WO2024012155A1 - 集成电感、电路板组件和逆变器 - Google Patents

集成电感、电路板组件和逆变器 Download PDF

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Publication number
WO2024012155A1
WO2024012155A1 PCT/CN2023/100913 CN2023100913W WO2024012155A1 WO 2024012155 A1 WO2024012155 A1 WO 2024012155A1 CN 2023100913 W CN2023100913 W CN 2023100913W WO 2024012155 A1 WO2024012155 A1 WO 2024012155A1
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WO
WIPO (PCT)
Prior art keywords
integrated inductor
magnetic core
windings
circuit board
core
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2023/100913
Other languages
English (en)
French (fr)
Inventor
梁金坤
智彦军
郑洲
胡小情
景遐明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Digital Power Technologies Co Ltd
Original Assignee
Huawei Digital Power Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Digital Power Technologies Co Ltd filed Critical Huawei Digital Power Technologies Co Ltd
Priority to EP23838649.4A priority Critical patent/EP4542592A4/en
Publication of WO2024012155A1 publication Critical patent/WO2024012155A1/zh
Priority to US19/014,345 priority patent/US20250149234A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/30—Fastening or clamping coils, windings, or parts thereof together; Fastening or mounting coils or windings on core, casing, or other support
    • H01F27/306—Fastening or mounting coils or windings on core, casing or other support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/02—Casings
    • H01F27/027—Casings specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/24—Magnetic cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2895—Windings disposed upon ring cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/32—Insulating of coils, windings, or parts thereof
    • H01F27/323—Insulation between winding turns, between winding layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F3/00—Cores, Yokes, or armatures
    • H01F3/10—Composite arrangements of magnetic circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F3/00—Cores, Yokes, or armatures
    • H01F3/10—Composite arrangements of magnetic circuits
    • H01F3/14—Constrictions; Gaps, e.g. air-gaps
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F3/00—Cores, Yokes, or armatures
    • H01F3/10—Composite arrangements of magnetic circuits
    • H01F2003/106—Magnetic circuits using combinations of different magnetic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F2027/297—Terminals; Tapping arrangements for signal inductances with pin-like terminal to be inserted in hole of printed path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/32—Insulating of coils, windings, or parts thereof
    • H01F27/324—Insulation between coil and core, between different winding sections, around the coil; Other insulation structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/1003—Non-printed inductor

Definitions

  • the present application relates to the field of inductors, and in particular to an integrated inductor, a circuit board assembly and an inverter.
  • the interfering electromagnetic field in the inverter will produce differential mode current between the wires, or common mode current between the wires and the ground, both of which will interfere with the load and affect the normal operation of the load.
  • the differential mode interference is usually suppressed through a differential mode inductor, and the common mode interference is suppressed through a common mode inductor.
  • This application provides an integrated inductor, a circuit board assembly and an inverter.
  • the integrated inductor has the advantage of miniaturization and can ensure the suppression of common mode interference and differential mode interference.
  • the application provides an integrated inductor, including a first magnetic core, at least two second magnetic cores and at least two windings.
  • the first magnetic core includes a first surface and a first surface arranged oppositely in a first direction. There are two surfaces, and the first magnetic core is provided with a first through hole penetrating the first surface and the second surface.
  • the second magnetic cores are disposed on a side of the first surface away from the second surface in the first direction, and each second magnetic core is provided with a second through hole.
  • At least two windings and the second magnetic core are arranged in one-to-one correspondence, and each winding passes through the first through hole and a corresponding second through hole, so that at least each winding is wound around the first magnetic core and a second magnetic core.
  • core, at least two windings and the first magnetic core form a common mode inductor, and at least two windings and at least two second magnetic cores form a differential mode inductor.
  • Each second core includes a first portion and a second portion, along the first direction and on a side of the first surface facing away from the second surface, the first portion is located between the winding and the first surface, and the second portion is located between the winding and the first surface. one side of the surface.
  • the first part and the second part of the second magnetic core may be of a one-piece structure (for example, made of ferrite material), or the first part and the second part may be of a split structure and are pasted together. Assemble and fix into one piece.
  • the first magnetic core and the second magnetic core share a set of windings.
  • the first magnetic core and the winding form a common mode inductor
  • the second magnetic core and the winding form a differential mode inductor. It can ensure the working efficiency of the integrated inductor. Integrating common mode inductors and differential mode inductors into a whole is beneficial to saving space and reducing costs.
  • the integrated inductor provided in the embodiment of the present application can reduce copper loss by sharing windings with common mode inductors and differential mode inductors, thereby reducing the impact of copper loss on the efficiency of the inverter system, thereby effectively improving the efficiency of the integrated inductor.
  • the first direction may be perpendicular to the surface on the circuit board for mounting the integrated inductor.
  • the first magnetic core and the second magnetic core are stacked in the first direction, which can save integration costs.
  • each winding includes two connection pins, and all the connection pins of at least two windings are arranged on a side of the second surface away from the first surface in the first direction.
  • This solution limits the wiring pins to Arranged in one direction on the side of the second surface away from the first surface. Since the wiring pins are used to connect the integrated inductor to the circuit board, this solution limits the positions of the wiring pins, which can be understood as: wiring pins, common The mode magnetic cores and the differential mode magnetic cores are arranged in sequence in the first direction. This solution is conducive to realizing integrated circuits and saving the board space of the circuit board.
  • the wiring pins are all located on the same side of the first magnetic core. During the process of assembling the integrated inductor to the circuit board, the wiring pins can be easily installed in batches and the processing efficiency during the assembly process can be improved.
  • vertical projections of all the second through holes on the first surface are located within the first surface.
  • the projection of the second through hole in the first direction all falls into the first surface, that is, the projection of the second magnetic core and the first magnetic core in the first direction mostly overlap, it is possible to save the integrated inductor in the first direction.
  • the size of the projected area in one direction. limits the positional relationship between the second through hole and the first surface so that the vertical projection of the second through hole on the first surface does not exceed the range of the first surface of the first magnetic core.
  • the integrated inductor provided by this solution
  • the arrangement of the second magnetic core does not affect the maximum radial size of the first magnetic core, which helps ensure the total size of the integrated inductor in the direction perpendicular to the first direction, and helps save board area.
  • each second magnetic core includes a third surface and a fourth surface
  • the second through hole connects the third surface and the fourth surface
  • the first surface is planar
  • the third surface or The fourth surface is flat or arcuate
  • the third surface is perpendicular to the first surface. Since the first surface can be understood as the reference plane on which all second magnetic cores are set, limiting the first surface of the first magnetic core to a planar shape is beneficial to improving the connection stability between the second magnetic core and the first magnetic core. It is helpful to ensure the consistency of the assembly positions of all second magnetic cores. This plan summarizes a specific structural form of the second magnetic core.
  • the third surface is arranged perpendicularly to the first surface, so that the projections of the second magnetic core and the first magnetic core in the first direction have most of the overlap.
  • the projected area of the integrated inductor in the first direction can be saved.
  • the third surface and the fourth surface are arc-shaped, the vertical relationship between the first surface and the third surface can be understood as: the axis generatrix of the third surface is perpendicular to the first surface, and the generatrix of the third surface can be an arc. Any moving line forming an arc on the third surface of the shape.
  • an air gap is provided between the first magnetic core and the second magnetic core.
  • the value range of the air gap is greater than or equal to 5 ⁇ m.
  • the air gap can not only make the layout of the integrated inductor compact, reduce the installation space occupied, but also maximize the overall anti-saturation capability of the integrated inductor.
  • the outer surface of the first magnetic core has a first insulating layer, the first insulating layer forming at least part of the air gap.
  • This solution forms at least part of the air gap by arranging a first insulating layer on the outer surface of the first magnetic core.
  • the first insulating layer can protect the first magnetic core on the one hand, and on the other hand serves as a gap between the first magnetic core and the second magnetic core.
  • the magnetic circuit isolation structure has dual functionality. This solution is conducive to miniaturizing the size of the integrated inductor while ensuring that the common mode magnetic circuit and the differential mode magnetic circuit are independent of each other.
  • the outer surface of the second magnetic core has a second insulating layer, the second insulating layer forming at least part of the air gap.
  • This solution forms at least part of the air gap by arranging a second insulating layer on the outer surface of the second magnetic core.
  • the second insulating layer can protect the first magnetic core on the one hand and act as a gap between the first magnetic core and the second magnetic core on the other hand.
  • the magnetic circuit isolation structure has dual functionality. This solution is conducive to miniaturizing the size of the integrated inductor while ensuring that the common mode magnetic circuit and the differential mode magnetic circuit are independent of each other.
  • the number of windings and second magnetic cores is three, and this solution defines a three-phase integrated inductor.
  • the number of windings and second magnetic cores is two, and this solution defines a two-phase integrated inductor.
  • the integrated inductor further includes a chassis, which is located on a side of the second surface away from the first surface; the wiring pins of the windings are all fixedly connected to the chassis.
  • the chassis is made of insulating material.
  • the chassis is used to fix all the wiring pins. On the one hand, it facilitates the management of the wiring pins of the integrated inductor. On the other hand, it also facilitates the subsequent fixed installation of the wiring pins (installed on the circuit board).
  • the chassis can The functional structure of the integrated inductor (i.e., the first magnetic core, the second magnetic core and the winding) is isolated from the mounting surface of the circuit board to protect the integrated inductor.
  • the wiring pins pass through the chassis, and some of the wiring pins are located on a side of the chassis away from the first magnetic core.
  • This solution limits the wiring pins to pass through the chassis and expose the side of the chassis away from the first magnetic core.
  • the assembly position is on the side of the chassis away from the first magnetic core.
  • it does not It is necessary to connect the wiring pins in the space outside the installation area of the circuit board occupied by the integrated inductor. Hiding the wiring pins between the chassis and the circuit board can save board space and also borrow the wiring pins during the assembly process.
  • the chassis isolates the assembly area and the first magnetic core. For example, when assembled by welding, the welding temperature will not affect the first magnetic core and winding due to the isolation of the chassis.
  • the chassis includes at least two mounting parts, each mounting part is fixed to a wiring pin of a winding, the at least two mounting parts are independent of each other, or at least one of the two mounting parts are connected through flexible connectors.
  • a split chassis or a chassis composed of at least two mounting parts connected by a flexible connector
  • the posture greatly enhances the adaptability of integrated inductors to the installation environment and expands the applicable scenarios of integrated inductors.
  • the integrated inductor further includes an insulating member, the insulating member is disposed between adjacent windings, and part of the insulating member is located in the first through hole.
  • insulators are provided between adjacent windings, which can effectively isolate the electrical effects between adjacent windings and prevent breakdown damage to the integrated inductor.
  • each winding includes an abutting portion, each abutting portion is in contact with the insulating member, and the abutting portion generates elastic deformation by contacting the insulating member.
  • This solution restricts the contact between the windings and the insulating parts and produces elastic deformation, and limits the position setting between the windings.
  • the distance between the windings is small and smaller than the thickness of the insulating parts. In this way, when the insulating parts are installed on the windings When between, the contact part will be forced to elastically deform.
  • This solution is conducive to realizing the miniaturization design of the integrated circuit.
  • Each winding is in contact with the insulator, making the internal layout of the integrated inductor compact and effectively reducing the integrated circuit. The installation area occupied by the inductor.
  • the insulating member includes a middle column and three insulating plates connected to the outer side of the middle column.
  • the number of windings is three, and the three insulating plates are respectively located between two adjacent windings. .
  • This plan defines a specific insulating board structure.
  • the insulating parts are of an integrated structure. The structure is simple and convenient for mass production. The installation steps of the integrated insulating parts are simple, which can effectively improve the installation efficiency.
  • the insulating piece and the chassis are fixedly connected.
  • the two can be fixedly connected by adhesive, or the fixed connection can be achieved through the cooperation of buckles and slots.
  • a buckle is provided at the bottom of the insulating piece.
  • a card slot is provided on the chassis, and the buckle is inserted into the card slot to achieve a fixed connection between the insulating part and the chassis.
  • the insulating part and the chassis are an integral structure. This solution is conducive to improving the stability of the overall structure of the integrated inductor.
  • the magnetic permeability of the first magnetic core of the common mode inductor is 20,000, and the magnetic permeability of the second magnetic core of the differential mode inductor is 1,000.
  • This solution defines a specific integrated inductor architecture by limiting the magnetic permeability of the first magnetic core and the second magnetic core.
  • the magnetic permeability of the first magnetic core of the common mode inductor is 7000
  • the magnetic permeability of the second magnetic core of the differential mode inductor is 125.
  • this application provides a circuit board assembly, which includes a circuit board and an integrated inductor provided in the first aspect, and the integrated inductor is connected to the circuit board.
  • Integrated inductor and circuit board installation Since the integrated inductor provided by this application has a compact structure, when the integrated inductor is installed with the circuit board, it occupies a smaller area in the first direction, which facilitates the installation of other components on the circuit board. space, making the component layout of the circuit board more reasonable.
  • the application provides a circuit board assembly, which includes a circuit board and an integrated inductor provided in the first aspect.
  • the circuit board includes an inductor mounting area, a pad is provided in the inductor mounting area, and the outer contour of the integrated inductor and the inductor mounting area are The area is consistent, and the wiring pins of the integrated inductor are welded to the pad.
  • the wiring pins are fixedly connected to the pads so that the integrated inductor is fixedly connected to the circuit board. Since the projected area of the integrated inductor in the first direction is small, the area of the inductor installation area will be smaller, making it easier to install the inductor on the circuit board. Other components save installation space, making the internal layout of the circuit board assembly more reasonable.
  • this application provides an inverter, including a housing and the circuit board assembly described in the third or fourth aspect, and the housing surrounds the circuit board assembly.
  • the internal layout of the circuit board assembly is reasonable and the structure is compact, which can effectively reduce the overall space of the inverter while ensuring the working efficiency of the inverter.
  • Figure 1 is a schematic diagram of the power supply system of the inverter according to the embodiment of the present application.
  • Figure 2 is a schematic diagram of the assembly structure of the inverter according to the embodiment of the present application.
  • Figure 3 is a schematic diagram of the assembly structure of the integrated inductor according to the embodiment of the present application.
  • Figure 4 is a top view of the assembly structure of the integrated inductor according to the embodiment of the present application.
  • Figure 5 is a schematic diagram of the exploded structure of the integrated inductor according to the embodiment of the present application.
  • Figure 6 is a schematic diagram of the assembly structure of the integrated inductor according to the embodiment of the present application.
  • FIG. 7 is a structural schematic diagram of a chassis with an integrated inductor according to an embodiment of the present application.
  • FIG. 8 is another structural schematic diagram of a chassis with an integrated inductor according to an embodiment of the present application.
  • Figure 9 is a schematic structural diagram of a common mode component of an integrated inductor according to an embodiment of the present application.
  • Figure 10 is a schematic structural diagram of a differential mode magnetic core integrated with an inductor according to an embodiment of the present application.
  • Figure 11 is another structural schematic diagram of a differential mode magnetic core integrated with an inductor according to an embodiment of the present application.
  • Figure 12 is a schematic structural diagram of the winding of the integrated inductor according to the embodiment of the present application.
  • Figure 13 is a schematic structural diagram of an insulator of an integrated inductor according to an embodiment of the present application.
  • Figure 14 is a schematic diagram of the matching structure of the winding and insulator according to the embodiment of the present application.
  • Figure 15 is a schematic structural diagram of a circuit board according to an embodiment of the present application.
  • Parallel as defined in this application is not limited to absolute parallel. This definition of parallel can be understood as basic parallel, which allows for situations that are not absolutely parallel due to factors such as assembly tolerances, design tolerances, and structural flatness. These The situation may lead to the situation that the sliding fitting part and the first door panel are not absolutely parallel, but this application also defines this situation as being parallel.
  • the vertical defined in this application is not limited to the relationship of absolute vertical intersection (the included angle is 90 degrees). It is allowed that the influence of assembly tolerance, design tolerance, structural flatness and other factors are not absolute vertical intersection. The relationship allows errors in a small angular range, for example, within the assembly error range of 80 degrees to 100 degrees, it can be understood as a vertical relationship.
  • first, second, etc. are used for descriptive purposes only and shall not be understood as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features. Thus, features defined by “first,” “second,” etc. may explicitly or implicitly include one or more of such features.
  • Inverters are widely used in power supply or power control scenarios such as photovoltaics and frequency converters.
  • differential mode interference and common mode interference will have adverse effects on the circuit system, and filter circuits are usually used to filter them.
  • common mode signals refer to signals with equal amplitude and the same phase.
  • Differential mode signals are signals with equal amplitude and opposite phase.
  • the common-mode interference signal In a closed circuit, the common-mode interference signal has the same amplitude and direction on the two conductors. Its essence is the interference caused by the voltage difference between the two traces and the ground wire in the closed circuit; the differential-mode interference signal has the same amplitude on the two conductors. The amplitudes are equal and the phases are opposite. The essence is the interference between the two traces.
  • the "A”, “B” and “C” terminals are the power input terminals of the inverter's power system
  • the "A'", “B'” and “C” terminals are The '" terminal is the power output terminal of the inverter's power system.
  • the inductor Lc is a common mode inductor, mainly used to suppress common mode interference
  • the inductor Ld is a differential mode inductor, mainly used for filtering and suppressing differential mode resonance.
  • the common mode inductor Lc and the differential mode inductor Ld in the inverter are independent of each other and installed separately as two independent inductance components.
  • FIG. 1 is a schematic diagram of the power supply system of an inverter provided by an embodiment of the present application.
  • FIG. 2 is a schematic structural diagram of an inverter 300 provided by an embodiment of the present application.
  • an inverter 300 provided in one embodiment of the present application integrates a common mode inductor Lc and a differential mode inductor Ld into an integrated inductor 10, thereby reducing the common mode inductor Lc and the differential mode inductor Ld.
  • the size of the mode inductor Lc and the differential mode inductor Ld is reduced, the board area is reduced and the cost is reduced.
  • the present application provides an inverter 300 .
  • the inverter 300 may include a circuit board assembly 100 and a housing 200 .
  • the housing 200 surrounds the outside of the circuit board assembly 100 and protects the circuit board assembly 100 .
  • the circuit board assembly 100 may include an integrated inductor 10, a circuit board 20, a control chip 30 and other electronic components.
  • the integrated inductor 10 and the control chip 30 are fixedly connected on the circuit board 20 .
  • FIGs 3, 4, 5 and 6 are schematic structural diagrams of an integrated inductor 10 provided in an embodiment of the present application.
  • the integrated inductor 10 may include a chassis 1, a common mode component 2, a winding 3, a differential mode core 5 and an insulator 4.
  • the common mode component 2, winding 3, and differential mode core 5 are functional devices in the integrated inductor 10, used to generate a common mode inductor to suppress common mode interference and to generate a differential mode inductor to suppress resonance and differential mode interference.
  • the chassis 1 is a structure used to assemble the above-mentioned functional devices of the integrated inductor 10. Next, the specific structure of the chassis 1 will be described with reference to Figures 7 and 8.
  • the chassis 1 may have a plate-like structure, and the chassis 1 may include a base plate 11 and a flange 12 .
  • the chassis 1 may have an integrated structure, as shown in FIG. 7 , that is, the base plate 11 and the flange 12 are connected as one body.
  • the base plate 11 is approximately in the shape of a disc
  • the flange 12 is approximately in the shape of a sector plate.
  • the flanges 12 are evenly distributed on the edge of the base plate 11 and are fixedly connected to the base plate 11 , for example, they can be integrated into one body.
  • the number of flanges 12 matches the number of windings 3, for example there can be three.
  • the flange 12 and the base plate 11 are provided with three sets of mounting holes 1a for fixing the winding 3 to the chassis 1 (as will be explained below). Among them, the number of mounting holes 1a also matches the number of windings 3.
  • the chassis 1 has an integrated structure. In other embodiments, the chassis 1 can have a split structure. As shown in Figure 8, the chassis 1 can include multiple mounting parts 13. The number of mounting parts 13 can be determined according to the winding. 3 depends on the quantity. Each mounting part 13 is provided with a set of mounting holes 1a for fixed installation of the winding 3 and the chassis 1. The plurality of mounting parts 13 are independent of each other or at least two mounting parts are connected through flexible connectors. The fixing method of each mounting part 13 to the winding 3 is the same as the connection method of the chassis 1 and the winding 3 of the integrated structure (hereinafter, will explain) are approximately the same.
  • the advantage of having the chassis 1 as a split structure is that when the integrated inductor 10 is fixedly connected to the circuit board 20, if the height of the mounting surface of the circuit board 20 is inconsistent, the split chassis 1 can adapt to the mounting surfaces with different height differences to a certain extent. , adjust the integrated inductor according to the height difference
  • the installation posture of 10 greatly enhances the adaptability of the integrated inductor 10 to the installation environment, and can expand the applicable scenarios of the integrated inductor 10 .
  • the chassis 1 can isolate the functional structure of the integrated inductor 10 (ie, the common mode component 2, the differential mode core 5 and the winding 3) from the upper mounting surface of the circuit board 20 to protect the integrated inductor 10.
  • the common mode component 2 may include a common mode core 22 , an upper shell 21 and a lower shell 23 .
  • the common mode magnetic core 22 may also be called the first magnetic core
  • the housing composed of the upper housing 21 and the lower housing 23 may be called the first insulating layer. It can be understood that the first insulation layer is provided outside the first magnetic core. There may be a gap between the first insulating layer and the outer surface of the first magnetic core, or they may be in contact with each other.
  • the common mode core 22 may have a circular ring structure.
  • the common mode magnetic core 22 has an opposite first surface 22a and a second surface 22b, and both the first surface 22a and the second surface 22b may be approximately planar. Wherein, the first surface 22a and the second surface 22b both belong to a part of the outer surface 22d of the common mode core 22 .
  • the common mode core 22 is provided with a first through hole 22c.
  • the first through hole 22c penetrates both the first surface 22a and the second surface 22b.
  • the extending direction of the first through hole 22c is the first direction. Refer to Figure 9, arrow P.
  • the extending direction is the first direction.
  • the outer surface 22d of the common mode core 22 can be understood as the surface of the common mode core 22 facing away from the hole wall of the first through hole 22c.
  • the first directions are both approximately perpendicular to the first surface 22a and the second surface 22b.
  • the common mode core 22 has a circular ring structure.
  • the common mode core 22 is not limited to the circular ring structure, and can also be other polygonal ring structures.
  • the common mode magnetic core 22 may be made of magnetic materials such as amorphous ribbon, nanocrystalline ribbon, ferrite, etc.
  • the upper housing 21 is approximately an annular groove structure with a through hole inside.
  • the lower housing 23 is approximately an annular cover structure with a through hole inside. Both the upper housing 21 and the lower housing 23 can be made of insulating materials.
  • the upper case 21 and the lower case 23 can surround and form a receiving space, and accommodate the common mode core 22 therein, so that the common mode core 22 is surrounded by a case of insulating material.
  • the through hole of the upper housing 21 communicates with the through hole of the lower housing 23 so that the first through hole 22c is exposed.
  • the chassis 1 is located on the side of the common mode component 2 with the lower housing 23 , and there is a gap between the chassis 1 and the common mode component 2 .
  • the outer surface 22d of the common mode core 22 is covered with an insulating material by being surrounded by the upper housing 21 and the lower housing 23.
  • the upper and lower insulating layers may not be provided. Instead, an insulating layer is sprayed on the surface of the common mode core 22 so that the outer surface 22d of the common mode core 22 is covered with the insulating material. Covering the outer surface 22d of the common mode core 22 with an insulating material can prevent the winding 3 from breaking down under the action of overvoltage and causing damage to the integrated inductor 10 when the winding 3 is wound on the common mode core 22.
  • the differential mode magnetic core 5 may also be called the second magnetic core. As shown in Figure 10, the differential mode core 5 may be a rectangular ring-mounted structure.
  • the differential mode magnetic core 5 includes a first part 51 and a second part 52.
  • the differential mode magnetic core 5 has a second through hole 5c, and the shape of the second through hole 5c can be arbitrarily designed according to requirements.
  • the first part 51 and the second part 52 are respectively located on both sides of the second through hole 5c.
  • the differential mode core 5 has an opposite third surface 5a and a fourth surface 5b.
  • the third surface 5a and the fourth surface 5b are both part of the outer surface 5d of the differential mode core 5.
  • the outer surface 5d of the differential mode core 5 is It can be understood as the surface of the differential mode magnetic core 5 facing away from the inner wall of the second through hole 5c.
  • the third surface 5a is the surface close to the paper surface
  • the fourth surface 5b is the surface of the second through hole 5c facing away from the third surface 5a.
  • the third surface 5a and/or the fourth surface 5b may be a flat surface or a curved surface, and the second through hole 5c penetrates both the third surface 5a and the fourth surface 5b.
  • the outer surface 5d of the differential mode core 5 is not provided with an insulating layer.
  • the differential mode core 5 can be provided with a second insulating layer, and the second insulating layer can be sprayed on the differential mode.
  • the insulating layer on the outer surface 5d of the magnetic core 5 may be an insulating shell surrounding the outer surface 5d of the differential mode magnetic core 5.
  • the second insulating layer is used to prevent breakdown between the differential mode core 5 and other components of the integrated inductor 10 and damage the integrated Internal components of inductor 10. It can be understood that the second insulating layer is located outside the second magnetic core (differential mode magnetic core), and there may be a gap or contact between the second insulating layer and the outer surface of the second magnetic core.
  • the differential mode magnetic core 5 is not limited to a rectangular ring-mounted structure, but may also be other polygonal ring-mounted structures.
  • the differential mode core 5 has a split structure, for example, it can be spliced into two parts, which makes the assembly of the differential mode core 5 simple and convenient, and can improve the installation efficiency during the assembly process of the integrated inductor 10 .
  • the differential mode core 5 may have an integrated structure. The integrated structure of the differential mode core 5 is simple to process and can improve production efficiency during the production process of the differential mode core 5 .
  • the differential mode magnetic core 5 can be made of amorphous ribbon, nanocrystalline ribbon, ferrite, silicon steel, iron-silicon magnetic powder core, iron-silicon-aluminum magnetic powder core, iron-nickel magnetic powder core, iron-nickel-molybdenum magnetic powder Core, iron powder core and other materials.
  • the integrated inductor 10 is a three-phase integrated inductor, and there can be three differential mode cores 5.
  • the differential mode cores 5 are located on the first surface of the common mode component 2.
  • three differential mode cores 5 are evenly distributed in three phases on the common mode component 2.
  • the differential mode core 5 and the common mode component 2 are stacked and arranged.
  • the first part 51 of the differential mode core 5 is located close to the first One side of the surface 22a;
  • the second part 52 is located on the side of the second through hole 5c away from the first surface 22a (that is, in the first direction, the first part 51, the second through hole 5c, and the second part 52 are distributed in sequence).
  • the third surface 5 a may face the outside of the common mode component 2
  • the fourth surface 5 b may face the first through hole 22 c of the common mode component 2 .
  • At least a part of the projection of the second through hole 5c in the first direction falls into the first surface 22a, for example, the entire projection of the second through hole 5c can fall into the first surface 22a.
  • both the third surface 5a and the fourth surface 5b are approximately perpendicular to the first surface 22a; as shown in Figures 3, 9 and 11, when the third surface 5a and the fourth surface 5b are flat,
  • the surface 5b is an arc surface
  • the generatrix of the third surface 5a and the fourth surface 5b is approximately perpendicular to the first surface 22a.
  • the generatrix of the third surface 5a can be any moving line forming an arc in the third surface 5a.
  • the vertical projection of the second through hole 5c on the first surface 22a does not exceed the range of the first surface 22a of the common mode core 22, that is, the arrangement of the differential mode core 5 does not affect the maximum radial size of the common mode core 22, It is beneficial to ensure the total size of the integrated inductor 10 in the direction perpendicular to the first direction and save board area.
  • the first surface 22a is a plane, which can effectively improve the stability of the connection between the differential mode core 5 and the common mode component 2, and help ensure the consistency of the assembly positions of the differential mode core 5 and the common mode component 2.
  • the three-phase integrated inductor has three differential mode cores 5.
  • the mode cores 5 are independent of each other and are separately assembled to the common mode component 2, thus forming a space between adjacent differential mode cores 5.
  • This solution facilitates assembly and has higher efficiency during the assembly process. Flexibility improves assembly efficiency.
  • each differential mode core 5 can use a simpler single-phase core, and there is no need to make three single-phase cores into an integrated structure, which can improve production efficiency and reduce costs.
  • the size of the air gap is ⁇ 5 ⁇ m.
  • This air gap refers to the isolation between the differential mode core 5 and the common mode core 22. It is not limited to isolation through an insulating medium, and can also be air isolation. It can be understood that the air gap can include a physical insulating dielectric structure, or It can be a gap (or pore)-like spacing.
  • an air gap is formed by the first insulating layer between the differential mode core 5 and the common mode core 22 (for example, the first insulating layer can be a shell used to wrap the common mode core 22),
  • a second insulating layer can be provided on the differential mode core 5 (for example, the second insulating layer can be a shell used to wrap the outer surface 5d of the differential mode core 5) to form an air gap
  • the size requirements of the air gap can be met by means of being elevated or provided with fillers.
  • the above embodiments can be combined arbitrarily to form the air gap.
  • the above mainly describes the differential mode core 5 and the common mode component 2 in the integrated inductor 10 .
  • the structure of the winding 3 and the assembly and cooperation of the winding 3 with the differential mode core 5 and the common mode component 2 will be described.
  • the winding 3 is surrounded by wires covered with an insulating layer, such as enameled wires or film-coated wires.
  • the winding 3 includes a coil body 31 and a wiring pin 32, which are connected.
  • the coil body 31 has a through hole surrounded by the coil.
  • Each winding 3 has the same number of turns, and the winding direction of each winding 3 is also the same.
  • the number of windings 3 is set corresponding to the number of differential mode cores 5 , so that the windings 3 and the differential mode cores 5 correspond one to one. There are at least two windings 3, for example there may be three.
  • there may be two wiring pins 32 which are located on both sides of the coil body 31 and are approximately tangent to the coil body 31 .
  • the wiring pins 32 may be located on the same side of the coil body 31 .
  • the different distribution modes of the wiring pins 32 on the coil body 31 will also affect the difference in the installation area occupied by the integrated inductor 10 on the circuit board 20. Therefore, the location of the wiring pins 32 can be designed as needed.
  • each winding 3 cooperates with the first through hole 22c of the common mode component 2 and the second through hole 5c of the differential mode core 5: each winding 3
  • the coil body 31 passes through the first through hole 22c and the second through hole 5c of one differential mode core 5 at the same time, so that each winding 3 is wound around the common mode core 22 and one differential mode core 5.
  • the through hole of each coil body 31 receives a portion of the common mode component 2 and a first portion of the differential mode core 5, so that the first portion 51 is located between the coil body 31 and the first surface 22a, and the second portion 52 is located between the coil body 31 and the first surface 22a.
  • the side of the main body 31 away from the first surface 22a.
  • connection pins 32 of the winding 3 are all located on the side of the second surface 22b away from the first surface 22a in the first direction.
  • the three windings 3 can be evenly distributed on the common mode component 2, and the spacing between every two windings 3 is approximately equal.
  • the winding 3 is fixedly connected to the chassis 1.
  • Each winding 3 cooperates with a set of mounting holes 1a.
  • one wiring pin 32 of the winding 3 extends into the first through hole 22c and passes through the mounting hole 1a on the base plate, and the other wiring pin 32 is located outside the common mode component 2 and passes through through the mounting hole 1a on the flange 12.
  • the common mode core 22 is located on the other side of the chassis 1 where the wiring pins 32 are exposed, and the second surface 22b faces the chassis 1 in the first direction.
  • the wiring pins 32 are arranged on the side of the second surface 22b away from the first surface 22a in the first direction.
  • the wiring pins 32 are used to connect the integrated inductor 10 to the circuit board 20, the positions of the wiring pins 32 are defined. , the wiring pins 32 , the common mode core 22 , and the differential mode core 5 can be arranged in sequence in the first direction, which is beneficial to realizing the integrated inductor 10 and saving the board space of the circuit board 20 .
  • the wiring pins 32 are all located on the same side of the common mode core 22. During the process of assembling the integrated inductor 10 to the circuit board 20, the wiring pins 32 are assembled on the side of the chassis 1 away from the common mode component 2. It is necessary to connect the wiring pins 32 in the space outside the installation area of the circuit board 20 occupied by the integrated inductor 10.
  • the chassis 1 is used to isolate the assembly area and the common mode component 2. For example, when assembled by welding, due to the isolation of the chassis 1, the welding temperature will not affect the common mode component 2 and the winding 3.
  • the common mode core 22 since the common mode core 22 is a closed annular core, the common mode core 22 forms a closed common mode magnetic circuit A.
  • a common mode inductance is formed between the common mode core 22 and each winding 3 to suppress common mode interference.
  • the differential mode magnetic cores 5 all form a closed differential mode magnetic circuit B, and each differential mode magnetic core 5 forms a differential mode inductance with the winding 3 surrounding it to suppress differential mode current.
  • the air gap can ensure that the differential mode magnetic circuit B and the common mode magnetic circuit A are independent of each other and do not interfere or influence each other.
  • the common mode core 22 can be made of magnetic material with a magnetic permeability of 2000-100000, and the differential mode core 5 can be made of magnetic material with a magnetic permeability of 26-5000.
  • the common mode core 22 can be made of a nanocrystalline tape with a magnetic permeability of 20,000
  • the differential mode core 5 can be made of an amorphous tape with a magnetic permeability of 1,000, so that the common mode
  • the sensitivity is 202 microhenries
  • the differential mode sensitivity is 12 microhenries.
  • the common mode core 22 is made of ferrite with a magnetic permeability of 7000
  • the differential mode core 5 is made of an iron-silicon magnetic powder core with a magnetic permeability of 125, so that the common mode inductance is 180 microhenries, differential mode sensitivity is 14 microhenries.
  • the common mode inductance formed between the winding 3 and the common mode core 22 can be adjusted.
  • the common mode core 22 and each differential mode core 5 have a closed ring structure. This is because when the common mode core 22 or the differential mode core 5 has a closed ring structure, When the magnetic core is used, the winding utilization rate of the winding 3 wound on the common mode magnetic core 22 or the differential mode magnetic core 5 can be effectively improved. Therefore, the closed ring structure of the common mode core 22 and the differential mode core 5 is just an example. In fact, the core structures of the common mode core 22 and the differential mode core 5 can be designed as other solutions as needed, such as The common mode core 22 or each differential mode core 5 is configured as an unclosed annular structure.
  • the insulating member 4 is used to isolate and protect adjacent windings 3 .
  • the insulating member 4 may include at least two insulating plates 41 , and the number of the insulating plates 41 corresponds to the number of the windings 3 , for example, there may be three.
  • the insulating plate 41 may be a rectangular plate-shaped structure, made of insulating material, and used to be disposed between adjacent windings 3 to isolate and protect the windings 3 .
  • the insulating component 4 may be an integrated insulating component 4 .
  • the integrated insulating member 4 may include an insulating plate 41 and a middle column 42.
  • the three insulating plates 41 surround the outer side of the middle column 42 and are fixedly connected to the middle column 42 along the axis direction of the middle column 42. , and an included angle that is not 0 is formed between two adjacent insulating plates 41 .
  • the three insulating plates 41 of the insulating member 4 are evenly distributed on the middle column 42 so that the included angle between every two adjacent insulating plates 41 is approximately 120°.
  • the integrated insulator 4 is easy to install and can be installed in batches with integrated inductors 10 to improve installation efficiency.
  • the insulating member 4 may have a split structure, and the insulating member 4 only includes three insulating plates 41 , and the three insulating plates 41 may not be connected to each other or may be connected to each other using flexible parts.
  • the split-type insulator 4 can flexibly adjust the installation position of the insulation board 41 according to different scenarios. Therefore, the split-type insulator 4 has strong adaptability to the environment and can cope with changing installation scenarios.
  • the insulating member 4 is provided between the three windings 3 and is fixedly connected to the chassis 1.
  • it can be fixedly connected by glue, or it can also be fixedly connected through the cooperation of buckles and slots.
  • a buckle is provided at the bottom of the insulating member 4, a slot is provided on the chassis 1, and the buckle is inserted into the slot to achieve a fixed connection between the insulating member 4 and the chassis 1.
  • the insulating member 4 and the chassis 1 are integrally formed, which is beneficial to improving the stability of the overall structure of the integrated inductor 10 .
  • Each insulating plate 41 of the insulating member 4 is located between two adjacent windings 3 to separate the two adjacent windings 3 and prevent breakdown between the adjacent windings 3 in the event of current overload.
  • the insulating plate 41 may have gaps with the windings 3 on both sides. In another embodiment, the insulating plate 41 may be resisted by the windings 3 on both sides.
  • the upper part of Figure 14 shows the scene when there is no insulating plate 41 between the windings 3, and the distance between the windings 3 is D1; the lower part of Figure 14 shows that the insulating plate is provided between the windings 3
  • the winding 3 on both sides of the insulating plate 41 is in contact with the insulating plate 41, and the part where the winding 3 and the insulating plate 41 are in contact can be called the contact portion 31a.
  • the distance between the windings 3 is D2.
  • the width of D2 is greater than the width of D1. That is, elastic deformation will occur when the contact portion 31a contacts the insulating plate 41. Therefore, the layout between the windings 3 and the insulating plate 41 can be improved. It is more compact, thereby saving the area of the circuit board 20 occupied by the integrated inductor 10 in the first direction.
  • the circuit board 20 is provided with an inductor mounting area 201 , and the inductor mounting area 201 is provided with a soldering pad 202 .
  • the inductor mounting area 201 is used to position and install the integrated inductor 10.
  • the outline of the inductor mounting area 201 is basically consistent with the projection of the outer outline of the integrated inductor 10 in the first direction. Therefore, the area of the inductor mounting area 201 is the area of the integrated inductor 10 on the circuit board. 20 square meters of floor space.
  • the soldering pad 202 is used to correspond to the connecting pin 32 of the winding 3 so that the connecting pin 32 is welded to the soldering pad 202 .
  • the position distribution of the bonding pads 202 in the inductor mounting area 201 depends on the position distribution of the wiring pins 32.
  • the distribution position of the bonding pads 202 can be designed as needed, and no excessive settings are required here.
  • the differential mode core 5 and the common mode core 22 are stacked in the first direction, and the projection of the differential mode core 5 in the first direction and the projection of the common mode core 22 in the first direction are There is most overlap. Since the first direction is perpendicular to the circuit board 20, the utilization rate of the integrated inductor 10 of the present application on the circuit board 20 (that is, the area of the inductor mounting area 201) is greatly improved. Compared with other differential mode Compared with the embodiment in which the magnetic core and the common-mode magnetic core are installed independently, the integrated inductor 10 of the present application can reduce the area occupied by the circuit board 20 and has a high power density.
  • the differential mode core 5 and the common mode core 22 share the three-phase winding 3.
  • reducing the usage of the winding 3 can effectively reduce the copper loss, thereby reducing the copper loss.
  • the system efficiency of the inverter 300 is affected, thereby effectively improving the efficiency of the integrated inductor 10 .
  • the differential mode magnetic circuit B and the common mode magnetic circuit A of this application are independent of each other.
  • the magnetic flux of the differential mode core 5 will not occupy the magnetic flux of the common mode core 22, so that the integrated inductor 10 can withstand a larger current and has excellent anti-magnetic saturation capability.
  • the integrated inductor 10 of the present application has a stacked layout, and the projections of the differential mode core 5 and the common mode core 22 in the first direction overlap in a large area. Therefore, when the integrated inductor 10 is installed with the circuit board 20, the inductance can be greatly reduced.
  • the area of the installation area 201 can provide installation space for other components on the circuit board 20 , thereby reducing the size of the circuit board assembly 100 .

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Abstract

本申请提供了一种集成电感、电路板组件和逆变器，集成电感包括第一磁芯、至少两个第二磁芯和至少两个绕组，第一磁芯包括在第一方向上相对的第一表面和第二表面，第一磁芯设有贯穿第一表面和第二表面的第一通孔。第二磁芯在第一方向上设置在第一表面远离第二表面的一侧，第二磁芯设有一个第二通孔。绕组缠绕第一磁芯和第二磁芯，绕组和第一磁芯构成共模电感，绕组和第二磁芯构成差模电感。第二磁芯包括第一部分和第二部分，沿第一方向且在第一表面背离第二表面的一侧，第一部分位于绕组和第一表面之间，第二部分位于绕组远离第一表面的一侧。第一磁芯与第二磁芯共用一组绕组，在保证集成电感工作效率的情况下，能够节省集成电感安装时的占板面积。

Description

集成电感、电路板组件和逆变器
本申请要求于2022年7月13日提交中国专利局、申请号为202210821256.3，发明名称为“集成电感、电路板组件和逆变器”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电感领域，尤其涉及一种集成电感、电路板组件和逆变器。
背景技术
随着现代工业技术的发展，电力系统中如逆变器等各种非线性和时变性电力电子装置大量运用，在提升工业生产效率的同时也会具有许多负面效应。逆变器中的干扰电磁场会在导线间产生差模电流，或者在导线与大地之间产生共模电流，二者都会对于负载上产生干扰，影响负载的正常工作。对于产生的差模干扰和共模干扰，通常会通过差模电感抑制差模干扰，通过共模电感抑制共模干扰。
如何设计一种集成共模电感和差模电感的架构，即能保证抑制共模干扰和差模干扰，又具有小型化的优势为业界研究的方向。
发明内容
本申请提供一种集成电感、电路板组件和逆变器，集成电感具有小型化的优势，且能保证抑制共模干扰和差模干扰。
第一方面，本申请提供了一种集成电感，包括第一磁芯、至少两个第二磁芯和至少两个绕组，第一磁芯包括在第一方向上相对设置的第一表面和第二表面，第一磁芯设有贯穿第一表面和第二表面的第一通孔。第二磁芯在第一方向上设置在第一表面远离第二表面的一侧，每个第二磁芯设有一个第二通孔。至少两个绕组和第二磁芯一一对应设置，每个绕组均穿过第一通孔和一个对应的第二通孔，以使至少每个绕组均缠绕第一磁芯和一个第二磁芯，至少两个绕组和第一磁芯构成共模电感，至少两个绕组和至少两个第二磁芯构成差模电感。每个第二磁芯包括第一部分和第二部分，沿第一方向且在第一表面背离第二表面的一侧，第一部分位于绕组和第一表面之间，第二部分位于绕组远离第一表面的一侧。
具体而言，第二磁芯的第一部分和第二部分可以为一体成型式的结构(例如铁氧体材料一体成型制作而成)，第一部分和第二部分也可以为分体式结构并经过粘贴组装固定为一体。
本方案通过第一磁芯与第二磁芯共用一组绕组，第一磁芯与绕组构成共模电感，第二磁芯与绕组构成差模电感，能够在保证集成电感工作效率的情况下，将共模电感和差模电感集成为一个整体，有利于节约空间且降低成本。本申请实施例提供的集成电感通过共模电感和差模电感共用绕组，能够实现降低铜损，从而降低铜损对于逆变器系统效率的影响，从而有效的提升集成电感的效率。当集成电感组装至电路板时，第一方向可以为垂直于电路板上用于安装集成电感的表面，本申请通过第一磁芯与第二磁芯在第一方向上层叠设置，能够节省集成电感所占用的电路板的面积。
在第一方面的一种实现方式中，每个绕组均包括两个接线引脚，至少两个绕组的所有的接线引脚在第一方向上排列在第二表面背离第一表面的一侧。本方案通过限定接线引脚在第 一方向上排列在第二表面背离第一表面的一侧，由于接线引脚用于将集成电感连接至电路板上，本方案通过限定接线引脚的位置，具体可以理解为：接线引脚、共模磁芯、差模磁芯在第一方向上依次排列，本方案有利于实现集成电路节约电路板的占板空间。接线引脚全部位于第一磁芯的同一侧，在将集成电感组装至电路板的过程中，能够便于批量固定安装接线引脚，提升组装过程中的加工效率。
在第一方面的一种实现方式中，所有的第二通孔在第一表面上的垂直投影位于第一表面内。当第二通孔在第一方向上的投影全部落入第一表面内时，即第二磁芯与第一磁芯在第一方向上的投影有大部分的重叠，能够节省集成电感在第一方向上的投影面积大小。本方案通过限定第二通孔和第一表面的位置关系，使得第二通孔在第一表面上的垂直投影不超出第一磁芯的第一表面的范围，本方案提供的集成电感中的第二磁芯的设置不影响第一磁芯的径向最大尺寸，有利于保证集成电感在垂直于第一方向上的总尺寸，有利于节约占板面积。
在第一方面的一种实现方式中，每个第二磁芯包括第三表面和第四表面，第二通孔连通第三表面和第四表面，第一表面呈平面状，第三表面或第四表面为平面状或弧面状，第三表面垂直于第一表面。由于第一表面可以理解为设置所有的第二磁芯的基准面，通过限定第一磁芯的第一表面为平面状，有利于提升第二磁芯和第一磁芯的连接稳固性，有利于保证所有的第二磁芯的组装位置的一致性。本方案概括了一种具体的第二磁芯的结构形态，通过第三表面与第一表面垂直设置，使得第二磁芯与第一磁芯在第一方向上的投影有大部分的重叠，能够节省集成电感在第一方向上的投影面积大小。当第三表面和第四表面为弧面状时，第一表面和第三表面之间的垂直关系可以理解为：第三表面的轴母线与第一表面垂直，第三表面的母线可以为弧形的第三表面中任一条形成弧面的动线。
在第一方面的一种实现方式中，第一磁芯与第二磁芯之间设有气隙。本方案通过第一磁芯与第二磁芯之间的气隙隔离第一磁芯和第二磁芯构成的磁路，使得共模磁路与差模磁路相互独立，互不影响，能够提升集成电感的整体抗饱和能力。
在第一方面的一种实现方式中，气隙的取值范围大于或等于5μm。气隙在该取值范围内时，既能使得集成电感布局紧凑、减少占用的安装空间，又能使得集成电感的整体抗饱和能力最大化。
在第一方面的一种实现方式中，第一磁芯的外表面具有第一绝缘层，第一绝缘层构成至少部分气隙。本方案通过设置第一磁芯的外表面的第一绝缘层构成至少部分气隙，第一绝缘层一方面可以保护第一磁芯，另一方面作为第一磁芯和第二磁芯之间的磁路隔离结构，具有双功能性，本方案有利于在保证共模磁路与差模磁路相互独立的情况下，实现集成电感的尺寸小型化。
在第一方面的一种实现方式中，第二磁芯的外表面具有第二绝缘层，第二绝缘层构成至少部分气隙。本方案通过设置第二磁芯的外表面的第二绝缘层构成至少部分气隙，第二绝缘层一方面可以保护第一磁芯，另一方面作为第一磁芯和第二磁芯之间的磁路隔离结构，具有双功能性，本方案有利于在保证共模磁路与差模磁路相互独立的情况下，实现集成电感的尺寸小型化。
在第一方面的一种实现方式中，绕组和第二磁芯的数量均为三个，本方案限定一种三相集成电感。
在第一方面的一种实现方式中，绕组和第二磁芯的数量均为两个，本方案限定一种两相集成电感。
在第一方面的一种实现方式中，集成电感还包括底盘，底盘位于第二表面背离第一表面的一侧；绕组的接线引脚均与底盘固定连接。底盘为绝缘材质，底盘用于固定所有的接线引脚，一方面便于管理集成电感的接线引脚，另一方面也便于接线引脚的后续固定安装(安装至电路板上)，同时底盘能够将集成电感的功能性结构(即第一磁芯、第二磁芯和绕组)与电路板上安装面隔离开，保护集成电感。
在第一方面的一种实现方式中，接线引脚穿过底盘，部分接线引脚位于底盘背离第一磁芯的一侧。本方案通过限定接线引脚穿过底盘并底盘远离第一磁芯的一侧露出，在将集成电路组装至电路板时，组装的位置在底盘远离第一磁芯的一侧，一方面，不需要在集成电感占用电路板的安装区之外的空间连接接线引脚，将接线引脚隐藏在底盘和电路板之间，可以节约占板空间，也会在接线引脚的组装过程中，借用底盘隔离组装区域和第一磁芯，例如当通过焊接的方式组装时，由于底盘的隔离，焊接温度不会对第一磁芯和绕组造成影响。
在第一方面的一种实现方式中，底盘包括至少两个安装部，每个安装部均与一个绕组的接线引脚固定，至少两个安装部之间互相独立，或者至少两个安装部之间通过柔性连接件连接。集成电感固定连接时，若安装面高度不一致，分体式的底盘(或柔性连接件连接的至少两个安装部构成的底盘)更容易适应高度差不同的安装面，根据高度差调整集成电感的安装姿态，使得集成电感对安装环境的适应性大大增强，能够拓展集成电感的适用情景。
在第一方面的一种实现方式中，集成电感还包括绝缘件，绝缘件设置在相邻的绕组之间，部分绝缘件位于第一通孔内。本方案通过绝缘件设于相邻的绕组之间，能够有效的隔绝相邻绕组之间的电效应，防止击穿损坏集成电感。
在第一方面的一种实现方式中，每个绕组均包括抵接部，各抵接部和绝缘件接触，抵接部通过接触绝缘件产生弹性形变。本方案通过限定绕组的抵接部和绝缘件接触并产生弹性形变，限定绕组之间的位置设置，各绕组之间的间隔距离较小，小于绝缘件的厚度，这样当将绝缘件安装在绕组之间时，会迫使抵接部产生弹性形变，本方案有利于实现集成电路的尺寸小型化设计，每个绕组都与绝缘件抵接，使得集成电感内部的布局紧凑，能够有效地减小集成电感占用的安装面积。
在第一方面的一种实现方式中，绝缘件包括中间柱和连接在中间柱外侧面的三个绝缘板，绕组的数量为三个，三个绝缘板分别位于相邻的两个绕组之间。本方案限定了一种具体的绝缘板的架构，绝缘件为一体式的结构，其结构简单，便于批量生产，并且一体式的绝缘件安装步骤简洁，能够有效地提升安装效率。
一种实现方式中，绝缘件和底盘固定连接，二者之间可以通过粘胶的方式固定连接，也可以通过卡扣和卡槽的配合实现固定连接，例如在绝缘件的底部设置卡扣，在底盘上设卡槽，将卡扣插入卡槽，可以实现绝缘件和底盘之间的固定连接。
一种实现方式中，绝缘件和底盘为一体成型的结构，本方案有利于提升集成电感整体结构的稳定性。
一种实现方式中，所述共模电感的所述第一磁芯的磁导率为20000，所述差模电感的所述第二磁芯的磁导率为1000。本方案通过限定第一磁芯和第二磁芯的磁导率，限定一种具体的集成电感的架构。
一种实现方式中，所述共模电感的所述第一磁芯的磁导率为7000，所述差模电感的所述第二磁芯的磁导率为125。本方案通过限定第一磁芯和第二磁芯的磁导率，限定一种具体的集成电感的架构。
第二方面，本申请提供了一种电路板组件，包括电路板和第一方面提供的集成电感，集成电感与电路板连接。集成电感与电路板安装，由于本申请提供的集成电感结构紧凑，因此集成电感与电路板安装时，在第一方向上占用的占板面积较小，便于为电路板上的其他元件节省出安装空间，使得电路板的元件布局更加合理。
第三方面，本申请提供了一种电路板组件，包括电路板和第一方面提供的集成电感，电路板包括电感安装区，电感安装区内设有焊盘，集成电感的外轮廓和电感安装区一致，集成电感的接线引脚与焊盘焊接。接线引脚与焊盘固定连接以使集成电感与电路板固定连接，又由于集成电感在第一方向上的投影面积较小，因此会使得电感安装区的面积较小，便于为电路板上的其他元件节省出安装空间，使得电路板组件内部布局更加合理。
第四方面，本申请提供了一种逆变器，包括壳体和第三方面或第四方面所述的电路板组件，壳体包围电路板组件。电路板组件内部布局合理、结构紧凑，在保证逆变器工作效率的情况下，能够有效的减少逆变器的整体空间。
附图说明
图1是本申请实施例的逆变器的电源系统示意图；
图2是本申请实施例的逆变器的组装结构示意图；
图3是本申请实施例的集成电感的组装结构示意图；
图4是本申请实施例的集成电感的组装结构俯视图；
图5是本申请实施例的集成电感的分解结构示意图；
图6是本申请实施例的集成电感的组装结构示意图；
图7是本申请实施例的集成电感的底盘的一种结构示意图；
图8是本申请实施例的集成电感的底盘的另一种结构示意图；
图9是本申请实施例的集成电感的共模组件的结构示意图；
图10是本申请实施例的集成电感的差模磁芯的一种结构示意图；
图11是本申请实施例的集成电感的差模磁芯的另一种结构示意图；
图12是本申请实施例的集成电感的绕组的结构示意图；
图13是本申请实施例的集成电感的绝缘件的结构示意图；
图14是本申请实施例的绕组和绝缘件的配合结构示意图；
图15是本申请实施例的电路板的结构示意图。
具体实施方式
部分术语的解释
平行：本申请所定义的平行不限定为绝对平行，此平行的定义可以理解为基本平行，允许在组装公差、设计公差、结构平面度的影响等因素所带来的不是绝对平行的情况，这些情况会导到滑动配合部和第一门板之间不是绝对的平行，但是本申请也定义为这种情况是平行的。
垂直：本申请所定义的垂直不限定为绝对的垂直相交(夹角为90度)的关系，允许在组装公差、设计公差、结构平面度的影响等因素所带来的不是绝对的垂直相交的关系，允许存在小角度范围的误差，例如80度至100度的范围的组装误差范围内，都可以被理解为是垂直的关系。
术语“第一”、“第二”等仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”等的特征可以明示或者隐含地包括一个或者更多个该特征。
以下通过实施例对本申请方案进行示例说明。
逆变器广泛应用于光伏、变频器等供电或者电力控制场景，该场景中会存在差模干扰和共模干扰对电路系统有不良影响，通常会使用滤波电路对其进行滤波。其中，共模信号是指幅度相等，相位相同的信号。差模信号是指幅度相等，相位相反的信号。在一个闭合电路中，共模干扰信号在两导线上幅度相等、方向相同，其本质是闭合回路中两条走线和地线之间的电压差所引起的干扰；差模干扰信号在两导线之间幅度相等，相位相反，其本质是两条走线之间的干扰。如图1所示，三相线路中，“A”端、“B”端和“C”端为逆变器的电源系统功率输入端，“A'”端、“B'”端和“C'”端为逆变器的电源系统功率输出端。其中电感Lc为共模电感，主要用来抑制共模干扰，电感Ld为差模电感，主要用来滤波以及抑制差模谐振。
一种实施方式中，逆变器中共模电感Lc和差模电感Ld彼此独立，作为两个独立的电感元件分开安装。
图1是本申请一种实施方式提供的逆变器的电源系统示意图，图2是本申请一种实施方式提供的逆变器300的结构示意图。基于提高功率密度以及降低成本的需求，参阅图1和图2，本申请一种实施方式提供的逆变器300将共模电感Lc和差模电感Ld集成为一个集成电感10，从而减小共模电感Lc和差模电感Ld的体积、减小占板面积并降低成本。
如图2所示，本申请提供了一种逆变器300，逆变器300可以包括电路板组件100和壳体200。壳体200包围在电路板组件100的外侧，保护电路板组件100。电路板组件100可以包括集成电感10、电路板20和控制芯片30等其他电子元器件。集成电感10和控制芯片30在电路板20上固定连接。
图3、图4、图5和图6为本申请一种实施方式提供的集成电感10的结构示意图。集成电感10可以包括底盘1、共模组件2、绕组3、差模磁芯5和绝缘件4。共模组件2、绕组3、差模磁芯5为集成电感10中的功能器件，用于产生抑制共模干扰的共模电感和产生用于抑制谐振及差模干扰的差模电感。底盘1为用于组装集成电感10的上述功能器件的结构，接下来参阅图7和图8对底盘1的具体架构展开描述。
如图7所示，底盘1可以为板状结构，底盘1可以包括基座盘11和凸缘12。在一种实施方式中，底盘1可以为一体式结构，如图7所示，即基座盘11与凸缘12连为一体。基座盘11近似为圆板状，凸缘12近似为扇形板状结构。凸缘12均匀的分布在基座盘11的边缘，并与基座盘11固定连接，例如可以连为一体。凸缘12个数与绕组3的数量相匹配，例如可以有三个。凸缘12与基座盘11上设有三组安装孔1a，用于使绕组3与底盘1固定(下文将会继续说明)。其中，安装孔1a的数量也与绕组3的数量相匹配。
上述实施方式中，底盘1为一体式结构，在其他实施方式中，底盘1可以为分体式结构，如图8所示，底盘1可以包括多个安装部13，安装部13的数量可以根据绕组3的数量而定。每个安装部13上都设有一组安装孔1a，用于使绕组3与底盘1固定安装。多个安装部13之间相互独立或者至少两个安装部之间通过柔性连接件连接，每个安装部13与绕组3的固定方式与一体式结构的底盘1与绕组3的连接方式(下文将会说明)近似相同。将底盘1设为分体式结构的好处在于，当集成电感10与电路板20固定连接时，若电路板20的安装面高度不一致，分体式的底盘1可以一定程度上适应高度差不同的安装面，根据高度差调整集成电感 10的安装姿态，使得集成电感10对安装环境的适应性大大增强，能够拓展集成电感10的适用情景。并且底盘1能够将集成电感10的功能性结构(即共模组件2、差模磁芯5和绕组3)与电路板20上安装面隔离开，保护集成电感10。
接下来描述共模组件2的结构组成以及共模组件2与底盘1的位置关系。
如图9所示，共模组件2可以包括共模磁芯22、上壳体21和下壳体23。其中，共模磁芯22也可以称为第一磁芯，上壳体21与下壳体23组成的壳体可以称为第一绝缘层。可以理解为：第一绝缘层设置在第一磁芯的外侧。第一绝缘层和第一磁芯的外表面之间可以具有间隙，也可以相互接触。
如图9所示，共模磁芯22可以为圆环状结构。共模磁芯22具有相对的第一表面22a和第二表面22b，第一表面22a和第二表面22b都可以近似为平面。其中，第一表面22a和第二表面22b都属于共模磁芯22的外表面22d的一部分。共模磁芯22设有第一通孔22c，第一通孔22c同时贯穿第一表面22a和第二表面22b，第一通孔22c的延伸方向为第一方向，参阅图9，箭头P的延伸方向为第一方向。共模磁芯22的外表面22d可以理解为共模磁芯22的背离第一通孔22c的孔壁的表面。第一方向都近似垂直于第一表面22a和第二表面22b。在本申请实施例中，共模磁芯22为圆环状结构，在其他实施例中，共模磁芯22不仅限于圆环状结构，也可以为其他的多边形环装结构。在本申请实施例中，共模磁芯22可以由非晶带材、纳米晶带材、铁氧体等磁性材料制成。
如图9所示，上壳体21近似为环槽结构，其内部具有通孔。下壳体23近似为环状盖板结构，其内部具有通孔。上壳体21与下壳体23都可以为绝缘材料制成。
如图9所示，上壳体21和下壳体23能够包围形成收容空间，将共模磁芯22收容在内，以使共模磁芯22被绝缘材料的壳体包围。上壳体21的通孔与下壳体23的通孔连通，以使得第一通孔22c露出。
底盘1位于共模组件2具有下壳体23的一侧，底盘1与共模组件2之间具有间隔。
在本申请实施例中，通过上壳体21和下壳体23包围的方式使得共模磁芯22的外表面22d被绝缘材料覆盖，在其他实施例中，也可以不设置绝缘的上、下壳体，而是对共模磁芯22的表面喷涂绝缘层，以使共模磁芯22外表面22d被绝缘材料覆盖。共模磁芯22的外表面22d覆盖绝缘材料能够防止绕组3绕制在共模磁芯22上时，在过电压的作用下二者发生击穿导致集成电感10损坏。
接下来描述差模磁芯5的结构以及差模磁芯5与共模组件2的位置关系。
差模磁芯5也可以称为第二磁芯。如图10所示，差模磁芯5可以是矩形环装结构。差模磁芯5包括第一部分51和第二部分52，差模磁芯5具有第二通孔5c，第二通孔5c的形状可以根据需求任意设计。第一部分51和第二部分52分别位于第二通孔5c的两侧。差模磁芯5具有相对的第三表面5a和第四表面5b，第三表面5a和第四表面5b都属于差模磁芯5的外表面5d的一部分，差模磁芯5的外表面5d可以理解为差模磁芯5的背离第二通孔5c的内壁的表面。在图10所示方向中，第三表面5a为贴近纸面的表面，第四表面5b为第二通孔5c背离第三表面5a一侧的表面。如图10和图11所示，第三表面5a和/或第四表面5b可以为平面或弧面，第二通孔5c同时贯穿第三表面5a和第四表面5b。在本申请实施例中，差模磁芯5的外表面5d不设有绝缘层，在其他实施例中，差模磁芯5可以设置第二绝缘层，第二绝缘层可以为喷涂在差模磁芯5的外表面5d的绝缘层或者为包围差模磁芯5的外表面5d的绝缘外壳。第二绝缘层用于防止差模磁芯5与集成电感10的其他元件之间发生击穿，损伤集成 电感10的内部元件。可以理解为，第二绝缘层位于第二磁芯(差模磁芯)的外侧，第二绝缘层和第二磁芯的外表面之间可以具有间隙，也可以接触。
本申请实施例中，差模磁芯5不仅限于矩形环装结构，也可以是其他多边形环装结构。在一种实施方式中，差模磁芯5为分体式结构，例如可以由两部分拼接而成，使得差模磁芯5的组装方式简单便捷，能够在集成电感10组装过程中提升安装效率。在另一种实施方式中，差模磁芯5可以为一体式结构，一体式结构的差模磁芯5加工方式简单，能够在差模磁芯5的生产过程中提升生产效率。在本申请实施例中，差模磁芯5可以由非晶带材、纳米晶带材、铁氧体、硅钢、铁硅磁粉芯、铁硅铝磁粉芯、铁镍磁粉芯、铁镍钼磁粉芯、铁粉芯等材料制成。
如图3和图9所示，一种实施方式中，集成电感10是三相集成电感，差模磁芯5的数量可以有三个，差模磁芯5位于共模组件2具有第一表面22a的一侧，三个差模磁芯5在共模组件2上呈三相均匀分布。
在一种实施方式中，沿第一方向，差模磁芯5与共模组件2层叠布置，如图3、图9和图10所示，差模磁芯5的第一部分51位于靠近第一表面22a的一侧；第二部分52位于第二通孔5c远离第一表面22a的一侧(即在第一方向上，第一部分51、第二通孔5c、第二部分52依次分布)。第三表面5a可以朝向共模组件2的外侧，第四表面5b可以朝向共模组件2的第一通孔22c。第二通孔5c在第一方向上的投影至少有一部分落入第一表面22a内，例如可以全部落入第一表面22a内。第三表面5a与第四表面5b为平面时，第三表面5a和第四表面5b都与第一表面22a近似垂直；如图3、图9和图11示，当第三表面5a和第四表面5b为弧面时，第三表面5a和第四表面5b的母线与第一表面22a近似垂直，第三表面5a的母线可以为第三表面5a中任一条形成弧面的动线。
第二通孔5c在第一表面22a上的垂直投影不超出共模磁芯22的第一表面22a的范围，即差模磁芯5的设置不影响共模磁芯22的径向最大尺寸，有利于保证集成电感10在垂直于第一方向上的总尺寸，能够节约占板面积。并且第一表面22a为平面，能够有效的提升差模磁芯5与共模组件2连接的稳固性，有利于保证差模磁芯5与共模组件2组装位置的一致性。
一种实施方式中，本申请实施例中的差模磁芯5之间具有间隔空间，例如，对于三相集成电感而言，三相集成电感具有三个差模磁芯5，这三个差模磁芯5相互独立，单独组装至共模组件2上，这样在相邻的差模磁芯5之间就形成了间隔空间，这种方案方便组装，在组装的过程中具有更高的灵活性，提升组装的效率。而且，每一个差模磁芯5可以选用较简单的单相磁芯，不需要将三个单相磁芯制作为一体的结构，可以提高生产效率，降低成本。
差模磁芯5与共模磁芯22之间具有气隙，在第一方向上，气隙的尺寸≥5μm。此气隙指的是差模磁芯5与共模磁芯22之间的隔离，不限于通过绝缘介质进行隔离，也可以为空气隔离，可以理解为，气隙可以包括实体的绝缘介质结构，也可以为类似缝隙(或孔隙)的间隔。在本申请实施例中，通过差模磁芯5和共模磁芯22之间的第一绝缘层(例如：第一绝缘层可以为用于包裹共模磁芯22的外壳)构成气隙，在另一种实施方式中，可以对差模磁芯5设置第二绝缘层(例如：第二绝缘层可以为用于包裹差模磁芯5的外表面5d的外壳)来构成气隙，又或者可以通过架空或设置填充物等手段来满足气隙的尺寸要求。在其他实施方式中，可以将上述实施方式任意结合以构成该气隙。
上文主要说明集成电感10中的差模磁芯5和共模组件2，接下来将展开描述绕组3的结构以及与绕组3与差模磁芯5和共模组件2的组装配合。
在本申请实施例中，绕组3由外表覆有绝缘层的线环绕而成，例如可以是漆包线或者膜包线等。如图3和图12所示，绕组3包括线圈主体31和接线引脚32，二者相连，线圈主体31内具有线圈围成的通孔。每个绕组3的线圈匝数相同，并且每个绕组3的绕线方向也相同。绕组3的数量与差模磁芯5的数量对应设置，以使绕组3与差模磁芯5一一对应。绕组3至少有两个，例如可以有三个。在一种实施方式中，接线引脚32可以有两个，分别位于线圈主体31的两侧，与线圈主体31近似相切。在其他实施方式中，接线引脚32可以位于线圈主体31的同一侧。接线引脚32在线圈主体31上分布方式的不同也会影响到集成电感10在电路板20上占用的安装面积的不同，因此可以根据需要设计接线引脚32的所在位置。
如图3、图6、图9和图10，每个绕组3的线圈主体31与共模组件2的第一通孔22c和差模磁芯5的第二通孔5c配合：每个绕组3的线圈主体31同时穿过第一通孔22c和一个差模磁芯5的第二通孔5c，以使每个绕组3均缠绕共模磁芯22和一个差模磁芯5。每个线圈主体31的通孔均收容共模组件2的一部分和差模磁芯5的第一部分，以使第一部分51位于线圈主体31和第一表面22a之间，第二部分52位于线圈主体31远离第一表面22a的一侧。绕组3的接线引脚32均在第一方向上位于第二表面22b远离第一表面22a的一侧。三个绕组3可以在共模组件2上均匀分布，每两个绕组3之间的间距近似相等。
如图6、图7和图9所示，绕组3与底盘1固定连接。每个绕组3都与一组安装孔1a配合。在一种实施方式中，绕组3的一个接线引脚32伸入第一通孔22c，并且穿过基座盘上安装孔1a，另一个接线引脚32位于共模组件2的外侧，穿过凸缘12上的安装孔1a。共模磁芯22位于底盘1露出接线引脚32的另一侧，第二表面22b在第一方向上朝向底盘1。接线引脚32在第一方向上排列在第二表面22b背离第一表面22a的一侧，由于接线引脚32用于将集成电感10连接至电路板20上，通过限定接线引脚32的位置，可以使得接线引脚32、共模磁芯22、差模磁芯5在第一方向上依次排列，有利于实现集成电感10节约电路板20的占板空间。接线引脚32全部位于共模磁芯22的同一侧，在将集成电感10组装至电路板20的过程中，接线引脚32组装的位置在底盘1远离共模组件2的一侧，不需要在集成电感10占用电路板20的安装区之外的空间连接接线引脚32，将接线引脚32隐藏在底盘1和电路板20之间，可以节约占板空间，也会在接线引脚32的组装过程中，借用底盘1隔离组装区域和共模组件2，例如当通过焊接的方式组装时，由于底盘1的隔离，焊接温度不会对共模组件2和绕组3造成影响。
接下来描述集成电感10的磁路的构成方案。
如图3和图9所示，由于共模磁芯22为封闭的环形磁芯，因此共模磁芯22构成了闭合的共模磁路A。共模磁芯22与每个绕组3之间形成共模电感，抑制共模干扰。差模磁芯5都构成闭合的差模磁路B，每个差模磁芯5都与环绕其上的绕组3形成差模电感，抑制差模电流。又由于差模磁芯5与共模磁芯22之间具有气隙，因此该气隙能够保证差模磁路B与共模磁路A相互独立，互不干涉、影响。
共模磁芯22可以由磁导率为2000-100000的磁性材料制成，差模磁芯5可以由磁导率为26-5000的磁性材料制成。
在一种实现方式中，共模磁芯22可以由磁导率为20000的纳米晶带材绕制成，差模磁芯5由磁导率为1000的非晶带材制成，使得共模感量为202微亨，差模感量为12微亨。
在另一种实现方式中，共模磁芯22由磁导率为7000的铁氧体制成，差模磁芯5由磁导率为125的铁硅磁粉芯制成，使得共模感量为180微亨，差模感量为14微亨。
作为示例而非限定，通过调节任意一个绕组3的匝数，或者通过调节共模磁芯22的横截面的面积，可以调节该绕组3与该共模磁芯22之间形成的共模电感量。
在上述例举的实施方式中，共模磁芯22与每个差模磁芯5都为封闭的环形结构，这是因为，当共模磁芯22或差模磁芯5为封闭的环形结构的磁芯时，能够有效地提升在共模磁芯22或差模磁芯5上绕制绕组3的绕线利用率。因此共模磁芯22与差模磁芯5都为封闭的环形结构仅仅是一种举例，实际上共模磁芯22与差模磁芯5的磁芯结构可以根据需要设计为其它方案，例如共模磁芯22或各差模磁芯5设置为不封闭的环形架构。
一种实施方式中，通过在集成电感内设置绝缘件4，绝缘件用于隔离保护相邻的绕组3。
如图13所示，绝缘件4可以包括至少两个绝缘板41，绝缘板41的数量与绕组3的数量相对应，例如可以有三个。绝缘板41可以为矩形板状结构，由绝缘材料制成，用于设于相邻绕组3之间起到隔离保护绕组3的作用。
本申请实施例中，绝缘件4可以为一体式的绝缘件4。如图13所示，一体式的绝缘件4可以包括绝缘板41和中间柱42，三个绝缘板41环绕中间柱42的外侧面，并且分别沿中间柱42的轴线方向与中间柱42固定连接，且相邻的两个绝缘板41之间形成不为0的夹角。例如，绝缘件4的三个绝缘板41在中间柱42上均匀分布，以使每两个相邻的绝缘板41的夹角近似为120°。一体式的绝缘件4安装方式简单，能够批量安装集成电感10，提升安装效率。
在其他实施方式中，绝缘件4可以为分体式结构，绝缘件4仅包括三个绝缘板41，三个绝缘板41之间可以互不连接或者使用柔性件相互连接。分体式的绝缘件4可以根据不同的情景灵活调整绝缘板41的安装位置，因此分体式的绝缘件4对环境的适应性较强，能够应对多变的安装场景。
如图3、图13所示，绝缘件4设于三个绕组3之间，与底盘1固定连接，例如可以通过粘胶的方式固定连接，也可以通过卡扣和卡槽的配合实现固定连接，例如在绝缘件4的底部设置卡扣，在底盘1上设卡槽，将卡扣插入卡槽，可以实现绝缘件4和底盘1之间的固定连接。在另一种实施方式中，绝缘件4和底盘1为一体成型的结构，有利于提升集成电感10整体结构的稳定性。
绝缘件4的每个绝缘板41都位于相邻的两个绕组3之间，将相邻的两个绕组3隔开，能够防止相邻绕组3之间在电流过载的情况下发生击穿。在一种实施方式中，绝缘板41可以与两侧的绕组3都具有间隙。在另一种实施方式中，绝缘板41可以被两侧的绕组3抵持。如图14所示，图14的上半部分表示绕组3之间没有设置绝缘板41时的场景，绕组3之间的间距为D1；图14的下半部分表示绕组3之间设有绝缘板41以后的场景，此时绝缘板41两侧的绕组3与绝缘板41抵接，绕组3与绝缘板41抵持的部分可以称为抵接部31a。绕组3之间的间距为D2，对比得出D2的宽度大于D1的宽度，即抵接部31a与绝缘板41抵接时会产生弹性形变，因此能够使得绕组3与绝缘板41之间的布局更加的紧凑，从而节省集成电感10在第一方向上占用的电路板20的面积。
结合图2和图15所示，电路板20上设有电感安装区201，电感安装区201内设有焊盘202。电感安装区201用于定位安装集成电感10，电感安装区201的轮廓与集成电感10的外轮廓在第一方向上的投影基本一致，因此电感安装区201的面积即为集成电感10在电路板20上的占板面积。焊盘202用于与绕组3的接线引脚32对应，使得接线引脚32焊接于焊盘202上。焊盘202在电感安装区201内的位置分布取决于接线引脚32的位置分布，可以根据需要设计焊盘202的分布位置，在此不做过多的设定。
而本申请的集成电感10，差模磁芯5与共模磁芯22在第一方向上层叠设置，差模磁芯5在第一方向上的投影与共模磁芯22在第一方向上的投影有大部分的重叠，由于第一方向垂直于电路板20，因此本申请的集成电感10在电路板20上的占板面积(即电感安装区201的面积)利用率大大提高，与其他差模磁芯与共模磁芯分别独立安装实施例相比，本申请的集成电感10能够减少对电路板20的占板面积，功率密度大。
差模磁芯5和共模磁芯22共用三相绕组3，在能够保证抑制差模电流和共模电流的前提下，减少绕组3的使用量，能够有效地降低铜损，从而降低铜损对于逆变器300的系统效率的影响，从而有效的提升集成电感10的效率。
本申请的差模磁路B与共模磁路A相互独立。差模磁芯5的磁通不会占用共模磁芯22的磁通，使得集成电感10能够耐受更大的电流，具有优异的抗磁饱和能力。
本申请的集成电感10为层叠布局，差模磁芯5和共模磁芯22在第一方向上的投影有大面积的重叠，因此集成电感10与电路板20安装时，能够大大减小电感安装区201的面积，可以为电路板20上的其他元件避让出安装空间，进而减小电路板组件100的体积。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请通过的保护范围应以所述权利要求的保护范围为准。

Claims (18)

  1. 一种集成电感，其特征在于，包括：
    第一磁芯，包括在第一方向上相对设置的第一表面和第二表面，所述第一磁芯设有贯穿所述第一表面和所述第二表面的第一通孔；
    至少两个第二磁芯，在所述第一方向上设置在所述第一表面远离所述第二表面的一侧，每个所述第二磁芯设有一个第二通孔；
    至少两个绕组，和所述第二磁芯一一对应设置，每个所述绕组均穿过所述第一通孔和一个对应的所述第二通孔，以使每个所述绕组均缠绕所述第一磁芯和一个所述第二磁芯，所述至少两个绕组和所述第一磁芯构成共模电感，所述至少两个绕组和所述至少两个第二磁芯构成差模电感；
    每个所述第二磁芯包括沿所述第一方向分布在所述第二通孔相对的两侧的第一部分和第二部分，所述第一部分位于所述绕组和所述第一表面之间，所述第二部分位于所述绕组远离所述第一表面的一侧。
  2. 根据权利要求1所述的集成电感，其特征在于，
    每个所述绕组均包括两个接线引脚，所述至少两个绕组的所有的所述接线引脚在所述第一方向上排列在所述第二表面背离所述第一表面的一侧。
  3. 根据权利要求1或2所述的集成电感，其特征在于，
    沿所述第一方向，所有的所述第二通孔在所述第一表面上的垂直投影位于所述第一表面内。
  4. 根据权利要求1-3任一项所述的集成电感，其特征在于，
    每个所述第二磁芯包括第三表面和第四表面，所述第二通孔连通所述第三表面和所述第四表面，所述第一表面呈平面状，所述第三表面或所述第四表面为平面状或弧面状，所述第三表面垂直于所述第一表面。
  5. 根据权利要求1-4任一项所述的集成电感，其特征在于，
    所述第一磁芯与所述第二磁芯之间设有气隙。
  6. 根据权利要求5所述的集成电感，其特征在于，
    所述气隙的取值范围大于或等于5μm。
  7. 根据权利要求5-6任一项所述的集成电感，其特征在于，
    所述第一磁芯的外表面具有第一绝缘层，所述第一绝缘层构成至少部分所述气隙。
  8. 根据权利要求5-7任一项所述的集成电感，其特征在于，
    所述第二磁芯的外表面具有第二绝缘层，所述第二绝缘层构成至少部分所述气隙。
  9. 根据权利要求2所述的集成电感，其特征在于，
    所述集成电感还包括底盘，所述底盘位于所述第二表面背离所述第一表面的一侧；所述绕组的所述接线引脚均与所述底盘固定连接。
  10. 根据权利要求9所述的集成电感，其特征在于，
    所述接线引脚穿过所述底盘，部分所述接线引脚位于所述底盘背离所述第一磁芯的一侧。
  11. 根据权利要求9或10所述的集成电感，其特征在于，
    所述底盘包括至少两个安装部，每个所述安装部均与一个所述绕组的所述接线引脚固定， 所述至少两个安装部之间互相独立，或者所述至少两个安装部之间通过柔性连接件连接。
  12. 根据权利要求1-11任一项所述的集成电感，其特征在于，
    所述集成电感还包括绝缘件，所述绝缘件设置在相邻的所述绕组之间，部分所述绝缘件位于所述第一通孔内。
  13. 根据权利要求12所述的集成电感，其特征在于，
    每个所述绕组均包括抵接部，各所述抵接部和所述绝缘件接触，所述抵接部通过接触所述绝缘件产生弹性形变。
  14. 根据权利要求12或13所述的集成电感，其特征在于，
    所述绝缘件包括中间柱和连接在所述中间柱外侧面的三个绝缘板，所述绕组的数量为三个，所述三个绝缘板分别位于相邻的两个所述绕组之间。
  15. 根据权利要求1-14任一项所述的集成电感，其特征在于，
    所述绕组和所述第二磁芯的数量均为三个；或者，所述绕组和所述第二磁芯的数量均为两个。
  16. 一种电路板组件，其特征在于，
    所述电路板组件包括电路板和权利要求1-15任一项所述的集成电感，所述集成电感与所述电路板连接。
  17. 一种电路板组件，其特征在于，
    所述电路板组件包括电路板和权利要求1-11任一项所述的集成电感，所述电路板包括电感安装区，所述电感安装区内设有焊盘，所述集成电感的通过接线引脚与所述焊盘焊接。
  18. 一种逆变器，其特征在于，
    所述逆变器包括壳体和权利要求16或17所述的电路板组件，所述壳体包围所述电路板组件。
PCT/CN2023/100913 2022-07-13 2023-06-17 集成电感、电路板组件和逆变器 Ceased WO2024012155A1 (zh)

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