WO2024152151A1 - 一种耳机 - Google Patents

一种耳机 Download PDF

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Publication number
WO2024152151A1
WO2024152151A1 PCT/CN2023/072360 CN2023072360W WO2024152151A1 WO 2024152151 A1 WO2024152151 A1 WO 2024152151A1 CN 2023072360 W CN2023072360 W CN 2023072360W WO 2024152151 A1 WO2024152151 A1 WO 2024152151A1
Authority
WO
WIPO (PCT)
Prior art keywords
capacitive sensor
electrode plate
earphone
headset
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2023/072360
Other languages
English (en)
French (fr)
Inventor
黄雨佳
邓文俊
袁永帅
周文兵
廖风云
齐心
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Shokz Co Ltd
Original Assignee
Shenzhen Shokz Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Shokz Co Ltd filed Critical Shenzhen Shokz Co Ltd
Priority to CN202380042090.8A priority Critical patent/CN119256556B/zh
Priority to PCT/CN2023/072360 priority patent/WO2024152151A1/zh
Priority to EP23916643.2A priority patent/EP4518349A4/en
Publication of WO2024152151A1 publication Critical patent/WO2024152151A1/zh
Priority to US18/956,249 priority patent/US20250088783A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1008—Earpieces of the supra-aural or circum-aural type
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1016—Earpieces of the intra-aural type
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1041—Mechanical or electronic switches, or control elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R5/00—Stereophonic arrangements
    • H04R5/033—Headphones for stereophonic communication
    • H04R5/0335—Earpiece support, e.g. headbands or neckrests
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1058—Manufacture or assembly
    • H04R1/1066—Constructional aspects of the interconnection between earpiece and earpiece support

Definitions

  • the present invention relates to the field of acoustic technology, and in particular to a headset.
  • sensors are widely used in wearing detection of headphones and other products. Sensors can be used to identify the user's actions of wearing or taking off headphones, and adjust the working state of the headphones accordingly, greatly improving the user experience.
  • the sensors used for wearing detection are mainly contact sensors.
  • contact sensors due to factors such as sweat and false touch, contact sensors have the problem of low accuracy in headphone wearing detection.
  • the headphone wearing detection using a bending sensor has a higher accuracy.
  • capacitive sensors are widely used for wearing detection due to their advantages of low hysteresis, high linearity and high sensitivity.
  • the absolute value of the capacitance of the capacitive sensor itself and the detection value caused by the slight deformation are very small.
  • the detection principle of the capacitive sensor its detection result is easily affected by the change of the external electric field, resulting in the detection value being easily confused with the external error, thereby reducing the accuracy of the capacitive sensor detection.
  • the human body as a conductor approaches the capacitive sensor, its capacitance value will change due to the change in the electric field distribution, making its detection result inaccurate. Therefore, it is necessary to design an electromagnetic shielding design for the capacitive sensor in the earphone to shield the external influence and realize the accurate identification of the earphone wearing state.
  • An embodiment of the present specification may provide an earphone, comprising: two speaker assemblies and a connecting member; the connecting member is used to connect the two speaker assemblies, the connecting member provides a clamping force to fix the two speaker assemblies on the user's head through bending deformation, the connecting member comprises a shell having an accommodating cavity, a capacitive sensor is arranged in the accommodating cavity, the capacitive sensor is used to identify the bending state of the connecting member, wherein the capacitive sensor comprises a shielding structure, the potential of the shielding structure always remains unchanged, and is used to reduce the influence of external electric fields on the capacitive sensor.
  • the connector includes two ear hook components and a rear hook component, the two speaker components are connected to the rear hook component through the two ear hook components, respectively, and the capacitive sensor is located in the accommodating cavity formed by the rear hook component.
  • the capacitive sensor further includes a first electrode plate
  • the shielding structure serves as a second electrode plate of the capacitive sensor and forms a capacitor with the first electrode plate
  • the second electrode plate has a cavity
  • the first electrode plate is disposed in the cavity.
  • the first electrode plate and the second electrode plate are flexible conductors, and a flexible substrate is filled in the space between the first electrode plate and the second electrode plate.
  • the first electrode plate includes a plurality of sub-electrode plates that are spaced apart from each other.
  • the plurality of sub-electrode plates are electrically connected to each other via wires.
  • the capacitive sensor further includes a first electrode plate and a second electrode plate
  • the shielding structure is a conductor having a cavity
  • the first electrode plate and the second electrode plate are disposed in the cavity.
  • the conductor includes any one of conductive glue, flexible conductive cloth, and conductive film.
  • the rear suspension assembly further includes a skeleton structure, and the capacitive sensor is disposed in close contact with the skeleton structure.
  • the cavity has no opening.
  • the skeleton structure is a conductor skeleton
  • the cavity has an opening
  • the opening faces the conductor skeleton.
  • the earphone further includes a wiring, and the wiring is disposed in the accommodating cavity of the rear hanging component.
  • the earphone further includes a platform structure, the platform structure is disposed on the rear hanging component, and the capacitive sensor is fixed on the platform structure.
  • the platform structure is a solid conductor.
  • the capacitive sensor is a differential capacitive sensor.
  • FIG1A is a schematic structural diagram of an exemplary headset according to some embodiments of this specification.
  • FIG1B is a schematic structural diagram of an exemplary headset according to some embodiments of this specification.
  • FIG2 is a schematic diagram of a circuit module of an exemplary headset according to some embodiments of this specification.
  • FIG3 is a schematic diagram of a structure of an exemplary capacitive sensor according to some embodiments of this specification.
  • FIG4 is a schematic diagram of a structure of an exemplary capacitive sensor according to other embodiments of the present specification.
  • FIG5 is a schematic diagram of a structure of an exemplary capacitive sensor according to other embodiments of this specification.
  • FIG6 is a schematic diagram of a structure of an exemplary capacitive sensor according to other embodiments of this specification.
  • FIG7 is a schematic cross-sectional view of a connector of an exemplary headset according to some embodiments of the present specification.
  • FIG8 is a schematic cross-sectional view of a connector of an exemplary headset according to other embodiments of the present specification.
  • FIG9A is a schematic diagram of a cross-sectional structure of a connector of an exemplary headset according to other embodiments of the present specification.
  • FIG9B is a schematic diagram of a cross-sectional structure of a connector of an exemplary headset according to other embodiments of the present specification.
  • FIG10 is a schematic diagram of a platform structure of a connector of an exemplary headset according to some embodiments of this specification.
  • FIG11 is a schematic cross-sectional view of a connector of an exemplary headset according to other embodiments of the present specification.
  • FIG12 is a schematic diagram of a circuit module of an exemplary headset according to other embodiments of this specification.
  • FIG13A is a schematic diagram of an exemplary earphone in a free-standing state according to some embodiments of the present specification
  • FIG13B is a schematic diagram of an exemplary headset in a normal wearing state according to some embodiments of the present specification.
  • FIG13C is a schematic diagram of an exemplary headset in an abnormal wearing state according to some embodiments of the present specification.
  • FIG14A is a schematic diagram of an exemplary earphone in a free-standing state according to some embodiments of the present specification
  • FIG14B is a schematic diagram of an exemplary headset in a normal wearing state according to some embodiments of the present specification.
  • FIG. 14C is a schematic diagram of an exemplary headset in an abnormal wearing state according to some embodiments of the present specification.
  • first and second are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as “first” and “second” may explicitly or implicitly include at least one of the features. In the description of this specification, the meaning of “plurality” is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
  • the terms “installed”, “connected”, “connected”, “fixed” and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined.
  • installed can be a fixed connection, a detachable connection, or an integral connection
  • it can be a mechanical connection or an electrical connection
  • it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined.
  • the specific meanings of the above terms in this specification can be understood according to specific circumstances.
  • the embodiment of the present specification provides an earphone (also referred to as an acoustic output device), which includes two speaker assemblies and a connector.
  • the connector is used to connect the two speaker assemblies.
  • the connector provides a way to connect the two speaker assemblies by bending. The clamping force of the speaker assembly fixed on the user's head.
  • the connector includes a housing having an accommodating cavity, in which a capacitive sensor is arranged.
  • the capacitive sensor is used to identify the bending state of the connector.
  • the capacitive sensor includes a shielding structure, the potential of which remains unchanged, and is used to reduce the influence of the external electric field on the capacitive sensor.
  • the capacitive sensor with a shielding structure can accurately detect the bending state of the connector between the speaker assemblies, so as to analyze the current placement state of the earphone (for example, normal wearing state, abnormal wearing state or free placement state), so as to further adjust the working state of one or more electronic components of the earphone (for example, Bluetooth module, battery, etc.) according to the current placement state of the earphone.
  • multiple sensors for example, sensors of the same or different types
  • FIG. 1A is a schematic diagram of the structure of an earphone shown in some embodiments of this specification.
  • the earphone 100 may be a bone conduction earphone, an air conduction earphone, or a bone-air conduction combined earphone. In some embodiments, the earphone 100 may be an open earphone. In some embodiments, the earphone 100 may include a headphone, a back-hook earphone, a single-ear earhook earphone, and the like. In some embodiments of the present application, a bone conduction earphone with two speaker assemblies will be described as an example, which does not limit the scope of the present application. Referring to FIG. 1A , the earphone 100 may include two speaker assemblies 110, a connector 120, and a capacitive sensor 210.
  • the two speaker assemblies 110 can be used to convert an audio signal (i.e., an electrical signal) into a mechanical vibration signal (i.e., an acoustic signal), thereby outputting sound to a user.
  • the speaker assembly 110 can include various types, such as an electromagnetic type (e.g., a moving coil type, a moving iron type, etc.), a piezoelectric type, an inverse piezoelectric type, an electrostatic type, etc., which is not limited in the present application.
  • the connector 120 can be used to connect the two speaker assemblies 110.
  • the connector 120 can be used as a fixing device to keep the earphone 100 fixed relative to the user.
  • the connector 120 can have a certain deformation ability and the ability to recover deformation, and it can provide a clamping force to fix the two speaker assemblies 110 to the user's head or neck through bending deformation.
  • the connector 120 may include a head-mounted connector or a rear-hanging connector. Exemplarily, when the connector 120 is a head-mounted connector, the user can place the connector 120 on the top of the head, so that the earphone 100 is fixed relative to the user.
  • the connector 120 When the connector 120 is a rear-hanging connector, the user can place the connector 120 behind the user's head or behind the neck, so that the earphone 100 is fixed relative to the user. For example, when the user wears the earphone 100 normally, the connector 120 can be fixed behind the user's head, and when the user does not use the earphone 100, the user can hang the earphone 100 around the neck. At this time, the connector 120 can be fixed behind the user's neck (that is, the earphone 100 is not in a normal wearing state).
  • the connector 120 is connected to the two speaker assemblies 110.
  • the connection between the two speaker assemblies 110 may include injection molding, welding, riveting, bolting, bonding, clamping, etc. or any combination thereof.
  • the connector 120 may include a housing having a receiving cavity, which may be used to accommodate one or more components of the earphone 100, for example, a communication cable for transmitting signals to the two speaker assemblies 110, a capacitive sensor 210, etc.
  • the connector 120 may include two ear hook components 121 and a rear hook component 122.
  • the ear hook component 121 may cooperate with the user's auricle so that the headset 100 can be hung on the user's ear.
  • the rear hook component 122 may be placed behind the user's neck or head (for example, when the user wears the headset 100 normally, the rear hook component 122 may be fixed behind the user's head, and when the user does not use the headset 100, the user may hang the headset 100 on the neck, at which time, the rear hook component 122 may be fixed behind the user's neck).
  • the ear hook component 121 and the rear hook component 122 may cooperate to provide a clamping force that fixes the two speaker components 110 on the user's head or ear, so that the headset 100 can be stably hung on the user's ear and is not easy to fall off.
  • the two speaker components 110 may be connected to the rear hook component 122 via two ear hook components 121, respectively.
  • the capacitive sensor 210 may be disposed in the accommodation cavity formed by the rear hook component 122. It should be noted that, when the earphone 100 is a headphone, the connector 120 can directly connect the two speaker assemblies 110 and provide a clamping force to fix the two speaker assemblies 110 on the user's head. In this case, the connector 120 may not include the ear hook assembly 121.
  • the capacitive sensor 210 may be disposed at a position where the curvature of the connector 120 (e.g., the rear hanging component 122) changes relatively greatly, for example, where the symmetry plane of the rear hanging component 122 intersects with the rear hanging component 122, i.e., the middle part of the rear hanging component 122. It should be noted that in the embodiments of the present specification, the symmetry plane of the rear hanging component 122 may refer to a symmetry plane formed with the two ends of the rear hanging component 122 as symmetry points.
  • the sensitive direction of the capacitive sensor 210 can also be made consistent with the bending deformation direction of the connector 120 (e.g., the rear hanging component 122) during wearing.
  • the bending deformation direction of the connector 120 e.g., the rear hanging component 122 can refer to the direction in which the radius of curvature corresponding to the connector 120 (or the rear hanging component 122) changes the most during wearing.
  • the capacitive sensor 210 can have the best response effect to the change in the bending state of the connector 120 or the rear hanging component 122, thereby improving the detection accuracy of the placement state of the headset 100.
  • At least one of the two ear hook assemblies 121 may further include an earphone compartment 130.
  • the earphone compartment 130 may be used to store or accommodate one or more components of the earphone 100 (e.g., processing circuit, control circuit, Bluetooth module, battery, etc.).
  • the capacitive sensor 210 can be used to identify the bending state of the connector 120.
  • the bending state of the connector 120 can cause the capacitance value of the capacitive structure in the capacitive sensor 210 to change, and the capacitance value (which can also be called the bending signal of the capacitive sensor 210) can reflect the bending degree of the connector 120, and further reflect the current use state of the headset 100.
  • the length of the electrode plate of the capacitive sensor 210 can be 0.1cm-2cm, for example, it can be 0.5cm, 0.8cm, 1cm, etc.
  • the capacitive sensor 210 can include a shielding structure (not shown in FIG. 1A), the potential of which remains unchanged, thereby reducing the influence of the external electric field on the capacitive sensor 210.
  • the capacitance sensor 210 may be a differential capacitance sensor. By performing differential operations on the differential capacitance sensor, temperature drift and other common mode signals may be removed, thereby further improving the accuracy and reliability of the detection results of the capacitance sensor 210. In addition, by using a differential capacitance sensor to remove temperature drift, it is possible to avoid using a temperature sensor for calibration, thereby reducing the hardware cost of the headset 100 to a certain extent.
  • a differential capacitance sensor to remove temperature drift, it is possible to avoid using a temperature sensor for calibration, thereby reducing the hardware cost of the headset 100 to a certain extent.
  • the capacitive sensor 210 may be disposed in the middle of the accommodating cavity of the connector 120 (that is, the capacitive sensor 210 and the two speaker assemblies 110 have the same or substantially the same distance), for example, at position A shown in FIG1A . In some embodiments, the capacitive sensor 210 may also be disposed close to one of the two speaker assemblies 110, for example, at position B or position C shown in FIG1A . It should be noted that, in this specification, position A, position B, and position C are merely exemplary descriptions and are not intended to limit specific positions.
  • FIG. 1B is a schematic diagram of the structure of an exemplary headset shown in some embodiments of this specification.
  • the headset 100 may also be a single-ear earhook headset as shown in FIG. 1B.
  • the headset 100B may include a hook portion 11, a connecting portion 12, and a retaining portion 13.
  • the connecting portion 12 connects the hook portion 11 and the retaining portion 13 so that the headset 100B is curved in a three-dimensional space when it is in a non-wearing state (i.e., a free placement state).
  • a non-wearing state i.e., a free placement state
  • the hook portion 11, the connecting portion 12, and the retaining portion 13 are not coplanar.
  • the hook portion 11 can be mainly used to hang between the back side of the user's ear and the head, and the retaining portion 13 can be mainly used to contact the front side of the user's ear, thereby allowing the retaining portion 13 and the hook portion 11 to cooperate to clamp the ear.
  • the connecting portion 12 may extend from the head to the outside of the head, and cooperate with the hook-shaped portion 11 to provide the retaining portion 13 with a pressing force on the front side of the ear.
  • the capacitive sensor 210 can be set at a position where the bending degree of the connecting portion 12 and/or the hook portion 11 changes relatively greatly to detect the current placement state of the headset 100B (for example, normal wearing state or non-wearing state). Further, the capacitive sensor 210 may include a shielding structure (not shown in FIG. 1B ), the potential of which remains unchanged at all times, thereby reducing the influence of the external electric field on the capacitive sensor 210.
  • FIG. 2 is a schematic diagram of a circuit module of an earphone shown in some embodiments of the present specification.
  • the earphone 100 may further include a processing circuit 220 and a control circuit 230.
  • the processing circuit 220 may be electrically connected to the capacitive sensor 210 and the control circuit 230.
  • the processing circuit 220 may determine the bending state of the connector 120 based on the bending signal detected by the capacitive sensor 210.
  • the processing circuit 220 may determine the equivalent radius of curvature of the connector 120 based on the bending signal detected by the capacitive sensor 210, thereby determining the bending state (or degree of bending) of the connector 120.
  • the mapping relationship between the bending signal and the equivalent radius of curvature of the connector 120 may be pre-configured based on experimental data.
  • the processing circuit 220 may determine the equivalent radius of curvature of the connector 120 based on the bending signal detected by the capacitive sensor 210 and the mapping relationship, thereby determining the bending state (or degree of bending) of the connector 120. It should be noted that in the embodiment of the present specification, when the earphone 100 is a bone conduction earphone as shown in FIG. 1A, due to the limitation of the shape of the rear hanging component 122 (for example, the shape of the titanium wire), the measurement of the equivalent radius of curvature is easier to achieve than the simple stress measurement, and the measurement result is more reliable.
  • the equivalent radius of curvature can establish a more stable mapping relationship with the placement state of the bone conduction earphone, and is not easily disturbed by factors such as pressure and shaking, thereby making the wearing detection more accurate.
  • the processing circuit 220 can determine the placement state of the earphone 100 according to the bending state of the connector 120.
  • the placement state of the earphone 100 may include one of a normal wearing state, an abnormal wearing state, or a free placement state.
  • the normal wearing state may refer to the state of the earphone 100 when the user wears the earphone 100 normally to play audio;
  • the free placement state may refer to the state when the earphone 100 is not worn by the user;
  • the abnormal wearing state may refer to other states of the earphone 100 other than the normal wearing state and the free placement state, for example, the state when the user hangs the earphone 100 around the neck.
  • the placement state of the earphone 100 please refer to other places in this specification, such as Figure 12, Figures 13A-13C, Figures 14A-14C and their descriptions, which will not be repeated here.
  • the control circuit 230 can adjust the working state of one or more electronic components (e.g., Bluetooth module, battery, etc.) of the headset 100 based on the determination result of the processing circuit 220. Specifically, when the headset 100 is in a normal wearing state, the control circuit 230 can control at least one of the one or more electronic components to be in a wake-up state, and when the headset 100 is in an abnormal wearing state or a free placement state, the control circuit 230 can control the one or more electronic components to be in a wake-up state. At least one of the electronic components is in a low-power working state or a disabled state.
  • one or more electronic components e.g., Bluetooth module, battery, etc.
  • the control circuit 230 can control the headset 100 to enter a wake-up state (i.e., connect the battery to the circuit), otherwise, when it is determined that the headset 100 is in an abnormal wearing state or a free placement state, the control circuit 230 can control the headset 100 to be in a standby state (i.e., disconnect the battery from the circuit).
  • the control circuit 230 can control the Bluetooth module to turn on the Bluetooth function, otherwise, when it is determined that the headset 100 is in an abnormal wearing state or a free placement state, the control circuit 230 can control the Bluetooth module to disable the Bluetooth function.
  • the control circuit 230 can control the headset 100 to automatically play music, otherwise, when it is determined that the headset 100 is in an abnormal wearing state or a free placement state, the control circuit 230 can control the headset 100 to stop playing music.
  • the processing circuit 220 can also determine the user's head circumference based on the bending signal detected by the capacitive sensor 210, thereby determining the force between the speaker assembly 110 and the user's head or ear. Further, the processing circuit 220 can optimize the acoustic output algorithm of the two speaker assemblies 110 based on the force between the speaker assembly 110 and the user's head or ear, and adjust the audio output signal so that the user obtains the best sound effect and wearing experience.
  • the equivalent radius of curvature of each connector 120 can correspond to a head circumference. The processing circuit 220 can determine the user's head circumference based on the determined equivalent radius of curvature of the connector 120.
  • the size of the head circumference can reflect the size of the force between the speaker assembly 110 and the user's head or ear. The larger the head circumference, the greater the force between the speaker assembly 110 and the user's head or ear.
  • the force between the speaker assembly 110 and the user's head or ear is less than a certain value, the loss of low-frequency signals in the audio signal transmitted to the skin by the speaker assembly 110 may be relatively large.
  • the output gain of the low-frequency signals can be increased in the acoustic output algorithm of the speaker assembly 110 to achieve balance, thereby avoiding the problem of reducing the low-frequency signals in the output signal of the speaker assembly 110 due to wearing problems, thereby improving the user experience.
  • the headset 100 can obtain audio signals by wired communication and/or wireless communication.
  • the headset 100 may also include a cable and a connector.
  • the connector can be used to connect to other devices (such as mobile phones, computers, etc.) to obtain audio data.
  • the audio data can be transmitted to the two speaker assemblies 110 via a cable for output, thereby converting the electrical signal into an acoustic signal.
  • the headset 100 may include a wireless communication module (not shown in FIG. 1A).
  • the headset 100 can receive audio data from other devices through the wireless communication module and output sound through the two speaker assemblies 110.
  • Exemplary wireless communication modules may include a Bluetooth module, an infrared communication module, a WiFi module, a ZigBee module, etc.
  • Fig. 3 is a schematic diagram of the structure of a capacitive sensor according to some embodiments of the present specification.
  • Fig. 4 is a schematic diagram of the structure of a capacitive sensor according to some other embodiments of the present specification.
  • the capacitive sensor 210 may include a first electrode plate 211 and a shielding structure 213.
  • the shielding structure 213 may also serve as a second electrode plate of the capacitive sensor 210, and together with the first electrode plate 211, constitute a capacitor.
  • the first electrode plate 211 and at least a portion of the second electrode plate constituted by the shielding structure 213 may be parallel to each other to constitute a capacitor.
  • the area of the first electrode plate 211 may be smaller than the area of the second electrode plate constituted by the shielding structure 213.
  • the second electrode plate constituted by the shielding structure 213 has a cavity 2132, and the first electrode plate 211 may be disposed in the cavity 2132.
  • the shielding structure 213 (e.g., the second electrode plate) can be a closed setting or a non-closed setting.
  • the closed setting can be understood as the cavity 2132 formed by the shielding structure 213 having no opening. It should be noted that the shielding structure 213 being a closed setting can mean that the shielding structure 213 is surrounded by conductors except for the tiny gaps caused by the necessary signal leads.
  • the non-closed setting can be understood as the cavity 2132 formed by the shielding structure 213 having an opening.
  • the opening can be oriented in a direction perpendicular to the facing direction of the two electrode plates (i.e., the AA' direction in FIG.
  • the opening 2134 is oriented in the direction ZZ' as shown in FIG. 3
  • the cavity 2132 of the second electrode plate formed by the shielding structure 213 has an opening 2134, and the opening 2134 is located at one end of the first electrode plate 211.
  • the second electrode plate formed by the shielding structure 213 completely or substantially completely covers the first electrode plate 211. That is, the cavity 2132 of the second electrode plate formed by the shielding structure 213 has no opening.
  • the size of the opening 2134 may affect the shielding effect of the non-enclosed shielding structure 213. Therefore, the size of the opening 2134 may be designed according to actual needs, and this specification does not impose any specific restrictions.
  • the shielding structure 213 can be connected to the reference potential terminal.
  • the reference potential may refer to an end of the headset 100 where the potential is constant, and its potential value may be equal to or not equal to 0.
  • the reference potential terminal may also be referred to as the ground terminal (GND).
  • the shielding structure 213 when the shielding structure 213 is connected to the ground terminal (GND), the same potential difference can exist between the shielding structure 213 (i.e., the second electrode plate) and the first electrode plate 211, and because the electric field lines of the shielding structure 213 are perpendicular to its surface, the electric field lines between the second electrode plate formed by the shielding structure 213 and the first electrode plate 211 are guaranteed not to change, so that the capacitive sensor 210 is not affected by the outside world.
  • the impedance between the shielding structure 213 and the reference potential in the processing circuit 220 can be limited from being affected by the outside world, so that the potential of the shielding structure 213 of the capacitive sensor 210 is a fixed value.
  • an electric potential equal to that of the first electrode plate 211 can be applied to the shielding structure 213 (i.e., the second electrode plate) by active excitation.
  • the same excitation signal is used to make the potential difference between the shielding structure 213 and the first electrode plate 211 zero. It can be understood that when the shielding structure 213 (i.e., the second electrode plate) and the first electrode plate 211 are at the same potential, there is no electric field line distribution between the shielding structure 213 and the first electrode plate 211, and the impedance between the shielding structure 213 and the reference potential in the processing circuit 220 will not be affected by the outside world.
  • the first electrode plate 211 and the second electrode plate formed by the shielding structure 213 may be a flexible conductor.
  • the flexible conductor may refer to an object having a certain degree of flexibility and capable of conducting electricity.
  • the flexible conductor may include a fluid conductor or a non-fluid conductor.
  • the fluid conductor may include a liquid metal, or a conductive solution with fluidity based on conductor particles (e.g., metal particles, carbon nanotubes, etc.) and a fluid solvent.
  • the non-fluid conductor may include a non-fluid conductive coating obtained by doping conductor particles and a non-fluid flexible solvent after curing.
  • Exemplary conductor particles may include carbon black, carbon nanotubes, graphene, silver powder, copper powder, etc.
  • Exemplary non-fluid flexible solvents after curing may include epoxy resin, polyvinyl chloride (PVC), polyimide resin, phenolic resin, etc.
  • the surfaces of the first electrode plate 211 and/or the second electrode plate formed by the shielding structure 213 may be coated with insulating materials respectively.
  • the space between the first electrode plate 211 and the second electrode plate formed by the shielding structure 213 may be filled with a flexible substrate 215.
  • the flexible substrate 215 is an insulating material, which is used to divide the first electrode plate 211 and the second electrode plate formed by the shielding structure 213 into two parts that do not contact each other.
  • the flexible substrate 215 may include one or more flexible insulating materials such as hot melt adhesive, silica gel, silicone rubber, PDMS (Polydimethylsiloxane, polydimethylsiloxane) and the like.
  • flexible insulating materials such as hot melt adhesive, silica gel, silicone rubber, PDMS (Polydimethylsiloxane, polydimethylsiloxane) and the like.
  • the capacitive sensor 210 may further include a lead (not shown in the figure), which may be connected to the first electrode plate 211 and the second electrode plate formed by the shielding structure 213, respectively, so as to lead out the signal on the second electrode plate formed by the first electrode plate 211 and the shielding structure 213.
  • the lead may be connected to the processing circuit 220, and the processing circuit 220 may determine the current bending state of the connector 120 based on the signal output by the lead and the mapping relationship between the signal and the bending degree of the connector 120.
  • electromagnetic shielding can be achieved, reducing the interference of the external electric field on the capacitive sensor, while effectively reducing the difficulty of the processing technology for setting the shielding structure for the capacitive sensor, and to a certain extent reducing the overall thickness and cost of the capacitive sensor and the shielding structure, which is beneficial to industrial production.
  • FIG. 5 is a schematic diagram of the structure of a capacitive sensor according to other embodiments of the present specification.
  • the first electrode plate 211 may include a plurality of sub-electrode plates arranged separately, for example, sub-electrodes 2112 , 2114 and 2116 .
  • the plurality of sub-electrode plates may be independent of each other (for example, the plurality of sub-electrode plates and the second electrode plate formed by the shielding structure 213 are separated by a flexible substrate 215 ), and each electrode plate may output its signal through a lead (or wire) corresponding thereto.
  • the processing circuit 220 may process the signals output by each lead respectively to determine the current placement state of the earphone 100 .
  • the processing circuit 220 may determine the current bending degree of the corresponding part based on the signals output by the sub-electrode plates at different positions.
  • the processing circuit 220 may determine the current placement state of the earphone 100 based on the bending degree of each part. For example, for a single-ear earhook earphone 100B, different sub-electrode plates may be evenly or unevenly distributed in the hook-shaped portion 11 and/or the connecting portion 12 .
  • the processing circuit 220 may determine the bending degree of each position based on its output signal. Only when the bending degree of the sub-electrode plates at each position exceeds the threshold degree, the processing circuit 220 can determine that the earphone 100 is in a normal wearing state.
  • the plurality of sub-electrode plates and the second electrode plate formed by the shielding structure 213 may have the same or different distances.
  • multiple sub-electrode plates can also be electrically connected to each other through wires.
  • multiple sub-electrode plates can be connected in series through wires. After being connected in series through the wires, the multiple sub-electrode plates can output their signals through only one lead. The lead can be electrically connected to any sub-electrode plate. In this way, the capacitive sensor 210 is not easily broken during the bending and deformation of the rear hanging component 122 of the earphone 100, thereby increasing the service life of the capacitive sensor 210.
  • FIG. 6 is a schematic diagram of the structure of a capacitive sensor according to other embodiments of the present specification.
  • the capacitive sensor 210 may include a first electrode plate 211, a second electrode plate 212, and a shielding structure 213.
  • the shielding structure 213 may be a conductor (e.g., a metal conductor and/or a non-metallic conductor) having a cavity.
  • the first electrode plate 211 and the second electrode plate 212 may be disposed in a cavity inside the shielding structure 213.
  • the shielding structure 213 may be a closed arrangement or a non-closed arrangement, see FIG. 3 or FIG. 4 for details, which will not be described in detail herein.
  • the horizontal and vertical (including ZZ’ direction and AA’ direction) arrangements between the first electrode plate 211 and the second electrode plate 212 may be symmetrical or offset as required.
  • the conductor of the shielding structure 213 is prepared to have a certain elasticity so as to be deformed along with the deformation of the back hanging component 122 of the headset 100.
  • Exemplary conductors may include conductive glue, flexible conductive cloth, conductive film (e.g., conductive silver paste film, conductive carbon paste film), etc.
  • a skeleton structure (such as the skeleton structure 270 in FIG. 7 ) may be provided inside the rear hanging component 122.
  • the skeleton structure may have a certain hardness or rigidity, and it may provide the clamping force required by the user when wearing it through the ability to deform and recover the deformation.
  • the skeleton structure may include metal structures such as titanium wire, titanium-nickel wire (sheet), etc.
  • the stiffness of the skeleton structure in the bending direction of the rear hanging component 122 can be greater than the stiffness of the capacitive sensor 210 in the bending direction of the rear hanging component 122, so that the skeleton structure can provide a clamping force to fix the two speaker components 110 on the user's head through bending deformation.
  • the capacitive sensor 210 in order to further ensure that the capacitive sensor 210 can accurately detect the change in the bending state of the connecting member 120, the capacitive sensor 210 can be fitted with the skeleton structure.
  • the skeleton structure is a conductor, such as titanium wire
  • the skeleton structure can be used as a part of the capacitive sensor 210 (such as the shielding structure 213 of the aforementioned capacitive sensor), and the two together play a role in detecting the change in the bending state of the connecting member 120.
  • Fig. 7 is a schematic diagram of the cross-sectional structure of a connector of an earphone according to some embodiments of the present specification.
  • Fig. 8 is a schematic diagram of the cross-sectional structure of a connector of an earphone according to some other embodiments of the present specification.
  • the connector 120 may include a housing 123.
  • the housing 123 may form a housing 125.
  • a wiring 260, a skeleton structure 270, and a capacitive sensor 210 may be accommodated in the housing 125.
  • the wiring 260 may refer to a cable arranged inside the housing 125, which may be used to transmit audio signals, bending signals detected by the capacitive sensor 210, and control signals for controlling the working states of components such as the two speaker assemblies 110 and the Bluetooth module.
  • the housing 123 may be made of a hard material with a certain hardness or rigidity, which may have a certain deformation ability and provide the clamping force required when the user wears it.
  • the hard material may include a metal material or a non-metal material, such as an aluminum alloy, a nickel-titanium alloy, a plastic, etc.
  • the outer contour of the housing 123 may be a regular shape such as a cylinder, an elliptical cylinder, a prism (such as a quadrangular prism, a pentagonal prism, a hexagonal prism, etc.) or other irregular shapes.
  • the wiring 260 and the capacitive sensor 210 can be separated on both sides of the skeleton structure 270.
  • the wiring 260 and the capacitive sensor 210 can be fixed to the inner wall of the accommodating cavity 125 by bonding, clamping, etc.
  • a filler can be used to fix the wiring 260 and the capacitive sensor 210 to the inner wall of the accommodating cavity 125.
  • the gap in the accommodating cavity 125 is filled, for example, silica gel, sponge, etc. can be filled in the gap.
  • the shape of the wiring 260 is only an example. In some other embodiments, the wiring 260 can have other shapes, for example, it can be cylindrical, elliptical cylinder, prism, etc.
  • the capacitive sensor 210 may not have an opening. That is, after the shielding structure 213 of the capacitive sensor 210 completely or substantially completely covers the capacitive structure in the capacitive sensor 210, it is then fitted together with the skeleton structure 270. At this time, the skeleton structure 270 may be a conductor skeleton (which has conductive properties) or a non-conductor skeleton (which does not have conductive properties). It can be understood that in the earphone 100 having the connector as shown in FIG. 7 , the shielding structure 213 plays an electromagnetic shielding role on the capacitive sensor 210 to reduce the influence of the external electric field on the capacitive sensor 210.
  • the skeleton structure 270 may be a conductor skeleton.
  • the cavity formed by the shielding structure 213 of the capacitive sensor 210 may have an opening, and the opening may be oriented toward the skeleton structure 270. That is, when the shielding structure 213 of the capacitive sensor 210 partially covers the capacitive structure in the capacitive sensor 210, the opening of the shielding structure 213 is closed by fitting the opening of the shielding structure 213 and the skeleton structure 270 together to shield the interference of the external electric field.
  • the shielding structure 213 and the skeleton structure 270 jointly play an electromagnetic shielding role on the capacitive sensor 210 to reduce the influence of the external electric field on the capacitive sensor 210.
  • 9A and 9B are schematic diagrams of the cross-sectional structure of the connector of the earphone according to some embodiments of the present specification.
  • the trace 260 and the capacitive sensor 210 may also be located on the same side of the skeleton structure 270.
  • the capacitive sensor 210 may be located between the trace 260 and the skeleton structure 270, and a portion of the capacitive sensor 210 may be in contact with the trace 260 and the skeleton structure 270.
  • the capacitive sensor 210 may not have an opening. That is, after the shielding structure 213 of the capacitive sensor 210 completely or substantially completely covers the capacitive structure in the capacitive sensor 210, it is then fitted together with the skeleton structure 270. At this time, the skeleton structure 270 may be a conductor skeleton (which has conductive properties) or a non-conductor skeleton (which does not have conductive properties). It can be understood that in the earphone 100 having the connector as shown in FIG9A , the shielding structure 213 acts as an electromagnetic shield for the capacitive sensor 210 to reduce the influence of the external electric field on the capacitive sensor 210.
  • the skeleton structure 270 may be a conductor skeleton.
  • the cavity formed by the shielding structure 213 of the capacitive sensor 210 may have an opening, and the opening may face the skeleton structure 270. That is, when the shielding structure 213 of the capacitive sensor 210 partially covers the capacitive structure in the capacitive sensor 210, the shielding structure 213 may be provided to the capacitive sensor 210.
  • the opening of the shielding structure 213 is arranged together with the skeleton structure 270, so that the opening of the shielding structure 213 is closed to shield the interference of the external electric field. It can be understood that in the earphone 100 with the connecting member shown in FIG. 9B, the shielding structure 213 and the skeleton structure 270 together play an electromagnetic shielding role for the capacitive sensor 210 to reduce the influence of the external electric field on the capacitive sensor 210.
  • the shielding structure 213 may wrap the skeleton structure 270 and/or the trace 260 together.
  • Fig. 10 is a schematic diagram of a platform structure of a connector of an earphone according to some embodiments of this specification.
  • Fig. 11 is a schematic diagram of a cross-sectional structure of a connector of an earphone according to some other embodiments of this specification.
  • the headset 100 may further include a platform structure 300. It can be understood that the deformation at the capacitive sensor 210 can be reduced to a certain extent through the platform structure 300, thereby avoiding damage or reduction of working performance due to excessive deformation.
  • the platform structure 300 may be disposed in the rear suspension assembly 122 and used to install the capacitive sensor 210. Specifically, the platform structure 300 may be disposed on the skeleton structure 270, and the capacitive sensor 210 may be disposed on the platform structure.
  • the platform structure 300 can be made of metal or non-metal material.
  • the platform structure 300 can work together with the shielding structure 213 of the capacitive sensor 210 to electromagnetically shield the capacitive sensor 210 to reduce the influence of the external electric field on the capacitive sensor 210.
  • the cavity formed by the shielding structure 213 of the capacitive sensor 210 can have an opening, and the opening can be oriented toward the platform structure 300.
  • the opening of the shielding structure 213 is closed by fitting the opening of the shielding structure 213 with the platform structure 300 to shield the interference of the external electric field.
  • the platform structure 300 can be integrally formed with the skeleton structure 270 (eg, titanium wire). In some embodiments, the platform structure 300 can be a separate component that can be fitted and installed with the skeleton structure 270, for example, by glue.
  • FIG. 12 is a schematic diagram of a circuit module of an earphone according to other embodiments of the present specification.
  • the earphone 100 may further include a contact sensor 240.
  • the contact sensor 240 may be disposed in the housing of the at least one speaker assembly 110 or in the earphone compartment 130 as shown in FIG. 1A. The sensor 240 can be used to identify whether the earphone compartment 130 is close to or in contact with the user (for example, in contact with the user's skin).
  • the earphone 100 may include two left and right earphone compartments 130. In order to improve the accuracy of wearing detection, a contact sensor 240 may be provided in each of the left and right earphone compartments 130. The contact signals detected by the two contact sensors 240 are used to jointly determine whether the earphone compartment 130 is close to or in contact with the user.
  • the processing circuit 220 determines that the earphone compartment 130 is close to or in contact with the user.
  • the contact sensor 240 may include one or more of a capacitive proximity sensor, a pressure sensor (for example, a film pressure sensor), an infrared sensor, a laser sensor, and the like. It should be noted that different types of contact sensors may adopt different working principles, and the parameters for determining whether the corresponding component is in contact with the user may be different.
  • a pressure sensor when the detected pressure is greater than a pressure threshold, it can be determined that the corresponding component is in contact with the user; and when the detected pressure is less than the pressure threshold, it is determined that the corresponding component is not in contact with the user.
  • a distance threshold when the detected distance is greater than a distance threshold, it can be determined that the corresponding component is in contact with the user; and when the detected distance is less than the distance threshold, it is determined that the corresponding component is not in contact with the user.
  • the capacitive proximity sensor may also include a shielding structure, the potential of which may always remain unchanged and be used to reduce the influence of the external electric field on the capacitive proximity sensor.
  • the processing circuit 220 can determine the current placement state of the earphone 100 based on the bending signal collected by the capacitive sensor 210 and the contact signal collected by the contact sensor 240. For more information on determining the placement state of the earphone 100 in combination with the bending signal of the capacitive sensor 210 and the contact signal of the contact sensor 240, please refer to the description of Figures 13A-13C and Figures 14A-14C of this specification, which will not be repeated here.
  • the contact sensor 240 may be placed in a sleep state by default, and when the bending signal collected by the capacitive sensor 210 indicates that the equivalent radius of curvature of the connector 120 is greater than or equal to a preset threshold, the processing circuit 220 may control the contact sensor 240 to collect the contact signal. In some embodiments, in order to reduce the power consumption generated by the earphone 100 and/or the contact sensor 240, the processing circuit 220 may receive the contact signal of the contact sensor 240 for processing only when the bending signal collected by the capacitive sensor 210 indicates that the equivalent radius of curvature of the connector 120 is greater than or equal to a preset threshold. The preset threshold may be greater than the equivalent radius of curvature when the earphone 100 is placed freely.
  • the headset 100 may not include the connector 120.
  • the headset 100 may be one or more of an open-type headset, smart glasses, a single-ear ear-hook headset, a single-ear in-ear headset (e.g., a true wireless Bluetooth headset), etc.
  • the headset 100 may not include the capacitive sensor 210, but may include at least two other Other types of sensors (for example, two contact sensors).
  • the processing circuit 220 can collaboratively determine whether the headset 100 is in a normal wearing state based on the signals detected by at least two other types of sensors.
  • the headset 100 may include a first contact sensor and a second contact sensor. The categories of the first contact sensor and the second contact sensor may be the same or different.
  • the first contact sensor may be an infrared sensor
  • the second contact sensor may be a film pressure sensor.
  • the first contact sensor and the second contact sensor may be set at any suitable position of the headset 100.
  • the first contact sensor and the second contact sensor may be simultaneously set in the housing of the same speaker assembly 110 or respectively set in the housings of two speaker assemblies 110.
  • the first contact sensor and the second contact sensor may be simultaneously set in one temple or respectively set in two temples.
  • the first contact sensor may be set on the temple, and the second contact sensor may be set on the nose pad.
  • the processing circuit 220 can directly determine whether the headset 100 is in a normal wearing state based on the contact signals collected by the first contact sensor and the second contact sensor. For example, only when the first contact sensor and the second contact sensor simultaneously detect that the user is approaching or touching the user, the processing circuit 220 determines that the headset 100 is in a normal wearing state.
  • the headset 100 may include a contact sensor and an orientation sensor (e.g., a gyroscope).
  • the contact sensor may be disposed near the top of the auricle when the headset is normally worn.
  • the processing circuit 220 determines that the headset 100 is in a normal wearing state.
  • Fig. 13A is a schematic diagram of an exemplary headset in a free placement state according to some embodiments of the present specification.
  • Fig. 13B is a schematic diagram of an exemplary headset in a normal wearing state according to some embodiments of the present specification.
  • Fig. 13C is a schematic diagram of an exemplary headset in an abnormal wearing state according to some embodiments of the present specification.
  • the contact sensor 240 may be disposed on the inner side of the earphone compartment 130 (i.e., the side close to the human skin when the earphone 100 is in a normal wearing state).
  • the equivalent radius of curvature of the connector 120 is R0.
  • the equivalent radius of curvature of the connector 120 increases to R1, i.e., R1>R0. At this time, the earphone compartment 130 is not in contact with the user's head.
  • the equivalent radius of curvature of the connector 120 increases to R2, i.e., R2>R0. Since the neck size is smaller than the head size, R1>R2>R0. At this time, the earphone compartment 130 is in contact with the user's neck (or close to the user's neck). Based on this, in some embodiments, the current equivalent bending strength of the connector 120 can be determined based on the bending signal generated by the capacitive sensor 210. The radius of curvature and the contact state between the earphone compartment 130 and the user detected by the contact sensor 240 are used together to determine the current placement state of the earphone 100.
  • the output of the capacitive sensor 210 may be 1 (i.e., the output is a high level); conversely, when the bending signal detected by the capacitive sensor 210 is a second bending signal indicating that the equivalent radius of curvature of the connecting member 120 is less than the preset threshold, the output of the capacitive sensor 210 may be 0 (i.e., the output is a low level).
  • the output of the contact sensor 240 may be 1 (i.e., the output is a high level); conversely, when the contact signal detected by the contact sensor 240 is a second contact signal indicating that the earphone compartment 130 is in contact with the user (or the distance from the user is less than a preset distance threshold), the output of the contact sensor 240 may be 0 (i.e., the output is a low level).
  • a total bending signal may be determined based on the bending signals detected by the plurality of capacitive sensors 210. For example, when the bending signals detected by the capacitive sensors 210 disposed at positions A, B, and C as shown in FIG. 1A all indicate that the equivalent radius of curvature of the connector 120 (or the rear hanging component 122) is greater than or equal to a preset threshold, the total bending signal output by the plurality of capacitive sensors 210 may be determined as the first bending signal (i.e., its value is 1).
  • the bending signal detected by the capacitive sensor 210 arranged at position B indicates that the equivalent curvature radius of the connecting member 120 (or the rear hanging component 122) is greater than or equal to the preset threshold, but the bending signals detected by the capacitive sensors 210 at positions A and C indicate that the equivalent curvature radius of the connecting member 120 (or the rear hanging component 122) is equal to the equivalent curvature radius when the earphone 100 is freely placed, it means that bending deformation may occur at position B due to accidental contact.
  • the total bending signal of multiple capacitive sensors 210 can be determined as the second bending signal (that is, its value is 0).
  • the processing circuit 220 can determine whether the earphone 100 is in a normal wearing state based on the output of the capacitive sensor 210 and the output of the contact sensor 240, and thus send instructions to the control circuit 230 based on whether the earphone 100 is in a normal wearing state.
  • the control circuit 230 can control the working state of the earphone 100 based on the received control instructions.
  • the output of the processing circuit 220 can be 1, which means that the earphone 100 is judged to be in a normal wearing state.
  • the control circuit 230 can control the working state of one or more components of the earphone 100 based on the output of the processing circuit 220. For example, when the total output of the processing circuit 220 is 1, the control circuit 230 The control circuit 230 can control the headset 100 to enter the awake state; when the total output of the processing circuit 220 is 0, the control circuit 230 can control the headset 100 to maintain the standby state.
  • the output signals shown in Table 1 are only exemplary. In some embodiments, other methods may be used to represent the bending signal detected by the capacitive sensor 210, the contact signal detected by the touch sensor 240, and the total output signal of the headset 100. For example, in some embodiments, when the contact signal detected by the touch sensor 240 is the aforementioned first contact signal, its output may also be represented by 0 (i.e., the output is a low level). Conversely, when the contact signal detected by the touch sensor 240 is the aforementioned second contact signal, its output may be represented by 1 (i.e., the output is a high level).
  • Fig. 14A is a schematic diagram of an exemplary headset in a free placement state according to some embodiments of the present specification.
  • Fig. 14B is a schematic diagram of an exemplary headset in a normal wearing state according to some embodiments of the present specification.
  • Fig. 14C is a schematic diagram of an exemplary headset in an abnormal wearing state according to some embodiments of the present specification.
  • the contact sensor 240 may also be disposed inside the housing of at least one speaker assembly 110 (e.g., the side close to human skin when the earphone 100 is in a normal wearing state) to identify whether the speaker assembly 110 is in contact with the user (or close to the user).
  • the contact sensor 240 may also be disposed inside the housing of at least one speaker assembly 110 (e.g., the side close to human skin when the earphone 100 is in a normal wearing state) to identify whether the speaker assembly 110 is in contact with the user (or close to the user).
  • the contact sensor 240 may also be disposed inside the housing of at least one speaker assembly 110 (e.g., the side close to human skin when the earphone 100 is in a normal wearing state) to identify whether the speaker assembly 110 is in contact with the user (or close to the user).
  • the output of the contact sensor 240 when the contact signal detected by the contact sensor 240 is a first contact signal indicating that the speaker assembly 110 is not in contact with the user (or the distance from the user is greater than a preset distance threshold), the output of the contact sensor 240 may be 1 (i.e., the output is a high level), whereas, when the contact signal detected by the contact sensor 240 is a second contact signal indicating that the speaker assembly 110 is in contact with the user (or the distance from the user is less than a preset distance threshold), the output of the contact sensor 240 may be 0 (i.e., the output is a low level).
  • the output of the processing circuit 220 is 1, that is, it is determined that the earphone 100 is in a normal wearing state.
  • the output of the processing circuit 220 may be all 0, that is, it is determined that the earphone 100 is in an abnormal state. Wearing state or free placement state.
  • the control circuit 230 can control the working state of one or more components of the headset 100 based on the output of the processing circuit 220. For example, when the total output of the processing circuit 220 is 1, the control circuit 230 can control the headset 100 to enter the awake state; when the total output of the processing circuit 220 is 0, the control circuit 230 can control the headset 100 to remain in the standby state.
  • the output signals shown in Table 2 are only exemplary. In some embodiments, other methods can be used to represent the bending signal detected by the capacitive sensor 210, the contact signal detected by the contact sensor 240, and the total output signal of the headset 100. For example, in some embodiments, when the contact signal detected by the contact sensor 240 is the aforementioned first contact signal, its output can also be represented by 0 (that is, the output is a low level), and when the contact signal detected by the contact sensor 240 is the aforementioned second contact signal, its output can also be represented by 1 (that is, the output is a high level).
  • the beneficial effects that may be brought about by the embodiments of this specification include but are not limited to: (1) In some embodiments of this specification, by setting a shielding structure outside the capacitive sensor, the influence of the external electric field on the capacitive sensor can be reduced, thereby improving the accuracy of the detection result of the capacitive sensor; (2) In some embodiments of this specification, the shielding structure is used as the second electrode plate of the capacitive sensor, which can achieve electromagnetic shielding, reduce the interference of the external electric field on the capacitive sensor, and effectively reduce the difficulty of the processing technology of setting the shielding structure for the capacitive sensor, and to a certain extent reduce the overall thickness and cost of the capacitive sensor and the shielding structure, thereby improving the product yield; (3) In some embodiments of this specification, by setting a platform structure for installing the capacitive sensor, the installation of the capacitive sensor can be made more convenient and reliable, and the capacitive sensor can be prevented from being damaged or reducing its working performance due to excessive deformation during the deformation of the ear hook component. It

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Abstract

本说明书实施例提供一种耳机，包括：两个扬声器组件以及连接件；所述连接件用于连接所述两个扬声器组件，所述连接件通过弯曲形变提供将所述两个扬声器组件固定在用户头部的夹紧力，所述连接件包括具有容置腔的外壳，所述容置腔中设置有电容传感器，所述电容传感器用于识别所述连接件的弯曲状态，其中，所述电容传感器包括屏蔽结构，所述屏蔽结构的电位始终保持不变，并用于降低外界电场对所述电容传感器的影响。

Description

一种耳机 技术领域
本说明书涉及声学技术领域，特别涉及一种耳机。
背景技术
在目前的耳机市场中，传感器被广泛应用在耳机等产品的佩戴检测中。利用传感器可以识别到用户佩戴或者摘下耳机的动作，并据此调整耳机的工作状态，大大提高使用体验。
目前，用于佩戴检测的传感器主要是接触式传感器。然而，由于汗水、误触等因素，导致接触式传感器在耳机佩戴检测中存在准确度不高的问题。根据耳机佩戴状态不同时耳机连接结构的形变不同，即利用弯曲传感器来识别耳机的佩戴检测具有较高的准确度。在弯曲传感器中，电容式传感器由于其具备低迟滞性、高线性度、高灵敏度的优势，被广泛用于佩戴检测。但是，在依靠佩戴带来的微小形变改变电容值的情况下，由于受限于结构的特殊性，电容式传感器本身的电容绝对值和由微小形变导致的检测值都非常小，根据电容式传感器的检测原理，其检测结果很容易受到外部电场变化带来的影响，导致检测值很容易与外界误差混淆，从而降低电容传感器检测的准确度。例如，当人体作为导体靠近电容式传感器时，会因为引起电场分布变化而导致其电容值发生变化，从而使其检测结果不准确。因此，需要在耳机中针对电容式传感器进行电磁屏蔽设计，以屏蔽外界影响，实现耳机佩戴状态的准确识别。
发明内容
本说明书实施例可以提供一种耳机，包括：两个扬声器组件以及连接件；所述连接件用于连接所述两个扬声器组件，所述连接件通过弯曲形变提供将所述两个扬声器组件固定在用户头部的夹紧力，所述连接件包括具有容置腔的外壳，所述容置腔中设置有电容传感器，所述电容传感器用于识别所述连接件的弯曲状态，其中，所述电容传感器包括屏蔽结构，所述屏蔽结构的电位始终保持不变，并用于降低外界电场对所述电容传感器的影响。
在一些实施例中，所述连接件包括两个耳挂组件和后挂组件，所述两个扬声器组件分别通过所述两个耳挂组件连接到所述后挂组件，所述电容传感器位于所述后挂组件形成的所述容置腔中。
在一些实施例中，所述电容传感器还包括第一电极板，所述屏蔽结构作为所述电容传感器的第二电极板与所述第一电极板构成电容器，所述第二电极板具有空腔，所述第一电极板设置在所述空腔内。
在一些实施例中，所述第一电极板与所述第二电极板为柔性导体，所述第一电极板与所述第二电极板之间的空间中填充有柔性衬底。
在一些实施例中，所述第一电极板包括多个隔开布置的子电极板。
在一些实施例中，所述多个子电极板通过导线相互电连接。
在一些实施例中，所述电容传感器还包括第一电极板和第二电极板，所述屏蔽结构为具有空腔的导体，所述第一电极板和所述第二电极板设置在所述空腔内。
在一些实施例中，所述导体包括导电胶、柔性导电布、导电薄膜中的任意一种。
在一些实施例中，所述后挂组件还包括骨架结构，所述电容传感器与所述骨架结构贴合设置。
在一些实施例中，所述空腔不具有开口。
在一些实施例中，所述骨架结构为导体骨架，所述空腔具有开口，所述开口朝向所述导体骨架。
在一些实施例中，所述耳机还包括走线，所述走线设置在所述后挂组件的所述容置腔中。
在一些实施例中，所述耳机还包括平台结构，所述平台结构设置在所述后挂组件上，所述电容传感器固定在所述平台结构上。
在一些实施例中，所述平台结构为固体导体。
在一些实施例中，所述电容传感器为差分电容传感器。
附加的特征将在下面的描述中部分地阐述，并且对于本领域技术人员来说，通过查阅以下内容和附图将变得显而易见，或者可以通过实例的产生或操作来了解。本说明书的特征可以通过实践或使用以下详细实例中阐述的方法、工具和组合的各个方面来实现和获得。
附图说明
本说明书将以示例性实施例的方式进一步说明，这些示例性实施例将通过附图进行详细描述。这些实施例并非限制性的，在这些实施例中，相同的编号表示相同的结构，其中：
图1A是根据本说明书一些实施例所示的示例性的耳机的结构示意图；
图1B是根据本说明书一些实施例所示的示例性的耳机的结构示意图；
图2是根据本说明书一些实施例所示的示例性的耳机的电路模块示意图；
图3是根据本说明书一些实施例所示的示例性的电容传感器的结构示意图；
图4是根据本说明书另一些实施例所示的示例性的电容传感器的结构示意图；
图5是根据本说明书另一些实施例所示的示例性的电容传感器的结构示意图；
图6是根据本说明书另一些实施例所示的示例性的电容传感器的结构示意图；
图7是根据本说明书一些实施例所示的示例性耳机的连接件的横截面结构示意图；
图8是根据本说明书另一些实施例所示的示例性耳机的连接件的横截面结构示意图；
图9A是根据本说明书另一些实施例所示的示例性耳机的连接件的横截面结构示意图；
图9B是根据本说明书另一些实施例所示的示例性耳机的连接件的横截面结构示意图；
图10是根据本说明书一些实施例所示的示例性耳机的连接件的平台结构示意图；
图11是根据本说明书另一些实施例所示的示例性耳机的连接件的横截面结构示意图；
图12是根据本说明书另一些实施例所示的示例性的耳机的电路模块示意图；
图13A是根据本说明书一些实施例所示的示例性耳机处于自由放置状态的示意图；
图13B是根据本说明书一些实施例所示的示例性耳机处于正常佩戴状态的示意图；
图13C是根据本说明书一些实施例所示的示例性耳机处于非正常佩戴状态的示意图；
图14A是根据本说明书一些实施例所示的示例性耳机处于自由放置状态的示意图；
图14B是根据本说明书一些实施例所示的示例性耳机处于正常佩戴状态的示意图；
图14C是根据本说明书一些实施例所示的示例性耳机处于非正常佩戴状态的示意图。
具体实施方式
为了更清楚地说明本说明书的实施例的技术方案，下面将对实施例描述中所需要使用的附图作简单的介绍。显而易见地，下面描述中的附图仅仅是本说明书的一些示例或实施例，对于本领域的普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图将本说明书应用于其他类似情景。应当理解，给出这些示例性实施例仅仅是为了使相关领域的技术人员能够更好地理解进而实现本说明书，而并非以任何方式限制本说明书的范围。除非从语言环境中显而易见或另做说明，图中相同标号代表相同结构或操作。
如本说明书和权利要求书中所示，除非上下文明确提示例外情形，“一”、“一个”、“一种”和/或“该”等词并非特指单数，也可包括复数。一般说来，术语“包括”与“包含”仅提示包括已明确标识的步骤和元素，而这些步骤和元素不构成一个排它性的罗列，方法或者设备也可能包含其他的步骤或元素。术语“基于”是“至少部分地基于”。术语“一个实施例”表示“至少一个实施例”；术语“另一实施例”表示“至少一个另外的实施例”。
在本说明书的描述中，需要理解的是，术语“前”、“后”“耳挂”、“后挂”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本说明书和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本说明书的限制。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。在本说明书的描述中，“多个”的含义是至少两个，例如两个、三个等，除非另有明确具体的限定。
在本说明书中，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系，除非另有明确的限定。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本说明书中的具体含义。
本说明书实施例提供一种耳机(也可以称为声学输出装置)，其包括两个扬声器组件和连接件。连接件用于连接两个扬声器组件。连接件通过弯曲形变提供将两个扬声 器组件固定在用户头部的夹紧力。连接件包括具有容置腔的外壳，该容置腔中设置有电容传感器。电容传感器用于识别连接件的弯曲状态。电容传感器包括屏蔽结构，该屏蔽结构的电位始终保持不变，并用于降低外界电场对电容传感器的影响。通过带屏蔽结构的电容传感器可以准确检测扬声器组件之间的连接件的弯曲状态，以此来分析耳机的当前放置状态(例如，正常佩戴状态、非正常佩戴状态或自由放置状态)，从而进一步根据耳机的当前放置状态调整耳机的一个或多个电子组件(例如，蓝牙模块、电池等)的工作状态。在一些实施例中，还可以协同多个传感器(例如，相同或不同类型的传感器)检测声学输出装置(例如，耳机、智能眼镜等)的当前放置状态，从而提升声学输出装置佩戴检测的准确性。
下面结合附图对本说明书实施例提供的耳机进行详细说明。
图1A是本说明书一些实施例所示的耳机的结构示意图。
在一些实施例中，耳机100可以为骨传导耳机、气传导耳机或骨气导结合的耳机。在一些实施例中，耳机100可以为开放式的耳机。在一些实施例中，耳机100可以包括头戴式耳机、后挂式耳机、单耳耳挂式耳机等等。在本申请的一些实施例中，将以具有两个扬声器组件的骨传导耳机作为示例进行描述，其并不限制本申请的范围。参照图1A，耳机100可以包括两个扬声器组件110、连接件120以及电容传感器210。
两个扬声器组件110可以用于将音频信号(即，电学信号)转换为机械振动信号(即，声学信号)，从而将声音输出给用户。在一些实施例中，扬声器组件110可以包括各种类型，例如，电磁型(例如，动圈型、动铁型等)、压电型、逆压电型、静电型等，这在本申请中不受限制。
连接件120可以用于连接两个扬声器组件110。连接件120可以作为固定装置使耳机100相对于用户保持固定。具体地，连接件120可以具有一定的形变能力和恢复形变的能力，其可以通过弯曲形变提供将两个扬声器组件110固定在用户头部或颈部的夹紧力。在一些实施例中，连接件120可以包括头戴式连接件或后挂式连接件。示例性地，当连接件120为头戴式连接件时，用户可以将该连接件120置于头顶，从而使得耳机100相对于用户固定。当连接件120为后挂式连接件时，用户可以将该连接件120置于用户头部后方或颈部后方，从而使得耳机100相对于用户固定。例如，当用户正常佩戴耳机100时，连接件120可以固定在用户的头部后方，而当用户不使用耳机100时，用户可以将耳机100挂在脖子上，此时，连接件120可以固定在用户的颈部后方(即耳机100处于非正常佩戴状态)。在一些实施例中，连接件120与两个扬声器组件110之 间的连接可以包括注塑连接、焊接、铆接、螺栓、粘接、卡接等或其任意组合。在一些实施例中，连接件120可以包括具有容置腔的外壳，该容置腔可以用于容纳耳机100的一个或多个部件，例如，用于给两个扬声器组件110传输信号的通信线缆、电容传感器210等。
参照图1A，在一些实施例中，连接件120可以包括两个耳挂组件121和后挂组件122。耳挂组件121可以与用户的耳廓相互配合，使耳机100能挂在用户耳朵上。后挂组件122可以置于用户的脖子或头部后方(例如，当用户正常佩戴耳机100时，后挂组件122可以固定在用户的头部后方，而当用户不使用耳机100时，用户可以将耳机100挂在脖子上，此时，后挂组件122可以固定在用户的颈部后方)。耳挂组件121和后挂组件122可以配合提供将两个扬声器组件110固定在用户头部或耳部的夹紧力，从而使耳机100能稳定挂在用户耳朵上不易掉落。两个扬声器组件110可以分别通过两个耳挂组件121连接到后挂组件122。在一些实施例中，电容传感器210可以设置于后挂组件122所形成的容置腔内。需要知道的是，当耳机100为头戴式耳机时，连接件120可以直接连接两个扬声器组件110，并提供将两个扬声器组件110固定在用户头部的夹紧力。此时，连接件120可以不包括耳挂组件121。
由于用户在佩戴耳机的过程中会使得连接件120(例如，后挂组件122)的弯曲程度发生变化，因此，在一些实施例中，为了准确检测到连接件120的弯曲状态从而准确确定耳机100的当前放置状态(例如，正常佩戴状态或非正常佩戴状态)，可以将电容传感器210设置在连接件120(例如，后挂组件122)的弯曲度变化相对较大的部位，例如，后挂组件122的对称面与后挂组件122相交的位置，即后挂组件122的中间部位。需要说明的是，在本说明书的实施例中，后挂组件122的对称面可以指以后挂组件122的两端作为对称点所形成的对称面。
在一些实施例中，为了进一步确保准确检测到连接件120的弯曲状态从而准确确定耳机100的当前放置状态(例如，正常佩戴状态或非正常佩戴状态)，还可以使得电容传感器210的敏感方向与佩戴过程中连接件120(例如，后挂组件122)的弯曲形变方向保持一致。连接件120(例如，后挂组件122)的弯曲形变方向可以指佩戴过程中连接件120(或后挂组件122)所对应的曲率半径变化最大的方向。可以理解，通过使电容传感器210的敏感方向与连接件120或后挂组件122的弯曲方向保持一致，可以使得电容传感器210对于连接件120或后挂组件122的弯曲状态变化的响应效果最佳，进而提高耳机100的放置状态的检测准确性。
在一些实施例中，参照图1A，两个耳挂组件121中的至少一个还可以包括耳机仓130。在一些实施例中，耳机仓130可以用于收纳或容置耳机100的一个或多个部件(例如，处理电路、控制电路、蓝牙模块、电池等)。
电容传感器210可以用于识别连接件120的弯曲状态。连接件120的弯曲状态可以引起电容传感器210中电容结构的电容值发生变化，通过该电容值(也可以称为电容传感器210的弯曲信号)可以反映出连接件120的弯曲程度，进而反映出耳机100的当前使用状态。在一些实施例中，电容传感器210的电极板长度可以在0.1cm-2cm，例如，可以为0.5cm、0.8cm、1cm等。在一些实施例中，电容传感器210可以包括屏蔽结构(图1A中未示出)，该屏蔽结构的电位始终保持不变，从而可以降低外界电场对于电容传感器210的影响。
在一些实施例中，电容传感器210可以是差分电容传感器，通过差分电容传感器进行差分运算，可以除去温度漂移以及其他共模信号，从而进一步提高电容传感器210的检测结果的准确性和可靠性。此外，通过使用差分电容传感器除去温度漂移，可以免于使用温度传感器进行标定，从而在一定程度上降低耳机100的硬件成本。关于该屏蔽结构的更多描述可以参见本说明书的其他地方，例如图3～图11及其相关描述，此处不再赘述。
在一些实施例中，电容传感器210可以设置于连接件120的容置腔的中间部位(也就是说电容传感器210与两个扬声器组件110具有相同或大致相同的距离)，例如，图1A中所示的位置A。在一些实施例中，电容传感器210也可以靠近两个扬声器组件110中的其中一个设置，例如，图1A中所示的位置B或位置C。需要说明的是，在本说明书中，位置A、位置B以及位置C仅为示例性说明，其不做具体位置的限制。
图1B是本说明书一些实施例所示的示例性的耳机的结构示意图。在一些实施例中，耳机100还可以是如图1B所示的单耳耳挂式耳机。示例性的，如图1B所示，耳机100B可以包括钩状部11、连接部12和保持部13。连接部12连接钩状部11与保持部13，以使得耳机100B处于非佩戴状态(也即是自由放置状态)时在三维空间中呈弯曲状。换言之，在三维空间中，钩状部11、连接部12、保持部13不共面。如此设置，以在耳机100B处于正常佩戴状态时，钩状部11可以主要是用于挂设在用户的耳部的后侧与头部之间，保持部13可以主要是用于接触用户的耳部的前侧，进而允许保持部13和钩状部11配合以夹持耳部。作为示例性地，连接部12则可以从头部向头部的外侧延伸，进而与钩状部11配合为保持部13提供对耳部的前侧的压紧力。
由于用户在佩戴耳机100B的过程中会使得连接部12和/或钩状部11(例如，连接部12与钩状部11连接位置附近的区域)的弯曲程度发生变化，因此，可以将电容传感器210设置在连接部12和/或钩状部11的弯曲程度变化相对较大的部位，以检测耳机100B的当前放置状态(例如，正常佩戴状态或非佩戴状态)。进一步地，电容传感器210可以包括屏蔽结构(图1B中未示出)，该屏蔽结构的电位始终保持不变，从而可以降低外界电场对于电容传感器210的影响。
图2是本说明书一些实施例所示的耳机的电路模块示意图。参照图2，在一些实施例中，耳机100还可以包括处理电路220和控制电路230。处理电路220可以与电容传感器210及控制电路230电连接。处理电路220可以基于电容传感器210检测的弯曲信号，确定连接件120的弯曲状态。具体地，处理电路220可以根据电容传感器210检测的弯曲信号，确定连接件120的等效曲率半径，从而确定连接件120的弯曲状态(或弯曲程度)。示例性的，在一些实施例中，可以基于实验数据预先配置该弯曲信号与连接件120的等效曲率半径之间的映射关系。处理电路220可以基于电容传感器210检测的弯曲信号以及该映射关系确定连接件120的等效曲率半径，从而确定连接件120的弯曲状态(或弯曲程度)。需要知道的是，在本说明书实施例中，当耳机100为如图1A所示的骨传导耳机时，由于后挂组件122的形状(例如，钛丝的形状)的限制，等效曲率半径的测量比单纯的应力测量更容易实现，其测量结果也更可靠。此外，等效曲率半径能够和骨传导耳机的放置状态之间建立更稳定的映射关系，不易受压力、晃动等因素的干扰，从而使佩戴检测更加准确。进一步地，处理电路220可以根据连接件120的弯曲状态，确定耳机100的放置状态。在一些实施例中，耳机100的放置状态可以包括正常佩戴状态、非正常佩戴状态或自由放置状态中的一种。正常佩戴状态可以指用户正常佩戴耳机100进行播放音频时耳机100所处的状态；自由放置状态可以指耳机100没有被用户佩戴时的状态；非正常佩戴状态可以指除正常佩戴状态和自由放置状态之外的耳机100所处的其他状态，例如，用户将耳机100悬挂在脖子上时的状态。关于耳机100的放置状态的确定的更多描述可以参见本说明书的其他地方，例如图12、图13A-13C、图14A-14C及其描述，此处不再赘述。
控制电路230可以基于处理电路220的确定结果，调整耳机100的一个或多个电子组件(例如，蓝牙模块、电池等)的工作状态。具体地，当耳机100处于正常佩戴状态时，控制电路230可以控制该一个或多个电子组件中的至少一个处于唤醒状态，而当耳机100处于非正常佩戴状态或自由放置状态时，控制电路230可以控制该一个或多个 电子组件中的至少一个处于低功耗工作状态或者禁用状态。例如，当确定耳机100处于正常佩戴状态时，控制电路230可以控制耳机100进入唤醒状态(即将电池连接入电路)，反之，当确定耳机100处于非正常佩戴状态或自由放置状态时，控制电路230可以控制耳机100处于待机状态(即将电池从电路中断开)。又例如，当确定耳机100处于正常佩戴状态时，控制电路230可以控制蓝牙模块开启蓝牙功能，反之，当确定耳机100处于非正常佩戴状态或自由放置状态时，控制电路230可以控制蓝牙模块禁用蓝牙功能。再例如，当确定耳机100处于正常佩戴状态时，控制电路230可以控制耳机100自动播放音乐，反之，当确定耳机100处于非正常佩戴状态或自由放置状态时，控制电路230可以控制耳机100停止播放音乐。
在一些实施例中，处理电路220还可以根据电容传感器210检测的弯曲信号，确定用户的头围，从而确定扬声器组件110与用户头部或耳部之间的作用力。进一步地，处理电路220可以基于扬声器组件110与用户头部或耳部之间的作用力，优化两个扬声器组件110的声学输出算法，调节音频输出信号，使得用户获得最佳的音效与佩戴体验。例如，每个连接件120的等效曲率半径可以对应一个头围。处理电路220可以根据确定的连接件120的等效曲率半径，确定用户的头围。头围的大小可以反映扬声器组件110与用户头部或耳部之间的作用力大小。头围越大，扬声器组件110与用户头部或耳部之间的作用力越大。当扬声器组件110与用户头部或耳部之间的作用力小于某一值时，扬声器组件110传输到皮肤的音频信号中低频信号损失可能会比较大，此时可以在扬声器组件110的声学输出算法中增大中低频信号的输出增益来进行平衡，从而避免由于佩戴问题导致扬声器组件110的输出信号中的中低频信号减少的问题，提升用户体验。
需要说明的是，在本说明书的一些实施例中，耳机100可以通过有线通信和/或无线通信的方式获取音频信号。例如，在一些实施例中，耳机100还可以包括线缆以及连接头。连接头可以用于与其他设备(例如手机、电脑等)进行连接，以获取音频数据。该音频数据可以经由线缆传输至两个扬声器组件110进行输出，从而将电学信号转换为声学信号。又例如，在一些实施例中，耳机100可以包括无线通信模块(图1A中未示出)。耳机100可以通过该无线通信模块从其他设备接收音频数据，并通过两个扬声器组件110输出声音。示例性的无线通信模块可以包括蓝牙模块、红外通信模块、WiFi模块、ZigBee模块等。
图3是根据本说明书一些实施例所示的电容传感器的结构示意图。图4是根据本说明书另一些实施例所示的电容传感器的结构示意图。
参照图3，在一些实施例中，电容传感器210可以包括第一电极板211和屏蔽结构213。屏蔽结构213同时可以作为电容传感器210的第二电极板，并与第一电极板211共同构成电容器。例如，第一电极板211与屏蔽结构213所构成的第二电极板的至少一部分之间可以相互平行，以构成电容器。具体地，如图3所示，第一电极板211的面积可以小于屏蔽结构213所构成的第二电极板的面积。该屏蔽结构213所构成的第二电极板具有空腔2132，第一电极板211可以设置在该空腔2132内。
在一些实施例中，屏蔽结构213(例如，第二电极板)可以为封闭式设置或非封闭式设置。封闭式设置可以理解为屏蔽结构213所形成的空腔2132不具有开口。需要知道的是，屏蔽结构213为封闭式设置可以指除必要的信号引线导致的微小空隙外，屏蔽结构213的周围均由导体包围。非封闭式设置可以理解为该屏蔽结构213所形成的空腔2132具有开口。在一些实施例中，开口可以朝向垂直于两电极板的正对方向(即图3中AA’方向)的方向(例如，开口朝向如图3中所示的方向ZZ’)。例如，如图3所示，屏蔽结构213所构成的第二电极板的空腔2132具有开口2134，且该开口2134位于第一电极板211的一端。又例如，如图4所示，屏蔽结构213所构成的第二电极板完全或基本上完全包覆第一电极板211。也就是说，屏蔽结构213所构成的第二电极板的空腔2132不具有开口。在一些实施例中，该开口2134的大小会影响非封闭式屏蔽结构213的屏蔽效果，因此，可以根据实际需要设计开口2134的大小，本说明书不做具体限制。
进一步地，通过将屏蔽结构213(即第二电极板)的电位(或称为电势)设置为固定值(即，其始终保持不变)，可以使得电容传感器210的电场线尽可能少的泄露在空气中，从而降低外界电场对电容传感器210的影响，提高电容传感器210的检测准确性。在一些实施例中，为了保证电容传感器210的屏蔽结构213的电位为固定值，可以将屏蔽结构213连接至参考电位端。需要知道的是，在一些实施例中，参考电位可以指耳机100中电位恒定不变的一端，其电位值可以等于或不等于0。当参考电位端电位为0时，参考电位端也可以称为接地端(GND)。在一些实施例中，当屏蔽结构213连接至接地端(GND)时，可以使得屏蔽结构213(即第二电极板)与第一电极板211之间存在相同的电势差，并且，由于屏蔽结构213的电场线垂直于其表面，因此保证屏蔽结构213所构成的第二电极板与第一电极板211之间的电场线不变化，从而使电容传感器210不受外界影响。在一些实施例中，可以限制屏蔽结构213与处理电路220中参考电位之间的阻抗不受外界影响，以使得电容传感器210的屏蔽结构213的电位为固定值。示例性地，可以通过主动激励，向屏蔽结构213(即第二电极板)施加与第一电极板211的电势 相同的激励信号，从而使得屏蔽结构213与第一电极板211之间电势差为零。可以理解，当屏蔽结构213(即第二电极板)和第一电极板211等电势时，屏蔽结构213和第一电极板211之间没有电场线分布，此时屏蔽结构213与处理电路220中参考电位之间的阻抗不会受到外界影响。
在一些实施例中，为了适应耳机100的弯曲状态的检测，第一电极板211以及屏蔽结构213所构成的第二电极板可以为柔性导体。该柔性导体可以是指具有一定柔韧度且能够导电的物体。在一些实施例中，该柔性导体可以包括流体导体或非流体导体。在一些实施例中，流体导体可以包括液态金属，或者基于导体颗粒(例如，金属颗粒、碳纳米管等)和流体溶剂掺杂的具有流动性的导电溶液。在一些实施例中，非流体导体可以包括基于导体颗粒和固化后非流体的柔性溶剂掺杂得到的非流体导电涂料。示例性导体颗粒可以包括炭黑、碳纳米管、石墨烯、银粉、铜粉等。示例性固化后非流体的柔性溶剂可以包括环氧树脂、聚氯乙烯(Polyvinyl chloride，PVC)、聚酰亚胺树脂、酚醛树脂等。
在一些实施例中，为了在电容传感器210形变过程中使其两个电极板之间绝对绝缘，第一电极板211和/或屏蔽结构213所构成的第二电极板的表面可以分别包覆有绝缘材料。在一些实施例中，为了在电容传感器210形变过程中使其两个电极板之间绝对绝缘，第一电极板211与屏蔽结构213所构成的第二电极板之间的空间中可以填充有柔性衬底215。该柔性衬底215为绝缘材料，用于将第一电极板211与屏蔽结构213所构成的第二电极板分割为互不接触的两个部分。示例性地，在一些实施例中，该柔性衬底215可以包括热熔胶类、硅胶、硅橡胶、PDMS(Polydimethylsiloxane，聚二甲基硅氧烷)等柔性绝缘材料中的一种或多种。
在一些实施例中，电容传感器210还可以包括引线(图中未示出)，该引线可以分别与第一电极板211以及屏蔽结构213所构成的第二电极板连接，从而将第一电极板211和屏蔽结构213所构成的第二电极板上的信号引出。在一些实施例中，该引线可以连接至处理电路220，处理电路220可以基于该引线输出的信号以及该信号与连接件120的弯曲程度之间的映射关系确定连接件120的当前弯曲状态。
通过采用屏蔽结构作为电容传感器的第二电极板，可以在实现电磁屏蔽，降低外界电场对电容传感器的干扰的同时，有效减少对电容传感器设置屏蔽结构的加工工艺难度，并在一定程度上减小电容传感器和屏蔽结构的整体厚度和成本，有利于工业生产。
图5是根据本说明书另一些实施例所示的电容传感器的结构示意图。
在一些实施例中，参照图5，第一电极板211可以包括多个隔开布置的子电极板，例如，子电极2112、2114和2116。在一些实施例中，该多个子电极板可以相互独立(例如，该多个子电极板与屏蔽结构213所构成的第二电极板之间均通过柔性衬底215隔开)，每个电极板可以通过与其对应的引线(或导线)输出其信号。处理电路220可以分别对各个引线输出的信号进行处理，以确定耳机100的当前放置状态。例如，处理电路220可以基于不同位置的子电极板输出的信号确定与其对应部位的当前弯曲程度。处理电路220可以基于各个部位的弯曲程度确定，耳机100的当前放置状态。例如，对于单耳耳挂式耳机100B，不同的子电极板可以均匀或非均匀分布在钩状部11和/或连接部12中。针对每个子电极板，处理电路220可以根据其输出信号确定每个位置的弯曲程度。只有当各个位置的子电极板的弯曲程度超过阈值程度时，处理电路220可以确定耳机100处于正常佩戴状态。在一些实施例中，该多个子电极板与屏蔽结构213所构成的第二电极板之间可以具有相同或不同的距离。
在一些实施例中，多个子电极板之间也可以通过导线相互电连接，换句话说，即多个子电极板可以通过导线相互串联。通过该导线串联后，该多个子电极板可以仅由一条引线输出其信号。该引线可以与任意子电极板电连接。如此设置，可以使电容传感器210在随耳机100后挂组件122弯曲形变的过程中不易被折断，增加电容传感器210的使用寿命。
图6是根据本说明书另一些实施例所示的电容传感器的结构示意图。
参照图6，在一些实施例中，电容传感器210可以包括第一电极板211、第二电极板212以及屏蔽结构213。屏蔽结构213可以为具有空腔的导体(例如，金属导体和/或非金属导体)。第一电极板211和第二电极板212可以设置在屏蔽结构213内部的空腔内。在一些实施例中，屏蔽结构213可以为封闭式设置或非封闭式设置，具体参见图3或图4，此处不再赘述。
在一些实施例中，第一电极板211与第二电极板212之间的横纵(包括ZZ’方向和AA’方向)排布可以是对称，也可以根据需求有所偏移。
在一些实施例中，为了使电容传感器210适用于检测耳机100的佩戴检测，制备屏蔽结构213的导体具有一定弹性，以能随耳机100后挂组件122的形变而形变。示例性的导体可以包括导电胶、柔性导电布、导电薄膜(例如导电银浆薄膜、导电碳浆薄膜)等。
在一些实施例中，为了满足连接件120在使用过程中的支撑性能以及夹紧性能，可以在后挂组件122内部设置骨架结构(如图7中骨架结构270)。该骨架结构可以具有一定的硬度或刚度，其可以通过形变以及恢复形变的能力提供用户佩戴时所需的夹紧力。示例性地，在一些实施例中，该骨架结构可以包括钛丝、钛镍金属丝(片)等金属结构。
在一些实施例中，骨架结构在后挂组件122的弯曲方向上的刚度可以大于电容传感器210在该后挂组件122的弯曲方向上的刚度，从而使得骨架结构可以通过弯曲形变提供将两个扬声器组件110固定在用户头部的夹紧力。在一些实施例中，为了进一步确保电容传感器210能够准确检测到连接件120的弯曲状态变化，可以将电容传感器210与骨架结构贴合设置。需要知道的是，在一些实施例中，当电容传感器210与骨架结构贴合设置以后，若骨架结构为导体，例如钛丝制成，骨架结构可以作为电容传感器210的一部分(例如前述电容传感器的屏蔽结构213)，两者共同起到检测连接件120的弯曲状态变化的作用。
图7是根据本说明书一些实施例所示的耳机的连接件的横截面结构示意图。图8是根据本说明书另一些实施例所示的耳机的连接件的横截面结构示意图。
参照图7，在一些实施例中，连接件120可以包括外壳123。外壳123可以形成容置腔125。在一些实施例中，走线260、骨架结构270以及电容传感器210等可以容置于该容置腔125中。走线260可以指排布于该容置腔125内部的线缆，其可以用于传输音频信号、电容传感器210所检测的弯曲信号以及用于控制两个扬声器组件110、蓝牙模块等组件的工作状态的控制信号等。
在一些实施例中，外壳123可以采用具有一定硬度或刚度的硬质材料制成，其可以具有一定的形变能力并提供用户佩戴时所需的夹紧力。在一些实施例中，硬质材料可以包括金属材料或非金属材料，例如铝合金、镍钛合金、塑料等。在一些实施例中，外壳123的外部轮廓可以是圆柱体、椭圆柱体、棱柱体(例如四棱柱、五棱柱、六棱柱等)等规则形状或其他不规则形状。
参照图7和图8，在一些实施例中，走线260与电容传感器210可以分居骨架结构270的两侧。在一些实施例中，为了避免走线260、骨架结构270、以及电容传感器210受到外力作用在容置腔125内晃动、碰撞，从而产生噪音或者对电容传感器210的检测结果产生影响，可以采用粘接、卡接等固定方式将走线260和电容传感器210固定在容置腔125的内壁。在一些实施例中，为了进一步避免前述问题，还可以使用填充剂对 容置腔125中的间隙进行填充，例如可以在间隙中填充硅胶、海绵等。需要说明的是，在本说明书中，走线260的形状仅为示例。在一些其他的实施例中，走线260可以具有其他形状，例如，可以是圆柱形、椭圆柱体形、棱柱形等。
在一些实施例中，参照图7，电容传感器210可以不具有开口。也就是说，电容传感器210的屏蔽结构213完全或基本完全包覆电容传感器210中的电容结构后，其再与骨架结构270贴合设置在一起。此时，骨架结构270可以是导体骨架(其具有导电性能)，也可以是非导体骨架(其不具有导电性能)。可以理解，在具有如图7所示的连接件的耳机100中，屏蔽结构213对电容传感器210起到电磁屏蔽作用，以减少外界电场对电容传感器210的影响。
在一些实施例中，参照图8，骨架结构270可以为导体骨架。此时，电容传感器210的屏蔽结构213形成的空腔可以具有开口，开口可以朝向骨架结构270。也就是说，当电容传感器210的屏蔽结构213部分包覆电容传感器210中的电容结构时，通过将屏蔽结构213的开口与骨架结构270贴合设置在一起，从而使屏蔽结构213的开口闭合，以屏蔽外界电场的干扰。可以理解，在具有如图8所示的连接件的耳机100中，屏蔽结构213和骨架结构270共同对电容传感器210起到电磁屏蔽作用，以减少外界电场对电容传感器210的影响。
图9A和图9B是根据本说明书一些实施例所示的耳机的连接件的横截面结构示意图。
参照图9A和图9B，在一些实施例中，走线260与电容传感器210也可以位于骨架结构270的同一侧。电容传感器210可以位于走线260与骨架结构270之间，并且，电容传感器210的部分区域可以与走线260及骨架结构270相互贴合。
在一些实施例中，如图9A所示，电容传感器210可以不具有开口。也就是说，电容传感器210的屏蔽结构213完全或基本完全包覆电容传感器210中的电容结构后，其再与骨架结构270贴合设置在一起。此时，骨架结构270可以是导体骨架(其具有导电性能)，也可以是非导体骨架(其不具有导电性能)。可以理解，在具有如图9A所示的连接件的耳机100中，屏蔽结构213对电容传感器210起到电磁屏蔽作用，以减少外界电场对电容传感器210的影响。
在一些实施例中，参照图9B，骨架结构270可以为导体骨架。电容传感器210的屏蔽结构213形成的空腔可以具有开口，开口可以朝向骨架结构270。也就是说，当电容传感器210的屏蔽结构213部分包覆电容传感器210中的电容结构时，通过将屏蔽结构 213的开口与骨架结构270贴合设置在一起，从而使屏蔽结构213的开口闭合，以屏蔽外界电场的干扰。可以理解，在具有如图9B所示的连接件的耳机100中，屏蔽结构213和骨架结构270共同对电容传感器210起到电磁屏蔽作用，以减少外界电场对电容传感器210的影响。
在一些实施例中，为了确保电容传感器210与骨架结构270和/或走线260更好地连接固定，可以使屏蔽结构213将骨架结构270和/或走线260包裹在一起。
图10是根据本说明书一些实施例所示的耳机的连接件的平台结构示意图。图11是根据本说明书另一些实施例所示的耳机的连接件的横截面结构示意图。
在一些实施例中，考虑到如果直接将电容传感器210设置在后挂组件122中，可能会在用户使用过程中由于后挂组件122的形变量过大而导致传感器发生不可逆的塑性形变，进而导致传感器迟滞或损坏。因此，为了避免前述问题，同时使得电容传感器210(例如电容式传感器)的安装更加方便、可靠，耳机100还可以包括平台结构300。可以理解，通过该平台结构300，可以在一定程度减小电容传感器210处的形变量，从而避免其由于形变量过大而损坏或降低工作性能。
参照图10或图11，平台结构300可以设置在后挂组件122中，并用于安装电容传感器210。具体地，平台结构300可以贴合设置在骨架结构270上，电容传感器210可以贴合设置在平台结构上。
在一些实施例中，平台结构300可以采用金属或非金属材料制作而成。当平台结构300由金属材料制作而成时，平台结构300可以与电容传感器210的屏蔽结构213共同对电容传感器210起到电磁屏蔽作用，以减少外界电场对电容传感器210的影响。此时，电容传感器210的屏蔽结构213形成的空腔可以具有开口，开口可以朝向平台结构300。也就是说，当电容传感器210的屏蔽结构213部分包覆电容传感器210中的电容结构时，通过将屏蔽结构213的开口与平台结构300贴合设置在一起，从而使屏蔽结构213的开口闭合，以屏蔽外界电场的干扰。
在一些实施例中，该平台结构300可以与骨架结构270(例如钛丝)一体成型。在一些实施例中，平台结构300可以为单独的部件，其可以与骨架结构270贴合安装，例如，通过胶水。
图12是根据本说明书另一些实施例所示的耳机的电路模块示意图。
在一些实施例中，耳机100还可以包括接触式传感器240。接触式传感器240可以设置在至少一个扬声器组件110的壳体内或如图1A所示的耳机仓130内。接触式传感 器240可以用于识别耳机仓130是否与用户接近或者与用户接触(例如与用户的皮肤接触)。在一些实施例中，耳机100可以包括左右两个耳机仓130。为了提高佩戴检测的准确性，左右两个耳机仓130中可以分别设置一个接触式传感器240。通过两个接触式传感器240检测的接触信号共同判断耳机仓130是否与用户接近或接触。例如，只有当左右两个接触式传感器240检测到用户接近或接触用户时，处理电路220才判断耳机仓130与用户接近或接触。在一些实施例中，接触式传感器240可以包括电容式接近传感器、压力传感器(例如，薄膜压力传感器)、红外传感器、激光传感器等中的一种或多种。需要知道的是，不同类型的接触式传感器可以采用不同的工作原理，其判断对应部件是否与用户接触的参数可以不同。例如，对于压力传感器，当检测到的压力大于压力阈值时，可以判断对应部件与用户接触；而当检测到的压力小于压力阈值时，则判断对应部件与用户不接触。再例如，对于红外传感器，当检测到的距离大于距离阈值时，可以判断对应部件与用户接触；而当检测到的距离小于距离阈值时，则判断对应部件与用户不接触。
需要知道的是，当接触式传感器240为电容式接近传感器时，电容式接近传感器也可以包括屏蔽结构，该屏蔽结构的电位可以始终保持不变，并用于降低外界电场对电容式接近传感器的影响。
处理电路220可以基于电容传感器210采集的弯曲信号和接触式传感器240采集的接触信号，判断耳机100的当前放置状态。更多关于结合电容传感器210的弯曲信号和接触式传感器240的接触信号判断耳机100的放置状态可以参见本说明书图13A-13C及图14A-14C的描述，此处不再赘述。
在一些实施例中，为了降低耳机100和/或接触式传感器240所产生的功耗，可以使接触式传感器240默认处于睡眠状态，当电容传感器210所采集的弯曲信号指示连接件120的等效曲率半径大于或等于预设阈值时，处理电路220可以控制接触式传感器240采集接触信号。在一些实施例中，为了降低耳机100和/或接触式传感器240所产生的功耗，还可以使处理电路220只有在电容传感器210所采集的弯曲信号指示连接件120的等效曲率半径大于或等于预设阈值时，才接收接触式传感器240的接触信号以进行处理。预设阈值可以大于耳机100自由放置时的等效曲率半径。
在一些实施例中，耳机100可以不包括连接件120，此时，耳机100可以是开放式耳机、智能眼镜、单耳耳挂式耳机、单耳入耳式耳机(例如，真无线蓝牙耳机)等中的一种或多种。在这种情况下，耳机100可以不包括电容传感器210，而包括至少两个其 他类型的传感器(例如，两种接触式传感器)。处理电路220可以基于至少两个其他类型的传感器所检测到的信号协同判断耳机100是否处于正常佩戴状态。仅作为示例，耳机100可以包括第一接触式传感器和第二接触式传感器。第一接触式传感器与第二接触式传感器的类别可以相同或不同。例如，第一接触式传感器可以为红外传感器，第二接触式传感器可以为薄膜压力传感器。在一些实施例中，第一接触式传感器和第二接触式传感器可以设置在耳机100的任何合适的位置。例如，第一接触式传感器和第二接触式传感器可以同时设置在同一个扬声器组件110的壳体中或分别设置在两个扬声器组件110的壳体中。又例如，对于智能眼镜，第一接触式传感器和第二接触式传感器可以同时设置在一个镜腿中或分别设置在两个镜腿中。又例如，对于智能眼镜，第一接触式传感器可以设置在镜腿上，第二接触式传感器可以设置在鼻托上。处理电路220可以直接基于第一接触式传感器和第二接触式传感器采集的接触信号，判断耳机100是否处于正常佩戴状态。例如，只有当第一接触式传感器和第二接触式传感器同时检测到用户接近或接触用户时，处理电路220才判断耳机100处于正常佩戴状态。
在一些实施例中，耳机100可以包括接触式传感器和方向传感器(例如，陀螺仪)。例如，对应单耳耳挂式耳机，接触式传感器可以设置在正常佩戴时靠近耳廓顶端的位置。当接触式传感器检测到用户接近或接触用户，且方向传感器指示耳机竖直放置时，处理电路220才判断耳机100处于正常佩戴状态。
图13A是根据本说明书一些实施例所示的示例性耳机处于自由放置状态的示意图。图13B是根据本说明书一些实施例所示的示例性耳机处于正常佩戴状态的示意图。图13C是根据本说明书一些实施例所示的示例性耳机处于非正常佩戴状态的示意图。
在一些实施例中，参照图13A-13C，接触式传感器240可以设置在耳机仓130内侧(即耳机100处于正常佩戴状态时靠近人体皮肤的一侧)。当耳机100处于自由放置状态时(如图13A所示)，连接件120的等效曲率半径为R0。当耳机100处于正常佩戴状态时(如图13B所示)，由于头部的支撑作用，连接件120的等效曲率半径增大为R1，即R1>R0。此时，耳机仓130与用户头部不接触。当耳机100处于非正常佩戴状态时(例如，用户将耳机100悬挂于颈部)时(如图13C所示)，由于颈部的支撑作用，连接件120的等效曲率半径增大为R2，即R2>R0。由于颈部尺寸小于头部尺寸，因此，R1>R2>R0。此时，耳机仓130与用户的颈部接触(或者靠近用户的颈部)。基于此，在一些实施例中，可以根据电容传感器210生成的弯曲信号确定出连接件120的当前等效 曲率半径，以及接触式传感器240所检测到的耳机仓130与用户的接触状态，共同判断出耳机100的当前放置状态。
仅作为示例，当电容传感器210检测到的弯曲信号为指示连接件120(或后挂组件122)的等效曲率半径大于或等于预设阈值的第一弯曲信号时，电容传感器210的输出可以为1(即输出为高电平)，反之，当电容传感器210检测到的弯曲信号为指示连接件120的等效曲率半径小于预设阈值的第二弯曲信号时，电容传感器210的输出可以为0(即输出为低电平)。类似地，当接触式传感器240检测到的接触信号为指示耳机仓130与用户不接触(或者与用户的距离大于预设距离阈值)的第一接触信号时，接触式传感器240的输出可以为1(即输出为高电平)，反之，当接触式传感器240检测到的接触信号指示耳机仓130与用户接触(或者与用户的距离小于预设距离阈值)的第二接触信号时，接触式传感器240的输出可以为0(即输出为低电平)。
需要说明的是，在本说明书的一些实施例中，当耳机100包括设置在不同位置的多个电容传感器210时，可以根据多个电容传感器210检测的弯曲信号共同确定一个总弯曲信号。例如，当设置在如图1A所示的位置A、位置B和位置C处的电容传感器210检测到的弯曲信号均指示连接件120(或后挂组件122)的等效曲率半径大于或等于预设阈值时，多个电容传感器210输出的总弯曲信号可以确定为第一弯曲信号(即，其值为1)。又例如，当设置在位置B处的电容传感器210检测到的弯曲信号指示连接件120(或后挂组件122)的等效曲率半径大于或等于预设阈值，但位置A和位置C处的电容传感器210检测到的弯曲信号指示连接件120(或后挂组件122)的等效曲率半径等于耳机100自由放置时的等效曲率半径时，表示位置B处可能由于误碰而产生弯曲形变，此时，多个电容传感器210的总弯曲信号可以确定为第二弯曲信号(即，其值为0)。
进一步地，处理电路220可以根据电容传感器210的输出和接触式传感器240的输出判断耳机100是否处于正常佩戴状态，从而根据耳机100是否处于正常佩戴状态发出指令给控制电路230。控制电路230可以基于接收到的控制指令对耳机100的工作状态进行控制。在一些实施例中，参照表1，只有当弯曲信号为第一弯曲信号(即，其值为1)且接触信号为第一接触信号(即，其值为1)时，处理电路220的输出可以为1，即表示判断耳机100处于正常佩戴状态。当电容传感器210和接触式传感器240中任意一者的输出为0时，处理电路220的输出可以皆为0，即表示判断耳机100处于非正常佩戴状态或自由放置状态。进一步地，控制电路230可以基于处理电路220的输出，控制耳机100的一个或多个组件的工作状态。例如，当处理电路220的总输出为1时，控制电 路230可以控制耳机100进入唤醒状态；当处理电路220的总输出为0时，控制电路230可以控制耳机100保持待机状态。
表1接触式传感器置于耳机仓内时耳机放置状态的检测方案
需要说明的是，表1所示的输出信号仅为示例性说明，在一些实施例中，可以采用其他的方式对电容传感器210检测的弯曲信号、接触式传感器240检测接触信号以及耳机100的总输出信号进行表示。例如，在一些实施例中，当接触式传感器240检测到的接触信号为前述第一接触信号时，其输出也可以用0表示(即输出为低电平)，反之，当接触式传感器240检测到的接触信号为前述第二接触信号时，其输出可以用1表示(即输出为高电平)。
图14A是根据本说明书一些实施例所示的示例性耳机处于自由放置状态的示意图。图14B是根据本说明书一些实施例所示的示例性耳机处于正常佩戴状态的示意图。图14C是根据本说明书一些实施例所示的示例性耳机处于非正常佩戴状态的示意图。
在一些实施例中，参照图14A-14C，接触式传感器240还可以设置在至少一个扬声器组件110的壳体内部(例如，耳机100处于正常佩戴状态时靠近人体皮肤的一侧)，以用于识别扬声器组件110是否与用户接触(或者与用户接近)。与图13A-13C不同的是，当接触式传感器240检测到的接触信号为指示扬声器组件110与用户不接触(或者与用户的距离大于预设距离阈值)的第一接触信号时，接触式传感器240的输出可以为1(即输出为高电平)，反之，当接触式传感器240检测到的接触信号指示扬声器组件110与用户接触(或者与用户的距离小于预设距离阈值)的第二接触信号时，接触式传感器240的输出可以为0(即输出为低电平)。
在一些实施例中，参照表2所示，当接触式传感器240设置在扬声器组件110的壳体内部时，只有当电容传感器210检测到的弯曲信号为前述第一弯曲信号(即，其值为1)，且接触式传感器240检测到的信号为第二接触信号(即，其值为0)时，处理电路220的输出为1，即判断耳机100处于正常佩戴状态。当电容传感器210检测到的弯曲信号为前述第二弯曲信号(即，其值为0)，和/或接触式传感器240检测到的信号为指示扬声器组件110与用户不接触(或者与用户距离大于预设距离阈值)的第一接触信号(即，其值为1)时，处理电路220的输出可以皆为0，即表示判断耳机100处于非正常 佩戴状态或自由放置状态。进一步地，控制电路230可以基于处理电路220的输出，控制耳机100的一个或多个组件的工作状态。例如，当处理电路220的总输出为1时，控制电路230可以控制耳机100进入唤醒状态；当处理电路220的总输出为0时，控制电路230可以控制耳机100保持待机状态。
表2接触式传感器置于扬声器组件壳体内时耳机放置状态的检测方案
同上，需要说明的是，表2所示的输出信号也仅为示例性说明，在一些实施例中，同样可以采用其他的方式对电容传感器210检测的弯曲信号、接触式传感器240检测接触信号以及耳机100的总输出信号进行表示。例如，在一些实施例中，当接触式传感器240检测到的接触信号为前述第一接触信号时，其输出也可以用0表示(即输出为低电平)，当接触式传感器240检测到的接触信号为前述第二接触信号时，其输出也可以用1表示(即输出为高电平)。
本申说明书实施例可能带来的有益效果包括但不限于：(1)在本说明书的一些实施例中，通过在电容传感器外设置屏蔽结构，可以降低外界电场对电容传感器产生的影响，从而提高电容传感器的检测结果的准确性；(2)在本说明书的一些实施例中，采用屏蔽结构作为电容传感器的第二电极板，可以在实现电磁屏蔽，降低外界电场对电容传感器的干扰的同时，有效减少对电容传感器设置屏蔽结构的加工工艺难度，并在一定程度上减小电容传感器和屏蔽结构的整体厚度和成本，提高产品良率；(3)在本说明书的一些实施例中，通过设置用于安装电容传感器的平台结构，可以使得电容传感器的安装更加方便、可靠，并且可以避免电容传感器在随耳挂组件产生形变的过程中由于形变量过大而损坏或降低工作性能。需要说明的是，不同实施例可能产生的有益效果不同，在不同的实施例里，可能产生的有益效果可以是以上任意一种或几种的组合，也可以是其他任何可能获得的有益效果。
上文已对基本概念做了描述，显然，对于本领域技术人员来说，上述详细披露仅仅作为示例，而并不构成对本说明书的限定。虽然此处并没有明确说明，本领域技术人员可能会对本说明书进行各种修改、改进和修正。该类修改、改进和修正在本说明书中被建议，所以该类修改、改进、修正仍属于本说明书示范实施例的精神和范围。

Claims (16)

  1. 一种耳机，包括：
    两个扬声器组件；
    连接件，用于连接所述两个扬声器组件，所述连接件通过弯曲形变提供将所述两个扬声器组件固定在用户头部的夹紧力，所述连接件包括具有容置腔的外壳，所述容置腔中设置有电容传感器，所述电容传感器用于识别所述连接件的弯曲状态，其中，
    所述电容传感器包括屏蔽结构，所述屏蔽结构的电位始终保持不变，并用于降低外界电场对所述电容传感器的影响。
  2. 根据权利要求1所述的耳机，其中，所述连接件包括两个耳挂组件和后挂组件，所述两个扬声器组件分别通过所述两个耳挂组件连接到所述后挂组件，所述电容传感器位于所述后挂组件形成的所述容置腔中。
  3. 根据权利要求2所述的耳机，其中，所述电容传感器还包括第一电极板，所述屏蔽结构作为所述电容传感器的第二电极板与所述第一电极板构成电容器，所述第二电极板具有空腔，所述第一电极板设置在所述空腔内。
  4. 根据权利要求3所述的耳机，其中，所述第一电极板与所述第二电极板为柔性导体，所述第一电极板与所述第二电极板之间的空间中填充有柔性衬底。
  5. 根据权利要求3所述的耳机，其中，所述第一电极板包括多个隔开布置的子电极板。
  6. 根据权利要求5所述的耳机，其中，所述多个子电极板通过第一导线相互电连接，所述多个子电极板的信号通过与所述多个子电极板中任一子电极板连接的第二导线输出。
  7. 根据权利要求5所述的耳机，其中，所述多个子电极板中的每个子电极板分别与第二导线电连接，所述多个子电极板的信号通过与每个子电极板对应的第二导线输出。
  8. 根据权利要求2所述的耳机，其中，所述电容传感器还包括第一电极板和第二电极板，所述屏蔽结构为具有空腔的导体，所述第一电极板和所述第二电极板设置在所述空腔内。
  9. 根据权利要求8所述的耳机，其中，所述导体包括导电胶、柔性导电布、导电薄膜中的任意一种。
  10. 根据权利要求3至9中任一项所述的耳机，其中，所述后挂组件还包括骨架结构，所述电容传感器与所述骨架结构贴合设置。
  11. 根据权利要求10所述的耳机，其中，所述空腔为封闭结构。
  12. 根据权利要求10所述的耳机，其中，所述骨架结构为导体骨架，所述空腔具有开口，所述开口朝向所述导体骨架。
  13. 根据权利要求2至12中任一项所述的耳机，其中，所述耳机还包括平台结构，所述平台结构设置在所述后挂组件上，所述电容传感器固定在所述平台结构上。
  14. 根据权利要求13所述的耳机，其中，所述平台结构为固体导体。
  15. 根据权利要求1至14中任一项所述的耳机，其中，所述电容传感器为差分电容传感器。
  16. 一种耳机，包括：
    钩状部，用于挂设在用户的耳部的后侧与头部之间；
    保持部，用于接触所述耳部的前侧；以及
    连接部，用于连接所述钩状部与所述保持部，并从所述头部向所述头部的外侧延伸，进而与所述钩状部配合为所述保持部提供对所述耳部的前侧的压紧力，其中，所述 钩状部或所述连接部设置有电容传感器，所述电容传感器用于识别所述钩状部或所述连接部的弯曲状态，其中，
    所述电容传感器包括屏蔽结构，所述屏蔽结构的电位始终保持不变，并用于降低外界电场对所述电容传感器的影响。
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