WO2024021866A1 - 传输线组件、印制电路板组件、电子设备 - Google Patents

传输线组件、印制电路板组件、电子设备 Download PDF

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Publication number
WO2024021866A1
WO2024021866A1 PCT/CN2023/098328 CN2023098328W WO2024021866A1 WO 2024021866 A1 WO2024021866 A1 WO 2024021866A1 CN 2023098328 W CN2023098328 W CN 2023098328W WO 2024021866 A1 WO2024021866 A1 WO 2024021866A1
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WO
WIPO (PCT)
Prior art keywords
printed circuit
circuit board
signal line
opening
signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2023/098328
Other languages
English (en)
French (fr)
Inventor
罗兵
覃雯斐
苏国玉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Priority to EP23845079.5A priority Critical patent/EP4553998A4/en
Publication of WO2024021866A1 publication Critical patent/WO2024021866A1/zh
Priority to US19/026,991 priority patent/US20250158262A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/06—Coaxial lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/081—Microstriplines
    • H01P3/084—Suspended microstriplines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases

Definitions

  • Embodiments of the present application relate to the technical field of printed circuit boards, and in particular, to a transmission line assembly, a printed circuit board assembly, and an electronic device.
  • Transmission lines are one of the most common circuit structures used in electronic equipment to carry radio frequency signals from one point to another.
  • commonly used transmission lines include: microstrip line (microstrip line) 01, grounded coplanar waveguide (GCPW) 02, stripline (Stripline) 03, coplanar waveguide (coplanar wave) guide, CPW)04, rectangular waveguide 05, twisted pair 06, coaxial cable 07, etc.
  • microstrip line 01, strip line 03, grounded coplanar waveguide 02, and coplanar waveguide 04 have the advantage of high integration, but their losses are large.
  • the existing technology mainly focuses on two aspects: material and structure.
  • Figure 2a is a schematic structural diagram of a single-layer coplanar waveguide 04.
  • the signal line 041 and the ground line 042 are located on the same side of the dielectric printed circuit board 043.
  • the signal line 041 and the ground line The area facing 042 is small, and the impedance of signal line 041 is high.
  • the current distribution is concentrated on the edge of signal line 041. The small current distribution area leads to increased loss.
  • Figure 2b is a schematic structural diagram of a single-layer coplanar waveguide 04 with a reference ground. As shown in Figure 2b, a signal line 041 and a ground line 042 are provided on one side of the dielectric printed circuit board 043. The other side of the media printed circuit board 043 is provided with a reference ground 044 . The isolation between signal line 041 and other adjacent transmission lines can be enhanced, but its loss is still large.
  • Figure 2c is a schematic structural diagram of a double-layer coplanar waveguide. As shown in Figure 2c, signal lines 041 and ground lines 042 are distributed on both sides of the dielectric printed circuit board 043. The signal lines 041 on both sides are connected through metallized vias 045. , the ground wires 042 on both sides are connected through metalized vias 045.
  • Figure 2d is a schematic structural diagram of a double-layer coplanar waveguide with slots. The difference between Figure 2d and Figure 2c is that the dielectric printed circuit board 043 is provided with slots 046 to reduce the amount of dielectric material.
  • Embodiments of the present application provide a transmission line assembly, a printed circuit board assembly, and an electronic device to improve the problem of large signal loss in signal transmission lines.
  • a transmission line assembly for connecting to a printed circuit board; the surface of the printed circuit board is provided with a signal terminal and a grounding terminal; the transmission line assembly includes a shielding cover and a signal line; the shielding cover is used for connecting with a printed circuit board.
  • the ground terminal is connected;
  • the shielding case has a receiving space, and the receiving space is provided with a first opening and a second opening;
  • the signal line includes a first end and a second end arranged oppositely; the signal line is passed through the receiving space, And there is a gap between the signal line and the inner wall of the accommodation space; the first end passes through the first opening, the second end passes through the second opening, and at least one end of the first end and the second end is used for Connect to this signal terminal.
  • the signal line is passed through the accommodation space of the shielding cover.
  • the shielding cover can prevent the radiation of the signal line from overflowing and interfering with other transmission lines. Similarly, the shielding cover can also prevent other transmission lines from interfering with the signal line.
  • the transmission line assembly further includes: an insulating member, the insulating member is disposed in the gap, the inner wall of the insulating member is in contact with the signal line, and the outer wall of the insulating member is in contact with the signal line. It is in contact with the inner wall of the accommodation space. Therefore, the insulating member can insulate the signal line and the shielding case, thereby preventing the signal line from being electrically connected to the shielding case.
  • the insulating member has an open-loop structure.
  • the use of insulating material can be reduced, the conversion of electromagnetic energy to the signal line can be reduced, and the loss can be reduced.
  • the insulating member has a closed-loop structure. In this way, the insulating member can prevent the signal line from being electrically connected to the shielding case.
  • the first opening is located at an end of the shielding case. Therefore, the first end of the signal line does not need to be provided with a corner in the accommodation space, thereby reducing the volume of the shielding cover and increasing the integration of the printed circuit board.
  • the second opening is located at an end of the shielding case. Therefore, the second end of the signal line does not need to be provided with a corner in the accommodation space, which is beneficial to reducing the size of the shielding case.
  • the accommodation space is further provided with a window, and the window is located between two ends of the shielding case. Therefore, the existence of the window can reduce the weight of the shielding cover, save the material cost and process cost of the shielding cover, and effectively increase the integration of the printed circuit board.
  • the window extends from an edge of the first opening to an edge of the second opening. This is beneficial to reducing the manufacturing cost of the shielding cover.
  • the distance from the plane where the window is located to the signal line is greater than the minimum distance from the signal line to the inner wall of the accommodation space. In this way, the proportion of the signal line's external radiation signal capability can be controlled to less than one thousandth.
  • the cross section of the shielding cover includes a bending structure; the cross section is perpendicular to the extension direction of the signal line; the bending structure is surrounded by a plurality of bending areas, one At least one signal line is passed through the bending area. Therefore, the bending area of the bending structure has a blocking effect on the signal of the signal line, and the mutual interference between adjacent signal lines is weakened.
  • the shielding case includes a plurality of sub-covers, and the plurality of sub-covers are spaced apart along the extension path of the signal line. Therefore, the shielding cover composed of multiple sub-cover bodies can save manufacturing costs. In addition, during the assembly process, the position and direction of the sub-cover can be adjusted, and more types of signal line extension paths can be applied.
  • the signal line further includes a third end, the third end is located between the first end and the second end, and the accommodation space is provided with a third opening; Three ends pass through the third opening; at least one of the first end, the second end and the third end is used to connect with the signal end.
  • a shield can be provided for a signal line with a signal branch in the middle, such as a power splitter, and the signal line is in the air medium, thereby reducing the signal loss of the signal line.
  • At least two end surfaces are coplanar. Therefore, when surface mount technology is used to connect transmission line components and printed circuit boards, connecting more than two surfaces at the same time can reduce process costs and process time.
  • a printed circuit board assembly in a second aspect, includes: a printed circuit board and any transmission line assembly provided in the first aspect; a signal terminal and a grounding terminal are provided on the surface of the printed circuit board. terminal; the shielding case is connected to the ground terminal, and at least one of the first terminal and the second terminal is connected to the signal terminal. Since the signal loss of transmission line components is small, the material selection for printed circuit boards does not need to be limited to low-loss RF boards, which is beneficial to reducing costs.
  • the first opening and the second opening both face the printed circuit board. Therefore, the printed circuit board can block the first opening and the second opening to prevent the radiation of the signal line from overflowing from the first opening and the second opening and causing interference to other transmission lines.
  • the window of the shielding cover faces the printed circuit board. Therefore, the printed circuit board can block the window and prevent the radiation of the signal line from overflowing from the window and causing interference to other transmission lines.
  • the window of the shielding cover faces away from the printed circuit board.
  • the radiation in the signal line is less likely to leak from the gap between the shield and the ground terminal, and the radiation has less impact on adjacent transmission lines.
  • the shield case and the ground terminal are welded through a surface mounting process.
  • the process flow of the printed circuit board can be shortened and the manufacturing cost can be reduced.
  • the first end and/or the second end and the first signal end are welded through a surface mounting process.
  • the process flow of the printed circuit board can be shortened and the manufacturing cost can be reduced.
  • an electronic device in a third aspect, includes a housing and any printed circuit board assembly provided in the second aspect, and the printed circuit board assembly is located in the housing. As the electrical performance of printed circuit board assemblies improves, the electrical performance of electronic devices also improves.
  • the high integration level of printed circuit boards is conducive to the thinning and lightness of electronic devices.
  • Figure 1a is a schematic structural diagram of a microstrip line.
  • Figure 1b is a schematic structural diagram of a grounded coplanar waveguide.
  • Figure 1c is a schematic structural diagram of a strip line.
  • Figure 1d is a schematic structural diagram of a coplanar waveguide.
  • Figure 1e is a schematic structural diagram of a rectangular waveguide.
  • Figure 1f is a schematic structural diagram of a twisted pair.
  • Figure 1g is a schematic structural diagram of a coaxial cable.
  • Figure 2a is a schematic structural diagram of a single-layer coplanar waveguide.
  • Figure 2b is a schematic structural diagram of a single-layer coplanar waveguide with a reference ground.
  • Figure 2c is a schematic structural diagram of a double-layer coplanar waveguide.
  • Figure 2d is a schematic structural diagram of a double-layer coplanar waveguide with slots.
  • Figure 3 is a schematic structural diagram of an electronic device.
  • Figure 4 is a schematic diagram of the electric field distribution of the microstrip line.
  • Figure 5a is a schematic structural diagram of a printed circuit board assembly provided by an embodiment of the present application.
  • Figure 5b is a schematic structural diagram of a printed circuit board and signal lines provided by an embodiment of the present application.
  • Figure 6a is a schematic structural diagram of a transmission line assembly provided by an embodiment of the present application.
  • Figure 6b is a cross-sectional view of the transmission line assembly provided by the embodiment of the present application.
  • Figure 6c is another cross-sectional view of the transmission line assembly provided by the embodiment of the present application.
  • Figure 6d is another cross-sectional view of the transmission line assembly provided by the embodiment of the present application.
  • Figure 7a is a schematic structural diagram of the first shielding case and signal lines in Example 1.
  • Figure 7b is a schematic structural diagram of the second shielding case and signal lines in Example 1.
  • Figure 7c is a schematic structural diagram of the third shielding case and signal lines in Example 1.
  • Figure 8a is a schematic structural diagram of the fourth shielding case and signal lines in Example 1.
  • Figure 8b is a schematic structural diagram of the fifth shielding case and signal lines in Example 1.
  • Figure 9 is a schematic structural diagram of the shielding case and multiple signal lines in Example 1.
  • Figure 10a is a schematic structural diagram of the sixth shielding case and signal lines in Example 1.
  • Figure 10b is a cross-sectional view of an embodiment of the sixth shielding case in Example 1.
  • Figure 10c is a cross-sectional view of yet another embodiment of the sixth shielding case in Example 1.
  • Figure 10d is a schematic structural diagram of the seventh shield case and signal line in Example 1.
  • Figure 10e is a cross-sectional view of an embodiment of the seventh shielding cover in Example 1.
  • Figure 10f is a cross-sectional view of yet another embodiment of the seventh shielding case in Example 1.
  • Figure 10g is a cross-sectional view of another embodiment of the seventh shielding case in Example 1.
  • Figure 10h is a schematic structural diagram of yet another embodiment of the seventh shielding case in Example 1.
  • Figure 11 is a schematic structural diagram of the shielding case and signal lines provided in Example 2 of this application.
  • Figure 12 is a schematic structural diagram of the shielding case and signal lines provided in Example 3 of this application.
  • Figure 13a is a connection structure diagram of the shielding cover and the printed circuit board in Figure 8b.
  • Figure 13b is another connection structure diagram of the shielding cover and the printed circuit board in Figure 8b.
  • Figure 13c is a schematic cross-sectional view of the shield case and the printed circuit board with the window not closed by the printed circuit board.
  • Figure 13d is another connection structure diagram of the shielding cover and the printed circuit board in Figure 8b.
  • Figure 13e is a schematic diagram of the surface structure of the shielding cover provided in Figure 7b.
  • Figure 14a is a connection structure diagram of a shield case with a window and a printed circuit board.
  • Figure 14b is another connection structure diagram of a shield case with a window and a printed circuit board.
  • Embodiments of the present application provide an electronic device.
  • the electronic device may be, for example, a mobile phone (mobile phone), a tablet computer (pad), a personal digital assistant (personal digital assistant, PDA), a television, or a smart wearable product (such as a smart watch). , smart bracelets), virtual reality (VR) terminal equipment, augmented reality (AR) terminal equipment, rechargeable small household appliances (such as soy milk machines, sweeping robots), drones, radar, aerospace equipment Different types of user equipment or terminal equipment such as vehicle-mounted equipment, etc., the embodiments of this application do not place special restrictions on the specific form of the electronic equipment.
  • the electronic device is a mobile phone as an example below.
  • the electronic device 10 mainly includes a cover 11 , a display screen 12 , a middle frame 13 and a rear case 17 .
  • the back shell 17 and the display screen 12 are respectively located on both sides of the middle frame 13 , and the middle frame 13 and the display screen 12 are arranged in the back shell 17 .
  • the cover plate 11 is disposed on the side of the display screen 12 away from the middle frame 13 .
  • the display screen 12 The display surface faces the cover 11.
  • the above-mentioned middle frame 13 includes a bearing plate 15 and a frame 14 surrounding the bearing plate 15 .
  • Electronic components such as printed circuit board assembly 100 (printed circuit board, PCB), battery, camera, etc. in the electronic device 10 can be disposed on the carrier board 15 .
  • the printed circuit board assembly 100 serves one of the functions of integrating electronic components of the electronic device 10, for example, realizing interconnections between chips.
  • the connection between electronic components is mainly realized through transmission lines.
  • the aforementioned transmission line is, for example, a microstrip line.
  • Figure 4 is a schematic diagram of the electric field distribution of the microstrip line.
  • H is the magnetic field intensity
  • E is the electric field intensity.
  • H is the magnetic field intensity
  • E is the electric field intensity.
  • embodiments of the present application provide a printed circuit board aimed at reducing the loss of transmission lines.
  • FIG 5a is a schematic structural diagram of a printed circuit board assembly 100 provided by an embodiment of the present application. Please refer to Figure 5a.
  • the printed circuit board assembly 100 includes a printed circuit board 110, a chip 120 and a transmission line assembly 200.
  • the chip 120 and the transmission line assembly 200 are located on the same surface of the printed circuit board 110 .
  • the structure at the position of the chip 120 in FIG. 5a may be other electrical devices, and is not limited to the chip 120.
  • This embodiment uses the chip as an example for description.
  • At least one end of the transmission line assembly 200 is connected to the signal end on the surface of the printed circuit board 110 .
  • both ends of the transmission line assembly 200 can be connected to the signal end on the surface of the printed circuit board 110 , or one end of the transmission line assembly 200 is connected to the signal end on the surface of the printed circuit board 110 , and the other end is connected to the signal end on the surface of the printed circuit board 110 . 110 outside the transmission line (such as cable) connection.
  • the transmission line assembly 200 has multiple branches, at least one end of the transmission line assembly 200 is connected to the printed circuit board.
  • the signal terminal on the surface of the circuit board 110 is connected.
  • each end of the transmission line assembly 200 is connected to a signal end on the surface of the printed circuit board 110 as an example for description.
  • the surface of the printed circuit board 110 is provided with a first signal terminal 111 , a second signal terminal 112 and a ground terminal 113 .
  • the first signal terminal 111 and the second signal terminal 112 are respectively connected to the signal pads of different chips 120 , and the ground pad of the chip 120 is connected to the ground terminal 113 .
  • the embodiment of the present application does not limit the number of chips 120.
  • the number of chips 120 can be two, three, four or more, and can be set according to the functions of the printed circuit board assembly 100.
  • the transmission line assembly 200 connects the first signal terminal 111 and the second signal terminal 112 so that the plurality of chips 120 are interconnected through the transmission line assembly 200 .
  • the printed circuit board assembly 100 also includes a plurality of signal connectors 150 and a plurality of ground electrical connectors 160.
  • the signal connectors 150 and the ground electrical connectors 160 both penetrate two opposite sides of the printed circuit board 110. surface.
  • the first signal terminal 111 and the second signal terminal 112 are both connected to the signal connector 150 .
  • the end of the signal connector 150 away from the first signal terminal 111 can be connected to other components in the electronic device 10 , such as the display screen 12 .
  • the ground electrical connector 160 is connected to the ground terminal 113 .
  • One end of the ground electrical connector 160 away from the ground terminal 113 is grounded.
  • the transmission line assembly 200 is an important factor affecting the signal loss of the chip 120 . To this end, embodiments of the present application provide a transmission line assembly 200 that can reduce signal loss.
  • FIG 6a is a schematic structural diagram of a transmission line assembly 200 provided by an embodiment of the present application. Please refer to Figure 6a.
  • the transmission line assembly 200 includes a shielding cover 210 and a signal line 220.
  • the shielding case 210 is connected to the ground terminal 113. Therefore, the shielding case 210 is connected to the ground electrical connector 160 through the ground terminal 113 .
  • the two opposite ends of the signal line 220 are connected to the first signal terminal 111 and the second signal terminal 112 respectively. Therefore, the signal pads of different chips 120 are interconnected through the signal lines 220 .
  • the shielding case 210 has an accommodating space 201, the signal line 220 is passed through the accommodating space 201, and there is a gap between the signal line 220 and the inner wall of the shielding case 210.
  • Figure 5b is a schematic structural diagram of the printed circuit board 110 and the signal line 220 provided by the embodiment of the present application. There is a gap between the signal line 220 and the printed circuit board 110. Most of the signal line 220 is in the air.
  • the signal lines 220 are in the air, which can effectively improve signal loss compared with being in the dielectric layer.
  • the signal line 220 is located in the accommodation space 201 of the shielding case 210.
  • the shielding case 210 can prevent the radiation of the signal line 220 from overflowing and causing interference to other transmission lines.
  • the shielding case 210 can also prevent other transmission lines from interfering with the signal line 220.
  • the transmission line assembly 200 also includes an insulator 230.
  • the insulating member 230 is provided in the gap between the signal line 220 and the shield case 210 .
  • the inner wall of the insulating member 230 is in contact with the signal line 220
  • the outer wall of the insulating member 230 is in contact with the signal line 220 .
  • the aforementioned contact includes mutual connection, contact but not connection, and other connection methods.
  • the inner side wall of the insulating member 230 is in contact with the signal line 220 but not connected, or the inner side wall of the insulating member 230 is connected to the signal line 220 . Therefore, the insulating member 230 can insulate the signal line 220 and the shielding case 210 to prevent the signal line 220 from being connected to the shielding case 210 .
  • the embodiment of the present application does not limit the structure of the insulating member 230.
  • the insulating member 230 has an open-loop structure.
  • the open-loop structure insulating member 230 surrounds the signal line 220 and has one or more gaps. Therefore, the use of materials of the insulating member 230 can be reduced, and the electromagnetic impact on the signal line 220 can be reduced. Conversion of energy and reduction of losses.
  • the insulating member 230 has a closed-loop structure.
  • the insulating members 230 of the open-loop structure are connected end to end in a cross section perpendicular to the extension direction of the signal line 220 .
  • the insulating member 230 is an elliptical ring, and the insulating member 230 is snap-fitted with the shielding case 210 . In this way, the insulating member 230 can prevent the shielding cover 210 from collapsing and connecting with the signal line 220 to cause a short circuit in the circuit.
  • the insulating member 230 has a cavity 101 inside.
  • the cavity 101 is beneficial to reducing the weight of the insulating member 230, and in the embodiment where the insulating member 230 is an elastic material, the cavity 101
  • the deformation space of the insulating member 230 can be increased to make the contact between the insulating member 230 and the signal line 220 more stable.
  • the shape of the insulating member 230 is not limited to the shapes shown in FIG. 6b, FIG. 6c, and FIG. 6d.
  • the outer shape of the insulating member 230 can be set according to the shape of the inner wall of the accommodation space 201 so that the two match.
  • the inner shape of the insulating member 230 can be set according to the shape of the signal line 220 so that they match.
  • the number of insulating members 230 may be one, two, three or more. In an embodiment where there are multiple insulating members 230 , the plurality of insulating members 230 distributed at intervals along the extension direction of the signal line 220 .
  • the smaller number of insulating members 230 can reduce the production cost of the transmission line assembly 200 and reduce the weight of the transmission line assembly 200 .
  • a larger number of insulators 230 can reduce the risk of a circuit short circuit due to collapse of the shielding cover 210 .
  • the insulating member 230 may not be provided.
  • a gap may be provided between the signal line 220 and the shielding case 210 to insulate the two. .
  • the signal line 220 includes a first end 221 and a second end 222.
  • the first end 221 and the second end 222 are arranged oppositely.
  • the first terminal 221 is connected to the first signal terminal 111
  • the second terminal 222 is connected to the second signal terminal 112 .
  • the embodiment of the present application does not limit the extension path of the signal line 220 , and the extension path of the signal line 220 is set according to the trajectory of the interconnection line of the chip 120 .
  • the extension path of the signal line 220 is a curve or multiple straight lines with inflection points, or the extension path of the signal line 220 is a straight line, or the extension path of the signal line 220 has multiple branch lines.
  • the embodiment of the present application does not limit the extension path of the shielding case 210 .
  • the extension path of the shielding case 210 is the same as the extension path of the signal line 220 .
  • the extending direction of the shielding cover 210 is named the first direction X
  • the direction perpendicular to the extending direction of the shielding cover 210 is named the second direction Y.
  • the first direction X is parallel to the plane where the printed circuit board 110 is located.
  • the extension direction of a certain part of the shielding cover 210 is perpendicular to the extension path of the part.
  • the embodiment of the present application does not limit the shape of the shielding case 210 and the shape of the accommodating space 201.
  • the shape of the shielding case 210 can be cylindrical, prismatic, or other irregular shapes
  • the accommodating space 201 can also be cylindrical, prismatic, or other irregular shapes. Prismatic or other irregular shapes, etc.
  • the embodiment of the present application does not limit the material of the shielding cover 210 .
  • the material of the shielding cover 210 may be sheet metal, profiles, etc.
  • the embodiment of the present application does not limit the molding process of the shielding cover 210.
  • the shielding cover 210 can be made by a die-casting or drawing process.
  • the accommodation space 201 of the shielding cover 210 is provided with a first opening 202 and a second opening 203.
  • the first end 221 passes through the first opening 202, and the second end 222 passes through the second opening 203.
  • the embodiment of the present application does not limit the position of the first opening 202.
  • the first opening 202 is located at the end of the shielding cover 210. In this way, the first opening 202 faces the first direction X.
  • the first opening 202 is located between two ends of the shielding cover 210, so that the first opening 202 is oriented in the second direction Y.
  • the embodiment of the present application does not limit the position of the second opening 203.
  • the second opening 203 is located at the end of the shielding case 210, or the second opening 203 is located between two ends of the shielding case 210.
  • the accommodation space 201 also has a window 204 located between two ends of the shielding case 210 along the first direction X. Therefore, the weight of the shielding cover 210 can be reduced, saving materials and reducing the weight of the printed circuit board assembly 100 .
  • the embodiment of the present application does not limit the shape of the window 204.
  • the window 204 is a rectangle. It can be understood that in other embodiments of the present application, the shape of the window 204 may be waist-shaped, oval, circular, etc.
  • the shielding case 210 Since the shape of the shielding case 210 is related to the shape of the signal line 220 , the shielding case 210 suitable for the signal lines 220 of different shapes will be described below as an example.
  • the signal line 220 is a straight line. In other words, the extension path of the signal line 220 is a straight line.
  • Figure 7a is a schematic structural diagram of the first shielding case 210 and the signal line 220 in Example 1. Please refer to Figure 7a.
  • the first opening 202 and the second opening 203 are respectively located at two opposite ends of the shielding case 210 along the first direction X, so that , the signal line 220 does not need to be provided with corners in the accommodation space 201, thereby reducing the volume of the shielding cover 210 and increasing the integration of the printed circuit board assembly 100.
  • Figure 7b is a schematic structural diagram of the second shielding case 210 and the signal line 220 in Example 1.
  • the first opening 202 is opened between the two ends of the shielding case 210 along the first direction X
  • the second opening 203 is opened between between two ends of the shielding case 210 along the first direction X.
  • both the first opening 202 and the second opening 203 are opened toward the second direction Y.
  • the first opening 202 can be as close as possible to one end of the shielding case 210, and the second opening 203 can be as close as possible to the other end of the shielding case 210.
  • the length of the signal line 220 located in the accommodation space 201 along the first direction X is closer to the length of the shielding cover 210 along the first direction The degree of integration of the circuit board assembly 100.
  • the opening directions of the first opening 202 and the second opening 203 are not limited to the same direction.
  • Figure 7c is a schematic structural diagram of the third shielding case 210 and the signal line 220 in Example 1.
  • the second opening 203 is located at the end of the shielding case 210 along the first direction X
  • the first opening 202 is located at the end of the shielding case 210 along the first direction between two ends of the cover 210 along the first direction X.
  • the opening direction of the second opening 203 is the first direction X
  • the opening direction of the first opening 202 is the second direction Y.
  • the opening direction of the first opening 202 is the second direction Y
  • the opening direction of the second opening 203 is the first direction X.
  • the first opening 202 can be selected according to the position of the ground terminal 113, the position of the first signal terminal 111, the position of the second signal terminal 112 on the printed circuit board assembly 100 and the length of the shielding cover 210 along the first direction X.
  • the opening direction and the opening direction of the second opening 203 are the same.
  • the shielding cover 210 is arranged around the signal line 220. Therefore, the radiation shielding ability of the signal line 220 is better.
  • the shielding cover 210 is also provided with a window 204, and the embodiment of the present application does not limit the arrangement manner of the window 204.
  • Figure 8a is a schematic structural diagram of the fourth shielding case 210 and the signal line 220 in Example 1. Please refer to Figures 8a and 7a. The difference between the fourth shielding case 210 and Figure 7a is that it has a window 204.
  • This embodiment of the present application does not limit the length of the window 204 along the first direction X.
  • the window 204 extends from the edge of the first opening 202 to the edge of the second opening 203 .
  • the provision of the window 204 can reduce the quality of the shielding cover 210, reduce the weight of the transmission line assembly 200, and effectively increase the integration level of the printed circuit board assembly 100.
  • the shielding cover 210 shown in FIG. 8a can be formed by bending a thin plate, thereby saving the material cost and process cost of the shielding cover 210.
  • This example does not limit the width of the window 204.
  • the window 204 extends from one side of the shielding cover 210 to the opposite side. Therefore, the projection of the shielding cover 210 on the plane where the window 204 is located is located in the window. 204, in this way, the weight of the shielding cover 210 can be reduced.
  • Figure 8b is a schematic structural diagram of the fifth shielding case 210 and the signal line 220 in Example 1. The main difference between it and Figure 7a is that the position of the window 204 is different.
  • the side of the shielding cover 210 with the window 204 has a baffle 205.
  • the window 204 extends from the first opening 202 to the second opening 203.
  • the window 204 and the baffle 205 are coplanar.
  • the shielding cover 210 has two baffles 205, and the two baffles 205 are located on opposite sides of the window 204. It can be understood that in other embodiments, the shielding case 210 may have only one baffle 205 , and the baffle 205 is connected to one side of the shielding case 210 .
  • the window 204 is surrounded by a baffle 205, and the shape of the window 204 is related to the baffle 205.
  • the embodiment of the present application does not limit the shape of the window 204, and it can be linear, wavy, polygonal, etc.
  • the baffle 205 can be used to connect to other components, such as a printed circuit board.
  • the shielding cover 210 shown in FIG. 7c can also be provided with the window 204 shown in FIG. 8a or 8b. No further details will be given here.
  • the opening directions of the first opening 202, the second opening 203, and the window 204 are not related to each other, and the opening directions of the three openings can be selected independently.
  • FIGS. 7a to 7c and 8a to 8b Please refer to FIGS. 7a to 7c and 8a to 8b together. It can be seen that a signal line is passed through the shielding case 210 .
  • multiple signal lines 220 may be run through the shielding case 210 .
  • the accommodation space 201 can accommodate two or more signal wires 220 to pass through, and the two signal wires 220 are arranged independently.
  • the shielding cover 210 can provide shielding for the plurality of signal lines 220 .
  • the space can be fully utilized, the volume of the printed circuit board assembly 100 can be reduced, and the electronic device 10 can be made lighter and thinner.
  • the shield case 210 in FIGS. 7b to 7c and 8a to 8b can refer to the structure shown in FIG. 9 and run multiple signal lines 220, which will not be described again here.
  • an insulating member 230 may be disposed between the two signal lines 220 . In other words, at least part of the insulating member 230 is located between the two signal lines 220 .
  • the accommodation space 201 inside the shielding case 210 is separated.
  • Figure 10a is a schematic structural diagram of the sixth shielding case 210 and the signal line 220 in Example 1. Please refer to Figure 10a.
  • the accommodation space 201 is divided into multiple areas.
  • FIG 10b is a schematic structural diagram of the sixth shielding cover from another perspective. Please refer to Figures 10b and 10a.
  • the cross-section of the shielding cover 210 includes a bending structure 208.
  • the bending structure 208 is surrounded by a plurality of bending areas 207, one At least one signal line 220 is passed through the bending area 207 .
  • the aforementioned cross section is perpendicular to the first direction X.
  • the embodiment of the present application does not limit the number of bending areas 207.
  • the number of bending areas 207 is three, or in Figure 10c, the number of bending areas 207 is two.
  • the embodiment of the present application does not limit the number of signal lines 220 that can be inserted into a bending area 207.
  • one, two or more signal lines 220 can be inserted into a bending area 207.
  • the bending area 207 surrounded by the bending structure 208 may only partially pass through the signal line 220 .
  • the signal line 220 can be run through each bending area 207 , or the signal line 220 can be run through only part of the bending area 207 , and the remaining parts of the bending area 207 can be run through. No signal line 220 is passed through.
  • the bending area 207 of the bending structure 208 has a blocking effect on the signal of the signal line 220. In this way, the mutual interference between the signal lines 220 located in the same accommodation space 201 is weakened. For example, two adjacent signal lines 220 are blocked by the bending area 207 in the opposite direction.
  • the bending structure 208 is a plurality of arc structures connected in sequence, and is generally W-shaped.
  • the bending area 207 is distributed on one side of the bending structure 208 .
  • the shape of the shield case 210 whose cross section includes the bent structure 208 is not limited to the structure shown in FIG. 10b.
  • FIG. 10d is a schematic structural diagram of the seventh shield case 210 and signal line 220 in Example 1. Please refer to FIG. 10d.
  • the accommodation space 201 is divided into multiple areas.
  • the bending areas 207 are distributed on opposite sides of the bending structure 208.
  • the bending structure 208 is a plurality of square structures connected in sequence.
  • the bending structure 208 is surrounded by a plurality of bending areas 207, and two adjacent bending areas 207 are independent of each other. In other words, along the second direction Y, two adjacent bending areas 207 are not connected.
  • the bending structure 208 can better shield the interference between the signal lines 220 located in different bending areas 207. Reduce interference between signal lines 220.
  • the embodiment of the present application does not limit the number of bending areas 207.
  • the number of bending areas 207 is four, or in Figure 10f, the number of bending areas 207 is two.
  • the bending structure 208 is not limited to the shape shown in Figures 10c and 10d.
  • it can be "sun" shape, "eye” shape, "field” shape, etc.
  • the shielding cover 210 may further include a shell surrounding the periphery of the bending structure 208 .
  • the cross-section of the shielding case 210 may only include the bending structure 208, and the cross-section of the shielding case 210 may also include a shell surrounding the outer periphery of the bending structure 208, and the like.
  • the shielding cover 210 may also include a bending structure 208 as shown in FIG. 10g, so that the shielding effect of the shielding cover 210 is better.
  • the shielding case 210 may also include a bending structure 208 as shown in FIG. 10h.
  • the weight of the shielding cover 210 is smaller, and the bending structure 208 can reduce mutual interference between the signal lines 220 in the shielding case 210.
  • the extension path of the shielding cover 210 is a straight line. Since the surface area of the printed circuit board 110 is limited, in some embodiments, the extension path of the signal line 220 may have corners, bends, etc. In this way, the extension path of the shielding cover 210 may be a curve, a straight line with multiple inflection points, etc.
  • the embodiment of the present application also provides the shielding case 210 shown in Example 2.
  • the signal line 220 is a polyline or a curve.
  • FIG 11 is a schematic structural diagram of the shielding case 210 and the signal line 220 provided in Example 2 of this application. Please refer to Figure 11.
  • the shielding case 210 includes two sub-covers 211.
  • the two sub-covers 211 are connected to each other.
  • the two sub-covers 211 are connected along the signal line.
  • the extension paths of lines 220 are spaced apart.
  • Each sub-cover 211 has an opening for the signal wire 220 to pass through.
  • the embodiment of the present application does not limit the shape of the sub-cover body 211.
  • the shape of the sub-cover body 211 can refer to the shape of the shielding cover 210 in Example 1, which will not be described again here.
  • the embodiment of the present application does not limit the length of the sub-cover 211.
  • the length of the sub-cover 211 is related to the distance between two adjacent inflection points of the signal line 220, and can be set according to this distance.
  • This embodiment of the present application does not limit the number of sub-covers 211 and can be set according to the number of inflection points of the signal lines 220 .
  • the embodiment of the present application does not limit the connection method between the sub-covers 211.
  • they can be connected through electrical connectors 212.
  • the electrical connector 212 has the function of connecting two adjacent sub-covers 211 .
  • the electrical connector 212 also has the function of reducing signal overflow at the inflection point of the signal line 220 .
  • the electrical connector 212 may be copper foil or the like.
  • the above-mentioned electrical connector 212 may not be provided.
  • two adjacent sub-covers 211 are not connected and are independent of each other.
  • the shielding case 210 composed of multiple sub-covers 211 distributed can save manufacturing costs.
  • the position and direction of the sub-cover 211 can be adjusted, and more types of extension paths for the signal lines 220 can be applied.
  • the signal line 220 has two branches, namely a first end 221 and a second end 222 .
  • the branches of the signal line 220 are not limited to two, that is, the transmission ends of the signal line 220 are not limited to both ends of the signal line 220 .
  • the power splitter needs to lead out a signal distribution branch in the middle of the signal line 220 .
  • Example 3 of the present application provides a shielding case 210 that is applicable to a signal line 220 having multiple distribution branches.
  • the signal line 220 also has a branch between the first end 221 and the second end 222, for example, it also has a third end.
  • FIG. 12 is a schematic structural diagram of the shielding case 210 and the signal line 220 provided in Example 3 of the present application. Please refer to FIG. 12 .
  • the signal line 220 also includes a third end 223 , and the third end 223 is located outside the third opening 206 .
  • the accommodation space 201 of the shielding case 210 is also provided with a third opening 206 .
  • the third end 223 of the signal line 220 is located between the first end 221 and the second end 222 .
  • the third end 223 of the signal line 220 is connected to the third signal end of the printed circuit board 110 .
  • the transmission line assembly 200 can provide excellent shielding for the signal line 220 having three branches, and can also reduce the signal loss of the signal line 220 .
  • Example 3 For other structures of the shielding cover 210 in Example 3, please refer to Example 1 and will not be described again here.
  • the embodiment of the present application does not limit the relative position of the third end 223 and the signal line 220, and can be distributed according to the design of the signal line 220.
  • the third end 223 is located in the middle of the signal line 220.
  • the embodiment of the present application does not limit the position of the third opening 206.
  • the third opening 206 is located between two ends of the shielding cover 210 along the first direction X.
  • the third opening 206 is opened toward the second direction Y.
  • the opening direction of the third opening 206 may be the first direction X.
  • the opening direction of the first opening 202 or the second opening 203 may be the second direction Y.
  • the third opening The opening direction of 206 may be the first direction X.
  • the transmission line assembly 200 is located on the surface of the printed circuit board 110 , and the shielding cover 210 is connected to the ground terminal 113 on the surface of the printed circuit board 110 .
  • the signal line 220 is connected to the signal terminal on the surface of the printed circuit board 110 .
  • the embodiment of the present application does not limit the connection method between the shielding cover 210 and the printed circuit board 110 .
  • the shielding cover 210 is connected to the printed circuit board 110 away from the outer surface of the accommodation space 201 . In this way, the same shielding case 210 and the printed circuit board 110 can be connected in multiple ways.
  • FIG. 8 b Please refer to FIG. 8 b again.
  • the following description will take the connection structure between the shield case 210 and the printed circuit board 110 provided in FIG. 8 b as an example.
  • Figure 13a is a connection structure diagram of the shielding cover 210 and the printed circuit board 110 in Figure 8b. Please refer to Figure 13a.
  • the side of the shielding cover 210 away from the window 204 is connected to the printed circuit board 110.
  • the window 204 is located on the side of the shielding cover 210 away from the printed circuit board 110.
  • the shielding cover 210 has a larger contact area with the printed circuit board 110, and there are more choices for the connection parts with the printed circuit board 110, which can be adjusted.
  • the large margin will help reduce the cost of assembly of the two. Assuming that the signal line 220 has radiation overflowing from the window 204, the overflowing radiation will have less impact on the adjacent signal line 220 and the signal end on the surface of the printed circuit board 110.
  • Figure 13b is another connection structure diagram of the shielding cover 210 and the printed circuit board 110 in Figure 8b. Please refer to FIG. 13b.
  • the surface of the shielding cover 210 adjacent to the window 204 is connected to the printed circuit board 110, and the window 204 is away from the printed circuit board 110.
  • the surface where the window 204 is located and the surface where the shielding cover 210 and the printed circuit board 110 are connected are adjacent.
  • the shielding cover 210 and the printed circuit board 110 have a large contact area, and the adjustment margin during the assembly process is large.
  • the window 204 is away from the printed circuit board 110, even if there is a gap between the shielding case 210 and the ground terminal 113, since the signal line 220 and the gap are blocked by the shielding case 210, the radiation emitted by the signal line 220 passes through the gap. The probability of passing through is small. Therefore, the existence of the gap has a small impact on the radiation of the signal line 220 interfering with other transmission lines.
  • the window 204 is not closed by the printed circuit board 110.
  • the positional relationship between the shielding cover 210 and the signal line 220 can be set to reduce the radiation in the signal line 220 from overflowing from the window 204 and reduce the interference of the signal line 220 to the transmission lines outside the accommodation space 201 .
  • Figure 13c is a cross-sectional view of the shield case 210 and the printed circuit board 110 with the window 204 not closed by the printed circuit board 110.
  • the minimum distance between the shielding cover 210 and the signal line 220 is d1
  • the distance between the plane where the window 204 is located and the signal line 220 is d2.
  • the proportion of radiation from the signal line 220 that overflows outside the shielding cover 210 is less than one thousandth. In this way, even if the window 204 is not closed by the printed circuit board 110, the signal line 220 has no impact on the accommodation space.
  • the interference of transmission lines outside 201 is also limited, which can meet the interference control requirements of most industrial electronic products and consumer electronic products.
  • Figure 13d is another connection structure diagram of the shielding cover 210 and the printed circuit board 110 in Figure 8b.
  • the surface of the baffle 205 of the shielding case 210 is connected to the printed circuit board 110 .
  • the window 204 of the shield 210 faces the printed circuit board 110 .
  • the printed circuit board 110 can block the window 204 to prevent the radiation of the signal line 220 from overflowing from the window 204 and interfering with adjacent transmission lines.
  • the embodiment of the present application does not limit the connection structure between the shielding cover 210 and the printed circuit board 110 in other examples.
  • the first opening 202 and the second opening 203 can both be facing away from the printed circuit board 110.
  • the surface area of the shield case 210 connected to the printed circuit board 110 is large, and there are many parts to choose from.
  • the plane of the first opening 202 and the second opening 203 is adjacent to the surface of the shielding cover 210 connected to the printed circuit board 110, which will not be described again here.
  • the first opening 202 and the second opening 203 can both face the printed circuit board 110.
  • the first opening 202 and the second opening 203 are both closed by the printed circuit board 110 , which can reduce the radiation of the signal line 220 from overflowing from the first opening 202 and the second opening 203 .
  • connection structure of the shielding cover 210 and the printed circuit board 110 in other examples is the same and will not be described again here.
  • the embodiment of the present application does not limit the connection methods between the shielding case 210 and the printed circuit board 110 and the signal lines 220 and the printed circuit board 110.
  • the shielding case 210 and the printed circuit board 110 are welded through a surface mounting process.
  • the signal line 220 and the printed circuit board 110 are soldered through a surface mounting process.
  • SMC surface mount process welding
  • connection method between the shielding case 210 and the printed circuit board 110 is not limited to surface mounting process welding, and may be directly welded through pins, for example.
  • the end surface of the first end 221 of the signal line 220 , the end surface of the second end 222 of the signal line 220 , and the shielding cover 210 are connected to the printed circuit board 110 At least two surfaces of the end face are coplanar.
  • the surface mounting process can mount more than two surfaces at the same time, shortening the connection time and reducing the connection cost.
  • the remaining surface can be soldered.
  • the embodiment of the present application does not limit the size and shape of the surface C.
  • the entire surface of the shielding cover 210 is used to connect with the printed circuit board 110 .
  • surface C may only occupy a portion of the surface of shield 210 facing printed circuit board 110 .
  • surface C can be a continuous surface or multiple non-connected surfaces. The remaining surfaces can be set according to the shape of the shielding cover 210.
  • the aforementioned coplanar surfaces may be formed when the transmission line assembly 200 is completed, or may be formed before the transmission line assembly 200 is connected to the printed circuit board 110 form.
  • the surface mount process is used for soldering, after the transmission line assembly 200 is prepared, it satisfies the condition that at least two surfaces of surface A, surface B and surface C are coplanar.
  • the transmission line assembly 200 may be subjected to secondary processing before being connected to the printed circuit board 110 to make it meet the aforementioned conditions.
  • the embodiment of the present application does not limit the relative positional relationship between the signal line 220 and the printed circuit board 110 .
  • the width direction of the signal line 220 may be consistent with the printed pattern.
  • the surface of the circuit board 110 is parallel, or the height direction of the signal line 220 may be parallel to the surface of the printed circuit board 110 .
  • the size of the signal line 220 along the width direction is L
  • the size of the signal line 220 along the height direction is H.
  • the width L of the signal line 220 is smaller than the height H.
  • the width L of the signal line 220 is greater than the height H. In this way, the size of the printed circuit board assembly 100 along the height direction of the signal line 220 can be reduced.
  • FIG. 14a and FIG. 14b are only examples of a shielding cover 210. It can be understood that the shielding cover 210 with other structures in Example 1 is the same and will not be described again here.
  • the loss per unit length of the transmission line assembly 200 is comparable to that of a coaxial cable, about 50% of that of an ordinary microstrip line. Therefore, the selected material of the printed circuit board assembly 100 can Not limited to low-loss RF boards, which helps reduce costs.
  • the structural design of the shielding cover 210 such as the aforementioned window 204 and bending structure 208, the weight of the printed circuit board assembly 100 can be reduced, which is beneficial to increasing the integration level.
  • the transmission line assembly 200 is connected to the printed circuit board 110 by soldering using a surface mounting process, it is greatly helpful to shorten the process flow of the printed circuit board assembly 100, satisfying integration while reducing manufacturing costs.
  • the electrical performance of the printed circuit board assembly 100 is improved, the electrical performance of the electronic device 10 is also improved.
  • the high integration level of the printed circuit board assembly 100 is beneficial to making the electronic device 10 thinner and lighter.
  • the cost of the electronic device 10 will be reduced due to the reduced cost of the printed circuit board assembly 100 .

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

一种传输线组件、印制电路板组件、电子设备，涉及印制电路板技术领域，解决了信号线的信号损耗大的问题。传输线组件包括屏蔽罩和信号线；屏蔽罩与接地端连接；该屏蔽罩具有容纳空间，该容纳空间设有第一开口和第二开口；该信号线包括相对设置的第一端和第二端；该信号线穿设于该容纳空间，且该信号线与该容纳空间的内侧壁具有间隙；该第一端穿过该第一开口，该第二端穿过该第二开口，信号线的第一端和第二端中的至少一端用于与信号端连接。由于信号线处于空气介质中，有效改善信号损耗。屏蔽罩对信号线的包裹可以避免信号线辐射溢出干扰其他传输线。屏蔽罩和信号线与印制电路板通过表面贴装工艺焊接，可以降低工艺成本和工艺时间。

Description

传输线组件、印制电路板组件、电子设备
本申请要求于2022年07月29日提交国家知识产权局、申请号为202210906236.6、申请名称为“传输线组件、印制电路板组件、电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请实施例涉及印制电路板技术领域，尤其涉及一种传输线组件、印制电路板组件、电子设备。
背景技术
传输线是电子设备中最常用的一种电路结构，用于将射频信号从一点传送到另一点。如图1a～图1g所示，常用的传输线包括：微带线(microstrip line)01、接地共面波导(grounded coplanar waveguide，GCPW)02、带状线(Stripline)03、共面波导(coplanar wave guide，CPW)04、矩形波导05、双绞线06、同轴电缆07等。其中，矩形波导05、同轴电缆07、双绞线06具有低损耗特性，但是不能直接集成到印制电路板(printed circuit board，PCB)上或芯片内部。微带线01、带状线03、接地共面波导02、共面波导04具有集成度高的优势，但是其损耗大。
为了减小损耗，现有技术主要从材料和结构两方面着手。
例如，改变介质材料的微观分子结构以降低介质的损耗。但是材料制备成本高，还可能出现结构强度低、阻燃效果差、抗腐蚀能力弱等衍生问题。
以共面波导04为例，图2a为单层共面波导04的结构示意图，如图2a所示，信号线041与地线042位于介质印制电路板043同一面，信号线041与地线042正对面积小，信号线041阻抗较高，另外受趋肤效应影响，电流分布集中在信号线041边缘，电流分布区域小导致损耗加大。
图2b为单层带参考地的共面波导04的结构示意图，如图2b所示，介质印制电路板043的一面设置信号线041与地线042。介质印制电路板043的另一面设置参考地044。可以增强信号线041和临近其他传输线的隔离，但是其损耗仍然较大。
图2c为双层共面波导的结构示意图，如图2c所示，介质印制电路板043两侧均分布有信号线041与地线042，两侧的信号线041通过金属化过孔045连接，两侧的地线042通过金属化过孔045连接。
图2d为具有开槽的双层共面波导的结构示意图，图2d与图2c的区别在于，介质印制电路板043设有槽046，减小介质材料用量。
图2c与图2d均在接地平面上开槽，破坏了地平面的完整性，导致信号线041封闭性差，容易产生对外辐射或干扰其它邻近信号线。
如此，如何降低信号线的信号损耗仍然是电路结构必须要解决的问题。
发明内容
本申请实施例提供一种传输线组件、印制电路板组件、电子设备，改善信号传输线的信号损耗大的问题。
为达到上述目的，本申请采用如下技术方案：
第一方面，提供一种传输线组件，用于与印制电路板连接；该印制电路板的表面设有信号端和接地端；该传输线组件包括屏蔽罩和信号线；该屏蔽罩用于与该接地端连接；该屏蔽罩具有容纳空间，该容纳空间设有第一开口和第二开口；该信号线包括相对设置的第一端和第二端；该信号线穿设于该容纳空间，且该信号线与该容纳空间的内侧壁具有间隙；该第一端穿过该第一开口，该第二端穿过该第二开口，第一端和该第二端中的至少一端用于与该信号端连接。由此，大部分信号线处于空气介质中，与处于介质层中相比，空气介质能有效改善信号损耗。此外，信号线穿设于屏蔽罩的容纳空间，屏蔽罩可以避免信号线的辐射外溢而对其他传输线干扰，同样，屏蔽罩也可以避免其他传输线对信号线的干扰。
结合第一方面，在一些可实现的方式中，该传输线组件还包括：绝缘件，该绝缘件设置在该间隙中，该绝缘件的内侧壁与该信号线抵接，该绝缘件的外侧壁与该容纳空间的内侧壁抵接。由此，绝缘件可以使信号线和屏蔽罩绝缘，避免信号线与屏蔽罩电连接。
结合第一方面，在一些可实现的方式中，该绝缘件为开环结构。由此，可以减小绝缘件材料的使用，减小对信号线电磁能量的转化，降低损耗。
结合第一方面，在一些可实现的方式中，该绝缘件为闭环结构。由此，绝缘件可以避免信号线与屏蔽罩的电连接。
结合第一方面，在一些可实现的方式中，该第一开口位于该屏蔽罩的端部。由此，信号线的第一端在容纳空间内可以不设置拐角，降低屏蔽罩的体积，增加印制电路板的集成度。
结合第一方面，在一些可实现的方式中，该第二开口位于该屏蔽罩的端部。由此，信号线的第二端在容纳空间内可以不设置拐角，有利于降低屏蔽罩的尺寸。
结合第一方面，在一些可实现的方式中，该容纳空间还设有窗口，该窗口位于该屏蔽罩的两端之间。由此，窗口的存在可以降低屏蔽罩的重量，节约屏蔽罩材料成本和工艺成本的同时，有效增加印制电路板的集成度。
结合第一方面，在一些可实现的方式中，该窗口从该第一开口的边缘延伸至该第二开口的边缘。由此，有利于降低屏蔽罩的制造成本。
结合第一方面，在一些可实现的方式中，该窗口所在平面至该信号线的距离大于该信号线至该容纳空间内侧壁的最小距离。如此，信号线对外辐射信号能力的占比可以控制到千分之一以下。
结合第一方面，在一些可实现的方式中，该信号线为多根，一个该容纳空间内具有多根间隔分布的该信号线。由此，能充分利用空间，降低印制电路板的体积。
结合第一方面，在一些可实现的方式中，述屏蔽罩的横截面包括折弯结构；该横截面与该信号线的延伸方向垂直；该折弯结构围设成多个折弯区，一个该折弯区穿设有至少一根信号线。由此，折弯结构的折弯区对信号线的信号具有阻挡作用，相邻信号线之间的相互干扰被削弱。
结合第一方面，在一些可实现的方式中，该屏蔽罩包括多个子罩体，多个子罩体沿该信号线的延伸路径间隔分布。由此，多个子罩体分布组成的屏蔽罩可以节约制造成本。此外，在装配过程中，可对子罩体的位置以及方向进行调整，可以适用更多形式的的信号线延伸路径。
结合第一方面，在一些可实现的方式中，该信号线还包括第三端，该第三端位于该第一端和该第二端之间，该容纳空间设有第三开口；该第三端穿过该第三开口；该第一端、该第二端以及该第三端中的至少一端用于与该信号端连接。由此，可以为中部具有信号支路的信号线提供屏蔽，例如功分器，且信号线处于空气介质中，降低信号线的信号损失。
结合第一方面，在一些可实现的方式中，该第一端的端面、该第二端的端面以及该屏蔽罩用于与该接地端连接的端面中，至少两个端面共面。由此，当采用表面贴装工艺连接传输线组件和印制电路板时，同时连接两个表面以上可以降低工艺成本和工艺时间。
第二方面，提供一种印制电路板组件，该印制电路板组件包括：印制电路板以及第一方面提供的任一种传输线组件；该印制电路板的表面设有信号端和接地端；该屏蔽罩与该接地端连接，该第一端和该第二端中的至少一端与该信号端连接。由于传输线组件的信号损耗小，印制电路板的选材料可以不局限于低损耗射频板材，有利于降低成本。
结合第二方面，在一些可实现的方式中，该第一开口、该第二开口均面向该印制电路板。由此，印制电路板可以封堵第一开口和第二开口，避免信号线的辐射从第一开口和第二开口溢出，而对其他传输线造成干扰。
结合第二方面，在一些可实现的方式中，该屏蔽罩的窗口面向该印制电路板。由此，印制电路板可以封堵窗口，可以避免信号线的辐射从窗口溢出，而对其他传输线造成干扰。
结合第二方面，在一些可实现的方式中，该屏蔽罩的窗口背离该印制电路板。由此，信号线内的辐射从屏蔽罩与接地端之间的缝隙泄露的概率较小，该辐射对相邻传输线的影响较小。
结合第二方面，在一些可实现的方式中，该屏蔽罩与该接地端通过表面贴装工艺焊接。由此，可缩短印制电路板的工艺流程，降低制造成本。
结合第二方面，在一些可实现的方式中，该第一端和/或第二端与第一信号端通过表面贴装工艺焊接。由此，可缩短印制电路板的工艺流程，降低制造成本。
第三方面，提供一种电子设备，电子设备包括壳体以及第二方面提供的任一种印制电路板组件，该印制电路板组件位于该壳体内。由于印制电路板组件电性能提升，电子设备的电性能随之提升。印制电路板的高集成度有利于电子设备的轻薄化。
附图说明
图1a为微带线的结构示意图。
图1b为接地共面波导的结构示意图。
图1c为带状线的结构示意图。
图1d为共面波导的结构示意图。
图1e为矩形波导的结构示意图。
图1f为双绞线的结构示意图。
图1g为同轴电缆的结构示意图。
图2a为单层共面波导的结构示意图。
图2b为单层带参考地的共面波导的结构示意图。
图2c为双层共面波导的结构示意图。
图2d为具有开槽的双层共面波导的结构示意图。
图3为电子设备的结构示意图。
图4为微带线电场分布示意图。
图5a为本申请实施例提供的印制电路板组件的结构示意图。
图5b为本申请实施例提供的印制电路板和信号线的结构示意图。
图6a为本申请实施例提供的传输线组件的结构示意图。
图6b为本申请实施例提供的传输线组件的一种截面图。
图6c为本申请实施例提供的传输线组件的又一种截面图。
图6d为本申请实施例提供的传输线组件的另一种截面图。
图7a为示例一中第一种屏蔽罩与信号线的结构示意图。
图7b为示例一中第二种屏蔽罩与信号线的结构示意图。
图7c为示例一中第三种屏蔽罩与信号线的结构示意图。
图8a为示例一中第四种屏蔽罩与信号线的结构示意图。
图8b为示例一中第五种屏蔽罩与信号线的结构示意图。
图9为示例一中屏蔽罩和多个信号线的一种结构示意图。
图10a为示例一中第六种屏蔽罩与信号线的结构示意图。
图10b为示例一中第六种屏蔽罩的一实施例的截面图。
图10c为示例一中第六种屏蔽罩的又一实施例的截面图。
图10d为示例一中第七种的屏蔽罩与信号线的结构示意图。
图10e为示例一中第七种屏蔽罩的一实施例的截面图。
图10f为示例一中第七种屏蔽罩的又一实施例的截面图。
图10g为示例一中第七种屏蔽罩的另一实施例的截面图。
图10h为示例一中第七种屏蔽罩的再一实施例结构示意图。
图11为本申请示例二提供的屏蔽罩与信号线的结构示意图。
图12为本申请示例三提供的屏蔽罩与信号线的结构示意图。
图13a为图8b中屏蔽罩与印制电路板的一种连接结构图。
图13b为图8b中屏蔽罩与印制电路板的又一种连接结构图。
图13c为窗口未被印制电路板封闭的屏蔽罩与印制电路板的截面示意图。
图13d为图8b中屏蔽罩与印制电路板的又一种连接结构图。
图13e为图7b提供的屏蔽罩的表面结构示意图。
图14a为具有窗口的屏蔽罩与印制电路板的一种连接结构图。
图14b为具有窗口的屏蔽罩与印制电路板的又一种连接结构图。
图中：01-微带线；02-接地共面波导；03-带状线；04-共面波导；041-信号线；042-地线；043-介质印制电路板；044-参考地；045-金属化过孔；046-槽；05-矩形波导；06-双绞线；07-同轴电缆；05-矩形波导；06-双绞线；07-同轴电缆；10-电子设备；11-盖板；12-显示屏；13-中框；14-边框；15-承载板；17-后壳；100-印制电路板组件；101-空腔；110-印制电路板；111-第一信号端；112-第二信号端；113-接地端；120-芯片；150-信号连接件；160-接地电连接件；200-传输线组件；201-容纳空间；202-第一开口；203-第二开口；204-窗口；205-挡板；206-第三开口；207-折弯区；208-折弯结构；210-屏蔽罩；211-子罩体；212-电连接件；220-信号线；221-第一端；222-第二端；223-第三端；230-绝缘件。
具体实施方式
为了使本申请的目的、技术方案和优点更加清楚，下面将结合附图对本申请作进一步地详细描述。
以下，术语“第一”、“第二”等仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”等的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中，除非另有说明，“多个”的含义是两个或两个以上。
此外，本申请中，“上”、“下”等方位术语是相对于附图中的部件示意置放的方位来定义的，应当理解到，这些方向性术语是相对的概念，它们用于相对于的描述和澄清，其可以根据附图中部件所放置的方位的变化而相应地发生变化。
本申请的实施例提供一种电子设备，该电子设备例如可以为手机(mobile phone)、平板电脑(pad)、个人数字助理(personal digital assistant，PDA)、电视、智能穿戴产品(例如，智能手表、智能手环)、虚拟现实(virtual reality，VR)终端设备、增强现实(augmented reality，AR)终端设备、充电家用小型电器(例如豆浆机、扫地机器人)、无人机、雷达、航空航天设备和车载设备等不同类型的用户设备或者终端设备，本申请实施例对电子设备的具体形式不作特殊限制。
以下为了方便说明，以电子设备为手机为例进行举例说明。如图3所示，电子设备10主要包括盖板11、显示屏12、中框13以及后壳17。后壳17和显示屏12分别位于中框13的两侧，且中框13和显示屏12设置于后壳17内，盖板11设置在显示屏12远离中框13的一侧，显示屏12的显示面朝向盖板11。
上述中框13包括承载板15以及绕承载板15一周的边框14。电子设备10中的印制电路板组件100(printed circuit board，PCB)、电池、摄像头等电子元器件可以设置在承载板15上。
印制电路板组件100板作用之一集成电子设备10的电子元器件，例如，实现芯片之间的互连。电子元器件之间的连接主要通过传输线实现。
前述的传输线例如为微带线。图4为微带线电场分布示意图，图4中H为磁场强度，E为电场强度。图4中可以看出，在信号传输过程中，大部分电场分布在介质中，由于介质的分子会在交变电场的作用下产生振动，将部分电磁能量转化为热能，从而导致传输线输出点的信号能量减少，形成损耗。且印制电路板的集成度越高，损耗越大。
由此，本申请实施例提供一种印制电路板，旨在降低传输线的损耗。
图5a为本申请实施例提供的印制电路板组件100的结构示意图，请参阅图5a，印制电路板组件100包括印制电路板110、芯片120以及传输线组件200。芯片120以及传输线组件200均位于印制电路板110的同一表面。
需要说明的是，在本申请的其他实施例中，图5a中芯片120位置处的结构可以为其他用电器件，不限于芯片120，本实施例以芯片作为示例进行描述。
传输线组件200的至少一端与印制电路板110的表面的信号端连接。例如，传输线组件200的两端均可以与印制电路板110的表面的信号端连接，或者，传输线组件200的一端与印制电路板110的表面的信号端连接，另一端与印制电路板110外的传输线(例如线缆)连接。
同理，在传输线组件200具有多个支路的实施例中，传输线组件200的至少一端与印 制电路板110的表面的信号端连接。
在本申请的实施例中，如图5a所示，以传输线组件200的每个端均与印制电路板110的表面的信号端连接作为示例进行描述。
印制电路板110的表面设有第一信号端111、第二信号端112和接地端113。
第一信号端111、第二信号端112分别与不同芯片120的信号焊盘连接，芯片120的接地焊盘与接地端113连接。
本申请实施例对芯片120的数量不做限制，例如，芯片120可以为两个、三个、四个或者更多个，可以根据印制电路板组件100的功能进行设置。
传输线组件200连接第一信号端111和第二信号端112，使多个芯片120通过传输线组件200互连。
请再次参阅图5a，印制电路板组件100还包括多个信号连接件150以及多个接地电连接件160，信号连接件150和接地电连接件160均贯穿印制电路板110相对的两个表面。
第一信号端111、第二信号端112均与信号连接件150连接，信号连接件150远离第一信号端111的一端可以与电子设备10中的其他部件连接，例如与显示屏12连接。
接地电连接件160与接地端113连接。接地电连接件160远离接地端113的一端接地。
传输线组件200是影响芯片120的信号损耗的重要因素。为此，本申请实施例提供一种可以降低信号损耗的传输线组件200。
图6a为本申请实施例提供的传输线组件200的结构示意图，请参阅图6a，传输线组件200包括屏蔽罩210和信号线220。
请一并参阅图5a与图6a，屏蔽罩210与接地端113连接。由此，屏蔽罩210便通过接地端113与接地电连接件160连接。
信号线220相对的两端分别与第一信号端111、第二信号端112连接。由此，不同芯片120的信号焊盘便通过信号线220实现互连。
其中，屏蔽罩210具有容纳空间201，信号线220穿设于容纳空间201，且信号线220和屏蔽罩210的内侧壁具有间隙。
图5b为本申请实施例提供的印制电路板110与信号线220的结构示意图，信号线220与印制电路板110之间存在间隙。大部分信号线220处于空气中。
由此，大部分信号线220处于空气中，与处于介质层中相比，空气能有效改善信号损耗。此外，信号线220位于屏蔽罩210的容纳空间201内，屏蔽罩210可以避免信号线220的辐射外溢而对其他传输线干扰，同样，屏蔽罩210也可以避免其他传输线对信号线220的干扰。
图6a中，传输线组件200还包括绝缘件230。绝缘件230设置在信号线220和屏蔽罩210之间的间隙中。绝缘件230的内侧壁与信号线220抵接，绝缘件230的外侧壁与信号线220抵接。前述的抵接包括相互连接、接触但不连接等连接方式。例如，绝缘件230的内侧壁与信号线220接触但未连接，或者，绝缘件230的内侧壁与信号线220连接。由此，绝缘件230可以使信号线220、屏蔽罩210之间绝缘，避免信号线220与屏蔽罩210连接。
本申请实施例对绝缘件230的结构不做限制，如图6b所示，绝缘件230为开环结构。例如，在垂直于信号线220的延伸方向的截面上该开环结构的绝缘件230包围信号线220，并具有一处或多处缺口。由此，可以减小绝缘件230材料的使用，减小对信号线220电磁 能量的转化，降低损耗。
或者，在本申请的其他实施例中，如图6c所示，绝缘件230为闭环结构。示例性地，在垂直于信号线220的延伸方向的截面上该开环结构的绝缘件230首尾相连。例如，绝缘件230为椭圆环，绝缘件230与屏蔽罩210卡接。如此，绝缘件230可以避免屏蔽罩210塌陷等原因与信号线220连接，导致电路短路。
在本申请的一些实施例中，如图6d所示，绝缘件230内部具有空腔101，空腔101有利于降低230的重量，且在绝缘件230为弹性材料的实施例中，空腔101可以增加绝缘件230的形变空间，使绝缘件230与信号线220之间的抵接更稳定。
在本申请的实施例中，绝缘件230的形状不仅限于图6b、图6c、图6d所示的形状。绝缘件230的外侧形状可以根据容纳空间201内侧壁的形状而设置，使二者匹配。绝缘件230的内侧形状可以根据信号线220的形状而设置，使二者匹配。
本申请对绝缘件230的数量不做限制，例如，绝缘件230的数量可以为一个、两个、三个或者更多个，在绝缘件230为多个的实施例中，多个绝缘件230沿信号线220的延伸方向间隔分布。
绝缘件230的数量较少，可以减小传输线组件200的生产成本以及降低传输线组件200的重量。绝缘件230的数量较多，可以降低因屏蔽罩210塌陷而使电路短路的风险。
在一些实施例中，可以不设置绝缘件230，例如，通过信号线220的第一端221和第二端222的支撑，可以使信号线220与屏蔽罩210之间有间隙，使二者绝缘。
请再次参阅图6a，在本申请的实施例中，信号线220包括第一端221和第二端222，第一端221和第二端222相对设置。第一端221与第一信号端111连接，第二端222与第二信号端112连接。
本申请实施例对信号线220的延伸路径不做限制，信号线220的延伸路径根据芯片120互连线的轨迹进行设置。
示例性地，信号线220的延伸路径为曲线或者具有拐点的多直线，或者，信号线220的延伸路径为直线，或者，信号线220的延伸路径具有多个分支线。
本申请实施例对屏蔽罩210的延伸路径不做限制，屏蔽罩210的延伸路径与信号线220的延伸路径相同。
在本申请的实施例中，为了便于描述，命名屏蔽罩210的延伸方向为第一方向X，命名与屏蔽罩210的延伸方向垂直的方向为第二方向Y。第一方向X与印制电路板110所在平面平行。
对于屏蔽罩210的延伸路径为曲线的实施例而言，屏蔽罩210某一部位的延伸方向与该部位的延伸路径垂直。
本申请实施例对屏蔽罩210的外形以及容纳空间201的形状均不做限制，例如，屏蔽罩210的外形可以为圆柱形、棱柱形或者其他不规则形状，容纳空间201同样可以是圆柱形、棱柱形或者其他不规则形状等。
本申请实施例对屏蔽罩210的材料不做限制，示例性地，屏蔽罩210的材料例如可以为钣金、型材等。
本申请实施例对屏蔽罩210的成型工艺不做限制，示例性地，屏蔽罩210例如可以采用压铸成型或者拉拔成型的工艺制成。
图6a中，屏蔽罩210的容纳空间201设有第一开口202和第二开口203。第一端221穿过第一开口202，第二端222穿过第二开口203。
本申请实施例对第一开口202的位置不做限制，示例性地，第一开口202位于屏蔽罩210的端部，如此，第一开口202的朝向为第一方向X。或者，第一开口202位于屏蔽罩210的两端之间，如此，第一开口202的朝向为第二方向Y。
同理，本申请实施例对第二开口203的位置不做限制，示例性地，第二开口203位于屏蔽罩210的端部，或者，第二开口203位于屏蔽罩210的两端之间。
在一些实施例中，容纳空间201还具有窗口204，窗口204位于屏蔽罩210沿第一方向X的两端之间。由此，可以降低屏蔽罩210的重量，节约材料的同时降低印制电路板组件100的重量。
本申请实施例对窗口204的形状不做限制，例如，图6a中，窗口204为长方形。可以理解的是，在本申请的其他实施例中，窗口204的形状可以为腰形、椭圆形、圆形等。
由于屏蔽罩210的形状与信号线220的形状相关，一下就适用不同形状信号线220的屏蔽罩210作为示例进行描述。
示例一
信号线220为直线，换言之，信号线220的延伸路径为直线。
图7a为示例一中第一种屏蔽罩210与信号线220的结构示意图，请参阅图7a，第一开口202和第二开口203分别位于屏蔽罩210沿第一方向X相对的两端，如此，信号线220在容纳空间201内可以不设置拐角，降低屏蔽罩210的体积，增加印制电路板组件100的集成度。
图7b为示例一中第二种屏蔽罩210与信号线220的结构示意图，图7b中，第一开口202开设于屏蔽罩210沿第一方向X的两端之间，第二开口203开设于屏蔽罩210沿第一方向X的两端之间。换言之，第一开口202和第二开口203均朝向第二方向Y开设。
如此，即便信号线220有部分辐射从第一开口202和第二开口203外溢，朝向第一方向X的辐射较少，对相邻的其他传输线的干扰较小。
在一些实施例中，为了尽可能地增加屏蔽罩210的利用空间，第一开口202可以尽可能地接近屏蔽罩210的一端，第二开口203可以尽可能地接近屏蔽罩210的另一端。如此，位于容纳空间201内的信号线220沿第一方向X的长度与屏蔽罩210沿第一方向X的长度更接近，可以充分利用屏蔽罩210，减小容纳空间201的浪费，提高印制电路板组件100的集成度。
在本申请的实施例中，第一开口202与第二开口203的开设方向不仅限于相同。
例如，图7c为示例一中第三种屏蔽罩210与信号线220的结构示意图，请参阅图7c，第二开口203位于屏蔽罩210沿第一方向X的端部，第一开口202位于屏蔽罩210沿第一方向X的两端之间。换言之，第二开口203的开设方向为第一方向X，第一开口202的开设方向为第二方向Y。
相应地，在一些实施例中，第一开口202的开设方向为第二方向Y，第二开口203的开设方向为第一方向X。
由此，可以根据印制电路板组件100上的接地端113的位置、第一信号端111的位置、第二信号端112的位置以及屏蔽罩210沿第一方向X的长度选择第一开口202的开设方向 和第二开口203的开设方向。
图7a～图7c中，屏蔽罩210围设于信号线220的四周，因此，对信号线220的辐射屏蔽能力较佳。
承上所述，在本申请的一些示例中，屏蔽罩210还设有窗口204，本申请实施例对窗口204的设置方式不做限制。
图8a为示例一中第四种屏蔽罩210与信号线220的结构示意图，请参阅图8a与图7a，第四种屏蔽罩210与图7a的区别在于具有窗口204。
本申请实施例对窗口204沿第一方向X的长度不做限制。例如，图8a中，窗口204从第一开口202边缘延伸至第二开口203的边缘。
由此，窗口204的设置，可以降低屏蔽罩210的质量，降低传输线组件200的重量，有效增加印制电路板组件100的集成度。此外，图8a所示的屏蔽罩210可以通过薄板折弯形成，节约屏蔽罩210材料成本和工艺成本。
本示例对窗口204的宽度不做限制，例如，图8a中，窗口204从屏蔽罩210的一侧延伸至相对的另一侧，由此，屏蔽罩210在窗口204所在平面的投影均位于窗口204的区域内，如此，可以减小屏蔽罩210的重量。
图8b为示例一中第五种屏蔽罩210与信号线220的结构示意图，其与图7a的主要区别在于窗口204的位置不同。
在图8b中，屏蔽罩210设置窗口204的一面具有挡板205，窗口204从第一开口202延伸至第二开口203，窗口204与挡板205共面。
图8b中屏蔽罩210具有两个挡板205，两个挡板205位于窗口204相对的两侧。可以理解的是，在其他实施例中，屏蔽罩210可以仅具有一个挡板205，该挡板205与屏蔽罩210的一侧连接。
窗口204由挡板205围设形成，窗口204的形状与挡板205相关。本申请实施例不限制窗口204的形状，可以是直线型、波浪形、折线形等。
在图8b中，挡板205可以用于与其他部件连接，例如与印制电路板连接。
同理，图7c所示的屏蔽罩210也可以设置图8a或者图8b所示的窗口204。此处不再赘述。
第一开口202、第二开口203、窗口204的开设方向相互不关联，三者的开设方向可独立选择。
请一并参阅图7a～图7c、图8a～图8b，可以看出，屏蔽罩210穿设一根信号线。
在印制电路板组件100的线路设计中，可能存在多条信号线220路径相同而并行的情况。为了进一步降低多条信号线220并行的示例中传输线组件200占用的空间，在本申请的一些实施例中，屏蔽罩210内可以穿设多个信号线220。
在一些实施例中，如图9所示，通过调整屏蔽罩210与信号线220的尺寸比例，容纳空间201可供两根及以上的信号线220穿过，两根信号线220独立设置。如此，屏蔽罩210可以为多根信号线220提供屏蔽作用。能充分利用空间，降低印制电路板组件100的体积，为电子设备10的轻薄化做贡献。
同理，图7b～图7c、图8a～图8b中的屏蔽罩210可以参阅图9所示结构，穿设多个信号线220，此处不再赘述。
在一些实施例中，为了避免信号线220之间相互接触导致短路，两根信号线220之间可以设置绝缘件230，换言之，绝缘件230的至少部分位于两根信号线220之间。
进一步地，为了降低屏蔽罩210内多跟信号线220之间的相互干扰，在一些实施例中，对屏蔽罩210内部的容纳空间201进行分隔。
图10a为示例一中第六种屏蔽罩210与信号线220的结构示意图，请参阅图10a，容纳空间201被分隔为多个区域。
图10b为第六种屏蔽罩另一视角的结构示意图，请参阅图10b和图10a，屏蔽罩210的横截面包括折弯结构208，折弯结构208围设成多个折弯区207，一个折弯区207穿设有至少一根信号线220。
前述的横截面与第一方向X垂直。
本申请实施例对折弯区207的数量不做限制，例如，图10b中，折弯区207的数量为三个，或者，图10c中，折弯区207的数量为两个。
本申请实施例对一个折弯区207内穿设的信号线220不做限制，例如，一个折弯区207内穿设一根、两根或者更多信号线220。
可选地，折弯结构208围设的折弯区207可以仅部分穿设信号线220。换言之，在折弯区207具有多个的实施例中，可以每个折弯区207均穿设信号线220，或者，可以仅部分折弯区207穿设信号线220，余下部分折弯区207不穿设信号线220。
图10b中，折弯结构208的折弯区207对信号线220的信号具有阻挡作用，如此，位于同一容纳空间201内信号线220之间的相互干扰被削弱。示例性地，相邻的两个信号线220在其正对的方向上被折弯区207遮挡。
图10b中，折弯结构208为多个依次连接的圆弧结构，大致为w形。折弯区207分布于折弯结构208的一侧。
图10b中，相邻两个折弯区207相互连通。
横截面包括折弯结构208的屏蔽罩210的形状不限于图10b所示的结构。
例如，图10d为示例一中第七种的屏蔽罩210与信号线220的结构示意图，请参阅图10d，容纳空间201被分隔为多个区域。
图10e示例与图10b示例的主要区别在于折弯结构208，其余结构请参阅图10b示例的相关描述，此处不再赘述。
图10e中，折弯区207分布于折弯结构208相对的两侧。
图10e中，折弯结构208为多个依次连接的方形结构，折弯结构208围设成多个折弯区207，相邻两个折弯区207相互独立。换言之，沿第二方向Y，相邻两个折弯区207不连通。
如此，图10d中，折弯结构208可以较好地屏蔽位于不同折弯区207内信号线220之间的干扰。降低信号线220之间的干扰。
同理，本申请实施例对折弯区207的数量不做限制，例如，图10e中，折弯区207的数量为四个，或者，图10f中，折弯区207的数量为两个。
请一并参阅图10a～图10d，可以理解的是，在本申请的其他实施例中，折弯结构208不限于图10c与图10d所示的形状。例如，可以为“日”形、“目”形、“田”形等。
在一些实施例中，屏蔽罩210还可以包括围设于折弯结构208外周的壳体。换言之， 屏蔽罩210横截面可以仅包括折弯结构208，屏蔽罩210横截面还可以包括围设于折弯结构208外周的壳体等等。
例如，屏蔽罩210还可以包括图10g所示的折弯结构208，如此，屏蔽罩210的屏蔽效果更优。
例如，屏蔽罩210还可以包括图10h所示的折弯结构208，如此，屏蔽罩210的重量较小，且折弯结构208可以降低屏蔽罩210内信号线220之间的相互干扰。
示例一种，屏蔽罩210的延伸路径为直线。由于印制电路板110表面的面积有限，在一些实施例中，信号线220的延伸路径可能会存在转角、弯折等现象。如此，屏蔽罩210的延伸路径可能为曲线、具有多个拐点的直线等。
因此，为了降低延伸路径为曲线或者具有多个拐点的直线的屏蔽罩210的制造成本，本申请实施例还提供示例二所示的屏蔽罩210。
示例二
信号线220为折线或者曲线。
图11为本申请示例二提供的屏蔽罩210与信号线220的结构示意图，请参阅图11，屏蔽罩210包括两个子罩体211，两个子罩体211相互连接，两个子罩体211沿信号线220的延伸路径间隔分布。
其中，每个子罩体211均具有供信号线220穿过的开口。
本申请实施例对子罩体211形状不做限制，子罩体211的形状可以参照示例一中屏蔽罩210的形状，此处不再赘述。
本申请实施例对子罩体211的长度不做限制，子罩体211的长度与信号线220相邻两个拐点之间的距离有关，可以根据该距离进行设置。
本申请实施例对子罩体211的数量不做限制，可以根据信号线220拐点的数量进行设置。
本申请实施例对子罩体211之间的连接方式不做限制，例如，可以通过电连接件212连接。电连接件212具有连接相邻两个子罩体211的作用，此外，电连接件212还兼顾降低信号线220拐点位置处的信号外溢的作用。
本申请对电连接件212的结构不做限制，示例性地，电连接件212可以为铜箔等。
可以理解的是，在本申请的其他实施例中，可以不设置上述电连接件212。例如，相邻两个子罩体211不连接，相互独立。
由此，在信号线220的延伸路径为曲线或者具有多个拐点的直线的实施例中，与一体的屏蔽罩210相比，多个子罩体211分布组成的屏蔽罩210可以节约制造成本。此外，在装配过程中，可对子罩体211的位置以及方向进行调整，可以适用更多形式的信号线220延伸路径。
在示例一和示例二中，信号线220均具有两个支路，即第一端221和第二端222。在一些应用场景下，信号线220的支路不限于两个，即信号线220的传输端不仅限于信号线220的两端。例如，功分器就需要在信号线220的中部引出信号分配支路。
由此，本申请示例三提供一种屏蔽罩210，其可适用于具有多个分配支路的信号线220。
示例三
信号线220的第一端221与第二端222之间还具有分支，例如还具有第三端。
图12为本申请示例三提供的屏蔽罩210与信号线220的结构示意图，请参阅图12，信号线220还包括第三端223，第三端223位于第三开口206外。屏蔽罩210的容纳空间201还设置有第三开口206。
信号线220的第三端223位于第一端221与第二端222之间。信号线220的第三端223与印制电路板110的第三信号端连接。
如此，传输线组件200可以为具有三个支路的信号线220提供优良的屏蔽，同时还可以减小该信号线220的信号损耗。
示例三的屏蔽罩210的其他结构请参阅示例一，此处不再赘述。
本申请实施例对第三端223与信号线220的相对位置不做限制，可以根据信号线220的设计进行分布。例如，第三端223位于信号线220的中部。
本申请实施例对第三开口206的位置不做限制，示例性地，第三开口206位于屏蔽罩210沿第一方向X的两端之间。
例如，图12中，第三开口206朝向第二方向Y开设。或者，在本申请的一些实施例中，第三开口206的开设方向可以为第一方向X，例如，第一开口202或者第二开口203的开设方向为第二方向Y，如此，第三开口206的开设方向可以为第一方向X。
请再次参阅图5a，传输线组件200位于印制电路板110的表面，屏蔽罩210与印制电路板110表面的接地端113连接。信号线220与印制电路板110表面的信号端连接。
本申请实施例对屏蔽罩210与印制电路板110的连接方式不做限制。示例性地，屏蔽罩210远离容纳空间201的外表面与印制电路板110连接。如此，相同的屏蔽罩210与印制电路板110的连接方式可以有多种。
请再次参阅图8b，以下就以图8b提供的屏蔽罩210与印制电路板110的连接结构作为示例进行描述。
图13a为图8b中屏蔽罩210与印制电路板110的一种连接结构图。请参阅图13a，屏蔽罩210远离窗口204的一面与印制电路板110连接。换言之，窗口204位于屏蔽罩210远离印制电路板110的一面，如此，屏蔽罩210与印制电路板110具有较大的接触面积，与印制电路板110连接部位的选择较多，可调整的余量大，有利于降低二者装配的成本。假设信号线220有辐射从窗口204溢出，溢出的辐射对相邻的信号线220以及印制电路板110表面的信号端的影响较小。
图13b为图8b中屏蔽罩210与印制电路板110的又一种连接结构图。请参阅图13b，屏蔽罩210与窗口204相邻的表面与印制电路板110连接，窗口204背离印制电路板110。窗口204所在表面、屏蔽罩210与印制电路板110连接的表面相邻。同理，屏蔽罩210与印制电路板110具有较大的接触面积，装配过程中可调整的余量大。此外，由于窗口204背离印制电路板110，即便屏蔽罩210与接地端113之间存在空隙，由于信号线220与该空隙之间被屏蔽罩210阻隔，信号线220散发的辐射从前述空隙穿过的概率小，由此，该空隙的存在对信号线220的辐射干扰其余传输线的影响较小。
请一并12a与图13b，图中，窗口204未被印制电路板110封闭。在一些实施例中，可以通过设置屏蔽罩210和信号线220的位置关系，以降低信号线220内辐射从窗口204溢出，降低信号线220对容纳空间201外的传输线的干扰。
图13c为窗口204未被印制电路板110封闭的屏蔽罩210与印制电路板110的截面示 意图，图13c中，屏蔽罩210和信号线220之间的最小距离为d1，窗口204所在平面与信号线220之间的距离为d2。在d2大于或等于d1的实施例中，信号线220溢至屏蔽罩210外的辐射占比小于千分之一，如此，即便窗口204未被印制电路板110封闭，信号线220对容纳空间201外的传输线的干扰也有限，可以满足大部分工业电子产品和消费类电子产品的干扰控制要求。
图13d为图8b中屏蔽罩210与印制电路板110的又一种连接结构图。请参阅图13d，屏蔽罩210的挡板205的表面与印制电路板110连接。换言之，屏蔽罩210的窗口204面向印制电路板110。如此，印制电路板110可以封堵窗口204，避免信号线220的辐射从窗口204溢出干扰相邻传输线。
同理，本申请实施例对其他示例中的屏蔽罩210与印制电路板110的连接结构也不做限制。
例如，前述图7b的屏蔽罩210与印制电路板110连接后，第一开口202和第二开口203可以均背离印制电路板110。如此，与印制电路板110连接的屏蔽罩210的表面面积大，可供选择的部位多。同理，第一开口202和第二开口203所在平面与印制电路板110连接的屏蔽罩210的表面相邻，此处不再赘述。
或者，前述图7b的屏蔽罩210与印制电路板110连接后，第一开口202与第二开口203可以均面向印制电路板110。如此，第一开口202与第二开口203均被印制电路板110封闭，可以减小信号线220的辐射从第一开口202与第二开口203溢出。
其他示例中的屏蔽罩210与印制电路板110的连接结构同理，此处不再赘述。
本申请实施例对屏蔽罩210与印制电路板110、信号线220与印制电路板110的连接方式不做限制，例如，屏蔽罩210与印制电路板110通过表面贴装工艺焊接。信号线220与印制电路板110通过表面贴装工艺焊接。
表面贴装工艺焊接全称为Surface Mount Technology，可以将无引脚或短引线表面组装元器件(简称SMC)安装在印制电路板的表面或其它基板的表面上，通过回流焊或浸焊等方法加以焊接组装的电路装连技术。
可以理解的是，屏蔽罩210与印制电路板110的连接方式不限于表面贴装工艺焊接，例如可以通过引脚等直接焊接。
示例性地，为了降低表面贴装工艺的成本，可选地，信号线220的第一端221的端面、信号线220的第二端222的端面、屏蔽罩210与印制电路板110连接的端面至少两个表面共面。
如图13e所示，以图7b中的屏蔽罩210为例，信号线220的第一端221的表面A、信号线220的第二端222的表面B以及屏蔽罩210的表面C至少两个表面共面。换言之，表面A和表面B共面，或者，表面A和表面C共面，或者，表面B和表面C共面，或者，表面A、表面B和表面C共面。
如此，表面贴装工艺过程可以同时贴两个面以上，缩短连接时间，降低连接成本。在表面贴装过程中一次贴两个表面的实施例中，余下一个表面可以采用焊接。
本申请实施例对表面C的大小以及形状不做限制，例如，图13e中，屏蔽罩210的整个表面均用于与印制电路板110连接。在其他实施例中，表面C可以仅占屏蔽罩210面向印制电路板110的表面的一部分。此外，表面C可以是一个连续的面，也可以是多个非连 续的面，可以根据屏蔽罩210的形状进行设置。
在表面A、表面B和表面C的至少两个表面共面的实施例中，前述共面的表面可以在传输线组件200制备完成时形成，也可以在传输线组件200与印制电路板110连接前形成。换言之，在采用表面贴装工艺焊接的实施例中，传输线组件200制备完成后，其满足表面A、表面B和表面C的至少两个表面共面的条件。或者，传输线组件200不满足至少两个表面共面的情况下，在传输线组件200与印制电路板110连接之前可以对其进行二次加工，使其满足前述条件。
本申请实施例对信号线220与印制电路板110的相对位置关系也不做限制。
示例性地，在信号线220的截面为偏平状结构的实施例中，例如，在信号线220的截面宽度的尺寸大于截面高度的尺寸的实施例中，信号线220的宽度方向可以与印制电路板110表面平行，或者，信号线220的高度方向可以与印制电路板110表面平行。
如图14a所示，信号线220沿宽度方向的尺寸为L，信号线220沿高度方向的尺寸为H。信号线220的宽度L小于高度H。屏蔽罩210与印制电路板110连接后，可以降低印制电路板组件100沿信号线220宽度方向的尺寸。
同理，如图14b所示，信号线220的宽度L大于高度H。如此，可以降低印制电路板组件100沿信号线220高度方向的尺寸。
图14a与图14b仅仅是对一种屏蔽罩210作为示例，可以理解的是，示例一中其余结构的屏蔽罩210同理，此处不再赘述。
由于传输线组件200的信号损耗小，在一些实施例中，单位长度传输线组件200的损耗与同轴电缆相当，约为普通微带线的50％，因此，印制电路板组件100的选材料可以不局限于低损耗射频板材，有利于降低成本。此外，通过对屏蔽罩210的结构设计，例如前述的窗口204和折弯结构208等，可降低印制电路板组件100的重量，有利于增加集成度。进一步地，在传输线组件200采用表面贴装工艺焊接与印制电路板110连接的实施例中，对缩短印制电路板组件100的工艺流程有极大帮助，满足集成的同时降低制造成本。
同理，由于印制电路板组件100电性能提升，电子设备10的电性能随之提升。印制电路板组件100的高集成度有利于电子设备10的轻薄化。同样，电子设备10的成本也会因印制电路板组件100的成本降低而降低。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何在本申请揭露的技术范围内的变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以所述权利要求的保护范围为准。

Claims (21)

  1. 一种传输线组件，其特征在于，用于与印制电路板连接；所述印制电路板的表面设有信号端和接地端；所述传输线组件包括：
    屏蔽罩，所述屏蔽罩用于与所述接地端连接；所述屏蔽罩具有容纳空间，所述容纳空间设有第一开口和第二开口；
    信号线，所述信号线包括相对设置的第一端和第二端；所述信号线穿设于所述容纳空间，且所述信号线与所述容纳空间的内侧壁具有间隙；所述第一端穿过所述第一开口，所述第二端穿过所述第二开口，所述第一端和所述第二端中的至少一端用于与所述信号端连接。
  2. 根据权利要求1所述的传输线组件，其特征在于，所述传输线组件还包括：绝缘件，所述绝缘件设置在所述间隙中，所述绝缘件的内侧壁与所述信号线抵接，所述绝缘件的外侧壁与所述容纳空间的内侧壁抵接。
  3. 根据权利要求2所述的传输线组件，其特征在于，所述绝缘件为开环结构。
  4. 根据权利要求2所述的传输线组件，其特征在于，所述绝缘件为闭环结构。
  5. 根据权利要求1-4任一项所述的传输线组件，其特征在于，所述第一开口和所述第二开口分别位于所述屏蔽罩相对的两个端部。
  6. 根据权利要求1-5任一项所述的传输线组件，其特征在于，所述第二开口和所述第一开口至少一个位于所述屏蔽罩的两端之间。
  7. 根据权利要求1-6任一项所述的传输线组件，其特征在于，所述容纳空间还设有窗口，所述窗口位于所述屏蔽罩的两端之间。
  8. 根据权利要求7所述的传输线组件，其特征在于，所述窗口从所述第一开口的边缘延伸至所述第二开口的边缘。
  9. 根据权利要求7所述的传输线组件，其特征在于，所述窗口所在平面至所述信号线的距离大于所述信号线至所述容纳空间内侧壁的最小距离。
  10. 根据权利要求1-9任一项所述的传输线组件，其特征在于，所述信号线为多根，一个所述容纳空间内具有多根间隔分布的所述信号线。
  11. 根据权利要求1-10任一项所述的传输线组件，其特征在于，所述屏蔽罩的横截面包括折弯结构；所述横截面与所述信号线的延伸方向垂直；所述折弯结构围设成多个折弯区，一个所述折弯区穿设有至少一根信号线。
  12. 根据权利要求1-11任一项所述的传输线组件，其特征在于，所述屏蔽罩包括多个子罩体，多个所述子罩体沿所述信号线的延伸路径间隔分布。
  13. 根据权利要求1-12任一项所述的传输线组件，其特征在于，所述信号线还包括第三端，所述第三端位于所述第一端和所述第二端之间，所述容纳空间设有第三开口；所述第三端穿过所述第三开口；所述第一端、所述第二端以及所述第三端中的至少一端用于与所述信号端连接。
  14. 根据权利要求1-13任一项所述的传输线组件，其特征在于，所述第一端的端面、所述第二端的端面以及所述屏蔽罩用于与所述接地端连接的端面中，至少两个端面共面。
  15. 一种印制电路板组件，其特征在于，所述印制电路板组件包括：
    印制电路板以及如权利要求1-14任一项所述的传输线组件；
    所述印制电路板的表面设有信号端和接地端；
    所述屏蔽罩与所述接地端连接，所述第一端和所述第二端中的至少一端与所述信号端连接。
  16. 根据权利要求15所述的印制电路板组件，其特征在于，所述第一开口、所述第二开口均面向所述印制电路板。
  17. 根据权利要求15或16所述的印制电路板组件，其特征在于，所述屏蔽罩的窗口面向所述印制电路板。
  18. 根据权利要求15或16所述的印制电路板组件，其特征在于，所述屏蔽罩的窗口背离所述印制电路板。
  19. 根据权利要求15-18任一项所述的印制电路板组件，其特征在于，所述屏蔽罩与所述接地端通过表面贴装工艺焊接。
  20. 根据权利要求15-19任一项所述的印制电路板组件，其特征在于，所述第一端和/或所述第二端与所述信号端通过表面贴装工艺焊接。
  21. 一种电子设备，其特征在于，所述电子设备包括壳体以及权利要求15-20任一项所述的印制电路板组件，所述印制电路板组件位于所述壳体内。
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