WO2024007686A1 - 一种电路板组件及电子设备 - Google Patents

一种电路板组件及电子设备 Download PDF

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Publication number
WO2024007686A1
WO2024007686A1 PCT/CN2023/089854 CN2023089854W WO2024007686A1 WO 2024007686 A1 WO2024007686 A1 WO 2024007686A1 CN 2023089854 W CN2023089854 W CN 2023089854W WO 2024007686 A1 WO2024007686 A1 WO 2024007686A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
component
assembly according
board assembly
interface unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2023/089854
Other languages
English (en)
French (fr)
Inventor
刘天野
严斌
刘秀兰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honor Device Co Ltd
Original Assignee
Honor Device Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honor Device Co Ltd filed Critical Honor Device Co Ltd
Priority to US18/847,386 priority Critical patent/US20250220096A1/en
Priority to EP23834466.7A priority patent/EP4465774A4/en
Publication of WO2024007686A1 publication Critical patent/WO2024007686A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0274—Details of the structure or mounting of specific components for an electrical connector module
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/184—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components inserted in holes through the PCBs and wherein terminals of the components are connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Definitions

  • the present application relates to the technical field of electronic equipment, and in particular, to a circuit board assembly and electronic equipment.
  • Electronic equipment in the related art often has a card holder for inserting a SIM card or a device that is plugged into a plug of an external device.
  • the shell of the electronic device is provided with a socket corresponding to the card holder or device.
  • the above-mentioned socket must also be moved in the direction close to the back cover accordingly to avoid the bent edge of the display screen.
  • the position of the socket on the circuit board corresponds to the position of the socket on the circuit board. Therefore, the circuit board with the card holder and other devices also needs to move in the direction of the rear cover as a whole.
  • the electronic components on the circuit board also move as a whole. In this way, the thickness of the electronic device is affected by the proximity of the circuit board. The higher the height of the device on one side of the back cover, the greater the thickness of the electronic device, which is not conducive to the thinning of the electronic device.
  • Embodiments of the present application provide a circuit board assembly and an electronic device, which are used to solve the problem in related technologies that the thickness of the entire electronic device is relatively large.
  • embodiments of the present application provide a circuit board assembly, including a first circuit board, a second device and a second circuit board, where the first circuit board has a first surface and a second surface arranged oppositely, A first component is provided on the first surface, and at least part of the second component is disposed on a side of the first circuit board away from the first surface.
  • the second component is used to provide SIM cards and external devices. At least one of the plugs is plugged in; the second circuit board is at least partially stacked on the second surface, a third component is provided on the second circuit board, and the height of the third component is greater than the The height of the first component, and along the thickness direction of the first circuit board, the third component at least partially overlaps the first circuit board.
  • the height of the third component protruding from the first circuit board is reduced by at least one thickness of the first circuit board, so that the back cover can be designed close to the bottom wall Some, thus helping to reduce the thickness of the mobile phone.
  • the first circuit board is provided with an escape opening
  • the second circuit board is provided with the third component at the escape opening
  • the third component is at least partially located on the escape opening. In the mouth.
  • the area of the second circuit board outside one side edge of the first circuit board is reduced. , thereby reducing the size (such as width) of the circuit board assembly in the direction parallel to the first circuit board, thereby conducive to reducing the impact of the circuit board assembly on the accommodation space. occupied.
  • the escape opening penetrates the first circuit board along the thickness direction of the first circuit board.
  • the second circuit board has a first area beyond one edge of the first circuit board, and the first area is provided with the third component.
  • the area for arranging a taller third device on the second circuit board is increased.
  • the opening at the position of the first circuit board corresponding to the third device is reduced.
  • the area of the escape opening improves the strength of the first circuit board; when there is one third component, it is avoided to open an escape opening on the first circuit board for the third component to pass through, which reduces the thickness of the mobile phone without affecting the thickness of the mobile phone.
  • the processing steps of the first circuit board are shortened, thereby improving the flexibility of arranging the third device on the second circuit board.
  • a portion of the third component is disposed higher than the first surface, and the distance of the third component above the first surface is less than the height of the first component.
  • the distance protruding from the first surface is determined by the height of the first component which is smaller than the height of the third component, which is beneficial to reducing the thickness of the entire electronic device.
  • first devices and third devices there are multiple first devices and third devices, and the distance of each third device above the first surface is less than the maximum value of the height of the first device.
  • each third device is increased while reducing the distance between the back cover and the first circuit board.
  • the second device includes a card holder for inserting a SIM card, and the card holder is disposed on the second surface.
  • the space between the first circuit board and the bottom wall can be fully utilized, thereby improving the space utilization of the accommodation space.
  • the number of the second circuit boards is two, and the two second circuit boards are spaced apart to form a limiting groove, and the card holder is arranged in the limiting groove.
  • the limiting groove effectively limits the movement of the card holder in a direction parallel to the first circuit board, thereby preventing the card holder from loosening during long-term insertion and removal, resulting in poor contact with the first circuit board.
  • the second device includes an interface unit for plugging a plug of the external device, and the interface unit is disposed on the second circuit board and along the first circuit board. In the thickness direction, a part of the interface unit overlaps at least one of the first circuit board and the second circuit board.
  • the size of the interface unit overlaps with the thickness of the first circuit board and the second circuit board, thereby helping to reduce the overall size of the circuit board assembly along the thickness direction of the first circuit board.
  • a portion of the interface unit is higher than the first surface, and the distance of the interface unit higher than the first surface is less than the height of the first device.
  • the interface unit does not additionally increase the distance between the first surface and the back cover along the thickness direction of the first circuit board, thereby improving the space utilization of the circuit board assembly in the accommodation space.
  • the interface unit is provided with an avoidance space that passes through the first circuit board and the second circuit board, and a part of the interface unit is disposed on the second circuit board away from the One side surface of the first circuit board and the other part of the interface unit are located in the avoidance space.
  • the lateral space occupied by the interface unit on the first circuit board and the second circuit board can be reduced. This reduces the size (such as width) of the circuit board assembly in the direction parallel to the first circuit board, which is beneficial to reducing the occupation of the accommodation space by the circuit board assembly; on the other hand, the avoidance space can play a role in protecting the interface unit.
  • the limiting function is beneficial to improving the reliability of the electrical connection between the interface unit and the second circuit board.
  • the second component is at least partially higher than a third surface
  • the third surface is a side surface of the second circuit board facing away from the first circuit board.
  • lower-height devices can be arranged on the third surface, which increases the arrangement area of the devices and optimizes the arrangement of the devices on the circuit board assembly.
  • a fourth component is disposed on the third surface, and the height of the fourth component is less than the maximum value of the distance between the second component and the third surface.
  • the fourth component includes a conductive elastic piece, the conductive elastic piece is connected to a connecting piece, and a part of the connecting piece extends out of the edge of the third surface and toward the first circuit board. One side extends for electrical connection with the antenna radiator.
  • the electrical connection between the conductive spring piece and the antenna radiator on the side of the circuit board assembly is facilitated.
  • the first circuit board and the second circuit board do not need to open fixing holes at the position of the conductive spring piece to install the conductive spring piece. It can avoid the fixing holes from occupying space on the first circuit board and the second circuit board.
  • the first circuit board and the second circuit board are both rigid circuit boards; and/or the first circuit board and the second circuit board are electrically connected through solder joints.
  • embodiments of the present application provide an electronic device, including a housing, a display screen, and the circuit board assembly described in the first aspect.
  • the housing includes a bottom wall, and a The side wall and the back cover connected to the side wall.
  • the bottom wall, the side wall and the back cover form a receiving space.
  • the side wall is provided with plugs for inserting SIM cards and external devices.
  • the socket the display screen is arranged on the side of the bottom wall away from the accommodation space, and the edge of the display screen is bent toward one side of the back cover and connected to the side wall;
  • the circuit board The component is disposed in the accommodation space, the first circuit board is located on a side of the second circuit board close to the back cover, and the second device is disposed at the socket.
  • Figure 1 is a partial structural schematic diagram of a mobile phone in some embodiments of the present application.
  • Figure 2 is an exploded view of the mobile phone of Figure 1;
  • Figure 3 is a structural diagram of the housing in Figure 2 from one perspective
  • Figure 4 is a simplified cross-sectional view of the connection between the circuit board assembly and the housing in the related art
  • Figure 5 is a simplified cross-sectional view of the connection between the circuit board assembly and the housing in the embodiment of the present application;
  • Figure 6 is a structural diagram of the circuit board assembly from one perspective in the embodiment of the present application.
  • Figure 7 is an exploded view of the circuit board assembly in Figure 6 from another perspective
  • Figure 8 is a simplified diagram of the connection between the housing and the circuit board assembly in other embodiments of the present application.
  • Figure 9 is a structural diagram of the circuit board assembly in Figure 6 from another perspective
  • Figure 10 is an exploded view of the connection structure between the circuit board assembly, the speaker and the antenna board in some embodiments of the present application;
  • FIG 11 is a partial structural schematic diagram of the circuit board assembly in Figure 6;
  • FIG. 12 is a cross-sectional view along line A-A of FIG. 6 .
  • first and second are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, features defined as “first” and “second” may explicitly or implicitly include one or more of these features.
  • electrical connection should be understood in a broad sense.
  • current conduction can be achieved through direct connection, or electrical energy conduction can be achieved through capacitive coupling.
  • the electronic device in the embodiment of the present application may be a mobile phone, a tablet computer, an e-reader, a wearable device, a remote control, a POS (point of sales terminal; point of sale information management system) machine, a laptop computer, or a personal digital assistant (personal digital assistant). , PDA), vehicle-mounted equipment and other electronic equipment that require a SIM card or a device that is plugged into an external device plug.
  • the following uses a mobile phone as an example to specifically describe the electronic equipment in the embodiment of the present application.
  • Other types of electronic equipment can be specifically configured with reference to the design concept of the circuit board assembly 10 in the mobile phone embodiment, and will not be described again one by one.
  • Figure 1 is a partial structural diagram of a mobile phone in some embodiments of the present application
  • Figure 2 is an exploded view of the mobile phone in Figure 1
  • Figure 3 is a diagram of the housing 20 in Figure 2. Part of the structure from another perspective.
  • the mobile phone includes a casing 20 , a display screen 30 , and a circuit board assembly 10 .
  • the housing 20 includes a bottom wall 201 , a side wall 202 provided at the periphery of the bottom wall 201 , and a back cover 22 connected to the side wall 202 .
  • the bottom wall 201 , the side wall 202 and the back cover 22 surrounds a receiving space 203, the circuit board assembly 10 is arranged in the receiving space 203, and a socket 23 is provided on the side wall 202.
  • the socket 23 includes a first socket 231 for inserting the SIM card and a second socket 232 for inserting the plug 71 of the external device.
  • the display screen 30 is provided on the side of the bottom wall 201 away from the accommodation space 203.
  • the display screen 30 The edge of 30 is bent toward one side of the rear cover 22 and connected with the side wall 202 .
  • the materials of the bottom wall 201 and the side wall 202 can be both metal or a combination of metal and plastic.
  • the metal part can be used as the antenna radiator 63.
  • the antenna radiator 63 is used to transmit and receive electromagnetic wave signals.
  • the bottom wall 201 and The side wall 202 can be fixed by bonding or welding, which is not specifically limited here.
  • the display screen 30 is electrically connected to the circuit board assembly 10 for displaying images, text, etc.
  • the display screen 30 is a flexible screen.
  • the display screen 30 is an OLED (Organic Light-Emitting Diode; organic light-emitting diode) screen.
  • the display screen 30 includes a display panel 31, a protective cover 32 and a back panel 33.
  • the display panel 31 is disposed on the side of the bottom wall 201 away from the accommodation space 203; the protective cover 32 is attached to the side of the display panel 31 away from the bottom wall 201.
  • the protective cover 32 used to protect the display panel 31, is a flexible glass plate, the edge of the protective cover 32 is bent to one side of the rear cover 22 and connected to the side wall 202; the back plate 33 is connected to the display panel 31 close to the bottom wall One side of 201 is connected to the bottom wall 201 to protect the display panel 31 and dissipate heat.
  • FIG. 4 is a simplified cross-sectional view of the connection between the circuit board assembly 10 and the housing 20 in the related art.
  • the circuit board assembly 10 in the technology includes a circuit board 1 and a first device 40, a second device 45 and a third device 50 arranged on the circuit board 1.
  • the first device 40 and the third device 50 are arranged close to the circuit board 1. on one side surface of the back cover 22, and the height H3 of the third device 50 is greater than the height H1 of the first device 40;
  • the second device 45 is disposed on a side surface of the circuit board 1 away from the back cover 22, and the second device 45 It includes a card holder 451 for SIM card insertion.
  • the first socket 231 should also move toward the back cover 22 to avoid the bent edge of the display screen 30 .
  • 451 corresponds to the position of the first socket 231 for plugging the SIM card on the side wall 202. Therefore, the circuit board 1 on which the second device 45 is disposed also needs to move as a whole toward the back cover 22. In this way, the thickness of the mobile phone is affected by the circuit board. 1.
  • FIG. 5 is a simplified cross-sectional view of the connection between the circuit board assembly 10 and the housing 20 in the embodiment of the present application.
  • Figure 6 is a view of the circuit board assembly 10 in the embodiment of the present application from one perspective.
  • Structural diagram Figure 7 is an exploded view of the circuit board assembly 10 in Figure 6 from another perspective.
  • FIG. 5 only schematically illustrates a simplified structural diagram of the circuit board assembly 10 and a schematic connection diagram of the housing 20 in some embodiments of the present application, but the structure of the circuit board assembly 10 is not limited to that shown in FIG. 5 .
  • the circuit board assembly 10 includes: a first circuit board 11 , a second device 45 and a second circuit board 12 .
  • the first circuit board 11 is located on a side of the second circuit board 12 close to the back cover 22 .
  • the first circuit board 11 has a first surface 111 and a second surface 112 arranged oppositely.
  • the first device 40 is provided on the first surface 111, the second device 45 is provided at the socket 23, and the second device 45 is at least A part of the first circuit board 11 is disposed on the side away from the first surface 111; a part of the second circuit board 12 is stacked on the second surface 112.
  • the third device 50 is disposed on the second circuit board 12, and the height of the third device 50 is H3 is greater than the height H1 of the first device 40 , and along the thickness direction T of the first circuit board 11 , the third device 50 overlaps the first circuit board 11 .
  • overlap specifically means that the dimensions of the two components in a certain direction have a certain amount of overlap.
  • the third device 50 and the first circuit board 11 Overlapping means that in the thickness direction T of the first circuit board 11, the sizes of the first circuit board 11 and the third device 50 have a certain amount of overlap, that is, the first circuit board 11 and the third device 50 are vertically aligned. Orthographic projections on the plane of the first circuit board 11 have overlapping areas.
  • the back cover 22 It can be designed closer to the bottom wall 201, which is beneficial to reducing the thickness of the mobile phone.
  • both the first circuit board 11 and the second circuit board 12 are rigid circuit boards.
  • the second circuit board 12 is a combination of flexible circuit boards, which increases the area for device arrangement, and the production cost of the rigid circuit board is low, which is beneficial to controlling the production cost of the circuit board assembly 10 .
  • the first circuit board 11 and the second circuit board 12 are electrically connected through solder.
  • the solder firmly connects the first circuit board 11 and the second circuit board 12 to play a structural fixing role.
  • the solder can realize the electrical connection between the first circuit board 11 and the second circuit board 12 and play a role in signal communication. , so that the function of the circuit board assembly 10 is consistent with the function of arranging all devices on one circuit board.
  • the solder can be in the form of dots, so that after the second circuit board 12 and the first circuit board 11 are welded by the solder, The distance between the welding surfaces of the first circuit board 11 and the second circuit board 12 can be effectively controlled, so that the second circuit board 12 and the second surface 112 of the first circuit board 11 are closer to each other. That is to say, along the first circuit board 11 In the thickness direction T, the distance between the second circuit board 12 and the second surface 112 of the first circuit board 11 is negligible.
  • the position of the solder on the second surface 112 can be selected by the user on the premise of ensuring the reliability of the connection between the first circuit board 11 and the second circuit board 12 , and is not specifically limited here.
  • the first circuit board 11 and the second circuit board 12 can also be electrically connected through wires or conductive components.
  • the conductive components can be conductive pins or conductive spring pieces, which are not specifically limited here.
  • the first circuit board 11 is provided with a relief opening 13
  • the second circuit board 12 is provided with a third device 50 at the relief opening 13
  • the third device 50 is partially (Of course, all of them can be located in the escape opening 13 .
  • this reduces the problem that the second circuit board 12 is outside one side edge of the first circuit board 11 area, thereby reducing the size (such as width) of the circuit board assembly 10 in the direction parallel to the first circuit board 11 , thereby conducive to reducing the occupation of the accommodation space 203 by the circuit board assembly 10 .
  • the number of escape openings 13 can be the same as the number of third devices 50 in one-to-one correspondence.
  • One or more third devices 50 can also be provided at one escape opening 13, which is not specifically limited here.
  • the relief opening 13 penetrates the first circuit board 11 .
  • the escape opening 13 penetrates the first circuit board 11 , it is convenient for the third component 50 to penetrate the escape opening 13 .
  • the escape opening 13 may not penetrate the first circuit board 11 , as shown in FIG. 8 , and is not specifically limited here.
  • FIG. 8 is a simplified diagram of the connection between the housing 20 and the circuit board assembly 10 in other embodiments of the present application.
  • the first circuit board 11 and the second circuit board 12 are stacked through the elevated board 16 .
  • the elevated board 16 Through the arrangement of the elevated board 16, higher-height components can be placed between the first surface 111 and the second circuit board 12, which increases the area for arranging the components; in addition, through the elevated board 16 and the first circuit board 11 and The second circuit boards 12 are stacked, which improves the stability and reliability of the connection between the first circuit board 11 and the second circuit board 12 .
  • the third device 50 is disposed on a side surface of the second circuit board 12 close to the first circuit board 11 and located on the first circuit board. Between the board 11 and the second circuit board 12 , the sum of the thickness of the elevated board 16 and the thickness of the second circuit board 12 is less than the height of the second device 45 . In this way, along the thickness direction T of the first circuit board 11, while reducing the size (such as width) of the circuit board assembly 10 in the direction parallel to the first circuit board 11, the height of the elevated plate 16 is increased.
  • the area of the third device 50 with a higher height is provided on two opposite surfaces of the second circuit board 12 .
  • a portion of the third device 50 is disposed above the first surface 111 , and the distance h1 of the third device 50 above the first surface 111 is less than the height of the first device 40 H1. In this way, the protruding distance from the first surface 111 is determined by the height of the lower first component 40. In this way, the back cover 22 can be designed closer to the bottom wall 201, which is beneficial to reducing the thickness of the mobile phone.
  • the distance h1 of the third device 50 above the first surface 111 is less than the height H1 of the first device 40
  • the distance h1 of the third device 50 above the first surface 111 can also be equal to the height H1 of the first device 40. This is not specifically limited.
  • the second circuit board 12 has a first area 122 , the first area 122 extends beyond one edge of the first circuit board 11 , and the first area 122 is provided with the third device 50 .
  • the area for disposing the higher third device 50 on the second circuit board 12 is increased.
  • the third device 50 is disposed on the first area 122, which avoids opening an escape opening 13 on the first circuit board 11 for the third device 50 to pass through, without affecting the thickness of the mobile phone.
  • the second circuit board 11 protrudes from the first surface 111 through the escape openings 13 on the first circuit board 11.
  • Figure 9 is a structural diagram of the circuit board assembly 10 in Figure 6 from another perspective.
  • the second component 45 is higher than the third surface 121 , where the third surface 121 is a side surface of the second circuit board 12 facing away from the first circuit board 11 .
  • components with lower height can be disposed on the third surface 121 without increasing the thickness of the circuit board assembly 10 , thereby increasing the layout area of the components and optimizing the layout of the components on the circuit board assembly 10 .
  • the second device 45 includes a card holder 451 for inserting a SIM card, and the card holder 451 is disposed on the second surface 112 .
  • the arrangement of the card holder 451 makes full use of the space between the first circuit board 11 and the bottom wall 201 , avoids wasting the space between the first circuit board 11 and the bottom wall 201 , thereby improving the space utilization of the accommodation space 203 .
  • the card holder 451 can also be disposed on a side surface of the second circuit board 12 close to the second surface 112 , which is not specifically limited here.
  • the card holder 451 is used in this way.
  • the card holder 451 passes through the socket 23 opened on the side wall 202, and the pin 72 is inserted through the socket 25 opened on the side wall 202, so that the card holder 451 pops out of the casing 20.
  • the card holder 451 is moved toward the inside of the casing 20 into the casing 20 .
  • the pin 72 is also used to pop the card holder 451 out of the housing 20, which will not be described again.
  • the number of the second circuit boards 12 is two.
  • the two second circuit boards 12 are spaced apart to form the limiting slot 14
  • the card holder 451 is provided in the limiting slot. 14 in.
  • the two second circuit boards 12 are spaced apart to form a limiting groove 14.
  • the stability and reliability of the connection between the first circuit board 11 and the second circuit board 12 are improved.
  • the limiting groove 14 effectively limits the card.
  • the movement of the seat 451 in a direction perpendicular to the thickness direction T of the first circuit board 11 prevents the card seat 451 from loosening during long-term insertion and removal, resulting in poor contact with the first circuit board 11 .
  • the number of second circuit boards 12 may also be one, three, four, and so on.
  • there is one second circuit board 12 and a limiting slot 14 is provided on the second circuit board 12 at a position corresponding to the card holder 451 . In this way, the number of components of the circuit board assembly 10 is reduced, and the overall functional consistency of the circuit board assembly 10 is improved.
  • the second device 45 includes an interface unit 452 for plugging the plug 71 of an external device.
  • the interface unit 452 is disposed on the second circuit board 12 and along the second circuit board 12 . In the thickness direction T of the circuit board 11 , a part of the interface unit 452 overlaps the first circuit board 11 and the second circuit board 12 . This design avoids the size of the interface unit 452 from overlapping with the thickness of the first circuit board 11 and the second circuit board 12 , thereby conducive to reducing the overall size of the circuit board assembly 10 along the thickness direction T of the first circuit board 11 size.
  • the interface unit 452 can be used to connect an external power supply device for charging the mobile phone.
  • the interface unit 452 can be any one of Type-C interface, Micro-USB interface, and Mini-USB interface, which is not specifically limited here.
  • the interface unit 452 can also be a USB interface or a headphone interface, which is not specifically limited here.
  • a part of the interface unit 452 may overlap with both the first circuit board 11 and the second circuit board 12 , or may overlap with one of the first circuit board 11 or the second circuit board 12 .
  • Figure 10 is an exploded view of the connection structure between the circuit board assembly 10, the speaker 64 and the antenna plate 65 in some embodiments of the present application
  • Figure 11 is a part of the circuit board assembly 10 in Figure 6 Schematic.
  • the interface unit 452 is provided with an escape space 15 that passes through the first circuit board 11 and the second circuit board 12 .
  • a part of the interface unit 452 (referring to the connecting portion 4521 of the interface unit 452 ) is disposed on the third surface 121 .
  • the other part of the interface unit 452 (referring to the slot 4522 where the interface unit 452 is plugged into the plug 73 of the external device) is located in the avoidance space 15 , where the third surface 121 is the second circuit board 12 facing away from the first circuit board. 11 side surface.
  • the interface unit 452 can be reduced from occupying the lateral space of the first circuit board 11 and the second circuit board 12 , thereby reducing the risk of the circuit board assembly 10 parallel to the second circuit board 11 and the second circuit board 12 .
  • the size (such as width) of the circuit board 11 in the direction helps to reduce the occupation of the accommodation space 203 by the circuit board assembly 10; on the other hand, the avoidance space 15 can play a role in limiting the interface unit 452, so that This helps to improve the reliability of the electrical connection between the interface unit 452 and the second circuit board 12 .
  • the interface unit 452 can also be disposed on the second surface 112 toward one side of the second circuit board 12 , or the interface unit 452 can be disposed on one side of the second circuit board 12 close to the second surface 112 and toward the second circuit board 112 .
  • the first surface 111 side or the third surface 121 side is not specifically limited here.
  • a portion of the interface unit 452 is higher than the first surface 111 , and the distance by which the interface unit 452 is higher than the first surface 111 is less than the height of the first device 40 .
  • the distance between the interface unit 452 and the first surface 111 is less than the height of the second elastic piece 402 .
  • the interface unit 452 is still determined by the highest device among the lower first devices 40 , and the interface unit 452 does not increase the space between the first surface 111 and the back cover 22 . The distance improves the space utilization of the circuit board assembly 10 in the accommodation space 203 .
  • one end of the interface unit 452 that is plugged into the external device is fixed on the third surface 121 through the connecting ear 18 , and the connecting ear 18 is downward toward the side facing the first surface 111 .
  • the concave overlaps the third surface 121 so that one end of the interface unit 452 for plugging into the external device is located in the avoidance space 15 .
  • the arrangement of the connecting ears 18 well limits the movement of the interface unit 452 in a direction parallel to the first circuit board 11 , thereby improving the reliability of the electrical connection between the interface unit 452 and the second circuit board 12 , thereby improving the reliability of the circuit board.
  • Component 10 reliability Component 10 reliability.
  • each third device 50 above the first surface 111 is less than the height of the first device 40 the maximum value.
  • the plurality of first components 40 are first elastic pieces 401 and second elastic pieces 402 respectively.
  • the first elastic pieces 401 are disposed at the edge of the first surface 111 and used for It is electrically connected to the antenna radiator 63
  • the second spring piece 402 is used to be electrically connected to the speaker 64 .
  • the antenna and the speaker 64 are electrically connected to the first circuit board 11 through the first elastic piece 401 and the second elastic piece 402 respectively. This ensures the reliability of the electrical connection between the antenna and the speaker 64 and the first circuit board 11 while ensuring user-friendly operation and low cost. Low.
  • the speaker 64 includes a lower cover 641, a speaker unit 643, and a second flexible circuit board 61.
  • the lower cover 641 has a cavity 642, the speaker unit 643 is disposed in the cavity 642, and the second flexible circuit board One end of 61 is electrically connected to the speaker unit 643, and the other end is electrically connected to the circuit board assembly 10 through the second elastic piece 402.
  • the lower cover 641 It is fixed with the bottom wall 201 so that the speaker 64 is fixed with the casing 20.
  • the space enclosed by the cavity 642 and the bottom wall 201 of the casing 20 forms a sound cavity, so that the speaker 64 is in close contact with the bottom wall 201.
  • the combination saves the accommodation space 203 occupied by the upper cover body, thus reducing the thickness of the mobile phone.
  • the side wall 202 of the housing 20 corresponding to the sound output portion of the sound cavity of the speaker 64 is provided with a sound outlet 24 .
  • the sound outlet 24 is used to release the sound emitted by the speaker unit 643 .
  • a dust-proof net 644 is provided between the sound outlet 24 and the sound outlet part of the sound cavity.
  • Figure 12 is a cross-sectional view along line A-A in Figure 6 .
  • the plurality of third components 50 are respectively a microphone component 501, a connector component 504, and an antenna connector component 508.
  • the microphone assembly 501 includes a microphone 502 and a shielding case 503 .
  • the shielding case 503 is arranged on the second circuit board 12 , and the microphone 502 is arranged in the shielding case 503 .
  • a relief opening 13 penetrating the first circuit board 11 is opened on one side of the first circuit board 11 , and the entire microphone assembly 501 is located in the relief opening 13 .
  • the height of the microphone assembly 501 is the height of the shielding case 503, that is to say, the height of the microphone assembly 501 is the distance between the side surface of the second circuit board 12 close to the second surface 112 and the highest point of the outer bottom wall 201 of the shielding case 503 .
  • the height of the microphone assembly 501 is greater than the height of the first elastic piece 401
  • the microphone assembly 501 is higher than the first surface 111
  • the height of the microphone assembly 501 above the first surface 111 is smaller than the first component 40 such as the first elastic piece 401 the height of.
  • the connector assembly 504 includes a fixing member 505 , a first connector 506 disposed on the second circuit board 12 , and a second connector 507 for connecting to the first flexible circuit board 60 , the second connector 507 is electrically connected to the first connector 506, and the fixing member 505 is used to relatively fix the second connector 507 and the first connector 506. At this time, the second connector 507 and the first connector 506 are located at 13 points to avoid.
  • the structure of the fixing member 505 is plate-shaped, and the first connector 506 and the second connector 507 can be male and female sockets of a BTB connector.
  • the first connector 506 and the second connector are connected through the fixing member 505 507 is turned on to realize the electrical connection between the circuit board assembly 10 and the main board.
  • the height of the connector assembly 504 includes the distance between the highest point of the side surface of the fixing member 505 away from the second circuit board 12 and the side surface of the second circuit board 12 where the second connector 507 is located.
  • the fixing parts 505 in the two connector assemblies 504 are made into an integrated plate-like structure. In this way, the fixing parts 505 lay the first flexible circuit board 60 on the first surface 111 of the first circuit board 11 to avoid the second If the flexible circuit board 60 is damaged during the assembly process of the circuit board assembly 10, the reliability of the electrical connection between the first flexible circuit board 60 and the circuit board assembly 10 is improved.
  • two fixing members 505 can also be provided correspondingly, which is not specifically limited here.
  • the antenna connector assembly 508 includes a connector body 5081 and a pressing plate 5082 provided on the second circuit board 12 .
  • the connector body 5081 is disposed on the first area 122 of the second circuit board 12, and one end of the third flexible circuit board 62 is electrically connected to the antenna connector assembly 508 through the pressure plate 5082, and the other end of the third flexible circuit board 62 is electrically connected to the antenna connector assembly 508.
  • One end is electrically connected to the antenna board 65 , thereby realizing the electrical connection between the antenna board 65 and the circuit board assembly 10 .
  • the pressure plate 5082 and the lower cover 641 of the speaker 64 have an integral structure. Such a setting reduces the number of parts of the mobile phone quantity.
  • the third flexible circuit board 62 can be electrically connected to the circuit board assembly 10 by bending, folding, etc., it can adapt to the internal space of the accommodation space 203 , has better flexibility, and takes up less space than a rigid circuit board. , eliminating the ultrasonic welding process, further reducing the assembly cost of the circuit board assembly 10 .
  • the number of small antenna plates 65 can be one or more to increase the feed point of the antenna and improve the signal strength of the antenna.
  • the specific number and position of the small antenna plates 65 are selected according to actual needs and are not specifically limited here.
  • a fourth component 55 is disposed on the third surface 121 , and the height of the fourth component 55 is less than the maximum value of the distance between the second component 45 and the third surface 121 .
  • the thickness of the circuit board assembly 10 (that is, the size of the circuit board assembly 10 in the thickness direction T of the first circuit board 11) is related to the height of the second device 45 disposed on the second surface 112, reducing the The influence of the fourth device 55 on the thickness of the circuit board assembly 10 prevents the circuit board assembly 10 from being too thick, thereby making the arrangement in the accommodation space 203 more compact.
  • the fourth component 55 includes a conductive elastic piece 551 , the conductive elastic piece 551 is connected to a connecting piece 552 , a part of the connecting piece 552 extends out of the edge of the third surface 121 and toward the first line.
  • One side of the plate 11 extends for electrical connection with the antenna radiator 63 .
  • the connecting piece 522 it is convenient to electrically connect the conductive spring piece 551 to the antenna radiator 63 on the side of the circuit board assembly 10. Then the first circuit board 11, The second circuit board 12 does not need to open a fixing hole at the position of the conductive elastic piece 551 to install the conductive elastic piece 551 (similar to the installation structure of the first elastic piece 401 in FIG. 6 ), thereby avoiding the fixing holes on the first circuit board 11 and the second circuit board 11 . Second, the space occupied on the circuit board 12.
  • the conductive spring piece 551 and the connecting piece 552 can be integrally formed, or they can be separate structures connected by welding or conductive bonding, etc., which are not specifically limited here.
  • each conductive elastic piece 551 is connected to a connector 552 and is electrically connected to an antenna radiator 63.
  • the radiators 63 are disposed on the side wall 202 and are arranged at intervals along the circumferential direction of the bottom wall 201.
  • Each connector 552 is electrically connected to an antenna radiator 63 to form a feeding point of the antenna. The arrangement of multiple antenna radiators 63 increases the feed points of the antenna and improves the signal strength of the antenna.
  • the fourth device 55 further includes a conductive member 553 , and the conductive member 553 is electrically connected to the metal portion of the bottom wall 201 .
  • the second circuit board 12 is provided with a mounting hole 17, and the conductive member 553 is disposed on the periphery of the mounting hole 17. After the fastener passes through the mounting hole 17 to connect the circuit board assembly 10 to the bottom wall 201, the conductive member 553 It is electrically connected to the metal part of the bottom wall 201 .
  • the above-mentioned fasteners may be screws or bolts, which are not specifically limited here.
  • the conductive member 553 can be used for feeding or grounding the antenna.
  • the conductive member 553 may be a large elastic piece.
  • the number of conductive members 553 may be one, which is provided at one mounting hole 17; the number of conductive members 553 may also be multiple, that is, one conductive member 553 may be provided at each mounting hole 17 to improve the connection between the circuit board assembly 10 and The reliability of the electrical connection of the bottom wall 201.
  • the conductive member 553 can also be a metal spring, etc., which is not specifically limited here.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Telephone Set Structure (AREA)
  • Combinations Of Printed Boards (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

一种电路板组件及电子设备，电路板组件包括第一线路板(11)、第二器件(45)和第二线路板(12)，第一线路板具有相背设置的第一表面(111)和第二表面(112)，第一表面上设有第一器件(40)，第二器件至少一部分设置于第一线路板背离第一表面的一侧，第二器件用于供SIM卡、外部设备的插头中的至少一者插接；第二线路板至少部分层叠设置于第二表面，第二线路板上设有第三器件(50)，第三器件的高度大于第一器件的高度，且沿第一线路板的厚度方向，第三器件至少部分与第一线路板相重叠。

Description

一种电路板组件及电子设备
本申请要求于2022年7月4日提交国家知识产权局、申请号为202221722187.2、申请名称为“一种电路板组件及电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电子设备技术领域，尤其涉及一种电路板组件及电子设备。
背景技术
随着电子技术的发展，诸如手机等电子设备，为了实现更极致的外观效果，将显示屏的边缘进行弯折处理，如何在显示屏边缘折弯情况下减小电子设备的厚度成为业内重要的课题。
相关技术中的电子设备往往具有插SIM卡的卡座或具有与外接设备插头相插接的器件，电子设备的壳体上开设有与上述卡座或器件相对应的插口。在显示屏的边缘向靠近后盖的方向弯折的情况下，上述插口也要相应地向靠近后盖的方向移动，以避让显示屏的弯折的边缘，由于卡座等器件需要与壳体上的插口的位置相对应，因此，设置卡座等器件的线路板也需要整体向后盖的方向移动，线路板上的电子器件也随之整体移动，这样，电子设备的厚度受到线路板靠近后盖一侧表面上的高度较高器件的影响，器件的高度越高，电子设备的厚度越大，从而不利于电子设备的轻薄化。
发明内容
本申请的实施例提供一种电路板组件及电子设备，用于解决相关技术中的电子设备整机的厚度较大的问题。
为达到上述目的，本申请的实施例采用如下技术方案：
第一方面，本申请实施例提供了一种电路板组件，包括第一线路板、第二器件和第二线路板，所述第一线路板具有相背设置的第一表面和第二表面，所述第一表面上设有第一器件，所述第二器件至少一部分设置于所述第一线路板背离所述第一表面的一侧，所述第二器件用于供SIM卡、外部设备的插头中的至少一者插接；所述第二线路板至少部分层叠设置于所述第二表面，所述第二线路板上设有第三器件，所述第三器件的高度大于所述第一器件的高度，且沿所述第一线路板的厚度方向，所述第三器件至少部分与所述第一线路板相重叠。
通过采用上述方案，这样，沿第一线路板的厚度方向，使得第三器件凸出于第一线路板的高度至少减小一个第一线路板的厚度，这样后盖就可以设计得靠近底壁一些，从而有利于减小手机的厚度。
在一些实施例中，所述第一线路板上设有避让口，所述第二线路板在所述避让口处设有所述第三器件，并且所述第三器件至少部分位于所述避让口中。
通过采用上述方案，相较于将第三器件设置于第二线路板位于第一线路板的一侧边缘之外，减小了第二线路板位于第一线路板的一侧边缘之外的面积，进而减小电路板组件在平行于第一线路板方向上的尺寸(比如宽度)，进而有利于减小电路板组件对容纳空间的 占用。
在一些实施例中，沿所述第一线路板的厚度方向，所述避让口贯穿所述第一线路板。
通过采用上述方案，避让口贯穿第一线路板后，便于第三器件贯穿避让口。
在一些实施例中，所述第二线路板具有第一区域，所述第一区域超出所述第一线路板的一侧边缘之外，所述第一区域设有所述第三器件。
通过采用上述方案，这样，增大了在第二线路板上设置较高第三器件的面积，当第三器件为多个时，减小了在第一线路板对应第三器件的位置上开设避让口的面积，提高了第一线路板的强度；当第三器件为一个时，避免在第一线路板上开设供该第三器件穿过的避让口，在不影响手机厚度的同时，减小了第一线路板的加工工序，进而提高了第三器件在第二线路板上布置的灵活性。
在一些实施例中，所述第三器件的一部分高出所述第一表面设置，且所述第三器件高出所述第一表面的距离小于所述第一器件的高度。
通过采用上述方案，这样，凸出于第一表面的距离由高度小于第三器件的第一器件的高度决定，从而有利于减小电子设备整机的厚度。
在一些实施例中，所述第一器件、所述第三器件均为多个，每个所述第三器件高出所述第一表面的距离均小于所述第一器件高度的最大值。
通过采用上述方案，在减小后盖与第一线路板之间的距离的同时，提高了每个第三器件的高度范围。
在一些实施例中，所述第二器件包括用于供SIM卡插接的卡座，所述卡座设置于所述第二表面上。
通过采用上述方案，这样可以充分利用第一线路板与底壁之间的空间，进而提高了容纳空间的空间利用率。
在一些实施例中，所述第二线路板的数目为两个，两个所述第二线路板相隔设置以形成限位槽，所述卡座设置于限位槽中。
通过采用上述方案，限位槽有效限制了卡座沿平行于第一线路板的方向移动，避免卡座长时间插拔过程中松动导致与第一线路板接触不良。
在一些实施例中，所述第二器件包括用于供所述外部设备的插头插接的接口单元，所述接口单元设置于所述第二线路板上，且沿所述第一线路板的厚度方向，所述接口单元的一部分与所述第一线路板、所述第二线路板中的至少一者相重叠。
通过采用上述方案，这样，这样避免了接口单元的尺寸与第一线路板、第二线路板的厚度相交叠，从而有利于减小电路板组件沿第一线路板的厚度方向的整体尺寸。
在一些实施例中，所述接口单元的一部分高出所述第一表面，且所述接口单元高出所述第一表面的距离小于所述第一器件的高度。
通过采用上述方案，这样沿第一线路板的厚度方向，接口单元不会额外增加第一表面与后盖之间的距离，提高了电路板组件在容纳空间内的空间利用率。
在一些实施例中，所述接口单元的位置处设有贯穿所述第一线路板、所述第二线路板的避让空间，所述接口单元的一部分设置于所述第二线路板背离所述第一线路板的一侧表面，所述接口单元的另一部分位于所述避让空间中。
通过采用上述方案，这样可以减小接口单元占用第一线路板、第二线路板的侧向空间， 从而减小了电路板组件在平行于第一线路板方向上的尺寸(比如宽度)，进而有利于减小了电路板组件对容纳空间的占用；另一方面，避让空间可对接口单元起到限位的作用，有利于提高接口单元与第二线路板电连接的可靠性。
在一些实施例中，所述第二器件至少部分高出第三表面，所述第三表面为所述第二线路板背离所述第一线路板的一侧表面。
通过采用上述方案，可在第三表面上设置高度较低的器件，增加了器件的布置面积，优化了电路板组件上器件的布置。
在一些实施例中，所述第三表面上设有第四器件，所述第四器件的高度小于所述第二器件高出所述第三表面距离的最大值。
通过采用上述方案，减小了第四器件对电路板组件的厚度的影响，避免电路板组件的厚度过大，从而使得容纳空间内的布置更加紧凑。
在一些实施例中，所述第四器件包括导电弹片，所述导电弹片连接有连接件，所述连接件的一部分伸出所述第三表面的边缘之外且向所述第一线路板的一侧延伸，以用于与天线辐射体电连接。
通过采用上述方案，这样方便了导电弹片与电路板组件侧向的天线辐射体电连接，那么第一线路板、第二线路板在导电弹片的位置就无需开设固定孔来安装导电弹片，从而就可以避免固定孔对第一线路板、第二线路板上空间的占用。
在一些实施例中，所述第一线路板、所述第二线路板均为刚性线路板；和/或，所述第一线路板与所述第二线路板之间通过焊点电连接。
通过采用上述方案，这样，一方面，不需要额外组装工序和定位结构，方便电路板组件的组装和连接，有利于电路板组件的改造，另一方面，相较于刚性线路和柔性线路板的组合，有利于控制电路板组件的制作成本。
第二方面，本申请实施例提供了一种电子设备，包括壳体、显示屏、以及第一方面所述的电路板组件，所述壳体包括底壁、设置于所述底壁周缘处的侧壁、以及与所述侧壁连接的后盖，所述底壁、所述侧壁以及所述后盖围成容纳空间，所述侧壁上开设有用于供SIM卡、外部设备的插头插入的插口；所述显示屏设置于所述底壁远离所述容纳空间的一侧，所述显示屏的边缘向所述后盖的一侧弯曲并且与所述侧壁相连接；所述电路板组件设置于所述容纳空间中，所述第一线路板位于所述第二线路板靠近所述后盖的一侧，所述第二器件设置在所述插口处。
本申请实施例中的电子设备所具有的有益效果与第一方面中的电路板组件的具有有益效果相同，在此不在赘述。
附图说明
图1为本申请一些实施例中的手机的部分结构示意图；
图2为图1的手机的分解图；
图3为图2中的壳体在一视角下的结构图；
图4为相关技术中的电路板组件与壳体连接的截面简化图；
图5为本申请实施例中的电路板组件与壳体连接的截面简化图；
图6为本申请实施例中的电路板组件在一个视角下的结构图；
图7为图6中的电路板组件在另一个视角下的分解图；
图8为本申请另一些实施例中的壳体与电路板组件的连接的简化图；
图9为图6中的电路板组件在另一个视角下的结构图；
图10为本申请一些实施例中的电路板组件与扬声器、天线小板的连接结构分解图；
图11为图6中的电路板组件的部分结构示意图；
图12为图6的A-A剖视图。
具体实施方式
在本申请实施例中，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。
在本申请实施例中，需要说明的是，术语“电连接”应做广义理解，例如，可以是通过直接连接的方式实现电流导通，也可以是通过电容耦合的方式实现电能量传导。
本申请实施例中的电子设备可以是手机、平板电脑、电子阅读器、可穿戴设备、遥控器、POS(point of salesterminal；销售点情报管理系统)机、笔记本电脑、个人数字助理(personal digital assistant，PDA)、车载设备等需要插SIM卡或具有与外接设备插头相插接的器件的电子设备。
下面以手机为例为具体描述本申请实施例中的电子设备，其它类型的电子设备具体可参照手机实施例中电路板组件10的设计构思来设置，在此不再一一赘述。
如图1、图2和图3所示，图1为本申请一些实施例中的手机的部分结构示意图，图2为图1的手机的分解图，图3为图2中的壳体20在另一视角下的部分结构图。该手机包括壳体20、显示屏30、以及电路板组件10。
如图2和图3所示，壳体20包括底壁201、设置于底壁201周缘处的侧壁202、以及与侧壁202连接的后盖22，底壁201、侧壁202以及后盖22围成容纳空间203，电路板组件10设置于容纳空间203中，侧壁202上开设有插口23。示例的，插口23包括用于供SIM卡插接的第一插口231和与外部设备的插头71插入的第二插口232，显示屏30设置于底壁201远离容纳空间203的一侧，显示屏30的边缘向后盖22的一侧弯曲并且与侧壁202相连接。
其中，底壁201和侧壁202的材质可以均为金属或均为金属和塑胶的合成，金属部分可用于作为天线辐射体63，天线辐射体63用于发射和接收电磁波信号，底壁201和侧壁202可以通过粘接或焊接固定，在此不做具体限定。
其中，显示屏30与电路板组件10电连接，用于显示图像、文字等。显示屏30为柔性屏。示例的，显示屏30为OLED(Organic Light-Emitting Diode；有机发光二极管)屏。显示屏30包括显示面板31、保护盖板32及背板33，显示面板31设置于底壁201远离容纳空间203的一侧；保护盖板32贴合于显示面板31远离底壁201的一侧，用于保护显示面板31，保护盖板32为柔性玻璃板，保护盖板32的边缘向后盖22的一侧弯曲并且与侧壁202相连接；背板33连接于显示面板31靠近底壁201的一侧，与底壁201连接，起到保护显示面板31和散热等作用。
如图4所示，图4为相关技术中的电路板组件10与壳体20连接的截面简化图。相关 技术中的电路板组件10，包括线路板1及设置于线路板1上的第一器件40、第二器件45、第三器件50，第一器件40和第三器件50设置于线路板1靠近后盖22的一侧表面上，且第三器件50的高度H3大于第一器件40的高度H1；第二器件45设置于线路板1远离后盖22的一侧表面上，且第二器件45包括用于供SIM卡插接的卡座451。
在显示屏30的边缘向靠近后盖22的方向弯折的情况下，第一插口231也要相应地向靠近后盖22的方向移动，以避让显示屏30的弯折的边缘，由于卡座451与侧壁202上SIM卡插接的第一插口231的位置相对应，因此设置第二器件45的线路板1也需要整体向靠近后盖22的方向移动，这样，手机的厚度受到线路板1靠近后盖22一侧表面上高度较高的第三器件50的影响，第三器件50的高度越高，后盖22就要设计得远离底壁201，手机的厚度越大，不利于手机的轻薄化。
如图5～图7所示，图5为本申请实施例中的电路板组件10与壳体20连接的截面简化图，图6为本申请实施例中的电路板组件10在一个视角下的结构图，图7为图6中的电路板组件10在另一个视角下的分解图。需要说明的是，图5仅示意性地示意本申请一些实施例中的电路板组件10的结构简化图与壳体20的连接示意图，但电路板组件10的结构不限于图5所示。电路板组件10包括：第一线路板11、第二器件45和第二线路板12，第一线路板11位于第二线路板12靠近后盖22的一侧。
其中，第一线路板11具有相背设置的第一表面111和第二表面112，第一表面111上设有第一器件40，第二器件45设置在插口23处，且第二器件45至少一部分设置于第一线路板11背离第一表面111的一侧；第二线路板12一部分层叠设置于第二表面112，第二线路板12上设有第三器件50，第三器件50的高度H3大于第一器件40的高度H1，且沿第一线路板11的厚度方向T，第三器件50与第一线路板11相重叠。
在本申请实施例中，“重叠”具体是指两个部件在某方向上的尺寸具有一定的重合量，比如沿第一线路板11的厚度方向T，第三器件50与第一线路板11相重叠是指：在第一线路板11的厚度方向T上，第一线路板11、第三器件50的尺寸具有一定的重合量，也就是：第一线路板11、第三器件50在垂直于第一线路板11的平面上的正投影具有相重合的区域。
采用上述技术方案，这样，沿第一线路板11的厚度方向T，使得第三器件50凸出于第一线路板11的高度至少减小一个第一线路板11的厚度，这样，后盖22就可以设计得靠近底壁201一些，从而有利于减小手机的厚度。
在一些实施例中，如图5和图6所示，第一线路板11、第二线路板12均为刚性线路板。这样，一方面，不需要额外组装工序和定位结构，方便电路板组件10的组装和连接，有利于电路板组件10的改造，另一方面，相较于第一线路板11为刚性线路板，第二线路板12为柔性线路板的组合，增加了器件布置的面积，且刚性线路板的制作成本较低，有利于控制电路板组件10的制作成本。
在一些实施例中，如图6所示，第一线路板11与第二线路板12之间通过焊料电连接。这样，焊料将第一线路板11与第二线路板12固定连接，起到结构固定作用，同时，焊料能够实现第一线路板11与第二线路板12的电连接，起到信号通讯的作用，使得电路板组件10的功能与将全部器件设置在一块线路板上的功能相一致。
其中，焊料可以呈点状，这样通过焊料将第二线路板12与第一线路板11焊接以后， 可有效控制第一线路板11与第二线路板12焊接面的距离，使得第二线路板12与第一线路板11的第二表面112更贴合，也就是说，沿第一线路板11厚度方向T，第二线路板12与第一线路板11的第二表面112的距离可忽略不计。焊料在第二表面112的位置用户可在确保第一线路板11与第二线路板12连接可靠性的前提下选择，在此不做具体限定。
当然，第一线路板11与第二线路板12之间除了通过焊料电连接以外，也可以通过导线或导电部件电连接，导电部件可以为导电弹针或导电弹片，在此不做具体限定。
在一些实施例中，如图5～图7所示，第一线路板11上设有避让口13，第二线路板12在避让口13处设有第三器件50，并且第三器件50部分(当然也可以使全部)位于避让口13中。相较于将第三器件50设置于第二线路板12位于第一线路板11的一侧边缘之外，这样，减小了第二线路板12位于第一线路板11的一侧边缘之外的面积，进而减小电路板组件10在平行于第一线路板11方向上的尺寸(比如宽度)，进而有利于减小电路板组件10对容纳空间203的占用。
另外，避让口13的数目可以与第三器件50的数目相同，一一对应，也可以在一个避让口13处设置一个或多个第三器件50，在此不做具体限定。
在一些实施例中，如图7所示，沿第一线路板11的厚度方向T，避让口13贯穿第一线路板11。避让口13贯穿第一线路板11后，便于第三器件50贯穿避让口13。
当然，避让口13除了贯穿第一线路板11以外，也可以不贯穿第一线路板11，如图8所示，在此不做具体限定。
在一些实施例中，如图8所示，图8为本申请另一些实施例中的壳体20与电路板组件10的连接的简化图。第一线路板11和第二线路板12通过架高板16层叠设置。
通过架高板16的设置，使得第一表面111与第二线路板12之间可设置高度较高的器件，增加了布置器件的面积；另外，通过架高板16与第一线路板11和第二线路板12层叠设置，提高了第一线路板11和第二线路板12连接的稳定性和可靠性。
在一些实施例中，如图8所示，沿第一线路板11的厚度方向T，第三器件50设置于第二线路板12靠近第一线路板11的一侧表面，且位于第一线路板11与第二线路板12之间，架高板16的厚度与第二线路板12的厚度之和小于第二器件45的高度。这样，沿第一线路板11的厚度方向T，在减小电路板组件10在平行于第一线路板11方向上的尺寸(比如宽度)的同时，通过架高板16的架高，增加了在第二线路板12相对的两表面上设置高度较高的第三器件50的面积。
在一些实施例中，如图5和图6所示，第三器件50的一部分高出第一表面111设置，且第三器件50高出第一表面111的距离h1小于第一器件40的高度H1。这样，凸出于第一表面111的距离由高度较低的第一器件40的高度决定，这样，后盖22就可以设计得靠近底壁201一些，从而有利于减小手机的厚度。
当然，第三器件50高出第一表面111的距离h1小于第一器件40的高度H1以外，第三器件50高出第一表面111的距离h1也可以等于第一器件40的高度H1，在此不做具体限定。
在一些实施例中，如图6所示，第二线路板12具有第一区域122，第一区域122超出第一线路板11的一侧边缘之外，第一区域122设有第三器件50。
采用上述技术方案，增大了在第二线路板12上设置较高第三器件50的面积，当第三 器件50为一个时，将该第三器件50设置于第一区域122上，避免了在第一线路板11上开设供该第三器件50穿过的避让口13，在不影响手机厚度的同时，减小了第一线路板11的加工工序；当第三器件50为多个时，可以将多个第三器件50中的部分设置于第一区域122上，另一部分第三器件50设置于第二线路板11上且通过第一线路板11上的避让口13凸出于第一表面111，相较于将多个第三器件50均通过避让口13穿过第一线路板11，这样，减小了在第一线路板11对应第三器件50的位置上开设避让口13的面积，提高了第一线路板11的强度，进而提高了第三器件50在第二线路板12上布置的灵活性。
如图7和9所示，图9为图6中的电路板组件10在另一个视角下的结构图。第二器件45高出第三表面121，其中，第三表面121为第二线路板12背离第一线路板11的一侧表面。
这样，在不增加电路板组件10厚度的情况下，可在第三表面121上设置高度较低的器件，增加了器件的布置面积，优化了电路板组件10上器件的布置。
在一些实施例中，如图6和图9所示，第二器件45包括用于供SIM卡插接的卡座451，卡座451设置于第二表面112上。这样，卡座451的布置充分利用第一线路板11与底壁201之间的空间，避免第一线路板11与底壁201之间的空间闲置浪费，从而提高了容纳空间203的空间利用率。
当然，卡座451除了可以设置在第二表面112以外，卡座451也可以设置在第二线路板12靠近第二表面112的一侧表面，在此不做具体限定。
卡座451是这样使用的，卡座451穿过侧壁202上开设的插口23处，插针72通过侧壁202上开设的插孔25插入，使得卡座451弹出于壳体20外，将SIM卡放入卡座451后将卡座451向壳体20的内部的方向移动至壳体20内。当SIM卡需要取出去，也是用插针72将卡座451弹出于壳体20外，在此不做赘述。
在一些实施例中，如图5和图9所示，第二线路板12的数目为两个，两个第二线路板12相隔设置以形成限位槽14，卡座451设置于限位槽14中。两个第二线路板12相隔设置以形成限位槽14，一方面，提高了第一线路板11和第二线路板12连接的稳定性和可靠性的同时，限位槽14有效限制了卡座451沿垂直于第一线路板11厚度方向T的方向的移动，避免卡座451长时间插拔过程中松动导致与第一线路板11接触不良。
第二线路板12的数目除了为两个以外，也可以为一个或三个、四个等等。示例的，第二线路板12为一个，在第二线路板12上卡座451对应位置开设限位槽14。这样，减少了电路板组件10的部件数量，提高了电路板组件10的功能整体一致性。
在一些实施例中，如图6和图9所示，第二器件45包括用于供外部设备的插头71插接的接口单元452，接口单元452设置于第二线路板12上，且沿第一线路板11的厚度方向T，接口单元452的一部分与第一线路板11、第二线路板12相重叠。如此设计，这样避免了接口单元452的尺寸与第一线路板11、第二线路板12的厚度相交叠，从而有利于减小了电路板组件10沿第一线路板11的厚度方向T的整体尺寸。
其中，接口单元452可以用于给手机充电的外部电源设备连接。接口单元452可以为Type-C接口、Micro-USB接口、Mini-USB接口中任意一种，在此不做具体限定。当然，接口单元452除了可以用于给手机充电的外部电源设备连接以外，也可以为USB接口或耳机接口等，在此不做具体限定。
需要说明的是，接口单元452的一部分可以与第一线路板11、第二线路板12均相重叠，也可以与第一线路板11或第二线路板12中的其中一个相重叠。
如图10和图11所示，图10为本申请一些实施例中的电路板组件10与扬声器64、天线小板65的连接结构分解图，图11为图6中的电路板组件10的部分结构示意图。接口单元452的位置处设有贯穿第一线路板11、第二线路板12的避让空间15，接口单元452的一部分(指的是接口单元452的连接部4521)设置于第三表面121上，接口单元452的另一部分(指的是接口单元452与外部设备的插头73插接的插槽部4522)位于避让空间15中，其中，第三表面121为第二线路板12背离第一线路板11的一侧表面。
通过将接口单元452的一部分设置在避让空间15中，这样可以减小接口单元452占用第一线路板11、第二线路板12的侧向空间，从而减小了电路板组件10在平行于第一线路板11方向上的尺寸(比如宽度)，进而有利于减小了电路板组件10对容纳空间203的占用；另一方面，避让空间15可对接口单元452起到限位的作用，有利于提高了接口单元452与第二线路板12电连接的可靠性。
当然，接口单元452也可以设置在第二表面112上，朝向第二线路板12的一侧，或者，接口单元452可以设置在第二线路板12靠近第二表面112的一侧表面，朝向第一表面111一侧或第三表面121一侧，在此不做具体限定。
在一些实施例中，如图6所示，接口单元452的一部分高出第一表面111，且接口单元452高出第一表面111的距离小于第一器件40的高度。示例的，接口单元452高出第一表面111的距离小于第二弹片402的高度。这样，沿第一线路板11的厚度方向T，接口单元452依旧由高度较低的第一器件40中高度最高的器件决定，接口单元452不会额外增加第一表面111与后盖22之间的距离，提高了电路板组件10在容纳空间203内的空间利用率。
在一些实施例中，如图9和图10所示，接口单元452与外部设备插接的一端通过连接耳18固定于第三表面121上，连接耳18向朝向第一表面111的一侧下凹搭接于第三表面121上，使接口单元452与外部设备插接的一端位于避让空间15中。连接耳18的设置，很好地限制了接口单元452沿平行于第一线路板11的方向的移动，进而提高了接口单元452与第二线路板12电连接的可靠性，进而提高了电路板组件10的可靠性。
在一些实施例中，如图5～图7所示，第一器件40、第三器件50均为多个，每个第三器件50高出第一表面111的距离均小于第一器件40高度的最大值。
通过采用上述方案，在后盖22与第一线路板11之间距离减小的同时，提高了每个第三器件50的高度范围。
在一些实施例中，如图3和图6所示，多个第一器件40分别为第一弹片401和第二弹片402，第一弹片401设置于第一表面111的边缘处，且用于与天线辐射体63电连接，第二弹片402用于与扬声器64电连接。分别通过第一弹片401和第二弹片402将天线和扬声器64电连接于第一线路板11上，在确保天线和扬声器64与第一线路板11电连接可靠性的同时，用户方便操作且成本低。
如图10所示，扬声器64包括下盖体641、喇叭单体643、第二柔性电路板61，下盖体641具有腔体642，喇叭单体643设置于腔体642，第二柔性电路板61一端与喇叭单体643电连接，另一端通过第二弹片402与电路板组件10电连接。此时，通过下盖体641 与底壁201固定，以使扬声器64与壳体20固定，此时，腔体642与壳体20的底壁201围合而成的空间形成音腔，这样使得扬声器64与底壁201紧密贴合，节省了上盖体所占容纳空间203的空间，进而减小了手机的厚度。
如图3所示，与扬声器64的音腔的出声部相对应的壳体20的侧壁202上开设有出声孔24，出声孔24用于将喇叭单体643发出的声音释放出壳体20外，出声孔24与音腔的出声部之间设置有防尘网644。通过设置防尘网644，阻止金属颗粒及其他灰尘通过出声孔24进入扬声器64中，进而减小灰尘对扬声器64性能的影响。出声孔24的数量需要综合壳体20侧壁202的尺寸、喇叭单体643和音腔的设置等因素而确定，在此不做具体限定。
如图6、图7、图10和图12所示，图12为图6的A-A剖视图。多个第三器件50分别为麦克风组件501、连接器组件504、天线连接器组件508。
如图6所示，麦克风组件501包括麦克风502以及屏蔽罩503，屏蔽罩503设置于第二线路板12上，麦克风502设置于屏蔽罩503中。具体地，第一线路板11的一侧开设有贯穿第一线路板11的避让口13，麦克风组件501整体位于避让口13中。
需要说明的是，麦克风502和屏蔽罩503均设置于第二线路板12靠近第二表面112的一侧表面时，麦克风组件501的高度为屏蔽罩503的高度，也就是说麦克风组件501的高度为第二线路板12靠近第二表面112的一侧表面与屏蔽罩503外底壁201最高处的距离。示例的，麦克风组件501的高度大于第一弹片401的高度，麦克风组件501高出于第一表面111，且麦克风组件501高出于第一表面111的高度小于第一器件40如第一弹片401的高度。
如图7和图12所示，连接器组件504包括固定件505、设置于第二线路板12上的第一连接器506、以及用于与第一柔性电路板60连接的第二连接器507，第二连接器507与第一连接器506电连接，固定件505用于将第二连接器507与第一连接器506相对固定，此时，第二连接器507与第一连接器506位于避让口13中。
需要说明的是，固定件505的结构为板状，第一连接器506和第二连接器507可以为BTB连接器的公母插座，通过固定件505使得第一连接器506和第二连接器507导通，实现电路板组件10与主板的电连接。连接器组件504的高度包括固定件505远离第二线路板12的一侧表面最高处与第二线路板12的第二连接器507所在一侧表面的距离。
在一些实施例中，如图7所示，第一柔性电路板60为两个，连接器组件504为两个，由于两个连接器组件504距离比较近，为节省电路板组件10的部件数量，将两个连接器组件504中的固定件505做成一体的板状结构，这样，固定件505将第一柔性电路板60铺设于第一线路板11的第一表面111上，避免了第一柔性电路板60在电路板组件10在组装过程中的损坏，提高了第一柔性电路板60与电路板组件10电连接可靠性。
当然，也可以对应设置两个固定件505，在此不做具体限定。
如图6和图10所示，天线连接器组件508包括设置在第二线路板12上的连接器本体5081及压板5082。示例的，连接器本体5081设置于第二线路板12的第一区域122上，通过压板5082将第三柔性电路板62的一端与天线连接器组件508电连接，第三柔性电路板62的另一端与天线小板65电连接，进而实现天线小板65与电路板组件10电连接。示例的，压板5082与扬声器64的下盖体641为一体结构。这样的设置，减小手机的零部件 的数量。
由于第三柔性电路板62可通过弯曲、折叠等方式与电路板组件10电连接，使得与容纳空间203的内部空间相适配，灵活性更好，且相较于硬质电路板占用空间小，省去了超声波焊接工序，进一步降低了电路板组件10的装配成本。
天线小板65的数量可以为一个或多个，以增加天线的馈电点，提高了天线的信号强度，天线小板65的具体数量和位置根据实际需要选择，在此不做具体限定。
在一些实施例中，如图5和图9所示，第三表面121上设有第四器件55，第四器件55的高度小于第二器件45高出第三表面121距离的最大值。这样，使得电路板组件10的厚度(也就是电路板组件10在第一线路板11的厚度方向T上的尺寸)与设置于第二表面112上的第二器件45的高度有关，减小了第四器件55对电路板组件10的厚度的影响，避免电路板组件10的厚度过大，从而使得容纳空间203内的布置更加紧凑。
在一些实施例中，如图9所示，第四器件55包括导电弹片551，导电弹片551连接有连接件552，连接件552的一部分伸出第三表面121的边缘之外且向第一线路板11的一侧延伸，以用于与天线辐射体63电连接。
相较于导电弹片551直接与天线辐射体63电连接，通过设置连接件522，这样就可以方便导电弹片551与电路板组件10侧向的天线辐射体63电连接，那么第一线路板11、第二线路板12在导电弹片551的位置就无需开设固定孔来安装导电弹片551(类似于图6中第一弹片401的安装结构)，从而就可以避免固定孔对第一线路板11、第二线路板12上空间的占用。
其中，导电弹片551和连接件552可以一体成型，也可以通过焊接或导电粘接等连接的分体结构，在此不做具体限定。
在一些实施例中，如图3和图9所示，导电弹片551和连接件552均为多个，每个导电弹片551连接一个连接件552，与一个天线辐射体63电连接，多个天线辐射体63设置于侧壁202且沿底壁201的周向相隔排布，每个连接件552电连接于一个天线辐射体63，以形成天线的馈电点。多个天线辐射体63的设置，增加了天线的馈电点，提高了天线的信号强度。
在一些实施例中，如图9所示，第四器件55还包括导电件553，导电件553与底壁201的金属部分电连接。具体地，第二线路板12上开设有安装孔17，导电件553设置于安装孔17的外围，紧固件穿过安装孔17将电路板组件10连接于底壁201上后，导电件553与底壁201的金属部分电连接。上述紧固件可以为螺钉或螺栓，在此不做具体限定。
其中，导电件553可用于天线的馈电或接地。示例的，导电件553可以为大面弹片。导电件553的数量可以为一个，在一个安装孔17处设置；导电件553也可以为多个，也就是说，在每个安装孔17处设置一个导电件553，以提高电路板组件10与底壁201电连接的可靠性。当然，导电件553也可以为金属弹簧等，在此不做具体限定。
在本说明书的描述中，具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
最后应说明的是：以上实施例仅用以说明本申请的技术方案，而非对其限制；尽管参照前述实施例对本申请进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而 这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例技术方案的精神和范围。

Claims (16)

  1. 一种电路板组件，其特征在于，包括：
    第一线路板，具有相背设置的第一表面和第二表面，所述第一表面上设有第一器件；
    第二器件，至少有一部分设置于所述第一线路板背离所述第一表面的一侧，所述第二器件用于供SIM卡、外部设备的插头中的至少一者插接；
    第二线路板，至少部分层叠设置于所述第二表面，所述第二线路板上设有第三器件，所述第三器件的高度大于所述第一器件的高度，且沿所述第一线路板的厚度方向，所述第三器件至少部分与所述第一线路板相重叠。
  2. 根据权利要求1所述的电路板组件，其特征在于，
    所述第一线路板上设有避让口，所述第二线路板在所述避让口处设有所述第三器件，并且所述第三器件至少部分位于所述避让口中。
  3. 根据权利要求2所述的电路板组件，其特征在于，
    沿所述第一线路板的厚度方向，所述避让口贯穿所述第一线路板。
  4. 根据权利要求1～3中任一项所述的电路板组件，其特征在于，
    所述第二线路板具有第一区域，所述第一区域超出所述第一线路板的一侧边缘之外，所述第一区域设有所述第三器件。
  5. 根据权利要求1～4中任一项所述的电路板组件，其特征在于，
    所述第三器件的一部分高出所述第一表面设置，且所述第三器件高出所述第一表面的距离小于所述第一器件的高度。
  6. 根据权利要求5所述的电路板组件，其特征在于，
    所述第一器件、所述第三器件均为多个，每个所述第三器件高出所述第一表面的距离均小于所述第一器件高度的最大值。
  7. 根据权利要求1～6中任一项所述的电路板组件，其特征在于，
    所述第二器件包括用于供SIM卡插接的卡座，所述卡座设置于所述第二表面上。
  8. 根据权利要求7所述的电路板组件，其特征在于，
    所述第二线路板的数目为两个，两个所述第二线路板相隔设置以形成限位槽，所述卡座设置于限位槽中。
  9. 根据权利要求1～8中任一项所述的电路板组件，其特征在于，
    所述第二器件包括用于供所述外部设备的插头插接的接口单元，所述接口单元设置于所述第二线路板上，且沿所述第一线路板的厚度方向，所述接口单元的一部分与所述第一线路板、所述第二线路板中的至少一者相重叠。
  10. 根据权利要求9所述的电路板组件，其特征在于，
    所述接口单元的一部分高出所述第一表面，且所述接口单元高出所述第一表面的距离小于所述第一器件的高度。
  11. 根据权利要求9或10所述的电路板组件，其特征在于，
    所述接口单元的位置处设有贯穿所述第一线路板、所述第二线路板的避让空间，所所述接口单元的一部分设置于所述第二线路板背离所述第一线路板的一侧表面，所述接口单元的另一部分位于所述避让空间中。
  12. 根据权利要求1～11中任一项所述的电路板组件，其特征在于，
    所述第二器件至少部分高出第三表面，所述第三表面为所述第二线路板背离所述第一线路板的一侧表面。
  13. 根据权利要求12所述的电路板组件，其特征在于，
    所述第三表面上设有第四器件，所述第四器件的高度小于所述第二器件高出所述第三表面距离的最大值。
  14. 根据权利要求13所述的电路板组件，其特征在于，
    所述第四器件包括导电弹片，所述导电弹片连接有连接件，所述连接件的一部分伸出所述第三表面的边缘之外且向所述第一线路板的一侧延伸，以用于与天线辐射体电连接。
  15. 根据权利要求1～14中任一项所述的电路板组件，其特征在于，
    所述第一线路板、所述第二线路板均为刚性线路板；和/或，所述第一线路板与所述第二线路板之间通过焊点电连接。
  16. 一种电子设备，其特征在于，包括：
    壳体，包括底壁、设置于所述底壁周缘处的侧壁、以及与所述侧壁连接的后盖，所述底壁、所述侧壁以及所述后盖围成容纳空间，所述侧壁上开设有用于供SIM卡、外部设备的插头插入的插口；
    显示屏，设置于所述底壁远离所述容纳空间的一侧，所述显示屏的边缘向所述后盖的一侧弯曲并且与所述侧壁相连接；
    权利要求1～15中任一项所述的电路板组件，设置于所述容纳空间中，所述第一线路板位于所述第二线路板靠近所述后盖的一侧，所述第二器件设置在所述插口处。
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