WO2024108406A1 - 一种光信号处理装置、芯片、激光雷达和终端 - Google Patents

一种光信号处理装置、芯片、激光雷达和终端 Download PDF

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Publication number
WO2024108406A1
WO2024108406A1 PCT/CN2022/133583 CN2022133583W WO2024108406A1 WO 2024108406 A1 WO2024108406 A1 WO 2024108406A1 CN 2022133583 W CN2022133583 W CN 2022133583W WO 2024108406 A1 WO2024108406 A1 WO 2024108406A1
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Prior art keywords
signal light
optical
processing device
laser
signal processing
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Ceased
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PCT/CN2022/133583
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English (en)
French (fr)
Inventor
李孟麟
刘彤辉
王伟
余安亮
张化红
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Huawei Technologies Co Ltd
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Huawei Technologies Co Ltd
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Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Priority to PCT/CN2022/133583 priority Critical patent/WO2024108406A1/zh
Priority to EP22966105.3A priority patent/EP4614185A4/en
Priority to CN202280097791.7A priority patent/CN119487415A/zh
Publication of WO2024108406A1 publication Critical patent/WO2024108406A1/zh
Priority to US19/216,564 priority patent/US20250283986A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481—Constructional features, e.g. arrangements of optical elements
    • G01S7/4814—Constructional features, e.g. arrangements of optical elements of transmitters alone
    • G01S7/4815—Constructional features, e.g. arrangements of optical elements of transmitters alone using multiple transmitters
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
    • G01S17/06—Systems determining position data of a target
    • G01S17/08—Systems determining position data of a target for measuring distance only
    • G01S17/32—Systems determining position data of a target for measuring distance only using transmission of continuous waves, whether amplitude-, frequency-, or phase-modulated, or unmodulated
    • G01S17/34—Systems determining position data of a target for measuring distance only using transmission of continuous waves, whether amplitude-, frequency-, or phase-modulated, or unmodulated using transmission of continuous, frequency-modulated waves while heterodyning the received signal, or a signal derived therefrom, with a locally-generated signal related to the contemporaneously transmitted signal
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481—Constructional features, e.g. arrangements of optical elements
    • G01S7/4817—Constructional features, e.g. arrangements of optical elements relating to scanning
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/491—Details of non-pulse systems
    • G01S7/4911—Transmitters
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/491—Details of non-pulse systems
    • G01S7/4912—Receivers
    • G01S7/4913—Circuits for detection, sampling, integration or read-out
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/491—Details of non-pulse systems
    • G01S7/4912—Receivers
    • G01S7/4917—Receivers superposing optical signals in a photodetector, e.g. optical heterodyne detection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481—Constructional features, e.g. arrangements of optical elements
    • G01S7/4811—Constructional features, e.g. arrangements of optical elements common to transmitter and receiver
    • G01S7/4812—Constructional features, e.g. arrangements of optical elements common to transmitter and receiver transmitted and received beams following a coaxial path
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481—Constructional features, e.g. arrangements of optical elements
    • G01S7/4818—Constructional features, e.g. arrangements of optical elements using optical fibres
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/499—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00 using polarisation effects

Definitions

  • the present application relates to optical devices, and in particular to an optical signal processing device, a chip, a laser radar and a terminal.
  • Light detection and ranging technology is a technology that emits detection signal light and obtains relevant information of the target (such as the target's position, shape, or speed, etc.) by detecting the target's return signal light.
  • coherent laser radar is a radar that uses frequency modulated signal light for target detection and processes the transmitted signal and the returned signal to obtain relevant information of the target.
  • the signal emitted by the coherent laser radar is often modulated in a certain form so that the frequency of the emitted signal changes with time.
  • the change rule can be a sawtooth, triangle or sine waveform. If the frequency change is linear and continuous, it is called linear frequency modulated continuous wave (Frequency Modulated Continuous Waves, FMCW).
  • FMCW laser radar combines laser linear sweep ranging technology.
  • the principle of distance detection is to measure the round-trip time of light transmission to the target, so as to obtain the target distance.
  • FMCW Linear frequency modulated continuous wave
  • Multi-channel transceiver LiDAR needs to emit detection signal light of multiple channels to ensure the output rate.
  • the embodiments of the present application provide an optical signal processing device, a chip, a laser radar and a terminal, which can increase the number of channels and the luminous power of signal light and improve the detection performance.
  • an embodiment of the present application provides an optical signal processing device, comprising at least one input port, a first beam splitting unit, a second beam splitting unit, and an M-stage amplification unit, where M is an integer and M ⁇ 2.
  • the at least one input port is used to receive signal light from at least one laser
  • the first beam splitting unit is used to split the signal light from the at least one laser into a plurality of sub-signal lights
  • the first stage amplifying unit in the M stage amplifying units is used to amplify one of the plurality of sub-signal lights to generate a first signal light;
  • the second beam splitting unit is used to split the first signal light into a plurality of second signal lights
  • the second-stage amplifying unit in the M-stage amplifying unit is used to amplify at least one second signal light among the plurality of second signal lights to generate a third signal light.
  • the signal light of the laser can be split by the beam splitting unit to obtain signal lights of multiple channels. These signal lights can pass through the multi-stage amplification unit, and the multi-stage amplification unit can perform multi-stage amplification on the signal light, thereby ensuring the power of the output signal light and improving the detection performance.
  • the working principle of the amplification unit is to obtain a higher power signal light through electric current.
  • the position of the amplification unit and the size of the driving current of each amplification unit can be flexibly designed to avoid excessive current in a certain amplification unit.
  • it can reduce the risk of burning out various electrical components due to excessive current and reduce the need for heat dissipation; on the other hand, it can reduce the crosstalk caused by large current, reduce noise and interference, and improve the effectiveness of the signal light.
  • the service life of the optical signal processing device can be increased and the detection performance can be significantly improved.
  • the multiple sub-signal lights include local oscillator signal light and detection signal light;
  • the first-stage amplifying unit is used to amplify the detection signal light to generate the first signal light.
  • the local oscillator signal light is used for subsequent mixing with the return signal light to obtain the beat frequency signal.
  • the detection signal light is used to be emitted into space for detection.
  • the local oscillator signal light is usually transmitted inside the optical signal processing device, and the energy loss is relatively small.
  • the energy loss of the signal light is relatively large when it is emitted into space and then received back.
  • the first-stage amplification unit is mainly used to amplify the detection signal light, so the power of the detection signal light can be accurately increased, thereby improving the detection performance.
  • some of the second signal lights are used as local oscillator signal lights, and another part of the second signal lights are used as detection signal lights.
  • the second-stage amplification unit is used to amplify the detection signal light to generate a third signal light.
  • the second-stage amplification unit is mainly used to amplify the detection signal light, so the power of the detection signal light can be accurately increased, thereby improving the detection performance.
  • the local oscillator signal light may need to be transmitted to the mixing unit for mixing with the return signal light, and the return signal light may also have multiple channels, multiple return signal lights may cause crosstalk between the optical paths of multiple detection signal lights.
  • the local oscillator signal light and the detection signal light are separated in the rear beam splitting unit, so that the local oscillator signal and the detection signal light can be interleaved, and the return signal light does not need to pass through the detection signal light for mixing, which can reduce the crosstalk between the signal lights and improve the effectiveness of the signal.
  • the optical signal processing device further includes a beam combining unit, and the at least one input port includes a first input port and a second input port, wherein:
  • the first input port is used to receive signal light from a first laser, and the second input port is used to receive signal light from a second laser;
  • the first beam splitting unit is used to split the signal light from the first laser into a plurality of fourth signal lights, and to split the signal light from the second laser into a plurality of fifth signal lights, wherein the plurality of fifth signal lights belong to the plurality of sub-signal lights;
  • the beam combining unit is used to combine at least one fourth signal light and at least one fifth signal light to obtain a sixth signal light;
  • the first-stage amplifying unit is used to amplify the sixth signal light to generate the first signal light.
  • the optical signal processing device is also suitable for processing signal lights of multiple lasers, and the above only takes the first laser and the second laser as an example. Part of the signal lights of these multiple lasers can be combined, and the combined signal lights are like the signal lights of a single light source during the transmission process, which can avoid crossing and reduce crosstalk.
  • the signal lights emitted by multiple lasers have different properties.
  • the return signal light is first split and then mixed with the local oscillator signal lights of the two lasers, so that multiple sampling points can be obtained using the return signal of one channel.
  • the first laser and the second laser can emit linear frequency modulated lasers with positive and negative slopes, respectively.
  • the detection signal light of one channel contains linear frequency modulated lasers with positive and negative slopes.
  • the detection signal light of this channel is irradiated to the same point on the target; after the return signal light is split, it is mixed with the local oscillator signal lights of the linear frequency modulated lasers with positive and negative slopes, respectively, to obtain two sampling points, which can improve the point output rate and enable the laser radar to obtain a higher point cloud resolution.
  • the signal light from the first laser and the signal light from the second laser have different frequency sweep slopes.
  • the signal light from the first laser and the signal light from the second laser have different central wavelengths.
  • the beam splitting of the return signal light may be demultiplexing, thereby separating the return signal lights corresponding to different lasers.
  • the first laser emits 1550nm laser light
  • the second laser emits 1310nm laser light.
  • the beam splitting unit used to separate the return signal light can separate the 1550nm laser light in the return signal light and the 1310nm laser light in the return signal light.
  • the 1550nm laser light in the return signal light is mixed with the local oscillator signal light of the first laser
  • the 1310nm laser light in the return signal light is mixed with the local oscillator signal light of the second laser. In this way, the output rate can be improved and the energy loss can be reduced.
  • the second beam splitting unit includes N beam splitters, the N beam splitters are arranged in a tree topology structure and each beam splitter serves as a node of the tree topology structure, N is an integer and N>0, and the signal light obtained by beam splitting by the beam splitter at each parent node position is provided to the beam splitter at the child node position;
  • the first signal light is input to the beam splitter at the root node position, and the plurality of second signal lights are output from the beam splitters at the leaf node positions.
  • the beam splitter may be a 1-to-M (M is an integer and M>1) beam splitter, such as a 1-to-2 beam splitter, a 1-to-3 beam splitter, etc.
  • M is an integer and M>1
  • the energy distribution of the split signal can be controlled, thereby flexibly designing the resolution distribution.
  • the signal light projected to the center of the field of view passes through fewer levels of beam splitters than the signal light projected to the edge of the field of view. In this way, the power of the signal light projected to the center of the field of view is higher than the power of the signal light projected to the edge of the field of view, thereby making the laser radar have higher resolution and higher detection accuracy in the center of the field of view.
  • the second-stage amplification unit includes a plurality of amplifiers
  • the multiple amplifiers are located after the beam splitter at the leaf node position.
  • an amplifier is arranged after the second beam splitting unit, and the signal light is input into the amplifier after being split, so that the power of the third signal light can be controlled more accurately and the stability of the detection signal light can be improved.
  • the multiple amplifiers are located between the beam splitters in the multiple tree topology structures.
  • the signal light will be split again after passing through the second-stage amplification unit, which is equivalent to several signal lights sharing one amplifier, thereby reducing the number of amplifiers and saving costs.
  • some of the multiple amplifiers are located after the beam splitters at leaf node positions, and another part of the amplifiers are located between the beam splitters in the multiple tree topological structures.
  • the user can set the position of the amplifier according to needs, control the power of the detection signal light, and improve the flexibility of optical path design and power design.
  • the optical signal processing device further includes a power controller, and the power controller is used to adjust the driving current of the second-stage amplifying unit to control the power of the signal light output by the second-stage amplifying unit.
  • the power of the signal light passing through the amplifying unit can be controlled by changing the driving current of the amplifying unit, thereby improving flexibility and reducing energy consumption.
  • the power controller is further used to:
  • the driving current of the second-stage amplifying unit is adjusted according to a control signal, wherein the control signal is related to the pointing angle of the scanner.
  • the transmit power is increased at the center of the field of view, and the transmit power is reduced at the edge of the field of view.
  • the optical power amplification function of the amplification unit is used.
  • the scanning invalid area refers to the scanning angle where the detection signal light cannot be fully projected onto the field of view. At this time, the detection signal may be projected into the device.
  • This implementation not only increases the measurement dynamic range of the lidar system and reduces overall power consumption, but also reduces stray light within the system.
  • control signal may be from a processor or from a controller.
  • the optical signal processing device further includes an optical input and output unit, and the optical input and output unit includes a plurality of output ports and a plurality of receiving ports;
  • the plurality of output ports are used to output the third signal light
  • the multiple receiving ports are used to receive the return signal light, wherein the return signal light includes the reflection of the third signal light;
  • the frequency mixing unit is used to obtain one or more frequency mixing results according to the return signal light and the local oscillator signal light, and the one or more frequency mixing results are used to determine relevant information of the target in the field of view;
  • the local oscillator signal light belongs to the multiple sub-signal lights, or belongs to the multiple second signal lights.
  • the optical signal processing device can also perform frequency mixing processing on the return signal light to obtain a frequency mixing result, which can further realize the integration of the device, improve the stability of the device, and reduce the volume.
  • the frequency mixing unit includes a third beam splitting unit, a first frequency mixer, and a second frequency mixer;
  • the third beam splitting unit is used to split the return signal light to obtain a first sub-return signal light and a second sub-return signal light,
  • the first mixer is used for mixing a first sub-local oscillator signal light and the first sub-return signal light to obtain a first mixing result, wherein the first sub-local oscillator signal light comes from a first laser;
  • the second mixer is used for mixing a second sub-local oscillator signal and the second sub-return signal light to obtain a second mixing result, and the second sub-local oscillator signal light comes from a second laser.
  • a return signal light can be split into multiple sub-return signal lights, so as to obtain multiple output points based on the beat frequency of multiple local oscillator signals, thereby improving the output point rate and thus improving the point cloud resolution.
  • the third beam splitting unit may be an energy beam splitting type beam splitting unit, or a wavelength beam splitting type beam splitting unit.
  • the optical signal processing device further includes a fourth beam splitting unit, the fourth beam splitting unit being configured to demultiplex the local oscillator signal light to obtain a first sub-local oscillator signal light and a second sub-local oscillator signal light, the first sub-local oscillator signal light being used as the local oscillator signal of the signal light from the first laser, and the second sub-local oscillator signal light being used as the local oscillator signal of the signal light from the second laser;
  • the local oscillation signal light includes the signal light from the first laser and the signal light from the second laser.
  • the fourth beam splitting unit may be an energy splitting type beam splitting unit, or a wavelength splitting type beam splitting unit.
  • the plurality of receiving ports are arranged in columns to form a receiving port group, and the plurality of output ports are arranged in columns to form an output port group;
  • the receiving port group and the output port group are arranged opposite to each other, and one output port and at least one receiving port are arranged opposite to each other and share a transceiver optical module.
  • the plurality of receiving ports are arranged in columns to form a receiving port group, and the plurality of output ports are arranged in columns to form an output port group;
  • the receiving port group shares a receiving optical module, and the output port group shares a transmitting optical module.
  • a spacing between output ports in a middle portion is smaller than a spacing between output ports in an edge portion.
  • the multiple receiving ports include a first receiving port, the output port includes a first output port, and the signal light received by the first receiving port includes a reflection of the signal light output by the first output port;
  • the optical signal processing device further comprises a power controller, wherein the power controller is used for:
  • the driving current of the second-stage amplifying unit is increased to increase the power of the detection signal light emitted by the first transmitting sub-port.
  • the optical input and output unit includes a first output port set and a second output port set, the first output port set and the second output port set each include at least one output port, the first output port set is used to emit detection signal light to a middle area of the field of view, and the second output port set is used to emit detection signal light to an edge area of the field of view;
  • the power of the detection signal light emitted from the first output port set is higher than the power of the detection signal light emitted from the second output port set.
  • the optical signal processing device further includes an optical switch, which is arranged between the second beam splitting unit and any output port and is used to control whether an optical path is formed between the second beam splitting unit and any output port.
  • the optical signal processing device further includes a feedback unit, and the multiple sub-signal lights include feedback signal light;
  • the feedback unit is used to detect the frequency sweep information and/or phase noise of the signal light from at least one laser according to the feedback signal.
  • the optical signal processing device further includes a multi-layer substrate and a plurality of waveguides, wherein the plurality of waveguides are used to form optical paths for transmitting signal light in different layers of the substrate.
  • optical paths for transmitting the local oscillator signal light and the return signal light are located in different layers of the substrate.
  • optical paths for transmitting the feedback signal light and the return signal light are located in different layers of the substrate.
  • an embodiment of the present application provides a chip, wherein the chip comprises one or more optical signal processing devices, and the optical signal processing device is the optical signal processing device as described in any one of the first aspect.
  • the chip further includes at least one laser input port and at least one optical switch, and the at least one laser input port includes a first laser input port;
  • the at least one laser input port is used to receive signal light from at least one laser
  • the at least one optical switch is arranged between the first laser input port and L optical signal processing devices, and is configured to: switchably couple the L optical signal processing devices to an optical path to control whether an optical path is formed between the L optical signal processing devices and the first laser input port, where L is an integer and L ⁇ K.
  • an optical route can be formed between multiple optical signal processing devices through at least one optical switch, so that one or more optical signal processing devices can be enabled as needed, thereby improving flexibility.
  • K ⁇ 2 K ⁇ 2
  • any two optical signal processing devices among the K optical signal processing devices are symmetrically arranged.
  • an embodiment of the present application provides a laser radar, wherein the laser radar comprises a laser, a scanner, and an optical signal processing device as described in any one of the first aspects;
  • the laser is used to provide frequency modulated signal light to the optical signal processing device
  • the scanner is used to project the third signal light from the optical signal processing device into the field of view.
  • an embodiment of the present application provides a laser radar, a laser, an array detector, a transceiver optical module, a scanner, and an optical signal processing device described in any one of the first aspects;
  • the laser is used to provide frequency modulated signal light to the optical signal processing device
  • the scanner is used to project the third signal light from the optical signal processing device into the field of view, and to receive the return signal light from the field of view and provide it to the optical signal processing device;
  • the transceiver optical module is arranged between the scanner and the optical signal processing device;
  • the array detector is used to receive one or more mixing results from the optical signal processing device and obtain an electrical signal based on the one or more mixing results, and the electrical signal is used to determine relevant information of the target in the field of view.
  • the optical module includes a polarization beam splitter and a quarter wave plate, and the polarization beam splitter and the quarter wave plate are used to achieve coaxial transmission and reception, wherein:
  • the third signal light is provided to the scanner through the output port of the optical signal processing device, the polarization beam splitter and the quarter wave plate in sequence;
  • the return signal light from the scanner passes through the quarter wave plate and the polarization beam splitter in sequence and is provided to the receiving port of the optical signal processing device.
  • the optical module further includes a half wave plate, and the half wave plate is arranged between the polarization beam splitter and the receiving port of the optical signal processing device.
  • an embodiment of the present application provides a terminal, which includes the optical signal processing device described in any one of the first aspect, or the terminal includes the chip described in any one of the second aspect, or the terminal includes a laser radar as described in any one of the third aspect or any one of the fourth aspect.
  • the terminal is a vehicle, a drone or a robot.
  • FIG1 is a schematic diagram of the working principle of an amplifier
  • FIG2 is a schematic diagram of the structure of an optical signal processing device provided in an embodiment of the present application.
  • FIG3 is a schematic diagram of the structure of another optical signal processing device provided in an embodiment of the present application.
  • FIG4 is a schematic diagram of the structure of another optical signal processing device provided in an embodiment of the present application.
  • FIG5 is a schematic diagram of the structure of another possible optical signal processing device provided in an embodiment of the present application.
  • FIG6A is a schematic diagram of the structure of another possible optical signal processing device provided in an embodiment of the present application.
  • FIG6B is a schematic diagram of the slope of a signal light of a multi-laser provided in an embodiment of the present application.
  • FIG7A is a schematic diagram of the structure of another signal processing device provided in an embodiment of the present application.
  • FIG7B is a schematic diagram of the structure of another signal processing device provided in an embodiment of the present application.
  • FIG7C is a schematic diagram of the structure of another optical signal processing device provided in an embodiment of the present application.
  • FIG7D is a schematic diagram of the structure of another possible optical signal processing device provided in an embodiment of the present application.
  • FIG8A is a schematic diagram of the structure of another optical signal processing device provided in an embodiment of the present application.
  • FIG8B is a schematic diagram of the structure of another optical signal processing device provided in an embodiment of the present application.
  • FIG8C is a schematic diagram of the structure of another optical signal processing device provided in an embodiment of the present application.
  • FIG8D is a schematic diagram of the structure of another optical signal processing device provided in an embodiment of the present application.
  • FIG9A is a schematic diagram of another optical signal processing device provided in an embodiment of the present application.
  • FIG9B is a schematic diagram of another optical signal processing device provided in an embodiment of the present application.
  • FIG10A is a schematic diagram of the structure of another possible optical signal processing device provided in an embodiment of the present application.
  • FIG10B is a schematic diagram of the structure of another possible optical signal processing device provided in an embodiment of the present application.
  • FIG10C is a schematic diagram of the structure of another possible optical signal processing device provided in an embodiment of the present application.
  • FIG10D is a schematic diagram of the structure of another possible optical signal processing device provided in an embodiment of the present application.
  • FIG11A is a schematic diagram of the structure of another possible optical signal processing device provided in an embodiment of the present application.
  • FIG11B is a schematic diagram of the structure of another possible optical signal processing device provided in an embodiment of the present application.
  • FIG11C is a schematic diagram of the structure of another possible optical signal processing device provided in an embodiment of the present application.
  • FIG11D is a schematic diagram of the structure of another possible optical signal processing device provided in an embodiment of the present application.
  • FIG12A is a schematic diagram of a relative arrangement of a receiving port and an output port provided in an embodiment of the present application
  • FIG12B is a schematic diagram of an optical path provided in an embodiment of the present application.
  • FIG12C is a schematic diagram of a relative arrangement of a receiving port and an output port provided in an embodiment of the present application.
  • FIG13A is a schematic diagram of another relative arrangement of a receiving port and an output port provided in an embodiment of the present application.
  • FIG13B is a schematic diagram of another optical path provided in an embodiment of the present application.
  • FIG14 is a schematic diagram of another output port and a receiving port provided in an embodiment of the present application.
  • FIG15A is a schematic diagram of an output port provided in an embodiment of the present application.
  • FIG15B is a schematic diagram of a possible output port provided in an embodiment of the present application.
  • FIG16 is a schematic diagram of an off-axis optical path provided in an embodiment of the present application.
  • FIG17 is a schematic diagram of a coaxial optical path provided in an embodiment of the present application.
  • FIG18 is a schematic diagram of an optical switch provided in an embodiment of the present application.
  • FIG19 is a schematic diagram of another optical switch provided in an embodiment of the present application.
  • FIG20 is a schematic diagram of a possible feedback unit provided in an embodiment of the present application.
  • FIG21 is a schematic diagram of an application of a possible optical signal processing device provided in an embodiment of the present application.
  • FIG22 is a schematic diagram of another possible application of an optical signal processing device provided in an embodiment of the present application.
  • FIG23 is a schematic diagram of an application of another optical signal processing device provided in an embodiment of the present application.
  • FIG24 is a schematic diagram of an application of another optical signal processing device provided in an embodiment of the present application.
  • FIG25 is a schematic diagram of an application of another optical signal processing device provided in an embodiment of the present application.
  • FIG26 is a schematic diagram of an application of another optical signal processing device provided in an embodiment of the present application.
  • FIG27 is a schematic diagram of an application of another optical signal processing device provided in an embodiment of the present application.
  • FIG28 is a schematic diagram of an application of another optical signal processing device provided in an embodiment of the present application.
  • FIG29 is a schematic diagram of an application of another optical signal processing device provided in an embodiment of the present application.
  • FIG30 is a schematic diagram of an application of another optical signal processing device provided in an embodiment of the present application.
  • FIG31 is a schematic diagram of a possible silicon photonic chip provided in an embodiment of the present application.
  • FIG32 is a schematic diagram of another possible silicon photonic chip provided in an embodiment of the present application.
  • FIG33 is a schematic diagram of a working scenario of an optical signal processing device provided in an embodiment of the present application.
  • FIG34 is a schematic diagram of a working scenario of another optical signal processing device provided in an embodiment of the present application.
  • FIG35 is a schematic diagram of a working scenario of another optical signal processing device provided in an embodiment of the present application.
  • FIG. 36 is a schematic diagram of the structure of a laser radar provided in an embodiment of the present application.
  • Figure 37 is a schematic diagram of a working scenario of a laser radar provided in an embodiment of the present application.
  • the detection device mentioned in the embodiments of the present application may be a laser radar or other optical detection devices, such as a fusion detection device (for example, a detection device integrating a radar detector and an image sensor). Its working principle is to detect the corresponding detection area by emitting detection signal light and receiving the returned signal light.
  • a fusion detection device for example, a detection device integrating a radar detector and an image sensor.
  • the detection device in the embodiment of the present application can be used in various fields such as intelligent driving, intelligent transportation, intelligent manufacturing, environmental detection, surveying and mapping, drones, etc., and can complete one or more functions of target detection, distance measurement, speed measurement, target tracking, imaging recognition, etc.
  • the detection device in the embodiment of the present application can be applied to a vehicle-mounted detection device (such as a vehicle-mounted radar), a roadside detection device (such as an intersection radar), etc., and can also be applied to other detection devices, such as detection devices installed on drones, robots, rail cars, bicycles, signal lights, speed measuring devices or base stations, etc.
  • vehicle-mounted detection device such as a vehicle-mounted radar
  • roadside detection device such as an intersection radar
  • the present application does not limit the location where the detection device is installed.
  • a waveguide is a structure used to directional guide electromagnetic waves, so that electromagnetic waves can be transmitted between their endpoints.
  • Light is also an electromagnetic wave, and the waveguide that transmits light is called an optical waveguide, such as a planar dielectric optical waveguide or an optical fiber.
  • Polarization refers to the fact that the vibration direction of the electric vector of light has a certain regularity. Polarization is a property of light, and the polarization state is a parameter of light. The polarization state can be divided into: linear polarization, elliptical polarization (including circular polarization), etc.
  • a polarization beam splitter is an optical filter.
  • the transmittance of signal light when passing through the polarization beam splitter is related to the polarization direction of the signal light.
  • linear polarized light in a certain polarization direction can pass through, while light in certain polarization directions is blocked (cannot pass through).
  • P-light represents linear polarized light whose polarization direction is parallel to the polarization direction of the beam splitter
  • S-light represents linear polarized light whose polarization direction is perpendicular to the polarization direction of the beam splitter.
  • the polarization state of light is also described by transverse electric (TE) or transverse magnetic (TM).
  • TE polarized light can pass through the polarization beam splitter, and the transmitted signal light still maintains TE polarization.
  • TE polarization can be converted into circular polarized light or elliptically polarized light after passing through a quarter wave plate (QWP) once, and the circular polarized light or elliptically polarized light is converted into TM polarized light after passing through the quarter wave plate again, and the TM polarized light is reflected when passing through the polarization beam splitter.
  • QWP quarter wave plate
  • Wave plates also known as phase retarders, can cause phase shifts in the two mutually orthogonal polarization components of light passing through the wave plate, and can be used to adjust the polarization state of light.
  • wave plates can be divided into half wave plates (HWP), QWP, eighth wave plates, etc.
  • the QWP shown in some embodiments of the present application may also be replaced by one or more of a Faraday rotator, a combination of a Faraday rotator and a wave plate, a combination of a quarter wave plate and a half wave plate, or a combination of two eighth wave plates.
  • Field of view refers to the range that can be detected by the detection device, also known as the field of view.
  • LOS line of sight
  • This line of sight area can be understood as the field of view.
  • An optical amplifier is a device that amplifies signal light, hereinafter referred to as an amplifier.
  • the principle of the amplifier is basically based on the stimulated radiation of lasers, which converts other energy into the energy of signal light, thereby achieving amplification.
  • Amplifiers include but are not limited to semiconductor amplifiers or fiber amplifiers.
  • semiconductor amplifiers semiconductor optical amplifiers, SOA
  • SOA semiconductor optical amplifiers
  • FIG. 1 it is a schematic diagram of the working principle of the amplifier. After the driving current is input into the amplifier, when the signal light passes through the amplifier, the electrons lose energy in the form of photons, generating excited photons. The excited photons have the same wavelength (and other characteristics) as the optical signal.
  • the driving current converts semiconductor carriers into inversion particles, so that the injected seed light amplitude is amplified and the basic physical properties of the injected seed light, such as polarization, line width and frequency, are maintained.
  • the driving current increases, the output light power also increases in a certain functional relationship. Therefore, using SOA can amplify the power of the signal light without significantly changing its optical properties.
  • FMCW refers to electromagnetic waves whose frequency changes with time.
  • the frequency of an electromagnetic wave changes linearly with time, it is called a linear frequency modulated continuous wave.
  • the linear change here generally refers to the linear change within a transmission cycle.
  • the waveform of the linear frequency modulation continuous wave is generally a sawtooth wave or a triangle wave.
  • FMCW may also have other possible waveforms, such as a linear frequency modulation step frequency waveform.
  • the optical signal processing device includes a first beam splitting unit 201, a second beam splitting unit 202 and a multi-stage amplification unit, and the black thick line represents the transmission path of the light.
  • the number of stages of the amplification unit is described as M stages below, where M is an integer and M ⁇ 2.
  • the first beam splitting unit 201 is used to split the signal light from the laser to obtain a plurality of sub-signal lights.
  • the sub-signal lights may include sub-signal light a0 and sub-signal light a1 .
  • part of the sub-signal lights (e.g., sub-signal light a 0 ) among the multiple sub-signal lights may be transmitted to the second beam splitting unit 202. Further, another part of the photon signal (e.g., sub-signal light a 1 ) may be transmitted to other units (not shown). For example, part of the sub-signal lights may be transmitted to the frequency mixing unit as local oscillator signal lights. And/or, part of the sub-signal lights may be input to the feedback unit as feedback signal lights.
  • each sub-signal among the multiple sub-signals is transmitted to the second beam splitting unit 202 .
  • the two sub-signal lights shown in FIG2 are only examples, and the present application does not limit the number of sub-signal lights.
  • the number of lasers shown in FIG2 is only an example.
  • the signal light from the laser can be a signal light whose frequency changes linearly with time, for example, the signal light from the laser can be a frequency modulated continuous wave (FMCW) laser.
  • FMCW frequency modulated continuous wave
  • the second beam splitting unit 202 is used to split the input signal light into multiple second signal lights.
  • the multiple second signal lights may include a second signal light b0 and a second signal light b1 .
  • the two second signal lights shown in FIG2 are only examples, and the present application does not limit the number of second signal lights.
  • part of the second signal lights among the plurality of second signal lights can be emitted from the optical signal processing device to form detection signal lights. Further, another part of the second signal lights can be used as local oscillator signal lights or feedback signal lights.
  • Each of the M-stage amplification units is used to amplify the intensity of the signal light.
  • the signal light passing through can be amplified in stages. It should be understood that a multi-stage amplification unit does not refer to multiple amplification units, but refers to at least two amplifications for a certain signal light.
  • the number of amplifying units included in each stage of amplifying units may be one or more.
  • the amplifying unit 203c is a stage of amplifying units, which may include multiple amplifying units, each of which is used to amplify one channel of second signal light.
  • the multi-stage amplification unit can be dispersedly arranged between multiple other units.
  • the amplification unit 203a is one of the first-stage amplification units
  • the amplification unit 203b is one of the first-stage amplification units
  • the amplification unit 203c is one of the first-stage amplification units.
  • the M-stage amplification unit may include at least two of the amplification units 203a, 203b, and 203c.
  • FIG3 is a schematic diagram of the structure of another optical signal processing device provided by an embodiment of the present application, where amplifying unit 301a is one stage of amplifying unit and amplifying unit 301b is another stage of amplifying unit.
  • the optical signal processing device may further include an input port, and the input port is used to receive signal light from a laser.
  • the signal light of the laser is split by the splitting unit to obtain signal lights of multiple channels. These signal lights can pass through the multi-stage amplification unit, and the multi-stage amplification unit can perform multi-stage amplification on these signal lights, thereby ensuring the power of the output signal light.
  • the signal light from the laser can be split and amplified to increase the number of channels and ensure the power of the signal light of each channel, which can reduce costs and ensure detection performance, and has great commercial value.
  • the working principle of the amplifier unit is to generate a higher power signal light by driving the current.
  • the position of the amplifier unit and the current size of each amplifier unit can be flexibly designed to avoid excessive current in a certain amplifier unit.
  • it can reduce the risk of burning out various electrical components due to excessive current and reduce the need for heat dissipation; on the other hand, it can reduce the crosstalk caused by high current, reduce noise and interference, and improve the effectiveness of the signal light.
  • the service life of the optical signal processing device can be extended and the detection performance can be improved.
  • part or all of the modules of the optical signal processing device may be chips, or implemented in chips.
  • the chip here may be a silicon photonic chip, an integrated circuit (IC) chip, etc.
  • part or all of the modules of the optical signal processing device can be implemented on a material platform, which is also referred to as a substrate.
  • the material of the material platform can be semiconductor, ceramic, glass, or plastic.
  • the materials in the material platform include but are not limited to complementary metal-oxide-semiconductor (CMOS), silicon dioxide, silicon nitride, silicon oxynitride, indium phosphide, and silicon-on-insulator (SOI), etc.
  • CMOS complementary metal-oxide-semiconductor
  • SOI silicon-on-insulator
  • the optical signal processing device when the optical signal processing device is implemented in the form of a chip or on a material platform, the signal light is transmitted in the chip (or material platform) through a waveguide.
  • the material platform further includes but is not limited to a silicon-on-insulator (SOI) waveguide platform, a silicon nitride waveguide platform, a silicon oxynitride waveguide platform, and a silicon dioxide planar light waveguide circuit (PLC) waveguide platform.
  • SOI silicon-on-insulator
  • PLC silicon dioxide planar light waveguide circuit
  • the material bottle can also be a multilayer waveguide platform including multiple types of waveguides stacked.
  • the amplifier can be implemented in a chip manner.
  • the amplifier can be coupled inside the chip (or material platform), or coupled outside the chip (or material platform), such as outside the chip.
  • the amplifier can be implemented by a chip and has an incident end face and an output end face.
  • the incident end face of the amplifier is coupled with a waveguide, so that the signal light can enter the incident end face of the SOA from the waveguide in the chip.
  • the output end face may also be coupled with the waveguide, so that the amplified signal light enters the waveguide from the output end face and continues to be transmitted.
  • the amplifier can be coupled to the silicon photonic chip in an integrated manner.
  • the amplifier chip is coupled to the silicon photonic chip in a flip-chip manner.
  • Flip-chip means that the amplifier chip and the silicon photonic chip are processed separately, and when integrated, one of the chips (usually the amplifier chip) is turned upside down to make it fit together with the other chip.
  • the amplifier chip is coupled to the silicon photonic chip in a spatial light manner through a lens or the like.
  • the two chips are usually tightly fitted together without passing through a lens.
  • the spatial light method there is a space between the two chips and a lens is set in the space. After the signal light is emitted from one chip, it is converged through the lens and then enters the other chip.
  • the amplifier chip is coupled to the silicon photonic chip by bonding wafer to wafer.
  • the amplifier chip is coupled to the silicon photonic chip by bonding wafer to wafer.
  • the M-stage amplification unit at least includes a first-stage amplification unit and a second-stage amplification unit.
  • FIG4 is a schematic diagram of the structure of another possible optical signal processing device provided in an embodiment of the present application.
  • the signal light from the laser passes through the first beam splitting unit 201 and is split into a plurality of sub-signal lights.
  • the first-stage amplifying unit 401 is used to amplify at least one of the plurality of sub-signal lights to generate a first signal light.
  • the second beam splitting unit 202 is used to split the first signal light into a plurality of second signal lights.
  • the second-stage amplifying unit 402 is used to amplify at least one of the plurality of second signal lights to generate a third signal light.
  • the second-stage amplifying unit 402 includes a plurality of amplifying units, such as the amplifying unit 402 a and the amplifying unit 402 b shown in FIG. 4 .
  • each stage of amplification units is dispersedly arranged after the light splitting unit.
  • amplifying part or all of the signal light after light splitting can further reduce the current range of the amplification unit.
  • the multi-channel signals after light splitting usually have different functions or point to different areas in the field of view.
  • the beam splitting unit can split the signal light into multiple paths, and each stage of the amplification unit is arranged after the beam splitting unit.
  • each stage of amplification unit can be used to amplify part of the split signal light, that is, at least one sub-signal light is part of the sub-signal light among multiple sub-signal lights, and/or at least one second signal light is part of the second signal light among multiple second signal lights.
  • the multiple sub-signal lights include local oscillator signal light and detection signal light
  • one of the multi-stage amplification units e.g., the first-stage amplification unit
  • the multiple sub-signal lights obtained by the first beam splitting unit include sub-signal light a0 and sub-signal light a1
  • sub-signal light a0 is used as the detection signal light
  • sub-signal light a1 is used as the local oscillator signal light.
  • the first-stage amplification unit 401 is used to amplify the detection signal light.
  • the local oscillator signal light is used for frequency mixing, obtaining a beat frequency signal, frequency multiplication, or frequency division, etc.
  • the detection signal light is used for emitting into the field of view for detection.
  • the first-stage amplification unit is mainly used to amplify the detection signal light, which can accurately increase the power of the detection signal light and improve the detection performance.
  • some of the second sub-signals in the plurality of second sub-signal lights are used as local oscillator signal lights, and some of the second sub-signals are used as detection signal lights.
  • One of the amplification units (e.g., the second amplification unit) in the multi-stage amplification unit is used to amplify the detection signal light to generate the first signal light.
  • FIG5 is a schematic diagram of the structure of another possible optical signal processing device provided by an embodiment of the present application.
  • the multiple second signal lights obtained by the first beam splitting unit include the second signal light b0 , the second signal light b1 , the second signal light b2 and the second signal light b3 .
  • the second signal light b0 and the second signal light b2 are used as detection signal lights, and the second signal light b1 and the second signal light b3 are used as local oscillator signal lights.
  • the second-stage amplification unit 501 is used to amplify the detection signal light.
  • the second-stage amplifying unit 501 includes a plurality of amplifying units, such as an amplifying unit 501a and an amplifying unit 501b, wherein the amplifying unit 501a is used to amplify the second signal light b0 , and the amplifying unit 501c is used to amplify the second signal light b2 .
  • the second-stage amplification unit is mainly used to amplify the detection signal light, which can accurately increase the power of the detection signal light and improve the detection performance.
  • the local oscillator signal light and the detection signal light are interwoven in the plurality of second signal lights. That is, the signal lights on both sides of the local oscillator signal light are detection signal lights, and the signal lights on both sides of the detection signal light are local oscillator signal lights.
  • the second signal light b 0 detection signal light
  • the second signal light b 1 local oscillator signal light
  • the second signal light b 1 local oscillator signal light
  • the second signal light b 2 detection signal light
  • the local oscillator signal light may need to be transmitted to the mixing unit for mixing with the return signal light, and the return signal light may also have multiple channels, which may cause multiple return signal lights to cross the optical paths of multiple detection signal lights, resulting in crosstalk.
  • the local oscillator signal light and the detection signal light are separated in the rear beam splitting unit, so that the local oscillator signal and the detection signal light can be intertwined, and the return signal light does not need to pass through the detection signal light for mixing, which can reduce the crosstalk between the signal lights and improve the effectiveness of the signal.
  • the signal light input to the first beam splitting unit comes from multiple lasers.
  • the following is an example of two lasers (referred to as the first laser and the second laser for easy distinction), and the present application is also applicable to other numbers of lasers.
  • the signal light from the first laser and the signal light from the second laser are passed through the first beam splitting unit to obtain a plurality of sub-signal lights, and one of the first-stage amplification units in the multi-stage amplification unit is used to amplify at least one sub-signal light to generate a first signal light, and the at least one sub-signal light includes part of the signal light from the first laser and part of the signal light from the second laser.
  • the subsequent processing process can refer to the aforementioned embodiment and other designs.
  • the optical signal processing device may include a beam combining unit, which is used to combine part of the signal light from the first laser and part of the signal light from the second laser to obtain the at least one signal light.
  • the beam combining unit can be implemented by a multi-wavelength beam combining structure such as wavelength division multiplexing (WDM) and arrayed waveguide grating (AWG), or can be implemented by an optical energy beam combining structure such as a multi-mode interferometer (MMI) and a directional coupler (DC). It is understandable that since the optical path is reversible, WDM, AWG, MMI, DC, etc. can also be used for beam splitting and/or demultiplexing.
  • WDM wavelength division multiplexing
  • AWG arrayed waveguide grating
  • DC directional coupler
  • FIG6A is a schematic diagram of the structure of another possible optical signal processing device provided in an embodiment of the present application.
  • the first beam splitting unit 601 is used to split the signal light from the first laser into a plurality of fourth signal lights, and to split the signal light from the second laser into a plurality of fifth signal lights.
  • the fourth signal light and the fifth signal light here can be regarded as the aforementioned sub-signal lights.
  • the number of the fourth signal light and the fifth signal light is not limited in this application.
  • the plurality of fourth signal lights may include fourth signal light c 0 and fourth signal light c 1
  • the plurality of fifth signal lights may include fifth signal light d 0 and fifth signal light d 1 .
  • the optical signal processing device further comprises a beam combining unit 602, which is used to combine at least one fourth signal light and at least one fifth signal light to obtain a sub-signal light a 1.
  • a beam combining unit 602 which is used to combine at least one fourth signal light and at least one fifth signal light to obtain a sub-signal light a 1.
  • the signal light obtained after combining is referred to as the sixth signal light.
  • One of the M-stage amplification units is used to amplify the sixth signal light (ie, the sub-signal light a 1 shown in FIG6A ) to generate the first signal light.
  • the subsequent processing may refer to the above.
  • the optical signal processing device is also suitable for processing signal lights of multiple lasers, and the above only takes the first laser and the second laser as an example. Part of the signal lights of these multiple lasers can be combined, and the combined signal lights are like the signal lights of a single light source during the transmission process, which can avoid crossing and reduce crosstalk.
  • the signal lights emitted by the multiple lasers generally have different properties.
  • the signal light from the first laser and the signal light from the second laser have different sweep slopes.
  • the signal light from the first laser and the signal light from the second laser have different central wavelengths.
  • demultiplexing the return signal can distinguish the return signals of different detection signal lights, so that multiple sampling points can be obtained using the return signal of one channel.
  • the first laser and the second laser can emit linear frequency modulated lasers with positive and negative slopes respectively.
  • the detection signal light of one channel contains linear frequency modulated lasers with positive and negative slopes, and the detection signal light of this channel is irradiated to the same point of the target; the return signal can be mixed separately through beam splitting to obtain two sampling points, which can improve the point output rate and obtain a higher point cloud resolution.
  • FIG. 6B it is a schematic diagram of the slope of a signal light of a multi-laser provided in an embodiment of the present application. It can be seen that in the time period t0-t1, laser 1 emits a positive slope sweep laser, while laser 2 emits a negative slope sweep laser. Therefore, during the beat frequency, the return signal obtained after the target reflection can be separated and mixed with each local oscillator to form a beat frequency signal of different frequencies.
  • the beat frequency signal can be intercepted in sequence according to time to obtain multiple signal segments, and the multiple signal segments are used to obtain information of multiple measurement points respectively.
  • the first segment of the signal with a coherent duration of N1 is taken for processing after the flight time to obtain the distance and speed information of the first measurement point; during the second beat frequency, the second segment of the signal with a coherent duration of N2 is taken for processing to obtain the information of the second measurement point, and the lengths of the two segments can be equal or unequal.
  • FIG. 6B is introduced with different directions of the frequency sweep slopes.
  • signal lights of different lasers may be distinguished by other methods.
  • both laser 1 and laser 2 emit positive slope swept laser or negative slope swept laser, but the sweep slope (ie, sweep speed) is different.
  • laser 1 and laser 2 emit lasers of different wavelength ranges.
  • the different wavelength ranges here refer to different central wavelengths, which can also be understood as different upper and lower limits of the wavelength ranges of the lasers. That is, the wavelength ranges of the two may have a certain overlap, but not completely overlap.
  • laser 1 emits infrared light
  • laser 2 emits visible light.
  • the beam splitting unit may include one or more beam splitters, and the present application does not limit the number of paths of the beam splitter.
  • the beam splitter may be a one-to-two beam splitter, or a one-to-three beam splitter.
  • the beam splitting unit may include a plurality of beam splitters, and the plurality of beam splitters may be arranged in a tree structure to output signals of a plurality of channels through multiple light splitting operations.
  • the number of beam splitters included in the second beam splitting unit is, for example, N, where N is an integer and N>0.
  • the N beam splitters are arranged in a tree topology structure and each beam splitter serves as a node of the tree topology structure.
  • the signal light obtained by the beam splitter at each parent node position is provided to the beam splitter at the child node position.
  • the first signal light is input to the beam splitter at the root node position, and the multiple second signal lights are output from the beam splitters at the leaf node positions.
  • FIG7A is a schematic diagram of the structure of another signal processing device provided by an embodiment of the present application.
  • the first beam splitting unit 701 includes a one-to-two beam splitter, which splits the signal light from the laser into two sub-signal lights;
  • the second beam splitting unit 702 includes multiple one-to-two beam splitters, each of which splits the input signal light into two parts, and finally outputs multiple second signal lights from the beam splitter at the leaf node position.
  • multiple signal lights can be split by waveguides, that is, beam splitters can be implemented by waveguides.
  • beam splitters can be implemented by waveguides.
  • Using optical waveguides as beam splitting units is easier to integrate, can further reduce the volume, and improve stability.
  • waveguide splitting can reduce the energy loss caused by optical splitting, improve signal effectiveness, and avoid stray light.
  • the second beam splitting unit includes a plurality of waveguides, each waveguide is used to split the input signal light into a plurality of parts, and finally output a plurality of second signal lights.
  • the waveguide 703 can be used as a first beam splitting unit to split the input signal light into multiple sub-signal lights at region 704.
  • the second beam splitting unit 705 includes multiple waveguides, each of which includes multiple forks, and splits the input signal light into multiple second signal lights through the forks of the multiple waveguides.
  • one of the first-stage amplification units of the M-stage amplification units includes a plurality of amplifiers, and the plurality of amplifiers are located after the beam splitter at the leaf node position.
  • the SOA is located after the last beam splitter.
  • each second signal light has passed through the same light splitting level, but it is not limited to that each second signal light has the same power.
  • the beam splitter can set the splitting ratio when splitting light. For example, in the two signal lights split by a one-to-two beam splitter, the energy of one signal light can be higher than that of the other.
  • part of the second signal light can have a higher power, so that the power of the signal light can be designed according to the requirements of the detection result (such as resolution, detection accuracy or detection distance, etc.).
  • the second signal light used to be emitted to the area of interest in the field of view has a higher power to improve the resolution and detection accuracy of the detection result of the area of interest.
  • the region of interest may be the middle portion of the field of view, or a predefined field of view area, etc.
  • Implementation method 2 The number of layers of the optical splitter experienced by part of the second signal light is different from the number of layers of the optical splitter experienced by another part of the second signal light.
  • FIG. 7C a structural schematic diagram of another optical signal processing device provided in an embodiment of the present application, the second beam splitting unit 706 splits the output signal light into multiple second signal lights. Among them, the second signal light corresponding to part 1 and the second signal light corresponding to part 3 undergo four-layer optical splitting, while the second signal light corresponding to part 2 undergoes three-layer optical splitting.
  • part of the second signal light can have a higher power, so that the power of the signal light can be designed according to the requirements of the detection results (such as resolution, detection accuracy or detection distance, etc.).
  • the second signal light used to be emitted to the area of interest in the field of view undergoes relatively fewer light splitting levels, so these second signal lights have higher power to improve the resolution and detection accuracy of the detection results of the area of interest.
  • FIG. 7D is a schematic diagram of the structure of another possible optical signal processing device provided in an embodiment of the present application, in which the second beam splitting unit 707 divides the output signal light into a plurality of second signal lights. Among them, the second signal light 708 is obtained by merging two signal lights in area 709. The second signal light 708 may have a higher power.
  • the above implementation method of achieving the power difference of the second signal lights by using the light splitting unit is only an example, and the difference between the second signal lights may be achieved by other methods during the specific implementation process.
  • the tree-shaped beam splitter structure can be used to control the energy distribution of the split signal, thereby flexibly designing the resolution distribution of the detection device.
  • the second beam splitter unit includes multiple beam splitters in a tree structure, and each beam splitter serves as a node of the tree topology.
  • the tree structure contains multiple branches, which makes the position design of the amplification unit more flexible. The following are several possible situations of the amplification unit:
  • some of the M-stage amplification units include multiple amplifiers, and the multiple amplifiers are located after the beam splitter at the leaf node position.
  • multiple SOAs are arranged after the beam splitter at the leaf node position.
  • an amplifier is arranged after the second beam splitting unit, and the signal light is input into the amplifier after being split, so that the power of the third signal light can be controlled more accurately and the stability of the detection signal light can be improved.
  • some stage amplification units include multiple amplifiers, and the multiple amplifiers are located between multiple beam splitters in a tree topology structure.
  • FIG8A is a schematic diagram of the structure of another optical signal processing device provided in an embodiment of the present application, wherein the second beam splitting unit includes two beam splitting units, namely, a beam splitting unit 801 and a beam splitting unit 802.
  • the beam splitting unit 801 includes a plurality of beam splitters, and the beam splitting unit also includes a plurality of beam splitters, and the signal light input into the beam splitting unit 802 is obtained by beam splitting the beam splitting unit 801.
  • a first-stage amplification unit, namely, an amplification unit 803, is provided between the beam splitting unit 801 and the beam splitting unit 802, and the amplification unit 803 includes a plurality of SOAs.
  • the beam splitting unit 801 is used to split the input signal light into a plurality of second signal lights, such as the second signal light b 0 , the second signal light b 1 , the second signal light b 3 , and the second signal light b 1 shown in FIG8A .
  • the amplifying unit 803 is used to amplify at least one second signal light among the plurality of second signal lights to obtain a plurality of third signal lights.
  • the plurality of third signal lights can be further input into the beam splitting unit 802 for further beam splitting.
  • the design of the SOA shown in FIG8A is only an example, and other designs may be used in the specific implementation process.
  • the SOA may be arranged on the transmission path of part of the second signal light, and in this case, the amplification unit 803 is used to amplify part of the second signal light.
  • part of the second signal light (or the third signal light) may no longer be split.
  • the signal light will be split again after passing through the second-stage amplification unit, which is equivalent to several signal lights sharing one amplifier, which can reduce the number of amplifiers and save costs.
  • adding a beam splitter after the final amplifier can increase the number of transmission channels and improve the output rate.
  • some stage amplification units include multiple amplifiers. Some of the multiple amplifiers are located after the beam splitters at the leaf node positions, and another part of the amplifiers are located between the beam splitters in the multiple tree topological structures.
  • a first-stage amplification unit namely, amplification unit 804, is provided between beam splitting unit 801 and beam splitting unit 802.
  • a first-stage amplification unit namely, amplification unit 805, is provided after beam splitting unit 802.
  • the amplifying unit 804 includes a plurality of SOAs, which are used to amplify part of the second signal light to obtain a third signal light, and this part of the third signal light can be input into the beam splitting unit 802 for further splitting. Another part of the second signal light that has not been amplified is also input into the beam splitting unit 802, and the signal light obtained after the splitting is input into the amplifying unit 805 for amplification.
  • part of the third signal light is amplified by the amplifier and then split, which is equivalent to the final part of the signal light sharing one amplifier; part of the signal light is amplified after multi-layer splitting, that is, each signal light is independently amplified by an amplifier, so that the power of the detection signal light can be set according to demand, which can save a certain cost and give priority to ensuring the power of part of the detection signal light.
  • FIG8C is a schematic diagram of the structure of another optical signal processing device provided in an embodiment of the present application, wherein a first-stage amplification unit, i.e., amplification unit 803, is provided between beam splitting unit 801 and beam splitting unit 802.
  • the amplifying unit 803 is used to amplify the multiple second signal lights to obtain the third signal light, and this part of the third signal light can be input into the beam splitting unit 802 for further splitting. Part of the signal light obtained by the beam splitting unit 802 is amplified by the amplifying unit 806.
  • the manufacturer can set the position of the amplifier according to the needs, control the power of the detection signal light, and improve the flexibility of the optical path design and power design.
  • the final amplifier unit in the M-stage amplifier unit includes multiple amplifiers, and the multiple amplifiers are located after the second beam splitting unit.
  • the signal light after passing through the final amplifier unit may be split again.
  • FIG8D a structural schematic diagram of another optical signal processing device provided in an embodiment of the present application is shown in FIG8D.
  • an amplifier unit 808 i.e., a final amplifier unit
  • the second beam splitting unit 807 is used to output the second signal light.
  • the second signal light will be split again after passing through the amplifier unit 808.
  • the level of beam splitting and the number of split signal lights are not strictly limited in this application.
  • the signal light contained in part 1 undergoes two levels of beam splitting after the final amplifier unit 808, while the signal light contained in part 2 undergoes one level of beam splitting after the final amplifier unit 808.
  • the amplification effect of the amplification unit is controllable.
  • SOA by using the characteristic that the power of the signal light output by SOA is related to the driving current, the optical signal processing device can change the driving current of the amplification unit, thereby controlling the power of the signal light passing through the amplification unit, improving flexibility and reducing energy consumption.
  • the following is an example of an amplification unit passing through SOA, which is also applicable to other amplifiers.
  • the optical signal processing device further includes a power controller, which is used to adjust the driving current of some or all of the M-stage amplification units to control the power of the output signal light.
  • the power controller may increase the driving current of part or all of the SOAs when the signal light indicates an area of interest in the field of view, and reduce the driving current of part or all of the SOAs in other areas of the field of view.
  • the signal light scans the field of view in a line scan manner, and the time required to complete a scan of the area within the field of view is 20 milliseconds (ms).
  • the power controller can increase the driving current of some or all SOAs in the 5th to 10ms of each scanning cycle, so that when scanning the middle part of the field of view, the detection signal light has a higher power, thereby increasing the point rate in the middle part of the field of view.
  • Using lower power scanning in the edge area can reduce energy consumption, control heat dissipation, and increase service life.
  • the driving current of the corresponding SOA is increased, thereby increasing the output point rate in a targeted manner in the area of interest, thereby improving the resolution of the area of interest in the detection result, which is conducive to using the perception results for identification and decision-making, thereby improving the level of intelligence.
  • the transmission power of a signal is related to the current pointing angle of the signal.
  • the transmit power is increased at the center of the field of view, and the transmit power is reduced at the edge of the field of view.
  • the optical power amplification function of the amplification unit is used.
  • the scanning invalid area refers to the scanning angle where the detection signal light cannot be fully projected onto the field of view. At this time, the detection signal light may be projected into the inside of the device.
  • the directional angle of the signal can be changed by the scanner.
  • the power controller can adjust the driving current of the second-stage amplification unit according to a control signal from the processor and/or controller, and the control signal is related to the directional angle of the scanner.
  • the optical signal processing device further includes an optical input and output unit, and the optical input and output unit includes a plurality of output ports, and the plurality of output ports are used to emit the detection signal light into space for detection.
  • the output port may be provided by a final amplifier and/or by a coupler (hereinafter referred to as a transmission coupler for easy distinction).
  • the transmission coupler may be an edge coupler or a grating coupler.
  • the amplifier includes an incident end face and an output end face, and the output end face can be used as an output port to output the signal light into space.
  • FIG9A is a schematic diagram of another optical signal processing device provided in an embodiment of the present application. After the signal light enters SOA901, it is emitted to the outside from the output end face of SOA901 to form a detection signal light.
  • FIG9B is a schematic diagram of another optical signal processing device provided in an embodiment of the present application.
  • the signal light After the signal light enters SOA902, it is transmitted from the output end face of SOA902 to the emission coupler 903 (i.e., a triangular component), and is emitted from the end face of the emission coupler 903 to form a detection signal light.
  • the emission coupler 903 i.e., a triangular component
  • FIG. 9A and FIG. 9B are two possible implementations for illustrating the design of the output port, and do not limit the transmission path and the splitting situation.
  • SOA 902 to the transmission coupler 903 may also pass through a splitter and/or an optical switch.
  • the related description may be designed in other ways, which will not be described here one by one.
  • the optical signal processing device may further include a plurality of receiving ports, and the plurality of receiving ports are used to receive return signal light, wherein the return signal light includes a reflection of the detection signal light.
  • return signal light it is not limited to the return signal light only including the reflection of the detection signal light.
  • the return signal light may also include signal light from other light sources in the field of view, such as the sun, street lights, car lights, or lasers.
  • the receiving port may be implemented by a coupler (hereinafter referred to as a receiving coupler for ease of distinction), such as an edge coupler or a grating coupler.
  • a coupler hereinafter referred to as a receiving coupler for ease of distinction
  • the receiving port can be coupled with the output port. That is, the output port can also be used as a receiving port.
  • a polarizing beam splitter PBS
  • PBS can provide three ports (called port 1, port 2, and port 2 for easy distinction), wherein port 1 receives the detection signal light and outputs it to space through port 3, and port 3 also receives the signal light from the field of view and outputs the signal light from the field of view from port 2 as the return signal light, that is, the PBS can provide both an output port and a receiving port.
  • a polarization beam splitting grating (PSGC) coupler also includes port 1 and port 2, wherein port 1 is used to receive the signal light to be detected and output it to space, and port 2 is used to obtain the return signal light.
  • PSGC polarization beam splitting grating
  • the power of the signal light is controllable.
  • the power of the detection signal light can be adjusted by monitoring the energy intensity of the return signal light.
  • the power of the detection signal light can be increased to improve the detection accuracy.
  • the power of the detection signal light can be reduced, which can not only reduce energy consumption, but also reduce the possibility of burning out the detection element due to the strong reflection of high-reflection or angle-reflection targets.
  • the receiving port and the output port there is a corresponding relationship between the receiving port and the output port.
  • the signal light received by the first receiving port includes the reflection of the detection signal light output by the first output port.
  • the optical signal processing device can reduce the driving current of the second-stage amplification unit to reduce the power of the detection signal light output by the first output port.
  • the optical signal processing device increases the driving current of the second-stage amplification unit to increase the power of the detection signal light output by the first transmitting sub-port.
  • the operation of adjusting the driving current may be implemented by a power controller.
  • the optical signal processing device further includes a mixing unit, which is used to obtain one or more mixing results according to the return signal light and the local oscillator signal light.
  • the mixing result here can be a signal light obtained after mixing or beating frequency processing.
  • the local oscillator signal light is a signal light having the same properties as the signal light from the laser.
  • the local oscillator signal light may belong to the aforementioned sub-signal light, or to the aforementioned second signal light.
  • Fig. 10A is a schematic diagram of the structure of another possible optical signal processing device provided in an embodiment of the present application.
  • the optical signal processing device may include multiple receiving ports and a frequency mixing unit 1001.
  • the frequency mixing unit may include multiple mixers.
  • the input of the mixing unit 1001 is the local oscillator signal light and the return signal light received by the receiving port.
  • the return signal light is represented as e 0 , e 1 , e 2 and e 3 respectively.
  • the local oscillator signal light also includes signal lights of multiple channels, which are represented as a 1_0 , a 1_1 , a 1_2 and a 1_3 respectively.
  • the mixing unit is used to mix the local oscillator signal light and the return signal light to obtain multiple mixing results. As shown in FIG10A, the local oscillator signal light a 1_0 and the return signal light e 0 are mixed in the mixer to obtain the mixing result f 0.
  • the local oscillator signal light e 1 and the return signal light a 1_1 are mixed in the mixer to obtain the mixing result f 1.
  • the mixing of the remaining signal lights is similar, and the mixing results f 0 , f 1 , f 2 and f 3 are obtained.
  • the mixing result can be input into the detection unit for further processing.
  • the mixing result f1 can be input into the input port 1003 of the detection unit (the input port of the detection unit is indicated by a circle).
  • some detection units may also receive output from the feedback unit 1002 (described below).
  • Fig. 10B is a schematic diagram of the structure of another possible optical signal processing device provided in an embodiment of the present application.
  • the optical signal processing device may include multiple receiving ports and mixing units (multiple mixers as shown in Fig. 10B).
  • the input of the mixing unit is the local oscillator signal light and the return signal light received by the receiving port, wherein the local oscillator signal light (such as b1, b3, b5 and b7 shown in FIG10B) is led out of the second beam splitting unit, which can be selected before the final SOA or after the final SOA.
  • the mixing unit is used to mix the local oscillator signal light and the return signal light to obtain multiple mixing results. As shown in FIG10B, the local oscillator signal light and the return signal light are mixed in the mixer to obtain a mixing result, and the mixing result is input to the input port 1004 of the detection unit for further processing.
  • the local oscillator signal light may be obtained by partially reflecting the emitted signal light, or the signal light received by the receiving port includes the local oscillator signal light and the return signal light.
  • FIG. 10C is a schematic diagram of the structure of another optical signal processing device provided in an embodiment of the present application.
  • the signal light outputted from the output port (such as SOA) passes through the optical module 1005.
  • the optical module 1005 includes an optical element with partial reflection and partial transmission, which can partially reflect the output signal light.
  • the embodiment of the present application does not limit the reflection ratio of the partially reflective and partially transmissive optical element. For example, the ratio of semi-transparent and semi-reflective, or 70% transmission and 30% reflection, etc., is applicable to this solution.
  • the optical module 1005 includes a PBS, a QWP, a semi-transparent and semi-reflective mirror, an HWP (optional), a reflector (optional), etc.
  • the signal light output from the output port passes through the PBS, the QWP, and the semi-transparent and semi-reflective mirror. About half of the signal light passes through the semi-transparent and semi-reflective mirror, and half of the signal light is reflected. The reflected signal light passes through the QWP again.
  • the signal light reflected by the semi-transparent and semi-reflective mirror is reflected when passing through the PBS again, and passes through the HWP (optional) and the reflector (optional) to reach the receiving port.
  • the signal light reflected by the semi-transparent and semi-reflective mirror can be used as the local oscillator signal light.
  • the return signal light from the field of view passes through the QWP and PBS, is reflected when passing through the PBS, and passes through the HWP (optional) and the reflector (optional) to reach the receiving port.
  • the QWP may also be replaced by one or more of two eighth wave plates, a Faraday rotator, a combination of a Faraday rotator and a wave plate, or a combination of a quarter wave plate and a half wave plate.
  • the signal light received by the receiving port includes the local oscillator signal light and the return signal light, so the signal light received by the receiving port can be regarded as the mixed signal light. Further, the signal light received by the receiving port can be input to the input port 1004 of the detector for further processing.
  • Fig. 10C is illustrated by taking multiple optical modules respectively arranged before multiple receiving ports as an example.
  • the multiple optical modules can be replaced by optical modules covering multiple transmitting ports and receiving ports.
  • Fig. 10D is a schematic diagram of the structure of another optical signal processing device provided in an embodiment of the present application.
  • the functions implemented by multiple optical modules 1005 in Fig. 10C can be implemented by optical module 1006, and optical module 1006 covers multiple transmitting ports and receiving ports.
  • the mixing result obtained by the optical signal processing device is used to determine relevant information of the target in the field of view.
  • the relevant information of the target is such as the distance, position, speed, reflectivity or color of the target.
  • the frequency mixing result may be transmitted to the detection unit, and the detection unit may obtain an electrical signal according to the frequency mixing result.
  • the electrical signal may be used to process and obtain relevant information of the target.
  • the detection unit may include one or more detection elements (or detectors), which may be used to receive signal light and obtain electrical signals.
  • the detection element may be a photodiode (PD) capable of detecting light energy, such as InGaAs PD, InP PD, or germanium PD.
  • the detection unit may be an InGaAs PD Array, an InP PD Array, or the like.
  • the multiple detection elements can be arranged in an array, for example, 10 detection elements can be arranged to form a 1 ⁇ 10 array, a 2 ⁇ 5 array, etc.
  • the detection unit can also be called an array detector.
  • the detection unit can be arranged at the edge outside the optical signal processing device.
  • the optical signal processing device is small in size and easy to process.
  • the optical signal processing device and the detection unit can be processed separately, and the detection element is subsequently mounted on the edge of the optical signal processing device, so that the detection element can process the output result of the optical signal processing device.
  • mounting is only an exemplary inheritance method, and it can also be replaced by flip-chip, patch and other methods.
  • the detection elements in the detection unit can be integrated into the optical signal processing device.
  • multiple detection elements are processed and coupled with the chip (or material platform) through on-chip integration.
  • the silicon photonic chip contains an integrally processed germanium PD.
  • the topological structure of the optical signal processing device can be optimized. This structure effectively avoids the crossing of waveguides and can basically achieve a solution of no crosstalk or low crosstalk, thereby improving the detection capability of the signal and reducing the discrimination threshold.
  • the return signal when there are multiple lasers, the return signal may include reflections of signal lights from multiple lasers.
  • the return signal light needs to be split so as to be mixed with the local oscillator signal lights of the multiple lasers respectively.
  • the splitting can separate the signal lights corresponding to different lasers.
  • the following describes the processing of the return signal light by taking the laser including the first laser and the second laser as an example. It should be understood that when the beam splitter can separate the signal lights of different properties, it can also be called a demultiplexing process. This application is uniformly described by taking beam splitting as an example, and the same is applicable to the demultiplexing case.
  • the optical signal processing device further includes a third beam splitting unit and a frequency mixing unit.
  • the third beam splitting unit is used to split the return signal light into a first sub-return signal light and a second sub-return signal light.
  • the mixing unit is used to mix the first sub-return signal light with the first sub-local oscillator signal light to obtain a first mixing result, and to mix the second sub-return signal light with the second sub-local oscillator signal light to obtain a second mixing result.
  • the first sub-local oscillator signal light comes from the first laser
  • the second sub-local oscillator signal light comes from the second laser.
  • FIG. 11A is a schematic diagram of another possible optical signal processing device provided by an embodiment of the present application.
  • the optical signal device divides the signal light from the first laser into two parts, namely, sub-signal light a0 and sub-signal light a1 , and divides the signal light from the second laser into two parts, namely, sub-signal light c0 and sub-signal light c1 .
  • sub-signal light a0 and sub-signal light c0 are used as detection signal lights, and are amplified by the beam combining unit, the second beam splitting unit and the multi-stage amplification unit (such as SOA) before being emitted.
  • Sub-signal light a1 and sub-signal light c1 are used as the first sub-local oscillator signal light and the second sub-local oscillator signal light, respectively. Further, the first sub-local oscillator signal light ( a1 ) can be further split to obtain signal lights a1_0 , a1_1 , a1_2 and a1_3 , and the second sub-local oscillator signal light ( c1 ) can be further split to obtain signal lights c1_0 , c1_1 , c1_2 and c1_3 .
  • the receiving port receives the return signal light, and each return signal light is divided into two sub-return signal lights after being split by the third beam splitting unit (including 4 "demultiplexing" modules), and mixed with two local oscillator signal lights (first sub-local oscillator signal light and second sub-local oscillator signal light) respectively.
  • the multiple demultiplexing modules of the present application can also be replaced by a beam splitter, such as a wavelength splitter or an energy splitter.
  • the first sub-return signal light may include: e 0 , e 1 , e 2 and e 3
  • the second sub-return signal light may include: g 0 , g 1 , g 2 and g 3 .
  • the frequency mixing unit 1101 includes four beam splitters for mixing the first sub-return signal light and the first sub-local oscillator signal light, the sub-return signal light e 0 is mixed with the first sub-local oscillator signal light a 1_0 , and a mixing result f 0 is obtained;
  • the frequency mixing unit 1102 includes four beam splitters for mixing the second sub-return signal light and the second sub-local oscillator signal light, the sub-return signal light g 0 is mixed with the second sub-local oscillator signal light c 1_3 , and a mixing result f 8 is obtained.
  • the rest of the cases are similar, and reference may be made to FIG11A .
  • the local oscillator signal light may be combined by a beam combining unit, that is, the local oscillator signal light includes the signal light from the first laser and the signal light from the second laser.
  • the optical signal processing device further includes a fourth beam splitting unit.
  • the fourth beam splitting unit is used to demultiplex the local oscillator signal light to obtain a first sub-local oscillator signal light and a second sub-local oscillator signal light, wherein the first sub-local oscillator signal light serves as the local oscillator signal of the signal light from the first laser, and the second sub-local oscillator signal light serves as the local oscillator signal of the signal light from the second laser.
  • FIG11B it is a schematic diagram of another possible optical signal processing device provided by an embodiment of the present application.
  • the optical signal device divides the signal light from the first laser into two parts, namely, sub-signal light a0 and sub-signal light a1 , and divides the signal light from the second laser into two parts, namely, sub-signal light c0 and sub-signal light c1 .
  • sub-signal light a0 and sub-signal light c0 after beam combination and beam splitting, obtain multiple second signal lights, for example, represented as b0 , b1 , b2 , b3 , b4 , b5 , b6 and b7 .
  • b0 , b2 , b4 and b6 are emitted.
  • b1 , b3 , b5 and b7 are used as local oscillator signal lights, and after being processed by the fourth beam splitting unit (including 4 "beam splitting" modules), the first sub-local oscillator signal light and the second sub-local oscillator signal light are obtained respectively.
  • the first sub-local oscillator signal lights include b1_0 , b3_0 , b5_0 and b7_0
  • the second sub-local oscillator signal lights include b1_1 , b3_1 , b5_1 and b7_1 .
  • the receiving port receives the return signal light, for example, the return signal light includes e 0 , e 1 , e 2 and e 3 , and each return signal light passes through the third beam splitting unit (including 4 "beam splitting" modules) to obtain the first sub-return signal light and the second sub-return signal light.
  • the first sub-return signal light includes e 0_0 , e 1_0 , e 2_0 and e 3_0
  • the second sub-return signal light includes e 0_1 , e 1_1 , e 2_1 and e 3_1 .
  • the sub-return signal light e0_0 is mixed with the first sub-local oscillator signal light b1_0 to obtain a mixing result
  • the sub-return signal light e0_1 is mixed with the first sub-local oscillator signal light b1_1 to obtain a mixing result.
  • the rest of the cases are similar, and can be referred to FIG. 11B.
  • the beam splitting of the return signal light may be energy beam splitting or wavelength beam splitting.
  • the "demultiplexing" described in some embodiments may also be replaced by "beam splitting”.
  • the return signal light may be split by an optical element and then received by a receiving port.
  • FIG11C is a schematic diagram of another possible optical signal processing device provided in an embodiment of the present application.
  • the emission part of the signal light please refer to FIG11B and will not be repeated here.
  • the processing of the return signal light is exemplified as follows: the signal lights e 0 , e 1 , e 2 and e 3 are split by the optical module (such as including four splitter elements 1103), and each path is divided into two sub-signal lights.
  • the receiving port receives the sub-return signal light to obtain four first sub-return signal lights and four second sub-return signal lights.
  • the first sub-return signal lights include e 0_0 , e 1_0 , e 2_0 and e 3_0 , respectively
  • the second sub-return signal lights include e 0_1 , e 1_1 , e 2_1 and e 3_1 , respectively.
  • the sub-return signal light e0_0 is mixed with the first sub-local oscillator signal light b1_0 to obtain a mixing result
  • the sub-return signal light e0_1 is mixed with the first sub-local oscillator signal light b1_1 to obtain a mixing result.
  • the rest of the cases are similar, and can be referred to FIG. 11B.
  • the light splitting element 1103 may be a grating, an interferometer, etc.
  • WDM WDM
  • AWG AWG
  • MMI MMI
  • DC DC
  • Fig. 11C illustrates the light splitting by multiple light splitting elements 1103.
  • the signal light from the field of view can also be split as a whole to obtain signal light that can be received by multiple receiving elements.
  • the number of transmitting channels and the number of receiving channels provided in each embodiment of the present application are only examples, and more or fewer channels may be included in the specific implementation process.
  • the 4 channels of transmitted signal light and the 8 channels of return signal light shown in FIG11C are only examples.
  • the arrangement of the output port (such as the output end face of the SOA) and the receiving port shown in FIG11C is only for illustration.
  • the design of "the return signal light can be split by an optical element and then received by the receiving port" can also be applied.
  • the signal light received by the receiving port may include signal light that can be used as a local oscillator.
  • the signal light received by the receiving port can pass through a beam splitter to separate two groups of signal lights, and the two groups of signal lights can correspond to different lasers.
  • the two groups of signal lights enter different detection units for detection, and no additional mixing is required.
  • FIG. 11D it is a schematic diagram of another possible optical signal processing device provided by an embodiment of the present application. Please refer to the above for the relevant description of the emission part of the signal light, which will not be repeated here.
  • the signal light output by the output port (such as the output end face of the SOA) passes through the optical module, and the optical module contains an optical element with partial reflection and partial transmission, which can partially reflect the output signal light.
  • the optical module includes a PBS, a QWP, a semi-transparent and semi-reflective mirror, an HWP (optional), a reflector (optional), etc.
  • the signal light output from the output port passes through the PBS, the QWP, and the semi-transparent and semi-reflective mirror. About half of the signal light passes through the semi-transparent and semi-reflective mirror, and half of the signal light is reflected. The reflected signal light passes through the QWP again.
  • the signal light reflected by the semi-transparent and semi-reflective mirror is reflected when passing through the PBS again, and passes through the HWP (optional) and the reflector (optional) to reach the receiving port.
  • the signal light reflected by the semi-transparent and semi-reflective mirror can be used as the local oscillator signal light.
  • the return signal light from the field of view passes through the QWP and PBS, is reflected when passing through the PBS, and passes through the HWP (optional) and the reflector (optional) to reach the receiving port.
  • the signal light received by the receiving port includes the local oscillator signal light and the return signal light, so the signal light received by the receiving port can be regarded as a mixed signal light. Since both the local oscillator signal light and the return signal light include signal lights from two lasers, at this time, the signal light received by the receiving port can be split by a beam splitter, so that multiple sampling points can be obtained based on one return signal light, thereby improving the resolution.
  • the split signal light can be input into the input port of the detection unit for further processing.
  • the embodiment of the present application does not limit the reflection ratio of the partially reflective and partially transmissive optical element.
  • a split ratio of half-transparent and half-reflective, or 70% transmission and 30% reflection is applicable to this solution.
  • the half-transparent and half-reflective mirror shown in Figure 11D is only an example.
  • multiple receiving ports are arranged in columns to form a receiving port group
  • multiple output ports are arranged in columns to form an output port group
  • the receiving port group and the output port group are arranged relative to each other
  • one output port and at least one receiving port are arranged relative to each other and share an optical module.
  • the relative arrangement may be that the devices are installed in opposite directions (or have surfaces facing each other), or they may be installed in the same directions but opposite in spatial positions.
  • FIG. 12A is a schematic diagram of a receiving port and an output port being arranged relative to each other provided by an embodiment of the present application, and the output port and the receiving port are arranged relative to each other on the left and right.
  • FIG. 12B is a schematic diagram of an optical path provided by an embodiment of the present application, in which the signal light is transmitted on the side of the surface opposite to the transmitting end face and the receiving end face, and the detection signal light output by the output port and the signal light received by the receiving port pass through the same optical module 1201. Since both the output signal light and the received signal light pass through the optical module, the optical module 1201 can also be called a transceiver optical module.
  • FIG. 12A and FIG. 12B are described by taking one output port corresponding to one receiving port as an example. In the specific implementation process, one output port may also correspond to multiple receiving ports.
  • FIG. 12C is a schematic diagram of a receiving port and an output port provided in an embodiment of the present application, wherein one output port corresponds to two receiving ports, such as output port 1 corresponds to receiving port 1_1 and receiving port 1_2, and output port 1 is arranged relative to receiving port 1_1 and receiving port 1_2. Further, receiving port 1_1 and receiving port 1_2 are closely arranged, and output port 1 shares a transceiver optical module with receiving port 1_1 and receiving port 1_2.
  • the receiving port 1_1 and the receiving port 1_2 can obtain two echo signals, which also correspond to two local oscillator signals during mixing and are mixed with the corresponding mixing signals.
  • FIG13A is a schematic diagram of another relative arrangement of a receiving port and an output port provided in an embodiment of the present application, wherein the output port and the receiving port are arranged relative to each other up and down.
  • FIG13B is another optical path schematic diagram provided in an embodiment of the present application, wherein the output port and the receiving port, the signal light is transmitted at the transmitting end face and the receiving end face, and the signal light output by the output port and the signal light received by the receiving port pass through the same optical module 1301.
  • optical modules there may be multiple optical modules.
  • the number of optical modules is the same as the number of receiving ports or the number of output ports.
  • one receiving port and one output port share one optical module
  • another receiving port and another output port share another optical module.
  • optical module there may be only one optical module, and multiple receiving ports and multiple output ports all share the same optical module.
  • the optical path of the detection signal light and the optical path of the reception signal light may be coaxial or off-axis.
  • the multiple receiving ports are arranged in columns to form a receiving port group, and the multiple output ports are arranged in columns to form an output port group; the receiving port group shares a receiving optical module, and the output port group shares a transmitting optical module.
  • FIG14 is a schematic diagram of another output port and receiving port provided in an embodiment of the present application, wherein an output port group 1401 includes multiple output ports, and a receiving port group 1403 includes multiple receiving ports.
  • the multiple output ports share one optical module 1402, and the multiple receiving ports share one optical module 1404.
  • the output port group includes multiple output ports, and the spacing between the multiple output ports can be designed so that the spacing between some output ports is relatively smaller, thereby improving the detection accuracy of some areas within the field of view.
  • FIG. 15A is a schematic diagram of a possible output port provided in an embodiment of the present application, where an output port group 1501 includes a plurality of output ports, wherein the spacing between the output ports of the upper part is D1, and the spacing between the output ports of the lower part is D2, where D1 ⁇ D2.
  • an output port group 1501 includes a plurality of output ports, wherein the spacing between the output ports of the upper part is D1, and the spacing between the output ports of the lower part is D2, where D1 ⁇ D2.
  • D1 ⁇ D2 the spacing between the output ports of the lower part
  • FIG. 15B is a schematic diagram of a possible output port provided in an embodiment of the present application, wherein the output port group 1502 includes a plurality of output ports, the spacing between the output ports in the upper portion is D3, the spacing between the output ports in the middle portion is D4, and the spacing between the output ports in the lower portion is D5, D4 ⁇ D3, and/or, D4 ⁇ D5.
  • the detection signal light emitted from the output port of the upper part points to the top of the field of view
  • the detection signal light emitted from the output port of the middle part points to the middle of the field of view
  • the detection signal light emitted from the output port of the lower part points to the bottom of the field of view.
  • the output ports pointing to the middle of the field of view are densely arranged, which can improve the resolution of the detection results for the middle area of the field of view, improve the detection accuracy, facilitate subsequent target recognition or autonomous driving decisions, and improve the availability of the detection results.
  • the size between D3 and D5 can be designed according to actual needs, for example, D5 ⁇ D3.
  • the interest level in the lower part of the field of view is higher than that in the upper part of the field of view.
  • the spacing between the output ports in the lower part can be designed to be smaller than the spacing between the output ports in the upper part.
  • D3>D5, D3 D5, etc.
  • the spacing between the output ports can be designed so that the detection resolution and detection accuracy meet the detection requirements and improve the detection performance.
  • the light transmitting and receiving paths can be coaxial or off-axis.
  • the following describes the coaxial optical path design and the off-axis optical path design respectively.
  • FIG16 is a schematic diagram of a possible off-axis optical path provided by an embodiment of the present application.
  • the signal light is transmitted through a transmitter (transmitter, Tx, also called a detection) coupler (coupler) to form a detection signal light, and the detection signal light is irradiated onto a target within the field of view through a transmitting lens (Tx lens), generating reflection to form a return signal light.
  • Tx lens transmitting lens
  • the return signal light is received by a receiving coupler (Rxcoupler) through a receiving (Receiver, Rx) lens.
  • the optical axes of the detection signal light and the reflected signal light are different.
  • FIG 17 is a schematic diagram of a possible coaxial optical path provided by an embodiment of the present application.
  • the detection signal light is emitted into space through the transmitting coupler, passes through the transmitting lens and PBS, and is transmitted to the quarter wave plate.
  • the polarization direction of the detection signal light is P polarization.
  • the quarter wave plate (quarter wave plate, QWP) will change the polarization direction of the detection signal light and convert the linear polarization into circular polarization. Therefore, the detection signal light after passing through the quarter wave plate is circularly polarized.
  • the circularly polarized light is irradiated on the target in the field of view to generate reflection, forming a return signal light (still circularly polarized).
  • the polarization direction changes, forming a return signal light with an S polarization direction.
  • the S-polarized return signal light is reflected after passing through the PBS, and reaches the receiving coupler through the receiving lens.
  • the optical axis of the detection signal light and the reflected signal light is the same.
  • the detection signal light is P-polarized light.
  • the QWP in each embodiment of the present application may also be replaced by one or more of two eighth wave plates, a Faraday rotator mirror, a combination of a Faraday rotator mirror and a wave plate, or a combination of a quarter wave plate and a half wave plate.
  • a half wave plate can be further arranged on the optical path between the PBS and the receiving coupler.
  • the HWP converts the S-polarized return signal light into P-polarized return signal light, so that the signal light output into space by the optical signal processing device and the received signal light have the same polarization direction, which is beneficial to subsequent optical path processing.
  • waveguides have different polarization-maintaining properties. Therefore, the signal light transmitted in the optical signal processing device has a consistent polarization direction, which is beneficial to the optical path design and waveguide procurement, and reduces the complexity of the optical path design.
  • one or more reflectors may be arranged in the optical path to change the propagation direction of the signal light.
  • the present application does not limit the number and arrangement positions of the reflectors.
  • FIG. 16 and FIG. 17 are exemplary introductions made to explain the concepts of coaxial and off-axis, and are not intended to limit the coaxial and off-axis solutions of the present application to be implemented in the above manner.
  • the optical signal processing device further includes an optical switch, and the optical switch is used to control the on-off of the optical transmission path.
  • an optical switch is included before at least one output port, and the optical switch is used to select a plurality of output ports between the at least one output port.
  • FIG18 is a schematic diagram of a possible optical switch provided by an embodiment of the present application.
  • the optical switch 1801 When the optical switch 1801 is switched upward, an optical path is formed between the optical switch 1801 and output port 0, that is, output port 0 is enabled; when the optical switch is switched downward, an optical path is formed between the optical switch 1801 and output port 1, that is, output port 1 is enabled.
  • the optical switch can be coupled to multiple optical paths in the optical signal processing device.
  • the optical switch can be arranged between the second beam splitting unit and the output port, so as to control whether a path is formed between the second beam splitting unit and the output port.
  • there may be multiple optical switches for example, multiple switches are used to form an optical route, thereby selecting one or more channels from multiple channels.
  • an optical switch can switch between channels of multiple output ports, increasing the number of transmission channels through time multiplexing. At the same time, by switching the transmission channels using an optical switch, the light output power of each channel will not be lost, thereby ensuring the light power of each transmission channel.
  • FIG19 is a schematic diagram of another possible optical switch provided in an embodiment of the present application. Taking the example of an optical switch selecting four output ports, at time t0, multiple optical switches select output port 0; at time t1, multiple optical switches select output port 1; at time t2, multiple optical switches select output port 2; and at time t3, multiple optical switches select output port 3.
  • optical switch Through the optical switch, multiple output ports are selected in a preset order, which can reduce the requirements for the number of SOAs and output power compared to selecting all output ports at the same time. Furthermore, this solution can also flexibly select output ports according to the requirements for resolution or detection performance, thereby improving availability.
  • the optical signal processing device further includes a feedback unit.
  • the input of the feedback unit is part of the signal light from the laser, and the feedback unit is used to detect the sweep frequency information and/or phase noise of the signal light from the laser according to the feedback signal light.
  • the output of the feedback unit may be one or more signal lights.
  • the output of the feedback unit may be provided to a detection unit, and the detection unit may obtain an electrical signal according to the feedback result from the feedback unit, and the electrical signal may be used to obtain the frequency sweep information and/or phase noise of the signal light from the laser.
  • the sub-signal light a3 is input into the feedback unit as the feedback signal light.
  • FIG. 20 is a schematic diagram of a possible feedback unit provided in an embodiment of the present application.
  • the feedback unit includes a beam splitting unit 2001 and a frequency mixing unit 2002 .
  • the beam splitting unit 2001 After the signal light is input into the beam splitting unit 2001, it is split into two paths.
  • the beam splitting unit 2001 includes two optical paths of unequal length.
  • the two signal lights are input into the mixing unit 2002 after passing through the two optical paths of unequal length.
  • the mixing unit 2002 can mix the two signal lights to obtain one or more feedback results.
  • one or more feedback results output by the frequency mixing unit 2002 may be received by a detection element of the detection unit.
  • the beam splitter 2001 may include an asymmetric Mach-Zehnder interferometer (AMZI).
  • the mixer 2002 includes an in-phase/quadrature (I/Q or IQ) mixer such as a 2 ⁇ 4 (2-input, 4-output) MMI, or includes a mixer such as a 2 ⁇ 2 (2-input, 2-output) MMI.
  • the detection unit may include multiple detection elements, some of which may receive the signal light output from the feedback unit.
  • the mixing unit 2002 includes one mixer such as a 2 ⁇ 4 MMI, so the mixing unit outputs four signal lights, which may be received by four detection elements respectively.
  • the optical signal processing device is implemented by a chip or a material platform, and the chip and/or the material platform includes different layers.
  • the optical paths for transmitting the local oscillator signal light and the return signal light are located in different layers of the substrate. And/or, the optical paths for transmitting the feedback signal light and the return signal light are located in different layers of the substrate.
  • FIG21 is a schematic diagram of a possible application of an optical signal processing device 210 provided in an embodiment of the present application.
  • the linear frequency sweep laser emitted by the FMCW laser is coupled into the optical waveguide, it is split into three beams by the first beam splitting unit, one beam is used as the detection signal light (Tx), amplified by the SOA and split by the second beam splitting unit before being emitted, one beam is used as the feedback signal light and input into the AMZI, and the last beam is split and used as the local oscillator (LO) signal light to mix with the return signal light (Rx).
  • Tx detection signal light
  • SOA the SOA
  • the second beam splitting unit the second beam splitting unit before being emitted
  • one beam is used as the feedback signal light and input into the AMZI
  • the last beam is split and used as the local oscillator (LO) signal light to mix with the return signal light (Rx).
  • LO local oscillator
  • the optical signal processing device 210 processes the detection signal light as follows: after being amplified by the first-stage SOA, it is split into 8 beams by the second beam splitting unit, and the end of the second beam splitting unit enters the second-stage SOA, and after being amplified, it is emitted from the SOA output end face to form 8 channels of detection signal light.
  • the power of the detection signal light of each channel is the output power of the second-stage SOA.
  • the optical signal processing device 210 processes the feedback signal light as follows: the feedback signal light is input into AMZI, AMZI divides the feedback signal light into two paths, and after passing through two optical paths of unequal lengths, it is received and detected by four PDs after passing through an IQ mixer such as 2 ⁇ 4MMI, or received by two PDs after passing through a mixer such as 2 ⁇ 2MMI.
  • the optical signal processing device 210 processes the local oscillator signal light as follows: the local oscillator signal light is divided into local oscillator channels equal in number to the transmitting channels (i.e., 8 channels of local oscillator signal light) by a beam splitter, and corresponds one-to-one with the receiving channels (i.e., 8 channels of return signal light).
  • the beam splitter here may include MMI or DC, etc., which can realize equal or unequal division of optical energy.
  • the local oscillator signal lights of 8 channels and the return signal lights of 8 channels are input to the mixing unit for mixing.
  • the mixing unit may include multiple mixers, such as 2 ⁇ 2MMI, 2 ⁇ 4MMI, or IQ mixers.
  • a mixer is used to mix a local oscillator signal light and a return signal light, and output one or more (for example, 2) mixing results, which can be received by the PD.
  • each of the three signal lights obtained by the first beam splitting unit must meet the preset energy requirements. If the energy of the light source is insufficient, a SOA can be added before the first beam splitting unit so that the signal light is amplified by the SOA before being input into the first beam splitting unit. Alternatively, the signal light is first split by the first beam splitting unit and then amplified in the subsequent optical path.
  • the first beam splitting unit and/or the second beam splitting unit may be formed by cascading at least one 1-to-2 beam splitter, or may be formed by cascading at least one 1-to-3 beam splitter.
  • the signal light after the splitting of the beam splitter may be designed to meet a certain ratio requirement.
  • the local oscillator signal light and the return signal light are mixed in the waveguide, and there may be an intersection between the waveguide that propagates the local oscillator signal light and the waveguide that propagates the return signal light.
  • the waveguide that propagates the local oscillator signal light or the waveguide that propagates the feedback signal light can be in the same layer as the waveguide that propagates the echo, or can be conducted in different layers.
  • the expression of the layer here refers to a layered waveguide in the vertical direction. For example, as shown in FIG21, the waveguide represented by the solid line is in the first layer, and the waveguide represented by the dotted line is in the second layer.
  • the detector array includes multiple detection elements, and the detection element can be a PD capable of detecting light energy.
  • the detector array can be an InGaAs PD Array, an InP PD Array, etc. coupled to the silicon photonic chip by packaging, flip-chip, etc., or a germanium PD processed integrally with the silicon photonic chip.
  • the receiving coupler uses an edge coupler to couple the return signal light gathered by the receiving lens into the optical waveguide for mixing.
  • the receiving couplers correspond to the transmitting SOA one by one and have the same number.
  • the return signal of the detection signal light output by a certain transmitting channel can be received by the receiving coupler at the corresponding position.
  • the transmitting part uses a group of light sources to split the light to form a linear array output, and the signal light power is amplified by a multi-stage SOA, which can increase the number of channels while ensuring the power of each channel.
  • SOA can also adjust the power and control the selection of the light-emitting channel, which improves the flexibility of the transmitting linear array design.
  • the integration of the amplifier and the silicon photonic chip is realized through hybrid integration, heterogeneous integration or package coupling, which can significantly reduce the volume and improve the stability.
  • FIG. 22 is a schematic diagram of another possible application of an optical signal processing device provided in an embodiment of the present application.
  • the FMCW lasers emitted by the two FMCW lasers are coupled into the optical waveguide respectively, and the two FMCW lasers are respectively divided into three beams by the first beam splitting unit, namely, the detection signal light (Tx), the feedback signal light and the local oscillator signal light (LO).
  • the first beam splitting unit namely, the detection signal light (Tx), the feedback signal light and the local oscillator signal light (LO).
  • each signal light can be directly split, or split after being amplified by the SOA.
  • the optical signal processing device 220 processes the detection signal light as follows: the detection signal light obtained by splitting the two FMCW lasers is input into the beam combiner, and after being combined by the beam combiner, it is amplified and split by multiple stages of SOA, and finally amplified and emitted by the final stage SOA of the output port.
  • the beam combiner can be a multi-wavelength beam combiner or a power beam combiner.
  • the circle after the FMCW laser represents the coupler, that is, the input port of the optical signal processing device, which is used to receive the signal light from the laser.
  • the optical signal processing device 220 processes the feedback signal light as follows: two beams of feedback signal light are respectively input into respective AMZIs, each AMZI is used to measure the frequency sweep and phase noise of a laser, and its parameters may be different according to the respective light source settings. For detailed description, please refer to the relevant description of FIG. 21.
  • the optical signal processing device 220 processes the local oscillator signal light as follows: the two local oscillator signal lights are divided into the same number as the receiving channels, and are mixed with the corresponding return signal lights. As shown in Figure 21, the receiving coupler receives the return signal light formed by the reflection of the outgoing laser formed by the combination of the two light sources on the target surface. The return signal light contains the reflection of the FMCW lasers of the two lasers. The return signal light is received by the receiving coupler, and after being coupled into the optical waveguide, it is divided into two parts by the beam splitter.
  • the beam splitter for separating the return signal light can be a wavelength splitter device such as AWG, WDM, or can be a power splitter device of 1 ⁇ 2MMI.
  • the feedback signal light and the local oscillator signal light are split by two FMCW lasers, and the splitting position can be before the first-stage SOA according to the power requirement, as shown in FIG22 .
  • the splitting position can be after the first-stage SOA.
  • Figure 23 is an application schematic diagram of another optical signal processing device provided in an embodiment of the present application.
  • the first laser and the second laser have different properties.
  • the optical signal processing device 230 combines the signal lights of the first laser and the second laser, and then extracts the local oscillator signal light (LO) and the feedback signal light (i.e., the signal light input to AMZI).
  • the signal lights from different lasers can be distinguished by the properties of the light.
  • the signal light from the first laser and the signal light from the second laser can be distinguished by different sweep slopes.
  • the signal light from the first laser and the signal light from the second laser can be distinguished by different wavelengths.
  • the local oscillator signal light derived after beam combining can be split, so as to be mixed with the split return signal light (Rx) respectively.
  • the beam splitting here includes but is not limited to wavelength splitting or energy splitting.
  • the feedback signal light drawn out after beam combining can also be input into two feedback units respectively after beam splitting.
  • optical signal processing device 230 For the related description of the components, optical paths, etc. in the optical signal processing device 230, reference may be made to the description of FIG. 21 or FIG. 22 .
  • Figure 24 is a schematic diagram of another application of an optical signal processing device provided in an embodiment of the present application.
  • the first laser and the second laser have different properties, and the optical signal processing device 240 combines the signal lights of the first laser and the second laser, and then extracts the local oscillator signal light (LO) and the feedback signal light (i.e., the signal light input to AMZI).
  • LO local oscillator signal light
  • AMZI the feedback signal light
  • the input local oscillator signal light of each mixer contains both the signal light from the first laser and the signal light from the second laser. Accordingly, the return signal light received by the receiving unit is not split, but directly beats with the combined local oscillator signal light.
  • the output signal obtained by the mixer after the beat frequency can be input into the detection unit (i.e., the detector array).
  • the detection unit can distinguish the echo signals corresponding to different lasers by the different properties of the light in the output signal. For example, the detection unit distinguishes the echo signals of different frequencies by different sweep slopes.
  • optical signal processing device 230 For the related description of the components, optical paths, etc. in the optical signal processing device 230, reference may be made to the description of FIG. 21 or FIG. 22 .
  • Figure 25 is a schematic diagram of the application of another optical signal processing device provided in an embodiment of the present application.
  • the output port (such as the SOA end face) and the receiving port are closely arranged.
  • the output port and the receiving port can use the same optical lens.
  • the receiving and transmitting can be coaxial or non-coaxial.
  • Figure 10A or Figure 22.
  • FIG. 25 takes the structure of a single light source as an example, which is also applicable to the structure of a dual light source.
  • Figure 26 is a schematic diagram of another application of an optical signal processing device provided in an embodiment of the present application.
  • the difference between the optical signal processing device 260 and the optical signal processing device 210 shown in Figure 21 is that the output port of the optical signal processing device 260 adopts a surface-coupled grating coupler 2601.
  • the receiving port of the optical signal processing device 260 is provided by a receiving coupler 2602.
  • the local oscillator signal light and the return signal light are prevented from crossing, thereby reducing the crosstalk between the signal lights and improving the effectiveness of the signal.
  • FIG. 27 is a schematic diagram of another application of an optical signal processing device provided in an embodiment of the present application.
  • the optical signal processing device 270 can perform hierarchical amplification on the signal light from multiple lasers to form a beam array emission of multiple channels.
  • Its receiving port is provided by a surface-coupled grating coupler, and the receiving port is provided by a receiving coupler.
  • the crossover between the local oscillator signal light and the return signal light is reduced, the crosstalk between the signal lights is reduced, and the effectiveness of the signal is improved.
  • the waveguide for propagating the local oscillator signal light and the waveguide for propagating the echo wave can be in the same layer or in different layers.
  • the waveguide for propagating the local oscillator signal light is in the first layer
  • the waveguide for propagating the echo wave is in the second layer.
  • FIG. 28 is a schematic diagram of an application of another optical signal processing device provided in an embodiment of the present application.
  • the output port and the receiving port of the optical signal processing device 280 are closely arranged relative to each other and correspond to each other.
  • the receiving port and the output port can share an optical lens.
  • each local oscillator LO signal can be led out after the final optical splitter unit (optionally before the final SOA), and transmitted to the mixer for mixing with the return signal light.
  • the detection element may also be integrated into the optical signal processing device 280 .
  • FIG. 29 is a schematic diagram of an application of another optical signal processing device provided in an embodiment of the present application.
  • the optical signal processing device 290 can perform hierarchical amplification on the optical signals from multiple lasers to form a linear beam array transmission of multiple channels.
  • each local oscillator LO signal can be led out after the final optical splitting unit (optionally before the final SOA), and two sub-local oscillator signals are obtained after beam splitting, and then mixed with the received echo after beam splitting.
  • the return signal light is also split to obtain two sub-return signals, and the two return signals are mixed with the two sub-local oscillator signals respectively.
  • Figure 30 is an application schematic diagram of another optical signal processing device provided in an embodiment of the present application.
  • the signal light amplified by the final SOA can be coupled into the optical waveguide again, and after being split by the beam splitter, the signals of multiple channels are emitted from the output port.
  • the signal light passing through the final SOA can be split multiple times after coupling into the optical waveguide.
  • the signal light output from different output ports can undergo different splitting times, and the number of emission couplers after splitting can also be different.
  • the power of the signal light output by each emission coupler can also be different.
  • the splitting here can be achieved by a splitting device such as MMI or DC.
  • the signal light after passing through the final SOA, as shown in area 3001 passes through one or more optical switches after being split.
  • the optical switch is used to switch between several channels, and the number of transmission channels is increased through time multiplexing. At the same time, by switching the transmission channels using the optical switch, the optical output power of each channel can be similar to that before the optical switch.
  • optical signal processing device provided in the embodiment of the present application is introduced above.
  • multiple optical signal processing devices can be set in one device or chip.
  • the following is introduced by taking the setting of multiple groups of optical signal processing devices on a chip as an example.
  • the chip is provided with M optical signal processing device groups, each of which may include one or more optical signal processing devices, and the optical signal processing devices may refer to the above.
  • the chip may receive signal light from N lasers, and one or more of the M optical signal processing device groups may be selected through the optical switch tree, where M is an integer greater than 1, and N is an integer greater than 1.
  • the switch tree can be used to enable the optical signal processing device group to switchably receive signal lights input by 0-N lasers.
  • FIG. 31 is a schematic diagram of a possible silicon photonic chip provided in an embodiment of the present application.
  • the number of lasers can be 14, and Figure 31 omits the 12 middle lasers.
  • the number of optical signal processing device groups is M, and each optical signal processing device group exemplarily includes 14 optical signal processing devices.
  • the optical signal processing device group can control which or which lasers' signal light are processed by the switch tree. It is also possible to control which one or which optical signal processing devices in the optical signal processing device group perform the processing.
  • N groups of optical signal processing devices are provided in the silicon photonic chip, wherein the N groups of optical signal processing devices may be arranged relative to each other, for example, every two optical signal processing devices are arranged in an axially symmetrical manner.
  • FIG 32 is a schematic diagram of another possible silicon photonic chip provided in an embodiment of the present application.
  • the silicon photonic chip 320 includes two optical signal processing devices arranged opposite to each other.
  • the optical signal processing device here is described by taking the optical signal processing device shown in Figure 26 as an example, and the same is applicable to the optical signal processing devices in other embodiments.
  • the plurality of optical signal processing devices may also be stacked in multiple layers in the vertical direction.
  • the above introduces the structures of the optical signal processing device and the silicon photonic chip.
  • the following is an exemplary description of the working scenarios of the optical signal processing device and the chip.
  • FIG 33 it is a schematic diagram of a working scenario of an optical signal processing device provided in an embodiment of the present application.
  • the optical signal processing device can receive signal light from a light source (such as a laser) and process it to obtain multiple detection signal lights (depicted as solid lines with arrows in the figure). These multiple detection signal lights are presented in the form of a beam array and emitted into the field of view with the help of an optical module 3301. Each detection signal light can correspond to an angle range in the field of view.
  • the optical signal processing device can also receive signal light from within the field of view with the help of the optical module 3301 .
  • the optical module may include one or more optical elements, wherein the optical elements include but are not limited to lenses, reflectors, beam splitters, gratings, wave plates, light homogenizers, or scanning devices.
  • the scanning device is used to provide the detection signal light at different angles to different angle ranges of the field of view.
  • the scanning method can be one-dimensional or two-dimensional.
  • the present application does not limit the scanning method or the device for realizing the scanning.
  • the scanning device can realize one-dimensional or two-dimensional scanning by means of a swing mirror, a rotating mirror (Polygon), a micro-electro-mechanical system (MEMS) galvanometer, a metal galvanometer, etc.
  • an embodiment of the present application provides another working scenario schematic diagram of an optical signal processing device.
  • the optical signal processing device can receive signal light from a light source (such as a laser) and process it to obtain multiple detection signal lights (depicted as solid lines with arrows in the figure). These multiple detection signal lights are presented in the form of a beam array and are emitted into the field of view at a certain angle with the help of a scanning device 3401. For example, at a certain moment, the signal light processed by the optical signal processing device is irradiated onto area 3402 in the field of view. By changing the angle of the scanner, the signal light can complete the scanning of the field of view.
  • the output port of the optical signal processing device itself can be designed to meet the detection resolution requirements of different areas in the field of view.
  • the detection resolution of different areas in the field of view can be designed.
  • An optical signal processing device A receives the signal light from laser A, processes it to obtain a plurality of detection signal lights, and irradiates them onto an area 3502 in the field of view through a scanning device 3501.
  • an optical signal processing device B receives the signal light from laser B, processes it to obtain a plurality of detection signal lights, and irradiates them onto an area 3503 in the field of view through a scanning device 3501.
  • the detection signal lights processed by the two optical signal processing devices form an overlapping area 3504 in the middle area of the field of view, so that the detection result of the overlapping area 3504 has a higher resolution.
  • the laser radar 360 includes a laser (or laser) and an optical signal processing device 3601.
  • the optical signal processing device 3601 may include one or more of a plurality of beam splitters, a multi-stage SOA, a receiving coupler, a mixer, an AMZI, etc., such as the units shown by solid lines in the optical signal processing device 3601.
  • the beam splitter may include an LO beam splitter for splitting LO.
  • the optical signal processing device 3601 further includes an emission coupler, a switch (such as an optical switch) or a beam combiner, such as the units shown by dotted lines in the optical signal processing device 3601.
  • a switch such as an optical switch
  • a beam combiner such as the units shown by dotted lines in the optical signal processing device 3601.
  • the description of the optical signal processing device 3601 can be referred to above and will not be described one by one here.
  • the laser radar may also include one or more of a laser, a detector array, an analog digital converter (ADC), a transimpedance amplifier (TIA), a driver (such as a laser driver), a control and data processing module, or an optical device (including a scanner).
  • ADC analog digital converter
  • TIA transimpedance amplifier
  • the aforementioned one or more modules may be implemented by circuit means, for example, the ADC may also be a sampling circuit, and the TIA may be an amplification circuit.
  • the number of the aforementioned modules may be one or more. For example, there may be multiple lasers.
  • the laser is used to generate signal light, which can be provided to the optical signal processing device.
  • the laser can include a semiconductor laser, a fiber laser, or a gas laser.
  • the semiconductor laser includes but is not limited to a laser diode (laser diode, LD), a vertical cavity surface emitting laser (Vertical Cavity Surface Emitting Laser, VCSEL), an edge emitting laser (edge-emitting laser, EEL), a distributed feedback laser (distributed feedback LD, DFB-LD), a distributed Bragg reflection laser (distributed brag reflection LD, DBR-LD), a grating coupled sampling reflection LD (Grating coupled sampling reflection LD, GCSR-LD), or a micro opto electro mechanical system LD (micro opto electro mechanical system LD, MOEMS-LD), etc.
  • a laser diode laser diode
  • VCSEL Vertical Cavity Surface Emitting Laser
  • EEL edge emitting laser
  • a distributed feedback laser distributed feedback laser
  • DFB-LD
  • the scanner is used to project the signal light from the optical signal processing device into the field of view at multiple angles, and to receive the signal light from the field of view and provide it to the optical signal processing device, refer to the optical path shown in Figures 35 and 36.
  • Optical devices are used to implement optical path design, such as one or more of convergence, collimation, shaping, reflection, scanning, or coaxial transmission and reception.
  • Optical devices include but are not limited to shaping devices (such as collimation devices, or optical path shaping devices, etc.), reflectors, lenses, windows, beam splitters, oscillating mirrors, rotating mirrors (Polygon), or Micro-Electro-Mechanical System (MEMS) micro-vibration mirrors, beam splitters, polarizers, filters, or homogenizers, etc.
  • shaping devices such as collimation devices, or optical path shaping devices, etc.
  • reflectors such as collimation devices, or optical path shaping devices, etc.
  • reflectors lenses, windows, beam splitters, oscillating mirrors, rotating mirrors (Polygon), or Micro-Electro-Mechanical System (MEMS) micro-vibration mirrors, beam splitters, polarizers, filters, or homogenizers, etc.
  • MEMS Micro-Electro
  • the array detector is used to receive one or more mixing results from the optical signal processing device and obtain an electrical signal based on the one or more mixing results, and the electrical signal is used to determine the relevant information of the target in the field of view.
  • the array detector may include one or more detection elements.
  • the array detector may include one or more of the following detection elements: single-photon avalanche diode (SPAD), silicon photomultiplier (SiPM), semiconductor avalanche photodiode (APD), multi-pixel photon counter (MPPC), or electron multiplying charge-coupled device (EMCCD) and other detection elements.
  • SPAD single-photon avalanche diode
  • SiPM silicon photomultiplier
  • API semiconductor avalanche photodiode
  • MPPC multi-pixel photon counter
  • ECCD electron multiplying charge-coupled device
  • the control and data processing module is used to generate control signals and/or process data.
  • the control and data processing module includes a power controller for controlling the driving current of the SOA.
  • the control and data processing module is used to process the electrical signal to obtain relevant information of the target.
  • control and data processing module can be implemented by a processor and/or a controller.
  • the control and data processing module includes one or more of the following devices: a central processing unit (CPU), an application processor (AP), a time-to-digital converter (TDC), a filter, a graphics processing unit (GPU), a microprocessor (MPU), an application specific integrated circuit (ASIC), a TIA, an image signal processor (ISP), a digital signal processor (DSP), a field programmable gate array (FPGA), a complex programmable logic device (CPLD), a coprocessor (to assist the central processor in completing corresponding processing and applications), a microcontroller unit (MCU), and/or a neural-network processing unit (NPU).
  • CPU central processing unit
  • AP application processor
  • TDC time-to-digital converter
  • filter a filter processing unit
  • GPU graphics processing unit
  • MPU microprocessor
  • ASIC application specific integrated circuit
  • ISP image signal processor
  • DSP digital signal processor
  • control and data processing module shown in Figure 35 includes multiple modules, some modules can be set outside the laser radar and some modules can be set inside the laser radar.
  • FIG37 is a schematic diagram of a working scenario of a laser radar provided in an embodiment of the present application.
  • the FMCW signal light generated by the laser is split and amplified (implemented by an optical signal processing device), and then irradiated to the field of view through optical devices and scanners (such as swing mirrors 3701 and rotating mirrors 3702).
  • the signal light irradiated in the field of view can be reflected by the target in the field of view to form a return signal light.
  • the return signal light then passes through the scanner and the optical device and reaches the optical signal processing device.
  • the optical signal processing device receives the signal light into the optical waveguide through the receiving port, and obtains one or mixing results after processing.
  • the mixing result is provided to the detector array to output an electrical signal.
  • the electrical signal can be input into a controller and/or a processor, such as a TIA, an ADC, an application-specific integrated circuit (ASIC) and other modules.
  • a controller and/or a processor such as
  • the processor can complete the processing of the electrical signal and/or control one or more components of the laser radar.
  • the processor can further process the electrical signal to obtain detection data reflecting relevant information of the target.
  • detection data can specifically be point cloud data corresponding to the field of view, or the detection data can include one or more of the distance, direction, pixel area occupied by the target, height, speed, posture or shape information of the target in the field of view.
  • a detection module may be obtained by BOX packaging.
  • the embodiment of the present application further provides a terminal, which includes the aforementioned optical signal processing device, or includes the aforementioned silicon photonic chip, or includes the aforementioned laser radar.
  • the terminal may include a mobile platform or transportation tool such as a vehicle, ship, airplane, train, spacecraft, drone, robot, etc.
  • V2X vehicle to everything
  • LTE-V long-term evolution of vehicle communication
  • V2V vehicle to vehicle
  • the words “exemplary” or “for example” are used to indicate examples, illustrations or descriptions. Any embodiment or design described as “exemplary” or “for example” in the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as “exemplary” or “for example” is intended to present related concepts in a specific way.
  • At least one refers to one or more, and “plurality” refers to two or more.
  • At least one of the following” or similar expressions refers to any combination of these items, including any combination of single items or plural items.
  • at least one of a, b, or c can be represented by: a, b, c, (a and b), (a and c), (b and c), or (a and b and c), where a, b, c can be single or multiple.
  • “And/or” describes the association relationship of associated objects, indicating that three relationships can exist.
  • a and/or B can be represented by: A exists alone, A and B exist at the same time, and B exists alone, where A and B can be singular or plural.
  • the character "/" generally indicates that the associated objects before and after are in an "or” relationship.
  • first and second used in the embodiments of the present application are used to distinguish multiple objects, and are not used to limit the order, timing, priority or importance of multiple objects.
  • first signal light and the second signal light are only for the convenience of description, and do not indicate the difference in the source, order, importance, etc. of the first signal light and the second signal light.
  • the first signal light and the second signal light can also be the same signal light.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Electromagnetism (AREA)
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Abstract

本申请实施例提供一种光信号处理装置、芯片、激光雷达和终端，可以应用于探测、智能测绘、智能驾驶等领域。其中，光信号处理装置包含多个分束单元和多级放大单元，通过多个分束单元对激光器的信号光进行分光可以分得多个通道的信号光。这些信号光经过多级放大单元对信号光进行多级放大，从而在提高输出的信号光的通道数情况下，能够保证输出的信号光的功率，提升探测性能。

Description

一种光信号处理装置、芯片、激光雷达和终端 技术领域
本申请涉及光学器件，尤其涉及一种光信号处理装置、芯片、激光雷达和终端。
背景技术
光探测和测距技术是一种发射探测信号光并通过探测目标的返回的信号光来获取目标的相关信息(例如目标的位置、形状、或速度等特征量)的技术。其中，相干激光雷达是采用调频信号光进行目标探测，并根据发射的信号和返回的信号进行处理得到标的相关信息的雷达。相干激光雷达的发射的信号往往按照某一形式进行调制，使得发射的信号的频率随时间变化，其变化规律可以是锯齿、三角或者正弦等波形，如果频率的变化是线性连续的则称为线性的调频连续波(Frequency Modulated Continuous Waves，FMCW)。FMCW激光雷达结合了激光线性扫频测距技术，其距离探测的原理是：测量光传输到目标的往返时间，从而得到目标距离。为了测得这个往返时间，需要在发射激光上进行与时间有关的特征标记。线性调频连续波(FMCW)激光雷达正是利用频率按时间的线性变化对激光进行调制，以此将时变的频率信息标记在发射的信号上。
基于远距离探测、高帧率和高出点率的要求，考虑尺寸、成本、功耗等条件，相干激光雷达的关键方向之一是多通道收发且器件高度集成。多通道收发的激光雷达需要发射多个通道的探测信号光，来保证出点率。
发射多个通道的探测信号光的方式有两种。一种是将一个光源进行分光，得到多个通道的探测信号光，但这会导致每个通道的发光功率受限，探测性能差。另一种方式通过增加光源数量，来减少每个光源分得的通道数，由于需要多个发光光源，会显著提高相干激光雷达的成本。
发明内容
本申请实施例提供一种光信号处理装置、芯片、激光雷达和终端，能够信号光的通道数和发光功率，提升探测性能。
第一方面，本申请实施例提供了一种光信号处理装置，包括至少一个输入端口、第一分束单元、第二分束单元和M级放大单元，M为整数且M≥2。
其中，所述至少一个输入端口，用于接收来自至少一个激光器的信号光；
所述第一分束单元，用于将来自所述至少一个激光器的信号光分为多个子信号光；
所述M级放大单元中的第一级放大单元，用于对所述多个子信号光中的一个子信号光进行放大生成第一信号光；
所述第二分束单元，用于将所述第一信号光分为多个第二信号光；
所述M级放大单元中的第二级放大单元，用于对所述多个第二信号光中的至少一个第二信号光进行放大生成第三信号光。
本申请中，通过分束单元对激光器的信号光进行分光可以分得多个通道的信号光。这些信号光可以经过多级放大单元，而多级放大单元可以对信号光进行多级放大，从而保证输出的信号光的功率，提升探测性能。
另外，放大单元的工作原理是通过电流来得到更大功率的信号光。通过设置多级的放大单元，可以灵活的设计放大单元的位置以及各放大单元的驱动电流的大小，避免某一处放大单元的电流过大。一方面可以减少由于电流过大烧坏各电器件的危险性，降低对散热的需求；另一方面，可以降低因大电流带来的串扰，降低噪声和干扰，提升信号光的有效性。总之，通过多级的放大单元，可以提升光信号处理装置的使用寿命，显著提升探测性能。
在第一方面的一种可能的实施方式中，所述多个子信号光包含本振信号光和探测信号光；
所述第一级放大单元用于对所述探测信号光进行放大生成所述第一信号光。
其中，本振信号光用于后续和返回信号光进行混频、得到拍频信号。探测信号光用于发射到空间中进行探测。
可理解的，本振信号光通常在光信号处理装置的内部传输，能量损耗较小。而信号光发射到空间中，再接收返回信号光的过程能量损耗较大。这种实施方式中，第一级放大单元主要用于对探测信号光进行放大，因此可以精准提升探测信号光的功率，提升探测性能。
在第一方面的一种可能的实施方式中，所述多个第二信号光中，部分第二信号光作为本振信号光，另一部分第二信号光作为探测信号光。所述第二级放大单元，用于对所述探测信号光进行放大生成第三信号光。
在这种实施方式中，第二级放大单元主要用于对探测信号光进行放大，因此可以精准提升探测信号光的功率，提升探测性能。
另外，由于本振信号光需要可能需要传输到混频单元与返回信号光进行混频，且返回信号光也会有多个通道，这使得多个返回信号光可能会与多个探测信号光的光学路径之间发生串扰。而在这种实施方式中，在靠后的分束单元中分离本振信号光和探测信号光，可以使得本振信号和探测信号光交织，返回信号光也无需穿过探测信号光进行混频，可以降低信号光之间传输的串扰，提升信号的有效性。
在第一方面的一种可能的实施方式中，所述光信号处理装置还包括合束单元，所述至少一个输入端口包含第一输入端口和第二输入端口，其中：
所述第一输入端口用于接收来自第一激光器的信号光，所述第二输入端口用于接收来自第二激光器的信号光；
所述第一分束单元，用于将来自所述第一激光器的信号光分为多个第四信号光，以及将来自所述第二激光器的信号光分为多个第五信号光，所述多个第五信号光属于所述多个子信号光；
所述合束单元，用于将至少一个第四信号光和至少一个第五信号光进行合并，得到第六信号光；
所述第一级放大单元用于放大所述第六信号光生成所述第一信号光。
在这种实施方式中，光信号处理装置也适用于处理多个激光器的信号光，以上仅以第一激光器和第二激光器为例。这多个激光器的信号光中的部分信号可以进行合束，合束之后的信号光在发射过程中就像发射单光源的信号光一样，可以避免交叉，减少串扰。
可选的，多个激光器发射的信号光具有不同的性质。在处理返回信号光时，返回信号光先被分束，再分别与两个激光器各自的本振信号光进行混频，从而使用一个通道的返回信号可以获得多个采样点。例如，第一激光器和第二激光器可以分别发射正、负斜率的线性调频激光，经过合束后，一个通道的探测信号光即包含正、负斜率的线性调频激光。这个通道的探测信号光照射到目标同一点上；返回信号光被分束后，再分别与正、负斜率的线性调频激光的本振信号光进行混频，从而得到两个采样点，可以提高出点率，使得激光雷达获得更高 的点云分辨率。
在第一方面的一种可能的实施方式中，所述来自第一激光器的信号光和来自所述第二激光器的信号光具有不同的扫频斜率。
在第一方面的一种可能的实施方式中，所述来自第一激光器的信号光和来自所述第二激光器的信号光具有不同的中心波长。
可选的，对于返回信号光的分束可以为解复用，从而分离出对应不同激光器的返回信号光。
以二者具有不同的中心波长为例，第一激光器发射1550nm的激光，第二激光器发射1310nm的激光。用于分离返回信号光的分束单元，可以分离出返回信号光中的1550nm激光和返回信号光中的1310nm激光，返回信号光中的1550nm激光与第一激光器的本振信号光混频，返回信号光中的1310nm激光与第二激光器的本振信号光混频。这种方式，既可以提升出点率又可以降低能量损耗。
在第一方面的一种可能的实施方式中，所述第二分束单元包含N个分束器，所述N个分束器以树形拓扑结构排列且每个分束器作为树形拓扑结构的节点，N为整数且N＞0，每个父节点位置的分束器分束得到的信号光被提供给子节点位置的分束器；
所述第一信号光输入根节点位置的分束器，所述多个第二信号光从叶子节点位置的分束器输出。
可选的，分束器可以为1分M(M为整数且M>1)分束器，例如一分二分束器、一分三分束器等。通过树形的分束器结构，可以控制分光后的信号的能量分布，从而灵活设计分辨率分布。
作为一种可能的实现，投射到视野中心部分的信号光经过的分束器的层级少于投射到视野边缘部分的信号光经过的分束器的层级。如此，投射到视野中心部分的信号光的功率高于投射到视野边缘区域的信号光的功率，从而使得激光雷达在视野中心部分的分辨率更高、探测精度更高。
在第一方面的一种可能的实施方式中，所述第二级放大单元包含多个放大器；
所述多个放大器位于叶子节点位置的分束器之后。
应理解，这里的之后是指位于叶子节点位置的分束器的输出端之后。
这种实施方式中，在第二分束单元之后设置放大器，信号光经过分光以后再输入放大器，从而可以更加精准地控制第三信号光的功率，提升探测信号光的稳定性。
在第一方面的一种可能的实施方式中，所述多个放大器位于所述多个树形拓扑结构内的分束器之间。
这种实施方式中，信号光经过第二级放大单元后还会被再次分光，相当于几个信号光可以共用一个放大器，可以减少放大器的数量，节省成本。
在第一方面的一种可能的实施方式中，所述多个放大器中的部分放大器位于叶子节点位置的分束器之后，另一部分放大器位于所述多个树形拓扑结构中的分束器之间。
这种实施方式中，用户可以根据需求设置放大器的位置，控制探测信号光的功率，提升光路设计和功率设计的灵活性。
在第一方面的一种可能的实施方式中，所述光信号处理装置还包含功率控制器，所述功率控制器用于调整所述第二级放大单元的驱动电流，以控制所述第二级放大单元输出的信号光的功率。
这种实施方式中，利用放大器输出功率与驱动电流相关的特性，通过改变放大单元的驱 动电流，可以控制经过放大单元的信号光的功率，提升灵活性，降低能耗。
在第一方面的一种可能的实施方式中，所述功率控制器还用于：
根据控制信号，调整所述第二级放大单元的驱动电流，所述控制信号与扫描器的指向角度相关。
例如，在中心视场位置增大发射功率，在边缘视场处减小发射功率。
再如，在发射光束不能经由扫描器出射的扫描无效区域，放大单元的光功率放大功能。其中，扫描无效区域是指探测信号光无法全部投射到视野上的扫描角度。此时，探测信号可能会被投射到设备内部。
这种实施方式不仅可以增加激光雷达系统的测量动态范围，降低整体功耗，也可以降低系统内部的杂散光。
可选的，该控制信号可以是来自处理器或者来自控制器的。
在第一方面的一种可能的实施方式中，所述光信号处理装置还包含光输入输出单元，所述光输入输出单元包含多个输出端口和多个接收端口；
所述多个输出端口，用于输出所述第三信号光；
所述多个接收端口，用于接收返回信号光，所述返回信号光包含所述第三信号光的反射；
所述混频单元，用于根据所述返回信号光和本振信号光得到一个或者多个混频结果，所述一个或者多个混频结果用于确定视野内的目标的相关信息；
所述本振信号光属于所述多个子信号光，或者，属于所述多个第二信号光。
在这种实施方式中，光信号处理装置还可以对返回信号光进行混频处理，得到混频结果。如此可以进一步实现器件的集成，提升器件的稳定性，减小体积。
在第一方面的一种可能的实施方式中，所述混频单元包含第三分束单元、第一混频器和第二混频器；
所述第三分束单元，用于将所述返回信号光进行分束，得到第一子返回信号光和第二子返回信号光，
所述第一混频器用于将第一子本振信号光和所述第一子返回信号光混频得到第一混频结果，所述第一子本振信号光来自第一激光器；
所述第二混频器用于将第二子本振信号和所述第二子返回信号光混频得到第二混频结果，所述第二子本振信号光来自第二激光器。
在这种实施方式中，一个返回信号光可以被分束得到多个子返回信号光，从而基于多个本振信号进行拍频得到多个输出点，提升出点率，从而提升点云分辨率。
可选的，第三分束单元可以是能量分束型的分束单元，或者波长分束型的分束单元。
在第一方面的一种可能的实施方式中，所述光信号处理装置还包含第四分束单元，所述第四分束单元用于将本振信号光解复用得到第一子本振信号光和第二子本振信号光，所述第一子本振信号光作为来自第一激光器的信号光的本振信号，所述第二子本振信号光作为来自所述第二激光器的信号光的本振信号；
所述本振信号光包含来自所述第一激光器的信号光和来自所述第二激光器的信号光。
可选的，第四分束单元可以是能量分束型的分束单元，或者波长分束型的分束单元。
在第一方面的一种可能的实施方式中，所述多个接收端口按列排布形成接收端口组，所述多个输出端口按列排布形成输出端口组；
所述接收端口组和所述输出端口组相对设置，一个输出端口和至少一个接收端口相对设置且共用一个收发光学模组。
在第一方面的一种可能的实施方式中，所述多个接收端口按列排布形成接收端口组，所述多个输出端口按列排布形成输出端口组；
所述接收端口组共用一个接收光学模组，所述输出端口组共用一个发射光学模组。
在第一方面的一种可能的实施方式中，所述输出端口组中，中间部分的输出端口之间的间距小于边缘部分的输出端口之间的间距。
在第一方面的一种可能的实施方式中，所述多个接收端口包含第一接收端口，所述输出端口包含第一输出端口，所述第一接收端口接收的信号光包含由第一输出端口输出的信号光的反射；
所述光信号处理装置还包含功率控制器，所述功率控制器用于：
当由第一接收端口接收的信号光的功率大于第一阈值，则降低所述第二级放大单元的驱动电流以降低由所述第一输出端口出射的探测信号光的功率；
当由第一接收端口接收的信号光的功率小于第二阈值，则提高所述第二级放大单元的驱动电流以增大由第一发射子端口出射的探测信号光的功率。
在第一方面的一种可能的实施方式中，所述光输入输出单元包含第一输出端口集合和第二输出端口集合，所述第一输出端口集合和所述第二输出端口集合分别包含至少一个输出端口，所述第一输出端口集合用于向所述视野的中间区域出射探测信号光，所述第二输出端口集合用于向所述视野的边缘区域出射探测信号光；
所述第一输出端口集合出射的探测信号光的功率高于所述第二输出端口集合出射的探测信号光的功率。
在第一方面的一种可能的实施方式中，所述光信号处理装置还包含光开关，所述光开关设置在所述第二分束单元至任一输出端口之间，用于控制是否在所述第二分束单元与所述任一输出端口之间形成光学路径。
在第一方面的一种可能的实施方式中，所述光信号处理装置还包含反馈单元，所述多个子信号光包含反馈信号光；
所述反馈单元用于根据所述反馈信号检测所述来自至少一个激光器的信号光的扫频信息和/或相位噪声。
在第一方面的一种可能的实施方式中，所述光信号处理装置还包含多层的基底以及多条波导，所述多条波导用于在基底的不同层中形成传输信号光的光学路径。
在第一方面的一种可能的实施方式中，传输所述本振信号光和所述返回信号光的光学路径位于所述基底的不同层。
在第一方面的一种可能的实施方式中，传输所述反馈信号光和所述返回信号光的光学路径位于所述基底的不同层。
第二方面，本申请实施例提供一种芯片，所述芯片包含一个或者多个光信号处理装置，所述光信号处理装置为第一方面任一项所述的光信号处理装置。
为了便于描述，以下以芯片包含的光信号处理装置为K个为例进行描述，K为整数且K≥1。
在第二方面的一种可能的实施方式中，所述芯片还包含至少一个激光输入端口和至少一个光开关，所述至少一个激光输入端口包含第一激光输入端口；
所述至少一个激光输入端口用于接收来自至少一个激光器的信号光；
所述至少一个光开关设置在所述第一激光输入端口和L个光信号处理装置之间，且被配 置为：将所述L个光信号处理装置可切换地耦合到光学路径以控制是否在所述L个光信号处理装置与所述第一激光输入端口之间形成光学路径，L为整数且L≤K。
在这种实施方式中，通过至少一个光开关，可以在多个光信号处理装置之间形成光学路由，从而可以根据需求启用一个或者多个光信号处理装置，提升灵活性。
在第二方面的一种可能的实施方式中，K≥2，且，所述K个光信号处理装置中的任意两个光信号处理装置对称设置。
第三方面，本申请实施例提供一种激光雷达，所述激光雷达包含激光器、扫描器，以及第一方面任一项所描述的光信号处理装置；
所述激光器用于向所述光信号处理装置提供调频信号光；
所述扫描器用于将来自所述光信号处理装置的第三信号光投射到视野中。
第四方面，本申请实施例提供一种激光雷达，激光器、阵列探测器、收发光学模块、扫描器，以及第一方面任一项所描述的光信号处理装置；
所述激光器用于向所述光信号处理装置提供调频信号光；
所述扫描器用于将来自所述光信号处理装置的第三信号光投射到视野中，以及接收来自视野的返回信号光并提供给所述光信号处理装置；
所述收发光学模组设置在所述扫描器和所述光信号处理装置之间；
所述阵列探测器用于接收来自所述光信号处理装置的一个或者多个混频结果并基于所述一个或多个混频结果得到电信号，所述电信号用于确定视野内的目标的相关信息。
在第四方面的一种可能的实施方式中，所述光学模组包含偏振分束器和四分之一波片，所述偏振分束器和所述四分之一波片用于实现收发同轴，其中：
第三信号光依次经过所述光信号处理装置的输出端口、所述偏振分束器和所述四分之一波片被提供给所述扫描器；
来自所述扫描器的返回信号光依次经过所述四分之一波片、所述偏振分束器被提供给所述光信号处理装置的接收端口。
在第四方面的一种可能的实施方式中，所述光学模组还包含二分之一波片，所述二分之一波片设置在所述偏振分束器和所述光信号处理装置的接收端口之间。
第五方面，本申请实施例提供一种终端，所述终端包含第一方面任一项所描述的光信号处理装置，或者，所述终端包含第二方面任一项所描述的芯片，或者，所述终端包含如第三方面任一项或第四方面任一项所描述的激光雷达。
可选的，终端为车辆、无人机或者机器人。
附图说明
下面将对实施例描述中所需要使用的附图作简单的介绍。
图1是一种放大器的工作原理的示意图；
图2是本申请实施例提供的一种光信号处理装置的结构示意图；
图3是本申请实施例提供的又一种光信号处理装置的结构示意图；
图4是本申请实施例提供的又一种光信号处理装置的结构示意图；
图5是本申请实施例提供的又一种可能光信号处理装置的结构示意图；
图6A是本申请实施例提供的又一种可能的光信号处理装置的结构示意图；
图6B是本申请实施例提供的一种多激光器的信号光的斜率示意图；
图7A是本申请实施例提供的又一种信号处理装置的结构示意图；
图7B是本申请实施例提供的又一种信号处理装置的结构示意图；
图7C是本申请实施例提供的又一种光信号处理装置的结构示意图；
图7D是本申请实施例提供的又一种可能的光信号处理装置的结构示意图；
图8A是本申请实施例提供的又一种光信号处理装置的结构示意图；
图8B是本申请实施例提供的又一种光信号处理装置的结构示意图；
图8C是本申请实施例提供的又一种光信号处理装置的结构示意图；
图8D是本申请实施例提供的又一种光信号处理装置的结构示意图；
图9A是本申请实施例提供的又一种光信号处理装置的示意图；
图9B是本申请实施例提供的又一种光信号处理装置的示意图；
图10A是本申请实施例提供的又一种可能的光信号处理装置的结构示意图；
图10B是本申请实施例提供的又一种可能的光信号处理装置的结构示意图；
图10C是本申请实施例提供的又一种可能的光信号处理装置的结构示意图；
图10D是本申请实施例提供的又一种可能的光信号处理装置的结构示意图；
图11A是本申请实施例提供的又一种可能的光信号处理装置的结构示意图；
图11B是本申请实施例提供的又一种可能的光信号处理装置的结构示意图；
图11C是本申请实施例提供的又一种可能的光信号处理装置的结构示意图；
图11D是本申请实施例提供的又一种可能的光信号处理装置的结构示意图；
图12A是本申请实施例提供的一种接收端口和输出端口相对设置的示意图；
图12B是本申请实施例提供的一种光路示意图；
图12C是本申请实施例提供的一种接收端口和输出端口相对设置的示意图；
图13A是本申请实施例提供的又一种接收端口和输出端口相对设置的示意图；
图13B是本申请实施例提供的又一种光路示意图；
图14是本申请实施例提供的又一种输出端口和接收端口的示意图；
图15A是本申请实施例提供的一种输出端口的示意图；
图15B是本申请实施例提供的一种可能的输出端口的示意图；
图16是本申请实施例提供的一种离轴光路的示意图；
图17是本申请实施例提供的一种同轴光路的示意图；
图18是本申请实施例提供的一种光开关的示意图；
图19是本申请实施例提供的又一种光开关的示意图；
图20是本申请实施例提供的一种可能的反馈单元的示意图；
图21是本申请实施例提供的一种可能的光信号处理装置的应用示意图；
图22是本申请实施例提供的又一种可能的光信号处理装置的应用示意图；
图23是本申请实施例提供的又一种光信号处理装置的应用示意图；
图24是本申请实施例提供的又一种光信号处理装置的应用示意图；
图25是本申请实施例提供的又一种光信号处理装置的应用示意图；
图26是本申请实施例提供的又一种光信号处理装置的应用示意图；
图27是本申请实施例提供的又一种光信号处理装置的应用示意图；
图28是本申请实施例提供的又一种光信号处理装置的应用示意图；
图29是本申请实施例提供的又一种光信号处理装置的应用示意图；
图30是本申请实施例提供的又一种光信号处理装置的应用示意图；
图31是本申请实施例提供的一种可能的硅光芯片的示意图；
图32是本申请实施例提供的又一种可能的硅光芯片的示意图；
图33是本申请实施例提供的一种光信号处理装置的工作场景示意图；
图34是本申请实施例提供的又一种光信号处理装置的工作场景示意图；
图35是本申请实施例提供的又一种光信号处理装置的工作场景示意图；
图36是本申请实施例提供的一种激光雷达的结构示意图
图37是本申请实施例提供的一种激光雷达的工作场景示意图。
具体实施方式
为了使本申请实施例的目的、技术方案和优点更加清楚，下面将结合附图对本申请实施例作进一步地详细描述。
为了便于理解，以下示例地给出了部分与本申请实施例相关概念的说明以供参考。如下所述：
1.探测装置
本申请实施例中提到的探测装置可以是激光雷达，也可以是其它的光探测装置，例如融合探测装置(例如，集成雷达探测器和图像传感器的探测装置)。其工作原理是通过发射探测信号光，并接收返回的信号光来探测相应的探测区域。
本申请实施例中的探测装置能够使用在智能驾驶、智能运输、智能制造、环境探测、测绘、无人机等各种领域，能够完成目标探测、距离测量、速度测量、目标跟踪、成像识别等中的一项或者多项功能。
本申请实施例中的探测装置可以应用于车载探测装置(例如车载雷达)、路侧探测装置(例如路口雷达)等，也可以应用于其它的探测装置，例如安装在无人机、机器人、轨道车、自行车、信号灯、测速装置或基站等等装置上面的探测装置。本申请对探测装置安装的位置不做限定。
2.波导
波导(waveguide)是用来定向引导电磁波的结构，电磁波可以在其端点之间传输。光也是电磁波，传输光的波导被称为光波导，例如平面介质光波导、或光纤等。
3.偏振(polarization)
偏振，是指光的电矢量的振动方向具有一定的规律。偏振是光的一种属性，偏振状态(polarization state)是光的一个参数。偏振状态可分为：线偏振，椭圆偏振(包含圆偏振)等。
例如，对于线偏振光，它的电矢量沿着一个方向做往复振动。而非偏振光，如自然光，它们的电矢量的振动是杂乱无章的，既不朝着某些相同的方向，振动时又不具有固定的时间对应关系(没有固定相位)，因此，它们的振动是随机的，没有固定规律。
4.偏振分束器
偏振分束器是一种光滤波器，信号光经过偏振分束器时的透射率与信号光的偏振方向相关，通常是某一偏振方向的线偏振光可以通过，而某些偏振方向的光则被阻挡(不能通过)。
一些场景中，当光通过偏振分束器，光的偏振态用P偏振光(以下简称P光)和S偏振光(以下简称S光)来描述。其中，P光表示偏振方向与分束器的偏振方向平行的线偏振光，S光表示偏振方向与分束器的偏振方向垂直的线偏振光。
又一些场景中，光的偏振态也通过横电(transverse electric，TE)或者横磁(transverse magnetic，TM)来描述。作为一种可能的设计，TE偏振光经过偏振分束器时可以透过偏振分束器，且透过的信号光仍然保持TE偏振。TE偏振经过一次四分之一波片(quarter wave plate，QWP)后可以被转换为圆偏振光或椭圆偏振光，圆偏振光或椭圆偏振光再次经过四分之一波片后被转换为TM偏振光，TM偏振光经过该偏振分束器时被反射。
5.波片
波片，又称为相位延迟片，能够使通过波片的光的两个互相正交的偏振分量产生相位偏移，可用来调整光的偏振状态。根据波片推迟的相位偏移，波片可以分为二分之一波片(half wave plate，HWP)、QWP、八分之一波片等。
可选的，本申请部分实施例中的示出的QWP也可以替换为法拉第旋转镜、法拉第旋转镜和波片的组合、四分之一波片和二分之一波片的组合、或两个八分之一波片的组合等中的一项或者多项。
6.视野(field of view，FOV)
视野是指可以被探测装置探测到的范围，也称为视场。一些场景中，探测装置的发射端与目标物体之间，和/或，探测装置的接收端与目标物体之间，需要具有信号(例如无线电波、激光)传输不中断的视线区域(line of sight，LOS)。该视线区域即可以理解为视野。
7.光放大器
光放大器是对信号光进行放大的装置，以下简称放大器。放大器的原理基本上是基于激光的受激辐射，将其他能量转变为信号光的能量，从而实现放大作用。
放大器包含但不限于是半导体放大器、或光纤放大器等。其中，半导体放大器(semiconductor optical amplifier，SOA)以半导体材料为增益介质，能够对信号光进行功率放大并且不明显降低其光学指标。
如图1所示是放大器的工作原理的示意图，驱动电流输入放大器后，当信号光通过放大器时，电子会以光子的形式失去能量，产生受激励的光子，受激励的光子具有与光信号相同的波长(以及其他特性)。
以半导体放大器为例，其工作原理是由驱动电流将半导体载流子转化为反转粒子，使得注入种子光幅度放大，并保持注入种子光的偏振、线宽和频率等基本物理特性。随着驱动电流的增加，输出光功率也成一定函数关系增长。因此，使用SOA可以在不明显改变其光学性质的情况下放大信号光的功率。
8.调频连续波(frequency modulated continuous wave，FMCW)
FMCW是指频率随时间变化的电磁波。当电磁波的频率随时间线性变化时，称为线性调频连续波。
这里的线性变化一般是指在一个发射周期内的线性变化。示例性的，线性调频连续波的波形一般是锯齿波或者三角波。当然，FMCW也可能存在其它可能的波形，例如线性调频步进频波形等。
下面对本申请实施例的方案进行详细说明。
请参见图2，图2是本申请实施例提供的一种光信号处理装置的结构示意图。在该示例中，光信号处理装置中包含第一分束单元201、第二分束单元202和多级放大单元，而黑色粗线条表示光的传输路径。为了便于描述，以下将放大单元的级数描述为M级，M为整数且M≥2。
其中，第一分束单元201用于将来自激光器的信号光进行分束，得到多个子信号光。示 例性地，子信号光可以包含子信号光a 0和子信号光a 1。
作为一种可能的实施方式，多个子信号光中的部分子信号光(例如子信号光a 0)可能会向第二分束单元202传输。进一步的，另一部分光子信号(例如子信号光a 1)可能传输到其他单元(未示出)。例如，一部分子信号光可以作为本振信号光传输到混频单元。和/或，一部分子信号光可以作为反馈信号光输入反馈单元等。
作为一种可能的实施方式，多个子信号中的每一路子信号都向第二分束单元202传输。
应理解，图2所示的两路子信号光仅为示例，本申请对于子信号光的数量不作限定。图2所示的激光器的数量仅为示例。可选的，来自激光器的信号光可以为频率随时间线性变化的信号光，例如，来自激光器的信号光可以为调频连续波(frequency modulated continuous waves，FMCW)激光。
第二分束单元202用于将输入的信号光分为多个第二信号光。示例性地，多个第二信号光可以包含第二信号光b 0和第二信号光b 1。当然，图2所示的两路第二信号光仅为示例，本申请对于第二信号光的数量不作限定。
作为一种可能的实施方式，多个第二信号光中的部分第二信号光可以从光信号处理装置出射，形成探测信号光。进一步的，另一部分第二信号光可以作为本振信号光、或者反馈信号光等。
M级放大单元中的每一级放大单元用于对信号光的强度进行放大。设置多级放大单元，可以分级放大经过的信号光。应理解，多级放大单元并不是指多个放大单元，而是指对于某一路信号光至少进行了两次放大。
可选的，每一级放大单元中包含的放大单元的数量可以是一个或者多个。例如，放大单元203c为一级放大单元，该级放大单元中可以包含多个放大单元，每一个放大单元用于放大一路第二信号光。
应理解，多级放大单元的位置可以有多种可能的实施方式，以下示例性的列举两种可能情况：
情况1：多级放大单元可以分散的设置在多个其他单元之间。示例性地，图2所示的示例中，放大单元203a为其中一级放大单元，放大单元203b为其中一级放大单元，放大单元203c为其中一级放大单元。M级放大单元，则可以包含放大单元203a、放大单元203b和放大单元203c中的至少两级。
情况2：多级放大单元可以相邻设置。如图3是本申请实施例提供的又一种光信号处理装置的结构示意图，放大单元301a为其中一级放大单元，放大单元301b为另一级放大单元。
可选的，光信号处理装置还可以包含输入端口，输入端口用于接收来自激光器的信号光。
本申请实施例中，通过分光单元对激光器的信号光进行分光，可以分得多个通道的信号光。这些信号光可以经过多级放大单元，而多级放大单元可以对这些信号光进行多级放大，从而保证输出的信号光的功率。通过本申请实施例，可以对来自激光器的信号光进行分光、放大，来提高通道数量且保证每个通道的信号光的功率，既能够减少成本，也可以保证探测性能，具有较大的商用价值。
另外，放大单元的工作原理是通过驱动电流来产生更大功率的信号光。通过设置多级的放大单元，可以灵活的设计放大单元的位置以及各放大单元的电流的大小，避免某一处放大单元的电流过大。一方面可以减少由于电流过大烧坏各电器件的危险性，降低对散热的需求；另一方面，可以降低因大电流带来的串扰，降低噪声和干扰，提升信号光的有效性。总之，通过多级的放大单元，可以提升光信号处理装置的使用寿命，提升探测性能。
以上对光信号处理装置的基础结构进行了介绍，下面介绍一些本申请实施例的可能设计。需要说明的是，下面的多种设计可以单独实施，也可以进行组合。对于组合的情况，下文也会进行示例性的说明。下面先分别介绍多种可能的设计：
【设计1】
作为一种可能的设计，光信号处理装置的部分或者全部模块可以为芯片，或者，在芯片中实施。这里的芯片可以为硅光芯片、集成电路(Integrated Circuit,IC)芯片等。
可替换的，光信号处理装置的部分或者全部模块可以在材料平台上实施，这里的材料平台也称为基底。材料平台的材质可以为半导体、陶瓷、玻璃、或塑料等材质。
示例性的，材料平台中的材料包含但不限于互补型金属氧化物半导体(complementary metal-oxide-semiconductor，CMOS)、二氧化硅、氮化硅、氮氧化硅、磷化铟和绝缘体上硅(silicon-on-insulator，SOI)等。
作为一种可能的方案，当光信号处理装置以芯片形式实施或者在材料平台上实施时，信号光在芯片(或材料平台)中的传输通过波导来传输。
示例性的，材料平台进一步的包含但不限于是绝缘体上硅(silicon-on-insulator，SOI)波导平台、氮化硅波导平台、氮氧化硅波导平台、二氧化硅平面光波导(planar light waveguidecircuit，PLC)波导平台。可选的，材料瓶体还可以是包含多种类型波导层叠的多层波导平台。
通过芯片或材料平台集成的方式，不仅提高了光信号处理装置集成度，减小了器件的整体体积，还能够降低振动对于光学元件和光路的影响，提升器件和光路的稳定性，有助于提升探测装置的探测性能。
【设计2】
放大器可以通过芯片方式实施。当光信号处理装置实施在硅谷芯片(或材料平台)上时，放大器可以耦合在芯片(或材料平台)之中，或者耦合在芯片(或材料平台)外，例如芯片外侧。
作为一种可能的实施方式，放大器可以通过芯片实现，且具有入射端面和出射端面。放大器的入射端面与波导耦合，使得信号光可以从芯片中的波导进入SOA的入射端面。
一些场景中，若经过放大的信号光还需要传输进入波导中，则出射端面也可以与波导耦合，使得经过放大的信号光再从出射端面进入波导继续传输。
以光信号处理装置在硅谷光芯片上实施为例，放大器可以与硅光芯片通过集成方式耦合。
例如，放大器芯片以倒装的方式与硅光芯片耦合。其中，倒装是指放大器芯片和硅光芯片分别加工，在集成时，通过颠倒其中一个芯片(一般是颠倒放大器芯片)使其与另一个芯片贴合在一起。
再如，放大器芯片通过透镜等以空间光的方式与硅光芯片耦合。倒装方式中，两个芯片之间通常紧密贴合，不经过透镜。而空间光方式中，两个芯片之间具有空间且空间中设置有透镜，信号光从一个芯片出射后，通过透镜汇聚再进入另一个芯片中。
再如，放大器芯片通过晶片与晶元贴合的方式与硅光芯片耦合。或，放大器芯片通过晶元与晶元贴合的方式与硅光芯片耦合。
【设计3】
不限于前述的设计，在一种可能的设计中，M级放大单元至少包含第一级放大单元和第二级放大单元。
如图4是本申请实施例提供的又一种可能的光信号处理装置的结构示意图。来自激光器的信号光经过第一分束单元201，被分为多个子信号光，第一级放大单元401用于对多个子信号光中的至少一个子信号光进行放大生成第一信号光。第二分束单元202用于将第一信号光分为多个第二信号光，第二级放大单元402用于对多个第二信号光中的至少一个第二信号光进行放大生成第三信号光。
可选的，第二级放大单元402包含多个放大单元，如图4所示的放大单元402a和放大单元402b。
这种实施方式中，每一级放大单元分散地设置在分光单元后。一方面，在分光后对其中的部分或者全部信号光进行放大，可以进一步缩小放大单元的电流范围。另一方面，分光后的多路信号通常具有不同的作用或者指向视野中的不同区域，在分光单元后设置一级放大单元，可以根据需求设计放大单元的位置，提升放大作用的实施精确性和有效性，提高对信号光功率进行控制时的灵活性。
在前述实施方式中，分束单元可以将信号光分为多路，每级放大单元均设置在分束单元之后。
作为一种可能的方案，每一级放大单元可以用于放大分束后的部分信号光。即，至少一个子信号光为多个子信号光中的部分子信号光，和/或，至少一个第二信号光为多个第二信号光中的部分第二信号光。
作为一种可能的实施方式，多个子信号光包含本振信号光和探测信号光，多级放大单元中的其中一级放大单元(例如第一级放大单元)用于对探测信号光进行放大生成第一信号光。如图4所示，第一分束单元分束得到的多个子信号光包含子信号光a 0和子信号光a 1，子信号光a 0作为探测信号光，而子信号光a 1作为本振信号光，此时，第一级放大单元401用于对探测信号光进行放大。
其中，本振信号光用于混频、得到拍频信号、倍频、或分频等。探测信号光用于发射到视野中进行探测。
由于本振信号光在传输过程中比较稳定且能量损耗较小，而信号发射到视野中再接收返回信号的过程能量损耗较大。因此，第一级放大单元主要用于对探测信号光进行放大，可以精准提升探测信号光的功率，提升探测性能。
【设计4】
不限于前述的设计，在一种可能的设计中，多个第二子信号光中的部分第二子信号作为本振信号光，部分第二子信号作为探测信号光。多级放大单元中的其中一级放大单元(例如第二级放大单元)用于对探测信号光进行放大生成第一信号光。
如图5是本申请实施例提供的又一种可能光信号处理装置的结构示意图。第一分束单元分束得到的多个第二信号光包含第二信号光b 0、第二信号光b 1、第二信号光b 2和第二信号光b 3。其中，第二信号光b 0和第二信号光b 2作为探测信号光，而第二信号光b 1和第二信号光b 3作为本振信号光。第二级放大单元501用于对探测信号光进行放大。
具体的，第二级放大单元501包含多个放大单元，如放大单元501a和放大单元501b。其中，放大单元501a用于放大第二信号光b 0，而放大单元501c用于放大第二信号光b 2。
在这种实施方式中，第二级放大单元主要用于对探测信号光进行放大，可以精准提升探 测信号光的功率，提升探测性能。
可选的，在一种可能的实施方式中，多个第二信号光中本振信号光和探测信号光相互交织。即，本振信号光两侧的信号光为探测信号光，探测信号光两侧的信号光为本振信号光。如图5所示，第二信号光b 0(探测信号光)与第二信号光b 1(本振信号光)相邻，第二信号光b 1(本振信号光)与第二信号光b 0(探测信号光)和第二信号光b 2(探测信号光)相邻。
本振信号光可能需要传输到混频单元与返回信号光进行混频，而返回信号光也会有多个通道，这使得多个返回信号光可能会与多个探测信号光的光学路径之间产生交叉，发生串扰。而在这种实施方式中，在靠后的分束单元中分离本振信号光和探测信号光，可以使得本振信号和探测信号光交织，返回信号光也无需穿过探测信号光进行混频，可以降低信号光之间传输的串扰，提升信号的有效性。
【设计5】
不限于前述的设计，在一种可能的设计中，输入第一分束单元的信号光来自多个激光器。以下以激光器的数量为2个(便于区分称为第一激光器和第二激光器)为例进行介绍，对于其他数量的激光器本申请同样适用。
来自第一激光器的信号光和来自第二激光器的信号光经过第一分束单元得到多个子信号光，多级放大单元中的其中一级放大单元用于对至少一个子信号光进行放大生成第一信号光，该至少一个子信号光包含部分来自第一激光器的信号光和部分来自第二激光器的信号光。后续的处理过程可以参考前述实施例以及其他设计。
作为一种可能的实施方式，光信号处理装置可以包含合束单元，合束单元用于将部分来自第一激光器的信号光和部分来自第二激光器的信号光进行合并，得到该至少一个信号光。可选的，合束单元可以通过波分复用(wavelength division multiplexing，WDM)、阵列波导光栅(arrayed waveguide grating，AWG)等多波长合束结构实现，或者，可以通过多模干涉仪(multi-mode interferometer，MMI)、定向耦合器(directional coupler，DC)等光能量合束结构实现。可理解的，由于光路可逆，因此，WDM、AWG、MMI、DC等也可以用于分束和/或解复用。
如图6A是本申请实施例提供的又一种可能的光信号处理装置的结构示意图。第一分束单元601用于将来自第一激光器的信号光分为多个第四信号光，以及将来自第二激光器的信号光分为多个第五信号光。这里的第四信号光和第五信号光可以看作前述的子信号光。
第四信号光和第五信号光的数量本申请不做限定。示例性的，多个第四信号光可以包含第四信号光c 0和第四信号光c 1，多个第五信号光可以包含第五信号光d 0和第五信号光d 1。
光信号处理装置还包含合束单元602，合束单元602用于将至少一个第四信号光和至少一个第五信号光进行合束，得到子信号光a 1。为了便于区分，以下将合束后得到的信号光称为第六信号光。
M级放大单元中的其中一级放大单元用于放大第六信号光(即图6A所示的子信号光a 1)生成第一信号光。后续处理过程中可以参考前述。
在这种实施方式中，光信号处理装置也适用于处理多个激光器的信号光，以上仅以第一激光器和第二激光器为例。这多个激光器的信号光中的部分可以进行合束，合束之后的信号光在发射过程中就像发射单光源的信号光一样，可以避免交叉，减少串扰。
可选的，多个激光器发射的信号光通常具有不同的性质。示例性的，所述来自第一激光器的信号光和来自所述第二激光器的信号光具有不同的扫频斜率。示例性的，所述来自第一 激光器的信号光和来自所述第二激光器的信号光具有不同的中心波长。
在返回的处理过程中，对返回信号进行解复用可以区分不同探测信号光的返回信号，从而使用一个通道的返回信号可以获得多个采样点。例如，第一激光器和第二激光器可以分别发射正、负斜率的线性调频激光，经过合束后，一个通道的探测信号光即包含正、负斜率的线性调频激光，这个通道的探测信号光照射到目标同一点上；返回信号通过分束可以分别进行混频，得到两个采样点，可以提高出点率，获得更高的点云分辨率。
如图6B是本申请实施例提供的一种多激光器的信号光的斜率示意图，可以看出，在t0-t1的时间段内，激光器1发射正斜率扫频激光，而激光器2发射负斜率扫频激光。因此，在拍频时，目标反射后得到的返回信号，经分离后可以与各自本振混频形成不同频率的拍频信号。拍频信号可以按照时间依次被截取，得到多个信号段，多个信号段分别用于得到多个测量点的信息。例如，第一次拍频时，在飞行时间后取第一段相干时长为N1的信号进行处理，获得第一个测量点的距离和速度信息；第二次拍频时，取第二段相干时长为N2的信号进行处理，获得第二个测量点的信息，前后两段信号长度可相等或不等。
可选的，图6B以扫频斜率的方向不同进行介绍，具体实施过程中，还可以通过其他方式区分不同激光器的信号光。
例如，激光器1和激光器2发射的都是正斜率扫频激光或负斜率扫频激光，只是扫频斜率(即扫频速度)不同。
再如，激光器1和激光器2发射的是不同波长范围的激光。应理解，这里的不同波长范围是指中心波长不同，也可以理解为，激光的波长范围的上限和下限不同。即，二者的波长范围可以具有一定的重叠的部分，但是不完全重叠。示例性的，激光器1发射红外线，激光器2发射可见光。
【设计6】
分束单元可以包含一个或者多个分束器，本申请对于分束器的分路数量不做限定。例如，分束器可以为一分二分束器、或一分三分束器等。
作为一种可能的设计，分束单元可以包含多个分束器，多个分束器可以按照树形结构排列，通过多次分光输出多个通道的信号。
以第二分束单元为例，第二分束单元包含的分束器的数量例如为N个，N为整数且N＞0。N个分束器以树形拓扑结构排列且每个分束器作为树形拓扑结构的节点，每个父节点位置的分束器分束得到的信号光被提供给子节点位置的分束器。第一信号光输入根节点位置的分束器，所述多个第二信号光从叶子节点位置的分束器输出。
以下示例性的提供几种分束单元的实现示意图。需要说明的是，下文中的部分实施例中，放大单元以SOA为例进行描述，对于采用其他放大器的情况本申请同样适用。
如图7A是本申请实施例提供的又一种信号处理装置的结构示意图。如图7A所示，第一分束单元701包含一个一分二分束器，该一分二分束器将来自激光器的信号光分为两个子信号光；第二分束单元702包含多个一分二分束器，每个一分二分束器都将输入的信号光分成两份，最终从叶子节点位置的分束器中输出多个第二信号光。
一些场景中，通过波导可以分出多路信号光，即，分束器可以通过波导实现。将光波导作为分束单元，更易于集成，可以进一步降低体积，提高稳定性。此外，波导分光可以降低由于光学分光造成的能量损失，提升信号有效性且避免杂散光。
如图7B是本申请实施例提供的又一种信号处理装置的结构示意图。第二分束单元包含 多个波导，每个波导用于将输入的信号光分成多份，最终输出多个第二信号光。
如图7B所示，波导703可以作为第一分束单元，在区域704处将输入的信号光分为多个子信号光。再如，第二分束单元705包含多条波导，多条波导中包含多个分岔口，将输入的信号光通过多个波导的分岔口分为多个第二信号光。
作为一种可能的实施方式，M级放大单元的其中一级放大单元中包含多个放大器，该多个放大器位于叶子节点位置的分束器之后。
如图7A和/或图7B所示，SOA位于末层分束器之后。
需要说明的是，图7A和图7B所示的实施例中，每个第二信号光都经过了相同的分光层级，但并不限定每个第二信号光具有相同的功率。以下列举两种实现多个第二信号光功率差别设计的方式：
实现方式一：分束器在分光时可以设置分光的比例。例如，一分二分束器分得的两路信号光中，其中一路的信号光的能量可以高于另一路。
通过控制分光比例，可以使得部分第二信号光具有更高的功率，从而可以根据对探测结果的需求(例如分辨率、探测精度或探测距离等需求)对信号光的功率进行设计。例如，用于发射到视野中感兴趣区域的第二信号光具有更高的功率，以提升对感兴趣区域的探测结果的分辨率和探测精度等。
可选的，感兴趣区域可以是视野的中间部分，或者预先定义的视野区域等。
实现方式二：部分第二信号光所经历的分光器的层数与另一部分第二信号光所经历的分光器的层数不同。如图7C是本申请实施例提供的又一种光信号处理装置的结构示意图，第二分束单元706将输出的信号光分为多个第二信号光。其中，部分1对应的第二信号光和部分3对应的第二信号光经过四层分光，而部分2对应的第二信号光进行三层分光。
通过控制分光层级，可以使得部分第二信号光具有更高的功率，从而可以根据对探测结果的需求(例如分辨率、探测精度或探测距离等需求)对信号光的功率进行设计。例如，用于发射到视野中感兴趣区域的第二信号光经历相对更少的分光层级，因此这些第二信号光具有更高的功率，以提升对感兴趣区域的探测结果的分辨率和探测精度等。
实现方式三：部分第二信号光可以是经过合并得到的。如图7D是本申请实施例提供的又一种可能的光信号处理装置的结构示意图，第二分束单元707将输出的信号光分为多个第二信号光。其中，第二信号光708是由两路信号光在区域709处合并得到的。第二信号光708可能具有更高的功率。
以上通过分光单元实现第二信号光的功率差异的实现方式仅为示例，具体实施过程中还可能通过其他方式实现第二信号光之间的差异。
综上可知，通过树形的分束器结构，可以控制分光后的信号的能量分布，从而灵活设计探测装置的分辨率分布。
【设计7】
在设计6中可以了解到，第二分束单元包含树形结构的多个分束器，每个分束器作为树形拓扑结构的节点。树形结构中间包含多条分路，这使得放大单元的位置设计也更加灵活。以下列举几种可能的放大单元的可能情况：
情况1，M级放大单元中的部分级放大单元包含多个放大器，多个放大器位于叶子节点位置的分束器之后。
如图7A、图7B、图7C和图7D所示，多个SOA设置在叶子节点位置的分束器之后。 这种实施方式中，在第二分束单元之后设置放大器，信号光经过分光以后再输入放大器，从而可以更加精准地控制第三信号光的功率，提升探测信号光的稳定性。
情况2，M级放大单元中，部分级放大单元包含多个放大器，多个放大器位于多个树形拓扑结构内的分束器之间。
如图8A是本申请实施例提供的又一种光信号处理装置的结构示意图，其中，第二分束单元包含两个分束单元，即分束单元801和分束单元802。分束单元801包含多个分束器，分束单元也包含多个分束器，且分束单元802中输入的信号光由分束单元801分束得到。分束单元801和分束单元802之间设置一级放大单元，即放大单元803，放大单元803包含多个SOA。
如图8A所示，分束单元801用于将输入的信号光分为多个第二信号光，如图8A所示的第二信号光b 0、第二信号光b 1、第二信号光b 3和第二信号光b 1。放大单元803，用于将多个第二信号光中的至少一个第二信号光进行放大，得到若干个第三信号光。若干个第三信号光可以进一步输入分束单元802再次分束。
应理解，图8A所示的SOA的设计仅为示例，具体实施过程中还可以有其他设计。例如，SOA可以设置在部分第二信号光的传输路径上，此时，放大单元803用于对部分第二信号光进行放大。再如，部分第二信号光(或者第三信号光)可以不再经过分束。
这种实施方式中，信号光经过第二级放大单元后还会被再次分光，相当于几个信号光可以共用一个放大器，可以减少放大器的数量，节省成本。另外，在末级放大器后再增加分束器，可以增加发射通道数量，提高出点率。
情况3，M级放大单元中，部分级放大单元包含多个放大器。多个放大器中的部分放大器位于叶子节点位置的分束器之后，另一部分放大器位于所述多个树形拓扑结构中的分束器之间。
如图8B是本申请实施例提供的又一种光信号处理装置的结构示意图。分束单元801和分束单元802之间设置一级放大单元，即放大单元804。分束单元802之后设置一级放大单元，即放大单元805。
具体的，放大单元804包含多个SOA，用于将部分第二信号光进行放大，得到第三信号光，这部分第三信号光可以输入分束单元802，进行进一步分光。而另一部分未经放大的第二信号光也输入分束单元802，经过分束以后得到的信号光输入至放大单元805进行放大。
这种实施方式中，部分第三信号光是经过放大器放大以后再分光，相当于最终的部分信号光共用一个放大器；部分信号光是经过多层分光以后再放大，即每路信号光独立使用一个放大器进行放大，如此可以根据需求设置探测信号光的功率，既可以节省一定的成本，也可以优先保证部分探测信号光的功率。
一些场景中，部分信号光还可以经过多次放大器。如图8C是本申请实施例提供的又一种光信号处理装置的结构示意图，分束单元801和分束单元802之间设置一级放大单元，即放大单元803。分束单元802之后设置一级放大单元，即放大单元806。
放大单元803用于将多个第二信号光进行放大，得到第三信号光，这部分第三信号光可以输入分束单元802，进行进一步分光。由分束单元802分光得到的信号光中的部分信号光，经过放大单元806进行放大。综上，通过树形结构的分束器和多个放大单元，厂商可以根据需求设置放大器的位置，控制探测信号光的功率，提升光路设计和功率设计的灵活性。
情况四，M级放大单元中的末级放大单元包含多个放大器，多个放大器位于第二分束单元之后，经过末级放大单元之后的信号光可能被再次分光。如图8D是本申请实施例提供的 又一种光信号处理装置的结构示意图，如图8D所示，第二分束单元807之后设置放大单元808(即末级放大单元)，第二分束单元807用于输出第二信号光，第二信号光经过放大单元808后会再次被分束。
可选的，分束的层级以及分得的信号光的数量本申请不做严格限定。例如，如图8D所示的部分1中包含的信号光在末级放大单元808后经历两层分束，而部分2中包含的信号光在末级放大单元808后经历一层分束。
【设计8】
作为一种可能的设计，放大单元的放大作用可控。以SOA为例，利用SOA输出信号光的功率与驱动电流相关的特性，光信号处理装置可以改变放大单元的驱动电流，从而控制经过放大单元的信号光的功率大小，提升灵活性，降低能耗。以下以放大单元通过SOA为例进行说明，对于其他放大器同样适用。
一些可能的场景中，光信号处理装置还包含功率控制器，所述功率控制器用于调整M级放大单元中部分或者全部级放大单元的驱动电流，以控制输出的信号光的功率。
示例性的，功率控制器可以在信号光指示到视野中的感兴趣区域时增大部分或者全部SOA的驱动电流，在视野中的其他区域减小部分或者全部SOA的驱动电流。
例如，信号光以行扫的方式扫描视野，对视野内的区域完成一次扫描所需的时间为20毫秒(ms)。功率控制器可以每个扫描周期的第5-10ms提高部分或者全部SOA的驱动电流，从而使得扫描视野中间部分时，探测信号光具有更大的功率，从而提升视野中间部分的出点率。而在边缘区域使用较低的功率扫描，可以降低能耗，控制散热，提升使用寿命。
再如，通过在视野中划定感兴趣区域，当信号光扫描至感兴趣区域时，提升对应的SOA的驱动电流，从而针对感兴趣区域定向提高出点率，进而提升探测结果的感兴趣区域的分辨率，有利于使用感知结果进行识别、决策，提升智能化程度。
一些可能的场景中，信号的发射功率与信号当前的指向角度相关。
例如，在中心视场位置增大发射功率，在边缘视场处减小发射功率。
再如，在发射光束不能经由扫描器出射的扫描无效区域，放大单元的光功率放大功能。其中，扫描无效区域是指探测信号光无法全部投射到视野上的扫描角度。此时，探测信号光可能会被投射到设备内部。
信号的指向角可以通过扫描器来改变。作为一种可能的方案，功率控制器可以根据来自处理器和/或控制器的控制信号，调整所述第二级放大单元的驱动电流，控制信号与扫描器的指向角度相关。
【设计9】
不限于前述的设计，在一种可能的设计中，光信号处理装置还包含光输入输出单元，所述光输入输出单元包含多个输出端口，多个输出端口用于将探测信号光出射到空间中，进行探测。
可选的，输出端口可以由末级放大器提供，和/或，由耦合器(便于区分以下称为发射耦合器)提供。可选的，发射耦合器可以为边沿耦合器或者光栅耦合器。
作为一种可能的实施方式，放大器包含入射端面和出射端面，出射端面可以作为输出端口，将信号光输出到空间中。如图9A是本申请实施例提供的又一种光信号处理装置的示意图，信号光进入SOA901后，从SOA901的出射端面出射到外部，形成探测信号光。
作为又一种可能的实施方式，信号光的输出端口由耦合器提供。如图9B是本申请实施 例提供的又一种光信号处理装置的示意图，信号光进入SOA902后，从SOA902的出射端面传输到发射耦合器903(即三角形状的部件)，从发射耦合器903的端面出射，形成探测信号光。
应理解，图9A和图9B是用于说明输出端口的设计故列举的两种可能的实施方式，并不对传输路径和分光情况做限定。例如，SOA902至发射耦合器903中还可能经过分光器和/或光开关等。相关描述可以其他设计，此处不再一一说明。
【设计10】
不限于前述的设计，在又一种可能的设计中，光信号处理装置还可以包含多个接收端口，多个接收端口用于接收返回信号光，所述返回信号光包含探测信号光的反射。
需要说明的是，虽然此处称为返回信号光，但是并不限定返回信号光中只包含对探测信号光的反射。例如，返回信号光中还可能包含来自视野内的其他光源的信号光，其他光源例如太阳、路灯、车灯、或激光等。
可选的，接收端口可以通过耦合器(便于区分以下称为接收耦合器)实现，例如边沿耦合器或光栅耦合器等。
作为一种可能的设计，接收端口可以与输出端口耦合在一起。即，输出端口也可以作为接收端口。例如，一种偏振分束器(polarizing beam splitter，PBS)可以提供三个端口(便于区分称为端口1、端口2和端口2)，其中，端口1接收探测信号光并通过端口3输出到空间中，端口3还接收来自视野的信号光并将来自视野的信号光从端口2输出作为返回信号光，即，该PBS既可以提供输出端口也提供接收端口。再如，一种偏振分束光栅(polarization beam splitting grating，PSGC)耦合器也包含端口1和端口2，端口1用于接收需要探测信号光并输出到空间中，端口2用于得到返回信号光。
在前述的设计中我们了解到，信号光的功率是可控制的。作为一种可能的设计，通过监测返回信号光的能量强度，可以调整探测信号光的功率。
例如，当返回信号光的能力强度太低时，可以增大探测信号光的功率，提升探测精度。
再如，当返回信号光的能力强度太高时，可以降低探测信号光的功率。这样既可以减少能耗，还可以降低由于高反或者角反目标的强反射作用烧坏探测元件的可能性。
一些可能的场景中，接收端口和输出端口之间具有对应关系。例如以第一输出端口和第一接收端口为例，第一接收端口接收的信号光包含由第一输出端口输出的探测信号光的反射。此时，当由第一接收端口接收的信号光的功率大于第一阈值，光信号处理装置可以降低所述第二级放大单元的驱动电流以降低由所述第一输出端口输出的探测信号光的功率。同理，当由第一接收端口接收的信号光的功率小于第二阈值，光信号处理装置提高所述第二级放大单元的驱动电流以增大由第一发射子端口输出的探测信号光的功率。
可选的，调整驱动电流的操作可以由功率控制器来实现。
作为一种可能的方案，光信号处理装置还包含混频单元，混频单元用于根据返回信号光和本振信号光得到一个或者多个混频结果。这里的混频结果可以是经过混频、或拍频等的处理，得到的信号光。
可选的，本振信号光是与来自激光器的信号光的性质相同的信号光。例如，在上文中我们提到，本振信号光可以属于前述的子信号光，或者属于前述的第二信号光。
如图10A是本申请实施例提供的又一种可能的光信号处理装置的结构示意图。光信号处理装置可以包含多个接收端口和混频单元1001。示例性的，混频单元可以包含多个混频器。
混频单元1001的输入为本振信号光和由接收端口接收的返回信号光。为了便于理解，将返回信号光分别表示为e 0、e 1、e 2和e 3。而本振信号光也包含多个通道的信号光，分别表示为a 1_0、a 1_1、a 1_2和a 1_3。混频单元用于对本振信号光和返回信号光进行混频，得到多个混频结果。如图10A所示，本振信号光a 1_0和返回信号光e 0在混频器进行混频，得到混频结果f 0，类似的，本振信号光e 1和返回信号光a 1_1在混频器进行混频，得到混频结果f 1。其余信号光的混频类推，得到混频结果f 0、f 1、f 2和f 3。
进一步的，混频结果可以输入探测单元中进行进一步处理。如图10A所示，混频结果f 1可以输入探测单元的输入端口1003(探测单元的输入端口通过圆圈示意)。
可选的，部分探测单元还可以接收来自反馈单元1002的输出(下文中进行介绍)。
如图10B是本申请实施例提供的又一种可能的光信号处理装置的结构示意图。光信号处理装置可以包含多个接收端口和混合单元(如图10B所示的多个混频器)。
混合单元的输入为本振信号光和由接收端口接收的返回信号光，其中，本振信号光(例如图10B所示的b1、b3、b5和b7)在第二分束单元引出，可选在末级SOA之前或者末级SOA之后。混频单元用于对本振信号光和返回信号光进行混频，得到多个混频结果。如图10B所示，本振信号光和返回信号光在混频器进行混频，得到混频结果，混频结果输入探测单元的输入端口1004，进行进一步处理。
作为一种可能的实施方式，本振信号光可以为对出射的信号光进行部分反射所得到的，或者，接送端口所接收的信号光包含了本振信号光和返回信号光。
请参见图10C，图10C是本申请实施例提供的又一种光信号处理装置结构示意图，由输出端口(如SOA)输出的信号光经过光学模组1005，光学模组1005中包含具有部分反射部分透射的光学元件，可以将输出的信号光进行部分反射。本申请实施例对于部分反射部分透射的光学元件的反射比例不进行限制，如为半透半反、或者70％透射30％反射等比例均适用本方案。
如图10C所示，光学模组1005包含PBS、QWP、半透半反镜、HWP(可选)、反射镜(可选)等，输出端口输出的信号光经过PBS、QWP和半透半反镜，约一半的信号光透过半透半反镜，一半的信号光被反射。被反射的信号光再次经过QWP，由于经过两次QWP使得偏振方向改变，因此，被半透半反镜反射的信号光再次经过PBS时被反射，并经过HWP(可选)、反射镜(可选)到达接收端口。被半透半反镜反射的信号光可以作为本振信号光。
进一步的，来自视野内的返回信号光经过QWP、PBS，经过PBS时被反射，并经过HWP(可选)、反射镜(可选)到达接收端口。
可选的，QWP也可以替换为两个八分之一波片、法拉第旋转镜、法拉第旋转镜和波片的组合、或四分之一波片和二分之一波片的组合等中的一项或者多项。
作为一种可能的实施方式，接收端口接收的信号光包含本振信号光和返回信号光，因此，接收端口接收的信号光可以看作是经过混频的信号光。进一步的，接收端口接收的信号光可以输入探测器的输入端口1004进行进一步处理。
需要说明的是，图10C以分别设置在多个接收端口之前的多个光学模组为例进行示意。具体实施过程中，多个光学模组可以替换为覆盖多个发射端口和接收端口的光学模组。
图10D所示是本申请实施例提供的又一种光信号处理装置的结构示意图。图10C中由多个光学模组1005实现的功能可以由光学模组1006所实现，光学模组1006覆盖多个发射端口和接收端口。
光信号处理装置所得到的混频结果用于确定视野内的目标的相关信息。目标的相关信息 例如目标的距离、位置、速度、反射率或颜色等。
作为一种可能的实施方式，混频结果可以被传输到探测单元，探测单元可以根据混频结果得到电信号。该电信号可以用于处理得到目标的相关信息。
探测单元可以包含一个或者多个探测元件(或称探测器)，探测元件可以用于接收信号光并得到电信号。示例性的，探测元件可以为能探测光能量的光电二极管(Photo Diode，PD)，例如InGaAs PD、InP PD、或锗PD等。相应的，探测单元可以是InGaAs PD Array，InP PD Array等。
一些场景中，在探测单元包含多个探测元件的情况下，多个探测元件可以通过阵列方式排布，例如10个探测元件可以排列形成1×10阵列、2×5阵列等。此时，探测单元也可以称为阵列探测器。
可选的，探测单元可以设置在光信号处理装置之外的边缘处。探测单元设置在外部时，光信号处理装置的体积较小，易于加工。示例性地，光信号处理装置和探测单元可以分别加工，后续将探测元件贴装在光信号处理装置的边缘处，可以使得探测元件可以对光信号处理装置的输出结果进行处理。当然，贴装只是一种示例性的继承方式，还可以替换为倒装、贴片等方式。
可替换的，探测单元中的探测元件可以集成在光信号处理装置中。例如，通过片上集成方式，将多个探测元件与芯片(或材料平台)一起加工耦合。以光信号处理装置通过硅光芯片实现为例，硅光芯片中包含一体加工的锗PD。
将探测元件设置在光信号处理装置中，可以对光信号装置的拓扑结构进行优化。这种结构有效避免了波导的交叉，可以基本实现无串扰或者低串扰的方案，从而提高信号的探测能力，降低判别阈值。
【设计11】
作为一种可能的实施方式，当激光器的数量为多个时，返回信号可能包含对来自多个激光器的信号光的反射。在对返回信号光进行处理时，需要将返回信号光进行分光，从而分别与多个激光器的本振信号光进行混频。可选的，分光可以分离出对应不同激光器的信号光。
以下以激光器包含第一激光器和第二激光为例，对返回信号光的处理过程进行介绍。应理解，在分束器可以分离得到不同性质的信号光时，也可以称为解复用过程。本申请统一以分束为例进行介绍，对于解复用的情况同样适用。
作为一种可能的方案，光信号处理装置还包含第三分束单元和混频单元。
第三分束单元用于将返回信号光分为第一子返回信号光和第二子返回信号光。混频单元用于，将第一子返回信号光和第一子本振信号光混频得到第一混频结果，以及，将第二子返回信号光和第二子本振信号光混频得到第二混频结果。其中，所述第一子本振信号光来自第一激光器，所述第二子本振信号光来自第二激光器。
如图11A是本申请实施例提供的又一种可能的光信号处理装置的示意图。光信号装置将来自第一激光器的信号光分为两个部分，即子信号光a 0和子信号光a 1，将来自第二激光器的信号光分为两个部分，即子信号光c 0和子信号光c 1。其中，子信号光a 0和子信号光c 0作为探测信号光，经过合束单元、第二分束单元和多级放大单元(如SOA)放大后出射。子信号光a 1和子信号光c 1分别作为第一子本振信号光和第二子本振信号光。进一步的，第一子本振信号光(a 1)可以进一步分光，得到信号光a 1_0、a 1_1、a 1_2和a 1_3，第二子本振信号光(c 1)可以进一步分光，得到信号光c 1_0、c 1_1、c 1_2和c 1_3。
接收端口接收返回信号光，每一路返回信号光经过第三分束单元(包含4个“解复用”模块)的分束后，分为两路子返回信号光，分别与两路本振信号光(第一子本振信号光和第二子本振信号光)进行混频。可替换的，本申请的多个解复用模块也可以替换为分束器，例如波长分束或者能量分束的分束器。
如图11A，第一子返回信号光可以包含：e 0、e 1、e 2和e 3，第二子返回信号光可以包含：g 0、g 1、g 2和g 3。示例性的，混频单元1101包含四个分束器，用于对第一子返回信号光和第一子本振信号光进行混频，子返回信号光e 0与第一子本振信号光a 1_0混频，得到混频结果f 0；混频单元1102包含四个分束器，用于对第二子返回信号光和第二子本振信号光进行混频，子返回信号光g 0与第二子本振信号光c 1_3混频，得到混频结果f 8。其余情况以此类推，可以参照图11A。
作为又一种可能的方案，本振信号光可能经过合束单元合束，即本振信号光包含来自所述第一激光器的信号光和来自所述第二激光器的信号光。这种情况下，光信号处理装置还包含第四分束单元。第四分束单元，用于将本振信号光解复用得到第一子本振信号光和第二子本振信号光，所述第一子本振信号光作为来自第一激光器的信号光的本振信号，所述第二子本振信号光作为来自所述第二激光器的信号光的本振信号。
如图11B所示是本申请实施例提供的又一种可能的光信号处理装置的示意图。光信号装置将来自第一激光器的信号光分为两个部分，即子信号光a 0和子信号光a 1，将来自第二激光器的信号光分为两个部分，即子信号光c 0和子信号光c 1。其中，子信号光a 0和子信号光c 0，经过合束后、分束后得到多个第二信号光，例如表示为b 0、b 1、b 2、b 3、b 4、b 5、b 6和b 7。其中，b 0、b 2、b 4和b 6出射。其中，b 1、b 3、b 5和b 7作为本振信号光，经过第四分束单元(包含4个“分束”模块)处理后分别得到第一子本振信号光和第二子本振信号光。例如，第一子本振信号光分别包含b 1_0、b 3_0、b 5_0和b 7_0，第二子本振信号光分别包含b 1_1、b 3_1、b 5_1和b 7_1。
接收端口接收返回信号光，例如返回信号光包含e 0、e 1、e 2和e 3，每一路返回信号光分别经过第三分束单元(包含4个“分束”模块)得到第一子返回信号光和第二子返回信号光。例如，第一子返回信号光分别包含e 0_0、e 1_0、e 2_0和e 3_0，第二子返回信号光分别包含e 0_1、e 1_1、e 2_1和e 3_1。
示例性的，子返回信号光e 0_0与第一子本振信号光b 1_0混频，得到一个混频结果，子返回信号光e 0_1与第一子本振信号光b 1_1混频，得到一个混频结果。其余情况以此类推，可以参照图11B。
需要说明的是，本申请各实施例中，对于返回信号光的分束可以为能量分束、或波长分束。另外，一些实施例中所描述的“解复用”也可以替换为“分束”。
作为又一种可能的方案，返回信号光可以经过光学元件分光后再由接收端口接收。
如图11C所示是本申请实施例提供的又一种可能的光信号处理装置的示意图。信号光的发射部分的相关说明请参见图11B，此处不再赘述。
对于返回信号光的处理示例性如下：信号光e 0、e 1、e 2和e 3被光学模组(如包含4个分光元件1103)分光，每一路被分为两路子信号光。接收端口接收子返回信号光，得到4个第一子返回信号光和4个第二子返回信号光，如图所示，第一子返回信号光分别包含e 0_0、e 1_0、e 2_0和e 3_0，第二子返回信号光分别包含e 0_1、e 1_1、e 2_1和e 3_1。
示例性的，子返回信号光e 0_0与第一子本振信号光b 1_0混频，得到一个混频结果；子返回信号光e 0_1与第一子本振信号光b 1_1混频，得到一个混频结果。其余情况以此类推，可以 参照图11B。
其中，分光元件1103可以为光栅、干涉仪等。例如，WDM、AWG、MMI、DC等。
可选的，图11C以多个分光元件1103进行分光为例进行示意。具体实施过程中，也可以通过对来自视野内的信号光进行整体的分束从而得到可供多个接收元件接收的信号光。
需要理解的是，本申请各个实施例提供的发射通道数量和接收通道数量仅为示例，具体实施过程中可以包含更多或者更少的通道。例如，图11C所示的4个通道的发射信号光、8个通道的返回信号光等仅为示例。另外，图11C所示的输出端口(如SOA的出射端面)与接收端口的排列仅为示意。对于其他的排列方式，也可以同样适用“将返回信号光可以经过光学元件分光后再由接收端口接收”这一设计。
作为又一种可能的方案，接收端口所接收的信号光中可能包含可作为本振的信号光。在这种情况下，由接收端口接收的信号光可以经过分束器，分离出两组信号光，两组信号光可以分别对应不同的激光器。两组信号光分别进入不同的探测单元进行探测，可以无需进行额外的混频。
如图11D所示是本申请实施例提供的又一种可能的光信号处理装置的示意图。信号光的发射部分的相关说明请参考前述，此处不再赘述。由输出端口(如SOA的出射端面)输出的信号光经过光学模组，光学模组中包含具有部分反射部分透射的光学元件，可以将输出的信号光进行部分反射。
如图11D所示，光学模组包含PBS、QWP、半透半反镜、HWP(可选)、反射镜(可选)等，输出端口输出的信号光经过PBS、QWP和半透半反镜，约一半的信号光透过半透半反镜，一半的信号光被反射。被反射的信号光再次经过QWP，由于经过两次QWP使得偏振方向改变，因此，被半透半反镜反射的信号光再次经过PBS时被反射，并经过HWP(可选)、反射镜(可选)到达接收端口。被半透半反镜反射的信号光可以作为本振信号光。
进一步的，来自视野内的返回信号光经过QWP、PBS，经过PBS时被反射，并经过HWP(可选)、反射镜(可选)到达接收端口。
作为一种可能的实施方式，接收端口接收的信号光包含本振信号光和返回信号光，因此，接收端口接收的信号光可以看作是经过混频的信号光。由于本振信号光和返回信号光中均包含来自两个激光器的信号光，此时，通过分束器可以将接收端口接受的信号光进行分束，从而基于一个返回信号光可以得到多个采样点，提升分辨率。
进一步的，经过分束的信号光可以输入探测单元的输入端口进行进一步处理。可选的，本申请实施例对于部分反射部分透射的光学元件的反射比例不进行限制，如为半透半反、或者70％透射30％反射的分光比例均适用本方案。图11D所示的半透半反镜仅为示例。
【设计12】
由于输出端口和输出端口分别有多个，光信号处理装置的接收端口和反射端口排布可以有多种可能的设计。下面示例性地列举几种可能的情况：
情况一，多个接收端口按列排布形成接收端口组，多个输出端口按列排布形成输出端口组，接收端口组和所述输出端口组相对设置，一个输出端口和至少一个接收端口相对设置且共用一个光学模组。
其中，相对设置可以是器件的安装方向相反(或具有相互面对的表面)，也可以是方向相同但是空间位置上相对。
作为一种接收端口和输出端口相对设置的示例，图12A是本申请实施例提供的一种接收 端口和输出端口相对设置的示意图，输出端口和接收端口左右相对设置。如图12B是本申请实施例提供的一种光路示意图，信号光在发射端面和接收端面相对的面的侧面传输，由输出端口输出的探测信号光和由接收端口接收的信号光经过相同的光学模组1201。由于输出的信号光和接收的信号光都从光学模组经过，因此该光学模组1201也可以称为收发光学模组。
需要说明的是，图12A和图12B是以一个输出端口对应一个接收端口为例进行说明。具体实施过程中，一个输出端口还可以对应多个接收端口。如图12C是本申请实施例提供的有一种接收端口和输出端口相对设置的示意图，一个输出端口对应2个接收端口，如输出端口1对应接收端口1_1和接收端口1_2，输出端口1与接收端口1_1和接收端口1_2相对设置。进一步的，接收端口1_1和接收端口1_2紧密排列，输出端口1与接收端口1_1和接收端口1_2共同一个收发光学模组。
可选的，接收端口1_1和接收端口1_2可以得到两路回波信号，在混频时也对应两路本振信号，并与各自对应的混频信号混频。
作为一种接收端口和输出端口相对设置的示例，图13A是本申请实施例提供的又一种接收端口和输出端口相对设置的示意图，输出端口和接收端口上下相对设置。如图13B是本申请实施例提供的又一种光路示意图，其中，输出端口和接收端口，信号光在发射端面和接收端面传输，由输出端口输出的信号光和由接收端口接收的信号光经过相同的光学模组1301。
可选的，光学模组可以有多个。例如，光学模组的数量与接收端口的数量或输出端口的数量相同，此时，一个接收端口和一个输出端口共用一个光学模组，另一个接收端口和另一个输出端口则共用另一个光学模组。
或者可选的，光学模组可以只有一个，多个接收端口和多个输出端口均共用一个光学模组。
可选的，探测信号光的光学路径和接收信号光的光学路径可以同轴，或者，离轴。
情况二，所述多个接收端口按列排布形成接收端口组，所述多个输出端口按列排布形成输出端口组；接收端口组共用一个接收光学模组，所述输出端口组共用一个发射光学模组。
如图14是本申请实施例提供的又一种输出端口和接收端口的示意图，其中输出端口组1401包含多个输出端口，接收端口组1403包含多个接收端口。其中，多个输出端口共用一个光学模组1402，多个接收端口共用一个光学模组1404。
情况三，输出端口组包含多个输出端口，多个输出端口之间的间距可以进行设计，使得部分输出端口之间的间距相对更小，从而提升对视野内部分区域的探测精度。
作为一种可能的实施方式，上部分的输出端口之间的间距小于下部分的输出端口之间的间距。如图15A是本申请实施例提供的一种可能的输出端口的示意图，输出端口组1501包含多个输出端口，其中，上部分输出端口之间的间距为D1，下部分的输出端口之间的间距为D2，D1＜D2。当然，根据使用场景的不同，还可以设计，D1＜D2。
作为又一种可能的实施方式，中间部分的输出端口之间的间距小于边缘部分的输出端口之间的间距。如图15B是本申请实施例提供的一种可能的输出端口的示意图，其中，输出端口组1502包含多个输出端口，上部分输出端口之间的间距为D3，中间部分的输出端口之间的间距为D4，下部分的输出端口之间的间距为D5，D4＜D3，和/或，D4＜D5。
考虑一种可能的场景，上半部分的输出端口出射的探测信号光指向视野区域的上方，中间部分的输出端口出射的探测信号光指向视野区域的中间，下半部分的输出端口出射的探测信号光指向视野区域的下方。当该光信号处理装置的视野为车辆前方时，由于车辆前方的视野区域上方通常为建筑或者天空，视野区域下方为近距离地面，视野区域中间为车辆前方中 远距离的地面，因此，将指向视野区域中间的输出端口密集排布，可以提升对视野中间区域的探测结果分辨率，提升探测精度，有利于进行后续进行目标识别或者自动驾驶决策，提升探测结果的可用性。
可选的，D3和D5之间的大小可以根据实际需求设计，例如D5＜D3。如在前述的车辆行驶场景中，对于视野下部分的感兴趣程度高于视野上部分，此时可以设计下半部分的输出端口之间的间距小于上部分输出端口之间的间距。
当然，根据使用场景的不同，还可以设计D3＞D5，D3＝D5等。总之，通过多个输出端口进行发射，可以对输出端口之间的间距进行设计，使得探测分辨率和探测精度满足探测需求，提升探测性能。
【设计13】
在上文中我们提到，本申请的光信号处理装置，收发光路可以是同轴的，或者，离轴的。以下分别说明同轴的光路设计和离轴的光路设计。
如图16是本申请实施例提供的一种可能的离轴光路的示意图。信号光经过发射(transmitter，Tx，也称为探测)耦合器(coupler)发射形成探测信号光，探测信号光经过发射镜头(Tx lens)照射到视野内的目标上，产生反射，形成返回信号光。返回信号光经过接收(Receiver，Rx)镜头被接收耦合器(Rxcoupler)接收。探测信号光和反射信号光的光轴不同。
如图17是本申请实施例提供的一种可能的同轴光路的示意图。探测信号光经过发射耦合器出射到空间中，经过发射镜头及PBS，被透射到达四分之一波片，此时探测信号光的偏振方向为P偏振。四分之一波片(quarter wave plate，QWP)会改变探测信号光的偏振方向，将线偏光转换为圆偏光，因此，经过四分之一波片后的探测信号光为圆偏光。圆偏光照射到视野内的目标上产生反射，形成返回信号光(仍为圆偏光)。返回信号光再次经过四分之一波片时，偏振方向发生改变，形成偏振方向为S偏振的返回信号光。S偏振的返回信号光经过PBS后被反射，经过接收透镜到达接收耦合器。探测信号光和反射信号光的光轴相同。
可选的，探测信号光为P偏振光。
可替换的，本申请各实施例中QWP也可以替换为两个八分之一波片、法拉第旋转镜、法拉第旋转镜和波片的组合、或者四分之一波片和二分之一波片的组合等中的一项或者多项。
作为一种可能的实施方案，在PBS和接收耦合器之间的光路上还可以设置二分之一波片(half wave plate，HWP)，HWP将S偏振的返回信号光转换为P偏振的返回信号光，从而使得光信号处理装置的输出到空间中的信号光和接收的信号光具有相同的偏振方向，有利于后续的光路处理。
另外，在一些场景中，波导具有不同的保偏性质。因此，在光信号处理装置中传输的信号光具有一致的偏振方向，有利于光路设计和波导的采购，降低光路设计的复杂度。
应理解，光路中还可以设置一个或者多个反光镜(或者具有反射作用的光学元件)，用于改变信号光的传播方向。本申请对于反光镜的数量和设置位置不做限定。
当然，图16和图17是为了解释同轴和离轴的概念所做出的示例性的介绍，并不旨在限定本申请的同轴和离轴方案一定通过上述方式来实施。
【设计14】
不限于前述的设计，在又一种可能的设计中，光信号处理装置中还包含光开关，光开关 用于控制光学传输路径的通断。
作为一种可能的方案，至少一个输出端口之前包含光开关，光开关用于选通至少一个输出端口之间的若干个输出端口。
如图18是本申请实施例提供的一种可能的光开关的示意图。当光开关1801切换到上方时，光开关1801至输出端口0之间形成光学路径，即选通输出端口0；当光开关切换到下方时，光开关1801至输出端口1之间形成光学路径，即选通输出端口1。
应理解，光开关可以耦合在光信号处理装置中的多个光学路径上。例如，光开关可以设置在第二分束单元至输出端口之间，从而控制是否在所述第二分束单元与所述输出端口之间形成通路。
在一些可能的场景中，光开关的数量可以为多个。例如，通过多个开关组成光学路由，从而从多个通道中选通一个或者多个通道。
作为一种可能的实施方式，光开关可以在多个输出端口的通道间进行切换，通过时间上的复用来增加发射通道数量，同时，利用光开关切换发射通道，可以使各通道出光功率不会受到损耗，从而保证了每个发射通道的发光功率。
如图19是本申请实施例提供的又一种可能的光开关的示意图，以光开关选通4个输出端口为例，在t0时刻，多个光开光选通输出端口0；在t1时刻，多个光开关选通输出端口1；在t2时刻，多个光开关选通输出端口2；在t3时刻，多个光开关选通输出端口3。
通过光开关，多个输出端口按照预设的顺序依次选通，相比同时选通所有输出端口，可以降低对SOA数量以及输出功率的要求。进一步地，该方案还可以根据对分辨率或者探测性能的需求灵活选通输出端口，提高了可用性。
【设计15】
不限于前述的设计，在又一种可能的设计中，光信号处理装置还包含反馈单元。反馈单元的输入为部分来自激光器的信号光，反馈单元用于根据所述反馈信号光检测所述来自激光器的信号光的扫频信息和/或相位噪声。
反馈单元的输出(即反馈结果)可以为一个或者多路信号光。可选，反馈单元的输出可以被提供给探测单元，探测单元可以根据来自反馈单元的反馈结果得到电信号，该电信号可以用于得到来自激光器的信号光的扫频信息和/或相位噪声。
如图10A所示，多个子信号光中，子信号光a3作为反馈信号光输入反馈单元。
如图20是本申请实施例提供的一种可能的反馈单元的示意图，反馈单元包含分束单元2001和混频单元2002。
当信号光输入分束单元2001后，被分为两路。分束单元2001中包含两路不等长的光学路径，两路信号光经过两路不等长的光学路径后输入混频单元2002。混频单元2002可以对两路的信号光进行混频，得到一个或者多个反馈结果。
进一步的，混频单元2002输出的一个或者多个反馈结果可以被探测单元的探测元件接收。
可选的，分束单元2001可以包含非对称马赫曾德尔干涉仪(asymmetric Mach-Zehnder interferometer，AMZI)。混频单元2002包含1个如2×4(2路输入、4路输出)MMI的同相/正交混频器(In-phase/Quadrature，I/Q或IQ)混频器，或包含1个如2×2(2路输入、2路输出)MMI的混频器。
探测单元可以包含多个探测元件，多个探测元件中的部分探测元件可以接收来自反馈单元输出的信号光。例如，混频单元2002包含1个如2×4MMI的混频器，因此混频单元输出 四路信号光，该四路信号光可以分别被四个探测元件接收。
【设计16】
不限于前述的设计，在又一种可能的设计中，光信号处理装置通过芯片或者材料平台实施，芯片和/或材料平台包含不同层。
可选的，传输所述本振信号光和返回信号光的光学路径位于所述基底的不同层。和/或，传输所述反馈信号光和所述返回信号光的光学路径位于所述基底的不同层。
以上对本申请实施例的一些可能的设计进行了介绍。具体实施过程中，上述的多个设计之间还可以进行组合。以下对部分设计进行组合的情况进行示例性地介绍。应理解，以下方式中未解释到的模块、逻辑，可以参考上文中的基础结构以及可能设计。
如图21是本申请实施例提供的一种可能的光信号处理装置210的应用示意图。FMCW激光器发出的线性扫频激光耦合进入光波导后，经过第一分束单元分成三束，一束作为探测信号光(Tx)，经SOA放大、第二分束单元分束后发射，一束作为反馈信号光输入AMZI，最后一束经分光后作为本振(LO)信号光与返回信号光(Rx)混频。
其中，光信号处理装置210对探测信号光的处理如下：经第一级SOA放大后经第二分束单元分成8束，并第二分束单元的末端进入第二级SOA，经放大后由SOA出射端面发射，形成8个通道的探测信号光。每个通道的探测信号光的功率为第二级SOA的出光功率。
光信号处理装置210对反馈信号光的处理如下：反馈信号光输入AMZI，AMZI将反馈信号光分成两路，经过两路不等长的光路后再由1个如2×4MMI的IQ混频器后由4个PD接收探测，或由1个如2×2MMI的混频器后由2个PD接收。
光信号处理装置210对本振信号光的处理如下：本振信号光经过分束器分成与发射通道数量相同的本振通道(即8个通道的本振信号光)，并与接收通道(即8个通道的返回信号光)一一对应。这里的分束器可以包含MMI或DC等，能实现光能量的等分或非等分。
8个通道的本振信号光和8个通道的返回信号光输入混频单元进行混频，混频单元可以包含多个混频器，混频器例如为2×2MMI、2×4MMI、或IQ混频器等。一个混频器用于对一个本振信号光和一个返回信号光进行混频，输出一个或者多个(例如2个)混频结果，混频结果可以被PD接收。
作为一种可能的情况，经过第一分束单元分得的三束信号光，每束都需满足预设的能量需求。若光源能量不够，可以在第一分束单元之前增加一级SOA，使得信号光经过SOA放大后再输入第一分束单元。或者，先经过第一分束单元分束，再后续的光路中再进行放大。
可选的，第一分束单元和/或第二分束单元可以由至少一个1分2分束器级联而成，也可以是由至少一个1分3分束器级联而成。进一步可选的，分束器的分路后的信号光，可以设计为满足一定比例需求。
在图21所示的光信号处理装置中，本振信号光与返回信号光在波导中混频，传播本振信号光的波导和返回信号光的波导之间可能存在交叉。由于光信号处理装置可以为多层结构，作为一种可能的方案，传播本振信号光的波导或传播反馈信号光的波导，与传播回波的波导可以在同一层，也可以在不同层传导。注意，此处对层的表述为在垂直方向上的分层波导。例如，如图21所示，实线表示的波导在第一层，而虚线表示的波导在第二层。
可选的，探测器阵列包含多个探测元件，探测元件可以为能探测光能量的PD。探测器阵列和可以为可以是InGaAs PD Array，InP PD Array等通过封装、倒装等方式与硅光芯片耦合， 也可以是与硅光芯片一体加工的锗PD。
如图21所示，接收耦合器采用边沿耦合器，将接收透镜汇聚的返回信号光耦合进光波导进行混频。接收耦合器与发射SOA一一对应，数量相同。某一发射通道输出的探测信号光，其返回信号能够被对应位置的接收耦合器接收。
在图21所示的实施例中，发射部分采用一组光源分光后形成线阵出射，通过多级SOA对信号光功率进行放大，在提高通道数的同时还能保证每个通道的功率。另外，SOA还可以调节功率并控制发光通道的选择，提升了发射线阵设计的灵活性。进一步的，通过波导传输信号光，通过混合集成、异质集成或封装耦合的方式实现放大器与硅光芯片的集成，可以显著减小体积，提高稳定性。
请参见图22，图22是本申请实施例提供的又一种可能的光信号处理装置的应用示意图。如图22所示，两个FMCW激光器发出的FMCW激光分别耦合进入光波导，且两个FMCW激光分别经过第一分束单元分成三束，分别为探测信号光(Tx)、反馈信号光和本振信号光(LO)。可选的，各束信号光可以直接进行分光，或者，经过SOA放大后再进行分光。
光信号处理装置220对探测信号光的处理如下：将两个FMCW激光分别分光得到的探测信号光输入合束器，由合束器合并后再经过多级SOA放大、分束，最终经输出端口的末级SOA放大后出射。其中，所述合束器可以是多波长合束器或功率合束器等。在图22中，FMCW激光后的圆圈表示耦合器，即光信号处理装置的输入端口，用于接收来自激光器的信号光。
光信号处理装置220对反馈信号光的处理如下：两束反馈信号光分别输入各自的AMZI，每个AMZI用于测量一个激光器的扫频及相位噪声等信息，其参数根据各自光源设置，可以有所不同。详细描述可以参考图21的相关描述。
光信号处理装置220对本振信号光的处理如下：两个本振信号光分成与接收通道相同的数量，并与各自对应的返回信号光进行混频。如图21所示，接收耦合器接收两个光源合束后形成的出射激光在目标表面反射形成的返回信号光。该返回信号光包含两个激光器的FMCW激光的反射。返回信号光由接收耦合器接收，并耦合进入光波导后再由分束器分成两部分，一部分包含第一激光器的FMCW激光的反射，因此与第一激光器的本振信号光进行混频；另一部分包含第二激光器的FMCW激光的反射，因此与第二激光器的本振信号光进行混频。示例性的，此处分离返回信号光的分束器，可以是如AWG、WDM的波长分束器件，或者可以是1×2MMI的功率分束器件。
应理解，反馈信号光和本振信号光由两个FMCW激光器分光而来。而分光的位置根据功率需求可以在第一级SOA之前，如图22所示。或者，分光位置可以在第一级SOA之后。
其他相关描述可以参考前述图21的描述，或者还可以结合前述的多种设计。
请参见图23，图23是本申请实施例提供的又一种光信号处理装置的应用示意图。图23中，第一激光器和第二激光器具有不同的性质，光信号处理装置230将第一激光器和第二激光器的信号光进行合束后，再引出本振信号光(LO)和反馈信号光(即输入AMZI的信号光)。通过光的性质可以区分来自不同激光器的信号光。例如，通过不同的扫频斜率则可以区分来自第一激光器的信号光和来自第二激光器的信号光。例如，通过不同的波长则可以区分来自第一激光器的信号光和来自第二激光器的信号光。
可选的，合束后引出的本振信号光可以被分束，从而分别与经过分束后的返回信号光(Rx)进行混频。其中，这里的分束包含但不限于是波长分束或能量分束等。
类似的，对于合束后引出的反馈信号光也可以经过分束后分别输入两个反馈单元。
光信号处理装置230中部件、光路等的相关描述可以参考对图21或图22的描述。
请参见图24，图24是本申请实施例提供的又一种光信号处理装置的应用示意图。图24中，第一激光器和第二激光器具有不同的性质，光信号处理装置240将第一激光器和第二激光器的信号光进行合束后，再引出本振信号光(LO)和反馈信号光(即输入AMZI的信号光)。
在LO和返回信号光(Rx)混频时，每一个混频器的输入本振信号光既包含来自第一激光器的信号光，也包含来自第二激光器的信号光。相应的，接收单元接收的一个返回信号光也不进行分束，直接与经过合束的本振信号光拍频。
进一步的，混频器经过拍频得到的输出信号，可以输入探测单元(即探测器阵列)。探测单元可以通过输出信号中的光的不同性质区分对应不同激光器的回波信号。例如，探测单元通过不同的扫频斜率，区分不同频率的回波信号。
光信号处理装置230中的部件、光路等的相关描述可以参考对图21或图22的描述。
请参见图25，图25是本申请实施例提供的又一种光信号处理装置的应用示意图。在光信号处理装置250中，输出端口(如SOA端面)和接收端口紧密排列。输出端口和接收端口可以采用同一光学镜头。可选的，如接收和发射可以是同轴或者非同轴的。详细描述可以参考前述，例如图10A、或图22等实施例中的相关描述。
另外，图25以单光源的结构为例进行介绍，对于双光源的结构同样适用。
请参见图26，图26是本申请实施例提供的又一种光信号处理装置的应用示意图。如图26所示，光信号处理装置260与图21所示的光信号处理装置210的不同在于，光信号处理装置260的输出端口采用了表面耦合的光栅耦合器2601。
可选的，光信号处理装置260的接收端口由接收耦合器2602提供。且通过将本振信号光绕过接收耦合器外部，从而避免本振信号光和返回信号光产生交叉，降低了信号光之间的串扰，提升了信号的有效性。
请参见图27，图27是本申请实施例提供的又一种光信号处理装置的应用示意图。光信号处理装置270可以对来自多个激光器的信号光进行分级放大，形成多个通道的线束阵列发射。其接收端口由表面耦合的光栅耦合器提供，接收端口由接收耦合器提供。且通过将本振信号光绕过光栅耦合和接收耦合器外部，从而减少了本振信号光和返回信号光之间的交叉，降低了信号光之间的串扰，提升了信号的有效性。
可选的，传播本振信号光的波导与传播回波的波导可以在同一层，也可以在不同层传导。例如传播本振信号光的波导在第一层，传播回波的波导在第二层。
请参见图28，图28是本申请实施例提供的又一种光信号处理装置的应用示意图。
光信号处理装置280的输出端口和接收端口紧密相对排列，且一一对应。可选的，接收端口和输出端口可以共用一个光学镜头。
在光信号处理装置280中，每路本振LO信号可以在末级分光单元后(可选在末级SOA前)引出，并传输到混频器与返回信号光进行。
可选的，探测元件也可以集成在光信号处理装置280中。
请参见图29，图29是本申请实施例提供的又一种光信号处理装置的应用示意图。
光信号处理装置290可以对来自多个激光器的光信号进行分级放大，形成多个通道的线束阵列发射。
在光信号处理装置290中，每路本振LO信号可以在末级分光单元后(可选在末级SOA前)引出，经分束得到两路子本振信号，再分别与接收回波分束后混频。相应的，返回信号光也经过分束得到两路子返回信号，两路子返回信号分别与两路子本振信号进行混频。
请参见图30，图30是本申请实施例提供的又一种光信号处理装置的应用示意图。
在光信号处理装置300中，经过末级SOA放大后的信号光，还可以再耦合进光波导，并经由分束器分束后为多个通道的信号从输出端口出射。
可选的，经过末级SOA的信号光，再耦合进入光波导后可经多次分光。不同输出端口输出的信号光，经历的分光的次数可以不同，分光后的发射耦合器数量也可以不同。每个发射耦合器输出的信号光的功率也可以不同。此处的分光可以通过MMI、或DC等分光器件实现。
又一种可能的实施方式中，如区域3001所示经过末级SOA后的信号光，经分光后还经过一个或者多个光开关。光开关用于在若干个通道间进行切换，通过时间上的复用来增加发射通道数量，同时，利用光开关切换发射通道，可以使各通道出光功率与光开关前相似。
以上对本申请实施例提供的光信号处理装置进行了介绍。在具体实施过程中，一个设备或者芯片中可以设置多个光信号处理装置。以下以在芯片上设置多组光信号处理装置为例进行介绍。
作为一种可能的设计，芯片中设置有M个光信号处理装置组，每一个光信号处理装置组可以包含一个或者多个光信号处理装置，关于光信号处理装置可以参考前述。芯片可以接收N个激光器的信号光，通过光开关树可以选通M个光信号处理装置组中的一个或者多个，M为整数且M大1，N为整数N大于1。
对于每一个光信号处理装置组，通过开关树可以使得一个光信号处理装置组可切换地接收0-N个激光器输入的信号光。
以下以芯片为硅材质的硅光芯片为例进行说明。请参见图31，图31是本申请实施例提供的一种可能的硅光芯片的示意图。其中激光器的数量可以为14个，图31省略了中间的12个激光器。硅光芯片310中，光信号处理装置组的数量为M个，每个光信号处理装置组中示例性包含14个光信号处理装置，通过开关树(switchtree)可以控制光信号处理装置组的处理哪个或者哪几个激光器的信号光。进一步还可以控制由光信号处理装置组中的哪一个或者哪几个光信号处理装置来执行处理。
作为又一种可能的设计，硅光芯片中设置有N组光信号处理装置，其中，N组光信号处理装置可以相对设置，例如，每两个光信号处理装置通过轴对称方式设置。
请参见图32，图32是本申请实施例提供的又一种可能的硅光芯片的示意图。硅光芯片320包含两个相对设置的光信号处理装置，此处的光信号处理装置以图26所示的光信号处理装置为例进行说明，对于其他实施方式的光信号处理装置同样适用。
当然，多个光信号处理装置还可以是在垂直方向上以多层的方式堆叠设置。
以上对光信号处理装置和硅光芯片的结构进行了介绍，以下对光信号处理装置和芯片的工作场景进行示例性的说明。
如图33是本申请实施例提供的一种光信号处理装置的工作场景示意图，光信号处理装置可以接收来自光源(如激光器)的信号光，并处理得到多个探测信号光(如图中被描绘为带箭头的实线)。这多个探测信号光以线束阵列的形式呈现，并借助光学模组3301发射到视野中，每个探测信号光可以对应视野中的一个角度范围。
进一步的，光信号处理装置还可以借助光学模组3301接收来自视野内的信号光。
在图33中，光学模组可以包含一个或者光学元件。这里的光学元件包含但不限于是透镜、反射镜、分束器、光栅、波片、匀光片、或扫描装置等。
其中，扫描装置用于将探测信号光以不同的角度提供到视野的不同角度范围上，其扫描方式可以是一维的，也可以二维的，本申请对于扫描方式、实现扫描的装置不进行限定。例如，扫描装置例如可以通过摆镜、转镜(Polygon)、微机电系统(Micro-Electro-Mechanical System,MEMS)振镜、金属振镜等方式实现一维或二维扫描。
如图34是本申请实施例提供又一种光信号处理装置的工作场景示意图，光信号处理装置可以接收来自光源(如激光器)的信号光，并处理得到多个探测信号光(如图中被描绘为带箭头的实线)。这多个探测信号光以线束阵列的形式呈现，并借助扫描装置3401以某一个角度发射到视野中。例如，在某个时刻，光信号处理装置处理过的信号光照射到视野中的区域3402上。通过扫描器的角度改变，可以使信号光完成对视野的扫描。
一些场景中，通过对光信号处理装置的本身输出端口进行设计，可以满足对视野内不同区域的探测分辨率的需求。或者，通过组合多个光信号处理装置，可以对视野内不同区域的探测分辨率进行设计。
如图35是本申请实施例提供又一种光信号处理装置的工作场景示意图，光信号处理装置A接收来自激光器A的信号光，处理得到多个探测信号光，通过扫描装置3501照射到视野中的区域3502上。类似的，光信号处理装置B接收来自激光器B的信号光，处理得到多个探测信号光，通过扫描装置3501照射到视野中的区域3503上。两个光信号处理装置处理得到的探测信号光在视野的中间区域形成重叠区域3504，使得对重叠区域3504的探测结果具有更高的分辨率。
当然，具体实施过程中可以通过更多的光信号处理装置实现更多的分辨率设计，此处不再一一说明。
下面对本申请实施例提供的探测装置进行介绍。
请参见图36，图36是本申请实施例提供的一种可能的激光雷达的结构示意图，激光雷达360包含激光器(或称激光器)和光信号处理装置3601。
其中，光信号处理装置3601可以包含多个分束器、多级SOA、接收耦合器、混频器、AMZI等中的一项或者多项，如光信号处理装置3601中用实线示出的单元。其中，分束器可以包含用于对LO进行分束的LO分束器。
可选的，光信号处理装置3601还包含发射耦合器、开关(如光开光)或合束器等，如光信号处理装置3601中用虚线示出的单元。关于光信号处理装置3601的描述可以参考前述，此处不再一一说明。
一些场景中，激光雷达还可以包含激光器、探测器阵列、模拟数字转换器(analog digital converter，ADC)、跨阻放大器(trans impedance amplifier，TIA)、驱动(例如激光器驱动)、控制和数据处理模块、或光学器件(包含扫描器)等中的一项或者多项。前述的一个或者多个模块可以通过电路方式实现，例如，ADC也可以为采样电路，TIA可以为放大电路。其中，上述模块的数量可以为一个或者多个。例如，激光器可以为多个。
下面对激光雷达360中的部分部件的作用进行介绍。
激光器用于产生信号光，该信号光可以被提供给光信号处理装置。例如，该激光器可以包含为半导体激光器、光纤激光器、或气体激光器等。其中，半导体激光器包含但不限于是激光二极管(laser diode，LD)、垂直腔面发射激光器(Vertical Cavity Surface Emitting Laser，VCSEL)、边缘发射激光器(edge-emitting laser，EEL)、分布式反馈激光器(distributed feedback LD，DFB-LD)、分布式布拉格反射激光器(distributed brag reflection LD，DBR-LD)、光栅耦合采样反射激光器(Grating coupled sampling reflection LD，GCSR-LD)、或微光机电系统激光器(micro opto electro mechanical system LD，MOEMS-LD)等。
扫描器用于将来自所述光信号处理装置的信号光以多个角度投射到视野中，以及接收来自视野的信号光并提供给光信号处理装置，参考图35、图36所示的光路。
光学器件用于实现光路设计，例如汇聚、准直、整形、反射、扫描、或收发同轴等中的一项或者多项。光学器件包含但不限于是整形器件(例如准直装置、或光路整形器件等)、反射镜、透镜、视窗、分光镜、摆镜、转镜(Polygon)、或微机电系统(Micro-Electro-Mechanical System,MEMS)微振镜、分光镜、偏振镜、滤光镜、或匀光片等。
阵列探测器用于接收来自所述光信号处理装置的一个或者多个混频结果并基于所述一个或多个混频结果得到电信号，所述电信号用于确定视野内的目标的相关信息。阵列探测器可以包含一个或者多个探测元件。例如，阵列探测器可以包含以下探测元件中的一项或者多项：单光子雪崩二极管(single-photon avalanche diode，SPAD)、硅光电倍增管(Silicon photomultiplier，SiPM)、半导体雪崩光电二极管(avalanche photo detector，APD)、多像素光子计数器(multi-pixel photon counter，MPPC)、或者电子倍增电荷耦合器(electron multiplying charge-coupled device，EMCCD)等探测元件中的一项或者多项。
控制和数据处理模块用于产生控制信号和/或对数据进行处理。例如，控制和数据处理模块包含功率控制器，用于控制SOA的驱动电流。再如，控制和数据处理模块用于对电信号进行处理得到目标的相关信息。
一些场景中，控制和数据处理模块可以通过处理器和/或控制器实现。例如，控制和数据处理模块包含以下器件中的一项或者多项：中央处理器(central processing unit，CPU)、应用处理器(application processor，AP)、时间数字转换器(Time-to-Digital Converter,TDC)、滤波器、图形处理器(graphics processing unit，GPU)、微处理器(microprocessor unit，MPU)、专用集成电路(Application Specific Integrated Circuit，ASIC)、TIA、图像信号处理器(image signal processor，ISP)、数字信号处理器(digital signal processor，DSP)、现场可编程逻辑门阵列(Field Programmable Gate Array，FPGA)、复杂可编程逻辑器件(Complex programmable logic device，CPLD)、协处理器(协助中央处理器完成相应处理和应用)、微控制单元(Microcontroller Unit，MCU)、和/或神经网络处理器(neural-network processing unit，NPU)等。
可选的，图35所示的控制和数据处理模块包含多个模块时，部分模块可以设置在激光雷达的外部，部分模块设置在激光雷达内部。
图37所示是本申请实施例提供的一种激光雷达的工作场景示意图。激光器产生的FMCW信号光，经分光、放大(由光信号处理装置实现)后，经过光学器件和扫描器(如摆镜3701和转镜3702)照射到视野。照射视野中的信号光可以被视野中的目标反射，形成返回信号光。返回信号光再经过扫描器和光学器件，到达光信号处理装置。光信号处理装置通过接收端口将信号光接收到光波导中，经过处理得到一个或者混频结果。混频结果被提供给探测器阵列，输出电信号。可选的，电信号可以被输入至控制器和/或处理器中，例如输入至TIA、ADC、 专用集成电路(application-specific integrated circuit，ASIC)等模块。
进一步的，处理器可以完成件对电信号进行处理和/或对激光雷达中的一个或者多个部件进行控制。示例性，处理器可以对电信号进行进一步处理得到反映目标的相关信息的探测数据。这些探测数据具体可以为视场范围对应的点云数据，或者，探测数据可以包含视场范围中的目标的距离、方位、目标所占用的像素区域、高度、速度、姿态或形状信息等中的一项或者多项。
可选的，如图37的灰色框中的一个或者多个部件可以集成为一个模组。例如，通过BOX封装得到一个探测模组。
本申请实施例还提供一种终端，终端包含前述的光信号处理装置，或者包含前述的硅光芯片，或者包含前述的激光雷达。可选的，上述终端可以包含车辆、船舶、飞机、火车、航天器、无人机、机器人等移动平台或运输工具。
本申请实施例还可以应用于智能汽车技术领域，如车辆外联(vehicle to everything，V2X)、车间通信长期演进技术(Long Term Evolution-vehicle，LTE-V)、车辆-车辆(vehicle to vehicle，V2V)等。
在本申请的描述中，术语“中心”、“上”、“下”、“垂直”、“水平”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
本申请实施例中，“示例性的”或者“例如”等词用于表示作例子、例证或说明。本申请中被描述为“示例性的”或者“例如”的任何实施例或设计方案不应被解释为比其他实施例或设计方案更优选或更具优势。确切而言，使用“示例性的”或者“例如”等词旨在以具体方式呈现相关概念。
本申请中实施例提到的“至少一个”是指一个或者多个，“多个”是指两个或两个以上。“以下至少一项(个)”或其类似表达，是指的这些项中的任意组合，包括单项(个)或复数项(个)的任意组合。例如，a、b、或c中的至少一项(个)，可以表示：a、b、c、(a和b)、(a和c)、(b和c)、或(a和b和c)，其中a、b、c可以是单个，也可以是多个。“和/或”，描述关联对象的关联关系，表示可以存在三种关系，例如，A和/或B，可以表示：单独存在A、同时存在A和B、单独存在B这三种情况，其中A、B可以是单数或者复数。字符“/”一般表示前后关联对象是一种“或”的关系。
以及，除非有相反的说明，本申请实施例使用“第一”、“第二”等序数词是用于对多个对象进行区分，不用于限定多个对象的顺序、时序、优先级或者重要程度。例如，第一信号光和第二信号光，只是为了便于描述，而并不是表示这第一信号光和第二信号光的来源、顺序、重要程度等的不同，在某些实施例中，第一信号光和第二信号光还可以是同一个信号光。
上述实施例中所用，根据上下文，术语“当……时”可以被解释为意思是“如果……”或“在……后”或“响应于确定……”或“响应于检测到……”。以上所述仅为本申请的可选实施例，并不用以限制本申请，凡在本申请的构思和原则之内，所作的任何修改、等同替换、改进等，均应包含在本申请的保护范围之内。
本领域普通技术人员可以理解实现上述实施例的全部或部分步骤可以通过硬件来完成，也可以通过程序来指令相关的硬件完成，所述的程序可以存储于一种计算机可读存储介质中，上述提到的存储介质可以是只读存储器，磁盘或光盘等。

Claims (27)

  1. 一种光信号处理装置，其特征在于，包括：至少一个输入端口、第一分束单元、第二分束单元和M级放大单元，M为整数且M≥2，其中：
    所述至少一个输入端口，用于接收来自至少一个激光器的信号光；
    所述第一分束单元，用于将来自所述至少一个激光器的信号光分为多个子信号光；
    所述M级放大单元中的第一级放大单元，用于对所述多个子信号光中的一个子信号光进行放大生成第一信号光；
    所述第二分束单元，用于将所述第一信号光分为多个第二信号光；
    所述M级放大单元中的第二级放大单元，用于对所述多个第二信号光中的至少一个第二信号光进行放大生成第三信号光。
  2. 根据权利要求1所述的光信号处理装置，其特征在于，所述多个子信号光包含本振信号光和探测信号光；
    所述第一级放大单元用于对所述探测信号光进行放大生成所述第一信号光。
  3. 根据权利要求1所述的光信号处理装置，其特征在于，所述光信号处理装置还包括合束单元，所述至少一个输入端口包含第一输入端口和第二输入端口，其中：
    所述第一输入端口，用于接收来自第一激光器的信号光；
    所述第二输入端口，用于接收来自第二激光器的信号光；
    所述第一分束单元，用于将来自所述第一激光器的信号光分为多个第四信号光，以及将来自所述第二激光器的信号光分为多个第五信号光，所述多个第四信号光和所述多个第五信号光属于所述多个子信号光；
    所述合束单元，用于将至少一个第四信号光和至少一个第五信号光进行合并，得到第六信号光；
    所述第一级放大单元，用于放大所述第六信号光生成所述第一信号光。
  4. 根据权利要求1所述的光信号处理装置，其特征在于，所述光信号处理装置还包括合束单元，所述至少一个输入端口包含第一输入端口和第二输入端口，其中：
    所述第一输入端口用于接收来自第一激光器的信号光，所述第二输入端口用于接收来自第二激光器的信号光；
    所述合束单元，用于将来自所述第一激光器的信号光和来自所述第二激光器的信号光进行合束，得到第七信号光；
    所述第一分束单元，用于将所述第七信号光进行分束，得到所述多个子信号光，所述多个子信号光包含本振信号光和探测信号光；
    所述第一级放大单元用于放大所述探测信号光生成所述第一信号光。
  5. 根据权利要求3或4所述的光信号处理装置，其特征在于，所述来自第一激光器的信号光和来自所述第二激光器的信号光具有不同的扫频斜率，
    和/或，具有不同的中心波长。
  6. 根据权利要求1-5任一项所述的光信号处理装置，其特征在于，所述第二分束单元包含N个分束器，所述N个分束器以树形拓扑结构排列且每个分束器作为树形拓扑结构的节点，N为整数且N＞0，每个父节点位置的分束器分束得到的信号光被提供给子节点位置的分束器；
    所述第一信号光输入根节点位置的分束器，所述多个第二信号光从叶子节点位置的分束器输出。
  7. 根据权利要求6所述的光信号处理装置，其特征在于，所述第二级放大单元包含多个 放大器；
    所述多个放大器位于叶子节点位置的分束器之后，
    或者，所述多个放大器位于所述多个树形拓扑结构内的分束器之间；
    或者，所述多个放大器中的部分放大器位于叶子节点位置的分束器之后，另一部分放大器位于所述多个树形拓扑结构中的分束器之间。
  8. 根据权利要求1-7任一项所述的光信号处理装置，其特征在于，所述光信号处理装置还包含功率控制器，所述功率控制器用于调整所述第二级放大单元的驱动电流，以控制所述第二级放大单元输出的信号光的功率。
  9. 根据权利要求8所述的光信号处理装置，其特征在于，所述功率控制器还用于：
    根据来自处理器的控制信号，调整所述第二级放大单元的驱动电流，所述控制信号与扫描器的指向角度相关。
  10. 根据权利要求1-9任一项所述的光信号处理装置，其特征在于，所述光信号处理装置还包含光输入输出单元，所述光输入输出单元包含多个输出端口、多个接收端口和混频单元；
    所述多个输出端口，用于发射所述第三信号光；
    所述多个接收端口，用于接收返回信号光，所述返回信号光包含所述第三信号光的反射；
    所述混频单元，用于根据所述返回信号光和本振信号光得到一个或者多个混频结果，所述一个或者多个混频结果用于确定视野内的目标的相关信息；
    所述本振信号光属于所述多个子信号光，或者属于所述多个第二信号光。
  11. 根据权利要求10所述的光信号处理装置，其特征在于，所述混频单元包含第三分束单元、第一混频器和第二混频器；
    所述第三分束单元，用于将所述返回信号光进行分束，得到第一子返回信号光和第二子返回信号光，
    所述第一混频器用于将第一子本振信号光和所述第一子返回信号光混频得到第一混频结果，所述第一子本振信号光来自第一激光器；
    所述第二混频器用于将第二子本振信号和所述第二子返回信号光混频得到第二混频结果，所述第二子本振信号光来自第二激光器。
  12. 根据权利要求11所述的光信号处理装置，其特征在于，所述光信号处理装置还包含第四分束单元，所述第四分束单元用于将本振信号光解复用得到第一子本振信号光和第二子本振信号光，所述第一子本振信号光作为来自第一激光器的信号光的本振信号，所述第二子本振信号光作为来自所述第二激光器的信号光的本振信号；
    所述本振信号光包含来自所述第一激光器的信号光和来自所述第二激光器的信号光。
  13. 根据权利要求1-12任一项所述的光信号处理装置，其特征在于，
    所述多个接收端口按列排布形成接收端口组，所述多个输出端口按列排布形成输出端口组，接收端口组和所述输出端口组相对设置，一个输出端口和至少一个接收端口相对设置且共用一个收发光学模组；
    或者，
    所述多个接收端口按列排布形成接收端口组，所述多个输出端口按列排布形成输出端口组；
    所述接收端口组共用一个接收光学模组，所述输出端口组共用一个发射光学模组。
  14. 根据权利要求10或11所述的光信号处理装置，其特征在于，所述多个接收端口包含第一接收端口，所述输出端口包含第一输出端口，所述第一接收端口接收的信号光包含由第 一输出端口输出的信号光的反射；
    所述光信号处理装置还包含功率控制器，所述功率控制器用于：
    当由第一接收端口接收的信号光的功率大于第一阈值，则降低所述第二级放大单元的驱动电流以降低由所述第一输出端口出射的探测信号光的功率；
    当由第一接收端口接收的信号光的功率小于第二阈值，则提高所述第二级放大单元的驱动电流以增大由第一发射子端口出射的探测信号光的功率。
  15. 根据权利要求10或11任一项所述的光信号处理装置，其特征在于，所述光输入输出单元包含第一输出端口集合和第二输出端口集合，所述第一输出端口集合和所述第二输出端口集合分别包含至少一个输出端口，所述第一输出端口集合用于向所述视野的中间区域出射探测信号光，所述第二输出端口集合用于向所述视野的边缘区域出射探测信号光；
    所述第一输出端口集合所出射的探测信号光的功率高于所述第二输出端口集合所出射的探测信号光的功率。
  16. 根据权利要求10-15任一项所述的光信号处理装置，其特征在于，所述光信号处理装置还包含光开关，所述光开关设置在所述第二分束单元至任一输出端口之间，用于控制是否在所述第二分束单元与所述任一输出端口之间形成光学路径。
  17. 根据权利要求10-16任一项所述的光信号处理装置，其特征在于，所述光信号处理装置还包含反馈单元，所述多个子信号光包含反馈信号光；
    所述反馈单元用于根据所述反馈信号检测所述来自至少一个激光器的信号光的扫频信息和/或相位噪声。
  18. 根据权利要求1-17任一项所述的光信号处理装置，其特征在于，所述光信号处理装置还包含多层的基底以及多条波导，所述多条波导用于在基底的不同层中形成传输信号光的光学路径。
  19. 一种芯片，其特征在于，包含K个如权利要求1-18任一项所述的光信号处理装置，K为整数且K≥1。
  20. 根据权利要求19所述的芯片，其特征在于，所述芯片还包含至少一个激光输入端口和至少一个光开关，所述至少一个激光输入端口包含第一激光输入端口；
    所述至少一个激光输入端口用于接收来自至少一个激光器的信号光；
    所述至少一个光开关设置在所述第一激光输入端口和L个光信号处理装置之间，且被配置为：将所述L个光信号处理装置可切换地耦合到光学路径以控制是否在所述L个光信号处理装置与所述第一激光输入端口之间形成光学路径，L为整数且L≤K。
  21. 根据权利要求19所述的芯片，其特征在于，K为偶数且K≥2，且，所述K个光信号处理装置中的任意两个光信号处理装置对称设置。
  22. 一种激光雷达，其特征在于，所述激光雷达包含激光器、扫描器，以及，如权利要求1-18任一项所述的光信号处理装置；
    所述激光器用于向所述光信号处理装置提供调频信号光；
    所述扫描器用于将来自所述光信号处理装置的第三信号光投射到视野中。
  23. 一种激光雷达，其特征在于，所述激光雷达包含激光器、阵列探测器、收发光学模块、扫描器，以及，如权利要求10-17任一项所述光信号处理装置；
    所述激光器用于向所述光信号处理装置提供调频信号光；
    所述扫描器用于将来自所述光信号处理装置的第三信号光投射到视野中，以及接收来自视野的返回信号光并提供给所述光信号处理装置；
    所述收发光学模组设置在所述扫描器和所述光信号处理装置之间；
    所述阵列探测器用于接收来自所述光信号处理装置的一个或者多个混频结果并基于所述一个或多个混频结果得到电信号，所述电信号用于确定视野内的目标的相关信息。
  24. 根据权利要求23所述的激光雷达，其特征在于，所述光学模组包含偏振分束器和四分之一波片，所述偏振分束器和所述四分之一波片用于实现收发同轴，其中：
    第三信号光依次经过所述光信号处理装置的输出端口、所述偏振分束器和所述四分之一波片被提供给所述扫描器；
    来自所述扫描器的返回信号光依次经过所述四分之一波片、所述偏振分束器被提供给所述光信号处理装置的接收端口。
  25. 根据权利要求24所述的激光雷达，其特征在于，所述光学模组还包含二分之一波片，所述二分之一波片设置在所述偏振分束器和所述光信号处理装置的接收端口之间。
  26. 一种终端，其特征在于，所述终端包含如权利要求1-18任一项所述的光信号处理装置，
    或者，包含如权利要求19-21任一项所述的芯片，
    或者，包含如权利要求22所述的激光雷达，
    或者，包含如权利要求23-25任一项所述的激光雷达。
  27. 根据权利要求26所述的终端，其特征在于，所述终端为车辆、无人机或者机器人。
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