WO2023197965A1 - 显示模组、电子设备、显示模组的制备方法 - Google Patents

显示模组、电子设备、显示模组的制备方法 Download PDF

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Publication number
WO2023197965A1
WO2023197965A1 PCT/CN2023/087028 CN2023087028W WO2023197965A1 WO 2023197965 A1 WO2023197965 A1 WO 2023197965A1 CN 2023087028 W CN2023087028 W CN 2023087028W WO 2023197965 A1 WO2023197965 A1 WO 2023197965A1
Authority
WO
WIPO (PCT)
Prior art keywords
display
area
lower frame
electronic device
frame area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2023/087028
Other languages
English (en)
French (fr)
Inventor
龙浩晖
张立
孙艺哲
马会财
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Priority to EP23787609.9A priority Critical patent/EP4478342A4/en
Publication of WO2023197965A1 publication Critical patent/WO2023197965A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
    • G06F1/1641—Details related to the display arrangement, including those related to the mounting of the display in the housing the display being formed by a plurality of foldable display components
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
    • G06F1/1652—Details related to the display arrangement, including those related to the mounting of the display in the housing the display being flexible, e.g. mimicking a sheet of paper, or rollable
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates

Definitions

  • the present application relates to the field of display technology, and in particular to a display module, an electronic device including the display module, and a preparation method of the display module.
  • DDIC display driver integrated circuit
  • TPIC touch panel integrated circuit
  • Figures 1 and 2 show one of the packaging structures of a display driver chip DDIC in a display device (such as a mobile phone), and Figure 2 is a cross-sectional view along the M-M direction of Figure 1.
  • This packaging structure can be It is called chip on panel (COP) packaging.
  • COP chip on panel
  • the display driver chip 13 is disposed on the lower frame area CC, and other electronic devices 14, such as a touch chip (TPIC), capacitors, resistors, etc., are integrated on a flexible printed circuit board (flexible printed circuit) that is electrically connected to the main circuit board.
  • FPC flexible printed circuit board
  • the FPC 12 extends in a direction parallel to the lower frame area CC, and the FPC 12 is connected to the lower frame area CC through the bonding structure 16 to realize the signal between the electronic device 14 on the FPC 12 and the display driver chip 13 interconnected.
  • the FPC 12 When using the on-panel chip packaging technology shown in FIGS. 1 and 2 , since the electronic devices 14 electrically connected to the display driver chip 13 are integrated on the FPC 12 , the FPC 12 needs to be laid out and occupies a relatively large space. Therefore, the size of the display device will be increased, for example, the size in the Y direction as shown in Figure 2 will be larger.
  • the size of the display device in the Y direction when the size of the display device in the Y direction is constant, the size of other structures in the Y direction will be correspondingly reduced due to the existence of the large-size FPC 12 .
  • the use space of the battery 15 in the Y direction may be limited, which may limit the growth of the battery capacity and also limit the improvement of the battery life of the display device such as a mobile phone.
  • the present application provides a display module, an electronic device including the display module, and a preparation method of the display module.
  • the solution of this application provides a display module that can reduce the space occupied, so that the display module When the display module is used in electronic equipment, it can create more space for other structural components in the electronic equipment.
  • this application provides a display module, which can be applied in electronic devices with display functions, such as mobile phones, televisions, etc.
  • the display module includes: a flexible display panel and a chip package.
  • the flexible display panel includes a display area, a bending area located at the outer edge of the display area, and a lower frame area adjacent to the bending area.
  • the lower frame area is located on the back of the display area.
  • a chip package (such as a display driver chip) is provided on the lower frame area;
  • the display module also includes a packaging structure, the packaging structure includes a substrate, and a first electronic device and a second electronic device provided on the substrate, and, The substrate is disposed on the lower frame area; furthermore, the lower frame area includes a first wiring structure, and the first electronic device and the second electronic device are electrically connected to the chip package through the first wiring structure.
  • a display driver chip can be disposed on the lower frame area. Then, the display driver chip can drive the drive circuit of the pixel unit in the display area to realize the display function.
  • the first electronic device and the second electronic device that are electrically connected to the display area for example, the first electronic device and the second electronic device can be capacitors, inductors, resistors or touch chips, etc., are packaged in a system-level package ( system in package (SIP) technology is encapsulated in an encapsulation structure, and the encapsulation structure is also set on the lower border area.
  • SIP system in package
  • the display module has a circuit board that is electrically connected to the main circuit board, some of the electronic devices (such as the first electronic device and the second electronic device here) or all of the electronic devices that are electrically connected to the display area It can be transferred from the circuit board to the packaging structure, thereby reducing the area of the circuit board and reducing the space occupied by the circuit board, thereby reducing the space occupied by the display module.
  • the display module provided in this application when the display module provided in this application is applied to electronic equipment, more accommodation space can be reserved for other structural components, or, while the dimensions of other structural components remain unchanged, it can be made
  • the electronic device meets the miniaturization design requirements.
  • the display module further includes: a circuit board, which may be a flexible circuit board; the extension direction of the circuit board is perpendicular to the extension direction of the lower frame area, and the circuit board is used to electrically connect the lower frame bezel area and main circuit board.
  • a circuit board which may be a flexible circuit board; the extension direction of the circuit board is perpendicular to the extension direction of the lower frame area, and the circuit board is used to electrically connect the lower frame bezel area and main circuit board.
  • the circuit board is arranged in such a way that the extension direction of the circuit board is perpendicular to the extension direction of the lower frame region, instead of being parallel to the extension direction of the lower frame region as in the related art.
  • the circuit board extends along the X direction perpendicular to the Y direction. In this case, the space occupied in the Y direction will be reduced.
  • the first part of the circuit board is located on the side of the lower frame area, and the first part is used to electrically connect to the main circuit board.
  • the display module further includes: a third electronic device, and the third electronic device is disposed on the first part, and the third electronic device is electrically connected to the display area, or is electrically connected to the first electronic device and the third electronic device. Two electronic devices are electrically connected.
  • the third electronic device may be integrated on the first part and with the display area, or with the first electronic device and the second Electronic devices electrical connections.
  • the second part of the circuit board covers the lower frame area, and the second part is electrically connected to the lower frame area; a receiving cavity is opened in the second part, and the chip package and the packaging structure are placed in in the accommodation cavity.
  • the number of conductive layers of the circuit board can be reduced to reduce the thickness of the second part. Furthermore, the size of the display module in the direction perpendicular to the lower frame area will not be increased too much. For example, the size of the Z direction perpendicular to both the X direction and the Y direction will not be increased too much.
  • one end of the second part away from the first part is electrically connected to the lower frame area through a connection structure.
  • a connection structure For example, through bonding structures.
  • connection process between the circuit board and the lower frame area can also be kept unchanged, that is, it is compatible with the existing connection process.
  • the first electronic device or the second electronic device includes at least one of a touch chip and a passive device.
  • the first electronic device is a touch chip
  • the second electronic device includes an inductor, a resistor, and the like.
  • the lower frame area includes a substrate, and a first wiring structure is formed on the substrate;
  • the first wiring structure includes at least three layers of a first conductive layer, a first dielectric layer and a first conductive channel, At least three first conductive layers are stacked in a direction perpendicular to the substrate; a first dielectric layer is provided between each adjacent two first conductive layers to isolate them; a first conductive channel runs through the first dielectric layer , to electrically connect different first conductive layers.
  • the wiring structure used to electrically connect the packaging structure and the display area is a multi-layer (at least three-layer) wiring structure, rather than the single-layer or two-layer wiring structure in the related art.
  • a second wiring structure is also formed in the lower frame area, and the chip package is electrically connected to the display area through the second wiring structure. That is, the second wiring structure formed on the lower frame area can be used to realize signal interconnection between the chip package (eg, display driver chip) and the display area.
  • the second wiring structure includes a second conductive layer; or, the second wiring structure includes: two second conductive layers, a second dielectric layer and a second conductive channel, two The second conductive layer is stacked in a direction perpendicular to the substrate; a second dielectric layer is provided between the two second conductive layers; the second conductive channel penetrates the second dielectric layer to electrically connect the two layers second conductive layer.
  • At least two different wiring structures are formed, one is single-layer or double-layer wiring, and the other is at least three-layer wiring.
  • the second wiring structure is arranged close to the bending area relative to the first wiring structure.
  • the multi-layer wiring structure is away from the bending area, and the single-layer or double-layer wiring structure is close to the bending area.
  • a single-layer or double-layer conductive layer wiring structure is formed on the bending area.
  • the flexibility of the bending area can be ensured, so that the lower frame area can be located on the back of the display area under the bending of the bending area.
  • the arrangement direction of the chip packages and packaging structures is perpendicular to the extension direction of the lower frame area; or, the arrangement direction of the chip packages and packaging structures is parallel to the extension direction of the lower frame area.
  • the chip package includes a first display driver chip and a second display driver chip, and the arrangement direction of the first display driver chip and the second display driver chip is perpendicular to the extension direction of the lower frame area, And the packaging structure is located between the first display driving chip and the second display driving chip.
  • the display module with this structure can be applied in a foldable display device, such as a foldable mobile phone.
  • Disposing the packaging structure between the first display driver chip and the second display driver chip will not increase the size of the display module in the direction in which the extension direction of the lower frame area is consistent with the increase in the packaging structure. For example, it will not increase the size of the display module. Will increase the size of the phone in the Y direction.
  • the chip package and the packaging structure are located on a side of the lower frame area away from the display area.
  • the chip package and the packaging structure are arranged oppositely on both sides of the lower frame area.
  • the first electronic device and the second electronic device are respectively disposed on the same surface of the substrate through electrical connection structures.
  • a two-dimensional integration method is used to arrange the first electronic device and the second electronic device on the substrate.
  • the first electronic device and the second electronic device are stacked on the substrate in a direction perpendicular to the substrate.
  • a three-dimensional integration method is used to arrange the first electronic device and the second electronic device on the substrate.
  • this application also provides an electronic device, which may be an electronic device with a display function.
  • the electronic device includes a main circuit board and a display module related to any of the above implementations, wherein the display module is electrically connected to the main circuit board.
  • the display module is electrically connected to the main circuit board.
  • at least one of the display panel, display driving circuit, and packaging structure in the display module is electrically connected to the main circuit board.
  • the display driver chip can be integrated on the lower frame area of the flexible display panel, but also the display driver chip can be integrated with the display area to be electrically connected.
  • the first electronic device and the second electronic device are also integrated on the lower frame area in a modular system-level packaging structure. Then, there is no need to set up a circuit board with a large area, so that the display module occupies a large area in the electronic device. Space is reduced.
  • a placement space is formed on a side of the lower frame area away from the bending area; the electronic device further includes a battery, and the battery is placed in the placement space.
  • the space for placing the battery can be larger, the battery capacity can be increased, and the battery life of the electronic device can be improved.
  • this application also provides a method for preparing a display module, which includes:
  • a chip package electrically connected to the display area is provided on the lower frame area of the flexible display panel;
  • a packaging structure is provided on the lower frame area.
  • the packaging structure includes a substrate arranged on the lower frame area, and a first electronic device and a second electronic device arranged on the substrate, and the first electronic device and the second electronic device are formed on the lower frame area.
  • the first wiring structure on the flexible display panel is electrically connected to the chip package; wherein, the flexible display panel includes a display area, a bending area located at the outer edge of the display area, and a lower frame area adjacent to the bending area, and the lower frame area is located at the edge of the display area. back.
  • the display driver chip can be integrated in the lower frame area of the flexible display panel, but also the packaging structure integrating multiple electronic devices can be integrated in the lower frame area, that is, using The lower frame area serves as a carrier for multiple electronic devices.
  • the area of the circuit board can be reduced, so that the size of the display module produced is relatively small and the space occupied by the display module is reduced.
  • the preparation method before arranging the packaging structure and the chip package on the lower frame area, the preparation method further includes:
  • the conductive layer and dielectric layer used to form the second wiring structure on the lower frame area are a single conductive layer, or two conductive layers, Furthermore, the number of conductive layers and dielectric layers used to form the first wiring structure on the lower frame area is retained to be the same as the number of conductive layers and dielectric layers on the display area.
  • the conductive layer and the dielectric layer in part of the lower frame area can be removed to form a single-layer wiring or a double-layer wiring for electrically connecting the display driver chip and the display area.
  • the conductive layer and the dielectric layer can be removed. No treatment is required, thus simplifying the preparation process.
  • the preparation method further includes:
  • a circuit board is provided, and the circuit board extends in a direction perpendicular to the extension direction of the lower frame area.
  • the circuit board When arranging the circuit board, the circuit board extends in a direction perpendicular to the extending direction of the lower frame region, rather than in a direction parallel to the extending direction of the lower frame region.
  • the preparation method before setting the circuit board, the preparation method further includes:
  • a third electronic device is disposed on a portion of the circuit board located on the side of the lower frame area, so that the third electronic device is electrically connected to the display area, or the third electronic device is electrically connected to the packaging structure.
  • Figure 1 is a package structure diagram of a display driver chip in the related art
  • Figure 2 is a cross-sectional view taken along the M-M direction of Figure 1;
  • Figure 3a is a structural diagram of an electronic device provided by an embodiment of the present application.
  • Figure 3b is a structural diagram of another electronic device provided by an embodiment of the present application.
  • Figure 4 is a structural diagram showing an arrangement of a driver chip and some electronic devices
  • Figure 5a is a structural diagram of a display area of a flexible display panel provided by an embodiment of the present application.
  • Figure 5b is a structural diagram of the bending area or the lower frame area of a flexible display panel provided by an embodiment of the present application.
  • Figure 6 is a block diagram of a partial circuit structure in an electronic device provided by an embodiment of the present application.
  • Figure 7 is a structural diagram of an arrangement of a display driver chip and some electronic devices provided by an embodiment of the present application.
  • Figure 8 is a cross-sectional view taken along the N1-N1 direction of Figure 7;
  • Figure 9 is a structural diagram of the packaging structure provided by the embodiment of the present application.
  • Figure 10a is a structural diagram of an arrangement of a display driver chip and some electronic devices in the related art
  • Figure 10b is a structural diagram of an arrangement of a display driver chip and some electronic devices provided by an embodiment of the present application.
  • Figure 11 is a structural diagram of another arrangement of a display driver chip and some electronic devices provided by an embodiment of the present application.
  • Figure 12a is a structural diagram of an arrangement of a display driver chip and packaging structure provided by an embodiment of the present application.
  • Figure 12b is a structural diagram of another arrangement of the display driver chip and packaging structure provided by the embodiment of the present application.
  • Figure 12c is a structural diagram of another arrangement of the display driver chip and packaging structure provided by the embodiment of the present application.
  • Figure 12d is a structural diagram of an arrangement of a display driver chip and packaging structure provided by an embodiment of the present application.
  • Figure 13a is a structural diagram of the packaging structure provided by the embodiment of the present application.
  • Figure 13b is another structural diagram of the packaging structure provided by the embodiment of the present application.
  • Figure 14a is a structural diagram of a substrate of a packaging structure provided by an embodiment of the present application.
  • Figure 14b is another structural diagram of the substrate of the packaging structure provided by the embodiment of the present application.
  • Figure 14c is another structural diagram of the substrate of the packaging structure provided by the embodiment of the present application.
  • Figure 15 is a structural diagram of a display driver chip and packaging structure provided by an embodiment of the present application, as well as an arrangement of a circuit board;
  • Figure 16 is a structural diagram of a display driver chip and packaging structure provided by an embodiment of the present application, as well as another arrangement of a circuit board;
  • Figure 17 is a structural diagram of a display driver chip and packaging structure provided by an embodiment of the present application, as well as another arrangement of a circuit board;
  • Figure 18 is a cross-sectional view taken along the N2-N2 direction of Figure 17;
  • Figure 19 is a structural diagram of a display driver chip and packaging structure provided by an embodiment of the present application, as well as another arrangement of a circuit board;
  • Figure 20a is a structural diagram of an arrangement method of a display driver chip and a circuit board in the related art
  • Figure 20b is a structural diagram of a display driver chip and packaging structure provided by an embodiment of the present application, as well as another arrangement of a circuit board;
  • Figure 21 is a structural diagram of a display driver chip, packaging structure, and wiring structure provided by an embodiment of the present application.
  • Figure 22 is a cross-sectional view taken along the N3-N3 direction of Figure 21;
  • Figure 23 is a structural diagram of another arrangement of the display driver chip, packaging structure, and wiring structure provided by the embodiment of the present application.
  • Figure 24 is a structural diagram of another arrangement of the display driver chip, packaging structure, and wiring structure provided by the embodiment of the present application.
  • Figure 25 is a structural diagram of another arrangement of the display driver chip, packaging structure, and wiring structure provided by the embodiment of the present application.
  • Figure 26 is a structural diagram of another arrangement of the display driver chip, packaging structure, and wiring structure provided by the embodiment of the present application.
  • Figures 27a to 27c are schematic structural diagrams of the corresponding structures after completion of each step in the method for manufacturing the packaging structure according to the embodiment of the present application;
  • Figures 28a to 28d show the corresponding results after completion of each step in the method for producing a display module according to the embodiment of the present application. Structure diagram.
  • 11-flexible display panel 11a-substrate; 11b-light-emitting element; 11c-light-emitting drive circuit; 11d-wiring structure;
  • 17-circuit board 17a-first part; 17b-second part; 17b1-accommodating cavity;
  • 18-packaging structure 18a-substrate; 18b1-first electronic device; 18b2-second electronic device; 18b3-third electronic device; 18c-encapsulation layer; 18d-electrical connection structure;
  • Embodiments of the present application provide an electronic device, which may include a mobile phone (mobile phone), a tablet computer (pad), a television, smart wearable products (such as smart watches, smart bracelets), virtual reality (VR) ) terminal equipment, augmented reality (AR) terminal equipment and other electronic products with display functions.
  • a mobile phone mobile phone
  • a tablet computer pad
  • TV smart wearable products
  • VR virtual reality
  • AR augmented reality
  • the embodiments of the present application do not place special restrictions on the specific form of the above-mentioned electronic device with a display function.
  • the following uses a mobile phone as an example to illustrate the structure of the electronic device.
  • FIG 3a shows a structural diagram of a foldable mobile phone.
  • the foldable mobile phone may include a first housing 100a, a second housing 100b and a flexible display panel 11. Among them, the flexible display panel 11 continuously covers the first housing 100a and the second housing 100b.
  • the foldable mobile phone may also include a rotating shaft mechanism 100c, a first housing 100a and The second housing 100b is disposed on both sides of the rotating shaft mechanism 100c and is connected to the rotating shaft mechanism 100c respectively.
  • the rotating shaft mechanism 100c can move so that the first housing 100a and the second housing 100b are relatively folded or unfolded to realize a flexible display panel. 11 flattening and closing.
  • Figure 3b shows the structural diagram of a straight mobile phone.
  • the candy bar mobile phone may include a casing 100d and a flexible display panel 11, and the flexible display panel 11 covers the casing 100d.
  • the flexible display panel 11 can be used to display information and provide an interactive interface for users.
  • the flexible display panel 11 can be, but is not limited to, an organic light-emitting diode (OLED) display screen, an active matrix organic light-emitting diode or an active matrix organic light-emitting diode (active-matrix organic light-emitting diode).
  • OLED organic light-emitting diode
  • active-matrix organic light-emitting diode active-matrix organic light-emitting diode
  • AMOLED matrix organic light-emitting diode
  • mini organic light-emitting diode mini organic light-emitting diode
  • micro organic light-emitting diode micro organic light-emitting diode
  • micro organic light-emitting diode micro organic light-emitting diode
  • micro organic light-emitting diode micro organic light-emitting diode
  • micro organic light-emitting diode micro organic light-emitting diode
  • QLED quantum dot light emitting diode
  • FIG 4 shows a structural diagram of a flexible display panel 11 that can be used in the above-mentioned electronic devices.
  • the flexible display panel 11 includes a display area AA for displaying to the user, a bending area BB located at the edge of the display area AA, and a lower frame area CC adjacent to the bending area.
  • the bending area BB is used to bend the lower frame area CC to the back of the display area AA.
  • the bent area BB and the lower frame area CC connected together may be called a fanout area.
  • the side of the display area AA facing the user is the front side of the display area AA, and conversely, the side opposite to the front side of the display area AA is the back side of the display area AA. Then, it is easy to understand the positional relationship between the lower frame area CC and the display area AA, that is, the lower frame area CC faces the back of the display area AA.
  • the bending area BB exemplified in this application is formed by bending the lower frame area CC and extends along the Y direction of the electronic device.
  • the Y direction generally refers to the long side direction of the electronic device
  • the X direction refers to the short side direction of the electronic device.
  • FIG. 4 only shows an exemplary structure. In other embodiments, the bending area BB can extend along the X direction after bending the lower frame area CC.
  • FIG. 5a illustrates an implementable structure of the display area AA.
  • the display area AA may include a substrate 11a and a light-emitting driving circuit 11c provided on the substrate 11a and mainly composed of a thin film transistor (TFT).
  • the light-emitting driving circuit 11c is used to drive the light-emitting element 11b to emit light.
  • the light-emitting driving circuit 11c and the light-emitting element 11b may form a pixel unit.
  • the wiring structure in the display area AA may include multiple conductive layers, for example, at least three conductive layers, to form a circuit structure.
  • Figure 5b illustrates an achievable structure of the bending area BB. Since the bending area BB requires specific flexibility, that is, the hardness cannot be too high, and further, as shown in Figure 5b, the bending area BB It includes a substrate 11a and a wiring structure 11d provided on the substrate 11a.
  • the wiring structure 11d is used to electrically connect the display area AA with other electronic devices, and the wiring structure 11d has relatively few conductive layer structures.
  • the conductive layer structure is relatively small.
  • a small wiring structure 11d can interconnect the display area AA with other electronic devices.
  • the light-emitting driving circuit 11c can communicate with the main circuit board through the wiring structure 11d.
  • the lower frame area CC can also adopt the structure shown in Figure 5b.
  • An installation space may be formed in the first casing 100a and/or the second casing 100b of the foldable mobile phone in Figure 3a, or in the casing 100d of the straight mobile phone in Figure 3b, for installing the main circuit of the electronic device.
  • the main circuit board can integrate the main controller, storage unit, antenna module, power management module and other electronic devices of the electronic device, and the battery can power the flexible display panel 11, the main circuit board, receiver, speaker, camera and other electronic devices.
  • Figure 6 exemplarily shows a block diagram of a partial circuit structure in an electronic device.
  • the circuit structure of the electronic device may include a main circuit board, a display driver chip, a touch chip and a pixel unit, as well as other electronic components related to the display driver chip and touch chip.
  • other electronic components may be passive components. Examples include inductors, capacitors, resistors, etc.
  • Display driver chips and touch chips are important components of display touch imaging systems. They integrate resistors, regulators, power transistors and other components, and are responsible for driving flexible display panels and controlling driving current.
  • the pixel unit, display driver chip, touch chip and other electronic devices are all electrically connected to the main circuit board.
  • the display driver chip 13 in Figure 6 can be integrated on the lower frame area CC in Figure 4, and the relevant electronic devices electrically connected to the display driver chip 13 can be integrated on the circuit board 17, for example,
  • the electronic device 14 in Figure 4 may include the touch chip in Figure 6, other electronic devices, etc.
  • the circuit board 17 not only has the function of electrically connecting with the main circuit board, but also needs a larger area to carry these electronic devices that are electrically connected to the display driver chip 13 or the display area. Therefore, the area of the circuit board 17 will be reduced. Larger, such a design will lead to a larger size of the mobile phone in the Y direction as shown in Figure 3a and Figure 3b.
  • embodiments of the present application provide a display module that can be used in the above-mentioned electronic settings.
  • the display module improves the packaging technology of electronic devices so that the display module can be used in electronic devices. , it will not occupy a large space.
  • the specific structure is shown below.
  • FIG. 7 is a schematic diagram of the connection relationship between a flexible display panel 11 and some electronic devices carried on the flexible display panel 11 according to an embodiment of the present application.
  • FIG. 7 a portion of the display area AA, the lower frame area CC, and the bend area BB connecting the display area AA and the lower frame area CC are shown.
  • FIG. 8 is a cross-sectional view taken along the N1-N1 direction of FIG. 7 .
  • a flexible display panel 11 formed with a display area AA, a bending area BB of a lower frame area CC, a chip package (for example, with the display area AA
  • the electrically connected display driver chip 13) is disposed on the lower frame area CC, and the transparent cover 19 of the electronic device covers the display area AA to serve as a display window.
  • a support layer 20 is also provided in the lower frame area CC and the display area AA.
  • the support layer 20 is used to support and protect the display area AA and the lower frame area CC.
  • adhesive glue can be used The layer serves as a support layer 20 structure.
  • the structures shown in Figures 7 and 8 are different from the above embodiments in that the lower frame area CC provided in the embodiment of the present application is also provided with a packaging structure 18.
  • the packaging structure 18 includes a display driver chip 13 and/or a display Area AA electrically connects some electronic devices.
  • the chip package involved in the embodiment of the present application may be the display driver chip 13 or other chip package structures electrically connected to the display area. It can also be understood that the display driver chip 13 can also be other chip packaging structures that are electrically connected to the display area.
  • FIG. 9 shows a schematic structural diagram of a packaging structure 18.
  • the packaging structure 18 may include a substrate 18a and a plurality of electronic devices disposed on the substrate 18a.
  • FIG. 9 exemplarily shows an electronic device including a first electronic device 18b1, The second electronic device 18b2 and the third electronic device 18b3.
  • the first electronic device 18b1 and the second electronic device 18b2 may be included, or more electronic devices may be included.
  • the substrate 18a is disposed on the lower frame area CC through an electrical connection structure 18d, which may include a plurality of solder balls, such as a ball grid array (BGA), or a plurality of metal pillars.
  • BGA ball grid array
  • the packaging structure 18 may also include an packaging layer 18c, and each electronic device integrated on the substrate 18a may be encapsulated in the packaging layer 18c, so that these electronic devices are electrically isolated.
  • the packaging structure 18 may also include a heat dissipation cover covering the packaging layer 18c to dissipate the heat diffused by these electronic devices.
  • the electronic devices in the above-mentioned packaging structure 18 may include some peripheral devices related to the display driver chip 13, such as resistors, capacitors, etc., or the electronic devices may include a touch chip electrically connected to the display area, or the electronic devices may Including some peripheral devices related to the touch chip, such as resistors, capacitors, etc.
  • some electronic devices electrically connected to the display area and/or the display driver chip 13 are arranged on the circuit board 17 as shown in Figure 4, It is moved to be integrated on the lower border area CC and exists in the form of system in package (SIP). Furthermore, a wiring structure formed on the flexible display panel 11 may be used to electrically connect the packaging structure 18 to the display area AA, or to electrically connect the packaging structure 18 to the display driving chip 13 . Due to the adjustment of the position of the electronic devices, the area of the circuit board 17 can be reduced.
  • the circuit board 17 mainly serves to electrically connect the flexible display panel 11 and the main circuit board, weakening the role of carrying these electronic devices. For example, the circuit board 17 It can be reduced from the larger area shown in Figure 4 to the smaller area shown in Figure 7 .
  • Figure 10a shows a structural diagram of a display module in which multiple electronic devices are integrated on a circuit board 17 in the prior art
  • Figure 10b shows a display module in an embodiment of the present application.
  • a structural diagram of a display module including a packaging structure 18 disposed on a flexible display panel 11 Comparing Figure 10a and Figure 10b, the size of the lower frame area CC of the flexible display panel 11 along the Y direction is 14.175mm.
  • the size of the circuit board 17 along the Y direction is 11.560mm, which is reserved for the battery 15. The size is S1.
  • the packaging structure 18 is disposed in the lower frame area CC away from the display area AA. That is, the package structure 18 and the display driver chip 13 can be integrated on the surface of the lower frame area CC away from the display area AA.
  • FIG. 11 shows yet another structural diagram of a display module according to an embodiment of the present application.
  • the packaging structure 18 can be disposed on the surface of the lower frame area CC facing the display area AA, and the display driver chip 13 is disposed on the surface of the lower frame area CC facing away from the display area AA, that is, the packaging structure 18 and the display driving chip 13 are disposed On opposite sides of the lower border area CC.
  • the packaging structure 18 can be disposed on the surface of the lower frame area CC away from the display area AA, and the display driver chip 13 is disposed on the surface of the lower frame area CC facing the display area AA.
  • the embodiment of the present application does not specifically limit the number of packaging structures 18 either.
  • it may include one packaging structure as shown in FIG. 12a; for another example, it may include a first packaging structure 181 and a second packaging structure 182 as shown in FIG. 12b; or it may include more packaging structures.
  • the relative positions of the packaging structure 18 and the display driver chip 13 can be implemented in various ways, as detailed below.
  • Figure 12a shows an arrangement of the relative positions of the packaging structure 18 and the display driver chip 13.
  • the packaging structure 18 and the display driver chip are arranged in a direction perpendicular to the extending direction of the lower frame area CC (direction P in the figure).
  • Figure 12b shows another arrangement of the relative positions of the packaging structure 18 and the display driver chip 13.
  • the packaging structure 18 and the display driver chip are also arranged in a direction perpendicular to the extending direction of the lower frame area CC (direction P in the figure).
  • the display driver chip includes a first display driver chip 131 and a second display driver chip 132.
  • the first display driver chip 131 can drive the flexible display panel 11 on the first housing 100a
  • the second display driving chip 132 can drive the flexible display panel 11 on the second housing 100b.
  • the package structure 18 includes one package structure 18, the first display driver chip 131 and the second display driver chip 132 arranged along the direction perpendicular to the P direction.
  • a packaging structure 18 is provided between the first display driving chip 131 and the second display driving chip 132; in Figure 12b, the first packaging structure 181 and the second packaging structure 182, and the first display driving chip 131 and the second display driving chip 132.
  • the two display driving chips 132 are arranged in a direction perpendicular to the P direction, and the first packaging structure 181 and the second packaging structure 182 are located between the first display driving chip 131 and the second display driving chip 132 .
  • Figure 12c shows another arrangement of the relative positions of the packaging structure 18 and the display driver chip 13.
  • the one package structure 18, the first display driver chip 131 and the second display driver chip 132 are arranged in the direction perpendicular to the P direction.
  • the one package structure 18 is arranged in the first The side of the area where the first display driver chip 131 and the second display driver chip 132 are located.
  • Figure 12d shows another arrangement of the relative positions of the packaging structure 18 and the display driver chip 13.
  • this display module can be applied to a candy bar electronic device (such as the candy bar mobile phone in Figure 3b above).
  • this display driver chip 13 drives and controls the flexible display panel 11 that is continuously covered on the casing 100d.
  • this display driver chip 13 and the packaging structure 18 are arranged in a direction parallel to the extending direction of the lower frame area CC (direction P in the figure).
  • this application provides at least two of the following.
  • Figure 13a shows one arrangement of multiple electronic devices.
  • each of the plurality of electronic devices is disposed on the substrate 18a through an electrical connection structure.
  • the electronic device includes a first electronic device 18b1 and a second electronic device.
  • the electronic device 18b2, the first electronic device 18b1 and the second electronic device 18b2 are all arranged on the substrate 18a using electrical connection structures.
  • These multiple electronic devices are arranged on the substrate 18a using a two-dimensional integration method.
  • Figure 13b shows another arrangement of multiple electronic devices.
  • a plurality of electronic devices are stacked on the substrate 18a along a direction perpendicular to the substrate 18a.
  • the first electronic device 18b1 and the second electronic device 18b2 illustrated in FIG. 13b are stacked on the substrate 18a.
  • These multiple electronic devices It is arranged on the substrate 18a in a three-dimensional integration manner.
  • the substrate 18a in the packaging structure 18 involved in the embodiment of the present application has a variety of structures that can be implemented.
  • the substrate 18a may use the packaging substrate shown in FIG. 14a.
  • the packaging substrate includes a substrate 311 and a rewiring structure 21b located on the upper surface and lower surface of the substrate 311.
  • the substrate 18a may be a redistribution layer (RDL) produced through the redistribution process as shown in FIG. 14b.
  • the RDL includes multi-layer metal traces 312 and multi-layer dielectric layers 313. Each two adjacent layers are Layer metal traces 312 are separated by dielectric layer 313 .
  • a conductive channel 314 can be made in the dielectric layer 313 so that the metal traces 312 on different layers are electrically connected through the conductive channel 314 .
  • RDL redistribution layer
  • the substrate 18a may be an interposer shown in FIG. 14c.
  • the interposer includes a substrate 311, a rewiring layer RDL integrated on the substrate 311, and a conductive channel 314 penetrating the substrate 311.
  • Conductive via 314 is electrically connected to metal traces in redistribution layer RDL 21b.
  • FIG 15 shows another structural diagram of a display module according to an embodiment of the present application.
  • the display module not only includes the above-mentioned flexible display panel 11, display driver chip 13 and packaging structure 18, but also includes a circuit board 17, which may be electrically connected to the main circuit board of the electronic device.
  • Flexible printed circuit board (FPC) Flexible printed circuit board
  • the circuit board 17 in the display module in the embodiment of the present application is not only small in size, but also arranged in different locations.
  • the circuit board 17 extends in a direction perpendicular to the extension direction of the lower frame area CC (direction P in the figure), and the circuit board 17 electrically connects the lower frame area CC and the main circuit.
  • the board for example, can electrically connect the circuit board 17 to the main circuit board through the bonding structure 16 .
  • the flexible circuit board 12 extends in a direction parallel to the extending direction of the lower frame area CC (direction P in the figure).
  • the relatively small circuit board 17 provided in the embodiment of the present application will not occupy a large space in the X direction.
  • the circuit board 17 extending to the side of the flexible display panel 11 can be called the first part. 17a.
  • the first part 17a which is the electrical connection structure with the main circuit board, can be bent along the direction perpendicular to the The space occupied in the X direction.
  • all electronic devices electrically connected to the display driver chip 13 and the flexible display panel 11 may be integrated into the packaging structure 18 using packaging technology, or some electronic devices may be integrated into the packaging structure 18 .
  • packaging technology for example, in FIG. 15 , all circuits electrically connected to the display driver chip 13 and the flexible display panel 11 are The sub-devices are integrated in the packaging structure 18 using packaging technology, so that the circuit board 17 serves as an electrical connection structure connected to the main circuit board; for another example, as shown in Figure 16, some electronic devices can be integrated in the packaging structure 18, part of the electronic device 14 is arranged on the first part 17a.
  • FIG. 17 shows another structural diagram of the display module in the embodiment of the present application
  • FIG. 18 is a cross-sectional view taken along N2-N2 in FIG. 17 .
  • the second part 17b and the first part 17a are an integrally formed structure.
  • the second part 17b has an accommodating cavity 17b1 as shown in Figure 18, and the display driver chip 13 and the packaging structure 18 are both placed in the accommodating cavity 17b1.
  • the display driver chip 13 and the packaging structure 18 as shown in FIG. 17 will be disposed between the second part 17b and the lower frame area CC, and are further shown with a dotted line.
  • the second part 17b can be electrically connected to the lower frame area CC using the bonding structure 16. In this way, it can be compatible with the existing connection process between the circuit board 17 and the flexible display panel 11. Compatible, no additional preparation process means will be added.
  • all electronic devices electrically connected to the display driver chip 13 and the flexible display panel 11 may be integrated into the packaging structure 18 using packaging technology, or some electronic devices may be integrated into the packaging structure 18 .
  • packaging technology for example, in FIG. 17 , all electronic devices electrically connected to the display driver chip 13 and the flexible display panel 11 are integrated into the packaging structure 18 using packaging technology, so that the circuit board 17 serves as a circuit board connected to the main circuit board.
  • Electrical connection structure for another example, as shown in Figure 19, some electronic devices can be integrated in the packaging structure 18, and some electronic devices 14 are provided on the first part 17a.
  • the wiring structure of the circuit board 17 can be simplified.
  • the conductive layer of the second part 17b can be reduced.
  • the number for example, can be reduced from the original at least four conductive layers to one or two conductive layers.
  • Figure 20a shows a structural diagram of a display module.
  • the circuit board 17 is also stacked on the lower frame area CC of the flexible display panel 11.
  • the electronic device 14 is integrated on the surface of the circuit board 17 away from the lower frame area CC, and no system-level
  • the packaging technology is laid out such that the distance between the surface of the electronic device 14 away from the circuit board 17 and the surface of the lower frame area CC is about 1.637 mm as shown in Figure 20a.
  • a wiring structure needs to be formed on the lower frame area CC to electrically connect the packaging structure 18 to the display driver chip 13. Connect, or electrically connect the packaging structure 18 to the display area AA.
  • FIG. 21 is a structural diagram of a display module according to an embodiment of the present application, which includes a wiring structure for electrically connecting the packaging structure 18 with other electronic devices (such as a display driver chip or a display area).
  • a wiring structure for electrically connecting the packaging structure 18 with other electronic devices such as a display driver chip or a display area.
  • FIG. 21 not only the first wiring structure D1 in which the package structure 18 is electrically connected to other electronic devices is shown, but also the first wiring structure D1 is shown.
  • the second wiring structure D2 that displays the driving chip 13 is electrically connected to the display area.
  • the black lines in the first wiring structure D1 and the second wiring structure D2 in FIG. 21 are exemplary metal wirings.
  • FIG. 22 is a cross-sectional view of FIG. 21 taken along N3-N3. Combining FIG. 21 and FIG. 22 together, the achievable structures of the first wiring structure D1 and the second wiring structure D2 are different.
  • the first wiring structure D1 it includes multiple conductive layers 41 stacked on the substrate 11a, and these multiple conductive layers 41 are stacked in a direction perpendicular to the substrate 11a. Between each two adjacent conductive layers 41 are separated by the dielectric layer 42; in addition, the conductive channel 43 is also included, and the conductive channel 43 penetrates the dielectric layer 42 to electrically connect different conductive layers 41.
  • a first wiring structure D1 including four conductive layers 41 is shown.
  • the four conductive layers may be source and drain lines, gate lines, TMA lines, and TMB lines respectively.
  • the second wiring structure D2 includes a conductive layer 41 .
  • the conductive layer in the first wiring structure D1 can be called the first conductive layer, the dielectric layer is called the first dielectric layer, and the conductive channel is called the first conductive channel.
  • the conductive layer in the second wiring structure D2 is called the second conductive layer, the dielectric layer is called the second dielectric layer, and the conductive channel is called the second conductive channel.
  • the first conductive layer and the second conductive layer can be made of the same material, the first dielectric layer and the second dielectric layer can be made of the same material, and the third dielectric layer can be made of the same material. a conductive channel and a second conductive channel.
  • FIG. 23 shows another implementable structure of the first wiring structure D1 and the second wiring structure D2 according to the embodiment of the present application.
  • the first wiring structure D1 has the same structure as the first wiring structure D1 of FIG. 22 , and also includes four conductive layers 41 .
  • the second wiring structure D2 two conductive layers 41 are included.
  • the two conductive layers 41 are separated by a dielectric layer 42, and are connected by a conductive channel 43 penetrating the dielectric layer 42. 41 are electrically connected to form a wiring layer structure with electrical connection function.
  • the two conductive layers can be gate lines and source and drain lines respectively.
  • the first wiring structure D1 provided in the embodiment of the present application belongs to a wiring structure of at least three conductive layers, while the second wiring structure D2 belongs to a wiring structure of single or double conductive layers.
  • the first wiring structure D1 and the second wiring structure D2 cannot affect each other, that is, the first wiring structure D1 cannot affect the electrical conductivity of the second wiring structure D2.
  • Connection function similarly, the second wiring structure D2 cannot affect the electrical connection function of the first wiring structure D1. Therefore, in the process structure that can be realized, the area where the first wiring structure D1 is located should not overlap with the area where the second wiring structure D2 is located.
  • the second wiring structure D2 The area where the first wiring structure D1 is located is located on the side of the display driving chip 13 close to the bending area, and the area where the first wiring structure D1 is located is located on the side of the display driving chip 13 away from the bending area. That is, the second wiring structure D2 is compared with the first wiring structure. D1 is set close to the bending area.
  • Figure 24 is a structural diagram of another display module according to an embodiment of the present application.
  • the same thing about the display module shown in Figure 21 is that it not only shows the first wiring structure for electrically connecting the packaging structure 18 to other electronic devices.
  • D1 also shows a second wiring structure D2 through which the display driver chip 13 is electrically connected to the display area.
  • the circuit board 17 includes a first portion 17a located on the side of the lower frame area CC, while in Figure 24, the circuit board 17 not only includes the first portion 17a, but also includes a second portion adjacent to the first portion 17a. part 17b, and the second part 17b is electrically connected to the lower frame area through the bonding structure.
  • the layout method of the first wiring structure D1 and the second wiring structure D2 in Figure 24 can be used, and details will not be described again here.
  • the packaging structure 18 in Figure 24 can be a touch chip packaging structure.
  • the touch chip TPIC routing The line pair impedance requirements are strict, and the multi-layer wiring area directly passing through the lower frame area has the risk of increasing the impedance and exceeding the standard.
  • the touch chip TPIC wiring can be concentrated in the package structure area 18 through the wiring on the second part 17b. , and then through the bonding interconnection between the second part 17b and the lower frame area, a low-impedance connection is achieved between the outer touch chip TPIC trace and the inner system-level package SIP pin.
  • Figures 25 and 26 are respectively structural diagrams of two different display modules according to embodiments of the present application.
  • the difference between the display module shown in Figures 25 and 26 and the display module shown in Figures 21 and 24 is that in Figures 25 and 26, a display driver chip 13 is included, and the display driver chip 13
  • the packaging structure 18 is arranged in a direction parallel to the extending direction of the lower frame region CC.
  • the first wiring structure D1 is formed between the display driving chip 13 and the packaging structure 18
  • the second wiring structure D2 is formed on the side of the display driving chip 13 away from the packaging structure 18 .
  • the layout method of the first wiring structure D1 and the second wiring structure D2 in FIG. 25 and FIG. 26 the layout method shown in FIG. 21 can also be adopted, and details will not be described again here.
  • the embodiments of this application also provide a method for preparing a display module.
  • the preparation method includes:
  • a chip package electrically connected to the display area is provided on the lower frame area of the flexible display panel.
  • the chip package may be a display driver chip.
  • a packaging structure is provided on the lower frame area.
  • the packaging structure includes a substrate arranged on the lower frame area, and a first electronic device and a second electronic device arranged on the substrate, and the first electronic device and the second electronic device are formed on the lower frame area.
  • the first wiring structure on the display area is electrically connected to the display area.
  • the flexible display panel includes a display area, a bending area located at the outer edge of the display area, and a lower frame area adjacent to the bending area. The bending area is used to bend the lower frame area to the back of the display area.
  • the chip package for controlling the display area is provided in the lower frame area of the flexible display panel, but also some other electronic devices electrically connected to the display area are integrated into the packaging structure in the form of system-level packaging, and Set the encapsulation structure also on the lower border area.
  • the display module produced in this way can reduce the size of the circuit board (for example, the flexible circuit board) electrically connected to the main circuit board, which can reserve more space for other structures.
  • the preparation method also includes:
  • a circuit board is provided, and the circuit board extends in a direction perpendicular to the extension direction of the lower frame area.
  • the circuit board electrically connected to the main circuit board can be extended in a direction perpendicular to the extension direction of the lower frame area and stacked on the lower frame area.
  • multiple (at least three) conductive layers are formed on the display area, bending area and lower frame area of the flexible display panel.
  • the preparation method before arranging the packaging structure and the display driver chip on the lower frame area, the preparation method also includes: removing the conductive layer and the dielectric layer used to form the second wiring structure on the lower frame area, so that the formed electrical connection chip package and The second wiring structure of the display area is a single conductive layer or two conductive layers, and the number of conductive layers and dielectric layers used to form the first wiring structure on the lower frame area is retained, and the number of layers on the display area is the same as that of the conductive layer on the lower frame area.
  • the number of conductive layers and dielectric layers is the same.
  • an area for forming the second wiring structure on the lower frame area is required. and the bending area are processed to form a single conductive layer or a double conductive layer, and the remaining areas do not need to be processed. In this case, the preparation process can also be simplified.
  • an electronic device may also be disposed on the first part of the circuit board located on the side of the lower frame area, so that the electronic device is electrically connected to the display area.
  • Figures 27a to 27c illustrate a possible method of preparing the packaging structure 18.
  • a plurality of electronic devices 18b are provided on the substrate 18a.
  • three electronic devices 18b are disposed on the substrate 18a.
  • FIG. 27a shows that a plurality of electronic devices are arranged on the substrate 18a in a two-dimensional integrated manner. In other processes, some of the plurality of electronic devices may be disposed on the substrate 18a in a three-dimensional integration manner, and other electronic devices may be disposed on the substrate 18a in a two-dimensional integration manner.
  • an encapsulation layer 18c is provided on the substrate 18a formed with a plurality of electronic devices 18b, so that the encapsulation layer 18c wraps the multiple electronic devices 18b, thereby achieving electrical isolation between the electronic devices 18b and the outside world.
  • a plastic encapsulation layer can be used as the encapsulation layer 18c.
  • an electrical connection structure 18d is formed on the side of the substrate 18a away from the plurality of electronic devices 18b.
  • the electrical connection structure 18d may include a plurality of solder balls, such as a ball grid array (BGA), or a plurality of metal pillars. In this way, a system-in-package structure integrating multiple electronic devices is produced.
  • BGA ball grid array
  • Figures 28a to 28d show an achievable preparation method for arranging the packaging structure 18 and the display driver chip 13 on the flexible display panel 11.
  • deconduction is performed in the area of the flexible display panel 11 used to form the bending area and the area used to form the second wiring structure D2 (the wiring portion used to electrically connect the display driver chip 13 and the display area).
  • Layer processing so that the traces in these areas are single-layer conductive layer traces or double-layer conductive layer traces.
  • a display driver chip 13 is provided on the lower frame area of the flexible display panel 11 .
  • the packaging structure 18 produced in Figures 27a to 27c is provided on the lower frame area of the flexible display panel 11.
  • the circuit board 17 is then installed and electrically connected to the flexible display panel 11 .
  • a display module including a display driver chip 13, a packaging structure 18, and a circuit board 17 is produced.

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Abstract

本申请提供一种显示模组、以及电子设备。涉及显示技术领域。本申请提供一种具有系统级封装的显示面板系统(system on pane，SOP)。该显示模组包括：柔性显示面板和芯片封装体，柔性显示面板包括显示区域、位于显示区域外缘的弯折区域，以及与弯折区域邻接的下边框区域，芯片封装体(比如显示驱动芯片)设置在下边框区域上；另外，该显示模组还包括封装结构，封装结构包括基板，以及设置在基板上的第一电子器件和第二电子器件，并且，基板设置在下边框区域上；下边框区域包括第一布线结构，第一电子器件和第二电子器件通过第一布线结构与芯片封装体电连接。该显示模组能够减小在电子设备中的占用空间。

Description

显示模组、电子设备、显示模组的制备方法
本申请要求于2022年04月15日提交国家知识产权局、申请号为202210397251.2、发明名称为“显示模组、电子设备、显示模组的制备方法”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及显示技术领域，尤其涉及一种显示模组，以及，包含有该显示模组的电子设备，还涉及显示模组的制备方法。
背景技术
随着人机交互技术的发展，显示成为人机交互的重要要素，而显示驱动芯片(display driver integrated circuit，DDIC)和触控芯片(touch panel integrated circuit，TPIC)做为显示触控成像系统很重要的组成部分，它集成了电阻，调节器，功率晶体管等部件，负责驱动显示面板和控制驱动电流等功能。
图1和图2示出了显示装置(例如手机)中的显示驱动芯片DDIC的其中一种封装结构，并且图2是沿着图1的M-M方向剖切的剖面图，该种封装结构可以被称为面板上的芯片(chip on panel，COP)封装。具体的，一并结合图1和图2，柔性显示面板11的边缘部分经折弯，以使得该柔性显示面板11形成显示区域AA和下边框区域CC，以及连接显示区域AA和下边框区域CC的弯折区域BB。
显示驱动芯片13被设置在下边框区域CC上，而其他的电子器件14，比如，触控芯片(TPIC)、电容、电阻等被集成在与主电路板电连接的柔性电路板(flexible printed circuit，FPC)12上，并且FPC12沿与下边框区域CC相平行的方向延伸，FPC12再通过键合结构16与下边框区域CC连接，以实现FPC12上的电子器件14与显示驱动芯片13之间的信号互联。
当采用图1和图2所示的面板上的芯片封装技术时，由于与显示驱动芯片13电连接的电子器件14均被集成在FPC12上，这样的话，就需要布局占据空间比较大的FPC12。从而，就会增加显示设备的尺寸，比如，会导致如图2所示的Y方向尺寸较大。
换而言之，当显示装置在Y方向的尺寸一定时，因为大尺寸FPC12的存在，会相对应的减少其他结构在Y方向的尺寸。例如图2，就会限制电池15在Y方向上的使用空间，从而，可能会限定电池容量的增长，也就会限定显示装置例如手机的续航的提升。
发明内容
本申请提供一种显示模组，以及包含有该显示模组的电子设备，还提供一种显示模组的制备方法。通过本申请的方案提供可以减小占据空间的显示模组，以使得该显 示模组被应用在电子设备中时，可以为电子设备中的其他结构件避让更多的安置空间。
为达到上述目的，本申请采用如下技术方案：
第一方面，本申请提供了一种显示模组，该显示模组可以被应用在具有显示功能的电子设备中，比如，手机、电视等。
该显示模组包括：柔性显示面板和芯片封装体，柔性显示面板包括显示区域、位于显示区域外缘的弯折区域，以及与弯折区域邻接的下边框区域，下边框区域位于显示区域的背面，芯片封装体(比如显示驱动芯片)设置在下边框区域上；另外，该显示模组还包括封装结构，封装结构包括基板，以及设置在基板上的第一电子器件和第二电子器件，并且，基板设置在下边框区域上；还有，下边框区域包括第一布线结构，第一电子器件和第二电子器件通过第一布线结构与芯片封装体电连接。
本申请提供的显示模组中，比如，可以将显示驱动芯片设置在下边框区域上，那么，通过显示驱动芯片可以驱动显示区域中的像素单元的驱动电路，以实现显示功能。另外，还把与显示区域电连接的第一电子器件和第二电子器件，比如，该第一电子器件和第二电子器件可以为电容、电感、电阻或者触控芯片等，以系统级封装(system in package，SIP)技术被封装在封装结构中，并把该封装结构也设置在下边框区域上。这样，当显示模组中具有与主电路板电连接的线路板时，由于把与显示区域电连接的部分电子器件(比如，这里的第一电子器件和第二电子器件)，或者全部电子器件可以从线路板，转移至封装结构中，进而，可以减小线路板的面积，缩小线路板所占据的空间，以减小显示模组所占据空间。
所以，当将把本申请给出的显示模组应用在电子设备中时，可以给其他结构件预留更大的容置空间，或者，在保持其他结构件尺寸不变的情况下，可以使得该电子设备符合小型化设计要求。
在一种可能实现的方式中，该显示模组还包括：线路板，该线路板可以是柔性电路板；线路板的延伸方向与下边框区域的延伸方向相垂直，线路板用于电连接下边框区域和主电路板。
在该实施例中，关于线路板的设置方式为：线路板的延伸方向与下边框区域的延伸方向是垂直的，而不是相关技术的与下边框区域的延伸方向平行。比如，当下边框区域沿电子设备的Y方向延伸时，线路板是沿着与Y方向垂直的X方向延伸。这样的话，就会减小在Y方向上占据的空间。
除此之外，由于把线路板上的一些或全部电子器件被封装在封装结构中，所以，尺寸较小的线路板也不会在X方向上占据较大的空间。
在一种可能实现的方式中，线路板的第一部分位于下边框区域的侧方，第一部分用于电连接主电路板。
在一种可能实现的方式中，该显示模组还包括：第三电子器件，且第三电子器件设置在第一部分上，第三电子器件与显示区域电连接，或者与第一电子器件和第二电子器件电连接。
当部分电子器件，比如，包括电阻的第三电子器件，未被集成在封装结构中时，可以将第三电子器件集成在第一部分上，并与显示区域，或者与第一电子器件和第二电子器件电连接。
在一种可能实现的方式中，线路板的第二部分覆盖在下边框区域上，第二部分与下边框区域电连接；第二部分上开设有容置腔，芯片封装体和封装结构均安置在容置腔内。
在此种实现方式中，由于将一部分电子器件集成在封装结构中，相比将全部电子器件均集成在线路板上，可以减少线路板的导电层的数量，以减少第二部分的厚度尺寸，进而，也不会过多的增加该显示模组的沿与下边框区域相垂直方向的尺寸，比如，不会过多的增加与X方向和Y方向均垂直的Z方向的尺寸。
在一种可能实现的方式中，第二部分的远离第一部分的一端通过连接结构与下边框区域电连接。比如，通过键合结构。
本申请实施例中，在改变线路板设置位置的基础上，还可以使得线路板与下边框区域的连接工艺保持不变，即与现有的连接工艺相兼容。
在一种可能实现的方式中，第一电子器件或者第二电子器件包括触控芯片、无源器件中的至少一种。例如，第一电子器件为触控芯片，第二电子器件包括电感和电阻等。
在一种可能实现的方式中，下边框区域包括衬底，第一布线结构形成在衬底上；第一布线结构包括至少三层第一导电层、第一介电层和第一导电通道，至少三层第一导电层沿与衬底相垂直的方向堆叠；每相邻两层第一导电层之间设置有第一介电层隔离开；第一导电通道贯通在第一介电层内，以电连接不同的第一导电层。
用于电连接封装结构和显示区域的布线结构是一种多层(至少三层)的走线结构，而不是相关技术中的单层或者两层走线结构。
在一种可能实现的方式中，下边框区域还形成有第二布线结构，芯片封装体通过第二布线结构与显示区域电连接。即利用形成在下边框区域上的第二布线结构，可以实现芯片封装体(例如，显示驱动芯片)和显示区域的信号互联。
在一种可能实现的方式中，第二布线结构包括一层第二导电层；或者，第二布线结构包括：两层第二导电层、一层第二介电层和第二导电通道，两层第二导电层沿与衬底相垂直的方向堆叠；两层第二导电层之间设置有一层第二介电层；第二导电通道贯通在第二介电层内，以电连接两层第二导电层。
在下边框区域，形成有至少两种不同结构的走线结构，一种是单层或者双层布线，另一种是至少三层的布线。
在一种可能实现的方式中，第二布线结构相对第一布线结构靠近弯折区域布设。
多层布线结构远离弯折区域，单层或者双层布线结构靠近弯折区域。
在一种可能实现的方式中，弯折区域上形成单层或者双层导电层的布线结构。
通过设置单层或者双层导电层的布线结构，可以保障弯折区域的柔性，以使得在下边框区域在弯折区域的折弯下，可以位于显示区域的背面。
在一种可能实现的方式中，芯片封装体和封装结构的排布方向与下边框区域的延伸方向相垂直；或者，芯片封装体和封装结构的排布方向与下边框区域的延伸方向相平行。
上述仅给出了关于芯片封装体，比如显示驱动芯片，和封装结构的其中两种布设方式，也可以采用其他的布设方式。
在一种可能实现的方式中，芯片封装体包括第一显示驱动芯片和第二显示驱动芯片，第一显示驱动芯片和第二显示驱动芯片的排布方向与下边框区域的延伸方向相垂直，且封装结构位于第一显示驱动芯片和第二显示驱动芯片之间。
当芯片封装体包括第一显示驱动芯片和第二显示驱动芯片时，该种结构的显示模组可以被应用在折叠显示装置中，比如折叠手机中。
将封装结构设置在第一显示驱动芯片和第二显示驱动芯片之间，不会因为增加了封装结构，而增加该显示模组延长与下边框区域延伸方向一致的方向上的尺寸，比如，不会增加手机的沿Y方向的尺寸。
在一种可能实现的方式中，芯片封装体和封装结构位于下边框区域的背离显示区域的侧面上。
在一种可能实现的方式中，芯片封装体和封装结构相对的设置在下边框区域的两侧。
在一种可能实现的方式中，第一电子器件和第二电子器件分别通过电连接结构设置在基板的同一表面上。
采用了二维集成方式将第一电子器件和第二电子器件设置在基板上。
在一种可能实现的方式中，第一电子器件和第二电子器件沿与基板相垂直的方向堆叠在基板上。
采用了三维集成方式将第一电子器件和第二电子器件设置在基板上。
第二方面，本申请还提供了一种电子设备，该电子设备可以是具有显示功能的电子设备。
该电子设备包括主电路板和上述任一实现方式涉及的显示模组，其中，显示模组与主电路板电连接。比如，显示模组中的显示面板、显示驱动电路、封装结构中的至少一个与主电路板电连接。
由于在该电子设备中，采用了上述涉及的显示模组，并且，在该显示模组中，不仅可以将显示驱动芯片集成在柔性显示面板的下边框区域上，将集成有与显示区域电连接的第一电子器件和第二电子器件以模块化的系统级封装结构也集成在下边框区域上，那么，就不需要设置面积较大的线路板，使得该显示模组在电子设备中的占据的空间减小。
在一种可能实现的方式中，下边框区域的远离弯折区域的一侧形成有安置空间；电子设备还包括电池，电池设置在安置空间内。
由于将部分电子器件或者全部电子器件集成在封装结构中，所以，可以使得放置电池的安置空间更大，可以提升电池的容量，提升该电子设备的续航。
第三方面，本申请还提供了一种显示模组的制备方法，该显示模组包括：
在柔性显示面板的下边框区域上设置与显示区域电连接的芯片封装体；
在下边框区域上设置封装结构，封装结构包括设置在下边框区域上的基板，以及设置在基板上的第一电子器件和第二电子器件，且第一电子器件和第二电子器件通过形成在下边框区域上的第一布线结构与芯片封装体电连接；其中，柔性显示面板包括显示区域、位于显示区域外缘的弯折区域，和与弯折区域邻接的下边框区域，下边框区域位于显示区域的背面。
在上述给出的显示模组的制备方法中，不仅可以把显示驱动芯片集成在柔性显示面板的下边框区域，同时也将集成有多个电子器件的封装结构集成在下边框区域上，即就是采用下边框区域作为多个电子器件的载体，这样，就可以减小线路板的面积，以使得制得的显示模组的尺寸比较小，减小该显示模组所占据空间。
在一种可能实现的方式中，在下边框区域上设置封装结构和芯片封装体之前，制备方法还包括：
去除下边框区域上的用于形成第二布线结构的导电层和介质层，以使得形成的电连接芯片封装体和显示区域的第二布线结构为单层导电层，或者为两层导电层，以及，保留下边框区域上的用于形成第一布线结构的导电层和介质层的层数，与显示区域上的导电层和介质层的层数相同。
在该制备方法中，可以将下边框区域上的部分区域的导电层和介质层去除，以形成用于电连接显示驱动芯片和显示区域的单层走线或者双层走线，关于其他区域可以不进行处理，这样的话，可以简化制备工艺。
在一种可能实现的方式中，在下边框区域上设置封装结构和芯片封装体之后，制备方法还包括：
设置线路板，且线路板沿与下边框区域延伸方向相垂直的方向延伸。
在设置该线路板时，该线路板是沿着与下边框区域延伸方向相垂直的方向延伸，而不是与下边框区域延伸方向相平行的方向布设。
在一种可能实现的方式中，在设置线路板之前，制备方法还包括：
在线路板的位于下边框区域的侧方的部分上设置第三电子器件，以使得第三电子器件与显示区域电连接，或者，第三电子器件与封装结构电连接。
附图说明
图1为相关技术中的显示驱动芯片的一种封装结构图；
图2是沿着图1的M-M方向剖切的剖视图；
图3a为本申请实施例提供的一种电子设备的结构图；
图3b为本申请实施例提供的另一种电子设备的结构图；
图4为显示驱动芯片和一些电子器件的一种设置方式的结构图；
图5a为本申请实施例提供的一种柔性显示面板的显示区域的结构图；
图5b为本申请实施例提供的一种柔性显示面板的弯折区域或者下边框区域的结构图；
图6为本申请实施例提供的一种电子设备中的部分电路结构的框图；
图7为本申请实施例提供的显示驱动芯片和一些电子器件的一种设置方式的结构图；
图8是沿着图7的N1-N1方向剖切的剖视图；
图9为本申请实施例提供的封装结构的一种结构图；
图10a为相关技术中的显示驱动芯片和一些电子器件的一种设置方式的结构图；
图10b为本申请实施例提供的显示驱动芯片和一些电子器件的一种设置方式的结构图；
图11为本申请实施例提供的显示驱动芯片和一些电子器件的又一种设置方式的结构图；
图12a为本申请实施例提供的显示驱动芯片和封装结构的一种设置方式的结构图；
图12b为本申请实施例提供的显示驱动芯片和封装结构的又一种设置方式的结构图；
图12c为本申请实施例提供的显示驱动芯片和封装结构的又一种设置方式的结构图；
图12d为本申请实施例提供的显示驱动芯片和封装结构的一种设置方式的结构图；
图13a为本申请实施例提供的封装结构的一种结构图；
图13b为本申请实施例提供的封装结构的又一种结构图；
图14a为本申请实施例提供的封装结构的基板的一种结构图；
图14b为本申请实施例提供的封装结构的基板的又一种结构图；
图14c为本申请实施例提供的封装结构的基板的又一种结构图；
图15为本申请实施例提供的显示驱动芯片和封装结构，以及线路板的一种设置方式的结构图；
图16为本申请实施例提供的显示驱动芯片和封装结构，以及线路板的又一种设置方式的结构图；
图17为本申请实施例提供的显示驱动芯片和封装结构，以及线路板的又一种设置方式的结构图；
图18是沿着图17的N2-N2方向剖切的剖视图；
图19为本申请实施例提供的显示驱动芯片和封装结构，以及线路板的又一种设置方式的结构图；
图20a为相关技术中的显示驱动芯片和线路板的一种设置方式的结构图；
图20b为本申请实施例提供的显示驱动芯片和封装结构，以及线路板的又一种设置方式的结构图；
图21为本申请实施例提供的显示驱动芯片和封装结构，以及布线结构的一种设置方式的结构图；
图22是沿着图21的N3-N3方向剖切的剖视图；
图23是本申请实施例提供的显示驱动芯片和封装结构，以及布线结构的又一种设置方式的结构图；
图24是本申请实施例提供的显示驱动芯片和封装结构，以及布线结构的又一种设置方式的结构图；
图25是本申请实施例提供的显示驱动芯片和封装结构，以及布线结构的又一种设置方式的结构图；
图26是本申请实施例提供的显示驱动芯片和封装结构，以及布线结构的又一种设置方式的结构图；
图27a至图27c为本申请实施例制得封装结构的方法中各步骤完成后相对应的结构示意图；
图28a至图28d为本申请实施例制得显示模组的方法中各步骤完成后相对应的结 构示意图。
附图标记：
100a-第一壳体；
100b-第二壳体；
100c-转轴机构；
100d-壳体；
11-柔性显示面板；11a-衬底；11b-发光元件；11c-发光驱动电路；11d-布线结构；
12-柔性电路板；
13-显示驱动芯片；131-第一显示驱动芯片；132-第二显示驱动芯片；
14-电子器件；
15-电池；
16-键合结构；
17-线路板；17a-第一部分；17b-第二部分；17b1-容纳腔；
18-封装结构；18a-基板；18b1-第一电子器件；18b2-第二电子器件；18b3-第三电子器件；18c-封装层；18d-电连接结构；
181-第一封装结构；182-第二封装结构；
19-盖板；
20-支撑层；
21a-封装基板；
21b-重新布线结构；
21c-转接板；
311-衬底；
312-金属走线；
313-介电层；
314-导电通道；
41-导电层；
42-介电层；
43-导电通道。
具体实施方式
下面结合附图详细介绍本申请涉及的具体实施例。
本申请实施例提供一种电子设备，该电子设备可以包括手机(mobile phone)、平板电脑(pad)、电视、智能穿戴产品(例如，智能手表、智能手环)、虚拟现实(virtual reality，VR)终端设备、增强现实(augmented reality AR)终端设备等具有显示功能的电子产品。本申请实施例对上述具有显示功能的电子设备的具体形式不做特殊限制。
以下为了方便说明，以手机为示例，说明该电子设备的结构。
图3a示出一种折叠手机的结构图。该折叠手机可以包括第一壳体100a、第二壳体100b以及柔性显示面板11。其中，柔性显示面板11连续的覆盖在第一壳体100a和第二壳体100b上。另外，该折叠手机还可以包括转轴机构100c，第一壳体100a和 第二壳体100b设置于转轴机构100c的两侧并分别与转轴机构100c连接，转轴机构100c能够运动，以使第一壳体100a和第二壳体100b相对折叠或相对展开，实现柔性显示面板11的展平和闭合。
图3b示出一种直板手机的结构图。该直板手机可以包括壳体100d和柔性显示面板11，柔性显示面板11覆盖在壳体100d上。
上述的诸如手机的电子设备中，柔性显示面板11能够用于显示信息并为用户提供交互界面。在本申请各实施例中，柔性显示面板11可以但不限于有机发光二极管(organic light-emitting diode，OLED)显示屏，有源矩阵有机发光二极体或主动矩阵有机发光二极体(active-matrix organic light-emitting diode，AMOLED)显示屏，迷你发光二极管(mini organic light-emitting diode)显示屏，微型发光二极管(micro organic light-emitting diode)显示屏，微型有机发光二极管(micro organic light-emitting diode)显示屏，量子点发光二极管(quantum dot light emitting diodes，QLED)显示屏等。
图4给出了可以应用在上述电子设备中的柔性显示面板11的结构图。该柔性显示面板11包括用于向用户显示的显示区域AA、位于显示区域AA边缘的弯折区域BB，以及与弯折区域邻接的下边框区域CC。其中，弯折区域BB用于将下边框区域CC弯折至显示区域AA的背面。连接在一起的弯折区域BB和下边框区域CC可以被称为扇出(fanout)区域。
显示区域AA的朝向用户的一面为显示区域AA的正面，相反的，与显示区域AA的正面相对的面为显示区域AA的背面。那么，很容易的理解下边框区域CC与显示区域AA的位置关系，即所述的下边框区域CC朝向显示区域AA的背面。
一并结合图3a、图3b和图4，本申请示例性给出的弯折区域BB是将下边框区域CC弯折后，并沿着电子设备的Y方向延伸。Y方向一般指的是电子设备的长边方向，X方向指的是电子设备的短边方向。上述的图4仅给出的是一种示例性结构，在另外一些实施例中，弯折区域BB将下边框区域CC折弯后，可以沿着X方向延伸。
由于显示区域AA为朝向用户的一面，进而，显示区域AA包括发光元件，例如，图5a示例性的给出了显示区域AA的一种可以实现的结构。具体的，显示区域AA可以包括衬底11a和设置在衬底11a上、主要由薄膜晶体管(thin film transistor，TFT)构成的发光驱动电路11c，该发光驱动电路11c用于驱动发光元件11b发光，发光驱动电路11c和发光元件11b可以形成像素单元。如图5a所示，由于在显示区域AA包括发光驱动电路11c，进而，在显示区域AA的布线结构可以包括多层导电层，例如包括至少三层导电层，以形成电路结构。
另外，图5b示例性的给出了弯折区域BB的一种可以实现的结构，由于弯折区域BB需要具体柔性，即硬度不能太高，进而，如图5b所示的，弯折区域BB包括衬底11a和设置在衬底11a上布线结构11d，该布线结构11d是为了将显示区域AA与其他电子器件进行电连接，并且该布线结构11d的导电层结构比较少，利用导电层结构较少的布线结构11d可以将显示区域AA与其他电子器件进行信号互联即可，比如，发光驱动电路11c通过该布线结构11d与主电路板之间能够进行信号互通即可。从工艺制造的方便性角度讲，下边框区域CC也可以采用图5b所示的结构。
还有，在诸如上述的电子设备中，在用于支撑柔性显示面板11的壳体内，比如， 图3a的折叠手机的第一壳体100a和/或第二壳体100b内，再比如，图3b的直板手机的壳体100d内，可以形成有安装空间，以用于安装电子设备的主电路板、电池、受话器、扬声器、摄像头等电子器件。其中，主电路板可以集成电子设备的主控制器、存储单元、天线模块、电源管理模块等电子器件，电池则可以为柔性显示面板11、主电路板、受话器、扬声器、摄像头等电子器件供电。
图6示例性的给出了电子设备中的部分电路结构的框图。其中，电子设备的电路结构可以包括主电路板、显示驱动芯片、触控芯片和像素单元，以及与显示驱动芯片和触控芯片相关的其他电子器件，比如，其他电子器件可以是无源器件，示例的，如电感、电容、电阻等。
显示驱动芯片和触控芯片做为显示触控成像系统很重要的组成部分，它集成了电阻，调节器，功率晶体管等部件，负责驱动柔性显示面板和控制驱动电流等功能。像素单元、显示驱动芯片、触控芯片和其他电子器件均与主电路板电连接。
再参阅图4和图6，图6中的显示驱动芯片13可以集成在图4中的下边框区域CC上，与显示驱动芯片13电连接的相关电子器件可以集成在线路板17上，比如，图4中的电子器件14可以包括图6中的触控芯片、其他电子器件等。这样，线路板17不仅具有与主电路板电连接的作用，还需要具有较大的面积来承载这些与显示驱动芯片13或者显示区域电连接的电子器件，从而，就会导致线路板17的面积较大，如此设计的话，就会导致图3a和图3b所示的，手机在Y方向上的尺寸较大。
基于上述，本申请实施例给出了一种可以应用在上述电子设置中的显示模组，该显示模组对电子器件的封装技术进行了改进，以使得该显示模组被应用在电子设备中时，不会占据较大的空间。具体结构见下述。
图7是本申请实施例给出的一种柔性显示面板11、和承载在柔性显示面板11上的一些电子器件的连接关系示意图。在图7中，示出了显示区域AA的部分、下边框区域CC，和连接显示区域AA和下边框区域CC的弯折区域BB。图8是沿着图7的N1-N1方向剖切后的剖视图。
一并结合图7和图8，和上述实施例相同的是，也包括形成有显示区域AA、下边框区域CC的弯折区域BB的柔性显示面板11，芯片封装体(比如，与显示区域AA电连接的显示驱动芯片13)被设置在下边框区域CC上，以及，电子设备的透明的盖板19覆盖在显示区域AA上，以作为显示视窗。另外，在下边框区域CC和显示区域AA还设置有支撑层20，利用支撑层20对显示区域AA和下边框区域CC起到支撑保护作用，在一种可以实现的结构中，可以采用粘接胶层作为支撑层20结构。
图7和图8所示结构，和上述实施例不同的是：本申请实施例给出的下边框区域CC上还设置有封装结构18，该封装结构18包括与显示驱动芯片13和/或显示区域AA电连接的一些电子器件。
本申请实施例涉及的芯片封装体可以是显示驱动芯片13，也可以是与显示区域电连接的其他芯片封装结构。也可以理解为，显示驱动芯片13也可以是其他与显示区域电连接的芯片封装结构。
图9给出了一种封装结构18的结构示意图。该封装结构18可以包括基板18a、设置在基板18a上的多个电子器件。比如，图9示例性的给出了包括第一电子器件18b1、 第二电子器件18b2和第三电子器件18b3。在另外一些结构中，可以包括第一电子器件18b1和第二电子器件18b2，或者，可以包括更多的电子器件。
基板18a通过电连接结构18d设置在下边框区域CC上，该电连接结构18d可以包括多个焊球，例如球栅阵列(ball grid array，BGA)，或者包括多个金属柱。
除此之外，该封装结构18还可以包括封装层18c，集成在基板18a上的各个电子器件可以被包覆在封装层18c中，以使得这些电子器件实现电气隔离。另外，该封装结构18还可以包括散热盖，散热盖覆盖在封装层18c上，以驱散这些电子器件扩散的热量。
上述封装结构18中的电子器件可以包括与显示驱动芯片13相关的一些外围器件，例如，电阻、电容等，或者，电子器件可以包括与显示区域电连接的触控芯片，又或者，电子器件可以包括与触控芯片相关的一些外围器件，例如，电阻、电容等。
继续参阅图7、图8和图9展示的封装结构，本申请实施例将与显示区域和/或者显示驱动芯片13电连接的一些电子器件，由图4示出的设置在线路板17上，转移至集成在下边框区域CC上，且以系统级封装(system in package，SIP)形式存在。并且，可以采用形成在柔性显示面板11上的布线结构，将封装结构18与显示区域AA电连接，或者将封装结构18与显示驱动芯片13电连接。由于电子器件设置位置的调整，可以减小线路板17的面积，该线路板17主要起到电连接柔性显示面板11和主电路板的作用，弱化承载这些电子器件的作用，比如，线路板17可以由图4所示的较大面积缩小至图7所示的较小面积。
当线路板17的面积被减小时，可以为电子设备中的其他结构预留更多的容置空间，比如，可以增加电池的容纳空间。下述结合附图详细介绍采用本申请实施例时，如何给其他结构件预留更多的空间。
如图10a和图10b，其中，图10a示出的是现有技术中，将多个电子器件集成在线路板17上的显示模组的结构图，图10b示出的是本申请实施例中，包括设置在柔性显示面板11上的封装结构18的显示模组的结构图。对比图10a和图10b，柔性显示面板11的下边框区域CC的沿Y方向的尺寸均为14.175mm，在图10a中，线路板17沿Y方向的尺寸为11.560mm，而给电池15预留的尺寸为S1。但是，见图10b所示，当把电子器件以封装技术集成在封装结构18中后，而给电池15预留的尺寸由图10a的S1增加至S2。所以，本申请可以增加电池15的容量，提升该电子设备的续航，从而，提升该电子设备的使用性能。
继续参阅图10a和图10b，由于将图10a中的多个电子器件集成在图10b的封装结构18中，在图10a中，沿与Y方向相垂直的Z方向，电子器件14的远离线路板17的表面和显示驱动芯片13的远离下边框区域CC的表面，距离下边框区域CC的表面的尺寸为1.504mm，而在本申请实施例中，封装结构18的远离绑定区域CC的表面，距离下边框区域CC的表面的尺寸变为1.51mm，1.504mm相比1.51mm，增长比较小，所以，采用本申请的包含封装结构18的显示模组时，基本不会增加Z方向的尺寸。
封装结构18在下边框区域CC上设置的位置具有多种情况，下面给出了几种实施方式。
如图8和图10b所示的，封装结构18设置在下边框区域CC的背离显示区域AA 的面上，即封装结构18可以和显示驱动芯片13均集成在下边框区域CC的背离显示区域AA的面上。
在另外一些实施方式中，如图11所示，图11展示的是本申请实施例的显示模组的又一种结构图。具体的，可以将封装结构18设置在下边框区域CC的朝向显示区域AA的面上，显示驱动芯片13设置在下边框区域CC的背离显示区域AA的面上，即封装结构18和显示驱动芯片13设置在下边框区域CC的相对的两侧。
在又一些实施方式中，可以将封装结构18设置在下边框区域CC的背离显示区域AA的面上，显示驱动芯片13设置在下边框区域CC的朝向显示区域AA的面上。
本申请实施例对封装结构18的数量也不做特殊限定。比如，可以是图12a所示的包括一个封装结构；再比如，可以是图12b所示的包括第一封装结构181和第二封装结构182；也可以是包括更多的封装结构。
封装结构18和显示驱动芯片13的相对位置具有多种实现方式，具体见下述。
图12a给出了封装结构18和显示驱动芯片13相对位置的一种设置方式。封装结构18和显示驱动芯片沿与下边框区域CC延伸方向(如图中的P方向)相垂直的方向排布。
图12b给出了封装结构18和显示驱动芯片13相对位置的另一种设置方式。在该种实现方式中，封装结构18和显示驱动芯片也沿与下边框区域CC延伸方向(如图中的P方向)相垂直的方向排布。
图12b和图12a相同的是，显示驱动芯片均包括第一显示驱动芯片131和第二显示驱动芯片132，比如，在折叠的电子设备中(例如上述图3a的折叠手机)，第一显示驱动芯片131可以驱动第一壳体100a上的柔性显示面板11，第二显示驱动芯片132可以驱动第二壳体100b上的柔性显示面板11。
图12b和图12a不相同的是，在图12a中，封装结构18包括一个，该一个封装结构18、第一显示驱动芯片131和第二显示驱动芯片132沿与P方向相垂直的方向排布，且一个封装结构18设置在第一显示驱动芯片131和第二显示驱动芯片132之间；在图12b中，第一封装结构181和第二封装结构182，以及第一显示驱动芯片131和第二显示驱动芯片132沿与P方向相垂直的方向排布，且第一封装结构181和第二封装结构182位于第一显示驱动芯片131和第二显示驱动芯片132之间。
图12c给出了封装结构18和显示驱动芯片13相对位置的又一种设置方式。和上述图12a相同的是：该一个封装结构18、第一显示驱动芯片131和第二显示驱动芯片132沿与P方向相垂直的方向排布，不同的是：该一个封装结构18设置在第一显示驱动芯片131和第二显示驱动芯片132所处区域的侧方。
图12d给出了封装结构18和显示驱动芯片13相对位置的再一种设置方式。和上述图12a、图12b和图12c不同的是，在该种实现方式中，显示驱动芯片13为一个，比如，这种显示模组可以被应用在直板电子设备(例如上述图3b的直板手机)中，这一个显示驱动芯片13驱动控制连续覆盖在壳体100d上的柔性显示面板11。
继续参阅图12d，这一个显示驱动芯片13和封装结构18沿与下边框区域CC延伸方向(如图中的P方向)相平行的方向排布。
关于封装结构18中的电子器件的设置方式，本申请给出了下述至少两种。
图13a给出了多个电子器件的其中一种设置方式。见图13a所示，多个电子器件中的每一个电子器件均通过电连接结构设置在基板18a上，比如，在图13a中示例性的给出了电子器件包括第一电子器件18b1和第二电子器件18b2，第一电子器件18b1和第二电子器件18b2均采用电连接结构设置在基板18a，这些多个电子器件采用二维集成方式设置在基板18a上。
图13b给出了多个电子器件的另一种设置方式。多个电子器件沿着与基板18a相垂直的方向堆叠在基板18a上，比如，图13b中示例性给出的第一电子器件18b1和第二电子器件18b2堆叠在基板18a，这些多个电子器件采用三维集成方式设置在基板18a上。
本申请实施例涉及的封装结构18中的基板18a具有多种可以实现的结构。
示例的，基板18a可以采用图14a示出的封装基板(substrate)，封装基板包括衬底311、位于衬底311上表面和下表面的重新布线结构21b。
再示例的，基板18a可以是图14b示出的通过重布线工艺制得的重新布线层(redistribution layer，RDL)，RDL包括多层金属走线312、多层介电层313，每相邻两层金属走线312通过介电层313间隔开。为了使不同层上的金属走线312实现电连接，可以在介电层313内制作导电通道314，以使不同层的金属走线312通过该导电通道314电连接。当采用RDL作为基板时，还可以提升基板的柔性，抑制封装体的翘曲程度。
又示例的，基板18a可以是图14c示出的转接板(Interposer)，转接板包括衬底311，集成在衬底311上的重新布线层RDL，以及贯通衬底311的导电通道314，导电通道314与重新布线层RDL21b中的金属走线电连接。
图15示出了本申请实施例给出的显示模组的另一种结构图。在该显示模组中，不仅包括了上述涉及的柔性显示面板11、显示驱动芯片13和封装结构18，还包括了线路板17，该线路板17可以是与电子设备的主电路板电连接的柔性线路板(flexible printed circuit board，FPC)。
本申请实施例中的显示模组中的线路板17不仅尺寸小，设置位置也是不一样的。在本申请实施例中，见图15所示，线路板17沿与下边框区域CC延伸方向(如图中的P方向)相垂直的方向延伸，线路板17电连接下边框区域CC和主电路板，比如，可以通过键合结构16，将线路板17与主电路板电连接。而在上述图2所示的现有技术中，柔性电路板12沿与下边框区域CC延伸方向(如图中的P方向)相平行的方向延伸。
本申请实施例给出的尺寸比较小的线路板17也不会在X方向占据较大的空间，例如，如图16，可以将延伸至柔性显示面板11侧方的线路板17称为第一部分17a，在装配工艺中，作为与主电路板电连接结构的第一部分17a可以沿着与X方向相垂直的方向进行折弯，以与主电路板电连接，以进一步减小在线路板17在X方向所占据的空间。
在一些实施方式中，可以将与显示驱动芯片13和柔性显示面板11电连接的全部电子器件以封装技术集成在封装结构18中，也可以将部分电子器件集成在封装结构18中。例如，在图15中，将与显示驱动芯片13和柔性显示面板11电连接的全部电 子器件均以封装技术集成在封装结构18中，以使得该线路板17作为一种与主电路板连接的电连接结构；再例如，如图16所示，可以将部分电子器件集成在封装结构18中，部分电子器件14设置在第一部分17a上。
图17示出了本申请实施例中的显示模组的又一种结构图，图18是沿着图17的N2-N2剖切后的剖视图。一并结合图17和图18，在该显示模组中，和上述图15和图16相比，不仅包括了上述涉及的柔性显示面板11、显示驱动芯片13和封装结构18，以及第一部分17a，线路板17的另一部覆盖在下边框区域CC上，以形成第二部分17b，该第二部分17b和第一部分17a为一体成型的结构。
其中，第二部分17b如图18所示的开设有容置腔17b1，显示驱动芯片13和封装结构18均安置在容置腔17b1内。如此的话，就会使得如图17展示的显示驱动芯片13和封装结构18被设置在第二部分17b和下边框区域CC之间，进而采用虚线示出。
在一种连接工艺中，如图18，第二部分17b可以采用键合结构16与下边框区域CC电连接，这样一来，可以与现有的线路板17与柔性显示面板11的连接工艺相兼容，不会额外的增加制备工艺手段。
在一些实施方式中，可以将与显示驱动芯片13和柔性显示面板11电连接的全部电子器件均以封装技术集成在封装结构18中，也可以将部分电子器件集成在封装结构18中。例如，在图17中，将与显示驱动芯片13和柔性显示面板11电连接的全部电子器件均以封装技术集成在封装结构18中，以使得该线路板17作为一种与主电路板连接的电连接结构；再例如，如图19所示，可以将部分电子器件集成在封装结构18中，部分电子器件14设置在第一部分17a上。
一并参阅图17和图19，由于本申请实施例将部分电子器件采用封装技术集成在封装结构18中，从而，可以简化线路板17的布线结构，比如，可以减少第二部分17b的导电层的数量，例如，可以由原来的至少四层导电层减少至一层或者两层导电层。
图20a示出的是一种显示模组的结构图。在该显示模组中，线路板17也是堆叠在柔性显示面板11的下边框区域CC上，但是，电子器件14集成在线路板17的远离下边框区域CC的表面上，也并未采用系统级封装技术布设，这样一来，电子器件14的远离线路板17的表面，至下边框区域CC的表面之间的间距为图20a所示的1.637mm左右。
而在图20b所示的本申请实施例给出的显示模组的结构图中，由于把集成有电子器件的封装结构18安装在线路板的容置腔17b1内，这样，线路板17的远离下边框区域CC的表面至下边框区域CC之间的间距为1.6mm，即本申请的1.6mm相比图20a的1.637mm，由于线路板17的布线结构的层数减少，电子器件设置位置改变，不会在Z方向上占据较大的空间，从而，不会较多的增加电子设备的Z方向尺寸。
在本申请实施例中，将具有电子器件的封装结构18设置在柔性显示面板11的下边框区域CC上后，需要在下边框区域CC上形成布线结构，以将封装结构18与显示驱动芯片13电连接，或者将封装结构18与显示区域AA电连接。
图21是本申请实施例给出的一种显示模组的结构图，其中，包含了用于将封装结构18与其他电子器件(比如，显示驱动芯片或者显示区域)电连接的布线结构。在图21中，不仅示出了封装结构18与其他电子器件电连接的第一布线结构D1，还示出了 显示驱动芯片13与显示区域电连接的第二布线结构D2，图21中的第一布线结构D1和第二布线结构D2中的黑色线条为示例性画出的金属走线。
图22是图21沿着N3-N3剖切后的剖视图，一并结合图21和图22，第一布线结构D1和第二布线结构D2的可实现结构是不同的。在第一布线结构D1中，包括堆叠在衬底11a上的多层导电层41，且这些多层导电层41沿与衬底11a相垂直的方向层叠设置，每相邻两层导电层41之间被介电层42隔离开；另外，还包括导电通道43，导电通道43贯通介电层42，以电连接不同的导电层41。比如，在图22中，示出了包括四层导电层41的第一布线结构D1，这四层导电层可以分别为源漏极线、栅极线、TMA线、TMB线。
再参阅图21和图22，在第二布线结构D2中，包括一层导电层41。
为了便于清楚的理解，可以将第一布线结构D1中的导电层称为第一导电层，介电层称为第一介电层，导电通道称为第一导电通道。在第二布线结构D2中的导电层称为第二导电层，介电层称为第二介电层，导电通道称为第二导电通道。而在实际的工艺结构中，可以采用相同的材料制得第一导电层和第二导线层，相同的材料制得第一介电层和第二介电层，以及，相同的材料制得第一导电通道和第二导电通道。
图23是本申请实施例给出了第一布线结构D1和第二布线结构D2的另一种可实现结构。在该实施例中，第一布线结构D1和上述图22的第一布线结构D1结构相同，也包括四层导电层41。然而，在第二布线结构D2中，包括了两层导电层41，两层导电层41之间被介电层42隔离开，并通过贯通介电层42的导电通道43，将两层导电层41电连接，以构成具有电连接功能的布线层结构，比如该两层导电层可以分别为栅极线，源漏极线。
总之，本申请实施例给出的第一布线结构D1属于至少三层导电层的走线结构，而第二布线结构D2属于单层或者双层导电层的走线结构。
在柔性显示面板11上形成第一布线结构D1和第二布线结构D2时，第一布线结构D1和第二布线结构D2不能互相影响，即第一布线结构D1不能影响第二布线结构D2的电连接功能，同样的，第二布线结构D2也不能影响第一布线结构D1的电连接功能。所以，在可以实现的工艺结构中，第一布线结构D1所处区域尽量不与第二布线结构D2所处区域重合，例如，图21和图22，以及图23所示，第二布线结构D2所处区域位于显示驱动芯片13的靠近弯折区域一侧，第一布线结构D1所处区域位于显示驱动芯片13的远离弯折区域一侧，即就是第二布线结构D2相比第一布线结构D1靠近弯折区域设置。
图24是本申请实施例给出的又一种显示模组的结构图，上述图21所示显示模组相同的是：不仅示出了封装结构18与其他电子器件电连接的第一布线结构D1，还示出了显示驱动芯片13与显示区域电连接的第二布线结构D2。区别在于：在图21中，线路板17包括位于下边框区域CC侧方的第一部分17a，而在图24中，线路板17不仅包括了第一部分17a，还包括与第一部分17a邻接的第二部分17b，并且，第二部分17b通过键合结构与下边框区域电连接。
对于图24中的第一布线结构D1和第二布线结构D2的布设方式，可以采用图21所示的布设方式，在此不再赘述。
在一些实现结构中，图24中的封装结构18可以是触控芯片封装结构，同时若需要将显示驱动芯片13外侧的走线互连到中间的封装结构18区域，考虑到触控芯片TPIC走线对阻抗要求严苛，直接通过下边框区域的多层走线区存在阻抗增大超标风险，那么，可以通过第二部分17b上的走线实现触控芯片TPIC走线集中到封装结构18区域，再通过第二部分17b和下边框区域之间的键合bonding互连，实现低阻抗连接外侧触控芯片TPIC走线和内侧系统级封装SIP引脚。
图25和图26分别是本申请实施例给出的两种不同的显示模组的结构图。图25和图26所示的显示模组，和上述图21和图24所示显示模组的不同之处在于：在图25和图26中，包括一个显示驱动芯片13，并且显示驱动芯片13和封装结构18沿与下边框区域CC延伸方向相平行的方向排布。
在图25和图26中，第一布线结构D1形成在显示驱动芯片13和封装结构18之间，第二布线结构D2形成在显示驱动芯片13远离封装结构18的一侧。
对于图25和图26中的第一布线结构D1和第二布线结构D2的布设方式，也可以采用图21所示的布设方式，在此不再赘述。
本申请实施例还给出了一种显示模组的制备方法，该制备方法包括：
在柔性显示面板的下边框区域上设置与显示区域电连接的芯片封装体。比如，该芯片封装体可以为显示驱动芯片。
在下边框区域上设置封装结构，封装结构包括设置在下边框区域上的基板，以及设置在基板上的第一电子器件和第二电子器件，且第一电子器件和第二电子器件通过形成在下边框区域上的第一布线结构与显示区域电连接。其中，柔性显示面板包括显示区域、位于显示区域外缘的弯折区域，和与弯折区域邻接的下边框区域，弯折区域用于将下边框区域弯折至显示区域的背面。
该制备方法中，由于在柔性显示面板的下边框区域不仅设置了控制显示区域的芯片封装体，还将与显示区域电连接的其他一些电子器件以系统级封装的形成集成在封装结构中，并把封装结构也设置在下边框区域上。如此制作得到的显示模组，可以减小与主电路板电连接的线路板(比如，柔性电路板)的尺寸，这样可以为其他结构预留更多的设置空间。
另外，在下边框区域上设置封装结构和芯片封装体之后，制备方法还包括：
设置线路板，且线路板沿与下边框区域延伸方向相垂直的方向延伸。
本申请实施例可以将与主电路板电连接的线路板沿与下边框区域延伸方向相垂直的方向延伸，并堆叠在下边框区域上。
在一些实现方式中，在柔性显示面板上集成显示驱动芯片和封装结构之前，柔性显示面板的显示区域、弯折区域和下边框区域上均形成有多层(至少三层)导电层。
那么，在下边框区域上设置封装结构和显示驱动芯片之前，制备方法还包括：去除下边框区域上的用于形成第二布线结构的导电层和介质层，以使得形成的电连接芯片封装体和显示区域的第二布线结构为单层导电层，或者为两层导电层，以及，保留下边框区域上的用于形成第一布线结构的导电层和介质层的层数，与显示区域上的导电层和介质层的层数相同。
在可以实现的工艺流程中，需要在下边框区域上的用于形成第二布线结构的区域 和弯折区域进行处理，以形成单层导电层或者双层导电层，对于其余区域可以不进行处理，这样的话，也可以简化制备工艺。
在一些工艺方式中，也可以在线路板的位于下边框区域侧方的第一部分上设置电子器件，以使得该电子器件与显示区域电连接。
图27a至图27c展示的是封装结构18的一种可以实现的制备方法。
结合图27a，在基板18a上设置多个电子器件18b。比如，在图27a中，示例性的示出了在基板18a上设置三个电子器件18b。
关于基板18a可以选择的结构，上述已经对其进行详细说明，在此不再赘述。
还有，图27a示出的是多个电子器件以二维集成方式设置在基板18a上。在另外一些工艺中，可以将多个电子器件中的一部分以三维集成方式设置在基板18a上，另一部分电子器件以二维集成方式设置在基板18a上。
结合图27b，在形成有多个电子器件18b的基板18a上设置封装层18c，以使得该封装层18c将多个电子器件18b包裹住，从而，实现这些电子器件18b与外界的电气隔离。在一些实现方式中，可以采用塑封层作为该封装层18c。
结合图27c，在基板18a的背离所述的多个电子器件18b的侧面形成电连接结构18d。比如，该电连接结构18d可以包括多个焊球，例如球栅阵列(ball grid array，BGA)，或者包括多个金属柱。这样，就制得了集成有多个电子器件的系统级封装结构。
图28a至图28d展示的是将封装结构18和显示驱动芯片13设置在柔性显示面板11上的一种可以实现的制备方法。
结合图28a，在柔性显示面板11的用于形成弯折区域，和用于形成第二布线结构D2(用于将显示驱动芯片13和显示区域电连接的走线部分)的区域，进行去导电层处理，以使得这些区域的走线为单层导电层走线或者双层导电层走线。
而对于其他区域的走线，不进行处理，即保留与柔性显示面板11的显示区域相同的走线结构。
结合图28b，在柔性显示面板11的下边框区域上设置显示驱动芯片13。
结合图28c，在柔性显示面板11的下边框区域上设置上述图27a至图27c制得的封装结构18。
结合图28d，再设置线路板17，并使得该线路板17与柔性显示面板11电连接。
通过上述图28a至图28d所示工艺，就制得包含有显示驱动芯片13和封装结构18，以及线路板17的显示模组。
在本说明书的描述中，具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
以上，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (21)

  1. 一种显示模组，其特征在于，包括：
    柔性显示面板，包括显示区域、位于所述显示区域外缘的弯折区域，以及与所述弯折区域邻接的下边框区域，所述下边框区域位于所述显示区域的背面；
    芯片封装体，设置在所述下边框区域上，并与所述显示区域电连接；
    封装结构，包括基板，以及设置在所述基板上的第一电子器件和第二电子器件，所述基板设置在所述下边框区域上；
    所述下边框区域包括第一布线结构，所述第一电子器件和所述第二电子器件通过所述第一布线结构与所述芯片封装体电连接。
  2. 根据权利要求1所述的显示模组，其特征在于，所述显示模组还包括：线路板；
    所述线路板的延伸方向与所述下边框区域的延伸方向相垂直，所述线路板用于电连接所述下边框区域和主电路板。
  3. 根据权利要求2所述的显示模组，其特征在于，所述线路板的第一部分位于所述下边框区域的侧方，所述第一部分用于电连接所述主电路板。
  4. 根据权利要求3所述的显示模组，其特征在于，所述线路板的第二部分覆盖在所述下边框区域上，所述第二部分与所述下边框区域电连接；
    所述第二部分上开设有容置腔，所述芯片封装体和所述封装结构均安置在所述容置腔内。
  5. 根据权利要求3或4所述的显示模组，其特征在于，所述显示模组还包括：第三电子器件；
    所述第三电子器件设置在所述第一部分上，且所述第三电子器件与所述显示区域电连接，或者，所述第三电子器件与所述封装结构电连接。
  6. 根据权利要求1-5中任一项所述的显示模组，其特征在于，所述第一电子器件或者第二电子器件包括触控芯片、无源器件中的至少一种。
  7. 根据权利要求1-6中任一项所述的显示模组，其特征在于，所述芯片封装体为驱动所述显示区域显示的显示驱动芯片。
  8. 根据权利要求1-7中任一项所述的显示模组，其特征在于，所述下边框区域包括衬底，所述第一布线结构形成在所述衬底上；
    所述第一布线结构包括至少三层第一导电层，所述至少三层第一导电层沿与所述衬底相垂直的方向堆叠；
    第一介电层，每相邻两层所述第一导电层之间设置有所述第一介电层；
    第一导电通道，所述第一导电通道贯通在所述第一介电层内，以电连接不同的所述第一导电层。
  9. 根据权利要求8所述的显示模组，其特征在于，所述下边框区域还包括第二布线结构，
    所述芯片封装体通过所述第二布线结构与所述显示区域电连接。
  10. 根据权利要求9所述的显示模组，其特征在于，
    所述第二布线结构包括一层第二导电层；或者，
    所述第二布线结构包括：
    两层第二导电层，所述两层第二导电层沿与所述衬底相垂直的方向堆叠；
    一层第二介电层，所述两层第二导电层之间设置有所述一层第二介电层；
    第二导电通道，所述第二导电通道贯通在所述第二介电层内，以电连接所述两层第二导电层。
  11. 根据权利要求9或10所述的显示模组，其特征在于，所述第二布线结构相对所述第一布线结构靠近所述弯折区域布设。
  12. 根据权利要求1-11中任一项所述的显示模组，其特征在于，所述芯片封装体和所述封装结构的排布方向与所述下边框区域的延伸方向相垂直或者相平行。
  13. 根据权利要求12所述的显示模组，其特征在于，所述芯片封装体包括第一显示驱动芯片和第二显示驱动芯片，所述第一显示驱动芯片和所述第二显示驱动芯片的排布方向与所述下边框区域的延伸方向相垂直，且所述封装结构位于所述第一显示驱动芯片和所述第二显示驱动芯片之间。
  14. 根据权利要求1-13中任一项所述的显示模组，其特征在于，所述芯片封装体和所述封装结构位于所述下边框区域的背离所述显示区域的侧面上。
  15. 根据权利要求1-14中任一项所述的显示模组，其特征在于，所述第一电子器件和所述第二电子器件分别通过电连接结构设置在所述基板的同一表面上；或者，
    所述第一电子器件和所述第二电子器件沿与所述基板相垂直的方向堆叠在所述基板上。
  16. 一种电子设备，其特征在于，包括：
    如权利要求1至15任一项所述的显示模组；
    主电路板；
    所述显示模组与所述主电路板电连接。
  17. 根据权利要求16所述的电子设备，其特征在于，
    所述下边框区域的远离所述弯折区域的一侧形成有安置空间；
    所述电子设备还包括电池，所述电池设置在所述安置空间内。
  18. 一种显示模组的制备方法，其特征在于，包括：
    在柔性显示面板的下边框区域上设置与显示区域电连接的芯片封装体；
    在所述下边框区域上设置封装结构，所述封装结构包括设置在所述下边框区域上的基板，以及设置在所述基板上的第一电子器件和第二电子器件，且所述第一电子器件和所述第二电子器件通过形成在所述下边框区域上的第一布线结构与所述芯片封装体电连接；
    其中，所述柔性显示面板包括所述显示区域、位于所述显示区域外缘的弯折区域，和与所述弯折区域邻接的所述下边框区域，所述下边框区域位于所述显示区域的背面。
  19. 根据权利要求18所述的显示模组的制备方法，其特征在于，在所述下边框区域上设置所述封装结构和所述芯片封装体之前，所述制备方法还包括：
    去除所述下边框区域上的用于形成第二布线结构的导电层和介质层，以使得形成的电连接所述芯片封装体和所述显示区域的所述第二布线结构为单层导电层，或者为两层导电层，以及，保留所述下边框区域上的用于形成所述第一布线结构的导电层和介质层的层数，与所述显示区域上的导电层和介质层的层数相同。
  20. 根据权利要求18或19所述的显示模组的制备方法，其特征在于，在所述下边框区域上设置所述封装结构和所述芯片封装体之后，所述制备方法还包括：
    设置线路板，且所述线路板沿与所述下边框区域的延伸方向相垂直的方向延伸。
  21. 根据权利要求20所述的显示模组的制备方法，其特征在于，在设置所述线路板之前，所述制备方法还包括：
    在所述线路板的位于所述下边框区域的侧方的部分上设置第三电子器件，以使得所述第三电子器件与所述显示区域电连接，或者，所述第三电子器件与所述封装结构电连接。
PCT/CN2023/087028 2022-04-15 2023-04-07 显示模组、电子设备、显示模组的制备方法 Ceased WO2023197965A1 (zh)

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