WO2024007996A1 - 天线单元及电子设备 - Google Patents

天线单元及电子设备 Download PDF

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Publication number
WO2024007996A1
WO2024007996A1 PCT/CN2023/104915 CN2023104915W WO2024007996A1 WO 2024007996 A1 WO2024007996 A1 WO 2024007996A1 CN 2023104915 W CN2023104915 W CN 2023104915W WO 2024007996 A1 WO2024007996 A1 WO 2024007996A1
Authority
WO
WIPO (PCT)
Prior art keywords
radiator
antenna unit
array
electronic device
projection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2023/104915
Other languages
English (en)
French (fr)
Other versions
WO2024007996A9 (zh
Inventor
朱乃达
吴鹏飞
姚羽
吴有全
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Priority to US18/881,187 priority Critical patent/US20260011923A1/en
Priority to EP23834763.7A priority patent/EP4510385A4/en
Publication of WO2024007996A1 publication Critical patent/WO2024007996A1/zh
Publication of WO2024007996A9 publication Critical patent/WO2024007996A9/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/48—Earthing means; Earth screens; Counterpoises
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
    • H01Q15/24—Polarising devices; Polarisation filters 
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q19/00—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
    • H01Q19/005—Patch antenna using one or more coplanar parasitic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/30—Arrangements for providing operation on different wavebands
    • H01Q5/307—Individual or coupled radiating elements, each element being fed in an unspecified way
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/30—Arrangements for providing operation on different wavebands
    • H01Q5/378—Combination of fed elements with parasitic elements
    • H01Q5/385—Two or more parasitic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/0414—Substantially flat resonant element parallel to ground plane, e.g. patch antenna in a stacked or folded configuration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/0421—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with a shorting wall or a shorting pin at one end of the element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/24—Combinations of antenna units polarised in different directions for transmitting or receiving circularly and elliptically polarised waves or waves linearly polarised in any direction
    • H01Q21/26—Turnstile or like antennas comprising arrangements of three or more elongated elements disposed radially and symmetrically in a horizontal plane about a common centre

Definitions

  • the present application relates to the field of antennas, and in particular, to an antenna unit and an electronic device.
  • the millimeter wave antenna when the millimeter wave antenna is placed under the back cover of the terminal device, the lower the antenna profile (or the height of the antenna), the more conducive to miniaturization of the antenna and the terminal device.
  • reducing the antenna profile or can be understood as reducing the height of the antenna will affect the performance of the antenna (such as the bandwidth of the antenna).
  • the size of the radiator in order to alleviate the adverse effects of reduced profile on antenna performance, the size of the radiator can be increased, thereby reducing the Q value of the antenna to improve the performance of the antenna (such as the bandwidth of the antenna).
  • increasing the size of the radiator increases the space occupied by the antenna in the terminal device, which is not conducive to the miniaturization of the antenna.
  • the existing technology has the problem that it is difficult to balance the miniaturization and high performance (such as higher bandwidth) of the antenna.
  • Embodiments of the present application provide an antenna unit and electronic equipment, which solve the problem in the prior art that it is difficult to balance the miniaturization and high performance (such as higher bandwidth) of the antenna.
  • the present application provides an antenna unit, which includes a first radiator and a grounding member.
  • the first radiator is relatively spaced from the floor along the height direction of the antenna unit, and the first radiator is connected to the floor through the grounding member.
  • the second radiator is spaced apart from the first radiator. Along the height direction of the antenna unit, the second radiator is spaced apart from the floor.
  • the radiator array is arranged relatively spaced apart from the first radiator along the height direction of the antenna unit, and is located on the side of the first radiator away from the floor; the radiator array includes at least two sub-radiators, along the radiator array. In the extending direction of the plane, at least two sub-radiators are arranged spaced apart from each other.
  • the first radiator has a first hollow area
  • the radiator array has a second hollow area
  • the projection of the first radiator on the projection surface is the first projection
  • the projection of the second radiator on the projection surface is the second projection
  • the projection of the radiator array on the projection surface is The projection is a third projection; the first projection and the third projection at least partially overlap, at least part of the second projection is located within the contour line formed by the first hollow area on the projection surface, and at least part of the second projection is located in the second hollow area Within the contour formed on the projection surface.
  • the first radiator is provided with a first feed connection point
  • the second radiator is provided with a second feed connection point
  • the first feed connection point is connected to the first feed point
  • the second feed connection point is connected to the second Feed point.
  • the antenna unit of the embodiment of the present application can use the first radiator to generate a resonance in a lower operating frequency band (such as 24GHz millimeter wave frequency band, 28GHz millimeter wave frequency band, etc.), and use the radiator array to generate another resonance, so that the antenna unit can
  • the lower operating frequency band has two resonances, thereby broadening the bandwidth of the antenna unit when operating in the low frequency band.
  • the antenna unit in the embodiment of the present application can also operate in higher operating frequency bands (such as the 39GHz millimeter wave frequency band, 60GHz millimeter wave frequency band ) Use the second radiator to generate one resonance, and use the first radiator and the radiator array to generate another resonance, so that the antenna unit has two resonances in a higher operating frequency band, thereby broadening the bandwidth of the antenna unit when operating in the high frequency band. . It can be seen that the antenna unit of the embodiment of the present application is not only applicable to multiple frequency bands, but also has a relatively high bandwidth in each frequency band.
  • the antenna unit of the present application when using the same antenna profile (or it can be understood as the height of the antenna), the antenna unit of the present application has a higher bandwidth, or it can be understood that: under the condition of meeting the same bandwidth requirements, the antenna unit of the embodiment of the present application has The antenna unit has a lower antenna profile (or can be understood as the height of the antenna), which is beneficial to the miniaturization of the antenna and helps to realize the miniaturization of electronic equipment.
  • the spacing between the first radiator and the radiator array is the spacing d1
  • the center frequency of the first working frequency band of the antenna unit corresponds to 0.0084 times of the medium wavelength ⁇ spacing d1.
  • 0.05mm ⁇ physical length of spacing d1 ⁇ 0.3mm In some possible embodiments, 0.05mm ⁇ physical length of spacing d1 ⁇ 0.3mm.
  • the distance between the first radiator and the floor is the distance d2
  • the center frequency of the first working frequency band of the antenna unit corresponds to 0.0168 times the wavelength of the medium ⁇ the electric distance d2 Length ⁇ 0.117 times the wavelength of the medium corresponding to the center frequency of the first operating frequency band of the antenna unit.
  • the first radiator when the antenna unit is in the first operating frequency band, the first radiator can be excited to generate the first resonance, and the radiator array can be excited to generate the second resonance.
  • the second radiator when the antenna unit is in the second operating frequency band, the second radiator can be excited to generate the third resonance, and the first radiator and the radiator array can be excited to generate the fourth resonance.
  • the first working frequency band and the second working frequency band are different working frequency bands.
  • a part of the first operating frequency band overlaps a part of the second operating frequency band, and another part of the first operating frequency band is lower than another part of the second operating frequency band.
  • the first operating frequency band and the second operating frequency band do not overlap at all, and the first operating frequency band is lower than the second operating frequency band.
  • the antenna unit further includes a first feed member and a second feed member. Both ends of the first feed member are connected to the first feed connection point and the first feed point respectively, and the second feed member is connected to the first feed connection point and the first feed point respectively. Both ends of the power feeding component are connected to the second power feeding connection point and the second power feeding point respectively.
  • the radiator array includes two sub-radiators, the two sub-radiators are distributed on both sides of the second radiator along the first direction, and the gap between the two sub-radiators along the first direction serves as the second hollow In the area, the first feed connection point and the second feed connection point are distributed along a first direction, wherein the first direction is parallel to the plane where the second radiator is located.
  • the radiator array is an axially symmetric structure.
  • the radiator array is in a ring shape.
  • the radiator array includes N sub-radiator groups.
  • Each sub-radiator group includes multiple sub-radiators.
  • the multiple sub-radiators in each sub-radiator group are spaced apart and adjacent end to end to form a ring structure, where N is greater than or equal to 1.
  • N is greater than or equal to 2
  • the N ring-shaped structures formed by the N sub-radiator groups are concentrically arranged on the same plane and form a multi-layered ring structure.
  • the innermost ring structure among the N ring-shaped structures surrounds The inner space formed is used as the second hollow area.
  • the second projection is entirely located within the contour line formed by the second hollow area on the projection surface, and the second projection is entirely located within the contour line formed by the first hollow area on the projection surface.
  • the first radiator is further provided with a third feed connection point, the third feed connection point is connected to the third feed point, the second radiator is also provided with a fourth feed connection point, and the fourth The feed connection point is connected to the fourth feed point.
  • the included angle between the line connecting the first feed connection point and the center point of the first radiator, and the line connecting the third feed connection point and the center point of the first radiator is 90°.
  • the included angle between the line connecting the second feed connection point and the center point of the second radiator, and the line connecting the fourth feed connection point and the center point of the second radiator is 90°.
  • the antenna unit can achieve dual polarization when operating in both low-frequency and high-frequency bands, which is beneficial to improving the signal-to-noise ratio of the antenna unit and thereby increasing channel capacity.
  • the antenna unit further includes a third feeder and a fourth feeder. Both ends of the third feeder are connected to the third feed connection point and the third feed point respectively.
  • the fourth feeder Both ends of the power feeding component are connected to the fourth power feeding connection point and the fourth power feeding point respectively.
  • the first radiator has an annular shape, and the first radiator has an axially symmetric structure.
  • the grounding member has a ring-shaped columnar structure, one end of the grounding member is connected to the inner edge of the first radiator, and the other end of the grounding member is connected to the floor; or: the grounding member includes a plurality of grounding members arranged at circumferential intervals along the inner edge of the first radiator. A first end of each of the plurality of ground posts is connected to an inner edge of the first radiator.
  • the plurality of ground posts are evenly distributed circumferentially along the inner edge of the first radiator.
  • the first radiator has a first symmetry axis and a second symmetry axis that are perpendicular to each other, and the first radiator, the second radiator, and the radiator array are all symmetrical about the first symmetry axis and the second symmetry axis. Furthermore, the central axis of the first radiator, the central axis of the second radiator and the central axis of the radiator array coincide with each other.
  • the first radiator, the second radiator and the radiator array are all sheet-shaped radiators.
  • This application also provides an electronic device, including the antenna unit involved in the above embodiments and possible embodiments.
  • the antenna unit of the embodiment of the present application has a lower antenna profile (or can be understood as the height of the antenna) under the condition of meeting the same bandwidth requirement, the antenna unit of the embodiment of the present application occupies less space in the electronic device. , thus helping to achieve electronic Miniaturization of equipment.
  • the electronic device includes a plurality of antenna units, and the plurality of antenna units are distributed in an array in the electronic device.
  • the electronic device further includes a dielectric structure, and the first radiator, the second radiator and the radiator array are all disposed in the dielectric structure.
  • the electronic device further includes a back cover and a dielectric structure
  • the radiator array is attached to a surface of the back cover facing the inside of the electronic device, and the first radiator and the second radiator are disposed on the dielectric structure.
  • the electronic device further includes a back cover and a metal wall structure.
  • the back cover is arranged opposite to the antenna unit.
  • the metal wall structure is abutted between the back cover and the floor to enclose the antenna unit in the metal wall structure and the back wall. in the space formed by the cover and floor.
  • the first radiator includes a conductive component disposed in the electronic device
  • the second radiator includes a conductive component disposed in the electronic device
  • the radiator array includes a conductive component disposed in the electronic device
  • the first radiator includes a portion of the conductive layer in the PCB board
  • the second radiator includes a portion of the conductive layer in the PCB board
  • the radiator array includes a portion of the conductive layer in the PCB board
  • the floor includes a ground layer in the PCB board. part.
  • Figure 1 schematically shows an electronic device provided by an embodiment of the present application
  • Figure 2a is a schematic cross-sectional structural diagram of an antenna unit according to an embodiment of the present application.
  • Figure 2b is a schematic projection diagram of each radiator of the antenna unit according to the embodiment of the present application formed on the projection plane;
  • Figure 2c is a schematic top view of the structure of the antenna unit according to the embodiment of the present application.
  • Figure 3 is a schematic top view of the structure of the first radiator and the second radiator in the antenna unit according to the embodiment of the present application;
  • Figure 4 is a schematic top view of the structure of the first radiator and grounding column of the antenna unit according to the embodiment of the present application;
  • Figure 5a is a schematic top view of the structure of the radiator array in the antenna unit according to the embodiment of the present application.
  • Figure 5b is a schematic top view of the structure of the radiator array in the antenna unit according to the embodiment of the present application, in which the radiation array includes two sub-radiator groups;
  • Figure 6 is a schematic three-dimensional structural diagram of an antenna unit in an electronic device according to an embodiment of the present application, in which some sub-radiators in the radiator array are in a ring shape;
  • Figure 7 is a schematic diagram of a partial three-dimensional explosion structure of an electronic device according to an embodiment of the present application.
  • Figure 8 is a partial cross-sectional structural schematic diagram of an electronic device according to an embodiment of the present application.
  • FIG. 9 is a partial cross-sectional structural diagram of an electronic device according to an embodiment of the present application, in which the radiator array is attached to the surface of the back cover facing the inside of the electronic device;
  • Figures 10 and 11 are schematic cross-sectional structural diagrams of the antenna unit and the metal enclosure structure in the electronic device according to the embodiment of the present application;
  • Figure 12 is a partial three-dimensional structural diagram of an electronic device according to an embodiment of the present application, in which multiple antenna units are distributed in an array in the electronic device;
  • Figure 13 is a partially enlarged three-dimensional structural diagram of an antenna unit in an electronic device according to an embodiment of the present application.
  • Figure 14 is a S11 parameter effect curve obtained by analyzing the simulation effect of the antenna unit according to the embodiment of the present application.
  • Figure 15 is a gain effect curve obtained by analyzing the simulation effect of the antenna unit according to the embodiment of the present application.
  • connection should be understood in a broad sense.
  • connection or integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be an internal connection between two components.
  • connection or integral connection
  • connection or integral connection
  • connection can be a mechanical connection or an electrical connection
  • it can be a direct connection or an indirect connection through an intermediate medium
  • it can be an internal connection between two components.
  • specific meanings of the above terms in this application can be understood on a case-by-case basis.
  • Relative setting It can be understood as facing (opposite to, or face to face) setting or setting with at least partial overlap in a certain direction.
  • two oppositely arranged radiators are arranged adjacently without any other radiators between them.
  • Coupling can be understood as direct coupling and/or indirect coupling, and "coupling connection” can be understood as direct coupling connection and/or indirect coupling connection.
  • Direct coupling can also be called “electrical connection”, which is understood as the physical contact and electrical conduction of components; it can also be understood as the printed circuit board (PCB) copper foil or wires between different components in the circuit structure.
  • PCB printed circuit board
  • indirect coupling can be understood as two conductors being electrically connected through space/non-contact.
  • indirect coupling may also be called capacitive coupling, for example, signal transmission is achieved by forming an equivalent capacitance through coupling between a gap between two conductive members.
  • Ground/floor It can generally refer to at least a part of any ground layer, or ground plate, or ground metal layer, etc. in an electronic device (such as a mobile phone), or at least part of any combination of any of the above ground layers, or ground plates, or ground components, etc.
  • ground/floor can be used for grounding components within electronic equipment.
  • "ground/floor” may include any one or more of the following: the ground layer of the circuit board of the electronic device, the ground plate formed by the middle frame of the electronic device, the ground metal layer formed by the metal film under the screen, the ground metal layer of the battery Conductive ground layer, and conductive parts or metal parts that are electrically connected to the above-mentioned ground layer/ground plate/metal layer.
  • the circuit board may be a printed circuit board (PCB), such as an 8-, 10-, or 12- to 14-layer board with 8, 10, 12, 13, or 14 layers of conductive material, or by a circuit board such as Components separated and electrically insulated by dielectric or insulating layers such as fiberglass, polymer, etc.
  • the circuit board includes a dielectric substrate, a ground layer and a wiring layer, and the wiring layer and the ground layer are electrically connected through via holes.
  • components such as a display, touch screen, input buttons, transmitter, processor, memory, battery, charging circuit, system on chip (SoC) structure, etc. may be mounted on or connected to the circuit board; Or electrically connected to trace and/or ground planes in the circuit board.
  • SoC system on chip
  • ground layers, or ground plates, or ground metal layers are made of conductive materials.
  • the conductive material can be any of the following materials: copper, aluminum, stainless steel, brass and their alloys, copper foil on an insulating substrate, aluminum foil on an insulating substrate, gold foil on an insulating substrate, Silver-plated copper, silver-plated copper foil on an insulating substrate, silver foil and tin-plated copper on an insulating substrate, cloth impregnated with graphite powder, graphite-coated substrate, copper-plated substrate, brass-plated substrate sheet and aluminized substrate.
  • the ground layer/ground plate/ground metal layer can also be made of other conductive materials.
  • Electrical length can refer to the physical length (i.e. mechanical length or geometric length) multiplied by the transmission time of an electrical or electromagnetic signal in the medium required to travel the same distance in free space as the physical length of the medium. Expressed as a ratio of time, the electrical length can be Satisfy the following formula:
  • L is the physical length
  • a is the transmission time of electrical or electromagnetic signals in the medium
  • b is the transmission time in free space.
  • the electrical length can also refer to the ratio of the physical length (i.e. mechanical length or geometric length) to the wavelength of the transmitted electromagnetic wave.
  • the electrical length can satisfy the following formula:
  • L is the physical length
  • ⁇ is the wavelength of the electromagnetic wave.
  • the wavelength in a certain wavelength mode (such as a half-wavelength mode, etc.) of the antenna may refer to the wavelength of the signal radiated by the antenna.
  • the half-wavelength mode of the suspended metal antenna may generate resonance including a frequency band of 1.575 GHz, where the wavelength in the half-wavelength mode may refer to the wavelength at which the antenna radiates signals in the 1.575 GHz frequency band.
  • Medium wavelength (speed of light/ )/frequency, where ⁇ is the dielectric constant of the medium and frequency is the frequency of the radiation signal.
  • ⁇ is the dielectric constant of the medium and frequency is the frequency of the radiation signal.
  • the gaps and grooves in the above embodiments can be filled with insulating medium.
  • the technical solution provided by this application is applicable to electronic devices with one or more of the following communication technologies: Bluetooth (BT) communication technology, global positioning system (GPS) communication technology, wireless fidelity, WiFi) communication technology, global system for mobile communications (GSM) technology, wideband code division multiple access (WCDMA) communication technology, long term evolution (LTE) communication technology, 5G Communication technology, SUB-6G communication technology, millimeter wave communication technology and other future communication technologies, etc.
  • BT Bluetooth
  • GPS global positioning system
  • WiFi wireless fidelity
  • GSM global system for mobile communications
  • GSM global system for mobile communications
  • WCDMA wideband code division multiple access
  • LTE long term evolution
  • 5G Communication technology 5G Communication technology
  • SUB-6G communication technology millimeter wave communication technology and other future communication technologies
  • Electronic devices in the embodiments of this application may be mobile phones, tablets, laptops, smart speakers, smart homes, smart bracelets, smart watches, smart helmets, smart glasses, drones, wireless wearables, vehicle-mounted modules, etc.
  • the electronic device may also be a handheld device with wireless communication capabilities, a computing device or other processing device connected to a wireless modem, a vehicle-mounted device, an electronic device in a 5G network or a future evolved public land mobile network (PLMN) ), wireless routing or customer premise equipment (CPE), etc., the embodiments of the present application are not limited to this.
  • FIG. 1 schematically shows an electronic device provided by this application. The electronic device is described using a mobile phone as an example.
  • the electronic device 2 may include: a cover 25 , a display screen/module 241 , a printed circuit board (PCB board 20A), a middle frame 26 and a back cover 231 .
  • the cover 25 can be a glass cover, or can be replaced with a cover made of other materials, such as an ultra-thin glass material cover, PET (Polyethylene terephthalate, polyethylene terephthalate) ) material cover, etc.
  • the cover 25 can be placed close to the display screen/module 241, and can be mainly used to protect the display screen/module 241 and prevent dust.
  • the display screen/module 241 may include a liquid crystal display panel (LCD), a light emitting diode (LED) display panel or an organic light-emitting diode (OLED) display. Panels, etc., this application does not limit this.
  • LCD liquid crystal display panel
  • LED light emitting diode
  • OLED organic light-emitting diode
  • the middle frame 26 mainly plays a supporting role of the entire machine.
  • Figure 1 shows that the PCB board 20A is disposed between the middle frame 26 and the back cover 231. It should be understood that in one embodiment, the PCB board 20A can also be disposed between the middle frame 26 and the display screen/module 241. This application does not limit this.
  • the printed circuit board PCB board 20A can use a flame-resistant material (FR-4) dielectric board, a Rogers dielectric board, a mixed dielectric board of Rogers and FR-4, and so on.
  • FR-4 is the code for a flame-resistant material grade
  • Rogers dielectric board is a high-frequency board.
  • the PCB board 20A carries electronic components, such as radio frequency chips, etc.
  • a metal layer may be disposed on the printed circuit board PCB 20A.
  • the metal layer can be used for grounding the electronic components carried on the printed circuit board PCB 20A, and can also be used for grounding other components, such as bracket antennas, frame antennas, etc.
  • the metal layer can be called a floor, a ground plate, or a ground layer.
  • the metal layer may be formed by etching metal on the surface of any dielectric board in the PCB board 20A.
  • the metal layer used for grounding may be disposed on a side of the printed circuit board 20A close to the middle frame 26 .
  • the edge of the printed circuit board PCB 20A can be regarded as the edge of its ground layer.
  • the metal middle frame 26 can also be used for grounding the above components.
  • the electronic device 2 may also have other floors/ground plates/ground layers, as mentioned above, which will not be described again here.
  • the electronic device 2 may also include a battery (not shown in the figure).
  • the battery may be disposed between the middle frame 26 and the back cover 231 , or may be disposed between the middle frame 26 and the display/module 241 , which is not limited in this application.
  • the PCB board 20A is divided into a main board and a sub-board, and the battery can be disposed between the main board and the sub-board.
  • the main board can be disposed between the middle frame 26 and the upper edge of the battery, and the sub-board can It is arranged between the middle frame 26 and the lower edge of the battery.
  • the middle frame 26 may include a frame 261. As an integral part, the middle frame 26 including the frame 261 may support electronic devices in the entire machine.
  • the cover 25 and the back cover 231 are respectively covered along the upper and lower edges of the frame to form a shell or housing of the electronic device.
  • the cover 25 , the back cover 231 , the frame 261 , and the middle frame 26 can be collectively referred to as the casing or housing of the electronic device 2 .
  • casing or housing can be used to refer to part or all of any one of the cover 25 , the back cover 231 , the frame 261 or the middle frame 26 , or to refer to the cover 25 , the back cover 231 , or the frame 261 or any combination of part or all of box 26.
  • the back cover 231 can be a back cover made of metal material; it can also be a back cover made of non-conductive materials, such as glass back cover, plastic back cover and other non-metal back covers; it can also be made of both conductive materials and non-conductive materials. Completed back cover.
  • the antenna of the electronic device 2 may also be provided in the housing, such as a bracket antenna, an onboard antenna formed on the PCB board 20A, a millimeter wave antenna module, etc. (not shown in FIG. 1 ). There may be a gap between the antenna located in the housing and other conductive parts inside the housing, thereby ensuring that the antenna radiator has a good radiation environment.
  • an aperture may be provided near the antenna radiator.
  • the aperture may include an aperture disposed inside the electronic device 2 , for example, an aperture that is not visible from an exterior surface of the electronic device 2 .
  • the internal aperture can be formed by any one of the frame, the middle frame, the battery, the circuit board, the back cover, the display screen, and other internal conductive parts or by a plurality of them together.
  • the internal aperture can be formed by the middle frame.
  • the structural members of the frame are formed.
  • the aperture may also include a slit/slit/opening provided on the frame 261 .
  • the slit/slit/opening on the frame 261 may be a break formed on the frame, and the frame 261 is divided into two parts that are not directly connected at the break.
  • the aperture may also include a slit/slit/opening provided on the back cover 231 or the display screen/module 241.
  • the back cover 231 includes a conductive material, and the apertures provided in the conductive material can be connected with the slits or breaks of the frame to form continuous apertures on the appearance of the electronic device 2 .
  • the aperture on the back cover 231 or the display screen can also be used to place other devices, such as cameras, and/or sensors, and/or microphones, and/or speakers, and so on.
  • the antenna may be in the form of a Flexible Printed Circuit (FPC)-based antenna, a Laser-Direct-structuring (LDS)-based antenna, or a Microstrip Disk Antenna. MDA) and other antenna forms.
  • the antenna may also adopt a transparent structure embedded inside the screen of the electronic device, so that the antenna is a transparent antenna unit embedded inside the screen of the electronic device.
  • FIG. 1 only schematically shows some components included in the electronic device 2, and the actual shapes, actual sizes and actual structures of these components are not limited by FIG. 1 .
  • the side where the display screen of the electronic device is located can be considered to be the front
  • the side where the back cover is located is the back
  • the side where the frame is located is the side.
  • the orientation of the electronic device has a top, a bottom, a left side, and a right side.
  • the physical length of the antenna radiator may be (1 ⁇ 10%) times its electrical length.
  • Figure 2a is a schematic cross-sectional structural diagram of the antenna unit according to the embodiment of the present application.
  • Figure 2b is a schematic diagram of the projection formed by each radiator of the antenna unit on the projection surface according to the embodiment of the present application.
  • Figure 2c is a schematic diagram of the structure of the antenna unit according to the embodiment of the present application.
  • This application provides an antenna unit 1, which includes a first radiator 11 and a grounding member 21. Along the height direction H of the antenna unit, the first radiator 11 is spaced apart from the floor 20 . Furthermore, the first radiator 11 is connected to the floor 20 through the grounding member 21 .
  • the antenna unit 1 also includes a second radiator 12.
  • the second radiator 12 is spaced apart from the first radiator 11.
  • the second radiator 12 and the floor 20 are relatively spaced apart.
  • the second radiator 12 is at the same height as the first radiator 11 . In one embodiment, the second radiator 12 is located on a side of the first radiator 11 away from the floor 20 .
  • the second radiator 12 It can be at the same height as the radiator array 13, or it can be slightly higher or slightly lower than the radiator array 13. In other alternative embodiments, the second radiator 12 can also be located between the first radiator 11 and the floor. between 20.
  • the frequency ratio of the two operating frequency bands of the antenna unit can be adjusted by whether the second radiator 12 is grounded, so as to be suitable for different operating frequency bands of the antenna unit, or it can be understood that: whether the second radiator 12 is grounded can be adjusted as needed.
  • the design may be grounded or ungrounded, and this application does not limit this.
  • the antenna unit 1 also includes a radiator array 13. Along the height direction H of the antenna unit, the radiator array 13 is spaced apart from the first radiator 11 and is located on the side of the first radiator 11 away from the floor 20; the radiator array 13 It includes at least two sub-radiators, and the at least two sub-radiators are spaced apart from each other along the extension direction of the plane where the radiator array 13 is located. In one embodiment, the radiator array 13 has an axially symmetric structure.
  • the first radiator 11 has a first hollow area S1
  • the radiator array 13 has a second hollow area S2.
  • the plane parallel to the plane of the floor 20 is the projection surface
  • the projection of the first radiator 11 on the projection surface is the first projection T1
  • the projection of the second radiator 12 is The projection on the surface is the second projection T2
  • the projection of the radiator array 13 on the projection surface is the third projection T3; wherein, the first projection T1 and the third projection T3 at least partially overlap, and at least part of the second projection T2 is located
  • the first hollow area S1 is within the contour line M1 formed on the projection surface
  • at least part of the second projection T2 is located within the contour line M2 formed by the second hollow area S2 (shown as a dotted line in Figure 2b) on the projection surface.
  • At least part of the second projection T2 is located within the contour line M1, and at least part of the second projection T2 is located within the contour line M2. It can be understood that at least part of the second radiator 12 can pass through the first hollow area of the first radiator 11. S1 and the second hollow area S2 of the radiator array 13 radiate outward.
  • At least part of the second projection T2 is located within the contour line M1, and at least part of the second projection T2 is located within the contour line M2. It can also be understood that: from the top view direction of the antenna unit, at least part of the second radiator 12 is located in the first The second radiator 12 is located in the first hollow area S1 of the radiator 11 , and at least part of the second radiator 12 is located in the second hollow area S2 of the radiator array 13 .
  • the second projection T2 is entirely located within the contour line M2 formed by the second hollow area S2 on the projection surface, and the second projection T2 is entirely located within the contour line M1 formed by the first hollow area S1 on the projection surface.
  • the second projection T2 is entirely located within the contour line M2, and the second projection T2 is entirely located within the contour line M1, or it can be understood as: viewed from the top view direction of the antenna unit, all the second radiators 12 are located in the second hollow of the radiator array 13 In the area S2, and the second radiator 12 is entirely located in the first hollow area S1 of the first radiator 11.
  • the first radiator 11 is provided with a first feed connection point A1
  • the second radiator 12 is provided with a second feed connection point A2
  • the first feed connection point A1 is connected to the A feed point (not shown in the figure)
  • the second feed connection point A2 is connected to the second feed point (not shown in the figure).
  • the feed point in this application can be understood as a signal output end of the radio frequency source (or can be called a feed source).
  • it can be the output pin of the radio frequency chip, or it can also be used to connect the radio frequency source.
  • one end of the signal transmission line can be electrically connected to the radio frequency source through the feed point and receive the radio frequency signal, it does not depart from the scope of this embodiment.
  • the connection method between the first feed connection point A1 and the first feed point, and the connection method between the second feed connection point A2 and the second feed point are not limited. They can be directly connected or indirectly connected.
  • the connection may be through a feeder.
  • the antenna unit 1 also includes a feeder 221 and a feeder 222.
  • the two ends of the feeder 221 are respectively connected to the first The feed connection point A1 and the first feed point (not shown in the figure), and the two ends of the feed member 222 are respectively connected to the second feed connection point A2 and the second feed point (not shown in the figure).
  • the type of the feed component is not limited, and may be, for example, a conductive component provided in an electronic device, or a feed probe formed through a metal via hole, or the like.
  • the antenna unit of the present application can be applied to the two working frequency bands of millimeter wave antennas, low frequency band and high frequency band, and has a wide bandwidth in both frequency bands.
  • the low frequency band can be, for example, 24GHz millimeter wave frequency band, 28GHz millimeter wave frequency band.
  • the high frequency band may be, for example, 39GHz millimeter wave band, 60GHz millimeter wave band, etc.
  • the first radiator 11 can provide the first resonance for the antenna unit to work in the low frequency band
  • the radiator array 13 can provide the second resonance for the antenna unit to work in the low frequency band.
  • the antenna unit has two resonances in the low frequency band, thereby allowing the antenna unit to have a wider bandwidth in the low frequency band (for example, it can cover about 19.6% of the relative bandwidth in the millimeter wave 28GHz band), and the second radiator 12 can Providing the first resonance of the antenna unit to work in the high frequency band, the radiator array 13 and the first radiator 11 can provide the second resonance of the antenna unit to work in the high frequency band, so that the antenna unit has two resonances in the high frequency band, thereby making the antenna single
  • the element has a wider bandwidth in the high frequency band (for example, it can cover about 16.7% of the relative bandwidth in the millimeter wave 39GHz band).
  • the antenna unit of the present application can use the first radiator 11, the second radiator 12 and the radiator array 13, the antenna unit has two working modes: TM10 mode and anti-phase TM20 mode. , enriches the working mode of the antenna, so the antenna unit of the present application can greatly broaden the bandwidth of the antenna.
  • the antenna unit of the embodiment of the present application can use the first radiator 11 to generate one resonance and use the radiator array 13 to generate another resonance in a lower operating frequency band (such as the 24GHz millimeter wave frequency band, 28GHz millimeter wave frequency band, etc.), so that The antenna unit has two resonances in a lower operating frequency band, thus broadening the bandwidth of the antenna unit when operating in the low frequency band.
  • a lower operating frequency band such as the 24GHz millimeter wave frequency band, 28GHz millimeter wave frequency band, etc.
  • the antenna unit of the embodiment of the present application can also operate in a higher operating frequency band (such as the 39GHz millimeter wave band, 60GHz millimeter wave frequency band) uses the second radiator 12 to generate one resonance, and uses the first radiator 11 and the radiator array 13 to generate another resonance, so that the antenna unit has two resonances in a higher operating frequency band, thereby broadening the antenna unit Bandwidth when operating in high frequency bands.
  • a higher operating frequency band such as the 39GHz millimeter wave band, 60GHz millimeter wave frequency band
  • the antenna unit of the present application has a higher bandwidth, or it can be understood that: under the condition of meeting the same bandwidth requirements, the antenna of the embodiment of the present application
  • the unit has a lower antenna profile (or can be understood as the height of the antenna), which is conducive to the miniaturization of the antenna and the miniaturization of electronic equipment.
  • each radiator is not limited.
  • the first radiator 11 can be in the shape of a rectangular ring, a circular ring, a triangular ring, etc.
  • the second radiator 12 can be in a circular, rectangular, ring, or triangles, polygons, etc.
  • the shape of the sub-radiators 132 in the radiator array 13 can be circles, rectangles, rings, triangles, polygons, etc.
  • the operating frequency band when the antenna unit operates at low frequency is the first operating frequency band.
  • the first operating frequency band is: 24.25GHz-29.5GHz.
  • the center frequency of this frequency band is: 26.875GHz.
  • the medium structure (such as mentioned later)
  • the dielectric constant of the dielectric structure 201 and the dielectric structure 202 is 3.5.
  • the medium wavelength corresponding to the first working frequency band is:
  • the working frequency band of the antenna unit when working at high frequency is the second working frequency band.
  • the second working frequency band is: 37GHz-43.5GHz.
  • the center frequency of this frequency band is: 40.25GHz.
  • the medium structure (such as mentioned later)
  • the dielectric constant of the dielectric structure 201 and the dielectric structure 202 is 3.5.
  • the medium wavelength corresponding to the second operating frequency band is:
  • the spacing between the first radiator 11 and the radiator array 13 is the spacing d1
  • the medium wavelength corresponding to the center frequency of the first operating frequency band of the antenna unit is 0.0084 times ⁇ the electrical length of spacing d1 ⁇ 0.05 times the wavelength of the medium corresponding to the center frequency of the first operating frequency band of the antenna unit.
  • 0.05mm ⁇ the physical length of the distance d1 ⁇ 0.3mm for example, it can be 0.1mm. In other alternative embodiments, it can also be other values.
  • the distance between the first radiator 11 and the floor 20 is the distance d2
  • the center frequency of the first operating frequency band of the antenna unit corresponds to an electric distance of 0.0168 times the wavelength of the medium ⁇ the distance d2.
  • each radiator and the spacing between each radiator for example, the spacing between the first radiator 11 and the radiator array 13
  • the frequency ratio of the two operating frequency bands of the antenna unit can be adjusted, thereby eliminating unnecessary
  • the working mode is moved outside the working frequency band of the antenna unit to be suitable for different application scenarios.
  • the formation method of the radiator is not limited. In one embodiment, it can be formed by a conductive component provided in an electronic device. In other embodiments, it can also be formed by a conductive layer (or can be understood as a wiring layer) in a PCB board. , specifically, the first radiator 11 includes a part of the conductive layer in the PCB board, the second radiator 12 includes a part of the conductive layer in the PCB board, the radiator array 13 includes a part of the conductive layer in the PCB board, and the floor 20 Includes part of the ground plane in the PCB board.
  • the formation method of the ground member 21 is not limited. For example, it may be a conductive member provided in an electronic device, or it may be formed through a metal via hole.
  • the first radiator 11, the second radiator 12 and the radiator array 13 are all sheet radiators, which are suitable for the application scenario of a patch antenna (or patch antenna).
  • the first operating frequency band when the antenna unit 1 is in the first operating frequency band, the first operating frequency band may be, for example, the millimeter wave 28GHz frequency band, that is, within the frequency range of 24.25GHz to 29.5GHz, the first radiator 11 can be excited to generate the first resonance.
  • the resonant frequency of the first resonance may be, for example, 25.25 GHz
  • the radiator array 13 can be excited to generate a second resonance
  • the resonant frequency of the second resonance may be, for example, 28 GHz.
  • the second operating frequency band When the antenna unit is in the second operating frequency band, the second operating frequency band may be, for example, the millimeter wave 39GHz frequency band, that is, In the frequency range of 37GHz to 43.5GHz, the second radiator 12 can be excited to generate a third resonance.
  • the resonance frequency of the third resonance can be, for example, 38.25GHz.
  • the first radiator 11 and the radiator array 13 can be excited to generate a fourth resonance.
  • the resonant frequency of the fourth resonance may be,
  • Figure 3 is a schematic top view of the structure of the first radiator and the second radiator in the antenna unit according to the embodiment of the present application.
  • the first radiator 11 is also provided with a third feed connection point A3.
  • the third feed connection point A3 is connected to a third feed point (not shown in the figure).
  • the second radiator 12 is also provided with a fourth feed point.
  • Connection point A4, the fourth feed connection point A4 is connected to the fourth feed point (not shown in the figure).
  • the third feeding connection point A3 is connected to the third feeding point (not shown in the figure) through the feeding part 223, and the fourth feeding connection point A4 is connected to the third feeding point through the feeding part 224.
  • the third feed connection point A3 and the fourth feed connection point A4 may also be directly connected to the corresponding feed points.
  • the connection between the first feed connection point A1 and the center point O1 of the first radiator 11, and the connection between the third feed connection point A3 and the center point O1 of the first radiator 11 The angle between the lines is 90°. Or it can be understood that: the angle difference between the first feed connection point A1 and the third feed connection point A3 in the circumferential direction of the first radiator 11 is 90°.
  • the line connecting the second feed connection point A2 and the center point O2 of the second radiator 12 (in Figure 2c, the center point O1 and the center point O2 coincide), and the fourth feed connection point A4 and the second radiator 12
  • the angle between the lines connecting the center point O2 (in Figure 2c, the center point O1 and the center point O2 coincide) is 90°.
  • the angle difference between the second feed connection point A2 and the fourth feed connection point A4 in the circumferential direction of the second radiator 12 is 90°.
  • the first radiator 11 is in the shape of a circular ring, so the center point of the first radiator 11 is located at the center of the ring. In other embodiments, the first radiator 11 and the second radiator 12 have other shapes.
  • the center point O1 of the first radiator 11 can also be located at other positions, and the center point O2 of the second radiator 12 can also be located at other positions, along the extension direction of the plane where the radiator is located, or it can be understood as: from Figure 2c From the perspective shown, the center point O1 of the first radiator 11 and the center point O2 of the second radiator 12 may not coincide with each other.
  • the positional relationship between the first feed connection point A1 and the second feed connection point A2 is not limited.
  • the connection line between the first feed connection point A1 and the center point O1 of the first radiator 11, and The connection line between the second feed connection point A2 and the center point O2 of the second radiator 12 can be parallel, or can be understood as: as shown in Figure 2c, along the length direction L of the radiator, the first feed connection point A1 and the second feed connection point A2 are arranged in alignment.
  • the line connecting the first feed connection point A1 and the center point O1 of the first radiator 11, and the line connecting the second feed connection point A2 and the second feed connection point A2 are The lines connecting the center points O2 of the two radiators 12 may not be parallel.
  • the first feed connection point A1 and the second feed connection point A2 may be Misplaced settings.
  • the positional relationship between the third feed connection point A3 and the fourth feed connection point A4 is not limited. Along the length direction L of the radiator, they may be aligned or disposed.
  • the antenna unit in the embodiment of the present application can set two feed connection points (the first feed connection point A1 and the third feed connection point A3) on the first radiator 11, and the two feed connection points (the first feed connection point A3)
  • the angle difference between the feed connection point A1 and the third feed connection point A3) along the circumferential direction of the first radiator 11 is 90°
  • two feed connection points (the second feed connection point) are provided on the second radiator 12 point A2 and the fourth feed connection point A4)
  • the angle difference between the two feed connection points (the second feed connection point A2 and the fourth feed connection point A4) along the circumferential direction of the second radiator 12 is 90° °, which enables the antenna unit to achieve dual polarization when operating in both low-frequency and high-frequency bands, which is beneficial to improving the signal-to-noise ratio of the antenna unit and increasing channel capacity.
  • the first radiator 11 is annular, and the first radiator 11 has an axially symmetric structure.
  • the grounding member 21 has an annular columnar structure, one end of the grounding member 21 is connected to the inner edge of the first radiator 11 , and the other end of the grounding member 21 is connected to the floor 20 .
  • Figure 4 is a schematic top structural view of the first radiator and grounding post of the antenna unit according to the embodiment of the present application.
  • the grounding member 21 includes a plurality of grounding posts 211 circumferentially spaced along the inner edge of the first radiator 11 .
  • the first end of each grounding post 211 in the plurality of grounding posts 211 is connected to the inner edge of the first radiator 11 .
  • the second end of the grounding post 211 is connected to the floor 20 .
  • the plurality of ground posts 211 includes a plurality of ground post pairs, wherein two ground posts in each ground post pair are symmetrical about the center point O1 of the first radiator 11 .
  • symmetry is not strictly symmetrical in the mathematical sense, and may be offset at a certain angle.
  • the grounding column located directly below the center point O1 211 and the grounding post 211 located directly above the center point O1 are a grounding post pair.
  • the above two grounding posts can be strictly symmetrical about the center point O1, or they can be offset at a certain angle relative to the center point O1, for example, offset by 10 °(As shown in Figure 4, located directly at the center point O1
  • the upper grounding post 211 may be offset to the position of the grounding post 211' or the position of the grounding post 211" shown in dotted lines).
  • the first radiator 11 has a first symmetry axis F1 and a second symmetry axis F2 that are perpendicular to each other.
  • the plurality of ground posts 211 are symmetrical about the first axis of symmetry F1 of the first radiator 11 and/or the second axis of symmetry F2 of the first radiator 11 . Specifically, the plurality of ground posts 211 are about the first axis of symmetry F1 of the first radiator 11 .
  • the symmetry of the symmetry axis F1 and/or the second symmetry axis F2 of the first radiator 11 can be understood as: if the number of grounding posts 211 is 2, then the two grounding posts 211 can be symmetrical about the first symmetry axis F1, also It may be symmetrical about the second axis of symmetry F2. If the number of grounding pillars 211 is greater than 2, then the plurality of grounding pillars 211 are symmetrical about the first axis of symmetry F1 and symmetrical about the second axis of symmetry F2.
  • the plurality of ground posts 211 are evenly distributed along the circumferential direction of the inner edge of the first radiator 11 .
  • the number of ground posts 211 is not limited, for example, it can be 4, 6, 8, etc., as long as the plurality of ground posts 211 are about the first symmetry axis F1 and/or the second symmetry axis F2 of the first radiator 11 Symmetry does not depart from the scope of the embodiments of the present application.
  • the cross-sectional shape of the ground post 211 is not limited, and may be circular, rectangular, polygonal, etc., for example.
  • the first radiator 11, the second radiator 12 and the radiator array 13 are all symmetrical about the first symmetry axis F1 and the second symmetry axis F2. Furthermore, the central axis of the first radiator 11, the central axis of the second radiator, and the central axis of the radiator array coincide with each other.
  • the central axis of the first radiator 11 is the axis where the center of the circle is located.
  • the number of sub-radiators in the radiator array 13 is not limited, for example, it can be 2, 4, 6, 8, etc.
  • the number of sub-radiators is 2, and the two sub-radiators are distributed on both sides of the second radiator along the first direction, and the spacing between the two sub-radiators along the first direction serves as the second hollow area.
  • the first feed connection point and the second feed connection point are distributed along a first direction, wherein the first direction is parallel to the plane where the second radiator is located.
  • the first direction may be, for example, parallel to the plane shown in FIG. 2c represents the length direction L of the radiator.
  • the two sub-radiators can be, for example, the two sub-radiators located on the left and right sides of the second radiator 12 in FIG. 2c. In other embodiments, the first direction may also be other directions.
  • the radiator array is annular.
  • the radiator array includes N sub-radiator groups.
  • Each sub-radiator group includes multiple sub-radiators.
  • the multiple sub-radiators in each sub-radiator group are spaced apart and adjacent end to end to form a ring structure, where N is greater than or equal to 1.
  • N is equal to 1.
  • Figure 5a is a schematic top view of the structure of the radiator array in the antenna unit according to the embodiment of the present application.
  • the number of sub-radiators 132 is 12.
  • the 12 sub-radiators 132 are spaced apart from each other and adjacent end to end to form a rectangular ring.
  • the interior of the rectangular ring serves as the second hollow area S2 of the radiator array 13 .
  • the radiator array 13 with the above structure can also be understood as a 4 ⁇ 4 annular array structure.
  • N is greater than or equal to 2
  • N ring-shaped structures formed by N sub-radiator groups are concentrically arranged on the same plane and form a multi-layered ring structure.
  • the innermost ring structure among the N ring-shaped structures surrounds The inner space serves as the second hollow area.
  • N is equal to 2.
  • Figure 5b is a schematic top view of the radiator array in the antenna unit according to the embodiment of the present application.
  • the eight sub-radiators 132 in the inner circle are spaced in pairs and adjacent end to end to form a rectangle. Ring 133.
  • This rectangular ring 133 serves as a sub-radiator group of the radiator array 13.
  • the 16 sub-radiators 132 in the outer ring are arranged in pairs and are adjacent end to end to form a rectangular ring 134.
  • the rectangular ring 134 serves as another part of the radiator array 13.
  • the radiator array 13 with the above structure can also be understood as: a 3 ⁇ 3 two-turn annular array structure.
  • the number of sub-radiators in each sub-radiator group may also be other numbers, and the number N of sub-radiator groups may also be other numbers.
  • This application also provides an electronic device, including the antenna unit 1 involved in each of the above embodiments.
  • the antenna unit of the embodiment of the present application Since the antenna unit of the embodiment of the present application has a lower antenna profile (or can be understood as the height of the antenna) under the condition of meeting the same bandwidth requirement, the antenna unit of the embodiment of the present application occupies less space in the electronic device. , thus contributing to the miniaturization of electronic equipment.
  • the frequency ratio of the two operating frequency bands of the antenna unit is adapted to specific application scenarios.
  • Figures 6 and 7. 6 is a schematic three-dimensional structural diagram of an antenna unit in an electronic device according to an embodiment of the present application
  • FIG. 7 is a partial three-dimensional exploded structural diagram of an electronic device according to an embodiment of the present application.
  • the antenna unit 1 is provided below the back cover 231 of the electronic device 2.
  • the sub-radiators (such as sub-radiators 132A, 132B, 132C and 132D) located at the four corners of the rectangular ring in the radiator array 13 ) is in the shape of a rectangle, and the remaining radiators are in the shape of a ring; the second radiator 12 is in the shape of a rectangular ring. In other embodiments, the shape of each radiator may also be other shapes.
  • FIG. 8 is a partial cross-sectional structural diagram of an electronic device according to an embodiment of the present application.
  • the electronic device 2 also includes a dielectric structure (for example, dielectric structure 201 and dielectric structure 202).
  • the first radiator 11, the second radiator 12 and the radiator array 13 are all provided in the dielectric structure (for example, dielectric structure 201 and dielectric structure 202), wherein,
  • the media structure 201 and the media structure 202 can be the same media structure, or they can be different media structures.
  • the materials of the media structure 201 and the media structure 202 can be the same or different. This application does not limit this. .
  • the dielectric structure 201 and the dielectric structure 202 are formed by dielectric substrates at different layers in the PCB board, and the floor 20 is formed by the ground layer in the PCB board, wherein the first radiator 11 and the second radiator 12 They are all disposed in the dielectric structure 202, the radiator array 13 is disposed in the dielectric structure 201, and the first radiator 11, the second radiator 12 and the radiator array 13 are all conductive layers (or can be understood as wiring layers) in the PCB board. )Forming.
  • FIG. 9 is a partial cross-sectional structural diagram of an electronic device according to an embodiment of the present application.
  • the electronic device 2 also includes a back cover 231 and a dielectric structure 202 , and the radiator array 13 is attached to the back cover 231 toward the back cover 231 .
  • the radiator array 13 can be directly printed on the surface of the back cover 231 facing the floor 20 , and the first radiator 11 and the second radiator 12 are provided on the dielectric structure 202 . Attaching the radiator array 13 to the back cover 231 can maximize the use of the space under the back cover 231 of the electronic device, which is conducive to further reducing the space occupied by the antenna unit 1 in the electronic device and further miniaturizing the electronic device.
  • the electronic device 2 further includes a back cover 231 and a metal wall structure 27 .
  • the back cover 231 is arranged opposite to the antenna unit 1 .
  • the metal wall structure 27 is abutted between the back cover 231 and the floor 20 .
  • the antenna unit 1 is enclosed in a space formed by the metal enclosure structure 27, the back cover 231 and the floor 20. Surface waves can be effectively suppressed by providing the metal enclosure structure 27.
  • the metal enclosure structure 27 may be, for example, a conductive component provided in the electronic device 2 .
  • the shape of the metal enclosure structure 27 is not limited.
  • the metal enclosure structure 27 may be a rectangular ring column or a circular ring column arranged around the periphery of the antenna unit 1 .
  • one end of the metal wall structure 27 close to the back cover 231 has a protruding portion 271 extending along the surface of the back cover 231.
  • the protruding portion 271 can increase the contact area between the metal wall structure 27 and the back cover 231, thereby strengthening the The stability and firmness of the contact between the metal wall structure 27 and the back cover 231.
  • the electronic device 2 further includes a metal foam 28 , and the metal foam 28 is in contact between the metal enclosure structure 27 and the back cover 231 . Since the metal foam 28 has a certain elasticity and can be compressed, it can better fill the gap between the metal wall structure 27 and the back cover 231, so as to be suitable for different terminal IDs (industrial design).
  • FIG. 12 is a partial three-dimensional structural diagram of an electronic device according to an embodiment of the present application.
  • FIG. 13 is a partial enlarged three-dimensional structural diagram of an antenna unit in an electronic device according to an embodiment of the present application.
  • the electronic device 2 includes a plurality of antenna units 1 , and the plurality of antenna units 1 are distributed in an array in the electronic device 2 .
  • multiple antenna units 1 are provided with a metal enclosure structure around their periphery, which may be understood as: multiple antenna units share a metal enclosure structure to suppress surface waves generated on the back cover of the electronic device when the antenna units are excited.
  • an independent metal enclosure structure is provided around the periphery of each antenna unit among the plurality of antenna units 1 .
  • Simulation software is used to simulate and analyze the antenna unit in the electronic device provided in this embodiment, and simulation renderings as shown in Figures 14 and 15 are obtained.
  • parameter selection of an antenna is only an example of parameter selection of an antenna.
  • parameter selection and adjustment can be performed according to the actual application scenario, which is not limited by this application.
  • the abscissa represents the frequency in GHz
  • the ordinate represents the S11 amplitude value in dB.
  • S11 is one of the S parameters.
  • S11 represents the reflection coefficient. This parameter can characterize the quality of the antenna's transmission efficiency. Specifically, the smaller the S11 value, the smaller the antenna return loss, and the smaller the energy reflected back by the antenna itself, which represents the energy that actually enters the antenna. The more. It should be noted that in engineering, the S11 value of -6dB is generally used as a standard. When the S11 value of an antenna is less than -6dB, it can be considered that the antenna can work normally, or the antenna's radiation efficiency can be considered to be good.
  • the abscissa represents the frequency, in GHz
  • the ordinate represents the gain of the antenna, in dBi.
  • the gain of the antenna can be understood as: the radiated power flux density of the antenna in a certain specified direction is the same as that of the reference antenna.
  • the gain of the antenna can quantitatively represent the degree to which the antenna radiates the input power in a concentrated manner, and can be used to measure the ability of the antenna to send and receive signals in a specific direction.
  • curve 1 is the S11 curve when the antenna unit according to the embodiment of the present application excites the first feed point and the antenna unit works in the low frequency band.
  • Curve 2 is the S11 curve when the antenna unit according to the embodiment of the present application excites the second feed point, and S11 curve when the antenna unit works in the high frequency band.
  • each radiator since each radiator has an axially symmetric structure, the antenna unit excites the third feed point, and the S11 curve when the antenna unit operates in the low frequency band is basically consistent with Curve 1 or Coincidence, the antenna unit excites the fourth feed point, and the S11 curve when the antenna unit works in the high frequency band is basically consistent or coincident with curve 2.
  • the antenna unit of the embodiment of the present application can cover the frequency band of 24.25GHz to 29.5GHz and the frequency band of 37GHz to 43.5GHz.
  • curve 1 is the gain curve of the antenna unit of the embodiment of the present application when it operates in the low frequency band
  • curve 2 is the gain curve of the antenna unit of the embodiment of the present application when it operates in the high frequency band.
  • the gain of the antenna unit according to the embodiment of the present application is approximately 6.7dBi ⁇ 10.6dBi.
  • the antenna unit of the embodiment of the present application can cover the frequency bands of 24.25GHz ⁇ 29.5GHz and 37GHz ⁇ 43.5GHz, and the gain in these two frequency bands is about 6.7dBi ⁇ 10.6dBi. It can be seen that the antenna unit of the embodiment of the present application can It is suitable for multiple frequency bands and has high bandwidth in each frequency band.

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Abstract

本申请提供了一种天线单元及电子设备，天线单元包括第一辐射体、第二辐射体和辐射体阵列。第一辐射体通过接地件与地板连接，第二辐射体与地板相对间隔设置，第二辐射体与第一辐射体间隔设置。辐射体阵列与第一辐射体相对间隔设置，且位于第一辐射体远离地板的一侧。辐射体阵列包括至少两个子辐射体，沿辐射体阵列所在平面的延伸方向，至少两个子辐射体相互间隔设置。第一辐射体具有第一镂空区域，辐射体阵列具有第二镂空区域。本申请在满足相同带宽要求的条件下，具有更低的天线剖面，有利于天线的小型化，有助于实现电子设备的小型化。

Description

天线单元及电子设备
本申请要求于2022年07月07日提交中国专利局、申请号为CN202210802163.6、申请名称为“天线单元及电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及天线领域，尤其是涉及一种天线单元及电子设备。
背景技术
随着终端技术的更新换代以及迎合市场需要，终端设备的小型化逐渐成为了业界共同的目标，越来越小的终端设备给天线在终端设备中的设置带来了极大的挑战。
以毫米波天线为例，当毫米波天线置于终端设备的背盖下方时，天线的剖面(或可理解为天线的高度)越低，越有利于天线以及终端设备的小型化。然而，减小天线的剖面(或可理解为降低天线的高度)会影响天线的性能(例如天线的带宽)。
现有技术中，为了减轻降低剖面对天线性能的不良影响，可以增大辐射体的尺寸，从而减小天线的Q值，以提升天线的性能(例如天线的带宽)。然而，增大辐射体尺寸增加了天线在终端设备中所占用的空间，因而不利于天线的小型化。
可见，现有技术存在天线的小型化和高性能(例如较高的带宽)难以兼顾的问题。
发明内容
本申请实施例提供了一种天线单元及电子设备，解决了现有技术中存在的天线的小型化和高性能(例如较高带宽)难以兼顾的问题。
本申请提供了一种天线单元，包括第一辐射体和接地件，沿天线单元的高度方向，第一辐射体与地板相对间隔设置，并且第一辐射体通过接地件与地板连接。第二辐射体，第二辐射体与第一辐射体间隔设置，沿天线单元的高度方向，第二辐射体与地板相对间隔设置。辐射体阵列，沿天线单元的高度方向，辐射体阵列与第一辐射体相对间隔设置，且位于第一辐射体远离地板的一侧；辐射体阵列包括至少两个子辐射体，沿辐射体阵列所在平面的延伸方向，至少两个子辐射体相互间隔设置。
第一辐射体具有第一镂空区域，辐射体阵列具有第二镂空区域。
以平行于地板所在平面的平面为投影面，第一辐射体在投影面上的投影为第一投影，第二辐射体在投影面上的投影为第二投影，辐射体阵列在投影面上的投影为第三投影；第一投影和第三投影至少有部分重合，第二投影的至少部分位于第一镂空区域在投影面上形成的轮廓线内，第二投影的至少部分位于第二镂空区域在投影面上形成的轮廓线内。第一辐射体设有第一馈电连接点，第二辐射体设有第二馈电连接点，第一馈电连接点连接于第一馈电点，第二馈电连接点连接于第二馈电点。
本申请实施例的天线单元能够在较低的工作频段(例如24GHz毫米波频段、28GHz毫米波频段等)利用第一辐射体产生一个谐振，利用辐射体阵列产生另一个谐振，从而使得天线单元在较低的工作频段具有两个谐振，进而展宽天线单元在低频段工作时的带宽，同时，本申请实施例的天线单元还能够在较高的工作频段(例如39GHz毫米波频段、60GHz毫米波频段)利用第二辐射体产生一个谐振，利用第一辐射体和辐射体阵列产生另一个谐振，从而使得天线单元在较高的工作频段具有两个谐振，进而展宽天线单元在高频段工作时的带宽。可见，本申请实施例天线单元不仅能够适用于多个频段，并且在各频段内均具有较高的带宽。
进一步的，在采用相同的天线剖面(或可理解为天线的高度)时，本申请的天线单元具有更高的带宽，或可理解为：在满足相同带宽要求的条件下，本申请实施例的天线单元具有更低的天线剖面(或可理解为天线的高度)，有利于天线的小型化，有助于实现电子设备的小型化。
在一些实施例中，沿天线单元的高度方向，第一辐射体与辐射体阵列之间的间距为间距d1，天线单元第一工作频段的中心频率所对应介质波长的0.0084倍≤间距d1的电长度≤天线单元第一工作频段的中心频率所对应介质波长的0.05倍。
在一些可能的实施例中，0.05mm≤间距d1的物理长度≤0.3mm。
在一些可能的实施例中，沿天线单元的高度方向，第一辐射体与地板之间的间距为间距d2，天线单元第一工作频段的中心频率所对应介质波长的0.0168倍≤间距d2的电长度≤天线单元第一工作频段的中心频率所对应介质波长的0.117倍。
在一些可能的实施例中，0.1mm≤间距d2的物理长度≤0.7mm。
在一些实施例中，当天线单元处于第一工作频段时，第一辐射体能够被激励产生第一谐振，辐射体阵列能够被激励产生第二谐振。当天线单元处于第二工作频段时，第二辐射体能够被激励产生第三谐振，第一辐射体和辐射体阵列能够被激励产生第四谐振。
在一些可能的实施例中，第一工作频段和第二工作频段为不同的工作频段。
在一些可能的实施例中，第一工作频段的其中一部分频段与第二工作频段的其中一部分频段重合，第一工作频段的另一部分频段低于第二工作频段的另一部分频段。
在一些可能的实施例中，第一工作频段与第二工作频段完全不重合，且第一工作频段低于第二工作频段。
在一些可能的实施例中，天线单元还包括第一馈电件和第二馈电件，第一馈电件的两端分别连接于第一馈电连接点和第一馈电点，第二馈电件的两端分别连接于第二馈电连接点和第二馈电点。
在一些可能的实施中，辐射体阵列包括两个子辐射体，两个子辐射体沿第一方向分布于第二辐射体的两侧，两个子辐射体之间沿第一方向的间隙作为第二镂空区域，第一馈电连接点和第二馈电连接点沿第一方向分布，其中，第一方向平行于第二辐射体所在平面。
在一些实施例中，辐射体阵列为轴对称结构。辐射体阵列呈环形。辐射体阵列包括N个子辐射体组。
每个子辐射体组包括多个子辐射体，沿辐射体阵列所在平面的延伸方向，每个子辐射体组中的多个子辐射体两两间隔设置且首尾邻接形成一环形结构，其中，N大于或等于1。
在一些实施例中，N大于或等于2，N个子辐射体组所形成的N个环形结构在同一平面上同心设置，并形成一多层环结构，N个环形结构中最内侧的环形结构围成的内侧空间作为第二镂空区域。
在一些实施例中，第二投影全部位于第二镂空区域在投影面上形成的轮廓线内，且第二投影全部位于第一镂空区域在投影面上形成的轮廓线内。
在一些实施例中，第一辐射体还设有第三馈电连接点，第三馈电连接点连接于第三馈电点，第二辐射体还设有第四馈电连接点，第四馈电连接点连接于第四馈电点。
第一馈电连接点与第一辐射体的中心点的连线，以及，第三馈电连接点与第一辐射体的中心点的连线之间的夹角为90°。
第二馈电连接点与第二辐射体的中心点的连线，以及第四馈电连接点与第二辐射体的中心点的连线之间的夹角为90°。
采用上述技术方案，能够使得天线单元在低频段和高频段工作时均可实现双极化，有利于提高天线单元的信噪比，进而提高信道容量。
在一些可能的实施例中，天线单元还包括第三馈电件和第四馈电件，第三馈电件的两端分别连接于第三馈电连接点和第三馈电点，第四馈电件的两端分别连接于第四馈电连接点和第四馈电点。
在一些实施例中，第一辐射体呈环形，且第一辐射体为轴对称结构。接地件呈环形柱状结构，接地件的一端连接于第一辐射体的内侧边缘，接地件的另一端连接于地板；或者：接地件包括沿第一辐射体内侧边缘周向间隔设置的多个接地柱，多个接地柱中每个接地柱的第一端连接于第一辐射体的内侧边缘。
在一些实施例中，多个接地柱沿第一辐射体内侧边缘周向均匀分布。
在一些实施例中，第一辐射体具有相互垂直的第一对称轴和第二对称轴，第一辐射体、第二辐射体以及辐射体阵列均关于第一对称轴和第二对称轴对称。并且，第一辐射体的中心轴、第二辐射体的中心轴以及辐射体阵列的中心轴重合。
在一些实施例中，第一辐射体、第二辐射体以及辐射体阵列均为片状辐射体。
本申请还提供了一种电子设备，包括上述各实施例及可能的实施例所涉及的天线单元。
由于本申请实施例的天线单元在满足相同带宽要求的条件下具有更低的天线剖面(或可理解为天线的高度)，因而本申请实施例的天线单元在电子设备中所占用的空间较小，因而有助于实现电子 设备的小型化。
在一些实施例中，电子设备包括多个天线单元，多个天线单元在电子设备中阵列分布。
在一些实施例中，电子设备还包括介质结构，第一辐射体、第二辐射体以及辐射体阵列均设于介质结构。
在一些实施例中，电子设备还包括后盖和介质结构，辐射体阵列贴设于后盖朝向电子设备内部的表面，第一辐射体和第二辐射体设于介质结构。
在一些实施例中，电子设备还包括后盖和金属围墙结构，后盖与天线单元相对设置，金属围墙结构抵接于后盖和地板之间，以将天线单元围合在金属围墙结构、后盖以及地板构成的空间内。
在一些实施例中，第一辐射体包括设于电子设备中的导电件，第二辐射体包括设于电子设备中的导电件，辐射体阵列包括设于电子设备中的导电件；或者：
第一辐射体包括PCB板中的导电层的一部分，第二辐射体包括PCB板中的导电层的一部分，辐射体阵列包括PCB板中的导电层的一部分，地板包括PCB板中的接地层的一部分。
附图说明
图1示例性地示出本申请实施例提供的电子设备；
图2a为本申请实施例天线单元的剖视结构示意图；
图2b为本申请实施例天线单元的各辐射体在投影面上形成的投影示意图；
图2c为本申请实施例天线单元的俯视结构示意图；
图3为本申请实施例天线单元中第一辐射体和第二辐射体的俯视结构示意图；
图4为本申请实施例天线单元第一辐射体和接地柱的俯视结构示意图；
图5a为本申请实施例天线单元中辐射体阵列的俯视结构示意图；
图5b为本申请实施例天线单元中辐射体阵列的俯视结构示意图，其中，辐射阵列包括两个子辐射体组；
图6为本申请实施例电子设备中天线单元的立体结构示意图，其中，辐射体阵列中的部分子辐射体呈环形；
图7为本申请实施例电子设备的局部立体爆炸结构示意图；
图8为本申请实施例电子设备的局部剖视结构示意图；
图9为本申请实施例电子设备的局部剖视结构示意图，其中，辐射体阵列贴设于后盖朝向电子设备内部的表面；
图10、图11均为本申请实施例电子设备中天线单元以及金属围墙结构的剖视结构示意图；
图12为本申请实施例电子设备的局部立体结构示意图，其中，多个天线单元在电子设备中阵列分布；
图13为本申请实施例电子设备中天线单元的局部放大立体结构示意图；
图14为对本申请实施例天线单元进行仿真效果分析获得的S11参数效果曲线图；
图15为对本申请实施例天线单元进行仿真效果分析获得的增益效果曲线图。
附图标记说明：
1：天线单元；
11：第一辐射体；12：第二辐射体；13：辐射体阵列；132：子辐射体；133：矩形环；134：矩
形环；132A：子辐射体；132B：子辐射体；132C：子辐射体；132D：子辐射体；
2：电子设备；
20A：PCB板；20：地板；201：介质结构；202：介质结构；21：接地件；211：接地柱；211’：
接地件；211”：接地件；221：馈电件；222：馈电件；223：馈电件；224：馈电件；231：后盖；241：显示屏/模组；25：盖板；26：中框；261：边框；27：金属围墙结构；271：凸出部；28：泡棉；
A1：第一馈电连接点；A2：第二馈电连接点；A3：第三馈电连接点；A4：第四馈电连接点；
T1：第一投影；T2：第二投影；T3：第三投影；S1：第一镂空区域；S2：第二镂空区域；M1：
轮廓线；M2：轮廓线；O1：中心点；O2：中心点；F1：第一对称轴；F2：第二对称轴；
H：高度方向；L：长度方向。
具体实施方式
以下由特定的具体实施例说明本申请的实施方式，本领域技术人员可由本说明书所揭示的内容轻易地了解本申请的其他优点及功效。虽然本申请的描述将结合一些实施例一起介绍，但这并不代表此申请的特征仅限于该实施方式。恰恰相反，结合实施方式作申请介绍的目的是为了覆盖基于本申请的权利要求而有可能延伸出的其它选择或改造。为了提供对本申请的深度了解，以下描述中将包含许多具体的细节。本申请也可以不使用这些细节实施。此外，为了避免混乱或模糊本申请的重点，有些具体细节将在描述中被省略。需要说明的是，在不冲突的情况下，本申请中的实施例及实施例中的特征可以相互组合。
应注意的是，在本说明书中，相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步定义和解释。
以下，对本申请实施例可能出现的术语进行解释。
在本申请的描述中，需要说明的是，术语“中心”、“上”、“下”、“左”、“右”、“竖直”、“水平”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本申请中的具体含义。
相对设置：可理解为面对面(opposite to,或是face to face)设置或者沿某一方向上有至少部分区域重叠设置。在一个实施例中，两个相对设置的辐射体为相邻设置且其间没有设置其他辐射体。
耦合：可理解为直接耦合和/或间接耦合，“耦合连接”可理解为直接耦合连接和/或间接耦合连接。直接耦合又可以称为“电连接”，理解为元器件物理接触并电导通；也可理解为线路构造中不同元器件之间通过印制电路板(printed circuit board，PCB)铜箔或导线等可传输电信号的实体线路进行连接的形式；“间接耦合”可理解为两个导体通过隔空/不接触的方式电导通。在一个实施例中，间接耦合也可以称为电容耦合，例如通过两个导电件间隔的间隙之间的耦合形成等效电容来实现信号传输。
地/地板：可泛指电子设备(比如手机)内任何接地层、或接地板、或接地金属层等的至少一部分，或者上述任何接地层、或接地板、或接地部件等的任意组合的至少一部分，“地/地板”可用于电子设备内元器件的接地。一个实施例中，“地/地板”可以包括以下任一个或多个：电子设备的电路板的接地层、电子设备中框形成的接地板、屏幕下方的金属薄膜形成的接地金属层、电池的导电接地层，和与上述接地层/接地板/金属层有电连接的导电件或金属件。一个实施例中，电路板可以是印刷电路板(printed circuit board，PCB)，例如具有8、10、12、13或14层导电材料的8层、10层或12至14层板，或者通过诸如玻璃纤维、聚合物等之类的介电层或绝缘层隔开和电绝缘的元件。一个实施例中，电路板包括介质基板、接地层和走线层，走线层和接地层通过过孔进行电连接。一个实施例中，诸如显示器、触摸屏、输入按钮、发射器、处理器、存储器、电池、充电电路、片上系统(system on chip，SoC)结构等部件可以安装在电路板上或连接到电路板；或者电连接到电路板中的走线层和/或接地层。例如，射频源设置于走线层。
上述任何接地层、或接地板、或接地金属层由导电材料制得。一个实施例中，该导电材料可以采用以下材料中的任一者：铜、铝、不锈钢、黄铜和它们的合金、绝缘基片上的铜箔、绝缘基片上的铝箔、绝缘基片上的金箔、镀银的铜、绝缘基片上的镀银铜箔、绝缘基片上的银箔和镀锡的铜、浸渍石墨粉的布、涂覆石墨的基片、镀铜的基片、镀黄铜的基片和镀铝的基片。本领域技术人员可以理解，接地层/接地板/接地金属层也可由其它导电材料制得。
电长度：电长度可以是指，物理长度(即机械长度或几何长度)乘以电或电磁信号在媒介中的传输时间与这一信号在自由空间中通过跟媒介物理长度一样的距离时所需的时间的比来表示，电长度可以 满足以下公式：
其中，L为物理长度，a为电或电磁信号在媒介中的传输时间，b为在自由空间中的传输时间。
或者，电长度也可以是指物理长度(即机械长度或几何长度)与所传输电磁波的波长之比，电长度可以满足以下公式：
其中，L为物理长度，λ为电磁波的波长。
本申请的实施例中，天线的某种波长模式(如二分之一波长模式等)中的波长可以是指该天线辐射的信号的波长。例如，悬浮金属天线的二分之一波长模式可产生包括1.575GHz的频段的谐振，其中二分之一波长模式中的波长可以指天线辐射1.575GHz频段的信号的波长。应理解的是，辐射信号在空气中的波长可以如下计算：空气波长(或者真空波长)＝光速/频率，其中频率为辐射信号的频率(例如1575MHz)，光速可以取3×108m/s。辐射信号在介质中的波长可以如下计算：介质波长＝(光速/)/频率，其中，ε为该介质的介电常数，频率为辐射信号的频率。以上实施例中的缝隙、槽中可以填充绝缘介质。
本申请实施例中提及的共线、共轴、共面、对称(例如，轴对称、或中心对称等)、平行、垂直、相同(例如，长度相同、宽度相同等等)等这类限定，均是针对当前工艺水平而言的，而不是数学意义上绝对严格的定义。相互平行或垂直的两个结构之间可以存在预定角度(例如±5°，±10°)的偏差。
为使本申请的目的、技术方案和优点更加清楚，下面将结合附图对本申请的实施方式作进一步地详细描述。
本申请提供的技术方案适用于具有以下一种或多种通信技术的电子设备：蓝牙(bluetooth，BT)通信技术、全球定位系统(global positioning system，GPS)通信技术、无线保真(wireless fidelity，WiFi)通信技术、全球移动通讯系统(global system for mobile communications，GSM)技术、宽频码分多址(wideband code division multiple access，WCDMA)通信技术、长期演进(long term evolution，LTE)通信技术、5G通信技术、SUB-6G通信技术、毫米波通信技术以及未来其它通信技术等。本申请实施例中的电子设备可以是手机、平板电脑、笔记本电脑、智能音箱、智能家居、智能手环、智能手表、智能头盔、智能眼镜、无人机、无线穿戴、车载模块等。电子设备还可以是具有无线通信功能的手持设备、计算设备或连接到无线调制解调器的其它处理设备、车载设备，5G网络中的电子设备或者未来演进的公用陆地移动通信网络(public land mobile network，PLMN)中的电子设备、无线路由或客户前置设备(Customer Premise Equipment，CPE)等，本申请实施例对此并不限定。图1示例性地示出了本申请提供的电子设备，该电子设备以手机为例进行说明。
如图1所示，电子设备2可以包括：盖板25、显示屏/模组241、印刷电路板(printed circuit board，PCB板20A)、中框26和后盖231。应理解，在一些实施例中，盖板25可以是玻璃盖板，也可以被替换为其他材料的盖板，例如超薄玻璃材料盖板，PET(Polyethylene terephthalate，聚对苯二甲酸乙二酯)材料盖板等。
其中，盖板25可以紧贴显示屏/模组241设置，可主要用于对显示屏/模组241起到保护、防尘作用。
在一个实施例中，显示屏/模组241可以包括液晶显示面板(liquid crystal display，LCD)，发光二极管(light emitting diode，LED)显示面板或者有机发光半导体(organic light-emitting diode，OLED)显示面板等，本申请对此并不做限制。
中框26主要起整机的支撑作用。图1中示出PCB板20A设于中框26与后盖231之间，应可理解，在一个实施例中，PCB板20A也可设于中框26与显示屏/模组241之间，本申请对此并不做限制。其中，印刷电路板PCB板20A可以采用耐燃材料(FR-4)介质板，也可以采用罗杰斯(Rogers)介质板，也可以采用Rogers和FR-4的混合介质板，等等。这里，FR-4是一种耐燃材料等级的代号，Rogers介质板是一种高频板。PCB板20A上承载电子元件，例如，射频芯片等。
在一个实施例中，印刷电路板PCB板20A上可以设置一金属层。该金属层可用于印刷电路板PCB板20A上承载的电子元件接地，也可用于其他元件接地，例如支架天线、边框天线等，该金属层可以称为地板，或接地板，或接地层。在一个实施例中，该金属层可以通过在PCB板20A中的任意一层介质板的表面蚀刻金属形成。在一个实施例中，用于接地的该金属层可以设置在印刷电路板PCB板20A上靠近中框26的一侧。在一个实施例中，印刷电路板PCB板20A的边缘可以看作其接地层的边缘。可以在一个实施例中，金属中框26也可用于上述元件的接地。电子设备2还可以具有其他地板/接地板/接地层，如前所述，此处不再赘述。
其中，电子设备2还可以包括电池(图中未示出)。电池可以设置于设于中框26与后盖231之间，或者可设于中框26与显示屏/模组241之间，本申请对此并不做限制。在一些实施例中，PCB板20A分为主板和子板，电池可以设于所述主板和所述子板之间，其中，主板可以设置于中框26和电池的上边沿之间，子板可以设置于中框26和电池的下边沿之间。
中框26可以包括边框261，包括边框261的中框26作为一体件，可以对整机中的电子器件起支撑作用。盖板25、后盖231分别沿边框的上下边沿盖合从而形成电子设备的外壳或壳体(housing)。在一个实施例中，盖板25、后盖231、边框261、中框26，可以统称为电子设备2的外壳或壳体。应可理解，“外壳或壳体”可以用于指代盖板25、后盖231、边框261或中框26中任一个的部分或全部，或者指代盖板25、后盖231、边框261或中框26中任意组合的部分或全部。
后盖231可以是金属材料制成的后盖；也可以是非导电材料制成的后盖，如玻璃后盖、塑料后盖等非金属后盖；还可以是同时包括导电材料和非导电材料制成的后盖。
在一个实施例中，电子设备2的天线还可以设置于外壳内，例如支架天线、形成于PCB板20A上的板载天线、毫米波天线模组等(图1中未示出)。设于外壳内的天线与外壳内部的其他导电件之间可以存在间隙，从而保证天线辐射体具有良好的辐射环境。在一个实施例中，作为天线辐射体附近可以设置孔径。在一个实施例中，孔径可以包括设置在电子设备2的内部的孔径，例如，从电子设备2的外观面不可见的孔径。在一个实施例中，内部的孔径可以由边框、中框、电池、电路板、后盖、显示屏、及其他内部导电件的任一个形成或由多个共同形成，例如内部的孔径可以由中框的结构件形成。在一个实施例中，孔径还可以包括设置在边框261上的缝隙/开缝/开孔。在一个实施例中，边框261上的缝隙/开缝/开孔可以是形成于边框上的断缝，边框261在该断缝处被划分为没有直接连接关系的两个部分。在一个实施例中，孔径还可以包括设置在后盖231或显示屏/模组241上的缝隙/开缝/开孔。在一个实施例中，后盖231包括导电材料，在导电材料处设置的孔径可以与边框的开缝或断缝连通，以形成电子设备2外观面上连贯的孔径。在一个实施例中，后盖231或显示屏上的孔径还可以用于放置其他器件，例如摄像头、和/或传感器、和/或麦克风、和/或扬声器，等等。
在一个实施例中，天线的形式可以为基于柔性主板(Flexible Printed Circuit，FPC)的天线形式，基于激光直接成型(Laser-Direct-structuring，LDS)的天线形式或者微带天线(Microstrip Disk Antenna，MDA)等天线形式。在一个实施例中，天线也可采用嵌设于电子设备屏幕内部的透明结构，使得该天线为嵌设于电子设备的屏幕内部的透明天线单元。
图1仅示意性的示出了电子设备2包括的一些部件，这些部件的实际形状、实际大小和实际构造不受图1限定。
应理解，在本申请中，可以认为电子设备的显示屏所在的面为正面，后盖所在的面为背面，边框所在的面为侧面。
应理解，在本申请中，认为用户握持(通常是竖向并面对屏幕握持)电子设备时，电子设备所在的方位具有顶部、底部、左侧部和右侧部。
应可理解，在本申请中，天线辐射体的物理长度可以为其电长度的(1±10％)倍。
请参见图2a～图2c，图2a为本申请实施例天线单元的剖视结构示意图，图2b为本申请实施例天线单元的各辐射体在投影面上形成的投影示意图，图2c为本申请实施例天线单元的俯视结构示意图。本申请提供了一种天线单元1，包括第一辐射体11和接地件21。沿天线单元的高度方向H，第一辐射体11与地板20相对间隔设置。并且，第一辐射体11通过接地件21与地板20连接。
天线单元1还包括第二辐射体12，第二辐射体12和第一辐射体11间隔设置，沿天线单元的高度方向H，第二辐射体12和地板20相对间隔设置。
一个实施方式中，第二辐射体12与第一辐射体11处于同一高度，一个实施方式中，第二辐射体12位于第一辐射体11远离地板20的一侧，例如，第二辐射体12可以与辐射体阵列13处于同一高度，也可以是略高于或略低于辐射体阵列13的，其它可替代的实施方式中，第二辐射体12也可以是位于第一辐射体11与地板20之间的。
此外，可以通过第二辐射体12的接地与否调节天线单元的两个工作频段的频率比，以适用于天线单元不同的工作频段，或可理解为：第二辐射体12是否接地可以按需设计，可以是接地的，也可以是不接地的，本申请对此不作限定。
天线单元1还包括辐射体阵列13，沿天线单元的高度方向H，辐射体阵列13与第一辐射体11相对间隔设置，且位于第一辐射体11远离地板20的一侧；辐射体阵列13包括至少两个子辐射体，沿辐射体阵列13所在平面的延伸方向，至少两个子辐射体相互间隔设置。一个实施方式中，辐射体阵列13为轴对称结构。
请参见图2a，第一辐射体11具有第一镂空区域S1，辐射体阵列13具有第二镂空区域S2。请参见图2b并结合图2a和图2c理解，以平行于地板20所在平面的平面为投影面，第一辐射体11在投影面上的投影为第一投影T1，第二辐射体12在投影面上的投影为第二投影T2，辐射体阵列13在投影面上的投影为第三投影T3；其中，第一投影T1和第三投影T3至少有部分重合，第二投影T2的至少部分位于第一镂空区域S1在投影面上形成的轮廓线M1内，第二投影T2的至少部分位于第二镂空区域S2(如图2b中虚线所示)在投影面上形成的轮廓线M2内。
其中，第二投影T2的至少部分位于轮廓线M1内，第二投影T2的至少部分位于轮廓线M2可以理解为：第二辐射体12的至少部分可以通过第一辐射体11的第一镂空区域S1以及辐射体阵列13的第二镂空区域S2向外辐射。
第二投影T2的至少部分位于轮廓线M1内，第二投影T2的至少部分位于轮廓线M2内，还可以理解为：从天线单元的俯视方向看，第二辐射体12的至少部分位于第一辐射体11的第一镂空区域S1内，且第二辐射体12的至少部分位于辐射体阵列13的第二镂空区域S2内。
一个实施方式中，第二投影T2全部位于第二镂空区域S2在投影面上形成的轮廓线M2内，且第二投影T2全部位于第一镂空区域S1在投影面上形成的轮廓线M1内。
第二投影T2全部位于轮廓线M2内，第二投影T2全部位于轮廓线M1内，或可理解为：从天线单元的俯视方向看，第二辐射体12全部位于辐射体阵列13的第二镂空区域S2内，且第二辐射体12全部位于第一辐射体11的第一镂空区域S1内。
请参见图2c并结合图2a理解，第一辐射体11设有第一馈电连接点A1，第二辐射体12设有第二馈电连接点A2，第一馈电连接点A1连接于第一馈电点(图中未示出)，第二馈电连接点A2连接于第二馈电点(图中未示出)。
需要说明的是，本申请中的馈电点可理解为射频源(或可称为馈源)的一个信号输出端，例如可以是射频芯片的输出引脚，还可以是用于连接射频源的信号传输线的一端，只要能够通过该馈电点电连接于射频源并接收射频信号，就不脱离本实施例的范围。
其中，第一馈电连接点A1与第一馈电点的连接方式，以及第二馈电连接点A2与第二馈电点的连接方式不限，其可以是直接连接的，也可以是间接连接的，例如可以是通过馈电件连接的，一个实施方式中，请参见图2a，天线单元1还包括馈电件221和馈电件222，馈电件221的两端分别连接于第一馈电连接点A1和第一馈电点(图中未示出)，馈电件222的两端分别连接于第二馈电连接点A2和第二馈电点(图中未示出)。馈电件的类型不限，例如可以是设于电子设备中的导电件，也可以是通过金属过孔形成的馈电探针等等。
本申请的天线单元可应用于毫米波天线的低频段和高频段两个工作频段且在两个频段内均具有较宽的带宽，具体的，低频段可例如24GHz毫米波频段、28GHz毫米波频段等，高频段可例如39GHz毫米波频段、60GHz毫米波频段等，第一辐射体11能够提供天线单元工作于低频段的第一谐振，辐射体阵列13能够提供天线单元工作于低频段的第二谐振，使得天线单元在低频段具有两个谐振，进而使得天线单元在低频段具有较宽的带宽(例如在毫米波28GHz频段可覆盖约19.6％的相对带宽)，并且，第二辐射体12能够提供天线单元工作于高频段的第一谐振，辐射体阵列13和第一辐射体11能够提供天线单元工作于高频段的第二谐振，使得天线单元在高频段具有两个谐振，进而使得天线单 元在高频段具有较宽的带宽(例如在毫米波39GHz频段可覆盖约16.7％的相对带宽)。
从天线辐射工作模式的角度分析，由于本申请的天线单元能够通过第一辐射体11、第二辐射体12和辐射体阵列13使得天线单元具有TM10模式和反相位的TM20模式两种工作模式，丰富了天线的工作模式，因此本申请天线单元能够大大展宽天线的带宽。
可见，本申请实施例的天线单元能够在较低的工作频段(例如24GHz毫米波频段、28GHz毫米波频段等)利用第一辐射体11产生一个谐振，利用辐射体阵列13产生另一个谐振，从而使得天线单元在较低的工作频段具有两个谐振，进而展宽天线单元在低频段工作时的带宽，并且，本申请实施例的天线单元还能够在较高的工作频段(例如39GHz毫米波频段、60GHz毫米波频段)利用第二辐射体12产生一个谐振，利用第一辐射体11和辐射体阵列13产生另一个谐振，从而使得天线单元在较高的工作频段具有两个谐振，进而展宽天线单元在高频段工作时的带宽。可见，本申请实施例天线单元不仅能够适用于多个频段，并且在各频段内均具有较高的带宽。
因而，在采用相同的天线剖面(或可理解为天线的高度)时，本申请的天线单元具有更高的带宽，或可理解为：在满足相同带宽要求的条件下，本申请实施例的天线单元具有更低的天线剖面(或可理解为天线的高度)，有利于天线的小型化，有助于实现电子设备的小型化。
本申请实施例中，各辐射体的形状不限，例如，第一辐射体11可以是矩形环状、圆环形、三角环形等等，第二辐射体12可以是圆形、矩形、环形、三角形、多边形等等，辐射体阵列13中的子辐射体132的形状可以是圆形、矩形、环形、三角形、多边形等等。
一个实施方式中，天线单元工作于低频时的工作频段为第一工作频段，第一工作频段为：24.25GHz-29.5GHz，该频段的中心频率为：26.875GHz，介质结构(例如后文提及的介质结构201和介质结构202)的介电常数为3.5。第一工作频段对应的介质波长为：
一个实施方式中，天线单元工作于高频时的工作频段为第二工作频段，第二工作频段为：37GHz-43.5GHz，该频段的中心频率为：40.25GHz，介质结构(例如后文提及的介质结构201和介质结构202)的介电常数为3.5。第二工作频段对应的介质波长为：
请参考图2a，一个实施方式中，沿天线单元的高度方向H，第一辐射体11与辐射体阵列13之间的间距为间距d1，天线单元第一工作频段的中心频率所对应介质波长的0.0084倍≤间距d1的电长度≤天线单元第一工作频段的中心频率所对应介质波长的0.05倍。一个实施方式中，0.05mm≤间距d1的物理长度≤0.3mm，例如可以是0.1mm，其它可替代的实施方式中，也可以是其它数值。
一个实施方式中，沿天线单元的高度方向H，第一辐射体11与地板20之间的间距为间距d2，天线单元第一工作频段的中心频率所对应介质波长的0.0168倍≤间距d2的电长度≤天线单元第一工作频段的中心频率所对应介质波长的0.117倍。一个实施方式中，0.1mm≤间距d2的物理长度≤0.7mm，例如可以是0.2mm，其它实施方式中，也可以是其它数值。
通过改变各辐射体的形状、各辐射体之间的间距(例如第一辐射体11和辐射体阵列13之间的间距)可以调节天线单元的两个工作频段的频率比，进而将不需要的工作模式移到天线单元的工作频段外，以适用于不同的应用场景。
辐射体的形成方式不限，一个实施方式中，可以是设于电子设备的导电件形成的，其它实施方式中，也可以是PCB板中的导电层(或可理解为走线层)形成的，具体的，第一辐射体11包括PCB板中的导电层的一部分，第二辐射体12包括PCB板中的导电层的一部分，辐射体阵列13包括PCB板中的导电层的一部分，地板20包括PCB板中的接地层的一部分。接地件21的形成方式不限，例如可以是设于电子设备中的导电件，也可以是通过金属过孔形成的。
一个实施方式中，第一辐射体11、第二辐射体12以及辐射体阵列13均为片状辐射体，适用于Patch天线(或可称为贴片天线)的应用场景。
一个实施方式中，当天线单元1处于第一工作频段时，第一工作频段可例如为毫米波28GHz频段，即24.25GHz～29.5GHz频率范围内，第一辐射体11能够被激励产生第一谐振，第一谐振的谐振频率可例如为25.25GHz，辐射体阵列13能够被激励产生第二谐振，第二谐振的谐振频率可例如为28GHz。当天线单元处于第二工作频段时，第二工作频段可例如为毫米波39GHz频段，即 37GHz～43.5GHz频率范围内，第二辐射体12能够被激励产生第三谐振，第三谐振的谐振频率可例如为38.25GHz，第一辐射体11和辐射体阵列13能够被激励产生第四谐振，第四谐振的谐振频率可例如为41.5GHz。
一个实施方式中，请参见图2a～图3，图3为本申请实施例天线单元中第一辐射体和第二辐射体的俯视结构示意图。第一辐射体11还设有第三馈电连接点A3，第三馈电连接点A3连接于第三馈电点(图中未示出)，第二辐射体12还设有第四馈电连接点A4，第四馈电连接点A4连接于第四馈电点(图中未示出)。一个实施方式中，第三馈电连接点A3是通过馈电件223连接于第三馈电点(图中未示出)的，第四馈电连接点A4是通过馈电件224连接于第四馈电点(图中未示出)的，其它实施方式中，第三馈电连接点A3和第四馈电连接点A4也可以是直接连接于对应的馈电点的。
其中，如图2c所示，第一馈电连接点A1与第一辐射体11的中心点O1的连线，以及，第三馈电连接点A3与第一辐射体11的中心点O1的连线之间的夹角为90°。或可理解为：第一馈电连接点A1与第三馈电连接点A3在第一辐射体11的周向上的角度差为90°。
第二馈电连接点A2与第二辐射体12的中心点O2(在图2c中，中心点O1和中心点O2重合)的连线，以及第四馈电连接点A4与第二辐射体12的中心点O2(在图2c中，中心点O1和中心点O2重合)的连线之间的夹角为90°。或可理解为：第二馈电连接点A2与第四馈电连接点A4在第二辐射体12的周向上的角度差为90°。
一个实施方式中，第一辐射体11呈圆环形，因此第一辐射体11的中心点位于圆环的圆心处，其它实施方式中，第一辐射体11和第二辐射体12是其它形状时，第一辐射体11的中心点O1也可位于其它位置，第二辐射体的12的中心点O2也可位于其它位置，沿辐射体所在平面的延伸方向，或可理解为：从图2c所示的视角看，第一辐射体11的中心点O1和第二辐射体12的中心点O2也可以是不重合的。
此外，第一馈电连接点A1与第二馈电连接点A2的位置关系不限，一个实施方式中，第一馈电连接点A1与第一辐射体11的中心点O1的连线，以及第二馈电连接点A2与第二辐射体12的中心点O2的连线可以是平行的，或可理解为：如图2c所示，沿辐射体的长度方向L，第一馈电连接点A1与第二馈电连接点A2是对齐设置的，其它实施方式中，第一馈电连接点A1与第一辐射体11的中心点O1的连线，以及第二馈电连接点A2与第二辐射体12的中心点O2的连线可以是不平行的，例如，如图2c所示，沿辐射体的长度方向L，第一馈电连接点A1与第二馈电连接点A2可以是错位设置的。
同理，第三馈电连接点A3与第四馈电连接点A4的位置关系不限，沿辐射体的长度方向L，二者可以是对齐设置的，也可以是错位设置的。
本申请实施例天线单元能够通过在第一辐射体11上设置两个馈电连接点(第一馈电连接点A1和第三馈电连接点A3)，且两个馈电连接点(第一馈电连接点A1和第三馈电连接点A3)沿第一辐射体11周向方向的角度差为90°，在第二辐射体12上设置两个馈电连接点(第二馈电连接点A2和第四馈电连接点A4)，且两个馈电连接点(第二馈电连接点A2和第四馈电连接点A4)沿第二辐射体12周向方向的角度差为90°，能够使得天线单元在低频段和高频段工作时均可实现双极化，进而有利于提高天线单元的信噪比，提高信道容量。
一个实施方式中，请参见图2c并结合图2a理解，第一辐射体11呈环形，且第一辐射体11为轴对称结构。接地件21呈环形柱状结构，接地件21的一端连接于第一辐射体11的内侧边缘，接地件21的另一端连接于地板20。
其它可替代的实施方式中，请参见图4并结合图2a理解，图4为本申请实施例天线单元第一辐射体和接地柱的俯视结构示意图。
接地件21包括沿第一辐射体11内侧边缘周向间隔设置的多个接地柱211，多个接地柱211中每个接地柱211的第一端连接于第一辐射体11的内侧边缘，每个接地柱211的第二端连接于地板20。
一个实施方式中，多个接地柱211包括多个接地柱对，其中，每个接地柱对中的两个接地柱关于第一辐射体11的中心点O1对称。本领域技术人员可以理解的是，对称并不是数学意义上的严格对称，其可以存在一定角度的偏移，例如，以图4中所示的俯视视角看，位于中心点O1正下方的接地柱211和位于中心点O1正上方的接地柱211为一个接地柱对，上述两个接地柱可以是关于中心点O1严格对称的，也可以相对中心点O1存在一定角度的偏移，例如偏移10°(如图4中，位于中心点O1正 上方的接地柱211可以偏移至虚线示出的接地柱211’位置处或接地柱211”位置处)。
一个实施方式中，第一辐射体11具有相互垂直的第一对称轴F1和第二对称轴F2。多个接地柱211关于第一辐射体11的第一对称轴F1和/或第一辐射体11的第二对称轴F2对称，具体的，多个接地柱211关于第一辐射体11的第一对称轴F1和/或第一辐射体11的第二对称轴F2对称可以理解为：若接地柱211的数量为2个，则2个接地柱211可以是关于第一对称轴F1对称的，也可以是关于第二对称轴F2对称的，若接地柱211的数量大于2个，则多个接地柱211关于第一对称轴F1对称，并且关于第二对称轴F2对称。
一个实施方式中，多个接地柱211沿第一辐射体11内侧边缘周向均匀分布。
其中，接地柱211的数量不限，例如可以是4个、6个、8个等等，只要多个接地柱211关于第一辐射体11的第一对称轴F1和/或第二对称轴F2对称就不脱离本申请实施例的范围。接地柱211的横截面形状不限，例如可以是圆形、矩形、多边形等等。
一个实施方式中，请参考图2a和图2c理解，第一辐射体11、第二辐射体12以及辐射体阵列13均关于第一对称轴F1和第二对称轴F2对称。并且，第一辐射体11的中心轴、第二辐射体的中心轴以及辐射体阵列的中心轴重合。其中，第一辐射体11的中心轴为其圆环的圆心所在轴线。
本申请实施例中，辐射体阵列13中的子辐射体数量不限，例如可以是2个、4个、6个、8个等等。一个实施方式中，子辐射体的数量为2个，2个子辐射体沿第一方向分布于第二辐射体的两侧，两个子辐射体之间沿第一方向的间距作为第二镂空区域，第一馈电连接点和第二馈电连接点沿第一方向分布，其中，第一方向平行于第二辐射体所在平面，一个实施方式中，第一方向可例如是平行于图2c中所示辐射体长度方向L，进而，2个子辐射体可例如是图2c中位于第二辐射体12左侧和右侧的两个子辐射体。其它实施方式中，第一方向也可以是其它方向。
一个实施方式中，辐射体阵列呈环形。辐射体阵列包括N个子辐射体组。每个子辐射体组包括多个子辐射体，沿辐射体阵列所在平面的延伸方向，每个子辐射体组中的多个子辐射体两两间隔设置且首尾邻接形成一环形结构，其中，N大于或等于1。
一个实施方式中，N等于1，请参见图5a，图5a为本申请实施例天线单元中辐射体阵列的俯视结构示意图。子辐射体132的数量为12个，12个子辐射体132相互间隔设置首尾邻接形成一矩形环，矩形环的内部作为辐射体阵列13的第二镂空区域S2。上述结构的辐射体阵列13也可以理解为：4×4一圈环形阵列结构。
一个实施方式中，N大于或等于2，N个子辐射体组所形成的N个环形结构在同一平面上同心设置，并形成一多层环结构，N个环形结构中最内侧的环形结构围成的内侧空间作为第二镂空区域。
一个实施方式中，N等于2，请参见图5b，图5b为本申请实施例天线单元中辐射体阵列的俯视结构示意图，内圈的8个子辐射体132两两间隔设置且首尾邻接形成一矩形环133，该矩形环133作为辐射体阵列13一个子辐射体组，外圈的16个子辐射体132两两间隔设置且首尾邻接形成一矩形环134，该矩形环134作为辐射体阵列13的另一子辐射体组。上述结构的辐射体阵列13也可以理解为：3×3两圈环形阵列结构。
本领域技术人员可以理解的是，其它可替代的实施方式中，每个子辐射体组中的子辐射体数量也可以是其它数量，子辐射体组的数量N也可以是其它数量。
本申请还提供了一种电子设备，包括上述各实施方式所涉及的天线单元1。
由于本申请实施例的天线单元在满足相同带宽要求的条件下具有更低的天线剖面(或可理解为天线的高度)，因而本申请实施例的天线单元在电子设备中所占用的空间较小，因而有助于实现电子设备的小型化。
一个实施方式中，为了适用天线单元1在电子设备中的使用需求，使天线单元的两个工作频段的频率比适用于特定的应用场景，一个实施方式中，请参见图6和图7，图6为本申请实施例电子设备中天线单元的立体结构示意图，图7为本申请实施例电子设备的局部立体爆炸结构示意图。天线单元1设于电子设备2的后盖231的下方，辐射体阵列13中位于矩形环四角处的子辐射体(例如子辐射体132A、子辐射体132B、子辐射体132C以及子辐射体132D)的形状为矩形，其余的辐射体呈环形；第二辐射体12的形状为矩形环状。其它实施方式中，各辐射体的形状也可以是其它形状。
一个实施方式中，请参见图8，图8为本申请实施例电子设备的局部剖视结构示意图，电子设备 2还包括介质结构(例如介质结构201和介质结构202)，第一辐射体11、第二辐射体12以及辐射体阵列13均设于介质结构(例如介质结构201和介质结构202)，其中，介质结构201和介质结构202可以是同一介质结构，也可以是不同的介质结构，进一步的，介质结构201和介质结构202的材质可以是相同的，也可以是不同的，本申请对此不作限定。
一个实施方式中，介质结构201和介质结构202是PCB板中处于不同层的介质基板形成的，地板20是PCB板中的接地层形成的，其中，第一辐射体11和第二辐射体12均设于介质结构202，辐射体阵列13设于介质结构201，且第一辐射体11、第二辐射体12和辐射体阵列13均是PCB板中的导电层(或可理解为走线层)形成的。
一个实施方式中，请参见图9，图9为本申请实施例电子设备的局部剖视结构示意图，电子设备2还包括后盖231和介质结构202，辐射体阵列13贴设于后盖231朝向电子设备内部的表面，例如，可以将辐射体阵列13直接印刷在后盖231朝向地板20的表面，第一辐射体11和第二辐射体12设于介质结构202。将辐射体阵列13贴设于后盖231能够最大程度地利用电子设备后盖231下方的空间，有利于进一步缩小天线单元1在电子设备中的占用空间，进一步实现电子设备的小型化。
本申请实施例天线单元应用于毫米波天线时，且毫米波天线置于电子设备的后盖下方时，天线单元在工作时会在后盖上激励起表面波，进而影响天线单元的性能，一个实施方式中，请参见图10，电子设备2还包括后盖231和金属围墙结构27，后盖231与天线单元1相对设置，金属围墙结构27抵接于后盖231和地板20之间，以将天线单元1围合在金属围墙结构27、后盖231以及地板20构成的空间内，通过设置金属围墙结构27可以有效抑制表面波。
其中，金属围墙结构27可例如是设于电子设备2内的导电件，金属围墙结构27的形状不限，例如可以是环绕天线单元1外周设置的矩形环柱，或者圆形环柱等。一个实施方式中，金属围墙结构27靠近后盖231的一端具有沿后盖231表面延伸的凸出部271，凸出部271能够增大金属围墙结构27与后盖231的接触面积，进而能够加强金属围墙结构27与后盖231之间接触的稳定性与牢固性。
一个实施方式中，为了便于金属围墙结构27的安装，请参见图11，电子设备2还包括金属泡棉28，金属泡棉28抵接于金属围墙结构27与后盖231之间。由于金属泡棉28具有一定的弹性，可被压缩，可以较好地填充金属围墙结构27与后盖231之间的间距，以适用于不同的终端ID(industrial design，工业设计)。
一个实施方式中，请参见图12和图13，图12为本申请实施例电子设备的局部立体结构示意图，图13为本申请实施例电子设备中天线单元的局部放大立体结构示意图。电子设备2包括多个天线单元1，多个天线单元1在电子设备2中阵列分布。一个实施方式中，多个天线单元1的外周设有金属围墙结构，或可理解为：多个天线单元共用一个金属围墙结构以抑制天线单元被激励时在电子设备的后盖上产生的表面波，其它可替代的实施方式中，多个天线单元1中的每个天线单元外周均设有独立的金属围墙结构。
采用仿真软件对本实施例中所提供的电子设备中的天线单元进行仿真分析并获得了如图14和图15所示的仿真效果图。
获取图14和图15所示的仿真效果图的仿真数据如下表1所示(请结合图6和图8予以理解)。
表1

需要说明的是，以上仅是一种天线的参数选型示例，当本申请实施例的天线单元适用于其它工作频段时，可根据实际应用场景进行参数选型调整，本申请对此不作限定。
在图14中，横坐标表示频率，单位为GHz，纵坐标表示S11幅度值，单位为dB，S11属于S参数中的一种。S11表示反射系数，此参数能够表征天线发射效率的优劣，具体的，S11值越小，表征天线回波损耗越小，天线本身反射回来的能量越小，也就是代表实际上进入天线的能量就越多。需要说明的是，工程上一般以S11值为-6dB作为标准，当天线的S11值小于-6dB时，可以认为该天线可正常工作，或可认为该天线的发射效率较好。在图15中，横坐标表示频率，单位为GHz，纵坐标表示天线的增益，单位为dBi，天线的增益可理解为：天线在某一规定方向上的辐射功率通量密度与参考天线在相同输入功率时最大辐射功率表通量密度的比值，天线的增益能够定量地表征天线把输入功率集中辐射的程度，可用于衡量天线朝一个特定方向收发信号的能力。
在图14中，曲线1为本申请实施例天线单元激励第一馈电点，且天线单元工作于低频段时的S11曲线，曲线2为本申请实施例天线单元激励第二馈电点，且天线单元工作于高频段时的S11曲线。
需要说明的是，在本申请实施例中，由于各辐射体均为轴对称结构，因此，天线单元激励第三馈电点，且天线单元工作于低频段时的S11曲线与曲线1基本一致或者重合，天线单元激励第四馈电点，且天线单元工作于高频段时的S11曲线与曲线2基本一致或者重合。
从图14可以看出，以S11值为-10dB作为标准，本申请实施例天线单元能够覆盖24.25GHz～29.5GHz频段，以及37GHz～43.5GHz频段。
在图15中，曲线1为本申请实施例天线单元工作于低频段时的增益曲线，曲线2为本申请实施例天线单元工作于高频段时的增益曲线。
从图14中可以看出，在低频段24.25GHz～29.5GHz内和高频段37GHz～43.5GHz内，本申请实施例天线单元的增益约为6.7dBi～10.6dBi。
可见，本申请实施例天线单元能够覆盖24.25GHz～29.5GHz以及37GHz～43.5GHz的频段，且在这两个频段内的增益约为6.7dBi～10.6dBi，可见，本申请实施例的天线单元能够适用于多个频段，并且在各频段内均具有较高的带宽。
显然，本领域的技术人员可以对本申请进行各种改动和变型而不脱离本申请的精神和范围。这样，倘若本申请的这些修改和变型属于本申请权利要求及其等同技术的范围之内，则本申请也意图包含这些改动和变型在内。

Claims (16)

  1. 一种天线单元，其特征在于，包括：
    第一辐射体和接地件，沿所述天线单元的高度方向，所述第一辐射体与地板相对间隔设置，并且，所述第一辐射体通过所述接地件与所述地板连接；
    第二辐射体，所述第二辐射体与所述第一辐射体间隔设置，沿所述天线单元的高度方向，所述第二辐射体与所述地板相对间隔设置；
    辐射体阵列，沿所述天线单元的高度方向，所述辐射体阵列与所述第一辐射体相对间隔设置，且位于所述第一辐射体远离地板的一侧；所述辐射体阵列包括至少两个子辐射体，沿所述辐射体阵列所在平面的延伸方向，所述至少两个子辐射体相互间隔设置；
    所述第一辐射体具有第一镂空区域，所述辐射体阵列具有第二镂空区域；
    以平行于所述地板所在平面的平面为投影面，所述第一辐射体在所述投影面上的投影为第一投影，所述第二辐射体在所述投影面上的投影为第二投影，所述辐射体阵列在所述投影面上的投影为第三投影；所述第一投影和所述第三投影至少有部分重合，所述第二投影的至少部分位于所述第一镂空区域在所述投影面上形成的轮廓线内，所述第二投影的至少部分位于所述第二镂空区域在所述投影面上形成的轮廓线内；
    所述第一辐射体设有第一馈电连接点，所述第二辐射体设有第二馈电连接点，所述第一馈电连接点连接于第一馈电点，所述第二馈电连接点连接于第二馈电点。
  2. 如权利要求1所述的天线单元，其特征在于，当所述天线单元处于第一工作频段时，所述第一辐射体能够被激励产生第一谐振，所述辐射体阵列能够被激励产生第二谐振；
    当所述天线单元处于第二工作频段时，所述第二辐射体能够被激励产生第三谐振，所述第一辐射体和所述辐射体阵列能够被激励产生第四谐振。
  3. 如权利要求1或2所述的天线单元，其特征在于，所述辐射体阵列为轴对称结构；
    所述辐射体阵列呈环形；
    所述辐射体阵列包括N个子辐射体组；
    每个子辐射体组包括多个子辐射体，沿所述辐射体阵列所在平面的延伸方向，每个子辐射体组中的多个子辐射体两两间隔设置且首尾邻接形成一环形结构，其中，N大于或等于1。
  4. 如权利要求3所述的天线单元，其特征在于，N大于或等于2，所述N个子辐射体组所形成的N个环形结构在同一平面上同心设置，并形成一多层环结构，所述N个环形结构中最内侧的环形结构围成的内侧空间作为所述第二镂空区域。
  5. 如权利要求1～4任一项所述的天线单元，其特征在于，所述第二投影全部位于所述第二镂空区域在所述投影面上形成的轮廓线内，且所述第二投影全部位于所述第一镂空区域在所述投影面上形成的轮廓线内。
  6. 如权利要求1～5任一项所述的天线单元，其特征在于，所述第一辐射体还设有第三馈电连接点，所述第三馈电连接点连接于第三馈电点，所述第二辐射体还设有第四馈电连接点，所述第四馈电连接点连接于第四馈电点；
    所述第一馈电连接点与所述第一辐射体的中心点的连线，以及，所述第三馈电连接点与所述第一辐射体的中心点的连线之间的夹角为90°；
    所述第二馈电连接点与所述第二辐射体的中心点的连线，以及所述第四馈电连接点与所述第二辐射体的中心点的连线之间的夹角为90°。
  7. 如权利要求1～6任一项所述的天线单元，其特征在于，所述第一辐射体呈环形，且所述第一辐射体为轴对称结构；
    所述接地件呈环形柱状结构，所述接地件的一端连接于所述第一辐射体的内侧边缘，所述接地件的另一端连接于所述地板；或者：所述接地件包括沿所述第一辐射体内侧边缘周向间隔设置的多个接地柱，所述多个接地柱中每个接地柱的第一端连接于所述第一辐射体的内侧边缘。
  8. 如权利要求7所述的天线单元，其特征在于，所述多个接地柱沿所述第一辐射体内侧边缘周向均匀分布。
  9. 如权利要求7或8所述的天线单元，其特征在于，所述第一辐射体具有相互垂直的第一对称轴和第二对称轴，所述第一辐射体、所述第二辐射体以及所述辐射体阵列均关于所述第一对称轴和所述 第二对称轴对称；
    并且，所述第一辐射体的中心轴、所述第二辐射体的中心轴以及所述辐射体阵列的中心轴重合。
  10. 如权利要求1～9任一项所述的天线单元，其特征在于，所述第一辐射体、所述第二辐射体以及所述辐射体阵列均为片状辐射体。
  11. 一种电子设备，其特征在于，包括权利要求1～10任一项所述的天线单元。
  12. 如权利要求11所述的电子设备，其特征在于，所述电子设备包括多个所述天线单元，所述多个天线单元在所述电子设备中阵列分布。
  13. 如权利要求11或12所述的电子设备，其特征在于，所述电子设备还包括介质结构，所述第一辐射体、所述第二辐射体以及所述辐射体阵列均设于所述介质结构。
  14. 如权利要求11或12所述的电子设备，其特征在于，所述电子设备还包括后盖和介质结构，所述辐射体阵列贴设于所述后盖朝向电子设备内部的表面，所述第一辐射体和所述第二辐射体设于所述介质结构。
  15. 如权利要求11～14任一项所述的电子设备，其特征在于，所述电子设备还包括后盖和金属围墙结构，所述后盖与所述天线单元相对设置，所述金属围墙结构抵接于所述后盖和所述地板之间，以将所述天线单元围合在所述金属围墙结构、所述后盖以及所述地板构成的空间内。
  16. 如权利要求11～15任一项所述的电子设备，其特征在于：
    所述第一辐射体包括设于所述电子设备中的导电件，所述第二辐射体包括设于所述电子设备中的导电件，所述辐射体阵列包括设于所述电子设备中的导电件；或者：
    所述第一辐射体包括PCB板中的导电层的一部分，所述第二辐射体包括PCB板中的导电层的一部分，所述辐射体阵列包括PCB板中的导电层的一部分，所述地板包括PCB板中的接地层的一部分。
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