WO2024041012A1 - 便携式电子装置 - Google Patents

便携式电子装置 Download PDF

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Publication number
WO2024041012A1
WO2024041012A1 PCT/CN2023/090621 CN2023090621W WO2024041012A1 WO 2024041012 A1 WO2024041012 A1 WO 2024041012A1 CN 2023090621 W CN2023090621 W CN 2023090621W WO 2024041012 A1 WO2024041012 A1 WO 2024041012A1
Authority
WO
WIPO (PCT)
Prior art keywords
hole
sub
sound
electronic device
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2023/090621
Other languages
English (en)
French (fr)
Inventor
付振彪
马喆
杨红德
薛康乐
邸希剑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honor Device Co Ltd
Original Assignee
Honor Device Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honor Device Co Ltd filed Critical Honor Device Co Ltd
Priority to CN202380059784.2A priority Critical patent/CN119698825A/zh
Priority to EP23856107.0A priority patent/EP4465619B1/en
Publication of WO2024041012A1 publication Critical patent/WO2024041012A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/03—Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets
    • H04M1/035—Improving the acoustic characteristics by means of constructional features of the housing, e.g. ribs, walls, resonating chambers or cavities
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/03—Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly

Definitions

  • the present application relates to the technical field related to mobile communication equipment, and in particular, to a portable electronic device.
  • This application provides a portable electronic device that can solve the technical problem of being unable to ensure the stability of the microphone's sound collection effect in a limited space.
  • the portable electronic device includes a main body, a camera module, a noise reduction microphone and a sound pickup hole.
  • the main body includes first and second sides and an outer surface. The first and second sides are located on On opposite sides of the outer surface, the camera module is assembled on the main body and exposes the outer surface.
  • the main body includes a circuit board, the noise reduction microphone is mounted on the circuit board, and the sound pickup hole includes a sound receiving end.
  • the sound-receiving end penetrates the outer surface, the sound-receiving end is located on one side of the outer surface and close to the first side, the sound-emitting end is opened on the circuit board and It is connected to the sound outlet of the noise reduction microphone; along the width direction of the portable electronic device, the sound pickup hole is located between the camera module and the first side, and the sound pickup hole reaches The distance from the first side is smaller than the distance from the sound pickup hole to the second side.
  • the camera module can be understood as being located at the upper left corner of the portable electronic device.
  • the distance between the sound pickup hole and the first end is smaller than the distance between the sound pickup hole and the second end;
  • the distance is less than the distance between the sound pickup hole and the second side, and the sound pickup hole is located between the camera module and the first side (there is a sufficient distance from the camera module to ensure that the camera can achieve noise reduction when taking pictures) Purpose).
  • the sound pickup hole is located at the edge of the circuit board and the edge of the mobile phone. There are many components and shrapnel on the circuit board.
  • the sound pickup hole is set at the edge of the circuit board, not in the middle, nor inside the camera assembly.
  • Partial pickup holes are provided in the middle of the circuit board, which is more conducive to the layout and design of electronic components on the circuit board, improves the utilization rate of the circuit board, reduces the use of the internal space of the electronic device, and saves the internal space of the electronic device.
  • the sound-picking hole includes the sound-receiving end, a sound-passing slit, a third sub-hole, a second sub-hole, a connecting slit, a first sub-hole and the sound-emitting end.
  • the sound-receiving end, The sound-passing gap, the third sub-hole, the second sub-hole, the connecting gap, the first sub-hole and the sound outlet are connected in sequence to form a hole structure extending in a curve.
  • the sound pickup hole is arranged into a hole structure extending in a curve, which can make full use of the space between the internal structures of the electronic device, such as the middle frame, the arrangement and gaps between the circuit board, the bracket, and the camera module. In a certain area, the flexibility of setting the pickup position is improved.
  • the sound receiving end is located at one end of the sound transmission gap and penetrates the outer surface
  • the sound output end is one end of the first sub-hole
  • the sub-hole, the connecting gap, the first sub-hole and the sound outlet are located inside the main body, and the axial direction of the first sub-hole, the second sub-hole and the third sub-hole are in the thickness direction of the portable electronic device Parallel
  • the third sub-hole and the second sub-hole are offset from the first sub-hole
  • the connection gap and the sound-passing slit are directed toward the third sub-hole along the width direction of the portable electronic device.
  • the sound pickup hole in this embodiment is not limited to a hole through the plate.
  • the gap between the middle frame, the circuit board, the bracket and the back shell is also used to simplify the structure and facilitate the formation of the sound pickup hole.
  • the main body includes a middle frame, a frame surrounding the periphery of the middle frame, and a motherboard bracket, the first sub-hole penetrates the circuit board, and the second sub-hole penetrates the motherboard bracket, so
  • the connection gap is located between the mainboard bracket and the circuit board;
  • the frame is concave with a clamping groove toward the inner side of the mainboard bracket, and the mainboard bracket is provided with a buckle, and the buckle is connected with the third
  • the two sub-holes are adjacent, and the buckle extends along the width direction of the portable electronic device;
  • the circuit board is disposed between the middle frame and the motherboard bracket, and the buckle is locked with the card slot.
  • the second sub-hole penetrates the mainboard bracket and the frame that indirectly carries the mainboard bracket is clamped with the slot through buckles, thereby increasing the mutual interaction in the axis direction of the second sub-hole.
  • the holding force can increase the fixing force between the motherboard bracket and the middle frame in the thickness direction of the electronic device, and is used to enhance the assembly tightness between the motherboard bracket, the circuit board and the middle frame, the connection gap and the second sub-hole. Sealing performance, thereby ensuring the sealing performance of the sound pickup hole to ensure the sound pickup effect.
  • the motherboard bracket is provided with a connection hole
  • the buckle and the connection hole are located on opposite sides of the second sub-hole respectively, and the hole axis of the connection hole is along the axis of the portable electronic device.
  • the thickness direction of the device extends; the connection holes are connected with screws to firmly connect the circuit board and the motherboard bracket.
  • the second sub-hole is provided through the mainboard bracket and the circuit board is directly connected and fixed with screws.
  • the connecting holes and buckles of the connecting screws are located on opposite sides of the second sub-hole, further improving the mainboard bracket. The tightness of assembly with the circuit board ensures the sealing performance of the connection gap and the second sub-hole, thereby ensuring the sealing performance of the sound pickup hole to ensure the sound pickup effect.
  • a spring piece is provided on the circuit board, and the spring piece is adjacent to the first sub-hole.
  • the mainboard bracket includes a body and a retaining wall, and the second sub-hole penetrates two opposite holes of the body.
  • the buckle is located on one side of the body, and the retaining wall is located on the other side of the body and is spaced opposite to the buckle;
  • a cantilever is provided on the retaining wall.
  • the connection point between the cantilever and the body is a hollow area.
  • the hollow area and the second sub-hole are spaced apart along the width direction of the portable electronic device.
  • the buckle and The connecting holes are spaced apart from the retaining walls on both sides of the hollow area, and the elastic pieces elastically resist between the retaining walls and the circuit board.
  • the motherboard bracket and the frame that indirectly carries the motherboard bracket are held by buckles and the slots, and the elastic pieces elastically resist the elastic resistance between the retaining wall and the circuit board.
  • the force can be offset by the holding force of the buckle and the card slot, preventing the elastic resistance force from pushing the motherboard bracket away from the circuit board and increasing the gap size of the connection gap.
  • the elastic force of the elastic piece pushes against the retaining wall in a direction away from the circuit board. Since the hollow area and the second sub-hole are spaced along the width direction of the portable electronic device, the screws and buckles are located On the opposite sides of the second sub-hole, the elastic force will go around the hollow area and be transmitted along the cantilever to both sides of the hollow area, and can pass through screws and buckles. Decompose the elastic force to further reduce the reaction force on the motherboard bracket, thereby ensuring the sealing performance of the connection gap and the second sub-hole to ensure the sound pickup effect.
  • the body includes a first surface and a second surface disposed opposite to the first surface, the second surface is concavely provided with a groove, and the second sub-hole penetrates the concave surface.
  • the groove bottom wall of the groove is connected with the hollow area and is used to accommodate sealing foam.
  • the end of the second sub-hole away from the connection gap is sealed by placing the sealing foam in the groove, and the sealing foam is sealed on the periphery of the end of the second sub-hole located at the bottom wall of the groove, improving the The sealing performance of the second sub-hole.
  • the bracket of this embodiment will press against the sealing foam, so that it has a better sealing effect; the sealing foam is set in the groove and will not be directly affected by the insufficient fixing force between the bracket and the motherboard bracket. Further, The sealing effect of the second sub-hole is guaranteed.
  • a recess is provided on the first surface, the second sub-hole penetrates the bottom of the recess, the recess and the groove at least partially overlap in the thickness direction of the portable electronic device, and the recess is
  • the connection gap is formed between the bottom and the surface of the circuit board.
  • the gap between the circuit board and the motherboard bracket connected to the second sub-hole is divided into areas by the concave portion, that is, a connecting gap is formed between the concave portion and the surface of the circuit board, instead of a flat surface and a surface of the circuit board. Setting a gap directly between the planes can control the gap area, and is more conducive to the sealing performance of the concave part, which in turn is more conducive to the sealing of the connecting gap to ensure the sound pickup effect.
  • the main body includes a rear shell mounted on the middle frame.
  • the rear shell includes a shell and a cover plate covering the shell.
  • the sound receiving end penetrates the side edge of the cover plate.
  • the sound transmission gap is formed between the cover plate and the outer surface of the housing, and the sound transmission gap is connected with the sound receiving end.
  • the gap between the cover of the fixed camera assembly and the back cover is used to form a sound gap as part of the sound pickup hole, and the sound pickup end of the sound pickup hole is located at the side of the back shell, that is, in contact with the electronic
  • the position where the thickness directions of the devices intersect makes full use of the space and is conducive to the reception of sound pickup effects.
  • a bracket is provided on the surface of the housing facing away from the outer surface.
  • the bracket supports the camera module.
  • the third sub-hole penetrates the housing along the thickness direction of the electronic device. At the edge of the body and the bracket, one end of the third sub-hole is connected to the second sub-hole, and the other end is connected to the sound communication gap.
  • the third sub-hole is arranged on the edge of the bracket, close to the camera module, which is beneficial to ensuring the sound effect when the camera records video.
  • the present application provides a portable electronic device, which includes a middle frame, a frame surrounding the periphery of the middle frame, a circuit board, a motherboard bracket, a noise reduction microphone and a sound pickup hole;
  • the circuit board includes a front and a back, and the back is provided with elastic pieces;
  • the sound pickup hole includes a first sub-hole, a connecting gap and a second sub-hole connected in sequence.
  • the first sub-hole penetrates the front and back and is adjacent to the elastic piece.
  • the second sub-hole penetrates the motherboard bracket. ;
  • the motherboard bracket is provided with buckles and connection holes, the buckles and the connection holes are located on opposite sides of the second sub-hole, and the buckles extend along the width direction of the portable electronic device;
  • the hole axis of the connecting hole extends along the thickness direction of the portable electronic device;
  • the frame is recessed with a slot toward the inner side of the motherboard bracket;
  • the noise reduction microphone is installed on the front side of the circuit board and communicates with one end of the first sub-hole.
  • the circuit board is provided between the middle frame and the mainboard bracket.
  • the connection gap is formed on the mainboard bracket.
  • the elastic piece elastically resists the circuit board and the mainboard bracket, the buckle is clamped with the card slot, and the connection hole is connected with a screw to firmly connect the circuit board. and the motherboard bracket.
  • the mainboard bracket and the frame are held by the card slot through buckles, and are screwed to the circuit board through screws.
  • the connecting holes and buckles of the connecting screws are located on opposite sides of the second sub-hole.
  • the spring piece elastically resists the elastic resistance between the mainboard bracket and the circuit board and can be buckled with the slot.
  • the clamping force of the motherboard is offset to prevent the elastic resistance force from pushing the motherboard bracket away from the circuit board, thereby avoiding increasing the gap size of the connection gap, thereby ensuring the sealing performance of the sound pickup hole to ensure the sound pickup effect.
  • the motherboard bracket includes a body and a retaining wall, the second sub-hole penetrates two opposite surfaces of the body, the buckle is located on one side of the body, and the retaining wall is provided on the The other side of the body is opposite to the buckle space;
  • a cantilever is provided on the retaining wall.
  • the connection point between the cantilever and the body is a hollow area.
  • the hollow area and the second sub-hole are spaced apart along the width direction of the portable electronic device.
  • the buckle and The connecting holes are spaced apart from the retaining walls on both sides of the hollow area, and the elastic pieces elastically resist between the retaining walls and the circuit board.
  • the elastic force of the elastic piece pushes against the retaining wall in a direction away from the circuit board. Since the hollow area and the second sub-hole are spaced along the width direction of the portable electronic device, screws and clips
  • the buckles are located on opposite sides of the second sub-hole, and the elastic force will pass around the hollow area and along the cantilever to both sides of the hollow area.
  • the elastic force can be decomposed through the screws and buckles, further reducing the reaction force on the circuit board, and thus Ensure the sealing performance of the connection gap and the second sub-hole to ensure the sound pickup effect.
  • the body includes a first surface and a second surface disposed opposite to the first surface, the second surface is concavely provided with a groove, and the second sub-hole penetrates the concave surface.
  • the groove bottom wall of the groove is connected with the hollow area and is used to accommodate sealing foam.
  • the end of the second sub-hole away from the connection gap is sealed by placing the sealing foam in the groove, and the sealing foam is sealed on the periphery of the end of the second sub-hole located at the bottom wall of the groove, improving the The sealing performance of the second sub-hole.
  • the bracket of this embodiment will press against the sealing foam, so that it has a better sealing effect; the sealing foam is set in the groove and will not be directly affected by the insufficient fixing force between the bracket and the motherboard bracket. Further, The sealing effect of the second sub-hole is guaranteed.
  • a recess is provided on the first surface, the second sub-hole penetrates the bottom of the recess, the recess and the groove at least partially overlap in the thickness direction of the portable electronic device, and the recess is
  • the connection gap is formed between the bottom and the surface of the circuit board.
  • the gap between the circuit board and the motherboard bracket connected to the second sub-hole is divided into areas by the concave portion, that is, a connecting gap is formed between the concave portion and the surface of the circuit board, instead of a flat surface and a surface of the circuit board. Setting a gap directly between the planes can control the gap area, and is more conducive to the sealing performance of the concave part, which in turn is more conducive to the sealing of the connecting gap to ensure the sound pickup effect.
  • the sound pickup hole includes the sound receiving end and the sound passing gap
  • the main body includes a rear shell mounted on the middle frame
  • the rear shell includes a shell and a cover covering the shell. board
  • the sound-collecting end penetrates the side edge of the cover plate
  • the sound-passing gap is formed between the cover plate and the outer surface of the housing in the thickness direction of the electronic device, and the sound-passing gap is connected to the outer surface of the housing.
  • the radio terminal is connected.
  • the gap between the cover of the fixed camera assembly and the back cover is used to form a sound gap as part of the sound pickup hole, and the sound pickup end of the sound pickup hole is located at the side of the back shell, that is, in contact with the electronic
  • the position where the thickness directions of the devices intersect makes full use of the space and is conducive to the reception of sound pickup effects.
  • the sound pickup hole includes a third sub-hole, and a bracket is provided on the surface of the housing facing away from the outer surface.
  • the bracket supports the camera module along the thickness direction of the electronic device.
  • the third sub-hole penetrates the edge of the housing and the bracket, one end of the third sub-hole is connected to the second sub-hole, and the other end is connected to the sound communication gap.
  • the third sub-hole is arranged on the edge of the bracket, close to the camera module, which is beneficial to the sound effect when the camera is recording. ensure.
  • the portable electronic device described in this application arranges the sound pickup hole at the edge of the circuit board, not in the middle position, nor inside the camera assembly. There is no need to provide partial sound pickup holes in supplementary positions in the circuit board, which is more conducive to the electronic components on the circuit board.
  • the layout and design improve the utilization rate of the circuit board, reduce the use of the internal space of the electronic device, and save the internal space of the electronic device.
  • Figure 1 is a schematic three-dimensional structural diagram of a portable electronic device provided by an embodiment of the present application.
  • FIG 2 is a partial structural schematic diagram of the portable electronic device shown in Figure 1;
  • Figure 3 is an angular cross-sectional view of the portable electronic device shown in Figure 1;
  • Figure 4 is a schematic diagram of the internal structure of the portable electronic device shown in Figure 1;
  • FIG. 5 is a schematic structural diagram of the motherboard bracket of the portable electronic device shown in Figure 1;
  • FIG. 6 is an angular cross-sectional view of the portable electronic device shown in FIG. 1 .
  • the portable electronic device includes a main body, a camera module, a noise reduction microphone and a sound pickup hole.
  • the main body includes first and second sides and an outer surface. The first and second sides are located on On opposite sides of the outer surface, the camera module is assembled on the main body and exposes the outer surface.
  • the main body includes a circuit board, the noise reduction microphone is mounted on the circuit board, and the sound pickup hole includes a sound receiving end.
  • the sound-receiving end penetrates the outer surface, the sound-receiving end is located on one side of the outer surface and close to the first side, the sound-emitting end is opened on the circuit board and It is connected to the sound outlet of the noise reduction microphone; along the width direction of the portable electronic device, the sound pickup hole is located between the camera module and the first side, and the sound pickup hole reaches The distance from the first side is smaller than the distance from the sound pickup hole to the second side.
  • FIG. 1 is a schematic structural diagram of a portable electronic device 100 provided by an embodiment of the present application.
  • FIG. 2 is a partial structural diagram of the portable electronic device 100 shown in FIG. 1 , with the rear shell removed.
  • the portable electronic device can be a mobile phone, a tablet computer, a headset, an audio player, a smart watch, etc. with functions of playing audio and recording. Functional electronic products.
  • the embodiment of the present application takes the portable electronic device 100, a mobile phone, as an example for description.
  • the width direction of the portable electronic device 100 is defined as the X-axis direction, and the thickness is defined as the Y-axis direction, which is the arrangement direction of the main body A and the display screen B; the width and length direction of the portable electronic device 100 is defined as the Z-axis direction.
  • the portable electronic device 100 includes a main body A, a display screen B, a camera assembly 50 , a microphone module and a sound pickup hole 60 .
  • the display screen B is installed on one side of the main body A, and the camera assembly 50 is installed on the other side of the main body A.
  • Display B is used to operate the mobile phone and display the functional interface, images and images of the mobile phone;
  • display B can be an organic light-emitting diode OLED (Organic Light-Emitting Diode) display, or of course, a liquid crystal display. In this embodiment, it is an OLED display.
  • OLED Organic Light-Emitting Diode
  • the camera assembly 50 includes two or more camera modules 50A and flashes, which are used for the photo and video functions of the mobile phone.
  • the camera assembly 50 of this embodiment includes three camera modules 50A.
  • the three camera modules are arranged on the left edge or right edge of the main body A near the top.
  • the first camera module 50A is the main camera
  • the second and third camera modules are auxiliary cameras, which can be depth cameras, telephoto/wide-angle cameras, or black and white cameras, etc. It should be noted that the three cameras are just an embodiment and can be arranged side by side or in a ring.
  • the main body A of the portable electronic device 100 includes a top side 101 and a bottom side 102 as well as first and second sides 103 and 104.
  • the top side 101 is provided with a sound hole for emitting sound
  • the bottom side 102 is provided with a microphone sound hole.
  • the sound hole and microphone sound hole can also be used for the transmission of external functional sounds. This embodiment only lists some of the functional components of the mobile phone.
  • the top edge 101 and the bottom edge 102 may also include other functional holes, buttons and other structures, which are not limited to the description in this embodiment.
  • the first side 103 and the second side 104 are used to set the volume key or the power off key of the mobile phone. It can be understood that when the display screen B is installed on the main body A, the top side 101 and the bottom side 102 of the main body are also the top and bottom of the portable electronic device 100 , and the first side 103 and the second side 104 are also two sides of the portable electronic device 100 . side.
  • FIG. 3 is an angular cross-sectional view of the portable electronic device shown in FIG. 1 ; the main body A also includes a rear case 10 , a middle frame assembly 20 and a circuit board 30 .
  • subject A is not limited to the listed devices, but also includes devices such as speakers, antennas, processors, etc., which meet the multi-functional performance of existing mobile phones, so I will not go into details here.
  • the middle frame assembly 20 is used to carry the rear case 10 , the circuit board 30 and the microphone module, as well as the display screen B and the camera assembly 50 .
  • the rear case 10 and the display screen B are located on opposite sides of the middle frame assembly 20 , and the rear case 10 is located on the back of the portable electronic device 100 .
  • the microphone module is located on the side of the circuit board 30 facing away from the back case 10 and is electrically connected to the circuit board 30 .
  • the camera assembly 50 is located on the side of the main body A facing away from the display screen B and exposes the back case 10 .
  • the sound pickup hole 60 is located inside the main body A and communicates with the outside of the mobile phone.
  • the microphone module includes a main microphone (not shown), a secondary microphone (not shown) and a noise reduction microphone 40 .
  • the main microphone and the auxiliary microphone are respectively located in the main body A near the top edge 101 and the bottom edge 102.
  • the mobile phone is also equipped with a speaker (not shown) for playing audio.
  • the speaker is located in the main body A near the top edge 101 and connected with the above-mentioned Sound hole corresponding.
  • the main microphone is used for the mobile phone to pick up external audio (including noise reduction function) during recording, video and other functions.
  • a sound pickup hole is provided on the top side 101 or the back of the main body corresponding to the main microphone for volume to pass through.
  • the secondary microphone corresponds to the microphone sound hole and is generally used to pick up speech audio when talking on a mobile phone.
  • the noise reduction microphone is used to work simultaneously with the main microphone to pick up external noise for noise reduction.
  • the noise reduction microphone 40 can work simultaneously with the main microphone to pick up external noise for noise reduction.
  • the sound-picking hole includes the sound-receiving end, a sound-passing slit, a third sub-hole, a second sub-hole, a connecting slit, a first sub-hole and the sound-emitting end.
  • the sound-receiving end, the sound-passing slit, the third sub-hole The sub-hole, the second sub-hole, the connecting gap, the first sub-hole and the sound outlet are connected in sequence to form a hole structure extending in a curve.
  • the sound pickup hole is arranged into a hole structure extending in a curve. You can make full use of the space between the internal structures of electronic devices, such as the middle frame, the arrangement and gaps between circuit boards, brackets, and camera modules, to improve the flexibility of setting the pickup position in a certain area.
  • the sound pickup hole 60 includes a sound pickup end 61 and a sound output end.
  • the sound pickup hole 60 penetrates the rear case 10, the middle frame assembly 20 and the circuit board 30.
  • the sound pickup end 61 is located in the rear case 10, and the sound output end is located inside the main body A.
  • the noise reduction microphone 40 of the microphone module is connected and used for picking up sound from the noise reduction microphone 40 .
  • the sound pickup hole 60 is provided on one side of the camera assembly 50 to facilitate the removal of noise when the camera takes pictures and records.
  • the back shell 10 includes a casing 11, a cover 13 and a third sub-hole 16.
  • the casing 11 is a rectangular thin plate, which can be used as a battery cover of the mobile phone and is also an exterior part of the back of the mobile phone.
  • the housing 11 includes an outer surface 111 and a back surface (not labeled) located away from the outer surface 111 .
  • the housing 11 is also provided with an opening (not labeled) that penetrates the outer surface 111 and the back.
  • the opening is located at a corner of the housing 11 and is used to accommodate the camera assembly 50; it can also be understood that the camera assembly 50 is located on the main body. The upper left corner of A.
  • the bracket 14 is fixed on the back of the housing 11 for supporting the camera assembly 50 and fixing the camera assembly 50 on the rear case 10 .
  • the bracket 14 can be a part of the housing 11, integrally formed with the housing 11, or can be fixed to the housing 11 through a connection.
  • the bracket 14 is partially located in the opening, and the cover 13 is located on the side of the outer surface 111 and installed on the opening to cover part of the structure of the camera assembly 50 to prevent the internal structure of the camera assembly from affecting the appearance of the electronic device. 13 can also be used to allow light to pass through or expose the lens of the camera module.
  • the third sub-hole 16 penetrates through the outer surface 111 and the back surface along the thickness direction of the rear case 10 , specifically through the bracket 14 and part of the housing 11 . It can also be understood that the third sub-hole 16 penetrates the housing 11 or the rear housing 10 .
  • FIG. 6 is an angular cross-sectional view of the portable electronic device shown in FIG. 1 .
  • the cover 13 is bent with a connecting edge 131 on its periphery, and a notch 132 is provided on the connecting edge 131.
  • the connecting edge 131 is connected and sealed with the outer surface 111 around the opening.
  • There is a sound-passing gap a extending along the X-axis direction between the cover 13 and the outer surface 111 of the housing 11.
  • the sound-collecting end 61 is enclosed between the notch 132 and the outer surface 111.
  • the sound-collecting end 61 and The sound gap a is connected.
  • the sound receiving end 61 faces the first side 103 of the portable electronic device 100 .
  • the sound receiving end 61 can also be positioned toward the top edge 101 .
  • the outer surface and outer surface 111 of the cover 13 can be understood as the outer surface of the back of the main body A or the mobile phone, and the radio end 61 penetrates the outer surface.
  • Figure 4 is a schematic diagram of the internal structure of the portable electronic device shown in Figure 1;
  • the circuit board 30 is a board body, which includes a front surface 31 and a back surface 32 arranged away from the front surface 31;
  • the circuit board 30 is provided with a wiring layer inside, and the wiring layer leaks out of the front surface 31, and is used for electrical connection with electronic devices such as the central processor installed on the front surface 31, and for electrical connection with external devices such as cameras and speakers;
  • a plurality of elastic pieces 35 are provided on the front 31 and the back 32 . Used for grounding or conduction.
  • the backside 32 can also be used to mount electronic components.
  • the noise reduction microphone 40 is installed on the front surface 31 and is electrically connected to the circuit board 30 .
  • the circuit board 30 is also provided with a first sub-hole 301 , and the first sub-hole 301 penetrates the front 31 and the back 32 .
  • the first sub-hole 301 is used to be opposite to and communicate with the third sub-hole 16 .
  • the first sub-hole 301 is located at one side edge of the circuit board 30 and avoids the elastic pieces 35 .
  • the number of elastic pieces 35 on one side edge of the circuit board 30 is smaller. It can be understood that the first sub-hole 301 avoids the elastic pieces 35 on one side of the circuit board 30 .
  • Electronic devices and shrapnel are used to be opposite to and communicate with the third sub-hole 16 .
  • the first sub-hole 301 at the edge of the circuit board 30 instead of in the middle or inside the camera assembly, there is no need to provide a partial sound pickup hole in the middle of the circuit board 30, which is more conducive to the layout and design of electronic components on the circuit board 30. Improve the utilization rate of the circuit board, reduce the use of the internal space of the electronic device, and save the internal space of the electronic device.
  • FIG. 5 is a schematic structural diagram of the motherboard bracket of the portable electronic device shown in FIG. 1 ;
  • the middle frame assembly 20 includes a middle frame 21 , a frame 22 and a motherboard bracket 23 .
  • the middle frame 21 is generally a rectangular plate as a whole, which includes a first side (the side where the first side 103 is located) and a second side 212 (the side where the second side 104 is located) that is disposed opposite to the first side 211 .
  • the frame 22 is a rectangular frame structure, which is arranged around the periphery of the middle frame 21 .
  • the middle frame 21 is made of metal, and the frame 22 is made of plastic.
  • the frame 22 and the middle frame 21 are integrally formed.
  • the mainboard bracket 23 is fixed on the first side 211 of the middle frame 21 . It can be understood that the mainboard bracket 23 is a part of the middle frame 21 and can be integrally formed with the middle frame 21 . The mainboard bracket 23 is used to support the circuit board 30 .
  • the frame 22 includes a first end 221 , a second end 222 , a first side 223 and a second side 224 .
  • the first end 221 and the second end 222 are spaced apart and opposed along the Z-axis direction, and the first side 223 and the second side 224 are spaced apart along the X-axis direction.
  • the first end 221, the second end 222, the first side 223 and the second side 224 are connected end to end to form a frame.
  • the first end 221 is connected to one end of the middle frame 21 , the second end 222 is connected to the other end of the middle frame 21 ; the first side 223 is connected to one side of the middle frame 21 , and the second side 224 is connected to the middle frame 21 .
  • the first end edge 221 serves as the top edge 101 of the main body A and is located at the top of the portable electronic device 100 as the top shell.
  • the second end edge 222 serves as the bottom edge 102 of the main body A and is located at the bottom of the portable electronic device 100 Position as the bottom of the enclosure.
  • the first side 223 serves as the first side 103 of the main body A and is located at a side position of the portable electronic device 100 as a side casing.
  • the second side 224 serves as the second side 104 of the main body A and is located at a side of the portable electronic device 100 .
  • a side position of the electronic device 100 serves as a side housing.
  • the motherboard bracket 23 includes a body 230 and a cantilever 235 provided on the body 230 , a buckle 236 , a second sub-hole 233 and a connection hole 237 .
  • the body 230 includes a first surface 231 , a second surface 232 located away from the first surface 231 , a first side 238 and a second side 239 opposite to the first side 238 . Both the first side 238 and the second side 239 connect the first side 231 and the second side 232 .
  • the second sub-hole 233 penetrates the first surface 231 and the second surface 232 .
  • the second sub-hole 233 is used to communicate with the first sub-hole 301, where the communication means that the first sub-hole 301 and the second sub-hole 233 are in relative communication with each other along the hole axis, or are in offset communication.
  • the connecting hole 237 penetrates the first surface 231 and the second surface 232, and is spaced apart from the second sub-hole 233 along the Z direction.
  • a recess 2311 is formed on the first surface 231 .
  • the recess 2311 is used to form a connection gap b with the back surface 32 of the circuit board.
  • the connection gap b is used to connect the second sub-hole 233 and the first sub-hole 301 .
  • the second sub-hole 233 penetrates the bottom wall of the recess 2311 .
  • the second surface 232 is concavely provided with a groove 2321, and the groove 2321 is used to accommodate sealing foam to seal part of the sound pickup holes.
  • the recess 2311 and the groove 2321 at least partially overlap in the Y-axis direction, and the second sub-hole 233 (Y direction) penetrates the bottom wall of the recess 2311 and the bottom wall of the groove 2321.
  • the recess 2311 is closer to the first side 238 and is used to adapt to the position of the first sub-hole 301 on the circuit board 30 .
  • the end of the second sub-hole away from the connection gap is sealed by placing the sealing foam in the groove 2321.
  • the sealing foam is sealed on the peripheral edge of the second sub-hole 233 at the end of the bottom wall of the groove 2321. , improving the sealing performance of the second sub-hole 233.
  • the bracket of this embodiment will press against the sealing foam, so that it has a better sealing effect; the sealing foam is arranged in the groove and will not be directly affected by the insufficient fixing force between the bracket and the mainboard bracket 23.
  • the sealing effect of the second sub-hole 233 is further ensured.
  • the groove 2321 in this embodiment is connected with the hollow area.
  • the buckle 236 is provided on the edge connecting the first surface 231 and the first side 238 and is located on the side of the groove 2321 away from the connection hole 237.
  • the buckle 236 extends parallel to the first surface 231 in a direction protruding from the first side 238. , that is, the buckle 236 protrudes 238 on the first side.
  • the first side 223 of the frame 22 faces the surface of the middle frame 21 and is recessed with a card slot 225. After the motherboard bracket 23 is installed on the middle frame 21, the buckle 236 extends into the card slot 225 and is locked with the card slot 225 to prevent The mainboard bracket 23 is away from the circuit board in the Y-axis direction.
  • the second sub-hole 233 is provided through the mainboard bracket 23 and the circuit board 30 is directly connected and fixed with screws.
  • the connecting holes 237 and buckles 236 of the connecting screws are located on opposite sides of the second sub-hole 233 . side, further improving the assembly tightness between the mainboard bracket 23 and the circuit board 30, thereby ensuring the sealing performance of the connection gap b and the second sub-hole 233, and thereby ensuring the sealing performance of the sound pickup hole 60 to ensure the sound pickup effect. .
  • a retaining wall 2320 extending along the length direction of the second surface 232 is protruding from the second surface 232 , and the retaining wall 2320 is disposed close to the second side 239 .
  • the first surfaces 231 of 230 are separated by the hollow area C, and the cantilever 235 is located above one side of the groove 2321.
  • the hollow area C in this embodiment penetrates the retaining wall 2320 and is connected to the groove 2321, and the penetration direction of the hollow area C intersects with the extension direction of the retaining wall 2320.
  • the hollow area C penetrating the retaining wall 2320 may penetrate part of the body 230 and part of the retaining wall 2320 .
  • the retaining wall 2320 has a gap, which divides the retaining wall 2320 into two parts.
  • the cantilever 235 is located in the gap and connects the retaining wall parts on both sides of the gap.
  • the length direction of the cantilever 235 is the X-axis direction.
  • the cantilever 235 and the body 230 are separated by a partial gap.
  • the motherboard bracket 23 and the frame 22 that indirectly supports the motherboard bracket 23 are clamped with the slot 225 through buckles 236, and the elastic piece 35 elastically resists the retaining wall 2320 and the circuit.
  • the elastic resistance force between the boards 30 can be offset by the holding force between the buckle 236 and the card slot 225 to prevent the elastic resistance force from pushing the mainboard bracket 23 away from the circuit board and increasing the connection gap b. Gap size.
  • the mainboard bracket 23 includes an extension arm 23A.
  • the extension arm 23A is connected to the second side 239 of the body 230 .
  • the extension arm 23A and the mainboard bracket 23 form a substantially rectangular escape groove D for avoiding the camera assembly 50 .
  • the motherboard bracket 23 is a thin plate, and the escape groove is opened on the thin plate to form the body 230 and the extension arm 23A.
  • the motherboard bracket 23 is fixed on the middle frame 21 close to the first end edge 221 and the first side edge 223 .
  • the first surface 231 of the motherboard bracket 23 faces the same direction as the first side 211
  • the second surface 232 faces the same direction as the second side 212 .
  • the motherboard bracket 23 can be embedded in the middle frame 21 and can be supported by the middle frame 21 .
  • the motherboard bracket 23 is supported by the middle frame 21 .
  • the circuit board 30 and the display screen B are located on the first side 211 , and the display screen B is supported by the middle frame 21 and the frame 22 .
  • the camera assembly 50 and the rear case 10 are located on the second side 212 .
  • the rear case 10 covers the second side 212 of the middle frame 21 and is connected to the frame 22 .
  • the cover 13 limits the camera assembly 50 to the main body A.
  • the bracket 14 of the camera assembly 50 is pressed against the second surface 232 of the motherboard bracket 23 .
  • the groove 2321 is filled with sealing foam.
  • the bracket 14 is partially squeezed by the sealing foam to seal the periphery of the second sub-hole 233 .
  • the circuit board 30 is supported by the mainboard bracket 23 and part of the middle frame 21.
  • the first side 231 faces the back 32 of the circuit board 30.
  • connection holes 237 provided on the body 230 are equipped with screws. The screws are screwed to the circuit board 30 and the mainboard bracket 23. The circuit board 30 and the mainboard bracket 23 are relatively locked in the Y direction. At the same time, the buckle 236 extends into the slot 225 of the frame 22 and is locked with the slot 225 .
  • the first surface 231 of the mainboard bracket 23 is in contact with the back 32 of the circuit board 30; the first sub-hole 301 and the second sub-hole 233 are arranged along the Y-axis direction and are offset (the hole axes are not on the same straight line).
  • the first hole One end of 301 penetrating the first surface 231 and one end of the second sub-hole 233 penetrating the back surface 32 are respectively connected to the connection gap b.
  • connection gap b is located in the dislocation generation area between the first sub-hole 301 and the second sub-hole 233 .
  • the first sub-hole 301 is closer to the first side 103 of the portable electronic device 100 than the second sub-hole 233 , that is, the first sub-hole 301 is closer to the second sub-hole 233 is close to the first side 223 of the frame 22 .
  • the noise reduction microphone 40 is installed on the front surface 31 of the circuit board 30 and communicates with the first sub-hole 301.
  • One end of the first sub-hole 301 penetrating the front surface 31 is the sound output end. That is, along the Y direction, the mainboard bracket 23 is located between the circuit board 30 and the camera assembly 50 .
  • the sound pickup hole 60 is composed of a sound receiving end 61, a sound passing gap a, a third sub-hole 16, a second sub-hole 233, a connecting gap b, a first sub-hole 301, and a sound output end located in the first sub-hole 301.
  • the sound pickup path of the noise reduction microphone 40 is a curve and is the extension path of the sound pickup hole 60 .
  • the external sound source of the mobile phone enters the sound pickup hole 60 through the sound receiving end 61 and is transmitted to the microphone through the sound output end to achieve noise reduction.
  • the sound receiving end 61 is located at one end of the sound transmission gap a and penetrates the outer surface 111
  • the sound output end is one end of the first sub-hole 301 , the sound transmission gap a and the third sub-hole 16.
  • the second sub-hole 233, the connecting gap b, the first sub-hole 301 and the sound outlet are located inside the main body A.
  • the first sub-hole 301, the second sub-hole 233 and the third sub-hole 16 are The axial direction is parallel to the thickness direction of the portable electronic device, the third sub-hole 16 and the second sub-hole 233 are disposed offset from the first sub-hole 301, the connection gap b and the sound communication
  • the gap a extends toward the first side along the width direction of the portable electronic device.
  • the sound pickup hole 60 in this embodiment is not limited to a hole that passes through the board.
  • the gap between the middle frame 21, the circuit board 30, the motherboard bracket 23 and the back shell is also used to simplify the structure and facilitate the formation of the sound pickup hole. .
  • the elastic pieces 35 of the circuit board 30 are located between the circuit board 30 and the mainboard bracket 23 , and the elastic piece 35's rebound force in the direction away from the circuit board 30 resists the retaining wall 2320 and the cantilever 235 , and pushes the mainboard bracket 23 toward the mainboard bracket 23 .
  • a certain amount of resistance is generated in the direction away from the circuit board. Since the circuit board 30 and the mainboard bracket 23 are screwed together with screws, the circuit board 30 and the mainboard bracket 23 are locked in opposite directions in the Y-axis direction.
  • the buckle 236 extends into the slot 225 of the frame 22 and is locked with the slot 225 , a holding force will also be generated in the Y-axis direction.
  • the retaining wall 2320 transfers the rebound force of the elastic piece 35 to the buckle 236 and the screw through the body 230; and then transfers it to the middle frame 21 and the border 22 through the buckle 236 and the screw, and the limiting directions of the buckle 236 and the screw are both Y axial direction frame, so that the pressing and sealing effect of the mainboard bracket 23 and the circuit board 30 is not affected by the rebound force of the elastic piece. Therefore, the resistance force of the elastic piece 35 to the mainboard bracket 23 will be offset, and the mainboard bracket 23 and the circuit board 30 can be increased.
  • the pressing force between them improves the sealing effect of the connection gap b of the sound pickup hole 60 and prevents sound leakage in the connection gap b from affecting the sound pickup effect.
  • a hollow area C is formed on the retaining wall 2320 close to the second sub-hole 233.
  • the rebound force generated by the elastic piece 35 on the retaining wall 2320 bypasses the hollow area and is on the cantilever 235. Therefore, the rebound force of the elastic piece 35 can be reduced and directly exerted on the retaining wall 2320.
  • the screws and buckles 236 Located on the opposite sides of the second sub-hole 233, the elastic force will go around the hollow area and be transmitted to both sides of the hollow area along the cantilever 235.
  • the elastic force can be decomposed through screws and buckles, further reducing the reaction force on the motherboard bracket. This ensures the sealing performance of the connection gap b and the second sub-hole 233 to ensure the sound pickup effect.
  • the camera assembly 50 is installed on the main body A and is located at the upper left corner of the rear case 10 , that is, at the upper left corner of the back of the portable electronic device 100 .
  • the sound pickup hole 60 The distance L1 from the first end 221 is less than the distance between the sound pickup hole 60 and the second end 222 (not shown); along the X-axis direction, the distance L3 between the sound pickup hole 60 and the first side 223 is less than The distance between the hole 60 and the second side 224 (not shown), where, The limit of the sound pickup hole 60 is based on the entire area where the sound pickup hole 60 is located.
  • the sound pickup hole 60 is located between the camera module 50A of the camera assembly 50 and the first side 223. It can be understood that the sound pickup hole 60 is located at the edge of the circuit board 30 and the edge of the mobile phone; since the sound pickup hole 60 passes through Case 10, mainboard bracket 23, circuit board 30 and camera mold bracket 52, and there are many components and elastic pieces 35 on the circuit board 30, set the sound pickup hole 60 on the edge of the circuit board 30 instead of the middle position, or the camera assembly is close to the middle On one side of the circuit board, there is no need to provide a partial sound pickup hole in the middle of the circuit board, which is more convenient for the layout and design of electronic components on the circuit board 30, reduces the use of the internal space of the main body, and improves the utilization rate of the circuit board.

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
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  • Acoustics & Sound (AREA)
  • Telephone Set Structure (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)

Abstract

本申请提供一种便携式电子装置，其包括主体、摄像头模组、降噪麦克风及拾音孔，主体包括第一侧边和第二侧边以及外表面，第一侧边和第二侧边位于外表面相对两侧，摄像头模组装于主体并露出外表面，主体包括电路板，降噪麦克风装于电路板，拾音孔包括收音端和出音端，收音端贯穿外表面，收音端位于外表面的一侧位置并靠近第一侧边，出音端开设于电路板上并与降噪麦克风的出音孔连通；沿着便携式电子装置的宽度方向，拾音孔位于摄像头模组与第一侧边之间，拾音孔到第一侧边的距离小于拾音孔到第二侧边的距离。

Description

便携式电子装置
本申请要求2022年08月24日提交中国专利局、申请号为202211021683.X、申请名称为“便携式电子装置”的专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及移动通讯设备相关技术领域，尤其涉及一种便携式电子装置。
背景技术
手机作为最普及的智能终端设备，已成为我们生活中一个必不可少通讯娱乐工具。设计上对其外观和可靠性的极致追求，在越小的空间内满足越多的功能已然成为手机的大趋势方向。
比如，现有技术中为了实现手机音效的可靠性，在电路板的背面额外增加麦克风，与原有的音响装置共同实现优质音效；在实际设计中，麦克风位于主板上，拾音通道需要连通手机外部，因为内部器件及主板上电子器件较多，拾音通道路径复杂，在有限空间内，无疑是增加了设计及稳定性的难度。
发明内容
本申请提供一种便携式电子装置，可以解决因有限空间内无法保证麦克风收音效果的稳定性的技术问题。
本申请提供的便携式电子装置，包括主体、摄像头模组、降噪麦克风及拾音孔，所述主体包括第一侧边和第二侧边以及外表面，第一侧边和第二侧边位于所述外表面相对两侧，所述摄像头模组装于主体并露出所述外表面，所述主体包括电路板，所述降噪麦克风装于所述电路板，所述拾音孔包括收音端和出音端，所述收音端贯穿所述外表面，所述收音端位于所述外表面的一侧位置并靠近所述第一侧边，所述出音端开设于所述电路板上并与所述降噪麦克风的出音孔连通；沿着所述便携式电子装置的宽度方向，所述拾音孔位于所述摄像头模组与所述第一侧边之间，所述拾音孔到所述第一侧边的距离小于所述拾音孔到所述第二侧边的距离。
本实施例中，摄像头模组可以理解为是位于便携式电子装置左上角，拾音孔与第一端边的距离小于拾音孔与第二端边的距离；拾音孔与第一侧边的距离小于拾音孔与第二侧边的距离，并且拾音孔位于摄像头模组和第一侧边之间的位置，(距离摄像模组有足够的距离，保证摄像头摄像时可以达到降噪的目的)。同时可以理解为拾音孔位于电路板的边缘以及手机的边缘位置，电路板上元件和弹片较多，将拾音孔设置在电路板边缘，而不是中间位置，也不是摄像头组件内部，不用在电路板中补位置设置部分拾音孔，更利于电路板上电子元件的布局和设计，提高电路板的利用率，减小对电子装置内部空间的使用，节省电子装置内部空间。
一种实施例中，所述拾音孔包括所述收音端、通音缝隙、第三子孔、第二子孔、连接缝隙、第一子孔及所述出音端，所述收音端、通音缝隙、第三子孔、第二子孔、连接缝隙、第一子孔及出音端依次连通形成呈曲线延伸的孔结构。
本实施例中，将拾音孔设置成曲线延伸的孔结构，可以充分利用电子装置内部结构之间的空间，如中框，电路板、支架、摄像头模组之间的排布和缝隙，在一定的区域内，提高拾音位置设置的灵活性。
一种实施例中，所述收音端位于通音缝隙一端并贯穿所述外表面，所述出音端为所述第一子孔的一端，所述通音缝隙、第三子孔、第二子孔、连接缝隙、第一子孔及出音端位于所述主体内部，所述第一子孔、第二子孔和所述第三子孔的轴向与所述便携式电子装置的厚度方向平行，所述第三子孔和所述第二子孔均与所述第一子孔错位设置，所述连接缝隙和所述通音缝沿着所述便携式电子装置的宽度方向向所述第一侧边延伸。本实施例中的拾音孔不局限于一定是穿板的孔，也利用了中框，电路板、支架和后壳之间缝隙，简化结构，更利于拾音孔的形成。
一种实施例中，所述主体包括中框、围绕所述中框周缘的边框和主板支架，所述第一子孔贯穿所述电路板，所述第二子孔贯穿所述主板支架，所述连接缝隙位于所述主板支架和所述电路板之间；所述边框朝向所述主板支架的内侧面凹设有卡槽，所述主板支架设有卡扣，所述卡扣与所述第二子孔相邻，所述卡扣沿着所述便携式电子装置的宽度方向延伸；
所述电路板设于所述中框和所述主板支架之间，所述卡扣与所述卡槽卡持。
本实施例中，将设有所述第二子孔贯穿所述主板支架与间接承载所述主板支架的边框通过卡扣与所述卡槽卡持，增加在第二子孔孔轴方向的相互卡持力，可以增加主板支架和中框之间在电子装置厚度方向的固定力，用来增强对主板支架、电路板及中框之间的装配紧密性所述连接缝隙及第二子孔的密封性能，进而保证拾音孔的密封性能，以保证拾音效果。
一种实施例中，所述主板支架设有连接孔，所述卡扣和所述连接孔分别位于所述第二子孔相对的两侧，所述连接孔的孔轴沿着所述便携式电子装置的厚度方向延伸；所述连接孔连接有螺钉，以固定连接所述电路板和所述主板支架。本实施例中，将设有所述第二子孔贯穿所述主板支架与电路板直接通过螺钉连接固定，连接螺钉的连接孔和卡扣位于第二子孔的相对两侧，进一步提高主板支架与电路板之间的装配紧密性，进而保证所述连接缝隙及第二子孔的密封性能，进而保证拾音孔的密封性能，以保证拾音效果。
一种实施例中，所述电路板上设有弹片，所述弹片与所述第一子孔相邻，所述主板支架包括本体和挡墙，所述第二子孔贯穿所述本体两个相对的面，所述卡扣位于所述本体的一侧所述挡墙设于所述本体的另一侧且与所述卡扣间隔相对；
所述挡墙上设有悬臂，所述悬臂与所述本体连接处为镂空区，所述镂空区与所述第二子孔沿着所述便携式电子装置的宽度方向间隔，所述卡扣和所述连接孔分别与所述镂空区两侧的挡墙相对间隔相对，所述弹片弹性抵持所述挡墙与所述电路板之间。
本实施例中，所述主板支架与间接承载所述主板支架的边框通过卡扣与所述卡槽卡持，所述弹片弹性抵持所述挡墙与所述电路板之间的弹性抵持力可以被卡扣与所述卡槽卡持的卡持力抵消，避免弹性抵持力将主板支架向远离电路板方向推移，避免增加连接缝隙的缝隙尺寸。进一步的，所述弹片的弹性力向远离电路板方向抵推所述挡墙，由于所述镂空区与所述第二子孔沿着所述便携式电子装置的宽度方向间隔，螺钉和卡扣位于第二子孔的相对两侧，弹性力会绕镂空区域，沿着悬臂向镂空区域两侧位置传递，可以经过螺钉和卡扣 分解弹性力，进一步减小对主板支架的反作用力，进而保证连接缝隙及第二子孔的密封性能，以保证拾音效果。
一种实施例中，所述本体包括第一面和与所述第一面背向设置的第二面，所述第二面上凹设有凹槽，所述第二子孔贯穿所述凹槽的槽底壁，所述凹槽与所述镂空区连通并用于收容密封泡棉。本实施例中，通过密封泡棉放置于凹槽内来密封第二子孔远离连接缝隙的一端，密封泡棉密封于第二子孔的位于凹槽的槽底壁的端部的周缘，提高第二子孔的密封性能。同时本实施例的支架会抵压密封泡棉，使其具有更好的密封效果；密封泡棉设置在凹槽内，不会直接受到支架和主板支架之间的因固定力不够的影响，进一步保证了第二子孔的密封效果。
一种实施例中，所述第一面上设有凹部，所述第二子孔贯穿所述凹部的底部，所述凹部和凹槽在便携式电子装置的厚度方向至少部分重叠，所述凹部的底部与所述电路板的表面之间形成所述连接缝隙。本实施例中，将与第二子孔连接的所述电路板与主板支架之间的缝隙，通过凹部来划分区域，即凹部与所述电路板的表面之间形成连接缝隙，而不是平面与平面之间直接设置缝隙，可以控制缝隙区域，而且更利于凹部的密封性能，进而更利于连接缝隙的密封，以保证拾音效果。
一种实施例中，所述主体包括装于中框的后壳，所述后壳包括壳体和盖于所述壳体的盖板，所述收音端贯穿所述盖板的侧边缘，在所述电子装置厚度方向，所述盖板与所述壳体的外表面之间形成所述通音缝隙，所述通音缝隙与所述收音端连通。
本实施例中，利用固定摄像头组件的盖板和后盖之间的缝隙形成通音缝隙作为拾音孔的一部分，且将拾音孔的收音端设于后壳的侧部位置，即与电子装置厚度方向相交的位置，充分利用空间的同时，利于拾音效果的接收。
一种实施例中，所述壳体背向所述外表面的表面上设有支架，所述支架支撑所述摄像头模组，沿着电子装置厚度方向，所述第三子孔贯穿所述壳体和所述支架边缘位置，所述第三子孔一端连接所述第二子孔，另一端连接所述通音缝隙。本实施例中，将第三子孔设置于支架的边缘，靠近摄像头模组，利于摄像头录影时音效的保证。
一种实施例中，本申请提供一种便携式电子装置，其包括中框、围绕所述中框周缘的边框、电路板、主板支架、降噪麦克风及拾音孔；
所述电路板包括正面和背面，所述背面设有弹片；
所述拾音孔包括依次连通第一子孔、连接缝隙及第二子孔，所述第一子孔贯穿所述正面和背面并与弹片相邻，所述第二子孔贯穿所述主板支架；
所述主板支架设有卡扣和连接孔，所述卡扣和所述连接孔分别位于所述第二子孔相对的两侧，所述卡扣沿着所述便携式电子装置的宽度方向延伸；所述连接孔的孔轴沿着所述便携式电子装置的厚度方向延伸；所述边框朝向所述主板支架的内侧面凹设有卡槽；
所述降噪麦克风装于所述电路板正面与所述第一子孔一端连通，所述电路板设于所述中框和所述主板支架之间，所述连接缝隙形成于所述主板支架和所述电路板之间，所述弹片弹性抵持所述电路板与所述主板支架，所述卡扣与所述卡槽卡持，所述连接孔连接有螺钉以固定连接所述电路板和所述主板支架。
本实施例中，所述主板支架与边框通过卡扣与所述卡槽卡持，通过螺钉与电路板螺接， 连接螺钉的连接孔和卡扣位于第二子孔的相对两侧，所述弹片弹性抵持所述主板支架与所述电路板之间的弹性抵持力可以被卡扣与所述卡槽卡持的卡持力抵消，避免弹性抵持力将主板支架向远离电路板方向推移，避免增加连接缝隙的缝隙尺寸，进而保证拾音孔的密封性能，以保证拾音效果。
一种实施例中，所述主板支架包括本体和挡墙，所述第二子孔贯穿所述本体两个相对的面，所述卡扣位于所述本体的一侧所述挡墙设于所述本体的另一侧且与所述卡扣间隔相对；
所述挡墙上设有悬臂，所述悬臂与所述本体连接处为镂空区，所述镂空区与所述第二子孔沿着所述便携式电子装置的宽度方向间隔，所述卡扣和所述连接孔分别与所述镂空区两侧的挡墙相对间隔相对，所述弹片弹性抵持所述挡墙与所述电路板之间。本实施例中，所述弹片的弹性力向远离电路板方向抵推所述挡墙，由于所述镂空区与所述第二子孔沿着所述便携式电子装置的宽度方向间隔，螺钉和卡扣位于第二子孔的相对两侧，弹性力会绕镂空区域，沿着悬臂向镂空区域两侧位置传递，可以经过螺钉和卡扣分解弹性力，进一步减小对电路板的反作用力，进而保证连接缝隙及第二子孔的密封性能，以保证拾音效果。
一种实施例中，所述本体包括第一面和与所述第一面背向设置的第二面，所述第二面上凹设有凹槽，所述第二子孔贯穿所述凹槽的槽底壁，所述凹槽与所述镂空区连通并用于收容密封泡棉。本实施例中，通过密封泡棉放置于凹槽内来密封第二子孔远离连接缝隙的一端，密封泡棉密封于第二子孔的位于凹槽的槽底壁的端部的周缘，提高第二子孔的密封性能。同时本实施例的支架会抵压密封泡棉，使其具有更好的密封效果；密封泡棉设置在凹槽内，不会直接受到支架和主板支架之间的因固定力不够的影响，进一步保证了第二子孔的密封效果。
一种实施例中，所述第一面上设有凹部，所述第二子孔贯穿所述凹部的底部，所述凹部和凹槽在便携式电子装置的厚度方向至少部分重叠，所述凹部的底部与所述电路板的表面之间形成所述连接缝隙。本实施例中，将与第二子孔连接的所述电路板与主板支架之间的缝隙，通过凹部来划分区域，即凹部与所述电路板的表面之间形成连接缝隙，而不是平面与平面之间直接设置缝隙，可以控制缝隙区域，而且更利于凹部的密封性能，进而更利于连接缝隙的密封，以保证拾音效果。
一种实施例中，所述拾音孔包括所述收音端、和通音缝隙，所述主体包括装于中框的后壳，所述后壳包括壳体和盖于所述壳体的盖板，所述收音端贯穿所述盖板的侧边缘，在所述电子装置厚度方向，所述盖板与所述壳体的外表面之间形成所述通音缝隙，所述通音缝隙与所述收音端连通。
本实施例中，利用固定摄像头组件的盖板和后盖之间的缝隙形成通音缝隙作为拾音孔的一部分，且将拾音孔的收音端设于后壳的侧部位置，即与电子装置厚度方向相交的位置，充分利用空间的同时，利于拾音效果的接收。
一种实施例中，所述拾音孔包括第三子孔，所述壳体背向所述外表面的表面上设有支架，所述支架支撑所述摄像头模组，沿着电子装置厚度方向，所述第三子孔贯穿所述壳体和所述支架边缘位置，所述第三子孔一端连接所述第二子孔，另一端连接所述通音缝隙。本实施例中，将第三子孔设置于支架的边缘，靠近摄像头模组，利于摄像头录影时音效的 保证。
本申请所述的便携式电子装置将拾音孔设置在电路板边缘，而不是中间位置，也不是摄像头组件内部，不用在电路板中补位置设置部分拾音孔，更利于电路板上电子元件的布局和设计，提高电路板的利用率，减小对电子装置内部空间的使用，节省电子装置内部空间。
附图说明
为了更清楚地说明本申请实施例或背景技术中的技术方案，下面将对本申请实施例或背景技术中所需要使用的附图进行说明。
图1是本申请实施例提供的便携式电子装置立体结构示意图；
图2是图1所示的便携式电子装置部分结构示意图；
图3是图1所示的便携式电子装置的一个角度截面示意图；
图4是图1所示的便携式电子装置的内部部分结构示意图；
图5是图1所示的便携式电子装置的主板支架的结构示意图；
图6是图1所示的便携式电子装置的一个角度截面示意图。
具体实施方式
在本申请的描述中，术语“中心”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“竖向”、“横向”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。以下，术语“第一”、“第二”等仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”等的特征可以明示或者隐含地包括一个或者更多个该特征。
本申请提供的便携式电子装置，包括主体、摄像头模组、降噪麦克风及拾音孔，所述主体包括第一侧边和第二侧边以及外表面，第一侧边和第二侧边位于所述外表面相对两侧，所述摄像头模组装于主体并露出所述外表面，所述主体包括电路板，所述降噪麦克风装于所述电路板，所述拾音孔包括收音端和出音端，所述收音端贯穿所述外表面，所述收音端位于所述外表面的一侧位置并靠近所述第一侧边，所述出音端开设于所述电路板上并与所述降噪麦克风的出音孔连通；沿着所述便携式电子装置的宽度方向，所述拾音孔位于所述摄像头模组与所述第一侧边之间，所述拾音孔到所述第一侧边的距离小于所述拾音孔到所述第二侧边的距离。
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。
请参阅图1和图2，图1是本申请实施例提供的便携式电子装置100的结构示意图。图2是图1所示的便携式电子装置100的部分结构示意图，其中去除了后壳。所述的便携式电子装置可以为手机、平板电脑、耳机、音频播放器、智能手表等具有播放音频和录音 功能的电子产品。本申请实施例以便携式电子装置100手机为例进行说明。其中，为了便于描述，定义便携式电子装置100的宽度方向为X轴方向，厚度为Y轴方向，也就是主体A和显示屏B的排列方向；便携式电子装置100的宽度长度方向为Z轴方向。
便携式电子装置100包括主体A、显示屏B、摄像头组件50、麦克风模组及拾音孔60。显示屏B装于主体A的一侧，摄像头组件50装于主体A的另一侧。显示屏B用于操作手机及显示手机功能界面、图像及影像；显示屏B可以是有机发光二极管OLED(Organic Light-Emitting Diode)显示，当然也可以为液晶显示。本实施例中为OLED显示。
摄像头组件50包括两个或者两个以上的摄像头模组50A和闪光灯，用于手机的拍照和摄像功能。本实施例的摄像头组件50包括三个摄像头模组50A，三个摄像头模组排列于主体A靠近顶部的左侧边缘或者右侧边缘位置。比如第一个摄像头模组50A为主摄像头，第二和第三个摄像头模组为辅助摄像头，可以是深景摄像头、长焦/广角摄像头或者黑白摄像头等。需要说明的是，三个摄像头仅仅是一个实施例，可以是并排设置，也可以是围成环形设置。
便携式电子装置100的主体A包括顶边101和底边102以及第一侧边103和第二侧边104，顶边101设有用于发出声音的出音孔，底边102设有话筒音孔及连接器插口等；在使用者使用手机通话时，顶边101对应使用者的耳部，底边102对应人的口部，利于音量互相的传播。当然，出音孔和话筒音孔也可以适用于外方功能声音的传播。本实施例中仅仅列举出部分手机功能部件，顶边101和底边102还可以包括其它功能孔和按键等结构，不限于本实施例描述。第一侧边103和第二侧边104用于设置手机音量键或者关机键。可以理解，当显示屏B装于主体A后，主体的顶边101和底边102也是便携式电子装置100的顶部和底部，第一侧边103和第二侧边104也是便携式电子装置100的两个侧部。
请一并参阅图3，图3是图1所示的便携式电子装置的一个角度截面示意图；主体A还包括后壳10、中框组件20和电路板30。当然主体A不限所述列举器件，还包括如扬声器、天线、处理器等器件，满足现有手机多功能性能，在此不过多做赘述。中框组件20用于承载后壳10、电路板30及麦克风模组以及显示屏B和摄像头组件50。后壳10与显示屏B位于中框组件20的相对两侧位置且后壳10位便携式电子装置100的背部。麦克风模组位于电路板30背向后壳10的一侧并与电路板30电性连接，摄像头组件50位于主体A背向显示屏B的一侧并露出后壳10。拾音孔60位于主体A内部并与手机外部连通。
本实施例中，麦克风模组包括主麦克风(图未示)、副麦克风(图未示)和降噪麦克风40。主麦克风和副麦克风分别位于主体A内靠近顶边101位置和底边102位置，手机还设有播放音频的扬声器(图未示)，扬声器位于主体A内靠近顶边101位置并与所述的出音孔对应。主麦克风用于手机在录音、录像等功能时拾取外界音频(包括降噪功能)，在顶边101或者主体背部对应主麦克风设置拾音孔，用于音量通过。副麦克风与话筒音孔对应，一般用于在手机通话时拾取讲话音频。降噪麦克风用于与主麦克风同时工作，拾取外界噪音进行降噪。降噪麦克风40可以与主麦克风同时工作，拾取外界噪音进行降噪。
所述拾音孔包括所述收音端、通音缝隙、第三子孔、第二子孔、连接缝隙、第一子孔及所述出音端，所述收音端、通音缝隙、第三子孔、第二子孔、连接缝隙、第一子孔及出音端依次连通形成呈曲线延伸的孔结构。本实施例中，将拾音孔设置成曲线延伸的孔结构， 可以充分利用电子装置内部结构之间的空间，如中框，电路板、支架、摄像头模组之间的排布和缝隙，在一定的区域内，提高拾音位置设置的灵活性。
具体的，拾音孔60包括收音端61和出音端，拾音孔60贯穿后壳10、中框组件20及电路板30，收音端61位于后壳10，出音端位于主体A内部与麦克风模组的降噪麦克风40连接，用于降噪麦克风40的拾音。本实施例中，拾音孔60设于摄像头组件50一侧，便于摄像头摄像录音时去除杂音。
本实施例中，后壳10包括壳体11、盖板13以及第三子孔16，壳体11为矩形薄板，可以作为手机的电池盖，也是手机背部外观件。
具体的，所述壳体11包括外表面111和与外表面111背向设置的背面(图未标)。壳体11上还设有贯穿外表面111和背面的开孔(图未标)，开孔位于壳体11的一角位置，其用于容置摄像头组件50；也可以理解为摄像头组件50位于主体A的左上角位置。
支架14固定于所述壳体11的背面，用于支撑摄像头组件50，将支撑摄像头组件50固定于后壳10上。可以理解支架14可以是壳体11的一部分，与壳体11一体成型，也可以通过连接方式与壳体11固定。本实施例中支架14部分位于开孔内，盖板13位于外表面111一侧装于开孔上，用于遮盖摄像头组件50部分结构，防止摄像头组件内部结构影响电子装置的外观，并且盖板13还可以用于光线透过或者露出摄像模组的镜头。
所述的第三子孔16沿着后壳10的厚度方向贯穿外表面111和背面，具体是贯穿支架14和部分壳体11。也可以理解为所述的第三子孔16贯穿壳体11或者后壳10。
如图6所示，图6是图1所示的便携式电子装置的一个角度截面示意图。盖板13周缘弯折设有连接边131，连接边131上设有一缺口132，盖板13装于壳体11的开孔后，连接边131与开孔周围的外表面111连接并密封。其中，盖板13与壳体11的外表面111之间具有沿着X轴方向延伸的通音缝隙a，缺口132与外表面111之间围成所述收音端61，所述收音端61与通音缝隙a连通。本实施例中收音端61朝向便携式电子装置100的第一侧边103。当然，收音端61也可以朝向顶边101位置。盖板13的外表面和外表面111可以理解为是主体A或者手机的背部外表面，收音端61贯穿外表面。
一并参阅图3和图4，图4是图1所示的便携式电子装置的内部部分结构示意图；所述电路板30为板体，其包括正面31和与正面31背向设置的背面32；电路板30内部设有走线层，且走线层漏出于正面31，用于与安装于正面31的中心处理器等电子器件电性连接，以及用于摄像头、扬声器等外接器件的电连接；正面31和背面32设有多个弹片35。用于接地或者导通。背面32也可以用于安装电子器件。
本实施例中，降噪麦克风40安装于正面31上并与电路板30电性连接。本实施例中，电路板30还设有第一子孔301，第一子孔301贯穿正面31和背面32。第一子孔301用于与所述第三子孔16相对并连通。第一子孔301位于电路板30的一侧边缘的位置且避开弹片35，电路板30的一侧边缘弹片35的数量较少，可以理解为第一子孔301避开电路板30上的电子器件及弹片。将第一子孔301设置在电路板30边缘，而不是中间位置，也不是摄像头组件内部，不用在电路板30中部位置设置部分拾音孔，更利于电路板30上电子元件的布局和设计，提高电路板的利用率，减小对电子装置内部空间的使用，节省电子装置内部空间。
一并参阅图5，图5是图1所示的便携式电子装置的主板支架的结构示意图；中框组件20包括中框21、边框22和主板支架23。中框21整体大致呈矩形的板体，其包括第一侧(第一侧边103所在一侧)和与第一侧211背向设置的第二侧212(第二侧边104所在一侧)。边框22为矩形框架结构，其围绕中框21周缘设置。本实施例中，中框21为金属件，边框22为塑胶件，边框22与中框21一体成型。主板支架23固定于中框21的第一侧211上，可以理解为主板支架23位中框21的一部分，可以与中框21一体成型，主板支架23用于支撑电路板30。
具体的，如图2，边框22包括第一端边221、第二端边222、第一侧边223和第二侧边224。第一端边221和第二端边222沿着Z轴方向间隔相对，第一侧边223和第二侧边224沿着X轴方向间隔设置。第一端边221、第二端边222、第一侧边223和第二侧边224首尾连接围成框体。第一端边221连接于中框21的一端，第二端边222连接于中框21的另一端；第一侧边223连接于中框21的一侧边，第二侧边224连接于中框21的另一侧边。第一端边221作为主体A的顶边101，且位于便携式电子装置100的顶部位置作为顶部的外壳，所述第二端边222作为主体A的底边102，且位于便携式电子装置100的底部位置作为底部的外壳。第一侧边223作为主体A的第一侧边103，且位于便携式电子装置100的一个侧部位置作为侧部的外壳，第二侧边224作为主体A的第二侧边104，且位于便携式电子装置100的一个侧部位置作为侧部的外壳。
请参阅图5，本实施例中，所述主板支架23包括本体230和设于本体230的悬臂235、卡扣236、第二子孔233和连接孔237。
具体的，本体230包括第一面231、与第一面231背向设置的第二面232、第一侧238和与第一侧238相对的第二侧239。第一侧238和第二侧239均连接第一面231和第二面232。第二子孔233贯穿第一面231和第二面232。第二子孔233用于与第一子孔301连通，其中，所述的连通是指第一子孔301和第二子孔233同孔轴相对连通，或者错位连通。连接孔237贯穿第一面231和第二面232，沿着Z方向，连接孔237与第二子孔233间隔设置。
第一面231上凹设有凹部2311，凹部2311用于与电路板的背面32之间形成连接缝隙b，连接缝隙b用于连通第二子孔233和第一子孔301。第二子孔233贯穿凹部2311的底壁。第二面232上凹设有凹槽2321，凹槽2321用于容纳密封泡棉，实现对部分拾音孔进行密封。本实施例中，所述凹部2311和凹槽2321在Y轴方向至少部分重叠，第二子孔233(Y方向)贯穿凹部2311的底壁和凹槽2321的槽底壁。其中，所述凹部2311更靠近第一侧238，用于适应电路板30上的第一子孔301的位置。
本实施例中，通过密封泡棉放置于凹槽2321来密封第二子孔远离连接缝隙的一端，密封泡棉密封于第二子孔233的位于凹槽2321的槽底壁的端部的周缘，提高第二子孔233的密封性能。同时本实施例的支架会抵压密封泡棉，使其具有更好的密封效果；密封泡棉设置在凹槽内，不会直接受到支架和主板支架23之间的因固定力不够的影响，进一步保证了第二子孔233的密封效果。本实施例中的凹槽2321与镂空区连通。
卡扣236设于第一面231与第一侧238连接的边缘，并且位于凹槽2321远离连接孔237的一侧，卡扣236平行于第一面231的向凸出第一侧238方向延伸，即卡扣236凸出 第一侧238。边框22的第一侧边223朝向中框21的表面凹设有卡槽225，所述主板支架23装于中框21后，卡扣236伸入卡槽225内与卡槽225卡持，防止主板支架23在Y轴方向相对电路板远离。
本实施例中，将设有所述第二子孔233贯穿所述主板支架23与电路板30直接通过螺钉连接固定，连接螺钉的连接孔237和卡扣236位于第二子孔233的相对两侧，进一步提高主板支架23与电路板30之间的装配紧密性，进而保证所述连接缝隙b及第二子孔233的密封性能，进而保证拾音孔60的密封性能，以保证拾音效果。
第二面232上凸设有沿着第二面232长度方向延伸的挡墙2320，挡墙2320靠近第二侧239设置。挡墙2320与本体230连接处具有镂空区C，且挡墙2320上对应镂空区C形成悬臂235；即在挡墙2320形成镂空区C时剩余的部分为悬臂235，可以理解为悬臂235与本体230的第一面231之间通过镂空区C间隔，悬臂235位于凹槽2321一侧上方。本实施例的镂空区C贯穿挡墙2320并且连接凹槽2321，且镂空区C贯穿方向与挡墙2320延伸方向相交。在其他实施例中镂空区C贯穿挡墙2320可以贯穿部分本体230和部分挡墙2320。可以理解为，挡墙2320具有缺口，缺口将挡墙2320分成两部分，所述悬臂235位于缺口内并连接缺口两侧的挡墙部分，悬臂235长度方向为X轴方向。所述悬臂235与本体230之间通过部分缺口间隔。
本实施例中，所述主板支架23与间接承载所述主板支架23的边框22通过卡扣236与所述卡槽225卡持，所述弹片35弹性抵持所述挡墙2320与所述电路板30之间的弹性抵持力可以被卡扣236与所述卡槽225卡持的卡持力抵消，避免弹性抵持力将主板支架23向远离电路板方向推移，避免增加连接缝隙b的缝隙尺寸。
所述的主板支架23包括延伸臂23A，延伸臂23A连接于本体230的第二侧239，且延伸臂23A与主板支架23围成大致矩形的避让槽D，用于避让摄像头组件50。可以理解为，主板支架23为薄板，避让槽开设于薄板上并形成所述本体230和延伸臂23A。
主板支架23固定于中框21上靠近第一端边221和第一侧边223。主板支架23的第一面231与第一侧211朝向相同，第二面232与第二侧212朝向相同。可以理解的是主板支架23可以嵌设在中框21上，可以由中框21支撑。本实施例中，主板支架23由中框21支撑。
电路板30和显示屏B位于第一侧211，显示屏B通过中框21和边框22支撑。摄像头组件50及后壳10位于第二侧212，后壳10盖于中框21的第二侧212并与边框22连接。盖板13将摄像头组件50限位于主体A上。摄像头组件50的支架14抵持主板支架23的第二面232上，凹槽2321内装有密封泡棉，支架14部分挤压密封泡棉，实现对第二子孔233周缘密封的效果。电路板30通过主板支架23和部分中框21支撑，第一面231朝向电路板30的背面32，设于本体230的连接孔237上装有螺钉，螺钉螺接电路板30和主板支架23，使电路板30和主板支架23在Y方向相对锁紧，同时，卡扣236伸入边框22的卡槽225内与卡槽225卡持。
本实施例主板支架23的第一面231与电路板30的背面32接触；第一子孔301和第二子孔233沿着Y轴方向排列并错位(孔轴不在同一直线上)设置，第一面231上的凹部2311与背面32之间具有连接缝隙b，连接缝隙b沿着X轴方向向第一侧边223延伸。第一子孔 301贯穿第一面231的一端和第二子孔233贯穿背面32的一端分别连通连接缝隙b，可以理解为连接缝隙b位于第一子孔301和第二子孔233之间错位产生区域内。本实施例中，在X轴方向上，第一子孔301相较于第二子孔233靠近便携式电子装置100的第一侧边103，也就是第一子孔301相较于第二子孔233靠近边框22的第一侧边223。
降噪麦克风40装于电路板30的正面31上并与第一子孔301连通，第一子孔301贯穿正面31的一端为出音端。也就是沿着Y方向，主板支架23位于电路板30和摄像头组件50之间。即拾音孔60由收音端61、通音缝隙a、第三子孔16、第二子孔233、连接缝隙b及第一子孔301和位于第一子孔301的出音端组成。降噪麦克风40的拾音路径为曲线且即为拾音孔60的延伸路径。手机外部声源通过收音端61进入拾音孔60经过出音端传播至麦克风，达到降噪作用。可以理解为，所述收音端61位于通音缝隙a一端并贯穿所述外表面111，所述出音端为所述第一子孔301的一端，所述通音缝隙a、第三子孔16、第二子孔233、连接缝隙b、第一子孔301及出音端位于所述主体A内部，所述第一子孔301、第二子孔233和所述第三子孔16的轴向与所述便携式电子装置的厚度方向平行，所述第三子孔16和所述第二子孔233均与所述第一子孔301错位设置，所述连接缝隙b和所述通音缝隙a沿着所述便携式电子装置的宽度方向向所述第一侧边延伸。本实施例中的拾音孔60不局限于一定是穿板的孔，也利用了中框21，电路板30、主板支架23和后壳之间缝隙，简化结构，更利于拾音孔的形成。
需要说明的是，电路板30的部分弹片35位于电路板30与主板支架23之间，并且弹片35向远离电路板30的方向的反弹力抵持挡墙2320以及悬臂235，对主板支架23向远离电路板的方向产生一定抵持力。由于电路板30和主板支架23通过螺钉螺接，使电路板30和主板支架23在Y轴方向相对方向锁紧，同时，卡扣236伸入边框22的卡槽225内与卡槽225卡持，在Y轴方向也会产生卡持力。挡墙2320将弹片35的反弹力经本体230转移至卡扣236和螺钉上；在经过卡扣236和螺钉转移至中框21和边框22，且卡扣236和螺钉的限位方向皆为Y轴方向框上，从而主板支架23和电路板30的压合密封效果不受弹片反弹力的影响，因此会抵消弹片35对主板支架23的抵持力，可以增加主板支架23和电路板30板之间的压合力，改善拾音孔60的连接缝隙b的密封效果，防止连接缝隙b漏音影响拾音效果。
同时，挡墙2320靠近第二子孔233的位置形成有镂空区C，弹片35对挡墙2320产生的反弹力绕过镂空区而在悬臂235上，因此可以减小弹片35的反弹力直接对第二子孔233的密封性能的影响。即所述弹片的弹性力向远离电路板30方向抵推所述挡墙，由于所述镂空区与所述第二子孔233沿着所述便携式电子装置的宽度方向间隔，螺钉和卡扣236位于第二子孔233的相对两侧，弹性力会绕镂空区，沿着悬臂235向镂空区两侧位置传递，可以经过螺钉和卡扣分解弹性力，进一步减小对主板支架的反作用力，进而保证连接缝隙b及第二子孔233的密封性能，以保证拾音效果。
本实施例中，摄像头组件50装于主体A上，并位于后壳10左上角位置，也就是位于便携式电子装置100的背部左上角，沿着Z轴方向(手机长度方向)，拾音孔60与第一端边221的距离L1小于拾音孔60与第二端边222的距离(图未示)；沿着X轴方向，拾音孔60与第一侧边223的距离L3小于拾音孔60与第二侧边224的距离(图未示)，其中， 拾音孔60的界限以拾音孔60所在整个区域基准。拾音孔60位于摄像头组件50的摄像头模组50A和第一侧边223之间的位置，可以理解为拾音孔60位于电路板30的边缘以及手机的边缘位置；由于拾音孔60经过后壳10、主板支架23、电路板30和摄像头模支架52，并且电路板30上元件和弹片35较多，将拾音孔60设置在电路板30边缘，而不是中间位置，或者摄像头组件靠近中间的一侧，不用在电路板中间位置设置部分拾音孔，更利于电路板30上电子元件的布局和设计，减小对主体内部空间的使用，提高电路板的利用率。
以上，仅为本申请的部分实施例和实施方式，本申请的保护范围不局限于此，任何熟知本领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (16)

  1. 一种便携式电子装置，其特征在于，包括主体、摄像头模组、降噪麦克风及拾音孔，所述主体包括第一侧边和第二侧边以及外表面，第一侧边和第二侧边位于所述外表面相对两侧，所述摄像头模组装于主体并露出所述外表面，所述主体包括电路板，所述降噪麦克风装于所述电路板，
    所述拾音孔包括收音端和出音端，所述收音端贯穿所述外表面，所述收音端位于所述外表面的一侧位置并靠近所述第一侧边，所述出音端开设于所述电路板上并与所述降噪麦克风的出音孔连通；
    沿着所述便携式电子装置的宽度方向，所述拾音孔位于所述摄像头模组与所述第一侧边之间，所述拾音孔到所述第一侧边的距离小于所述拾音孔到所述第二侧边的距离。
  2. 根据权利要求1所述的便携式电子装置，其特征在于，所述拾音孔包括所述收音端、通音缝隙、第三子孔、第二子孔、连接缝隙、第一子孔及所述出音端，所述收音端、通音缝隙、第三子孔、第二子孔、连接缝隙、第一子孔及出音端依次连通形成呈曲线延伸的孔结构。
  3. 根据权利要求2所述的便携式电子装置，其特征在于，所述收音端位于所述通音缝隙一端并贯穿所述外表面，所述出音端为所述第一子孔的一端，所述通音缝隙、第三子孔、第二子孔、连接缝隙、第一子孔及出音端位于所述主体内部，所述第一子孔、第二子孔和所述第三子孔的轴向与所述便携式电子装置的厚度方向平行，所述第三子孔和所述第二子孔均与所述第一子孔错位设置，所述连接缝隙和所述通音缝沿着所述便携式电子装置的宽度方向向所述第一侧边延伸。
  4. 根据权利要求2所述的便携式电子装置，其特征在于，所述主体包括中框、围绕所述中框周缘的边框和主板支架，所述第一子孔贯穿所述电路板，所述第二子孔贯穿所述主板支架和，所述连接缝隙位于所述主板支架和所述电路板之间；
    所述边框朝向所述主板支架的内侧面凹设有卡槽，所述主板支架设有卡扣，所述卡扣与所述第二子孔相邻，所述卡扣沿着所述便携式电子装置的宽度方向延伸；
    所述电路板设于所述中框和所述主板支架之间，所述卡扣与所述卡槽卡持。
  5. 根据权利要求4所述的便携式电子装置，其特征在于，所述主板支架设有连接孔，所述卡扣和所述连接孔分别位于所述第二子孔相对的两侧，所述连接孔的孔轴沿着所述便携式电子装置的厚度方向延伸；所述连接孔连接有螺钉，以固定连接所述电路板和所述主板支架。
  6. 根据权利要求5所述的便携式电子装置，其特征在于，所述电路板上设有弹片，所述弹片与所述第一子孔相邻，
    所述主板支架包括本体和挡墙，所述第二子孔贯穿所述本体两个相对的面，所述卡扣位于所述本体的一侧所述挡墙设于所述本体的另一侧且与所述卡扣间隔相对；
    所述挡墙上设有悬臂，所述悬臂与所述本体连接处为镂空区，所述镂空区与所述第二子孔沿着所述便携式电子装置的宽度方向间隔，所述卡扣和所述连接孔分别与所述镂空区两侧的挡墙相对间隔相对，所述弹片弹性抵持所述挡墙与所述电路板之间。
  7. 根据权利要求6所述的便携式电子装置，其特征在于，所述本体包括第一面和与所述第一面背向设置的第二面，所述第二面上凹设有凹槽，所述第二子孔贯穿所述凹槽的槽底壁，所述凹槽与所述镂空区连通并用于收容密封泡棉。
  8. 根据权利要求7所述的便携式电子装置，其特征在于，所述第一面上设有凹部，所述第二子孔贯穿所述凹部的底部，所述凹部和凹槽在便携式电子装置的厚度方向至少部分重叠，所述凹部的底部与所述电路板的表面之间形成所述连接缝隙。
  9. 根据权利要求6所述的便携式电子装置，其特征在于，所述主体包括装于中框的后壳，所述后壳包括壳体和盖于所述壳体的盖板，所述收音端贯穿所述盖板的侧边缘，在所述电子装置厚度方向，所述盖板与所述壳体的外表面之间形成所述通音缝隙，所述通音缝隙与所述收音端连通。
  10. 根据权利要求9所述的便携式电子装置，其特征在于，所述壳体背向所述外表面的表面上设有支架，所述支架支撑所述摄像头模组，沿着电子装置厚度方向，所述第三子孔贯穿所述壳体和所述支架，所述第三子孔一端连接所述第二子孔，另一端连接所述通音缝隙。
  11. 一种便携式电子装置，其特征在于，包括中框、围绕所述中框周缘的边框、电路板、主板支架、降噪麦克风及拾音孔；
    所述电路板包括正面和背面，所述背面设有弹片；
    所述拾音孔包括依次连通第一子孔、连接缝隙及第二子孔，所述第一子孔贯穿所述正面和背面并与弹片相邻，所述第二子孔贯穿所述主板支架；
    所述主板支架设有卡扣和连接孔，所述卡扣和所述连接孔分别位于所述第二子孔相对的两侧，所述卡扣沿着所述便携式电子装置的宽度方向延伸；所述连接孔的孔轴沿着所述便携式电子装置的厚度方向延伸；所述边框朝向所述主板支架的内侧面凹设有卡槽；
    所述降噪麦克风装于所述电路板正面与所述第一子孔一端连通，所述电路板设于所述中框和所述主板支架之间，所述连接缝隙形成于所述主板支架和所述电路板之间，所述弹片弹性抵持所述电路板与所述主板支架，所述卡扣与所述卡槽卡持，所述连接孔连接有螺钉以固定连接所述电路板和所述主板支架。
  12. 根据权利要求11所述的便携式电子装置，其特征在于，所述主板支架包括本体和挡墙，所述第二子孔贯穿所述本体两个相对的面，所述卡扣位于所述本体的一侧所述挡墙设于所述本体的另一侧且与所述卡扣间隔相对；
    所述挡墙上设有悬臂，所述悬臂与所述本体连接处为镂空区，所述镂空区与所述第二子孔沿着所述便携式电子装置的宽度方向间隔，所述卡扣和所述连接孔分别与所述镂空区两侧的挡墙相对间隔相对，所述弹片弹性抵持所述挡墙与所述电路板之间。
  13. 根据权利要求12所述的便携式电子装置，其特征在于，所述本体包括第一面和与所述第一面背向设置的第二面，所述第二面上凹设有凹槽，所述第二子孔贯穿所述凹槽的槽底壁，所述凹槽与所述镂空区连通并用于收容密封泡棉。
  14. 根据权利要求13所述的便携式电子装置，其特征在于，所述第一面上设有凹部，所述第二子孔贯穿所述凹部的底部，所述凹部和凹槽在便携式电子装置的厚度方向至少部分重叠，所述凹部的底部与所述电路板的表面之间形成所述连接缝隙。
  15. 根据权利要求14所述的便携式电子装置，其特征在于，所述拾音孔包括所述收音端、和通音缝隙，所述主体包括装于中框的后壳，所述后壳包括壳体和盖于所述壳体的盖板，所述收音端贯穿所述盖板的侧边缘，在所述电子装置厚度方向，所述盖板与所述壳体的外表面之间形成所述通音缝隙，所述通音缝隙与所述收音端连通。
  16. 根据权利要求15所述的便携式电子装置，其特征在于，所述拾音孔包括第三子孔，所述壳体背向所述外表面的表面上设有支架，沿着电子装置厚度方向，所述第三子孔贯穿所述壳体和所述支架，所述第三子孔一端连接所述第二子孔，另一端连接所述通音缝隙。
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