WO2024051230A1 - 服务器和机柜服务器 - Google Patents

服务器和机柜服务器 Download PDF

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Publication number
WO2024051230A1
WO2024051230A1 PCT/CN2023/098502 CN2023098502W WO2024051230A1 WO 2024051230 A1 WO2024051230 A1 WO 2024051230A1 CN 2023098502 W CN2023098502 W CN 2023098502W WO 2024051230 A1 WO2024051230 A1 WO 2024051230A1
Authority
WO
WIPO (PCT)
Prior art keywords
board
server
adapter
processor
adapter board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2023/098502
Other languages
English (en)
French (fr)
Inventor
姬忠礼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
XFusion Digital Technologies Co Ltd
Original Assignee
XFusion Digital Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by XFusion Digital Technologies Co Ltd filed Critical XFusion Digital Technologies Co Ltd
Priority to EP23861933.2A priority Critical patent/EP4518596A4/en
Publication of WO2024051230A1 publication Critical patent/WO2024051230A1/zh
Priority to US18/953,583 priority patent/US20250081380A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1488—Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1487—Blade assemblies, e.g. blade cases or inner arrangements within a blade
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • G06F1/182—Enclosures with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for supporting printed circuit boards
    • G06F1/185—Mounting of expansion boards
    • G06F1/186—Securing of expansion boards in correspondence to slots provided at the computer enclosure
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means

Definitions

  • This application relates to the field of server technology, and in particular to a server and a cabinet server.
  • the cabinet server includes a cabinet and multiple servers.
  • the multiple servers are arranged horizontally at intervals along the height of the cabinet.
  • the server includes the motherboard, memory board and XPU (X Processing Unit various processors).
  • the memory board is inserted vertically on the motherboard. The height of the memory board determines the maximum height of the server. The higher the height of the server, the fewer servers can be accommodated in the cabinet server and the smaller the computing density of the cabinet server.
  • Embodiments of the present application provide a server and a cabinet server, which can improve space utilization in the server and reduce the height of the server.
  • a first aspect of an embodiment of the present application provides a server, including at least one motherboard, at least one adapter board, at least one processor, and at least one memory board; the adapter board and the processor are both disposed on the motherboard, and the adapter boards face each other.
  • the motherboard is tilted, the memory board is electrically connected to the adapter board, and the memory board extends from the adapter board toward the outside of the adapter board.
  • the server provided by the embodiment of the present application is provided with a mainboard, a memory board and an adapter board.
  • the adapter board is provided on the mainboard and the adapter board is electrically connected to the mainboard.
  • the memory board is provided on the adapter board and is electrically connected to the adapter board. , whereby the memory board can be electrically connected to the motherboard through the adapter board.
  • the adapter board is arranged vertically or obliquely relative to the motherboard. That is to say, the adapter board and the motherboard are in a non-parallel state.
  • the adapter board generally extends along the height direction of the server, and the memory board moves from the adapter board toward the adapter board. There is also an angle between the extension direction of the memory board and the extension direction of the adapter board.
  • the memory board generally extends along the length or width direction of the server. Therefore, more numbers can be arranged in the space above the motherboard. More memory boards improve space utilization.
  • the height of the server is determined by the height of the adapter board, and the height of the adapter board is usually smaller than the height of the memory board. Therefore, by setting the adapter board, the height of the server can also be reduced, so that a cabinet server of the same height can accommodate more With more servers, the computing power density of the cabinet server can be increased.
  • the adapter board is arranged vertically on the mainboard, the memory board is arranged vertically on the adapter board, and the mainboard and the memory board are parallel to facilitate the adapter board. Connecting to the motherboard and memory The connection with the adapter board further improves the space utilization in the processor.
  • At least two memory boards are arranged at intervals along the height direction of the adapter board. As a result, heat dissipation space can be left between the memory boards and the layout of each memory board can be neat.
  • the processor is located in the middle of the motherboard, the adapter board is located on the motherboard close to the processor, and the memory board is located on the side of the adapter board away from the processor. ;
  • the adapter board is located at the edge of the motherboard, and the memory board is located on the side of the adapter board facing the processor. Both settings allow the memory board and processor to occupy different spaces above the motherboard, and the memory board and adapter board do not interfere with each other.
  • the server provided by the embodiment of the present application has at least two adapter boards, and each adapter board is located on a different side of the processor.
  • the memory board is electrically connected to the mainboard through an adapter board. Therefore, increasing the number of adapter boards can increase the number of memory boards in the server to further increase the computing power density of the server.
  • the server provided by the embodiment of the present application, at least two motherboards are arranged in parallel, and at least one processor is installed on the opposite surface of the at least two motherboards.
  • the processor is set on the motherboard, so increasing the number of motherboards can increase the number of processors set on the motherboard to further increase the computing power density of the server.
  • the processors on the two motherboards are set opposite each other, so that the processors can occupy two The space between the motherboards does not increase the height of the server.
  • At least one mainboard includes a first mainboard and a second mainboard, and the adapter board extends from the first mainboard to the second mainboard.
  • the first motherboard and the second motherboard are electrically connected through the adapter board. Therefore, the processors on the first motherboard and the second motherboard can also be electrically connected through the adapter board, so that the processor on the first motherboard and the processor on the second motherboard are connected. communication between processors.
  • the server further includes at least one connector, at least one mainboard includes a first mainboard and a second mainboard, and at least one adapter board includes a first adapter board and a third adapter board. Two adapter boards, one end of the first adapter board is connected to the first mainboard, one end of the second adapter board is connected to the second mainboard, and the other end of the first adapter board is connected to the other end of the second adapter board. parts connection.
  • Connecting the first adapter board and the second adapter board through a connector can solve the following problem: when the first mainboard and the second mainboard are connected through an adapter board, the plug-in part on the first mainboard and the second mainboard When the plug-in part is misaligned, the adapter plate will be deformed.
  • the connecting member is one of a flexible circuit board, a ribbon cable, or a cable.
  • a flexible circuit board, a flat cable, or a cable is used as a connector to compensate for the positional tolerance caused when the first adapter board and the second adapter board are misaligned.
  • a second aspect of the embodiment of the present application provides a cabinet server, which includes a cabinet and the server provided in the first aspect installed in the cabinet.
  • Figure 1 is a schematic structural diagram of a data center provided by an embodiment of the present application.
  • FIG. 2 is a schematic diagram of a cabinet server provided by an embodiment of the present application.
  • Figure 3 is a schematic diagram of the internal structure of a server in related technologies
  • Figure 4 is a schematic diagram of the first internal structure of the server provided by the embodiment of the present application.
  • Figure 5 is a schematic diagram 1 of the positions of the adapter board and the mainboard in the server provided by the embodiment of the present application;
  • Figure 6 is a schematic diagram 2 of the positions of the adapter board and the mainboard in the server provided by the embodiment of the present application;
  • Figure 7 is a connection diagram between the adapter board and the mainboard in the server provided by the embodiment of the present application.
  • Figure 8 is a connection diagram between the memory board and the adapter board in the server provided by the embodiment of the present application.
  • Figure 9 is a schematic diagram of the second internal structure of the server provided by the embodiment of the present application.
  • Figure 10 is a connection diagram between the processor and the motherboard in the server provided by the embodiment of the present application.
  • Figure 11 is a first arrangement diagram of the adapter board and processor in the server provided by the embodiment of the present application.
  • Figure 12 is a second arrangement diagram of the adapter board and processor in the server provided by the embodiment of the present application.
  • Figure 13 is a third arrangement diagram of the adapter board and processor in the server provided by the embodiment of the present application.
  • Figure 14 is a schematic diagram of the third internal structure of the server provided by the embodiment of the present application.
  • Figure 15 is a schematic structural diagram of the cold plate in Figure 14;
  • Figure 16 is a cooling status diagram of the server in Figure 14;
  • Figure 17 is another schematic structural diagram of a data center provided by an embodiment of the present application.
  • Figure 18 is a schematic diagram of the fourth internal structure of the server provided by the embodiment of the present application.
  • Figure 19 is a cooling status diagram of the server in Figure 18;
  • Figure 20 is a schematic diagram of the fifth internal structure of the server provided by the embodiment of the present application.
  • Figure 21 is a cooling status diagram of the server in Figure 20;
  • Figure 22 is a schematic diagram of the sixth internal structure of the server provided by the embodiment of the present application.
  • Figure 23 is a connection diagram between the adapter board and the first mainboard and the second mainboard in Figure 22;
  • Figure 24 is a top view of Figure 22;
  • Figure 25 is a schematic diagram of the seventh internal structure of the server provided by the embodiment of the present application.
  • Figure 26 is a schematic diagram of the eighth internal structure of the server provided by the embodiment of the present application.
  • Figure 27 is a schematic diagram of the ninth internal structure of a server provided by an embodiment of the present application.
  • 222a motherboard; 2221, first motherboard; 2222, second motherboard; 223, 223a, processor; 224, 224a, memory board; 2241, first memory board; 2242, second memory board; 225, 225a, base; 226a, air-cooled heat sink; 227, adapter plate; 2271, first adapter plate; 2272, second adapter plate; 2273, connector; 228, radiator; 229, cold Plate; 2291, metal plate; 2292, channel; 2292a, channel entrance; 2292b, channel exit; H1, server height; H2, memory board height; H3. Relative height of the adapter board; J1, the first plug-in part; J2, the second plug-in part; J3, the third plug-in part; J4, the fourth plug-in part; X, first direction; Y, second direction; Z. Third direction.
  • the processor is the general name for various processors such as CPU (Central Processing Unit, central processing unit), GPU (Graphics Processing Unit, graphics processor) or TPU (Tensor Processing Unit, tensor processor), referred to as XPU for short .
  • CPU Central Processing Unit, central processing unit
  • GPU Graphics Processing Unit, graphics processor
  • TPU Transistor Processing Unit, tensor processor
  • Memory board The memory board is used to temporarily store operation data in the processor and data exchanged with external memories such as hard disks.
  • the processor transfers the data that needs to be calculated into the memory for calculation, and when the calculation is completed, the processor transmits the result.
  • Cold plate A sealed radiator that can hold flowing liquid, usually bonded to the heating element with a thermally conductive interface material to remove heat from the heating element.
  • Immersion liquid cooling The heating electronic components are immersed in the refrigerant (coolant), and the heat is taken away by the liquid flow circulation.
  • the heating element When using immersed liquid cooling, the heating element is in direct contact with the refrigerant in all directions. Therefore, the heat dissipation efficiency of immersed liquid cooling is higher.
  • FIG 1 is a schematic structural diagram of a data center provided by an embodiment of the present application.
  • the data center 10 is a global collaborative network of specific equipment used to transmit, accelerate, display, calculate, and store data information on the Internet infrastructure.
  • the data center 10 provided by the embodiment of the present application may include a computer room 100 and at least one cabinet server 200 disposed in the computer room 100. It can be understood that the computer room 100 may be a closed room or a room with one or more sides open. ;
  • the computer room 100 may be a temporary room built, such as a tent room, a board room, etc., or it may be a permanent room built.
  • cabinet server 200 Only one cabinet server 200 may be installed in the computer room 100, or multiple cabinet servers 200 may be installed. When multiple cabinet servers 200 are installed in the computer room 100, each cabinet server 200 may be the same, partially the same, or all different.
  • the cabinet server 200 can be various types such as desktop server, blade server, rack server, high-density server, XPU server, etc.
  • FIG. 2 is a schematic diagram of a cabinet server provided by an embodiment of the present application.
  • the cabinet server 200 provided by the embodiment of the present application may be a rack server.
  • the cabinet server 200 includes a cabinet 210 and multiple servers 220 installed in the cabinet 210 .
  • the cabinet 210 serves as the server 220 .
  • Support parts Specifically, please continue to refer to Figure 2.
  • the width direction of the cabinet 210 is called the first direction X
  • the length direction of the cabinet 210 is called the second direction Y
  • the height direction of the cabinet 210 is called the third direction Z.
  • a plurality of servers 220 are arranged in the cabinet at intervals along the third direction Z.
  • the height direction of the server 220 is consistent with the third direction Z.
  • the height of the server 220 is called the server height H1.
  • the server height H1 is usually a standard IU or 2U (where U is a unit representing the external size of an electronic device and is the abbreviation of unit , 1U is equal to 48.26cm), the smaller the server height H1 is, the more servers 220 can be accommodated in the cabinet 210 of the same height. Therefore, the computing power density of the cabinet server 200 is greater.
  • FIG. 3 is a schematic diagram of the internal structure of a server in the related art.
  • the server is represented by 220a, and each component in the server 220a is also added with a suffix a for distinction.
  • the server 220a includes a housing 221a, a motherboard 222a, at least one processor 223a and a plurality of memory boards 224a.
  • the casing 221a has a receiving cavity 2211a for accommodating the motherboard 222a, the processor 223a and the memory board 224a.
  • the server height H1 is the height of the casing 221a.
  • the main board 222a is connected to the inner bottom wall of the casing 221a and is arranged parallel to the inner bottom wall of the casing 221a.
  • the processor 223a can be welded to the main board through the base 225a.
  • a plurality of memory slots may be welded on the motherboard 222a around the processor 223a.
  • the memory board 224a is plugged into the memory slots to be electrically connected to the motherboard 222a.
  • the extending direction of the memory board 224a is consistent with the third direction Z.
  • the size of the memory board 224a along the third direction Z is called the memory board height H2.
  • the memory board height H2 determines the size of the server height H1. Since the memory board height H2 is usually larger, the server height H1 of a single server 220a is usually larger. As a result, the number of servers 220a accommodated in the cabinet 210 of the same height is smaller, and the computing power density of the cabinet server 200 is smaller.
  • the data center 10 can be an air-cooled and heat-dissipated data center.
  • the data center 10 is equipped with an air conditioner, and the cold air of the air conditioner takes away the heat generated by the cabinet server 200 .
  • the heat dissipation of the processor 223a in the server 220a is relatively large, and the processor 223a is also provided with an air-cooling heat sink 226a.
  • the air-cooling heat sink 226a is usually a fin as shown in Figure 3
  • the size of the fin structure along the third direction Z is larger, which will also cause the server height H1 to increase.
  • FIG 4 is a schematic diagram of the first internal structure of a server provided by an embodiment of the present application.
  • the server 220 includes at least one motherboard 222, at least one adapter board 227, at least one processor 223 and at least one memory board 224; the adapter board 227 and the processor 223 are both arranged on
  • the memory board 224 is electrically connected to the adapter board 227 and extends from the adapter board 227 toward the outside of the adapter board 227 .
  • the outside of the adapter board 227 may include a side of the adapter board 227 facing away from the processor 223 , and/or a side of the adapter board 227 facing the processor 223 .
  • the extension direction of the main board 222 is consistent with the first direction X or the second direction Y in FIG. 4.
  • the processor 223 is disposed on the main board 222 and is electrically connected to the main board 222.
  • the main board 222 is also electrically connected to other resistors, capacitors, sensors, etc.
  • Electronic devices in order to facilitate the electrical connection between the processor 223 and other electronic devices on the motherboard 222, the processor 223 is usually disposed in the middle area of the motherboard 222.
  • the processor 223 is the core working component of the server 220 for computing, and the processor 223 cooperates with other electronic devices on the motherboard 222 .
  • the processor 223 generates a large amount of heat when working, so a heat sink 228 is covered above the processor 223 to transfer the heat away when the processor 223 works.
  • the adapter board 227 is disposed on the main board 222 and is electrically connected to the main board 222 .
  • the memory board 224 is electrically connected to the adapter board 227 . Therefore, the memory board 224 is electrically connected to the main board 222 through the adapter board 227 .
  • FIG. 5 is a first schematic diagram of the positions of the adapter board and the main board in the server provided by the embodiment of the present application
  • FIG. 6 is a second schematic diagram of the positions of the adapter board and the main board of the server provided by the embodiment of the present application.
  • part of the adapter plate has been removed. See Figures 5 and 6.
  • the adapter plate 227 shown in Figure 5 The included angle ⁇ between the adapter plate 227 and the main board 222 is 45°.
  • the included angle ⁇ between the adapter plate 227 and the main board 222 shown in FIG. 6 is 90°.
  • the included angle ⁇ can vary between 45° and 90°.
  • the size of the adapter plate 227 along the third direction is called the relative height H3 of the adapter plate.
  • the included angle ⁇ is less than 45° At this time, it is inconvenient to plug the adapter board 227 into the mainboard 222, and the multiple memory boards 224 connected to the adapter board 227 will also occupy the top of the mainboard 222 along the first direction X (or the second direction Y) in FIG. 5 More space, therefore, the angle ⁇ can vary between 45° and 90°.
  • the thickness of the motherboard 222 (the size of the motherboard along the third direction Z) is generally a certain value. Therefore, the server height H1 is determined by the relative height H3 of the adapter board.
  • the memory board 224 extends toward the side of the adapter board 227, that is, there is an angle between the extension direction of the memory board height H2 and the extension direction of the adapter board relative height H3. Therefore, the space above the main board 222 can be arranged with a number of More memory boards 224 improve space utilization.
  • the extension direction of the adapter plate's relative height H3 is consistent with the third direction Z.
  • the adapter plate's relative height H3 has the largest size along the third direction Z, and the relative height H3 of the adapter board is still much smaller than the memory board height H2 at its maximum size. Therefore, by providing the adapter plate 227 , the server height H1 can be reduced, so that more servers 220 can be accommodated in the cabinet server 200 , thereby increasing the computing power density of the cabinet server 200 .
  • the adapter board 227 is arranged vertically on the main board 222
  • the memory board 224 is arranged vertically on the adapter board 227
  • the main board 222 and the memory board 224 are parallel.
  • Figure 7 is a connection diagram between the adapter board and the mainboard in the server provided by the embodiment of the present application.
  • a first plug-in part J1 is welded on the motherboard 222 , and the first plug-in part J1 may be a row of seats.
  • the adapter board 227 is provided with a second plug-in part J2 at one end facing the main board 222.
  • the second plug-in part J2 may be a pin header.
  • the second plug-in part J2 is plugged into the first plug-in part J1 to connect the adapter.
  • the connecting board 227 is electrically connected to the main board 222 .
  • first plug-in part J1 can also be a pin header
  • second plug-in part J2 can be a row socket
  • the adapter board 227 can be disposed vertically on the main board 222 to facilitate the insertion of the first plug-in part J1 and the second plug-in part J2.
  • FIG. 8 is a connection diagram between the memory board and the adapter board in the server provided by the embodiment of the present application.
  • a plurality of third plug-in parts J3 are welded on the adapter plate 227 .
  • the third plug-in parts J3 may be row seats.
  • the memory board 224 is provided with a fourth plug-in part at one end facing the adapter plate 227 .
  • J4 the fourth plug-in part J4 can be a pin header, and the fourth plug-in part J4 is plugged into the third plug-in part J3 to electrically connect the memory board 224 and the adapter board 227.
  • the third plug-in part J3 can also be a pin header, and the fourth plug-in part J4 can be a row socket.
  • the memory board 224 is arranged vertically on the adapter board 227 to facilitate the insertion of the third plug-in part J3 and the fourth plug-in part J4. In addition, the memory board 224 needs to be kept parallel to the main board 222 to fully utilize the space above the main board 222 .
  • the number of memory boards 224 is at least two, and each memory board 224 is arranged at intervals along the height direction of the adapter board 227 .
  • the number of memory boards 224 may be two or more.
  • the memory boards 224 are spaced apart in sequence along the extension direction of the adapter board relative to the height H3, and the memory boards 224 are parallel to each other, so that the memory boards 224 make full use of the space above the main board 222 in FIG. 4 .
  • FIG. 9 is a schematic diagram of the second internal structure of the server provided by the embodiment of the present application.
  • the processor 223 is located in the middle position on the motherboard 222 .
  • the adapter board 227 can be laid out in different ways on the mainboard 222. Specifically, in the embodiment shown in FIG. 4 , the adapter board 227 is located on the mainboard 222 close to the processor 223 , and the memory board 224 is located on the side of the adapter board 227 away from the processor 223 ; as shown in FIG. 9 In the embodiment, the adapter board 227 is located at the edge of the motherboard along the first direction X (or the second direction Y) in FIG.
  • the memory board 224 is located on the side of the adapter board facing the processor 223 .
  • the memory board 224 and The processor 223 occupies different spaces above the motherboard 222, so that the memory board 224 and the processor 223 do not interfere with each other.
  • FIG. 10 is a connection diagram between the processor and the motherboard in the server provided by the embodiment of the present application.
  • the server 220 also includes a base 225 .
  • the base 225 is provided between the processor 223 and the motherboard 222 , and is used to support the processor 223 .
  • the side of the base 225 facing the processor 223 is electrically connected to the processor 223, and the side of the base 225 facing the motherboard 222 is electrically connected to the motherboard, so the processor 223 is electrically connected to the motherboard through the base 225.
  • the processor 223 can be electrically connected to the base 225 through die-bonding
  • the base 225 can be electrically connected to the motherboard 222 through soldering.
  • the number of adapter boards 227 is at least two, and each adapter board 227 is located on different sides of the processor 223 .
  • the processor 223 is generally rectangular, and the adapter plates 227 can be disposed on four peripheral sides of the processor 223 .
  • the adapter board 227 and the processor 223 are arranged in different ways. Possible arrangements of the adapter board 227 and the processor 223 are described below.
  • FIG. 11 is a first arrangement diagram of an adapter board and a processor in a server provided by an embodiment of the present application. As shown in FIG. 11 , each adapter board 227 is located on two opposite sides of the processor 223 , and the adapter boards 227 on two opposite sides of the processor 223 are staggered.
  • the server 220 is provided with two adapter boards 227 and a processor 223.
  • the adapter boards 227 can be staggered on both sides of the processor 223 along the first direction X (or the second direction Y). set so that other electronic devices on the motherboard 222 can be avoided.
  • the server 220 may be provided with three adapter boards 227, and each adapter board 227 is provided on three different sides of the processor 223, or two of the adapter boards 227 are provided on the same side. Specifically, it depends on the layout setting on the motherboard 222.
  • Four adapter boards 227 can also be provided in the server 220, with each adapter board 227 being provided on four different sides of the processor 223, or two of the adapter boards 227 being provided on the same side. Specifically, according to the motherboard 222 layout settings on.
  • Figure 12 is a second arrangement diagram of the adapter board and processor in the server provided by the embodiment of the present application. As shown in FIG. 12 , the number of adapter boards 227 is an even number, and each adapter board 227 is symmetrical with respect to the processor 223 .
  • the server 220 is provided with two adapter boards 227 and a processor 223.
  • the adapter boards 227 can be symmetrical on both sides of the processor 223 along the first direction X (or the second direction Y).
  • the arrangement facilitates wiring on the mainboard 222 for electrically connecting the processor 223 and the adapter board 227 .
  • Each adapter board 227 may also be provided in the server 220 .
  • Each adapter board 227 is provided on four different sides of the processor 223 .
  • the adapter boards 227 on the two opposite sides are symmetrical with respect to the processor 223 .
  • FIG. 13 is a third arrangement diagram of the adapter board and processor in the server provided by the embodiment of the present application.
  • the server 220 may include two or more processors 223 .
  • the server 220 shown in Figure 13 includes two processors 223. Both processors 223 are electrically connected to the motherboard 222.
  • the two processors 223 can be electrically connected to each other through wiring on the motherboard 222, so that the processors 223 data transfer or backup between.
  • Each processor 223 has a corresponding adapter board 227.
  • the arrangement of the adapter board 227 and the processor 223 is the same as that shown in Figure 11 or Figure 12, which will not be described again here.
  • the processor 223, the memory board 224, and other electronic devices in the server 220 will dissipate a large amount of heat.
  • the accumulation of heat causes the temperature of the server 220 to rise.
  • the high temperature will reduce the performance of the processor 223, the memory board 224, and other electronic devices in the server 220, causing the server 220 to fail to operate normally. Therefore, effective heat dissipation measures are required to dissipate heat from the server 220 to reduce the operating temperature of each electronic device in the server 220 .
  • possible heat dissipation methods of the server 220 are described.
  • FIG 14 is a third schematic diagram of the internal structure of a server provided by an embodiment of the present application.
  • the server 220 in this embodiment also includes a plurality of cold plates 229. At least one of the memory board 224 and the radiator 228 is covered with the cold plate 229 and the cold plate 229.
  • the cold plate 229 is used to dissipate heat to the corresponding memory board 224 and processor 223 .
  • the cold plate 229 is a heat sink made of metal with good thermal conductivity.
  • the cold plate 229 can be an aluminum plate, a copper plate or a copper-aluminum alloy plate.
  • the cold plate 229 also has channels for liquid flow. The flow of liquid through the channels of cold plate 229 removes heat dissipated by processor 223 and memory board 224 .
  • the cold plate 229 directly covers the heat sink 228 of the processor 223 or the memory board 224. There is flowing cooling liquid in the cold plate 229. Therefore, the cooling efficiency of the cold plate 229 is higher than that of the air-cooled heat sink 226a, so that the cold plate 229 moves along the The space occupied in the third direction Z is small.
  • the size along the third direction Z is larger, making the server height H1 larger. Using the cold plate 229 for cooling is not sufficient. Will increase the server height H1.
  • Figure 15 is a schematic structural diagram of the cold plate in Figure 14.
  • the cold plate 229 includes a metal plate 2291 and a channel 2292.
  • the channel 2292 has a channel inlet 2292a and a channel outlet 2292b for cooling liquid to enter and exit.
  • FIGS. 1 and 16 are a cooling status diagram of the server in Figure 14.
  • a coolant storage device 110 is provided in the machine room 100 .
  • the coolant storage device 110 has a liquid inlet pipeline 111 and a liquid outlet pipeline 112.
  • the liquid outlet pipeline 112 includes a liquid outlet main pipeline 1121 and a plurality of liquid outlet sub-pipes 1122.
  • the liquid outlet main pipeline 1121 is connected to a plurality of outlet pipes respectively.
  • the liquid sub-pipes 1122 are connected, and each liquid sub-pipe 1122 is connected to the channel inlet 2292a in different cold plates 229 respectively.
  • the liquid inlet pipeline 111 includes a main liquid inlet pipeline 1111 and a liquid inlet sub-pipeline 1112.
  • the main liquid inlet pipeline 1111 is connected to a plurality of liquid inlet sub-pipes 1112, and each liquid inlet sub-pipeline 1112 is connected to a different cold plate 229.
  • the channel exit 2292b is connected.
  • arrows indicate the flow direction of the coolant.
  • the coolant flows from the coolant storage device 110 through the main liquid outlet pipe 1121, the liquid outlet sub-pipeline 1122, the channel inlet 2292a, and the cold plate 229 in sequence.
  • the channel 2292 in the cold plate 229, the channel outlet 2292b in the cold plate 229, the liquid inlet sub-pipeline 1112, the liquid inlet main pipe 1111, and then return to the coolant storage device 110, and the memory board 224 is taken away by the flow of liquid in the channel 2292. and processor 223 heat.
  • Each server 220 has its own cooling circuit. Therefore, when one of the servers 220 needs maintenance, you only need to close the liquid outlet sub-pipeline 1122 and the liquid inlet sub-pipeline 1112 connected to the server 220 without any impact. Other servers 220 operate normally.
  • the channel 2292 of the cold plate 229 located on the processor 223 and the channel 2292 of the cold plate 229 located on the memory board 224 can be connected in parallel.
  • the parallel connection makes the cooling efficiency of the processor 223 and the memory board 224 higher. high.
  • each server 220 the channel 2292 of the cold plate 229 located on the processor 223 and the channel 2292 of the cold plate 229 located on the memory board 224 can be connected in series.
  • the series connection can save the amount of cooling liquid.
  • the heat dissipation of the memory board 224 is less than the heat dissipation of the processor 223.
  • the cold plate 229 can be provided only on the processor 223 without providing the cold plate 229 on the memory board 224.
  • the memory board 224 dissipates heat through air cooling.
  • FIG. 17 is another schematic structural diagram of a data center provided by an embodiment of the present application.
  • the computer room 100 is also equipped with multiple air conditioners 120.
  • the cavity formed by the cabinet 210 is connected to the space in the computer room 100. Through the air The adjusted cold air lowers the temperature of the computer room 100, thereby taking away the heat generated by the memory board 228.
  • the server 220 can also be cooled by immersion liquid cooling.
  • Figure 18 is a fourth internal structural diagram of a server provided by an embodiment of the present application. Referring to FIG. 18 , the coolant is filled in a dotted manner, and each server 220 is immersed in the coolant. As the coolant flows, the heat dissipated by the processor 223 and the memory board 224 is taken away.
  • the coolant has properties such as insulation, anti-corrosion, non-flammability, and non-toxicity, so it will not damage various components in the server 220 .
  • FIG 19 is a cooling status diagram of the server in Figure 18.
  • a coolant storage device 110 is provided in the machine room 100, and the coolant storage device 110 has a liquid inlet pipeline 111 and a liquid outlet pipeline 112.
  • the cabinet 210 is provided with a cabinet inlet 211 and a cabinet outlet 212.
  • the cabinet inlet 211 is connected to the liquid outlet pipe 112, and the cabinet outlet 212 is connected to the liquid inlet pipe 111.
  • the cavity 213 formed by the cabinet 210 has a Coolant, each server 220 is immersed in the coolant.
  • arrows indicate the flow direction of the coolant. As shown in Figure 19, the coolant flows from the coolant storage device 110 through the liquid outlet pipe 112, the cabinet inlet 211, the cavity 213, and the cabinet outlet 212, and The coolant flows from the liquid inlet pipe 111 into the coolant storage device 110 .
  • each server 220 can also be individually immersed cooled.
  • Figure 20 is a schematic diagram of the fifth internal structure of a server provided by an embodiment of the present application.
  • the server 220 also includes a housing 221.
  • the housing 221 has an accommodation cavity 2211.
  • the mainboard 222, the processor 223, the adapter board 227 and the memory board 224 are all located in the accommodation cavity 2211, and the mainboard 222 and the housing are 221 inner wall connection.
  • the motherboard 222 can be connected to the side wall of the casing 221 through fasteners, so that the motherboard 222 is installed in the accommodation cavity.
  • the processor 223 and the adapter plate 227 are both connected to the motherboard 222, and the memory board 224 is connected to the adapter plate 227.
  • the processor 223, the adapter board 227 and the memory board 224 are all located in the accommodation cavity 2211.
  • the side wall of the housing 221 has a housing inlet 2212 and a housing outlet 2213 for cooling liquid to enter and exit.
  • the flow of the coolant in the housing 221 takes away the heat emitted by the processor 223 and the memory board 224 during operation.
  • Figure 21 is a cooling status diagram of the server in Figure 20.
  • a coolant storage device 110 is provided in the machine room 100.
  • the coolant storage device 110 has a liquid inlet pipeline 111 and a liquid outlet pipeline 112.
  • the liquid outlet pipeline 112 includes a main liquid outlet pipeline 1121. And a plurality of liquid outlet sub-pipes 1122, the liquid outlet main pipeline 1121 is connected to a plurality of liquid outlet sub-pipes 1122, and each liquid outlet sub-pipeline 1122 is connected to a different housing inlet 2212.
  • the liquid inlet pipeline 111 includes a main liquid inlet pipeline 1111 and a liquid inlet sub-pipeline 1112.
  • the main liquid inlet pipeline 1111 is connected to a plurality of liquid inlet sub-pipes 1112, and each liquid inlet sub-pipeline 1112 is connected to a different shell outlet. 2213 connected.
  • arrows indicate the flow direction of the coolant.
  • the coolant flows from the coolant storage device 110 through the main liquid outlet pipeline 1121, the liquid outlet sub-pipeline 1122, the housing inlet 2212, and the accommodation cavity 2211. , casing outlet 2213, liquid inlet sub-pipeline 1112, liquid inlet main pipe 1111, and then back to the coolant storage device 110.
  • the heat generated by each device in the server 220 is taken away through the flow of coolant. That is to say, each server 220 has its own cooling circuit. Therefore, when one of the servers 220 needs maintenance, it is only necessary to close the liquid outlet sub-pipe 1122 and the liquid inlet sub-pipe 1112 connected to the server 220. Yes, it does not affect the normal operation of other servers 220.
  • FIG. 22 is a schematic diagram of the sixth internal structure of a server provided by an embodiment of the present application.
  • the number of main boards 222 is Two
  • the adapter board 227 is connected between the two motherboards
  • the number of processors 223 is at least two
  • one motherboard 222 has at least one processor 223 on a side facing the other motherboard 222.
  • the server 220 may be provided with two motherboards 222, and the two motherboards 222 are arranged oppositely along the third direction Z in FIG. 22, where one motherboard 222 is called the first motherboard 2221, and the other motherboard 222 is called the second motherboard 2222.
  • the adapter board 227 is disposed between the first mainboard 2221 and the second mainboard 2222, and the adapter board 227 is electrically connected to both the first mainboard 2221 and the second mainboard 2222.
  • FIG. 23 is a connection diagram between the adapter board and the first mainboard and the second mainboard in FIG. 22 .
  • both ends of the adapter board 227 have second plug-in portions J2.
  • Both the first mainboard 2221 and the second mainboard 2222 have first plug-in portions J1.
  • the second plug-in portions J1 on one end of the adapter board 227 The plug-in part J2 is plugged into the first plug-in part J1 on the first mainboard 2221, and the second plug-in part J2 at the other end of the adapter board 227 is plugged into the first plug-in part J1 on the second mainboard 2222. , to electrically connect the first mainboard 2221 and the second mainboard 2222.
  • At least one processor 223 is provided on both the first motherboard 2221 and the second motherboard 2222.
  • the processor 223 on the first motherboard 2221 is disposed on a side of the first motherboard 2221 facing the second motherboard 2222.
  • the processor on the second motherboard 2222 223 are arranged on the side of the second motherboard 2222 facing the first motherboard 2221. Therefore, the processor 223 can occupy the space between the first motherboard 2221 and the second motherboard 2222 without additionally increasing the server height H1.
  • the interconnection between two processors 223 located on a motherboard 222 is realized through the wiring on the motherboard 222.
  • the motherboard 222 needs to be laid out for the processors 223 to communicate with each other. connected line layer.
  • the two processors 223 that need to be interconnected are respectively provided on the first mainboard 2221 and the second mainboard 2222.
  • the adapter board 227 is provided with circuits for electrically connecting the first mainboard 2221 and the second mainboard 2222. wire to electrically connect the processor 223 on the first motherboard 2221 and the processor 223 on the second motherboard 2222.
  • the processor 223 on the first motherboard 2221 and the processor 223 on the second motherboard 2222 can be electrically connected through the wiring in the adapter board 227. Therefore, the number of layers of the motherboard 222 can be reduced by providing the adapter board 227. , thereby reducing the complexity of the mainboard 222.
  • the memory board 224 and the adapter board 227 are electrically connected.
  • the memory board 224 and the adapter board 227 are electrically connected in the same manner as shown in FIG. 8 , which will not be described again here.
  • the memory board 224 electrically connected to the first motherboard 2221 through the adapter board 227 is called the first memory board 2241
  • the memory board electrically connected to the second motherboard 2222 through the adapter board 227 is called 224
  • the first memory board 2241 is placed close to the first motherboard 2221
  • the second memory board 2242 is placed close to the second motherboard 2222 to facilitate wiring on the adapter board 227.
  • FIG. 24 is a top view of FIG. 22 , in which the second motherboard 2222 is removed for clarity, and the processor 223 provided on the second motherboard 2222 and the second memory board 2242 electrically connected to the second motherboard 2222 are represented by dotted lines. .
  • the processor 223 provided on the first motherboard 2221 and the processor 223 provided on the second motherboard 2222 may or may not be aligned.
  • the first memory board is electrically connected to the first motherboard 2221. 2241 and the second memory board 2242 electrically connected to the second motherboard 2222 may be aligned or misaligned, specifically based on the design requirements of the first motherboard 2221 and the second motherboard 2222.
  • FIG 25 is a schematic diagram of the seventh internal structure of a server provided by an embodiment of the present application.
  • the server 220 in this embodiment also includes a housing 221.
  • the housing 221 has an adapter board 227 for accommodating the motherboard 222, the memory board 224, and the processor 223. accommodating cavity 2211.
  • One of the main boards 222 is connected to the inner bottom wall of the casing 221 and is called the first main board 2221.
  • the other main board 222 is connected to the inner top wall of the casing 221 and is called the second main board 2222.
  • Other structures of the server 220 shown in Figure 25 are the same as those of the server 220 shown in Figures 21 and 22, and will not be described again here.
  • the first plug-in portion J1 on the first mainboard 2221 and the first plug-in portion J1 on the second mainboard 2222 may be misaligned.
  • the second plug-in part J2 on one end of the adapter board 227 is plugged into the first plug-in part J1 on the first mainboard 2221, and the second plug-in part J2 on the other end of the adapter board 227 is connected with the first plug-in part J1 on the second mainboard 2222.
  • the first plug-in part J1 is plugged in, so that the adapter plate 227 will be deformed.
  • FIG. 26 is a schematic diagram of the eighth internal structure of the server provided by the embodiment of the present application.
  • the above problem can be solved through the connector 2273 shown in FIG. 26 .
  • the server 220 also includes at least one connector 2273, the number of mainboards 222 is two, and each mainboard 222 is connected to at least one adapter.
  • each adapter board 227 is located between the two main boards; the number of adapter boards 227 on the two main boards 222 is the same, and the adapter boards 227 on the two main boards 222 are arranged oppositely, and the two opposite adapter boards 227 are electrically connected through connectors 2273; the number of processors 223 is at least two, and one mainboard 222 has at least one processor 223 on a side facing the other mainboard 222.
  • the adapter board 227 electrically connected to the first main board 2221 is called the first adapter board 2271
  • the adapter board 227 electrically connected to the second main board 2222 is called the second adapter board 2272 .
  • the connecting piece 2273 is used to electrically connect the first adapter board 2271 and the second adapter board 2272.
  • One end of the connecting piece 2273 is electrically connected to the first adapter plate 2271, and the other end of the connecting piece 2273 is electrically connected to the second adapter plate 2272.
  • the positional deviation between the first adapter plate 2271 and the second adapter plate 2272 can be compensated through the flexible deformation of the connector 2273, thereby solving the deformation of the adapter plate 227 caused by the assembly tolerance of the first main board 2221 and the second main board 2222. The problem.
  • the arrangement of the processor 223 is the same as that of the embodiment shown in FIGS. 21 and 22 , and will not be described again here.
  • the connector 2273 is a flexible circuit board, a flat cable, or a cable.
  • the connector 2273 may be a flexible circuit board, and the first adapter board 2271 and the second adapter board 2272 are electrically connected through the flexible circuit board.
  • the flexible circuit board has male headers at both ends, and the first adapter board 2271 and the second adapter board 2272 both have female headers. The male headers are inserted into the female headers to realize the connection between the flexible circuit board and the first adapter board.
  • the board 2271 and the second adapter board 2272 are electrically connected.
  • the flexible circuit board has pins at both ends, and the first adapter board 2271 and the second adapter board 2272 have corresponding pads. The pins are welded to the first adapter board 2271 and the second adapter board 2272 respectively. On the soldering pad of the second adapter board 2272, the flexible circuit board is electrically connected to the first adapter board 2271 and the second adapter board 2272.
  • the connector 2273 may also be a flex cable or a cable.
  • the flex cable or cable is electrically connected to the first adapter board 2271 and the second adapter board 2272 in the same manner as described above, which will not be described again here.
  • FIG 27 is a schematic diagram of the ninth internal structure of a server provided by an embodiment of the present application.
  • the server 220 in this embodiment also includes a casing 221.
  • the casing 221 has a motherboard 222, a memory board 224, a processor 223 and an adapter board 227.
  • One of the main boards 222 is connected to the inner bottom wall of the casing 221 and is called the first main board 2221.
  • the other main board 222 is connected to the inner top wall of the casing 221 and is called the second main board 2222.
  • Other structures of the server 220 shown in Figure 25 are the same as those of the server 220 shown in Figures 21 and 22, and will not be described again here.
  • the server 220 can adopt cold plate cooling or immersion cooling.
  • the specific methods of cold plate cooling and immersion cooling are as described above. Detailed descriptions have been made in the embodiments and will not be repeated here.
  • connection should be understood in a broad sense.
  • it can be a fixed connection or a fixed connection.
  • connection can be the internal connection between two elements or the interaction between two elements.

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  • Computer Hardware Design (AREA)
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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本申请实施例提供一种服务器和机柜服务器，服务器包括至少一个主板、至少一个转接板、至少一个处理器和至少一个内存板；转接板和处理器均设置在主板上，且转接板相对于主板竖直或倾斜设置，内存板与转接板电连接，且内存板自转接板朝向转接板外侧延伸。本申请实施例的服务器，可以提高服务器中的空间利用率，同时降低服务器的高度。

Description

服务器和机柜服务器
本申请要求于2022年09月05日提交中国专利局、申请号为202211079381.8、申请名称为“服务器和机柜服务器”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及服务器技术领域，尤其涉及一种服务器和机柜服务器。
背景技术
随着大数据、云计算及AI(Artificial intelligence，人工智能)的兴起，对服务器的算力密度的需求越来越高。
机柜服务器包括柜体和多个服务器，多个服务器沿柜体的高度方向间隔水平设置。服务器包括主板、内存板和XPU(X Processing Unit各类处理器)。内存板竖直插在主板上，内存板的高度决定了服务器的最大高度，服务器的高度越高，导致机柜服务器中容纳的服务器数量越少，机柜服务器的计算密度越小。
但是，上述服务器中内存板的设置方式导致服务器中的空间利用率较低，并且使得服务器的高度较大。
发明内容
本申请实施例提供一种服务器和机柜服务器，可以提高服务器中的空间利用率，同时降低服务器的高度。
本申请实施例第一方面提供一种服务器，包括至少一个主板、至少一个转接板、至少一个处理器和至少一个内存板；转接板和处理器均设置在主板上，且转接板相对于主板倾斜，内存板与转接板电连接，且内存板自转接板朝向转接板外侧延伸。
本申请实施例提供的服务器，通过设置主板、内存板和转接板，转接板设置在主板上并且转接板与主板电连接，内存板设置在转接板上并且与转接板电连接，由此内存板可以通过转接板与主板电连接。转接板相对于主板竖直或倾斜设置，也就是说，转接板与主板处于非平行状态，转接板总体上沿着服务器的高度方向延伸，而内存板自转接板朝向转接板的侧方延伸，内存板的延伸方向与转接板的延伸方向之间也具有夹角，内存板总体上沿着服务器的长度方向或者宽度方向延伸，由此，主板上方的空间可以布置数量更多的内存板，提高了空间利用率。同时，服务器的高度由转接板的高度决定，而转接板的高度通常小于内存板的高度，因此，通过设置转接板还可以降低服务器的高度，使得相同高度的机柜服务器中可以容纳更多的服务器，由此可以提高机柜服务器的算力密度。
在一种可能的实施方式中，本申请实施例提供的服务器，转接板竖直设置于主板上，内存板竖直设置于转接板上，且主板与内存板平行，以便于转接板与主板的插接以及内存 与转接板的插接，并且进一步提高了处理器中的空间利用率。
在一种可能的实施方式中，本申请实施例提供的服务器，至少两个内存板沿转接板的高度方向依次间隔设置。由此，可以为内存板之间留有散热空间并且使得各内存板的布局整齐。
在一种可能的实施方式中，本申请实施例提供的服务器，处理器位于主板上的中部位置，转接板位于主板上靠近处理器的位置，内存板位于转接板背离处理器的一侧；或者，转接板位于主板上的边缘位置，内存板位于转接板朝向处理器的一侧。这两种设置方式均使得内存板与处理器占据主板上方不同的空间，内存板和转接板互不干涉。
在一种可能的实施方式中，本申请实施例提供的服务器，转接板的数量为至少两个，各转接板分别位于处理器的不同侧。内存板通过转接板与主板电连接，因此，增加转接板的数量可以增加服务器中内存板的数量，以进一步提高服务器的算力密度。
在一种可能的实施方式中，本申请实施例提供的服务器，至少两个主板平行设置，且至少两个主板的相对面均设有至少一个处理器。处理器设置在主板上，因此增加主板的数量可以增加主板上设置的处理器的数量，以进一步增加服务器的算力密度，此外，两个主板上的处理器相对设置，使得处理器可以占据两个主板之间的空间，不会额外增加服务器高度。
在一种可能的实施方式中，本申请实施例提供的服务器，至少一个主板包括第一主板和第二主板，转接板自第一主板延伸至第二主板。第一主板和第二主板通过转接板电连接，因此，第一主板和第二主板上的处理器也可以通过转接板电连接，以实现第一主板上的处理器和第二主板上的处理器之间的通信。
在一种可能的实施方式中，本申请实施例提供的服务器，服务器还包括至少一个连接件，至少一个主板包括第一主板和第二主板，至少一个转接板包括第一转接板和第二转接板，第一转接板的一端与第一主板连接，第二转接板的一端与第二主板连接，第一转接板的另一端与第二转接板的另一端通过连接件连接。通过连接件连接第一转接板和第二转接板，可以解决如下问题：当第一主板和第二主板通过一个转接板连接时，第一主板上的插接部与第二主板上的插接部未对时，转接板会产生变形。
在一种可能的实施方式中，本申请实施例提供的服务器，连接件为柔性电路板、排线或者线缆中的一者。柔性电路板、排线或者线缆中的一者作为连接件，可以补偿第一转接板与第二转接板未对准时产生的位置公差。
本申请实施例第二方面提供一种机柜服务器，包括柜体和被安装于柜体内的上述第一方面提供的服务器。
结合附图，根据下文描述的实施例，示例性实施例的这些和其它方面、实施形式和优点将变得显而易见。但应了解，说明书和附图仅用于说明并且不作为对本申请的限制的定义，详见随附的权利要求书。本申请的其它方面和优点将在以下描述中阐述，而且部分将从描述中显而易见，或通过本申请的实践得知。此外，本申请的各方面和优点可以通过所附权利要求书中特别指出的手段和组合得以实现和获得。
附图说明
图1为本申请实施例提供的数据中心的结构示意图；
图2为本申请实施例提供的机柜服务器的示意图；
图3为相关技术中服务器的内部结构示意图；
图4为本申请实施例提供的服务器的第一种内部结构示意图；
图5为本申请实施例提供的服务器中转接板与主板的位置示意图一；
图6为本申请实施例提供的服务器中转接板与主板的位置示意图二；
图7为本申请实施例提供的服务器中转接板与主板的连接图；
图8为本申请实施例提供的服务器中内存板与转接板的连接图；
图9为本申请实施例提供的服务器的第二种内部结构示意图；
图10为本申请实施例提供的服务器中处理器与主板的连接图；
图11为本申请实施例提供的服务器中转接板与处理器的第一种排布图；
图12为本申请实施例提供的服务器中转接板与处理器的第二种排布图；
图13为本申请实施例提供的服务器中转接板与处理器的第三种排布图；
图14为本申请实施例提供的服务器的第三种内部结构示意图；
图15为图14中冷板的结构示意图；
图16为图14中服务器的冷却状态图；
图17为本申请实施例提供的数据中心的另一结构示意图；
图18为本申请实施例提供的服务器的第四种内部结构示意图；
图19为图18中服务器的冷却状态图；
图20为本申请实施例提供的服务器的第五种内部结构示意图；
图21为图20中服务器的冷却状态图；
图22为本申请实施例提供的服务器的第六种内部结构示意图；
图23为图22中转接板与第一主板和第二主板的连接图；
图24为图22的俯视图；
图25为本申请实施例提供的服务器的第七种内部结构示意图；
图26为本申请实施例提供的服务器的第八种内部结构示意图；
图27为本申请实施例提供的服务器的第九种内部结构示意图。
附图标记说明：
10、数据中心；
100、机房；110、冷却液存储装置；111、进液管路；1111、进液主管路；1112、进
液子管路；112、出液管路；1121、出液主管路；1122、出液子管路；120、空调；
200、机柜服务器；
210、柜体；211、柜体入口；212、柜体出口；213、腔体；
220、220a、服务器；221、221a、壳体；2211、2211a、容纳腔；2212、壳体入口；
2213、壳体出口；222、222a、主板；2221、第一主板；2222、第二主板；223、223a、处理器；224、224a、内存板；2241、第一内存板；2242、第二内存板；225、225a、底座；226a、风冷散热件；227、转接板；2271、第一转接板；2272、第二转接板；2273、连接件；228、散热器；229、冷板；2291、金属板；2292、通道；2292a、通道入口；2292b、通道出口；
H1、服务器高度；
H2、内存板高度；
H3、转接板相对高度；
J1、第一插接部；
J2、第二插接部；
J3、第三插接部；
J4、第四插接部；
X、第一方向；
Y、第二方向；
Z、第三方向。
具体实施方式
本申请的实施方式部分使用的术语仅用于对本申请的具体实施例进行解释，而非旨在限定本申请，下面将结合附图对本申请实施例的实施方式进行详细描述。
为便于理解，首先对本申请实施例所涉及的技术术语进行解释和说明。
处理器：处理器为CPU(Central Processing Unit，中央处理器)、GPU(Graphics Processing Unit，图形处理器)或TPU(Tensor Processing Unit，张量处理器)等各种处理器的总称，简称为XPU。
内存板：内存板用于暂时存放处理器中的运算数据和与硬盘等外部存储器交换的数据。处理器把需要运算的数据调到内存中进行运算，当运算完成后处理器再将结果传送出来。
冷板：一种密封的可容纳流动液体的散热器，通常通过导热界面材料与发热元件进行贴合，从而带走发热元件的热量。
浸没式液冷：将发热的电子元件浸没在冷媒(冷却液)中，依靠液体流动循环带走热量。采用浸没式液冷时，发热元件与冷媒全方位直接接触，因此，浸没式液冷的散热效率更高。
图1为本申请实施例提供的数据中心的结构示意图。参见图1所示，数据中心10是全球协作的特定设备网络，用来在因特网络基础设施上传递、加速、展示、计算、存储数据信息。本申请实施例提供的数据中心10可以包括机房100和设置在机房100中的至少一个机柜服务器200，可以理解的是，机房100可以为封闭的房间，也可为一侧或者多侧开放的房间；机房100可以为搭建的临时性房间，如帐篷房、板房等，也可为修建的永久性房间。
机房100内可以仅设置一台机柜服务器200，也可设置多台机柜服务器200。机房100内设置多台机柜服务器200时，各台机柜服务器200可以相同、部分相同或者均不相同。机柜服务器200可以是台式服务器、刀片式服务器、机架式服务器、高密服务器、XPU服务器等各种类型。
图2为本申请实施例提供的机柜服务器的示意图。参见图2所示，本申请实施例提供的机柜服务器200可以为机架式服务器，机柜服务器200包括柜体210和被安装于柜体210内的多个服务器220，柜体210作为服务器220的支撑部件。具体的，请继续参见图2所示，柜体210的宽度方向称为第一方向X，柜体210的长度方向称为第二方向Y，柜体210的高度方向称为第三方向Z，多个服务器220沿第三方向Z依次间隔设置在柜体内。
服务器220的高度方向与第三方向Z一致，服务器220的高度称为服务器高度H1，服务器高度H1通常为标准的IU或者2U(其中，U是表示电子设备外部尺寸的单位，是unit的缩略语，1U等于48.26cm)，服务器高度H1越小，相同高度的柜体210中所容纳的服务器220的数量越多，由此，机柜服务器200的算力密度越大。
图3为相关技术中服务器的内部结构示意图，其中，相关技术中服务器以220a表示，服务器220a中的各部件也均加后缀a以进行区分。参见图3所示，服务器220a包括壳体221a、主板222a、至少一个处理器223a和多个内存板224a。壳体221a具有容纳主板222a、处理器223a和内存板224a的容纳腔2211a，服务器高度H1即为壳体221a的高度。
主板222a与壳体221a的内底壁连接并且与壳体221a的内底壁平行设置，处理器223a可以通过底座225a焊接在主板上。
主板222a上处理器223a的周侧可以焊接有多个内存插槽，内存板224a插接内存插槽上以与主板222a电连接，内存板224a的延伸方向与第三方向Z一致。内存板224a沿第三方向Z的尺寸称为内存板高度H2，内存板高度H2决定了服务器高度H1的大小，由于内存板高度H2通常较大，因此单个服务器220a的服务器高度H1通常较大，使得相同高度的柜体210中容纳的服务器220a的数量较少，机柜服务器200的算力密度较小。
此外，数据中心10可以为风冷散热的数据中心，数据中心10中设置有空调，通过空调的冷风带走机柜服务器200所产生的热量。服务器220a中处理器223a的散热量较大，处理器223a上还设置有风冷散热件226a，为了增大处理器223a上的冷风流量，风冷散热件226a通常为图3中所示的鳍片结构，鳍片结构沿着第三方向Z的尺寸较大，也会造成服务器高度H1增大。
图4为本申请实施例提供的服务器的第一种内部结构示意图。参见图4所示，本申请实施例中，服务器220包括至少一个主板222、至少一个转接板227、至少一个处理器223和至少一个内存板224；转接板227和处理器223均设置在主板222上，且转接板227相对于主板222倾斜或竖直设置，内存板224与转接板227电连接，且内存板224自转接板227朝向转接板227外侧延伸。在本实施例中，转接板227的外侧可以包括转接板227背离处理器223的一侧，和/或，转接板227朝向处理器223的一侧。
主板222的延伸方向与图4中的第一方向X或者第二方向Y一致，处理器223设置在主板222上并且与主板222电连接，主板222上还电连接有电阻、电容和传感器等其他电子器件，为了便于处理器223与主板222上的其他电子器件电连接，处理器223通常设置在主板222的中间区域。处理器223为服务器220进行运算的核心工作部件，处理器223和主板222上的其他电子器件配合工作。处理器223工作时产生的热量较大，因此在处理器223上方覆盖散热器228，以将处理器223工作时的热量传递出去。
转接板227设置在主板222上并且与主板222电连接，内存板224与转接板227电连接，由此，内存板224通过转接板227与主板222电连接。
图5为本申请实施例提供的服务器中转接板与主板的位置示意图一；图6为本申请实施例提供的服务器中转接板与主板的位置示意图二。其中，为了便于标注夹角α，移除了部分转接板，参见图5和图6所示，转接板227与主板222之间具有夹角α，图5中所示的转接板227与主板222之间的夹角α为45°，图6中所示的转接板227与主板222之间的夹角α为90°，夹角α可以在45°至90°之间变化。
转接板227的沿第三方向的尺寸称为转接板相对高度H3，夹角α越小，转接板相对高度H3越小，服务器高度H1越小，但是，当夹角α小于45°时，不便于转接板227与主板222的插接，并且与转接板227连接的多个内存板224也会沿图5中的第一方向X(或者第二方向Y)占据主板222上方较多的空间，因此，夹角α可以在45°与90°之间变化。
主板222的厚度(主板沿第三方向Z的尺寸)一般为确定值，由此，服务器高度H1由转接板相对高度H3确定。内存板224朝向转接板227的侧方延伸，也就是内存板高度H2的延伸方向与转接板相对高度H3的延伸方向之间也具有夹角，由此，主板222上方的空间可以布置数量更多的内存板224，提高了空间利用率。
请继续参见图4和图6所示，当转接板227与主板222的夹角为90°时，转接板相对高度H3的延伸方向与第三方向Z一致，此时转接板相对高度H3沿第三方向Z的尺寸最大，而转接板相对高度H3在最大尺寸时仍远小于内存板高度H2。由此，通过设置转接板227，可以降低服务器高度H1，使得机柜服务器200中可以容纳更多的服务器220，由此可以提高机柜服务器200的算力密度。
请继续参见图4所示，转接板227竖直设置于主板222上，内存板224垂直设置于转接板227上，且主板222与内存板224平行。
图7为本申请实施例提供的服务器中转接板与主板的连接图。参见图7所示主板222上焊接有第一插接部J1，第一插接部J1可以为排座。转接板227朝向主板222的一端设置有第二插接部J2，第二插接部J2可以为排针，将第二插接部J2插接在第一插接部J1中，以将转接板227与主板222电连接。可以理解的，第一插接部J1也可以为排针，第二插接部J2为排座。转接板227可以竖直设置于主板222上，以便于第一插接部J1与第二插接部J2插接。
图8为本申请实施例提供的服务器中内存板与转接板的连接图。参见图8所示，转接板227上焊接有多个第三插接部J3，第三插接部J3可以为排座，内存板224朝向转接板227的一端设置有第四插接部J4，第四插接部J4可以为排针，将第四插接部J4插接在第三插接部J3中，以将内存板224与转接板227电连接。可以理解的，第三插接部J3也可以为排针，第四插接部J4为排座。内存板224竖直设置于转接板227上，以便于第三插接部J3与第四插接部J4插接。此外，内存板224还需与主板222保持平行，以便于充分利用主板222上方的空间。
为了增加服务器220存储数据的能力，内存板224的数量为至少两个，各内存板224沿转接板227的高度方向依次间隔设置。
根据服务器220对存储数据能力要求的不同，内存板224的数量可以为两个或者两个以上。各内存板224沿转接板相对高度H3的延伸方向依次间隔设置，并且各内存板224相互平行，以便于内存板224充分利用了图4中主板222上方的空间。
图9为本申请实施例提供的服务器的第二种内部结构示意图，参见图4和图9所示，处理器223位于主板222上的中部位置。根据主板222的布局不同，转接板227在主板222上可以由不同的布局方式。具体的，在图4所示的实施例中，转接板227位于主板222上靠近处理器223的位置，内存板224位于转接板227背离处理器223的一侧；在图9所示的实施例中，转接板227沿图9中的第一方向X(或者第二方向Y)位于主板上的边缘位置，内存板224位于转接板朝向处理器223的一侧。上述两种设置方式中，内存板224与 处理器223占据主板222上方不同的空间，由此，内存板224和处理器223互不干涉。
图10为本申请实施例提供的服务器中处理器与主板的连接图。参见图10所示，服务器220还包括底座225。底座225设置在处理器223与主板222之间，底座225用于支撑处理器223。底座225朝向处理器223的一面与处理器223电连接，底座225朝向主板222的一面与主板电连接，由此处理器223通过底座225与主板电连接。具体的，处理器223可以通过固晶的方式与底座225电连接，底座225可以通过焊接的方式与主板222电连接。
为了连接更多的内存板224，转接板227的数量为至少两个，各转接板227分别位于处理器223的不同侧。
转接板227可以为两个或者两个以上，例如三个或者四个。处理器223通常为矩形，转接板227可以设置在处理器223的四个周侧。转接板227和处理器223的排布方式不同，以下对于转接板227和处理器223可能的排布方式进行说明。
图11为本申请实施例提供的服务器中转接板与处理器的第一种排布图。参见图11所示，各转接板227分别位于处理器223相对的两侧，且处理器223相对的两侧的各转接板227错开设置。
请继续参见图11所示，服务器220中设置有两个转接板227和一个处理器223，转接板227可以沿第一方向X(或者第二方向Y)在处理器223的两侧错开设置，由此可以避让主板222上的其他电子器件。
可以理解的是，服务器220中可以设置有三个转接板227，各转接板227分别设置在处理器223三个不同的侧边，或者，其中两个转接板227设置在同一侧边，具体根据主板222上的布局设置。服务器220中也可以设置四个转接板227，各转接板227分别设置在处理器223四个不同的侧边，或者，其中两个转接板227设置在同一侧边，具体根据主板222上的布局设置。
图12为本申请实施例提供的服务器中转接板与处理器的第二种排布图。参见图12所示，转接板227的数量为偶数个，且各转接板227相对于处理器223对称。
请继续参见图12所示，服务器220中设置有两个转接板227和一个处理器223，转接板227可以沿第一方向X(或者第二方向Y)在处理器223的两侧对称设置，使得主板222上用于电连接处理器223和转接板227的布线方便。
服务器220中也可以设置四个转接板227，各转接板227分别设置在处理器223四个不同的侧边，相对的两个侧边上的转接板227相对于处理器223对称。
图13为本申请实施例提供的服务器中转接板与处理器的第三种排布图。参见图13所示，为了提高服务器220的计算能力，服务器220可以包括两个或者两个以上的处理器223。图13所示的服务器220中包括两个处理器223，两个处理器223均与主板222电连接，两个处理器223之间可以通过主板222上的布线相互电连接，以便于处理器223之间的数据传输或者备份。
每个处理器223具有对应的转接板227，转接板227和处理器223的排布方式与图11或者图12中所示的排布方式相同，在此不再一一赘述。
服务器220运行时，处理器223、内存板224以及服务器220中的其他电子器件工作时会散发大量的热。这些热量的累计导致服务器220温度升高，高温会降低处理器223、内存板224以及服务器220中的其他电子器件的各项性能，使得服务器220不能正常运行。 因此，需要有效的散热措施来给服务器220散热，以降低服务器220中各电子器件的工作温度。下面，对服务器220可能的散热方式进行说明。
图14为本申请实施例提供的服务器的第三种内部结构示意图。参见图14所示，在上述实施例的基础上，本实施例中的服务器220还包括多个冷板229，内存板224和散热器228中的至少一者上覆盖冷板229冷板229，冷板229用于给对应的内存板224和处理器223散热。
冷板229是由导热性好的金属制成的散热件，例如，冷板229可以为铝板、铜板或者铜铝合金板。为了提高冷板229的冷却能力，冷板229内还具有供液体流动的通道。通过冷板229的通道内液体的流动带走处理器223和内存板224散发的热量。冷板229直接覆盖在处理器223的散热器228上或者内存板224上，冷板229中具有流动的冷却液，因此冷板229的冷却效率高于风冷散热件226a，使得冷板229沿第三方向Z占用的空间较小，相对于相关技术中具有鳍片结构的风冷散热件226a沿第三方向Z的尺寸较大，使得服务器高度H1较大而言，采用冷板229冷却不会增加服务器高度H1。
下面对采用冷板进行冷却的具体过程进行说明。
图15为图14中冷板的结构示意图。参见图15所示，冷板229包括金属板2291和通道2292，通道2292具有供冷却液进出的通道入口2292a和通道出口2292b。
图16为图14中服务器的冷却状态图。参见图1和图16所示，机房100内设置有冷却液存储装置110。冷却液存储装置110上有进液管路111和出液管路112，出液管路112包括出液主管路1121和多个出液子管路1122，出液主管路1121分别与多个出液子管路1122连通，各出液子管路1122分别与不同冷板229中的通道入口2292a连通。进液管路111包括进液主管路1111和进液子管路1112，进液主管路1111分别与多个进液子管路1112连通，各进液子管路1112分别与不同冷板229中的通道出口2292b连通。
图16中以箭头表示冷却液的流动方向，参见图16所示，冷却液从冷却液存储装置110依次流经出液主管路1121、出液子管路1122、冷板229中通道入口2292a、冷板229中的通道2292、冷板229中通道出口2292b、进液子管路1112、进液主管路1111，再回到冷却液存储装置110，通过通道2292内液体的流动带走内存板224和处理器223的热量。
每个服务器220有各自的冷却回路，由此，当其中一个服务器220需要进行维护时，只需关闭与该服务器220连接的出液子管路1122和进液子管路1112即可，不影响其他服务器220的正常运行。
每个服务器220中，位于处理器223上的冷板229的通道2292和位于内存板224上的冷板229的通道2292可以并联，并联的连接方式使得处理器223和内存板224的冷却效率较高。
每个服务器220中，位于处理器223上的冷板229的通道2292和位于内存板224上的冷板229的通道2292可以串联，串联的连接方式可以节省冷却液的用量。
内存板224的散热量小于处理器223的散热量，为了进一步降低冷却成本，并简化服务器220的结构，可以仅在处理器223上设置冷板229，而不在内存板224上设置冷板229，内存板224通过风冷的形式进行散热。
具体的，图17为本申请实施例提供的数据中心的另一结构示意图。参见图17所示，机房100还设置有多个空调120，柜体210形成的腔体与机房100内的空间连通，通过空 调的冷风降低机房100的温度，从而带走内存板228产生的热量。
需要说明的是，采用冷板229进行冷却时，由于冷却液不直接与服务器220中的器件接触，因此，对冷板中流动的冷却液的绝缘性和防腐蚀性不需要太高，以降低服务器220的制冷成本。
服务器220还可以采用浸没式液冷的方式进行冷却。图18为本申请实施例提供的服务器的第四种内部结构示意图。参见图18所示，冷却液以点状填充表示，各服务器220浸没在冷却液中，随着冷却液的流动带走处理器223和内存板224散发的热量。冷却液具有绝缘、防腐蚀、不可燃、无毒等特性，由此，不会损伤服务器220中的各种器件。
图19为图18中服务器的冷却状态图。参见图1和图19所示，机房100内设置有冷却液存储装置110，冷却液存储装置110上有进液管路111和出液管路112。柜体210上设置有柜体入口211和柜体出口212，柜体入口211与出液管路112连通，柜体出口212与进液管路111连通，柜体210形成的腔体213中具有冷却液，各服务器220浸没在冷却液中。图19中以箭头表示冷却液的流动方向，参见图19所示，冷却液从冷却液存储装置110依次流经出液管路112、柜体入口211、腔体213、柜体出口212，并从进液管路111流入冷却液存储装置110中。
上述为对机柜服务器200进行整体浸没式冷却，在一些实施例中，还可以每个服务器220进行单独浸没式冷却。图20为本申请实施例提供的服务器的第五种内部结构示意图。参见图20所示，服务器220还包括壳体221，壳体221具有容纳腔2211，主板222、处理器223、转接板227和内存板224均位于容纳腔2211内，且主板222与壳体221的内壁连接。
主板222可以通过紧固件与壳体221的侧壁连接，从而将主板222安装在容纳腔内，处理器223和转接板227均与主板222连接，内存板224与转接板227连接，处理器223、转接板227和内存板224均位于容纳腔2211内。
壳体221的侧壁上具有供冷却液进出的壳体入口2212和壳体出口2213。通过壳体221内冷却液的流动带走处理器223和内存板224工作时散发的热量。
具体的，图21为图20中服务器的冷却状态图。参见图1和图21所示，机房100内设置有冷却液存储装置110，冷却液存储装置110上有进液管路111和出液管路112，出液管路112包括出液主管路1121和多个出液子管路1122，出液主管路1121分别与多个出液子管路1122连通，各出液子管路1122分别与不同的壳体入口2212连通。进液管路111包括进液主管路1111和进液子管路1112，进液主管路1111分别与多个进液子管路1112连通，各进液子管路1112分别与不同的壳体出口2213连通。
图21中以箭头表示冷却液的流动方向，参见图21所示，冷却液从冷却液存储装置110依次流经出液主管路1121、出液子管路1122、壳体入口2212、容纳腔2211、壳体出口2213、进液子管路1112、进液主管路1111，再回到冷却液存储装置110，通过冷却液的流动带走服务器220中各器件产生的热量。也就是说，每个服务器220有各自的冷却回路，由此，当其中一个服务器220需要进行维护时，只需关闭与该服务器220连接的出液子管路1122和进液子管路1112即可，不影响其他服务器220的正常运行。
为了增加服务器220运算能力，还可以在服务器220中设置两个主板222。图22为本申请实施例提供的服务器的第六种内部结构示意图。参见图22所示，主板222的数量为 两个，转接板227连接在两个主板之间；处理器223的数量为至少两个，一主板222朝向另一主板222的一面上具有至少一个处理器223。
具体的，服务器220可以设置两个主板222，两个主板222沿图22中的第三方向Z相对设置，其中，一主板222称为第一主板2221，另一个主板222称为第二主板2222，转接板227设置在第一主板2221与第二主板2222之间，转接板227与第一主板2221和第二主板2222均电连接。
具体的，图23为图22中转接板与第一主板和第二主板的连接图。参见图23所示，转接板227的两端均具有第二插接部J2，第一主板2221和第二主板2222上均具有第一插接部J1，转接板227一端上的第二插接部J2插接在第一主板2221上的第一插接部J1中，转接板227另一端的第二插接部J2插接在第二主板2222上的第一插接部J1中，以电连接第一主板2221和第二主板2222。
第一主板2221和第二主板2222上均设置有至少一个处理器223，第一主板2221上的处理器223设置在第一主板2221朝向第二主板2222的一面，第二主板2222上的处理器223均设置在第二主板2222朝向第一主板2221的一面，由此，处理器223可以占用第一主板2221和第二主板2222之间的空间，不会额外增加服务器高度H1。
在图13所示的服务器220的结构中，位于一个主板222上的两个处理器223之间的互连是通过主板222上的走线实现的，主板222上需要布设用于处理器223互连的线路层。在本实施例中，将需要互连的两个处理器223分别设置在第一主板2221和第二主板2222上，转接板227内布设有用于电连接第一主板2221和第二主板2222走线，以电连接第一主板2221上的处理器223与第二主板2222上的处理器223。第一主板2221上的处理器223与第二主板2222上的处理器223通过转接板227内的走线即可实现电连接，由此，通过设置转接板227可以减少主板222的层数，从而降低主板222的复杂度。
内存板224与转接板227电连接，内存板224与转接板227电连接的方式与图8中所示的方式相同，此处不再一一赘述。需要注意的是，在本实施例中，通过转接板227与第一主板2221电连接的内存板224称为第一内存板2241，通过转接板227与第二主板2222电连接的内存板224称为第二内存板2242。可以理解的是，第一内存板2241靠近第一主板2221设置，第二内存板2242靠近第二主板2222设置，以便于转接板227上的走线。
图24为图22的俯视图，其中，为了清楚起见，移除了第二主板2222，设置在第二主板2222上的处理器223和与第二主板2222电连接的第二内存板2242以虚线表示。参见图24所示，设置在第一主板2221上的处理器223和设置在第二主板2222上的处理器223可以对准，也可以不对准，与第一主板2221电连接的第一内存板2241和与第二主板2222电连接的第二内存板2242可以对准也可以不对准，具体以第一主板2221和第二主板2222的设计需求来布局。
图25为本申请实施例提供的服务器的第七种内部结构示意图。参见图25所示，在图22所示的实施例的基础上，本实施例中的服务器220还包括壳体221，壳体221具有容纳主板222、内存板224、处理器223转接板227的容纳腔2211。其中一个主板222与壳体221的内底壁连接，称为第一主板2221，另一个主板222与壳体221的内顶壁连接，称为第二主板2222。图25所示的服务器220的其他结构均与图21图22所示的服务器220的结构相同，此处不再一一赘述。
在装配第一主板2221和第二主板2222时，由于存在装配公差，第一主板2221上的第一插接部J1和第二主板2222上的第一插接部J1会出现未对准的情况，转接板227一端上的第二插接部J2与第一主板2221上的第一插接部J1插接，转接板227另一端上的第二插接部J2与第二主板2222上的第一插接部J1插接，使得转接板227会出现形变。
图26为本申请实施例提供的服务器的第八种内部结构示意图，可以通过图26中所示的连接件2273解决上述问题。具体的，参见图26所示，在图21图22所示的实施例的基础上，服务器220还包括至少一个连接件2273，主板222的数量为两个，各主板222上连接至少一个转接板227，各转接板227位于两个主板之间；两个主板222上的转接板227的数量相同，且两个主板222上的转接板227相对设置，相对的两个转接板227通过连接件2273对应电连接；处理器223的数量为至少两个，一主板222朝向另一主板222的一面上具有至少一个处理器223。
与第一主板2221电连接的转接板227称为第一转接板2271，与第二主板2222电连接的转接板227称为第二转接板2272。
连接件2273用于电连接第一转接板2271和第二转接板2272。连接件2273的一端与第一转接板2271电连接，连接件2273的另一端与第二转接板2272电连接。通过连接件2273的柔性变形可以补偿第一转接板2271和第二转接板2272之间的位置偏差，从而可以解决第一主板2221和第二主板2222的装配公差导致的转接板227变形的问题。
处理器223的设置方式与图21图22所示的实施例的设置方式相同，此处不再一一赘述。
在本实施例中，连接件2273为柔性电路板、排线或者线缆等。
连接件2273可以为柔性电路板，通过柔性电路板电连接第一转接板2271和第二转接板2272。具体的，柔性电路板的两端具有公头，第一转接板2271和第二转接板2272上均具有母头，将公头插入到母头中，实现柔性电路板与第一转接板2271和第二转接板2272电连接。在另一种实现方式中，柔性电路板两端具有引脚，第一转接板2271和第二转接板2272上具有对应的焊盘，将引脚分别焊接到第一转接板2271和第二转接板2272的焊盘上，实现柔性电路板与第一转接板2271和第二转接板2272电连接。
连接件2273还可以为排线或者线缆，排线或者线缆与第一转接板2271和第二转接板2272电连接的方式与上述方式相同，此处不再一一赘述。
图27为本申请实施例提供的服务器的第九种内部结构示意图。参见图27所示，在图26所示的实施例的基础上，本实施例中的服务器220还包括壳体221，壳体221具有主板222、内存板224、处理器223转接板227的容纳腔2211。其中一个主板222与壳体221的内底壁连接，称为第一主板2221，另一个主板222与壳体221的内顶壁连接，称为第二主板2222。图25所示的服务器220的其他结构均与图21图22所示的服务器220的结构相同，此处不再一一赘述。
可以理解的是，在图21图22、图25、图26和图27所示的实施例中，服务器220可以采用冷板冷却或者浸没式冷却，冷板冷却和浸没式冷却的具体方式在上述实施例中已经进行了详细说明，此处不再一一赘述。
在本申请实施例的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应作广义理解，例如，可以是固定连接，也可以是通过中间媒介间接 相连，可以是两个元件内部的连通或者两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请实施例中的具体含义。
本申请实施例的说明书和权利要求书及上述附图中的术语“第一”、“第二”、“第三”、“第四”等(如果存在)是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。
最后应说明的是：以上各实施例仅用以说明本申请实施例的技术方案，而非对其限制；尽管参照前述各实施例对本申请实施例进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请实施例各实施例技术方案的范围。

Claims (10)

  1. 一种服务器，其特征在于，包括至少一个主板、至少一个转接板、至少一个处理器和至少一个内存板；
    所述转接板和所述处理器均设置在所述主板上，且所述转接板相对于所述主板竖直或倾斜设置，所述内存板与所述转接板电连接，所述转接板与所述主板电连接，且所述内存板自所述转接板朝向所述转接板外侧延伸。
  2. 根据权利要求1所述的服务器，其特征在于，所述内存板垂直设置于所述转接板上。
  3. 根据权利要求2所述的服务器，其特征在于，至少两个所述内存板沿所述转接板的高度方向依次间隔设置。
  4. 根据权利要求2所述的服务器，其特征在于，所述处理器位于所述主板上的中部位置，
    所述转接板位于所述主板上靠近所述处理器的位置，所述内存板位于所述转接板背离所述处理器的一侧；
    或者，所述转接板位于所述主板上的边缘位置，所述内存板位于所述转接板朝向所述处理器的一侧。
  5. 根据权利要求1所述的服务器，其特征在于，所述转接板的数量为至少两个，各所述转接板分别位于所述处理器的不同侧。
  6. 根据权利要求1所述的服务器，其特征在于，至少两个所述主板平行设置，且至少两个所述主板的相对面均设有至少一个所述处理器。
  7. 根据权利要求1至6任一项所述的服务器，其特征在于，所述至少一个主板包括第一主板和第二主板，所述转接板自所述第一主板延伸至所述第二主板。
  8. 根据权利要求1至6任一项所述的服务器，其特征在于，所述服务器还包括至少一个连接件，所述至少一个主板包括第一主板和第二主板，所述至少一个转接板包括第一转接板和第二转接板，所述第一转接板的一端与所述第一主板连接，所述第二转接板的一端与所述第二主板连接，所述第一转接板的另一端与所述第二转接板的另一端通过所述连接件连接连接件。
  9. 根据权利要求8所述的服务器，其特征在于，所述连接件为柔性电路板、排线或者线缆中的一者。
  10. 一种机柜服务器，其特征在于，包括柜体和被安装于所述柜体内的多个权利要求1-9任一项所述的服务器。
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