WO2024040913A1 - 一种摄像头模组以及电子设备 - Google Patents

一种摄像头模组以及电子设备 Download PDF

Info

Publication number
WO2024040913A1
WO2024040913A1 PCT/CN2023/079547 CN2023079547W WO2024040913A1 WO 2024040913 A1 WO2024040913 A1 WO 2024040913A1 CN 2023079547 W CN2023079547 W CN 2023079547W WO 2024040913 A1 WO2024040913 A1 WO 2024040913A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
camera
camera module
electrically connected
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2023/079547
Other languages
English (en)
French (fr)
Inventor
朱凯翔
戴晓芒
吴东
梁峰
范峻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honor Device Co Ltd
Original Assignee
Honor Device Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honor Device Co Ltd filed Critical Honor Device Co Ltd
Priority to EP23856010.6A priority Critical patent/EP4507316A4/en
Priority to US18/869,744 priority patent/US20250338003A1/en
Priority to CN202380008174.XA priority patent/CN116671118B/zh
Publication of WO2024040913A1 publication Critical patent/WO2024040913A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases

Definitions

  • the present application relates to the technical field of electronic equipment, and in particular, to a camera module and electronic equipment.
  • Embodiments of the present application provide a camera module and electronic equipment, which are used to solve the problem that existing camera modules are easily interfered and reduce the shooting performance of electronic equipment, thus affecting the shooting effect.
  • a camera module is provided.
  • the camera module is used in electronic equipment and includes a lens, a camera circuit board and a grounding piece.
  • the camera circuit board is fixed on the lens.
  • the grounding piece is disposed on the camera circuit board and is electrically connected to the camera circuit board.
  • the grounding piece is electrically connected to the grounding end of the circuit board of the electronic device.
  • the camera module provided in the first aspect of this application is provided with a grounding piece on the camera circuit board, the grounding piece is electrically connected to the camera circuit board, and the grounding piece is electrically connected to the grounding end of the electronic equipment circuit board, thereby increasing the number of connections between the camera circuit board and the camera circuit board.
  • the grounding point between the circuit boards of electronic equipment will help improve the interference suppression effect of the camera module and improve the shooting effect of the camera module.
  • the camera module also includes a connection structure, a first end of the connection structure is electrically connected to the camera circuit board, and a second end of the connection structure is electrically connected to the circuit board of the electronic device; the connection structure is electrically connected to the camera circuit board
  • the distribution direction is the first direction, and the two edges distributed along the direction perpendicular to the first direction on the camera circuit board are the first edges; the grounding piece extends out of the camera circuit board from the first edge and is connected with the circuit of the electronic device The ground terminal of the board is electrically connected.
  • the grounding member is electrically connected to the ground terminal of the electronic device at the first edge, and a ground point is added between the camera circuit board and the electronic device circuit board along the first direction to change the resonance of the camera module along the first direction. frequency, so that the resonant frequency of the camera module deviates from the sensitive frequency band of the antenna of the electronic device, thereby avoiding strong coupling between the antenna of the electronic device and the camera module when transmitting signals, thereby avoiding interference to the camera module. Improving the shooting effect of the camera module will help improve the user experience.
  • a conductive area is formed on the surface of the camera circuit board away from the lens, and the grounding piece is attached to the conductive area and is electrically connected to the camera circuit board; the grounding piece extends out of the camera circuit board from the first edge, And electrically connected to the ground terminal of the circuit board of the electronic device.
  • the conductive area includes a ground layer of the camera circuit board.
  • the two ends of the grounding member respectively protrude from the camera circuit board at the two first edges, and are electrically connected to the grounding end of the circuit board of the electronic device respectively.
  • the two first edges provided along the first direction on the camera circuit board both form ground points, which is conducive to further changing the resonant frequency of the camera module along the first direction to avoid interference between the camera module and the electronic device. Strong coupling occurs in antenna signals.
  • the grounding member includes conductive cloth or copper sheet. Using conductive cloth or copper as the grounding piece, you only need to attach it to the camera circuit board to achieve electrical connection with the camera circuit board, making the installation simpler and more convenient.
  • the grounding member extends from the first edge in a direction away from the camera circuit board, out of the camera circuit board, and contacts an adjacent shielding case and is electrically connected.
  • the shield and the ground terminal of the circuit board of the electronic equipment Since the shielding case is in good contact with the ground terminal of the circuit board of the electronic equipment, by electrically connecting the grounding piece to the shielding case, the grounding piece can be electrically connected to the grounding end of the circuit board.
  • the two ends of the grounding member extend from the two first edges in opposite directions and extend out of the camera circuit board.
  • One end of the grounding member is in contact with the adjacent shielding case, and the electrical Connection, the shielding case is electrically connected to the ground end of the circuit board of the electronic equipment; the other end of the grounding piece is in contact with the ground layer of the circuit board of the electronic equipment and is electrically connected.
  • the two first edges of the camera circuit board along the first direction can both have grounding points, thereby further ensuring that the camera module and the antenna signal will not be strongly coupled.
  • the grounding component includes a metal bracket and a conductive layer.
  • the metal bracket is disposed on the side of the camera circuit board away from the lens.
  • the conductive layer is disposed between the metal bracket and the camera circuit board.
  • the metal bracket is connected to the camera through the conductive layer.
  • the circuit board is electrically connected; the metal bracket is electrically connected to the ground end of the circuit board of the electronic device.
  • a metal bracket and a conductive layer are used to form a grounding piece.
  • the conductive layer is attached to the camera circuit board and contacts the conductive area to achieve electrical connection between the conductive layer and the camera circuit board.
  • the metal bracket and the conductive layer Contact and electrically connect, so that the metal bracket and the camera circuit board can be electrically connected; and then the metal bracket is electrically connected to the ground end of the circuit board of the electronic device, thereby increasing the ground point between the camera module and the circuit board.
  • the metal bracket includes a bracket body, a first connecting end and a fastener.
  • the bracket body is bonded with the conductive layer.
  • the first connection end is fixedly connected to the bracket body, and the first connection end extends out of the camera circuit board from the first edge.
  • the first connection end is fixedly connected to the circuit board of the electronic device through a fastener, and the first connection end is electrically connected to the ground end of the circuit board of the electronic device through the fastener.
  • the metal bracket and the circuit board of the electronic device can be relatively fixed through the fastener; on the other hand, the electrical connection between the metal bracket and the circuit board of the electronic device can be realized through the fastener, that is,
  • the fastener is used as the connection structure to realize the electrical connection between the ground end of the circuit board of the electronic device and the first connection end of the metal bracket, which is beneficial to reducing the number of parts and making the overall structure more compact.
  • the fasteners are screws.
  • the metal bracket further includes a second connecting end and a metal elastic piece.
  • the second connection end is fixedly connected to the bracket body, and a line connecting the second connection end and the first connection end intersects with the first direction.
  • One end of the metal spring piece is in contact with the second connection end, and the other end of the metal spring piece is electrically connected to the ground end of the circuit board of the electronic device. That is, the second connection end and the first connection end respectively extend out of the camera circuit board from two first edges, so that the camera circuit board has grounding points at both first edges along the first direction.
  • the fasteners since the fasteners relatively secure the metal bracket and the circuit board of the electronic device, no additional fixing structure is required between the second connection end and the circuit board. Therefore, by abutting the metal spring piece between the second connection end and the ground end of the circuit board, the second connection end and the ground end of the circuit board can be electrically connected.
  • a shielding cover is provided between the metal spring piece and the circuit board of the electronic device, the shielding case is electrically connected to the ground end of the circuit board of the electronic device, and the metal spring piece is in contact with the shielding case.
  • a matching piece is connected in series between the metal spring piece and the ground end of the circuit board of the electronic device, and the matching piece is used to adjust the resonant frequency of the camera module.
  • the resonant frequency of the camera module can be adjusted, thereby ensuring that the antenna signal of the camera module and the electronic device will not be strongly coupled, which is beneficial to improving the shooting performance of the camera module. Effect.
  • the conductive layer includes conductive foam.
  • the conductive layer includes high dielectric material or wave absorbing material.
  • the camera module further includes a matching piece.
  • the matching piece is connected in series between the ground piece and the ground end of the circuit board of the electronic device.
  • the matching piece is used to adjust the resonant frequency of the camera module. Under this structure, by setting matching parts with different values, the resonant frequency of the camera module can be adjusted to ensure that strong coupling between the camera module and the antenna signal does not occur.
  • the matching component includes a capacitor or an inductor.
  • the matching component includes a capacitor and an inductor.
  • the capacitor and the inductor are connected in parallel with each other, and the capacitor and the inductor are connected in series between the ground component and the ground end of the circuit board of the electronic device.
  • the camera module includes a front-facing camera module.
  • an electronic device including a casing, a circuit board and a camera module.
  • the circuit board is arranged inside the casing.
  • the camera module is a camera module as described in any of the above technical solutions.
  • the camera module is arranged inside the housing, and the second end of the FPC board of the camera module is electrically connected to the circuit board; and the grounding piece of the camera module is connected to the circuit board.
  • the ground terminal of the circuit board is electrically connected.
  • the electronic device provided in the second aspect of this application includes the camera module described in any of the above technical solutions, and therefore can solve the same technical problem and achieve the same technical effect.
  • the camera module includes a camera circuit board and a connection structure.
  • One end of the connection structure is electrically connected to the camera circuit board, and the other end of the connection structure is electrically connected to the circuit board of the electronic device; the camera circuit board and the connection structure
  • the physical size along the distribution direction is close to a quarter wavelength of the antenna operating frequency band of the electronic device.
  • Figure 1 is a structural diagram of an electronic device provided by an embodiment of the present application.
  • Figure 2 is an exploded view of an electronic device provided by an embodiment of the present application.
  • Figure 3 is a connection structure diagram between the camera module and the circuit board provided by related technologies
  • Figure 4 is a resonance characteristic diagram of the camera module provided in Figure 3;
  • Figure 5 is a structural diagram of a camera module provided by an embodiment of the present application.
  • Figure 6 is a cross-sectional view along line A-A in Figure 5;
  • Figure 7 is a connection structural diagram between the camera module and the circuit board provided in Figure 5;
  • Figure 8 is a resonance characteristic diagram of the camera module provided in Figure 5;
  • Figure 9 is a structural diagram of the grounding piece of the camera module provided by the embodiment of the present application.
  • FIG. 10 is a structural diagram of another grounding piece of the camera module provided by the embodiment of the present application.
  • FIG 11 is a structural diagram of another grounding piece of the camera module provided by the embodiment of the present application.
  • Figure 12 is a structural diagram of another grounding piece of the camera module provided by the embodiment of the present application.
  • Figure 13 is a structural diagram of another camera module provided by an embodiment of the present application.
  • Figure 14 is a B-B cross-sectional view of Figure 13;
  • Figure 15 is a structural diagram of a camera circuit board and the connection structure between the circuit board and matching parts provided by the embodiment of the present application;
  • Figure 16 is a diagram of another camera circuit board and the connection structure between the circuit board and the matching piece provided by the embodiment of the present application.
  • first”, “second”, etc. are used for descriptive purposes only and shall not be understood as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features. Thus, features defined by “first,” “second,” etc. may explicitly or implicitly include one or more of such features.
  • connection should be understood in a broad sense.
  • connection can be a fixed connection, a detachable connection, or an integral body; it can be a direct connection or a detachable connection. Can be connected indirectly through intermediaries.
  • an embodiment of the present application provides an electronic device, which is a type of electronic device with a shooting function.
  • the electronic device may be a portable electronic device or other types of electronic devices.
  • the electronic device may be a mobile phone, a tablet personal computer, a laptop computer, a personal digital assistant (PDA), a monitor, a camera, a personal computer, a notebook computer, a vehicle-mounted device, Wearable devices, augmented reality (AR) glasses, AR helmets, virtual reality (VR) glasses or VR helmets, etc.
  • AR augmented reality
  • VR virtual reality
  • the following examples take the electronic device as a mobile phone as an example.
  • FIG. 1 is a structural diagram of the electronic device 10 provided by the embodiment of the present application.
  • the electronic device 10 is a mobile phone, and the electronic device 10 may be approximately in the shape of a rectangular plate.
  • an XYZ coordinate system is established, defining the width direction of the electronic device 10 as the X-axis direction, the length direction of the electronic device 10 as the Y-axis direction, and the thickness direction of the electronic device 10 as Z-axis direction. It can be understood that the coordinate system of the electronic device 10 can be flexibly set according to actual needs. This application only gives an example, which cannot be considered as a special limitation on this application.
  • FIG. 2 is an exploded view of the electronic device 10 provided in this embodiment of the present application.
  • the above-mentioned electronic device 10 may include a display module 100, a housing 200, a circuit board 300, a circuit board bracket 400 and a camera module 500.
  • the above-mentioned display module 100 is used to display images, videos, etc.
  • the display module 100 may include a light-transmitting cover 110 and a display screen 120, and the light-transmitting cover 110 and the display screen 120 are stacked.
  • the light-transmitting cover 110 can be an ordinary light-transmitting cover 110 to protect the display screen 120 to prevent damage to the display screen 120 due to external force collision and to prevent dust; a transparent cover with a touch function can also be used.
  • the optical cover 110 is provided so that the electronic device 10 has a touch function, thereby making it more convenient for users to use. Therefore, this application does not impose any special limitations on the specific material of the light-transmitting cover plate 110 .
  • the display screen 120 may be a flexible display screen or a rigid display screen.
  • the display screen 120 can be an organic light-emitting diode (OLED) display, an active matrix organic light-emitting diode or an active-matrix organic light-emitting diode (AMOLED).
  • OLED organic light-emitting diode
  • AMOLED active-matrix organic light-emitting diode
  • Display mini organic light-emitting diode display, micro organic light-emitting diode display, micro organic light-emitting diode display, quantum dot light-emitting diode (quantum dot light emitting diodes, QLED) display screen, liquid crystal display (liquid crystal display, LCD).
  • the above-mentioned housing 200 is used to protect the electronic components inside the electronic device 10 .
  • the casing 200 includes a back cover 210 and a frame 220.
  • the back cover 210 is located on the side of the display screen 120 away from the light-transmitting cover 110, and is stacked and spaced apart from the light-transmitting cover 110 and the display screen 120.
  • the frame 220 is located on the light-transmitting cover. between the plate 110 and the back cover 210.
  • the frame 220 is fixed on the back cover 210.
  • the frame 220 can be connected to the back cover 210 through adhesive fixation.
  • the frame 220 can also be an integrally formed structure with the back cover 210, that is, the frame 220 and the back cover 210 are A structural member as a whole.
  • the light-transmitting cover 110 can be fixed on the frame 220 through adhesive, so that the light-transmitting cover 110 , the back cover 210 and the frame 220 form an internal accommodation space of the electronic device 10 .
  • the above-mentioned display screen 120, circuit board 300 and camera module 500 are all arranged in the internal accommodation space.
  • the above-mentioned housing 200 may further include a middle plate 230 .
  • the middle plate 230 is disposed in the above-mentioned internal accommodation space, and the middle plate 230 is located on the side of the display screen 120 away from the light-transmitting cover 110 .
  • the middle plate 230 and the frame 220 are fixedly connected.
  • the middle plate 230 and the frame 220 can be fixedly connected by gluing.
  • the middle plate 230 and the frame 220 can also be integrally formed, that is, they are one structural component.
  • the middle plate 230 divides the above-mentioned internal accommodation space into two mutually independent spaces.
  • One of the spaces is located between the light-transmitting cover 110 and the middle panel 230 , and the display screen 120 is located in this space.
  • Another space is located between the middle panel 230 and the back cover 210 , and the circuit board 300 , the circuit board bracket 400 and the camera module 500 are all disposed in this space.
  • the above-mentioned circuit board 300 is used for arranging electronic components of the electronic device 10 and realizing electrical connections between the electronic components.
  • the electronic components can be control chips (such as system on chip, SOC), graphics control chips (graphics processing unit, GPU), universal memory (universal flash storage, UFS), earpieces and flash modules. wait.
  • the above-mentioned circuit board bracket 400 is disposed inside the electronic device 10 .
  • the circuit board bracket 400 is disposed between the circuit board 300 and the back cover 210 .
  • the circuit board bracket 400 is fixed to the midplane 230 on the surface, and the circuit board bracket 400 covers the surface of the circuit board 300 facing the back cover 210, and uses flexible printed circuit (flexible printed circuit, FPC), elastic pieces and other non-fixed structures to connect some electronic components (such as flash modules) to
  • the circuit board 300 and the electronic components on the circuit board 300 are protected to prevent the electronic device 10 from being damaged due to the movement of the positions of these electronic components when the back cover 210 is opened for maintenance.
  • the above-mentioned camera module 500 is used to capture videos or images.
  • the camera module 500 includes but is not limited to a main camera, a wide-angle camera, a telephoto camera, etc., and the structural form of the camera module 500 includes but is not limited to an upright type and a periscope type. Please continue to refer to FIG. 2.
  • the camera module 500 may include a lens 510.
  • the lens 510 has a light incident surface, and the light incident surface may be the light incident surface of the optical lens 510 in the lens 510 .
  • the above-mentioned camera module 500 may include a front camera module and a rear camera module, and the front camera module and the rear camera module are both disposed between the middle plate 230 and the back cover 210 .
  • the rear camera module is fixed on the middle panel 230
  • the light incident surface of the lens 510 in the rear camera module faces the rear cover 210 .
  • the back cover 210 may include a back cover main body 211 and a lens decoration part 212.
  • the back cover main body 211 is provided with a mounting notch 211a, and the lens decoration part 212 is fixed in the installation notch 211a.
  • the lens decoration 212 is provided with a light-transmitting window 212a.
  • the light-incident surface of the lens 510 of the rear camera module is opposite to the light-transmitting window 212a, so that external light can pass through the light-transmitting window 212a and enter the main body of the lens 510 to achieve electronic
  • the rear camera module of the device 10 captures videos or images.
  • the above-mentioned middle plate 230 is provided with a light-transmitting hole 231.
  • the front-facing camera module is fixed on the middle plate 230, and the light-incident surface of the lens 510 in the front-facing camera module is opposite to the light-transmitting hole 231, so that light can pass through the display.
  • the module 100 passes through the light-transmitting hole 231 and enters the main body of the lens 510 in the front-facing camera module, so that the front-facing camera module of the electronic device 10 can capture a video screen or image.
  • FIG. 3 is a structural diagram of a camera module 500 provided by related technologies.
  • the camera module 500 also includes a camera circuit board 530 and a connection structure.
  • the connection structure may include an FPC board 520.
  • the camera circuit board 530 is fixedly connected to the lens 510 (not shown in Figure 3).
  • One end of the FPC board 520 is connected to the camera.
  • the circuit board 530 is electrically connected, and the other end of the FPC board 520 is electrically connected to the above-mentioned circuit board 300.
  • the FPC board 520 and the circuit board 300 can be connected through board-to-board connectors (BTB connectors, Board-to-board Connectors) Electrical connection.
  • BTB connectors Board-to-board Connectors
  • the radio frequency antenna of the electronic device 10 may interfere with the camera module 500, causing screen blur, freezes, screen freezes, crashes, harmonic excitation and other phenomena.
  • the N78 frequency band is the main frequency band of the current 5G network
  • the front camera module of the existing electronic device 10 is distributed along the direction of the camera circuit board 530 and the FPC board 520 (this direction is the first direction, the solid arrow in Figure 3
  • the physical size of the direction shown in a) is close to a quarter wavelength of the N78 frequency band. Therefore, please refer to Figure 4.
  • Figure 4 is the resonance characteristic diagram of the camera module 500 provided in Figure 3.
  • the camera module 500 When the frequency of the interference signal is close to 3.4 At G, the camera module 500 will generate a strong voltage, which is the largest wave peak shown in Figure 4. At the same time, the resonant frequency is in the N78 frequency band. Therefore, when the electronic device 10 transmits a signal, it is easy to be strongly coupled with the front camera module in the first direction, causing the front camera module to be interfered and affecting the shooting effect.
  • Figure 5 is a structural diagram of a camera module 500 provided by an embodiment of the present application.
  • Figure 6 is an AA cross-sectional view of Figure 5.
  • Figure 7 Figure 5 provides a connection structure diagram between the camera module 500 and the circuit board 300.
  • the camera module 500 can be applied to the above electronic devices Preparation 10.
  • the camera module 500 can be used as a front camera module or a rear camera module, which is not specifically limited in this application.
  • the following description takes the camera module 500 as a front camera module as an example.
  • the camera module 500 provided by the embodiment of the present application includes It also includes a grounding piece 540, wherein the camera circuit board 530 has two first edges 531 arranged oppositely, the distribution direction of the two first edges 531 is the second direction (shown by the dotted arrow b in Figure 5), and the second The direction is perpendicular to the above-mentioned first direction.
  • the grounding member 540 is disposed on the camera circuit board 530 and is electrically connected to the camera circuit board 530 .
  • the grounding member 540 extends out of the camera circuit board 530 from the first edge 531 and is electrically connected to the ground end of the circuit board 300 .
  • Figure 8 is a resonance characteristic diagram of the camera module 500 provided in Figure 5.
  • the edge of the camera circuit board 530 can be changed.
  • the resonance point in one direction, as shown in Figure 8, the camera module 500 will not generate a strong voltage when the frequency is close to 3.4G, so that the resonance point of the camera module 500 deviates from the sensitive frequency band of the electronic device 10 ( For example, N78 frequency band), thereby avoiding strong coupling between the antenna and the camera module 500 when the antenna of the electronic device 10 transmits power, causing the camera module 500 to be interfered, which is beneficial to improving the shooting effect of the camera module 500.
  • the sensitive frequency band of the electronic device 10 For example, N78 frequency band
  • both the above-mentioned first direction and the second direction can be any direction parallel to the XY plane, which is not specifically limited in this application.
  • the first direction is parallel to the Y-axis direction
  • the second direction is parallel to the X-axis direction.
  • the surface of the camera circuit board 530 away from the lens 510 is the first surface 532, and the first surface 532 has a conductive area (for example, a copper leakage area, that is, the ground layer of the camera circuit board 530).
  • a conductive area for example, a copper leakage area, that is, the ground layer of the camera circuit board 530.
  • FIG. 9 is a structural diagram of the grounding member 540 of the camera module 500 provided by an embodiment of the present application.
  • the above-mentioned grounding member 540 may include conductive cloth or copper sheet.
  • the grounding member 540 is attached to the first surface 532 of the camera circuit board 530 and contacts the conductive area on the first surface 532 and is electrically connected to realize the grounding member 540 It is electrically connected to the camera circuit board 530 .
  • the grounding member 540 extends out of the camera circuit board 530 from the first edge 531 of the camera circuit board 530 and contacts an adjacent shielding case 600 and is electrically connected.
  • the grounding piece 540 is in contact with the shielding case 600, thereby realizing the electrical connection between the grounding piece 540 and the grounding end of the circuit board 300, thereby realizing the connection between the camera circuit board 530 and the circuit board 300.
  • the ground terminal of the circuit board 300 is electrically connected.
  • the above-mentioned grounding member 540 extending out of the camera circuit board 530 from the first edge 531 of the camera circuit board 530 refers to the vertical projection of the grounding member 540 (ie, conductive cloth or copper sheet) in the XY plane, as shown in The first edge 531 extends beyond the range covered by the vertical projection of the camera circuit board 530 , that is, the vertical projection of the portion of the grounding member 540 extending out of the camera circuit board 530 does not coincide with the vertical projection of the camera circuit board 530 .
  • Figure 10 is a structural diagram of another grounding member 540 of the camera module 500 provided by the embodiment of the present application.
  • the grounding member 540 is along the second The two ends in the direction (X-axis direction) respectively extend out of the camera circuit board 530 from two first edges 531, and Furthermore, one end of the grounding member 540 can be in close contact with the shielding case 600 , and the other end of the grounding member 540 can be in contact with and electrically connected to the ground layer of the circuit board 300 .
  • the two first edges 531 provided along the first direction on the camera circuit board 530 are both provided with grounding points to achieve better interference suppression effect, which is conducive to further improving the shooting effect of the camera module 500 .
  • Table 1 below shows the simulation test results of the camera module 500 provided with the above-mentioned grounding member 540 (conductive cloth or copper sheet) and the camera module 500 without the grounding member 540 .
  • the isolation degree of the camera module 500 can be improved, which is beneficial to improving the interference suppression effect of the camera module 500 .
  • FIG. 11 is a structural diagram of another grounding member 540 of the camera module 500 provided in an embodiment of the present application.
  • the above-mentioned grounding member 540 may also include a metal bracket 541 and a conductive layer 542.
  • the conductive layer 542 is attached to the first surface 532 and is in contact with and electrically connected to the conductive area of the camera circuit board 530.
  • the metal bracket 541 is disposed on the side of the conductive layer 542 away from the camera circuit board 530, and is attached to and electrically connected to the conductive layer 542.
  • the conductive layer 542 is disposed between the metal bracket 541 and the first surface 532 of the camera circuit board 530 , and the two are electrically connected through the conductive layer 542 .
  • the metal bracket 541 extends from the first edge 531 of the camera circuit board 530 and is electrically connected to the ground terminal of the circuit board 300 . In order to realize that the camera circuit board 530 forms a ground point along the first direction.
  • the above-mentioned metal bracket 541 may include a bracket body 541a, a first connecting end 541b and a fastener 541d.
  • the first connecting end 541b is fixedly connected to the bracket body 541a.
  • the first connecting end 541b is connected by the camera circuit.
  • the first edge 531 of the board 530 extends out of the camera circuit board 530.
  • the first connection end 541b is fixedly connected to the circuit board 300 through a fastener 541d (such as a screw), and the first connection end 541b is connected to the circuit board 300 through a fastener 541d.
  • the ground terminal of the circuit board 300 is electrically connected.
  • the bracket body 541a and the circuit board 300 can be fixedly connected through the fastener 541d; on the other hand, when the fastener 541d is connected to the circuit board 300, it only needs to be in contact with the ground layer of the circuit board 300, that is, The first connection end 541b can be electrically connected to the ground end of the circuit board 300 through the fastener 541d, thereby realizing the electrical connection between the metal bracket 541 and the ground end of the circuit board 300.
  • Figure 12 is another grounding method of the camera module 500 provided by the embodiment of the present application.
  • the above-mentioned metal bracket 541 can also include a second connection end 541c and a metal elastic piece 541e.
  • the second connection end 541c is fixedly connected to the bracket body 541a.
  • the second connection end 541c and the first connection end 541b are along the above-mentioned second direction. distribution, that is, the second connection end 541c and the first connection end 541b respectively protrude from the camera circuit board 530 from the two first edges 531 of the camera circuit board 530, and the metal elastic piece 541e is in contact with the ground end of the circuit board 300 and the first connection end 541b.
  • the metal elastic piece 541e is abutted against the second connecting end 541c of the metal bracket 541.
  • the second connection terminal 541c and the ground terminal of the circuit board 300 can be electrically connected.
  • the metal spring piece 541e and the second connection end 541c can be fixedly connected by welding, and the other end of the metal spring piece 541e can also be connected to the ground of the circuit board 300 by welding. terminal electrical connection. This prevents the metal elastic piece 541e from being separated from the second connection terminal 541c or from the ground terminal of the circuit board 300, causing the connection to be interrupted.
  • first connection end 541b and the bracket body 541a, and the second connection end 541c and the bracket body 541a can be fixedly connected by welding or other methods; they can also be designed as an integrally formed structure, that is, the first connection The end 541b, the bracket body 541a and the second connecting end 541c are connected as a whole. Therefore, this application does not impose special limitations on this.
  • first connection end 541b and the second connection end 541c protruding from the first edge 531 outside the camera circuit board 530 means that the vertical projection of the first connection end 541b and the second connection end 541c in the XY plane is in line with the camera The vertical projections of the circuit board 530 in the XY plane do not overlap, and the first connection end 541b and the second connection end 541c are respectively located on both sides of the camera circuit board 530 along the second direction.
  • the distribution of the above-mentioned first connection end 541b and the second connection end 541c along the second direction means that they can be on the same straight line along the second direction, or they can be distributed in a staggered manner.
  • the connection line between the first connection end 541b and the second connection end 541c can be parallel to the second direction, that is, perpendicular to the first direction; the connection line between the first connection end 541b and the second connection end 541c can also be connected with the second direction.
  • the direction is not parallel, that is, it intersects but is not perpendicular to the first direction.
  • the above-mentioned conductive layer 542 may include conductive foam.
  • the conductive foam has good surface conductivity and is very light. Therefore, it can electrically connect the metal bracket 541 to the camera circuit board 530 and at the same time, it is also beneficial to reduce the weight of the electronic device. 10 weight. Moreover, the price of conductive foam is relatively low, which helps reduce costs.
  • the above-mentioned conductive layer 542 can also be made of high dielectric material or wave absorbing material.
  • the use of high dielectric material and wave absorbing material is conducive to achieving the grounding effect under high frequency conditions and can further ensure that the camera circuit board 530 and the metal bracket 541 Good electrical conductivity between them ensures good connection between the camera circuit board 530 and the ground terminal of the circuit board 300 .
  • Figure 13 is a structural diagram of another camera module 500 provided by an embodiment of the present application.
  • Figure 14 is a BB cross-sectional view of Figure 13.
  • the above-mentioned camera module 500 also includes a matching piece 543.
  • the component 543 is connected in series between the ground component 540 and the ground terminal of the circuit board 300 .
  • the matching piece 543 is used to adjust the resonant frequency of the camera module 500 .
  • the resonance point of the antenna coupling to the camera module 500 is adjusted, so that the resonance frequency of the camera module 500 greatly deviates from the sensitive key frequency band (for example, the N78 frequency band), thereby achieving better interference.
  • the suppression effect is conducive to further improving the shooting effect of the camera module 500.
  • the matching component 543 may include a capacitor or an inductor; alternatively, the matching component 543 may also include a capacitor and an inductor.
  • the capacitor and the inductor are connected in parallel, and the parallel capacitor and inductor are connected in series between the ground component 540 and the circuit. between the ground terminals of board 300.
  • the resonance point of the camera module 500 can be adjusted to achieve better interference suppression effect of the camera module 500 .
  • Table 2 below shows the camera module 500 provided with the above-mentioned grounding member 540 (including the metal bracket 541, the conductive layer 542 and the matching piece 543), and the camera module 500 provided with the grounding member 540 (including the metal bracket and the conductive layer, but without the matching piece 543). Simulation test results of the camera module 500 and the camera module 500 without the grounding piece 540 .
  • the isolation degree of the camera module 500 can be improved.
  • the solution of connecting the matching piece 543 in series between the metal bracket 541 and the circuit board 300 can further improve the isolation of the camera module 500 compared to the solution without the matching piece 543 , which is conducive to further improving the isolation of the camera module 500 interference suppression effect.
  • FIG. 15 is a structural diagram of a camera circuit board 530 and the connection between the circuit board 300 and the matching piece 543 provided by the embodiment of the present application.
  • the matching piece 543 can be connected in series between the metal elastic piece 541e and the ground end of the circuit board 300.
  • a capacitor is connected in series between the metal elastic piece 541e and the ground end of the circuit board 300, and then, through the connection between the metal elastic piece 541e and the circuit board 300
  • Capacitors of different sizes are connected in series between the ground terminals of 300, that is, the size of the capacitor is adjusted to adjust the resonance point of the camera module 500, thereby avoiding strong coupling with the camera module 500 when the antenna of the electronic device 10 transmits a signal.
  • FIG. 16 is a structural diagram of another camera circuit board 530 and the connection structure between the circuit board 300 and the matching piece 543 provided by the embodiment of the present application.
  • the above-mentioned matching piece 543 can also be connected in series between a shield case 600 and the ground end of the circuit board 300, and then the metal spring piece 541e is brought into contact with the shield case 600, or the second connection end 541c can be electrically connected to the ground end of the circuit board 300. connection, thereby realizing the camera electrical
  • the circuit board 530 is electrically connected to the ground terminal of the circuit board 300 through the metal bracket 541 .
  • the metal spring piece 541e and the second connection end 541c, and the metal spring piece 541e and the shielding case 600 can be fixedly connected by welding.
  • the connection between the second connection end 541c and the shielding case 600 can be realized.
  • Electrical connection is beneficial to improving the connection strength between the metal elastic piece 541e, the second connection end 541c and the shielding cover 600.

Landscapes

  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Studio Devices (AREA)

Abstract

本申请提供一种摄像头模组以及电子设备，涉及电子设备技术领域。用于解决摄像头模组容易被干扰，降低电子设备拍摄性能，影响拍摄效果的问题。上述摄像头模组应用于电子设备中，其包括镜头、摄像头电路板以及接地件。摄像头电路板固定于镜头上。接地件设置于摄像头电路板上，并与摄像头电路板电连接，接地件与电子设备的电路板的接地端电连接。

Description

一种摄像头模组以及电子设备
本申请要求于2022年08月25日提交国家知识产权局、申请号为202222246568.4、发明名称为“一种摄像头模组以及电子设备”的中国实用新型专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电子设备技术领域，尤其涉及一种摄像头模组以及电子设备。
背景技术
现有的电子设备大多具有拍照功能，并且，用户对于电子设备拍摄效果的需求也越来越高。但是，由于电子设备内部需要设置有天线，在天线发射信号时，会导致拍摄时出现花屏、卡顿等现象，因此，降低了电子设备的拍摄性能，影响用户体验感。
发明内容
本申请实施例提供一种摄像头模组以及电子设备，用于解决现有摄像头模组容易被干扰，降低了电子设备的拍摄性能，从而影响拍摄效果的问题。
为达到上述目的，本申请的实施例采用如下技术方案：
第一方面，提供了一种摄像头模组，该摄像头模组应用于电子设备，其包括镜头、摄像头电路板以及接地件。摄像头电路板固定于镜头上。接地件设置于摄像头电路板上，并与摄像头电路板电连接，接地件与电子设备的电路板的接地端电连接。
本申请第一方面提供的摄像头模组，通过在摄像头电路板上设置接地件，接地件与摄像头电路板电连接，并且接地件与电子设备电路板的接地端电连接，增加了摄像头电路板与电子设备电路板之间的接地点，从而有利于提高摄像头模组的干扰抑制效果，有利于提升摄像头模组的拍摄效果。
本申请的一些实施例中，摄像头模组还包括连接结构，连接结构的第一端与摄像头电路板电连接，连接结构的第二端与电子设备的电路板电连接；连接结构与摄像头电路板的分布方向为第一方向，摄像头电路板上沿垂直于第一方向的方向分布的两个边沿为第一边沿；接地件由第一边沿处伸出摄像头电路板外，并与电子设备的电路板的接地端电连接。这样一来，接地件由第一边沿处于电子设备的接地端电连接，沿第一方向增了摄像头电路板与电子设备电路板之间的接地点，以改变摄像头模组沿第一方向的谐振频率，使摄像头模组的谐振频率偏出电子设备的天线的敏感频段，从而避免电子设备的天线发射信号时，与摄像头模组之间发生强耦合，进而能够避免对摄像头模组产生干扰，以提升摄像头模组的拍摄效果，有利于提升用户体验感。
本申请的一些实施例中，摄像头电路板远离镜头的表面上形成有导电区域，接地件贴合于导电区域上，并与摄像头电路板电连接；接地件由第一边沿伸出摄像头电路板，并与电子设备的电路板的接地端电连接。这样一来，通过接地件由第一边沿伸出的部分与电子设备的电路板的接地端电连接，即可改变摄像头模组沿第一方向的谐振频率，从而能够使摄像头模组在第一方向上的谐振频率偏出电子设备天线的敏感频段，从而能够避免摄像头模组被干扰，有利于提升摄像头模组的拍摄效果。
本申请的一些实施例中，导电区域包括摄像头电路板的接地层。
本申请的一些实施例中，接地件的两端分别由两个第一边沿处伸出摄像头电路板，并且分别与电子设备的电路板的接地端电连接。这样一来，摄像头电路板上沿第一方向设置的两个第一边沿处均形成接地点，从而有利于进一步改变摄像头模组沿第一方向的谐振频率，以避免摄像头模组与电子设备的天线信号发生强耦合。
本申请的一些实施例中，接地件包括导电布或者铜皮。采用导电布或者铜皮作为接地件，只需要将其贴装于摄像头电路板上，即可实现与摄像头电路板电连接，安装更加简单方便。
本申请的一些实施例中，接地件由第一边沿处，沿远离摄像头电路板的方向，伸出摄像头电路板外，并与相邻的一个屏蔽罩接触，且电连接。屏蔽罩与电子设备的电路板的接地端。由于屏蔽罩与电子设备电路板的接地端是良好接触的，因此，将接地件与屏蔽罩电连接，即可实现接地件与电路板的接地端电连接。
本申请的一些实施例中，接地件的两端分别由两个第一边沿处，向相反的方向延伸，并伸出摄像头电路板外，接地件的一端与相邻的屏蔽罩接触，且电连接，屏蔽罩与电子设备的电路板的接地端电连接；接地件的另一端与电子设备的电路板的接地层接触，且电连接。这样一来，即可实现摄像头电路板沿第一方向的两个第一边沿处均具有接地点，从而进一步确保摄像头模组与天线信号不会发生强耦合。
本申请的一些实施例中，接地件包括金属支架和导电层，金属支架设置于摄像头电路板远离镜头的一侧，导电层设置于金属支架与摄像头电路板之间，金属支架通过导电层与摄像头电路板电连接；金属支架与电子设备的电路板的接地端电连接。在该结构下，采用金属支架和导电层形成接地件，导电层贴合于摄像头电路板上，并与导电区域接触，即可实现导电层与摄像头电路板电连接；同时，金属支架与导电层接触并电连接，从而能够实现金属支架与摄像头电路板电连接；然后金属支架与电子设备的电路板的接地端电连接，即可实现增加摄像头模组与电路板之间的接地点。
本申请的一些实施例中，金属支架包括支架本体、第一连接端以及紧固件。支架本体与导电层贴合。第一连接端与支架本体固定连接，第一连接端由第一边沿伸出摄像头电路板外。第一连接端与电子设备的电路板之间通过紧固件固定连接，且第一连接端通过紧固件与电子设备的电路板的接地端电连接。这样一来，一方面通过紧固件能够实现金属支架与电子设备的电路板之间的相对固定；另一方面，通过紧固件实现金属支架与电子设备的电路板之间的电连接，即采用紧固件作为实现电子设备的电路板的接地端与金属支架的第一连接端之间电连接的连接结构，从而有利于减少零部件，以使整体结构更加紧凑。
本申请的一些实施例中，紧固件为螺钉。
本申请的一些实施例中，金属支架还包括第二连接端和金属弹片。第二连接端与支架本体固定连接，第二连接端与第一连接端的连线与第一方向相交。金属弹片的一端与第二连接端抵接，金属弹片的另一端与电子设备的电路板的接地端电连接。即第二连接端和第一连接端分别由两个第一边沿处伸出摄像头电路板外，以使摄像头电路板沿第一方向的两个第一边沿处均具有接地点。并且，由于紧固件使金属支架与电子设备的电路板相对固定，因此，第二连接端与电路板之间不需要另外设置固定结构， 所以，通过金属弹片抵接于第二连接端与电路板的接地端之间，即可实现第二连接端与电路板的接地端电连接。
本申请的一些实施例中，金属弹片与电子设备的电路板之间设置有屏蔽罩，屏蔽罩与电子设备的电路板的接地端电连接，金属弹片与屏蔽罩抵接。
本申请的一些实施例中，金属弹片与电子设备的电路板的接地端之间串联有匹配件，匹配件用于调节摄像头模组的谐振频率。这样一来，通过调节匹配件的数值大小，则能够实现对摄像头模组的谐振频率进行调节，从而确保摄像头模组与电子设备的天线信号不会发生强耦合，有利于提升摄像头模组的拍摄效果。
本申请的一些实施例中，导电层包括导电泡棉。
本申请的一些实施例中，导电层包括高介电材料或者吸波材料。
本申请的一些实施例中，摄像头模组还包括匹配件，匹配件串联于接地件与电子设备的电路板的接地端之间，匹配件用于调节摄像头模组的谐振频率。在该结构下，通过设置不同数值的匹配件，即可对摄像头模组的谐振频率进行调节，以确保摄像头模组与天线信号不会发生强耦合。
本申请的一些实施例中，匹配件包括电容或者电感。
本申请的一些实施例中，匹配件包括电容和电感，电容和电感相互并联，且相互并联的电容和电感串联于接地件与电子设备的电路板的接地端之间。
本申请的一些实施例中，摄像头模组包括前置摄像头模组。
第二方面，提供了一种电子设备，包括壳体、电路板以及摄像头模组。电路板设置于壳体内部。摄像头模组为如上任一技术方案所述的摄像头模组，摄像头模组设置于壳体内部，且摄像头模组的FPC板的第二端与电路板电连接；且摄像头模组的接地件与电路板的接地端电连接。
本申请第二方面提供的电子设备，由于包括如上任一技术方案所述的摄像头模组，因此，能够解决相同的技术问题，并且取得相同的技术效果。
本申请的一些实施例中，摄像头模组包括摄像头电路板和连接结构，连接结构的一端与摄像头电路板电连接，连接结构的另一端与电子设备的电路板电连接；摄像头电路板和连接结构沿分布方向的物理尺寸，与电子设备的天线工作频段的四分之一波长接近。
附图说明
图1为本申请实施例提供的电子设备的结构图；
图2为本申请实施例提供的电子设备的爆炸图；
图3为相关技术提供的摄像头模组与电路板之间的连接结构图；
图4为图3提供的摄像头模组的谐振特性图；
图5为本申请实施例提供的一种摄像头模组的结构图；
图6为图5的A-A剖面图；
图7为图5提供的摄像头模组与电路板之间的连接结构图；
图8为图5提供的摄像头模组的谐振特性图；
图9为本申请实施例提供的摄像头模组的接地件的结构图；
图10为本申请实施例提供的摄像头模组的另一种接地件的结构图；
图11为本申请实施例提供的摄像头模组的又一种接地件的结构图；
图12为本申请实施例提供的摄像头模组的又一种接地件的结构图；
图13为本申请实施例提供的另一种摄像头模组的结构图；
图14为图13的B-B剖面图；
图15为本申请实施例提供的一种摄像头电路板以及电路板与匹配件的连接结构图；
图16为本申请实施例提供的另一种摄像头电路板以及电路板与匹配件的连接结构图。
附图标记：10-电子设备；100-显示模组；110-透光盖板；120-显示屏；200-壳体；210-后盖；211-后盖主体；211a-安装缺口；212-镜头装饰件；212a-透光窗口；220-边框；230-中板；231-透光孔；300-电路板；400-电路板支架；500-摄像头模组；510-镜头；520-FPC板；530-摄像头电路板；531-第一边沿；532-第一表面；540-接地件；541-金属支架；541a-支架本体；541b-第一连接端；541c-第二连接端；541d-紧固件；541e-金属弹片；542-导电层；543-匹配件；600-屏蔽罩。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。
以下，术语“第一”、“第二”等仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”等的特征可以明示或者隐含地包括一个或者更多个该特征。
此外，本申请中，“上”、“下”等方位术语是相对于附图中的部件示意置放的方位来定义的，应当理解到，这些方向性术语是相对的概念，它们用于相对于的描述和澄清，其可以根据附图中部件所放置的方位的变化而相应地发生变化。
在本申请中，除非另有明确的规定和限定，术语“连接”应做广义理解，例如，“连接”可以是固定连接，也可以是可拆卸连接，或成一体；可以是直接相连，也可以通过中间媒介间接相连。
本申请实施例提供一种电子设备，该电子设备为具有拍摄功能的一类电子设备。具体地，该电子设备可以是便携式电子装置或者其他类型的电子装置。例如，电子设备可以是手机、平板电脑(tablet personal computer)、膝上型电脑(laptop computer)、个人数码助理(personal digital assistant，PDA)、监控器、照相机、个人计算机、笔记本电脑、车载设备、可穿戴设备、增强现实(augmented reality，AR)眼镜、AR头盔、虚拟现实(virtual reality，VR)眼镜或者VR头盔等。以下为了方便说明，均是以电子设备为手机为例进行的举例说明。
由上述可知，请参阅图1，图1为本申请实施例提供的电子设备10的结构图。在本实施例中，该电子设备10为手机，且电子设备10可以近似呈矩形板状。在此基础上，为了方便后文各实施例的描述，建立XYZ坐标系，定义电子设备10的宽度方向为X轴方向，电子设备10的长度方向为Y轴方向，电子设备10的厚度方向为Z轴方向。可以理解的是，电子设备10的坐标系可以根据实际需要进行灵活设置，本申请仅给出了一种示例，并不能认为是对本申请构成的特殊限制。
在本实施例中，请参阅图2，图2为本申请实施例提供的电子设备10的爆炸图。上述电子设备10可以包括显示模组100、壳体200、电路板300、电路板支架400以及摄像头模组500。
上述显示模组100用于显示图像、视频等。显示模组100可以包括透光盖板110和显示屏120，且透光盖板110与显示屏120层叠设置。透光盖板110可以采用普通的透光盖板110，用于保护显示屏120，以避免显示屏120因外力碰撞导致损坏，并且能够起到防尘作用；也可以采用具有触控功能的透光盖板110，以使电子设备10具有触控功能，从而使用户使用更加方便。因此，本申请对于透光盖板110的具体材质不作特殊限定。
此外，显示屏120可以采用柔性显示屏，也可以采用刚性显示屏。例如，显示屏120可以为有机发光二极管(organic light-emitting diode，OLED)显示屏，有源矩阵有机发光二极体或主动矩阵有机发光二极体(active-matrix organic light-emitting diode，AMOLED)显示屏，迷你发光二极管(mini organic light-emitting diode)显示屏，微型发光二极管(micro organic light-emitting diode)显示屏，微型有机发光二极管(micro organic light-emitting diode)显示屏，量子点发光二极管(quantum dot light emitting diodes，QLED)显示屏，液晶显示屏(liquid crystal display，LCD)。
上述壳体200用于保护电子设备10内部的电子器件。壳体200包括后盖210和边框220，后盖210位于显示屏120远离透光盖板110的一侧，并与透光盖板110、显示屏120层叠且间隔设置，边框220位于透光盖板110与后盖210之间。边框220固定于后盖210上，示例性地，边框220可以通过粘接固定的方式连接于后盖210上，边框220也可以与后盖210为一体成型结构，即边框220与后盖210为一个结构件整体。透光盖板110可以通过胶粘固定于边框220上，以使透光盖板110、后盖210以及边框220围成电子设备10的内部容纳空间。上述显示屏120、电路板300以及摄像头模组500均设置于该内部容纳空间内。
在一些实施例中，请继续参阅图2，上述壳体200还可以包括中板230。中板230设置于上述内部容纳空间内，并且中板230位于显示屏120远离透光盖板110的一侧。该中板230与边框220固定连接，示例性地，中板230与边框220之间可以通过胶粘固定连接，中板230与边框220也可以一体成型结构，即二者为一个结构件整体。中板230将上述内部容纳空间分隔为两个相互独立的空间。其中一个空间位于透光盖板110与中板230之间，显示屏120位于该空间内。另一个空间位于中板230与后盖210之间，电路板300、电路板支架400以及摄像头模组500均设置于该空间内。
上述电路板300用于设置电子设备10的电子元器件并实现电子元器件之间的电连接。示例性地，电子元器件可以为控制芯片(例如系统级芯片，system on chip，SOC)、图形控制芯片(graphics processing unit，GPU)、通用存储器(universal flash storage，UFS)、听筒以及闪光灯模组等。
上述电路板支架400设置于电子设备10的内部。具体地，电路板支架400设置于电路板300与后盖210之间。在一些实施例中，电路板支架400固定于中板230 上，并且电路板支架400覆盖电路板300朝向后盖210的表面上，采用柔性电路板(flexible printed circuit，FPC)、弹片等非固定结构连接的一些电子元器件(比如闪光灯模组)，以保护电路板300以及电路板300上的这些电子元器件，避免电子设备10在后盖210开启维修的过程中，因这些电子元器件的位置发生移动，而导致损坏。
上述摄像头模组500用于实现视频或者图像的拍摄。摄像头模组500包括但不限于主摄像头、广角摄像头以及长焦摄像头等，且摄像头模组500的结构形式包括但不限于直立式和潜望式。请继续参阅图2，摄像头模组500可以包括镜头510。其中，镜头510具有入光面，该入光面可以为镜头510内光学镜头510的入光面。
上述摄像头模组500可以包括前置摄像头模组和后置摄像头模组，且前置摄像头模组和后置摄像头模组均设置于中板230与后盖210之间。示例性地，上述后置摄像头模组固定于中板230上，且后置摄像头模组中的镜头510的入光面朝向后盖210。在一些实施例中，后盖210可以包括后盖主体211和镜头装饰件212，后盖主体211上开设有安装缺口211a，镜头装饰件212固定于安装缺口211a内。镜头装饰件212上设置有透光窗口212a，后置摄像头模组的镜头510入光面与透光窗口212a相对，使得外界的光线能够穿过透光窗口212a进入镜头510主体内，以实现电子设备10的后置摄像头模组拍摄视频或者图像。
上述中板230上开设有透光孔231，前置摄像头模组固定于中板230上，且前置摄像头模组中的镜头510的入光面与透光孔231相对，使得光线能够通过显示模组100，并穿过透光孔231进入前置摄像头模组中的镜头510主体内，以实现电子设备10的前置摄像头模组拍摄视屏或者图像。
此外，请参阅图3，图3为相关技术提供的摄像头模组500的结构图。摄像头模组500还包括摄像头电路板530和连接结构，例如，该连接结构可以包括FPC板520，摄像头电路板530与镜头510(图3中未示出)固定连接，FPC板520的一端与摄像头电路板530电连接，FPC板520的另一端与上述电路板300电连接，例如，FPC板520与电路板300之间可以通过板对板连接器(BTB连接器，Board-to-board Connectors)电连接。
摄像头模组500在拍摄视频或者图像时，电子设备10的射频天线会对摄像头模组500形成干扰，导致花屏、卡顿、冻屏、闪退、激发谐波等现象。例如，N78频段是目前5G网络的主要频段，而现有电子设备10的前置摄像头模组沿摄像头电路板530和FPC板520的分布方向(该方向为第一方向，图3中实线箭头a所示方向)的物理尺寸，与N78频段的四分之一波长接近，因此，请参阅图4，图4为图3提供的摄像头模组500的谐振特性图，当干扰信号的频率接近3.4G时，摄像头模组500会产生较强的电压，即图4中所示最大的波峰。同时，该谐振频率处于N78频段内，因此，当电子设备10在发射信号时，容易与前置摄像头模组在第一方向上发生强耦合，导致前置摄像头模组被干扰，影响拍摄效果。
基于此，为解决该问题，请参阅图5、图6和图7，图5为本申请实施例提供的一种摄像头模组500的结构图，图6为图5的A-A剖面图，图7为图5提供的摄像头模组500与电路板300之间的连接结构图。该摄像头模组500可以应用于上述电子设 备10中。并且，该摄像头模组500可以作为前置摄像头模组，也可以作为后置摄像头模组，本申请对此不作特殊限定。以下均以该摄像头模组500为前置摄像头模组为例进行说明。
具体地，本申请实施例提供的摄像头模组500除包括上述镜头510(图5和图7中未示出)、摄像头电路板530以及FPC板520以外，本申请实施例提供的摄像头模组500还包括接地件540，其中，摄像头电路板530具有相对设置的两个第一边沿531，两个第一边沿531的分布方向为第二方向(图5中虚线箭头b所示)，且第二方向与上述第一方向垂直。接地件540设置于摄像头电路板530上，并与摄像头电路板530电连接，接地件540由第一边沿531处伸出摄像头电路板530外，且与电路板300的接地端电连接。
这样一来，请参阅图8，图8为图5提供的摄像头模组500的谐振特性图，通过在摄像头电路板530的第一边沿531处增加接地点，从而能够改变摄像头电路板530沿第一方向的谐振点，如图8所示，该摄像头模组500不会在频率接近3.4G时，产生较强的电压，以使摄像头模组500的谐振点偏出电子设备10的敏感频段(例如，N78频段)，从而避免电子设备10的天线发射功率时，天线与摄像头模组500发生强耦合，导致摄像头模组500被干扰，进而有利于提升摄像头模组500的拍摄效果。
需要说明的是，上述第二方向与第一方向垂直是指，该第二方向与第一方向大致垂直，即第二方向与第一方向之间也可以具有一定角度的偏移，例如，正负5°的范围内。并且，上述第一方向和第二方向均可以为平行于XY平面的任意方向，本申请对此不作特殊限定。在以下实施例中，均以第一方向与Y轴方向平行，第二方向与X轴方向平行为例进行说明。
此外，摄像头电路板530远离镜头510的表面为第一表面532，第一表面532上具有导电区域(例如，漏铜区域，即摄像头电路板530的接地层)。
在一些实施例中，请参阅图9，图9为本申请实施例提供的摄像头模组500的接地件540的结构图。上述接地件540可以包括导电布或者铜皮，接地件540贴合于摄像头电路板530的第一表面532上，并与第一表面532上的导电区域接触，并电连接，以实现接地件540与摄像头电路板530电连接。并且，接地件540由摄像头电路板530的第一边沿531处伸出摄像头电路板530外，并与相邻的一个屏蔽罩600接触，并电连接。由于屏蔽罩600与电路板300的接地端是良好接触的，因此，接地件540与屏蔽罩600接触，即可实现接地件540与电路板300的接地端电连接，从而实现摄像头电路板530与电路板300的接地端电连接。
可以理解的是，上述接地件540由摄像头电路板530的第一边沿531处伸出摄像头电路板530外是指，接地件540(即导电布或者铜皮)在XY平面内的垂直投影，由第一边沿531处伸出摄像头电路板530的垂直投影覆盖的范围之外，即接地件540伸出摄像头电路板530的部分的垂直投影，与摄像头电路板530的垂直投影相互不重合。
此外，为更进一步确保摄像头模组500的拍摄效果，请参阅图10，图10为本申请实施例提供的摄像头模组500的另一种接地件540的结构图，接地件540沿上述第二方向(X轴方向)的两端分别由两个第一边沿531处伸出摄像头电路板530外，并 且，接地件540的一端可以与上述屏蔽罩600贴合接触，接地件540的另一端可以与电路板300的接地层接触并电连接。这样一来，摄像头电路板530上沿第一方向设置的两个第一边沿531处均设置有接地点，以实现更好的干扰抑制效果，从而有利于进一步提升摄像头模组500的拍摄效果。
下表1为设置有上述接地件540(导电布或者铜皮)的摄像头模组500和未设置接地件540的摄像头模组500的仿真测试结果。
表1
由上述表1可知，通过在摄像头模组500上设置接地件540，即在摄像头电路板530上贴装导电部或者铜皮，并且使导电部或者铜皮与电路板300的接地端电连接，能够提高摄像头模组500的隔离度，从而有利于提高摄像头模组500的干扰抑制效果。
在另一些实施例中，请参阅图11，图11为本申请实施例提供的摄像头模组500的又一种接地件540的结构图。上述接地件540还可以包括金属支架541和导电层542，导电层542贴合于第一表面532上，并与摄像头电路板530的导电区域接触并电连接。金属支架541设置于导电层542远离摄像头电路板530的一侧，并与导电层542贴合且电连接。即导电层542设置于金属支架541与摄像头电路板530的第一表面532之间，并且二者通过导电层542实现电连接。金属支架541由摄像头电路板530的第一边沿531处伸出，并与电路板300的接地端电连接。以实现摄像头电路板530沿第一方向上形成接地点。
具体地，请继续参阅图11，上述金属支架541可以包括支架本体541a、第一连接端541b以及紧固件541d，第一连接端541b与支架本体541a固定连接，第一连接端541b由摄像头电路板530的第一边沿531伸出摄像头电路板530外，第一连接端541b与电路板300之间通过紧固件541d(例如螺钉)固定连接，并且第一连接端541b通过紧固件541d与电路板300的接地端电连接。这样一来，一方面通过紧固件541d能够使支架本体541a与电路板300固定连接；另一方面，紧固件541d与电路板300连接时，只需要与电路板300的接地层接触，即可实现第一连接端541b通过紧固件541d与电路板300的接地端电连接，从而实现金属支架541与电路板300的接地端电连接。
此外，请参阅图12，图12为本申请实施例提供的摄像头模组500的又一种接地 件540的结构图上述金属支架541还可以包括第二连接端541c和金属弹片541e，第二连接端541c与支架本体541a固定连接，第二连接端541c与第一连接端541b沿上述第二方向分布，即第二连接端541c和第一连接端541b分别由摄像头电路板530的两个第一边沿531处伸出摄像头电路板530外，金属弹片541e抵接于电路板300的接地端与第二连接端541c之间。由于金属支架541的第一连接端541b与电路板300通过紧固件541d固定连接，即金属支架541的第二连接端541c也相对于电路板300固定，因此，将金属弹片541e抵接于第二连接端541c与电路板300的接地端之间，即可实现第二连接端541c与电路板300的接地端电连接。
此外，为进一步提升金属弹片541e的连接强度，金属弹片541e与第二连接端541c之间可以通过焊接等方式固定连接，而金属弹片541e的另一端也可以通过焊接的方式与电路板300的接地端电连接。从而避免出现金属弹片541e与第二连接端541c，或者与电路板300的接地端之间分离，导致连接中断的情况发生。
需要说明的是，上述第一连接端541b与支架本体541a之间，以及第二连接端541c与支架本体541a之间可以通过焊接等方式固定连接；也可以设计为一体成型结构，即第一连接端541b、支架本体541a以及第二连接端541c连接为一个整体。因此，本申请对此不作特殊限定。
另外，第一连接端541b和第二连接端541c由第一边沿531处伸出摄像头电路板530外是指，第一连接端541b和第二连接端541c在XY平面内的垂直投影，与摄像头电路板530在XY平面内的垂直投影不重合，并且第一连接端541b和第二连接端541c分别处于摄像头电路板530沿上述第二方向的两侧。
同时，上述第一连接端541b和第二连接端541c沿第二方向分布是指，二者可以沿第二方向处于同一条直线上，也可以错位分布。具体地，第一连接端541b和第二连接端541c的连线可以与第二方向平行，即与第一方向垂直；第一连接端541b和第二连接端541c的连线也可以与第二方向不平行，即与第一方向相交但不垂直。
此外，上述导电层542可以包括导电泡棉，导电泡棉具有良好的表面导电性，并且材质非常轻，因此，能够使金属支架541与摄像头电路板530电连接的同时，还有利于减轻电子设备10的重量。并且导电泡棉价格较低，有利于降低成本。
或者，上述导电层542还可以采用高介电材料或者吸波材料，采用高介电材料以及吸波材料，有利于实现高频状态下的接地效果，能够进一步确保摄像头电路板530与金属支架541之间良好导电，即确保了摄像头电路板530与电路板300的接地端良好连接。
在此基础上，为更进一步提升摄像头模组500的干扰抑制效果，以提升摄像头模组500的拍摄效果。请参阅图13和图14，图13为本申请实施例提供的另一种摄像头模组500的结构图，图14为图13的B-B剖面图，上述摄像头模组500还包括匹配件543，匹配件543串联于接地件540与电路板300的接地端之间。匹配件543用于调节摄像头模组500的谐振频率。即通过调节匹配件543的大小，以调节天线耦合到摄像头模组500的谐振点，从而使摄像头模组500的谐振频率大幅偏出敏感重点频段(例如，N78频段)，进而实现更好的干扰抑制效果，有利于更进一步提升摄像头模组500的拍摄效果。
在一些实施例中，上述匹配件543可以包括电容或者电感；或者，该匹配件543也可以包括电容和电感，电容和电感相互并联，并且将相互并联的电容和电感串联在接地件540与电路板300的接地端之间。从而实现对摄像头模组500的谐振点的调节，以实现摄像头模组500更好的干扰抑制效果。
下表2为设置有上述接地件540(包括金属支架541、导电层542以及匹配件543)的摄像头模组500、设置有接地件540(包括金属支架和导电层，未设置匹配件543)的摄像头模组500以及未设置接地件540的摄像头模组500的仿真测试结果。
表2
由上述表2可知，通过在摄像头模组500上设置接地件540，即在摄像头电路板530上贴装导电层542以及金属支架541，并且使金属支架541与电路板300的接地端电连接，相比于接地的方案，能够提高摄像头模组500的隔离度。在金属支架541与电路板300之间串联匹配件543的方案，相比于未设置匹配件543的方案，能够更进一步提高摄像头模组500的隔离度，从而有利于更进一步提高摄像头模组500的干扰抑制效果。
示例性地，请参阅图15，图15为本申请实施例提供的一种摄像头电路板530以及电路板300与匹配件543的连接结构图。匹配件543可以串联于上述金属弹片541e与电路板300的接地端之间，例如，将一个电容串联于金属弹片541e与电路板300的接地端之间，然后，通过在金属弹片541e与电路板300的接地端之间串联不同大小的电容，即调节电容的大小，以实现对摄像头模组500的谐振点的调节，从而避免电子设备10的天线发射信号时，与摄像头模组500发生强耦合。
在另一些实施例中，请参阅图16，图16为本申请实施例提供的另一种摄像头电路板530以及电路板300与匹配件543的连接结构图。上述匹配件543还可以串联于一个屏蔽罩600与电路板300的接地端之间，然后将金属弹片541e与屏蔽罩600抵接，也可以实现第二连接端541c与电路板300的接地端电连接，进而实现摄像头电 路板530通过金属支架541与电路板300的接地端电连接。
具体地，金属弹片541e与第二连接端541c之间，以及金属弹片541e与屏蔽罩600之间均可以通过焊接固定的方式固定连接，一方面能够实现第二连接端541c与屏蔽罩600之间电连接，另一方面，有利于提升金属弹片541e与第二连接端541c以及屏蔽罩600之间的连接强度。
在本说明书的描述中，具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以所述权利要求的保护范围为准。

Claims (20)

  1. 一种摄像头模组，应用于电子设备中，其特征在于，包括：
    镜头；
    摄像头电路板，固定于所述镜头上；
    接地件，设置于所述摄像头电路板上，并与所述摄像头电路板电连接，所述接地件与电子设备的电路板的接地端电连接。
  2. 根据权利要求1所述的摄像头模组，其特征在于，所述摄像头模组还包括：
    连接结构，所述连接结构的第一端与所述摄像头电路板电连接，所述连接结构的第二端与所述电子设备的电路板电连接；所述连接结构与所述摄像头电路板的分布方向为第一方向，所述摄像头电路板上沿垂直于所述第一方向的方向分布的两个边沿为第一边沿；所述接地件由所述第一边沿处伸出所述摄像头电路板外，并与所述电子设备的电路板的接地端电连接。
  3. 根据权利要求2所述的摄像头模组，其特征在于，所述摄像头电路板远离所述镜头的表面上形成有导电区域，所述接地件贴合于所述导电区域上，并与所述摄像头电路板电连接；所述接地件由所述第一边沿伸出所述摄像头电路板，并与所述电子设备的电路板的接地端电连接。
  4. 根据权利要求3所述的摄像头模组，其特征在于，所述导电区域包括所述摄像头电路板的接地层。
  5. 根据权利要求3所述的摄像头模组，其特征在于，所述接地件的两端分别由两个所述第一边沿处伸出所述摄像头电路板，并且分别与所述电子设备的电路板的接地端电连接。
  6. 根据权利要求2～5任一项所述的摄像头模组，其特征在于，所述接地件包括导电布或者铜皮。
  7. 根据权利要求6所述的摄像头模组，其特征在于，所述接地件由所述第一边沿处，沿远离所述摄像头电路板的方向，伸出所述摄像头电路板外，并与相邻的一个屏蔽罩接触，且电连接；
    所述屏蔽罩与所述电子设备的电路板的接地端电连接。
  8. 根据权利要求7所述的摄像头模组，其特征在于，所述接地件的两端分别由两个所述第一边沿处，向相反的方向延伸，并伸出所述摄像头电路板外，所述接地件的一端与相邻的所述屏蔽罩接触，且电连接，所述屏蔽罩与所述电子设备的电路板的接地端电连接；所述接地件的另一端与所述电子设备的电路板的接地层接触，且电连接。
  9. 根据权利要求2～5任一项所述的摄像头模组，其特征在于，所述接地件包括金属支架和导电层，所述金属支架设置于所述摄像头电路板远离所述镜头的一侧，所述导电层设置于所述金属支架与摄像头电路板之间，所述金属支架通过所述导电层与所述摄像头电路板电连接；所述金属支架与所述电子设备的电路板的接地端电连接。
  10. 根据权利要求9所述的摄像头模组，其特征在于，所述金属支架包括：
    支架本体，与所述导电层贴合；
    第一连接端，与所述支架本体固定连接，所述第一连接端由所述第一边沿伸出所述摄像头电路板外；
    紧固件，所述第一连接端与所述电子设备的电路板之间通过所述紧固件固定连接，且所述第一连接端通过所述紧固件与所述电子设备的电路板的接地端电连接。
  11. 根据权利要求10所述的摄像头模组，其特征在于，所述紧固件为螺钉。
  12. 根据权利要求10所述的摄像头模组，其特征在于，所述金属支架还包括：
    第二连接端，与所述支架本体固定连接，所述第二连接端与所述第一连接端的连线与所述第一方向所在直线相交；
    金属弹片，一端与所述第二连接端连接，另一端与所述电子设备的电路板的接地端电连接。
  13. 根据权利要求12所述的摄像头模组，其特征在于，所述金属弹片与所述电子设备的电路板之间设置有屏蔽罩，所述屏蔽罩与所述电子设备的电路板的接地端电连接，所述金属弹片与所述屏蔽罩电连接。
  14. 根据权利要求9～13任一项所述的摄像头模组，其特征在于，所述导电层包括导电泡棉。
  15. 根据权利要求9～13任一项所述的摄像头模组，其特征在于，所述导电层包括高介电材料或者吸波材料。
  16. 根据权利要求1～15任一项所述的摄像头模组，其特征在于，所述摄像头模组还包括匹配件，所述匹配件串联于所述接地件与所述电子设备的电路板的接地端之间，所述匹配件用于调节所述摄像头模组的谐振频率。
  17. 根据权利要求16所述的摄像头模组，其特征在于，所述匹配件包括电容和电感，所述电容和所述电感相互并联，且相互并联的所述电容和所述电感串联于所述接地件与所述电子设备的电路板的接地端之间。
  18. 根据权利要求1～17任一项所述的摄像头模组，其特征在于，所述摄像头模组包括前置摄像头模组。
  19. 一种电子设备，其特征在于，包括：
    壳体；
    电路板，设置于所述壳体内部；
    摄像头模组，为权利要求1～18任一项所述的摄像头模组，所述摄像头模组设置于所述壳体内部，所述摄像头模组的接地件与所述电路板的接地端电连接。
  20. 根据权利要求19所述的电子设备，其特征在于，所述摄像头模组包括摄像头电路板和连接结构，所述连接结构的一端与所述摄像头电路板电连接，所述连接结构的另一端与所述电路板电连接；
    所述摄像头电路板和所述连接结构沿分部方向的物理尺寸，与所述电子设备的天线工作频段的四分之一波长接近。
PCT/CN2023/079547 2022-08-25 2023-03-03 一种摄像头模组以及电子设备 Ceased WO2024040913A1 (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP23856010.6A EP4507316A4 (en) 2022-08-25 2023-03-03 CAMERA MODULE AND ELECTRONIC DEVICE
US18/869,744 US20250338003A1 (en) 2022-08-25 2023-03-03 Camera module and electronic device
CN202380008174.XA CN116671118B (zh) 2022-08-25 2023-03-03 一种摄像头模组以及电子设备

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202222246568.4 2022-08-25
CN202222246568.4U CN219164662U (zh) 2022-08-25 2022-08-25 一种摄像头模组以及电子设备

Publications (1)

Publication Number Publication Date
WO2024040913A1 true WO2024040913A1 (zh) 2024-02-29

Family

ID=86621342

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2023/079547 Ceased WO2024040913A1 (zh) 2022-08-25 2023-03-03 一种摄像头模组以及电子设备

Country Status (2)

Country Link
CN (1) CN219164662U (zh)
WO (1) WO2024040913A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4507316A4 (en) * 2022-08-25 2025-09-03 Honor Device Co Ltd CAMERA MODULE AND ELECTRONIC DEVICE

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070013786A (ko) * 2005-07-27 2007-01-31 엘지전자 주식회사 이동통신 단말기
CN209691992U (zh) * 2019-05-09 2019-11-26 Oppo广东移动通信有限公司 摄像头模组接地弹片、摄像头组件及电子设备
CN212086313U (zh) * 2020-06-22 2020-12-04 湖南金康光电有限公司 摄像头模组及电子设备
CN112602309A (zh) * 2018-09-04 2021-04-02 华为技术有限公司 摄像头支架、摄像头组件及终端
CN213367941U (zh) * 2020-11-27 2021-06-04 维沃移动通信有限公司 电子设备

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070013786A (ko) * 2005-07-27 2007-01-31 엘지전자 주식회사 이동통신 단말기
CN112602309A (zh) * 2018-09-04 2021-04-02 华为技术有限公司 摄像头支架、摄像头组件及终端
CN209691992U (zh) * 2019-05-09 2019-11-26 Oppo广东移动通信有限公司 摄像头模组接地弹片、摄像头组件及电子设备
CN212086313U (zh) * 2020-06-22 2020-12-04 湖南金康光电有限公司 摄像头模组及电子设备
CN213367941U (zh) * 2020-11-27 2021-06-04 维沃移动通信有限公司 电子设备

Also Published As

Publication number Publication date
CN219164662U (zh) 2023-06-09

Similar Documents

Publication Publication Date Title
KR102046864B1 (ko) 유연성 디스플레이 장치
KR102079071B1 (ko) 전자 장치
AU2017392558A1 (en) Camera module and mobile terminal
CN116671118B (zh) 一种摄像头模组以及电子设备
WO2016173500A1 (zh) 一种移动终端和用于改善其显示屏emc性能的装置
KR20240054830A (ko) 폴더블 전자 장치
WO2024040913A1 (zh) 一种摄像头模组以及电子设备
US7813138B2 (en) Electronic device
CN110687968B (zh) 电子设备及其装配方法
CN113489890B (zh) 拍摄装置以及电子设备
CN118472604B (zh) 一种电子设备
CN113224125B (zh) 一种显示模组以及具有其的显示装置
CN218888626U (zh) 一种摄像头模组以及电子设备
CN219017911U (zh) 一种电子设备
CN115696819B (zh) 一种电子设备
WO2023169291A1 (zh) 一种摄像模组及电子设备
CN115693104B (zh) 一种天线连接装置、天线组件和电子设备
US20260074414A1 (en) Antenna and electronic device
CN112068342A (zh) 显示屏及电子设备
EP4733884A1 (en) Foldable electronic device
EP4379501A1 (en) Foldable electronic device
CN219065845U (zh) 镜头模组及电子装置
CN222215835U (zh) 摄像头模组及电子设备
CN220383159U (zh) 一种共基板的双摄像模组
CN118450227A (zh) 一种电子设备

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 23856010

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2023856010

Country of ref document: EP

ENP Entry into the national phase

Ref document number: 2023856010

Country of ref document: EP

Effective date: 20241106

WWE Wipo information: entry into national phase

Ref document number: 18869744

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE

WWP Wipo information: published in national office

Ref document number: 18869744

Country of ref document: US