WO2024139911A1 - 交接装置 - Google Patents
交接装置 Download PDFInfo
- Publication number
- WO2024139911A1 WO2024139911A1 PCT/CN2023/134130 CN2023134130W WO2024139911A1 WO 2024139911 A1 WO2024139911 A1 WO 2024139911A1 CN 2023134130 W CN2023134130 W CN 2023134130W WO 2024139911 A1 WO2024139911 A1 WO 2024139911A1
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- WO
- WIPO (PCT)
- Prior art keywords
- component
- mover
- supporting
- rotating
- bearing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3302—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
Definitions
- Patent CN103309176B proposes a wafer handover device, in which the support component is fixedly connected to the movable structure, and the movable structure and stator structure of the voice coil motor are connected through a micro ball guide to achieve vertical guidance, but also limit the freedom of rotation of each. Therefore, when the support component rotates synchronously with the suction cup, it will also drive the entire support handover device to rotate synchronously, and then the air path and cables connected to the device will also rotate, causing entanglement and distortion, thereby affecting the reliability and life of the device.
- Patent CN110032044A proposes a wafer transfer device, in which a lifting drive unit drives the lifting of a carrier, and a rotation drive unit drives the carrier to rotate, thereby also driving the lifting drive unit to rotate. That is, the entire device rotates synchronously, and then the air path and cables connected to the device also rotate accordingly, causing entanglement and distortion.
- the purpose of the present application is to provide a handover device for solving the problem that the handover device in the prior art rotates synchronously with the suction cup, causing the cables and air pipes of the handover device to be entangled and twisted.
- the lifting component includes a vertical driving component located on the bottom of the base and a supporting component located above the vertical driving component, wherein the vertical driving component includes a stator and a mover, the stator is installed at the bottom of the base, the mover is installed on the stator and can move vertically relative to the stator; the supporting component can move up and down with the mover, and a plurality of supporting claws are provided at the upper end of the supporting component;
- the rotating component includes a rotating driving component located outside the supporting component and a bearing device located above the lifting component.
- the rotating component can rotate relative to the base.
- the rotating driving component drives the supporting component and the bearing device to perform synchronous rotational motion.
- the supporting component can perform lifting motion relative to the bearing device.
- the lifting component also includes a rotation decoupling component, which is located between the vertical driving component and the supporting component.
- the vertical driving component and the supporting component are rotationally connected through the rotation decoupling component so that when the supporting component rotates, the vertical driving component does not rotate with the supporting component.
- the rotational decoupling component includes a double-ring bearing
- the double-ring bearing includes a bearing inner ring and a bearing outer ring
- the bearing inner ring and the bearing outer ring are capable of relative rotational motion
- the bearing inner ring is fixedly connected to the mover
- the bearing outer ring is fixedly connected to the support component
- the bearing outer ring is fixedly connected to the mover
- the bearing inner ring is fixedly connected to the support component.
- the rotation constraining component includes a guide rail, which is located outside the vertical driving component to constrain the rotation of the mover.
- the guide rail includes a guide rail fixing portion and a guide rail vertical moving portion matched with the guide rail fixing portion.
- the guide rail fixing portion is fixedly connected to the stator, and the guide rail vertical moving portion is fixedly connected to the mover.
- the rotating component further includes a rotating base and a top cover plate, wherein the rotating base is arranged on the outside of the vertical driving component, the supporting component and the rotating decoupling component and is connected to the mover of the rotating driving component, the stator of the rotating driving component is connected to the base, the top cover plate is located above the rotating base and is connected to the rotating base, a first through hole penetrating the top cover plate in a vertical direction is provided in the top cover plate, the bearing device is located above the top cover plate and is fixedly connected to the top cover plate, a second through hole penetrating the bearing device in a vertical direction is provided in the bearing device, the positions of the first through hole and the second through hole correspond in the vertical direction, and the supporting claw
- the rotating base performs vertical movement in the first through hole and the second through hole, wherein the rotating driving component drives the rotating base to rotate, thereby driving the top cover plate, the bearing device and the supporting component to rotate.
- the transmission component is located between the outer side of the supporting component and the inner side of the rotating base, the outer side of the transmission component is connected to the inner side of the rotating base, and the inner side of the transmission component is connected to the outer side of the supporting component.
- the handover device also includes a flexible connector, which is arranged between the transmission component and the rotating base.
- the flexible connector includes a first part, a second part and a flexible deformation part respectively connected to the first part and the second part.
- the first part is connected to the transmission component, and the second part is connected to the rotating base.
- the support component also includes an annular air groove arranged in the air avoidance area, the annular air groove is coaxial with the rotation axis of the support component, the first air path and the second air path are respectively connected to the annular air groove, wherein the second air path is connected to the annular air groove and is sealed with a sealing ring.
- a third air path is provided in the area of the rotating decoupling component, and the third air path passes through the rotating decoupling component in a vertical direction.
- One end of the third air path is connected to the first air path and is sealed by a sealing ring, and the other end of the third air path is connected to the second air path and is sealed by a sealing ring.
- the third air path coincides with the rotation axis of the supporting component, or the third air path is an annular air groove coaxial with the rotation axis of the supporting component.
- the vertical driving component includes a voice coil motor, the voice coil motor includes a magnet and a coil, the coil is wrapped around the magnet, the coil constitutes a stator, and the magnet constitutes a mover; or the magnet constitutes the stator, and the coil constitutes the mover, wherein a magnetic block is arranged in the coil.
- the rotational movement of the support component in the handover device of the present application is decoupled from the vertical movement of the mover, so that the air pipe and line located in the mover part do not rotate with the support component, solve the problem of entanglement and distortion of the air path and cable, and improve the reliability of the system.
- the supporting claw rotates with the load-bearing device. Compared with the equipment that does not rotate with the load-bearing device, it can shorten the vertical movement stroke of the thickness of the load-bearing device, solve the problem of too long handover stroke, and improve the handover efficiency.
- FIG. 1 is a schematic diagram showing the structure of the handover device provided in Example 1 of the present application.
- FIG. 2 is a schematic diagram showing the structure of the vertical driving component in the first embodiment of the present application.
- FIG. 5 is a schematic diagram showing the structure of the first type of rotation constraint component in the first embodiment of the present application.
- the above drawings include the following reference numerals: 1. base; 100. bottom of base; 101. side wall of base; 2. Vertical driving component; 201. Stator; 202. Mover; 203. Mounting seat; 21. Voice coil motor; 211. Magnetic steel; 212, coil; 213, magnetic block; 214, back iron; 3. Support component; 301. Support claw; 302. Adsorption head; 303. First gas path; 304. Second gas path; 305. Sealing ring; 306. Third gas path; 4. Rotating driving component; 5. Carrying device; 6. Rotational decoupling component; 601. Double-ring bearing; 602. Inner bearing mounting seat; 603. Outer bearing mounting seat; 604. Inner bearing pressure ring; 605. Outer bearing pressure ring; 611. Connecting block; 612.
- the carrying device 5 includes a suction cup for sucking the wafer.
- the bearing inner mounting seat 602 is located on the inner side of the double-ring bearing 601, the bearing inner pressure ring 604 is used to press the bearing inner ring and the bearing inner mounting seat 602 together, the bearing outer mounting seat 603 is located on the outer side of the double-ring bearing 601, and the bearing outer pressure ring 605 is used to press the bearing outer ring and the bearing outer mounting seat 603 together, wherein the bearing inner mounting seat 602 is connected to the mover 202, and the bearing outer mounting seat 603 is connected to the support component 3.
- the inner ring of the bearing may be fixedly connected to the support component 3
- the outer ring of the bearing may be fixedly connected to the mover 202, which is not limited to this embodiment.
- the rotation decoupling component 6 is used to achieve decoupling of the support component 3 from the vertical drive component 2 when the support component 3 rotates, that is, the vertical drive component 2 does not rotate with the support component 3.
- FIG. 4 another structural schematic diagram of the rotational decoupling component 6 is shown, including a connecting block 611, a first ball 612 and a second ball 613, the upper end of the connecting block 611 is fixedly connected to the supporting component 3, the lower end of the connecting block 611 is rotationally connected to the mover 202 through the first ball 612, the connecting block 611 and the mover 202 are parallel to the opposite surfaces of the rotating axis respectively provided with grooves matching the first ball 612, wherein at least one groove is an annular groove; a plurality of second balls 613 are located between the lower surface of the supporting component 3 and the upper surface of the mover 202 to rotationally connect the supporting component 3 and the mover 202, the lower surface of the supporting component 3 and the upper surface of the mover 202 are respectively provided with grooves matching the second ball 613, wherein at least one groove is an annular groove.
- the handover device also includes a flexible connector 11. As shown in Figure 7, the flexible connector 11 is arranged in the second through hole, the outer side of the flexible connector 11 is connected to the bearing device 5, and the inner side of the flexible connector 11 is connected to the transmission component 10, wherein the inner side of the flexible connector 11 is an arc-shaped structure with the middle part protruding from the upper and lower parts.
- the handover device is also provided with an electrical limit component and a mechanical limit component, which are respectively used for upper and lower electrical safety limits and upper and lower mechanical safety limits when the supporting component 3 moves vertically.
- the transmission component 10 includes a linear bearing or a guide rail slider, as shown in Figure 11.
- the transmission component 10 adopts a guide rail slider
- the slide fixing part is fixedly connected to the rotating base 8
- the slider moving part is fixedly connected to the support component 3.
- the transmission component 10 provides guidance for the vertical movement of the support component 3.
- the transmission component 10 fixes the relative position of the support component 3 and the carrying device 5.
- the rotating component rotates under the drive of the rotating drive component 4, it can better drive the support component 3 and the carrying device 5 to rotate synchronously.
- the external bearing 15 is located outside the rotating base 8 , the outer ring of the external bearing 15 is fixedly connected to the base 1 , and the inner ring of the external bearing 15 is rotatably connected to the outer side of the rotating base 8 to guide the rotation of the rotating base 8 .
Landscapes
- Connection Of Motors, Electrical Generators, Mechanical Devices, And The Like (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Engineering & Computer Science (AREA)
- Robotics (AREA)
Abstract
Description
1、底座;100、底座底部;101、底座侧墙;
2、垂向驱动部件;201、定子;202、动子;203、安装座;21、音圈电机;211、磁钢;
212、线圈;213、磁块;214、背铁;
3、支撑部件;301、支撑爪;302、吸附头;303、第一气路;304、第二气路;305、密
封圈;306、第三气路;
4、旋转驱动部件;5、承载装置;
6、旋转解耦部件;601、双圈轴承;602、轴承内安装座;603、轴承外安装座;604、轴
承内压环;605、轴承外压环;611、连接块;612、第一滚珠;613、第二滚珠;
7、旋转约束部件;70、导轨;701、导轨固定部;702、导轨垂向移动部;71、滚珠花键;
711、轴套;712、轴杆;
8、旋转底座;9、顶部盖板;10、传动部件;
11、柔性连接件;1101、第一部;1102、第二部;1103、柔性变形部;
12、旋转检测部件;13、垂向检测部件;14、弹性部件;15、外部轴承。
Claims (16)
- 一种交接装置,其特征在于,包括:底座(1),包括底座底部(100)与底座侧墙(101),所述底座底部(100)与所述底座侧墙(101)围成一收容空间;升降部件,包括位于所述底座底部(100)上的垂向驱动部件(2)和位于所述垂向驱动部件(2)上方的支撑部件(3),其中,所述垂向驱动部件(2)包括定子(201)与动子(202),所述定子(201)安装于所述底座底部(100),所述动子(202)安装于所述定子(201)上且可相对于所述定子(201)做垂向运动;所述支撑部件(3)能够随所述动子(202)做升降运动,所述支撑部件(3)的上端设有多个支撑爪(301);旋转部件,包括位于所述支撑部件(3)外侧的旋转驱动部件(4)和位于所述升降部件上方的承载装置(5),所述旋转部件能够相对于所述底座(1)旋转,所述旋转驱动部件(4)驱动所述支撑部件(3)和所述承载装置(5)做同步旋转运动,所述支撑部件(3)能相对所述承载装置(5)做升降运动;所述升降部件还包括旋转解耦部件(6),所述旋转解耦部件(6)位于所述垂向驱动部件(2)和所述支撑部件(3)之间,所述垂向驱动部件(2)和所述支撑部件(3)之间通过所述旋转解耦部件(6)转动连接,以使所述支撑部件(3)做旋转运动时所述垂向驱动部件(2)不随所述支撑部件(3)做旋转运动。
- 根据权利要求1所述的交接装置,其特征在于,所述旋转解耦部件(6)包括双圈轴承(601),所述双圈轴承(601)包括轴承内圈与轴承外圈,所述轴承内圈与所述轴承外圈能够做相对旋转运动;所述轴承内圈与所述动子(202)固定连接,所述轴承外圈与所述支撑部件(3)固定连接;或者所述轴承外圈与所述动子(202)固定连接,所述轴承内圈与所述支撑部件(3)固定连接。
- 根据权利要求1所述的交接装置,其特征在于,所述旋转解耦部件(6)包括连接块(611)、第一滚珠(612)和第二滚珠(613),所述连接块(611)的上端与所述支撑部件(3)固定连接,所述连接块(611)的下端与所述动子(202)之间通过所述第一滚珠(612)转动连接,所述连接块(611)和所述动子(202)平行于旋转轴的相对面各设有与所述第一滚珠(612)相配适的凹槽,其中至少一个凹槽为环形凹槽;多个所述第二滚珠(613)位于所述支撑部件(3)的下表面与所述动子(202)的上表面之间以使所述支撑部件(3)和所述动子(202)转动连接,所述支撑部件(3)的下表面与所述动子(202)的上表面分别设有与所述第二滚珠(613)相配适的凹槽,其中至少一个凹槽为环形凹槽。
- 根据权利要求1所述的交接装置,其特征在于,所述交接装置还包括旋转约束部件(7),所述旋转约束部件(7)的一端与所述定子(201)连接,所述旋转约束部件(7)的另一 端与所述动子(202)连接,当所述支撑部件(3)做旋转运动时所述旋转约束部件(7)以限制所述动子(202)旋转。
- 根据权利要求4所述的交接装置,其特征在于,所述旋转约束部件(7)包括导轨(70),所述导轨(70)位于所述垂向驱动部件(2)的外部以约束所述动子(202)旋转,所述导轨(70)包括导轨固定部(701)及与所述导轨固定部(701)相配适的导轨垂向移动部(702),所述导轨固定部(701)与所述定子(201)固定连接,所述导轨垂向移动部(702)与所述动子(202)固定连接。
- 根据权利要求4所述的交接装置,其特征在于,所述旋转约束部件(7)包括滚珠花键(71),所述滚珠花键(71)位于所述垂向驱动部件(2)的内部以约束所述动子(202)旋转,所述滚珠花键(71)包括轴套(711)及与所述轴套(711)相配适的轴杆(712),所述轴套(711)与所述定子(201)固定连接,所述轴杆(712)与所述动子(202)固定连接。
- 根据权利要求1所述的交接装置,其特征在于,所述旋转部件还包括旋转底座(8)和顶部盖板(9),其中,所述旋转底座(8)环设在所述垂向驱动部件(2)、所述支撑部件(3)及所述旋转解耦部件(6)的外侧并与所述旋转驱动部件(4)的动子连接,所述旋转驱动部件(4)的定子与底座(1)连接,所述顶部盖板(9)位于所述旋转底座(8)的上方与所述旋转底座(8)连接,所述顶部盖板(9)中设有在垂直方向贯穿所述顶部盖板(9)的第一通孔,所述承载装置(5)位于所述顶部盖板(9)上方与所述顶部盖板(9)固定连接,所述承载装置(5)中设有在垂直方向上贯穿所述承载装置(5)的第二通孔,所述第一通孔与所述第二通孔的位置在垂直方向上相对应,所述支撑爪(301)于所述第一通孔和所述第二通孔中做垂向运动,其中,所述旋转驱动部件(4)驱动所述旋转底座(8)旋转时,进而带动所述顶部盖板(9)、所述承载装置(5)和所述支撑部件(3)旋转。
- 根据权利要求7所述的交接装置,其特征在于,所述交接装置还包括传动部件(10),所述传动部件(10)位于所述支撑部件(3)与所述旋转部件之间,所述传动部件(10)带动所述支撑部件(3)跟随所述承载装置(5)做同步旋转运动且能够为所述支撑部件(3)的升降运动提供导向。
- 根据权利要求8所述的交接装置,其特征在于,所述传动部件(10)位于所述第一通孔或所述第二通孔中,所述传动部件(10)的内侧与所述支撑爪(301)连接,所述传动部件(10)的外侧与所述顶部盖板(9)或所述承载装置(5)连接。
- 根据权利要求9所述的交接装置,其特征在于,所述交接装置还包括柔性连接件(11);所述柔性连接件(11)设置于所述第二通孔中,所述柔性连接件(11)的外侧与所述承载装置(5)连接,所述柔性连接件(11)的内侧与所述传动部件(10)连接,其中,所述柔性连接件(11)的内侧呈中部凸出于上下部的弧形结构;或者所述柔性连接件(11)设置于所述第一通孔中,所述柔性连接件(11)的外侧与所 述顶部盖板(9)连接,所述柔性连接件(11)的内侧与所述传动部件(10)连接,其中,所述柔性连接件(11)的内侧呈中部凸出于上下部的弧形结构。
- 根据权利要求8所述的交接装置,其特征在于,所述传动部件(10)位于所述支撑部件(3)的外侧与所述旋转底座(8)的内侧之间,所述传动部件(10)的外侧与所述旋转底座(8)的内侧连接,所述传动部件(10)的内侧与所述支撑部件(3)的外侧连接。
- 根据权利要求11所述的交接装置,其特征在于,所述交接装置还包括柔性连接件(11),所述柔性连接件(11)设置在所述传动部件(10)与所述旋转底座(8)之间,所述柔性连接件(11)包括第一部(1101)、第二部(1102)及分别与所述第一部(1101)和所述第二部(1102)连接的柔性变形部(1103),所述第一部(1101)与所述传动部件(10)连接,所述第二部(1102)与所述旋转底座(8)连接。
- 根据权利要求1所述的交接装置,其特征在于,所述支撑爪(301)的顶端设有吸附头(302),所述支撑部件(3)内设有第一气路(303),所述第一气路(303)的一端延伸至所述吸附头(302),所述第一气路(303)的另一端延伸至所述旋转解耦部件(6)区域;所述动子(202)内部设有第二气路(304),所述第二气路(304)的一端延伸至所述旋转解耦部件(6)区域与所述第一气路(303)连通,所述第二气路(304)的另一端从所述动子(202)的侧边顶部引出与抽气装置连接。
- 根据权利要求13所述的交接装置,其特征在于,所述旋转解耦部件(6)设有避空区域,所述第一气路(303)与所述第二气路(304)在所述避空区域连通且采用密封圈(305)密封,所述第一气路(303)与所述第二气路(304)的连接点在所述支撑部件(3)的旋转轴上;或者所述支撑部件(3)还包括设置在所述避空区域内的环形气槽,所述环形气槽与所述支撑部件(3)的旋转轴同轴,所述第一气路(303)与所述第二气路(304)分别与所述环形气槽连通,其中所述第二气路(304)与所述环形气槽连通且采用密封圈(305)密封。
- 根据权利要求13所述的交接装置,其特征在于,所述旋转解耦部件(6)区域设有第三气路(306),所述第三气路(306)在垂直方向上贯穿所述旋转解耦部件(6),所述第三气路(306)的一端与所述第一气路(303)连通且通过密封圈(305)密封,所述第三气路(306)的另一端与所述第二气路(304)连通且通过密封圈(305)密封;所述第三气路(306)与所述支撑部件(3)的旋转轴重合;或者,所述第三气路(306)为与所述支撑部件(3)的旋转轴同轴的环形气槽。
- 根据权利要求1所述的交接装置,其特征在于,所述垂向驱动部件(2)包括音圈电机(21),所述音圈电机(21)包括磁钢(211)与线圈(212),所述线圈(212)围绕于所述磁钢(211),所述线圈(212)中设置有磁块(213);所述线圈(212)构成所述定子(201),所述磁钢(211)构成所述动子(202);或者所述磁钢(211)构成所述定子(201),所述线圈(212)构成所述动子(202)。
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| CN115662931B (zh) | 2023-03-10 |
| KR20250124232A (ko) | 2025-08-19 |
| KR102947371B1 (ko) | 2026-04-01 |
| EP4645377A1 (en) | 2025-11-05 |
| JP2026500693A (ja) | 2026-01-08 |
| CN115662931A (zh) | 2023-01-31 |
| EP4645377A4 (en) | 2026-04-22 |
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