WO2023274193A1 - 天线结构、天线模组、芯片与电子设备 - Google Patents

天线结构、天线模组、芯片与电子设备 Download PDF

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Publication number
WO2023274193A1
WO2023274193A1 PCT/CN2022/101755 CN2022101755W WO2023274193A1 WO 2023274193 A1 WO2023274193 A1 WO 2023274193A1 CN 2022101755 W CN2022101755 W CN 2022101755W WO 2023274193 A1 WO2023274193 A1 WO 2023274193A1
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WO
WIPO (PCT)
Prior art keywords
metal
antenna
antenna unit
layer
metal layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2022/101755
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English (en)
French (fr)
Inventor
姚羽
吴有全
侯猛
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
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Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Priority to EP22832007.3A priority Critical patent/EP4345885A4/en
Priority to US18/575,631 priority patent/US20240313388A1/en
Priority to KR1020257020969A priority patent/KR20250108121A/ko
Priority to KR1020247002123A priority patent/KR102826164B1/ko
Publication of WO2023274193A1 publication Critical patent/WO2023274193A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/246—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for base stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/48—Earthing means; Earth screens; Counterpoises
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/10—Resonant slot antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061—Two dimensional planar arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/24—Combinations of antenna units polarised in different directions for transmitting or receiving circularly and elliptically polarised waves or waves linearly polarised in any direction
    • H01Q21/26—Turnstile or like antennas comprising arrangements of three or more elongated elements disposed radially and symmetrically in a horizontal plane about a common centre
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/30—Arrangements for providing operation on different wavebands
    • H01Q5/307—Individual or coupled radiating elements, each element being fed in an unspecified way
    • H01Q5/314—Individual or coupled radiating elements, each element being fed in an unspecified way using frequency dependent circuits or components, e.g. trap circuits or capacitors
    • H01Q5/335—Individual or coupled radiating elements, each element being fed in an unspecified way using frequency dependent circuits or components, e.g. trap circuits or capacitors at the feed, e.g. for impedance matching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/045—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with particular feeding means
    • H01Q9/0457—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with particular feeding means electromagnetically coupled to the feed line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/16—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
    • H01Q9/28—Conical, cylindrical, cage, strip, gauze, or like elements having an extended radiating surface; Elements comprising two conical surfaces having collinear axes and adjacent apices and fed by two-conductor transmission lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/241—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements
    • H10W44/248—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements for antennas

Definitions

  • the present application relates to the technical field of antennas, in particular to an antenna structure, an antenna module, a chip and electronic equipment.
  • the present application provides an antenna structure, an antenna module, a chip and electronic equipment, and the antenna structure can be miniaturized.
  • the present application provides an antenna structure.
  • the antenna structure includes a ground plane, a feed unit and an antenna unit.
  • the antenna unit includes a first metal layer, a second metal layer, a first conductive element and a second conductive element.
  • the first metal layer is opposite to the ground layer and spaced apart from each other.
  • the second metal layer is located between the first metal layer and the ground layer, and is spaced apart from both the first metal layer and the ground layer.
  • the second metal layer includes a first region and a second region arranged at intervals.
  • the first conductive element is connected between the first metal layer and the first region of the second metal layer.
  • the second conductive element is connected between the ground layer and the second region of the second metal layer.
  • the feed unit is located on a side of the second metal layer facing the ground layer.
  • the power feeding unit is used for feeding power to the second metal layer and the first metal layer.
  • the current path includes the ground layer, the second conductive member, the The second area of the second metal layer, the first area of the second metal layer, the first conductive element and the first metal layer. Since the current can be transmitted between the first region and the second region of the second metal layer, the current path is bent. Compared with the antenna structure with the same current path and the current path of the antenna structure is linear, the cross-section height of the antenna structure in this embodiment is lower, and the antenna structure can be beneficial to achieve a thinner configuration.
  • the first conductive member is a plurality of first metal pillars.
  • the second conductive element includes a first metal connecting piece, a plurality of second metal pillars and a plurality of third metal pillars.
  • the first metal connection piece is located between the second metal layer and the ground layer.
  • a plurality of second metal posts are connected between the first metal connecting piece and the second region of the second metal layer.
  • a plurality of third metal posts are connected between the first metal connecting piece and the ground layer.
  • the antenna structure can be used for transmitting and receiving millimeter wave frequency band antennas.
  • the antenna structure may support frequency bands n257, n258, n259, n260 and n261, for example, the antenna structure may cover a frequency range from 24.25 GHz to 43.5 GHz.
  • the diameter of the third metal pillar is larger than the diameter of the second metal pillar.
  • the thickness of the dielectric layer wrapped around the second metal post can be made smaller.
  • the thickness of the dielectric layer wrapped around the third metal post can be made larger. In this way, in the forming process of the antenna structure, two dielectric boards with different thicknesses (one dielectric board is provided with the second metal post, and the other dielectric board is provided with the third metal post) can be stacked into one by bonding or welding. A whole.
  • a plurality of first metal columns are arranged in an L-shape or an arc shape
  • the first metal connecting piece is in an L-shape or an arc shape
  • a plurality of second metal columns are arranged in an L-shape or an arc shape
  • a plurality of third metal columns arranged in an L shape or an arc shape.
  • the first metal connecting piece in an L-shape or an arc shape
  • a plurality of second metal columns are arranged in an L-shape or an arc shape
  • a plurality of third metal columns are arranged in an L-shape or an arc shape , so that the second metal layer, the second metal post, the third metal post, the first metal connecting sheet and the ground layer enclose a space.
  • this space can be used for arranging other components of the antenna structure.
  • the space ratio of the antenna structure is relatively high.
  • the antenna structure can be arranged compactly, which is beneficial to the miniaturized arrangement of the antenna structure.
  • the projection of the third metal post on the first metal connecting sheet is at least partially coincident with the projection of the second metal post on the first metal connecting sheet. In this way, the current path is set in a bend.
  • the antenna structure is relatively simple.
  • the first metal connecting piece includes a third region and a fourth region arranged at intervals.
  • the second metal post is connected between the third area of the first metal connecting piece and the second area of the second metal layer.
  • the third metal post is connected between the fourth area of the first metal connecting sheet and the ground layer.
  • the current path when the antenna unit is in the working state, the current path includes the ground layer, the third metal post, the fourth area of the first metal connecting piece, the third area of the first metal connecting piece, the second metal post, the fourth The second metal layer, the first metal column and the first metal layer.
  • the current path is bent twice. fold settings. Compared with the scheme in which the current path is bent once, the section height of the antenna structure in this implementation manner can be made lower. In this way, thinning of the antenna structure can be realized more easily.
  • the number of antenna elements is four.
  • the four antenna units are arranged at intervals in 2 rows and 2 columns.
  • Four antenna elements have a center point.
  • the four antenna units are respectively a first antenna unit, a second antenna unit, a third antenna unit and a fourth antenna unit.
  • the second conductive member of the first antenna unit is located on a side away from the center point of the first conductive member of the first antenna unit.
  • the second conductive part of the second antenna unit is located on a side of the first conductive part of the second antenna unit away from the central point.
  • the second conductive member of the third antenna unit is located on a side of the first conductive member of the third antenna unit away from the central point.
  • the second conductive member of the fourth antenna unit is located on a side of the first conductive member of the fourth antenna unit away from the central point.
  • the feeding unit is located in the space surrounded by the second conductive member of the first antenna unit, the second conductive member of the second antenna unit, the second conductive member of the third antenna unit and the second conductive member of the fourth antenna unit .
  • the space ratio of the antenna structure is relatively high.
  • the antenna structure can be arranged compactly, which is beneficial to the miniaturized arrangement of the antenna structure.
  • the first antenna unit, the second antenna unit, the third antenna unit and the fourth antenna unit have a center-symmetric structure.
  • the feed unit includes first feed stubs and second feed stubs arranged at intervals.
  • One end of the first feeding stub is located on a side of the second metal layer of the first antenna unit facing the ground layer.
  • the other end of the first feeding stub is located on a side of the second metal layer of the fourth antenna unit facing the ground layer.
  • the first feeding branch is used to feed the second metal layer of the first antenna unit, the first metal layer of the first antenna unit, the second metal layer of the fourth antenna unit and the first metal layer of the fourth antenna unit.
  • One end of the second feeding stub is located on a side of the second metal layer of the second antenna unit facing the ground layer.
  • the other end of the second feeding stub is located on a side of the second metal layer of the third antenna unit facing the ground layer.
  • the second feeding branch is used to feed the second metal layer of the second antenna unit, the first metal layer of the second antenna unit, the second metal layer of the third antenna unit and the first metal layer of the third antenna unit.
  • the feeding unit may feed power to the first antenna unit, the second antenna unit, the third antenna unit and the fourth antenna unit simultaneously.
  • the first antenna unit, the second antenna unit, the third antenna unit and the fourth antenna unit are all symmetrical structures.
  • the plane of symmetry of the first antenna unit, the plane of symmetry of the second antenna unit, the plane of symmetry of the third antenna unit and the plane of symmetry of the fourth antenna unit all pass through the center point.
  • the extension direction of the first feeding stub is parallel to the symmetry plane of the first antenna unit and the symmetry plane of the fourth antenna unit.
  • the extension direction of the second feeding stub is parallel to the symmetry plane of the second antenna unit and the symmetry plane of the third antenna unit.
  • the antenna structure can generate two polarizations.
  • the first polarization is the -45° polarization of the antenna structure.
  • the second polarization is the +45° polarization of the antenna structure.
  • the first feed stub includes a first part, a second part, a third part, a fourth part and a fifth part connected in sequence.
  • the distance between the first part and the ground layer, the distance between the fifth part and the ground layer, and the distance between the second feed branch and the ground layer are all equal.
  • the second part, the third part and the fourth part are "U-shaped", and the third part is located between the second feed branch and the grounding layer.
  • the distance between the first feeding branch and the second metal layer of the first antenna unit, the distance between the first feeding branch and the second metal layer of the fourth antenna unit, the distance between the second feeding branch and the second metal layer may be largely equal.
  • the distance between the first feed stub and the ground layer is greater than or smaller than the distance between the second feed stub and the ground layer.
  • the structure of the feed unit in this implementation manner is relatively simple.
  • the antenna structure further includes a plurality of metal shorting hole groups.
  • a plurality of metal shorting hole groups are electrically connected to the ground layer and are located around the first antenna unit, the second antenna unit, the third antenna unit and the fourth antenna unit.
  • the first antenna unit and the second antenna unit form a first slot.
  • the group of the first slit and at least one metal short-connection hole is arranged in the extending direction of the first slit.
  • the first antenna unit and the third antenna unit form a second slot.
  • At least one metal shorting hole group is arranged in the extending direction of the second slit.
  • the third antenna unit and the fourth antenna unit form a third slot.
  • At least one metal shorting hole group is arranged in the extending direction of the third slit.
  • the fourth antenna unit forms a fourth slot with the second antenna unit. At least one metal shorting hole group is arranged in the extending direction of the fourth slit.
  • the antenna structure may have four resonant frequencies.
  • the antenna structure in the frequency range of n257, n258, n259, n260 and n261, the antenna structure can add a resonance point.
  • the antenna structure in the frequency range of n257, n258, n259, n260 and n261, the antenna structure can add a notch point.
  • the antenna structure further includes a plurality of matching via groups.
  • a plurality of matched via groups are electrically connected to the ground plane.
  • a plurality of matched via groups are located around the antenna unit. Multiple matched via groups are set around the antenna unit.
  • the matching via group can increase the current path between the antenna unit and the ground layer.
  • the matching via group can be used to tune the impedance of the antenna structure to achieve impedance matching.
  • the matched via group can increase the current path between the antenna unit and the ground layer, the size of the antenna unit and the ground layer in this embodiment can be reduced, thereby realizing the miniaturization of the antenna structure.
  • the antenna structure further includes a dielectric layer.
  • the ground layer, the feed unit and the antenna unit are all arranged on the dielectric layer. In this way, the integrity of the antenna structure is better, and the stability is better.
  • the material of the dielectric layer is LCP. Since the loss tangent of the LCP keeps a relatively small value at high frequencies, this can make the antenna structure have a small transmission loss, thereby improving the antenna radiation efficiency and obtaining higher antenna gain.
  • the first conductive member is a first metal wall.
  • the second conductive element includes a metal connecting piece, a second metal wall and a third metal wall.
  • the metal connection piece is located between the second metal layer and the ground layer.
  • the second metal wall is connected between the metal connecting sheet and the second region of the second metal layer.
  • the third metal wall is connected between the metal connection piece and the ground layer.
  • the antenna structure in this implementation manner can support low frequencies.
  • the frequency band that the antenna structure can cover may be 1.5GHz-3GHz.
  • the metal connecting sheet includes a third area and a fourth area arranged at intervals.
  • the second metal wall is connected between the third area of the metal connecting piece and the second area of the second metal layer.
  • the third metal wall is connected between the fourth area of the metal connecting sheet and the ground layer.
  • the current path includes the ground layer, the third metal wall, the metal connecting piece, the second metal wall, the second metal layer, the first metal wall and the first metal layer. Since the current can be transmitted between the third area and the fourth area of the metal connecting sheet, and between the first area and the second area of the second metal layer, the current path can be arranged as two bends. In this way, compared with the antenna structure with the same current path and the current path of the antenna structure is linear, the antenna structure of this embodiment has a lower section height, which is beneficial to the miniaturization of the antenna structure.
  • the projection of the third metal wall on the metal connecting piece and the projection of the second metal wall on the metal connecting piece are at least partially coincident. In this way, the current path is set in a bend.
  • the antenna structure is relatively simple.
  • the present application provides an antenna module.
  • the radio frequency circuit is electrically connected to the feeding unit of the antenna structure.
  • the antenna structure when the antenna structure is applied to the antenna module, since the antenna structure can be miniaturized, the antenna module can also be miniaturized.
  • the present application provides an electronic device.
  • the electronic equipment includes a circuit board and the above-mentioned antenna module.
  • the antenna module is arranged on the circuit board.
  • the antenna module when the antenna module is applied to an electronic device, since the antenna module can be miniaturized, the electronic device can also be miniaturized.
  • the antenna structure and the circuit board are integrally formed. In this way, the structure of the antenna module is simpler.
  • the present application provides a chip.
  • the chip includes a packaging substrate, an injection molded part, a chip body and the above-mentioned antenna structure. Both the antenna structure and the chip body are disposed on the packaging substrate and electrically connected to the packaging substrate. Injection molded parts are used to package the antenna structure and chip body.
  • the antenna structure when the antenna structure is applied to a chip, since the antenna structure can be miniaturized, the chip can also be miniaturized.
  • the chip body is a radio frequency transceiver chip.
  • the antenna structure is electrically connected to the chip body through the packaging substrate.
  • An electronic device includes a circuit board and a chip as described above.
  • the chip is arranged on the circuit board.
  • the chip when the chip is applied to an electronic device, since the chip can be miniaturized, the electronic device can also be miniaturized.
  • FIG. 1 is a schematic structural diagram of an embodiment of an electronic device provided by the present application.
  • FIG. 2 is a partially exploded schematic diagram of the electronic device shown in FIG. 1;
  • Fig. 3 is a partially exploded schematic view of the circuit board assembly shown in Fig. 2;
  • FIG. 4 is a partially exploded schematic diagram of the antenna structure shown in FIG. 3;
  • Fig. 5 is an exploded schematic diagram of the first antenna unit and the second antenna unit shown in Fig. 4;
  • Fig. 6 is a partial structural schematic diagram of the antenna structure shown in Fig. 3;
  • Fig. 7 is a structural schematic diagram of a first metal connection piece and a second metal connection piece of the first antenna unit shown in Fig. 5;
  • FIG. 8 is a partial structural schematic diagram of the antenna structure shown in FIG. 3;
  • FIG. 9 is a partial structural schematic diagram of the antenna structure shown in FIG. 3;
  • Fig. 10 is a schematic structural diagram of a second metal sheet of the first antenna unit shown in Fig. 5;
  • Fig. 11 is a partial structural schematic diagram of the antenna structure shown in Fig. 3;
  • Fig. 12 is a schematic structural diagram of a first metal sheet of the first antenna unit shown in Fig. 5;
  • Fig. 13 is a partial structural schematic diagram of the antenna structure shown in Fig. 3;
  • Fig. 14 is a schematic cross-sectional view of part of the antenna structure shown in Fig. 13 at line A-A;
  • Fig. 15 is an exploded schematic view of the third antenna unit and the fourth antenna unit shown in Fig. 4;
  • Fig. 16 is a partial structural schematic diagram of the antenna structure shown in Fig. 3;
  • Fig. 17 is a partial structural schematic diagram of the antenna structure shown in Fig. 3;
  • FIG. 18 is a schematic structural diagram of the antenna structure shown in FIG. 3;
  • Fig. 19 is a schematic structural diagram of the feed unit shown in Fig. 4.
  • Fig. 20 is a partial structural schematic diagram of the antenna structure shown in Fig. 3;
  • Fig. 21 is a schematic cross-sectional view of the antenna structure shown in Fig. 20 on line B-B;
  • Fig. 22 is a partial structural schematic diagram of the antenna structure shown in Fig. 3;
  • Fig. 23 is a schematic cross-sectional view of the antenna structure shown in Fig. 22 on line C-C;
  • Fig. 24 is a partial structural schematic diagram of the antenna structure shown in Fig. 3;
  • Fig. 25a is a data diagram of the reflection coefficient of the antenna structure of the embodiment of the present application changing with frequency
  • Fig. 25b is a schematic polarization diagram of the antenna structure of the embodiment of the present application.
  • Fig. 25c is another polarization schematic diagram of the antenna structure of the embodiment of the present application.
  • Fig. 25d is a partial cross-sectional schematic diagram of the packaging substrate structure of this embodiment.
  • Fig. 26 is a schematic structural view of another embodiment of the first metal connection piece and the second metal connection piece of the first antenna unit provided by the embodiment of the present application;
  • Fig. 27 is a partial structural schematic diagram of another implementation manner of the antenna structure provided by the embodiment of the present application.
  • Fig. 28 is a partial cross-sectional schematic diagram of another implementation manner of the antenna structure provided by the embodiment of the present application.
  • Fig. 29 is a schematic structural diagram of another implementation manner of the antenna structure provided by the embodiment of the present application.
  • Fig. 30a is a data diagram of the reflection coefficient of the antenna structure of the embodiment of the present application changing with frequency
  • Figure 30b is a schematic diagram of the current of the antenna structure in the n259 frequency band according to the embodiment of the present application.
  • Fig. 30c is a schematic diagram of the electric field of the antenna structure in the n259 frequency band according to the embodiment of the present application.
  • Figure 30d is a schematic diagram of the current of the antenna structure of the embodiment of the present application in the n260 frequency band;
  • Fig. 30e is a schematic diagram of the electric field of the antenna structure of the embodiment of the present application in the n260 frequency band;
  • Fig. 31 is a schematic structural diagram of another embodiment of the antenna structure provided by the embodiment of the present application.
  • Fig. 32a is a data diagram of the reflection coefficient of the antenna structure of the embodiment of the present application changing with frequency
  • Fig. 32b is a schematic cross-sectional view of a chip provided by an embodiment of the present application.
  • Fig. 33 is a schematic structural diagram of another embodiment of the electronic device provided by the embodiment of the present application.
  • Fig. 34 is an exploded schematic diagram of the antenna structure shown in Fig. 33;
  • Fig. 35 is an exploded schematic view of the first antenna unit shown in Fig. 34;
  • Fig. 36 is a partial structural schematic diagram of the antenna structure shown in Fig. 33;
  • Fig. 37 is a partial structural schematic diagram of the antenna structure shown in Fig. 33;
  • FIG. 38 is a schematic structural diagram of the antenna structure shown in FIG. 33 .
  • connection in this application can be understood as the physical contact and electrical conduction of components; it can also be understood as the connection between different components in the circuit structure through printed circuit board (Printed Circuit Board, PCB) copper foil or wires A form of connection such as physical lines that can transmit electrical signals.
  • electrical connection includes direct connection and indirect coupling.
  • connection and “connection” may refer to a mechanical connection relationship or a physical connection relationship. Take “connection” as an example for illustration.
  • Connection should be understood in a broad sense. For example, “connection” can be detachable or non-detachable; it can be direct or indirect through an intermediary.
  • the connection between A and B may mean that there is a fastening member between A and B (such as screws, bolts, rivets, etc.), or that A and B are in contact with each other and A and B are difficult to be separated.
  • length can be understood as the physical length of the object, and can also be understood as the electrical length.
  • Electrical length can refer to the physical length (i.e. mechanical length or geometric length) multiplied by the transmission time of an electrical or electromagnetic signal in a medium and the time required for this signal to travel the same distance as the physical length of the medium in free space Ratio means that the electrical length can satisfy the following formula:
  • L is the physical length
  • a is the transmission time of the electric or electromagnetic signal in the medium
  • b is the medium transmission time in free space.
  • the electrical length can also refer to the ratio of the physical length (ie mechanical length or geometric length) to the wavelength of the transmitted electromagnetic wave, and the electrical length can satisfy the following formula:
  • L is the physical length
  • ⁇ is the wavelength of the electromagnetic wave.
  • Coupling refers to the phenomenon that there is close cooperation and mutual influence between the input and output of two or more circuit elements or electrical networks, and the phenomenon of transferring energy from one side to the other through interaction.
  • Antenna gain It is used to characterize the degree to which the antenna radiates the input power. Generally, the narrower the main lobe of the antenna pattern and the smaller the side lobes, the higher the antenna gain.
  • Antenna radiation efficiency refers to the ratio of the power radiated from the antenna to space (that is, the power that effectively converts the electromagnetic wave part) to the active power input to the antenna.
  • active power input to the antenna input power of the antenna ⁇ loss power;
  • the loss power mainly includes return loss power and metal ohmic loss power and/or dielectric loss power.
  • Antenna return loss It can be understood as the ratio of the signal power reflected back to the antenna port through the antenna circuit and the transmit power of the antenna port. The smaller the reflected signal, the larger the signal radiated to the space through the antenna, and the greater the radiation efficiency of the antenna. The larger the reflected signal, the smaller the signal radiated to the space through the antenna, and the smaller the radiation efficiency of the antenna.
  • the return loss of the antenna can be expressed by the S11 parameter, and the S11 parameter is usually a negative number.
  • Antenna isolation refers to the ratio of the signal transmitted by one antenna and the signal received by another antenna to the signal of the transmitting antenna. Isolation is a physical quantity used to measure the degree of mutual coupling of antennas. Assuming that two antennas form a dual-port network, then the isolation between the two antennas is S21, S12 between the antennas. Antenna isolation can be expressed by S21 and S12 parameters. S21, S12 parameters are usually negative. The smaller the parameters of S21 and S12, the greater the isolation between antennas and the smaller the degree of antenna mutual coupling; the larger the parameters of S21 and S12, the smaller the isolation between antennas and the greater the degree of mutual coupling between antennas. The isolation of the antenna depends on the radiation pattern of the antenna, the spatial distance of the antenna, and the gain of the antenna.
  • Reference ground It can be the ground layer of the circuit board of an electronic device (such as a mobile phone), or it can be the ground layer formed by the board in the electronic device or the ground metal layer formed by the metal film under the screen.
  • the circuit board may be a printed circuit board (PCB), such as an 8-, 10-, or 12- to 14-layer board with 8, 10, 12, 13, or 14 layers of conductive material, or by means of materials such as fiberglass, polymer
  • a dielectric or insulating layer such as a dielectric or insulating layer separates and electrically insulates components.
  • a circuit board generally includes a dielectric substrate, a ground layer, and a wiring layer, and the wiring layer and the ground layer are electrically connected through via holes.
  • Components such as the display 120, touch screen, input buttons, transmitter, processor, memory, battery 140, charging circuitry, system on chip (SoC) structure, etc. may be mounted on or connected to the circuit board; or electrically connected to trace and/or ground planes in the board.
  • the radio frequency source is set on the wiring layer.
  • the ground layer, the ground layer, and the ground metal layer are made of conductive materials.
  • the conductive material can be any one of the following materials: copper, aluminum, stainless steel, brass and their alloys, copper foil on an insulating substrate, aluminum foil on an insulating substrate, gold foil on an insulating substrate, silver-plated copper, Silver-plated copper foil on insulating substrate, silver foil and tin-plated copper on insulating substrate, cloth impregnated with graphite powder, graphite-coated substrate, copper-plated substrate, brass-plated substrate and aluminum-coated substrate.
  • the ground layer/ground layer/ground metal layer can also be made of other conductive materials.
  • the mathematical concepts mentioned are symmetry, equality, 45°, parallel, perpendicular, etc. These limitations are all aimed at the current technological level, rather than an absolutely strict definition in the mathematical sense.
  • a small amount of deviation is allowed, such as approximately symmetrical, approximately equal, approximately 45°, approximately parallel, approximately vertical, etc.
  • a and B are parallel, which means that A and B are parallel or nearly parallel, and the angle between A and B can be between 0 degree and 10 degrees.
  • a and B are perpendicular, which means that A and B are perpendicular or nearly perpendicular, and the angle between A and B may be between 80 degrees and 100 degrees. Please refer to FIG. 1 .
  • FIG. 1 Please refer to FIG. 1 .
  • the electronic device 1 is a schematic structural diagram of an embodiment of an electronic device 1 provided in the present application.
  • the electronic device 1 can be a mobile phone, a watch, a tablet personal computer, a laptop computer, a personal digital assistant (PDA), a camera, a personal computer, a notebook computer, a vehicle-mounted device, a wearable Devices, augmented reality (AR) glasses, AR helmets, virtual reality (VR) glasses, VR helmets, mixed reality (MR) glasses, MR helmets, or devices that can be used to emit millimeter wave antennas .
  • the electronic device 1 of the embodiment shown in FIG. 1 is described by taking a mobile phone as an example.
  • FIG. 2 is a partially exploded schematic diagram of the electronic device 1 shown in FIG. 1 .
  • the electronic device 1 includes a circuit board assembly 100 , a casing 200 and a screen 300 .
  • FIG. 1 and FIG. 2 only schematically show some components included in the electronic device 1, and the actual shape, actual size, actual position and actual structure of these components are not affected by FIG. 1, FIG. 2 and the following appendices. Figure limited. It should be noted that, since the circuit board assembly 100 is located inside the electronic device 1 , FIG. 1 schematically shows the circuit board assembly 100 by dotted lines.
  • the screen 300 can be used to display images and the like.
  • the screen 300 may be a flat screen or a curved screen.
  • the screen 300 may include a transparent cover 301 and a display 302 .
  • the transparent cover 301 is stacked on the display screen 302 .
  • the transparent cover plate 301 can be arranged close to the display screen 302, and can be used to play light transmission, protection and dust-proof effects on the display screen 302.
  • the material of the transparent cover plate 301 may be glass.
  • the display screen 302 can be used to display images and the like.
  • the display screen 302 can be a liquid crystal display (liquid crystal display, LCD), an organic light-emitting diode (organic light-emitting diode, OLED) display, an active matrix organic light-emitting diode or an active-matrix organic light-emitting diode (active-matrix organic light-emitting diode).
  • LCD liquid crystal display
  • OLED organic light-emitting diode
  • active-matrix organic light-emitting diode active-matrix organic light-emitting diode
  • matrix organic light-emitting diode (AMOLED) display quantum dot light emitting diodes (quantum dot light emitting diodes, QLED) display, etc.
  • the housing 200 includes a frame 201 and a rear cover 202 .
  • the back cover 202 can be fixed on one side of the frame 201 by glue.
  • the rear cover 202 can also be integrally formed with the frame 201 .
  • the screen 300 can be fixed on the other side of the frame 201 by glue.
  • the screen 300 is disposed opposite to the rear cover 202 , and the transparent cover 301 of the screen 300 is located on a side of the display screen 302 of the screen 300 away from the rear cover 202 .
  • the back cover 202 , the frame 201 and the screen 300 can jointly enclose the interior of the electronic device 1 .
  • the interior of the electronic device 1 can be used to set components such as a battery, a speaker, a receiver, a camera, and a microphone.
  • the casing 200 may further include a middle plate (not shown).
  • the middle plate is located between the screen 300 and the rear cover 202 .
  • the middle plate may be at least partially spaced from the frame 201 , or at least partially connected to the inside of the frame 201 , or partially spaced from the frame and partially connected to the inside of the frame 201 .
  • the inner side of the bezel includes extensions.
  • the extension part is connected with the middle plate, or the frame and the middle plate are integrally structured.
  • the circuit board assembly 100 is fixed inside the electronic device 1 .
  • the circuit board assembly 100 can be fixed inside the electronic device 1 by fasteners (screws, screws or pins, etc.).
  • the casing 200 and the screen 300 can protect the circuit board assembly 100 .
  • FIG. 3 is a partially exploded view of the circuit board assembly 100 shown in FIG. 2 .
  • the circuit board assembly 100 includes an antenna structure 10 , a radio frequency circuit 20 and a printed circuit board (PCB) 30 .
  • PCB printed circuit board
  • the circuit board 30 can be a rigid circuit board, a flexible circuit board, or a rigid-flex circuit board.
  • the circuit board 30 may be an FR-4 dielectric board, a Rogers (Rogers) dielectric board, or a mixed media board of FR-4 and Rogers, and so on.
  • FR-4 is a code name of a flame-resistant material grade
  • Rogers dielectric board is a high-frequency board.
  • the circuit board 30 may be composed of one board, for example, the circuit board 30 may be a main board, or a sub-board, or any flexible circuit board connected between the main board and the sub-board. Exemplarily, both the main board and the sub board are rigid circuit boards.
  • the circuit board 30 may also consist of a plurality of boards.
  • the circuit board 30 may include a main board, a sub-board and a sub-board.
  • the sub-board is electrically connected between the main board and the sub-board.
  • both the main board and the sub-board are rigid circuit boards, and the sub-board is a flexible circuit board.
  • the antenna structure 10 and the radio frequency circuit 20 are both disposed on the circuit board 30 .
  • the antenna structure 10 can be electrically connected to the radio frequency circuit 20 through the circuit board 30 .
  • the radio frequency circuit 20 can transmit a radio frequency signal to the antenna structure 10 through the circuit board 30, so that the antenna structure 10 radiates electromagnetic waves according to the radio frequency signal.
  • the radio frequency circuit 20 can also receive the radio frequency signals converted by the antenna structure 10 through the circuit board 30 .
  • the antenna structure 10 can be integrated in the circuit board 30 .
  • the antenna structure 10 and the circuit board 30 are integrally formed.
  • the radio frequency circuit 20 includes a radio frequency transceiver chip 21 and a matching circuit 22 .
  • the matching circuit 22 may include electronic devices such as antenna switches, capacitors, inductors, or resistors.
  • the matching circuit 22 is electrically connected between the radio frequency transceiver chip 21 and the antenna structure 10 .
  • the radio frequency transceiver chip 21 is used for transmitting radio frequency signals to the antenna structure 10, so that the antenna structure 10 radiates electromagnetic waves according to the radio frequency signals.
  • the radio frequency transceiver chip 21 can also receive the radio frequency signals converted by the antenna structure 10 .
  • the matching circuit 22 can be used for signal processing of radio frequency signals. For example, signal amplification or filtering, etc.
  • the antenna structure 10 and the matching circuit 22 can be integrated in the radio frequency transceiver chip 21 .
  • the antenna structure 10, the matching circuit 22 and the radio frequency transceiver chip 21 form an integral structure.
  • the interior of the electronic device 1 can save the occupied space of the matching circuit 22 and the antenna structure 10, thereby improving the utilization rate of the internal space of the electronic device 1, reducing the transmission loss of the antenna, and improving the efficiency of the antenna.
  • the circuit board assembly 100 may further include a function chip.
  • the function chip is a central processing unit (central processing unit, CPU), a graphics processing unit (graphics processing unit, GPU), a universal flash storage (universal flash storage, UFS) or a battery management chip (power management integrated circuits).
  • the radio frequency circuit 20 and the antenna structure 10 can be integrated in a functional chip.
  • the radio frequency circuit 20, the antenna structure 10 and the functional chip are formed into an integral structure.
  • the radio frequency circuit 20 and the antenna structure 10 can be integrated on the CPU. In this way, the space occupied by the radio frequency circuit 20 and the antenna structure 10 can be saved inside the electronic device 1 , thereby improving the utilization rate of the internal space of the electronic device 1 .
  • the antenna structure 10 is disposed on the circuit board 30 .
  • the antenna structure 10 may also be disposed on other substrates.
  • a low temperature co-fired ceramic (LTCC) substrate for example, LTCC
  • the radiation direction of the antenna structure 10 can be set in various ways.
  • the antenna structure 10 can radiate or receive electromagnetic waves to the outside of the electronic device 1 through the back cover 202 .
  • the antenna structure 10 can directly radiate or receive electromagnetic waves to the outside of the electronic device 1 through the back cover 202 .
  • the antenna structure 10 can pass through the through hole of the back cover 202 to the The exterior of the electronic device 1 radiates or receives electromagnetic waves.
  • insulating materials for example: materials such as polymers, glass, ceramics, or combinations of these materials, etc.
  • the antenna structure 10 can radiate or receive electromagnetic waves to the outside of the electronic device 1 through the frame 201 .
  • the antenna structure 10 can directly radiate or receive electromagnetic waves to the outside of the electronic device 1 through the frame 201 .
  • the antenna structure 10 can pass through the hole of the frame 201 to the electronic device 1 external radiation or receive electromagnetic waves.
  • the through holes with insulating materials (for example: materials such as polymers, glass, ceramics, or combinations of these materials, etc.), the integrity of the frame 201 and the integrity of the frame 201 can be ensured without affecting the transmission of electromagnetic waves. Surface roughness.
  • the antenna structure 10 can radiate or receive electromagnetic waves to the outside of the electronic device 1 through the screen 300 .
  • the antenna structure 10 can directly radiate or receive electromagnetic waves to the outside of the electronic device 1 through the transparent cover 301 .
  • electromagnetic waves can be radiated or received outside the electronic device 1 through the transparent cover 301 .
  • the screen 300 may be a notch screen or a water drop screen.
  • the antenna structure 10 can radiate or receive electromagnetic waves to the outside of the electronic device 1 through the "water drop” position or the "notch” position of the screen 300, etc.
  • the "water drop” position or the "notch” position of the screen 300 is an opening structure.
  • the antenna structure 10 can radiate or receive electromagnetic waves to the outside of the electronic device 1 through the opening position of the screen 300 .
  • the antenna structure 10 is not limited to radiating from one portion.
  • the antenna structure 10 when the antenna structure 10 is close to the rear cover 202 and the frame 201 , the antenna structure 10 can radiate or receive electromagnetic waves to the outside of the electronic device 1 through the insulating parts of the rear cover 202 and the frame 201 .
  • the antenna structure 10 can support frequency bands n257, n258, n259, n260 and n261, for example, the antenna structure 10 can cover a frequency range from 24.25 GHz to 43.5 GHz.
  • f0 as the center frequency of the antenna structure 10 .
  • ⁇ 0 is the medium wavelength of the center frequency.
  • the antenna structure 10 can be applied in the millimeter wave frequency band.
  • the antenna structure 10 can meet the user's 5G (5th Generation, fifth generation) mobile communication requirements, so as to be applied in scenarios such as calls and video calls.
  • an NFC (Near Field Communication, near field communication) chip is set in the electronic device 1 to meet the user's near field communication requirements, so as to be applied in scenarios such as mobile payment, bus payment, and identification.
  • the antenna structure 10 may also cover other frequency bands. At this time, the center frequency f0 of the antenna structure 10 will also change accordingly.
  • FIG. 4 is a partially exploded schematic view of the antenna structure 10 shown in FIG. 3 .
  • the antenna structure 10 includes a dielectric layer 11 , a ground layer 12 , a feeding unit 13 , an antenna unit 14 and a plurality of matching via groups 15 .
  • the dielectric layer 11 adopts LCP (Liquid Crystal Polymer, liquid crystal polymer) dielectric layer 11, also can adopt FR-4 dielectric layer 11, also can adopt Rogers (Rogers) dielectric layer 11, also can adopt FR-4 and Rogers's Mixed media plates, etc.
  • LCP Liquid Crystal Polymer, liquid crystal polymer
  • FR-4 dielectric layer 11 also can adopt Rogers (Rogers) dielectric layer 11
  • FR-4 and Rogers's Mixed media plates etc. It can be understood that when the material of the dielectric layer is LCP, since the loss tangent value of LCP remains relatively small at high frequencies, this can make the antenna structure have a small transmission loss, thereby improving the antenna radiation efficiency and obtaining more High antenna gain.
  • the ground layer 12 , the feed unit 13 , the antenna unit 14 and a plurality of matching via groups 15 can all be disposed on the dielectric layer 11 .
  • the dielectric layer 11 can be used to support the ground layer 12, the feed unit 13, the antenna unit 14 and a plurality of matching via groups 15, so that the ground layer 12, the feed unit 13, the antenna unit 14 and the multiple The matched via group 15 forms an integral structure.
  • the dielectric layer 11 may wrap or semi-wrap the ground layer 12 , the feed unit 13 , the antenna unit 14 and a plurality of matching via groups 15 .
  • the dielectric layer 11 half-wraps the ground layer 12, the feed unit 13, the antenna unit 14, and a plurality of matching via groups 15, at least A portion may be exposed relative to the dielectric layer 11 .
  • the ground layer 12 , the feed unit 13 , the antenna unit 14 and a plurality of matching via groups 15 may be disposed on a surface of the dielectric layer 11 .
  • the structure formed by the ground layer 12 , the feed unit 13 , the antenna unit 14 and a plurality of matching via groups 15 is a multi-layer structure.
  • the multi-layer structure needs to be formed layer by layer.
  • this embodiment can correspondingly form a sub-layer of the dielectric layer.
  • the dielectric layer 11 is just enough to allow the ground layer 12 , the feeding unit 13 , the antenna unit 14 and a plurality of matching via groups 15 to be embedded in the dielectric layer 11 . Therefore, although the dielectric layer 11 shown in FIG. 4 is an integral structure, the dielectric layer 11 can also be formed by stacking multiple sub-layers.
  • the antenna structure 10 may also not include the dielectric layer 11 .
  • the ground layer 12 , the feed unit 13 and the antenna unit 14 may be fixed by a bracket or the like.
  • the antenna structure 10 may also not include the matched via group 15 .
  • the ground layer 12 is used to provide grounding for the antenna unit 14 .
  • the material of the ground layer 12 may be a metal material.
  • the shape of the ground layer 12 can be a square, a rectangle, a circle, and the like. Specifically, the shape of the ground layer 12 is not limited. In this embodiment, the ground layer 12 is described as a square as an example.
  • the ground layer 12 is provided with first through holes 121 and second through holes 122 arranged at intervals. Both the first through hole 121 and the second through hole 122 penetrate through two opposite surfaces of the ground layer 12 (eg, the top surface and the bottom surface of the ground layer 12 ).
  • the feeding unit 13 can be electrically connected to the radio frequency circuit 20 outside the antenna structure 10 through the first through hole 121 and the second through hole 122 .
  • the number of antenna units 14 may be one or multiple.
  • a plurality of antenna units 14 are taken as an example for description.
  • Multiple antenna units 14 are arranged in m rows and n columns, where m and n are both positive integers.
  • a gap is formed between two adjacent antenna units 14 .
  • a plurality of antenna elements 14 may form a "1x1" array, a "2x1” array, a "1x2" array, a "2x2" array, a "3x3" array, and the like.
  • the multiple antenna units 14 in this embodiment are described as an example of a "2x2" array.
  • the number of antenna units 14 is four, specifically including a first antenna unit 14a, a second antenna unit 14b, a third antenna unit 14c and a fourth antenna unit 14d.
  • FIG. 5 is an exploded view of the first antenna unit 14 a and the second antenna unit 14 b shown in FIG. 4 .
  • the first antenna unit 14 a includes a first metal layer 141 , a second metal layer 142 , a first metal post 143 , a second metal post 144 , a third metal post 145 , a first metal connecting piece 146 a and a second metal connecting piece 146 b.
  • the first metal post 143 constitutes the first conductive element in this embodiment.
  • the second metal post 144 , the third metal post 145 , the first metal connection piece 146 a and the second metal connection piece 146 b constitute the second conductive element in this embodiment.
  • the first metal layer 141 of the first antenna unit 14a, the second metal layer 142 of the first antenna unit 14a, the first metal post 143 of the first antenna unit 14a , the second metal post 144 of the first antenna unit 14a, the third metal post 145 of the first antenna unit 14a, the first metal connection piece 146a of the first antenna unit 14a and the second metal connection piece 146b of the first antenna unit 14a and other related descriptions are simplified as the first metal layer 141, the second metal layer 142, the first metal post 143, the second metal post 144, the third metal post 145, the first metal connecting piece 146a and the second metal connecting piece 146b, etc. describe.
  • first metal layer 141, the second metal layer 142, the first metal post 143, the second metal post 144, the third metal post 145, the first metal connecting piece 146a and the second metal connecting piece 146b are labeled
  • the post 164, the third metal post 165 of the second antenna unit 14b, the first metal connection piece 166a of the second antenna unit 14b, and the second metal connection piece 166b of the second antenna unit 14b are distinguished by names.
  • FIG. 6 is a partial structural diagram of the antenna structure 10 shown in FIG. 3 .
  • the third metal post 145 is connected to the ground layer 12 .
  • the number of the third metal pillars 145 is three.
  • the three third metal pillars 145 may be arranged in an "L shape", or may also be arranged in an arc.
  • Three third metal pillars 145 are semi-enclosed around the first through hole 121 of the ground layer 12 . In other embodiments, the quantity and arrangement shape of the third metal pillars 145 are not specifically limited.
  • the structure of the third metal pillar 145 may be that a layer of metal material is formed on the wall of the via hole.
  • the third metal post 145 is roughly in a "pipe" structure.
  • the structure of the third metal pillar 145 may also be filled with metal material in the via hole.
  • the third metal pillar 145 may be in a "pillar” structure, and in other embodiments, the third metal pillar 145 may also be in other structures.
  • this embodiment does not make a limitation.
  • the structures of the metal pillars mentioned below can refer to the structure of the third metal pillar 145 in this embodiment. The details will not be described in detail below.
  • FIG. 7 is a schematic structural diagram of the first metal connection piece 146 a and the second metal connection piece 146 b of the first antenna unit 14 a shown in FIG. 5 .
  • the number of the first metal connecting piece 146a is one. In other embodiments, the number of the first metal connecting pieces 146a is not limited.
  • the first metal connecting piece 146a includes a first connecting portion 1461 and a second connecting portion 1462 .
  • the first connecting portion 1461 is connected to the second connecting portion 1462 to form a bent shape.
  • the first metal connecting piece 146a is "L-shaped" or arc-shaped. It should be noted that, in order to clearly introduce the structure of the first metal connection piece 146a, FIG. 7 schematically distinguishes the first connection part 1461 and the second connection part 1462 by a dotted line.
  • the width a1 of the first connecting portion 1461 is equal to the width a2 of the second connecting portion 1462 .
  • the length c2 of the second connection portion 1462 is equal to the sum of the length c1 of the first connection portion 1461 and the width a2 of the second connection portion 1462 .
  • the size of each part of the first metal connection piece 146a is not specifically limited.
  • the number of the second metal connecting piece 146b can be multiple.
  • the number of the second metal connecting pieces 146b is four. In other embodiments, the number of the second metal connecting pieces 146b is not limited.
  • the second metal connecting piece 146b includes a third connecting portion 1463 and a fourth connecting portion 1464 .
  • the third connecting portion 1463 connects to the fourth connecting portion 1464 and forms a bent shape.
  • the second metal connection piece 146b may be in an "L-shape" shape or an arc shape. It should be noted that, FIG. 7 schematically distinguishes the third connecting portion 1463 and the fourth connecting portion 1464 by dotted lines.
  • the width a3 of the third connection portion 1463 is equal to the width a4 of the fourth connection portion 1464 .
  • the width a3 of the third connection portion is smaller than the width a1 of the first connection portion 1461 .
  • the width a4 of the fourth connecting portion 1464 is smaller than the width a2 of the second connecting portion 1462 .
  • the length c4 of the fourth connection portion 1464 is equal to the sum of the length c3 of the third connection portion 1463 and the width a4 of the fourth connection portion 1464 .
  • the length c4 of the fourth connection portion 1464 is equal to the length c2 of the second connection portion 1462 .
  • the size of each part of the second metal connection piece 146b is not specifically limited.
  • FIG. 8 is a partial structural diagram of the antenna structure 10 shown in FIG. 3 .
  • the ground layer 12 is spaced from and opposite to the first metal connection piece 146 a , and the first metal connection piece 146 a is connected to an end of the third metal post 145 away from the ground layer 12 .
  • the third metal post 145 is connected between the ground layer 12 and the first metal connection piece 146a, and the third metal post 145, the ground layer 12 and the first metal connection piece 146a are electrically connected to each other.
  • a third metal post 145 is connected to the first connection portion 1461 of the first metal connection piece 146a.
  • the two third metal pillars 145 are connected to the second connecting portion 1462 of the first metal connecting piece 146a.
  • the third metal post 145 may pass through the first metal connection piece 146a.
  • FIG. 9 is a partial structural diagram of the antenna structure 10 shown in FIG. 3 .
  • the plurality of second metal connecting pieces 146b are located on a side of the first metal connecting piece 146a away from the third metal post 145 .
  • a plurality of second metal connecting pieces 146b are arranged at intervals along the thickness direction of the antenna structure 10 .
  • the third connecting portion 1463 of each second metal connecting piece 146b is spaced from each other and disposed opposite to each other, and is spaced from and disposed opposite to the first connecting portion 1461 of the first metal connecting piece 146a.
  • the fourth connecting portion 1464 of each second metal connecting piece 146b is spaced apart from and opposite to each other, and is spaced from and opposite to the second connecting portion 1462 of the first metal connecting piece 146a.
  • a plurality of second metal pillars 144 are arranged at intervals, and one end of each second metal pillar 144 is also connected to the first metal connecting piece 146a.
  • the projection of the plurality of second metal pillars 144 on the first metal connecting sheet 146 a and the projection of the plurality of third metal pillars 145 on the first metal connecting sheet 146 a at least partially overlap.
  • the plurality of second metal pillars 144 are also connected to a plurality of second metal connecting pieces 146b.
  • the second metal connection piece 146b, the second metal post 144, the first metal connection piece 146a, the third metal post 145 and the ground layer 12 are electrically connected to each other.
  • the plurality of second metal pillars 14 may be arranged in an "L shape", or may also be arranged in an arc.
  • each second metal post 144 may pass through each second metal connection piece 146b. At this time, the connection between the second metal post 144 and the second metal connection piece 146b is more stable. In other implementations, each second metal post 144 may not pass through each second metal connecting piece 146b. At this time, by setting the second metal post 144 between every two second metal connecting pieces 146b, and setting the second metal post 144 between the second metal connecting piece 146b and the first metal connecting piece 146a, so that the second metal connecting piece 146b The two metal connection pieces 146b, the second metal pillar 144, and the first metal connection piece 146a are electrically connected to each other.
  • the diameter of the second metal post 144 is smaller than the diameter of the third metal post 145 . It can be understood that, when the diameter of the second metal pillar 144 is smaller, the thickness of the dielectric layer wrapped around the second metal pillar 144 can be made smaller. When the diameter of the third metal post 145 is larger, the thickness of the dielectric layer wrapped around the third metal post 145 can be made larger. In this way, in the forming process of the antenna structure 10, two dielectric plates with different thicknesses (one dielectric plate is provided with the second metal pillar 144, and the other dielectric plate is provided with the third metal pillar 145) can be bonded or welded. way stacked into a whole.
  • the width of the fourth connection part 1464 is a4 smaller than the width a4 of the first connection part 1461.
  • the width of the second connecting portion 1462 is a2, so that the first connecting portion 1461 and the second connecting portion 1462 have enough space to connect with the third metal post 145 and ensure better connection stability.
  • the first antenna unit 14a may not include the third metal post 145 and the first metal connecting piece 146a. At this time, the second metal post 144 may be directly connected to the ground layer 12 .
  • the first antenna unit 14a may not include the second metal connecting piece 146b.
  • FIG. 10 is a schematic structural diagram of the second metal sheet 142 of the first antenna unit 14 a shown in FIG. 5 .
  • the second metal layer 142 includes a top surface 1425 and a bottom surface 1426 opposite to each other, and a side surface 1427 connected between the top surface 1425 and the bottom surface 1426 . Since the thickness of the first metal layer 141 in this embodiment is smaller than the length and width of the first metal layer 141 , the distance between the top surface 1425 of the first metal layer 141 and the bottom surface 1426 of the first metal layer 141 is relatively small. Small, the structure of the top surface 1425 of the first metal layer 141 and the bottom surface 1426 of the first metal layer 141 are substantially the same.
  • this embodiment can be described by taking the top surface 1425 of the first metal layer 141 as an example.
  • the structure of the side surface 1427 of the first metal layer 141 has little influence on the structure of the first metal layer 141 . Therefore, the three-dimensional structure of the first metal layer 141 can also be roughly reflected by describing the structure of the top surface 1425 of the first metal layer 141 .
  • the shape of the second metal layer 142 may be square, rectangular, circular and so on. This embodiment is described by taking the shape of the second metal layer 142 as a square as an example.
  • the second metal layer 142 includes a first side 1421 and a second side 1422 opposite to each other, and a third side 1423 and a fourth side 1424 opposite to each other.
  • the third side 1423 and the fourth side 1424 are connected between the first side 1421 and the second side 1422 . Since the second metal layer 142 is a square, the lengths of the first side 1421 , the second side 1422 , the third side 1423 and the fourth side 1424 of the second metal layer 142 are all equal.
  • the side length b1 of the second metal layer 142 is equal to the length c4 of the second connection portion 1464 of the second metal connection piece 146b (see FIG. 7 ).
  • the second metal layer 142 includes a first region 142 a and a second region 142 b arranged at intervals.
  • FIG. 10 schematically distinguishes the first region 142a and the second region 142b by dashed lines.
  • the shapes of the first region 142a and the second region 142b may be "L-shaped".
  • the first region 142a is disposed close to the first side 1421 and the third side 1423 .
  • the second region 142b is disposed close to the second side 1422 and the fourth side 1424 .
  • the shapes of the first region 142a and the second region 142b are not specifically limited.
  • FIG. 11 is a partial structural diagram of the antenna structure 10 shown in FIG. 3 .
  • the second metal layer 142 is spaced apart from the second metal connection piece 146b and is oppositely disposed.
  • One end of each second metal pillar 144 is connected to the second region 142 b of the second metal layer 142 .
  • each second metal post 14 is connected between the second region 142 b of the second metal layer 142 and the first metal connecting piece 146 a.
  • Some of the second metal pillars 144 are disposed close to the second side 1422 of the second metal layer 142 , and some of the second metal pillars 144 are disposed close to the fourth side 1424 of the second metal layer 142 .
  • the second metal layer 142 , the second metal post 144 , the third metal post 145 , the first metal connection piece 146 a , the second metal connection piece 146 b and the ground layer 12 enclose the first space S1 .
  • the first space S1 can be used to arrange other components of the antenna structure 10 .
  • the space ratio of the antenna structure 10 is relatively high.
  • the antenna structure 10 can be arranged compactly, which facilitates the miniaturized arrangement of the antenna structure 10 .
  • the first through hole 121 of the ground layer 12 communicates with the first space S1.
  • first metal pillar 143 is connected to the first region 142 a of the second metal layer 142 .
  • the number of the first metal pillars 143 is three.
  • the three first metal pillars 143 may be arranged in an "L shape", or may be arranged in an arc.
  • the first metal post 143 is connected to the first region 142a of the second metal layer 142 , at this time, the first metal post 143
  • the second metal pillar 144 is divided into two regions on the second metal layer 142 and arranged at intervals, that is, the projection of the first metal pillar 143 on the second metal layer 142 is staggered from the projection of the second metal pillar 144 on the second metal layer 142 .
  • first metal post 143 the second metal layer 142 , the second metal post 144 , the third metal post 145 , the first metal connection piece 146 a , the second metal connection piece 146 b and the ground layer 12 are electrically connected to each other.
  • FIG. 12 is a schematic structural diagram of the first metal sheet 141 of the first antenna unit 14 a shown in FIG. 5 .
  • the shape of the first metal layer 141 may be a square, a rectangle, a circle, and the like. This embodiment is described by taking the shape of the first metal layer 141 as a square as an example.
  • the first metal layer 141 includes a first side 1411 and a second side 1412 opposite to each other, and a third side 1413 and a fourth side 1414 opposite to each other.
  • the third side 1413 and the fourth side 1414 are connected between the first side 1411 and the second side 1412 .
  • the lengths of the first side 1411 , the second side 1412 , the third side 1413 and the fourth side 1414 of the first metal layer 141 are all equal.
  • the side length of the first metal layer 141 is in the range of 0.25 ⁇ 0 to 0.35 ⁇ 0.
  • the area of the first metal layer 141 is larger than the area of the second metal layer 142 .
  • the first metal layer 141 has a diagonal line M1.
  • One end of the diagonal line M1 is located at the junction of the first side 1411 and the third side 1413 , and the other end is located at the junction of the second side 1412 and the fourth side 1414 .
  • the diagonal line M1 is not an actual structure on the first metal layer 141 .
  • Diagonal line M1 is a virtual line.
  • FIG. 12 illustrates the diagonal M1 by means of a dashed line.
  • FIG. 13 is a partial structural diagram of the antenna structure 10 shown in FIG. 3 .
  • the first metal layer 141 and the second metal layer 142 are spaced apart and opposite to each other.
  • the first metal layer 141 is fixed on the end of the first metal post 143 .
  • the first metal pillar 143 is connected between the first metal layer 141 and the first region 142 a of the second metal layer 142 .
  • the first metal layer 141 is electrically connected to the first metal pillar 143 .
  • the projection of the second metal layer 142 on the plane of the first metal layer 141 is located in the first metal layer 141 .
  • the projection of the first metal layer 141 on the ground layer 12 is located in the ground layer 12 .
  • the first side 1411 of the first metal layer 141 is opposite to the first side 1421 of the second metal layer 142, that is, the projection of the first side 1421 of the second metal layer 142 on the first metal layer 141 is the same as the first side 1421 of the second metal layer 142.
  • the first side 1411 of a metal layer 141 overlaps.
  • the third side 1413 of the first metal layer 141 is opposite to the third side 1423 of the second metal layer 142, that is, the third side 1423 of the second metal layer 142 and the projection on the first metal layer 141 and the first metal layer
  • the third side 1413 of 141 coincides.
  • FIG. 14 is a schematic cross-sectional view of part of the antenna structure 10 shown in FIG. 13 at the line A-A.
  • the current path (Fig. 14 is simply indicated by a thick line) ) includes the ground layer 12, the third metal post 145, the first metal connection piece 146a, the second metal post 144, the second region 142b of the second metal layer 142 (see FIG. 11), the first part of the second metal layer 142 The region 142a (see FIG. 11 ), the first metal pillar 143 and the first metal layer 141 .
  • the current path is arranged as a bend.
  • the cross-sectional height H of the antenna structure 10 of this embodiment is lower, and the antenna structure 10 can be beneficial to realize thinner configuration.
  • the section of the antenna structure 10 when the length of the current path (that is, the electrical length is equal to the sum of the section height H of the antenna structure 10 and the side length of the second metal layer 142) is in the range of 0.25 ⁇ 0 to 0.32 ⁇ 0, the section of the antenna structure 10 The height H may be in the range of 0.15 ⁇ 0 to 0.21 ⁇ 0. In this way, compared with the cross-sectional heights of other antenna structures 10 , the cross-sectional height H of the antenna structure 10 of this embodiment is greatly reduced.
  • the first antenna unit 14a may have a symmetrical structure, or a partially symmetrical structure, or the same or similar structure or a different structure.
  • the first antenna unit 14a has a symmetrical structure.
  • the first antenna unit 14a is symmetrical about the symmetry plane of the first antenna unit 14a.
  • the symmetry plane of the first antenna unit 14a is perpendicular to the plane where the first metal layer 141 is located, and the diagonal M1 of the first metal layer 141 is located on the symmetry plane of the first antenna unit 14a.
  • the second antenna unit 14b includes a first metal layer 161, a second metal layer 162, a first metal post 163, a second metal post 164, a third metal post 165, a first metal connecting piece 166a and a first metal post 166a.
  • Two metal connecting pieces 166b are two metal connecting pieces.
  • first metal layer 161, the second metal layer 162, the first metal post 163, the second metal post 164, the third metal post 165, the first metal connecting piece 166a and the second metal connecting piece 166b can be referred to
  • the second antenna unit 14b may not include the third metal post 165 , the first metal connection piece 166a and the second metal connection piece 166b .
  • the third metal post 165 is connected to the ground layer 12 .
  • the third metal post 165 of the second antenna unit 14b is located at one side of the third metal post 145 of the first antenna unit 14a.
  • the number of the third metal pillars 165 is three.
  • the three third metal pillars 165 are arranged in an "L shape", or may also be in an arc shape. In other embodiments, the number of the third metal pillars 165 is not specifically limited.
  • the first metal connecting piece 166 a is connected to the end of the third metal post 165 away from the ground layer 12 .
  • the third metal post 165 is connected between the first metal connection piece 166 a and the ground layer 12 , and the third metal post 165 , the first metal connection piece 166 a and the ground layer 12 are electrically connected to each other.
  • first connection portion 1661 of the first metal connection piece 166a of the second antenna unit 14b is opposite to the first connection portion 1461 of the first metal connection piece 146a of the first antenna unit 14a.
  • the second connection portion 1662 of the first metal connection piece 166a of the second antenna unit 14b is opposite to the second connection portion 1642 of the first metal connection piece 146a of the first antenna unit 14a.
  • a third metal post 165 is connected to the first connection portion 1661 of the first metal connection piece 166a.
  • the two third metal pillars 165 are connected to the second connecting portion 1662 of the first metal connecting piece 166a.
  • the plurality of second metal connecting pieces 166 b are located on the side of the first metal connecting piece 166 a away from the third metal post 165 .
  • a plurality of second metal connecting pieces 166b are arranged at intervals along the thickness direction of the antenna structure 10 .
  • the third connecting portion 1663 of each second metal connecting piece 166b is spaced apart from and opposite to each other, and is spaced from and opposite to the first connecting portion 1661 of the first metal connecting piece 166a.
  • the fourth connection portions 1664 of each second metal connection piece 166b are spaced apart from and opposite to each other, and are spaced from and opposite to the second connection portion 1662 of the first metal connection piece 166a.
  • a plurality of second metal pillars 164 are arranged at intervals, and one end of each second metal pillar 164 is also connected to the first metal connecting piece 166a.
  • the projection of the plurality of second metal pillars 164 on the first metal connecting sheet 166 a and the projection of the plurality of third metal pillars 165 on the first metal connecting sheet 166 a at least partially overlap.
  • the plurality of second metal pillars 164 are also connected to a plurality of second metal connecting pieces 166b. At this time, the second metal connecting piece 166 b , the second metal post 164 , the first metal connecting piece 166 a , the third metal post 165 and the ground layer 12 are electrically connected to each other.
  • each second metal post 164 may pass through each second metal connecting piece 166b. At this time, the connection between the second metal post 164 and the second metal connection piece 166b is more stable. In other implementations, each second metal post 164 may not pass through each second metal connecting piece 166b. At this time, by setting the second metal post 164 between every two second metal connecting pieces 166b, and setting the second metal post 164 between the second metal connecting piece 166b and the first metal connecting piece 166a, so that the second metal connecting piece 166b The two metal connection pieces 166b, the second metal pillar 164, and the first metal connection piece 166a are electrically connected to each other.
  • the second metal post 164 may be directly connected to the ground layer 12 .
  • the second metal layer 162 is fixed on ends of a plurality of second metal pillars 164 .
  • the first side 1621 of the second metal layer 162 of the second antenna unit 14b is spaced apart from the first side 1421 of the second metal layer 142 of the first antenna unit 14a.
  • each second metal pillar 164 is connected to the second region 162 b of the second metal layer 162 . At this moment, part of the second metal pillar 164 is disposed close to the second side 1622 of the second metal layer 162 . Part of the second metal pillar 144 is disposed close to the fourth side 1624 of the second metal layer 162 .
  • the second metal layer 162 , the second metal post 164 , the third metal post 165 , the first metal connection piece 166 a , the second metal connection piece 166 b and the ground layer 12 enclose the second space S2 .
  • the second space S2 communicates with the first space S1.
  • the second space S2 can be used to arrange other components of the antenna structure 10 .
  • the space ratio of the antenna structure 10 is relatively high.
  • the antenna structure 10 can be arranged compactly, which facilitates the miniaturized arrangement of the antenna structure 10 .
  • each first metal pillar 163 is connected to the first region 162 a of the second metal layer 162 .
  • the number of the first metal pillars 163 is three.
  • the three first metal pillars 163 are arranged in an "L-shape".
  • the first metal post 163 is connected to the first region 162a of the second metal layer 162.
  • the first metal post 163 The second metal pillar 164 is divided into two regions on the second metal layer 162 and arranged at intervals, that is, the projection of the first metal pillar 163 on the second metal layer 162 is staggered from the projection of the second metal pillar 164 on the second metal layer 162 .
  • first metal post 163 , the second metal layer 162 , the second metal post 164 , the third metal post 165 , the first metal connection piece 166 a , the second metal connection piece 166 b and the ground layer 12 are electrically connected to each other.
  • the first metal layer 161 and the second metal layer 162 are spaced apart and oppositely arranged.
  • the first metal layer 161 is fixed on the end of the first metal post 163 .
  • the first metal layer 161 is electrically connected to the first metal pillar 163 .
  • the projection of the second metal layer 162 on the plane of the first metal layer 161 is located in the first metal layer 161 .
  • the projection of the first metal layer 161 on the ground layer 12 is located in the ground layer 12 .
  • the first side 1611 of the first metal layer 161 of the second antenna unit 14 b and the first side 1411 of the first metal layer 141 of the first antenna unit 14 a form a first gap 191 .
  • the projection of the first slot 191 on the ground layer 12 is located in the ground layer 12 .
  • the projection of the first side 1621 of the second metal layer 162 on the first metal layer 161 coincides with the first side 1611 of the first metal layer 161 .
  • the projection of the third side 1623 of the second metal layer 162 on the first metal layer 161 coincides with the third side 1613 of the first metal layer 161 .
  • FIG. 14 Please refer to FIG. 14 again, by dividing the first metal post 163 and the second metal post 164 into two regions on the second metal layer 162 and setting them apart, so that when the second antenna unit 14b is in the working state, the current path (Fig. 14 It is simply illustrated by thick lines) including the ground layer 12, the third metal post 165, the first metal connection piece 166a, the second metal post 164, the second region 162b of the second metal layer 162 (see FIG. 11 ), the second metal The first region 162 a of the layer 162 (see FIG. 11 ), the first metal pillar 163 and the first metal layer 161 .
  • the current path is arranged as a bend.
  • the cross-sectional height H of the antenna structure 10 in this embodiment is lower, which is beneficial to realize thinner configuration of the antenna structure 10 .
  • the second antenna unit 14b may have a symmetrical structure, or a partially symmetrical structure, or the same or similar structure or a different structure.
  • the second antenna unit 14b has a symmetrical structure.
  • the second antenna unit 14b is symmetrical about the symmetry plane of the second antenna unit 14b.
  • the symmetry plane of the second antenna unit 14b is perpendicular to the plane where the first metal layer 161 is located, and the diagonal line M2 of the first metal layer 161 is located on the symmetry plane of the second antenna unit 14b.
  • One end of the diagonal line M2 of the first metal layer 161 is located at the junction of the first side 1611 and the third side 1613 , and the other end is located at the junction of the second side 1612 and the fourth side 1614 .
  • the second antenna unit 14b and the first antenna unit 14a may have symmetrical structures, or partially symmetrical structures, or the same or similar structures or different structures.
  • the second antenna unit 14b and the first antenna unit 14a have a symmetrical structure.
  • the second antenna unit 14b is symmetrical to the first antenna unit 14a with respect to the first symmetry plane N1.
  • the first symmetry plane N1 is not an actual structure on the antenna structure 10 .
  • the first symmetrical plane N1 is a virtual plane.
  • FIG. 13 schematically represents the first plane of symmetry N1 by dashed lines.
  • FIG. 15 is an exploded view of the third antenna unit 14c and the fourth antenna unit 14d shown in FIG. 4 .
  • the third antenna unit 14c includes a first metal layer 171 , a second metal layer 172 , a first metal post 173 , a second metal post 174 , a third metal post 175 , a first metal connecting piece 176 a and a second metal connecting piece 176 b.
  • first metal layer 171, the second metal layer 172, the first metal post 173, the second metal post 174, the third metal post 175, the first metal connecting piece 176a and the second metal connecting piece 176b can be referred to
  • the third antenna unit 14c may not include the third metal post 175 , the first metal connection piece 176a and the second metal connection piece 176b.
  • FIG. 16 is a partial structural diagram of the antenna structure 10 shown in FIG. 3 .
  • FIG. 17 is a partial structural diagram of the antenna structure 10 shown in FIG. 3 .
  • FIG. 18 is a schematic structural diagram of the antenna structure 10 shown in FIG. 3 .
  • first metal layer 171 the second metal layer 172, the first metal post 173, the second metal post 174, the third metal post 175, the first metal connection piece 176a and the second metal connection piece 176b of the third antenna unit 14c
  • the way of arrangement can refer to the first metal layer 141, the second metal layer 142, the first metal post 143, the second metal post 144, the third metal post 145, the first metal connecting piece 146a and the first metal post 146a of the first antenna unit 14a.
  • the third antenna unit 14c is located on one side of the first antenna unit 14a.
  • the third antenna unit 14c is opposite to and spaced apart from the first antenna unit 14a.
  • the first antenna unit 14a is located between the second antenna unit 14b and the third antenna unit 14c.
  • the third side 1713 of the first metal layer 171 of the third antenna unit 14c and the third side 1413 of the first metal layer 141 of the first antenna unit 14a form a second gap 192 .
  • the second slit 192 communicates with the first slit 191 .
  • the second metal layer 172, the second metal post 174, the third metal post 175, the first metal connection piece 176a, the second metal connection piece 176b and the ground layer 12 of the third antenna unit 14c can surround The third space S3.
  • the third space S3 communicates with the first space S1 and the second space S2. It can be understood that the third space S3 can be used to arrange other components of the antenna structure 10.
  • the space ratio of the antenna structure 10 is relatively high.
  • the antenna structure 10 can be arranged compactly, which facilitates the miniaturized arrangement of the antenna structure 10 .
  • the second through hole 122 of the ground layer 12 communicates with the third space S3.
  • the first metal post 173 and the second metal post 174 of the third antenna unit 14c may be divided into two areas and arranged at intervals on the second metal layer 172 so that the current path is bent once.
  • the cross-sectional height of the antenna structure 10 in this embodiment is lower, which is beneficial to the thinning of the antenna structure 10 .
  • the third antenna unit 14c may have a symmetrical structure, or a partially symmetrical structure, or the same or similar structure or a different structure.
  • the third antenna unit 14c has a symmetrical structure.
  • the third antenna unit 14c is symmetrical about the symmetry plane of the third antenna unit 14c.
  • the symmetry plane of the third antenna unit 14c is perpendicular to the plane where the first metal layer 171 is located, and the diagonal line M3 of the first metal layer 171 is located on the symmetry plane of the third antenna unit 14c.
  • One end of the diagonal line M3 of the first metal layer 171 is located at the junction of the first side 1711 and the third side 1713 , and the other end is located at the junction of the second side 1712 and the fourth side 1714 .
  • the third antenna unit 14c and the first antenna unit 14a may have symmetrical structures, or partially symmetrical structures, or the same or similar structures or different structures.
  • the third antenna unit 14c and the first antenna unit 14a have a symmetrical structure.
  • the third antenna unit 14c is symmetrical to the first antenna unit 14a with respect to the second symmetry plane N2.
  • the second symmetry plane N2 is not an actual structure on the antenna structure 10 .
  • the second symmetry plane N2 is a virtual plane.
  • FIG. 18 schematically shows the second plane of symmetry N2 by dashed lines.
  • the fourth antenna unit 14d includes a first metal layer 181, a second metal layer 182, a first metal post 183, a second metal post 184, a third metal post 185, a first metal connecting piece 186a and a first metal post 186a.
  • the structural arrangement of the first metal layer 181, the second metal layer 182, the first metal post 183, the second metal post 184, the third metal post 185, the first metal connecting piece 186a and the second metal connecting piece 186b can also be Refer to the first metal layer 141, the second metal layer 142, the first metal post 143, the second metal post 144, the third metal post 145, the first metal connecting piece 146a and the second metal connecting piece 146b of the first antenna unit 14a structure settings. Specifically, details will not be repeated here.
  • the fourth antenna unit 14d is located on a side of the third antenna unit 14c close to the second antenna unit 14b.
  • the fourth antenna unit 14d is disposed opposite to the third antenna unit 14c at intervals, and is disposed opposite to the second antenna unit 14b at intervals. At this time, the fourth antenna unit 14d is located between the third antenna unit 14c and the second antenna unit 14b.
  • first side 1811 of the first metal layer 181 of the fourth antenna unit 14d and the first side 1711 of the first metal layer 171 of the third antenna unit 14c form a third gap 193 .
  • the third side 1813 of the first metal layer 181 of the fourth antenna unit 14d and the third side 1613 of the first metal layer 161 of the second antenna unit 14b form a fourth gap 194 .
  • the fourth slot 194 communicates with the first slot 191 , the second slot 192 and the third slot 193 .
  • the first slit 191 , the second slit 192 , the third slit 193 and the fourth slit 194 form a substantially “cross” shape.
  • the second metal layer 182, the second metal post 184, the third metal post 185, the first metal connection piece 186a, the second metal connection piece 186b and the ground layer 12 of the fourth antenna unit 14d enclose the first Four space S4.
  • the fourth space S4 communicates with the first space S1 , the second space S2 and the third space S3 , that is, the first space S1 , the second space S2 , the third space S3 and the fourth space S4 enclose a large space.
  • the fourth space S4 can be used to arrange other components of the antenna structure 10 .
  • the space ratio of the antenna structure 10 is relatively high.
  • the antenna structure 10 can be arranged compactly, which facilitates the miniaturized arrangement of the antenna structure 10 .
  • the first metal post 183 and the second metal post 184 of the fourth antenna unit 14d can be divided into two areas on the second metal layer 182 and arranged at intervals, so that the current path is bent once. In this way, compared with the antenna structure with the same current path and the current path of the antenna structure is linear, the cross-sectional height of the antenna structure 10 in this embodiment is lower, which is conducive to the thinning of the antenna structure 10.
  • the fourth antenna unit 14d may have a symmetrical structure, or a partially symmetrical structure, or the same or similar structure or a different structure.
  • the fourth antenna unit 14d has a symmetrical structure.
  • the fourth antenna unit 14d is symmetrical about the symmetry plane of the fourth antenna unit 14d.
  • the symmetry plane of the fourth antenna unit 14d is perpendicular to the plane where the first metal layer 181 is located, and the diagonal line M4 of the first metal layer 181 is located on the symmetry plane of the fourth antenna unit 14d.
  • One end of the diagonal line M4 of the first metal layer 181 is located at the junction of the first side 1811 and the third side 1813 , and the other end is located at the junction of the second side 1812 and the fourth side 1814 .
  • the fourth antenna unit 14d and the third antenna unit 14c may have symmetrical structures, or partially symmetrical structures, or the same or similar structures or different structures.
  • the fourth antenna unit 14d and the third antenna unit 14c have symmetrical structures.
  • the fourth antenna unit 14d is also symmetrical to the third antenna unit 14c with respect to the first symmetry plane N1.
  • the fourth antenna unit 14d and the second antenna unit 14b may have symmetrical structures, or partially symmetrical structures, or the same or similar structures or different structures.
  • the fourth antenna unit 14d and the second antenna unit 14b have symmetrical structures.
  • the fourth antenna unit 14d is symmetrical to the second antenna unit 14b with respect to the second symmetry plane N2.
  • the first antenna unit 14a, the second antenna unit 14b, the third antenna unit 14c and the fourth antenna unit 14d may have a centrally symmetrical structure, or a partially centrally symmetrical structure, or the same or similar structures or different structures.
  • the first antenna unit 14a, the second antenna unit 14b, the third antenna unit 14c and the fourth antenna unit 14d are symmetrical about the center point.
  • the central point is located at the junction of the first symmetrical plane N1 and the second symmetrical plane N2.
  • the central point is the central position of the first antenna unit 14a, the second antenna unit 14b, the third antenna unit 14c and the fourth antenna unit 14d.
  • the plane of symmetry of the first antenna unit 14a, the plane of symmetry of the second antenna unit 14b, the plane of symmetry of the third antenna unit 14c and the plane of symmetry of the fourth antenna unit 14d all pass through the center point.
  • the second metal post 144 of the first antenna unit 14a is located on the side of the first metal post 143 of the first antenna unit 14a away from the central point.
  • the second metal post 164 of the second antenna unit 14b is located on a side of the first metal post 163 of the second antenna unit 14b away from the central point. As shown in FIG.
  • the second metal post 174 of the third antenna unit 14c is located on the side of the first metal post 163 of the third antenna unit 14c away from the central point.
  • the second metal post 184 of the fourth antenna unit 14d is located on the side of the first metal post 183 of the fourth antenna unit 14d away from the central point.
  • the antenna structure 10 encloses the first space S1 , the second space S2 , the third space S3 and the fourth space S4 by compactly arranging the structures of the various parts of the antenna unit 14 .
  • the first space S1 , the second space S2 , the third space S3 and the fourth space S4 can be used to arrange other components of the antenna structure 10 .
  • the space ratio of the antenna structure 10 is relatively high.
  • the structure of the antenna structure 10 is relatively compact, which facilitates the miniaturization of the antenna structure 10 .
  • the current path where the antenna structure 10 is set is bent once.
  • the cross-sectional height H of the antenna structure 10 of this embodiment is not only lower, but the first slot 191 of the antenna structure 10, the second The widths of the second slit 192 , the third slit 193 and the fourth slit 194 are also relatively low.
  • the widths of the first slit 191 , the second slit 192 , the third slit 193 and the fourth slit 194 can all be in the range of 0.03 ⁇ 0 to 0.1 ⁇ 0. In this way, the miniaturization of the antenna structure 10 is easier to realize.
  • the first antenna unit 14a, the second antenna unit 14b, the third antenna unit 14c and the fourth antenna unit 14d of the antenna structure 10 have been specifically introduced above in conjunction with the relevant drawings.
  • the first antenna unit 14a and the fourth antenna unit 14d may form an electric dipole.
  • the second antenna element 14b and the third antenna element 14c may form a further electric dipole.
  • the first slot 191 and the third slot 193 may form a magnetic dipole.
  • the second slot 192 and the fourth slot 194 may constitute another magnetic dipole.
  • the feeding unit 13 of the antenna structure 10 will be described in detail below in conjunction with related drawings.
  • FIG. 19 is a schematic structural diagram of the feeding unit shown in FIG. 4 .
  • the feed unit 13 includes a first feed stub 131 , a second feed stub 132 , a first metal hole 133 and a second metal hole 134 .
  • the structure of the first metal hole 133 may be that a layer of metal material is formed on the hole wall of the via hole. At this time, the first metal hole 133 is roughly in a "pipe" structure.
  • the structure of the first metal hole 133 may also be filled with metal material in the via hole. At this time, the first metal hole 133 may have a "pillar" structure.
  • the first metal hole 133 may also have other structures.
  • the structure of the second metal hole 134 can refer to the structure of the first metal hole 133 in this embodiment. The details will not be described in detail below.
  • the first feeding stub 131 includes a first part 1311 , a second part 1312 a , a third part 1312 b , a fourth part 1312 c and a fifth part 1313 which are sequentially connected.
  • the first part 1311 and the fifth part 1313 are arranged on the same layer.
  • the second portion 1312a, the third portion 1312b and the fourth portion 1312c are generally "U-shaped".
  • the second part 1312a and the fourth part 1312c may adopt a metal hole structure. At this time, both ends of the third part 1312b are respectively connected to the first part 1311 and the fifth part 1313 through a metal hole structure.
  • the fifth part 1313 may be in a "T-shape".
  • the antenna can be changed by changing the shape or size of the first part 1311, the second part 1312a, the third part 1312b, the fourth part 1312c, and the fifth part 1313 of the first feeding branch 131.
  • the first metal hole 133 includes a first hole portion 1331 and a second hole portion 1332 .
  • the second hole portion 1332 is connected to the first hole portion 1331 .
  • the diameter of the first hole portion 1331 is larger than the diameter of the second hole portion 1332 .
  • the second hole portion 1332 is connected to the first portion 1311 of the first feeding stub 131 .
  • the second feed branch 132 is generally in the shape of a "bar".
  • the second feeding stub 132 includes a first part 1321 , a second part 1322 and a third part 1323 connected in sequence.
  • the first part 1321 , the second part 1322 and the third part 1323 are arranged on the same layer.
  • the width of the first portion 1321 is greater than the width of the second portion 1322 .
  • the width of the third portion 1323 is greater than the widths of the first portion 1321 and the second portion 1322 .
  • the second part 1322 and the third part 1323 are roughly "T-shaped".
  • the resonant frequency of the antenna structure 10 can be changed by changing the shape or size of the first part 1321 , the second part 1322 and the third part 1323 of the second feeding branch 132 .
  • the second metal hole 134 includes a third hole portion 1341 and a fourth hole portion 1342 .
  • the third hole portion 1341 is connected to the fourth hole portion 1342 .
  • the diameter of the third hole portion 1341 is larger than the diameter of the fourth hole portion 1342 .
  • the fourth hole portion 1342 is connected to the first portion 1321 of the second feeding branch 132 .
  • the structure of the second metal hole 134 is the same as that of the first metal hole 133 .
  • the structure of the first feeding branch 131 may also adopt the structure of the second feeding branch 132 , that is, the first feeding branch 131 adopts a “strip” shape.
  • the first feeder branch 131 and the second feeder branch 132 in different layers, that is, the distance between the first feeder branch 131 and the ground layer 12 is larger or smaller than the distance between the second feeder branch 132 and the ground layer. The distance between the layers 12 can avoid short-circuiting between the first feeding branch 131 and the second feeding branch 132 .
  • FIG. 20 is a partial structural diagram of the antenna structure 10 shown in FIG. 3 .
  • FIG. 21 is a schematic cross-sectional view of the antenna structure 10 shown in FIG. 20 along line B-B.
  • the first hole portion 1331 of the first metal hole 133 is disposed opposite to the first through hole 121 of the ground layer 12 .
  • the first hole portion 1331 of the first metal hole 133 is electrically connected to the radio frequency circuit 20 through the first through hole 121 (refer to FIG. 3 ).
  • the first hole portion 1331 may be electrically connected to the radio frequency circuit 20 through a conductive structure such as a microstrip line, a coaxial line, a strip line or a probe.
  • the first hole portion 1331 is also spaced apart from the ground layer 12 to avoid a short circuit with the ground layer 12 .
  • the distance between the first part 1311 of the first feeding stub 131 and the ground layer 12 is the same as the distance between the first feeding stub 131 and the ground layer 12 .
  • the distance between the fifth portion 1313 of 131 and the ground layer 12 is equal.
  • a part of the first portion 1311 of the first feeding stub 131 is located on the side of the second metal layer 142 of the first antenna unit 14a facing the ground layer 12, that is, in the first space S1 of the first antenna unit 14a.
  • a part of the fifth portion 1313 of the first feeding stub 131 is located on the side of the second metal layer 182 of the fourth antenna unit 14d facing the ground layer 12, that is, in the fourth space S4 of the fourth antenna unit 14d.
  • the extending direction of the first feeding branch 131 is parallel to the diagonal line M1 of the first metal layer 141 of the first antenna unit 14a, that is, the extending direction of the first feeding branch 131 is parallel to the first
  • the included angle between the first sides 1411 of the metal layer 141 may be 45°.
  • the extending direction of the first feeding branch 131 is also parallel to the diagonal M4 of the first metal layer 181 of the fourth antenna unit 14d, that is, the extending direction of the first feeding branch 131 is also parallel to the diagonal line M4 of the fourth antenna unit 14d.
  • the included angle between the first sides 1811 of the first metal layer 181 may be 45°.
  • the radio frequency circuit 20 when the radio frequency circuit 20 transmits a radio frequency signal, the radio frequency signal can pass through the first metal hole 133, the first part 1311 of the first feeding stub 131, the second part 1312a, the third part 1312b, the fourth part 1312c and The fifth part 1313 couples and feeds to the second metal layer 182 and the first metal layer 181 of the fourth antenna unit 14d.
  • the ground layer 12, the third metal pillar 185, the first metal connecting sheet 186a, the second metal pillar 184, the second region 182b of the second metal layer 182, the first region 182a of the second metal layer 182, the first The current path formed by the metal pillar 183 and the first metal layer 181 has current transmission.
  • the radio frequency signal can also be coupled and fed to the second metal layer 142 and the first metal layer 141 of the first antenna unit 14 a through the first metal hole 133 and the first part 1311 of the first feeding stub 131 .
  • the ground layer 12 the third metal pillar 145, the first metal connecting piece 146a, the second metal pillar 144, the second region 142b of the second metal layer 142, the first region 142a of the second metal layer 142, the first The current path formed by the metal pillar 143 and the first metal layer 141 has current transmission.
  • FIG. 22 is a partial structural schematic diagram of the antenna structure 10 shown in FIG. 3 .
  • FIG. 23 is a schematic cross-sectional view of the antenna structure 10 shown in FIG. 22 along line C-C.
  • the third hole portion 1341 of the second metal hole 134 is disposed opposite to the second through hole 122 of the ground layer 12 .
  • the third hole portion 1341 of the second metal hole 134 is electrically connected to the radio frequency circuit 20 through the second through hole 122 (refer to FIG. 3 ).
  • the third hole portion 1341 may be electrically connected to the radio frequency circuit 20 through a conductive structure such as a microstrip line, a coaxial line, a strip line or a probe.
  • the third hole portion 1341 is also spaced apart from the ground layer 12 to avoid a short circuit with the ground layer 12 .
  • the second feeding branch 132 , the first part 1311 of the first feeding branch 131 and the fifth part 1313 of the first feeding branch 131 are arranged on the same layer, and the connection between the second feeding branch 132 and the ground layer 12
  • the distance between , the distance between the first part 1311 of the first feeding branch 131 and the ground layer 12 , and the distance between the fifth part 1313 of the first feeding branch 131 and the ground layer 12 are all equal.
  • a part of the first part 1321 of the second feeding stub 132 is located on the side of the second metal layer 172 of the third antenna unit 14c facing the ground layer 12, that is, in the third space S3 of the third antenna unit 14c.
  • Part of the third portion 1323 of the second feeding stub 132 is located on the side of the second metal layer 162 of the second antenna unit 14b facing the ground layer 12 , that is, in the second space S2 of the second antenna unit 14b.
  • the extending direction of the second feeding branch 132 is parallel to the diagonal M3 of the first metal layer 141 of the third antenna unit 14c, that is, the extending direction of the second feeding branch 132 is parallel to the first metal layer of the second antenna unit 14b.
  • the included angle between the first sides 1711 of 171 may be 45°.
  • the extending direction of the second feeding branch 132 is also parallel to the diagonal M2 of the first metal layer 161 of the second antenna unit 14b, that is, the extending direction of the second feeding branch 132 is also parallel to the first
  • the included angle between the first sides 1611 of the metal layer 161 may be 45°.
  • the radio frequency circuit 20 transmits a radio frequency signal
  • the radio frequency signal can be coupled and fed to the second The second metal layer 162 and the first metal layer 161 of the antenna unit 14b.
  • the ground layer 12 the third metal pillar 165, the first metal connecting sheet 166a, the second metal pillar 164, the second region 162b of the second metal layer 162, the first region 162a of the second metal layer 162, the first The current path formed by the metal post 163 and the first metal layer 161 has current transmission.
  • the radio frequency signal can also be coupled and fed to the second metal layer 172 and the first metal layer 171 of the third antenna unit 14c through the second metal hole 134 and the first part 1321 of the second feeding stub 132 .
  • the first portion 1311 of the first feeding stub 131 may be directly connected to the second metal layer 142 of the first antenna unit 14a.
  • the fifth portion 1313 of the first feeding stub 131 can be directly connected to the second metal layer 182 of the fourth antenna unit 14d.
  • the radio frequency signal can pass through the first metal hole 133, the first part 1311, the second part 1312a, the third part 1312b, the fourth part 1312c and the fifth part of the first feeding stub 131.
  • 1313 directly feeds power to the second metal layer 182 and the first metal layer 181 of the fourth antenna unit 14d.
  • the radio frequency signal can also be directly fed to the second metal layer 142 and the first metal layer 141 of the first antenna unit 14 a through the first metal hole 133 and the first part 1311 of the first feeding stub 131 .
  • the first portion 1321 of the second feeding stub 132 may be directly connected to the second metal layer 172 of the third antenna unit 14c.
  • the third portion 1323 of the second feeding stub 132 is directly connected to the second metal layer 162 of the second antenna unit 14b.
  • the radio frequency signal can be directly fed to the second antenna unit 14b through the second metal hole 134, the first part 1321, the second part 1322 and the third part 1323 of the second feeding branch 132
  • the radio frequency signal can also be directly fed to the second metal layer 172 and the first metal layer 171 of the third antenna unit 14c through the second metal hole 134 and the first part 1321 of the second feeding stub 132 .
  • the feed unit 13 has been specifically introduced above in conjunction with the relevant drawings.
  • the specific structure of the matched via group 15 will be described in detail below in conjunction with the relevant drawings.
  • FIG. 24 is a partial structural diagram of the antenna structure 10 shown in FIG. 3 .
  • a plurality of matching via groups 15 are electrically connected to the ground layer 12 .
  • a plurality of matching via groups 15 are located around the first antenna unit 14a, the second antenna unit 14b, the third antenna unit 14c and the fourth antenna unit 14d.
  • the multiple matching via groups 15 are located at the periphery of the ground layer 12 , that is, the multiple matching via groups 15 are arranged near the edge of the ground layer 12 .
  • a plurality of matching via groups 15 are arranged around the first antenna unit 14a, the second antenna unit 14b, the third antenna unit 14c and the fourth antenna unit 14d.
  • the number of matched via groups 15 is four.
  • the four matching via groups 15 are respectively located at the four corners of the ground layer 12 .
  • a group of matching via groups 15 is taken as an example for specific description.
  • the matching via group 15 includes a first matching via 151 , a second matching via 152 and a metal connecting piece 153 .
  • the structural configuration of the first matching via 151 and the second matching via 152 can refer to the structural configuration of the third metal post 145 (see FIG. 5 ) of the first antenna unit 14a. The details will not be repeated here.
  • the number of the first matching vias 151 is three.
  • the number of the second matching vias 152 is seven.
  • the number of metal connecting pieces 153 is seven.
  • a plurality of first matching vias 151 are arranged at intervals, and one end of each first matching via 151 is connected to the ground layer 12 .
  • a plurality of first matching vias 151 are arranged in an "L-shape".
  • a plurality of metal connecting pieces 153 are located on a side of the first matching via hole 151 away from the ground layer 12 , and are arranged at intervals in sequence. One of the metal connecting pieces 153 is connected to the plurality of first matching vias 151 . At this time, the first matching via hole 151 is located between the metal connection piece 153 and the ground layer 12.
  • each metal connection piece 153 is "L-shaped".
  • a plurality of second metal pillars 144 are arranged at intervals.
  • a plurality of second matching vias 152 are also arranged in an "L-shape". Each second matching via 152 is connected to each metal connecting piece 153 .
  • the matching via group 15 can increase the current path between the antenna unit 14 and the ground layer 12 .
  • the matching via group 15 can be used to tune the impedance of the antenna structure 10 to achieve impedance matching.
  • the matching via group 15 can increase the current path between the antenna unit 14 and the ground layer 12 , the size of the antenna unit 14 and the ground layer 12 in this embodiment can be reduced, thereby realizing the miniaturization of the antenna structure 10 .
  • the matching via group 15 may not include the second matching via 152 and the metal connecting piece 153 , that is, the matching via group 15 only includes the first matching via 151 .
  • FIG. 25 a is a data diagram of the variation of reflection coefficient with frequency of the antenna structure 10 according to the embodiment of the present application.
  • the solid line in FIG. 25a represents the S11 curve, and the S11 curve is used to reflect the input return loss.
  • the dotted line represents the S21 curve, and the S21 curve is used to reflect the isolation between two ports.
  • the abscissa is frequency in GHz, and the ordinate is in dB.
  • the frequency range that the antenna structure 10 can cover is 24.25GHz to 43.5GHz.
  • the return loss is above 10dB, and the isolation is above 15dB, meeting the performance requirements of the antenna.
  • the antenna structure 10 can work in the working frequency range of 24.25GHz-29.5GHz and 37GHz-43.5GHz.
  • the antenna structure 10 can support frequency bands n257, n258, n259, n260 and n261.
  • the antenna structure 10 has two resonance frequencies (also referred to as center frequencies).
  • the two resonant frequencies are 24GHz and 33GHz, respectively.
  • the antenna structure 10 is a broadband antenna.
  • FIG. 25b is a schematic diagram of polarization of the antenna structure 10 according to the embodiment of the present application.
  • the arrow direction in Fig. 25b refers to the current direction.
  • the shade of the arrow color refers to the magnitude of the current intensity. The darker the arrow, the greater the current intensity. The lighter the arrow color, the smaller the current intensity.
  • the first polarization of the antenna structure 10 is the ⁇ 45° polarization of the antenna structure 10 .
  • Most of the current in the antenna structure 10 is mainly in the first antenna unit 14a and the fourth antenna unit 14d, and a small part is in the second antenna unit 14b and the third antenna unit 14c.
  • the current on the first antenna unit 14a flows along the diagonal line M1 in a direction close to the fourth antenna unit 14d.
  • the current on the fourth antenna unit 14d flows along the diagonal line M4 and in a direction away from the first antenna unit 14a.
  • FIG. 25c is another polarization schematic diagram of the antenna structure 10 according to the embodiment of the present application.
  • the direction of the arrow in Fig. 25c refers to the current direction.
  • the shade of the arrow color represents the magnitude of the current intensity. The darker the arrow, the greater the current intensity. The lighter the arrow color, the smaller the current intensity.
  • the second polarization of the antenna structure 10 is the +45° polarization of the antenna structure 10 .
  • Most of the current in the antenna structure 10 is mainly in the second antenna unit 14b and the third antenna unit 14c, and a small part is in the first antenna unit 14a and the fourth antenna unit 14d.
  • the current on the second antenna unit 14b flows along the diagonal line M2 and away from the third antenna unit 14c.
  • the current on the third antenna unit 14c flows along the diagonal M3 and in a direction close to the second antenna unit 14b.
  • the antenna structure 10 of this embodiment has two polarization modes, that is, the antenna structure 10 has dual polarization characteristics.
  • FIG. 25d is a partial cross-sectional schematic view of the packaging substrate structure 90 of this embodiment.
  • the packaging substrate structure 90 may adopt a multi-layer symmetrical substrate arrangement.
  • the packaging substrate structure 90 includes an antenna layer 91 and a prepreg (PP) dielectric layer 92 that are stacked.
  • the antenna layer 91 is used to set the antenna structure 10 shown in FIGS. 4 to 24 .
  • FIG. 25d schematically shows the three-layer wiring in the PP dielectric layer 92 through thick lines.
  • the number of wiring layers in the PP dielectric layer 92 is not specifically limited. Wherein, the traces of each layer may be electrically connected through metal holes or metal pillars.
  • the traces of the PP dielectric layer 92 can be used to provide the antenna layer 91 with traces for radio frequency signals, ground traces, and power traces.
  • the PP dielectric layer 92 can also be used to provide signal traces, ground wires, power traces, etc. to other chips or devices.
  • the PP dielectric layer 92 can also be used to raise the antenna layer 91 .
  • the antenna structure 10 radiates or receives electromagnetic waves to the outside of the electronic device 1 through the insulating part of the back cover 202 .
  • the PP dielectric layer 92 can make the antenna structure 10 closer to the rear cover 202 .
  • the antenna layer 91 further includes a core board (also referred to as a core dielectric layer) 911 and a metal layer 912 that are stacked.
  • the core dielectric layer 911 is stacked on the PP dielectric layer 92 .
  • the core dielectric layer 911 can be connected to the PP dielectric layer 92 by means of pressing or the like.
  • Metal layer 912 includes a dielectric portion and a metal portion. The dielectric part can fully wrap or half wrap the metal part.
  • Figure 25d schematically shows the metal part of the three layers in the metal layer 912 by bold lines.
  • the number of layers of metal parts in the metal layer 912 is not specifically limited.
  • Metal holes or metal pillars can be arranged in the dielectric part to electrically connect the metal parts of each layer.
  • the PP dielectric layer 92 may be distributed symmetrically with respect to the core dielectric layer 911 .
  • the antenna structure 10 shown in FIGS. 4 to 24 is disposed on the antenna layer 91 .
  • the first metal layer, the second metal layer, the first metal post, the second metal post, the first metal connection piece and the second metal connection piece of each antenna unit 14 of the antenna structure 10 can be arranged on the metal layer 912 .
  • the third metal posts and the ground layer 12 of each antenna unit 14 of the antenna structure 10 can be disposed on the core dielectric layer 911 .
  • first feed branch 131 of the feed unit 13, the second feed branch 132, the second hole portion 1332 of the first metal hole 133 of the feed unit 13, and the second hole portion 1332 of the second metal hole 134 of the feed unit 13 The four hole portions 1342 may be disposed on the metal layer 912 . Both the first hole portion 1331 of the first metal hole 133 of the feed unit 13 and the third hole portion 1341 of the second metal hole 134 of the feed unit 13 can be disposed on the core dielectric layer 911 . The first hole portion 1331 of the first metal hole 133 of the feed unit 13 and the third hole portion 1341 of the second metal hole 134 of the feed unit 13 can pass through the signal traces, ground wires, and power lines of the PP dielectric layer 92. Connected to the radio frequency transceiver chip 21.
  • both the first matching vias 151 of the matching via group 15 and the metal connecting piece 153 may be disposed on the metal layer 912 .
  • the second matching vias 152 of the matching via group 15 may be disposed on the core dielectric layer 911 .
  • FIG. 26 schematically distinguishes the third region 1463a and the fourth region 1463b by dotted lines. Wherein, part of the third area 1463a is located at the first connecting portion 1461 of the first metal connecting piece 146a, and part of the third area 1463a is located at the second connecting portion 1462 of the first metal connecting piece 146a.
  • Part of the fourth area 1463b is located at the first connection portion 1461 of the first metal connection piece 146a, and part of the fourth area 1463b is located at the second connection portion 1462 of the first metal connection piece 146a.
  • the shapes of the third area 1463a and the fourth area 1463b can both be "L-shaped". In other embodiments, the shapes of the third region 1463a and the fourth region 1463b are not specifically limited.
  • the first metal connecting piece 146a in this embodiment is longer.
  • FIG. 27 is a partial structural diagram of another implementation manner of the antenna structure 10 provided by the embodiment of the present application.
  • the second metal post 144 is connected to the third region 1463a of the first metal connection piece 146a.
  • One end of the third metal pillar 145 is connected to the fourth region 1463b of the first metal connecting piece 146a.
  • the second metal post 144 and the third metal post 145 are divided into two regions on the first metal connecting sheet 146a and arranged at intervals, that is, the projection of the second metal post 144 on the first metal connecting sheet 146a and the projection of the third metal post 145 It is offset from the projection of the first metal connecting piece 146a (that is, there is no overlapping part).
  • FIG. 28 is a partial cross-sectional schematic diagram of another implementation manner of the antenna structure 10 provided by the embodiment of the present application.
  • the current path (simplified by thick lines in FIG. 28 ) includes the ground layer 12, the third metal post 145, the fourth region 1463b of the first metal connecting piece 146a, the first metal connecting piece The third region 1463 a of 146 a, the second metal pillar 144 , the second metal layer 142 , the first metal pillar 143 and the first metal layer 141 .
  • the current can be transmitted between the fourth region 1463b of the first metal connection piece 146a and the third region 1463a of the first metal connection piece 146a, and between the two regions on the second metal layer 142, the current The path is set with two bends.
  • the section height H of the antenna structure 10 in this embodiment can be made lower. In this way, the thinning of the antenna structure 10 is easier to realize.
  • the antenna of this embodiment may be in the range of 0.1 ⁇ 0 to 0.15 ⁇ 0.
  • FIG. 29 is a schematic structural diagram of another implementation manner of the antenna structure 10 provided by the embodiment of the present application.
  • the arrangement manner of the second antenna unit 14b, the third antenna unit 14c and the fourth antenna unit 14d please refer to the arrangement manner of the first antenna unit 14a. The details will not be repeated here.
  • the current paths of the first antenna unit 14 a , the second antenna unit 14 b , the third antenna unit 14 c and the fourth antenna unit 14 d in this embodiment can all be bent twice.
  • the widths of the first slot 191 , the second slot 192 , the third slot 193 and the fourth slot 194 can be made smaller.
  • the widths of the first slit 191 , the second slit 192 , the third slit 193 and the fourth slit 194 can all be in the range of 0.03 ⁇ 0 to 0.1 ⁇ 0. In this way, the miniaturization of the antenna structure 10 is easier to realize.
  • the first antenna unit 14a may further include a third metal connecting piece, a fourth metal connecting piece, a fifth metal connecting piece, . . . , an mth metal connecting piece, where m is an integer and greater than 2.
  • a third metal connecting piece a fourth metal connecting piece, a fifth metal connecting piece, . . . , an mth metal connecting piece, where m is an integer and greater than 2.
  • the first antenna unit 14a may further include a fourth metal post, a fifth metal post, . . . , an nth metal post, where n is an integer greater than three.
  • the current path of the first antenna unit 14a is bent multiple times, thereby further reducing the cross-sectional height H of the antenna structure 10 and the first gap 191, The width of the second slit 192 , the third slit 193 and the fourth slit 194 .
  • the antenna structure 10 further includes a plurality of metal shorting hole groups 19 .
  • a plurality of metal shorting hole groups 19 are electrically connected to the ground layer 12 .
  • a plurality of metal shorting hole groups 19 are located around the first antenna unit 14a, the second antenna unit 14b, the third antenna unit 14c and the fourth antenna unit 14d.
  • the number of metal shorting hole groups 19 is four groups.
  • a set of metal shorting holes 19 is located on the same side of the first antenna unit 14 a and the second antenna unit 14 b, and is arranged along the extending direction of the first slot 191 .
  • a set of metal short-connecting holes 19 is opposite to the first slit 191 .
  • a set of metal shorting holes 19 is located on the same side of the first antenna unit 14 a and the third antenna unit 14 c, and is arranged along the extending direction of the second slot 192 .
  • a group of metal short-connecting holes 19 is opposite to the second gap 192 .
  • a set of metal shorting holes 19 is located on the same side of the third antenna unit 14 c and the fourth antenna unit 14 d, and is arranged along the extending direction of the third slot 193 .
  • a group of metal short-connecting holes 19 is opposite to the third gap 193 .
  • a set of metal shorting holes 19 is located on the same side of the fourth antenna unit 14d and the second antenna unit 14b. , and arranged in the extending direction of the fourth slit 194 .
  • a set of metal shorting holes 19 is opposite to the fourth slit 194 .
  • This embodiment is specifically described by taking the metal shorting hole group 19 located on the same side of the fourth antenna unit 14d and the second antenna unit 14b as an example.
  • the metal shorting hole set 19 includes a first shorting hole 197 , a second shorting hole 198 , a first metal piece 199 a and a second metal piece 199 b.
  • the structural arrangement of the first shorting hole 191 and the second shorting hole 198 can refer to the structural arrangement of the third metal post 145 (see FIG. 5 ) of the first antenna unit 14a. The details will not be repeated here.
  • the number of the first shorting hole 191 is one.
  • one end of the first shorting hole 197 is connected to the ground layer 12 , and the other end is connected to the first metal sheet 199 a. At this time, the first shorting hole 197 is located between the ground layer 12 and the first metal sheet 199a.
  • One end of the second shorting hole 198 is connected to the first metal piece 199a, and the other end is connected to the second metal piece 199b. At this time, the second shorting hole 198 is located between the first metal piece 199a and the second metal piece 199b.
  • the first shorting hole 197 and the second shorting hole 198 may be divided into two regions on the first metal sheet 199 a and arranged at intervals. Specifically, reference may be made to the manner in which the second metal post 144 and the third metal post 145 are divided into two regions on the first metal connecting piece 146 a and arranged at intervals in this embodiment.
  • FIG. 30 a is a data diagram of the reflection coefficient of the antenna structure 10 according to the embodiment of the present application as a function of frequency.
  • the solid line in FIG. 30a represents the S11 curve, and the S11 curve is used to represent the input return loss.
  • the dotted line represents the S21 curve, and the S21 curve is used to reflect the isolation between two ports.
  • the abscissa is frequency in GHz, and the ordinate is in dB.
  • the frequency range that the antenna structure 10 can cover is 24.25 GHz to 43.5 GHz.
  • the return loss is above 10dB, and the isolation is above 15dB, meeting the performance requirements of the antenna.
  • the antenna structure 10 can work in the working frequency range of 24.25GHz-29.5GHz and 37GHz-43.5GHz.
  • the antenna structure 10 can support frequency bands n257, n258, n259, n260 and n261.
  • the antenna structure 10 has four resonant frequencies, namely 24 GHz, 32 GHz, 37 GHz and 44 GHz. It can be understood that, on the one hand, in the n257, n258, n259, n260 and n261 frequency ranges, the antenna structure 10 adds a resonance point (the resonance frequency is 44 GHz). On the other hand, in the frequency ranges of n257, n258, n259, n260 and n261, the antenna structure 10 adds a notch point (the frequency is approximately 35 GHz). At this time, the resonant frequency (33 GHz) of the first embodiment can be split into two resonant frequencies (32 GHz, 37 GHz).
  • FIG. 30b is a schematic diagram of the current of the antenna structure 10 in the n259 frequency band according to the embodiment of the present application.
  • the directions of the small arrows in FIG. 30 b refer to the current directions at various positions of the antenna structure 10 .
  • the depth of the color of the small arrow refers to the magnitude of the current intensity. The darker the small arrow, the greater the current intensity. The lighter the color of the small arrow, the smaller the current intensity.
  • the direction of the large arrow in FIG. 30 b refers to the overall current direction on one side of the antenna unit 14 . According to FIG. 30b, it can be seen that the current generated around the antenna structure 10 is generated by the antenna structure 10 at 44 GHz.
  • the current directions on the same side of the antenna structure 10 are basically the same.
  • the current direction on the left side of the antenna structure 10 is generally upward, that is, the current direction on the left side of the first antenna unit 14 a and the current direction on the left side of the third antenna unit 14 c are both upward.
  • Figure 30b is indicated by the large solid arrows.
  • FIG. 30c is a schematic diagram of the electric field of the antenna structure 10 in the n259 frequency band according to the embodiment of the present application.
  • the direction of the arrow in Fig. 30c refers to the direction of the electric field.
  • the shade of the arrow color refers to the magnitude of the electric field strength. The darker the arrow, the greater the electric field strength. The lighter the arrow color, the smaller the electric field strength.
  • FIG. 30c it can be seen that the electric field generated around the antenna structure 10 is generated by the antenna structure 10 at 44 GHz.
  • the direction of the electric field on the same side of the antenna structure 10 is distributed in an "anti-inverse" manner.
  • the electric field distribution on the left side of the antenna structure 10 includes a first region M1 , a second region M2 and a third region M3 .
  • the electric field direction of the first region M1 is upward.
  • the electric field direction of the second region M2 is downward.
  • the electric field direction of the third region M3 is upward. If the electric field direction of the first region M1 is upward, it is positive.
  • the electric field direction of the second region M2 is negative downward. It can be understood that the electric field distribution in the second region M2 is relatively small, so the antenna structure 10 can work normally in the high-order mode (ie, the resonant frequency is 44 GHz).
  • the antenna structure 10 is at the resonance position of 44 GHz. Since the antenna structure 10 is provided with a metal short-circuit hole group 19, the antenna structure 10 introduces a high-order field pattern, and the current is basically in the same direction. The antenna structure 10 adds a new resonance point (44GHz).
  • FIG. 30d is a schematic diagram of the current of the antenna structure 10 in the n260 frequency band according to the embodiment of the present application.
  • the directions of the small arrows in FIG. 30 d refer to the current directions at various positions of the antenna structure 10 .
  • the depth of the color of the small arrow refers to the magnitude of the current intensity. The darker the small arrow, the greater the current intensity. The lighter the color of the small arrow, the smaller the current intensity.
  • the direction of the large arrow in FIG. 30d refers to the overall current direction on one side of the antenna unit 14 . According to FIG. 30d , it can be known that the current generated around the antenna structure 10 is generated by the antenna structure 10 at 35 GHz.
  • the current directions on the same side of the antenna structure 10 are basically opposite.
  • the direction of the current on the left side of the antenna structure 10 is opposite, that is, the direction of the current on the left side of the first antenna unit 14a is downward (shown by the big arrow in dotted line in FIG. 30d ), and the direction of the current on the left side of the third antenna unit 14c is upward. (Fig. 30b indicated by the large solid arrow).
  • FIG. 30e is a schematic diagram of the electric field of the antenna structure 10 in the n260 frequency band according to the embodiment of the present application.
  • the direction of the arrow in Fig. 30e refers to the direction of the electric field.
  • the shade of the arrow color refers to the magnitude of the electric field strength. The darker the arrow, the greater the electric field strength. The lighter the arrow color, the smaller the electric field strength.
  • the direction of the electric field on the same side of the antenna structure 10 is "inversely" distributed.
  • the electric field distribution on the left side of the antenna structure 10 includes a first region M1 and a second region M2.
  • the electric field direction of the first region M1 is downward.
  • the electric field direction of the second region M2 is upward.
  • the direction of the electric field in the first region M1 is negative.
  • the direction of the electric field in the second region M2 is positive when it is upward. At this time, the direction of the electric field is "inversely" distributed.
  • the antenna structure 10 is a high order cancellation mode.
  • FIG. 31 is a schematic structural diagram of yet another implementation manner of the antenna structure 10 provided by the embodiment of the present application.
  • the current paths of the first antenna unit 14 a , the second antenna unit 14 b , the third antenna unit 14 c and the fourth antenna unit 14 d in this embodiment are all set by one-time bending.
  • the arrangement of the first antenna unit 14a, the second antenna unit 14b, the third antenna unit 14c and the fourth antenna unit 14d can refer to the first antenna unit 14a and the second antenna unit 14b described in FIGS. 4 to 24 1.
  • the arrangement of the third antenna unit 14c and the fourth antenna unit 14d I won't go into details here.
  • the antenna structure 10 of this embodiment further includes a plurality of metal shorting hole groups 19 .
  • the arrangement of the metal short-connection hole group 19 can refer to the metal short-connection hole group 19 described in FIG. 29 . I won't go into details here.
  • FIG. 32 a is a data diagram of the reflection coefficient of the antenna structure 10 according to the embodiment of the present application as a function of frequency.
  • the solid line in FIG. 32a represents the S11 curve, and the S11 curve is used to reflect the input return loss.
  • the dotted line represents the S21 curve, and the S21 curve is used to reflect the isolation between two ports.
  • the abscissa is frequency in GHz, and the ordinate is in dB.
  • the frequency range that the antenna structure 10 can cover is 24.25 GHz to 43.5 GHz.
  • the return loss is above 10dB
  • the isolation is above 15dB, meeting the performance requirements of the antenna.
  • the antenna structure 10 can work in the working frequency range of 24.25GHz-29.5GHz and 37GHz-43.5GHz.
  • the antenna structure 10 can support frequency bands n257, n258, n259, n260 and n261.
  • FIG. 32b is a schematic cross-sectional view of the chip 1 provided by the embodiment of the present application.
  • the chip 1 of this embodiment may be a chip based on an AiP (AiP, Antenna-in-Package) solution.
  • the chip 1 includes an antenna structure 10 , a chip body 40 , a package substrate 51 and an injection molded part 52 . Both the antenna structure 10 and the chip body 40 are disposed on the package substrate 51 and electrically connected to the package substrate 51 .
  • the injection molding part 52 encapsulates the antenna structure 10 and the chip body 40 . Exemplarily, the injection molded part 52 fully wraps the antenna structure 10 . The injection molded part 52 fully wraps the chip body 40 . In other embodiments, the injection molded part 52 may also half-wrap the antenna structure 10 . The injection molded part 52 can also half-wrap the chip body 40 .
  • the antenna structure 10 can refer to the antenna structure 10 shown in FIG. 4 to FIG. 24 , or the antenna structure 10 shown in FIG. 26 to FIG. 29 , or the antenna structure 10 shown in FIG. 31 . I won't go into details here.
  • the chip body 40 is a radio frequency transceiver chip.
  • the antenna structure 10 can be electrically connected to the chip body 40 through the packaging substrate 51 .
  • the chip body 40 transmits radio frequency signals to the antenna structure 10 through the packaging substrate 51 , so that the antenna structure 10 radiates electromagnetic waves according to the radio frequency signals.
  • the antenna structure 10 receives electromagnetic waves and converts the electromagnetic waves into radio frequency signals
  • the chip body 40 can also receive the radio frequency signals converted by the antenna structure 10 .
  • the packaging substrate 51 may also be provided with a matching circuit (not shown).
  • the matching circuit is electrically connected between the antenna structure 10 and the chip body 40 .
  • the chip can also be a chip based on the AiM (Antenna in Module) scheme, or a chip based on the AoC (Antenna-on-Chip) scheme.
  • AiM Antenna in Module
  • AoC Antenna-on-Chip
  • the chip 1 can be applied in electronic equipment. Specifically, the chip 1 may be disposed on a circuit board of an electronic device. The packaging substrate 51 of the chip 1 can be electrically connected to the circuit board.
  • FIG. 33 is a schematic structural diagram of another embodiment of the electronic device 1 provided by the embodiment of the present application.
  • the electronic device 1 may be a base station, a CPE (Customer Premise Equipment), a wireless access point device (for example, a wireless router), or a device for transmitting non-millimeter wave signals (for example, low frequency signals).
  • the electronic device 1 in the embodiment shown in FIG. 33 is described by taking a base station as an example.
  • the electronic device 1 has an antenna structure 10 .
  • FIG. 33 shows the antenna structure 10 by a dotted line.
  • the frequency band covered by the antenna structure 10 of this embodiment may be 1.5 GHz-3 GHz. In other embodiments, the antenna structure 10 may also cover other frequency bands.
  • FIG. 34 is an exploded schematic view of the antenna structure 10 shown in FIG. 33 .
  • the antenna structure 10 includes a dielectric layer 11 , a ground layer 12 , a feeding unit 13 , a plurality of antenna units 14 and a plurality of matching metal walls 15 .
  • the dielectric layer 11 , the ground layer 12 and the feed unit 13 refer to the arrangement of the dielectric layer 11 , the ground layer 12 and the feed unit 13 in the above embodiment. Specifically, details will not be repeated here.
  • the size and shape of the dielectric layer 11 , the ground layer 12 and the feed unit 13 can be flexibly set according to actual needs.
  • FIG. 35 is an exploded view of the first antenna unit 14 a shown in FIG. 34 .
  • the first antenna unit 14 a includes a first metal layer 141 , a second metal layer 142 , a first metal wall 143 , a second metal wall 144 , a third metal wall 145 and a metal connecting piece 146 .
  • the first metal wall 143 constitutes the first conductive element in this embodiment.
  • the second metal wall 144 , the third metal wall 145 and the metal connecting piece 146 constitute the second conductive element in this embodiment.
  • the arrangement of the first metal layer 141 and the second metal layer 142 can refer to the arrangement of the first metal layer 141 and the second metal layer 142 in the above embodiments. Specifically, details will not be repeated here. Wherein, the size and shape of the first metal layer 141 and the second metal layer 142 can be flexibly set according to actual requirements.
  • first metal wall 143 , the second metal wall 144 , the third metal wall 145 and the metal connecting piece 146 are all in an "L-shape".
  • first metal wall 143 , the second metal wall 144 , the third metal wall 145 and the metal connecting piece 146 may also all be arc-shaped.
  • the second metal layer 142 includes a first region 142a and a second region 142b arranged at intervals.
  • FIG. 35 schematically distinguishes the first region 142a and the second region 142b by dashed lines.
  • both the first region 142a and the second region 142b are "L-shaped".
  • the first region 142 a includes a first side 1421 and a third side 1423 of the second metal layer 142 .
  • the second region 142b includes a second side 1422 and a fourth side 1424 of the second metal layer 142 .
  • the metal connection piece 146 includes a third region 1463a and a fourth region 1463b arranged at intervals.
  • FIG. 35 schematically distinguishes the third region 1463a and the fourth region 1463b by dotted lines.
  • the shapes of the third area 1463a and the fourth area 1463b can both be "L-shaped".
  • FIG. 36 is a partial structural diagram of the antenna structure 10 shown in FIG. 33 .
  • FIG. 37 is a partial structural schematic diagram of the antenna structure 10 shown in FIG. 33 .
  • One end of the third metal wall 145 is connected to the ground layer 12, and the other end is connected to the fourth region 1463b of the metal connecting piece 146, that is, the third metal wall 145 is connected between the ground layer 12 and the fourth region 1463b of the metal connecting piece 146. between.
  • One end of the second metal wall 144 is connected to the third region 1463a of the metal connecting piece 146, and the other end is connected to the second region 142b of the second metal layer 142, that is, the second metal wall 144 is connected to the third region 1463a of the metal connecting piece 146. between the region 1463 a and the second region 142 b of the second metal layer 142 .
  • One end of the first metal wall 143 is connected to the first region 142a of the second metal layer 142, and the other end is connected to the first metal layer 141, that is, the first metal wall 143 is connected to the first region 142a and the second metal layer 142. between the first metal layers 141 .
  • the projection of the third metal wall 145 on the metal connecting piece 146 is offset from the projection of the second metal wall 144 on the metal connecting piece 146 .
  • the projection of the second metal wall 144 on the second metal layer 142 is staggered from the projection of the first metal wall 143 on the second metal layer 142 .
  • the projection of the third metal wall 145 on the metal connecting piece 146 at least partially overlaps the projection of the second metal wall 144 on the metal connecting piece 146 .
  • the first side 1421 of the second metal layer 142 is opposite to the first side 1411 of the first metal layer 141 .
  • the third side 1423 of the second metal layer 142 is opposite to the third side 1413 of the first metal layer 141 .
  • the second metal layer 142 , the first metal wall 143 , the second metal wall 144 , the third metal wall 145 , the metal connecting piece 146 and the ground layer 12 enclose the first space S1 .
  • the first space S1 can be used to arrange other components of the antenna structure 10 .
  • the space ratio of the antenna structure 10 is relatively high.
  • the antenna structure 10 can be arranged compactly, which facilitates the miniaturized arrangement of the antenna structure 10 .
  • the first metal wall 143 and the second metal wall 144 are arranged on the second metal layer 142
  • the upper part is divided into two areas and arranged at intervals, so that when the first antenna unit 14a is in the working state, the current path includes the ground layer 12, the third metal wall 145, the metal connecting piece 146, the second metal wall 144, the second metal layer 142, The first metal wall 143 and the first metal layer 141 .
  • the current path can be bent twice. fold settings. In this way, compared with the antenna structure with the same current path and the current path of the antenna structure is linear, the cross-section height H of the antenna structure 10 of this embodiment is lower, which is beneficial to the miniaturization of the antenna structure 10 .
  • the first antenna unit 14 a may not include the third metal wall 145 and the metal connecting piece 146 . At this time, the second metal wall 144 is directly connected to the ground layer 12 . In this way, the current path of the first antenna unit 14a is bent once.
  • the first antenna unit 14a may further include a second metal connection piece, a third metal connection piece, . . . , an mth metal connection piece, where m is an integer and greater than 1.
  • a second metal connection piece a third metal connection piece
  • . . . , an mth metal connection piece a third metal connection piece
  • m an integer and greater than 1.
  • the first antenna unit 14a may further include a fourth metal wall, a fifth metal wall, . . . , an nth metal wall, where n is an integer and greater than three. In this way, through the arrangement of the mth metal connecting piece and the nth metal wall, the current path of the first antenna unit 14a is arranged in multiple bends.
  • the first antenna unit 14a may have a symmetrical structure, or a partially symmetrical structure, or the same or similar structure or a different structure.
  • the first antenna unit 14a has a symmetrical structure.
  • the first antenna unit 14a is symmetrical about the symmetry plane of the first antenna unit 14a.
  • the symmetry plane of the first antenna unit 14a is perpendicular to the plane where the first metal layer 141 is located, and the diagonal line M1 of the first metal layer 141 is located on the symmetry plane of the first antenna unit 14a.
  • FIG. 38 is a schematic structural diagram of the antenna structure 10 shown in FIG. 33 .
  • the arrangement manner of the second antenna unit 14b, the third antenna unit 14c and the fourth antenna unit 14d please refer to the arrangement manner of the first antenna unit 14a.
  • the positional relationship and connection relationship of the first antenna unit 14a, the second antenna unit 14b, the third antenna unit 14c and the fourth antenna unit 14d can also refer to the first antenna unit 14a and the second antenna unit in the first embodiment. 14b, the positional relationship and connection relationship of the third antenna unit 14c and the fourth antenna unit 14d. The details will not be repeated here.
  • a new space is opened up in the antenna structure 10 by compactly arranging the structures of the various parts of the antenna unit 14, that is, the first space S1 is enclosed in the antenna structure 10 (see FIG. 36 ), The second space S2 (please refer to FIG. 36 ), the third space (not shown) and the fourth space (not shown).
  • the first space S1 , the second space S2 , the third space and the fourth space can be used to arrange other components of the antenna structure 10 .
  • the space ratio of the antenna structure 10 is relatively high.
  • the structure of the antenna structure 10 is relatively compact, which facilitates the miniaturization of the antenna structure 10 .
  • the current path of the antenna structure 10 is bent twice.
  • the cross-sectional height H of the antenna structure 10 of this embodiment is not only lower, but the first slot 191 of the antenna structure 10, the second The widths of the second slit 192 , the third slit 193 and the fourth slit 194 are also relatively low.
  • the second antenna unit 14b and the first antenna unit 14a may have symmetrical structures, or partially symmetrical structures, or the same or similar structures or different structures.
  • the second antenna unit 14b is symmetrical to the first antenna unit 14a.
  • the second antenna unit 14b is symmetrical to the first antenna unit 14a with respect to the first symmetry plane.
  • the first symmetry plane is perpendicular to the plane of the first metal layer 141 of the first antenna unit 14a, and the central plane N1 between the first antenna unit 14a and the second antenna unit 14b is located on the first symmetry plane.
  • the third antenna unit 14c and the first antenna unit 14a may have symmetrical structures, or partially symmetrical structures, or the same or similar structures or different structures.
  • the third antenna unit 14c and the first antenna unit 14a have a symmetrical structure.
  • the third antenna unit 14c is symmetrical to the first antenna unit 14a with respect to the second symmetry plane.
  • the second symmetry plane is perpendicular to the plane of the first metal layer 171 of the third antenna unit 14c, and the central plane N2 between the first antenna unit 14a and the third antenna unit 14c is located on the second symmetry plane.
  • the fourth antenna unit 14d and the third antenna unit 14c may have symmetrical structures, or partially symmetrical structures, or the same or similar structures or different structures.
  • the fourth antenna unit 14d and the third antenna unit 14c have symmetrical structures.
  • the fourth antenna unit 14d is symmetrical to the third antenna unit 14c with respect to the first symmetry plane.
  • the center plane N1 is also the center line of the fourth antenna unit 14d and the third antenna unit 14c.
  • the fourth antenna unit 14d and the second antenna unit 14b may have symmetrical structures, or partially symmetrical structures, or the same or similar structures or different structures.
  • the fourth antenna unit 14d and the second antenna unit 14b have symmetrical structures.
  • the fourth antenna unit 14d is symmetrical to the second antenna unit 14b with respect to the second symmetry plane.
  • the center plane N2 is also the center line of the second antenna unit 14b and the fourth antenna unit 14d.
  • the first antenna unit 14a, the second antenna unit 14b, the third antenna unit 14c and the fourth antenna unit 14d may have a centrally symmetrical structure, or a partially centrally symmetrical structure, or the same or similar structures or different structures.
  • the first antenna unit 14a, the second antenna unit 14b, the third antenna unit 14c, and the fourth antenna unit 14d are centrally symmetrical about the central axis.
  • the central axis is the intersection of the central plane N1 and the central plane N2.
  • the multiple matching metal walls 15 are located at the periphery of the ground layer 12 , that is, the multiple matching metal walls 15 are arranged near the edge of the ground layer 12 .
  • a plurality of matching metal walls 15 are disposed around the periphery of the ground layer 12 .
  • each matching metal wall 15 is "L-shaped" or arc-shaped.
  • the matching metal walls 15 can increase the current path between the antenna unit 14 and the ground layer 12 .
  • the matching metal wall 15 can be used to tune the impedance of the antenna structure 10 to achieve impedance matching.
  • the matching metal wall 15 can increase the current path between the antenna unit 14 and the ground layer 12 , the size of the antenna unit 14 and the ground layer 12 in this embodiment can be reduced, thereby realizing the miniaturization of the antenna structure 10 .
  • the antenna structure 10 of this embodiment may also refer to the arrangement manner of the antenna structure 10 in the second implementation manner of the first embodiment. At this time, the current path of the antenna structure 10 may be bent and arranged multiple times. In addition, the antenna structure 10 also has a group of metal shorting holes 19, at this time, the antenna structure 10 can further improve the bandwidth capability and increase the notch point.
  • the antenna structure 10 of this embodiment may also refer to the arrangement manner of the antenna structure 10 in the third implementation manner of the first embodiment.
  • the antenna structure 10 also has a metal shorting hole group 19 .

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Abstract

本申请提供一种天线结构、天线模组、芯片与电子设备，涉及天线技术领域。通过将第一导电件以及第二导电件在第二金属层上分成两个区域间隔设置，这样，当天线单元处于工作状态时，电流路径包括接地层、第二导电件、第二金属层的第二区域、第二金属层的第一区域、第一导电件以及第一金属层。由于电流可以在第二金属层的第一区域和第二区域之间传输，电流路径呈弯折设置。相较于在相同电流路径的天线结构中，且天线结构的电流路径为直线型时，本实施例的天线结构的剖面高度较低，天线结构可以有利于实现薄型化设置。

Description

天线结构、天线模组、芯片与电子设备
本申请要求于2021年06月30日提交中国专利局、申请号为202110742511.0、申请名称为“天线结构、天线模组、芯片与电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及天线技术领域，特别涉及一种天线结构、天线模组、芯片与电子设备。
背景技术
随着全面屏等关键技术的快速发展，手机等电子设备的轻薄化、极致的屏占比已成为一种趋势，这种设计也大大压缩了天线排布空间。在这种天线排布紧张的环境，传统天线很难满足多通信频段的性能需求。此外，手机通信频段还将在很长时间内出现3G、4G、5G频段共存的局面，天线数量越来越多，频段覆盖越来越广。基于这些变化，在手机上实现小型化的新型天线成为当务之急。
发明内容
本申请提供一种天线结构、天线模组、芯片与电子设备，该天线结构可以实现小型化设置。
第一方面，本申请提供一种天线结构。天线结构包括接地层、馈电单元以及天线单元。天线单元包括第一金属层、第二金属层、第一导电件以及第二导电件。第一金属层与接地层相对设置且彼此间隔。第二金属层位于第一金属层与接地层之间，且与第一金属层与接地层均间隔设置。第二金属层包括间隔设置的第一区域和第二区域。第一导电件连接于第一金属层与第二金属层的第一区域之间。第二导电件连接于接地层与第二金属层的第二区域之间。
馈电单元位于第二金属层朝向接地层的一侧。馈电单元用于向第二金属层和第一金属层馈电。
可以理解的是，通过将第一导电件以及第二导电件在第二金属层上分成两个区域间隔设置，这样，当天线单元处于工作状态时，电流路径包括接地层、第二导电件、第二金属层的第二区域、第二金属层的第一区域、第一导电件以及第一金属层。由于电流可以在第二金属层的第一区域和第二区域之间传输，电流路径呈弯折设置。相较于在相同电流路径的天线结构中，且天线结构的电流路径为直线型时，本实施例的天线结构的剖面高度较低，天线结构可以有利于实现薄型化设置。
在一种可实现的方式中，第一导电件为多个第一金属柱。第二导电件包括第一金属连接片、多个第二金属柱以及多个第三金属柱。第一金属连接片位于第二金属层与接地层之间。多个第二金属柱连接于第一金属连接片与第二金属层的第二区域之间。多个第三金属柱连接于第一金属连接片与接地层之间。
可以理解的是，该天线结构可以用于发射和接收毫米波频段的天线。示例性地，天线结构可以支持n257、n258、n259、n260和n261频段，例如，天线结构可以覆盖24.25GHz至43.5GHz的频率范围。
在一种可实现的方式中，第三金属柱的直径大于第二金属柱的直径。
可以理解的是，当第二金属柱的直径较小时，包裹在第二金属柱周边的介质层的厚度可以做小。当第三金属柱的直径较大时，包裹在第三金属柱周边的介质层的厚度可以做大。这样，在天线结构的成型工艺中，可以将两个厚度不同的介质板(一个介质板设有第二金属柱， 另一个介质板设有第三金属柱)通过粘接或者焊接等方式堆叠成一个整体。
在一种可实现的方式中，多个第一金属柱排布成L型或者弧形，第一金属连接片呈L型或者弧形，多个第二金属柱排布成L型或者弧形，以及多个第三金属柱排布成L型或者弧形。
可以理解的是，通过将第一金属连接片设置呈L型或者弧形，多个第二金属柱排布成L型或者弧形，以及多个第三金属柱排布成L型或者弧形，从而使得第二金属层、第二金属柱、第三金属柱、第一金属连接片以及接地层围出空间。这样，该空间可以用于设置天线结构的其他部件。一方面，天线结构的空间率较高。另一方面，天线结构可以紧凑设置，从而有利于天线结构的小型化设置。
在一种可实现的方式中，第三金属柱在第一金属连接片的投影与第二金属柱在第一金属连接片的投影至少部分重合。这样，电流路径呈一次弯折设置。天线结构较为简单。
在一种可实现的方式中，第一金属连接片包括间隔设置的第三区域和第四区域。第二金属柱连接于第一金属连接片的第三区域与第二金属层的第二区域之间。第三金属柱连接于第一金属连接片的第四区域与接地层之间。
可以理解的是，当天线单元处于工作状态时，电流路径包括接地层、第三金属柱、第一金属连接片的第四区域、第一金属连接片的第三区域、第二金属柱、第二金属层、第一金属柱以及第一金属层。此时，由于电流可以在第一金属连接片的第四区域和第一金属连接片的第三区域之间传输，以及在第二金属层上两个区域之间传输，电流路径呈两次弯折设置。相较于电流路径呈一次弯折设置的方案，本实现方式的天线结构的剖面高度可以做得更低。这样，天线结构的薄型化设置更容易实现。
在一种可实现的方式中，天线单元的数量为四个。四个天线单元呈2行2列间隔排布。四个天线单元具有中心点。四个天线单元分别为第一天线单元、第二天线单元、第三天线单元以及第四天线单元。
其中，第一天线单元的第二导电件位于第一天线单元的第一导电件远离中心点的一侧。第二天线单元的第二导电件位于第二天线单元的第一导电件远离中心点的一侧。第三天线单元的第二导电件位于第三天线单元的第一导电件远离中心点的一侧。第四天线单元的第二导电件位于第四天线单元的第一导电件远离中心点的一侧。这样，第一天线单元的第二导电件、第二天线单元的第二导电件、第三天线单元的第二导电件和第四天线单元的第二导电件可以围出一个体积较大的空间。
另外，馈电单元位于第一天线单元的第二导电件、第二天线单元的第二导电件、第三天线单元的第二导电件和第四天线单元的第二导电件所围成的空间。这样，一方面，天线结构的空间率较高。另一方面，天线结构可以紧凑设置，从而有利于天线结构的小型化设置。
在一种可实现的方式中，第一天线单元、第二天线单元、第三天线单元以及第四天线单元呈中心对称结构。
在一种可实现的方式中，馈电单元包括间隔设置的第一馈电枝节以及第二馈电枝节。第一馈电枝节的一端位于第一天线单元的第二金属层朝向接地层的一侧。第一馈电枝节的另一端位于第四天线单元的第二金属层朝向接地层的一侧。第一馈电枝节用于向第一天线单元的第二金属层、第一天线单元的第一金属层、第四天线单元的第二金属层以及第四天线单元的第一金属层馈电。第二馈电枝节的一端位于第二天线单元的第二金属层朝向接地层的一侧。第二馈电枝节的另一端位于第三天线单元的第二金属层朝向接地层的一侧。第二馈电枝节用于向第二天线单元的第二金属层、第二天线单元的第一金属层、第三天线单元的第二金属层 以及第三天线单元的第一金属层馈电。
可以理解的是，馈电单元可以向第一天线单元、第二天线单元、第三天线单元以及第四天线单元同时馈电。
在一种可实现的方式中，第一天线单元、第二天线单元、第三天线单元以及第四天线单元均为对称结构。第一天线单元的对称面、第二天线单元的对称面、第三天线单元的对称面以及第四天线单元的对称面均经过中心点。第一馈电枝节的延伸方向平行于第一天线单元的对称面和第四天线单元的对称面。第二馈电枝节的延伸方向平行于第二天线单元的对称面和第三天线单元的对称面。这样，天线结构可以产生两种极化。第一种极化为天线结构的-45°极化。第二种极化为天线结构的+45°极化。
在一种可实现的方式中，第一馈电枝节包括依次连接的第一部分、第二部分、第三部分、第四部分以及第五部分。第一部分与接地层之间的距离、第五部分与接地层之间的距离和第二馈电枝节与接地层之间的距离均相等。第二部分、第三部分和第四部分呈“U型”状，第三部分位于第二馈电枝节与接地层之间。这样，第一馈电枝节与第一天线单元的第二金属层之间的距离、第一馈电枝节与第四天线单元的第二金属层之间的距离、第二馈电枝节与第二天线单元的第二金属层之间的距离、第一馈电枝节与第三天线单元的第二金属层之间的距离可以较大程度地相等。
在一种可实现的方式中，第一馈电枝节与接地层之间的距离大于或者小于第二馈电枝节与接地层之间的距离。本实现方式的馈电单元的结构较为简单。
在一种可实现的方式中，天线结构还包括多个金属短接孔组。多个金属短接孔组电连接接地层，且位于第一天线单元、第二天线单元、第三天线单元以及第四天线单元的周边。
第一天线单元与第二天线单元形成第一缝隙。第一缝隙与至少一个金属短接孔组设置在第一缝隙的延伸方向上。第一天线单元与第三天线单元形成第二缝隙。至少一个金属短接孔组设置在第二缝隙的延伸方向上。第三天线单元与第四天线单元形成第三缝隙。至少一个金属短接孔组设置在第三缝隙的延伸方向上。第四天线单元与第二天线单元形成第四缝隙。至少一个金属短接孔组设置在第四缝隙的延伸方向上。
可以理解的是，天线结构可以具有四个谐振频率。一方面，在n257、n258、n259、n260和n261的频段范围内，天线结构可以增加一个谐振点。另一方面，在n257、n258、n259、n260和n261的频段范围内，天线结构可以增加一个陷波点。
在一种可实现的方式中，天线结构还包括多个匹配过孔组。多个匹配过孔组电连接接地层。多个匹配过孔组位于天线单元的周边。多个匹配过孔组环绕天线单元设置。
可以理解的是，通过在接地层上设有多个间隔设置的匹配过孔组，匹配过孔组可以增大天线单元与接地层之间的电流路径。匹配过孔组可以用于调谐天线结构的阻抗，以实现阻抗匹配。另外，由于匹配过孔组可以增大天线单元与接地层的电流路径，本实施例的天线单元和接地层的尺寸可以做小，从而实现天线结构的小型化设置。
在一种可实现的方式中，天线结构还包括介质层。接地层、馈电单元以及天线单元均设置于介质层。这样，天线结构的整体性较佳，稳定性较佳。
在一种可实现的方式中，介质层的材质采用LCP。由于LCP的损耗正切值在高频时保持相对较小数值，这可以使天线结构具有较小的传输损耗，从而提高天线辐射效率，获得更高的天线增益。
在一种可实现的方式中，第一导电件为第一金属墙。第二导电件包括金属连接片、第二金属墙以及第三金属墙。金属连接片位于第二金属层与接地层之间。第二金属墙连接于金属 连接片与第二金属层的第二区域之间。第三金属墙连接于金属连接片与接地层之间。
可以理解的是，本实现方式的天线结构可以支持低频。示例性地，天线结构可以覆盖的频段可以为1.5GHz-3GHz。
在一种可实现的方式中，金属连接片包括间隔设置的第三区域和第四区域。第二金属墙连接于金属连接片的第三区域与第二金属层的第二区域之间。第三金属墙连接于金属连接片的第四区域与接地层之间。
可以理解的是，通过将第二金属墙与第三金属墙在金属连接片上分成两个区域间隔设置，将第一金属墙与第二金属墙在第二金属层上分成两个区域间隔设置，从而当天线单元处于工作状态时，电流路径包括接地层、第三金属墙、金属连接片、第二金属墙、第二金属层、第一金属墙以及第一金属层。由于电流可以在金属连接片的第三区域和第四区域之间传输，以及在第二金属层的第一区域和第二区域之间传输，电流路径可以呈两次弯折设置。这样，相较于在相同电流路径的天线结构中，且天线结构的电流路径为直线型时，本实施例的天线结构的剖面高度较低，可以有利于天线结构的小型化设置。
在一种可实现的方式中，第三金属墙在金属连接片的投影与第二金属墙在金属连接片的投影至少部分重合。这样，电流路径呈一次弯折设置。天线结构较为简单。
第二方面，本申请提供一种天线模组。射频电路以及如上所述的天线结构。射频电路电连接于天线结构的馈电单元。
可以理解的是，当天线结构应用于天线模组时，由于天线结构可以实现小型化设置，使得天线模组也可以实现小型化设置。
第三方面，本申请提供一种电子设备。电子设备包括电路板以及如上所述的天线模组。天线模组设置于电路板。
可以理解的是，当天线模组应用于电子设备时，由于天线模组可以实现小型化设置，使得电子设备也可以实现小型化设置。
在一种可实现的方式中，天线结构与电路板为一体成型结构。这样，天线模组的结构更简单。
第四方面，本申请提供一种芯片。芯片包括封装基板、注塑件、芯片本体以及如上所述的天线结构。天线结构和芯片本体均设置于封装基板，且电连接于封装基板。注塑件用于封装天线结构和芯片本体。
可以理解的是，当天线结构应用于芯片时，由于天线结构可以实现小型化设置，使得芯片也可以实现小型化设置。
在一种可实现的方式中，芯片本体为射频收发芯片。天线结构通过封装基板电连接于芯片本体。
第五方面，本申请提供一种电子设备。电子设备包括电路板以及如上所述的芯片。芯片设置于电路板。
可以理解的是，当芯片应用于电子设备时，由于芯片可以实现小型化设置，使得电子设备也可以实现小型化设置。
附图说明
图1是本申请提供的电子设备的一种实施例的结构示意图；
图2是图1所示的电子设备的部分分解示意图；
图3是图2所示的电路板组件的部分分解示意图；
图4是图3所示的天线结构的部分分解示意图；
图5是图4所示的第一天线单元和第二天线单元的分解示意图；
图6是图3所示的天线结构的部分结构示意图；
图7是图5所示的第一天线单元的第一金属连接片和第二金属连接片的结构示意图；
图8是图3所示的天线结构的部分结构示意图；
图9是图3所示的天线结构的部分结构示意图；
图10是图5所示的第一天线单元的第二金属片的结构示意图；
图11是图3所示的天线结构的部分结构示意图；
图12是图5所示的第一天线单元的第一金属片的结构示意图；
图13是图3所示的天线结构的部分结构示意图；
图14是图13所示的部分天线结构在A-A线处的剖面示意图；
图15是图4所示的第三天线单元和第四天线单元的分解示意图；
图16是图3所示的天线结构的部分结构示意图；
图17是图3所示的天线结构的部分结构示意图；
图18是图3所示的天线结构的结构示意图；
图19是图4所示的馈电单元的结构示意图；
图20是图3所示的天线结构的部分结构示意图；
图21是图20所示的天线结构在B-B线的剖面示意图；
图22是图3所示的天线结构的部分结构示意图；
图23是图22所示的天线结构在C-C线的剖面示意图；
图24是图3所示的天线结构的部分结构示意图；
图25a是本申请实施例的天线结构的反射系数随频率变化的数据图；
图25b是本申请实施例的天线结构的一种极化示意图；
图25c是本申请实施例的天线结构的另一种极化示意图；
图25d是本实施例的封装基板结构的部分剖面示意图；
图26是本申请实施例提供的第一天线单元的第一金属连接片和第二金属连接片的另一种实施方式的结构示意图；
图27是本申请实施例提供的天线结构的另一种实施方式的部分结构示意图；
图28是本申请实施例提供的天线结构的另一种实施方式的部分剖面示意图；
图29是本申请实施例提供的天线结构的另一种实施方式的结构示意图；
图30a是本申请实施例的天线结构的反射系数随频率变化的数据图；
图30b是本申请实施例的天线结构在n259频段下的电流示意图；
图30c是本申请实施例的天线结构在n259频段的电场的示意图；
图30d是本申请实施例的天线结构在n260频段下的电流示意图；
图30e是本申请实施例的天线结构在n260频段下的电场示意图；
图31是本申请实施例提供的天线结构的再一种实施方式的结构示意图；
图32a是本申请实施例的天线结构的反射系数随频率变化的数据图；
图32b是本申请实施例提供的芯片的剖面示意图；
图33是本申请实施例提供的电子设备的另一种实施例的结构示意图；
图34是图33所示的天线结构的分解示意图；
图35是图34所示的第一天线单元的分解示意图；
图36是图33所示的天线结构的部分结构示意图；
图37是图33所示的天线结构的部分结构示意图；
图38是图33所示的天线结构的结构示意图。
具体实施方式
为方便理解本申请实施例提供的天线结构，对本申请中涉及到的有关名词进行解释：
应理解，在本申请中“电连接”可理解为元器件物理接触并电导通；也可理解为线路构造中不同元器件之间通过印制电路板(Printed Circuit Board，PCB)铜箔或导线等可传输电信号的实体线路进行连接的形式。其中，电连接包括直接连接和间接耦合。“连接”、“相连”均可以指一种机械连接关系或物理连接关系。以“连接”为例进行说明。“连接”应做广义理解，例如，“连接”可以是可拆卸地连接，也可以是不可拆卸地连接；可以是直接连接，也可以通过中间媒介间接连接。例如A与B连接可以指，A与B之间存在紧固的构件(如螺钉、螺栓、铆钉等)，或者A与B相互接触且A与B难以被分离。
在本申请中“长度”可理解为物体的物理长度，也可理解为电长度。电长度可以是指，物理长度(即机械长度或几何长度)乘以电或电磁信号在媒介中的传输时间与这一信号在自由空间中通过跟媒介物理长度一样的距离时所需的时间的比来表示，电长度可以满足以下公式：
Figure PCTCN2022101755-appb-000001
其中，L为物理长度，a为电或电磁信号在媒介中的传输时间，b为在自由空间中的中传输时间。
或者，电长度也可以是指物理长度(即机械长度或几何长度)与所传输电磁波的波长之比，电长度可以满足以下公式：
Figure PCTCN2022101755-appb-000002
其中，L为物理长度，λ为电磁波的波长。
耦合：指两个或两个以上的电路元件或电网络的输入与输出之间存在紧密配合与相互影响，并通过相互作用从一侧向另一侧传输能量的现象。
天线增益：用于表征天线把输入功率集中辐射的程度。通常，天线方向图的主瓣越窄，副瓣越小，天线增益越高。
天线辐射效率：指天线向空间辐射出去的功率(即有效地转换电磁波部分的功率)和输入到天线的有功功率之比。其中，输入到天线的有功功率＝天线的输入功率-损耗功率；损耗功率主要包括回波损耗功率和金属的欧姆损耗功率和/或介质损耗功率。
天线回波损耗：可以理解为经过天线电路反射回天线端口的信号功率与天线端口发射功率的比值。反射回来的信号越小，说明通过天线向空间辐射出去的信号越大，天线的辐射效率越大。反射回来的信号越大，说明通过天线向空间辐射出去的信号越小，天线的辐射效率越小。
天线回波损耗可以用S11参数来表示，S11参数通常为负数。S11参数越小，表示天线回波损耗越小，天线的系统效率越高；S11参数越大，表示天线回波损耗越大，天线的系统效率越低。
天线隔离度：是指一个天线发射信号，通过另一个天线接收的信号与该发射天线信号的比值。隔离度是用来衡量天线互耦程度大小的物理量。假定两个天线构成一个双端口网络，那么两个天线之间的隔离度就是天线之间的S21、S12。天线隔离度可以用S21、S12参数表 示。S21、S12参数通常为负数。S21、S12参数越小，表示天线之间的隔离度越大，天线互耦程度越小；S21、S12参数越大，表示天线之间的隔离度越小，天线互耦程度越大。天线的隔离度取决于天线辐射方向图、天线的空间距离、天线增益等。
参考地：可以是电子设备(比如手机)的电路板的接地层，也可以是电子设备中板形成的接地层或屏幕下方的金属薄膜形成的接地金属层。电路板可以是印刷电路板(printed circuit board，PCB)，例如具有8、10、12、13或14层导电材料的8层、10层或12至14层板，或者通过诸如玻璃纤维、聚合物等之类的介电层或绝缘层隔开和电绝缘的元件。电路板通常包括介质基板、接地层和走线层，走线层和接地层通过过孔进行电连接。诸如显示器120、触摸屏、输入按钮、发射器、处理器、存储器、电池140、充电电路、片上系统(system on chip，SoC)结构等部件可以安装在电路板上或连接到电路板；或者电连接到电路板中的走线层和/或接地层。例如，射频源设置于走线层。
上述接地层、接地层、接地金属层由导电材料制得。该导电材料可以采用以下材料中的任一者：铜、铝、不锈钢、黄铜和它们的合金、绝缘基片上的铜箔、绝缘基片上的铝箔、绝缘基片上的金箔、镀银的铜、绝缘基片上的镀银铜箔、绝缘基片上的银箔和镀锡的铜、浸渍石墨粉的布、涂覆石墨的基片、镀铜的基片、镀黄铜的基片和镀铝的基片。本领域技术人员可以理解，接地层/接地层/接地金属层也可由其它导电材料制得。
下面结合本申请实施例中的附图对本申请实施例进行描述。
在本申请实施例的描述中，“多个”是指两个或多于两个。在本申请实施例的描述中，A至B的范围包括端点A和B。另外，本申请实施例中所提到的方位用语，例如，“顶”、“底”以及“侧面”等，仅是参考附图的方向，因此，使用的方位用语是为了更好、更清楚地说明及理解本申请实施例，而不是指示或暗指所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请实施例的限制。
另外，在本申请实施例中，提到的数学概念，对称、相等、45°、平行、垂直等。这些限定，均是针对当前工艺水平而言的，而不是数学意义上绝对严格的定义，允许存在少量偏差，近似于对称、近似于相等、近似于45°、近似于平行、近似于垂直等均可以。例如，A与B平行，是指A与B之间平行或者近似于平行，A与B之间的夹角在0度至10度之间均可。例如，A与B垂直，是指A与B之间垂直或者近似于垂直，A与B之间的夹角在80度至100度之间均可。请参阅图1，图1是本申请提供的电子设备1的一种实施例的结构示意图。电子设备1可以为手机、手表、平板电脑(tablet personal computer)、膝上型电脑(laptop computer)、个人数码助理(personal digital assistant，PDA)、照相机、个人计算机、笔记本电脑、车载设备、可穿戴设备、增强现实(augmented reality，AR)眼镜、AR头盔、虚拟现实(virtual reality，VR)眼镜、VR头盔、混合现实(mixed reality，MR)眼镜、MR头盔或者可以用于发射毫米波天线的设备。图1所示实施例的电子设备1以手机为例进行阐述。
请参阅图2，并结合图1所示，图2是图1所示的电子设备1的部分分解示意图。电子设备1包括电路板组件100、壳体200以及屏幕300。可以理解的是，图1及图2仅示意性地示出了电子设备1包括的一些部件，这些部件的实际形状、实际大小、实际位置和实际结构不受图1、图2以及以下各附图限定。需要说明的是，由于电路板组件100位于电子设备1的内部，图1通过虚线示意性地表示电路板组件100。
其中，屏幕300可用于显示图像等。屏幕300可以为平面屏，也可以为曲面屏。屏幕300可以包括透明盖板301和显示屏302。透明盖板301层叠于显示屏302。透明盖板301可以紧 贴显示屏302设置，可用于对显示屏302起到透光、保护以及防尘作用。透明盖板301的材质可以为玻璃。显示屏302可用于显示图像等。显示屏302可以采用液晶显示屏(liquid crystal display,LCD)、有机发光二极管(organic light-emitting diode，OLED)显示屏，有源矩阵有机发光二极体或主动矩阵有机发光二极体(active-matrix organic light-emitting diode，AMOLED)显示屏，量子点发光二极管(quantum dot light emitting diodes，QLED)显示屏等。
示例性地，壳体200包括边框201以及后盖202。后盖202可以通过粘胶固定于边框201的一侧。在其他实施例中，后盖202也可以与边框201为一体成型结构。
另外，屏幕300可以通过粘胶固定于边框201的另一侧。屏幕300与后盖202相对设置，且屏幕300的透明盖板301位于屏幕300的显示屏302远离后盖202的一侧。此时，后盖202、边框201与屏幕300可以共同围设出电子设备1的内部。电子设备1的内部可用于设置电池、扬声器、受话器、摄像头以及麦克风等器件。
示例性地，壳体200还可以包括中板(图未示)。中板位于屏幕300与后盖202之间。中板可以至少部分地与边框201间隔设置，或者至少部分地连接于边框201的内侧，或者部分与边框间隔设置，部分连接于边框201的内侧。例如，边框的内侧包括延伸部。通过延伸部与中板连接，或边框与中板为一体结构。
另外，电路板组件100固定于电子设备1的内部。例如，电路板组件100可以通过紧固件(螺钉、螺丝或者销钉等)固定在电子设备1的内部。此时，壳体200与屏幕300可以保护电路板组件100。
请参阅图3，图3是图2所示的电路板组件100的部分分解示意图。电路板组件100包括天线结构10、射频电路20以及电路板(printed circuit board，PCB)30。
其中，电路板30可以为硬质电路板，也可以为柔性电路板，也可以为软硬结合电路板。此外，电路板30可以采用FR-4介质板，也可以采用罗杰斯(Rogers)介质板，也可以采用FR-4和Rogers的混合介质板，等等。这里，FR-4是一种耐燃材料等级的代号，Rogers介质板为一种高频板。可以理解的是，电路板30可以由一个板件构成，例如，电路板30可以为主板，或者副板，或者连接主板和副板之间的任意一个柔性电路板。示例性地，主板和副板均为刚性电路板。电路板30也可以由多个板件构成。例如，电路板30可以包括主板、副板和子板。子板电连接在主板和副板之间。示例性地，主板和副板均为刚性电路板，子板为柔性电路板。
其中，天线结构10和射频电路20均设置于电路板30。天线结构10可以通过电路板30电连接于射频电路20。此时，射频电路20可以通过电路板30向天线结构10发射射频信号，以使天线结构10根据射频信号辐射电磁波。此外，当天线结构10接收到电磁波，并将电磁波转换成射频信号时，射频电路20还可以通过电路板30接收天线结构10所转换的射频信号。
示例性地，天线结构10可以集成于电路板30内。此时，天线结构10与电路板30为一体成型结构。
其中，射频电路20包括射频收发芯片21以及匹配电路22。匹配电路22可以包括天线开关、电容、电感或者电阻等电子器件。匹配电路22电连接于射频收发芯片21与天线结构10之间。射频收发芯片21用于向天线结构10发射射频信号，以使天线结构10根据射频信号辐射电磁波。此外，当天线结构10接收到电磁波，并将电磁波转换成射频信号时，射频收发芯片21还可以接收天线结构10所转换的射频信号。
另外，匹配电路22可用于对射频信号进行信号处理。例如，信号放大或者滤波等。
在一种实施例中，天线结构10和匹配电路22可以集成在射频收发芯片21内。此时，天线结构10、匹配电路22和射频收发芯片21为一个整体结构。这样，电子设备1的内部可以节省匹配电路22和天线结构10的占用空间，从而提高电子设备1的内部空间的利用率，还可以减少天线的传输损耗，提高天线效率。
在一种实施例中，电路板组件100还可以包括功能芯片。例如，功能芯片为中央处理器(central processing unit，CPU)、图形处理器(graphics processing unit，GPU)、通用存储器(universal flash storage，UFS)或者电池管理芯片(power management integrated circuits)等。
示例性地，射频电路20和天线结构10可以集成在功能芯片内。此时，射频电路20、天线结构10以及功能芯片形成为一个整体结构。例如，射频电路20和天线结构10可以集成在CPU上。这样，电子设备1的内部可以节省射频电路20和天线结构10的占用空间，从而提高电子设备1的内部空间的利用率。
可以理解的是，上文给出了天线结构10设置于电路板30的实施方式。在其他实施方式中，天线结构10也可以设于其他基板上。例如低温共烧陶瓷(low temperature co-fired ceramic，LTCC)基板。
请再次参阅图3，并结合图1和图2所示，天线结构10的辐射方向具有多种设置方式。
第一种可选的方式：天线结构10可以通过后盖202向电子设备1的外部辐射或者接收电磁波。
示例性地，通过将后盖202的材质设置为绝缘材料(例如玻璃、陶瓷或者塑胶材料等)，以使天线结构10可以直接通过后盖202向电子设备1的外部辐射或者接收电磁波。
示例性地，通过将后盖202设置为金属材料(例如，铝合金材料等)，并在后盖202开设通孔(图未示)，以使天线结构10可以通过后盖202的通孔向电子设备1的外部辐射或者接收电磁波。另外，通过在通孔内填充绝缘材料(例如：聚合物、玻璃、陶瓷等材料或者这些材料的组合等)，以在不影响电磁波传输的同时，还可以保证后盖202的整体性以及后盖201的表面平整度。
第二种可选的方式：天线结构10可以通过边框201向电子设备1的外部辐射或者接收电磁波。
示例性地，通过将边框201的材质设置为绝缘材料(例如玻璃、陶瓷或者塑胶材料等)，以使天线结构10可以直接通过边框201向电子设备1的外部辐射或者接收电磁波。
示例性地，通过将边框201设置为金属材料(例如：铝合金材料等)，并在边框201开设通孔(图未示)，以使天线结构10可以通过边框201的通孔向电子设备1的外部辐射或者接收电磁波。另外，通过在通孔内填充绝缘材料(例如：聚合物、玻璃、陶瓷等材料或者这些材料的组合等)，以在不影响电磁波传输的同时，还可以保证边框201的整体性以及边框201的表面平整度。
第三种可选的方式：天线结构10可以通过屏幕300向电子设备1的外部辐射或者接收电磁波。
示例性地，通过将天线结构10设置于屏幕300的透明盖板301与屏幕300的显示屏302之间，以使天线结构10可以直接通过透明盖板301向电子设备1的外部辐射或者接收电磁波。
示例性地，通过将天线结构10直接嵌设于屏幕300的透明盖板301的内部，从而通过透明盖板301向电子设备1的外部辐射或者接收电磁波。
示例性地，屏幕300可以为刘海屏或者水滴屏等。天线结构10可以通过屏幕300的“水 滴”位置或者“刘海”位置等，向电子设备1的外部辐射或者接收电磁波。例如，屏幕300的“水滴”位置或者“刘海”位置为开孔结构。此时，天线结构10可以通过屏幕300的开孔位置向电子设备1的外部辐射或者接收电磁波。
在其他实施方式中，第一种可选的方式至第三种可选的方式中任意两个方式可以相互结合，或者三个实施方式可以相互结合。这样，天线结构10不限于从一个部分辐射出去。例如，当天线结构10靠近后盖202以及边框201时，天线结构10可以通过后盖202以及边框201的绝缘部分向电子设备1的外部辐射或者接收电磁波。
示例性地，天线结构10可以支持n257、n258、n259、n260和n261频段，例如，天线结构10可以覆盖24.25GHz至43.5GHz的频率范围。定义f0为天线结构10的中心频率。本实施例的f0＝(24.25+43.5)/2GHz＝33.875GHz。定义λ0是中心频率的介质波长。天线结构10可以应用于毫米波频段。天线结构10可以满足用户的5G(5th Generation，第五代)移动通信需求，以应用在通话、视频通话等场景中。或者，在电子设备1中设置NFC(Near Field Communication，近场通信)芯片，以满足用户的近场通信需求，以应用在移动支付、公交支付、身份识别等场景中。在其他实施例中，天线结构10也可以覆盖其他频段。此时，天线结构10的中心频率f0也会相应地变化。
本实施例将结合相关附图具体介绍几种天线结构10的设置方式。
请参阅图4，图4是图3所示的天线结构10的部分分解示意图。天线结构10包括介质层11、接地层12、馈电单元13、天线单元14以及多个匹配过孔组15。
其中，介质层11采用LCP(Liquid Crystal Polymer，液晶聚合物)介质层11，也可以采用FR-4介质层11，也可以采用罗杰斯(Rogers)介质层11，也可以采用FR-4和Rogers的混合介质板等。可以理解的是，当介质层的材质采用LCP时，由于LCP的损耗正切值在高频时保持相对较小数值，这可以使天线结构具有较小的传输损耗，从而提高天线辐射效率，获得更高的天线增益。
其中，接地层12、馈电单元13、天线单元14以及多个匹配过孔组15均可以设置于介质层11。可以理解的是，介质层11可以用于支撑接地层12、馈电单元13、天线单元14以及多个匹配过孔组15，以使接地层12、馈电单元13、天线单元14以及多个匹配过孔组15形成一个整体结构。
在一种实施方式中，介质层11可以包裹或者半包裹接地层12、馈电单元13、天线单元14以及多个匹配过孔组15。当介质层11半包裹接地层12、馈电单元13、天线单元14以及多个匹配过孔组15时，接地层12、馈电单元13、天线单元14以及多个匹配过孔组15的至少部分可以相对介质层11露出。
在一种实施方式中，接地层12、馈电单元13、天线单元14以及多个匹配过孔组15可以设置于介质层11的一表面。
在一种实施例中，接地层12、馈电单元13、天线单元14以及多个匹配过孔组15所构成的结构为多层结构。在天线结构10的形成过程中，这个多层结构需要一层一层地依次形成。在形成这个多层结构的每一层的过程中，本实施例可以相应地形成一个介质层的子层。这样，当天线结构10形成之后，介质层11刚好可以使得接地层12、馈电单元13、天线单元14以及多个匹配过孔组15均嵌设于介质层11内。故而，虽然图4所示意的介质层11是一个整体的结构，但介质层11也可以由多个子层堆叠形成。
在其他的实施例中，天线结构10也可以不包括介质层11。此时，接地层12、馈电单元13以及天线单元14之间可以通过支架等方式实现固定。
在其他实施例中，天线结构10也可以不包括匹配过孔组15。
请再次参阅图4，接地层12用于向天线单元14提供接地。其中，接地层12的材质可以为金属材料。例如，铜、金、银等。接地层12的形状可以为正方形、长方形、圆形等。具体地，接地层12的形状不做限定。本实施例以接地层12的形状是正方形为例进行描述。
另外，接地层12设有间隔设置的第一通孔121和第二通孔122。第一通孔121和第二通孔122均贯穿接地层12的两个相对表面(例如接地层12的顶面和底面)。馈电单元13可通过第一通孔121和第二通孔122电连接于天线结构10外部的射频电路20。
请再次参阅图4，天线单元14的数量可以为一个，也可以为多个。在本实施方式中，以多个天线单元14为例进行描述。多个天线单元14呈m行n列排布，其中m和n均为正整数。相邻两个天线单元14之间形成一个缝隙。多个天线单元14可以形成“1ⅹ1”阵列、“2ⅹ1”阵列、“1ⅹ2”阵列、“2ⅹ2”阵列、“3ⅹ3”阵列等。本实施例的多个天线单元14以呈“2ⅹ2”阵列为例进行描述。此时，天线单元14的数量为四个，具体包括第一天线单元14a、第二天线单元14b、第三天线单元14c和第四天线单元14d。
请参阅图5，图5是图4所示的第一天线单元14a和第二天线单元14b的分解示意图。第一天线单元14a包括第一金属层141、第二金属层142、第一金属柱143、第二金属柱144、第三金属柱145、第一金属连接片146a以及第二金属连接片146b。其中，第一金属柱143构成本实施方式的第一导电件。第二金属柱144、第三金属柱145、第一金属连接片146a以及第二金属连接片146b构成本实施方式的第二导电件。
需要说明的是，为了避免下文的相关描述过于繁杂冗长，第一天线单元14a的第一金属层141、第一天线单元14a的第二金属层142、第一天线单元14a的第一金属柱143、第一天线单元14a的第二金属柱144、第一天线单元14a的第三金属柱145、第一天线单元14a的第一金属连接片146a和第一天线单元14a的第二金属连接片146b等相关描述均简化为第一金属层141、第二金属层142、第一金属柱143、第二金属柱144、第三金属柱145、第一金属连接片146a以及第二金属连接片146b等描述。此外，通过第一金属层141、第二金属层142、第一金属柱143、第二金属柱144、第三金属柱145、第一金属连接片146a以及第二金属连接片146b等带有标号的名称与下文的第二天线单元14b的第一金属层161、第二天线单元14b的第二金属层162、第二天线单元14b的第一金属柱163、第二天线单元14b的第二金属柱164、第二天线单元14b的第三金属柱165、第二天线单元14b的第一金属连接片166a以及第二天线单元14b的第二金属连接片166b等名称进行区别。
请参阅图6，图6是图3所示的天线结构10的部分结构示意图。第三金属柱145连接于接地层12。示例性地，第三金属柱145的数量为三个。三个第三金属柱145可以呈“L型”排布，或者也可以呈弧形排布。三个第三金属柱145半围绕接地层12的第一通孔121设置。在其他实施例中，第三金属柱145的数量及排布形状不做具体地限制。
需要说明的是，第三金属柱145的结构可以是在过孔的孔壁形成一层金属材料。此时，第三金属柱145大致呈“管道”结构。第三金属柱145的结构也可以是在过孔内填充金属材料。此时，第三金属柱145可以呈“柱状”结构，在其他实施例中，第三金属柱145也可以为其他结构。具体地本实施例不做限定。可以理解的是，下文提到的金属柱(例如第一金属柱143、第二金属柱144等)的结构均可以参阅本实施例的第三金属柱145的结构。具体地下文将不再赘述。
请参阅图7，图7是图5所示的第一天线单元14a的第一金属连接片146a和第二金属连接片146b的结构示意图。在本实施例中，第一金属连接片146a的数量为一个。在其他实施 例中，第一金属连接片146a的数量不做限定。
另外，第一金属连接片146a包括第一连接部分1461和第二连接部分1462。第一连接部分1461连接第二连接部分1462，并形成弯折状。示例性地，第一金属连接片146a呈“L型”状或者弧形状等。需要说明的是，为了能够清楚地介绍第一金属连接片146a的结构，图7通过虚线示意性地区分第一连接部分1461和第二连接部分1462。
示例性地，第一连接部分1461的宽度a1等于第二连接部分1462的宽度a2。此外，第二连接部分1462的长度c2等于第一连接部分1461的长度c1与第二连接部分1462的宽度a2之和。在其他实施例中，第一金属连接片146a的各部分尺寸不做具体的限制。
请再次参阅图7，第二金属连接片146b的数量可以为多个。示例性地，第二金属连接片146b的数量为四个。在其他实施例中，第二金属连接片146b的数量不做限定。
另外，以其中一个第二金属连接片146b为例进行描述。第二金属连接片146b包括第三连接部分1463和第四连接部分1464。第三连接部分1463连接第四连接部分1464，并形成弯折状。示例性地，第二金属连接片146b可以呈“L型”状或者弧形状等。需要说明的是，图7通过虚线示意性地区分第三连接部分1463和第四连接部分1464。
示例性地，第三连接部分1463的宽度a3等于第四连接部分1464的宽度a4。第三连接部分的宽度a3小于第一连接部分1461的宽度a1。第四连接部分1464的宽度为a4小于第二连接部分1462的宽度为a2。另外，第四连接部分1464的长度c4等于第三连接部分1463的长度c3与第四连接部分1464的宽度a4之和。第四连接部分1464的长度c4等于第二连接部分1462的长度c2。在其他实施例中，第二金属连接片146b的各部分尺寸不做具体的限制。
请参阅图8，图8是图3所示的天线结构10的部分结构示意图。接地层12与第一金属连接片146a间隔，且相对设置，第一金属连接片146a连接于第三金属柱145远离接地层12的端部。此时，第三金属柱145连接于接地层12与第一金属连接片146a之间，且第三金属柱145、接地层12与第一金属连接片146a彼此电连接。
示例性地，一个第三金属柱145连接于第一金属连接片146a的第一连接部分1461。两个第三金属柱145连接于第一金属连接片146a的第二连接部分1462。此外，第三金属柱145可以贯穿第一金属连接片146a。
请参阅图9，并结合图8所示，图9是图3所示的天线结构10的部分结构示意图。多个第二金属连接片146b位于第一金属连接片146a远离第三金属柱145的一侧。多个第二金属连接片146b沿天线结构10的厚度方向间隔设置。每个第二金属连接片146b的第三连接部分1463均彼此间隔，且相对设置，并与第一金属连接片146a的第一连接部分1461间隔，且相对设置。每个第二金属连接片146b的第四连接部分1464均彼此间隔，且相对设置，并与第一金属连接片146a的第二连接部分1462间隔且相对设置。
多个第二金属柱144间隔设置，且每个第二金属柱144的一端还连接于第一金属连接片146a。其中，多个第二金属柱144在第一金属连接片146a投影与多个第三金属柱145在第一金属连接片146a投影至少部分重叠。此外，多个第二金属柱144还连接多个第二金属连接片146b。第二金属连接片146b、第二金属柱144、第一金属连接片146a、第三金属柱145以及接地层12实现彼此电连接。
示例性地，多个第二金属柱14可以呈“L型”排布，或者也可以呈弧形排布。
示例性地，每个第二金属柱144均可以贯穿每个第二金属连接片146b。此时，第二金属柱144与第二金属连接片146b的连接更加稳定。在其他实施方式中，每个第二金属柱144也可以未穿过每个第二金属连接片146b。此时，通过在每两个第二金属连接片146b之间设置 第二金属柱144，以及在第二金属连接片146b与第一金属连接片146a之间设置第二金属柱144，从而使得第二金属连接片146b、第二金属柱144、第一金属连接片146a实现彼此电连接。
在本实施例中，第二金属柱144的直径小于第三金属柱145的直径。可以理解的是，当第二金属柱144的直径较小时，包裹在第二金属柱144周边的介质层的厚度可以做小。当第三金属柱145的直径较大时，包裹在第三金属柱145周边的介质层的厚度可以做大。这样，在天线结构10的成型工艺中，可以将两个厚度不同的介质板(一个介质板设有第二金属柱144，另一个介质板设有第三金属柱145)通过粘接或者焊接等方式堆叠成一个整体。
另外，当第二金属柱144的直径小于第三金属柱145的直径时，通过设置第三连接部分的宽度a3小于第一连接部分1461的宽度a1，第四连接部分1464的宽度为a4小于第二连接部分1462的宽度为a2，以使第一连接部分1461和第二连接部分1462具有足够的空间与第三金属柱145连接，以及保证具有较佳的连接稳定性。
在其他实施例中，第一天线单元14a也可以不包括第三金属柱145和第一金属连接片146a。此时，第二金属柱144可以直接连接于接地层12。
在其他实施例中，第一天线单元14a也可以不包括第二金属连接片146b。
请参阅图10，图10是图5所示的第一天线单元14a的第二金属片142的结构示意图。第二金属层142包括相对设置的顶面1425和底面1426，以及连接在顶面1425和底面1426之间的侧面1427。由于本实施例的第一金属层141的厚度相较于第一金属层141的长度和宽度较小，第一金属层141的顶面1425与第一金属层141的底面1426之间的距离较小，第一金属层141的顶面1425与第一金属层141的底面1426的结构大致相同。这样，本实施例能够以第一金属层141的顶面1425为例进行描述。另外，由于第一金属层141的厚度较小，第一金属层141的侧面1427的结构对第一金属层141的结构的影响较小。故而，通过描述第一金属层141的顶面1425的结构也可以大致地反应第一金属层141的立体结构。
其中，第二金属层142的形状可以为正方形、长方形、圆形等。本实施例以第二金属层142的形状是正方形为例进行描述。具体地，第二金属层142包括相对设置的第一边1421和第二边1422，以及相对设置的第三边1423和第四边1424。第三边1423和第四边1424连接在第一边1421和第二边1422之间。由于第二金属层142为正方形，第二金属层142的第一边1421、第二边1422、第三边1423以及第四边1424的边长均相等。示例性地，第二金属层142的边长b1等于第二金属连接片146b(请参阅图7)的第二连接部分1464的长度c4。
在本实施例中，第二金属层142包括间隔设置的第一区域142a和第二区域142b。图10通过虚线示意性地区分第一区域142a和第二区域142b。示例性地，第一区域142a和第二区域142b的形状可以为“L型”状。第一区域142a靠近第一边1421和第三边1423设置。第二区域142b靠近第二边1422和第四边1424设置。在其他实施例中，第一区域142a和第二区域142b的形状不做具体地限定。
请参阅图11，并结合图9和图10，图11是图3所示的天线结构10的部分结构示意图。第二金属层142与第二金属连接片146b间隔，且相对设置。每个第二金属柱144的一端均连接于第二金属层142的第二区域142b。此时，每个第二金属柱14均连接于第二金属层142的第二区域142b与第一金属连接片146a之间。部分第二金属柱144靠近第二金属层142的第二边1422设置，部分第二金属柱144靠近第二金属层142的第四边1424设置。
在本实施方式中，第二金属层142、第二金属柱144、第三金属柱145、第一金属连接片146a、第二金属连接片146b以及接地层12围出第一空间S1。可以理解的是，第一空间S1 可以用于设置天线结构10的其他部件。这样，一方面，天线结构10的空间率较高。另一方面，天线结构10可以紧凑设置，从而有利于天线结构10的小型化设置。
示例性地，接地层12的第一通孔121连通第一空间S1。
另外，第一金属柱143的一端连接于第二金属层142的第一区域142a。示例性地，第一金属柱143的数量为三个。三个第一金属柱143可以呈“L型”状排布，或者也可以呈弧形排布。
可以理解的是，由于第二金属柱144连接于第二金属层142的第二区域142b，第一金属柱143连接于第二金属层142的第一区域142a，此时，第一金属柱143与第二金属柱144在第二金属层142上分成两个区域间隔设置，也即第一金属柱143在第二金属层142的投影与第二金属柱144在第二金属层142的投影错开。另外，第一金属柱143、第二金属层142、第二金属柱144、第三金属柱145、第一金属连接片146a、第二金属连接片146b以及接地层12实现彼此电连接。
请参阅图12，图12是图5所示的第一天线单元14a的第一金属片141的结构示意图。第一金属层141的形状可以为正方形、长方形、圆形等。本实施例以第一金属层141的形状是正方形为例进行描述。具体地，第一金属层141包括相对设置的第一边1411和第二边1412，以及相对设置的第三边1413和第四边1414。第三边1413和第四边1414连接在第一边1411和第二边1412之间。由于第一金属层141为正方形，第一金属层141的第一边1411、第二边1412、第三边1413和第四边1414的边长均相等。示例性地，第一金属层141的边长在0.25λ0至0.35λ0的范围内。在本实施例中，第一金属层141的面积大于第二金属层142的面积。
另外，第一金属层141具有对角线M1。对角线M1的一端位于第一边1411与第三边1413的连接处，另一端位于第二边1412与第四边1414的连接处。需要说明的是，对角线M1并不是第一金属层141上实际的结构。对角线M1为虚拟的一条线。图12通过虚线示意了对角线M1。
请参阅图13，并结合图11和图12所示，图13是图3所示的天线结构10的部分结构示意图。第一金属层141和第二金属层142间隔，且相对设置。第一金属层141固定于第一金属柱143的端部。第一金属柱143连接于第一金属层141和第二金属层142的第一区域142a之间。第一金属层141与第一金属柱143实现电连接。此外，第二金属层142在第一金属层141的所在平面的投影位于第一金属层141内。第一金属层141在接地层12的投影位于接地层12内。
示例性地，第一金属层141的第一边1411与第二金属层142的第一边1421相对设置，也即第二金属层142的第一边1421在第一金属层141的投影与第一金属层141的第一边1411重合。第一金属层141的第三边1413与第二金属层142的第三边1423相对设置，也即第二金属层142的第三边1423与在第一金属层141的投影与第一金属层141的第三边1413重合。
请参阅图14，图14是图13所示的部分天线结构10在A-A线处的剖面示意图。通过将第一金属柱143与第二金属柱144在第二金属层142上分成两个区域间隔设置，这样，当第一天线单元14a处于工作状态时，电流路径(图14通过粗线条简单地示意)包括接地层12、第三金属柱145、第一金属连接片146a、第二金属柱144、第二金属层142的第二区域142b(请参阅图11)、第二金属层142的第一区域142a(请参阅图11)、第一金属柱143以及第一金属层141。由于电流可以在第二金属层142的第一区域142a和第二区域142b之间传输，电流路径呈一次弯折设置。相较于在相同电流路径的天线结构中，且天线结构的电流路径为 直线型时，本实施例的天线结构10的剖面高度H较低，天线结构10可以有利于实现薄型化设置。
示例性地，当电流路径的长度(也即电长度等于天线结构10的剖面高度H与第二金属层142的边长之和)在0.25λ0至0.32λ0的范围内时，天线结构10的剖面高度H可以在0.15λ0至0.21λ0的范围内。这样，相较于其他天线结构10的剖面高度，本实施方式的天线结构10的剖面高度H较大程度地降低。
示例性地，第一天线单元14a可以是对称结构、或部分对称结构、或者相同或相似结构或者不同结构。在本实施例中，第一天线单元14a为对称结构。具体地，请再次参阅图13所示，第一天线单元14a关于第一天线单元14a的对称面对称。其中，第一天线单元14a的对称面垂直于第一金属层141的所在平面，且第一金属层141的对角线M1位于第一天线单元14a的对称面。
请再次参阅图5，第二天线单元14b包括第一金属层161、第二金属层162、第一金属柱163、第二金属柱164、第三金属柱165、第一金属连接片166a以及第二金属连接片166b。其中，第一金属层161、第二金属层162、第一金属柱163、第二金属柱164、第三金属柱165、第一金属连接片166a以及第二金属连接片166b的结构设置可以参阅第一天线单元14a的第一金属层141、第二金属层142、第一金属柱143、第二金属柱144、第三金属柱145、第一金属连接片146a以及第二金属连接片146b的结构设置。具体地，这里不再赘述。
在其他实施例中，第二天线单元14b也可以未包括第三金属柱165、第一金属连接片166a以及第二金属连接片166b。
请再次参阅图6，第三金属柱165连接于接地层12。第二天线单元14b的第三金属柱165位于第一天线单元14a的第三金属柱145的一侧。示例性地，第三金属柱165的数量为三个。三个第三金属柱165呈“L型”排布，或者也可以呈弧形状。在其他实施例中，第三金属柱165的数量不做具体地限制。
请再次参阅图8，第一金属连接片166a连接于第三金属柱165远离接地层12的端部。此时，第三金属柱165连接于第一金属连接片166a与接地层12之间，且第三金属柱165、第一金属连接片166a与接地层12彼此电连接。
另外，第二天线单元14b的第一金属连接片166a的第一连接部分1661与第一天线单元14a的第一金属连接片146a的第一连接部分1461相对设置。第二天线单元14b的第一金属连接片166a的第二连接部分1662与第一天线单元14a的第一金属连接片146a的第二连接部分1642相对设置。
示例性地，一个第三金属柱165连接于第一金属连接片166a的第一连接部分1661。两个第三金属柱165连接于第一金属连接片166a的第二连接部分1662。
请参阅图9，并结合图8所示，多个第二金属连接片166b位于第一金属连接片166a远离第三金属柱165的一侧。多个第二金属连接片166b沿天线结构10的厚度方向间隔设置。每个第二金属连接片166b的第三连接部分1663均彼此间隔且相对设置，并与第一金属连接片166a的第一连接部分1661间隔且相对设置。每个第二金属连接片166b的第四连接部分1664均彼此间隔且相对设置，并与第一金属连接片166a的第二连接部分1662间隔且相对设置。
另外，多个第二金属柱164间隔设置，且每个第二金属柱164的一端还连接于第一金属连接片166a。其中，多个第二金属柱164在第一金属连接片166a投影与多个第三金属柱165在第一金属连接片166a投影至少部分重叠。多个第二金属柱164还连接多个第二金属连接片 166b。此时，第二金属连接片166b、第二金属柱164、第一金属连接片166a、第三金属柱165以及接地层12实现彼此电连接。
示例性地，每个第二金属柱164均可以贯穿每个第二金属连接片166b。此时，第二金属柱164与第二金属连接片166b的连接更加稳定。在其他实施方式中，每个第二金属柱164也可以未穿过每个第二金属连接片166b。此时，通过在每两个第二金属连接片166b之间设置第二金属柱164，以及在第二金属连接片166b与第一金属连接片166a之间设置第二金属柱164，从而使得第二金属连接片166b、第二金属柱164、第一金属连接片166a实现彼此电连接。
在其他实施例中，当第二天线单元14b不包括第三金属柱165和第一金属连接片166a时，第二金属柱164可以直接连接于接地层12。
请再次参阅图11，并结合图9和图10，第二金属层162固定于多个第二金属柱164的端部。第二天线单元14b的第二金属层162的第一边1621与第一天线单元14a的第二金属层142的第一边1421间隔设置。
其中，每个第二金属柱164的一端均连接于第二金属层162的第二区域162b。此时，部分第二金属柱164靠近第二金属层162的第二边1622设置。部分第二金属柱144靠近第二金属层162的第四边1624设置。
可以理解的是，第二金属层162、第二金属柱164、第三金属柱165、第一金属连接片166a、第二金属连接片166b以及接地层12围出第二空间S2。第二空间S2连通第一空间S1。可以理解的是，第二空间S2可以用于设置天线结构10的其他部件。这样，一方面，天线结构10的空间率较高。另一方面，天线结构10可以紧凑设置，从而有利于天线结构10的小型化设置。
另外，每个第一金属柱163的一端均连接于第二金属层162的第一区域162a。示例性地，第一金属柱163的数量为三个。三个第一金属柱163呈“L型”状排布。
可以理解的是，由于第二金属柱164连接于第二金属层162的第二区域162b，第一金属柱163连接于第二金属层162的第一区域162a，此时，第一金属柱163与第二金属柱164在第二金属层162上分成两个区域间隔设置，也即第一金属柱163在第二金属层162的投影与第二金属柱164在第二金属层162的投影错开。另外，第一金属柱163、第二金属层162、第二金属柱164、第三金属柱165、第一金属连接片166a、第二金属连接片166b以及接地层12实现彼此电连接。
请参阅图13，并结合图11所示，第一金属层161和第二金属层162间隔，且相对设置。第一金属层161固定于第一金属柱163的端部。此时，第一金属层161与第一金属柱163实现电连接。第二金属层162在第一金属层161的所在平面的投影位于第一金属层161内。第一金属层161在接地层12的投影位于接地层12内。
在本实施例中，第二天线单元14b的第一金属层161的第一边1611与第一天线单元14a的第一金属层141的第一边1411形成第一缝隙191。第一缝隙191在接地层12的投影位于接地层12内。
示例性地，第二金属层162的第一边1621在第一金属层161的投影与第一金属层161的第一边1611重合。第二金属层162的第三边1623与在第一金属层161的投影与第一金属层161的第三边1613重合。
请再次参阅图14，通过将第一金属柱163与第二金属柱164在第二金属层162上分成两个区域间隔设置，从而当第二天线单元14b处于工作状态时，电流路径(图14通过粗线条简 单地示意)包括接地层12、第三金属柱165、第一金属连接片166a、第二金属柱164、第二金属层162的第二区域162b(请参阅图11)、第二金属层162的第一区域162a(请参阅图11)、第一金属柱163以及第一金属层161。由于电流可以在第二金属层162的第一区域162a和第二区域162b之间传输，电流路径呈一次弯折设置。这样，相较于在相同电流路径的天线结构中，且天线结构的电流路径为直线型时，本实施例的天线结构10的剖面高度H较低，有利于天线结构10实现薄型化设置。
示例性地，第二天线单元14b可以是对称结构、或部分对称结构、或者相同或相似结构或者不同结构。在本实施例中，第二天线单元14b为对称结构。具体地，请再次参阅图13所示，第二天线单元14b关于第二天线单元14b的对称面对称。其中，第二天线单元14b的对称面垂直于第一金属层161的所在平面，且第一金属层161的对角线M2位于第二天线单元14b的对称面。第一金属层161的对角线M2的一端位于第一边1611与第三边1613的连接处，另一端位于第二边1612与第四边1614的连接处。
示例性地，第二天线单元14b与第一天线单元14a可以是对称结构、或部分对称结构、或者相同或相似结构或者不同结构。在本实施例中，第二天线单元14b与第一天线单元14a为对称结构。具体地，第二天线单元14b关于第一对称面N1与第一天线单元14a对称。需要说明的是，第一对称面N1并不是天线结构10上实际的结构。第一对称面N1为虚拟的一个面。图13通过虚线示意性地表示第一对称面N1。
请参阅图15，图15是图4所示的第三天线单元14c和第四天线单元14d的分解示意图。第三天线单元14c包括第一金属层171、第二金属层172、第一金属柱173、第二金属柱174、第三金属柱175、第一金属连接片176a以及第二金属连接片176b。其中，第一金属层171、第二金属层172、第一金属柱173、第二金属柱174、第三金属柱175、第一金属连接片176a以及第二金属连接片176b的结构设置可以参阅第一天线单元14a的第一金属层141、第二金属层142、第一金属柱143、第二金属柱144、第三金属柱145、第一金属连接片146a以及第二金属连接片146b的结构设置。具体地，这里不再赘述。
在其他实施例中，第三天线单元14c也可以未包括第三金属柱175、第一金属连接片176a以及第二金属连接片176b。
请参阅图16至图18，图16是图3所示的天线结构10的部分结构示意图。图17是图3所示的天线结构10的部分结构示意图。图18是图3所示的天线结构10的结构示意图。第三天线单元14c的第一金属层171、第二金属层172、第一金属柱173、第二金属柱174、第三金属柱175、第一金属连接片176a以及第二金属连接片176b之间的设置方式可以参阅第一天线单元14a的第一金属层141、第二金属层142、第一金属柱143、第二金属柱144、第三金属柱145、第一金属连接片146a以及第二金属连接片146b之间的设置方式。这里不再赘述。
其中，第三天线单元14c位于第一天线单元14a的一侧。第三天线单元14c与第一天线单元14a相对且间隔设置。此时，第一天线单元14a位于第二天线单元14b与第三天线单元14c之间。
另外，第三天线单元14c的第一金属层171的第三边1713与第一天线单元14a的第一金属层141的第三边1413形成第二缝隙192。第二缝隙192连通第一缝隙191。
在本实施方式中，第三天线单元14c的第二金属层172、第二金属柱174、第三金属柱175、第一金属连接片176a、第二金属连接片176b以及接地层12可以围出第三空间S3。第三空间S3连通第一空间S1和第二空间S2。可以理解的是，第三空间S3可以用于设置天线 结构10的其他部件。这样，一方面，天线结构10的空间率较高。另一方面，天线结构10可以紧凑设置，从而有利于天线结构10的小型化设置。
示例性地，接地层12的第二通孔122连通第三空间S3。
另外，本实施方式也可以通过将第三天线单元14c的第一金属柱173与第二金属柱174在第二金属层172上分成两个区域间隔设置，以使电流路径呈一次弯折设置。这样，相较于在相同电流路径的天线结构中，且天线结构的电流路径为直线型时，本实施例的天线结构10的剖面高度较低，有利于天线结构10的薄型化设置。
示例性地，第三天线单元14c可以是对称结构、或部分对称结构、或者相同或相似结构或者不同结构。在本实施例中，第三天线单元14c为对称结构。具体地，请再次参阅图18所示，第三天线单元14c关于第三天线单元14c的对称面对称。其中，第三天线单元14c的对称面垂直于第一金属层171的所在平面，且第一金属层171的对角线M3位于第三天线单元14c的对称面。第一金属层171的对角线M3的一端位于第一边1711与第三边1713的连接处，另一端位于第二边1712与第四边1714的连接处。
示例性地，第三天线单元14c与第一天线单元14a可以是对称结构、或部分对称结构、或者相同或相似结构或者不同结构。在本实施例中，第三天线单元14c与第一天线单元14a为对称结构。具体地，第三天线单元14c关于第二对称面N2与第一天线单元14a对称。需要说明的是，第二对称面N2并不是天线结构10上实际的结构。第二对称面N2为虚拟的一个面。图18通过虚线示意地表示第二对称面N2。
请再次参阅图15，第四天线单元14d包括第一金属层181、第二金属层182、第一金属柱183、第二金属柱184、第三金属柱185、第一金属连接片186a以及第二金属连接片186b。其中，第一金属层181、第二金属层182、第一金属柱183、第二金属柱184、第三金属柱185、第一金属连接片186a以及第二金属连接片186b的结构设置也可以参阅第一天线单元14a的第一金属层141、第二金属层142、第一金属柱143、第二金属柱144、第三金属柱145、第一金属连接片146a以及第二金属连接片146b的结构设置。具体地，这里不再赘述。
其中，第四天线单元14d位于第三天线单元14c靠近第二天线单元14b的一侧。第四天线单元14d与第三天线单元14c相对且间隔设置，且与第二天线单元14b相对且间隔设置。此时，第四天线单元14d位于第三天线单元14c和第二天线单元14b之间。
另外，第四天线单元14d的第一金属层181的第一边1811与第三天线单元14c的第一金属层171的第一边1711形成第三缝隙193。
另外，第四天线单元14d的第一金属层181的第三边1813与第二天线单元14b的第一金属层161的第三边1613形成第四缝隙194。第四缝隙194连通第一缝隙191、第二缝隙192和第三缝隙193。此时，第一缝隙191、第二缝隙192和第三缝隙193与第四缝隙194形成大致“十字型”的形状。
在本实施方式中，第四天线单元14d的第二金属层182、第二金属柱184、第三金属柱185、第一金属连接片186a、第二金属连接片186b以及接地层12围出第四空间S4。第四空间S4连通第一空间S1、第二空间S2以及第三空间S3，也即第一空间S1、第二空间S2以及第三空间S3和第四空间S4围出一个大空间。可以理解的是，第四空间S4可以用于设置天线结构10的其他部件。这样，一方面，天线结构10的空间率较高。另一方面，天线结构10可以紧凑设置，从而有利于天线结构10的小型化设置。
另外，本实施方式也可以通过将第四天线单元14d的第一金属柱183与第二金属柱184在第二金属层182上分成两个区域间隔设置，以使电流路径呈一次弯折设置。这样，相较于 在相同电流路径的天线结构中，且天线结构的电流路径为直线型时，本实施例的天线结构10的剖面高度较低，有利于天线结构10的薄型化设置。
示例性地，第四天线单元14d可以是对称结构、或部分对称结构、或者相同或相似结构或者不同结构。在本实施例中，第四天线单元14d为对称结构。具体地，请再次参阅图18所示，第四天线单元14d关于第四天线单元14d的对称面对称。其中，第四天线单元14d的对称面垂直于第一金属层181的所在平面，且第一金属层181的对角线M4位于第四天线单元14d的对称面。第一金属层181的对角线M4的一端位于第一边1811与第三边1813的连接处，另一端位于第二边1812与第四边1814的连接处。
示例性地，第四天线单元14d与第三天线单元14c可以是对称结构、或部分对称结构、或者相同或相似结构或者不同结构。在本实施例中，第四天线单元14d与第三天线单元14c为对称结构。具体地，第四天线单元14d也关于第一对称面N1与第三天线单元14c对称。
示例性地，第四天线单元14d与第二天线单元14b可以是对称结构、或部分对称结构、或者相同或相似结构或者不同结构。在本实施例中，第四天线单元14d与第二天线单元14b为对称结构。具体地，第四天线单元14d关于第二对称面N2与第二天线单元14b对称。
示例性地，第一天线单元14a、第二天线单元14b、第三天线单元14c和第四天线单元14d可以是中心对称结构、或部分中心对称结构、或者相同或相似结构或者不同结构。在本实施例中，第一天线单元14a、第二天线单元14b、第三天线单元14c和第四天线单元14d关于中心点呈中心对称。其中，中心点位于第一对称面N1和第二对称面N2的连接处。中心点为第一天线单元14a、第二天线单元14b、第三天线单元14c和第四天线单元14d的中心位置。在本实施方式中，第一天线单元14a的对称面、第二天线单元14b的对称面、第三天线单元14c的对称面和第四天线单元14d的对称面均经过中心点。结合图11所示，第一天线单元14a的第二金属柱144位于所述第一天线单元14a的第一金属柱143远离中心点的一侧。第二天线单元14b的第二金属柱164位于第二天线单元14b的第一金属柱163远离中心点的一侧。结合图17所示，第三天线单元14c的第二金属柱174位于第三天线单元14c的第一金属柱163远离所述中心点的一侧。第四天线单元14d的第二金属柱184位于第四天线单元14d的第一金属柱183远离中心点的一侧。
在本实施例中，通过紧凑地设置天线单元14的各部分结构，从而在天线结构10中围出第一空间S1、第二空间S2、第三空间S3和第四空间S4。可以理解的是，第一空间S1、第二空间S2、第三空间S3和第四空间S4可以用于设置天线结构10的其他部件。这样，一方面，天线结构10的空间率较高。另一方面，天线结构10的结构较为紧凑，从而有利于天线结构10的小型化设置。另外，设置天线结构10的电流路径呈一次弯折设置。这样，相较于在相同电流路径的天线结构中，且天线结构的电流路径为直线型时，本实施例的天线结构10的剖面高度H不仅较低，天线结构10的第一缝隙191、第二缝隙192、第三缝隙193以及第四缝隙194的宽度也较低。示例性地，第一缝隙191、第二缝隙192、第三缝隙193以及第四缝隙194的宽度均可以在0.03λ0至0.1λ0的范围内。这样，天线结构10的小型化设置更容易实现。
上文结合相关附图具体介绍了天线结构10的第一天线单元14a、第二天线单元14b、第三天线单元14c和第四天线单元14d。在本实施方式中，第一天线单元14a和第四天线单元14d可以构成一个电偶极子。第二天线单元14b和第三天线单元14c可以构成另一个电偶极子。另外，第一缝隙191和第三缝隙193可以构成一个磁偶极子。第二缝隙192和第四缝隙194可以构成另一个磁偶极子。下文将结合相关附图具体介绍天线结构10的馈电单元13。
请参阅图19，图19是图4所示的馈电单元的结构示意图。馈电单元13包括第一馈电枝节131、第二馈电枝节132、第一金属孔133以及第二金属孔134。其中，第一金属孔133的结构可以是在过孔的孔壁形成一层金属材料。此时，第一金属孔133大致呈“管道”结构。此外，第一金属孔133的结构也可以是在过孔内填充金属材料。此时，第一金属孔133可以呈“柱状”结构。在其他实施方式中，第一金属孔133也可以为其他结构。此外，第二金属孔134的结构均可以参阅本实施方式的第一金属孔133的结构。具体地下文将不再赘述。
其中，第一馈电枝节131包括依次连接的第一部分1311、第二部分1312a、第三部分1312b、第四部分1312c以及第五部分1313。第一部分1311与第五部分1313同层设置。第二部分1312a、第三部分1312b和第四部分1312c大致呈“U型”状。示例性地，第二部分1312a和第四部分1312c可以采用金属孔结构。此时，第三部分1312b的两端分别通过一个金属孔结构连接于第一部分1311和第五部分1313。
示例性地，第五部分1313可以呈“T型”状。
可以理解的是，本实施方式可以通过改变第一馈电枝节131的第一部分1311、第二部分1312a、第三部分1312b、第四部分1312c以及第五部分1313的形状或者尺寸等因素来改变天线结构10的谐振频率。
请再次参阅图19，第一金属孔133包括第一孔部1331和第二孔部1332。第二孔部1332连接于第一孔部1331。第一孔部1331的直径大于第二孔部1332的直径。可以理解的是，在第一金属孔的成型工艺中，可以将两个厚度不同的介质板(一个介质板设有第一孔部1331，另一个介质板设有第二孔部1332)通过粘接或者焊接等方式堆叠成一个整体。
其中，第二孔部1332连接于第一馈电枝节131的第一部分1311。
请再次参阅图19，第二馈电枝节132整体大致呈“条型”状。第二馈电枝节132包括依次连接的第一部分1321、第二部分1322以及第三部分1323。第一部分1321、第二部分1322以及第三部分1323同层设置。
示例性地，第一部分1321的宽度大于第二部分1322的宽度。第三部分1323的宽度大于第一部分1321与第二部分1322的宽度。第二部分1322与第三部分1323大致呈“T型”状。
可以理解的是，本实施方式可以通过改变第二馈电枝节132的第一部分1321、第二部分1322以及第三部分1323的形状或者尺寸等因素来改变天线结构10的谐振频率。
另外，第二金属孔134包括第三孔部1341和第四孔部1342。第三孔部1341连接于第四孔部1342。第三孔部1341的直径大于第四孔部1342的直径。其中，第四孔部1342连接于第二馈电枝节132的第一部分1321。在本实施例中，第二金属孔134的结构与第一金属孔133的结构相同。
在其他实施例中，第一馈电枝节131的结构也可以采用第二馈电枝节132的结构，也即第一馈电枝节131采用“条型”状。此时，通过将第一馈电枝节131和第二馈电枝节132采用不同层设置，也即第一馈电枝节131与接地层12之间的距离大于或者小于第二馈电枝节132与接地层12之间的距离，从而避免第一馈电枝节131和第二馈电枝节132短接。
请参阅图20和图21，并结合图19所示，图20是图3所示的天线结构10的部分结构示意图。图21是图20所示的天线结构10在B-B线的剖面示意图。第一金属孔133的第一孔部1331与接地层12的第一通孔121相对设置。第一金属孔133的第一孔部1331通过第一通孔121电连接于射频电路20(请参阅图3)。示例性地，第一孔部1331可以通过微带线、同轴线、带状线或者探针等导电结构电连接于射频电路20。第一孔部1331还与接地层12间隔设置，以避免与接地层12短接。
可以理解的是，由于第一馈电枝节131的第一部分1311与第五部分1313同层设置，第一馈电枝节131的第一部分1311与接地层12之间的距离，和第一馈电枝节131的第五部分1313与接地层12之间的距离相等。
另外，第一馈电枝节131的第一部分1311的一部分位于第一天线单元14a的第二金属层142朝向接地层12的一侧，也即位于第一天线单元14a的第一空间S1内。此外，第一馈电枝节131的第五部分1313的一部分位于第四天线单元14d的第二金属层182朝向接地层12的一侧，也即位于第四天线单元14d的第四空间S4内。此外，第一馈电枝节131的延伸方向平行于第一天线单元14a的第一金属层141的对角线M1，也即第一馈电枝节131的延伸方向与第二天线单元14b的第一金属层141的第一边1411之间的夹角可以为45°。此外，第一馈电枝节131的延伸方向还平行于第四天线单元14d的第一金属层181的对角线M4，也即第一馈电枝节131的延伸方向还与第四天线单元14d的第一金属层181的第一边1811之间的夹角可以为45°。
可以理解的是，当射频电路20发射射频信号时，射频信号可以经第一金属孔133、第一馈电枝节131的第一部分1311、第二部分1312a、第三部分1312b、第四部分1312c以及第五部分1313耦合馈电至第四天线单元14d的第二金属层182和第一金属层181。此时，接地层12、第三金属柱185、第一金属连接片186a、第二金属柱184、第二金属层182的第二区域182b、第二金属层182的第一区域182a、第一金属柱183以及第一金属层181所构成的电流路径具有电流传输。
此外，射频信号也可以经第一金属孔133以及第一馈电枝节131的第一部分1311耦合馈电至第一天线单元14a的第二金属层142和第一金属层141。此时，接地层12、第三金属柱145、第一金属连接片146a、第二金属柱144、第二金属层142的第二区域142b、第二金属层142的第一区域142a、第一金属柱143以及第一金属层141所构成的电流路径具有电流传输。
请参阅图22和图23，并结合图19所示，图22是图3所示的天线结构10的部分结构示意图。图23是图22所示的天线结构10在C-C线的剖面示意图。第二金属孔134的第三孔部1341与接地层12的第二通孔122相对设置。第二金属孔134的第三孔部1341通过第二通孔122电连接于射频电路20(请参阅图3)。示例性地，第三孔部1341可以通过微带线、同轴线、带状线或者探针等导电结构电连接于射频电路20。第三孔部1341还与接地层12间隔设置，以避免与接地层12短接。
在本实施方式中，第二馈电枝节132、第一馈电枝节131的第一部分1311以及第一馈电枝节131的第五部分1313同层设置，第二馈电枝节132与接地层12之间的距离、第一馈电枝节131的第一部分1311与接地层12之间的距离、以及第一馈电枝节131的第五部分1313与接地层12之间的距离均相等。
另外，第二馈电枝节132的第一部分1321的一部分位于第三天线单元14c的第二金属层172朝向接地层12的一侧，也即位于第三天线单元14c的第三空间S3内。第二馈电枝节132的第三部分1323的一部分位于第二天线单元14b的第二金属层162朝向接地层12的一侧，也即位于第二天线单元14b的第二空间S2内。第二馈电枝节132的延伸方向平行于第三天线单元14c的第一金属层141的对角线M3，也即第二馈电枝节132的延伸方向与第二天线单元14b的第一金属层171的第一边1711之间的夹角可以为45°。第二馈电枝节132的延伸方向还平行于第二天线单元14b的第一金属层161的对角线M2，也即第二馈电枝节132的延伸方向还与第二天线单元14b的第一金属层161的第一边1611之间的夹角可以为45°。
可以理解的是，当射频电路20发射射频信号时，射频信号可以经第二金属孔134、第二馈电枝节132的第一部分1321、第二部分1322以及第三部分1323耦合馈电至第二天线单元14b的第二金属层162和第一金属层161。此时，接地层12、第三金属柱165、第一金属连接片166a、第二金属柱164、第二金属层162的第二区域162b、第二金属层162的第一区域162a、第一金属柱163以及第一金属层161所构成的电流路径具有电流传输。
此外，射频信号也可以经第二金属孔134、第二馈电枝节132的第一部分1321耦合馈电至第三天线单元14c的第二金属层172和第一金属层171。此时，接地层12、第三金属柱175、第一金属连接片176a、第二金属柱174、第二金属层172的第二区域172b、第二金属层172的第一区域172a、第一金属柱173以及第一金属层171所构成的电流路径具有电流传输。
在其他实施例中，请再次参阅图21，第一馈电枝节131的第一部分1311可以直接连接于第一天线单元14a的第二金属层142。另外，第一馈电枝节131的第五部分1313可以直接连接于第四天线单元14d的第二金属层182。这样，当射频电路20发射射频信号时，射频信号可以经第一金属孔133、第一馈电枝节131的第一部分1311、第二部分1312a、第三部分1312b、第四部分1312c以及第五部分1313直接馈电至第四天线单元14d的第二金属层182和第一金属层181。此外，射频信号也可以经第一金属孔133以及第一馈电枝节131的第一部分1311直接馈电至第一天线单元14a的第二金属层142和第一金属层141。
在其他实施例中，请再次参阅图23，第二馈电枝节132的第一部分1321可以直接连接于第三天线单元14c的第二金属层172。第二馈电枝节132的第三部分1323直接连接于第二天线单元14b的第二金属层162。这样，当射频电路20发射射频信号时，射频信号可以经第二金属孔134、第二馈电枝节132的第一部分1321、第二部分1322以及第三部分1323直接馈电至第二天线单元14b的第二金属层162和第一金属层161。射频信号也可以经第二金属孔134、第二馈电枝节132的第一部分1321直接馈电至第三天线单元14c的第二金属层172和第一金属层171。
上文结合相关附图具体介绍了馈电单元13。下文将结合相关附图具体介绍匹配过孔组15的具体结构。
请参阅图24，图24是图3所示的天线结构10的部分结构示意图。多个匹配过孔组15电连接接地层12。多个匹配过孔组15位于第一天线单元14a、第二天线单元14b、第三天线单元14c以及第四天线单元14d的周边。多个匹配过孔组15位于接地层12的周缘，也即多个匹配过孔组15靠近接地层12的边缘设置。多个匹配过孔组15环绕第一天线单元14a、第二天线单元14b、第三天线单元14c以及第四天线单元14d设置。
示例性地，匹配过孔组15的数量为四组。四组匹配过孔组15分别位于接地层12的四个角部。本实施例以其中一组匹配过孔组15来为例来具体描述。
在本实施例中，匹配过孔组15包括第一匹配过孔151、第二匹配过孔152以及金属连接片153。第一匹配过孔151和第二匹配过孔152的结构设置可以参阅第一天线单元14a的第三金属柱145(请参阅图5)的结构设置。具体的这里不再赘述。
示例性地，第一匹配过孔151的数量为三个。第二匹配过孔152的数量为七个。金属连接片153的数量为七个。
其中，多个第一匹配过孔151间隔设置，且每个第一匹配过孔151的一端均连接于接地层12。示例性地，多个第一匹配过孔151排布成“L型”状。
另外。多个金属连接片153位于第一匹配过孔151远离接地层12的一侧，且依次间隔设置。其中一个金属连接片153连接于多个第一匹配过孔151。此时，第一匹配过孔151位于 金属连接片153与接地层12之间。
示例性地，每个金属连接片153均呈“L型”状。
另外，多个第二金属柱144间隔设置。多个第二匹配过孔152也排布成“L型”状。每个第二匹配过孔152均连接于每个金属连接片153。
可以理解的是，通过在接地层12上设有多个间隔设置的匹配过孔组15，匹配过孔组15可以增大天线单元14与接地层12的电流路径。匹配过孔组15可以用于调谐天线结构10的阻抗，以实现阻抗匹配。另外，由于匹配过孔组15可以增大天线单元14与接地层12的电流路径，本实施例的天线单元14和接地层12的尺寸可以做小，从而实现天线结构10的小型化设置。
在其他实施例中，匹配过孔组15也可以未包括第二匹配过孔152以及金属连接片153，也即匹配过孔组15只包括第一匹配过孔151。
请参阅图25a，图25a是本申请实施例的天线结构10的反射系数随频率变化的数据图。其中，图25a中实线代表S11曲线，S11曲线用于体现输入回波损耗。虚线代表S21曲线，S21曲线用于体现两个端口之间的隔离度。横坐标为频率，单位GHz，纵坐标单位为dB。天线结构10可以覆盖的频段范围为24.25GHz至43.5GHz。回波损耗在10dB以上，隔离度在15dB以上，满足天线性能需求。这样，天线结构10可以在工作频段24.25GHz-29.5GHz的范围内和37GHz-43.5GHz的范围内工作。天线结构10可以支持n257、n258、n259、n260和n261频段。
此外，天线结构10具有两个谐振频率(也称为中心频率)。两个谐振频率分别为24GHz和33GHz。
天线结构10对应的信号带宽△f＝43.5GHz-24.25GHz＝19.25GHz；
中心频率f0＝(43.5GHz+24.25GHz)/2＝33.875GHz；
则相对带宽ffoc1＝△f/f0＝19.25GHz/33.875GHz＝56.83％。天线结构10为宽带天线。
请参阅图25b,图25b是本申请实施例的天线结构10的一种极化示意图。其中，图25b中的箭头方向指的是电流方向。此外，箭头颜色的深浅指的是电流强度的大小。箭头颜色越深，电流强度越大。箭头颜色越浅，电流强度越小。天线结构10的第一种极化为天线结构10的-45°极化。天线结构10的大部分电流主要在第一天线单元14a和第四天线单元14d，小部分在第二天线单元14b和第三天线单元14c。第一天线单元14a上的电流沿对角线M1，并向靠近第四天线单元14d的方向流动。第四天线单元14d上的电流沿对角线M4，并向远离第一天线单元14a的方向流动。
请参阅图25c,图25c是本申请实施例的天线结构10的另一种极化示意图。其中，图25c中的箭头的方向指的是电流方向。此外，箭头颜色的深浅代表电流强度的大小。箭头颜色越深，电流强度越大。箭头颜色越浅，电流强度越小。天线结构10的第二种极化为天线结构10的+45°极化。天线结构10的大部分电流主要在第二天线单元14b和第三天线单元14c，小部分在第一天线单元14a和第四天线单元14d。第二天线单元14b上的电流沿对角线M2，并向远离第三天线单元14c的方向流动。第三天线单元14c上的电流沿对角线M3，并向靠近第二天线单元14b的方向流动。
由图25b和图25c可知，本实施方式的天线结构10具有两种极化方式，也即天线结构10具有双极化的特性。
请参阅图25d,图25d是本实施例的封装基板结构90的部分剖面示意图。封装基板结构90可以采用多层对称基板设置。封装基板结构90包括层叠设置的天线层91和半固化 (prepreg,PP)介质层92。天线层91用于设置图4至图24所示的天线结构10。PP介质层92内具有多层的走线。图25d通过粗线示意性地给出PP介质层92中的三层走线。PP介质层92内的走线的层数不做具体限定。其中，每一层走线可以通过金属孔或者金属柱电连接。PP介质层92的走线可以用于向天线层91提供射频信号走线、地线和电源走线等。当然，PP介质层92也可以用于向其他芯片或者器件提供信号走线、地线和电源走线等。另外，PP介质层92还可以用于垫高天线层91。例如，天线结构10通过后盖202的绝缘部分向电子设备1的外部辐射或者接收电磁波。PP介质层92可以使得天线结构10更靠近后盖202。
在本实施方式中，天线层91还包括层叠设置的芯板(也称core介质层)911和金属层912。core介质层911层叠设置于PP介质层92。core介质层911可以通过压合等方式连接于PP介质层92。金属层912包括介质部分和金属部分。介质部分可以全包裹或者半包裹金属部分。图25d通过粗线示意性给出金属层912中的三层的金属部分。金属层912中的金属部分的层数不做具体的限定。介质部分内可以用于设置金属孔或者金属柱，以电连接每层的金属部分。示例性地，PP介质层92可以关于core介质层911呈对称分布。
在本实施方式中，图4至图24所示的天线结构10设置在天线层91上。其中，天线结构10的各个天线单元14的第一金属层、第二金属层、第一金属柱、第二金属柱、第一金属连接片以及第二金属连接片均可以设置在金属层912上。另外，天线结构10的各个天线单元14的第三金属柱以及接地层12均可以设置在core介质层911上。
另外，馈电单元13的第一馈电枝节131、第二馈电枝节132、馈电单元13的第一金属孔133的第二孔部1332和馈电单元13的第二金属孔134的第四孔部1342均可以设置在金属层912上。馈电单元13的第一金属孔133的第一孔部1331和馈电单元13的第二金属孔134的第三孔部1341均可以设置在core介质层911上。馈电单元13的第一金属孔133的第一孔部1331和馈电单元13的第二金属孔134的第三孔部1341可以通过PP介质层92的信号走线、地线、电源线电连接于射频收发芯片21。
另外，匹配过孔组15的第一匹配过孔151以及金属连接片153均可以设置在金属层912上。匹配过孔组15的第二匹配过孔152可以设置在core介质层911上。
与图4至图24所示意的实施方式相同或者相似的技术内容不再赘述：请参阅图26，图26是本申请实施例提供的第一天线单元14a的第一金属连接片146a和第二金属连接片146b的另一种实施方式的结构示意图。第一金属连接片146a包括间隔设置的第三区域1463a和第四区域1463b。图26通过虚线示意性地区分第三区域1463a和第四区域1463b。其中，部分第三区域1463a位于第一金属连接片146a的第一连接部分1461，部分第三区域1463a位于第一金属连接片146a的第二连接部分1462。部分第四区域1463b位于第一金属连接片146a的第一连接部分1461，部分第四区域1463b位于第一金属连接片146a的第二连接部分1462。示例性地，第三区域1463a和第四区域1463b的形状均可以为“L型”状。在其他实施例中，第三区域1463a和第四区域1463b的形状不做具体地限定。
可以理解的是，相较于第一种实施方式的第一金属连接片146a的第一连接部分1461的宽度a1和的第二连接部分1462的宽度a2，本实施方式的第一金属连接片146a的第一连接部分1461的宽度a1和第二连接部分1462的宽度a2较长。另外，本实施方式的第二金属连接片146b可以参阅第一种实施方式的第二金属连接片146b的设置方式。这里不再赘述。
请参阅图27，并结合图26，图27是本申请实施例提供的天线结构10的另一种实施方式的部分结构示意图。第二金属柱144连接于第一金属连接片146a的第三区域1463a。第三金属柱145的一端连接于第一金属连接片146a的第四区域1463b。这样，第二金属柱144与第 三金属柱145在第一金属连接片146a上分成两个区域间隔设置，也即第二金属柱144在第一金属连接片146a的投影与第三金属柱145与第一金属连接片146a的投影错开(也即没有重叠的部分)。
请参阅图28，并结合图26和图27，图28是本申请实施例提供的天线结构10的另一种实施方式的部分剖面示意图。当第一天线单元14a处于工作状态时，电流路径(图28通过粗线条简单地示意)包括接地层12、第三金属柱145、第一金属连接片146a的第四区域1463b、第一金属连接片146a的第三区域1463a、第二金属柱144、第二金属层142、第一金属柱143以及第一金属层141。此时，由于电流可以在第一金属连接片146a的第四区域1463b和第一金属连接片146a的第三区域1463a之间传输，以及在第二金属层142上两个区域之间传输，电流路径呈两次弯折设置。相较于第一种实施方式的电流路径，本实施方式的天线结构10的剖面高度H可以做得更低。这样，天线结构10的薄型化设置更容易实现。
示例性地，当电流路径的长度(也即电长度等于天线结构10的剖面高度H与第二金属层142的边长之和)在0.25λ0至0.32λ0的范围内时，本实施例的天线结构10的剖面高度H可以在0.1λ0至0.15λ0的范围内。
请参阅图29，图29是本申请实施例提供的天线结构10的另一种实施方式的结构示意图。第二天线单元14b、第三天线单元14c和第四天线单元14d的设置方式均可以参阅第一天线单元14a的设置方式。具体的这里不再赘述。
可以理解的是，本实施方式的第一天线单元14a、第二天线单元14b、第三天线单元14c和第四天线单元14d的电流路径均可以呈两次弯折设置。这样，天线结构10的剖面高度H不仅可以做得更低，第一缝隙191、第二缝隙192、第三缝隙193以及第四缝隙194的宽度也可以做得更小。示例性地，第一缝隙191、第二缝隙192、第三缝隙193以及第四缝隙194的宽度均可以在0.03λ0至0.1λ0的范围内。这样，天线结构10的小型化设置更容易实现。
在其他实施例中，第一天线单元14a还可以包括第三金属连接片、第四金属连接片、第五金属连接片、……、第m金属连接片，其中m为整数，且大于2。第m金属连接片的设置方式可以参阅第一金属连接片146a的设置方式。另外，第一天线单元14a还可以包括第四金属柱、第五金属柱、……、第n金属柱，其中n为整数，且大于3。这样，通过第m金属连接片和第n金属柱的设置，从而实现第一天线单元14a的电流路径呈多次弯折设置，从而进一步地降低天线结构10的剖面高度H和第一缝隙191、第二缝隙192、第三缝隙193以及第四缝隙194的宽度。
请再次参阅图29，天线结构10还包括多个金属短接孔组19。多个金属短接孔组19电连接接地层12。多个金属短接孔组19位于第一天线单元14a、第二天线单元14b、第三天线单元14c以及第四天线单元14d的周边。
示例性地，金属短接孔组19的数量为四组。一组金属短接孔组19位于第一天线单元14a与第二天线单元14b的同一侧，且设置在第一缝隙191的延伸方向上。一组金属短接孔组19与第一缝隙191相对设置。一组金属短接孔组19位于第一天线单元14a与第三天线单元14c的同一侧，且设置在第二缝隙192的延伸方向上。一组金属短接孔组19与第二缝隙192相对设置。一组金属短接孔组19位于第三天线单元14c与第四天线单元14d的同一侧，且设置在第三缝隙193的延伸方向上。一组金属短接孔组19与第三缝隙193相对设置。一组金属短接孔组19位于第四天线单元14d与第二天线单元14b的同一侧。，且设置在第四缝隙194的延伸方向上。一组金属短接孔组19与第四缝隙194相对。
本实施例以位于第四天线单元14d与第二天线单元14b的同一侧的金属短接孔组19来为 例来具体描述。
在本实施例中，金属短接孔组19包括第一短接孔197、第二短接孔198、第一金属片199a以及第二金属片199b。第一短接孔191和第二短接孔198的结构设置可以参阅第一天线单元14a的第三金属柱145(请参阅图5)的结构设置。具体的这里不再赘述。
示例性地，第一短接孔191的数量为一个。第二短接孔198的数量为两个。第一金属片199a以及第二金属片199b的数量均为一个。
其中，第一短接孔197的一端连接于接地层12，另一端连接于第一金属片199a。此时，第一短接孔197位于接地层12与第一金属片199a之间。第二短接孔198的一端连接于第一金属片199a，另一端连接于第二金属片199b。此时，第二短接孔198位于第一金属片199a和第二金属片199b之间。
示例性地，第一短接孔197与第二短接孔198可以在第一金属片199a上分成两个区域间隔设置。具体地可以参阅本实施方式中的第二金属柱144与第三金属柱145在第一金属连接片146a上分成两个区域间隔设置的方式。
请参阅图30a，图30a是本申请实施例的天线结构10的反射系数随频率变化的数据图。其中，图30a中实线代表S11曲线，S11曲线用于体现输入回波损耗。虚线代表S21曲线，S21曲线用于体现两个端口之间的隔离度。横坐标为频率，单位GHz，纵坐标单位为dB。如图30a所示，天线结构10可以覆盖的频段范围为24.25GHz至43.5GHz。回波损耗在10dB以上，隔离度在15dB以上，满足天线性能需求。这样，天线结构10可以在工作频段24.25GHz-29.5GHz的范围内和37GHz-43.5GHz的范围内工作。天线结构10可以支持n257、n258、n259、n260和n261频段。
另外，由图30a的S11曲线可知，当天线结构10具有金属短接孔组19时，天线结构10具有四个谐振频率，分别为24GHz、32GHz、37GHz和44GHz。可以理解的是，一方面，在n257、n258、n259、n260和n261频段范围内，天线结构10增加了一个谐振点(谐振频率为44GHz)。另一方面，在n257、n258、n259、n260和n261的频段范围内，天线结构10增加了一个陷波点(频率大致为35GHz)。此时，第一个实施方式的谐振频率(33GHz)可以分裂两个谐振频率(32GHz、37GHz)。
请参阅图30b，图30b是本申请实施例的天线结构10在n259频段下的电流示意图。其中，图30b中的小箭头方向指的是天线结构10的各位置的电流方向。此外，小箭头颜色的深浅指的是电流强度的大小。小箭头颜色越深，电流强度越大。小箭头颜色越浅，电流强度越小。图30b中的大箭头方向指的是天线单元14一侧的整体电流方向。根据图30b可知，天线结构10在44GHz下，天线结构10的周边产生的电流。其中，天线结构10同一侧的电流方向基本相同。例如，天线结构10的左侧的电流方向大致朝上，也即第一天线单元14a左侧的电流方向和第三天线单元14c左侧的电流方向均朝上。图30b通过实线的大箭头表示。
请参阅图30c，图30c是本申请实施例的天线结构10在n259频段下的电场示意图。图30c中的箭头方向指的是电场方向。此外，箭头颜色的深浅指的是电场强度的大小。箭头颜色越深，电场强度越大。箭头颜色越浅，电场强度越小。根据图30c可知，天线结构10在44GHz下，天线结构10的周边产生的电场。其中，天线结构10同一侧的电场方向呈“反正反”分布。例如，天线结构10的左侧的电场分布包括第一区域M1、第二区域M2以及第三区域M3。第一区域M1的电场方向朝上。第二区域M2的电场方向朝下。第三区域M3的电场方向朝上。以第一区域M1的电场方向朝上为正。第二区域M2的电场方向朝下为负。可以理解的是，第二区域M2的电场分布较小，因此天线结构10在高阶模式(也即谐振频率为44GHz) 可以正常工作。
可以理解的是，由图30b和图30c可知，天线结构10在44GHz谐振位置，由于天线结构10设置有金属短接孔组19，天线结构10引入了高阶的场型，电流基本同向，天线结构10添加了新的谐振点(44GHz)。
请参阅图30d，图30d是本申请实施例的天线结构10在n260频段下的电流示意图。其中，图30d中的小箭头方向指的是天线结构10的各位置的电流方向。此外，小箭头颜色的深浅指的是电流强度的大小。小箭头颜色越深，电流强度越大。小箭头颜色越浅，电流强度越小。图30d中的大箭头方向指的是天线单元14一侧的整体电流方向。根据图30d可知，天线结构10在35GHz下，天线结构10的周边产生的电流。其中，天线结构10同一侧的电流方向基本相反。例如，天线结构10的左侧的电流方向相反，也即第一天线单元14a左侧的电流方向朝下(图30d通过虚线的大箭头表示)，第三天线单元14c左侧的电流方向朝上(图30b通过实线的大箭头表示)。
请参阅图30e，图30e是本申请实施例的天线结构10在n260频段下的电场示意图。图30e中的箭头方向指的是电场方向。此外，箭头颜色的深浅指的是电场强度的大小。箭头颜色越深，电场强度越大。箭头颜色越浅，电场强度越小。其中，天线结构10同一侧的电场方向呈“反正”分布。例如，天线结构10的左侧的电场分布包括第一区域M1和第二区域M2。第一区域M1的电场方向朝下。第二区域M2的电场方向朝上。以第一区域M1的电场方向朝下为负。第二区域M2的电场方向朝上为正。此时，电场方向呈“反正”分布。天线结构10为高阶抵消模式。
可以理解的是，根据图30d和图30e可知，在35GHz陷波点位置，由于天线结构10设置有金属短接孔组19，天线结构10引入了反向的场型模式，此时电流反向，产生陷波点，同时由于陷波点的存在，将原先位置的谐振模式一分为二，构成两个谐振点，因此图30a的S11上会多出一个谐振与一个陷波点。
请参阅图31，图31是本申请实施例提供的天线结构10的再一种实施方式的结构示意图。本实施方式的第一天线单元14a、第二天线单元14b、第三天线单元14c与第四天线单元14d的电流路径均采用一次弯折设置。具体地，第一天线单元14a、第二天线单元14b、第三天线单元14c与第四天线单元14d的设置方式可以参阅图4至图24所描述的第一天线单元14a、第二天线单元14b、第三天线单元14c与第四天线单元14d的设置方式。这里不再赘述。
另外，本实施方式的天线结构10还包括多个金属短接孔组19。金属短接孔组19的设置方式可以参阅图29所描述的金属短接孔组19。这里不再赘述。
请参阅图32a，图32a是本申请实施例的天线结构10的反射系数随频率变化的数据图。其中，图32a中实线代表S11曲线，S11曲线用于体现输入回波损耗。虚线代表S21曲线，S21曲线用于体现两个端口之间的隔离度。横坐标为频率，单位GHz，纵坐标单位为dB。如32a所示，天线结构10可以覆盖的频段范围为24.25GHz至43.5GHz。另外，回波损耗在10dB以上，隔离度在15dB以上，满足天线性能需求。这样，天线结构10可以在工作频段24.25GHz-29.5GHz的范围内和37GHz-43.5GHz的范围内工作。天线结构10可以支持n257、n258、n259、n260和n261频段。
请参阅图32b，图32b是本申请实施例提供的芯片1的剖面示意图。本实施例的芯片1可以是基于AiP(AiP，Antenna-in-Package)方案的芯片。
其中，芯片1包括天线结构10、芯片本体40、封装基板51和注塑件52。天线结构10和芯片本体40均设置于封装基板51，且电连接于封装基板51。注塑件52封装天线结构10 和芯片本体40。示例性地，注塑件52全包裹天线结构10。注塑件52全包裹芯片本体40。在其他实施例中，注塑件52也可以半包裹天线结构10。注塑件52也可以半包裹芯片本体40。其中，天线结构10可以参阅图4至图24的天线结构10，或者图26至图29所示的天线结构10，或者图31所示的天线结构10。这里不再赘述。
示例性地，芯片本体40为射频收发芯片。天线结构10可以通过封装基板51电连接于芯片本体40。此时，芯片本体40通过封装基板51向天线结构10发射射频信号，以使天线结构10根据射频信号辐射电磁波。此外，当天线结构10接收到电磁波，并将电磁波转换成射频信号时，芯片本体40还可以接收天线结构10所转换的射频信号。
示例性地，封装基板51还可以设置有匹配电路(图未示)。匹配电路电连接于天线结构10与芯片本体40之间。
在其他实施方式中，芯片也可以基于AiM(Antenna in Module)方案的芯片、或者基于AoC(Antenna-on-Chip)方案的芯片。
在本实施例中，芯片1可以应用于电子设备中。具体地，芯片1可以设置于电子设备的电路板。芯片1的封装基板51可以电连接于电路板。
可以理解的是，本实施方式通过将天线结构10设置于封装基板51上，并通过注塑件52包裹，从而使得天线结构10、芯片本体40以及封装件50的整体性较佳。请参阅图33，图33是本申请实施例提供的电子设备1的另一种实施例的结构示意图。电子设备1可以是基站、CPE(Customer Premise Equipment)、无线访问点设备(例如，无线路由器)或者用于发射非毫米波信号(例如低频信号)的设备。图33所示实施例的电子设备1以基站为例进行阐述。
其中，电子设备1具有天线结构10。需要说明的是，由于天线结构10位于电子设备1的内部，图33通过虚线示意了天线结构10。示例性地，本实施例的天线结构10覆盖的频段可以为1.5GHz-3GHz。在其他实施例中，天线结构10也可以覆盖其他频段。
请参阅图34，图34是图33所示的天线结构10的分解示意图。天线结构10包括介质层11、接地层12、馈电单元13、多个天线单元14以及多个匹配金属墙15。其中，介质层11、接地层12以及馈电单元13的设置方式可以参阅上文实施方式的介质层11、接地层12以及馈电单元13的设置方式。具体地，这里不再赘述。在其他实施例中，介质层11、接地层12以及馈电单元13的尺寸、形状等可以根据实际需求灵活设置。
请参阅图35，图35是图34所示的第一天线单元14a的分解示意图。第一天线单元14a包括第一金属层141、第二金属层142、第一金属墙143、第二金属墙144、第三金属墙145以及金属连接片146。其中，第一金属墙143构成本实施方式的第一导电件。第二金属墙144、第三金属墙145以及金属连接片146构成本实施方式的第二导电件。
在本实施方式中，第一金属层141、第二金属层142的设置方式可以参阅上文各个实施方式的第一金属层141、第二金属层142的设置方式。具体地，这里不再赘述。其中，第一金属层141、第二金属层142的尺寸、形状等可以根据实际需求灵活设置。
示例性地，第一金属墙143、第二金属墙144、第三金属墙145以及金属连接片146均呈“L型”状。在其他实施方式中，第一金属墙143、第二金属墙144、第三金属墙145以及金属连接片146也可以均呈弧形状。
其中，第二金属层142包括间隔设置的第一区域142a和第二区域142b。图35通过虚线示意性地区分第一区域142a和第二区域142b。
示例性地，第一区域142a和第二区域142b均呈“L型”状。第一区域142a包括第二金属层142的第一边1421和第三边1423。第二区域142b包括第二金属层142的第二边1422 和第四边1424。
其中，金属连接片146包括间隔设置的第三区域1463a和第四区域1463b。图35通过虚线示意性地区分第三区域1463a和第四区域1463b。
示例性地，第三区域1463a和第四区域1463b的形状均可以为“L型”状。
请参阅图36及图37，并结合图35所示，图36是图33所示的天线结构10的部分结构示意图。图37是图33所示的天线结构10的部分结构示意图。第三金属墙145的一端连接于接地层12，另一端连接于金属连接片146的第四区域1463b，也即第三金属墙145连接于接地层12与金属连接片146的第四区域1463b之间。第二金属墙144的一端连接于金属连接片146的第三区域1463a，另一端连接于第二金属层142的第二区域142b，也即第二金属墙144连接于金属连接片146的第三区域1463a和第二金属层142的第二区域142b之间。第一金属墙143的一端连接于第二金属层142的第一区域142a，另一端连接于第一金属层141，也即第一金属墙143连接于第二金属层142的第一区域142a与第一金属层141之间。
在本实施方式中，第三金属墙145在金属连接片146的投影与第二金属墙144在金属连接片146的投影错开。此外，第二金属墙144在第二金属层142投影与第一金属墙143在第二金属层142投影错开。在其他实施方式中，第三金属墙145在金属连接片146的投影与第二金属墙144在金属连接片146的投影至少部分重叠。
示例性地，第二金属层142的第一边1421和第一金属层141的第一边1411相对设置。第二金属层142的第三边1423和第一金属层141的第三边1413相对设置。
其中，第二金属层142、第一金属墙143、第二金属墙144、第三金属墙145、金属连接片146以及接地层12围出第一空间S1。可以理解的是，第一空间S1可以用于设置天线结构10的其他部件。这样，一方面，天线结构10的空间率较高。另一方面，天线结构10可以紧凑设置，从而有利于天线结构10的小型化设置。
在本实施例中，通过将第二金属墙144与第三金属墙145在金属连接片146上分成两个区域间隔设置，将第一金属墙143与第二金属墙144在第二金属层142上分成两个区域间隔设置，从而当第一天线单元14a处于工作状态时，电流路径包括接地层12、第三金属墙145、金属连接片146、第二金属墙144、第二金属层142、第一金属墙143以及第一金属层141。由于电流可以在金属连接片146的第三区域1463a和第四区域1463b之间传输，以及在第二金属层142的第一区域142a和第二区域142b之间传输，电流路径可以呈两次弯折设置。这样，相较于在相同电流路径的天线结构中，且天线结构的电流路径为直线型时，本实施例的天线结构10的剖面高度H较低，可以有利于天线结构10的小型化设置。
在其他实施方式中，第一天线单元14a也可以未包括第三金属墙145以及金属连接片146。此时，第二金属墙144直接连接于接地层12。这样，第一天线单元14a的电流路径呈一次弯折设置。
在其他实施方式中，第一天线单元14a还可以包括第二金属连接片、第三金属连接片、……、第m金属连接片，其中m为整数，且大于1。第m金属连接片的设置方式可以参阅金属连接片146a的设置方式。另外，第一天线单元14a还可以包括第四金属墙、第五金属墙、……、第n金属墙，其中n为整数，且大于3。这样，通过第m金属连接片和第n金属墙的设置，从而实现第一天线单元14a的电流路径呈多次弯折设置。
示例性地，第一天线单元14a可以是对称结构、或部分对称结构、或者相同或相似结构或者不同结构。在本实施例中，第一天线单元14a为对称结构。具体地，请再次参阅图37，第一天线单元14a关于第一天线单元14a的对称面对称。其中，第一天线单元14a的对称面 垂直于第一金属层141的所在平面，且第一金属层141的对角线M1位于第一天线单元14a的对称面。
请参阅图38，图38是图33所示的天线结构10的结构示意图。第二天线单元14b、第三天线单元14c和第四天线单元14d的设置方式可以参阅第一天线单元14a的设置方式。此外，第一天线单元14a、第二天线单元14b、第三天线单元14c和第四天线单元14d的位置关系以及连接关系也可以参阅第一种实施例的第一天线单元14a、第二天线单元14b、第三天线单元14c和第四天线单元14d的位置关系和连接关系。具体的这里不再赘述。
在本实施例中，通过紧凑地设置天线单元14的各部分结构，从而在天线结构10中开辟出新的空间，也即在天线结构10中围出第一空间S1(请参阅图36)、第二空间S2(请参阅图36)、第三空间(图未示)和第四空间(图未示)。可以理解的是，第一空间S1、第二空间S2、第三空间和第四空间可以用于设置天线结构10的其他部件。这样，一方面，天线结构10的空间率较高。另一方面，天线结构10的结构较为紧凑，从而有利于天线结构10的小型化设置。另外，设置天线结构10的电流路径呈两次弯折设置。这样，相较于在相同电流路径的天线结构中，且天线结构的电流路径为直线型时，本实施例的天线结构10的剖面高度H不仅较低，天线结构10的第一缝隙191、第二缝隙192、第三缝隙193以及第四缝隙194的宽度也较低。
示例性地，第二天线单元14b与第一天线单元14a可以是对称结构、或部分对称结构、或者相同或相似结构或者不同结构。第二天线单元14b与第一天线单元14a为对称结构。具体地，第二天线单元14b关于第一对称面与第一天线单元14a对称。其中，第一对称面垂直于第一天线单元14a的第一金属层141的所在平面，且第一天线单元14a和第二天线单元14b之间的中心面N1位于第一对称面。
示例性地，第三天线单元14c与第一天线单元14a可以是对称结构、或部分对称结构、或者相同或相似结构或者不同结构。在本实施例中，第三天线单元14c与第一天线单元14a为对称结构。具体地，第三天线单元14c关于第二对称面与第一天线单元14a对称。其中，第二对称面垂直于第三天线单元14c的第一金属层171的所在平面，且第一天线单元14a和第三天线单元14c之间的中心面N2位于第二对称面。
示例性地，第四天线单元14d与第三天线单元14c可以是对称结构、或部分对称结构、或者相同或相似结构或者不同结构。在本实施例中，第四天线单元14d与第三天线单元14c为对称结构。具体地，第四天线单元14d关于第一对称面与第三天线单元14c对称。其中，中心面N1也为第四天线单元14d与第三天线单元14c的中心线。
示例性地，第四天线单元14d与第二天线单元14b可以是对称结构、或部分对称结构、或者相同或相似结构或者不同结构。在本实施例中，第四天线单元14d与第二天线单元14b为对称结构。具体地，第四天线单元14d关于第二对称面与第二天线单元14b对称。其中，中心面N2也为第二天线单元14b和第四天线单元14d的中心线。
示例性地，第一天线单元14a、第二天线单元14b、第三天线单元14c和第四天线单元14d可以是中心对称结构、或部分中心对称结构、或者相同或相似结构或者不同结构。在本实施例中，第一天线单元14a、第二天线单元14b、第三天线单元14c和第四天线单元14d关于中心轴呈中心对称。其中，中心轴为中心面N1和中心面N2的交点。
请再次参阅图38，多个匹配金属墙15位于接地层12的周缘，也即多个匹配金属墙15靠近接地层12的边缘设置。多个匹配金属墙15环绕接地层12的周缘设置。
示例性地，匹配金属墙15的数量为四个。四个匹配金属墙15分别位于接地层12的四个 角部。示例性地，每个匹配金属墙15均呈“L型”状或者弧形状。
可以理解的是，通过在接地层12上设有多个间隔设置的匹配金属墙15，匹配金属墙15可以增大天线单元14与接地层12的电流路径。匹配金属墙15可以用于调谐天线结构10的阻抗，以实现阻抗匹配。另外，由于匹配金属墙15可以增大天线单元14与接地层12的电流路径，本实施例的天线单元14和接地层12的尺寸可以做小，从而实现天线结构10的小型化设置。
在其他实施方式中，本实施例的天线结构10也可以参阅第一种实施例的第二实施方式的天线结构10的设置方式。此时，天线结构10的电流路径可以呈多次弯折设置。另外，天线结构10还具有金属短接孔组19，此时，天线结构10可以进一步提升带宽能力同时增加陷波点。
在其他实施方式中，本实施例的天线结构10也可以参阅第一种实施例的第三实施方式的天线结构10的设置方式。例如，天线结构10还具有金属短接孔组19。
以上所述，仅为本申请的具体实现方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以所述权利要求的保护范围为准。

Claims (20)

  1. 一种天线结构，其特征在于，包括接地层、馈电单元以及天线单元；
    所述天线单元包括第一金属层、第二金属层、第一导电件以及第二导电件，所述第一金属层与所述接地层相对设置且彼此间隔，所述第二金属层位于所述第一金属层与所述接地层之间，且与所述第一金属层与所述接地层均间隔设置，所述第二金属层包括间隔设置的第一区域和第二区域，所述第一导电件连接于所述第一金属层与所述第二金属层的第一区域之间，所述第二导电件连接于所述接地层与所述第二金属层的第二区域之间；
    所述馈电单元位于所述第二金属层朝向所述接地层的一侧，所述馈电单元用于向所述第二金属层和所述第一金属层馈电。
  2. 根据权利要求1所述的天线结构，其特征在于，所述第一导电件为多个第一金属柱；
    所述第二导电件包括第一金属连接片、多个第二金属柱以及多个第三金属柱，所述第一金属连接片位于所述第二金属层与所述接地层之间，多个所述第二金属柱连接于所述第一金属连接片与所述第二金属层的第二区域之间，多个所述第三金属柱连接于所述第一金属连接片与所述接地层之间。
  3. 根据权利要求2所述的天线结构，其特征在于，所述第三金属柱的直径大于所述第二金属柱的直径。
  4. 根据权利要求2或3所述的天线结构，其特征在于，多个所述第一金属柱排布成L型或者弧形，所述第一金属连接片呈L型或者弧形，多个所述第二金属柱排布成L型或者弧形，以及多个所述第三金属柱排布成L型或者弧形。
  5. 根据权利要求2至4中任一项所述的天线结构，其特征在于，所述第三金属柱在所述第一金属连接片的投影与所述第二金属柱在所述第一金属连接片的投影至少部分重合。
  6. 根据权利要求2至4中任一项所述的天线结构，其特征在于，所述第一金属连接片包括间隔设置的第三区域和第四区域；
    所述第二金属柱连接于所述第一金属连接片的第三区域与所述第二金属层的第二区域之间，所述第三金属柱连接于所述第一金属连接片的第四区域与所述接地层之间。
  7. 根据权利要求1至6中任一项所述的天线结构，其特征在于，所述天线单元的数量为四个，四个所述天线单元呈2行2列间隔排布，四个所述天线单元具有中心点，四个所述天线单元分别为第一天线单元、第二天线单元、第三天线单元以及第四天线单元；
    所述第一天线单元的第二导电件位于所述第一天线单元的第一导电件远离所述中心点的一侧，所述第二天线单元的第二导电件位于所述第二天线单元的第一导电件远离所述中心点的一侧，所述第三天线单元的第二导电件位于所述第三天线单元的第一导电件远离所述中心点的一侧，所述第四天线单元的第二导电件位于所述第四天线单元的第一导电件远离所述中心点的一侧；
    所述馈电单元位于所述第一天线单元的第二导电件、所述第二天线单元的第二导电件、所述第三天线单元的第二导电件和所述第四天线单元的第二导电件所围成的空间。
  8. 根据权利要求7所述的天线结构，其特征在于，所述第一天线单元、所述第二天线单元、所述第三天线单元以及所述第四天线单元呈中心对称结构。
  9. 根据权利要求7或8所述的天线结构，其特征在于，所述馈电单元包括间隔设置的第一馈电枝节以及第二馈电枝节；
    所述第一馈电枝节的一端位于所述第一天线单元的第二金属层朝向所述接地层的一侧，所述第一馈电枝节的另一端位于所述第四天线单元的第二金属层朝向所述接地层的一侧，所述第一馈电枝节用于向所述第一天线单元的第二金属层、所述第一天线单元的第一金属层、所述第四天线单元的第二金属层以及所述第四天线单元的第一金属层馈电；
    所述第二馈电枝节的一端位于所述第二天线单元的第二金属层朝向所述接地层的一侧，所述第二馈电枝节的另一端位于所述第三天线单元的第二金属层朝向所述接地层的一侧，所述第二馈电枝节用于向所述第二天线单元的第二金属层、所述第二天线单元的第一金属层、所述第三天线单元的第二金属层以及所述第三天线单元的第一金属层馈电。
  10. 根据权利要求9所述的天线结构，其特征在于，所述第一天线单元、所述第二天线单元、所述第三天线单元以及所述第四天线单元均为对称结构，所述第一天线单元的对称面、所述第二天线单元的对称面、所述第三天线单元的对称面以及所述第四天线单元的对称面均经过所述中心点；
    所述第一馈电枝节的延伸方向平行于所述第一天线单元的对称面和所述第四天线单元的对称面，所述第二馈电枝节的延伸方向平行于所述第二天线单元的对称面和所述第三天线单元的对称面。
  11. 根据权利要求9或10所述的天线结构，其特征在于，所述第一馈电枝节包括依次连接的第一部分、第二部分、第三部分、第四部分以及第五部分；所述第一部分与所述接地层之间的距离、所述第五部分与所述接地层之间的距离和所述第二馈电枝节与所述接地层之间的距离均相等，所述第二部分、所述第三部分和所述第四部分呈“U型”状，所述第三部分位于所述第二馈电枝节与所述接地层之间。
  12. 根据权利要求9或10所述的天线结构，其特征在于，所述第一馈电枝节与所述接地层之间的距离大于或者小于所述第二馈电枝节与所述接地层之间的距离。
  13. 根据权利要求7至12中任一项所述的天线结构，其特征在于，所述天线结构还包括多个金属短接孔组，多个所述金属短接孔组电连接所述接地层，且位于所述第一天线单元、所述第二天线单元、所述第三天线单元以及所述第四天线单元的周边；
    所述第一天线单元与所述第二天线单元形成第一缝隙，所述第一缝隙与至少一个所述金属短接孔组设置在所述第一缝隙的延伸方向上，所述第一天线单元与所述第三天线单元形成第二缝隙，至少一个所述金属短接孔组设置在所述第二缝隙的延伸方向上，所述第三天线单元与所述第四天线单元形成第三缝隙，至少一个所述金属短接孔组设置在所述第三缝隙的延伸方向上，所述第四天线单元与所述第二天线单元形成第四缝隙，至少一个所述金属短接孔组设置在所述第四缝隙的延伸方向上。
  14. 根据权利要求1至13中任一项所述的天线结构，其特征在于，所述天线结构还包括多个匹配过孔组，多个所述匹配过孔组电连接所述接地层，多个所述匹配过孔组位于所述天线单元的周边，多个所述匹配过孔组环绕所述天线单元设置。
  15. 根据权利要求1至14中任一项所述的天线结构，其特征在于，所述天线结构还包括介质层，所述接地层、所述馈电单元以及所述天线单元均设置于所述介质层。
  16. 一种天线模组，其特征在于，包括射频电路以及如权利要求1至15中任一项所述的天线结构，所述射频电路电连接于所述天线结构的馈电单元。
  17. 一种电子设备，其特征在于，包括电路板以及如权利要求16所述的天线模组，所述天线模组设置于所述电路板。
  18. 一种芯片，其特征在于，包括封装基板、注塑件、芯片本体以及如权利要求1至15中任一项所述的天线结构，所述天线结构和所述芯片本体均设置于所述封装基板，且电连接于所述封装基板，所述注塑件用于封装所述天线结构和所述芯片本体。
  19. 根据权利要求18所述的芯片，其特征在于，所述芯片本体为射频收发芯片，所述天线结构通过所述封装基板电连接于所述芯片本体。
  20. 一种电子设备，其特征在于，包括电路板以及如权利要求18或19所述的芯片，所述芯片设置于所述电路板。
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117239426A (zh) * 2023-11-07 2023-12-15 微网优联科技(成都)有限公司 一种基于磁电偶极子的圆极化卫星天线
WO2025129399A1 (zh) * 2023-12-18 2025-06-26 深圳市韶音科技有限公司 天线、天线组件和耳机

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN218182468U (zh) * 2022-06-13 2022-12-30 华为技术有限公司 天线装置及移动终端
CN120184576B (zh) * 2025-05-20 2025-09-05 杭州电子科技大学 一种基于天线增强器的系统地平面集成准各向同性天线

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005197776A (ja) * 2003-12-26 2005-07-21 Furukawa Electric Co Ltd:The 多周波共用アンテナ及び２周波共用アンテナ
CN102270780A (zh) * 2011-07-28 2011-12-07 四川九洲电器集团有限责任公司 一种工作于毫米波l频段的宽频带一体化全向天线
CN106463466A (zh) * 2014-05-06 2017-02-22 英特尔公司 具有集成天线的多层封装件
CN108183329A (zh) * 2018-01-05 2018-06-19 山西大学 一种低剖面单向辐射差分超宽带天线
CN209266562U (zh) * 2018-11-19 2019-08-16 中国电子科技集团公司第十四研究所 介质集成波导槽耦合腔体天线

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002029928A2 (en) * 2000-10-02 2002-04-11 Israel Aircraft Industries Ltd. Slot spiral miniaturized antenna
US7145511B2 (en) * 2004-10-05 2006-12-05 Industrial Technology Research Institute Apparatus of antenna with heat slug and its fabricating process
US10992022B2 (en) * 2016-04-01 2021-04-27 Sony Corporation Microwave antenna apparatus, packing and manufacturing method
KR101870421B1 (ko) * 2016-12-01 2018-06-26 주식회사 네패스 Ems 안테나 모듈 및 그 제조방법과 이를 포함하는 반도체 패키지
CN107069199B (zh) * 2017-01-25 2019-03-29 江西理工大学 一种基于三叉树弧形分形结构的偶极子贴片天线
AU2017413139B2 (en) * 2017-05-12 2021-05-13 Huawei Technologies Co., Ltd. Communication device
US10510693B2 (en) * 2017-09-28 2019-12-17 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor package structure
KR102486593B1 (ko) * 2017-12-19 2023-01-10 삼성전자 주식회사 수직편파 방사를 지원하는 안테나 모듈 및 이를 포함하는 전자장치
US10424550B2 (en) * 2017-12-19 2019-09-24 National Chung Shan Institute Of Science And Technology Multi-band antenna package structure, manufacturing method thereof and communication device
KR102022353B1 (ko) * 2018-01-18 2019-09-18 삼성전기주식회사 안테나 모듈
US10483648B2 (en) * 2018-03-27 2019-11-19 The Mitre Corporation Cavity-backed annular slot antenna array
KR102526400B1 (ko) * 2018-09-06 2023-04-28 삼성전자주식회사 5g 안테나 모듈을 포함하는 전자 장치
KR102587773B1 (ko) * 2018-12-31 2023-10-12 삼성전자주식회사 안테나 모듈을 포함하는 전자 장치
CN112490646B (zh) * 2019-09-12 2023-12-15 华为技术有限公司 一种天线和天线的加工方法
CN112751180B (zh) * 2019-10-31 2022-03-22 Oppo广东移动通信有限公司 天线模组及电子设备
CN111509376A (zh) * 2019-12-20 2020-08-07 瑞声科技(新加坡)有限公司 一种天线单元、封装模组及电子设备
CN113054403B (zh) * 2019-12-26 2022-06-10 华为技术有限公司 电子设备
CN111180886B (zh) * 2020-03-03 2025-06-17 南京锐码毫米波太赫兹技术研究院有限公司 小型化宽带双极化磁电偶极子毫米波边射天线及其阵列
CN111916892A (zh) * 2020-07-07 2020-11-10 深圳市信维通信股份有限公司 5g毫米波双极化天线单元、天线阵列及终端设备
CN112968281B (zh) * 2021-05-18 2021-09-24 华南理工大学 双极化滤波天线单元、双极化滤波天线阵列
CN113540765B (zh) * 2021-09-07 2022-01-07 华南理工大学 双频双极化天线和双频双极化天线阵列

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005197776A (ja) * 2003-12-26 2005-07-21 Furukawa Electric Co Ltd:The 多周波共用アンテナ及び２周波共用アンテナ
CN102270780A (zh) * 2011-07-28 2011-12-07 四川九洲电器集团有限责任公司 一种工作于毫米波l频段的宽频带一体化全向天线
CN106463466A (zh) * 2014-05-06 2017-02-22 英特尔公司 具有集成天线的多层封装件
CN108183329A (zh) * 2018-01-05 2018-06-19 山西大学 一种低剖面单向辐射差分超宽带天线
CN209266562U (zh) * 2018-11-19 2019-08-16 中国电子科技集团公司第十四研究所 介质集成波导槽耦合腔体天线

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
LI MINGJIAN; LUK KWAI-MAN: "Wideband Magneto-Electric Dipole Antenna for 60-GHz Millimeter-Wave Communications", IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, IEEE, USA, vol. 63, no. 7, 1 July 2015 (2015-07-01), USA, pages 3276 - 3279, XP011662474, ISSN: 0018-926X, DOI: 10.1109/TAP.2015.2425418 *
LUK KWAI-MAN; LI MINGJIAN: "Magneto-electric dipole antennas for millimeter-wave applications", 2013 ASIA-PACIFIC MICROWAVE CONFERENCE PROCEEDINGS (APMC), IEEE, 5 November 2013 (2013-11-05), pages 304 - 306, XP032549442, DOI: 10.1109/APMC.2013.6695127 *
See also references of EP4345885A4
WATANABE ATOM O.; ALI MUHAMMAD; SAYEED SK YEAHIA BEEN; TUMMALA RAO R.; PULUGURTHA MARKONDEYA RAJ: "A Review of 5G Front-End Systems Package Integration", IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY, IEEE, USA, vol. 11, no. 1, 1 December 2020 (2020-12-01), USA , pages 118 - 133, XP011833821, ISSN: 2156-3950, DOI: 10.1109/TCPMT.2020.3041412 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117239426A (zh) * 2023-11-07 2023-12-15 微网优联科技(成都)有限公司 一种基于磁电偶极子的圆极化卫星天线
CN117239426B (zh) * 2023-11-07 2024-01-23 微网优联科技(成都)有限公司 一种基于磁电偶极子的圆极化卫星天线
WO2025129399A1 (zh) * 2023-12-18 2025-06-26 深圳市韶音科技有限公司 天线、天线组件和耳机

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