover 24 includes a frame 241 and a transparent portion 242 surrounded by the frame 241 .
  • the bezel 241 is connected to the outer frame 23 and can rotate relative to the outer frame 23 .
  • the frame 241 can be made of aluminum alloy or other types of metal or non-metal materials.
  • the transparent part 242 may be made of transparent polycarbonate (PC) material or other types of transparent materials.
  • a first sealing ring (not shown) is provided on the side of the top cover 24 facing the cooling groove 21 .
  • the first sealing ring is used to seal between the top cover 24 and the cooling tank 21 .
  • the first sealing ring may comprise, for example, EPDM rubber or other types of sealing material. The use of the first sealing ring can improve the sealing performance between the top cover 24 and the cooling tank 21 , and further reduce the leakage of the first cooling liquid 5 in the cooling tank 24 .
  • the cabinet 2 in order to realize the opening and closing of the top cover 24, the cabinet 2 further includes a hydraulic drive device (not shown).
  • the hydraulic driving device is connected between the outer frame 23 and the top cover 24 for driving the top cover 24 to switch between the closed state and the open state.
  • the opening and closing of the top cover 24 can be conveniently realized by using a hydraulic drive device.
  • the hydraulic drive includes a pair of hydraulic rods (not shown).
  • One of a pair of hydraulic rods is connected between the first side 243 of the top cover 24 and a corresponding side of the outer frame 23 .
  • the other of the pair of hydraulic rods is connected between the second side 244 of the top cover 24 and the corresponding side of the outer frame 23 .
  • the first side 243 and the second side 244 of the top cover 24 are opposite sides. The state switching of the top cover 24 can be realized quickly and reliably through a pair of hydraulic rods arranged oppositely.
  • top cover 24 can be switched between the closed state and the open state in other ways, and the embodiments of the present disclosure are not strictly limited in this regard.
  • a handle (not shown) may also be provided on the side of the top cover 24 facing away from the cooling tank 21 . With this arrangement, the operator can open and close the top cover 24 by grasping the handle.
  • the heat exchange module 3 is suitable for being inserted into the installation groove 22 and withdrawn from the installation groove 22, the operator can conveniently use the Different heat exchange modules3.
  • both the cooling tank 21 and the installation tank 22 are used to accommodate the first cooling liquid 5 .
  • the first cooling liquid 5 can immerse the electronic equipment 4 for cooling the electronic equipment 4 .
  • the heat exchange module 3 can be at least partially submerged by the first cooling liquid 5 .
  • the heat exchange module 3 can be connected to an external cooling device (such as a cooling tower) to receive the second cooling liquid provided by the external cooling device.
  • the temperature of the second cooling liquid in the heat exchange module 3 is lower than that of the first cooling liquid 5 in the installation groove 22 , so the first cooling liquid 5 in the installation groove 22 can be cooled.
  • the second coolant in the heat exchange module 3 may include deionized water.
  • the second cooling liquid may also be of other types, which are not strictly limited in the embodiments of the present disclosure.
  • the heat exchange module 3 includes a coolant circulation pipeline 31 , a heat exchanger 32 , and a coolant driving device 33 .
  • the coolant circulation line 31 is in fluid communication with the heat exchanger 32 for circulating the second coolant between the heat exchanger 32 and an external cooling device such as a cooling tower.
  • the heat exchanger 32 can be provided with a second cooler liquid at a lower temperature.
  • the heat exchanger 32 is used for cooling the first cooling liquid 5 outside by using the second cooling liquid inside.
  • the coolant driving device 33 is used to circulate the first coolant 5 between the installation tank 22 and the cooling tank 21 .
  • the low-temperature first cooling liquid 5 entering the cooling groove 21 from the mounting groove 22 can absorb heat from the electronic device 4 , and the first cooling liquid 5 after absorbing heat can enter the mounting groove 21 through the through hole 6 .
  • the heat exchanger 32 and the cooling liquid driving device 33 can be submerged by the first cooling liquid 5 . Since the heat exchanger 32 has the second cooling liquid received through the cooling liquid circulation pipeline 31 , the second cooling liquid can be used to lower the temperature of the first cooling liquid 5 in the installation tank 22 .
  • the coolant circulation pipeline 31 may include two sets of liquid inlet and liquid return pipelines. Through such a redundant design, in the case of a problem with one set of liquid inlet and return pipelines, another set of liquid inlet and return pipelines can still operate normally, thereby improving the reliability of the system.
  • heat exchanger 32 may comprise a plate heat exchanger. In other embodiments, the heat exchanger 32 may include other types of heat exchangers, and embodiments of the present disclosure are not strictly limited in this regard.
  • a dense microcavity structure may be provided inside the heat exchanger 32 , so as to increase the contact area between the second cooling liquid and the heat exchanger 32 and improve the heat exchange efficiency of the heat exchanger 32 .
  • the heat exchanger 32 can be made of stainless steel. In other embodiments, the heat exchanger 32 may be made of other types of materials with higher thermal conductivity, and the embodiments of the present disclosure are not strictly limited in this regard.
  • FIG. 7 shows an exemplary arrangement of the through holes 6 on the outer wall 211 of the cooling groove 21 .
  • the vias 6 include a first set of vias 61 and a second set of vias 62 .
  • the coolant drive device 33 will be close to the first group of through holes 61 for Drive the first coolant 5 in the installation groove 22 into the cooling groove 21 through the first set of through holes 61, and make the first coolant 5 in the cooling groove 21 flow into the installation groove 22 through the second set of through holes 62 .
  • each through-hole in the first set of through-holes 61 may be oval in shape. It should be understood that, in other embodiments, each through-hole in the first group of through-holes 61 may be in other shapes, such as circular, rectangular, square, bar-shaped, etc., and the embodiments of the present disclosure are not strictly limited in this respect. .
  • each through-hole in the second set of through-holes 62 may be oval in shape.
  • each through-hole in the second group of through-holes 62 may be in other shapes, such as circular, rectangular, square, bar-shaped, etc., and the embodiments of the present disclosure are not strictly limited in this regard.
  • the first set of through holes 61 are located near the bottom side of the mounting slot 22
  • the second set of through holes 62 are located near the top side of the mounting slot 22 .
  • the coolant driving device 33 when the heat exchange module 3 is inserted into the installation groove 22 , the coolant driving device 33 is close to the bottom side of the installation groove 22 , and the thermal The exchanger 32 is located above the cooling liquid driving device 33 and arranged adjacent to the cooling liquid driving device 33 .
  • the first coolant 5 cooled by the heat exchanger 32 can be transported to the cooling tank 21 in time, further improving the heat dissipation performance of the liquid cooling device 100 .
  • the coolant driving device 33 includes a plurality of circulation pumps, wherein when the heat exchange module 3 is inserted into the installation groove 22, each circulation pump will be respectively close to the first The corresponding vias in the set of vias 61.
  • multiple circulating pumps can respectively drive the first cooling liquid 5 into the corresponding through holes, which can further increase the circulation speed of the first cooling liquid 5 between the installation groove 22 and the cooling groove 21 .
  • additional circulation pumps may be provided adjacent to each of the through holes in the first set of through holes 61 .
  • the circulation stability of the first cooling liquid 5 between the installation groove 21 and the cooling groove 22 can be improved.
  • the coolant driving device 33 may also include other types of driving units or adopt other arrangements, and the embodiments of the present disclosure are not strictly limited in this regard.
  • the heat exchange module 3 further includes a plurality of fluid occupying blocks 34 .
  • the plurality of liquid blocks 34 can be at least partially submerged in the first cooling liquid 5 in the installation groove 22 .
  • the liquid block 34 can discharge the volume of the first cooling liquid 5 in the installation groove 22, so that the liquid level of the first cooling liquid 5 in the installation groove 22 rises, reducing the required first cooling liquid 5 in the cabinet 2.
  • the amount of cooling liquid 5 reduces the overall cost.
  • liquid-occupying block 34 when the heat exchange module 3 is inserted into the installation groove 22 , a plurality of liquid blocks 34 will be close to the top side of the installation groove 22 set up.
  • the liquid-occupying block 34 may also be disposed at other positions, and the embodiments of the present disclosure are not strictly limited in this respect.
  • channels 35 for the first cooling liquid 5 to flow are provided between adjacent liquid blocks 34 among the plurality of liquid blocks 34 .
  • the first cooling liquid 5 can flow through the channels 35 occupying between the liquid blocks 34, thereby forming a stable fluid path.
  • the heat exchange module 3 includes a support portion 36 at the top.
  • the support portion 36 is located outside the installation groove 22 and supported by the outer frame 23 . In this way, the entire weight of the heat exchange module 3 can be reliably supported on the outer frame 23 .
  • a second sealing ring (not shown) is provided on a side of the supporting portion 36 facing the mounting groove 22.
  • the support portion 36 and the installation groove 22 are sealed by the second sealing ring.
  • the use of the second sealing ring can improve the sealing performance between the support portion 36 and the installation groove 22 , and further reduce the leakage of the first cooling liquid 5 in the installation groove 22 .
  • a pair of handles 37 are provided on the support portion 36 .
  • the operator can conveniently operate the heat exchange module 3 , such as pulling out the heat exchange module 3 from the installation slot 22 or inserting the heat exchange module 3 into the installation slot 22 .
  • the submerged liquid cooling device 100 further includes a height matching bracket 7 , which is disposed under the cooling tank 21 and supports the cooling tank 21 .
  • a height matching bracket 7 which is disposed under the cooling tank 21 and supports the cooling tank 21 .
  • Fig. 9 shows a schematic flow path of the first cooling liquid 5, indicated by arrows.
  • the heat exchanger 32 and the cooling liquid driving device 33 can be submerged by the first cooling liquid 5 . Since the heat exchanger 32 has the second cooling liquid received through the cooling liquid circulation pipeline 31 , the second cooling liquid can be used to lower the temperature of the first cooling liquid 5 in the installation tank 22 .
  • the cooling liquid driving device 33 then drives the first cooling liquid 5 in the installation groove 22 into the cooling groove 21 through the first group of through holes 61 , and flows through the electronic equipment 4 from bottom to top, thereby cooling the electronic equipment.
  • the first cooling liquid 5 in the cooling groove 21 after absorbing heat from the electronic device 4 flows into the installation groove 22 through the second group of through holes 62 .
  • the first cooling liquid 5 travels again from top to bottom in the installation tank 22 and cools down through the heat exchanger 32 to perform the next cycle.
  • the second coolant in the heat exchanger 32 can flow in the left and right directions, while the first coolant 5 in the installation groove 22 can flow up and down in the vertical direction, thereby forming a fork.
  • the heat exchange in the form of flow enhances the heat exchange efficiency of the heat exchanger 32.
  • electronic device 4 includes a server or a switch. In other embodiments, the electronic device 4 may also be of other types, which are not strictly limited in the embodiments of the present disclosure.
  • the electronic device 4 includes both a computing-type server and a storage-type server. As shown in FIG. 11 , the electronic device 4 mainly includes a storage type server. As shown in FIG. 12 , the electronic device 4 mainly includes a computing server.
  • the size of the cabinet 2 of the immersion liquid cooling device 100 shown in FIGS. 10 to 12 may be, for example, 8U. In other embodiments, the size of the cabinet 2 may be larger or smaller than 8U, and the embodiments of the present disclosure are not strictly limited in this respect.
  • the cabinet 2 along the length direction X is only about one-sixth of the length of conventional cabinets.
  • the length of the conventional cabinet is usually about 3 meters.
  • the length of the cabinet 2 in the disclosed embodiment is only 500 mm, which is significantly reduced in size.
  • the length of the cabinet 2 along the longitudinal direction X can be adjusted according to the number of electronic devices 4 arranged therein, and it is recommended to keep it in the range of 500mm to 800mm.
  • FIGS. 10 to 12 also show conductive terminals 8 for connecting the electronic device 4 so as to supply power to the electronic device 4 and perform signal/data transmission and the like.
  • the operator can stand on any side of the cabinet 2 to operate the electronic equipment 4 in the cabinet 2 .
  • the new structure of the submerged liquid-cooled data center can be greatly simplified .
  • FIG. 13 shows a schematic structural diagram of a liquid cooling system 900 according to an embodiment of the present disclosure.
  • the liquid cooling system 900 includes a plurality of submerged liquid cooling devices 100 arranged side by side.
  • Each of the multiple immersion liquid cooling devices 100 may be any one of the immersion liquid cooling devices 100 described in conjunction with FIGS. 1 to 12 .
  • the small immersion liquid cooling device 100 can be independently deployed in small quantities, bringing more application scenarios of miniaturization and flexible deployment.
  • the immersion liquid cooling device 100 can be arranged in advance in the data center computer room by pre-setting the cabinet 2 and the heat exchange module 3 in the data center, and the cooling liquid circulation pipeline 31 and the The primary side coolant supply system (such as cooling tower) is connected and debugged. Subsequently, the user can purchase IT equipment when there is a business need, deploy it in the cooling tank 21 of the cabinet 2, and finally add the first cooling liquid 5 into the cooling tank, thereby completing the deployment of the entire system. In this way, the deployment time of the data center can be greatly reduced.
  • the primary side coolant supply system such as cooling tower
  • the embodiment of the present disclosure also provides a large-scale cluster deployment data center, including: a plurality of immersion liquid cooling devices 100, which are pre-arranged in the data center computer room, and no electronic equipment is installed in each immersion liquid cooling device 100 4 and the first cooling liquid 5 has not yet been injected; and a cooling liquid supply system (such as a cooling tower) on the primary side is connected to the cooling liquid circulation line in the heat exchange module 3 of each submerged liquid cooling device 100 through an infusion line 31.
  • a cooling liquid supply system such as a cooling tower
  • the height matching bracket 7 can have different sizes, so that the same set of external frames 23 can adapt to different cooling grooves 21 .
  • the height-adjusting bracket 7 can also be a height-adjustable height-adjusting bracket.
  • the depth of a general computing server is 600mm, and the depth of a storage server is 800mm.
  • the cabinet 2 can adjust the depth of the cooling tank 21 through the height matching bracket 7 at the bottom; Coolant usage by IT equipment in system 900 is reduced by approximately 5-33%.
  • the embodiments of the present disclosure provide a liquid cooling system design with an internal heat exchanger, which can efficiently realize self-circulation cooling of IT equipment such as servers and switches arranged inside it, and reduce data center investment and overall operating costs.
  • the overall power usage effectiveness (PUE) of the data center can be controlled below 1.1, which can help achieve carbon neutrality.

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Abstract

本公开的实施例涉及一种浸没式液冷装置以及液冷系统。该浸没式液冷装置包括：机柜，机柜包括冷却槽和集成在冷却槽的外壁上的安装槽，冷却槽用于容纳待冷却的电子设备以及第一冷却液，安装槽用于容纳第一冷却液，冷却槽与安装槽经由通孔流体连通；以及换热模组，适于被插入到安装槽中，换热模组包括冷却液循环管路、热交换器、以及冷却液驱动装置，冷却液循环管路与热交换器流体连通以用于向热交换器提供第二冷却液，热交换器用于利用其内部的第二冷却液对其外部的第一冷却液进行冷却，冷却液驱动装置用于使第一冷却液在安装槽与冷却槽之间。

Description

浸没式液冷装置及液冷系统
本申请要求于2021年12月22日提交中国国家知识产权局、申请号为202111582976.0、申请名称为“浸没式液冷装置及液冷系统”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本公开的实施例总体上涉及电子设备冷却技术领域，并且更具体地，涉及浸没式液冷装置以及包括浸没式液冷装置的液冷系统。
背景技术
伴随着5G、云计算、大数据、人工智能等新一代信息通信技术与实体经济融合发展，数据中心正在逐渐从服务部分企业拓展到服务整个社会，成为一种新的基础设施。
这种新基础设施对散热中心的散热解决方案以及整体能效提出了更高的要求。一方面，随着大数据时代的到来，数据正以超出想象的速度增长，对海量数据的处理、存储和传输，要求IT设备的功耗成倍增长，使得芯片散热成为巨大挑战。传统的冷却解决方案已难以满足电子信息设备高效散热的需求。同时，国家、地方和行业陆续出台了能源政策，对数据中心的节能指标提出了更高要求。
传统数据中心机房通常采用房间级空调，地板下送风的冷却方式。该方式建设成本低，机房利用率高，用于解决3～5kW的单机柜发热。但随着机架式、刀片式服务器在机房大量应用，单机柜内设备数量、功率密度、发热密度都有显著提高。传统的机房级空调已经不能解决IT设备的散热问题，行级空调、背板空调应运而生。这种新型的空调末端更贴近热源，能解决局部热点、高发热密度的问题，通过近距离的冷量传输，减小风机功耗，达到节能。不论房间级空调，还是行级空调、背板空调，都是先冷却空气，再通过冷空 气与服务器的CPU进行热交换来降温。由于空气的换热效率、热流密度很低，空冷服务器有冷却能耗高、噪声大、设备密度低等问题。
为解决超高功率密度IT设备散热难题，数据中心开始采用液冷技术，使用工作流体作为中间热量传输的媒介，将热量从发热区传递到远处再进行冷却。液冷技术冷却效率显著高于风冷散热，可以有效解决高密度服务器的散热问题，降低冷却系统能耗而且减少噪声。
在目前的采用液冷方案的数据中心里，常规的浸没式液冷系统一般是大型的机柜(通常长度为3米左右)配备一套或者多套冷液分配单元(CDU)组成。冷液分配单元设置在机柜的左右两侧。本申请的发明人发现，这种常规的浸没式液冷系统存在多种问题。
第一，常规的浸没式液冷系统的机柜的体积大，运维困难。操作人员在维护时，只能站在机柜的前部方位，而无法站在机柜的左右两侧进行维护，操作上具有一定的难度。例如，在目前的浸没式液冷行业内，应用于服务器浸没散热的系统基本上都采用长度在2-3米左右的卧式机柜，这会带来很多实施与运维操作上的困难。
第二，常规的浸没式液冷系统都要搭载一套或者多套冷液分配单元，使得系统在整体架构上相对复杂。
第三，常规的浸没式液冷系统对于IT设备的适应性差。在常规的浸没式液冷系统中，在组装不同高度的IT设备时，需要使用同一款高度的机柜。当所要组装的IT设备的高度比机柜的高度低时，其中的服务器需要分摊的冷却液会更多，也就需要耗费更多的成本。
第四，常规的浸没式液冷系统单系统要求搭载的IT设备容量大，对于一些规模较小的IT系统需求时，会造成一定程度的设备及液体的浪费。
因此，存在对于改进的数据中心液冷方案的需要。
发明内容
本公开的目的是提供一种浸没式液冷装置以及包括浸没式液冷装置的液冷系统，以至少部分地解决现有技术中存在的上述问题。
根据本公开的第一方面，提供了一种浸没式液冷装置，包括：机柜，所述机柜包括冷却槽和集成在所述冷却槽的外壁上的安装槽，所述冷却槽用于容纳待冷却的电子设备以及第一冷却液，所述安装槽用于容纳所述第一冷却液，所述冷却槽与所述安装槽经由通孔流体连通；以及换热模组，适于被插入到所述安装槽中，所述换热模组包括冷却液循环管路、热交换器、以及冷却液驱动装置，所述冷却液循环管路与所述热交换器流体连通以用于向所述热交换器提供第二冷却液，所述热交换器用于利用其内部的所述第二冷却液对其外部的所述第一冷却液进行冷却，所述冷却液驱动装置用于使所述第一冷却液在所述安装槽与所述冷却槽之间循环。
根据本公开的实施例的浸没式液冷装置中的机柜体积小，整体重量小，解决了部署难的问题。操作人员可以在液冷装置的各个侧边进行维护，会非常容易实现对内部电子设备的部件的维护。此外，由于机柜与换热模组集成在一起，因而整个系统不需要再额外搭载冷液分配单元使用，非常灵活方便。
在一些实施例中，所述通孔包括第一组通孔和第二组通孔，其中在所述换热模组被插入到所述安装槽中的情况下，所述冷却液驱动装置靠近所述第一组通孔，以用于将所述安装槽中的所述第一冷却液驱动到所述冷却槽中，并且使所述冷却槽中的所述第一冷却液经由所述第二组通孔流动到所述安装槽中。在这样的实施例中，通过将冷却液驱动装置与第一组通孔邻近布置，能够实现第一冷却液在安装槽与冷却槽之间的快速循环。
在一些实施例中，所述第一组通孔靠近所述安装槽的底侧设置，并且所述第二组通孔靠近所述安装槽的顶侧设置。在这样的实施例中，安装槽中的大部分第一冷却液都能够循环流动到冷却槽中，提升了液冷装置的散热性能。
在一些实施例中，在所述换热模组被插入到所述安装槽中的情况下，所述冷却液驱动装置靠近所述安装槽的底侧，并且所述热交换器位于所述冷却液驱动装置上方且与所述冷却液驱动装置相邻设置。在这样的实施例中，通过将冷却液驱动装置与热交换器相邻设置，使得被热交换器冷却后的第一冷却液能够及时被输送到冷却槽中，进一步提升了液冷装置的散热性能。
在一些实施例中，所述冷却液驱动装置包括多个循环泵，其中在所述换热模组被插入到所述安装槽中的情况下，所述多个循环泵中的每个循环泵分别靠近所述第一组通孔中的相应通孔。在这样的实施例中，多个循环泵分别向相应通孔中驱动第一冷却液，能够进一步提升第一冷却液在安装槽与冷却槽之间的循环速度。
在一些实施例中，所述机柜还包括外部框架和顶盖，所述外部框架围绕所述冷却槽和所述安装槽设置，所述顶盖可转动地连接至所述外部框架并且能够在封闭所述冷却槽的关闭状态与打开所述冷却槽的打开状态之间切换。在这样的实施例中，通过采用顶盖来封闭第一冷却槽，能够减少冷却槽中的第一冷却液的泄露，并能够防止外部污染物进入冷却槽中。
在一些实施例中，所述顶盖包括边框和由所述边框围绕的透明部。在这样的实施例中，能够通过透明部观察冷却槽中的电子设备，及时了解电子设备的部件的运行状态。
在一些实施例中，所述顶盖的面朝所述冷却槽的一侧设置有第一密封圈，其中在所述顶盖处于所述关闭状态的情况下，所述顶盖与所述冷却槽之间通过所述第一密封圈密封。在这样的实施例中，采用第一密封圈能够提升顶盖与冷却槽之间的密封性能，进一步减少冷却槽中的第一冷却液的泄露。
在一些实施例中，所述机柜还包括液压驱动装置，所述液压驱动装置连接在所述外部框架与所述顶盖之间以用于驱动所述顶盖在所述关闭状态与所述打开状态之间切换。在这样的实施例中，能够 采用液压驱动装置方便地打开或关闭顶盖。
在一些实施例中，所述液压驱动装置包括一对液压杆，所述一对液压杆中的一个液压杆连接在所述顶盖的第一侧与所述外部框架之间，所述一对液压杆中的另一个液压杆连接在所述顶盖的第二侧与所述外部框架之间，所述顶盖的第一侧与第二侧是相对侧。在这样的实施例中，通过相对设置的一对液压杆能够快速、可靠地实现顶盖的状态切换。
在一些实施例中，所述浸没式液冷装置还包括配高支架，所述配高支架设置在所述冷却槽下方并且支撑所述冷却槽。在这样的实施例中，用户可以根据电子设备的实际深度需要搭配具有不同的配高支架的液冷装置，可以大幅度节省第一冷却液的使用量，能够助力实现碳中和。
在一些实施例中，所述换热模组还包括多个占液块，其中在所述换热模组被插入到所述安装槽中的情况下，所述多个占液块能够至少部分地浸没在所述安装槽中的所述第一冷却液中。在这样的实施例中，在换热模组被插入到安装槽中的情况下，占液块能够排开第一冷却液的体积，从而能够减少机柜中所需的第一冷却液的用量，降低总体成本。
在一些实施例中，在所述换热模组被插入到所述安装槽中的情况下，所述多个占液块靠近所述安装槽的顶侧设置。
在一些实施例中，所述多个占液块中的相邻占液块之间设置有供所述第一冷却液流过的通道。在这样的实施例中，第一冷却液可以流经占液块之间的通道，从而形成稳定的流体路径。
在一些实施例中，所述换热模组还包括支撑部，其中在所述换热模组被插入到所述安装槽中的情况下，所述支撑部位于所述安装槽外部。在这样的实施例中，通过支撑部可以实现机柜对换热模组的可靠支撑，并且支撑部可以防止安装槽中的第一冷却液的泄露。
在一些实施例中，所述支撑部的面朝所述安装槽的一侧设置有 第二密封圈，其中在所述换热模组被插入到所述安装槽中的情况下，所述支撑部与所述安装槽之间通过所述第二密封圈密封。在这样的实施例中，采用第二密封圈能够提升支撑部与安装槽之间的密封性能，进一步减少安装槽中的第一冷却液的泄露。
在一些实施例中，所述机柜的高度在1000mm至1100mm的范围内，所述机柜的宽度在750mm至850mm的范围内，并且所述机柜的长度在500mm至800mm的范围内。在这样的实施例中，在机柜的高度和宽度与常规机柜的高度和宽度基本相同的情况下，机柜的长度相比于常规机柜的长度显著减小，机柜的体积因而也显著减小。
在一些实施例中，所述第一冷却液包括氟化液或者矿物油，和/或所述第二冷却液包括去离子水。
在一些实施例中，所述电子设备包括服务器或交换机。
根据本公开的第二方面，提供了一种液冷系统，包括并排布置的多个浸没式液冷装置，其中所述多个浸没式液冷装置中的每个浸没式液冷装置是根据本公开的第一方面的任意一种浸没式液冷装置。
提供该内容部分是为了以简化的形式来介绍对概念的选择，它们在下文的具体实施方式中将被进一步描述。该内容部分无意标识本公开内容的关键特征或主要特征，也无意限制本公开内容的范围。
附图说明
通过参考附图阅读下文的详细描述，本公开的实施例的上述以及其他目的、特征和优点将变得易于理解。在附图中，以示例而非限制性的方式示出了本公开的若干实施例，其中：
图1和图2示出了根据本公开的一个实施例的浸没式液冷装置的结构示意图，其中在图1中顶盖处于关闭状态，而在图2中顶盖处于打开状态；
图3示出了图1中所示的浸没式液冷装置的结构示意图，其中换热模组处于抽出状态；
图4示出了图1中所示的浸没式液冷装置沿着另一视角查看时的结构示意图；
图5示出了图2中所示的浸没式液冷装置的俯视图，其中未示出顶盖以便显示冷却槽中的第一冷却液；
图6示出了图2中所示的浸没式液冷装置的俯视图，其中未示出顶盖和换热模组以便显示冷却槽和安装槽中的第一冷却液；
图7示出了根据本公开的一个实施例的冷却槽的用于集成安装槽的外壁的结构示意图；
图8示出了根据本公开的一个实施例的换热模组的结构示意图；
图9示出了第一冷却液的示意性流动路径；
图10至图12示出了根据本公开的实施例的浸没式液冷装置中的电子设备的不同布置；以及
图13示出了根据本公开的实施例的液冷系统的结构示意图。
具体实施方式
下面将参照附图更详细地描述本公开的优选实施例。虽然附图中显示了本公开的优选实施例，然而应该理解，可以以各种形式实现本公开而不应被这里阐述的实施例所限制。相反，提供这些实施例是为了使本公开更加透彻和完整，并且能够将本公开的范围完整地传达给本领域的技术人员。
在本文中使用的术语“包括”及其变形表示开放性包括，即“包括但不限于”。除非特别申明，术语“或”表示“和/或”。术语“基于”表示“至少部分地基于”。术语“一个示例实施例”和“一个实施例”表示“至少一个示例实施例”。术语“另一实施例”表示“至少一个另外的实施例”。术语“第一”、“第二”等等可以指代不同的或相同的对象。
如在上文中所描述的，常规的浸没式液冷系统存在多种问题，诸如运维困难、整体架构复杂、适应性差以及浪费冷却液等。本公开的实施例提供了一种内部集成热交换器的浸没式液冷装置以及包括浸没式液冷装置的液冷系统，以便降低运维难度、减小架构复杂、增强适应性以及节约冷却液。在下文中，将结合图1至图13对本公开的原理进行描述。
图1和图2示出了根据本公开的一个实施例的浸没式液冷装置100的结构示意图，其中在图1中顶盖24处于关闭状态，而在图2中顶盖24处于打开状态。图3示出了图1中所示的浸没式液冷装置100的结构示意图，其中换热模组3处于抽出状态。图4示出了图1中所示的浸没式液冷装置100沿着另一视角查看时的结构示意图。图1中的附图标记X指示浸没式液冷装置100的长度方向，附图标记Y指示浸没式液冷装置100的宽度方向，附图标记Z指示浸没式液冷装置100的高度方向。
如图1至图4所示，总体上，在此描述的浸没式液冷装置100包括机柜2和换热模组3。机柜2包括外部框架23、冷却槽21、集成在冷却槽21的外壁211上的安装槽22、以及顶盖24。冷却槽21用于容纳待冷却的电子设备4以及第一冷却液5(参见5和图6)。安装槽22用于容纳换热模组3和第一冷却液5(参见图6)。冷却槽21与安装槽22经由通孔6(参见图7)流体连通。换热模组3适于被插入到安装槽22中。
如图1至图4所示，外部框架23总体上围绕冷却槽21和安装槽22，以便在一定程度上对冷却槽21和安装槽22提供机械支撑。冷却槽21和安装槽22可以通过焊接或者其他方式安装在外部框架23上。在一些实施例中，外部框架23可以由型材方钢焊接成型。在其他实施例中，外部框架23也可以采用其他工艺或采用其他材料制造成型，本公开的实施例在此方面不做严格限制。
在一些实施例中，冷却槽21和安装槽22可以采用不锈钢板焊接 而成。在其他实施例中，冷却槽21和安装槽22可以通过其他工艺或采用其他材料制造成型，本公开的实施例在此方面不做严格限制。
如图1和图2所示，顶盖24可转动地连接至外部框架23并且能够在封闭冷却槽21的关闭状态与打开冷却槽21的打开状态之间切换。图1中示出了顶盖24处于关闭状态，而图2中示出了顶盖24处于打开状态。顶盖24在关闭状态下能够减少冷却槽21中的第一冷却液5的泄露，并能够防止外部污染物进入冷却槽21中。在顶盖24处于打开状态的情况下，操作人员可以对冷却槽21中的电子设备4进行安装或维护，以及向冷却槽21中注入第一冷却液5。
在一些实施例中，第一冷却液5包括氟化液或者矿物油。在其他实施例中，第一冷却液5还可以为其他类型，本公开的实施例在此方面不做严格限制。
在一些实施例中，顶盖24可以相对于外部框架23开启90度以上。在最大开启角度处，可以设置有止位件(未示出)，以限制顶盖24的位置。
在一些实施例中，顶盖24可以通过铰链连接至外部框架23的一侧。在其他实施例中，顶盖24可以通过其他方式连接至外部框架23，例如通过轴孔配合等，本公开的实施例在此方面不做严格限制。
在一些实施例中，如图1和图2所示，顶盖24包括边框241和由边框241围绕的透明部242。边框241连接至外部框架23并且能够相对于外部框架23转动。边框241可以采用铝合金或其他类型的金属或非金属材料制成。透明部242可以采用透明聚碳酸酯(PC)材料或其他类型的透明材料制成。通过设置透明部242，即使在顶盖24处于关闭状态的情况下，操作人员也能够通过透明部242观察冷却槽21中的电子设备4，及时了解电子设备4的部件的运行状态。
在一些实施例中，顶盖24的面朝冷却槽21的一侧设置有第一密封圈(未示出)。在顶盖24处于关闭状态的情况下，顶盖24与冷却槽21之间通过第一密封圈密封。第一密封圈例如可以包括 EPDM橡胶或其他类型的密封材料。采用第一密封圈能够提升顶盖24与冷却槽21之间的密封性能，进一步减少冷却槽24中的第一冷却液5的泄露。
在一些实施例中，为了实现顶盖24的开启与关闭，机柜2还包括液压驱动装置(未示出)。液压驱动装置连接在外部框架23与顶盖24之间以用于驱动顶盖24在关闭状态与打开状态之间切换。利用液压驱动装置能够方便地实现顶盖24的开启和关闭。
在一些实施例中，液压驱动装置包括一对液压杆(未示出)。一对液压杆中的一个液压杆连接在顶盖24的第一侧243与外部框架23的相应侧之间。一对液压杆中的另一个液压杆连接在顶盖24的第二侧244与外部框架23的相应侧之间。顶盖24的第一侧243与第二侧244是相对侧。通过相对设置的一对液压杆能够快速、可靠地实现顶盖24的状态切换。
应当理解，在其他实施例中，顶盖24可以通过其他方式在关闭状态和打开状态之间切换，本公开的实施例在此方面不做严格限制。
在一些实施例中，顶盖24的背对冷却槽21的一侧上还可以设置有把手(未示出)。利用这种布置，操作人员可以通过抓握把手来打开和关闭顶盖24。
此外，在根据本公开的实施例中，由于换热模组3适于被插入到安装槽22中以及从安装槽22中抽出，针对不同的电子设备4的散热要求，操作人员可以方便地使用不同的换热模组3。
如在上文中提到的，冷却槽21和安装槽22均用于容纳第一冷却液5。在冷却槽21中，第一冷却液5可以浸没电子设备4，以用于对电子设备4进行冷却。在安装槽22中，换热模组3可以至少部分地被第一冷却液5浸没。换热模组3可以与外部冷却设备(例如冷却塔)连接，以接收由外部冷却设备提供的第二冷却液。换热模组3中的第二冷却液的温度低于安装槽22中的第一冷却液5的温度，因此能够对安装槽22中的第一冷却液5进行冷却。
在一些实施例中，换热模组3中的第二冷却液可以包括去离子水。在其他实施例中，第二冷却液还可以为其他类型，本公开的实施例在此方面不做严格限制。
下面将结合图8描述换热模组3的示例性结构。如图8所示，换热模组3包括冷却液循环管路31、热交换器32、以及冷却液驱动装置33。冷却液循环管路31与热交换器32流体连通以用于使第二冷却液在热交换器32与外部冷却设备(例如冷却塔)之间循环。利用这种布置，可以向热交换器32提供温度较低的第二冷却液。热交换器32用于利用其内部的第二冷却液对其外部的第一冷却液5进行冷却。冷却液驱动装置33用于使第一冷却液5在安装槽22与冷却槽21之间循环。以此方式，从安装槽22进入冷却槽21中的低温的第一冷却液5可以从电子设备4吸收热量，吸热升温后的第一冷却液5可以从冷却槽21经由通孔6进入安装槽22，并且在安装槽22中再次被热交换器32降温，进行下一次循环。
结合图1至图8所示，在换热模组3被插入到安装槽22中的情况下，热交换器32和冷却液驱动装置33可以被第一冷却液5浸没。由于热交换器32中存在经由冷却液循环管路31接收的第二冷却液，因而可以利用第二冷却液对安装槽22中的第一冷却液5进行降温。
在一些实施例中，冷却液循环管路31可以包括两组进液和回液管路。通过这样的冗余设计，在一组进液和回液管路出现问题的情况下，另一组进液和回液管路仍能够正常操作，从而能够提高系统的可靠性。
在一些实施例中，热交换器32可以包括板式换热器。在其他实施例中，热交换器32可以包括其他类型的换热器，本公开的实施例在此方面不做严格限制。
在一些实施例中，热交换器32内部可以设置有密集的微腔结构，从而增大第二冷却液与热交换器32的之间的接触面积，提高热交换器32的换热效率。
在一些实施例中，热交换器32可以采用不锈钢材料制成。在其他实施例中，热交换器32可以采用其他类型的具有较高导热率的材料制成，本公开的实施例在此方面不做严格限制。
图7示出了冷却槽21的外壁211上的通孔6的示例性布置。在一些实施例中，如图7所示，通孔6包括第一组通孔61和第二组通孔62。结合图1至图4以及图7和图8所示，在换热模组3被插入到安装槽22中的情况下，冷却液驱动装置33将会靠近第一组通孔61，以用于将安装槽22中的第一冷却液5经由第一组通孔61驱动到冷却槽21中，并且使冷却槽21中的第一冷却液5经由第二组通孔62流动到安装槽22中。
在一些实施例中，如图7所示，第一组通孔61中的每个通孔可以为椭圆形形状。应当理解，在其他实施例中，第一组通孔61中的每个通孔可以为其他形状，诸如圆形，矩形，方形，条形等，本公开的实施例在此方面不做严格限制。
类似地，如图7所示，第二组通孔62中的每个通孔可以为椭圆形形状。在其他实施例中，第二组通孔62中的每个通孔可以为其他形状，诸如圆形，矩形，方形，条形等，本公开的实施例在此方面不做严格限制。
在一些实施例中，如图7所示，第一组通孔61靠近安装槽22的底侧设置，并且第二组通孔62靠近安装槽22的顶侧设置。利用这样的布置，可以使得安装槽22中的大部分第一冷却液5都能够参与到冷却槽21与安装槽22之间的冷却液循环中。
在一些实施例中，结合图1至图4以及图8所示，在换热模组3被插入到安装槽22中的情况下，冷却液驱动装置33靠近安装槽22的底侧，并且热交换器32位于冷却液驱动装置33上方且与冷却液驱动装置33相邻设置。通过将冷却液驱动装置33与热交换器32相邻设置，使得被热交换器32冷却后的第一冷却液5能够及时被输送到冷却槽21中，进一步提升了液冷装置100的散热性能。
在一些实施例中，如图8所示，冷却液驱动装置33包括多个循环泵，其中在换热模组3被插入到安装槽22中的情况下，每个循环泵将分别靠近第一组通孔61中的相应通孔。利用这种布置，多个循环泵可以分别向相应通孔中驱动第一冷却液5，能够进一步提升第一冷却液5在安装槽22与冷却槽21之间的循环速度。
在一些实施例中，可以在第一组通孔61中的每个通孔附近设置附加的循环泵。利用这种冗余设计，能够提高第一冷却液5在安装槽21与冷却槽22之间的循环稳定性。
在其他实施例中，冷却液驱动装置33还可以包括其他类型的驱动单元或采用其他布置，本公开的实施例在此方面不做严格限制。
在一些实施例中，如图8所示，换热模组3还包括多个占液块34。在换热模组3被插入到安装槽22中的情况下，多个占液块34能够至少部分地浸没在安装槽22中的第一冷却液5中。以此方式，占液块34能够排开安装槽22中的第一冷却液5的体积，从而使得安装槽22中的第一冷却液5的液面上升，减少机柜2中所需的第一冷却液5的用量，降低总体成本。
在一些实施例中，结合图1至图4以及图8所示，在换热模组3被插入到安装槽22中的情况下，多个占液块34将会靠近安装槽22的顶侧设置。在其他实施例中，占液块34还可以设置在其他位置，本公开的实施例在此方面不做严格限制。
在一些实施例中，如图8所示，多个占液块34中的相邻占液块34之间设置有供第一冷却液5流过的通道35。第一冷却液5可以流经占液块34之间的通道35，从而形成稳定的流体路径。
结合图1至图4以及图8所示，在一些实施例中，换热模组3包括位于顶部的支撑部36。在换热模组3被插入到安装槽22中的情况下，支撑部36位于安装槽22外部并且由外部框架23支撑。以此方式，换热模组3的整体重量可以可靠地支撑在外部框架23上。
在一些实施例中，支撑部36的面朝安装槽22的一侧设置有第二 密封圈(未示出)。在换热模组3被插入到安装槽22中的情况下，支撑部36与安装槽22之间通过第二密封圈密封。采用第二密封圈能够提升支撑部36与安装槽22之间的密封性能，进一步减少安装槽22中的第一冷却液5的泄露。
结合图1至图4以及图8所示，在一些实施例中，支撑部36上设置有成对把手37。通过抓握把手37，操作人员可以方便地对换热模组3进行操作，例如将换热模组3从安装槽22中抽出或将换热模组3插入到安装槽22中。
返回图1至图4，在一些实施例中，浸没式液冷装置100还包括配高支架7，配高支架7设置在冷却槽21下方并且支撑冷却槽21。利用这种布置，用户可以根据电子设备4的实际深度需要搭配具有不同的配高支架7的液冷装置，从而可以大幅度节省第一冷却液5的使用量，且能够助力实现碳中和。在一些情况下，配高支架7还可以支撑安装槽22。
图9示出了第一冷却液5的示意性流动路径，由箭头指示。如图9所示，在换热模组3被插入到安装槽22中的情况下，热交换器32和冷却液驱动装置33可以被第一冷却液5浸没。由于热交换器32中存在经由冷却液循环管路31接收的第二冷却液，因而可以利用第二冷却液对安装槽22中的第一冷却液5进行降温。冷却液驱动装置33随后将安装槽22中的第一冷却液5经由第一组通孔61驱动到冷却槽21中，并且自下而上流经电子设备4，从而对电子设备进行冷却。随后，冷却槽21中的从电子设备4吸收热量后的第一冷却液5经由第二组通孔62流动到安装槽22中。第一冷却液5在安装槽22中再次自上而下行进并且经由热交换器32降温，进行下一次循环。
在一些实施例中，如图9所示，热交换器32中的第二冷却液可以沿左右方向流动，而安装槽22中的第一冷却液5可以沿竖直方向上下流动，从而形成叉流形式的换热，增强了热交换器32的换热效率。
在一些实施例中，电子设备4包括服务器或交换机。在其他实施例中，电子设备4还可以为其他类型，本公开的实施例在此方面不做严格限制。
图10至图12示出了根据本公开的实施例的浸没式液冷装置100中的电子设备4的不同布置。如图10所示，电子设备4包括计算型服务器和存储型服务器二者。如图11所示，电子设备4主要包括存储型服务器。如图12所示，电子设备4主要包括计算型服务器。在一些实施例中，图10至图12所示的浸没式液冷装置100的机柜2的大小例如可以是8U。在其他实施例中，机柜2的大小可以大于或者小于8U，本公开的实施例在此方面不做严格限制。
结合图1所示，在根据本公开的实施例的机柜2的沿高度方向Z的高度和沿宽度方向Y的宽度与常规机柜的高度和宽度基本相同的情况下，机柜2的沿长度方向X的长度只有常规机柜的长度的六分之一左右。例如，在机柜高度处于1000mm至1100mm的范围内(例如约为1050mm)且机柜宽度处于750mm至850mm的范围内(例如约为800mm)的情况下，常规机柜的长度通常为3米左右，而本公开的实施例中的机柜2的长度只有500mm，尺寸显著减小。在根据本公开的实施例中，机柜2的沿长度方向X的长度可以根据其中设置的电子设备4的数量进行调整，推荐保持在500mm至800mm的范围内。
图10至图12中还示出了导电端子8，用于连接电子设备4，从而对电子设备4进行供电以及进行信号/数据传输等。
结合图10至图12所示，由于机柜2的尺寸与常规液冷方案相比而言较小，因此操作人员可以站在机柜2的任一侧对机柜2中的电子设备4进行操作。
在根据本公开的实施例中，通过将机柜2与换热模组3一体化的设计，并且在整个系统内部通过液液换热完成散热交换，能够极大简化浸没液冷数据中心新的架构。
图13示出了根据本公开的实施例的液冷系统900的结构示意图。如图13所示，液冷系统900包括并排布置的多个浸没式液冷装置100。多个浸没式液冷装置100中的每个浸没式液冷装置100可以是结合图1至图12描述的任意一种浸没式液冷装置100。
无论是在小型、中型或大型数据中心部署时，用户都可以根据业务需要来设置浸没式液冷装置100的数量，从而形成不同规模的业务系统，为数据中心带来了一种更为灵活高效的浸没式液冷系统部署模式。这还解决了单个机柜内的IT设备数量多而导致的单次故障损失过大的问题。比如在一些边缘计算的使用场景下，这种小型浸没式液冷装置100可以独立少量部署，带来了更多小型化灵活部署的应用场景。
此外，在大规模集群部署的时候，可以通过提前在数据中心预置机柜2和换热模组3来将浸没式液冷装置100提前布置在数据中心机房，并将冷却液循环管路31与一次侧冷却液提供系统(例如冷却塔)连接调试完成。随后，用户可以在有业务需求时，再采购IT设备，将其部署到机柜2的冷却槽21中，最后将第一冷却液5加入到冷却槽中，从而完成整个系统的部署。以此方式，可以大大缩短数据中心的部署时间。
本公开的实施例还提供了一种大规模集群部署的数据中心，包括：多个浸没式液冷装置100，预先布置在数据中心机房内，每个浸没式液冷装置100中尚未设置电子设备4并且尚未注入第一冷却液5；以及一次侧冷却液提供系统(例如冷却塔)，通过输液管路连接至每个浸没式液冷装置100的换热模组3中的冷却液循环管路31。利用这种布置，能够提前将浸没式液冷装置100与一次侧冷却液提供系统连接调试，便于快速的大规模集群部署。
在根据本公开的实施例中，浸没式液冷装置100中的机柜2的冷却槽21可以设计为具有不同尺寸，例如不同深度，以用于容纳不同大小的IT设备，例如4U，8U等，其中U表示IT设备的高度单位， 1U＝1.75英寸＝4.445厘米，4U＝7英寸＝17.78厘米，8U＝14英寸＝35.56厘米。相应地，配高支架7可以具有不同的尺寸，从而使得同一套外部框架23可以适应不同的冷却槽21。在一些实施例中，配高支架7也可以是高度可调的配高支架。
例如，一般计算型服务器的深度为600mm，存储型服务器深度为800mm，机柜2可以通过底部的配高支架7来调节冷却槽21的深度；通过设计具有不同深度的冷却槽21，能够使得液冷系统900中的IT设备对冷却液的使用量降低5-33％左右。
本公开的实施例提供了一种内部集成热交换器的液冷系统设计，高效地实现布置在其内部的服务器、交换机等IT设备的自循环冷却，降低了数据中心投资和整体运营成本，使得数据中心的整体电源使用效率(PUE)可控制在1.1以下，能够助力实现碳中和。
以上已经描述了本公开的各实施例，上述说明是示例性的，并非穷尽性的，并且也不限于所披露的各实施例。在不偏离所说明的各实施例的范围和精神的情况下，对于本技术领域的普通技术人员来说许多修改和变更都是显而易见的。本文中所用术语的选择，旨在最好地解释各实施例的原理、实际应用或对市场中的技术改进，或者使本技术领域的其他普通技术人员能理解本文披露的各实施例。

Claims (20)

  1. 一种浸没式液冷装置(100)，其包括：
    机柜(2)，所述机柜(2)包括冷却槽(21)和集成在所述冷却槽(21)的外壁(211)上的安装槽(22)，所述冷却槽(21)用于容纳待冷却的电子设备(4)以及第一冷却液(5)，所述安装槽(22)用于容纳所述第一冷却液(5)，所述冷却槽(21)与所述安装槽(22)经由通孔(6)流体连通；以及
    换热模组(3)，适于被插入到所述安装槽(22)中，所述换热模组(3)包括冷却液循环管路(31)、热交换器(32)、以及冷却液驱动装置(33)，所述冷却液循环管路(31)与所述热交换器(32)流体连通以用于向所述热交换器(32)提供第二冷却液，所述热交换器(32)用于利用其内部的所述第二冷却液对其外部的所述第一冷却液(5)进行冷却，所述冷却液驱动装置(33)用于使所述第一冷却液(5)在所述安装槽(22)与所述冷却槽(21)之间循环。
  2. 根据权利要求1所述的浸没式液冷装置(100)，其中，所述通孔(6)包括第一组通孔(61)和第二组通孔(62)，其中在所述换热模组(3)被插入到所述安装槽(22)中的情况下，所述冷却液驱动装置(33)靠近所述第一组通孔(61)，以用于将所述安装槽(22)中的所述第一冷却液(5)驱动到所述冷却槽(21)中，并且使所述冷却槽(21)中的所述第一冷却液(5)经由所述第二组通孔(62)流动到所述安装槽(22)中。
  3. 根据权利要求2所述的浸没式液冷装置(100)，其中，所述第一组通孔(61)靠近所述安装槽(22)的底侧设置，并且所述第二组通孔(62)靠近所述安装槽(22)的顶侧设置。
  4. 根据权利要求3所述的浸没式液冷装置(100)，其中，在 所述换热模组(3)被插入到所述安装槽(22)中的情况下，所述冷却液驱动装置(33)靠近所述安装槽(22)的底侧，并且所述热交换器(32)位于所述冷却液驱动装置(33)上方且与所述冷却液驱动装置(33)相邻设置。
  5. 根据权利要求2所述的浸没式液冷装置(100)，其中，所述冷却液驱动装置(33)包括多个循环泵，其中在所述换热模组(3)被插入到所述安装槽(22)中的情况下，所述多个循环泵中的每个循环泵分别靠近所述第一组通孔(61)中的相应通孔。
  6. 根据权利要求1所述的浸没式液冷装置(100)，其中，所述机柜(2)还包括外部框架(23)和顶盖(24)，所述外部框架(23)围绕所述冷却槽(21)和所述安装槽(22)设置，所述顶盖(24)可转动地连接至所述外部框架(23)并且能够在封闭所述冷却槽(21)的关闭状态与打开所述冷却槽(21)的打开状态之间切换。
  7. 根据权利要求6所述的浸没式液冷装置(100)，其中，所述顶盖(24)包括边框(241)和由所述边框(241)围绕的透明部(242)。
  8. 根据权利要求6所述的浸没式液冷装置(100)，其中，所述顶盖(24)的面朝所述冷却槽(21)的一侧设置有第一密封圈，其中在所述顶盖(24)处于所述关闭状态的情况下，所述顶盖(24)与所述冷却槽(21)之间通过所述第一密封圈密封。
  9. 根据权利要求6所述的浸没式液冷装置(100)，其中，所述机柜(2)还包括液压驱动装置，所述液压驱动装置连接在所述外部框架(23)与所述顶盖(24)之间以用于驱动所述顶盖(24)在 所述关闭状态与所述打开状态之间切换。
  10. 根据权利要求9所述的浸没式液冷装置(100)，其中，所述液压驱动装置包括一对液压杆，所述一对液压杆中的一个液压杆连接在所述顶盖(24)的第一侧(243)与所述外部框架(23)之间，所述一对液压杆中的另一个液压杆连接在所述顶盖(24)的第二侧(244)与所述外部框架(23)之间，所述顶盖(24)的第一侧(243)与第二侧(244)是相对侧。
  11. 根据权利要求6所述的浸没式液冷装置(100)，其中，所述浸没式液冷装置(100)还包括配高支架(7)，所述配高支架(7)设置在所述冷却槽(21)下方并且支撑所述冷却槽(21)。
  12. 根据权利要求1所述的浸没式液冷装置(100)，其中，所述换热模组(3)还包括多个占液块(34)，其中在所述换热模组(3)被插入到所述安装槽(22)中的情况下，所述多个占液块(34)能够至少部分地浸没在所述安装槽(22)中的所述第一冷却液(5)中。
  13. 根据权利要求12所述的浸没式液冷装置(100)，其中，在所述换热模组(3)被插入到所述安装槽(22)中的情况下，所述多个占液块(34)靠近所述安装槽(22)的顶侧设置。
  14. 根据权利要求12所述的浸没式液冷装置(100)，其中，所述多个占液块(34)中的相邻占液块(34)之间设置有供所述第一冷却液(5)流过的通道(35)。
  15. 根据权利要求1所述的浸没式液冷装置(100)，其中，所述换热模组(3)还包括支撑部(36)，其中在所述换热模组(3) 被插入到所述安装槽(22)中的情况下，所述支撑部(36)位于所述安装槽(22)外部。
  16. 根据权利要求15所述的浸没式液冷装置(100)，其中，所述支撑部(36)的面朝所述安装槽(22)的一侧设置有第二密封圈，其中在所述换热模组(3)被插入到所述安装槽(22)中的情况下，所述支撑部(36)与所述安装槽(22)之间通过所述第二密封圈密封。
  17. 根据权利要求1所述的浸没式液冷装置(100)，其中，所述机柜的高度在1000mm至1100mm的范围内，所述机柜的宽度在750mm至850mm的范围内，并且所述机柜的长度在500mm至800mm的范围内。
  18. 根据权利要求1所述的浸没式液冷装置(100)，其中，所述第一冷却液(5)包括氟化液或者矿物油，和/或所述第二冷却液包括去离子水。
  19. 根据权利要求1所述的浸没式液冷装置(100)，其中，所述电子设备(4)包括服务器或交换机。
  20. 一种液冷系统(900)，其包括并排布置的多个浸没式液冷装置(100)，其中所述多个浸没式液冷装置(100)中的每个浸没式液冷装置(100)是根据权利要求1至19中任一项所述的浸没式液冷装置(100)。
PCT/CN2022/138119 2021-12-22 2022-12-09 浸没式液冷装置及液冷系统 Ceased WO2023116475A1 (zh)

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