WO2024098790A1 - 一种电子组件及电子设备 - Google Patents

一种电子组件及电子设备 Download PDF

Info

Publication number
WO2024098790A1
WO2024098790A1 PCT/CN2023/103650 CN2023103650W WO2024098790A1 WO 2024098790 A1 WO2024098790 A1 WO 2024098790A1 CN 2023103650 W CN2023103650 W CN 2023103650W WO 2024098790 A1 WO2024098790 A1 WO 2024098790A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
module
liquid cooling
heat dissipation
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2023/103650
Other languages
English (en)
French (fr)
Inventor
李定方
李敏
余飞
白璐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Priority to EP23887486.1A priority Critical patent/EP4601426A4/en
Publication of WO2024098790A1 publication Critical patent/WO2024098790A1/zh
Priority to US19/203,478 priority patent/US20250275096A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/2049—Pressing means used to urge contact, e.g. springs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source

Definitions

  • the present application relates to the field of heat dissipation technology, and in particular to an electronic component and an electronic device.
  • Liquid cooling heat dissipation modules generally include a temperature plate and a cold plate. Due to the high power consumption of the main chip, it must be in close contact with the liquid cooling heat dissipation module when dissipating heat.
  • the circuit board is fixed and the cold plate used to dissipate heat for the main chip is floated, so that the cold plate is in close contact with the chip, while the remaining low-power devices on the circuit board dissipate heat by contacting the temperature plate.
  • a large number of connecting pipes need to be laid, which takes up more installation space and leads to a decrease in integration.
  • the embodiments of the present application provide an electronic component and an electronic device to solve the problem of low integration in the above-mentioned prior art.
  • a first aspect of an embodiment of the present application provides an electronic component, including a liquid-cooled heat dissipation module and a plurality of floating modules, wherein the plurality of floating modules are installed on the liquid-cooled heat dissipation module at intervals, the floating module includes a circuit board, a chip and an elastic connector, the chip is arranged on one side of the circuit board, and the circuit board is connected to the liquid-cooled heat dissipation module through the elastic connector, wherein the elastic connector is used to press the circuit board against the liquid-cooled heat dissipation module so that the chip abuts against the liquid-cooled heat dissipation module.
  • the circuit board in the floating module is connected to the liquid cooling module through an elastic connector.
  • the circuit board Under the action of the elastic connector, the circuit board can float in the direction of the liquid cooling module, thereby ensuring that the chip can fit tightly with the liquid cooling module. Since multiple floating modules are independent of each other and are arranged at intervals on the liquid cooling module, the floating of two adjacent floating modules will not interfere with each other.
  • the elastic connector can apply elastic force according to the distance between the chip on the floating module to which it belongs and the liquid cooling module, ensuring that the chip on each floating module can fit tightly with the liquid cooling module, thereby ensuring the heat dissipation reliability of each chip in the electronic component.
  • the liquid cooling module does not need to float and is an integrated liquid cooling structure, there is no need to set up a large number of connecting pipes, which reduces the structural complexity of the liquid cooling module, saves installation space, is conducive to the miniaturization design of electronic components, and improves the system integration of electronic equipment.
  • a plurality of the floating modules are installed on opposite sides of the liquid-cooling heat dissipation module.
  • multiple floating modules are installed on opposite sides of the liquid-cooled heat dissipation module, that is, multiple floating modules are simultaneously installed on the first mounting surface and the second mounting surface of the liquid-cooled heat dissipation module, so that more floating modules can be installed, that is, multiple high-power consumption chips can be cooled at the same time, thereby increasing the number of floating modules in the electronic components, so that the electronic equipment can have more high-power consumption chips, improving the performance of the electronic equipment, and due to the double-sided heat dissipation function of the liquid-cooled heat dissipation module, the number of liquid-cooled heat dissipation modules in the electronic equipment is reduced, further improving the system integration of the electronic equipment.
  • the elastic connecting member includes a connecting member and an elastic member, the connecting member is passed through the elastic member, a mounting hole is provided on the circuit board, the connecting member passes through the mounting hole and is connected to the liquid cooling heat dissipation module, one end of the elastic member abuts against the connecting member, and the other end abuts against the circuit board to press the chip on the circuit board against the liquid cooling heat dissipation module.
  • the connector can pass through the mounting hole on the circuit board to connect with the liquid cooling module, which can limit the displacement of the floating module on the liquid cooling module, avoid interference between multiple floating modules, and improve the structural stability of the electronic component.
  • the elastic member is arranged between the connector and the circuit board, and can compress the elastic member during the process of tightening the connector, so that the circuit board can drive the chip to float to one side of the liquid cooling module under the elastic force of the elastic member, thereby ensuring effective contact between the chip and the liquid cooling module, and improving the heat dissipation reliability of each chip in the electronic component.
  • the elastic member is a spring or a spring.
  • the spring or the spring sheet has the advantages of simple structure, easy manufacturing and low cost.
  • the elastic member is a spring or a spring sheet
  • the elastic effect of the elastic connecting member can be guaranteed, so that the floating module can float relative to the liquid cooling module, which is convenient for realizing its floating function, improves the reliability of the elastic connecting member, reduces the structural complexity of the elastic connecting member, and saves costs.
  • the floating module also includes a first reinforcement frame and a second reinforcement frame, the first reinforcement frame is connected to one side of the circuit board and surrounds the chip, the second reinforcement frame is correspondingly arranged on the other side of the circuit board, and the first reinforcement frame and the second reinforcement frame are provided with through holes corresponding to the positions of the mounting holes, and the connecting member passes through the elastic member, the second reinforcement frame, the circuit board and the first reinforcement frame in sequence to be connected to the liquid cooling module.
  • the provision of the first reinforcing frame and the second reinforcing frame improves the strength of the circuit board around the chip
  • the elastic member is located between the second reinforcing frame and the connecting member, so that the elastic force generated by the elastic member first acts on the second reinforcing frame, and then is transmitted to the circuit board through the second reinforcing frame, so that the force on the circuit board is more uniform, and it can avoid the circuit board from being deformed due to excessive stress concentration at the elastic connecting member, causing a gap between the chip and the liquid cooling module, affecting the heat dissipation effect of the chip, and can also prevent the circuit board from being deformed and damaged due to long-term pressure, thereby improving the service life of the circuit board.
  • the floating module further includes a first heat pipe, which is disposed on two opposite sides of the circuit board, and at least a portion of the first heat pipe extends out of an edge of the circuit board and is connected to the liquid-cooling heat dissipation module.
  • the first heat pipe is arranged on opposite sides of the circuit board, and can be connected to the remaining low-power heating devices on the circuit board except for the high-power chip, so that the low-power heating devices on the circuit board can be cooled, and the first heat pipe is connected to the liquid cooling heat dissipation module, and can transfer the heat of the low-power heating device to the liquid cooling heat dissipation module, thereby improving its heat dissipation efficiency.
  • the low-power heating device on the circuit board is not directly in contact with the liquid cooling heat dissipation module for heat dissipation, there is no need to consider the gap and tolerance between the low-power heating device and the liquid cooling heat dissipation module, which reduces the difficulty of heat dissipation of the low-power heating device on the circuit board while ensuring the heat dissipation reliability of the low-power heating device on the circuit board.
  • the first heat pipe includes a first section, a bending section, and a second section connected in sequence, the first section is connected to the circuit board, and the second section is connected to the liquid cooling module.
  • the first section of the first heat pipe is connected to the circuit board, and can absorb the heat of the low-power heating device on the circuit board.
  • the second section is connected to the liquid-cooled heat dissipation module, so that the absorbed heat can be transferred to the liquid-cooled heat dissipation module to improve its heat dissipation efficiency.
  • the setting of the bending section can make the second sections of the first heat pipes arranged on the opposite sides of the circuit board approximately at the same height, so as to reduce the height difference between the second sections of the first heat pipes on both sides, and the first heat pipes may also produce assembly tolerances in the height direction after assembly, and a height difference is generated between the second sections of multiple first heat pipes.
  • the bending section can produce micro-deformation, thereby further absorbing the tolerance of the first heat pipe after assembly, so that the second section can fit more closely with the liquid-cooled heat dissipation module, and improve the thermal conductivity efficiency.
  • the floating module also includes a fixing plate, which includes a main body and a connecting plate, the connecting plate is connected to the liquid-cooled heat dissipation module, and at least a portion of the second section is arranged between the main body and the liquid-cooled heat dissipation module.
  • the fixing plate is fixed to the liquid cooling module through the connecting plate, so that the second section can be pressed against the liquid cooling module through the body, further reducing the height difference between the second sections after the first heat pipes are assembled, reducing the gap between the second section and the liquid cooling module, and increasing the contact area between the second section and the liquid cooling module, thereby further improving the heat conduction efficiency.
  • it can also prevent the floating module from rotating or displacing relative to the liquid cooling module, thereby improving the structural stability of the electronic assembly.
  • a fixing hole is provided on the connecting plate, and the connecting plate is connected to the liquid cooling module through the cooperation of the fixing hole.
  • connection piece is fixed to the cooling module through the fixing hole, which can facilitate the disassembly of the floating module, the replacement, increase or reduction of the floating module, improve the user experience and save costs.
  • the fixing hole is a large circular hole or a slotted hole.
  • the fixing hole is a large circular hole or a slot-shaped hole, so that the fixing plate can be moved and adjusted relative to the second section on the cooling and heat dissipation module to reduce the assembly tolerance along the width and length directions of the circuit board that may be generated after the first heat pipe is assembled, thereby increasing the coverage area of the fixing plate body to the second section, so as to increase the area of the body pressing the second section, ensure the effective contact area between the second section and the cooling and heat dissipation module, and avoid the reduction of the coverage area of the body to the second section due to the assembly tolerance, thereby reducing the contact area between the second section and the cooling and heat dissipation module, thereby reducing the thermal conductivity of the first heat pipe.
  • the tolerance of the fixing hole it can also ensure that the first heat pipe will not get stuck during the assembly process, resulting in unbalanced force, and improve the structural stability of the electronic assembly.
  • the main body is provided with a recessed portion, and at least a portion of the second section is disposed in the recessed portion.
  • the recessed portion can limit the relative displacement between the second section and the body, preventing the body from rotating relative to the second section under the action of external force, causing the body to press the area of the second section, thereby improving the fixing effect of the fixing plate.
  • the floating module further includes an elastic compression plate, both ends of which are connected to the liquid-cooled heat dissipation module, and at least a portion of the second section is disposed between the elastic compression plate and the liquid-cooled heat dissipation module.
  • the elastic pressing plate is elastic, and when its two ends are fixed on the heat dissipation module, the second section can be pressed against the heat dissipation module through the elastic deformation part in the middle, thereby reducing the tolerance of the first heat pipe after assembly and increasing the effective contact area between the second section and the heat dissipation module to ensure the thermal conductivity of the second section, and the elastic pressing plate can fix multiple second sections at the same time to improve assembly efficiency.
  • the elastic pressing plate has a simple structure, is easy to manufacture, and is convenient for mass production, which can further reduce the manufacturing cost of electronic components.
  • the liquid-cooled heat dissipation module includes a first temperature averaging plate and multiple cold plates, the multiple cold plates are arranged at intervals on the first temperature averaging plate, and the multiple cold plates protrude from the first temperature averaging plate, the multiple cold plates correspond to the positions of multiple floating modules, the chip abuts against the cold plate, and the second section is connected to the first temperature averaging plate.
  • the cold plate protrudes from the surface of the first temperature averaging plate, so that when the chip abuts the cold plate, other parts of the circuit board can be out of contact with the first temperature averaging plate, thereby facilitating the arrangement of the first heat pipe and facilitating the low-power heating components on the circuit board to dissipate heat through the first heat pipe.
  • the floating module further includes a second temperature averaging plate, which is fixed to opposite sides of the circuit board, and at least a portion of the first section is disposed between the second temperature averaging plate and the circuit board.
  • the second temperature averaging plate can cover the low-power heating devices on the circuit board, so that the low-power heating devices on the circuit board can be evenly heated, with good temperature averaging performance, preventing the low-power heating devices from overheating, and the first section of the first heat pipe is arranged between the second temperature averaging plate and the circuit board, so that the second temperature averaging plate can transfer the heat of the low-power heating device to the first section, and then to the liquid cooling module. Therefore, the second temperature averaging plate can reduce the number of first heat pipes used, save costs, improve the thermal conductivity of low-power heating devices on the circuit board, reduce the impact of fixing the first heat pipe on the circuit board, and improve the yield of the floating module.
  • the floating module further includes a second heat pipe, a groove is provided on a side of the second temperature equalizing plate facing away from the circuit board, and the second heat pipe is disposed in the groove.
  • the heat absorbed by the second temperature equalizing plate in the structure can be transferred to the second heat pipe to further improve the temperature equalizing effect of the second temperature equalizing plate, thereby effectively preventing the low-power heating components on the circuit board from being overheated, thereby increasing the service life of the circuit board and improving the reliability of the electronic components.
  • the cross-section of the first heat pipe is rectangular or oval
  • the cross-section of the second heat pipe is rectangular or oval
  • the first heat pipe and the second heat pipe when the cross-sections of the first heat pipe and the second heat pipe are rectangular or oblate, can have a relatively flat surface, so as to facilitate the assembly and pressing of the first heat pipe and the second heat pipe, improve the fixing effect of the first heat pipe and the second heat pipe, and also reduce the thickness of the first heat pipe and the second heat pipe, so as to reduce the overall thickness of the electronic components and improve the system integration of the electronic equipment.
  • a second aspect of the present application provides an electronic device, the electronic device comprising a housing and any one of the above embodiments
  • the electronic component is installed in the housing. Since the electronic component has the above technical effects, the electronic device including the electronic component should also have corresponding technical effects, which will not be described in detail here.
  • FIG1 is a schematic structural diagram of a liquid cooling module of an electronic component in the prior art
  • FIG2 is a schematic diagram of the structure of an electronic component provided in the present application in an embodiment
  • FIG3 is a schematic diagram of the structure of the liquid cooling module in FIG2 ;
  • FIG4 is a schematic diagram of the structure of the floating module in FIG2;
  • FIG5 is a schematic structural diagram of the floating module in FIG4 from another perspective
  • FIG6 is a partial enlarged view of point A in FIG2;
  • FIG7 is a partial enlarged view of point B in FIG4;
  • FIG8 is a partial schematic diagram of the electronic component in FIG2 in another embodiment
  • FIG9 is a schematic cross-sectional view of the first heat pipe in FIG2 in an embodiment
  • FIG. 10 is a schematic cross-sectional view of the first heat pipe in FIG. 2 in another embodiment.
  • Reference numerals 1'-temperature balancing plate; 2'- floating cold plate; 3'-connecting pipeline; 1-Liquid cooling module; 11- first temperature equalizing plate; 111- first mounting surface; 112- second mounting surface; 12-cold plate; 2- Floating module; 21- Circuit board; 22-chip; 23- first heat pipe; 231- first paragraph; 232-bending section; 233-Second paragraph; 24- elastic connecting piece; 241-connector; 242- elastic member; 25-fixed plate; 251-body; 251a-depression; 252-connecting piece; 252a-fixing hole; 26-elastic compression sheet; 27- second temperature averaging plate; 271-groove; 28- second heat pipe; 29a-first reinforcement frame; 29b-Second reinforcement frame.
  • the main chip is an important component of the electronic component, which is arranged on a circuit board. Due to the high power consumption of the main chip, it must be in close contact with the liquid cooling heat dissipation module when dissipating heat.
  • the liquid cooling heat dissipation module includes a cold plate and a temperature equalizing plate. The circuit board is fixed, and the cold plate used to dissipate heat for the main chip is floated, so that the cold plate is in close contact with the chip, and the remaining low-power devices on the circuit board are dissipated by contacting with the temperature equalizing plate.
  • Figure 1 shows a structural schematic diagram of a liquid cooling heat dissipation structure of an electronic component in the prior art.
  • the embodiment of the present application provides an electronic component and an electronic device, and the electronic device includes, for example, a computer, a server, a storage, a switch and other electronic devices, which are not limited here.
  • the electronic device includes, for example, a computer, a server, a storage, a switch and other electronic devices, which are not limited here.
  • An embodiment of the present application provides an electronic component, as shown in Figures 2 to 5, the electronic component includes a liquid-cooled heat dissipation module 1 and multiple floating modules 2, the multiple floating modules 2 are installed on the liquid-cooled heat dissipation module 1 at intervals, the floating module 2 includes a circuit board 21, a chip 22 and an elastic connector 24, the chip 22 is arranged on one side of the circuit board 21, and the circuit board 21 is connected to the liquid-cooled heat dissipation module 1 through the elastic connector 24, wherein the elastic connector 24 is used to press the circuit board 21 against the liquid-cooled heat dissipation module 1 so that the chip 22 abuts against the liquid-cooled heat dissipation module 1.
  • the circuit board 21 in the floating module 2 is connected to the liquid cooling module 1 through an elastic connector 24.
  • the circuit board 21 can float toward the liquid cooling module 1, thereby ensuring that the chip 22 can fit closely with the liquid cooling module 1.
  • the elastic connector 24 can apply elastic force according to the distance between the chip 22 on the floating module 2 and the liquid cooling module 1, ensuring that the chip 22 on each floating module 2 can fit closely with the liquid cooling module 1, thereby ensuring the heat dissipation reliability of each chip 22 in the electronic component.
  • liquid cooling module 1 does not need to float and is an integrated liquid cooling structure, it is not necessary to set a large number of connecting pipes, which reduces the structural complexity of the liquid cooling module 1, saves installation space, is conducive to the miniaturization design of electronic components, and improves the system integration of electronic equipment.
  • multiple floating modules 2 will not interfere with each other, and it is also convenient for users to increase, reduce or replace floating modules 2 or circuit boards 21 with chips 22 according to needs to meet the performance requirements of users for electronic equipment. There is no need to replace all floating modules 2 or circuit boards 21 at one time, which saves costs and improves user experience.
  • circuit board 21 in this embodiment can be a printed circuit board (PCB) or other circuit boards without limitation.
  • PCB printed circuit board
  • the liquid-cooled heat dissipation module 1 in the electronic component does not need to float and is an integrated liquid cooling structure, there is no need to set up a large number of connecting pipes. Therefore, the liquid-cooled heat dissipation module 1 in the embodiment of the present application has installation space on both sides of the relative sides, so that the liquid-cooled heat dissipation module 1 can simultaneously have a relative first mounting surface 111 and a second mounting surface 112, that is, the floating module 2 can be installed on the first mounting surface 111 or the second mounting surface 112 to realize the single-sided heat dissipation function of the liquid-cooled heat dissipation module 1, and the floating module 2 can also be installed on the first mounting surface 111 and the second mounting surface 112 at the same time, so as to realize the double-sided heat dissipation function of the liquid-cooled heat dissipation module 1, and no limitation is made here.
  • a plurality of floating modules 2 are installed on two opposite sides of the liquid cooling module 1. side.
  • multiple floating modules 2 are installed on opposite sides of the liquid-cooling heat dissipation module 1, that is, multiple floating modules 2 are simultaneously installed on the first mounting surface 111 and the second mounting surface 112 of the liquid-cooling heat dissipation module 1, so that more floating modules 2 can be installed, that is, multiple high-power chips 22 can be cooled at the same time, thereby increasing the number of floating modules 2 in the electronic component, so that the electronic device can have more high-power chips 22, improving the performance of the electronic device, and due to the double-sided heat dissipation function of the liquid-cooling heat dissipation module 1, the number of liquid-cooling heat dissipation modules 1 in the electronic device is reduced, further improving the system integration of the electronic device.
  • multiple floating modules 2 can be set only on one side of the liquid cooling module 1 to save the cost of the electronic device.
  • the floating modules 2 can continue to be added, and there is no restriction here, so as to improve the performance of the electronic device and meet the user's use needs.
  • the elastic connecting member 24 includes a connecting member 241 and an elastic member 242.
  • the connecting member 241 is inserted into the elastic member 242.
  • a mounting hole is provided on the circuit board 21.
  • the connecting member 241 passes through the mounting hole to be connected to the liquid cooling heat dissipation module 1.
  • One end of the elastic member 242 abuts against the connecting member 241, and the other end abuts against the circuit board 21 to press the chip 22 on the circuit board 21 against the liquid cooling heat dissipation module 1.
  • the connector 241 can pass through the mounting hole on the circuit board 21 to connect with the liquid cooling module 1, and can limit the displacement of the floating module 2 on the liquid cooling module 1, avoid interference between multiple floating modules 2, and improve the structural stability of the electronic component.
  • the elastic member 242 is arranged between the connector 241 and the circuit board 21, and can compress the elastic member 242 during the process of tightening the connector 241, so that the circuit board 21 can drive the chip 22 to float to one side of the liquid cooling module 1 under the elastic force of the elastic member 242, thereby ensuring that the chip 22 can effectively contact with the liquid cooling module 1, and improving the heat dissipation reliability of each chip 22 in the electronic component.
  • the elastic connecting member 24 in this embodiment is not limited to the combination of the connecting member 241 and the elastic member 242, and may also be other floating connection methods that can play a fixing and elastic role, which is not limited here.
  • the elastic member 242 is a spring or a spring.
  • the spring or the spring sheet has the advantages of simple structure, easy manufacturing and low cost.
  • the elastic member 242 is a spring or a spring sheet, the elastic effect of the elastic connecting member 24 can be guaranteed, so that the floating module 2 can float relative to the liquid cooling module 1, which is convenient for realizing its floating function, improves the reliability of the elastic connecting member 24, reduces the structural complexity of the elastic connecting member 24, and saves costs.
  • the elastic member 242 may also be other elastic structures, which is not limited here.
  • the elastic member 242 of the elastic connector 24 is a spring sheet.
  • both ends of the spring sheet have through holes so that the connector 241 can pass through.
  • the middle part of the spring sheet has an elastic deformation part. When the two ends of the spring sheet are pressed, the middle elastic deformation part can be deformed to generate elastic force.
  • the two ends of the spring sheet are pressed, and the middle elastic deformation part is compressed to deform, so that the circuit board 21 can be pressed to one side of the liquid cooling module 1 to float, driving the chip 22 to be in close contact with the liquid cooling module 1.
  • the elastic connector 24 in this structure is composed of a spring sheet and two connectors 241, wherein the elastic deformation portion of the spring sheet can increase the contact area between the spring sheet and the circuit board 21, thereby making the circuit board 21 more evenly stressed, avoiding excessive stress concentration at the elastic connector 24 and causing deformation of the circuit board, thereby causing a gap between the chip 22 and the liquid-cooled heat dissipation module 1, affecting the heat dissipation effect of the chip 22, and can reduce the number of elastic members 242 and improve assembly efficiency.
  • the elastic connector 24 can be provided in multiple numbers, such as two or four, so that the circuit board 21 is subjected to a more uniform force and the pressing effect on the circuit board 21 and the chip 22 is improved, which is not limited here.
  • two elastic connectors 24 are provided, and the two elastic connectors 24 are arranged opposite to each other to further improve the pressing effect on the circuit board 21.
  • the mounting holes on the circuit board 21 can be arranged around the chip 22.
  • the mounting holes on the circuit board 21 are arranged at the four corners close to the chip 22.
  • the elastic connecting member 24 passes through this place to increase the pressure on its center and make the force on the installation place of the chip 22 of the circuit board 21 more uniform, so that the chip 22 can be easier to be pressed against the liquid cooling heat dissipation module 1, further ensuring that the chip 22 can effectively contact the liquid cooling heat dissipation module 1, and can also reduce the demand for the elastic coefficient of the elastic member 242, saving manufacturing costs.
  • the floating module 2 also includes a first reinforcement frame 29a and a second reinforcement frame 29b.
  • the first reinforcement frame 29a is connected to one side of the circuit board 21 and is arranged around the chip 22.
  • the second reinforcement frame 29b is correspondingly arranged on the other side of the circuit board 21.
  • Through holes corresponding to the positions of the mounting holes are arranged on the first reinforcement frame 29a and the second reinforcement frame 29b.
  • the connecting member 241 passes through the elastic member 242, the second reinforcement frame 29b, the circuit board 21 and the first reinforcement frame 29a in sequence to be connected to the liquid cooling module 1.
  • the provision of the first reinforcing frame 29a and the second reinforcing frame 29b improves the strength of the circuit board 21 around the chip 22, and the elastic member 242 is located between the second reinforcing frame 29b and the connecting member 241, so that the elastic force generated by the elastic member 242 first acts on the second reinforcing frame 29b, and then is transmitted to the circuit board 21 through the second reinforcing frame 29b, so that the force on the circuit board 21 is more uniform, and it can avoid the circuit board from being deformed due to excessive stress concentration at the elastic connecting member 24, causing a gap between the chip 22 and the liquid-cooling heat dissipation module 1, affecting the heat dissipation effect of the chip 22, and can also prevent the circuit board 21 from being deformed and damaged due to long-term pressure, thereby improving the service life of the circuit board 21.
  • the size and shape of the first reinforcing frame 29a and the second reinforcing frame 29b can be set according to the actual size and shape of the chip 22, and are not limited here.
  • the floating module 2 also includes a first heat pipe 23, which is arranged on two opposite sides of the circuit board 21, and at least a portion of the first heat pipe 23 extends out of the edge of the circuit board 21 and is connected to the liquid cooling module 1.
  • the first heat pipe 23 is arranged on opposite sides of the circuit board 21, and can be connected to the remaining low-power heating devices on the circuit board 21 except the chip 22 with high power consumption, so that the low-power heating devices on the circuit board 21 can be cooled, and the first heat pipe 23 is connected to the liquid cooling heat dissipation module 1, and can transfer the heat of the low-power heating device to the liquid cooling heat dissipation module, thereby improving its heat dissipation efficiency.
  • there will be a tolerance in the height of the low-power heating device on the circuit board 21, and the gap between it and the liquid cooling heat dissipation module 1 will not be exactly the same.
  • the low-power heating device on the circuit board 21 is not directly in contact with the liquid cooling heat dissipation module 1 for heat dissipation, there is no need to consider the gap and tolerance between the low-power heating device and the liquid cooling heat dissipation module 1, which reduces the difficulty of heat dissipation of the low-power heating device on the circuit board 21, while ensuring the heat dissipation reliability of the low-power heating device on the circuit board 21.
  • the circuit board 21 can float relative to the liquid-cooled heat dissipation module 1.
  • the first heat pipe 23 arranged on the side of the circuit board 21 facing the liquid-cooled heat dissipation module 1 can be pressed between the circuit board 21 and the liquid-cooled heat dissipation module 1, thereby absorbing the tolerance of the low-power heating components on the circuit board 21, making the low-power heating components on the circuit board 21 fit more closely with the first heat pipe 23, thereby improving the heat dissipation reliability.
  • the heat pipe uses the phase change process of the medium evaporating at the hot end and condensing at the cold end to conduct heat quickly.
  • the heat pipe is composed of a tube shell, a liquid wick and an end cap.
  • the inside of the heat pipe is pumped into a negative pressure state and filled with a suitable liquid.
  • This liquid has a low boiling point and is easy to volatilize.
  • the tube wall has a liquid wick, which is made of capillary porous material.
  • One end of the heat pipe is the evaporation end, and the other end is the condensation end.
  • the liquid in the capillary tube is rapidly vaporized, and the vapor flows to the other end under the power of heat diffusion, and condenses at the cold end to release heat.
  • the liquid then flows back to the evaporation end along the porous material by capillary action, and the cycle continues until the temperature at both ends of the heat pipe is equal. This cycle is carried out quickly, and heat can be conducted continuously.
  • the first heat pipe 23 and the second heat pipe 28 in this application both work on this principle.
  • the first heat pipe 23 includes a first section 231 , a bending section 232 , and a second section 233 connected in sequence, the first section 231 is connected to the circuit board 21 , and the second section 233 is connected to the liquid cooling module 1 .
  • the first section 231 of the first heat pipe 23 is connected to the circuit board 21, and can absorb the heat of the low-power heating device on the circuit board 21.
  • the second section 233 is connected to the liquid cooling heat dissipation module 1, so that the absorbed heat can be transferred to the liquid cooling heat dissipation module 1, thereby improving its heat dissipation efficiency.
  • the setting of the bending section 232 can make the second sections 233 of the first heat pipe 23 arranged on the opposite sides of the circuit board 21 be roughly at the same height, so as to reduce the height difference between the second sections 233 of the first heat pipes 23 on both sides, and the first heat pipe 23 may also produce an assembly tolerance in the height direction after assembly, and a height difference is generated between the second sections 233 of multiple first heat pipes 23.
  • the bending section 232 can produce a micro deformation, thereby further absorbing the tolerance of the first heat pipe 23 after assembly, so that the second section 233 can be more closely fitted with the liquid cooling heat dissipation module 1, thereby improving the heat conduction efficiency.
  • the bending shape and size of the bending section 232 can be set according to the actual structure of the electronic component.
  • the bending shapes and sizes of the bending sections 232 of the first heat pipe 23 on the opposite sides of the circuit board 21 may be different, and it is sufficient to ensure that the second sections 233 of the first heat pipe 23 arranged on the opposite sides of the circuit board 21 are approximately at the same height.
  • first end 231 may be fixed to the circuit board 21 by welding. Of course, it may also be fixed to the circuit board by other methods, which are not limited here.
  • first heat pipes 23 may be provided, and they may be provided according to the size, range, and number of the low-power heating devices on the circuit board 21.
  • the number of first heat pipes 23 may be two, four, six, eight, etc., and the number of first heat pipes 23 on both sides of the circuit board 21 may be the same or different, as long as the heat dissipation effect of the low-power heating devices on the circuit board 21 can be guaranteed, and no limitation is made here.
  • the number of first heat pipes 23 is eight, which are evenly provided on both sides of the circuit board 21, and four first heat pipes are provided on each side to improve the heat dissipation efficiency of the low-power heating devices on the circuit board 21.
  • the floating module 2 also includes a fixing plate 25, the fixing plate 25 includes a main body 251 and a connecting plate 252, the connecting plate 252 is connected to the liquid cooling heat dissipation module 1, and at least a portion of the second section 233 is arranged between the main body 251 and the liquid cooling heat dissipation module 1.
  • the fixing sheet 25 is fixed to the liquid cooling heat dissipation module 1 through the connecting sheet 252, so that the second section 233 can be pressed against the liquid cooling heat dissipation module 1 through the body 251, further reducing the height difference between the plurality of second sections 233 after the assembly of the plurality of first heat pipes 23, reducing the gap between the second section 233 and the liquid cooling heat dissipation module 1, and increasing the contact area between the second section 233 and the liquid cooling heat dissipation module 1, thereby further improving the heat conduction efficiency.
  • it can also prevent the floating module 2 from rotating or displacing relative to the liquid cooling heat dissipation module 1, thereby improving the structural stability of the electronic components.
  • the connecting piece 252 may be connected to the liquid cooling module 1 by welding, riveting, clamping, fastener connection, etc., which is not limited here.
  • the number of the fixing plates 25 can be set to be multiple, and the number of the fixing plates 25 matches the number of the first heat pipes 23, which is not limited here.
  • a fixing hole 252 a is provided on the connecting piece 252 , and the connecting piece 252 is connected to the liquid cooling module 1 through the fixing hole 252 a , and the fixing hole 252 a is a large circular hole or a slotted hole.
  • the connecting piece 252 is fixed to the heat dissipation module 1 through the fixing hole 252a, which can facilitate the disassembly of the floating module 2, the replacement, increase or reduction of the floating module 2, improve the user experience, and save costs.
  • the fixing hole 252a can be used in conjunction with fasteners such as screws, and no limitation is made here.
  • the fixing hole 252 a is a large circular hole or a slot-shaped hole.
  • assembly tolerances may also be generated along the width and length directions of the circuit board 21. That is, the lengths of the first heat pipes 23 extending along the edge of the circuit board 21 after the first heat pipe 23 may be different, making the edges of the second section 233 along the width and length directions of the circuit board 21 unevenly arranged.
  • the fixing hole 252a is a large circular hole or a slot-shaped hole, so that the fixing plate 25 can be moved and adjusted relative to the second section 233 on the cooling and heat dissipation module 1, so as to reduce the assembly tolerance along the width direction and the length direction of the circuit board 21 that may be generated after the first heat pipe 23 is assembled, thereby increasing the coverage area of the body 251 of the fixing plate 25 on the second section 233, so as to increase the area of the body 251 pressing the second section 233, ensure the effective contact area between the second section 233 and the cooling and heat dissipation module 1, and avoid the reduction of the coverage area of the body 251 on the second section 233 due to the assembly tolerance, thereby reducing the contact area between the second section 233 and the cooling and heat dissipation module 1, thereby reducing the heat conduction efficiency of the first heat pipe 23.
  • the tolerance of the fixing hole 252a it can also be ensured that the first heat pipe 23 will not be ensured that the first heat pipe 23 will not be ensured that the
  • the fixing hole 252a may also be a strip-shaped hole, etc., which is not limited here.
  • the body 251 is provided with a recessed portion 251 a , and at least a portion of the second section 233 is disposed in the recessed portion 251 a .
  • the recessed portion 251a can limit the relative displacement between the second section 233 and the main body 251, preventing the main body 251 from rotating relative to the second section 233 under the action of external force, causing the main body 251 to press the area of the second section 233, thereby improving the fixing effect of the fixing plate 25.
  • the fixing plate 25 when the main body 251 has a recessed portion 251a, the fixing plate 25 only has one connecting plate 252 to compress and fix the second section 233, thereby reducing the volume of the fixing plate 25, so that multiple second sections 233 can be compressed and fixed by the fixing plate 25 even when they are arranged relatively closely.
  • connecting pieces 252 may be provided on both sides of the body 251 to further improve the connection between the second section and the 233 fixed effect.
  • the main body 251 may be provided with a plurality of recessed portions 251a so that the main body 251 can simultaneously press a plurality of second sections 233, thereby facilitating simultaneous fixation of a plurality of closely arranged second sections 233, and also reducing the use of fixing plates 25, thereby improving assembly efficiency, which is not limited here.
  • the floating module 2 further includes an elastic compression sheet 26 , both ends of which are connected to the liquid cooling module 1 , and at least a portion of the second section 233 is disposed between the elastic compression sheet 26 and the liquid cooling module 1 .
  • the elastic clamping sheet 26 is elastic.
  • the second section 233 can be pressed against the heat dissipation module 1 through the elastic deformation portion in the middle, thereby reducing the tolerance of the first heat pipe 23 after assembly and increasing the effective contact area between the second section 233 and the heat dissipation module 1 to ensure the thermal conductivity of the second section 233.
  • the elastic clamping sheet 26 can fix multiple second sections 233 at the same time to improve assembly efficiency.
  • the elastic clamping sheet 26 has a simple structure, is easy to manufacture, and is convenient for mass production, which can further reduce the manufacturing cost of electronic components.
  • the length and size of the elastic compression piece 26 can be set according to the actual distribution and size of the first heat pipe 23 so that the elastic compression piece 26 can fix at least one second section 233, and there is no limitation here.
  • large round holes, slotted holes, strip holes and the like may be provided at both ends of the elastic clamping sheet 26 so that the elastic clamping sheet 26 can adjust its position relative to the second section 233 to further absorb the tolerance after the first heat pipe 23 is assembled, which is not limited here.
  • the second section 233 can also be fixed or pressed to the cooling module 1 by other structures or methods, which is not limited here.
  • the liquid cooling heat dissipation module 1 includes a first temperature averaging plate 11 and a plurality of cold plates 12, the plurality of cold plates 12 are arranged at intervals on the first temperature averaging plate 11, and the plurality of cold plates 12 protrude from the first temperature averaging plate 11, the plurality of cold plates 12 correspond to the positions of the plurality of floating modules 2, the chip 22 abuts against the cold plate 12, and the second section 233 is connected to the first temperature averaging plate 11.
  • the cold plate 12 protrudes from the surface of the first temperature averaging plate 11, so that when the chip 22 abuts against the cold plate 12, other parts of the circuit board 21 can be out of contact with the first temperature averaging plate 11, thereby facilitating the arrangement of the first heat pipe 23 and facilitating the low-power heating device on the circuit board 21 to dissipate heat through the first heat pipe 23.
  • the cold plate 12 can be fixed to the first temperature equalizing plate 11 by welding to realize an integrated liquid cooling module 1.
  • the cold plate 12 can also be fixed to the first temperature equalizing plate 11 by other methods, which are not limited here.
  • the floating module 2 further includes a second temperature averaging plate 27 , which is fixed to opposite sides of the circuit board 21 , and at least a portion of the first section 231 is disposed between the second temperature averaging plate 27 and the circuit board 21 .
  • the second temperature averaging plate 27 is arranged to cover the low-power heating device on the circuit board 21, so that the low-power heating device on the circuit board 21 can be evenly heated, with good temperature averaging performance, preventing the low-power heating device from overheating, and the first section 231 of the first heat pipe 23 is partially arranged between the second temperature averaging plate 27 and the circuit board, so that the second temperature averaging plate 27 can transfer the heat of the low-power heating device to the first section 231, and then to the liquid-cooled heat dissipation module 1.
  • the second temperature averaging plate 27 can reduce the number of first heat pipes 23 used, save costs, improve the thermal conductivity of the low-power heating device on the circuit board 21, reduce the impact of the fixed first heat pipe 23 on the circuit board 21, and improve the yield of the floating module 2.
  • the second temperature equalizing plate 27 may be fixed to the circuit board 21 by fasteners, or by other methods, which are not limited here.
  • the floating module 2 further includes a second heat pipe 28 , and a groove 271 is provided on the side of the second temperature equalizing plate 27 away from the circuit board 21 , and the second heat pipe 28 is disposed in the groove 271 .
  • the heat absorbed by the second temperature averaging plate 27 in the structure can be transferred to the second heat pipe 28 to further improve the temperature averaging effect of the second temperature averaging plate 27, thereby effectively preventing the low-power heating components on the circuit board 21 from being overheated, thereby increasing the service life of the circuit board 21 and improving the reliability of the electronic components.
  • the second heat pipe 28 may be U-shaped, and the groove 271 matches the shape of the second heat pipe 28 to increase the laying range of the second heat pipe 28 on the second temperature averaging plate 27, so as to further improve the temperature averaging effect of the second temperature averaging plate 27.
  • the second heat pipe 28 and the groove 271 may also be other shapes that match each other, such as L-shaped, etc., which can be adjusted according to the structure of the circuit board 21. No restrictions are imposed on this.
  • the second temperature averaging plate 27 may not be provided with the second heat pipe 28 as shown in Figure 4, or, as shown in Figures 4 and 5, one of the second temperature averaging plates 27 on both sides of the circuit board 21 is provided with the second heat pipe 28, and the other is not provided with the second heat pipe 28, and no limitation is made here.
  • the first temperature averaging plate 11 and the second temperature averaging plate 27 can be made of titanium alloy, stainless steel, copper or other materials according to the requirements, and there is no limitation here.
  • the cross section of the first heat pipe 23 is rectangular or oval
  • the cross section of the second heat pipe 28 is rectangular or oval.
  • the first heat pipe 23 and the second heat pipe 28 can have a relatively flat surface, so as to facilitate the assembly and pressing of the first heat pipe 23 and the second heat pipe 28, improve the fixing effect of the first heat pipe 23 and the second heat pipe 28, and also reduce the thickness of the first heat pipe 23 and the second heat pipe 28, so as to reduce the overall thickness of the electronic components and improve the system integration of the electronic equipment.
  • first heat pipe 23 and the second heat pipe 28 may be the same or different.
  • first heat pipe 23 and the second heat pipe 28 may also be other shapes, which are not limited here.
  • the embodiment of the present application also provides an electronic device, as shown in Figure 2, the electronic device includes a housing and an electronic component of any of the above embodiments, and the electronic component is installed in the housing. Since the electronic component has the above technical effects, the electronic device including the electronic component should also have the corresponding technical effects, which will not be repeated here.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

本申请涉及一种电子组件及电子设备，包括液冷散热模组和多个浮动模组，多个浮动模组间隔安装于液冷散热模组上，浮动模组包括电路板、芯片和弹性连接件，芯片设置于电路板的一侧，电路板通过弹性连接件与液冷散热模组连接，其中，弹性连接件用于将电路板压紧于液冷散热模组，以使芯片与液冷散热模组抵接，且多个浮动模组相互独立，彼此不会产生干扰，弹性连接件设置可确保电子组件中每个芯片的散热可靠性，另外，由于液冷散热模组无需浮动，因此，无需设置大量连通管路，降低了液冷散热模组的结构复杂程度，节约了安装空间，提高了电子设备的系统集成度。

Description

一种电子组件及电子设备
本申请要求于2022年11月10日提交中国专利局、申请号为202211404048.X、发明创造名称为“一种电子组件及电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及散热技术领域，尤其涉及一种电子组件及电子设备。
背景技术
随着互联网技术(Internet Technology，IT)市场的快速发展，各类芯片的功耗持续增加，传统的风冷散热逐渐向液冷演进，同时，由于碳达峰和碳中和的需要，对于电子设备系统的能耗比也提出了要求，全液冷散热也逐渐被广泛应用。
液冷散热模组一般包括均温板和冷板，由于主芯片的功耗高，散热时必须与液冷散热模组紧密接触，现有技术中，通过将电路板固定，使用于给主芯片散热的冷板浮动，以使冷板与芯片紧密接触，而电路板上其余的低功耗器件通过与均温板接触散热。但是为了保证冷板的浮动功能以及均温板的散热性能，需要铺设大量的连接管路，占用较多的安装空间，导致集成度下降。
申请内容
本申请实施例提供了一种电子组件及电子设备，以解决上述现有技术中集成度低的问题。
本申请实施例第一方面提供了一种电子组件，包括液冷散热模组和多个浮动模组，多个所述浮动模组间隔安装于所述液冷散热模组上，所述浮动模组包括电路板、芯片和弹性连接件，所述芯片设置于所述电路板的一侧，所述电路板通过所述弹性连接件与所述液冷散热模组连接，其中，所述弹性连接件用于将所述电路板压紧于所述液冷散热模组，以使所述芯片与所述液冷散热模组抵接。
本方案中，浮动模组中的电路板通过弹性连接件与液冷散热模组连接，在弹性连接件的作用下，电路板能够向液冷散热模组的方向浮动，从而确保芯片能够与液冷散热模组紧密贴合，且由于多个浮动模组相互独立，间隔设置于液冷散热模组上，因此，相邻两个浮动模组的浮动彼此不会产生干扰，弹性连接件可根据所属的浮动模组上的芯片与液冷散热模组之间的距离施加弹性力，确保每个浮动模组上的芯片都能够与液冷散热模组紧密贴合，保证了电子组件中每个芯片的散热可靠性。同时，由于液冷散热模组无需浮动，为一体化液冷结构，因此，无需设置大量连通管路，降低了液冷散热模组的结构复杂程度，节约了安装空间，有利于电子组件的小型化设计，提高了电子设备的系统集成度。
在一种可能的设计中，多个所述浮动模组安装于所述液冷散热模组的相对两侧。
本方案中，多个浮动模组安装于液冷散热模组的相对两侧，即多个浮动模组同时安装于液冷散热模组的第一安装面和第二安装面上，从而能够实现更多的浮动模组的安装，也就是说能够同时为多个具有高功耗的芯片散热，从而提高了电子组件中浮动模组的数量，以使电子设备可以具备更多的高功耗芯片，提高电子设备的性能，且由于液冷散热模组的双面散热功能，降低了电子设备中液冷散热模组的个数，进一步提高了电子设备的系统集成度。
在一种可能的设计中，所述弹性连接件包括连接件和弹性件，所述连接件穿设于所述弹性件，所述电路板上设置有安装孔，所述连接件穿过所述安装孔与所述液冷散热模组连接，所述弹性件一端与所述连接件抵接，另一端与所述电路板抵接，以将所述电路板上的所述芯片压紧于所述液冷散热模组。
本方案中，连接件能够穿过电路板上的安装孔与液冷散热模组连接，能够限制浮动模组在液冷散热模组上的位移，避免多个浮动模组之间产生干扰，提高电子组件的结构稳定性。弹性件设置在连接件与电路板之间，能够在紧固连接件的过程中，使弹性件产生压缩，从而地电路板能够在弹性件的弹力作用下带动芯片向液冷散热模组一侧浮动，从而保证芯片能够与液冷散热模组之间的有效接触，提高了电子组件中每个芯片的散热可靠性。
在一种可能的设计中，所述弹性件为弹簧或弹片。
本方案中，弹簧或弹片具均有结构简单、易于制造、成本低的优点，当弹性件为弹簧或弹片时，均能够保证弹性连接件的弹性作用，以使浮动模组能够相对于液冷散热模组产生浮动，便于实现其浮动功能，提高了弹性连接件的可靠性，且降低了弹性连接件的结构复杂程度，节约了成本。
在一种可能的设计中，所述浮动模组还包括第一加强框架和第二加强框架，所述第一加强框架连接于所述电路板的一侧，并围设于所述芯片，所述第二加强框架对应设置于所述电路板的另一侧，所述第一加强框架和所述第二加强框架上设置有与所述安装孔位置对应的通孔，所述连接件依次穿过所述弹性件、所述第二加强框架、所述电路板和所述第一加强框架与所述液冷散热模组连接。
本方案中，第一加强框架和第二加强框架的设置提高了电路板位于芯片周围的强度，弹性件位于第二加强框架与连接件之间，使弹性件产生的弹力先作用到第二加强框架上，再经第二加强框架传递到电路板上，使电路板受力更加均匀，且能够避免电路板在弹性连接件处应力过于集中产生形变，造成芯片与液冷散热模组之间产生间隙，影响芯片的散热效果，还能够防止电路板长期收到压力而形变损坏，提高了电路板的使用寿命。
在一种可能的设计中，所述浮动模组还包括第一热管，所述第一热管设置于所述电路板相对的两侧，所述第一热管的至少部分伸出于所述电路板的边缘与所述液冷散热模组连接。
本方案中，第一热管设置于电路板相对的两侧，能够与电路板上除具有高功耗的芯片之外的其余低功耗发热器件连接，从而能够对电路板上的低功耗发热器件进行散热，且第一热管与液冷散热模组连接，能够将低功耗发热器件的热量传导至液冷散热模组，从而提高其散热效率。另外，由于电路板上的低功耗发热器件并不是直接接触液冷散热模组进行散热的，无需考虑低功耗发热器件与液冷散热模组之间的间隙和公差，降低了电路板上的低功耗发热器件散热难度的同时，保证了电路板上的低功耗发热器件的散热可靠性。
在一种可能的设计中，所述第一热管包括依次连接的第一段、弯折段和第二段，所述第一段与所述电路板连接，所述第二段与所述液冷散热模组连接。
本方案中，第一热管的第一段电路板连接，能够吸收电路板上的低功耗发热器件的热量，第二段与液冷散热模组连接，从而能够将吸收的热量传递至液冷散热模组，提高其散热效率。弯折段的设置能够使设置在电路板相对两侧的第一热管的第二段大致处于同一高度，以减少两侧第一热管的第二段的之间的高度差，且第一热管的装配后还可能产生高度方向的装配公差，多个第一热管的第二段之间产生高度差，在浮动模组的浮动过程中弯折段能够产生微形变，从而进一步吸收第一热管的装配后的公差，使第二段能够与液冷散热模组更加紧密贴合，提高导热效率。
在一种可能的设计中，所述浮动模组还包括固定片，所述固定片包括本体和连接片，所述连接片与所述液冷散热模组连接，所述第二段的至少部分设置于所述本体与所述液冷散热模组之间。
本方案中，固定片通过连接片固定于液冷散热模组，从而能够通过本体将第二段压紧于液冷散热模组，进一步降低多个第一热管的装配后多个第二段之间的高度差，减小第二段与液冷散热模组之间的间隙，提高第二段与液冷散热模组的接触面积，从而进一步提高导热效率。另外，还能够防止浮动模组相对于也冷散热模组产生转动或位移，提高电子组件的结构稳定性。
在一种可能的设计中，所述连接片上设置有固定孔，所述连接片通过所述固定孔的配合与所述液冷散热模组连接。
本方案中，连接片通过固定孔的配合固定与也冷散热模组能够便于浮动模组的拆卸，便于浮动模组的更换、增加或减少，提高用户的使用体验，节约成本。
在一种可能的设计中，所述固定孔为大圆孔或槽型孔。
本方案中，固定孔为大圆孔或槽型孔，使固定片在也冷散热模组上能够相对于第二段移动调节，以减小第一热管的装配后可能产生的沿电路板宽度方向和长度方向的装配公差，从而提高固定片的本体对与第二段的覆盖面积，以提高本体压紧第二段的面积，保证第二段与也冷散热模组之间的有效接触面积，避免由于装配公差的原因而使本体对第二段的覆盖面积减小，而使第二段与也冷散热模组之间的接触面积减少，从而降低第一热管的导热效率。另外，通过固定孔的容差，还能够确保第一热管在装配过程中不会别住，导致受力不平衡，提高电子组件的结构稳定性。
在一种可能的设计中，所述本体设置有凹陷部，所述第二段的至少部分设置于所述凹陷部内。
本方案中，凹陷部能够限制第二段与本体之间的相对位移，防止本体在外力作用下相对于第二段产生转动，造成本体压紧第二段的面积，提高了固定片的固定效果。
在一种可能的设计中，所述浮动模组还包括弹性压紧片，所述弹性压紧片的两端与所述液冷散热模组连接，所述第二段的至少部分设置于所述弹性压紧片与所述液冷散热模组之间。
本方案中，弹性压紧片具有弹性，其两端固定在也冷散热模组时，能够通过中间的弹性形变部位将第二段压紧于也冷散热模组，降低第一热管装配后的公差，提高第二段与也冷散热模组的有效接触面积，以保证第二段的导热效率，且弹性压紧片可同时固定多个第二段，以提高装配效率，另外，弹性压紧片结构简单、易于制造、便于大批量生产，能够进一步降低电子组件的制造成本。
在一种可能的设计中，所述液冷散热模组包括第一均温板和多个冷板，多个所述冷板间隔设置于所述第一均温板，且多个所述冷板凸出于所述第一均温板，多个所述冷板与多个浮动模组的位置相对应，所述芯片与所述冷板抵接，所述第二段与所述第一均温板连接。
本方案中，冷板凸出于第一均温板的表面，从而使芯片与冷板抵接时，电路板上其他部位能够与第一均温板不接触，从而便于第一热管的布置，以及便于电路板上的低功耗发热器件，能够通过第一热管进行散热的方式的实现。
在一种可能的设计中，所述浮动模组还包括第二均温板，所述第二均温板固定于所述电路板的相对两侧，所述第一段的至少部分设置于所述第二均温板与电路板之间。
本方案中，第二均温板的设置可覆盖电路板上的低功耗发热器件，从而能够对电路板上的低功耗发热器件进行均温，具有较好的均温性能，防止低功耗发热器件过热，且第一热管的第一段的部分设置在了第二均温板与电路板之间，使得第二均温板能够将低功耗发热器件的热量传递给第一段，进而传递给液冷散热模组，因此，第二均温板能够降低第一热管的使用数量，节约成本，提高对电路板上的低功耗发热器件的导热效率，减少固定第一热管对电路板的影响，提高浮动模组的良率。
在一种可能的设计中，所述第二均温板与所述第一均温板之间具有间隙。
本方案中，第二均温板与第一均温板之间具有间隙，以使浮动模组可以具有相对于液冷散热模组产生浮动的空间，以保障芯片能够与冷板紧密接触，保证芯片的散热可靠性。
在一种可能的设计中，所述浮动模组还包括第二热管，所述第二均温板背离所述电路板一侧设置有凹槽，所述第二热管设置于所述凹槽内。
本方案中，该结构中第二均温板吸收的热量能够传递给第二热管，以进一步提高第二均温板的均温作用，从而能够有效防止电路板上的低功耗发热器件的热量过高，提高了电路板的使用寿命，提升了电子组件的使用可靠性。
在一种可能的设计中，所述第一热管的截面为长方形或扁圆形，所述第二热管的截面为长方形或扁圆形。
本方案中，第一热管和第二热管的截面为长方形或扁圆形时，使得第一热管和第二热管的能够具有较为平整的表面，以便于第一热管和第二热管的组装和压紧，提高第一热管和第二热管的固定效果，还能够降低第一热管和第二热管的厚度，以降低电子组件的整体厚度，提高电子设备的系统集成度。
本申请实施例第二方面提供了一种电子设备，所述电子设备包括壳体和以上任一实施例所述 的电子组件，所述电子组件安装于所述壳体内。由于电子组件具有上述技术效果，包括该电子组件的电子设备也应具有相应的技术效果，在此不再赘述。
应当理解的是，以上的一般描述和后文的细节描述仅是示例性的，并不能限制本申请。
附图说明
图1为现有技术中电子组件的液冷散热模组的一种结构示意图；
图2为本申请所提供电子组件在一种实施例中的结构示意图；
图3为图2中液冷散热模组的结构示意图；
图4为图2中浮动模组的结构示意图；
图5为图4中浮动模组在另一视角下的结构示意图；
图6为图2中A处的局部放大图；
图7为图4中B处的局部放大图；
图8为图2中电子组件在另一种实施例中的局部示意图；
图9为图2中第一热管在一种实施例中的截面示意图；
图10为图2中第一热管在另一种实施例中的截面示意图。
附图标记：
1’-均温板；
2’-浮动冷板；
3’-连接管路；
1-液冷散热模组；
11-第一均温板；
111-第一安装面；
112-第二安装面；
12-冷板；
2-浮动模组；
21-电路板；
22-芯片；
23-第一热管；
231-第一段；
232-弯折段；
233-第二段；
24-弹性连接件；
241-连接件；
242-弹性件；
25-固定片；
251-本体；
251a-凹陷部；
252-连接片；
252a-固定孔；
26-弹性压紧片；
27-第二均温板；
271-凹槽；
28-第二热管；
29a-第一加强框架；
29b-第二加强框架。
此处的附图被并入说明书中并构成本说明书的一部分，示出了符合本申请的实施例，并与说明书一起用于解释本申请的原理。
具体实施方式
为了更好的理解本申请的技术方案，下面结合附图对本申请实施例进行详细描述。
在一种具体实施例中，下面通过具体的实施例并结合附图对本申请做进一步的详细描述。
对于电子设备而言，通常设置有电子组件，主芯片是电子组件的重要组成部分，其设置在电路板上。由于主芯片的功耗高，散热时必须与液冷散热模组紧密接触。现有技术中，液冷散热模组包括冷板和均温板，通过将电路板固定，使用于给主芯片散热的冷板浮动，以使冷板与芯片紧密接触，而电路板上其余的低功耗器件通过与均温板接触散热。图1示出了现有技术中电子组件的液冷散热结构的一种结构示意图，为了使该结构中的浮动冷板2’能够浮动，且使浮动冷板2’与均温板1’中的用于冷却的液体流通，除了需要在浮动冷板2’上安装弹性连接件，还需要交叉铺设大量的连接管路3’，从而导致连接管路3’占用大量的安装空间，导致系统的集成度下降。
为了解决该技术问题，本申请实施例提供了一种电子组件以及电子设备，电子设备包括例如电脑、服务器、存储、交换机等电子设备，在此不做限制。下面通过具体的实施例并结合附图对本申请做进一步的详细描述。
本申请实施例提供了一种电子组件，如图2～图5所示，电子组件包括液冷散热模组1和多个浮动模组2，多个浮动模组2间隔安装于液冷散热模组1上，浮动模组2包括电路板21、芯片22和弹性连接件24，芯片22设置于电路板21的一侧，电路板21通过弹性连接件24与液冷散热模组1连接，其中，弹性连接件24用于将电路板21压紧于液冷散热模组1，以使芯片22与液冷散热模组1抵接。
本实施例中，如图2～图5所示，浮动模组2中的电路板21通过弹性连接件24与液冷散热模组1连接，在弹性连接件24的作用下，电路板21能够向液冷散热模组1的方向浮动，从而确保芯片22能够与液冷散热模组1紧密贴合，且由于多个浮动模组2相互独立，间隔设置于液冷散热模组1上，因此，相邻两个浮动模组2的浮动彼此不会产生干扰，弹性连接件24可根据所属的浮动模组2上的芯片22与液冷散热模组1之间的距离施加弹性力，确保每个浮动模组2上的芯片22都能够与液冷散热模组1紧密贴合，保证了电子组件中每个芯片22的散热可靠性。同时，由于液冷散热模组1无需浮动，为一体化液冷结构，因此，无需设置大量连通管路，降低了液冷散热模组1的结构复杂程度，节约了安装空间，有利于电子组件的小型化设计，提高了电子设备的系统集成度。
其中，多个浮动模组2之间彼此不会产生干扰，也便于用户根据需求增加、减少或更换具有芯片22的浮动模组2或电路板21，以满足用户对电子设备的性能需求，且无需一次性更换所有的浮动模组2或电路板21，节约了成本，提高用户的使用体验。
另外，本实施例中的电路板21可以为印制电路板(Printed Circuit Board，PCB)，也可以为其他电路板在此不做限制。
需要说明的是，本申请实施例主要应用于全液冷散热场景，但不局限于全液冷散热场景，也可应用于其他散热场景，例如贴壳散热场景等，在此不做限制。
此外，如图2和图3所示，由于该电子组件中的液冷散热模组1无需浮动，为一体化液冷结构，无需设置大量的连通管路，因此，本申请实施例中的液冷散热模组1的相对两侧均具有安装空间，从而液冷散热模组1可同时具有相对的第一安装面111和第二安装面112，即浮动模组2可以安装于第一安装面111或第二安装面112上实现液冷散热模组1的单面散热功能，浮动模组2也可以同时安装于第一安装面111和第二安装面112上，从而能够实现液冷散热模组1的双面散热功能，在此不做限制。
在一种具体实施例中，如图2和图3所示，多个浮动模组2安装于液冷散热模组1的相对两 侧。
本实施例中，如图2和图3所示，多个浮动模组2安装于液冷散热模组1的相对两侧，即多个浮动模组2同时安装于液冷散热模组1的第一安装面111和第二安装面112上，从而能够实现更多的浮动模组2的安装，也就是说能够同时为多个具有高功耗的芯片22散热，从而提高了电子组件中浮动模组2的数量，以使电子设备可以具备更多的高功耗芯片22，提高电子设备的性能，且由于液冷散热模组1的双面散热功能，降低了电子设备中液冷散热模组1的个数，进一步提高了电子设备的系统集成度。
在另一种实施例中，根据电子设备的实际结构和需求，可将多个浮动模组2仅设置在液冷散热模组1的一侧，以节约电子设备的成本，当然，根据后期的使用需求，也可以继续增加浮动模组2，在此不做限制，以提高电子设备的性能，满足用户的使用需求。
在一种具体实施例中，如图4和图5所示，弹性连接件24包括连接件241和弹性件242，连接件241穿设于弹性件242，电路板21上设置有安装孔，连接件241穿过安装孔与液冷散热模组1连接，弹性件242一端与连接件241抵接，另一端与电路板21抵接，以将电路板21上的芯片22压紧于液冷散热模组1。
本实施例中，如图4和图5所示，连接件241能够穿过电路板21上的安装孔与液冷散热模组1连接，能够限制浮动模组2在液冷散热模组1上的位移，避免多个浮动模组2之间产生干扰，提高电子组件的结构稳定性。弹性件242设置在连接件241与电路板21之间，能够在紧固连接件241的过程中，使弹性件242产生压缩，从而地电路板21能够在弹性件242的弹力作用下带动芯片22向液冷散热模组1一侧浮动，从而保证芯片22能够与液冷散热模组1之间的有效接触，提高了电子组件中每个芯片22的散热可靠性。
其中，本实施例中的弹性连接件24并不局限于连接件241和弹性件242的组合方式，也可以为其他能够起到固定并具有弹性作用的浮动连接方式，在此不做限制。
在一种具体实施例中，如图5所示，弹性件242为弹簧或弹片。
本实施例中，弹簧或弹片具均有结构简单、易于制造、成本低的优点，当弹性件242为弹簧或弹片时，均能够保证弹性连接件24的弹性作用，以使浮动模组2能够相对于液冷散热模组1产生浮动，便于实现其浮动功能，提高了弹性连接件24的可靠性，且降低了弹性连接件24的结构复杂程度，节约了成本。
当然，弹性件242也可以为其他弹性结构，在此不做限制。
如图5所示的具体实施例中，弹性连接件24的弹性件242为弹片，该结构中，弹片的两端具有通孔，以使连接件241能够穿过，弹片的中间部分具有弹性形变部，当弹片两端被压紧时，中间的弹性形变部能够产生形变以产生弹力。安装时，先将连接件241穿过弹片两端的通孔，再令连接件241穿过电路板21上的安装孔与液冷散热模组1连接，随着连接件241的紧固，弹片的两端被压紧，中间的弹性形变部被压缩产生形变，从而能够将电路板21向液冷散热模组1一侧压紧产生浮动，带动芯片22与液冷散热模组1紧密接触。也就是说，该结构中弹性连接件24由一个弹片和两个连接件241组成，其中，弹片的弹性形变部能够增加弹片与电路板21的接触面积，从而使电路板21受力更加均匀，避免电路板在弹性连接件24处应力过于集中产生形变，造成芯片22与液冷散热模组1之间产生间隙，影响芯片22的散热效果，且能够降低弹性件242的个数，提高装配效率。
其中，弹性连接件24可以设置为多个，例如两个、四个等，以使电路板21受力更加均匀，提高对电路板21以及芯片22的压紧作用，在此不做限制。如图3和图4所示的具体实施例中，弹性连接件24设置有两个，两个弹性连接件24相对设置，以进一步提高对电路板21的压紧作用。
另外，电路板21上的安装孔可设置在芯片22的四周，如图4和图5所示的具体实施例中，电路板21上的安装孔设置在了靠近芯片22的四个角处，弹性连接件24从该处穿过能够提高对其中心处的压力，且使电路板21的芯片22安装处受力更加均匀，使芯片22更易于被压紧与液冷散热模组1，进一步保证芯片22能够与液冷散热模组1之间的有效接触，还能够降低弹性件242的弹力系数的需求，节约制造成本。
在一种具体实施例中，如图4和图5所示，浮动模组2还包括第一加强框架29a和第二加强框架29b，第一加强框架29a连接于电路板21的一侧，并围设于芯片22，第二加强框架29b对应设置于电路板21的另一侧，第一加强框架29a和第二加强框架29b上设置有与安装孔位置对应的通孔，连接件241依次穿过弹性件242、第二加强框架29b、电路板21和第一加强框架29a与液冷散热模组1连接。
本实施例中，如图4和图5所示，第一加强框架29a和第二加强框架29b的设置提高了电路板21位于芯片22周围的强度，弹性件242位于第二加强框架29b与连接件241之间，使弹性件242产生的弹力先作用到第二加强框架29b上，再经第二加强框架29b传递到电路板21上，使电路板21受力更加均匀，且能够避免电路板在弹性连接件24处应力过于集中产生形变，造成芯片22与液冷散热模组1之间产生间隙，影响芯片22的散热效果，还能够防止电路板21长期收到压力而形变损坏，提高了电路板21的使用寿命。
其中，第一加强框架29a和第二加强框架29b的大小和形状可根据芯片22的实际大小和形状进行设置，在此不做限制。
在一种具体实施例中，如图2～图5所示，浮动模组2还包括第一热管23，第一热管23设置于电路板21相对的两侧，第一热管23的至少部分伸出于电路板21的边缘与液冷散热模组1连接。
本实施例中，如图2～图5所示，第一热管23设置于电路板21相对的两侧，能够与电路板21上除具有高功耗的芯片22之外的其余低功耗发热器件连接，从而能够对电路板21上的低功耗发热器件进行散热，且第一热管23与液冷散热模组1连接，能够将低功耗发热器件的热量传导至液冷散热模组，从而提高其散热效率。另外，电路板21上的低功耗发热器件的高度也会存在公差，其与液冷散热模组1之间的间隙不会完全相同，由于电路板21上的低功耗发热器件并不是直接接触液冷散热模组1进行散热的，无需考虑低功耗发热器件与液冷散热模组1之间的间隙和公差，降低了电路板21上的低功耗发热器件散热难度的同时，保证了电路板21上的低功耗发热器件的散热可靠性。
此外，通过弹性连接件24的作用，电路板21能够相对于液冷散热模组1产生浮动，电路板21向液冷散热模组1浮动的过程中，设置于电路板21朝向液冷散热模组1一侧的第一热管23，能够被压紧于电路板21与液冷散热模组1之间，从而能够吸电路板21上低功耗发热器件的公差，使电路板21上的低功耗发热器件与第一热管23更加贴合，提高散热可靠性。
其中，热管是利用介质在热端蒸发后在冷端冷凝的相变过程，使热量快速传导。一般热管由管壳、吸液芯和端盖组成。热管内部是被抽成负压状态，充入适当的液体，这种液体沸点低，容易挥发。管壁有吸液芯，其由毛细多孔材料构成。热管一端为蒸发端，另外一端为冷凝端，当热管一端受热时，毛细管中的液体迅速汽化，蒸气在热扩散的动力下流向另外一端，并在冷端冷凝释放出热量，液体再沿多孔材料靠毛细作用流回蒸发端，如此循环不止，直到热管两端温度相等。这种循环是快速进行的，热量可以被源源不断地传导开来。本申请中的第一热管23和第二热管28均为该工作原理。
在一种具体实施例中，如图4～图6所示，第一热管23包括依次连接的第一段231、弯折段232和第二段233，第一段231与电路板21连接，第二段233与液冷散热模组1连接。
本实施例中，如图4～图6所示，第一热管23的第一段231电路板21连接，能够吸收电路板21上的低功耗发热器件的热量，第二段233与液冷散热模组1连接，从而能够将吸收的热量传递至液冷散热模组1，提高其散热效率。弯折段232的设置能够使设置在电路板21相对两侧的第一热管23的第二段233大致处于同一高度，以减少两侧第一热管23的第二段233的之间的高度差，且第一热管23的装配后还可能产生高度方向的装配公差，多个第一热管23的第二段233之间产生高度差，在浮动模组2的浮动过程中弯折段232能够产生微形变，从而进一步吸收第一热管23的装配后的公差，使第二段233能够与液冷散热模组1更加紧密贴合，提高导热效率。
其中，弯折段232的弯折形状和尺寸可根据电子组件的实际结构设置，电路板21相对两侧的第一热管23的弯折段232的弯折形状和尺寸可不相同，能够保证设置在电路板21相对两侧的第一热管23的第二段233大致处于同一高度即可。
另外，第一端231可以通过焊接固定于电路板21，当然，也可以通过其他方式固定于电路板，在此不做限制。
此外，第一热管23可设置有多个，可根据电路板21上的低功耗发热器件的大小、范围、和数量进行设置，例如第一热管23的数量可以为两个、四个、六个、八个等，且电路板21两侧的第一热管23的数量可以相同，也可以不同，只要能够保证电路板21上的低功耗发热器件的散热效果即可，在此不做限制。如图2～图5所示的具体实施例中，第一热管23的数量为八个，均匀设置于电路板21的两侧，每侧各设置四个第一热管，以提高电路板21上的低功耗发热器件的散热效率。
在一种具体实施例中，如图6和图7所示，浮动模组2还包括固定片25，固定片25包括本体251和连接片252，连接片252与液冷散热模组1连接，第二段233的至少部分设置于本体251与液冷散热模组1之间。
本实施例中，如图6和图7所示，固定片25通过连接片252固定于液冷散热模组1，从而能够通过本体251将第二段233压紧于液冷散热模组1，进一步降低多个第一热管23的装配后多个第二段233之间的高度差，减小第二段233与液冷散热模组1之间的间隙，提高第二段233与液冷散热模组1的接触面积，从而进一步提高导热效率。另外，还能够防止浮动模组2相对于也冷散热模组1产生转动或位移，提高电子组件的结构稳定性。
其中，连接片252可以通过焊接、铆接、卡接、紧固件连接等方式与液冷散热模组1连接，在此不做限制。
另外，固定片25的个数可设置为多个，其个数与第一热管23的数量相配合，在此不做限制。
在一种具体实施例中，如图6和图7所示，连接片252上设置有固定孔252a，连接片252通过固定孔252a的配合于液冷散热模组1连接，固定孔252a为大圆孔或槽型孔。
本实施例中，如图6和图7所示，连接片252通过固定孔252a的配合固定与也冷散热模组1能够便于浮动模组2的拆卸，便于浮动模组2的更换、增加或减少，提高用户的使用体验，节约成本。
其中，固定孔252a可配合螺钉等紧固件使用，在此不做限制。
在一种具体实施例中，如图6和图7所示，固定孔252a为大圆孔或槽型孔。
第一热管23的装配后还可能产生沿电路板21宽度方向和长度方向的装配公差，也就是说第一热管23后各第一热管23沿电路板21边缘伸出的长度可能会不同，使得第二段233沿电路板21的宽度方向和长度方向的边缘排列参差不齐。本实施例中，如图6和图7所示，固定孔252a为大圆孔或槽型孔，使固定片25在也冷散热模组1上能够相对于第二段233移动调节，以减小第一热管23的装配后可能产生的沿电路板21宽度方向和长度方向的装配公差，从而提高固定片25的本体251对与第二段233的覆盖面积，以提高本体251压紧第二段233的面积，保证第二段233与也冷散热模组1之间的有效接触面积，避免由于装配公差的原因而使本体251对第二段233的覆盖面积减小，而使第二段233与也冷散热模组1之间的接触面积减少，从而降低第一热管23的导热效率。另外，通过固定孔252a的容差，还能够确保第一热管23在装配过程中不会别住，导致受力不平衡，提高电子组件的结构稳定性。
当然，固定孔252a也可以为条形孔等，在此不做限制。
在一种具体实施例中，如图6和图7所示，本体251设置有凹陷部251a，第二段233的至少部分设置于凹陷部251a内。
本实施例中，如图6和图7所示，凹陷部251a能够限制第二段233与本体251之间的相对位移，防止本体251在外力作用下相对于第二段233产生转动，造成本体251压紧第二段233的面积，提高了固定片25的固定效果。
另外，如图6和图7所示的具体实施例中，当本体251具有凹陷部251a时，使得固定片25仅具有一个连接片252即可对第二段233进行压紧固定，降低了固定片25的体积，使多个第二段233排列的较为紧密的情况下也可以通过固定片25压紧固定。
当然，在另一种实施例中，本体251的两侧均可以设置连接片252，以进一步提高对第二段 233的固定效果。
在另一种实施例中，本体251可设置有多个凹陷部251a以使本体251能够同时压紧多个第二段233，便于对多个紧密排列的第二段233同时固定，还能够减少固定片25的使用，提高装配效率，在此不做限制。
在另一种具体实施例中，如图8所示，浮动模组2还包括弹性压紧片26，弹性压紧片26的两端与液冷散热模组1连接，第二段233的至少部分设置于弹性压紧片26与液冷散热模组1之间。
本实施例中，如图8所示，弹性压紧片26具有弹性，其两端固定在也冷散热模组1时，能够通过中间的弹性形变部位将第二段233压紧于也冷散热模组1，降低第一热管23装配后的公差，提高第二段233与也冷散热模组1的有效接触面积，以保证第二段233的导热效率，且弹性压紧片26可同时固定多个第二段233，以提高装配效率，另外，弹性压紧片26结构简单、易于制造、便于大批量生产，能够进一步降低电子组件的制造成本。
其中，弹性压紧片26的长度和大小，可根据第一热管23的实际分布和大小而设定，使弹性压紧片26能够固定至少1个第二段233，在此不做限制。
另外，弹性压紧片26的两端也可设置大圆孔、槽型孔、条形孔等孔，以使弹性压紧片26能够相对于第二段233调整其位置，以进一步吸收第一热管23装配后的公差，在此不做限制。
当然，第二段233也可以通过其他结构或方式，固定或压紧于也冷散热模组1，在此不做限制。
在一种具体实施例中，如图2～图5所示，液冷散热模组1包括第一均温板11和多个冷板12，多个冷板12间隔设置于第一均温板11，且多个冷板12凸出于第一均温板11，多个冷板12与多个浮动模组2的位置相对应，芯片22与冷板12抵接，第二段233与第一均温板11连接。
本实施例中，如图2～图5所示，冷板12凸出于第一均温板11的表面，从而使芯片22与冷板12抵接时，电路板21上其他部位能够与第一均温板11不接触，从而便于第一热管23的布置，以及便于电路板21上的低功耗发热器件，能够通过第一热管23进行散热的方式的实现。
其中，冷板12可通过焊接固定第一均温板11，以实现一体化的液冷散热模组1，当然，也可以通过其他方式固定与第一均温板11，在此不做限制。
在一种具体实施例中，如图4和图5所示，浮动模组2还包括第二均温板27，第二均温板27固定于电路板21的相对两侧，第一段231的至少部分设置于第二均温板27与电路板21之间。
本实施例中，如图4和图5所示，第二均温板27的设置可覆盖电路板21上的低功耗发热器件，从而能够对电路板21上的低功耗发热器件进行均温，具有较好的均温性能，防止低功耗发热器件过热，且第一热管23的第一段231的部分设置在了第二均温板27与电路板之间，使得第二均温板27能够将低功耗发热器件的热量传递给第一段231，进而传递给液冷散热模组1，因此，第二均温板27能够降低第一热管23的使用数量，节约成本，提高对电路板21上的低功耗发热器件的导热效率，减少固定第一热管23对电路板21的影响，提高浮动模组2的良率。
其中，第二均温板27可通过紧固件固定于电路板21上，也可以通过其他方式固定，在此不做限制。
在一种具体实施例中，如图2～图5所示，第二均温板27与第一均温板11之间具有间隙。
本实施例中，如图2～图5所示，第二均温板27与第一均温板11之间具有间隙，以使浮动模组2可以具有相对于液冷散热模组1产生浮动的空间，以保障芯片22能够与冷板12紧密接触，保证芯片22的散热可靠性。
在一种具体实施例中，如图4所示，浮动模组2还包括第二热管28，第二均温板27背离电路板21一侧设置有凹槽271，第二热管28设置于凹槽271内。
本实施例中，如图4和图5所示，该结构中第二均温板27吸收的热量能够传递给第二热管28，以进一步提高第二均温板27的均温作用，从而能够有效防止电路板21上的低功耗发热器件的热量过高，提高了电路板21的使用寿命，提升了电子组件的使用可靠性。
其中，如图4所示，第二热管28可以为U形，凹槽271与第二热管28的形状相匹配，以提高第二热管28在第二均温板27上的铺设范围，以进一步提高第二均温板27的均温作用。当然，第二热管28和凹槽271也可以为相互配合的其他形状，例如L形等，可根据电路板21的结构进 行设置，在此不做限制。
在另一种实施例中，根据第二均温板27的材质以及电路板21的散热需求，如图4所示第二均温板27也可以不设置有第二热管28，或者，如图4和图5所示，电路板21两侧的第二均温板27中的一者设有第二热管28，另一者不设置有第二热管28，在此不做限制。
上述第一均温板11和第二均温板27的可根据需求采用钛合金材质、不锈钢材质或铜等材质制成，在此不做限制。
在一种具体实施例中，如2、图4、图5、图9和图10所示，第一热管23的截面为长方形或扁圆形，第二热管28的截面为长方形或扁圆形。
本实施例中，如2、图4、图5、图9和图10所示，第一热管23和第二热管28的截面为长方形或扁圆形时，使得第一热管23和第二热管28的能够具有较为平整的表面，以便于第一热管23和第二热管28的组装和压紧，提高第一热管23和第二热管28的固定效果，还能够降低第一热管23和第二热管28的厚度，以降低电子组件的整体厚度，提高电子设备的系统集成度。
其中，第一热管23和第二热管28的截面可以相同，也可以不同，另外，第一热管23和第二热管28也可以为其他形状，在此不做限制。
本申请实施例还提供了一种电子设备，如图2所示，电子设备包括壳体和以上任一实施例的电子组件，电子组件安装于壳体内。由于电子组件具有上述技术效果，包括该电子组件的电子设备也应具有相应的技术效果，在此不再赘述。
需要指出的是，本专利申请文件的一部分包含受著作权保护的内容。除了对专利局的专利文件或记录的专利文档内容制作副本以外，著作权人保留著作权。

Claims (18)

  1. 一种电子组件，其特征在于，包括：
    液冷散热模组(1)；
    多个浮动模组(2)，多个所述浮动模组(2)间隔安装于所述液冷散热模组(1)上；
    所述浮动模组(2)包括电路板(21)、芯片(22)和弹性连接件(24)，所述芯片(22)设置于所述电路板(21)的一侧，所述电路板(21)通过所述弹性连接件(24)与所述液冷散热模组(1)连接；
    其中，所述弹性连接件(24)用于将所述电路板(21)压紧于所述液冷散热模组(1)，以使所述芯片(22)与所述液冷散热模组(1)抵接。
  2. 根据权利要求1所述的电子组件，其特征在于，多个所述浮动模组(2)安装于所述液冷散热模组(1)的相对两侧。
  3. 根据权利要求1所述的电子组件，其特征在于，所述弹性连接件(24)包括连接件(241)和弹性件(242)，所述连接件(241)穿设于所述弹性件(242)，所述电路板(21)上设置有安装孔，所述连接件(241)穿过所述安装孔与所述液冷散热模组(1)连接；
    所述弹性件(242)一端与所述连接件(241)抵接，另一端与所述电路板(21)抵接，以将所述电路板(21)上的所述芯片(22)压紧于所述液冷散热模组(1)。
  4. 根据权利要求3所述的电子组件，其特征在于，所述弹性件(242)为弹簧或弹片。
  5. 根据权利要求3所述的电子组件，其特征在于，所述浮动模组(2)还包括第一加强框架(29a)和第二加强框架(29b)，所述第一加强框架(29a)连接于所述电路板(21)的一侧，并围设于所述芯片(22)，所述第二加强框架(29b)对应设置于所述电路板(21)的另一侧；
    所述第一加强框架(29a)和所述第二加强框架(29b)上设置有与所述安装孔位置对应的通孔，所述连接件(241)依次穿过所述弹性件(242)、所述第二加强框架(29b)、所述电路板(21)和所述第一加强框架(29a)与所述液冷散热模组(1)连接。
  6. 根据权利要求1所述的电子组件，其特征在于，所述浮动模组(2)还包括第一热管(23)，所述第一热管(23)设置于所述电路板(21)相对的两侧；
    所述第一热管(23)的至少部分伸出于所述电路板(21)的边缘与所述液冷散热模组(1)连接。
  7. 根据权利要求6所述的电子组件，其特征在于，所述第一热管(23)包括依次连接的第一段(231)、弯折段(232)和第二段(233)，所述第一段(231)与所述电路板(21)连接，所述第二段(233)与所述液冷散热模组(1)连接。
  8. 根据权利要求7所述的电子组件，其特征在于，所述浮动模组(2)还包括固定片(25)，所述固定片(25)包括本体(251)和连接片(252)；
    所述连接片(252)与所述液冷散热模组(1)连接；
    所述第二段(233)的至少部分设置于所述本体(251)与所述液冷散热模组(1)之间。
  9. 根据权利要求8所述的电子组件，其特征在于，所述连接片(252)上设置有固定孔(252a)，所述连接片(252)通过所述固定孔(252a)的配合与所述液冷散热模组(1)连接。
  10. 根据权利要求9所述的电子组件，其特征在于，所述固定孔(252a)为大圆孔或槽型孔。
  11. 根据权利要求8所述的电子组件，其特征在于，所述本体(251)设置有凹陷部(251a)，所述第二段(233)的至少部分设置于所述凹陷部(251a)内。
  12. 根据权利要求7所述的电子组件，其特征在于，所述浮动模组(2)还包括弹性压紧片(26)，所述弹性压紧片(26)的两端与所述液冷散热模组(1)连接；
    所述第二段(233)的至少部分设置于所述弹性压紧片(26)与所述液冷散热模组(1)之间。
  13. 根据权利要求7～12任一项所述的电子组件，其特征在于，所述液冷散热模组(1)包括第一均温板(11)和多个冷板(12)，多个所述冷板(12)间隔设置于所述第一均温板(11)，且多个所述冷板(12)凸出于所述第一均温板(11)；
    多个所述冷板(12)与多个浮动模组(2)的位置相对应；
    所述芯片(22)与所述冷板(12)抵接，所述第二段(233)与所述第一均温板(11)连接。
  14. 根据权利要求13所述的电子组件，其特征在于，所述浮动模组(2)还包括第二均温板(27)，所述第二均温板(27)固定于所述电路板(21)的相对两侧；
    所述第一段(231)的至少部分设置于所述第二均温板(27)与电路板(21)之间。
  15. 根据权利要求14所述的电子组件，其特征在于，所述第二均温板(27)与所述第一均温板(11)之间具有间隙。
  16. 根据权利要求14所述的电子组件，其特征在于，所述浮动模组(2)还包括第二热管(28)，所述第二均温板(27)背离所述电路板(21)一侧设置有凹槽(271)，所述第二热管(28)设置于所述凹槽(271)内。
  17. 根据权利要求16所述的电子组件，其特征在于，所述第一热管(23)的截面为长方形或扁圆形；
    所述第二热管(28)的截面为长方形或扁圆形。
  18. 一种电子设备，其特征在于，所述电子设备包括壳体和权利要求1至17中任一项所述的电子组件，所述电子组件安装于所述壳体内。
PCT/CN2023/103650 2022-11-10 2023-06-29 一种电子组件及电子设备 Ceased WO2024098790A1 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP23887486.1A EP4601426A4 (en) 2022-11-10 2023-06-29 ELECTRONIC ASSEMBLY AND ELECTRONIC DEVICE
US19/203,478 US20250275096A1 (en) 2022-11-10 2025-05-09 Electronic Assembly and Electronic Device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202211404048.X 2022-11-10
CN202211404048.XA CN118055591A (zh) 2022-11-10 2022-11-10 一种电子组件及电子设备

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US19/203,478 Continuation US20250275096A1 (en) 2022-11-10 2025-05-09 Electronic Assembly and Electronic Device

Publications (1)

Publication Number Publication Date
WO2024098790A1 true WO2024098790A1 (zh) 2024-05-16

Family

ID=91031868

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2023/103650 Ceased WO2024098790A1 (zh) 2022-11-10 2023-06-29 一种电子组件及电子设备

Country Status (4)

Country Link
US (1) US20250275096A1 (zh)
EP (1) EP4601426A4 (zh)
CN (1) CN118055591A (zh)
WO (1) WO2024098790A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119730199A (zh) * 2025-02-26 2025-03-28 东莞市嘉佰达电子科技有限公司 一种集成散热器的储能电池保护板
CN120529481A (zh) * 2025-07-23 2025-08-22 上海聪链信息科技有限公司 一种电路板组件

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN205611131U (zh) * 2016-03-15 2016-09-28 中兴通讯股份有限公司 一种多芯片式浮动散热装置
US20190132938A1 (en) * 2017-10-31 2019-05-02 Heatscape.Com, Inc. Floating core heat sink assembly
CN113805683A (zh) * 2021-08-20 2021-12-17 中航光电科技股份有限公司 一体式可浮动ai服务器液冷组件
CN216982368U (zh) * 2021-12-22 2022-07-15 锐捷网络股份有限公司 散热装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2476596T3 (es) * 2008-04-29 2014-07-15 Agie Charmilles Sa Unidad de placa de circuitos impresos y procedimiento para su fabricación
JP5065202B2 (ja) * 2008-08-28 2012-10-31 トヨタ自動車株式会社 半導体装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN205611131U (zh) * 2016-03-15 2016-09-28 中兴通讯股份有限公司 一种多芯片式浮动散热装置
US20190132938A1 (en) * 2017-10-31 2019-05-02 Heatscape.Com, Inc. Floating core heat sink assembly
CN113805683A (zh) * 2021-08-20 2021-12-17 中航光电科技股份有限公司 一体式可浮动ai服务器液冷组件
CN216982368U (zh) * 2021-12-22 2022-07-15 锐捷网络股份有限公司 散热装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP4601426A4

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119730199A (zh) * 2025-02-26 2025-03-28 东莞市嘉佰达电子科技有限公司 一种集成散热器的储能电池保护板
CN120529481A (zh) * 2025-07-23 2025-08-22 上海聪链信息科技有限公司 一种电路板组件

Also Published As

Publication number Publication date
CN118055591A (zh) 2024-05-17
EP4601426A1 (en) 2025-08-13
EP4601426A4 (en) 2026-02-11
US20250275096A1 (en) 2025-08-28

Similar Documents

Publication Publication Date Title
CN101674717B (zh) 散热装置
CN101573017B (zh) 散热装置
CN101636067B (zh) 散热装置
WO2024098790A1 (zh) 一种电子组件及电子设备
CN101909417A (zh) 散热装置及其制造方法
CN117794057A (zh) 一种散热组件及电路板组件
WO2020011045A1 (zh) 散热装置
CN106973555A (zh) 一种散热机箱及其印制板组件
CN213276533U (zh) 一种内存组件的散热装置
CN111405837B (zh) 一种绝缘高效导热散热装置
CN102892276B (zh) 基板及具有该基板的散热装置
CN210470147U (zh) 一种功率器件散热装置及电机驱动器
CN112601421A (zh) 一种3u密闭机箱高效散热结构
CN216693939U (zh) 冷却装置、电控盒及空调器
TW201347646A (zh) 散熱裝置組合
CN218244181U (zh) 散热装置及电子组件
CN213522815U (zh) 一种基于相变散热技术的高效散热密闭机箱
CN2857088Y (zh) 散热装置
CN211240248U (zh) 一种便于连接的pcb板
CN223798528U (zh) 电路板散热结构、控制器模组及车辆
CN100518473C (zh) 散热装置
CN219919549U (zh) 电子设备
CN223080344U (zh) 一种散热器模块及车载终端
CN223943020U (zh) 一种结构简单的散热装置
CN223067383U (zh) 屏蔽射频噪音弹片装置及散热屏蔽总成

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 23887486

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2023887486

Country of ref document: EP

ENP Entry into the national phase

Ref document number: 2023887486

Country of ref document: EP

Effective date: 20250507

NENP Non-entry into the national phase

Ref country code: DE

WWP Wipo information: published in national office

Ref document number: 2023887486

Country of ref document: EP