WO2024011532A1 - 一种间接蒸发冷却系统及换热组件 - Google Patents

一种间接蒸发冷却系统及换热组件 Download PDF

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Publication number
WO2024011532A1
WO2024011532A1 PCT/CN2022/105797 CN2022105797W WO2024011532A1 WO 2024011532 A1 WO2024011532 A1 WO 2024011532A1 CN 2022105797 W CN2022105797 W CN 2022105797W WO 2024011532 A1 WO2024011532 A1 WO 2024011532A1
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WIPO (PCT)
Prior art keywords
air
heat exchange
channel
air channel
machine room
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2022/105797
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English (en)
French (fr)
Inventor
宋金良
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Huawei Digital Power Technologies Co Ltd
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Huawei Digital Power Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Digital Power Technologies Co Ltd filed Critical Huawei Digital Power Technologies Co Ltd
Priority to PCT/CN2022/105797 priority Critical patent/WO2024011532A1/zh
Priority to EP22950653.0A priority patent/EP4538607A4/en
Priority to CN202280033849.1A priority patent/CN117296461A/zh
Publication of WO2024011532A1 publication Critical patent/WO2024011532A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20745—Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20827—Liquid cooling with phase change within rooms for removing heat from cabinets, e.g. air conditioning devices

Definitions

  • This application relates to the field of mechanical design, especially the design of an indirect evaporative cooling system and heat exchange components.
  • Data center computer rooms often use indirect evaporative cooling systems to reduce the internal temperature of the data center.
  • the most critical part of the indirect evaporative cooling system is the heat exchange core, also commonly called the heat exchanger.
  • the air direction inside the heat exchanger and the flow channel distribution structure will affect the location of the return air outlet and exhaust outlet of the data center.
  • the existing indirect evaporative cooling system may include heat exchangers, evaporators, condensers, compressors and other components.
  • the first surface (A1) of the heat exchanger is provided with a return air outlet, which is connected to the machine room through a return air duct.
  • the second surface (A2) opposite to the first surface (A1) is provided with an air supply port and is connected to the machine room through an air supply duct.
  • the air inside the machine room enters the heat exchanger through the return air outlet for heat exchange, and then flows out from the air supply outlet.
  • a fresh air outlet is provided on the third surface (B1) of the heat exchanger adjacent to the first surface (A1).
  • the fourth surface (B2) opposite to the third surface (B1) is provided with an air outlet. The air outside the machine room can enter the heat exchanger through the fresh air vent and flow out through the exhaust vent.
  • the air flow channel inside the machine room and the air flow channel outside the machine room are in the shape of a "cross".
  • the heat exchanger is also called a cross air-to-air heat exchanger.
  • the existing indirect evaporative cooling system requires additional return air ducts and air supply ducts, which requires a large space, resulting in a reduction in the usable space of the data center's computer room.
  • This application provides an indirect evaporative cooling system and heat exchange components, which do not require the installation of pipes for air circulation in the computer room between the system and the computer room, occupy less space, and are conducive to improving the space of the computer room.
  • inventions of the present application provide an indirect evaporative cooling system that can be used to dissipate heat in a computer room.
  • the system includes a box, an indoor air channel and an outdoor air channel.
  • the indoor air channel is connected with the machine room and can be used for air circulation in the machine room.
  • the outdoor air channel is connected with the outside of the machine room and can be used for air circulation outside the machine room.
  • the temperature of the air outside the machine room is lower than the temperature of the air in the machine room, and the heat exchange between the indoor air channel and the outdoor air channel can realize cooling of the air in the machine room.
  • the air inlet and air outlet of the indoor air channel are arranged on the first side of the box; the first side is used to fit with the wall of the machine room; the air inlet of the outdoor air channel is arranged on The air outlet of the outdoor air channel is provided on other sides of the box except the first side.
  • the indoor air channel of the indirect evaporative cooling system is connected to the inside of the computer room.
  • the indoor air channel of the indirect evaporative cooling system can refer to the space inside the system where the air flows in the computer room.
  • Indoor air channels can also be called indoor air ducts.
  • the outdoor air channel is connected to the outside of the computer room.
  • the outdoor air channel can refer to the space where the air flows inside the system and outside the computer room.
  • the outdoor air channel can also be called an outdoor air duct.
  • the air inlet and outlet of the indoor air channel are both set on the first side of the box.
  • the first side of the box is attached to the wall of the computer room, allowing the air in the computer room to enter the indirect evaporative cooling system through the air inlet of the indoor air channel.
  • the system includes a heat exchange component having a housing, a first air duct and a second air duct.
  • the air inlet side and the air outlet side of the first air duct are respectively arranged on two adjacent surfaces of the casing, and the air inlet side and the air outlet side of the second air duct are respectively arranged on the casing. on two adjacent surfaces, and the air inlet side of the first air duct and the air inlet side of the second air duct are respectively arranged on two opposite surfaces of the housing, and the first air duct
  • the air outlet side of the second air duct and the air outlet side of the second air duct are respectively arranged on two opposite surfaces of the housing.
  • the first air duct is arranged in the indoor air channel, and the air in the machine room enters from the air inlet side of the first air duct and is discharged from the air outlet side of the first air duct.
  • the second air duct is arranged in the outdoor air channel, and the air outside the machine room enters from the air inlet side of the second air duct and is discharged from the air outlet side of the second air duct.
  • the first air duct is in the indoor air channel, and the air inlet side and the air outlet side of the first air duct are on two adjacent surfaces of the heat exchange component housing.
  • the second air duct is in the outdoor air channel, and the air inlet side and the air outlet side of the second air duct are on two adjacent surfaces of the housing.
  • the air inlet of the second air duct is opposite to the surface of the air inlet of the first air duct, and the air outlet of the second air duct is opposite to the surface of the air outlet of the first air duct.
  • the air inlet of the outdoor air channel is provided on the second side of the box, the second side is opposite to the first side, and the air outlet of the outdoor air channel is provided on the second side of the box.
  • the third side of the box is connected to the first side and is close to the air inlet of the indoor air channel.
  • the air inlet and outlet of the outdoor air channel are not on the first side of the box, and there is no need to reserve space for the outdoor air channel between the machine room and the indirect evaporative cooling system.
  • the indirect evaporative cooling system can be directly attached to the wall of the computer room, occupying less space and increasing the usable space of the computer room.
  • the system further includes a mechanical evaporative cooling component;
  • the mechanical evaporative cooling component includes an evaporator and a condenser, and the evaporator is in communication with the condenser.
  • the evaporator is arranged in the indoor air channel, and the evaporator is located between the heat exchange component and the fourth side of the box, and the fourth side is opposite to the third side.
  • the condenser is disposed between the heat exchange component and the third side.
  • the condenser can be installed at any position inside the indirect evaporation system box. In such a design, the evaporator in the mechanical evaporative cooling component can dissipate heat from the air in the indoor air channel, making the entire system have high heat dissipation efficiency.
  • a compressor is provided between the outlet of the evaporator and the inlet of the condenser.
  • a first circulation pump is provided between the inlet of the evaporator and the outlet of the condenser.
  • a fluorine pump can be selected as the first circulation pump to reduce system energy consumption.
  • the condenser avoids the indoor and outdoor air passages.
  • the condenser can avoid the air outlet side of the second air duct, that is, the condenser does not interfere with the circulation path of the air outside the computer room.
  • the condenser will not increase the wind resistance of the system, and the circulation of air outside the computer room will not be interfered with. , which can achieve good heat exchange with the air in the computer room.
  • the projection of the evaporator on the first side of the box does not overlap with the projection of the air outlet of the indoor air channel on the first side of the box.
  • the evaporator can avoid the air outlet of the indoor air channel to reduce the wind resistance of the system and facilitate heat exchange of air in the computer room.
  • the system further includes a liquid storage tank and a spray assembly.
  • the spray assembly is disposed at the air inlet of the outdoor air channel.
  • the liquid storage tank is connected to the spray assembly to provide the spray assembly.
  • Spray liquid supply can be used to cool the wind outside the computer room entering the system and improve the heat exchange efficiency of the system.
  • the system further includes a spray component, the spray component is disposed at the air outlet of the outdoor air channel, and the liquid storage tank in the system is connected to the spray component for the purpose.
  • the above-mentioned spray components supply liquid.
  • the spray component can be used to cool the wind outside the computer room and improve the heat exchange efficiency of the system.
  • the system further includes a first fan assembly.
  • the first fan assembly may be disposed in the indoor air channel and used to drive air flow in the machine room.
  • the first fan assembly may be located on the air outlet side of the first air duct in the heat exchange assembly.
  • the system further includes a second fan assembly.
  • the second fan assembly may be disposed at an air outlet of the outdoor air channel for driving air flow outside the machine room.
  • the second fan assembly may be disposed inside the box, such as the air outlet side of the second air duct, or the second fan assembly may be disposed outside the box.
  • a heat exchange assembly which may include a housing and a first air duct and a second air duct provided in the housing.
  • the two openings of the first air duct are respectively provided on the first surface of the housing and the second surface adjacent to the first surface.
  • the two openings of the second air duct are respectively provided on the third surface and the fourth surface of the housing, the third surface is opposite to the first surface, and the fourth surface is opposite to the second surface.
  • the surface is opposite.
  • Figures 1A and 1B are schematic structural diagrams of existing indirect evaporative cooling systems
  • Figure 2A is a schematic structural diagram of an indirect evaporative cooling system provided by an embodiment of the present application.
  • Figure 2B is a schematic cross-sectional structural diagram of the plane A1-A1 in Figure 2A;
  • Figure 3A is an isometric view of a heat exchange component in the first direction
  • Figure 3B is a schematic diagram of the air flow inside the first air duct and the second air duct on the plane where A2-A2 is located in Figure 3A;
  • Figure 3C is an isometric view of a heat exchange component in the second direction
  • Figure 4 is a schematic structural diagram of the first air duct plate and the second air duct plate of the heat exchange assembly
  • Figure 5A is a schematic diagram of the position of a heat exchange component in Figure 2B;
  • Figure 5B is a schematic structural diagram of another indirect evaporative cooling system provided by the embodiment of the present application.
  • Figure 6 is a schematic structural diagram of another indirect evaporative cooling system provided by an embodiment of the present application.
  • Figure 7 is a schematic structural diagram of another indirect evaporative cooling system provided by an embodiment of the present application.
  • Figure 8 is a schematic structural diagram of another indirect evaporative cooling system provided by an embodiment of the present application.
  • Figure 9 is a schematic diagram of an application scenario of an indirect evaporative cooling system.
  • the embodiment of the present application provides an indirect evaporative cooling system that can be applied to air cooling in a computer room.
  • This indirect evaporative cooling system eliminates the need for additional indoor air return ducts and air supply ducts, and the indirect evaporative cooling system occupies less space, which is beneficial to increasing the space of the computer room.
  • the present application will be described in further detail below in conjunction with the accompanying drawings.
  • Figure 2A is a schematic three-dimensional structural diagram of an indirect evaporative cooling system.
  • Indirect evaporative cooling systems can be used to cool the air in the computer room.
  • the computer room can be the computer room of a data center.
  • the indirect evaporative cooling system can cool down the air with higher temperature in the computer room and then send it back to the computer room to cool the indoor air in the computer room.
  • the indirect evaporative cooling system provided by the embodiment of the present application may include a box 100, wherein the first side 100A of the box 100 is attached to the wall of the computer room.
  • the air inlet K1 and the air exhaust port K2 of the indoor air channel of the indirect evaporative cooling system may be provided on the first side 100A of the box 100 .
  • the air inlet M1 and the air exhaust port M2 of the outdoor air channel of the indirect evaporative cooling system are not provided on the first side 100A of the box 100 .
  • the air inlet M1 and the air exhaust port M2 of the outdoor air channel may be provided on other sides of the box 100 except the first side 100A.
  • the indirect evaporative cooling system is directly attached to the wall of the computer room. There is no need to set up pipes for air circulation in the computer room between the system and the computer room. Therefore, the indirect evaporative cooling system occupies less space, which is beneficial to improving the efficiency of the computer room. space.
  • the air inlet M1 of the outdoor air channel may be disposed on the second side 100B of the box 100 , and the second side 100B is opposite to the first side 100A.
  • the exhaust port M2 of the outdoor air channel can be provided on the third side 100C of the box 100.
  • the third side 100C is connected to the first side 100A, and the third side 100C is close to the air inlet K1 of the indoor air channel. And stay away from the air outlet K2.
  • the indoor air channel of the indirect evaporative cooling system is connected to the inside of the computer room.
  • the indoor air channel of the indirect evaporative cooling system can refer to the space inside the system where the air flows in the computer room.
  • Indoor air channels can also be called indoor air ducts.
  • the outdoor air channel is connected to the outside of the computer room.
  • the outdoor air channel can refer to the space where the air flows inside the system and outside the computer room.
  • the outdoor air channel can also be called an outdoor air duct.
  • FIG. 2B is a schematic cross-sectional structural diagram of the plane S1-S1 in FIG. 2A.
  • the indoor air channel is used for air circulation in the computer room.
  • this application will characterize the indoor air channel B1 in the air flow route B1 in the computer room inside the indirect evaporative cooling system, which will be referred to as indoor air channel B1 below.
  • the outdoor air channel can also be called the fresh air channel, which is used for air circulation outside the computer room for ease of introduction.
  • This application will characterize the outdoor air channel in the air flow route B2 outside the computer room inside the indirect evaporative cooling system. , hereinafter referred to as outdoor air channel B2.
  • the indoor air channel B1 has an air inlet K1 and an air outlet K2.
  • the air in the computer room can enter the indoor air channel B1 through the air inlet K1 and be discharged to the computer room through the air outlet K2.
  • Outdoor air channel B2 is used for air circulation outside the computer room.
  • the temperature of the air outside the computer room is lower than the air in the computer room.
  • the outdoor air channel B2 intersects with the indoor air channel B1.
  • the air in the computer room and the air outside the computer room can exchange heat and cold at the intersection of the outdoor air channel B2 and the indoor air channel B1.
  • the air outside the computer room takes away the air in the computer room. of heat to achieve cooling of the air in the computer room.
  • the first side of the box 100 has a plate-like structure.
  • the wall of the computer room is provided with an opening that matches the air inlet K1 and an opening that matches the air exhaust outlet K2.
  • the board on the first side 100A of the box 100 is fitted to the wall of the computer room.
  • the board on the first side 100A of the box 100 is provided with an air inlet K1 and an air exhaust port K2, which can respectively match the openings on the wall of the computer room.
  • the first side 100A of the box 100 does not have a plate-like structure, or the first side 100A of the box 100 does not have a plate-like structure, and the first side 100A of the box 100 is directly attached to the computer room.
  • all openings on the wall face the inside of the box 100 and serve as the air inlet K1 and the air exhaust port K2 of the indoor air channel B1.
  • the aforementioned indirect evaporative cooling system may include a heat exchange assembly 200, such as the assembly shown by the shaded portion in Figure 2B.
  • the heat exchange component 200 can be used for air circulation in the computer room, and can also be used for air circulation outside the computer room, and the air circulation in the computer room is isolated from the air circulation outside the computer room, and only heat transfer is achieved. Specifically, when the air in the computer room and the air outside the computer room circulate in the heat exchange component 200 at the same time, the heat of the air in the computer room can be transferred to the air outside the computer room, and the air outside the computer room takes away the heat of the air in the computer room, thereby cooling the air in the computer room. Cool down.
  • the embodiment of the present application also provides a heat exchange component 200.
  • the heat exchange component may have a shell, a first air duct and a second air duct.
  • the first air duct is arranged in the indoor air channel B1 and can be used for air circulation in the computer room.
  • the air in the computer room enters from the air inlet side of the first air duct and is discharged from the air outlet side of the first air duct.
  • the second air duct can be arranged in the outdoor air channel B2 and can be used for air circulation outside the computer room.
  • the air outside the computer room enters from the air inlet side of the second air duct and is discharged from the air outlet side of the second air duct.
  • FIG. 3A is an exemplary isometric view showing the heat exchange assembly 200 in the first direction.
  • the first direction is the direction shown by arrow P1 in FIG. 2B.
  • the heat exchange assembly 200 includes a housing 200A, a first air duct 201, and a second air duct (not shown in FIG. 3A).
  • the heat exchange assembly 200 shown in FIG. 3A has a plurality of first air channels 201 and a plurality of second air channels.
  • the air inlet side 201A and the air outlet side 201B of the first air duct 201 are respectively provided on two adjacent surfaces of the housing 200A.
  • FIG. 1 is an exemplary isometric view showing the heat exchange assembly 200 in the first direction.
  • the first direction is the direction shown by arrow P1 in FIG. 2B.
  • the heat exchange assembly 200 includes a housing 200A, a first air duct 201, and a second air duct (not shown in FIG. 3A).
  • the heat exchange assembly 200 shown in FIG. 3A has a
  • the air inlet side 201A of the first air duct 201 is provided on the first surface 200A1 of the housing 200A. There may be a first opening 200B1 on the first surface 200A1 of the housing 200A, and the first opening 200B1 is connected to the air inlet side 201A of the first air duct 201. Air can enter the interior of the first air duct 201 through the air inlet side 201A of the first air duct 201 .
  • the air outlet side 201B of the first air duct 201 is provided on the second surface 200A2 of the housing 200A. There may be a second switch 200B2 on the second surface 200A2.
  • the second opening B2 is connected with the air outlet side 201B of the first air duct 201 .
  • the air inside the first air duct 201 can flow out through the air outlet side 201B of the first air duct 201 .
  • Figure 3B shows the air flow direction inside the first air duct 201 and the second air duct 202 on the plane where S2-S2 is located in Figure 3A.
  • the internal air flow of the first air duct 201 is toward B1-201 and the internal air flow of the second air duct 202 is toward B2-202, respectively in an "L" shape.
  • the heat exchange assembly 200 may also be called an L-shaped counterflow air-to-air heat exchanger.
  • FIG. 3C is an isometric view of the heat exchange assembly 200 shown in FIG. 3A in the second direction, where the second direction is the direction indicated by arrow P2 in FIG. 2B .
  • the air inlet side 202A and the air outlet side 202B of the second air channel 202 of the heat exchange assembly 200 are respectively disposed on two adjacent surfaces of the housing 200A.
  • the air inlet side 202A of the second air duct 202 is provided on the third surface 200A3 of the housing, and the third surface 200A3 is opposite to the first surface 200A1.
  • the third surface 200A3 of the housing 200A has a third opening 200B3, and the third opening 200B3 is connected with the air inlet side 202A of the second air duct 202.
  • the air can flow out through the air outlet side 202B of the second air duct 202 .
  • the air outlet side 202B of the second air duct 202 is opposite to the fourth surface 200A4 provided on the housing, and the fourth surface 200A4 is opposite to the second surface 200A2.
  • the fourth surface 200A4 of the housing 200A has a fourth opening 200B4, and the fourth opening 200B4 is connected to the air outlet side 202B of the second air duct 200.
  • the air inside the second air duct 202 can flow out through the air outlet side 202B of the second air duct 202 .
  • the core of the heat exchange assembly 200 may include a plurality of stacked air duct plates.
  • the structures of each air duct board may be the same, and the air path directions formed by two adjacent air duct boards are different.
  • the heat exchange assembly 200 may include at least two air duct plates.
  • FIG. 4 shows a schematic structural view of two adjacent air duct plates in the core body of the heat exchange assembly 200 shown in FIGS. 3A and 3C .
  • the two adjacent air duct boards include a first air duct board and a second air duct board.
  • the first air duct plate is used to form the first air duct in the above example
  • the second air duct plate is used to form the second air duct in the above example.
  • the first air duct plate can include a plate body 301.
  • the first side 301A and the second side 301B of the plate body 301 can serve as the air inlet side 201A and the air outlet side of the first air duct 201 respectively.
  • the first side 301A and the second side 301B of the board 301 are adjacent two sides of the board 301 .
  • a first blocking part 302 is provided on the opposite side of the first side 301A of the plate body 301, and a second blocking part 303 is provided on the opposite side of the second side 301B.
  • the first blocking part 302 and the second blocking part 303 are used to change the air flow direction, so that the air can enter through the first side 301A of the plate body 301 and then flow out through the second side 301B.
  • At least one first partition 304 can be provided on the board body 301 of the first air duct plate, which can reduce the pressure of air circulation on the first blocking portion 302 and the second blocking portion 303 .
  • the first partition 304 shown in FIG. 4 is used for illustration and is not used as a specific limitation on the shape of the first partition 304 . In actual application scenarios, the first partition 304 may also adopt other shapes.
  • the second air duct plate can include a plate body 401.
  • the first side 401A and the second side 401B of the plate body 401 can serve as the air inlet side 202A and the air outlet side of the second air duct 202 respectively.
  • the first side 401A and the second side 402B of the plate body 401 are adjacent two sides of the plate body 401 .
  • a third blocking part 402 is provided on the opposite side of the first side 401A of the plate body 401, and a fourth blocking part 403 is provided on the opposite side of the second side 401B.
  • the third blocking part 402 and the fourth blocking part 403 are used to change the air flow direction, so that the air can enter through the first side 401A of the plate body 401 and then flow out through the second side 401B.
  • At least one second partition 404 can be provided on the board body 401 of the second air duct plate, which can reduce the pressure of air circulation on the third blocking portion 402 and the fourth blocking portion 403 .
  • the second partition 404 shown in FIG. 4 is used for illustration and is not used as a specific limitation on the shape of the second partition 404 . In actual application scenarios, the second partition 404 may also adopt other shapes.
  • the air inlet side 202A of the second air duct 202 of the heat exchange assembly 200 can be connected to the air inlet M1 of the outdoor air channel B2, and the air outlet side 202B of the second air duct 202 can be connected to the outdoor air channel B2.
  • the air outlet M2 is connected.
  • the air outside the computer room can enter the second air duct 202 of the heat exchange component through the air inlet M1 of the outdoor air channel B2. After passing through the second air duct 202, it flows out through the air outlet M2 of the outdoor air channel B2.
  • the third surface 200A3 of the housing 200A of the heat exchange assembly 200 may be parallel to the inner wall of the second side 100B of the box 100 .
  • FIG. 5A shows a schematic diagram of the position of a heat exchange assembly 200 in the indirect evaporative cooling system shown in FIG. 2B .
  • the third surface 200A3 of the housing 200A of the heat exchange assembly 200 may fit the inner wall of the second side 100B of the box 100 .
  • the first surface 200A1 of the housing 200A of the heat exchange assembly 200 can be attached to the inner wall of the first side 100A of the box 100 or attached to the wall of the machine room.
  • the second surface 200A2 of the housing 200A of the heat exchange assembly 200 and the fourth side 100D of the box 100 may form a first channel, and the first channel is connected to the air outlet K2 of the indoor air channel B1.
  • the air in the machine room enters the first air duct 201 of the heat exchange component through the air inlet K1 of the indoor air channel B1. After passing through the first air duct 201, it flows out from the air outlet K2 of the indoor air channel B1 through the first channel.
  • FIG. 5B shows a schematic diagram of the position of another heat exchange assembly 200 in the indirect evaporative cooling system shown in FIG. 2B .
  • the third surface 200A3 of the shell 200A of the heat exchange assembly 200 can be parallel to the inner wall of the second side 100B of the box 100 . There can be gaps between them.
  • the indirect generative cooling system may include a baffle R.
  • the baffle R is disposed on the third surface 200A3 of the housing 200A of the heat exchange assembly 200 and the inner wall of the second side 100B of the box 100. between.
  • the baffle R is used to isolate the air outside the computer room from the air inside the computer room.
  • the baffle, the second surface 200A2 of the shell 200A of the heat exchange assembly 200 and the fourth side 100D of the box 100 can form a first channel, so that the air in the machine room can pass through the first channel and flow from the indoor air channel B1
  • the air outlet K2 flows out.
  • a mixing loop air inlet may be provided on the second side of the aforementioned box.
  • a mixing circuit air inlet Q1 is provided on the second side 100B of the box 100 .
  • the mixing circuit air inlet is on the second side 100B of the box 100 .
  • the air outside the computer room can enter the first channel through the mixing loop air inlet Q1. In the first channel, the air outside the computer room and the air in the computer room are in direct contact, causing heat exchange.
  • the heat-exchanged air passes through the indoor air
  • the air flows out from the air outlet K2 of channel B1.
  • an air inlet valve is provided at the air inlet Q1 of the mixing circuit to adjust the air volume of the air outside the machine room entering the first channel.
  • the indirect evaporative system may also include a mechanical evaporative cooling component.
  • Mechanical evaporative cooling components can be used to cool the air in the computer room, such as absorbing heat from the air in the computer room through gas-liquid state conversion.
  • the evaporative cooling component of the computer room may include a condenser 500A and an evaporator 500B.
  • the evaporator 500B is connected to the condenser 500A.
  • the evaporator 500B is installed in the indoor air passage B2.
  • the evaporator 500B may be located between the heat exchange component 200 and the fourth side 100D of the box 100, or in other words, the evaporator 500B may be disposed in the first channel and may absorb heat from the air in the machine room.
  • the evaporator 500B is disposed in the first channel, and the projection of the evaporator 500B along the first direction (the direction from the second side 100B of the box 100 to the first side 100A of the box 100) is in line with the indoor direction.
  • the air outlets K2 of the air channel B1 partially overlap or completely overlap.
  • the evaporator 500B can avoid the indoor air channel B1.
  • the evaporator 500B is disposed in the first channel, and the projection of the evaporator 500B on the first side 100A of the box 100 is aligned with the air outlet K2 on the third side of the box 100.
  • the projections of 100A on one side do not overlap, which can reduce the obstruction of the evaporator 500B to the air flow in the computer room.
  • the liquid refrigerant in the evaporator 500B absorbs the heat of the air in the computer room and then vaporizes into gaseous refrigerant and is transferred to the condenser 500A.
  • the condenser 500A is used to condense the gaseous refrigerant into liquid refrigerant and then returns to the evaporator 500B. Absorbs heat from the air in the computer room through gas-liquid state conversion.
  • the condenser 500A may be disposed between the heat exchange assembly 200 and the third side 100C of the box 100 .
  • the projection of the condenser 500A along the second direction partially overlaps or completely overlaps with the air outlet M2 of the outdoor air channel B2. overlapping.
  • the condenser 500A can avoid the outdoor air channel B2, and the projection of the condenser 500A along the second direction does not overlap with the air outlet M2 of the outdoor air channel B2, thereby reducing the risk of air outside the machine room flowing out of the second air channel 202 of the heat exchange assembly 200. resistance.
  • a compressor 500C is provided on the path in which the evaporator 500B delivers gaseous refrigerant to the condenser 500A.
  • the compressor 500C is provided between the outlet of the evaporator 500B and the inlet of the condenser 500A. The compressor 500C sucks the gaseous refrigerant in the evaporator 500B, compresses the gaseous refrigerant, increases the pressure of the gas, and sends it to the condenser 500A.
  • the compressor 500C here can specifically be an air suspension compressor or an ordinary compressor, and can provide a compression function for the gaseous refrigerant in the mechanical evaporative cooling assembly.
  • the compressor 500C can be an oil-free compressor, which can improve the reliability of the system.
  • the condenser 500A condenses the gaseous refrigerant into liquid refrigerant and sends it back to the evaporator 500B again.
  • a first circulation pump 500D is provided on a path for conveying liquid refrigerant from the condenser 500A to the evaporator 500B. Specifically, the first circulation pump 500D is provided between the inlet of the evaporator 500B and the outlet of the condenser 500A.
  • the first circulation pump 500D here uses a fluorine pump, which can be an oil-free lubrication liquid floating fluorine pump or an ordinary fluorine pump.
  • the first circulation pump 500D uses a fluorine pump, which can reduce the energy consumption of the entire system, thereby improving the energy efficiency of the mechanical evaporative cooling component in all working conditions.
  • the indirect evaporative cooling system may also include a first fan assembly 601.
  • the first fan assembly 601 is disposed in the indoor air channel. Used to drive air flow in the computer room.
  • the first fan assembly 601 may be disposed at the air outlet side 201B of the first air duct 201 of the heat exchange assembly 200, or the first fan assembly 601 may be disposed between the air outlet side 201B of the first air duct 201 and the box. 100 on the fourth side between 100D.
  • the indirect evaporative cooling system may also include a second fan assembly 602 for driving air flow outside the computer room.
  • the second fan assembly 602 may be disposed at the air outlet M2 of the outdoor air channel.
  • the indirect evaporative cooling system may also include a liquid storage tank that can store liquid.
  • the liquid storage tank may be disposed between the heat exchange component and the third side of the tank.
  • the liquid storage tank can avoid indoor and outdoor circuits to reduce air circulation resistance outside the machine room.
  • the liquid storage tank 700 may be disposed between the heat exchange assembly 200 and the fourth side 100D of the tank 100 .
  • the liquid storage tank 700 can avoid indoor air passages to reduce air circulation resistance in the machine room.
  • the indirect evaporative cooling system may also include a spray assembly 701, which is specifically disposed at the air inlet M1 of the outdoor air channel B2.
  • the spray assembly 701 is between the air inlet M1 of the outdoor air channel B2 and the air inlet side 202A of the second air channel 202 of the heat exchange assembly 200 .
  • a water pump 702 is provided between the liquid inlet of the spray assembly 701 and the liquid outlet of the liquid storage tank 700 .
  • the spray assembly 701 is connected with the liquid storage tank 700, and the liquid storage tank 700 in the indirect evaporative cooling system can supply liquid to the spray assembly 701.
  • the spray assembly 701 can spray and cool the air outside the computer room that enters the second air duct 202, which is beneficial to improving the heat exchange effect between the air outside the computer room and the air inside the computer room.
  • the spray assembly 700 may include a spray spray device or a wet film spray device.
  • the indirect evaporative cooling system provided by the embodiment of the present application is also provided with a spray assembly 703.
  • the spray assembly 703 is specifically disposed at the air outlet M2 of the outdoor air channel B2, such as the air outlet of the second air channel 202. Side 202B.
  • the spray assembly 703 is connected with the liquid storage tank 700, and the liquid storage tank 700 can supply liquid to the spray assembly 703.
  • the spray assembly 703 can spray and cool the air in the second air duct 202, which is beneficial to improving the cold and heat exchange effect between the air outside the computer room and the air inside the computer room.
  • the sprinkler assembly 703 may include a water sprinkler device.
  • the working principle of the indirect evaporative cooling system provided by the embodiment of the present application is introduced below.
  • indirect evaporative cooling systems have multiple working modes. Each working mode of the indirect evaporative cooling system can be reasonably selected according to the temperature of the actual application scenario. Each working mode of the indirect evaporation system is introduced below.
  • the corresponding operating temperature range of each working mode is used for example reference and is not used as a specific limitation on the corresponding operating temperature range of the working mode.
  • Indirect evaporative cooling systems can have an air-to-air heat exchange mode.
  • the outdoor air channel is activated to extract air outside the computer room to the heat exchange component 200, and the air outside the computer room circulates in the second air channel 202 of the heat exchange component 200.
  • the air outside the computer room in the second air duct 202 and the air in the computer room in the first air duct 201 undergo air-to-air cooling and heat exchange in the heat exchange component 200 to achieve cooling of the air in the computer room.
  • the air in the computer room is equivalent to passing through the heat exchange component 200 and the mechanical refrigeration component at the same time, but only exchanges heat and cools down at the heat exchange component 200 .
  • the indirect evaporative cooling system can be configured in the air-to-air heat exchange mode.
  • the first temperature may be 15°C.
  • Indirect evaporative cooling systems can have a fresh air free cooling mode.
  • the mixing loop air inlet is opened, and the air outside the computer room enters the aforementioned first channel (of the heat exchange component 200) through the mixing loop air inlet.
  • the air outside the computer room is directly mixed with the air in the computer room to achieve cooling of the air in the computer room.
  • the air in the computer room enters the first channel through the first air duct of the heat exchange component, and is only cooled in the first channel.
  • the indirect evaporative cooling system can be configured in a fresh air natural cooling mode.
  • the first temperature may be 15°C
  • the second temperature may be 27°C.
  • the indirect evaporative cooling system may have a first hybrid mode.
  • the first hybrid mode is a combined air-to-air heat exchange + mechanical refrigeration supplementary cooling mode.
  • the outdoor air channel is activated to extract air outside the computer room to the heat exchange component 200 , and the air outside the computer room circulates in the second air channel 202 of the heat exchange component 200 .
  • the air outside the computer room in the second air duct 202 and the air in the computer room in the first air duct 201 undergo air-to-air cooling and heat exchange in the heat exchange component 200, thereby achieving cooling of the air in the computer room.
  • the evaporator 500B, the condenser 500A, and the compressor 500C are started.
  • the compressor 500C operates to transport the vaporized refrigerant of the evaporator 500B to the input port of the condenser 500A.
  • the evaporator 500B absorbs the heat of the air in the computer room to vaporize the refrigerant and transfers it to the condenser 500A to release heat and condense it into a liquid state, thereby cooling the air in the computer room.
  • the air in the computer room is equivalent to passing through the heat exchange component 200 and the evaporator 500B at the same time, and at the same time, the heat exchange component 200 is cooled by heat exchange and the evaporator 500B is cooled by heat dissipation.
  • the indirect evaporative cooling system may be configured in the first hybrid mode.
  • the first temperature may be 15°C.
  • the indirect evaporative cooling system may have a second hybrid mode.
  • the second mixing mode is the combined air-to-air heat exchange + fluorine pump mode.
  • the outdoor air channel is activated to extract air outside the computer room to the heat exchange component 200 , and the air outside the computer room circulates in the second air channel 202 of the heat exchange component 200 .
  • the air outside the computer room in the second air duct 202 and the air in the computer room in the first air duct 201 undergo air-to-air cooling and heat exchange in the heat exchange component 200 to achieve cooling of the air in the computer room.
  • the evaporator 500B, the condenser 500A and the fluorine pump are started.
  • the liquid refrigerant output from the condenser 500A can be returned to the input port of the evaporator 500B.
  • the evaporator 500B absorbs the heat of the air in the computer room to vaporize the refrigerant and transfers it to the condenser 500A to release heat and condense it into a liquid state, thereby cooling the air in the computer room.
  • the air in the computer room is equivalent to passing through the heat exchange component 200 and the evaporator 500B at the same time, and at the same time, the heat exchange component 200 is cooled by heat exchange and the evaporator 500B is cooled by heat dissipation.
  • the indirect evaporative cooling system can be configured in the second hybrid mode.
  • the first temperature may be 5°C
  • the second temperature may be 20°C.
  • the second hybrid mode has less system energy consumption.
  • the indirect evaporative cooling system may have a third hybrid mode.
  • the third mixing mode is the combined air-to-air heat exchange + spray mode.
  • the outdoor air channel is activated to extract air outside the computer room to the heat exchange component 200 , and the air outside the computer room circulates in the second air channel 202 of the heat exchange component 200 .
  • the air outside the computer room in the second air duct 202 and the air in the computer room in the first air duct 201 undergo air-to-air cooling and heat exchange in the heat exchange component 200 to achieve cooling of the air in the computer room.
  • the indirect evaporative cooling system can be configured in the third hybrid mode.
  • the first temperature may be 15°C
  • the second temperature may be 18°C.
  • the indirect evaporative cooling system may have a fourth hybrid mode.
  • the fourth hybrid mode is the combined air-to-air heat exchange + spray mode.
  • the outdoor air channel is activated to extract air outside the computer room to the heat exchange component 200 , and the air outside the computer room circulates in the second air channel 202 of the heat exchange component 200 .
  • the air outside the computer room in the second air duct 202 and the air in the computer room in the first air duct 201 undergo air-to-air cooling and heat exchange in the heat exchange component 200 to achieve cooling of the air in the computer room.
  • the indirect evaporative cooling system may be configured in the fourth hybrid mode.
  • the first temperature may be 18°C.
  • the indirect evaporative cooling system may have a fifth hybrid mode.
  • the fifth hybrid mode is a combined air-to-air heat exchange + spray + mechanical refrigeration supplementary cooling mode.
  • the outdoor air channel is activated to extract air outside the computer room to the heat exchange component 200 , and the air outside the computer room circulates in the second air channel 202 of the heat exchange component 200 .
  • the air outside the computer room in the second air duct 202 and the air in the computer room in the first air duct 201 undergo air-to-air cooling and heat exchange in the heat exchange component 200 to achieve cooling of the air in the computer room.
  • the spray component which can spray the outdoor air in the heat exchange component, reduce the temperature of the air outside the machine room in the second air duct of the heat exchange component, and improve the relationship between the air outside the machine room in the heat exchange component and The heat exchange efficiency of the air in the computer room.
  • the evaporator 500B, the condenser 500A, and the compressor 500C are started.
  • the compressor 500C operates to transport the vaporized refrigerant of the evaporator 500B to the input port of the condenser 500A.
  • the evaporator 500B absorbs the heat of the air in the computer room to vaporize the refrigerant and transfers it to the condenser 500A to release heat and condense it into a liquid state, thereby cooling the air in the computer room.
  • the air in the computer room is equivalent to passing through the heat exchange component 200 and the evaporator 500B at the same time, and at the same time, the heat exchange component 200 is cooled by heat exchange and the evaporator 500B is cooled by heat dissipation.
  • the indirect evaporative cooling system may be configured in the fifth hybrid mode.
  • the first temperature may be 22°C
  • the target wet bulb temperature may be 19°C.
  • Figure 9 shows a schematic diagram of an indirect evaporative cooling system application scenario.
  • multiple indirect evaporative cooling systems can be used to regulate the temperature of the computer room.
  • Each indirect evaporative cooling system can adopt the structure of any indirect evaporative cooling system provided by the embodiments of the present application.
  • each indirect evaporative cooling system can operate independently.
  • multiple indirect evaporative cooling systems can work together.
  • each indirect evaporative cooling system can work independently or with other indirect evaporative cooling systems.

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Abstract

一种间接蒸发冷却系统及换热组件，不需要在系统与机房之间设置用于机房内空气流通的管道，占据较少的空间，利于提升机房的空间。系统包括箱体（100）、室内风通道和室外风通道。室内风通道与机房连通可以用于机房内的空气流通。室外风通道与机房外部连通，可以用于机房外的空气流通。机房外的空气的温度低于机房内的空气的温度，室内风通道与室外风通道热交换，可实现对机房内的空气降温。其中，室内风通道的进风口（K1）和出风口（K2）设置在箱体（100）的第一侧（100A）上；第一侧（100A）用于与机房墙壁贴合；室外风通道的进风口（M1）设置在箱体（100）除第一侧（100A）之外的其它侧，室外风通道的出风口（M2）设置在箱体（100）除第一侧（100A）之外的其它侧。

Description

一种间接蒸发冷却系统及换热组件 技术领域
本申请涉及机械设计领域，尤其设计一种间接蒸发冷却系统及换热组件。
背景技术
数据中心的机房多采用间接蒸发冷却系统降低数据中心内部温度。间接蒸发冷却系统最关键的部分是换热芯体，通常也称为换热器。换热器内部空气走向以及流道分布结构会影响数据中心的回风口和排风口的位置。
如图1A所示，现有间接蒸发冷却系统可以包括换热器、蒸发器、冷凝器、压缩机等组件。换热器的第一表面(A1)设置有回风口，通过回风管道与机房连通。换热器上，与第一表面(A1)相对的第二表面(A2)设置有送风口，通过送风管道与机房连通。机房内部的空气，通过回风口进入换热器进行热交换后，由送风口流出。换热器上与第一表面(A1)的邻接的第三表面(B1)设置有新风口。与第三表面(B1)相对的第四表面(B2)设置有排风口。机房外部的空气可以通过新风口进入换热器，并由排风口流出。
现有换热器中，机房内部风的流道与机房外部风的流道呈“十”字型，采用换热器也被称为十字交叉空空换热器。如图1B所示，现有间接蒸发冷却系统需要额外设置回风管道和送风管道，需要占据空间较大，导致数据中心的机房可使用空间减少。
发明内容
本申请提供一种间接蒸发冷却系统及换热组件，不需要在系统与机房之间设置用于机房内空气流通的管道，占据较少的空间，利于提升机房的空间。
第一方面，本申请实施例提供一种间接蒸发冷却系统，可以用于为机房散热。所述系统包括箱体、室内风通道和室外风通道。所述室内风通道与机房连通可以用于所述机房内的空气流通。所述室外风通道与所述机房外部连通，可以用于所述机房外的空气流通。所述机房外的空气的温度低于所述机房内的空气的温度，所述室内风通道与所述室外风通道热交换，可实现对机房内的空气降温。其中，所述室内风通道的进风口和出风口设置在所述箱体的第一侧上；所述第一侧用于与所述机房墙壁贴合；所述室外风通道的进风口设置在所述箱体除所述第一侧之外的其它侧，所述室外风通道的出风口设置在所述箱体除所述第一侧之外的其它侧。
本申请实施例中，间接蒸发冷却系统的室内风通道与机房内部连通，间接蒸发冷却系统的室内风通道可指在系统内部，机房内的空气流动的空间。室内风通道也可称为室内风路。室外风通道与机房外部连通，室外风通道可指在系统内部，机房外的空气流动的空间。室外风通道也可称为室外风路。室内风通道的进风口和出风口均设置在箱体的第一侧，箱体的第一侧与机房墙壁贴合，可使机房内的空气经由室内风通道的进风口进入间接蒸发冷却系统，并经由室内风通道的出风口流回机房内。而室外风通道的进风口和排风口均不设置在箱体的第一侧上。这样的设计中，不需要在机房与间接蒸发冷却系统之间的位置设置用于机房内空气流通的管道，如送风管道、回风管道等，也不需要在机房与间接蒸发冷却系统之间的位置为室外风通道预留出空间。可以看出，间接蒸发冷却系统可以直接与机房 墙壁贴合，占据较少的空间，可以提升机房的可使用空间。
该系统包括换热组件，所述换热组件具有壳体、第一风道和第二风道。所述第一风道的进风侧与出风侧分别设置在所述壳体相邻的两个表面上，所述第二风道的进风侧与出风侧分别设置在所述壳体相邻的两个表面上，并且所述第一风道的进风侧和所述第二风道的进风侧分别设置在所述壳体相对的两个表面上，所述第一风道的出风侧和所述第二风道的出风侧分别设置在所述壳体相对的两个表面上。其中，所述第一风道设置在所述室内风通道内，所述机房内的空气从所述第一风道的进风侧进入，并从所述第一风道的出风侧排出。所述第二风道设置在所述室外风通道内，所述机房外的空气从所述第二风道的进风侧进入，并从所述第二风道的出风侧排出。
本申请实施例中，第一风道在室内风通道内，第一风道的进风侧和出风侧在换热组件壳体相邻的两个表面上。第二风道在室外风通道内，第二风道的进风侧和出风侧在该壳体相邻的两个表面上。并且第二风道的进风口和第一风道的进风口所在表面相对，第二风道的出风口和第一风道的出风口所在表面相对。这样的设计，可以在换热组件内部增加机房内空气与机房外空气热交换接触空间，提高换热效率。
一种可能的设计中，所述室外风通道的进风口设置在所述箱体的第二侧，所述第二侧与所述第一侧相对，所述室外风通道的出风口设置在所述箱体的第三侧，所述第三侧为与所述第一侧相连，且靠近所述室内风通道的进风口。这样的设计中，室外风通道的进风口和出风口均不在箱体的第一侧，不需要在机房与间接蒸发冷却系统之间的位置为室外风通道预留出空间。间接蒸发冷却系统可以直接与机房墙壁贴合，占据较少的空间，可以提升机房的可使用空间。
一种可能的设计中，所述系统还包括机械蒸发冷却组件；所述机械蒸发冷却组件包括蒸发器和冷凝器，所述蒸发器与所述冷凝器连通。所述蒸发器设置于所述室内风通道内，且所述蒸发器位于所述换热组件与所述箱体的第四侧之间，所述第四侧与所述第三侧相对。所述冷凝器设置在所述换热组件与所述第三侧之间。所述冷凝器可以设置在间接蒸发系统箱体内部的任意一个位置。这样的设计中，机械蒸发冷却组件中蒸发器可以对室内风通道内的空气进行散热，使得整个系统具有较高的散热效率。
一种可能的设计中，所述蒸发器的出口与所述冷凝器的入口之间设置有压缩机。
一种可能的设计中，所述蒸发器的入口与所述冷凝器的出口之间设置有第一循环泵。其中，第一循环泵具体可以选择氟泵，以降低系统能耗。
一种可能的设计中，所述冷凝器避让所述室内外风通道。示例性的，冷凝器可以避让第二风道的出风侧，即冷凝器与机房外空气的流通路径互不干涉，冷凝器不会增大系统的风阻，机房外空气的流通不会受到干涉，可以与机房内空气实现良好的热交换。
一种可能的设计中，所述蒸发器在所述箱体的第一侧的投影与所述室内风通道的出风口在所述箱体的第一侧的投影不重叠。示例性的，蒸发器可以避让室内风通道的出风口，降低系统的风阻，利于机房内空气的热交换。
一种可能的设计中，所述系统还包括储液箱和喷雾组件，所述喷雾组件设置于所述室外风通道的进风口处，所述储液箱与所述喷雾组件连通以为所述喷淋喷雾供液。这样的设计中，喷雾组件可以用于为进入系统的机房外的风降温，提升系统的换热效率。
一种可能的设计中，所述系统还包括喷淋组件，所述喷淋组件设置于所述室外风通道的出风口处，所述系统中的储液箱与所述喷淋组件连通以为所述喷淋组件供液。这样的设 计中，喷淋组件可以用于为机房外的风降温，提升系统的换热效率。
一种可能的设计中，所述系统还包括第一风扇组件。所述第一风扇组件可以设置在所述室内风通道内，用于驱动所述机房内的空气流动。示例性的，所述第一风扇组件可以位于换热组件中的所述第一风道的出风侧。
一种可能的设计中，所述系统还包括第二风扇组件。所述第二风扇组件可以设置在所述室外风通道的出风口处，用于驱动所述机房外的空气流动。示例性的，所述第二风扇组件可以设置在箱体内部，如所述第二风道的出风侧，或者所述第二风扇组件可以设置在箱体的外部。
第二方面，本申请实施例提供一种换热组件，可以包括壳体以及设置在所述壳体内的第一风道和第二风道。其中，所述第一风道的两个开口分别设置在所述壳体的第一表面和与所述第一表面相邻的第二表面上。所述第二风道的两个开口分别设置在所述壳体的第三表面和第四表面上，所述第三表面与所述第一表面相对，所述第四表面与所述第二表面相对。这样的设计，可以在换热组件内部增加机房内空气与机房外空气热交换接触空间，提高换热效率。
附图说明
图1A和1B为现有间接蒸发冷却系统的结构示意图；
图2A为本申请实施例提供的一种间接蒸发冷却系统的结构示意图；
图2B为图2A中A1-A1所在平面的剖面结构示意图；
图3A为一种换热组件在第一方向的轴测图；
图3B为图3A中A2-A2所在平面上第一风道和第二风道内部空气流向示意图；
图3C为一种换热组件在第二方向的轴测图；
图4为换热组件的第一风道板和第二风道板的结构示意图；
图5A为一种换热组件在图2B中的位置示意图；
图5B本申请实施例提供的另一种间接蒸发冷却系统的结构示意图；
图6为本申请实施例提供的又一种间接蒸发冷却系统的结构示意图；
图7为本申请实施例提供的又一种间接蒸发冷却系统的结构示意图；
图8为本申请实施例提供的又一种间接蒸发冷却系统的结构示意图；
图9为一种间接蒸发冷却系统应用场景示意图。
具体实施方式
以下实施例中所使用的术语只是为了描述特定实施例的目的，而并非旨在作为对本申请的限制。如在本申请的说明书和所附权利要求书中所使用的那样，单数表达形式“一个”、“一种”、“所述”、“上述”、“该”和“这一”旨在也包括例如“一个或多个”这种表达形式，除非其上下文中明确地有相反指示。
在本说明书中描述的参考“一个实施例”或“一些实施例”等意味着在本申请的一个或多个实施例中包括结合该实施例描述的特定特征、结构或特点。由此，在本说明书中的不同之处出现的语句“在一个实施例中”、“在一些实施例中”、“在其他一些实施例中”、“在另外一些实施例中”等不是必然都参考相同的实施例，而是意味着“一个或多个但不是所 有的实施例”，除非是以其他方式另外特别强调。术语“包括”、“包含”、“具有”及它们的变形都意味着“包括但不限于”，除非是以其他方式另外特别强调。
本申请实施例提供一种可以应用于机房内空气降温的间接蒸发冷却系统。该间接蒸发冷却系统可以不需要设置额外室内风的回风管道和送风管道，并且间接蒸发冷却系统占据较少的空间，有利于提升机房空间。为了使本申请的目的、技术方案和优点更加清楚，下面将结合附图对本申请作进一步地详细描述。
图2A为一种间接蒸发冷却系统的立体结构示意图。间接蒸发冷却系统可以用于为机房内空气降温。在一些应用场景中，机房可以是数据中心的机房。间接蒸发冷却系统可以将机房内温度较高的空气降温后再送回机房内，实现机房室内空气降温。本申请实施例提供的间接蒸发冷却系统可以包括箱体100，其中，箱体100的第一侧100A与机房墙壁贴合。间接蒸发冷却系统的室内风通道的进风口K1和排风口K2可以设置在箱体100的第一侧100A。间接蒸发冷却系统的室外风通道的进风口M1和排风口M2，均不设置在箱体100的第一侧100A上。室外风通道的进风口M1和排风口M2可以设置在箱体100的除了第一侧100A之外的其它侧。这样的设计中，间接蒸发冷却系统直接与机房的墙壁贴合，不需要在系统与机房之间设置用于机房内空气流通的管道，因而间接蒸发冷却系统占据较少的空间，利于提升机房的空间。
一些应用场景中，请继续参见图2A，室外风通道的进风口M1可以设置在箱体100的第二侧上100B，第二侧100B与第一侧100A相对。可选的，室外风通道的排风口M2可以设置在箱体100的第三侧100C上，第三侧面100C与第一侧面100A相连，其中第三侧面100C靠近室内风通道的进风口K1，且远离出风口K2。
本申请实施例中，间接蒸发冷却系统的室内风通道与机房内部连通，间接蒸发冷却系统的室内风通道可指在系统内部，机房内的空气流动的空间。室内风通道也可称为室内风路。室外风通道与机房外部连通，室外风通道可指在系统内部，机房外的空气流动的空间。室外风通道也可称为室外风路。
图2B为图2A中S1-S1所在平面的剖面结构示意图。间接蒸发冷却系统中，室内风通道用于机房内的空气流通，便于介绍，本申请将在间接蒸发冷却系统内部机房内的空气流动路线B1表征室内风通道，下文中记为室内风通道B1。类似地，间接蒸发冷却系统中，室外风通道也可以称为新风通道，用于机房外的空气流通，便于介绍，本申请将在间接蒸发冷却系统内部机房外的空气流动路线B2表征室外风通道，下文中记为室外风通道B2。
室内风通道B1具有进风口K1以及出风口K2，机房内的空气可以经过进风口K1进入室内风通道B1，并经过出风口K2排出至机房内。室外风通道B2用于机房外的空气流通，机房外的空气的温度低于机房内的空气。该室外风通道B2与室内风通道B1交汇，机房内的空气和机房外的空气可以在室外风通道B2与室内风通道B1的交汇处进行冷热交换，具体是机房外空气带走机房内空气的热量，实现机房内空气的冷却降温。
一种可能的场景中，箱体100的第一侧具有板状结构。机房墙壁上设置有与进风口K1配合的开口，以及与排风口K2的开口。则箱体100的第一侧100A的板与机房墙壁贴合，在箱体100的第一侧100A的板上设置有进风口K1和排风口K2，可以分别与机房墙壁上的开口相匹配。另一种可能的场景中，箱体100的第一侧100A没有板状结构，或者说箱体100的第一侧100A没有设置板状结构，箱体100的第一侧100A直接贴合在机房墙壁上，将墙壁上的开口均朝向箱体100的内部，并作为室内风通道B1的进风口K1和排风口K2。
前述间接蒸发冷却系统可以包括换热组件200，如图2B中阴影部分示出的组件。换热组件200即可以用于机房内空气流通，还可以用机房外空气流通，并且机房内空气的流通与机房外空气的流通相隔离，仅实现热量传递。具体的，当机房内空气和机房外空气同时在换热组件200内流通，机房内空气的热量可以传递到机房外空气，机房外空气带走机房内空气的热量，实现对机房内空气的冷却降温。
本申请实施例还提供一种换热组件200，换热组件可以具有壳体、第一风道以及第二风道。第一风道设置在室内风通道B1内，可以用于机房内的空气流通，机房内的空气从第一风道的进风侧进入，并从第一风道的出风侧排出。第二风道可以设置在室外风通道B2内，可以用于机房外的空气流通，机房外的空气从第二风道的进风侧进入，并从第二风道的出风侧排出。
图3A为示例性的示出换热组件200在第一方向的轴测图。其中，第一方向为图2B中箭头P1所示出的方向。换热组件200包括壳体200A、第一风道201、以及第二风道(图3A中未示出)。图3A中示出的换热组件200具有多个第一风道201和多个第二风道。第一风道201的进风侧201A与出风侧201B分别设置在壳体200A相邻的两个表面上。例如，图3A中示出的换热组件200中，第一风道201的进风侧201A设置在壳体200A的第一表面200A1。壳体200A的第一表面200A1上可以有第一开口200B1，第一开口200B1与第一风道201的进风侧201A连通。空气可以经由第一风道201的进风侧201A进入第一风道201内部。
第一风道201的出风侧201B设置在壳体200A的第二表面200A2上。第二表面200A2上可以有第二开关200B2。第二开口B2与第一风道201的出风侧201B连通。第一风道201内部空气可以经由第一风道201的出风侧201B流出。
图3B为图3A中S2-S2所在平面上第一风道201和第二风道202内部空气流向。第一风道201的内部空气流向B1-201和第二风道202的内部空气流向B2-202，分别呈“L”型。换热组件200也可以称为L型逆流空空换热器。
图3C为图3A所示的换热组件200在第二方向的轴测图，其中，第二方向为图2B中箭头P2所示出的方向。请参见图3B，换热组件200的第二风道202的进风侧202A与出风侧202B分别设置在壳体200A相邻的两个表面上。例如，第二风道202的进风侧202A设置在壳体的第三表面200A3，第三表面200A3与第一表面200A1相对。壳体200A的第三表面200A3上具有第三开口200B3，第三开口200B3与第二风道202的进风侧202A连通。空气可以经由第二风道202的出风侧202B流出。
第二风道202的出风侧202B与设置在壳体的第四表面200A4，第四表面200A4与第二表面200A2相对。壳体200A的第四表面200A4上具有第四开口200B4，第四开口200B4与第二风道200的出风侧202B连通。第二风道202内部空气可以经由第二风道202的出风侧202B流出。
换热组件200的芯体可以包括多个层叠放置的风道板。各风道板的结构可以相同，相邻的两个风道板分别形成的风路方向不同。换热组件200中可以包括至少两个风道板。图4示出图3A和图3C中所示的换热组件200中芯体中的相邻的两个风道板的结构示意图。相邻的两个风道板包括第一风道板和第二风道板。第一风道板用于形成上述示例中的第一风道，第二风道板用于形成上述示例中的第二风道。
请结合图4和图3A，第一风道板可以包括板体301，板体301的第一侧301A和第二 侧301B，可以分别作为第一风道201的进风侧201A和出风侧201B。其中，板体301的第一侧301A和第二侧301B是板体301相邻的两侧。板体301的第一侧301A的对侧设置有第一阻挡部302，以及第二侧301B的对侧设置有第二阻挡部303。第一阻挡部302和第二阻挡部303用于改变空气流动方向，可使空气经由板体301的第一侧301A进入后，由第二侧301B流出。
可选的，第一风道板的板体301上还可以设置至少一个第一分隔部304，可以减少空气流通对第一阻挡部302和第二阻挡部303的压力。需说明的是，图4中示出的第一分隔部304用于举例说明，不作为第一分隔部304的形状的具体限定。在实际应用场景中，第一分隔部304还可以采用其它形状。
请结合图4和图3C，第二风道板可以包括板体401，板体401的第一侧401A和第二侧401B，可以分别作为第二风道202的进风侧202A和出风侧202B。其中，板体401的第一侧401A和第二侧402B是板体401相邻的两侧。板体401的第一侧401A的对侧设置有第三阻挡部402，以及第二侧401B的对侧设置有第四阻挡部403。第三阻挡部402和第四阻挡部403用于改变空气流动方向，可使空气经由板体401的第一侧401A进入后，由第二侧401B流出。
可选的，第二风道板的板体401上还可以设置至少一个第二分隔部404，可以减少空气流通对第三阻挡部402和第四阻挡部403的压力。需说明的是，图4中示出的第二分隔部404用于举例说明，不作为第二分隔部404的形状的具体限定。在实际应用场景中，第二分隔部404还可以采用其它形状。
在间接蒸发冷却系统中，换热组件200的第二风道202的进风侧202A可以与室外风通道B2的进风口M1连通，第二风道202的出风侧202B可以与室外风通道B2的出风口M2连通。机房外的空气可以通过室外风通道B2的进风口M1进入换热组件的第二风道202，经过第二风道202后，经由室外风通道B2的出风口M2流出。
换热组件200的壳体200A的第三表面200A3可以与箱体100的第二侧100B的内壁平行。一个示例中，图5A示出一种换热组件200在图2B示出的间接蒸发冷却系统中的位置示意图。换热组件200的壳体200A的第三表面200A3可以贴合箱体100的第二侧100B的内壁。
换热组件200的壳体200A的第一表面200A1可以贴合箱体100的第一侧100A的内壁，或者贴合机房墙体。换热组件200的壳体200A的第二表面200A2与箱体100的第四侧100D可以形成第一通道，并且该第一通道与室内风通道B1的出风口K2连通。机房内空气经过室内风通道B1的进风口K1进入换热组件的第一风道201，经过第一风道201后，经由该第一通道从室内风通道B1的出风口K2流出。
另一个示例中，图5B示出另一种换热组件200在图2B示出的间接蒸发冷却系统中的位置示意图。图5B中换热组件200的壳体200A的第三表面200A3可以与箱体100的第二侧100B的内壁平行，壳体200A的第三表面200A3与箱体100的第二侧100B的内壁之间可以存在空隙。
一些应用场景中，请继续参见图5B，间接生发冷却系统可以包括挡板R，挡板R设置在换热组件200的壳体200A的第三表面200A3与箱体100的第二侧100B的内壁之间。该挡板R用于隔离机房外的空气和机房内的空气。该挡板、换热组件200的壳体200A的第二表面200A2以及箱体100的第四侧100D可以向形成第一通道，可使机房内的空气经 过第一通道后，从室内风通道B1的出风口K2流出。
基于上述任意一个示例提供的间接蒸发冷却系统，间接蒸发冷却系统中，前述箱体的第二侧上可以设置有混合回路进风口。如图6所示，箱体100的第二侧100B上设置混合回路进风口Q1。该混合回路进风口在箱体100的第二侧100B上。图6中与前述图2B中相同之处，可以参见前述图2B的相关介绍，此处不再赘述。这样的设计中，机房外的空气可以通过混合回路进风口Q1进入第一通道，在第一通道内机房外的空气和机房内的空气直接接触，发生热交换，热交换后的空气经由室内风通道B1的出风口K2流出。可选地，混合回路进风口Q1处设有进风阀，用于调整进入第一通道的机房外空气的风量。
基于上述任意一个示例提供的间接蒸发冷却系统，间接蒸发系统还可以包括机械蒸发冷却组件。机械蒸发冷却组件可以用于对机房内的空气降温，例如通过气-液状态转换吸收机房内空气的热量。示例性的，如图7所示，机房蒸发冷却组件可以包括冷凝器500A和蒸发器500B，蒸发器500B与冷凝器500A连通。图7中与前述图2B中相同之处，可以参见前述图5B的相关介绍，此处不再赘述。
蒸发器500B设置在室内风通道B2内。蒸发器500B可以位于换热组件200与箱体100的第四侧100D之间，或者说，蒸发器500B可以设置在前述第一通道内，可以吸收机房内空气的热量。可选的，蒸发器500B设置在第一通道内，且蒸发器500B沿着第一方向(由箱体100的第二侧100B指向箱体100的第一侧100A的方向)的投影，与室内风通道B1的出风口K2部分重叠或者完全重叠。或者，蒸发器500B可以避让室内风通道B1，如蒸发器500B设置在第一通道内，且蒸发器500B在箱体100的第一侧100A侧的投影，与出风口K2在箱体100的第一侧100A的投影不重叠，可减少蒸发器500B对机房内空气流动的阻碍。
蒸发器500B内的液态制冷剂吸收机房内空气的热量后气化为气态制冷剂并转移到冷凝器500A中，冷凝器500A用于将气态制冷剂冷凝成液态制冷剂再次回到蒸发器500B，通过气-液状态转换吸收机房内空气的热量。冷凝器500A可以设置在换热组件200与箱体100的第三侧100C之间。可选的，冷凝器500A沿着第二方向(由箱体100的第四侧100D指向箱体100的第三侧100C的方向)的投影，与室外风通道B2的出风口M2部分重叠或者完全重叠。或者，冷凝器500A可以避让室外风通道B2，冷凝器500A沿着第二方向的投影与室外风通道B2的出风口M2不重叠，降低机房外空气流出换热组件200的第二风道202的阻力。
请再参见图7，为了实现蒸发器500B与冷凝器500A之间的气液流通，蒸发器500B向冷凝器500A输送气态制冷剂的路径上设置有压缩机500C。具体地，压缩机500C设置于蒸发器500B的出口与冷凝器500A的入口之间。压缩机500C吸入蒸发器500B内的气态制冷剂，对气态制冷剂进行压缩，增加气体的压强后送入冷凝器500A。此处的压缩机500C具体可以为气悬浮压缩机或普通的压缩机，能够为机械蒸发冷却组件中的气态制冷剂提供压缩功能。其中压缩机500C可以为无油压缩机，能够提高系统的可靠性。
如图7所示，冷凝器500A将气态制冷剂冷凝成为液态制冷剂，并再次送回蒸发器500B。在冷凝器500A向蒸发器500B输送液态制冷剂的路径上设置有第一循环泵500D。具体地，第一循环泵500D设置于蒸发器500B的入口与冷凝器500A的出口之间。此处的第一循环泵500D选用氟泵，具体可以为无油润滑的液浮氟泵或普通氟泵。第一循环泵500D选用氟泵，能够减小整个系统的能耗，进而可以提升机械蒸发冷却组件的全工况能效。
一种可能的设计中，基于上述任意一个示例提供的间接蒸发冷却系统，请继续参考图7，间接蒸发冷却系统还可以包括第一风扇组件601，第一风扇组件601设置在室内风通道内，用于驱动机房内空气流动。示例性的，第一风扇组件601可以设置在换热组件200的第一风道201的出风侧201B处，或者第一风扇组件601设置在第一风道201的出风侧201B与箱体100的第四侧100D之间。可选的，间接蒸发冷却系统还可以包括第二风扇组件602，用于驱动机房外空气流动。第二风扇组件602可以设置在室外风通道的出风口M2处。
一种可能的设计中，基于上述任意一个示例提供的间接蒸发冷却系统，间接蒸发冷却系统还可以包括储液箱，可以存储液体。一个实施例中，储液箱可以设置在换热组件与箱体的第三侧之间。可选的，储液箱可以避让室内外回路，减少机房外空气流通阻力。另一个实施例中，请参见图8，储液箱700可以设置在换热组件200与箱体100的第四侧100D之间。可选的，储液箱700可以避让室内风通道，减少机房内空气流通阻力。图8中与前述图2B中相同之处，可以参见前述图7的相关介绍，此处不再赘述。
请继续参见图8，间接蒸发冷却系统还可以包括喷雾组件701，所述喷雾组件701具体设置与室外风通道B2的进风口M1处。示例性的，如图8所示，喷雾组件701室外风通道B2的进风口M1处和换热组件200的第二风道202的进风侧202A之间。在喷淋组件701的进液口与储液箱700的出液口之间设置有水泵702。喷雾组件701与储液箱700连通，间接蒸发冷却系统中的储液箱700可以为喷雾组件701供液。喷雾组件701可以为进入第二风道202的机房外的空气进行喷雾降温，有利于挺高机房外空气与机房内空气之间的热交换效果。可选地，喷雾组件700可以包括喷雾喷淋器件或者湿膜喷淋器件。
可选的，本申请实施例所提供的间接蒸发冷却系统还设置有喷淋组件703，喷淋组件703具体设置于室外风通道B2的排风口M2处，例如第二风道202的出风侧202B。喷淋组件703与储液箱700连通，储液箱700可以为喷淋组件703供液。喷淋组件703可以为第二风道202内的空气进行喷淋降温，有利于提高机房外空气与机房内空气之间的冷热交换效果。可选地，喷淋组件703可以包括淋水喷淋器件。
基于图8所示的间接蒸发冷却系统，下面对本申请实施例所提供的间接蒸发冷却系统工作原理进行介绍。在实际应用中，间接蒸发冷却系统具有多种工作模式。间接蒸发冷却系统的各工作模式，可以根据实际应用场景的温度进行合理选择。下面对间接蒸发系统的各工作模式进行介绍，其中，各工作模式相应的运行温度范围，用于举例参考，并不做为对工作模式对应运行温度范围的具体限定。
间接蒸发冷却系统可以具有空空换热模式。在空空换热模式下，启动室外风通道，将机房外空气抽取到换热组件200，机房外空气在换热组件200的第二风道202内流通。第二风道202内的机房外空气与第一风道201内的机房内空气在换热组件200内发生气-气冷热交换，实现对机房内空气的冷却降温。在该空空换热模式下，机房内空气相当于同时经过换热组件200和机械制冷组件，但是仅在换热组件200处换热降温。可选的，当室外温度(相当于机房外空气温度)低于第一温度，该间接蒸发冷却系统可以被配置为空空换热模式。示例性的，第一温度可以为15℃。
间接蒸发冷却系统可以具有全新风自然冷却模式。在全新风自然冷却模式下，开启混合回路进风口，机房外空气经由混合回路进风口进入前述第一通道(换热组件200的)。在第一通道内，机房外空气与机房内空气直接混合，实现对机房内空气的冷却降温。在该全新风自然冷却模式下，机房内空气经由换热组件的第一风道进入第一通道内，仅在第一 通道内降温。可选的，当室内温度大于第一温度，且小于第二温度时，该间接蒸发冷却系统可以被配置为全新风自然冷却模式。示例性的，第一温度可以为15℃，第二温度可以为27℃。
间接蒸发冷却系统可以具有第一混合模式。第一混合模式为组合式空空换热+机械制冷补冷模式。在该第一混合模式下，启动室外风通道，将机房外空气抽取到换热组件200，机房外空气在换热组件200的第二风道202内流通。第二风道202内的机房外空气与第一风道201内的机房内空气在换热组件200内发生气-气冷热交换，实现对机房内空气的冷却降温。同时，启动蒸发器500B、冷凝器500A和压缩机500C。压缩机500C工作，将蒸发器500B气化的冷剂传输到冷凝器500A的输入口。蒸发器500B吸收机房内空气的热量将制冷剂气化并转移到冷凝器500A放热冷凝为液态，实现对机房内空气的冷却降温。在该第一混合模式下，机房的机房内空气相当于同时经过换热组件200和蒸发器500B，且同时换热组件200处换热降温和蒸发器500B处散热降温。可选的，当室内温度大于第一温度，该间接蒸发冷却系统可以被配置为第一混合模式。示例性的，第一温度可以为15℃。
间接蒸发冷却系统可以具有第二混合模式。第二混合模式为组合式空空换热+氟泵模式。在该第二混合模式下，启动室外风通道，将机房外空气抽取到换热组件200，机房外空气在换热组件200的第二风道202内流通。第二风道202内的机房外空气与第一风道201内的机房内空气在换热组件200内发生气-气冷热交换，实现对机房内空气的冷却降温。同时，启动蒸发器500B、冷凝器500A和氟泵。氟泵工作时，可以将冷凝器500A输出液态制冷剂送回到蒸发器500B的输入口。蒸发器500B吸收机房内空气的热量将制冷剂气化并转移到冷凝器500A放热冷凝为液态，实现对机房内空气的冷却降温。在该第二混合模式下，机房的机房内空气相当于同时经过换热组件200和蒸发器500B，且同时换热组件200处换热降温和蒸发器500B处散热降温。可选的，当室内温度大于第一温度，且小于第二温度，该间接蒸发冷却系统可以被配置为第二混合模式。示例性的，第一温度可以为5℃，第二温度可以为20℃。相比于第一混合模式，第二混合模式具有更少的系统能耗。
间接蒸发冷却系统可以具有第三混合模式。第三混合模式为组合式空空换热+喷雾模式。在该第三混合模式下，启动室外风通道，将机房外空气抽取到换热组件200，机房外空气在换热组件200的第二风道202内流通。第二风道202内的机房外空气与第一风道201内的机房内空气在换热组件200内发生气-气冷热交换，实现对机房内空气的冷却降温。同时，启动喷雾组件，喷雾组件可以对抽取到换热组件中的室外风进行喷雾操作，降低进入换热组件的第二风道的机房外空气的温度，可以提高换热组件内机房外空气与机房内空气的换热效率。可选的，当室内温度大于第一温度，且小于第二温度，该间接蒸发冷却系统可以被配置为第三混合模式。示例性的，第一温度可以为15℃，第二温度可以为18℃。
间接蒸发冷却系统可以具有第四混合模式。第四混合模式为组合式空空换热+喷淋模式。在该第四混合模式下，启动室外风通道，将机房外空气抽取到换热组件200，机房外空气在换热组件200的第二风道202内流通。第二风道202内的机房外空气与第一风道201内的机房内空气在换热组件200内发生气-气冷热交换，实现对机房内空气的冷却降温。同时，启动喷淋组件，喷淋组件可以对换热组件中的室外风进行喷淋操作，降低换热组件的第二风道内的机房外空气的温度，可以提高换热组件内机房外空气与机房内空气的换热效率。可选的，当室内温度大于第一温度，该间接蒸发冷却系统可以被配置为第四混合模式。示例性的，第一温度可以为18℃。
间接蒸发冷却系统可以具有第五混合模式。第五混合模式为组合式空空换热+喷淋+机械制冷补冷模式。在该第五混合模式下，启动室外风通道，将机房外空气抽取到换热组件200，机房外空气在换热组件200的第二风道202内流通。第二风道202内的机房外空气与第一风道201内的机房内空气在换热组件200内发生气-气冷热交换，实现对机房内空气的冷却降温。同时，启动喷淋组件，喷淋组件可以对换热组件中的室外风进行喷淋操作，降低换热组件的第二风道内的机房外空气的温度，可以提高换热组件内机房外空气与机房内空气的换热效率。同时，启动蒸发器500B、冷凝器500A和压缩机500C。压缩机500C工作，将蒸发器500B气化的冷剂传输到冷凝器500A的输入口。蒸发器500B吸收机房内空气的热量将制冷剂气化并转移到冷凝器500A放热冷凝为液态，实现对机房内空气的冷却降温。在该第五混合模式下，机房的机房内空气相当于同时经过换热组件200和蒸发器500B，且同时换热组件200处换热降温和蒸发器500B处散热降温。可选的，当室内温度大于第一温度，并且湿球温度大于目标湿球温度时，该间接蒸发冷却系统可以被配置为第五混合模式。示例性的，第一温度可以为22℃，目标湿球温度可以为19℃。
一种可能的应用场景中，图9中示出一种间接蒸发冷却系统应用场景示意图。如图9所示，多个间接蒸发冷却系统可以用于为机房调节温度。各间接蒸发冷却系统可以采用本申请实施例提供的任意一种间接蒸发冷却系统的结构。一个示例中，各间接蒸发冷却系统可以独立工作。另一个示例中，多个间接蒸发冷却系统可以协同工作。又一个示例中，各间接蒸发冷却系统可以独立工作，也可以与其它间接蒸发冷却系统工作。
以上，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (14)

  1. 一种间接蒸发冷却系统，其特征在于，所述系统包括箱体、室内风通道和室外风通道；所述室内风通道与机房连通，用于所述机房内的空气流通；所述室外风通道与所述机房外部连通，用于所述机房外的空气流通；所述机房外的空气的温度低于所述机房内的空气的温度，所述室内风通道与所述室外风通道热交换；
    其中，所述室内风通道的进风口和出风口设置在所述箱体的第一侧上；所述第一侧用于与所述机房墙壁贴合；所述室外风通道的进风口设置在所述箱体除所述第一侧之外的其它侧，所述室外风通道的出风口设置在所述箱体除所述第一侧之外的其它侧。
  2. 如权利要求1所述的系统，其特征在于，所述系统包括换热组件，所述换热组件具有壳体、第一风道和第二风道；
    所述第一风道的进风侧与出风侧分别设置在所述壳体相邻的两个表面上，所述第二风道的进风侧与出风侧分别设置在所述壳体相邻的两个表面上，并且所述第一风道的进风侧和所述第二风道的进风侧分别设置在所述壳体相对的两个表面上，所述第一风道的出风侧和所述第二风道的出风侧分别设置在所述壳体相对的两个表面上；
    其中，所述第一风道设置在所述室内风通道内，所述机房内的空气从所述第一风道的进风侧进入，并从所述第一风道的出风侧排出；
    所述第二风道设置在所述室外风通道内，所述机房外的空气从所述第二风道的进风侧进入，并从所述第二风道的出风侧排出。
  3. 如权利要求2所述的系统，其特征在于，所述室外风通道的进风口设置在所述箱体的第二侧，所述第二侧与所述第一侧相对，所述室外风通道的出风口设置在所述箱体的第三侧，所述第三侧与所述第一侧相连，且靠近所述室内风通道的进风口。
  4. 如权利要求2所述的系统，其特征在于，所述系统包括机械蒸发冷却组件；所述机械蒸发冷却组件包括蒸发器和冷凝器，所述蒸发器与所述冷凝器连通；
    所述蒸发器设置于所述室内风通道内，且所述蒸发器位于所述换热组件与所述箱体的第四侧之间，所述第四侧与所述第三侧相对；
    所述冷凝器设置在所述换热组件与所述第三侧之间。
  5. 如权利要求4所述的系统，其特征在于，所述蒸发器的出口与所述冷凝器的入口之间设置有压缩机。
  6. 如权利要求4或5所述的系统，其特征在于，所述蒸发器的入口与所述冷凝器的出口之间设置有第一循环泵。
  7. 如权利要求6所述的系统，其特征在于，所述第一循环泵为氟泵。
  8. 如权利要求4-7任一所述的系统，其特征在于，所述冷凝器避让所述室内外风通道。
  9. 如权利要求4-8任一所述的系统，其特征在于，所述蒸发器在所述箱体的第一侧的投影与所述室内风通道的出风口在所述箱体的第一侧的投影不重叠。
  10. 如权利要求1-9任一所述的系统，其特征在于，所述系统包括储液箱和喷雾组件，所述喷雾组件设置于所述室外风通道的进风口处，所述储液箱与所述喷雾组件连通以为所述喷淋喷雾供液。
  11. 如权利要求2-10任一所述的系统，其特征在于，所述系统还包括喷淋组件，所述喷淋组件设置于所述室外风通道的出风口处，所述系统中的储液箱与所述喷淋组件连通以 为所述喷淋组件供液。
  12. 如权利要求2-11任一所述的系统，其特征在于，所述系统还包括第一风扇组件；
    所述第一风扇组件设置在所述室内风通道内，用于驱动所述机房内的空气流动。
  13. 如权利要求2-12任一所述的系统，其特征在于，所述系统还包括第二风扇组件；
    所述第二风扇组件设置在所述室外风通道的出风口处，用于驱动所述机房外的空气流动。
  14. 一种换热组件，其特征在于，包括壳体以及设置在所述壳体内的第一风道和第二风道；
    其中，所述第一风道的两个开口分别设置在所述壳体的第一表面和与所述第一表面相邻的第二表面上；
    所述第二风道的两个开口分别设置在所述壳体的第三表面和第四表面上，所述第三表面与所述第一表面相对，所述第四表面与所述第二表面相对。
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