WO2024077468A1 - 一种耳机 - Google Patents

一种耳机 Download PDF

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Publication number
WO2024077468A1
WO2024077468A1 PCT/CN2022/124541 CN2022124541W WO2024077468A1 WO 2024077468 A1 WO2024077468 A1 WO 2024077468A1 CN 2022124541 W CN2022124541 W CN 2022124541W WO 2024077468 A1 WO2024077468 A1 WO 2024077468A1
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WO
WIPO (PCT)
Prior art keywords
bending
earphone
contact
sensor
headset
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2022/124541
Other languages
English (en)
French (fr)
Inventor
邓文俊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Shokz Co Ltd
Original Assignee
Shenzhen Shokz Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Shokz Co Ltd filed Critical Shenzhen Shokz Co Ltd
Priority to EP22961663.6A priority Critical patent/EP4513889A4/en
Priority to CN202280093411.2A priority patent/CN118947131A/zh
Priority to PCT/CN2022/124541 priority patent/WO2024077468A1/zh
Publication of WO2024077468A1 publication Critical patent/WO2024077468A1/zh
Priority to US18/963,742 priority patent/US20250097622A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R5/00—Stereophonic arrangements
    • H04R5/033—Headphones for stereophonic communication
    • H04R5/0335—Earpiece support, e.g. headbands or neckrests
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1041—Mechanical or electronic switches, or control elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/16—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
    • G01B7/18—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge using change in resistance
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1008—Earpieces of the supra-aural or circum-aural type
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/105—Earpiece supports, e.g. ear hooks
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1058—Manufacture or assembly
    • H04R1/1066—Constructional aspects of the interconnection between earpiece and earpiece support
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2460/00—Details of hearing devices, i.e. of ear- or headphones covered by H04R1/10 or H04R5/033 but not provided for in any of their subgroups, or of hearing aids covered by H04R25/00 but not provided for in any of its subgroups
    • H04R2460/03—Aspects of the reduction of energy consumption in hearing devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2460/00—Details of hearing devices, i.e. of ear- or headphones covered by H04R1/10 or H04R5/033 but not provided for in any of their subgroups, or of hearing aids covered by H04R25/00 but not provided for in any of its subgroups
    • H04R2460/13—Hearing devices using bone conduction transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00—Circuits for transducers
    • H04R3/04—Circuits for transducers for correcting frequency response

Definitions

  • the present invention relates to the field of acoustic technology, and in particular to a headset.
  • sensors are widely used in wearing detection of headphones and other products.
  • the system can be automatically awakened.
  • the system can automatically enter standby mode, thereby reducing power consumption and extending usage time. At the same time, it saves users' operating steps and greatly improves the user experience.
  • the existing sensors used for wearing detection mainly include infrared sensors and capacitive contact sensors.
  • the former has a complex structure and system, while the latter has low stability.
  • both have the problem of insufficient recognition accuracy.
  • traditional wearing detection sensors cannot achieve ideal detection results. Therefore, it is necessary to develop a new wearing detection solution to accurately identify the wearing status of headphones.
  • An embodiment of the present specification may provide an earphone, comprising: two speaker assemblies, a connector and a processing circuit.
  • the connector is used to connect the two speaker assemblies.
  • the connector provides a clamping force to fix the two speaker assemblies on the user's head through bending deformation.
  • the connector includes a shell having a receiving cavity.
  • a bending sensor is provided in the receiving cavity, and the bending sensor is used to generate a bending signal based on the bending state of the connector.
  • the processing circuit is used to determine the placement state of the earphone based on the bending signal.
  • the placement state includes one of a normal wearing state, an abnormal wearing state or a free placement state.
  • the connector includes two ear hook components and a rear hook component, the two speaker components are connected to the rear hook component through the two ear hook components, respectively, and the bending sensor is located in the accommodating cavity formed by the rear hook component.
  • a sensitive direction of the bending sensor is consistent with a bending direction of the rear suspension component.
  • the bending sensor is disposed at a position where a symmetry plane of the rear suspension component intersects the rear suspension component.
  • the housing is made of a hard material, and the bending sensor is adhered to the inner wall of the accommodating cavity.
  • the rear hanging component further includes a skeleton structure
  • the bending sensor is arranged in close contact with the skeleton structure, and the stiffness of the skeleton structure in the bending direction of the rear hanging component is greater than the stiffness of the bending sensor in the bending direction of the rear hanging component.
  • the processing circuit can determine that the earphone is in an abnormal wearing state. In some embodiments, when the bending signal of the bending sensor indicates that the equivalent curvature radius of the rear hanging component is greater than the equivalent curvature radius of the earphone when it is freely placed and is less than a preset threshold, the processing circuit can determine that the earphone is in an abnormal wearing state. In some embodiments, when the bending signal of the bending sensor indicates that the equivalent curvature radius of the rear hanging component is greater than the equivalent curvature radius of the earphone when it is freely placed and is greater than the preset threshold, the processing circuit can determine that the earphone is in a normal wearing state.
  • At least one of the two ear hook components includes an earphone compartment
  • the earphone further includes: a contact sensor, disposed in the earphone compartment, for identifying whether the earphone compartment is in contact with the user.
  • the processing circuit is further used to determine the placement state of the earphone based on the bending signal of the bending sensor and the contact signal of the contact sensor.
  • the headset includes one or more electronic components, wherein the processing circuit adjusts the working state of the one or more electronic components according to the placement state of the headset, including: when the headset is in a normal wearing state, controlling the one or more electronic components to be in a wake-up state; when the headset is in an abnormal wearing state or the free placement state, controlling the one or more electronic components to be in a low power consumption working state.
  • the processing circuit determines that the earphone is in a normal wearing state, wherein the first bending signal indicates that the equivalent curvature radius of the rear hanging component is greater than the equivalent curvature radius when the earphone is freely placed and is greater than or equal to a preset threshold, and the first contact signal indicates that the earphone compartment is not in contact with the user.
  • the processing circuit determines that the earphone is in an abnormal wearing state, wherein the first bending signal indicates that the equivalent curvature radius of the connector is greater than the equivalent curvature radius when the earphone is freely placed and is greater than or equal to a preset threshold, and the second contact signal indicates that the earphone compartment is in contact with the user.
  • the headset further includes: a contact sensor, which is disposed in a housing of at least one of the two speaker assemblies and is used to identify whether the speaker assembly is in contact with the user.
  • the processing circuit determines that the earphone is in a normal wearing state, wherein the first bending signal indicates that the equivalent curvature radius of the connecting member is greater than the equivalent curvature radius when the earphone is freely placed and is greater than or equal to a preset threshold, and the second contact signal indicates that the speaker assembly is in contact with the user.
  • the processing circuit determines that the earphone is in an abnormal wearing state, wherein the first bending signal indicates that the equivalent curvature radius of the connecting member is greater than the equivalent curvature radius when the earphone is freely placed and is greater than or equal to a preset threshold, and the first contact signal indicates that the speaker assembly is not in contact with the user.
  • the contact sensor includes at least one of a capacitive proximity sensor, a thin film pressure sensor, and an infrared sensor.
  • FIG1 is a schematic structural diagram of an exemplary headset according to some embodiments of this specification.
  • FIG2 is a schematic diagram of a circuit module of an exemplary headset according to some embodiments of this specification.
  • FIG3 is a schematic structural diagram of an exemplary headset according to other embodiments of this specification.
  • FIG4 is a schematic structural diagram of a cross-section of a connector of an exemplary headset according to some embodiments of this specification.
  • FIG5A is a schematic structural diagram of a cross-section of a connector of an exemplary earphone according to other embodiments of the present specification.
  • FIG5B is a schematic structural diagram of a cross-section of a connector of an exemplary headset according to other embodiments of the present specification.
  • FIG6A is a schematic diagram of an exemplary earphone in a free-standing state according to some embodiments of the present specification
  • FIG6B is a schematic diagram of an exemplary headset in a normal wearing state according to some embodiments of the present specification.
  • FIG. 7 is a schematic diagram of a circuit module of an exemplary headset according to other embodiments of this specification.
  • FIG8A is a schematic diagram of an exemplary earphone in a free-standing state according to some embodiments of the present specification
  • FIG8B is a schematic diagram of an exemplary headset in a normal wearing state according to some embodiments of the present specification.
  • FIG8C is a schematic diagram of an exemplary headset in an abnormal wearing state according to some embodiments of the present specification.
  • FIG9A is a schematic diagram of an exemplary earphone in a free-standing state according to some embodiments of the present specification.
  • FIG9B is a schematic diagram of an exemplary headset in a normal wearing state according to some embodiments of the present specification.
  • FIG. 9C is a schematic diagram of an exemplary headset in an abnormal wearing state according to some embodiments of the present specification.
  • first and second are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as “first” and “second” may explicitly or implicitly include at least one of the features. In the description of this specification, the meaning of “plurality” is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
  • the terms “installed”, “connected”, “connected”, “fixed” and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined.
  • installed can be a fixed connection, a detachable connection, or an integral connection
  • it can be a mechanical connection or an electrical connection
  • it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined.
  • the specific meanings of the above terms in this specification can be understood according to specific circumstances.
  • the embodiments of this specification provide a headset (also referred to as an acoustic output device), which analyzes the current placement state of the headset (e.g., normal wearing state, abnormal wearing state, or free placement state) by detecting the bending state of the connector between the speaker components, thereby further adjusting the working state of one or more electronic components of the headset (e.g., Bluetooth module, battery, etc.) according to the current placement state of the headset.
  • multiple sensors e.g., the same or different types of sensors
  • can be coordinated to detect the current placement state of the acoustic output device e.g., headset, smart glasses, etc.
  • the headset provided in the embodiments of this specification is described in detail below in conjunction with the accompanying drawings.
  • FIG. 1 is a schematic diagram of the structure of the earphone shown in some embodiments of this specification.
  • the earphone 100 may be a bone conduction earphone, an air conduction earphone, or a bone-air conduction combined earphone.
  • the earphone 100 may be an open earphone.
  • a bone conduction earphone will be described as an example, which does not limit the scope of the present application.
  • the earphone 100 may include two speaker assemblies 110, a connector 120, and a bend sensor 210.
  • the two speaker assemblies 110 can be used to convert an audio signal (i.e., an electrical signal) into a mechanical vibration signal (i.e., an acoustic signal), thereby outputting sound to a user.
  • the speaker assembly 110 can include various types, such as an electromagnetic type (e.g., a moving coil type, a moving iron type, etc.), a piezoelectric type, an inverse piezoelectric type, an electrostatic type, etc., which is not limited in the present application.
  • the connector 120 can be used to connect the two speaker assemblies 110.
  • the connector 120 can be used as a fixing device to keep the earphone 100 fixed relative to the user.
  • the connector 120 can have a certain deformation ability and deformation recovery ability, and it can provide a clamping force to fix the two speaker assemblies 110 to the user's head or neck through bending deformation.
  • the connector 120 may include a head-mounted connector or a back-hanging connector. Exemplarily, when the connector 120 is a head-mounted connector, the user can place the connector 120 on the top of the head, so that the earphone 100 is fixed relative to the user.
  • the connector 120 When the connector 120 is a back-hanging connector, the user can place the connector 120 behind the user's head or behind the neck, so that the earphone 100 is fixed relative to the user. For example, when the user wears the earphone 100 normally, the connector 120 can be fixed behind the user's head, and when the user is not using the earphone 100
  • connection between the connector 120 and the two speaker assemblies 110 can include injection molding, welding, riveting, bolts, bonding, clamping, etc. or any combination thereof.
  • the connector 120 may include a housing having a housing cavity, and the housing cavity may be used to accommodate one or more components of the earphone 100, for example, a communication cable for transmitting signals to the two speaker assemblies 110, a bending sensor 210, etc.
  • the housing cavity may be used to accommodate one or more components of the earphone 100, for example, a communication cable for transmitting signals to the two speaker assemblies 110, a bending sensor 210, etc.
  • the housing cavity please refer to FIG. 4 and FIG. 5A-5B and related descriptions in this specification.
  • the bend sensor 210 can be used to identify the bending state of the connector 120. It should be noted that the bending state of the connector 120 can cause a change in a specific parameter in the bend sensor 210. Different types of bend sensors 210 can be based on different working principles, and their corresponding specific parameters may be different. Just as an example, in some embodiments, the bend sensor 210 can have a cavity, and the deformation of the connector 120 can cause the volume of the cavity and the air pressure therein to change, thereby generating a corresponding signal to characterize the bending state. In some embodiments, the bend sensor 210 can have a capacitor structure, and the deformation of the connector 120 can cause the capacitance of the capacitor structure to change.
  • the bend sensor 210 can have a resistor whose resistance changes with the change of the bending state, so that the bending state of the bend sensor 210 can be determined based on the change of its resistance.
  • the bend sensor 210 can be in the shape of a slender strip or a film.
  • the length of the bend sensor 210 can be 0.1 cm-2 cm, for example, it can be 0.5 cm, 0.8 cm, 1 cm, etc.
  • the bending sensor 210 may include an FPC (Flexible Printed Circuit) flexible circuit, and its surface may include a printed sensitive material.
  • the sensitive material may include a material or structure that can respond to changes in the bending state.
  • the sensitive material may include a conductive carbon paste.
  • a microstructure such as a micro gap, a micro hole, etc., may be provided on the surface of the conductive carbon paste.
  • the bending sensor 210 may be disposed in the middle of the receiving cavity of the connecting member 120.
  • the bending sensor 210 is at the same or substantially the same distance from the two speaker assemblies 110), for example, position A shown in Figure 1.
  • the bending sensor 210 may also be disposed close to one of the two speaker assemblies 110, for example, position B or position C shown in Figure 1.
  • FIG. 2 is a schematic diagram of a circuit module of an earphone shown in some embodiments of the present specification.
  • the earphone 100 may further include a processing circuit 220 and a control circuit 230.
  • the processing circuit 220 may be electrically connected to the bending sensor 210 and the control circuit 230.
  • the processing circuit 220 may determine the bending state of the connecting member 120 based on the bending signal detected by the bending sensor 210.
  • the processing circuit 220 may determine the equivalent radius of curvature of the connecting member 120 based on the bending signal detected by the bending sensor 210, thereby determining the bending state (or degree of bending) of the connecting member 120.
  • a mapping relationship between the bending signal and the equivalent radius of curvature of the connecting member 120 may be pre-configured based on experimental data.
  • the processing circuit 220 may determine the equivalent radius of curvature of the connecting member 120 based on the bending signal detected by the bending sensor 210 and the mapping relationship, thereby determining the bending state (or degree of bending) of the connecting member 120.
  • the earphone 100 is a bone conduction earphone as shown in FIG. 3
  • the measurement of the equivalent radius of curvature is easier to achieve than the simple stress measurement, and the measurement result is more reliable.
  • the equivalent radius of curvature can establish a more stable mapping relationship with the placement state of the bone conduction earphone, and is not easily disturbed by factors such as pressure and shaking, thereby making the wearing detection more accurate.
  • the processing circuit 220 can determine the placement state of the earphone 100 according to the bending state of the connector 120.
  • the placement state of the earphone 100 may include one of a normal wearing state, an abnormal wearing state, or a free placement state.
  • the normal wearing state may refer to the state of the earphone 100 when the user wears the earphone 100 normally to play audio;
  • the free placement state may refer to the state when the earphone 100 is not worn by the user;
  • the abnormal wearing state may refer to other states of the earphone 100 other than the normal wearing state and the free placement state, for example, the state when the user hangs the earphone 100 around the neck.
  • the placement state of the headset 100 please refer to other places in this specification, such as Figures 6A-6B, Figures 8A-8C, Figures 9A-9C and their descriptions, which will not be repeated here.
  • the control circuit 230 can adjust the working state of one or more electronic components (for example, Bluetooth module, battery, etc.) of the headset 100 based on the determination result of the processing circuit 220. Specifically, when the headset 100 is in a normal wearing state, the control circuit 230 can control at least one of the one or more electronic components to be in a wake-up state, and when the headset 100 is in an abnormal wearing state or a free placement state, the control circuit 230 can control at least one of the one or more electronic components to be in a low-power working state or a disabled state.
  • one or more electronic components for example, Bluetooth module, battery, etc.
  • the control circuit 230 can control the headset 100 to enter a wake-up state (i.e., connect the battery to the circuit), conversely, when it is determined that the headset 100 is in an abnormal wearing state or a free placement state, the control circuit 230 can control the headset 100 to be in a standby state (i.e., disconnect the battery from the circuit).
  • the control circuit 230 can control the Bluetooth module to turn on the Bluetooth function.
  • the control circuit 230 can control the Bluetooth module to disable the Bluetooth function.
  • the control circuit 230 can control the headset 100 to automatically play music. Conversely, when it is determined that the headset 100 is in an abnormal wearing state or a free placement state, the control circuit 230 can control the headset 100 to stop playing music.
  • the earphone 100 may include multiple (e.g., two or more) bend sensors 210 (or the bend sensor 210 may include multiple sensitive units).
  • the multiple bend sensors 210 (or the multiple sensitive units of the bend sensor 210) may be arranged at different positions in the accommodating cavity of the connector 120, and the processing circuit 220 may jointly determine the current bending state of the connector 120 based on the bending signals collected by the multiple bend sensors 210, thereby improving the accuracy of identifying the placement state of the earphone 100.
  • a bending sensor 210 can be respectively set at position A, position B and position C as shown in Figure 1.
  • the processing circuit 220 can determine that the earphone 100 is in a freely placed state, and accordingly, the control circuit 230 can control the earphone 100 to be in a standby state.
  • the processing circuit 220 can also determine the user's head circumference based on the bending signal detected by the bending sensor 210, thereby determining the force between the speaker assembly 110 and the user's head or ear. Further, the processing circuit 220 can optimize the acoustic output algorithm of the two speaker assemblies 110 based on the force between the speaker assembly 110 and the user's head or ear, and adjust the audio output signal so that the user obtains the best sound effect and wearing experience.
  • the equivalent radius of curvature of each connector 120 can correspond to a head circumference. The processing circuit 220 can determine the user's head circumference based on the determined equivalent radius of curvature of the connector 120.
  • the size of the head circumference can reflect the size of the force between the speaker assembly 110 and the user's head or ear. The larger the head circumference, the greater the force between the speaker assembly 110 and the user's head or ear.
  • the force between the speaker assembly 110 and the user's head or ear is less than a certain value, the loss of low-frequency signals in the audio signal transmitted to the skin by the speaker assembly 110 may be relatively large.
  • the output gain of the mid- and low-frequency signals can be increased in the acoustic output algorithm of the speaker assembly 110 to achieve balance, thereby avoiding the problem of reducing the mid- and low-frequency signals in the output signal of the speaker assembly 110 due to wearing problems, thereby improving the user experience.
  • the headset 100 can obtain audio signals by wired communication and/or wireless communication.
  • the headset 100 may also include a cable and a connector.
  • the connector can be used to connect to other devices (such as mobile phones, computers, etc.) to obtain audio data.
  • the audio data can be transmitted to the two speaker assemblies 110 via a cable for output, thereby converting the electrical signal into an acoustic signal.
  • the headset 100 may include a wireless communication module (not shown in FIG1).
  • the headset 100 can receive audio data from other devices through the wireless communication module and output sound through the two speaker assemblies 110.
  • Exemplary wireless communication modules may include a Bluetooth module, an infrared communication module, a WiFi module, a ZigBee module, etc.
  • FIG. 3 is a schematic diagram of the structure of headphones shown in other embodiments of the present specification.
  • the connector 120 may include two ear hook components 121 and a rear hook component 122.
  • the ear hook component 121 may cooperate with the user's auricle so that the earphone 100 can be hung on the user's ear.
  • the rear hook component 122 may be placed behind the user's neck or head (for example, when the user wears the earphone 100 normally, the rear hook component 122 may be fixed behind the user's head, and when the user does not use the earphone 100 (i.e., the earphone 100 is in an abnormal wearing state), the user may hang the earphone 100 on the neck, at which time, the rear hook component 122 may be fixed behind the user's neck).
  • the ear hook component 121 and the rear hook component 122 may cooperate to provide a clamping force to fix the two speaker components 110 on the user's head or ear, so that the earphone 100 can be stably hung on the user's ear and is not easy to fall off.
  • the two speaker components 110 may be connected to the rear hook component 122 through the two ear hook components 121, respectively.
  • the bending sensor 210 may be disposed in the accommodation cavity formed by the rear hook component 122.
  • the bending sensor 210 may be disposed at a position where the curvature of the connector 120 (e.g., the rear hanging component 122) changes relatively greatly, for example, where the symmetry plane of the rear hanging component 122 intersects with the rear hanging component 122, i.e., the middle part of the rear hanging component 122. It should be noted that in the embodiments of the present specification, the symmetry plane of the rear hanging component 122 may refer to a symmetry plane formed with the two ends of the rear hanging component 122 as symmetry points.
  • the sensitive direction of the bend sensor 210 may be made consistent with the bending deformation direction of the connector 120 (e.g., the rear hanging component 122) during wearing.
  • the bending deformation direction of the connector 120 e.g., the rear hanging component 122 may refer to the direction in which the radius of curvature corresponding to the connector 120 (or the rear hanging component 122) changes the most during wearing.
  • the sensitive direction of the bend sensor 210 consistent with the bending direction of the connector 120 or the rear hanging component 122, the response effect of the bend sensor 210 to the change in the bending state of the connector 120 or the rear hanging component 122 can be optimized, thereby ensuring the accuracy of detecting the placement state of the headset 100.
  • At least one of the two ear hook components 121 may further include an earphone compartment 130.
  • the earphone compartment 130 may be used to store or accommodate one or more components of the earphone 100 (e.g., processing circuit 220, control circuit 230, Bluetooth module, battery, etc.).
  • FIG. 4 is a schematic structural diagram of a cross-section of a connector of an earphone according to some embodiments of the present specification.
  • the connector 120 may include a housing 123.
  • the housing 123 may form a housing cavity 125.
  • the cable 124, the bending sensor 210, etc. may be accommodated in the housing cavity 125.
  • the cable 124 can be used to transmit audio signals, bending signals detected by the bending sensor 210, and control signals for controlling the working states of components such as the two speaker assemblies 110 and the Bluetooth module.
  • the housing 123 may be made of a hard material with a certain hardness or rigidity, which may have a certain deformation ability and provide the clamping force required when the user wears it.
  • the hard material may include a metal material or a non-metal material, such as an aluminum alloy, a nickel-titanium alloy, a plastic, etc.
  • the outer contour of the housing 123 may be a regular shape such as a cylinder, an elliptical cylinder, a prism (such as a quadrangular prism, a pentagonal prism, a hexagonal prism, etc.) or other irregular shapes.
  • the cable 124 and the bend sensor 210 may be fixed to the inner wall of the accommodating cavity 125 by means of bonding, clamping, or other fixing methods.
  • the gap between the cable 124 and the bend sensor 210, or between any one of the cable 124 and the bend sensor 210 and the inner wall of the accommodating cavity 125 may be filled with a filler, such as silicone, sponge, etc.
  • Fig. 5A is a schematic diagram of the structure of a cross section of a connector of an earphone shown in some other embodiments of this specification.
  • Fig. 5B is a schematic diagram of the structure of a cross section of a connector of an earphone shown in some other embodiments of this specification.
  • the shell 123 may directly contact the human skin during wearing, if its hardness is too large, it may cause discomfort to the part of the human body that contacts the shell 123. Therefore, in some embodiments, the shell 123 may be made of flexible materials such as silicone and/or elastic resin, which can be coated on the outside of the cable 124 and the bending sensor 210. At the same time, in order to meet the supporting performance and clamping performance of the connector 120 during use, a skeleton structure 126 can be set inside the shell 123 composed of flexible materials.
  • the skeleton structure 126 can have a certain hardness or rigidity, which can provide the clamping force required by the user when wearing it through the ability to deform and restore deformation.
  • the skeleton structure 126 may include metal structures such as titanium wire, titanium-nickel wire (sheet).
  • the cable 124, the skeleton structure 126, and the bending sensor 210 can be arranged in any manner inside the housing 123.
  • the cable 124 and the bending sensor 210 can be arranged at relative positions of the skeleton structure 126.
  • the cable 124 and the bending sensor 210 can be arranged at adjacent positions of the skeleton structure 126.
  • the rigidity of the skeleton structure 126 in the bending direction of the rear hanging component 122 may be greater than the rigidity of the bending sensor 210 in the bending direction of the rear hanging component 122, so that the skeleton structure 126 can provide a clamping force to fix the two speaker assemblies 110 on the user's head through bending deformation.
  • the rigidity of the bending sensor 210 in the bending direction of the rear hanging component 122 may be large enough to provide a clamping force to fix the two speaker assemblies 110 on the user's head through bending deformation. In this case, the headset 100 may not include the skeleton structure 126.
  • the bending sensor 210 in order to further ensure that the bending sensor 210 can accurately detect the change in the bending state of the connecting member 120, the bending sensor 210 can be arranged in affixed with the skeleton structure 126. It should be noted that when the bending sensor 210 is attached to the surface of the skeleton structure 126 (for example, titanium wire), the skeleton structure 126 can be regarded as a part of the bending sensor, and the two together play a role in detecting the change in the equivalent radius of curvature of the skeleton structure 126 (or the connecting member 120). In some embodiments, the sensor for detecting the change in the equivalent radius of curvature of the connecting member 120 may also be a stress strain sensor.
  • the outer contour of the housing 123 may also be a regular shape such as a cylinder, an elliptical cylinder, a prism (such as a quadrangular prism, a pentagonal prism, a hexagonal prism, etc.) or other irregular shapes.
  • the cable 124 and the bending sensor 210 may be fixed to the skeleton structure 126 by bonding, clamping, or other fixing methods.
  • the housing 123 may be injection molded on the outside of the cable 124, the skeleton structure 126, and the bending sensor 210 by injection molding, so that the housing 123 covers the cable 124, the skeleton structure 126, and the bending sensor 210.
  • the composition of the filler or filler may be the same as or different from that of the housing 123.
  • Fig. 6A is a schematic diagram of an exemplary headset in a free-standing state according to some embodiments of the present specification.
  • Fig. 6B is a schematic diagram of an exemplary headset in a normal wearing state according to some embodiments of the present specification.
  • the connector 120 when the earphone 100 is in a free placement state (as shown in FIG. 6A), the connector 120 presents a natural contraction bending state under the constraint of the skeleton structure 126 or the hard shell 121, and its equivalent radius of curvature may be R0; when the earphone 100 is in a normal wearing state (as shown in FIG. 6B), since the user needs to wear the earphone 100 on the head or ear, the curvature of the connector 120 changes due to the action of the head, and its equivalent radius of curvature increases to R1, that is, R1>R0.
  • the current equivalent radius of curvature of the connector 120 can be determined according to the bending signal generated by the bending sensor 210, and the current placement state of the earphone 100 can be determined based on the equivalent radius of curvature and a preset threshold.
  • the preset threshold may be greater than the equivalent radius of curvature when the earphone 100 is in a free placement state.
  • the processing circuit 220 may determine that the earphone 100 is in a free placement wearing state.
  • the processing circuit 220 can determine that the headset 100 is in an abnormal wearing state, for example, the headset 100 is hung on the user's neck.
  • the processing circuit 220 can determine that the headset 100 is in a normal wearing state.
  • the parameters of the degree of curvature of the connecting member 120 may be characterized by parameters such as deflection and rotation angle.
  • the preset threshold can be determined by counting the actual wearing conditions of a large number of users. For example, the preset threshold corresponding to adult users can be set larger than that of child users.
  • the user can customize the preset threshold according to his or her wearing condition.
  • the headset 100 may be provided with a preset threshold adjustment component (for example, a preset threshold adjustment button or a preset threshold adjustment box is provided in the APP connected to the headset 100), and the user can adjust the preset threshold according to his or her wearing condition.
  • an adaptive calibration algorithm can also be configured for the aforementioned preset threshold to automatically adjust the preset threshold. For example, statistical analysis can be performed based on experimental data to determine the initial value of the preset threshold.
  • the user can perform wearing confirmation when wearing the headset 100 normally, for example, through a button or a touch key.
  • the processing circuit 220 can adjust the preset threshold according to the equivalent radius of curvature of the headset 100 when the user performs wearing confirmation. Specifically, for example, the processing circuit 220 may adjust a preset threshold (e.g., an initial value or a preset threshold last updated) to be equal to the value of the equivalent radius of curvature of the earphone 100 when the user confirms wearing.
  • a preset threshold e.g., an initial value or a preset threshold last updated
  • the processing circuit 220 may also calibrate the preset threshold according to the bending signal generated by the bending sensor 210 when the user wears the earphone normally for multiple times or for a period of time. For example, the processing circuit 220 may determine the candidate threshold based on the bending signal generated by the bending sensor 210 each time the earphone is normally worn. The processing circuit 220 may adjust the preset threshold (e.g., an initial value or a preset threshold last updated) to be equal to the average value of each candidate threshold. Through the adaptive calibration algorithm, the corresponding preset threshold may be automatically adjusted when the user of the earphone 100 changes, thereby improving the intelligence and adaptability of the earphone 100 and improving the user experience to a certain extent.
  • the preset threshold e.g., an initial value or a preset threshold last updated
  • Exemplary adaptive calibration algorithms may include a minimum mean square error algorithm (Least Mean Square, LMS), a recursive least squares method (Recursive Least Square, RLS), a zero forcing algorithm, a steepest descent algorithm, a blind equalization algorithm, etc.
  • LMS minimum mean square error algorithm
  • RLS recursive least squares method
  • the adaptive calibration algorithm may also be other algorithms, which are not limited in the present application.
  • the headset 100 may further include one or more indicator lights for indicating the current working state or wearing state of the headset 100.
  • the headset 100 may include red and green indicator lights.
  • the green indicator light may indicate that the headset 100 is currently in an abnormal wearing state or a free placement state, and its working mode is in a standby state; conversely, the red indicator light may indicate that the headset 100 is currently in a normal wearing state, and its working mode is in a wake-up state.
  • the above indicator light colors are only for illustration purposes. In some other embodiments, the indicator light may be replaced by other colors or the same indicator light may indicate different states of the headset 100 by displaying different colors.
  • FIG. 7 is a schematic diagram of a circuit module of an earphone according to other embodiments of this specification.
  • the headset 100 may further include a contact sensor 240.
  • the contact sensor 240 may be disposed in the housing of at least one speaker assembly 110 or in the headset chamber 130 as shown in FIG. 3.
  • the contact sensor 240 may be used to identify whether the headset chamber 130 is close to or in contact with the user (e.g., in contact with the user's skin).
  • the headset 100 may include two left and right headset chambers 130.
  • a contact sensor 240 may be disposed in each of the left and right headset chambers 130. The contact signals detected by the two contact sensors 240 are used to jointly determine whether the headset chamber 130 is close to or in contact with the user.
  • the processing circuit 220 determines that the headset chamber 130 is close to or in contact with the user.
  • the contact sensor 240 may include one or more of a capacitive proximity sensor, a pressure sensor (e.g., a film pressure sensor), an infrared sensor, a laser sensor, and the like. It should be noted that different types of contact sensors may adopt different working principles, and the parameters for determining whether the corresponding components are in contact with the user may be different.
  • a pressure sensor when the detected pressure is greater than a pressure threshold, it can be determined that the corresponding component is in contact with the user; and when the detected pressure is less than the pressure threshold, it can be determined that the corresponding component is not in contact with the user.
  • a distance threshold when the detected distance is greater than a distance threshold, it can be determined that the corresponding component is in contact with the user; and when the detected distance is less than the distance threshold, it can be determined that the corresponding component is not in contact with the user.
  • the processing circuit 220 can determine the current placement state of the earphone 100 based on the bending signal collected by the bending sensor 210 and the contact signal collected by the contact sensor 240. For more information on determining the placement state of the earphone 100 by combining the bending signal of the bending sensor and the contact signal of the contact sensor 240, please refer to the description of Figures 8A-8C and Figures 9A-9C of this specification, which will not be repeated here.
  • the contact sensor 240 may be placed in a sleep state by default, and when the bending signal collected by the bending sensor 210 indicates that the equivalent radius of curvature of the connector 120 is greater than or equal to a preset threshold, the processing device 220 may control the contact sensor 240 to collect the contact signal. In some embodiments, in order to reduce the power consumption generated by the earphone 100 and/or the contact sensor 240, the processing circuit 220 may receive the contact signal of the contact sensor 240 for processing only when the bending signal collected by the bending sensor 210 indicates that the equivalent radius of curvature of the connector 120 is greater than or equal to a preset threshold. The preset threshold may be greater than the equivalent radius of curvature when the earphone 100 is placed freely.
  • the earphone 100 may not include the connector 120.
  • the earphone 100 may be one or more of an open earphone, smart glasses, a single-ear ear-hook earphone, a single-ear in-ear earphone (e.g., a true wireless Bluetooth earphone), etc.
  • the earphone 100 may not include the bending sensor 210, but include at least two other types of sensors (e.g., two contact sensors).
  • the processing circuit 220 may collaboratively determine whether the earphone 100 is in a normal wearing state based on the signals detected by the at least two other types of sensors.
  • the earphone 100 may include a first contact sensor and a second contact sensor.
  • the categories of the first contact sensor and the second contact sensor may be the same or different.
  • the first contact sensor may be an infrared sensor
  • the second contact sensor may be a film pressure sensor.
  • the first contact sensor and the second contact sensor may be set at any suitable position of the earphone 100.
  • the first contact sensor and the second contact sensor may be set simultaneously in the housing of the same speaker assembly 110 or respectively in the housings of two speaker assemblies 110.
  • the first contact sensor and the second contact sensor may be set simultaneously in one temple or respectively in two temples.
  • the first contact sensor can be set on the temple
  • the second contact sensor can be set on the nose pad.
  • the processing circuit 220 can directly determine whether the headset 100 is in a normal wearing state based on the contact signals collected by the first contact sensor and the second contact sensor. For example, only when the first contact sensor and the second contact sensor simultaneously detect that the user is approaching or touching the user, the processing circuit 220 determines that the headset 100 is in a normal wearing state.
  • the headset 100 may include a contact sensor and an orientation sensor (e.g., a gyroscope).
  • the contact sensor may be disposed near the top of the auricle when the headset is normally worn.
  • the processing circuit 220 determines that the headset 100 is in a normal wearing state.
  • Fig. 8A is a schematic diagram of an exemplary headset in a free placement state according to some embodiments of the present specification.
  • Fig. 8B is a schematic diagram of an exemplary headset in a normal wearing state according to some embodiments of the present specification.
  • Fig. 8C is a schematic diagram of an exemplary headset in an abnormal wearing state according to some embodiments of the present specification.
  • the contact sensor 240 may be disposed on the inner side of the earphone compartment 130 (i.e., the side close to the human skin when the earphone 100 is in a normal wearing state).
  • the equivalent radius of curvature of the connector 120 is R0.
  • the equivalent radius of curvature of the connector 120 increases to R1, i.e., R1>R0. At this time, the earphone compartment 130 is not in contact with the user's head.
  • the equivalent radius of curvature of the connector 120 increases to R2, i.e., R2>R0. Since the neck size is smaller than the head size, R1>R2>R0. At this time, the earphone compartment 130 is in contact with the user's neck (or close to the user's neck).
  • the current equivalent radius of curvature of the connector 120 can be determined according to the bending signal generated by the bending sensor 210, and the contact state between the earphone compartment 130 and the user detected by the contact sensor 240 can be used to jointly determine the current placement state of the earphone 100.
  • the output of the bending sensor 210 may be 1 (i.e., the output is a high level); conversely, when the bending signal detected by the bending sensor 210 is a second bending signal indicating that the equivalent radius of curvature of the connecting member 120 is less than the preset threshold, the output of the bending sensor 210 may be 0 (i.e., the output is a low level).
  • the output of the contact sensor 240 may be 1 (i.e., the output is a high level); conversely, when the contact signal detected by the contact sensor 240 is a second contact signal indicating that the earphone compartment 130 is in contact with the user (or the distance from the user is less than a preset distance threshold), the output of the contact sensor 240 may be 0 (i.e., the output is a low level).
  • a total bending signal may be determined based on the bending signals detected by the plurality of bending sensors 210. For example, when the bending signals detected by the bending sensors 210 disposed at positions A, B, and C as shown in FIG. 1 all indicate that the equivalent radius of curvature of the connector 120 (or the rear hanging component 122) is greater than or equal to a preset threshold, the total bending signal output by the plurality of bending sensors 210 may be determined as the first bending signal (i.e., its value is 1).
  • the bending signal detected by the bending sensor 210 arranged at position B indicates that the equivalent curvature radius of the connecting member 120 (or the rear hanging component 122) is greater than or equal to the preset threshold, but the bending signals detected by the bending sensors 210 at positions A and C indicate that the equivalent curvature radius of the connecting member 120 (or the rear hanging component 122) is equal to the equivalent curvature radius when the earphone 100 is freely placed, it means that bending deformation may occur at position B due to accidental contact.
  • the total bending signal of multiple bending sensors 210 can be determined as the second bending signal (that is, its value is 0).
  • the processing circuit 220 can determine whether the earphone 100 is in a normal wearing state according to the output of the bending sensor 210 and the output of the contact sensor 240, and thus issue an instruction to the control circuit 230 according to whether the earphone 100 is in a normal wearing state.
  • the control circuit 230 can control the working state of the earphone 100 based on the received control instruction.
  • the output of the processing circuit 220 can be 1, which means that the earphone 100 is judged to be in a normal wearing state.
  • the output of the processing circuit 220 can be both 0, which means that the earphone 100 is judged to be in an abnormal wearing state or a free placement state.
  • the control circuit 230 can control the working state of one or more components of the earphone 100 based on the output of the processing circuit 220. For example, when the total output of the processing circuit 220 is 1, the control circuit 230 can control the headset 100 to enter the awake state; when the total output of the processing circuit 220 is 0, the control circuit 230 can control the headset 100 to remain in the standby state.
  • the output signals shown in Table 1 are only exemplary. In some embodiments, other methods may be used to represent the bending signal detected by the bending sensor 210, the contact signal detected by the contact sensor 240, and the total output signal of the headset 100. For example, in some embodiments, when the contact signal detected by the contact sensor 240 is the aforementioned first contact signal, its output may also be represented by 0 (i.e., the output is a low level); conversely, when the contact signal detected by the contact sensor 240 is the aforementioned second contact signal, its output may be represented by 1.
  • Fig. 9A is a schematic diagram of an exemplary headset in a free placement state according to some embodiments of the present specification.
  • Fig. 9B is a schematic diagram of an exemplary headset in a normal wearing state according to some embodiments of the present specification.
  • Fig. 9C is a schematic diagram of an exemplary headset in an abnormal wearing state according to some embodiments of the present specification.
  • the contact sensor 240 may also be disposed inside the housing of at least one speaker assembly 110 (e.g., the side close to human skin when the earphone 100 is in a normal wearing state) to identify whether the speaker assembly 110 is in contact with the user (or close to the user).
  • the contact sensor 240 may also be disposed inside the housing of at least one speaker assembly 110 (e.g., the side close to human skin when the earphone 100 is in a normal wearing state) to identify whether the speaker assembly 110 is in contact with the user (or close to the user).
  • the contact sensor 240 may also be disposed inside the housing of at least one speaker assembly 110 (e.g., the side close to human skin when the earphone 100 is in a normal wearing state) to identify whether the speaker assembly 110 is in contact with the user (or close to the user).
  • the output of the contact sensor 240 when the contact signal detected by the contact sensor 240 is a first contact signal indicating that the speaker assembly 110 is not in contact with the user (or the distance from the user is greater than a preset distance threshold), the output of the contact sensor 240 may be 1 (i.e., the output is a high level), whereas, when the contact signal detected by the contact sensor 240 is a second contact signal indicating that the speaker assembly 110 is in contact with the user (or the distance from the user is less than a preset distance threshold), the output of the contact sensor 240 may be 0 (i.e., the output is a low level).
  • the output of the processing circuit 220 is 1, i.e., it is determined that the earphone 100 is in a normal wearing state.
  • the output of the processing circuit 220 may be all 0, i.e., it is determined that the earphone 100 is in an abnormal wearing state or a free placement state.
  • the control circuit 230 may control the working state of one or more components of the earphone 100 based on the output of the processing circuit 220. For example, when the total output of the processing circuit 220 is 1, the control circuit 230 can control the headset 100 to enter the awake state; when the total output of the processing circuit 220 is 0, the control circuit 230 can control the headset 100 to remain in the standby state.
  • the output signals shown in Table 2 are only exemplary. In some embodiments, other methods may be used to represent the bending signal detected by the bending sensor 210, the contact signal detected by the contact sensor 240, and the total output signal of the headset 100. For example, in some embodiments, when the contact signal detected by the contact sensor 240 is the aforementioned first contact signal, its output may also be represented by 0 (i.e., the output is a low level), and when the contact signal detected by the contact sensor 240 is the aforementioned second contact signal, its output may also be represented by 1 (i.e., the output is a high level).
  • the beneficial effects that may be brought about by the embodiments of this application include but are not limited to: (1) by detecting the bending state of the connector between the speaker components through the bending sensor, and then analyzing the current use state of the earphone, the accurate identification of the earphone wearing state and the accurate control of the earphone working state can be achieved; (2) by jointly determining the current wearing state of the earphone through the contact sensor and the bending sensor, the accuracy of the earphone wearing state identification and the accuracy of the earphone working state control can be further improved. It should be noted that different embodiments may produce different beneficial effects. In different embodiments, the beneficial effects that may be produced may be any one or a combination of the above, or any other possible beneficial effects.

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Abstract

本说明书实施例提供一种耳机，所述耳机包括：两个扬声器组件、连接件以及处理电路，所述连接件用于连接所述两个扬声器组件，所述连接件通过弯曲形变提供将所述两个扬声器组件固定在用户头部的夹紧力，所述连接件包括具有容置腔的外壳，其中，所述容置腔中设置有弯曲传感器，所述弯曲传感器用于基于所述连接件的弯曲状态生成弯曲信号；所述处理电路用于基于所述弯曲信号，判断所述耳机的放置状态，所述放置状态包括正常佩戴状态、非正常佩戴状态或自由放置状态中的一种。

Description

一种耳机 技术领域
本说明书涉及声学技术领域，特别涉及一种耳机。
背景技术
在目前的耳机市场中，传感器被广泛应用在耳机等产品的佩戴检测中。当利用传感器识别到用户佩戴耳机后，可以自动唤醒系统，当识别到用户摘下耳机后，可以自动进入待机模式，从而实现降低功耗、延长使用时间的目的，同时节省用户的操作步骤，大大提高使用体验。
目前现有的用于佩戴检测的传感器主要包括红外传感器和电容式接触传感器，前者结构与系统复杂，后者稳定性低，且两者都存在识别准确度不够高的问题。在骨传导耳机中，因为其独特的佩戴方式，传统的佩戴检测传感器均不能实现理想的检测效果。因此，需要开发一种新型的佩戴检测方案，实现耳机佩戴状态的准确识别。
发明内容
本说明书实施例可以提供一种耳机，包括：两个扬声器组件、连接件以及处理电路。所述连接件用于连接所述两个扬声器组件。所述连接件通过弯曲形变提供将所述两个扬声器组件固定在用户头部的夹紧力。所述连接件包括具有容置腔的外壳。所述容置腔中设置有弯曲传感器，所述弯曲传感器用于基于所述连接件的弯曲状态生成弯曲信号。所述处理电路用于基于所述弯曲信号，判断所述耳机的放置状态。所述放置状态包括正常佩戴状态、非正常佩戴状态或自由放置状态中的一种。
在一些实施例中，所述连接件包括两个耳挂组件和后挂组件，所述两个扬声器组件分别通过所述两个耳挂组件连接到所述后挂组件，所述弯曲传感器位于所述后挂组件形成的所述容置腔中。
在一些实施例中，所述弯曲传感器的敏感方向与所述后挂组件的弯曲方向一致。
在一些实施例中，所述弯曲传感器设置在所述后挂组件的对称面与所述后挂组件相交的位置。
在一些实施例中，所述外壳由硬质材料制成，所述弯曲传感器粘贴在所述容置腔的内壁。
在一些实施例中，所述后挂组件还包括骨架结构，所述弯曲传感器与所述骨架结构贴合设置，所述骨架结构在所述后挂组件的弯曲方向上的刚度大于所述弯曲传感器在所述后挂组件的弯曲方向上的刚度。
在一些实施例中，当所述弯曲传感器的弯曲信号指示所述后挂组件的等效曲率半径大于所述耳机自由放置时的等效曲率半径且小于预设阈值时，所述处理电路可以判断所述耳机处于非正常佩戴状态。在一些实施例中，当所述弯曲传感器的弯曲信号指示所述后挂组件的等效曲率半径大于所述耳机自由放置时的等效曲率半径且大于所述预设阈值时，所述处理电路可以判断所述耳机处于正常佩戴状态。
在一些实施例中，所述两个耳挂组件中至少一个耳挂组件包括耳机仓，所述耳机还包括：接触式传感器，设置于所述耳机仓内，用于识别所述耳机仓是否与所述用户接触。
在一些实施例中，所述处理电路还用于基于所述弯曲传感器的所述弯曲信号和所述接触式传感器的接触信号，判断所述耳机的放置状态。
在一些实施例中，所述耳机包括一个或多个电子组件，其中，所述处理电路根据所述耳机的放置状态，调整所述一个或多个电子组件的工作状态，包括：当所述耳机处于正常佩戴状态时，控制所述一个或多个电子组件处于唤醒状态；当所述耳机处于非正 常佩戴状态或所述自由放置状态时，控制所述一个或多个电子组件处于低功耗工作状态。
在一些实施例中，当所述弯曲信号为第一弯曲信号且所述接触信号为第一接触信号时，所述处理电路判断所述耳机处于正常佩戴状态，其中，所述第一弯曲信号指示所述后挂组件的等效曲率半径大于所述耳机自由放置时的等效曲率半径且大于或等于预设阈值，所述第一接触信号指示所述耳机仓与所述用户不接触。
在一些实施例中，当所述弯曲信号为第一弯曲信号且所述接触信号为第二接触信号时，所述处理电路判断所述耳机处于非正常佩戴状态，其中，所述第一弯曲信号指示所述连接件的等效曲率半径大于所述耳机自由放置时的等效曲率半径且大于或等于预设阈值，所述第二接触信号指示所述耳机仓与所述用户接触。
在一些实施例中，所述耳机还包括：接触式传感器，所述接触式传感器设置于所述两个扬声器组件中至少一个扬声器组件的壳体内，用于识别所述扬声器组件是否与所述用户接触。
在一些实施例中，当所述弯曲信号为第一弯曲信号且所述接触信号为第二接触信号时，所述处理电路判断所述耳机处于正常佩戴状态，其中，所述第一弯曲信号指示所述连接件的等效曲率半径大于所述耳机自由放置时的等效曲率半径且大于或等于预设阈值，所述第二接触信号指示所述扬声器组件与所述用户接触。
在一些实施例中，当所述弯曲信号为第一弯曲信号且所述接触信号为第一接触信号时，所述处理电路判断所述耳机处于非正常佩戴状态，其中，所述第一弯曲信号指示所述连接件的等效曲率半径大于所述耳机自由放置时的等效曲率半径且大于或等于预设阈值，所述第一接触信号指示所述扬声器组件与所述用户不接触。
在一些实施例中，所述接触式传感器包括电容式接近传感器、薄膜压力传感器、红外传感器中的至少一种。
附加的特征将在下面的描述中部分地阐述，并且对于本领域技术人员来说，通过查阅以下内容和附图将变得显而易见，或者可以通过实例的产生或操作来了解。本说明书的特征可以通过实践或使用以下详细实例中阐述的方法、工具和组合的各个方面来实现和获得。
附图说明
本说明书将以示例性实施例的方式进一步说明，这些示例性实施例将通过附图进行详细描述。这些实施例并非限制性的，在这些实施例中，相同的编号表示相同的结构，其中：
图1是根据本说明书一些实施例所示的示例性的耳机的结构示意图；
图2是根据本说明书一些实施例所示的示例性的耳机的电路模块示意图；
图3是根据本说明书另一些实施例所示的示例性的耳机的结构示意图；
图4是根据本说明书一些实施例所示的示例性的耳机的连接件的横截面的结构示意图；
图5A是根据本说明书另一些实施例所示的示例性的耳机的连接件的横截面的结构示意图；
图5B是根据本说明书另一些实施例所示的示例性的耳机的连接件的横截面的结构示意图；
图6A是根据本说明书一些实施例所示的示例性耳机处于自由放置状态的示意图；
图6B是根据本说明书一些实施例所示的示例性耳机处于正常佩戴状态的示意图；
图7是根据本说明书另一些实施例所示的示例性的耳机的电路模块示意图；
图8A是根据本说明书一些实施例所示的示例性耳机处于自由放置状态的示意图；
图8B是根据本说明书一些实施例所示的示例性耳机处于正常佩戴状态的示意图；
图8C是根据本说明书一些实施例所示的示例性耳机处于非正常佩戴状态的示意图；
图9A是根据本说明书一些实施例所示的示例性耳机处于自由放置状态的示意图；
图9B是根据本说明书一些实施例所示的示例性耳机处于正常佩戴状态的示意图；
图9C是根据本说明书一些实施例所示的示例性耳机处于非正常佩戴状态的示意图。
具体实施例
为了更清楚地说明本说明书的实施例的技术方案，下面将对实施例描述中所需要使用的附图作简单的介绍。显而易见地，下面描述中的附图仅仅是本说明书的一些示例或实施例，对于本领域的普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图将本说明书应用于其他类似情景。应当理解，给出这些示例性实施例仅仅是为了使相关领域的技术人员能够更好地理解进而实现本说明书，而并非以任何方式限制本说明书的范围。除非从语言环境中显而易见或另做说明，图中相同标号代表相同结构或操作。
如本说明书和权利要求书中所示，除非上下文明确提示例外情形，“一”、“一个”、“一种”和/或“该”等词并非特指单数，也可包括复数。一般说来，术语“包括”与“包含”仅提示包括已明确标识的步骤和元素，而这些步骤和元素不构成一个排它性的罗列，方法或者设备也可能包含其他的步骤或元素。术语“基于”是“至少部分地基于”。术语“一个实施例”表示“至少一个实施例”；术语“另一实施例”表示“至少一个另外的实施例”。
在本说明书的描述中，需要理解的是，术语“前”、“后”“耳挂”、“后挂”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本说明书和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本说明书的限制。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。在本说明书的描述中，“多个”的含义是至少两个，例如两个、三个等，除非另有明确具体的限定。
在本说明书中，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系，除非另有明确的限定。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本说明书中的具体含义。
本说明书实施例提供一种耳机(也可以称为声学输出装置)，其通过检测扬声器组件之间的连接件的弯曲状态来分析耳机的当前放置状态(例如，正常佩戴状态、非正常佩戴状态或自由放置状态)，从而进一步根据耳机的当前放置状态调整耳机的一个或多个电子组件(例如，蓝牙模块、电池等)的工作状态。在一些实施例中，可以协同多个传感器(例如，相同或不同类型的传感器)检测声学输出装置(例如，耳机、智能眼镜等)的当前放置状态，从而提升声学输出装置佩戴检测的准确性。下面结合附图对本说明书实施例提供的耳机进行详细说明。
图1是本说明书一些实施例所示的耳机的结构示意图。在一些实施例中，耳机100可以为骨传导耳机、气传导耳机或骨气导结合的耳机。在一些实施例中，耳机100可以为开放式的耳机。在本申请的一些实施例中，将以骨传导耳机作为示例进行描述，其并不限制本申请的范围。参照图1，耳机100可以包括两个扬声器组件110、连接件120以及弯曲传感器210。
两个扬声器组件110可以用于将音频信号(即，电学信号)转换为机械振动信号(即，声学信号)，从而将声音输出给用户。在一些实施例中，扬声器组件110可以包括各种类型，例如，电磁型(例如，动圈型、动铁型等)、压电型、逆压电型、静电型等，这在本申请中不受限制。
连接件120可以用于连接两个扬声器组件110。连接件120可以作为固定装置使耳机100相对于用户保持固定。具体地，连接件120可以具有一定的形变能力和恢复形变的能力，其可以通过弯曲形变提供将两个扬声器组件110固定在用户头部或颈部的夹紧力。在一些实施例中，连接件120可以包括头戴式连接件或后挂式连接件。示例性地，当连接件120为头戴式连接件时，用户可以将该连接件120置于头顶，从而使得耳机100相对于用户固定。当连接件120为后挂式连接件时，用户可以将该连接件120置于用户头部后方或颈部后方，从而使得耳机100相对于用户固定。例如，当用户正常佩戴耳机100时，连接件120可以固定在用户的头部后方，而当用户不使用耳机100时
(即耳机100处于非正常佩戴状态)，用户可以将耳机100挂在脖子上，此时，连接件120可以固定在用户的颈部后方。在一些实施例中，连接件120与两个扬声器组件110之间的连接可以包括注塑连接、焊接、铆接、螺栓、粘接、卡接等或其任意组合。
在一些实施例中，连接件120可以包括具有容置腔的外壳，该容置腔可以用于容纳耳机100的一个或多个部件，例如，用于给两个扬声器组件110传输信号的通信线缆、弯曲传感器210等。更多关于容置腔的描述可以参见本说明书中图4及图5A-5B及相关描述。
弯曲传感器210可以用于识别连接件120的弯曲状态。需要知道的是，连接件120的弯曲状态可以引起弯曲传感器210中特定参数发生改变。不同类型的弯曲传感器210可以基于不同的工作原理，其对应的特定参数可能有所不同。仅作为示例，在一些实施例中，弯曲传感器210可以具有腔体，连接件120的形变能引起腔体体积及其内的气压发生变化，以此生成相应的信号以表征弯曲状态。在一些实施例中，弯曲传感器210可以具有电容结构，连接件120的形变能引起电容结构的容值发生变化。在一些实施例中，弯曲传感器210可以具有阻值随弯曲状态的变化而变化的电阻，从而可以基于其阻值的变化情况确定弯曲传感器210的弯曲状态。在一些实施例中，弯曲传感器210可以为细长条状或薄膜状。在一些实施例中，弯曲传感器210的长度可以在0.1cm-2cm，例如，可以为0.5cm、0.8cm、1cm等。在一些实施例中，弯曲传感器210可以包括FPC(Flexible Printed Circuit)柔性电路，其表面可以包括印刷而成的敏感材料。该敏感材料可以包括能够对弯曲状态变化产生响应的材料或结构。示例性地，该敏感材料可以包括导电碳浆。在一些实施例中，为了放大该敏感材料的灵敏度，可以在导电碳浆的表面设置微结构，例如微缝隙、微孔等。
在一些实施例中，弯曲传感器210可以设置于连接件120的容置腔的中间部位
(即弯曲传感器210与两个扬声器组件110具有相同或大致相同的距离)，例如，图1中所示的位置A。在一些实施例中，弯曲传感器210也可以靠近两个扬声器组件110中的其中一个设置，例如，图1中所示的位置B或位置C。
图2是本说明书一些实施例所示的耳机的电路模块示意图。参照图2，在一些实施例中，耳机100还可以包括处理电路220和控制电路230。处理电路220可以与弯曲传感器210及控制电路230电连接。处理电路220可以基于弯曲传感器210检测的弯曲信 号，确定连接件120的弯曲状态。具体地，处理电路220可以根据弯曲传感器210检测的弯曲信号，确定连接件120的等效曲率半径，从而确定连接件120的弯曲状态(或弯曲程度)。示例性的，在一些实施例中，可以基于实验数据预先配置该弯曲信号与连接件120的等效曲率半径之间的映射关系。处理电路220可以基于弯曲传感器210检测的弯曲信号以及该映射关系确定连接件120的等效曲率半径，从而确定连接件120的弯曲状态(或弯曲程度)。需要知道的是，在本说明书实施例中，当耳机100为如图3所示的骨传导耳机时，由于后挂组件210形状(例如，钛丝的形状)的限制，等效曲率半径的测量比单纯的应力测量更容易实现，其测量结果也更可靠。此外，等效曲率半径能够和骨传导耳机的放置状态之间建立更稳定的映射关系，不易受压力、晃动等因素的干扰，从而使佩戴检测更加准确。进一步地，处理电路220可以根据连接件120的弯曲状态，确定耳机100的放置状态。在一些实施例中，耳机100的放置状态可以包括正常佩戴状态、非正常佩戴状态或自由放置状态中的一种。正常佩戴状态可以指用户正常佩戴耳机100进行播放音频时耳机100所处的状态；自由放置状态可以指耳机100没有被用户佩戴时的状态；非正常佩戴状态可以指除正常佩戴状态和自由放置状态之外的耳机100所处的其他状态，例如，用户将耳机100悬挂在脖子上时的状态。关于耳机100的放置状态的确定的更多描述可以参见本说明书的其他地方，例如图6A-6B、图8A-8C、图9A-9C及其描述，此处不再赘述。控制电路230可以基于处理电路220的确定结果，调整耳机100的一个或多个电子组件(例如，蓝牙模块、电池等)的工作状态。具体地，当耳机100处于正常佩戴状态时，控制电路230可以控制该一个或多个电子组件中的至少一个处于唤醒状态，而当耳机100处于非正常佩戴状态或自由放置状态时，控制电路230可以控制该一个或多个电子组件中的至少一个处于低功耗工作状态或者禁用状态。例如，当确定耳机100处于正常佩戴状态时，控制电路230可以控制耳机100进入唤醒状态(即将电池连接入电路)，反之，当确定耳机100处于非正常佩戴状态或自由放置状态时，控制电路230可以控制耳机100处于待机状态(即将电池从电路中断开)。又例如，当确定耳机100处于正常佩戴状态时，控制电路230可以控制蓝牙模块开启蓝牙功能，反之，当确定耳机100处于非正常佩戴状态或自由放置状态时，控制电路230可以控制蓝牙模块禁用蓝牙功能。再例如，当确定耳机100处于正常佩戴状态时，控制电路230可以控制耳机100自动播放音乐，反之，当确定耳机100处于非正常佩戴状态或自由放置状态时，控制电路230可以控制耳机100停止播放音乐。
在一些实施例中，耳机100可以包括多个(例如两个或两个以上)弯曲传感器210(或者弯曲传感器210可以包括多个敏感单元)。多个弯曲传感器210(或者弯曲传感器210的多个敏感单元)可以设置在连接件120的容置腔内的不同位置，处理电路220可以基于多个弯曲传感器210采集的弯曲信号共同确定连接件120的当前弯曲状态，从而提高识别耳机100放置状态的准确性。例如，可以在如图1所示的位置A、位置B和位置C分别设置一个弯曲传感器210，若其中位置B处的弯曲传感器210检测到的弯曲信号指示连接件120的等效曲率半径大于耳机100自由放置时的等效曲率半径，而位置A和位置C处的弯曲传感器210检测到的弯曲信号指示连接件120的等效曲率半径等于耳机100自由放置时的等效曲率半径，则可以表示位置B处可能由于误碰而产生弯曲形变，此时，处理电路220可以判断耳机100处于自由放置状态，相应的，控制电路230可以控制耳机100处于待机状态。
在一些实施例中，处理电路220还可以根据弯曲传感器210检测的弯曲信号，确定用户的头围，从而确定扬声器组件110与用户头部或耳部之间的作用力。进一步地，处理电路220可以基于扬声器组件110与用户头部或耳部之间的作用力，优化两个扬声器组件110的声学输出算法，调节音频输出信号，使得用户获得最佳的音效与佩戴体验。例如，每个连接件120的等效曲率半径可以对应一个头围。处理电路220可以根据 确定的连接件120的等效曲率半径，确定用户的头围。头围的大小可以反映扬声器组件110与用户头部或耳部之间的作用力大小。头围越大，扬声器组件110与用户头部或耳部之间的作用力越大。当扬声器组件110与用户头部或耳部之间的作用力小于某一值时，扬声器组件110传输到皮肤的音频信号中低频信号损失可能会比较大，此时可以在扬声器组件110的声学输出算法中增大中低频信号的输出增益来进行平衡，从而避免由于佩戴问题导致扬声器组件110的输出信号中中低频信号减少的问题，提升用户体验。
需要说明的是，在本说明书的一些实施例中，耳机100可以通过有线通信和/或无线通信的方式获取音频信号。例如，参照图1，在一些实施例中，耳机100还可以包括线缆以及连接头。连接头可以用于与其他设备(例如手机、电脑等)进行连接，以获取音频数据。该音频数据可以经由线缆传输至两个扬声器组件110进行输出，从而将电学信号转换为声学信号。又例如，在一些实施例中，耳机100可以包括无线通信模块(图1中未示出)。耳机100可以通过该无线通信模块从其他设备接收音频数据，并通过两个扬声器组件110输出声音。示例性的无线通信模块可以包括蓝牙模块、红外通信模块、WiFi模块、ZigBee模块等。
图3是本说明书另一些实施例所示的耳机的结构示意图。
参照图3，在一些实施例中，连接件120可以包括两个耳挂组件121和后挂组件122。耳挂组件121可以与用户的耳廓相互配合，使耳机100能挂在用户耳朵上。后挂组件122可以置于用户的脖子或头部后方(例如，当用户正常佩戴耳机100时，后挂组件122可以固定在用户的头部后方，而当用户不使用耳机100时(即耳机100处于非正常佩戴状态)，用户可以将耳机100挂在脖子上，此时，后挂组件122可以固定在用户的颈部后方)。耳挂组件121和后挂组件122可以配合提供将两个扬声器组件110固定在用户头部或耳部的夹紧力，从而使耳机100能稳定挂在用户耳朵上不易掉落。两个扬声器组件110可以分别通过两个耳挂组件121连接到后挂组件122。在一些实施例中，弯曲传感器210可以设置于后挂组件122所形成的容置腔内。
由于用户在佩戴耳机的过程中会使得连接件120(例如，后挂组件122)的弯曲度发生变化，因此，在一些实施例中，为了准确检测到连接件120的弯曲状态从而准确确定耳机100的当前放置状态(例如，正常佩戴状态或非正常佩戴状态)，可以将弯曲传感器210设置在连接件120(例如，后挂组件122)的弯曲度变化相对较大的部位，例如，后挂组件122的对称面与后挂组件122相交的位置，即后挂组件122的中间部位。需要说明的是，在本说明书的实施例中，后挂组件122的对称面可以指以后挂组件122的两端作为对称点所形成的对称面。
在一些实施例中，为了进一步确保准确检测到连接件120的弯曲状态从而准确确定耳机100的当前放置状态(例如，正常佩戴状态或非正常佩戴状态)，还可以使得弯曲传感器210的敏感方向与佩戴过程中连接件120(例如，后挂组件122)的弯曲形变方向保持一致。连接件120(例如，后挂组件122)的弯曲形变方向可以指佩戴过程中连接件120(或后挂组件122)所对应的曲率半径变化最大的方向。可以理解，通过使弯曲传感器210的敏感方向与连接件120或后挂组件122的弯曲方向保持一致，可以使得弯曲传感器210对于连接件120或后挂组件122的弯曲状态变化的响应效果最佳，进而确保耳机100的放置状态的检测准确性。
参照图3，在一些实施例中，两个耳挂组件121中的至少一个还可以包括耳机仓130。在一些实施例中，耳机仓130可以用于收纳或容置耳机100的一个或多个部件(例如，处理电路220、控制电路230、蓝牙模块、电池等)。
图4是根据本说明书一些实施例所示的耳机的连接件的横截面的结构示意图。
参照图4，在一些实施例中，连接件120可以包括外壳123。外壳123可以形成容置腔125。在一些实施例中，线缆124、弯曲传感器210等可以容置于该容置腔125
中。线缆124可以用于传输音频信号、弯曲传感器210所检测的弯曲信号以及用于控制两个扬声器组件110、蓝牙模块等组件的工作状态的控制信号等。
在一些实施例中，外壳123可以采用具有一定硬度或刚度的硬质材料制成，其可以具有一定的形变能力并提供用户佩戴时所需的夹紧力。在一些实施例中，硬质材料可以包括金属材料或非金属材料，例如铝合金、镍钛合金、塑料等。在一些实施例中，外壳123的外部轮廓可以是圆柱体、椭圆柱体、棱柱体(例如四棱柱、五棱柱、六棱柱等)等规则形状或其他不规则形状。
参照图4，在一些实施例中，为了避免线缆124以及弯曲传感器210受到外力作用在容置腔125内晃动、碰撞，从而产生噪音或者对弯曲传感器210的检测结果产生影响，可以采用粘接、卡接等固定方式将线缆124和弯曲传感器210固定在容置腔125的内壁。在一些实施例中，为了进一步避免前述问题，容置腔125在用于容置线缆124和弯曲传感器210后，线缆124与弯曲传感器210之间，或者线缆124和弯曲传感器210中任意一者与容置腔125的内壁之间的间隙可以使用填充剂对容置腔125中的间隙进行填充，例如可以在间隙中填充硅胶、海绵等。
图5A是本说明书另一些实施例所示的耳机的连接件的横截面的结构示意图。图5B是本说明书另一些实施例所示的耳机的连接件的横截面的结构示意图。
参照图5A和图5B，在一些实施例中，考虑到在佩戴过程中外壳123可能会直接与人体皮肤接触，若其硬度过大，可以会引起人体与外壳123接触的部位不适，因此，在一些实施例中，外壳123可以采用硅胶和/或弹性树脂等柔性材料，其可以包覆在线缆124和弯曲传感器210的外部。与此同时，为了满足连接件120在使用过程中所述的支撑性能以及夹紧性能，可以在柔性材料构成的外壳123内部设置骨架结构126。该骨架结构126可以具有一定的硬度或刚度，其可以通过形变以及恢复形变的能力提供用户佩戴时所需的夹紧力。示例性地，在一些实施例中，该骨架结构126可以包括钛丝、钛镍金属丝(片)等金属结构。
结合图5A和图5B，在本说明书的一些实施例中，线缆124、骨架结构126和弯曲传感器210三者在外壳123内部可以呈任意方式排布。例如，如图5A所示，线缆124和弯曲传感器210可以设置在骨架结构126的相对位置。又例如，如图5B所示，线缆124和弯曲传感器210可以设置在骨架结构126的相邻位置。
在一些实施例中，骨架结构126在后挂组件122的弯曲方向上的刚度可以大于弯曲传感器210在该后挂组件122的弯曲方向上的刚度，从而使得骨架结构126可以通过弯曲形变提供将两个扬声器组件110固定在用户头部的夹紧力。在一些实施例中，弯曲传感器210在后挂组件122的弯曲方向上的刚度可以足够大，以通过弯曲形变提供将两个扬声器组件110固定在用户头部的夹紧力。在这种情况下，耳机100可以不包括骨架结构126。参照图5A或5B，在一些实施例中，为了进一步确保弯曲传感器210能够准确检测到连接件120的弯曲状态变化，可以将弯曲传感器210与骨架结构126贴合设置。需要知道的是，当弯曲传感器210贴在骨架结构126(例如，钛丝)表面以后，骨架结构126可以视为弯曲传感器的一部分，两者共同起到检测骨架结构126(或连接件120)的等效曲率半径的变化的作用。在一些实施例中，用于检测连接件120的等效曲率半径的变化的传感器也可以是应力应变传感器。
在一些实施例中，当外壳123采用柔性材料制作而成时，外壳123的外部轮廓也可以是圆柱体、椭圆柱体、棱柱体(例如四棱柱、五棱柱、六棱柱等)等规则形状或其他不规则形状。在一些实施例中，为了避免线缆124以及弯曲传感器210受到外力作用在容置腔125内晃动、碰撞，从而产生噪音或者对弯曲传感器210的检测结果产生影响，可以采用粘接、卡接等固定方式将线缆124和弯曲传感器210固定在骨架结构126上。在一些实施例中，可以通过注塑的方式将外壳123注塑在线缆124、骨架结构126和 弯曲传感器210外部，并使得外壳123将线缆124、骨架结构126和弯曲传感器210包覆。在一些实施例中，线缆124、骨架结构126以及弯曲传感器210中任意两者之间，或者线缆124、骨架结构126和弯曲传感器210中任意一者与外壳123的内壁之间可能存在一定的间隙，该间隙可以使用填充剂或填充物进行填充，例如可以在该间隙中填充硅胶、海绵等。需要说明的是，在本说明书的一些实施例中，该填充剂或填充物的成分可以与外壳123相同或不同。
图6A是根据本说明书一些实施例所示的示例性耳机处于自由放置状态的示意图。图6B是根据本说明书一些实施例所示的示例性耳机处于正常佩戴状态的示意图。
参照图6A和6B，当耳机100处于自由放置状态时(如图6A所示)，连接件120在骨架结构126或者硬质外壳121的约束下呈现自然的收缩弯曲状态，其等效曲率半径可以为R0；当耳机100处于正常佩戴状态时(如图6B所示)，由于用户需要将耳机100佩戴在头上或者耳部，此时由于头部的作用，使得连接件120的弯曲弧度发生变化，其等效曲率半径增大为R1，即，R1>R0。基于此，可以根据弯曲传感器210生成的弯曲信号，确定出连接件120的当前等效曲率半径，并基于该等效曲率半径及预设阈值判断出耳机100当前放置状态。预设阈值可以大于耳机100处于自由放置状态时的等效曲率半径。具体地，当弯曲传感器210检测到的弯曲信号指示连接件120的等效曲率半径为小于或等于R0时，处理电路220可以判断耳机100处于自由放置佩戴状态。当弯曲传感器210检测到的弯曲信号指示连接件120的等效曲率半径大于R0但小于预设阈值时，处理电路220可以判断耳机100处于非正常佩戴状态，例如，耳机100被挂设在用户脖子上。当弯曲传感器210检测到的弯曲信号指示连接件120的等效曲率半径大于R0且大于或等于预设阈值时，处理电路220可以判断耳机100处于正常佩戴状态。
需要知道的是，在一些实施例中，除利用等效曲率半径表征连接件120的弯曲程度之外，还可以利用其他参数表征连接件120的弯曲程度，从而根据对应表征参数识别耳机的当前放置状态。例如，可以利用挠度、转角等参数来表征连接件120的弯曲程度的参数。
在一些实施例中，预设阈值可以通过统计大量用户的实际佩戴情况进行确定。例如，相对于儿童用户，成人用户对应的预设阈值可以设置得更大。在一些实施例中，考虑到不同用户正常佩戴耳机100时所对应的R1的值可能会有所不同，因此，为了更准确识别出耳机100的放置状态，用户可以根据自己佩戴情况自定义预设阈值。例如，耳机100上可以设置有预设阈值调节组件(例如，预设阈值调节按钮或在与耳机100连接的APP中设置有预设阈值调节框)，用户可以根据自己佩戴情况调节预设阈值。在一些实施例中，为了进一步提高耳机100的灵敏性和适用性，还可以针对前述预设阈值配置自适应校准算法，以自动对预设阈值进行调整。例如，可以基于实验数据进行统计分析，确定预设阈值的初始值。用户在正常佩戴耳机100时可以进行佩戴确认，例如，通过按钮或触控键等。处理电路220可以根据用户进行佩戴确认时耳机100的等效曲率半径对预设阈值进行调整。具体地，例如，处理电路220可以将预设阈值(例如，初始值或上次更新的预设阈值)调整为等于用户进行佩戴确认时耳机100的等效曲率半径的值。在一些实施例中，处理电路220还可以根据多次或一段时间内用户正常佩戴时弯曲传感器210生成的弯曲信号对预设阈值进行校准。例如，处理电路220可以基于每次正常佩戴时弯曲传感器210生成的弯曲信号确定候选阈值。处理电路220可以将预设阈值(例如，初始值或上次更新的预设阈值)调整为等于各候选阈值的平均值。通过自适应校准算法，可以在耳机100的使用者发生变化时自动调整对应的预设阈值，从而可以提高耳机100的智能性和适应性，在一定程度提高用户的使用体验。示例性的自适应校准算法可以包括最小均方误差算法(Least Mean Square，LMS)、递推最小二乘法(Recursive Least  Square，RLS)、迫零算法、最陡下降算法、盲均衡算法等。在一些实施例中，自适应校准算法还可以是其他算法，这在本申请中不受限制。
在一些实施例中，耳机100还可以包括用于指示耳机100的当前工作状态或佩戴状态等的一个或多个指示灯。例如，耳机100可以包括红色和绿色指示灯。绿色指示灯亮起可以表示耳机100当前处于非正常佩戴状态或自由放置状态，其工作模式处于待机状态；反之，红色指示灯亮起可以表示耳机100当前处于正常佩戴状态，其工作模式处于唤醒状态。需要说明的是，以上关于指示灯的颜色仅为举例说明，在一些其他的实施例中，指示灯可以采用其他的颜色代替或同一个指示灯通过显示不同颜色表示耳机100的不同状态。
图7是根据本说明书另一些实施例所示的耳机的电路模块示意图。
在一些实施例中，耳机100还可以包括接触式传感器240。接触式传感器240可以设置在至少一个扬声器组件110的壳体内或如图3所示的耳机仓130内。接触式传感器240可以用于识别耳机仓130是否与用户接近或者与用户接触(例如与用户的皮肤接触)。在一些实施例中，耳机100可以包括左右两个耳机仓130。为了提高佩戴检测的准确性，左右两个耳机仓130中可以分别设置一个接触式传感器240。通过两个接触式传感器240检测的接触信号共同判断耳机仓130是否与用户接近或接触。例如，只有当左右两个接触式传感器240检测到用户接近或接触用户时，处理电路220才判断耳机仓130与用户接近或接触。在一些实施例中，接触式传感器240可以包括电容式接近传感器、压力传感器(例如，薄膜压力传感器)、红外传感器、激光传感器等中的一种或多种。需要知道的是，不同类型的接触式传感器可以采用不同的工作原理，其判断对应部件是否与用户接触的参数可以不同。例如，对于压力传感器，当检测到的压力大于压力阈值时，可以判断对应部件与用户接触；而当检测到的压力小于压力阈值时，则判断对应部件与用户不接触。再例如，对于红外传感器，当检测到的距离大于距离阈值时，可以判断对应部件与用户接触；而当检测到的距离小于距离阈值时，则判断对应部件与用户不接触。
处理电路220可以基于弯曲传感器210采集的弯曲信号和接触式传感器240采集的接触信号，判断耳机100的当前放置状态。更多关于结合弯曲传感器的弯曲信号和接触传感器240的接触信号判断耳机100的放置状态可以参见本说明书图8A-8C及图9A-9C的描述，此处不再赘述。
在一些实施例中，为了降低耳机100和/或接触式传感器240所产生的功耗，可以使接触式传感器240默认处于睡眠状态，当弯曲传感器210所采集的弯曲信号指示连接件120的等效曲率半径大于或等于预设阈值时，处理设备220可以控制接触式传感器240采集接触信号。在一些实施例中，为了降低耳机100和/或接触式传感器240所产生的功耗，还可以使处理电路220只有在弯曲传感器210所采集的弯曲信号指示连接件120的等效曲率半径大于或等于预设阈值时，才接收接触式传感器240的接触信号以进行处理。预设阈值可以大于耳机100自由放置时的等效曲率半径。
在一些实施例中，耳机100可以不包括连接件120，此时，耳机100可以是开放式耳机、智能眼镜、单耳耳挂式耳机、单耳入耳式耳机(例如，真无线蓝牙耳机)等中的一种或多种。在这种情况下，耳机100可以不包括弯曲传感器210，而包括至少两个其他类型的传感器(例如，两种接触式传感器)。处理电路220可以基于至少两个其他类型的传感器所检测到的信号协同判断耳机100是否处于正常佩戴状态。仅作为示例，耳机100可以包括第一接触式传感器和第二接触式传感器。第一接触式传感器与第二接触式传感器的类别可以相同或不同。例如，第一接触式传感器可以为红外传感器，第二接触式传感器可以为薄膜压力传感器。在一些实施例中，第一接触式传感器和第二接触式传感器可以设置在耳机100的任何合适的位置。例如，第一接触式传感器和第二接触式 传感器可以同时设置在同一个扬声器组件110的壳体中或分别设置在两个扬声器组件110的壳体中。又例如，对于智能眼镜，第一接触式传感器和第二接触式传感器可以同时设置在一个镜腿中或分别设置在两个镜腿中。又例如，对于智能眼镜，第一接触式传感器可以设置在镜腿上，第二接触式传感器可以设置在鼻托上。处理电路220可以直接基于第一接触式传感器和第二接触式传感器采集的接触信号，判断耳机100是否处于正常佩戴状态。例如，只有当第一接触式传感器和第二接触式传感器同时检测到用户接近或接触用户时，处理电路220才判断耳机100处于正常佩戴状态。
在一些实施例中，耳机100可以包括接触式传感器和方向传感器(例如，陀螺仪)。例如，对应单耳耳挂式耳机，接触式传感器可以设置在正常佩戴时靠近耳廓顶端的位置。当接触式传感器检测到用户接近或接触用户，且方向传感器指示耳机竖直放置时，处理电路220才判断耳机100处于正常佩戴状态。
图8A是根据本说明书一些实施例所示的示例性耳机处于自由放置状态的示意图。图8B是根据本说明书一些实施例所示的示例性耳机处于正常佩戴状态的示意图。图8C是根据本说明书一些实施例所示的示例性耳机处于非正常佩戴状态的示意图。
在一些实施例中，参照图8A-8C，接触式传感器240可以设置在耳机仓130内侧(即耳机100处于正常佩戴状态时靠近人体皮肤的一侧)。当耳机100处于自由放置状态时(如图8A所示)，连接件120的等效曲率半径为R0。当耳机100处于正常佩戴状态时(如图8B所示)，由于头部的支撑作用，连接件120的等效曲率半径增大为R1，即R1>R0。此时，耳机仓130与用户头部不接触。当耳机100处于非正常佩戴状态时(例如，用户将耳机100悬挂于颈部)时(如图8C所示)，由于颈部的支撑作用，连接件120的等效曲率半径增大为R2，即R2>R0。由于颈部尺寸小于头部尺寸，因此，R1>R2>R0。此时，耳机仓130与用户的颈部接触(或者靠近用户的颈部)。基于此，在一些实施例中，可以根据弯曲传感器210生成的弯曲信号确定出连接件120的当前等效曲率半径，以及接触式传感器240所检测到的耳机仓130与用户的接触状态，共同判断出耳机100的当前放置状态。
仅作为示例，当弯曲传感器210检测到的弯曲信号为指示连接件120(或后挂组件122)的等效曲率半径大于或等于预设阈值的第一弯曲信号时，弯曲传感器210的输出可以为1(即输出为高电平)，反之，当弯曲传感器210检测到的弯曲信号为指示连接件120的等效曲率半径小于预设阈值的第二弯曲信号时，弯曲传感器210的输出可以为0(即输出为低电平)。类似地，当接触式传感器240检测到的接触信号为指示耳机仓130与用户不接触(或者与用户的距离大于预设距离阈值)的第一接触信号时，接触式传感器240的输出可以为1(即输出为高电平)，反之，当接触式传感器240检测到的接触信号指示耳机仓130与用户接触(或者与用户的距离小于预设距离阈值)的第二接触信号时，接触式传感器240的输出可以为0(即输出为低电平)。
需要说明的是，在本说明书的一些实施例中，当耳机100包括设置在不同位置的多个弯曲传感器210时，可以根据多个弯曲传感器210检测的弯曲信号共同确定一个总弯曲信号。例如，当设置在如图1所示的位置A、位置B和位置C处的弯曲传感器210检测到的弯曲信号均指示连接件120(或后挂组件122)的等效曲率半径大于或等于预设阈值时，多个弯曲传感器210输出的总弯曲信号可以确定为第一弯曲信号(即，其值为1)。又例如，当设置在位置B处的弯曲传感器210检测到的弯曲信号指示连接件120(或后挂组件122)的等效曲率半径大于或等于预设阈值，但位置A和位置C处的弯曲传感器210检测到的弯曲信号指示连接件120(或后挂组件122)的等效曲率半径等于耳机100自由放置时的等效曲率半径时，表示位置B处可能由于误碰而产生弯曲形变，此时，多个弯曲传感器210的总弯曲信号可以确定为第二弯曲信号(即，其值为0)。
进一步地，处理电路220可以根据弯曲传感器210的输出和接触式传感器240的输出判断耳机100是否处于正常佩戴状态，从而根据耳机100是否处于正常佩戴状态发出指令给控制电路230。控制电路230可以基于接收到的控制指令对耳机100的工作状态进行控制。在一些实施例中，参照表1，只有当弯曲信号为第一弯曲信号(即，其值为1)且接触信号为第一接触信号(即，其值为1)时，处理电路220的输出可以为1，即表示判断耳机100处于正常佩戴状态。当弯曲传感器210和接触式传感器240中任意一者的输出为0时，处理电路220的输出可以皆为0，即表示判断耳机100处于非正常佩戴状态或自由放置状态。进一步地，控制电路230可以基于处理电路220的输出，控制耳机100的一个或多个组件的工作状态。例如，当处理电路220的总输出为1时，控制电路230可以控制耳机100进入唤醒状态；当处理电路220的总输出为0时，控制电路230可以控制耳机100保持待机状态。
表1接触式传感器置于耳机仓内时耳机放置状态的检测方案
弯曲传感器 接触式传感器 总输出
1 1 1
1 0 0
0 1 0
0 0 0
需要说明的是，表1所示的输出信号仅为示例性说明，在一些实施例中，可以采用其他的方式对弯曲传感器210检测的弯曲信号、接触传感器240检测接触信号以及耳机100的总输出信号进行表示。例如，在一些实施例中，当接触式传感器240检测到的接触信号为前述第一接触信号时，其输出也可以用0表示(即输出为低电平)，反之，当接触式传感器240检测到的接触信号为前述第二接触信号时，其输出可以用1表示
(即输出为高电平)。
图9A是根据本说明书一些实施例所示的示例性耳机处于自由放置状态的示意图。图9B是根据本说明书一些实施例所示的示例性耳机处于正常佩戴状态的示意图。图9C是根据本说明书一些实施例所示的示例性耳机处于非正常佩戴状态的示意图。
在一些实施例中，参照图9A-9C，接触式传感器240还可以设置在至少一个扬声器组件110的壳体内部(例如，耳机100处于正常佩戴状态时靠近人体皮肤的一侧)，以用于识别扬声器组件110是否与用户接触(或者与用户接近)。与图8A-8C不同的是，当接触式传感器240检测到的接触信号为指示扬声器组件110与用户不接触(或者与用户的距离大于预设距离阈值)的第一接触信号时，接触式传感器240的输出可以为1(即输出为高电平)，反之，当接触式传感器240检测到的接触信号指示扬声器组件110与用户接触(或者与用户的距离小于预设距离阈值)的第二接触信号时，接触式传感器240的输出可以为0(即输出为低电平)。
在一些实施例中，参照表2所示，当接触式传感器240设置在扬声器组件110的壳体内部时，只有当弯曲传感器210检测到的弯曲信号为前述第一弯曲信号(即，其值为1)，且接触式传感器240检测到的信号为第二接触信号(即，其值为0)时，处理电路220的输出为1，即判断耳机100处于正常佩戴状态。当弯曲传感器210检测到的弯曲信号为前述第二弯曲信号(即，其值为0)，和/或接触式传感器240检测到的信号为指示扬声器组件110与用户不接触(或者与用户距离大于预设距离阈值)的第一接触信号(即，其值为1)时，处理电路220的输出可以皆为0，即表示判断耳机100处于非正常佩戴状态或自由放置状态。进一步地，控制电路230可以基于处理电路220的输出，控制耳机100的一个或多个组件的工作状态。例如，当处理电路220的总输出为1时，控制电路230可以控制耳机100进入唤醒状态；当处理电路220的总输出为0时，控制电路230可以控制耳机100保持待机状态。
表2接触式传感器置于扬声器组件壳体内时耳机放置状态的检测方案
弯曲传感器 接触式传感器 总输出
1 0 1
1 1 0
0 1 0
0 0 0
同上，需要说明的是，表2所示的输出信号也仅为示例性说明，在一些实施例中，同样可以采用其他的方式对弯曲传感器210检测的弯曲信号、接触传感器240检测接触信号以及耳机100的总输出信号进行表示。例如，在一些实施例中，当接触式传感器240检测到的接触信号为前述第一接触信号时，其输出也可以用0表示(即输出为低电平)，当接触式传感器240检测到的接触信号为前述第二接触信号时，其输出也可以用1表示(即输出为高电平)。
本申说明书实施例可能带来的有益效果包括但不限于：(1)通过弯曲传感器检测扬声器组件之间的连接件的弯曲状态，进而分析耳机的当前使用状态，可以实现耳机佩戴状态的准确识别以及耳机工作状态的准确控制；(2)通过接触式传感器和弯曲传感器共同确定耳机的当前佩戴状态，可以进一步提高耳机佩戴状态识别的准确性以及耳机工作状态控制的准确性。需要说明的是，不同实施例可能产生的有益效果不同，在不同的实施例里，可能产生的有益效果可以是以上任意一种或几种的组合，也可以是其他任何可能获得的有益效果。
上文已对基本概念做了描述，显然，对于本领域技术人员来说，上述详细披露仅仅作为示例，而并不构成对本说明书的限定。虽然此处并没有明确说明，本领域技术人员可能会对本说明书进行各种修改、改进和修正。该类修改、改进和修正在本说明书中被建议，所以该类修改、改进、修正仍属于本说明书示范实施例的精神和范围。

Claims (18)

  1. 一种耳机，包括：
    两个扬声器组件；
    连接件，用于连接所述两个扬声器组件，所述连接件通过弯曲形变提供将所述两个扬声器组件固定在用户头部的夹紧力，所述连接件包括具有容置腔的外壳，其中，
    所述容置腔中设置有弯曲传感器，所述弯曲传感器用于基于所述连接件的弯曲状态生成弯曲信号；以及
    处理电路，用于基于所述弯曲信号，判断所述耳机的放置状态，所述放置状态包括正常佩戴状态、非正常佩戴状态或自由放置状态中的一种。
  2. 根据权利要求1所述的耳机，所述连接件包括两个耳挂组件和后挂组件，所述两个扬声器组件分别通过所述两个耳挂组件连接到所述后挂组件，所述弯曲传感器位于所述后挂组件形成的所述容置腔中。
  3. 根据权利要求2所述的耳机，其中，所述弯曲传感器的敏感方向与所述后挂组件的弯曲方向一致。
  4. 根据权利要求2或3所述的耳机，其中，所述弯曲传感器设置在所述后挂组件的对称面与所述后挂组件相交的位置。
  5. 根据权利要求2至4中任一项所述的耳机，其中，所述后挂组件还包括骨架结构，所述弯曲传感器与所述骨架结构贴合设置，所述骨架结构在所述后挂组件的弯曲方向上的刚度大于所述弯曲传感器在所述后挂组件的弯曲方向上的刚度。
  6. 根据权利要求2至5中任一项所述的耳机，其中，所述弯曲信号反映所述后挂组件的等效曲率半径。
  7. 根据权利要求6所述的耳机，其中，
    当所述弯曲信号指示所述后挂组件的等效曲率半径大于所述耳机自由放置时的等效曲率半径但小于预设阈值时，所述处理电路判断所述耳机处于所述非正常佩戴状态；或
    当所述弯曲信号指示所述后挂组件的等效曲率半径大于所述耳机自由放置时的等效曲率半径且大于所述预设阈值时，所述处理电路判断所述耳机处于所述正常佩戴状态。
  8. 根据权利要求7所述的耳机，其中，所述耳机还包括：
    阈值调节组件，被配置为调节所述预设阈值。
  9. 根据权利要求8所述的耳机，其中，所述阈值调节组件进一步用于接收用户正常佩戴所述耳机时的确认指令，
    所述处理电路进一步用于：
    基于所述确认指令，确定所述用户进行正常佩戴时所述耳机的目标等效曲率半 径；以及
    基于自适应校准算法以及目标等效曲率半径，对所述预设阈值进行调整。
  10. 根据权利要求6所述的耳机，其中，所述两个耳挂组件中至少一个耳挂组件包括耳机仓，所述耳机还包括：
    接触式传感器，设置于所述耳机仓内，用于识别所述耳机仓是否与所述用户接触，
    所述处理电路还用于基于所述弯曲传感器的所述弯曲信号和所述接触式传感器的接触信号，判断所述耳机的所述放置状态。
  11. 根据权利要求10所述的耳机，所述耳机包括一个或多个电子组件，其中，所述处理电路还用于根据所述耳机的所述放置状态，调整所述一个或多个电子组件的工作状态，包括：
    当所述耳机处于所述正常佩戴状态时，控制所述一个或多个电子组件处于唤醒状态；
    当所述耳机处于所述非正常佩戴状态或所述自由放置状态时，控制所述一个或多个电子组件处于低功耗工作状态。
  12. 根据权利要求10所述的耳机，其中，当所述弯曲信号为第一弯曲信号且所述接触信号为第一接触信号时，所述处理电路判断所述耳机处于所述正常佩戴状态，其中，所述第一弯曲信号指示所述后挂组件的等效曲率半径大于预设阈值，所述预设阈值大于所述耳机自由放置时的等效曲率半径，所述第一接触信号指示所述耳机仓与所述用户不接触。
  13. 根据权利要求10所述的耳机，其中，当所述弯曲信号为第一弯曲信号且所述接触信号为第二接触信号时，所述处理电路判断所述耳机处于所述非正常佩戴状态，其中，所述第一弯曲信号指示所述连接件的等效曲率半径大于预设阈值，所述预设阈值大于所述耳机自由放置时的等效曲率半径，所述第二接触信号指示所述耳机仓与所述用户接触。
  14. 根据权利要求6所述的耳机，其中，所述耳机还包括：
    接触式传感器，所述接触式传感器设置于所述两个扬声器组件中至少一个扬声器组件的壳体内，用于识别所述扬声器组件是否与所述用户接触。
  15. 根据权利要求14所述的耳机，其中，当所述弯曲信号为第一弯曲信号且所述接触信号为第二接触信号时，所述处理电路判断所述耳机处于所述正常佩戴状态，其中，所述第一弯曲信号指示所述连接件的等效曲率半径大于预设阈值，所述预设阈值大于所述耳机自由放置时的等效曲率半径，所述第二接触信号指示所述扬声器组件与所述用户接触。
  16. 根据权利要求14所述的耳机，其中，当所述弯曲信号为第一弯曲信号且所述接触信号为第一接触信号时，所述处理电路判断所述耳机处于所述非正常佩戴状态，其中，所述第一弯曲信号指示所述连接件的等效曲率半径大于预设阈值，所述 预设阈值大于所述耳机自由放置时的等效曲率半径，所述第一接触信号指示所述扬声器组件与所述用户不接触。
  17. 根据权利要求10至16中任一项所述的耳机，其中，所述接触式传感器包括电容式接近传感器、薄膜压力传感器、红外传感器中的至少一种。
  18. 根据权利要求6至17中任一项所述的耳机，其中，为了确定所述后挂组件的所述等效曲率半径，所述处理电路还用于：
    基于不同佩戴场景下的测试数据，生成所述弯曲信号与所述后挂组件的等效曲率半径之间的映射关系；以及
    基于所述弯曲信号以及所述映射关系，确定所述后挂组件的所述等效曲率半径。
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