WO2023147622A1 - Audio headset - Google Patents
Audio headset Download PDFInfo
- Publication number
- WO2023147622A1 WO2023147622A1 PCT/AU2022/051560 AU2022051560W WO2023147622A1 WO 2023147622 A1 WO2023147622 A1 WO 2023147622A1 AU 2022051560 W AU2022051560 W AU 2022051560W WO 2023147622 A1 WO2023147622 A1 WO 2023147622A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- headset
- assembly
- earcup
- headband
- locking mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/1058—Manufacture or assembly
- H04R1/1066—Constructional aspects of the interconnection between earpiece and earpiece support
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/1008—Earpieces of the supra-aural or circum-aural type
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/105—Earpiece supports, e.g. ear hooks
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/1083—Reduction of ambient noise
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/1091—Details not provided for in groups H04R1/1008 - H04R1/1083
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R5/00—Stereophonic arrangements
- H04R5/033—Headphones for stereophonic communication
- H04R5/0335—Earpiece support, e.g. headbands or neckrests
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/10—Details of earpieces, attachments therefor, earphones or monophonic headphones covered by H04R1/10 but not provided for in any of its subgroups
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/10—Details of earpieces, attachments therefor, earphones or monophonic headphones covered by H04R1/10 but not provided for in any of its subgroups
- H04R2201/107—Monophonic and stereophonic headphones with microphone for two-way hands free communication
Definitions
- the present invention relates generally to the field of audio headsets, and more particularly to a headset including improved comfort and functionality.
- Headphones are often used to output audio to a user via a pair of ear cups. Similar to headphones, headsets typically output audio to a user and also include a microphone to, for example, facilitate communicating with others.
- Headsets may be used for various applications, such as video gaming.
- Video games have become increasingly complex and allow gamers to play against individuals via the internet.
- audio plays an important part in providing the gaming experience.
- a gamer will wear a headset that provides game audio to the user's ears, as well as includes a microphone to allow the gamers to communicate with each other.
- Game audio often refers to audio generated by a video game, usually during game play. Such audio may include musical soundtracks, sound effects, and other audio. The importance of game audio often depends on the type of video game or the type of interactions involved. For example, in puzzles games, audio may serve to enhance the game play but may not be crucial for proper gamer interaction with the video game. In contrast, game audio may play an important or even crucial role in achieving favorable results for certain video games. For instance, the ability to hear sounds of the surrounding gaming environment may be important in a first-person shooter. Examples of audio that gamers rely on may include footsteps of approaching enemies, doors opening, vehicles, and other game audio. Based on the audio received, a gamer may, for example, communicate with teammates, anticipate their next move, determine their next response, or perform a certain action.
- Conventional headsets also often include fixed constructions such that there is little or no opportunity to easily upgrade or interchange individual components. As a result, conventional headsets may be difficult to repair and may require replacement after a limited number of uses.
- the present invention relates generally to the field of audio headsets, and more particularly to a headset including improved comfort and functionality
- the headset may include one or more earcup assemblies and a headband assembly.
- the headband assembly may include a bracket having one or more slots. Each slot of the bracket may be configured to receive a locking mechanism.
- the locking mechanism may be operable for adjusting a distance between the headband assembly and the one or more earcup assemblies.
- the headset may include a post that is pivotally attach to an earcup assembly and the locking mechanism to facilitate pivotal movement of the earcup assembly with respect to the headband assembly.
- the headband assembly may further include a cushion assembly removably coupled to the bracket.
- the cushion assembly may be configured to connect to one or more stoppers of the headband assembly.
- the cushion assembly may include a top section detachably coupled to a bottom section via, for example, a hook and loop fastener.
- the top section may include a channel for guiding a flat wire.
- the locking mechanism of the headset may be a cam assembly including a housing and thumb pad.
- the housing may contain a cam and a lockpad.
- the thumb pad may include a rod having a pin that is configured to interface with the cam.
- locking mechanism may be configured to compress and secure to the bracket.
- the user may adjust a distance between the headband assembly and the earcup assembly.
- the earcup assemblies of the headset may include a frame, a driver assembly, and an earpad.
- the driver assembly may be detachably connected to the frame.
- the earpad may be detachably connected to the driver assembly.
- the earpad is formed of one or more layers.
- One layer may be configured to cover the remaining layers and formed of an acoustically absorbent material, such as alcantara.
- Another layer may be a memory foam layer that provides additional comfort to a user.
- Yet another layer may be a cooling layer, such as a cooling gel to, for example, reduce ear fatigue and discomfort.
- the earcup assembly may further comprise a bayonet mount configured to couple with a corresponding bayonet fastener.
- the earcup assembly may include an input port.
- one earcup assembly may include a first input port configured to couple with an audio source and the other earcup assembly may include a second input port configured to couple with a microphone.
- FIG. 1 illustrates a perspective view of a headset
- FIG. 2A illustrates a front view of the headset of FIG. 1;
- FIG. 2B illustrates a sectional view of an exemplary headband assembly of the headset of FIG. 1;
- FIG. 3 illustrates a side view of the headset of FIG. 1;
- FIG. 4 illustrates a bottom view of the headset of FIG.1 ;
- FIG. 5 illustrates an exploded view of an exemplary locking mechanism
- FIG. 6 illustrates the locking mechanism of FIG. 5;
- FIG. 7 illustrates an exemplary headband assembly including the locking mechanism of FIG. 5;
- FIG. 8 illustrates a lockpad and a cam of an exemplary locking mechanism
- FIG. 9A illustrates a perspective view of a locking mechanism in an unlocked position
- FIG. 9B illustrates a perspective view of a locking mechanism in an locked position
- FIG. 10A illustrates a section view of a locking mechanism in an unlocked position
- FIG. 10B illustrates a rear view of a locking mechanism in an unlocked position
- FIG. 10C illustrates a section view of a locking mechanism in a locked position
- FIG. 10D illustrates a bottom view of a locking mechanism in a locked position
- FIG. 11 illustrates an exploded view of earcup assembly
- FIG. 12A illustrates a frame of the earcup assembly of FIG. 11
- FIG. 12B is a sectional view illustrating an exemplary connection of the earcup frame to a bracket
- FIG. 13A illustrates an exemplary connection of the frame to a driver assembly
- FIG. 13B is a sectional view illustrating the exemplary connection of the frame to a driver assembly of FIG. 13 A;
- FIG. 14A illustrates an exemplary connection of earpad assembly to the driver assembly
- FIG. 14B illustrates a rear view of the earpad of FIG. 14A
- FIG. 14C is a sectional view illustrating the exemplary connection of the driver assembly to an earpad of FIG. 14A.
- the present invention relates generally to audio headsets and more particularly to a headset including improved comfort and functionality.
- the headset may be shaped to provide a comfortable and proper seal to, for example, reduce ambient noise.
- the headset may be configured to include various interchangeable components and may further include several input ports.
- the headset may be modular and also may facilitate coupling with one or more interfaces, such as an audio source and a microphone.
- FIGS. 1-4 illustrate an exemplary headset 100 shaped to fit comfortably over the top of the user's head.
- headset 100 may include a headband assembly 102 and an earcup assembly 104.
- a locking mechanism 110 may be configured to adjust a distance between headband assembly 102 and earcup assembly 104, as detailed below.
- headset 100 also may include a bracket 140 pivotally coupling earcup assembly 104 to locking mechanism 110.
- Bracket 140 may be curved to conform to the shape of earcup assembly 104.
- Bracket 140 may be configured to facilitate pivotal movement of earcup assembly 104 with respect to the headband assembly 102 such that a force on the head of the user may be spread evenly around their ears.
- headband assembly 102 may include a headband 106 including one or more preferably longitudinal slots 108. Slots 108 may be formed on either end of headband 106 and configured to receive locking mechanism 110.
- Headband 106 may be made of a suitable material, such as plastic, metal, or some other lightweight material.
- a cushion assembly 112 may be removably attached to headband 106.
- Cushion assembly 112 may include a top section 116 and a bottom section 118.
- Bottom section 118 may include a padding 120 formed on a brace 119.
- Padding 120 may be, for example, a gel, foam or other suitable material.
- each segment 116, 118 of cushion assembly 112 may removably attach to headband 106 via one or more stoppers 114.
- Stopper 114 may be slidably engaged with headband 106.
- a bulge 107 of headband 106 is configured to pry against a rim 115 of stoppers 114 to secure cushion assembly 112 to headband 106.
- top section 116 of cushion assembly 112 may include a knob (not shown) configured to be inserted into an aperture 160 (FIG. 6) of headband 106. Further, extra fabric of top section 116 may wrap around and enclose headband 106.
- Bottom segment 118 of cushion assembly 112 may be detachably coupled to top segment 116 by a hook-and-loop type fastener. It is further contemplated that segments 116, 118 of padding 120 may be detachably coupled to one another via, for example, buttons, hooks, clasps, pins, or other known fasteners.
- a conductive cable or wire 122 interconnects each earcup assembly 104 and may be configured to carry an audio signals.
- Wire 122 may be substantially flat and flexible, and may run along headband 106 through locking mechanism 110, cushion assembly 112, and stoppers 114.
- locking mechanism 110 may include a cable slit 150 (FIG. 5) configured to receive wire 122.
- top segment 116 of cushion assembly 112 may include a channel 121 (FIG. 2B) into which wire 122 may be positioned substantially flush with the surface of top segment 116 such that wire 122 does not interfere with the coupling of cushion assembly 112 to headband 106.
- FIGS. 5-10D illustrate an exemplary locking mechanism 110 operable to adjust a distance between headband assembly 102 and earcup assembly 104.
- locking mechanism 110 may include a housing 138.
- Housing 138 may be configured to contain one or more actuating components. While various actuating components are contemplated, as illustrated in FIG. 5, housing 138 may contain a cam assembly including, for example, a lockpad 142, a cam 144, and a retainer 146.
- housing 138 also may include a substantially circular opening 147 for receiving a thumb pad 136, a substantially semi-circular lip 149 for limiting the rotation of thumb pad 136, a bracket slit 148 for receiving headband 106 and, as discussed above, a cable slit 150 for receiving wire 122.
- Thumb pad 136 may include indicia 158, such as symbols or words, such that locking mechanism 110 may be easily manipulated by the user, as detailed below.
- FIG. 8 illustrates an exemplary lockpad 142 and cam 144 of locking mechanism 110.
- lockpad 142 may include a front surface 170 and an opposing back surface 171. Front surface 170 may be substantially flat or include a slight curve with a large radius corresponding to the headband 106 curvature and radius.
- Back surface 171 may include protrusions 172 and depressions 173.
- Lockpad 142 may further include a core section 174 with appendages 176 on either end. Core section 174 may include an opening 178.
- back surface 171 of core section 174 may be adapted to receive cam 144 such that opening 178 of lockpad 142 lines up with a rounded cavity 180 of cam 144.
- Cam 144 may be substantially circular and may include a front surface 162 and a substantially flat back surface 164. As shown, front surface 162 of cam 144 also may include protrusions 166 and depressions 168, each of which is configured to align with protrusions 172 and/or depressions 173 of lockpad 142, as detailed below.
- FIGS. 9A-9B and FIGS. 10A-10D illustrate an exemplary connection of thumb pad 136 to housing 138 via a rod 137 having a pin 139.
- Rod 137 may be configured to pass through slot 108 in headband 106 and an opening 155 of extension member 154 of bracket 140 (FIG. 6).
- Pin 139 may be configured to pass through opening 178 of lockpad 142.
- Pin 130 also may be shaped to interface with rounded cavity 180 to turn cam 144.
- pin 139 may include a threaded interior configured to receive a corresponding fastener 156, thereby securing locking mechanism 110 to headband 106 and bracket 140.
- thumb pad 136 results in a corresponding rotation of cam 144. While thumb pad is shown to rotate approximately 90 degrees, other rotations are contemplated including, for example, 180 degrees and 360 degrees.
- thumb pad 136 may correspond to an unlocked position 182 or a locked position 184 of locking mechanism 110. More specifically, when thumb pad 136 is rotated to unlocked position 182, pin 139 may interface with cavity 180 to turn cam 144 such that protrusions 172 of lockpad 142 align with depressions 168 of cam 144. When thumb pad 136 is rotated to locked position 184, pin 139 may interface with cavity 180 to turn cam 144 such that protrusions 172 of lockpad 142 align with protrusions 166 of cam 144. In other words, when rotating thumb pad 136, depressions 168 of cam 144 may correspond to unlocked position 182 and protrusions 166 of cam 144 may correspond to locked position 184.
- front surface 170 of lockpad 142 is configured to compress headband 106 between housing 138 and thumb pad 136.
- front surface 170 of lockpad 142 is configured to decompress headband 106, thereby facilitating adjustment of a distance between headband assembly 102 and corresponding earcup assembly 106.
- headset 100 may further include one or more earcup assemblies 104 comprising interchangeable components, as detailed below.
- Earcup assemblies 104 may be D-shaped to resemble the structure of a user’s ear and head. Other shapes of earcup assemblies 104 are contemplated including, for example, a cup, cone or other forms that may comfortably contact, and in some cases seal to, the user's head.
- the height of ear cup assembly 104 may range between about eighty millimeters to about one hundred and twenty millimeters, and preferably between about ninety millimeters and one hundred millimeters. In one embodiment, earcup assembly 104 has an approximate height of about ninety-five millimeters. [0062] The width of earcup assembly 104 may range between about sixty millimeters to about ninety millimeters, and preferably between about seventy millimeters and eighty millimeters. In one embodiment, ear cup assembly 104 has an approximate height of about seventy-five millimeters.
- earcup assembly 104 may include a frame 124 and an earpad 126. Between frame 124 and earpad 126, earcup assembly 104 may include a driver assembly 186 and a seal 188.
- Frame 124 may be formed of a plastic material or the like that can be curved (such as by molding) to the desired shape and size. As shown, frame 124 may include an interior surface 123 and an exterior surface 125. Interior surface 123 may include ribs 196 and connectors 198. Ribs 196 may be configured to reinforce the structure of frame 124. Connectors 198 of frame 124 may facilitate attachment to, for example, driver assembly 186 having corresponding connectors 204 (FIGS. 13A-13B).
- exterior surface 125 of frame 124 may include an indicia 194, such as letters, symbols, braille, and the like.
- exterior surface 125 may include extended portion 128 configured to create space for seal 188.
- Frame 124 also may include several openings, such as a wire opening 129, an interface opening 130, and a post opening 131.
- Wire opening 129 may be configured to receive wire 122.
- wire 122 may include a mass 152 configured to plug wire opening 129.
- Interface opening 130 is configured to receive an interface, which may couple with input port 132 of driver assembly 186.
- seal 188 may abut interface opening 129. Seal 188 may operate in conjunction with a connector or bayonet mount 134 of ear cup assembly 104.
- bayonet mount 134 may be include one or more radial pins. Each radial pin may be adapted to receive a corresponding female receptor with L-shaped slot. In operation, the female slot are inserted into bayonet mount 134 and caused to turn so that the radial pin engages the slot.
- FIGS. 12A-12B illustrate an exemplary attachment of frame 124 to bracket 140.
- interior surface 123 of post 124 may be configured to clutch a support plate 190 via a long branch 193 and a short branch 191, each of which are on either end of post opening 131.
- Post opening 131 may receive an insert 200 of bracket 140.
- Insert 200 may include a threaded interior configured to receive a corresponding fastener 202, which is placed through support plate 190.
- Fastener 202 may be inserted through a support plate 190.
- bracket 140 may be pivotally attached to earcup assembly 104 to facilitate pivotal movement with respect to the headband assembly 102.
- bracket 140 may facilitate rotation of earcup assembly 104 on at least two axes with respect to headband assembly 102.
- driver assembly 186 may be removably attached to frame 124.
- Driver assembly 186 may include a front surface 185 and a rear surface 187.
- rear surface 187 may include connectors 204 corresponding to connectors 198 of frame 124.
- Various connectors are contemplated to secure driver assembly 186 to frame 124 including, for example, clips, clasps, snaps, buttons, hook and loop fasteners, and the like.
- Driver assembly 186 may facilitate converting an electrical signal to a sound wave and outputting the converted sound wave to a user.
- Driver assembly 186 may include an input port 132 (FIG. 11) configured to receive, for example, a tip-sleeve (TS) interface, a tip-ring-sleeve (TSR) interface, a tip-ring-ring-sleeve (TRRS) interface, an RCA interface, an XLR interface, and the like.
- TS tip-sleeve
- TSR tip-ring-sleeve
- TRRS tip-ring-ring-sleeve
- one earcup assembly 104 of headset 100 may include a first interface and the another earcup assembly 104 may include a second interface.
- headset 100 may facilitate coupling with various devices.
- a first input port may be configured to couple with an audio source and second input port may be configured to couple with a microphone.
- earpad 126 may be removably attached to driver assembly 186.
- earpad 126 may include a front surface 203 and a rear surface 205.
- Front surface 203 may include indicia to, for example, indicate to a user how to place the headset 100 on their head.
- Rear surface 205 may include connectors 206 corresponding to connectors 207 on front surface 185 of driver assembly 186.
- various connectors are contemplated to secure earpad 126 to driver assembly 186 including, for example, clips, clasps, snaps, buttons, hook and loop fasteners, and the like.
- earpad 126 may include one or more layers to, for example, reduce user ear fatigue and discomfort. As shown in FIG. 14C, earpad 126 may include a first layer 208, second layer 209, and third layer 210.
- First layer 208 may be formed of a flexible polyurethane foam, e.g., memory foam, which may have properties that measure according to JIS K 6400.
- a thickness of first layer 208 may range between about ten millimeters and about twenty millimeters, and preferably between about twelve millimeters and about sixteen millimeters. In one embodiments, a thickness of first layer 208 may be about fourteen millimeters.
- Second layer 209 may be a gel layer, which may be defined by an encasement of cooling gel.
- the second layer 209 may be adapted to absorb and retain cool temperatures and resist absorbing heat given off by a wearer's head. It is also contemplated that the second layer 209 may be configured to provide additional cushioning from impacts resulting from the customary use of the earpad 126.
- a thickness of second layer 209 may range between about four millimeters and about eight millimeters, and preferably between about five millimeters and about seven millimeters. In one embodiments, a thickness of second layer 209 may be about six millimeters.
- Third layer 210 may be a membrane formed from an acoustically absorbent material and/or perforated leather, such as Alcantara. Third layer 210 may wrap around or cover other layers, such as first layer 208 and second layer 209. A thickness of third layer 210 may range between about a quarter of a millimeter and about three quarters of a millimeter, and preferably between about a third of a millimeter and about half of a millimeter. In one embodiments, a thickness of third layer 210 may be about four tenths of a millimeter.
- headset 100 may be shaped to provide a comfortable and proper seal to a user.
- headset 100 may be configured to include various interchangeable components and may further include several input ports.
- the headset may be modular and also may facilitate coupling with one or more interfaces, such as an audio source and a microphone.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Health & Medical Sciences (AREA)
- Otolaryngology (AREA)
- Manufacturing & Machinery (AREA)
- Headphones And Earphones (AREA)
Abstract
Description
Claims
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020247029511A KR20240144330A (en) | 2022-02-04 | 2022-12-22 | Audio headset |
| CN202280090633.9A CN118743247A (en) | 2022-02-04 | 2022-12-22 | Audio headset |
| JP2024545020A JP2025504962A (en) | 2022-02-04 | 2022-12-22 | Audio Headset |
| CA3244012A CA3244012A1 (en) | 2022-02-04 | 2022-12-22 | Audio headset |
| AU2022438825A AU2022438825A1 (en) | 2022-02-04 | 2022-12-22 | Audio headset |
| EP22924603.8A EP4458029A4 (en) | 2022-02-04 | 2022-12-22 | AUDIO HEADPHONES |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/592,722 US11910151B2 (en) | 2022-02-04 | 2022-02-04 | Audio headset |
| US17/592,722 | 2022-02-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2023147622A1 true WO2023147622A1 (en) | 2023-08-10 |
Family
ID=87520678
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/AU2022/051560 Ceased WO2023147622A1 (en) | 2022-02-04 | 2022-12-22 | Audio headset |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US11910151B2 (en) |
| EP (1) | EP4458029A4 (en) |
| JP (1) | JP2025504962A (en) |
| KR (1) | KR20240144330A (en) |
| CN (1) | CN118743247A (en) |
| AU (1) | AU2022438825A1 (en) |
| CA (1) | CA3244012A1 (en) |
| WO (1) | WO2023147622A1 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1017576S1 (en) * | 2021-12-07 | 2024-03-12 | Tao Peng | Headphone |
| USD1018497S1 (en) * | 2022-02-04 | 2024-03-19 | Freedman Electronics Pty Ltd | Headphone |
| USD1019597S1 (en) * | 2022-02-04 | 2024-03-26 | Freedman Electronics Pty Ltd | Earcups for a headset |
| USD1017572S1 (en) * | 2022-04-11 | 2024-03-12 | Shenzhen Sarepo Technology Co., Ltd. | Headset |
| USD1006784S1 (en) * | 2023-09-19 | 2023-12-05 | Shenzhen Yinzhuo Technology Co., Ltd. | Headphone |
| USD1012065S1 (en) * | 2023-09-21 | 2024-01-23 | Shengbo ZHANG | Foldable headphone |
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| US20090103762A1 (en) * | 2007-10-22 | 2009-04-23 | Hiroyuki Ishida | Headphones |
| US20120140961A1 (en) * | 2007-12-17 | 2012-06-07 | Jordan Reiss | Headset with Noise Plates |
| US20140177884A1 (en) * | 2012-11-29 | 2014-06-26 | Polk Audio, Inc. | Personalized modular headphone system and method |
| US20200280784A1 (en) * | 2017-11-20 | 2020-09-03 | Apple Inc. | Headphones with Telescoping Stem Assembly |
| KR102152342B1 (en) * | 2019-06-12 | 2020-09-04 | 김종호 | Headset |
| US20210392424A1 (en) * | 2020-06-12 | 2021-12-16 | Safariland, Llc | Multi-configurable headset support apparatus |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5862241A (en) * | 1996-05-03 | 1999-01-19 | Telex Communications, Inc. | Adjustable headset |
| AU2009201813B2 (en) * | 2008-05-14 | 2013-08-29 | Nixon, Inc. | Headphones |
| US10616673B2 (en) * | 2018-05-17 | 2020-04-07 | Bose Corporation | Snapfold headband cushion |
| US11006206B2 (en) * | 2019-06-07 | 2021-05-11 | Microsoft Technology Licensing, Llc | Ergonomic headphone device |
| US11185120B2 (en) * | 2020-02-20 | 2021-11-30 | Varjo Technologies Oy | Adjustment mechanism for adjusting length of a headband |
| US11190878B1 (en) * | 2020-09-16 | 2021-11-30 | Apple Inc. | Headphones with on-head detection |
-
2022
- 2022-02-04 US US17/592,722 patent/US11910151B2/en active Active
- 2022-12-22 WO PCT/AU2022/051560 patent/WO2023147622A1/en not_active Ceased
- 2022-12-22 EP EP22924603.8A patent/EP4458029A4/en active Pending
- 2022-12-22 KR KR1020247029511A patent/KR20240144330A/en active Pending
- 2022-12-22 AU AU2022438825A patent/AU2022438825A1/en active Pending
- 2022-12-22 CA CA3244012A patent/CA3244012A1/en active Pending
- 2022-12-22 JP JP2024545020A patent/JP2025504962A/en active Pending
- 2022-12-22 CN CN202280090633.9A patent/CN118743247A/en active Pending
Patent Citations (6)
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| US20090103762A1 (en) * | 2007-10-22 | 2009-04-23 | Hiroyuki Ishida | Headphones |
| US20120140961A1 (en) * | 2007-12-17 | 2012-06-07 | Jordan Reiss | Headset with Noise Plates |
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| US20200280784A1 (en) * | 2017-11-20 | 2020-09-03 | Apple Inc. | Headphones with Telescoping Stem Assembly |
| KR102152342B1 (en) * | 2019-06-12 | 2020-09-04 | 김종호 | Headset |
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Also Published As
| Publication number | Publication date |
|---|---|
| US11910151B2 (en) | 2024-02-20 |
| AU2022438825A1 (en) | 2024-08-01 |
| EP4458029A1 (en) | 2024-11-06 |
| EP4458029A4 (en) | 2025-08-06 |
| JP2025504962A (en) | 2025-02-19 |
| US20230254627A1 (en) | 2023-08-10 |
| CA3244012A1 (en) | 2023-08-10 |
| CN118743247A (en) | 2024-10-01 |
| KR20240144330A (en) | 2024-10-02 |
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