WO2024169630A1 - 液冷模组、液冷模件及电子设备 - Google Patents

液冷模组、液冷模件及电子设备 Download PDF

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Publication number
WO2024169630A1
WO2024169630A1 PCT/CN2024/075186 CN2024075186W WO2024169630A1 WO 2024169630 A1 WO2024169630 A1 WO 2024169630A1 CN 2024075186 W CN2024075186 W CN 2024075186W WO 2024169630 A1 WO2024169630 A1 WO 2024169630A1
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WIPO (PCT)
Prior art keywords
liquid cooling
liquid
rigid substrate
flexible film
pump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2024/075186
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English (en)
French (fr)
Inventor
靳林芳
骆洋
方浩明
胡锦炎
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Huawei Technologies Co Ltd
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Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Priority to CN202480002019.1A priority Critical patent/CN119096711A/zh
Priority to EP24756004.8A priority patent/EP4557904A4/en
Publication of WO2024169630A1 publication Critical patent/WO2024169630A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20281Thermal management, e.g. liquid flow control
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04BPOSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B43/00Machines, pumps, or pumping installations having flexible working members
    • F04B43/02Machines, pumps, or pumping installations having flexible working members having plate-like flexible members, e.g. diaphragms
    • F04B43/04Pumps having electric drive
    • F04B43/043Micropumps
    • F04B43/046Micropumps with piezoelectric drive
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04BPOSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B53/00Component parts, details or accessories not provided for in, or of interest apart from, groups F04B1/00 - F04B23/00 or F04B39/00 - F04B47/00
    • F04B53/16Casings; Cylinders; Cylinder liners or heads; Fluid connections
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1633Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637Details related to the display arrangement, including those related to the mounting of the display in the housing
    • G06F1/1641Details related to the display arrangement, including those related to the mounting of the display in the housing the display being formed by a plurality of foldable display components
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1633Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637Details related to the display arrangement, including those related to the mounting of the display in the housing
    • G06F1/1652Details related to the display arrangement, including those related to the mounting of the display in the housing the display being flexible, e.g. mimicking a sheet of paper, or rollable
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1633Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1675Miscellaneous details related to the relative movement between the different enclosures or enclosure parts
    • G06F1/1681Details related solely to hinges
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • G06F1/203Cooling means for portable computers, e.g. for laptops
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/40Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20Indexing scheme relating to G06F1/20
    • G06F2200/201Cooling arrangements using cooling fluid
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20Indexing scheme relating to G06F1/20
    • G06F2200/203Heat conductive hinge
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

Definitions

  • the present application relates to the technical field of electronic equipment, and in particular to a liquid cooling module, a liquid cooling module and an electronic equipment.
  • TIM thermal interface materials
  • Artificial graphite film graphene film
  • copper film and other heat-dissipating materials
  • heat pipes VC heat pipes
  • micro fans heat pipes
  • Folding mobile phones and folding PCs are a new type of mobile terminals that have emerged recently, are growing rapidly and are widely welcomed by users.
  • the hinge is required to pass the reliability test of ⁇ 100,000 bends, while most of the current heat dissipation devices and materials, such as artificial graphite, copper film, heat pipes, VC, etc., cannot pass the reliability test requirements.
  • CN114340305B provides a through-axis pump-driven liquid cooling and flexible heat dissipation solution that can be applied to PCs or mobile phones and watches. Compared with traditional liquid cooling systems, it is a relatively simplified liquid cooling system without a liquid collection tank, a liquid filling device, and an exhaust valve. However, the system includes ⁇ 3 connecting hoses (made of bending-resistant PTFE metal-plated to prevent evaporation), 2 cold plates (made of stainless steel composite plates), 2 water nozzles connected to the cold plates (3D printed stainless steel), 1 mechanical pump (precision injection molding, containing 3 sealing rings, requiring multiple bolt connections to provide pre-tightening force), 1 four-way valve (to meet the needs of testing, debugging, testing and maintenance), etc.
  • the system has a total of ⁇ 12 sealing interfaces.
  • the sealed pipe joints cannot be fully automatically assembled. After the incoming materials from different suppliers are inspected, they are assembled, filled with liquid and sealed for testing in the system factory; the system generally uses metal material pipelines, and O-ring sealing systems with pre-tightening force are used in many places.
  • the sealing effect of the interface is closely related to the resilience of the interface material itself, the contact pressure, the swelling amount of the sealing material to the liquid cooling medium, the assembly accuracy of the assembly parts, etc., involving materials from multiple suppliers and assembly of production lines. It is impossible to fully automate the production in engineering, and quality control is difficult and costly. For consumer products, the application scenarios are complex and changeable.
  • liquid cooling modules are formed by flow channels of membrane materials such as polymer PET, PP, and PPS. Small molecules such as water will penetrate the diaphragm made of polymer materials, and this amount increases exponentially with evaporation and temperature.
  • adhesive sealing can be used between the pump and the liquid cooling module, and inside the liquid cooling module.
  • Microbubbles are likely to form between the layers during bonding, and long-term temperature and weather resistance is very limited. It is especially not resistant to high temperature and humidity, and is prone to creep or moisture absorption. The adhesive strength of the glue layer decreases and fails, and it cannot be reliably sealed for a long time. Glue is basically not used for sealing liquid cooling systems in engineering. In summary, leakage and evaporation problems are the biggest bottlenecks for the application of traditional liquid cooling systems in massive mobile terminal consumer electronic products; for folding machines, wearables and other products, an innovative flexible liquid cooling system sealing and heat dissipation solution is required.
  • the present application provides a liquid cooling module, a liquid cooling module and an electronic device.
  • the liquid cooling module includes a pump and a liquid cooling module.
  • the pump is used to provide power for the cooling medium in the liquid cooling module, and the pump includes a pump base and a piezoelectric component.
  • the pump base is provided with a pump inlet and a pump outlet.
  • the liquid cooling module includes a liquid cooling outlet and a liquid cooling inlet, the liquid cooling outlet is used to communicate with the pump inlet, and the liquid cooling inlet is used to communicate with the pump outlet.
  • the part of the liquid cooling module around the liquid cooling outlet is the same or similar to the part of the pump base around the pump inlet, and is an integrated sealed welding structure without solder paste or other third materials.
  • the part of the liquid cooling module around the liquid cooling inlet is the same or similar to the part of the pump base around the pump outlet, and is an integrated sealed welding structure without solder paste or other third materials.
  • the liquid cooling module is composed of a first flexible film, a second flexible film, a first rigid base, a second rigid base, a third rigid base, etc.
  • the first rigid substrate and the second rigid substrate are made of the same or similar materials as the first flexible membrane and the second flexible membrane, and the seal therebetween adopts an integrated sealing welding structure without solder paste or other third materials.
  • the stacking design, material selection and integrated welding of the pump and the liquid cooling membrane are adopted to realize the integrated sealing of the flexible system without pre-tightening force, and the system can dynamically adapt to bending and use, and the system can be easily sealed. It can effectively reduce the fluctuation of system pressure and volume, greatly simplify the design and manufacturing, and has no assembly leakage. It is suitable for mobile electronic devices such as candy-bar phones, folding phones, folding PCs, wearables, accessories, etc.
  • the present application provides a liquid cooling module, the liquid cooling module comprising a pump and a liquid cooling module, the pump comprising a pump base and a piezoelectric component fixed to the pump base, the pump base being provided with a pump inlet and a pump outlet.
  • the liquid cooling module comprises a liquid cooling outlet and a liquid cooling inlet, the liquid cooling outlet is used to communicate with the pump inlet, the liquid cooling inlet is used to communicate with the pump outlet, the portion of the liquid cooling module around the liquid cooling outlet and the portion of the pump base around the pump inlet are an integrated sealing structure, the portion of the liquid cooling module around the liquid cooling inlet and the portion of the pump base around the pump outlet are an integrated sealing structure.
  • the pump as the power source of the liquid cooling module, can provide the power for the flow and circulation of the cooling medium in the liquid cooling module, realize active liquid cooling, and thus achieve the effect of long-lasting heat dissipation.
  • active liquid cooling can adjust the speed of the pump as needed to achieve the best heat dissipation effect, while passive liquid cooling can only passively follow the changes in device temperature to dissipate heat, so active liquid cooling has better adjustability.
  • the liquid cooling outlet is used to connect with the pump inlet, which does not mean that the liquid cooling outlet and the pump inlet are always connected, but only indicates that under certain conditions, the cooling medium can flow from the liquid cooling outlet into the pump inlet.
  • the relationship between the liquid cooling inlet and the pump outlet is similar.
  • the piezoelectric component uses the inverse piezoelectric effect of piezoelectric materials.
  • Piezoelectric materials refer to crystalline materials that will produce voltage between the two end faces when subjected to pressure.
  • the inverse piezoelectric effect refers to the mechanical deformation or mechanical pressure of the piezoelectric component in a certain direction after an electric field is applied to the piezoelectric component. When the external electric field is removed, these deformations or stresses disappear.
  • the use of piezoelectric components in pumps has the characteristics of small size, high energy density and no electromagnetic interference, and can realize the precise delivery and control of cooling media.
  • the piezoelectric component includes piezoelectric ceramics, a metal substrate and a plastic partition (to prevent liquid working fluid from corroding the metal substrate).
  • part of the liquid cooling module on the side around the liquid cooling outlet and part of the pump base on the side around the pump inlet are an integrated sealing structure
  • part of the liquid cooling module on the side around the liquid cooling inlet and part of the pump base on the side around the pump outlet are an integrated sealing structure.
  • the formation of an integrated sealing structure means that there is no continuous interface between the two due to mutual fusion and penetration, and the side around the liquid cooling outlet refers to the adjacent area around the liquid cooling outlet.
  • the fixing method using screw connection is not convenient for quality control because the tightness of the screw connection (i.e., the sealing effect) is limited by many factors such as assembly accuracy and the material's own resilience. In actual use, it may cause leakage of the cooling medium, thereby affecting the heat dissipation efficiency of the cooling medium and damaging the internal components. It is usually necessary to set a base in the pump, and the screws pass through the base and the liquid cooling module in turn to achieve fixation.
  • the integrated sealing structure in this application integrates part of the liquid cooling module on the side of the liquid cooling outlet with part of the pump base on the side of the pump inlet, and the connection relationship is tighter, which is conducive to improving the sealing effect of the pump base and the liquid cooling module.
  • the liquid cooling module provided in the present application can be applied to electronic equipment.
  • the electronic equipment is subjected to external force (such as falling to the ground and colliding with the ground)
  • the use of screw fixation may cause the connection between the pump base and the liquid cooling module to loosen, or the O-ring to shift and the local seal to be loose.
  • the integrated sealing structure makes it difficult for relative displacement to occur between the pump base and the liquid cooling module, which is beneficial to improving the stability of the overall structure of the liquid cooling module and increasing the service life of the electronic equipment.
  • a pump is used to provide power for the flow and circulation of the cooling medium to achieve active heat dissipation in the liquid cooling module. Compared with passive liquid cooling, it can more effectively reduce the temperature of the device and improve the heat dissipation efficiency.
  • the area around the liquid cooling outlet in the liquid cooling module and the area around the pump inlet in the pump base are an integrated sealing structure.
  • the area around the liquid cooling inlet in the liquid cooling module and the area around the pump outlet in the pump base are an integrated sealing structure.
  • the integrated sealing structure has a better sealing effect and can prevent leakage of the cooling medium, thereby avoiding reducing the heat dissipation efficiency of the cooling medium and protecting the device from damage.
  • the centers of the liquid cooling outlet and the pump inlet are aligned in the thickness direction of the liquid cooling module, and the projections of the areas surrounded by the peripheral walls of the liquid cooling outlet and the pump inlet in the thickness direction overlap.
  • the centers of the liquid cooling inlet and the pump outlet are aligned in the thickness direction of the liquid cooling module, and the projections of the areas surrounded by the peripheral walls of the liquid cooling inlet and the pump outlet along the thickness direction overlap.
  • At least a portion of the liquid cooling module around the liquid cooling outlet and at least a portion of the pump base around the pump inlet are continuously fused together along the circumference of the liquid cooling outlet to form an integrated sealing structure.
  • the integrated sealing structure in order to ensure the sealing effect between the pump base and the liquid cooling module, the integrated sealing structure needs to be continuously fused into an integrated sealing structure along the circumference of the liquid cooling outlet.
  • the integrated sealing structure can be an ellipse, a square, a triangle, or an irregular shape.
  • the circumference of the liquid cooling outlet forms an integrated sealing structure in the radial direction.
  • a part of the liquid-cooling module on the peripheral side of the liquid-cooling outlet and a part of the pump base on the peripheral side of the pump inlet may have a discontinuous interface, and the spacing between the interfaces is not limited, wherein the position without the interface is an integrated sealing structure.
  • no interface is formed between a part of the liquid-cooling module on the peripheral side of the liquid-cooling outlet and a part of the pump base on the peripheral side of the pump inlet, which is a preferred processing technology with the best sealing effect.
  • the radial and circumferential directions are determined based on the liquid cooling outlet being circular.
  • the radial direction can be understood as the direction from the center of the liquid cooling outlet to a certain position on the circumferential side.
  • At least part of the liquid cooling module on the side of the liquid cooling inlet and at least part of the pump base on the side of the pump outlet are continuously fused into one along the circumference of the liquid cooling inlet to form an integrated sealing structure.
  • the integrated sealing structure on the side of the liquid cooling inlet is continuously fused into one along the circumference of the liquid cooling inlet.
  • the pump base includes a pump bottom wall, and the pump bottom wall, the piezoelectric component, and a portion of the pump base therebetween form a pump cavity, the pump inlet and the pump outlet are arranged on the pump bottom wall and connected to the pump cavity, and the pump bottom wall and a portion of the liquid cooling module on the side surrounding the liquid cooling outlet and the side surrounding the liquid cooling inlet are an integrated sealing structure.
  • connection relationship between the pump inlet and the pump cavity is similar to the connection relationship between the liquid cooling outlet and the pump inlet, that is, the pump inlet and the pump cavity are not always connected, but under the drive of the piezoelectric component, the cooling medium enters the pump cavity through the liquid cooling outlet and the pump inlet.
  • the connection relationship between the pump outlet and the pump cavity is similar.
  • the pump inlet and the pump outlet are both arranged on the bottom wall of the pump, and part of the pump bottom wall and part of the liquid cooling module located on the periphery of the pump inlet and the pump outlet are an integrated sealing structure, that is, there is no need to add a base to the pump.
  • the base and the liquid cooling module can only be fixed by screws, and the sealing effect is poor, which is easy to cause leakage of the cooling medium.
  • the liquid cooling module includes two parallel pumps, and the two pumps in parallel can achieve a larger flow rate.
  • the liquid cooling module includes two series pumps, and the two pumps in series can achieve a larger driving pressure.
  • the liquid cooling module may include multiple pumps, and the multiple pumps may be distributed in different positions in the liquid cooling module, which can be specifically set according to needs.
  • the pump further comprises an inlet valve membrane and an outlet valve membrane fixed to the bottom wall of the pump, the inlet valve membrane is used to close or open the pump inlet, and the outlet valve membrane is used to close or open the pump outlet.
  • the piezoelectric component in the liquid inlet scenario, is used to receive an electrical signal and then deform, the volume of the pump cavity increases, the inlet valve membrane is driven to open and the outlet valve membrane is driven to close, and power is provided for the cooling medium in the liquid cooling module, so that the cooling medium enters the pump cavity from the liquid cooling outlet and the pump inlet in turn.
  • the piezoelectric component in the liquid outlet scenario, is used to receive an electrical signal and then deform, the volume of the pump cavity decreases, the inlet valve membrane is driven to close and the outlet valve membrane is driven to open, and power is provided for the cooling medium in the liquid cooling module, so that the cooling medium enters the liquid cooling module from the pump outlet and the liquid cooling inlet in turn.
  • the inlet valve membrane is located on the side of the pump inlet away from the liquid cooling outlet along the thickness direction, and the outlet valve membrane is located between the pump outlet and the liquid cooling inlet along the thickness direction.
  • the inlet valve membrane is located between the pump inlet and the pump cavity along the thickness direction, and the outlet valve membrane is located on the side of the liquid cooling inlet away from the pump outlet along the thickness direction.
  • the liquid cooling module in this implementation method can not only cool the components of the electronic equipment, but also optimize the performance of the pump contained in the liquid cooling module itself.
  • the pump base also includes a pump side wall located between the pump bottom wall and the piezoelectric component, and the pump side wall is an integrated sealing structure.
  • the pump side wall extends along the thickness direction of the liquid cooling module. Since the pump side wall, the pump bottom wall, and the piezoelectric component together enclose a pump cavity, the pump side wall is set as an integrated sealing structure in this solution, which can effectively prevent the cooling medium from leaking from the pump side wall and improve the sealing performance of the pump base.
  • the pump base includes a pump chamber layer, a first flow channel layer, a valve sheet layer and a second flow channel layer stacked along the thickness direction, a cavity hole is provided in the pump chamber layer, the first flow channel layer is provided with the pump outlet and a first guide channel corresponding to the pump inlet, the first flow channel layer is connected with the cavity hole in the pump chamber layer, the valve sheet layer is provided with the inlet valve membrane and the outlet valve membrane that can be opened and closed, the second flow channel layer is provided with the pump inlet and a second guide channel corresponding to the pump outlet, the second flow channel layer is connected with the liquid cooling module, and the pump chamber layer, the first flow channel layer, the valve sheet layer and the second flow channel layer are formed into an integrated sealing structure by hot pressing.
  • the pump inlet, the inlet valve membrane and the first guide channel are correspondingly arranged in the thickness direction of the liquid cooling module
  • the pump outlet, the outlet valve membrane and the second guide channel are correspondingly arranged in the thickness direction of the liquid cooling module.
  • the projection area of the area enclosed by the peripheral wall of the first guide channel along the thickness direction is larger than the projection area of the area enclosed by the peripheral wall of the pump inlet along the thickness direction, which is advantageous
  • the projected area of the area surrounded by the peripheral wall of the second flow guide channel along the thickness direction is larger than the projected area of the area surrounded by the peripheral wall of the pump outlet along the thickness direction, which is beneficial to prevent the cooling medium from flowing back to the pump inlet and outlet, and to give full play to the guiding effect of the second flow guide channel on the cooling medium.
  • the edges of the pump cavity layer, the first flow channel layer, the valve sheet layer and the second flow channel layer are hot pressed to form the pump side wall, so that each layer is sealed, thereby improving the sealing effect of the pump base.
  • the liquid cooling module includes a first flexible membrane, the liquid cooling outlet and the liquid cooling inlet are arranged on the first flexible membrane, and the pump bottom wall and the periphery of the liquid cooling outlet and a part of the first flexible membrane around the liquid cooling inlet are an integrated sealing structure.
  • the fixed connection between the liquid cooling module and the pump is actually the fixed connection between the first flexible membrane and the bottom wall of the pump.
  • the first flexible membrane which is located around the liquid cooling outlet and the liquid cooling inlet, forms an integrated sealing structure with the bottom wall of the pump. Since the first flexible membrane and the bottom wall of the pump are made of the same or similar materials, the difficulty of hot pressing is relatively small, which is conducive to forming an integrated sealing structure.
  • first flexible membrane there is a discontinuous interface between the first flexible membrane and the bottom wall of the pump.
  • at least part of the first flexible membrane and the bottom wall of the pump are continuously fused into one to form an integrated sealing structure.
  • the first flexible membrane is an integrated sealing structure with the bottom wall of the pump except for the liquid cooling outlet and the liquid cooling inlet, and there is no interface between the two.
  • This sealing interface is a preferred sealing interface, which has stronger flexibility, sealing and impact resistance.
  • adhesive sealing may be used at the location where the pump is connected to the liquid cooling module 200 to improve sealing and reliability.
  • the difference between the glass transition temperature of the material of the pump bottom wall and the glass transition temperature of the material of the first flexible film is less than or equal to 20° C.
  • the difference between the glass transition temperatures of the material of the pump bottom wall and the material of the first flexible film is set to be small, which is conducive to sealing the pump bottom wall and the first flexible film into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.
  • the difference between the melting temperature of the material of the pump bottom wall and the melting temperature of the material of the first flexible film is less than or equal to 20° C.
  • the difference between the melting temperatures of the material of the pump bottom wall and the material of the first flexible film is set to be small, which is conducive to sealing the pump bottom wall and the first flexible film into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.
  • the material of the portion of the liquid-cooling module around the liquid-cooling outlet is the same as the material of the portion of the pump base around the pump inlet
  • the material of the portion of the liquid-cooling module around the liquid-cooling inlet is the same as the material of the portion of the pump base around the pump outlet.
  • the material of the pump bottom wall is selected from a flexible heat-resistant polymer material with a breaking elongation greater than 10%, and the material of the pump bottom wall is selected from at least one of polyethylene terephthalate copolymer, polyethylene naphthalate, polyethylene 2,5-furandicarboxylate, polyimide, polyetheretherketone, and biaxially stretched polypropylene.
  • the material of the first flexible film is selected from a flexible heat-resistant polymer material with a breaking elongation greater than 10%, and the material of the first flexible film is selected from at least one of polyethylene terephthalate copolymer, polyethylene naphthalate, polyethylene 2,5-furandicarboxylate, polyimide, polyetheretherketone, and biaxially stretched polypropylene.
  • the material selected for the pump bottom wall and the first flexible film is conducive to the hot pressing between the pump bottom wall and the first flexible film to form an integrated sealing structure, wherein the pump bottom wall and the first flexible film can be made of different materials, as long as an integrated sealing structure can be formed between the pump bottom wall and the first flexible film.
  • the monomers of the polyethylene terephthalate copolymer include terephthalic acid, ethylene glycol and a hard segment molecular structure, and the mass percentage of the hard segment molecular structure in the polyethylene terephthalate copolymer is greater than or equal to 20% and less than or equal to 80%.
  • This solution introduces a hard segment molecular structure into the structure of polyethylene terephthalate, which can increase the glass transition temperature of the polyethylene terephthalate copolymer.
  • the liquid cooling module can be applied to medium and high temperature applications.
  • the hard segment molecular structure is set to the above-mentioned ratio, which can improve the structural strength of the polyethylene terephthalate copolymer.
  • the polyethylene terephthalate copolymer is used in a liquid cooling module, it can improve the impact resistance and drop resistance of the liquid cooling module, and effectively protect other devices inside the electronic device.
  • the hard segment molecular structure is selected from at least one of 2,5-furandicarboxylic acid, dimethyl carbonate and 2,6-naphthalene dicarboxylic acid.
  • the above materials are used as the hard segment molecular structure, which can improve the structural strength of the polyethylene terephthalate copolymer.
  • other hard segment molecular structures except dimethyl carbonate are used, the evaporation problem of the first flexible film and the second flexible film can also be alleviated, and the water permeability and air permeability can be reduced.
  • the liquid-cooling module further includes a second flexible film and a first rigid substrate located between the first flexible film and the second flexible film, wherein the first flexible film, the second flexible film and the first rigid substrate enclose an inner cavity of the liquid-cooling module. Both ends of the first rigid substrate are respectively integrated with the first flexible film and the second flexible film to form a sealing structure.
  • the sealing welding interface materials between the first rigid substrate and the first flexible film and the second flexible film are the same or similar, and the sealing and reliability between the first rigid substrate and the first flexible film and the second flexible film can be improved by adopting the welding methods without solder paste or other third materials such as thermocompression bonding sealing welding, hot melt welding, ultrasonic welding, and ultra-frequency welding. If the sealing between the first rigid substrate and the first flexible film and the second flexible film leaks, the system performance will drop rapidly and fail quickly.
  • the first flexible membrane and the second flexible membrane are flexible and have good bending performance, and are suitable for situations where the liquid-cooled module needs to be bent.
  • a first rigid substrate is arranged between the first flexible membrane and the second flexible membrane, and the two ends of the first rigid substrate are used to support the first flexible membrane and the second flexible membrane, which is beneficial to improving the overall strength of the liquid-cooled module in the thickness direction.
  • the cooling medium flows in the inner cavity surrounded by the first flexible membrane, the second flexible membrane and the first rigid substrate.
  • the two ends of the first rigid substrate are arranged to form an integrated sealing structure with the first flexible membrane and the second flexible membrane, respectively, which can improve the sealing of the inner cavity and prevent leakage of the cooling medium in the inner cavity.
  • the two ends of the first rigid substrate are respectively discontinuous interfaces with the first flexible film and the second flexible film.
  • the two ends of the first rigid substrate and at least part of the first flexible film and the second flexible film are continuously fused into one, so as to form an integrated sealing structure.
  • the two ends of the first rigid substrate and the first flexible film and the second flexible film are all continuously fused into an integrated sealing structure, and there is no interface between the two ends of the first rigid substrate and the first flexible film, and there is no interface between the two ends of the first rigid substrate and the second flexible film, which is conducive to further improving the sealing effect.
  • the first rigid substrate is arranged around the edges of the first flexible membrane and the second flexible membrane. This solution is conducive to improving the strength of the edge of the liquid cooling module in the thickness direction, and the integrated sealing structure can effectively prevent the cooling medium from leaking at the edge of the liquid cooling module.
  • the thickness of the first flexible film and the second flexible film is less than the length and width of the liquid cooling module.
  • the ratio of the thickness of the first flexible film and the second flexible film to the length of the liquid cooling module is less than or equal to 0.2
  • the ratio of the thickness of the first flexible film and the second flexible film to the width of the liquid cooling module is less than or equal to 0.2.
  • the first flexible membrane and the second flexible membrane are made of a material with a breaking elongation higher than 10% to adapt to system pressure fluctuations and bending.
  • the first flexible membrane and the second flexible membrane are made of a material with a breaking elongation higher than 50%.
  • the surfaces of the first flexible membrane and the second flexible membrane are treated with an anti-evaporation coating, such as coating a flexible inorganic oxide film on the surface of a polymer film to isolate water vapor.
  • the difference between the glass transition temperature of the material of the first rigid substrate and the glass transition temperature of the first flexible film is less than or equal to 20° C.
  • the difference between the glass transition temperatures of the material of the first rigid substrate and the material of the first flexible film is set to be small, which is conducive to sealing the first rigid substrate and the first flexible film into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.
  • the difference between the glass transition temperature of the material of the first rigid substrate and the glass transition temperature of the second flexible film is less than or equal to 20° C.
  • the difference between the glass transition temperatures of the material of the first rigid substrate and the material of the second flexible film is set to be relatively small, which is conducive to sealing the first rigid substrate and the second flexible film into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.
  • the difference between the melting temperature of the material of the first rigid substrate and the melting temperature of the material of the first flexible film is less than or equal to 20° C. Setting the difference between the melting temperatures of the material of the first rigid substrate and the material of the first flexible film to be relatively small is conducive to sealing the first rigid substrate and the first flexible film into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.
  • the difference between the melting temperature of the material of the first rigid substrate and the melting temperature of the material of the second flexible film is less than or equal to 20° C. Setting the difference between the melting temperatures of the material of the first rigid substrate and the material of the second flexible film to be relatively small is conducive to sealing the first rigid substrate and the second flexible film into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.
  • At least one of the first flexible film and the second flexible film includes two sub-flexible film layers and an anti-evaporation layer located between the two sub-flexible film layers, and the anti-evaporation layer includes at least one of a polyimide layer, a polyvinylidene chloride layer, or a metal film layer.
  • the material of the sub-flexible film layer can be selected from any one of the materials of the first flexible film or the second flexible film mentioned above.
  • the material of the sub-flexible film layer can be selected from the polyethylene terephthalate copolymer mentioned above, referred to as PET copolymer.
  • the first flexible film and the second flexible film adopts a multi-layer film process, that is, the first flexible film and the second flexible film are set to a sandwich structure of "PET copolymer-X-PET copolymer", where the X layer refers to an anti-evaporation layer.
  • Polyimide, polyvinylidene chloride and metal film are materials with low water vapor permeability.
  • the anti-evaporation layer adopts the above materials to reduce the evaporation of water vapor in the first flexible film and the second flexible film.
  • a multi-layer co-extrusion technology or a multi-layer film pressing technology is used to realize a multi-layer film structure in the first flexible film and the second flexible film.
  • the metal film layer may be a copper film, a nickel film, an aluminum film or a metal-plastic composite film material, and the thickness is less than or equal to 10
  • this solution is conducive to ensuring that the first flexible film and the second flexible film meet the requirements of 100,000 to 400,000 bending tests at different bending angles.
  • At least one of the first flexible film and the second flexible film is provided with an inorganic oxide film on a surface away from the inner cavity.
  • the surfaces of the first flexible film and the second flexible film away from the inner cavity are not in direct contact with the cooling medium, they are both interfaces that the cooling medium must pass through when evaporating to the outside.
  • the provision of the inorganic oxide film is conducive to isolating water vapor and alleviating the evaporation problem of the cooling medium.
  • the liquid-cooling module also includes a second rigid substrate, which divides the inner cavity of the liquid-cooling module into a liquid inlet channel and a liquid outlet channel, the liquid cooling inlet is connected to the liquid inlet channel, the liquid cooling outlet is connected to the liquid outlet channel, and the two ends of the second rigid substrate are respectively integrated with the first flexible membrane and the second flexible membrane to form a sealing structure.
  • the two ends of the second rigid substrate respectively adopt an integrated sealing structure with the first flexible membrane and the second flexible membrane to improve the sealing performance and reliability. If the segmentation and sealing between the second rigid substrate and the first flexible membrane and the second flexible membrane leaks, the performance of the liquid cooling system will be greatly reduced and gradually fail.
  • the second rigid substrate is used to separate the flow channel of the inner cavity into an inlet channel and an outlet channel, and the inlet channel and the outlet channel are formed by the second rigid substrate and the first rigid substrate, the first flexible membrane and the second flexible membrane.
  • the inlet channel is connected to the liquid cooling inlet
  • the outlet channel is connected to the liquid cooling outlet.
  • the inlet channel and the outlet channel are separated by the second rigid substrate, which helps to avoid mixing of the cooling medium in the inlet channel and the outlet channel, thereby reducing the cooling efficiency.
  • Both ends of the second rigid substrate are integrated with the first flexible membrane and the second flexible membrane by hot pressing and sealing, which helps to improve the isolation effect between the inlet channel and the outlet channel, and can further improve the structural strength of the liquid cooling module.
  • liquid inlet channel and the liquid outlet channel are not two completely isolated parts.
  • the second rigid base only separates the liquid inlet channel and the liquid outlet channel adjacent to the pump.
  • the liquid inlet channel and the liquid outlet channel are connected in an area far away from the pump.
  • the two ends of the second rigid substrate are respectively discontinuous interfaces with the first flexible film and the second flexible film.
  • the two ends of the second rigid substrate and at least part of the first flexible film and the second flexible film are continuously fused into one, so as to form an integrated sealing structure.
  • the two ends of the second rigid substrate are completely continuously fused with the first flexible film and the second flexible film to form an integrated sealing structure, and there is no interface between the two ends of the second rigid substrate and the first flexible film, and there is no interface between the two ends of the second rigid substrate and the second flexible film, which is conducive to further improving the sealing effect.
  • the second rigid matrix includes a first sub-rigid matrix located below the pump and a second sub-rigid matrix located outside the pump, and the orthographic projection of the first sub-rigid matrix on the second flexible membrane does not overlap with the orthographic projection of the area enclosed by the edges of the liquid-cooling inlet and the liquid-cooling outlet on the second flexible membrane.
  • below the pump refers to the side of the pump close to the liquid cooling module along the thickness direction.
  • the orthographic projection of the first sub-rigid matrix on the second flexible membrane does not overlap with the orthographic projection of the area enclosed by the edges of the pump inlet and the pump outlet on the second flexible membrane.
  • the first sub-rigid matrix can be extended to a point outside the pump.
  • the second rigid substrate mainly serves to separate the liquid inlet and outlet channels, but the second rigid substrate cannot cause any obstruction to the cooling medium entering and exiting the pump chamber. Therefore, this scheme reduces the flow resistance of the cooling medium when passing through the liquid cooling inlet and the liquid cooling outlet by arranging the orthographic projection of the first sub-rigid substrate on the second flexible membrane and the area enclosed by the edges of the liquid cooling inlet and the liquid cooling outlet not overlapping with each other.
  • the first sub-rigid substrate is made of the same material as the first rigid substrate.
  • the first sub-rigid substrate is located below the pump. When the pump is working, the cooling liquid pumped out by the pump will exert impact pressure on the first sub-rigid substrate when it enters and exits the liquid cooling inlet and the liquid cooling outlet, which will cause the system performance to drop rapidly and fail quickly.
  • the first sub-rigid substrate is made of the same material as the first rigid substrate, so that the sealing effect and structural strength between the first sub-rigid substrate and the first flexible membrane and the second flexible membrane are the same as the sealing effect and structural strength between the first rigid substrate and the first flexible membrane and the second flexible membrane, effectively improving the sealing effect and structural strength between the first sub-rigid substrate and the first flexible membrane and the second flexible membrane, and preventing the liquid near the pump from impacting the first sub-rigid substrate and affecting the sealing effect.
  • the first sub-rigid substrate and the first rigid substrate are an integrated structure, which improves the sealing and reliability between the first sub-rigid substrate and the first rigid substrate.
  • the first sub-rigid substrate and the second sub-rigid substrate are an integrated structure, which improves the sealing and reliability between the first sub-rigid substrate and the second sub-rigid substrate.
  • the first rigid sub-base is simultaneously heat-pressed and welded with the first rigid base and the first flexible film or the second flexible film. This solution can improve the sealing effect and structural strength between the first rigid sub-base and the first flexible film or the second flexible film.
  • the second rigid substrate is in a strip shape as a whole. This solution can reduce processing costs, and the more regular shape of the second rigid substrate is conducive to reducing the flow resistance of the second rigid substrate to the cooling medium.
  • the first flexible membrane corresponding to the second rigid substrate in the thickness direction is an integrated sealing structure with the pump bottom wall. This solution can further ensure that the cooling medium in the liquid inlet flow channel and the liquid outlet flow channel does not short-circuit and mix.
  • the liquid cooling module further includes a third rigid substrate, which is distributed in the liquid inlet channel and the liquid outlet channel, and the two ends of the third rigid substrate are respectively integrated with the first flexible membrane and the second flexible membrane to form a sealing structure. If the segmentation and sealing between the third rigid substrate and the first flexible membrane and the second flexible membrane leaks, the performance of the liquid cooling system will be slightly reduced, but the entire liquid cooling system will not fail.
  • a plurality of third rigid substrates divide the liquid inlet flow channel into a plurality of interconnected liquid inlet sub-flow channels, and divide the liquid outlet flow channel into a plurality of interconnected liquid outlet sub-flow channels.
  • the third rigid substrate plays a role of guiding flow in the liquid inlet flow channel and the liquid outlet flow channel, respectively, reducing flow resistance and avoiding eddy current loss, which is conducive to enhancing the heat exchange effect of the cooling medium.
  • the third rigid substrate can be in a strip shape or a cylindrical shape as a whole.
  • the third rigid substrate in a strip shape is conducive to guiding the flow of the cooling medium, and the third rigid substrate in a cylindrical shape is conducive to enhancing the mixing of the cooling medium.
  • the third rigid substrate plays the role of both guiding and mixing flow
  • the third rigid substrate can be set in the area where the width of the liquid inlet or outlet channel suddenly changes, the area where the cooling medium flow direction suddenly changes, and the area adjacent to the liquid cooling inlet.
  • the two ends of the third rigid substrate are respectively discontinuous interfaces with the first flexible film and the second flexible film.
  • the two ends of the third rigid substrate and at least part of the first flexible film and the second flexible film are continuously fused into one, so as to form an integrated sealing structure.
  • the two ends of the third rigid substrate and the first flexible film and the second flexible film are all continuously fused into an integrated sealing structure, and there is no interface between the two ends of the third rigid substrate and the first flexible film, and there is no interface between the two ends of the second rigid substrate and the second flexible film, which can further improve the sealing effect.
  • the thickness of the first rigid substrate, the second rigid substrate, and the third rigid substrate are all less than the width of the liquid cooling module. Specifically, the ratio range of the thickness of the first rigid substrate, the second rigid substrate, and the third rigid substrate to the width of the liquid cooling module is greater than or equal to 0.1 and less than or equal to 0.2. The thickness of the first rigid substrate, the second rigid substrate, and the third rigid substrate are all less than the length of the liquid cooling module. Specifically, the ratio range of the thickness of the first rigid substrate, the second rigid substrate, and the third rigid substrate to the length of the liquid cooling module is greater than or equal to 10-5 and less than or equal to 0.2. This solution is conducive to ensuring the high strength of the liquid cooling module in the thickness direction and the flexibility of the liquid cooling module in the length and width directions.
  • the thicknesses of the first rigid substrate, the second rigid substrate, and the third rigid substrate are not equal.
  • the thickness refers to the dimension in the thickness direction.
  • the three rigid substrates are designed with unequal thicknesses.
  • the first flexible membrane or the second flexible membrane may also be provided with a liquid injection port and an air extraction port, etc.
  • the liquid injection port and the air extraction port are an integrated sealing structure with at least one of the three rigid substrates and the first flexible membrane or the second flexible membrane.
  • the liquid injection port is used to inject cooling medium into the inner cavity before cooling
  • the air extraction port is used to extract the gas in the inner cavity to avoid negative effects on the heat dissipation effect.
  • the liquid injection port and the air extraction port are integrally sealed and connected with at least one of the first rigid substrate, the second rigid substrate and the third rigid substrate, and the first flexible membrane or the second flexible membrane, which is conducive to avoiding leakage of the cooling medium in the liquid injection port and the air extraction port.
  • the liquid injection port, the air extraction port and the liquid cooling module are in the same plane, that is, between the first flexible membrane and the second flexible membrane.
  • the liquid-cooling module includes a liquid-cooling film bending zone, the liquid-cooling module is folded through the liquid-cooling film bending zone, at least one of the first rigid substrate, the second rigid substrate and the third rigid substrate is provided with a flexibility-enhancing structure, the flexibility-enhancing structure is located in the liquid-cooling film bending zone, and the flexibility-enhancing structure is used to improve the flexibility of the liquid-cooling film bending zone.
  • the first rigid substrate, the second rigid substrate and the third rigid substrate can enhance the strength of the liquid cooling module in the thickness direction due to their rigidity.
  • the bending portion of the liquid cooling module needs to have a certain flexibility. Therefore, this solution sets a flexibility enhancement structure in the bending area of the liquid cooling film of the liquid cooling module, which can reduce the resistance of the bending portion of the liquid cooling module when bending, and meet the folding requirements of the electronic device.
  • the flexibility enhancement structure may be at least one of a groove, a through hole, a through hole, and an opening.
  • the liquid cooling module further comprises a first liquid cooling film static area and a second liquid cooling film static area located on both sides of the liquid cooling film bending area.
  • first liquid cooling film static area and the second liquid cooling film static area do not deform.
  • the flexibility enhancement structure of the first rigid substrate includes a groove located on a side wall of the first rigid substrate, and the groove is located in a bending area of the liquid-cooling film.
  • the first rigid substrate is arranged around the edge of the liquid cooling module, and is a barrier between the cooling medium and the external environment. Therefore, the first rigid substrate needs to have a high structural strength to ensure the sealing effect, so that the cooling medium does not leak to the outside of the liquid cooling module.
  • the first rigid substrate located in the bending area of the liquid cooling film needs to take into account both structural strength and a certain degree of flexibility. Therefore, the flexibility enhancement structure arranged on the first rigid substrate is preferably a groove. If a through hole, through hole or opening is set on the first rigid substrate, there will be a risk of cooling medium leakage.
  • the flexibility enhancement structure of the second rigid substrate includes a through hole penetrating the second rigid substrate along a first direction, the through hole is located in the bending area of the liquid cooling film, and the first direction is the arrangement direction of the first flexible film and the second flexible film.
  • a through hole is provided in the second rigid substrate, which can improve the flexibility of the bent portion of the second rigid substrate. Since the two sides of the second rigid substrate are the liquid inlet channel and the liquid outlet channel respectively, the opening on the second rigid substrate cannot connect the cooling medium on both sides to avoid affecting the cooling effect due to mixed flow. Among them, the first direction A is also the thickness direction of the liquid cooling module.
  • the liquid-cooling module is provided with a through hole penetrating the second rigid substrate, the first flexible membrane and the second flexible membrane along the first direction, and the through hole is located in a bending area of the liquid-cooling membrane.
  • a through hole is provided in the second rigid substrate, which can improve the flexibility of the bending part of the second rigid substrate and reduce the rebound force and friction force of the bending area of the liquid cooling module when bending.
  • the first direction is the thickness direction of the liquid cooling module.
  • the through hole penetrates the second rigid substrate along the first direction without causing short circuit and mixed flow of the cooling medium in the liquid inlet and outlet channels.
  • the third rigid substrate can be opened to reduce the rebound force of the bending area of the liquid cooling module and the friction force with the screen and the middle frame when bending, and will not cause short circuit of the cooling medium flow.
  • the flexibility structure of the second rigid substrate includes through holes and through holes, or the flexibility structure of the second rigid substrate includes any one of through holes and through holes.
  • through holes and through holes can be flexibly arranged in the second rigid substrate according to actual conditions, thereby improving the practicality of the second rigid substrate in different application environments.
  • the flexibility enhancement structure of the third rigid substrate includes an opening located in the third rigid substrate, and the opening is connected to flow channels on both sides of the third rigid substrate.
  • this solution is set to set an opening in the third rigid substrate, which is equivalent to partially disconnecting the third rigid substrate at the position of the opening, inducing bending deformation at the designed position, and effectively reducing the stress generated during bending.
  • Part of the third rigid substrate is distributed in the liquid inlet channel, and part of the third rigid substrate is distributed in the liquid outlet channel, that is, the channels on both sides of the third rigid substrate belong to the same liquid inlet channel or the same liquid outlet channel, so the opening connects the two sides of the third rigid substrate without affecting the heat dissipation efficiency, and can increase the mixing effect of the cooling medium in the same flow direction in the liquid inlet channel or the liquid outlet channel, thereby improving the cooling effect.
  • the flexibility enhancement structure may extend along the flow direction of the cooling medium. In another embodiment, the flexibility enhancement structure may extend along the folding direction of the folding device. Setting the size of the flexibility enhancement structure in the extension direction to be larger can effectively improve the flexibility of the bending area of the liquid cooling film, reduce the rebound force of the bending area of the liquid cooling module and the friction force with the screen and the middle frame when bending, and thus improve the user experience of the folding device.
  • a lubricating material layer is applied on the surface of the first flexible film and the second flexible film away from the inner cavity, and the lubricating material layer is located in the bending area of the liquid-cooled film.
  • a lubricating material layer can also be provided on the outer surface of the first flexible film and the second flexible film to reduce the friction of the bending area of the liquid-cooled film when bending, so that the bending process can be carried out more smoothly.
  • the lubricating material layer includes, but is not limited to, solid, liquid or paste lubricating materials such as Teflon film, graphite film, graphene film or grease.
  • the lubricating material layer can be arranged only in the bending area of the liquid-cooled film, or it can be arranged simultaneously in at least one of the first liquid-cooled film static area and the second liquid-cooled film static area and the liquid-cooled film bending area.
  • the lubricating material layer can also enhance the heat dissipation effect and reduce the overall temperature of the cooling medium, thereby reducing the startup time and frequency of the pump.
  • the present application provides a liquid-cooling module, comprising a first flexible film, a second flexible film, and a first rigid substrate located between the first flexible film and the second flexible film, the first flexible film, the second flexible film, and the first rigid substrate enclose an inner cavity of the liquid-cooling module, and the difference between the glass transition temperature of the first rigid substrate and the glass transition temperature of the material of the first flexible film is less than or equal to 20°C.
  • the first flexible film and the second flexible film can reduce the difficulty of bending the electronic device.
  • the first rigid substrate is used to enhance the structural strength of the liquid cooling module in the thickness direction.
  • the first flexible film, the second flexible film and the first rigid substrate enclose an inner cavity, and the cooling medium flows in the inner cavity.
  • the two ends of the first rigid substrate and the first flexible film and the second flexible film form an integrated sealing structure, which is conducive to improving the sealing performance of the first rigid substrate and avoiding leakage of the cooling medium.
  • the difference in glass transition temperature between the material of the first rigid substrate and the material of the first flexible film is set to be small, which is conducive to sealing the first rigid substrate and the first flexible film into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.
  • the difference between the melting temperature of the material of the first rigid substrate and the melting temperature of the material of the first flexible film is less than or equal to 20° C. In this embodiment, the difference between the melting temperatures of the material of the first rigid substrate and the material of the first flexible film is set to be small, which is conducive to sealing the first rigid substrate and the first flexible film into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.
  • the present application provides a liquid-cooling module, the liquid-cooling module comprising a first flexible film, a second flexible film and a first rigid substrate located between the first flexible film and the second flexible film, the first flexible film, the second flexible film and the first rigid substrate enclose an inner cavity of the liquid-cooling module, the material of the first flexible film, the second flexible film and the first rigid substrate is selected from a flexible temperature-resistant polymer material with a breaking elongation greater than 10%, and the materials of the first flexible film, the second flexible film and the first rigid substrate are independently selected from polyethylene terephthalate copolymer, polyethylene naphthalate, polyethylene 2,5-furandicarboxylate, polyimide, poly At least one of ether ether ketone and biaxially stretched polypropylene.
  • the first flexible film and the second flexible film can reduce the difficulty of bending the electronic device.
  • the first rigid substrate is used to enhance the structural strength of the liquid cooling module in the thickness direction.
  • the first flexible film, the second flexible film and the first rigid substrate enclose an inner cavity, and the cooling medium flows in the inner cavity.
  • the two ends of the first rigid substrate and the first flexible film and the second flexible film form an integrated sealing structure, which is conducive to improving the sealing performance of the first rigid substrate and avoiding leakage of the cooling medium.
  • the materials selected for the first rigid substrate and the first flexible film or the second flexible film are conducive to the first rigid substrate and the first flexible film or the second flexible film being hot pressed to form an integrated sealing structure.
  • the first rigid substrate and the first flexible film or the second flexible film can be made of different materials as long as an integrated sealing structure can be formed between the first rigid substrate and the first flexible film or the second flexible film.
  • the present application provides a liquid cooling module, the liquid cooling module comprising a first flexible film, a second flexible film and a rigid substrate located between the first flexible film and the second flexible film.
  • the liquid cooling module comprises a liquid cooling film bending area, the liquid cooling module is folded through the liquid cooling film bending area, the rigid substrate is provided with a flexibility enhancement structure, the flexibility enhancement structure is located in the liquid cooling film bending area, and the flexibility enhancement structure is used to improve the flexibility of the liquid cooling film bending area.
  • the two ends of the rigid substrate are used to support the first flexible membrane and the second flexible membrane.
  • the provision of the rigid substrate in the liquid-cooling module is beneficial to improving the structural strength of the liquid-cooling module in the thickness direction.
  • the flexibility enhancement structure may be at least one of a groove, a through hole, a through hole, and an opening.
  • the rigid substrate may include a first rigid substrate, a second rigid substrate, and a third rigid substrate.
  • the present application provides an electronic device, the electronic device comprising the liquid cooling module as described in any one of the implementations of the first aspect, the liquid cooling module being located in the electronic device. In one implementation, the liquid cooling module is located in an accessory of the electronic device. In one implementation, the electronic device comprises the liquid cooling module as described in any one of the second, third, and fourth aspects, the liquid cooling module being located in the electronic device. In one implementation, the liquid cooling module is located in an accessory of the electronic device.
  • the electronic device includes a first non-folding portion, a folding portion, and a second non-folding portion, the second non-folding portion can be folded toward the first non-folding portion through the folding portion
  • the liquid-cooling module includes a liquid-cooling film bending zone, and when the electronic device is folded, the liquid-cooling module is folded through the liquid-cooling film bending zone, and at least one of the first rigid substrate, the second rigid substrate, and the third rigid substrate is provided with a flexibility-enhancing structure, and the flexibility-enhancing structure is located in the liquid-cooling film bending zone, and the flexibility-enhancing structure is used to improve the flexibility of the liquid-cooling film bending zone.
  • the beneficial effects of the present application are as follows: On foldable electronic devices, the equivalent thermal conductivity of the liquid cooling film group can reach more than 5000W/m-K, which is more than 100% higher than the heat dissipation capacity of cross-axis/through-axis graphite heat dissipation materials; the liquid cooling system can be extremely simplified in processing and manufacturing, with no assembly leakage and high flexibility.
  • FIG. 1a is a schematic structural diagram of a liquid cooling module provided in a first embodiment of the present application
  • FIG1b is a partial enlarged view of portion P in FIG1a;
  • FIG. 1c is a physical schematic diagram of the pump portion of the liquid cooling module provided in the first embodiment of the present application.
  • FIG2 is a cross-sectional view of a liquid cooling module provided in the first embodiment of the present application.
  • FIG3 is a cross-sectional view of a liquid cooling module provided in the first embodiment of the present application.
  • FIG4 is a top view of a liquid cooling module provided in the first embodiment of the present application.
  • FIG5 is a cross-sectional view of a liquid cooling module provided in the first embodiment of the present application.
  • FIG6 is a cross-sectional view of a liquid cooling module provided in the first embodiment of the present application.
  • FIG7 is an exploded view of a stacked structure of a pump portion provided in the first embodiment of the present application.
  • FIG8 is a cross-sectional view of a liquid cooling module provided in the first embodiment of the present application.
  • FIG9 is a cross-sectional view of a liquid cooling module provided in the first embodiment of the present application.
  • FIG10 is a side view of the pump and the second rigid substrate provided in the first embodiment of the present application.
  • FIG11 is a cross-sectional view of a liquid cooling module provided in the first embodiment of the present application.
  • FIG12 is a cross-sectional view of a liquid cooling module provided in the first embodiment of the present application.
  • FIG13 is a cross-sectional view of a first flexible film provided in the first embodiment of the present application.
  • FIG14 is a cross-sectional view of a liquid cooling module provided in the first embodiment of the present application.
  • FIG15 is a partial enlarged view of the liquid cooling module shown in FIG1a;
  • FIG16 is a cross-sectional view of a liquid cooling module provided in the first embodiment of the present application.
  • FIG17 is a cross-sectional view of a liquid cooling module provided in the first embodiment of the present application.
  • FIG18 is a cross-sectional view of a liquid cooling module provided in the first embodiment of the present application.
  • FIG19 is a cross-sectional view of a liquid cooling module provided in the first embodiment of the present application.
  • FIG20 is a schematic diagram of the structure of an electronic device provided in the first embodiment of the present application.
  • FIG21 is a schematic diagram of the structure of an electronic device provided in a second embodiment of the present application.
  • FIG22 is a schematic diagram of the structure of an electronic device provided in a second embodiment of the present application.
  • FIG23 is a schematic diagram of the structure of an electronic device provided in a third embodiment of the present application.
  • FIG24 is a schematic diagram of a partial structure of a liquid cooling module provided in a third embodiment of the present application.
  • FIG25 is a schematic diagram of the structure of a liquid cooling module and a flexible circuit board provided in a third embodiment of the present application.
  • FIG26 is a schematic structural diagram of a liquid cooling module provided in a fourth embodiment of the present application.
  • FIG27 is a schematic diagram of the structure of an electronic device provided by an embodiment of the present application.
  • FIG28 is a schematic structural diagram of an electronic device provided in a fifth embodiment of the present application.
  • FIG. 29 is a schematic diagram of a liquid cooling module provided in an embodiment of the present application.
  • PET polyethylene terephthalate
  • Glass transition temperature refers to the temperature corresponding to the transition from glass state to highly elastic state. A high glass transition temperature indicates that the material has good heat resistance.
  • the embodiment of the present application provides a liquid cooling module, which includes a pump and a liquid cooling module.
  • the pump is used to provide power for the cooling medium in the liquid cooling module.
  • the pump includes a pump base and a piezoelectric component.
  • the pump base is provided with a pump inlet and a pump outlet.
  • the liquid cooling module includes a liquid cooling outlet and a liquid cooling inlet.
  • the liquid cooling outlet is connected to the pump inlet.
  • the liquid cooling inlet is connected to the pump outlet.
  • Part of the liquid cooling module around the liquid cooling outlet is made of the same or similar material as part of the pump base around the pump inlet, which is an integrated sealed welding structure without solder paste or other third materials.
  • Part of the liquid cooling module around the liquid cooling inlet is made of the same or similar material as part of the pump base around the pump outlet, which is an integrated sealed welding structure without solder paste or other third materials.
  • This integrated sealed welding method includes welding methods without solder paste or other third materials such as hot pressing bonding sealing welding, hot melt welding, ultrasonic welding, and ultra-frequency welding.
  • the liquid cooling module is composed of a first flexible film (elongation at break>10%), a second flexible film (elongation at break>10%), a first rigid substrate, a second rigid substrate, a third rigid substrate, etc.
  • the first rigid substrate and the second rigid substrate are made of the same or similar materials as the first flexible film and the second flexible film, and the seal therebetween adopts an integrated sealing welding structure without solder paste or other third materials.
  • This integrated sealing welding includes welding methods such as hot compression bonding sealing welding, hot melt welding, ultrasonic welding, and ultra-frequency welding without solder paste or other third materials.
  • the integrated welding seal between the pump and the liquid cooling module and the liquid cooling module has no assembly leakage, is resistant to bending and impact, adapts to changes in system pressure and volume, greatly simplifies design and manufacturing, and can avoid leakage of cooling medium due to sealing problems, thereby improving the stability of the overall structure of the liquid cooling module and the safety performance of electronic equipment.
  • liquid cooling module provided in the embodiments of the present application will be described in detail below.
  • Figure 1a is a structural schematic diagram of the liquid cooling module 10 provided in the first embodiment of the present application
  • Figure 1b is a local enlarged diagram of part P in Figure 1a
  • Figure 1c is a physical schematic diagram of the pump part of the liquid cooling module provided in the first embodiment of the present application
  • Figure 2 is a cross-sectional view of the liquid cooling module 10 provided in the first embodiment of the present application.
  • the liquid cooling module 10 includes a pump 200 and a liquid cooling module 100 (as shown in FIG. 1a and FIG. 2 ).
  • the pump 200 includes a pump base 210 and a piezoelectric component 220, etc.
  • the pump base 210 is provided with a pump inlet 211 and a pump outlet 212 (as shown in FIG. 2 ).
  • the liquid cooling module 100 includes a liquid cooling outlet 111 and a liquid cooling inlet 112 (as shown in FIG. 2 ).
  • the liquid cooling outlet 111 is used to communicate with the pump inlet 211.
  • the liquid cooling inlet 112 is used to communicate with the pump outlet 212.
  • Part of the liquid cooling module 100 around the liquid cooling outlet 111 and part of the pump base 210 around the pump inlet 211 are an integrated sealing structure (as shown in FIG. 2 ). Part of the liquid cooling module 100 around the liquid cooling inlet 112 and part of the pump base 210 around the pump outlet 212 are sealed.
  • the pump base 210 on the side is an integrated sealing structure (as shown in FIG. 2 ). The pump and the liquid cooling module can assist in dispensing glue to strengthen the structural positioning and strength, but it is not a sealed welding surface.
  • the pump 200 as the power source of the liquid cooling module 10, can provide the power for the cooling medium in the liquid cooling module 100 to flow and circulate, realize active liquid cooling, and thus achieve the effect of long-lasting heat dissipation.
  • active liquid cooling can adjust the speed of the pump 200 as needed to achieve the best heat dissipation effect, while passive liquid cooling can only passively follow the change of device temperature to dissipate heat, so active liquid cooling has better adjustability.
  • liquid cooling outlet 111 is used to communicate with the pump inlet 211, which does not mean that the liquid cooling outlet 111 and the pump inlet 211 are always connected, but only indicates that under certain conditions, the cooling medium can flow from the liquid cooling outlet 111 into the pump inlet 211.
  • the relationship between the liquid cooling inlet 112 and the pump outlet 212 is similar.
  • part of the liquid cooling module 100 around the liquid cooling outlet 111 and part of the pump base 210 around the pump inlet 211 are an integrated sealing structure
  • part of the liquid cooling module 100 around the liquid cooling inlet 112 and part of the pump base 210 around the pump outlet 212 are an integrated sealing structure.
  • forming an integrated sealing structure means that there is no continuous interface between the two due to mutual fusion and penetration, and the surrounding side of the liquid cooling outlet 111 refers to the adjacent area around the liquid cooling outlet 111.
  • the fixing method of screw connection is not convenient for quality control because the tightness of the screw connection (i.e., the sealing effect) is limited by various factors such as assembly accuracy and the resilience of the material itself. In actual use, it may cause leakage of the cooling medium, thereby affecting the heat dissipation efficiency of the cooling medium and damaging the internal components. It is usually necessary to set a base in the pump 200, and the screws pass through the base and the liquid cooling module 100 in turn to achieve fixation.
  • the integrated sealing structure in the embodiment of the present application integrates part of the liquid cooling module 100 on the side of the liquid cooling outlet 111 and part of the pump base 210 on the side of the pump inlet 211 into one, and the connection relationship is tighter, which is conducive to improving the sealing effect of the pump base 210 and the liquid cooling module 100, and there is no need to add an additional base, simplifying the structure of the liquid cooling module 10, reducing costs and processing difficulty, and achieving an ultra-thin design.
  • the liquid cooling module 10 provided in the embodiment of the present application can be applied to electronic equipment.
  • the use of screw fixation may cause the connection between the pump base 210 and the liquid cooling module 100 to loosen, or the O-ring to shift and the local seal to be loose.
  • the integrated sealing structure makes it difficult for relative displacement to occur between the pump base 210 and the liquid cooling module 100, which is beneficial to improving the stability of the overall structure of the liquid cooling module 10 and increasing the service life of the electronic equipment.
  • the pump 200 is used to provide power for the flow and circulation of the cooling medium, and active heat dissipation is achieved in the liquid cooling module 10.
  • active heat dissipation is achieved in the liquid cooling module 10.
  • passive liquid cooling it can more effectively reduce the temperature of the device and improve the heat dissipation efficiency.
  • the area around the liquid cooling outlet 111 in the liquid cooling module 100 and the area around the pump inlet 211 in the pump base 210 are an integrated sealing structure
  • the area around the liquid cooling inlet 112 in the liquid cooling module 100 and the area around the pump outlet 212 in the pump base 210 are an integrated sealing structure.
  • the integrated sealing structure has a better sealing effect and can prevent leakage of the cooling medium, thereby avoiding reducing the heat dissipation efficiency of the cooling medium and protecting the device from damage.
  • the centers of the liquid cooling outlet 111 and the pump inlet 211 are aligned in the thickness direction A of the liquid cooling module 10, and the projections of the areas surrounded by the peripheral walls of the liquid cooling outlet 111 and the pump inlet 211 along the thickness direction A overlap.
  • the centers of the liquid cooling inlet 112 and the pump outlet 212 are aligned in the thickness direction A of the liquid cooling module 10, and the projections of the areas surrounded by the peripheral walls of the liquid cooling inlet 112 and the pump outlet 212 along the thickness direction A overlap.
  • This solution is conducive to reducing the flow resistance of the cooling medium when passing through the liquid cooling inlet 112 and the pump outlet 212, thereby improving the cooling efficiency.
  • Figure 3 is a cross-sectional view of the liquid cooling module 10 provided in the first embodiment of the present application
  • Figure 4 is a top view of the liquid cooling module 10 provided in the first embodiment of the present application.
  • at least a portion of the liquid cooling module 100 on the side of the liquid cooling outlet 111 and at least a portion of the pump base 210 on the side of the pump inlet 211 are continuously fused into one along the circumferential direction D of the liquid cooling outlet 111 (as shown in combination with Figures 3 and 4) to form an integrated sealing structure.
  • the integrated sealing structure needs to be continuously fused along the circumference of the liquid-cooling outlet 111 to form an integrated sealing structure M, as shown in the annular shaded area in Figure 4.
  • M can be an ellipse, a square, a triangle, or an irregular shape.
  • the circumference of the liquid-cooling outlet 111 forms an integrated sealing structure along the radial direction E. It should be noted that continuous fusion can be set only at one or several positions on the circumference of the liquid-cooling outlet 111 along the circumferential direction D, and there is no integrated sealing welding structure of a third material.
  • FIG. 5 is a cross-sectional view of the liquid cooling module 10 provided in the first embodiment of the present application
  • FIG. 6 is a cross-sectional view of the liquid cooling module 10 provided in the first embodiment of the present application.
  • a portion of the liquid cooling module 100 on the side of the liquid cooling outlet 111 and a portion of the pump base 210 on the side of the pump inlet 211 may have a discontinuous interface, and the interface The spacing between them is not limited (as shown in FIG. 3 and FIG. 5 ), wherein the position without interface is an integrated sealing structure.
  • no interface is formed between the part of the liquid-cooling module 100 on the side of the liquid-cooling outlet 111 and the part of the pump base 210 on the side of the pump inlet 211 (as shown in FIG. 6 ), which is the preferred processing technology with the best sealing effect.
  • the radial direction E and the circumferential direction D are determined based on the liquid cooling outlet 111 being circular.
  • the radial direction E can be understood as the direction from the center of the liquid cooling outlet 111 to a certain position on the circumferential side.
  • At least a portion of the liquid cooling module 100 on the side of the liquid cooling inlet 112 and at least a portion of the pump base 210 on the side of the pump outlet 212 are continuously fused together along the circumference of the liquid cooling inlet 112 to form an integrated sealing structure.
  • the integrated sealing structure on the side of the liquid cooling inlet 112 is continuously fused together along the circumference of the liquid cooling inlet 112.
  • the pump 200 also includes a piezoelectric component 220, which is fixed to the pump base 210.
  • the pump base 210 includes a pump bottom wall 213.
  • the pump bottom wall 213, the piezoelectric component 220, and a portion of the pump base 210 therebetween form a pump cavity 214.
  • the pump inlet 211 and the pump outlet 212 are disposed on the pump bottom wall 213 and are connected to the pump cavity 214.
  • the pump bottom wall 213 and a portion of the liquid cooling module 100 on the side surrounding the liquid cooling outlet 111 and the side surrounding the liquid cooling inlet 112 form an integrated sealing structure.
  • the piezoelectric component 220 utilizes the inverse piezoelectric effect of piezoelectric materials.
  • Piezoelectric materials refer to crystalline materials that will produce voltage between the two end faces when subjected to pressure.
  • the inverse piezoelectric effect refers to the mechanical deformation or mechanical pressure of the piezoelectric component 220 in a certain direction after an electric field is applied to the piezoelectric component 220. When the external electric field is removed, these deformations or stresses also disappear.
  • the piezoelectric component 220 used in the pump 200 has the characteristics of small size, high energy density and no electromagnetic interference, and can realize the precise delivery and control of the cooling medium.
  • the piezoelectric component 220 includes piezoelectric ceramics, a metal substrate and a plastic partition (to prevent the metal substrate from being corroded by the liquid working medium).
  • connection relationship between the pump inlet 211 and the pump cavity 214 is similar to the connection relationship between the liquid cooling outlet 111 and the pump inlet 211, that is, the pump inlet 211 and the pump cavity 214 are not always connected, but under the drive of the piezoelectric component 220, the cooling medium enters the pump cavity 214 through the liquid cooling outlet 111 and the pump inlet 211.
  • the connection relationship between the pump outlet 212 and the pump cavity 214 is similar.
  • the pump inlet 211 and the pump outlet 212 are both arranged on the pump bottom wall 213, and the part of the pump bottom wall 213 and the part of the liquid cooling module 100 located on the periphery of the pump inlet 211 and the pump outlet 212 are an integrated sealing structure, that is, there is no need to add an additional base to the pump 200. If a base is provided in the pump 200, on the one hand, the base can only be fixed to the liquid cooling module 100 by screws, which has a poor sealing effect and is prone to leakage of the cooling medium. On the other hand, it is usually necessary to provide the pump liquid inlet 211 and the pump liquid outlet 212 on the outside of the base, which lengthens the flow path of the cooling medium and reduces the heat dissipation efficiency of the cooling medium.
  • the liquid cooling module 10 includes two pumps 200 connected in parallel.
  • the two pumps 200 connected in parallel can achieve a larger flow rate.
  • the liquid cooling module 10 includes two pumps 200 connected in series.
  • the two pumps 200 connected in series can achieve a larger driving pressure.
  • the liquid cooling module 10 may include multiple pumps 200, and the multiple pumps 200 may be distributed in different positions in the liquid cooling module 10, which can be specifically set according to needs.
  • the pump 200 further includes a liquid inlet valve membrane 230 and a liquid outlet valve membrane 240 fixed to the pump bottom wall 213.
  • the liquid inlet valve membrane 230 is used to close or open the pump liquid inlet 211
  • the liquid outlet valve membrane 240 is used to close or open the pump liquid outlet 212.
  • the piezoelectric component 220 is used to deform after receiving an electrical signal, and the volume of the pump cavity 214 increases, driving the liquid inlet valve membrane 230 to open and the liquid outlet valve membrane 240 to close, providing power for the cooling medium in the liquid cooling module 100, so that the cooling medium enters the pump cavity 214 from the liquid cooling outlet 111 and the pump liquid inlet 211 in turn.
  • the piezoelectric component 220 is used to generate deformation after receiving the electrical signal, and the volume of the pump chamber 214 becomes smaller, driving the liquid inlet valve membrane 230 to close and the liquid outlet valve membrane 240 to open, providing power for the cooling medium in the liquid cooling module 100, so that the cooling medium enters the liquid cooling module 100 from the pump outlet 212 and the liquid cooling inlet 112 in turn.
  • the inlet valve membrane 230 is located along the thickness direction A on the side of the pump inlet 211 away from the liquid cooling outlet 111, and the outlet valve membrane 240 is located along the thickness direction A between the pump outlet 212 and the liquid cooling inlet 112.
  • the inlet valve membrane 230 is located along the thickness direction A between the pump inlet 211 and the pump chamber 214, and the outlet valve membrane 240 is located along the thickness direction A on the side of the liquid cooling inlet 112 away from the pump outlet 212.
  • the liquid cooling module 10 in the embodiment of the present application can not only cool the components of the electronic device, but also optimize the performance of the pump 200 contained in the liquid cooling module 10 itself.
  • the pump base 210 also includes a pump side wall 215 located between the pump bottom wall 213 and the piezoelectric component 220, and the pump side wall 215 is an integrated sealing structure.
  • the pump side wall 215 extends along the thickness direction A of the liquid cooling module 10. Since the pump side wall 215, the pump bottom wall 213, and the piezoelectric component 220 together enclose the pump cavity 214, the present solution sets the pump side wall 215 as an integrated sealing structure, which can effectively prevent the cooling medium from leaking from the pump side wall 215 and improve the sealing performance of the pump base 210.
  • the pump side wall 215 forms an integrated sealing structure by hot pressing. Hot pressing can be a welding method without solder paste or other third materials such as hot pressing bonding sealing welding, hot melt welding, ultrasonic welding, and ultra-high frequency welding.
  • FIG 7 is an exploded view of the pump stacking structure provided in the first embodiment of the present application.
  • the layers of the pump base body are sealed and welded by thermocompression bonding, hot melt welding, ultrasonic welding, ultra-frequency welding, etc. without solder paste or other third materials.
  • the pump base 210 includes a pump chamber layer 216, a first flow channel layer 217, a valve sheet layer 218 and a second flow channel layer 219 which are stacked along a thickness direction A, a cavity hole 2161 is provided in the pump chamber layer 216, a pump outlet 212 and a first guide channel 2171 corresponding to the pump inlet 211 are provided in the first flow channel layer 217, the first flow channel layer 217 is communicated with the cavity hole 2161 in the pump chamber layer 216, an openable and closable inlet valve membrane 230 and an outlet valve membrane 240 are provided in the valve sheet layer 218, a pump inlet 211 and a second guide channel 2191 corresponding to the pump outlet 212 are provided in the second flow channel layer 219, the second flow channel layer 219 is communicated with the liquid cooling module 100, and the pump chamber layer 216, the first flow channel layer 217, the valve sheet layer 218 and the second flow channel layer 219 are formed into an integrated sealing structure by hot pressing.
  • the pump inlet 211, the inlet valve membrane 230 and the first guide channel 2171 are correspondingly arranged in the thickness direction A of the liquid cooling module 10
  • the pump outlet 212, the outlet valve membrane 240 and the second guide channel 2191 are correspondingly arranged in the thickness direction A of the liquid cooling module 10.
  • the cooling medium enters the pump cavity 214 from the pump inlet 211 through the inlet valve membrane 230 and the first guide channel 2171 in sequence, and when the outlet valve membrane 240 is opened and the inlet valve membrane 230 is closed, the cooling medium enters the liquid cooling module 100 from the pump outlet 212 through the outlet valve membrane 240 and the second guide channel 2191 in sequence.
  • the projection area of the area surrounded by the peripheral wall of the first guide channel 2171 along the thickness direction A is larger than the projection area of the area surrounded by the peripheral wall of the pump inlet 211 along the thickness direction A, which is conducive to preventing the cooling medium from flowing back to the pump inlet 211, and exerting the guiding effect of the first guide channel 2171 on the cooling medium.
  • the projection area of the area surrounded by the peripheral wall of the second guide channel 2191 along the thickness direction A is larger than the projection area of the area surrounded by the peripheral wall of the pump outlet 212 along the thickness direction A, which is conducive to preventing the cooling medium from flowing back to the pump 200 inlet and outlet, and exerting the guiding effect of the second guide channel 2191 on the cooling medium.
  • the edges of the pump chamber layer 216, the first flow channel layer 217, the valve sheet layer 218 and the second flow channel layer 219 are hot pressed to form the pump side wall 215 (as shown in combination with Figures 2 and 7), so that each layer is sealed, thereby improving the sealing effect of the pump base 210.
  • the liquid cooling module 100 includes a first flexible membrane 110, a liquid cooling outlet 111 and a liquid cooling inlet 112 are arranged on the first flexible membrane 110, and the pump bottom wall 213 and a portion of the first flexible membrane 110 around the liquid cooling outlet 111 and the liquid cooling inlet 112 are an integrated sealing structure.
  • the fixed connection between the liquid cooling module 100 and the pump 200 is actually the fixed connection between the first flexible membrane 110 and the pump bottom wall 213.
  • the first flexible membrane 110 which is located around the liquid cooling outlet 111 and the liquid cooling inlet 112, forms an integrated sealing structure with the pump bottom wall 213. Since the first flexible membrane 110 and the pump bottom wall 213 are made of the same or similar materials, the difficulty of hot pressing is relatively small, which is conducive to forming an integrated sealing structure.
  • the first flexible membrane 110 is an integrated sealing structure with the pump bottom wall 213 except for the liquid cooling outlet 111 and the liquid cooling inlet 112, and there is no interface between the two.
  • This sealing interface is a preferred sealing interface with stronger flexibility, sealing and impact resistance.
  • it is difficult to achieve perfect processing in engineering, and it is more of a partially continuous fusion interface, and there is a micro air gap or a non-welding area of discontinuous contact between the interfaces.
  • adhesive sealing may be used at the connection position between the pump 200 and the liquid cooling module 100 to improve the sealing performance and reliability.
  • the liquid cooling module 100 further includes a second flexible film 120 and a first rigid substrate 130 located between the first flexible film 110 and the second flexible film 120.
  • the first flexible film 110, the second flexible film 120 and the first rigid substrate 130 enclose an inner cavity 140 of the liquid cooling module 100.
  • the two ends of the first rigid substrate 130 are respectively integrated with the first flexible film 110 and the second flexible film 120 to form a sealing structure.
  • the two interface materials of the sealing welding between the first rigid substrate 130 and the first flexible film 110 and the second flexible film 120 are the same or similar.
  • the welding method without solder paste or other third materials such as thermal compression bonding sealing welding, hot melt welding, ultrasonic welding, and ultra-frequency welding can improve the sealing and reliability between the first rigid substrate 130 and the first flexible film 110 and the second flexible film 120.
  • the first flexible film 110 and the second flexible film 120 are flexible and have good bending performance, and are suitable for the case where the liquid cooling module 100 needs to be bent.
  • a first rigid substrate 130 is arranged between the first flexible film 110 and the second flexible film 120, and the two ends of the first rigid substrate 130 are used to support the first flexible film 110 and the second flexible film 120, which is conducive to improving the overall strength of the liquid cooling module 100 in the thickness direction A.
  • the cooling medium flows in the inner cavity 140 surrounded by the first flexible film 110, the second flexible film 120 and the first rigid substrate 130.
  • the two ends of the first rigid substrate 130 are respectively integrated with the first flexible film 110 and the second flexible film 120 to form a sealing structure, which can improve the sealing of the inner cavity 140 and prevent the cooling medium in the inner cavity 140 from leaking.
  • the two ends of the first rigid substrate 130 are respectively formed as discontinuous interfaces with the first flexible film 110 and the second flexible film 120.
  • the two ends of the first rigid substrate 130 and at least part of the first flexible film 110 and the second flexible film 120 are continuously fused into one body to form an integrated sealing structure.
  • the two ends of the first rigid substrate 130 and the first flexible film 110 and the second flexible film 120 are all continuously fused into an integrated sealing structure, and there is no interface between the two ends of the first rigid substrate 130 and the first flexible film 110, and there is no interface between the two ends of the first rigid substrate 130 and the second flexible film 120.
  • the first rigid substrate 130 is disposed around the edges of the first flexible membrane 110 and the second flexible membrane 120 (as shown in FIG. 1a ). This solution is conducive to improving the strength of the edge of the liquid cooling module 100 in the thickness direction A, and the integrated sealing structure can effectively prevent the cooling medium from leaking at the edge of the liquid cooling module 100.
  • the thickness of the first flexible film 110 and the second flexible film 120 is less than the length and width of the liquid cooling module 10. Specifically, the ratio of the thickness of the first flexible film 110 and the second flexible film 120 to the length of the liquid cooling module 10 is less than or equal to 0.2, and the ratio of the thickness of the first flexible film 110 and the second flexible film 120 to the width of the liquid cooling module 10 is less than or equal to 0.2.
  • this solution can ensure the flexibility of the first flexible film 110 and the second flexible film 120 in the bending direction, reducing the difficulty of bending the device.
  • the material of the first flexible film 110 and the second flexible film 120 is a material with an elongation at break higher than 10%, such as polymer PET, PP, PPS, PEN or modified film materials thereof, so as to adapt to system pressure fluctuations and bending.
  • the material of the first flexible film 110 and the second flexible film 120 is a material with an elongation at break higher than 50%.
  • the surface of the first flexible film 110 and the second flexible film 120 is treated with an anti-evaporation coating, such as coating a flexible inorganic oxide film on the surface of the polymer film to isolate water vapor.
  • the specific coating method can be physical vapor deposition (PVD), chemical vapor deposition (CVD), atomic layer deposition (ALD) and other process means.
  • the liquid cooling module 100 also includes a second rigid substrate 150.
  • the second rigid substrate 150 divides the inner cavity 140 of the liquid cooling module 100 into a liquid inlet channel 142 and a liquid outlet channel 141.
  • the liquid cooling inlet 112 is connected to the liquid inlet channel 142
  • the liquid cooling outlet 111 is connected to the liquid outlet channel 141.
  • the two ends of the second rigid substrate 150 are respectively integrated with the first flexible membrane 110 and the second flexible membrane 120 to form an integrated sealing structure. If the division and sealing between the second rigid substrate 150 and the first flexible membrane 110 and the second flexible membrane 120 leak, the performance of the liquid cooling system will be greatly reduced and gradually fail.
  • the two ends of the second rigid substrate 150 are respectively integrated with the first flexible membrane 110 and the second flexible membrane 120 to improve the sealing performance and reliability.
  • the second rigid substrate 150 is used to separate the flow channel of the inner cavity 140 into an inlet channel 142 and an outlet channel 141, and the inlet channel 142 and the outlet channel 141 are formed by the second rigid substrate 150, the first rigid substrate 130, the first flexible membrane 110 and the second flexible membrane 120.
  • the inlet channel 142 is connected to the liquid cooling inlet 112
  • the outlet channel 141 is connected to the liquid cooling outlet 111.
  • the inlet channel 142 and the outlet channel 141 are separated by the second rigid substrate 150, which is conducive to preventing the cooling medium in the inlet channel 142 and the outlet channel 141 from mixing and thus reducing the cooling efficiency.
  • Both ends of the second rigid substrate 150 are integrally heat-pressed and sealed with the first flexible membrane 110 and the second flexible membrane 120 , which is beneficial to improving the isolation effect between the liquid inlet channel 142 and the liquid outlet channel 141 and can further improve the structural strength of the liquid cooling module 100 .
  • the liquid inlet channel 142 and the liquid outlet channel 141 are not two completely isolated parts.
  • the second rigid base 150 only separates the liquid inlet channel 142 and the liquid outlet channel 141 adjacent to the pump 200.
  • the liquid inlet channel 142 and the liquid outlet channel 141 are connected in an area away from the pump 200.
  • the liquid inlet channel 142 and the liquid outlet channel 141 are connected in a relatively narrow end area.
  • the two ends of the second rigid substrate 150 are respectively formed as discontinuous interfaces with the first flexible film 110 and the second flexible film 120.
  • the two ends of the second rigid substrate 150 and at least part of the first flexible film 110 and the second flexible film 120 are continuously fused into one body to form an integrated sealing structure.
  • the two ends of the second rigid substrate 150 and the first flexible film 110 and the second flexible film 120 are all continuously fused into an integrated sealing structure, and there is no interface between the two ends of the second rigid substrate 150 and the first flexible film 110, and there is no interface between the two ends of the second rigid substrate 150 and the second flexible film 120.
  • FIG. 10 is a side view of the pump 200 and the second rigid substrate 150 provided in the first embodiment of the present application.
  • the second rigid substrate 150 includes a first sub-rigid substrate 151 located below the pump 200 and a second sub-rigid substrate 152 located outside the pump 200 (as shown in FIG. 10).
  • the orthographic projection of the first sub-rigid substrate 151 on the second flexible film 120 does not overlap with the orthographic projection of the area enclosed by the edges of the liquid-cooling inlet 112 and the liquid-cooling outlet 111 on the second flexible film 120 (as shown in FIG. 2).
  • the bottom of the pump 200 refers to the side of the pump 200 close to the liquid-cooling module 100 along the thickness direction A.
  • the orthographic projection of the first sub-rigid substrate 151 on the second flexible film 120 does not overlap with the orthographic projection of the area enclosed by the edges of the pump inlet 211 and the pump outlet 212 on the second flexible film 120.
  • the first sub-rigid matrix 151 can be extended to a point outside the pump 200, as shown in FIG. 1a, and the length of the first sub-rigid matrix 151 along the left-right direction in FIG. 1a is greater than the length of the pump 200 along the left-right direction.
  • the first sub-rigid substrate 151 is made of the same material as the first rigid substrate 130 (as shown in FIG. 1a and FIG. 1b ).
  • a sub-rigid substrate 151 is located below the pump 200. When the cooling liquid pumped out by the pump 200 enters and exits the liquid cooling inlet 112 and the liquid cooling outlet 111 during operation, it will exert impact pressure on the first sub-rigid substrate 151, which will cause the system performance to drop rapidly and fail rapidly.
  • the first sub-rigid substrate 151 is made of the same material as the first rigid substrate 130, so that the sealing effect and structural strength between the first sub-rigid substrate 151 and the first flexible membrane 110 and the second flexible membrane 120 are the same as the sealing effect and structural strength between the first rigid substrate 130 and the first flexible membrane 110 and the second flexible membrane 120, effectively improving the sealing effect and structural strength between the first sub-rigid substrate 151 and the first flexible membrane 110 and the second flexible membrane 120, and preventing the liquid near the pump 200 from impacting the first sub-rigid substrate 151 and affecting the sealing effect.
  • the first sub-rigid substrate 151 and the first rigid substrate 130 are an integrated structure, as shown in FIG1a , which improves the sealing and reliability between the first sub-rigid substrate 151 and the first rigid substrate 130.
  • the first sub-rigid substrate 151 and the second sub-rigid substrate 152 are an integrated structure, which improves the sealing and reliability between the first sub-rigid substrate 151 and the second sub-rigid substrate 152.
  • first rigid sub-base 151 and the first rigid base 130 are simultaneously heat-pressed welded with the first flexible film 110 or the second flexible film 120 to improve the sealing effect and structural strength between the first rigid sub-base 151 and the first flexible film 110 or the second flexible film 120 .
  • the second rigid substrate 150 is in a strip shape as a whole. This solution can reduce the processing cost, and the relatively regular shape of the second rigid substrate 150 is conducive to reducing the flow resistance of the second rigid substrate 150 to the cooling medium.
  • an integrated sealing structure is formed between the first flexible membrane 110 and the pump bottom wall 213 which are arranged corresponding to the second rigid substrate 150 in the thickness direction A. This solution can further ensure that the cooling medium in the liquid inlet channel 142 and the liquid outlet channel 141 does not short-circuit or mix.
  • the liquid cooling module 100 further includes a third rigid substrate 160, which is distributed in the liquid inlet channel 142 and the liquid outlet channel 141.
  • the two ends of the third rigid substrate 160 are respectively integrated with the first flexible membrane 110 and the second flexible membrane 120 to form a sealed structure. If leakage occurs in the segmentation and sealing between the third rigid substrate 160 and the first flexible membrane 110 and the second flexible membrane 120, the performance of the liquid cooling system will be slightly reduced, but it will not cause the entire liquid cooling system to fail.
  • the plurality of third rigid substrates 160 divide the liquid inlet channel 142 into a plurality of liquid inlet sub-channels connected to each other, and divide the liquid outlet channel 141 into a plurality of liquid outlet sub-channels connected to each other.
  • the third rigid substrate 160 plays a role of guiding flow in the liquid inlet channel 142 and the liquid outlet channel 141, respectively, reducing flow resistance and avoiding eddy current loss, which is conducive to enhancing the heat exchange effect of the cooling medium.
  • the third rigid substrate 160 can be strip-shaped or cylindrical in shape. The strip-shaped third rigid substrate 160 is conducive to guiding the flow of the cooling medium, and the cylindrical third rigid substrate 160 is conducive to enhancing the mixing of the cooling medium.
  • the third rigid substrate 160 plays the role of both guiding and mixing flow, the third rigid substrate 160 can be set in the area where the width of the liquid inlet channel 142 or the liquid outlet channel 141 suddenly changes, the area where the cooling medium flow direction suddenly changes, and the area adjacent to the liquid cooling inlet 112.
  • the two ends of the third rigid substrate 160 are respectively formed as discontinuous interfaces with the first flexible film 110 and the second flexible film 120.
  • the two ends of the third rigid substrate 160 and at least part of the first flexible film 110 and the second flexible film 120 are continuously fused into one body to form an integrated sealing structure.
  • the two ends of the third rigid substrate 160 and the first flexible film 110 and the second flexible film 120 are all continuously fused into an integrated sealing structure, and there is no interface between the two ends of the third rigid substrate 160 and the first flexible film 110, and there is no interface between the two ends of the second rigid substrate 150 and the second flexible film 120.
  • the thickness of the first rigid substrate 130, the second rigid substrate 150 and the third rigid substrate 160 is less than the width of the liquid cooling module 10. Specifically, the ratio of the thickness of the first rigid substrate 130, the second rigid substrate 150 and the third rigid substrate 160 to the width of the liquid cooling module 10 is greater than or equal to 0.1 and less than or equal to 0.2. The thickness of the first rigid substrate 130, the second rigid substrate 150 and the third rigid substrate 160 is less than the length of the liquid cooling module 10. Specifically, the ratio of the thickness of the first rigid substrate 130, the second rigid substrate 150 and the third rigid substrate 160 to the length of the liquid cooling module 10 is greater than or equal to 10-5 and less than or equal to 0.2. This solution is conducive to ensuring the high strength of the liquid cooling module 10 in the thickness direction and the flexibility of the liquid cooling module 10 in the length direction and the width direction.
  • the sum of the cross-sectional areas of the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 is smaller than the area of the first flexible film 110 or the second flexible film 120.
  • the area of the first flexible film 110 refers to the area of the surface facing the rigid substrate
  • the area of the second flexible film 120 refers to the area of the surface facing the rigid substrate.
  • the width of the first rigid substrate 130 is greater than or equal to 1 mm and less than or equal to 10 mm.
  • the width direction of the first rigid substrate 130 intersects with the thickness direction A and the extension direction of the first rigid substrate 130 .
  • the width of the second rigid substrate 150 is greater than or equal to 1 mm and less than or equal to 10 mm.
  • the width direction of the second rigid substrate 150 intersects with the thickness direction A and the extension direction of the second rigid substrate 150 .
  • the width of the third rigid substrate 160 is greater than or equal to 1 mm and less than or equal to 10 mm.
  • the width direction of the third rigid substrate 160 intersects with the thickness direction A and the extension direction of the third rigid substrate 160 .
  • the thickness of the first flexible film 110 is greater than or equal to 5 ⁇ m and less than or equal to 500 ⁇ m.
  • the thickness of the first flexible film 110 is 40 ⁇ m.
  • the thickness of the second flexible film 120 is greater than or equal to 5 ⁇ m and less than or equal to 500 ⁇ m.
  • the thickness of the second flexible film 120 is 40 ⁇ m.
  • the thickness of the first rigid substrate 130, the second rigid substrate 150 and the third rigid substrate 160 is greater than or equal to 0.1 mm and less than or equal to 1 mm.
  • the thickness of the first rigid substrate 130, the second rigid substrate 150 and the third rigid substrate 160 is 0.12 mm.
  • FIG. 11 is a cross-sectional view of a liquid cooling module 100 provided in the first embodiment of the present application.
  • the thicknesses of the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 are not equal.
  • the thickness refers to the dimension in the thickness direction A.
  • the three rigid substrates are designed with unequal thicknesses.
  • FIG. 12 is a cross-sectional view of the liquid cooling module 100 provided in the first embodiment of the present application.
  • the first flexible film 110 or the second flexible film 120 may also be provided with a liquid injection port 113 and an air extraction port 114, etc.
  • the liquid injection port 113 and the air extraction port 114 are integrated with at least one of the three rigid substrates and the first flexible film 110 or the second flexible film 120 to form an integrated sealing structure.
  • the liquid injection port 113 is used to inject cooling medium into the inner cavity 140 before cooling
  • the air extraction port 114 is used to extract the gas in the inner cavity 140 to avoid negative effects on the heat dissipation effect.
  • the liquid injection port 113 and the air extraction port 114 are integrally sealed and connected with at least one of the first rigid substrate 130, the second rigid substrate 150 and the third rigid substrate 160, the first flexible film 110 or the second flexible film 120, which is conducive to avoiding leakage of cooling medium in the liquid injection port 113 and the air extraction port 114.
  • the liquid injection port 113, the air extraction port 114 and the liquid cooling module 100 are in the same plane, that is, between the first flexible film 110 and the second flexible film 120.
  • the liquid injection port 113, the air extraction port 114 and the liquid cooling module 100 can be assisted with glue to enhance the structural positioning and strength, but it is not a sealed welding surface.
  • the difference between the glass transition temperature of the material of the pump bottom wall 213 and the glass transition temperature of the material of the first flexible film 110 is less than or equal to 20°C; if they are the same material, the difference is zero.
  • the glass transition temperature refers to the temperature corresponding to the transition from a glassy state to a highly elastic state. A high glass transition temperature indicates that the material has good heat resistance.
  • the difference between the glass transition temperatures of the material of the pump bottom wall 213 and the material of the first flexible film 110 is set to be small, which is conducive to sealing the pump bottom wall 213 and the first flexible film 110 into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.
  • the difference between the glass transition temperature of the material of the first rigid substrate 130 and the glass transition temperature of the material of the first flexible film 110 or the second flexible film 120 is less than or equal to 20° C. Setting the difference between the glass transition temperatures of the material of the first rigid substrate 130 and the material of the first flexible film 110 or the second flexible film 120 to be relatively small is conducive to sealing the first rigid substrate 130 and the first flexible film 110 or the second flexible film 120 into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.
  • the difference between the glass transition temperature of the material of the second rigid substrate 150 and the glass transition temperature of the material of the first flexible film 110 or the second flexible film 120 is less than or equal to 20° C. Setting the difference between the glass transition temperature of the material of the second rigid substrate 150 and the material of the first flexible film 110 or the second flexible film 120 to be relatively small is conducive to sealing the second rigid substrate 150 and the first flexible film 110 or the second flexible film 120 into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.
  • the difference between the glass transition temperature of the material of the third rigid substrate 160 and the glass transition temperature of the material of the first flexible film 110 or the second flexible film 120 is less than or equal to 20° C. Setting the difference between the glass transition temperatures of the material of the third rigid substrate 160 and the material of the first flexible film 110 or the second flexible film 120 to be relatively small is conducive to sealing the third rigid substrate 160 and the first flexible film 110 or the second flexible film 120 into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.
  • the difference between the glass transition temperature of the material of the pump base 210 and the glass transition temperature of the material of the liquid cooling module 100 is less than or equal to 20° C.; if they are made of the same material, the difference is zero.
  • the glass transition temperature of the material of the pump bottom wall 213 is greater than or equal to 69° C. and less than or equal to 243° C.
  • the glass transition temperature of the material of the first flexible film 110 is greater than or equal to 69° C. and less than or equal to 243° C.
  • the glass transition temperature of the material of the second flexible film 120 is greater than or equal to 69° C. and less than or equal to 243° C.
  • the glass transition temperature of the material of the first rigid substrate 130 is greater than or equal to 69° C. and less than or equal to 243° C.
  • the glass transition temperature of the material of the second rigid substrate 150 is greater than or equal to 69° C. and less than or equal to 243° C.
  • the glass transition temperature of the material of the third rigid substrate 160 is greater than or equal to 69° C. and less than or equal to At 243°C.
  • the glass transition temperatures of the materials of the pump bottom wall 213, the first flexible membrane 110, the second flexible membrane 120, the first rigid substrate 130, the second rigid substrate 150 and the third rigid substrate 160 overlap in value ranges, in actual situations, it is not necessary for the glass transition temperatures of the materials of the pump bottom wall 213, the first flexible membrane 110, the second flexible membrane 120, the first rigid substrate 130, the second rigid substrate 150 and the third rigid substrate 160 to be completely equal, and it is only necessary to satisfy the condition that the difference is less than or equal to 20°C.
  • the difference between the melting temperature of the material of the pump bottom wall 213 and the melting temperature of the material of the first flexible film 110 is less than or equal to 20° C. In this embodiment, the difference between the melting temperatures of the material of the pump bottom wall 213 and the material of the first flexible film 110 is set to be small, which is conducive to sealing the pump bottom wall 213 and the first flexible film 110 into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.
  • the difference between the melting temperature of the material of the first rigid substrate 130 and the melting temperature of the material of the first flexible film 110 or the second flexible film 120 is less than or equal to 20° C. Setting the difference between the melting temperatures of the material of the first rigid substrate 130 and the material of the first flexible film 110 or the second flexible film 120 to be relatively small is conducive to sealing the first rigid substrate 130 and the first flexible film 110 or the second flexible film 120 into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.
  • the difference between the melting temperature of the material of the second rigid substrate 150 and the melting temperature of the material of the first flexible film 110 or the second flexible film 120 is less than or equal to 20° C. Setting the difference between the melting temperatures of the material of the second rigid substrate 150 and the material of the first flexible film 110 or the second flexible film 120 to be relatively small is conducive to sealing the second rigid substrate 150 and the first flexible film 110 or the second flexible film 120 into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.
  • the difference between the melting temperature of the material of the third rigid substrate 160 and the melting temperature of the material of the first flexible film 110 or the second flexible film 120 is less than or equal to 20° C. Setting the difference between the melting temperatures of the material of the third rigid substrate 160 and the material of the first flexible film 110 or the second flexible film 120 to be relatively small is conducive to sealing the third rigid substrate 160 and the first flexible film 110 or the second flexible film 120 into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.
  • the melting temperature of the material of the pump bottom wall 213 is greater than or equal to 195° C. and less than or equal to 343° C.
  • the melting temperature of the material of the first flexible film 110 is greater than or equal to 195° C. and less than or equal to 343° C.
  • the melting temperature of the material of the second flexible film 120 is greater than or equal to 195° C. and less than or equal to 343° C.
  • the melting temperature of the material of the first rigid substrate 130 is greater than or equal to 195° C. and less than or equal to 343° C.
  • the melting temperature of the material of the second rigid substrate 150 is greater than or equal to 195° C. and less than or equal to 343° C.
  • the melting temperature of the material of the third rigid substrate 160 is greater than or equal to 195° C. and less than or equal to 343° C.
  • the difference between the melting temperature of the material of the pump base 210 and the melting temperature of the material of the first flexible film 110 is less than or equal to 20°C.
  • the melting temperatures of the materials of the above-mentioned pump bottom wall 213, the first flexible membrane 110, the second flexible membrane 120, the first rigid matrix 130, the second rigid matrix 150 and the third rigid matrix 160 overlap in value ranges, in actual situations, it is not necessary for the melting temperatures of the materials of the pump bottom wall 213, the first flexible membrane 110, the second flexible membrane 120, the first rigid matrix 130, the second rigid matrix 150 and the third rigid matrix 160 to be completely equal, and it is only necessary to meet the condition that the difference is less than or equal to 20°C.
  • the pump base 210 and the pump bottom wall 213 are made of a flexible, heat-resistant polymer material with a breaking elongation greater than 10%. In one embodiment, the pump base 210 and the pump bottom wall 213 are made of a flexible, heat-resistant polymer material with a breaking elongation greater than 50%.
  • the material of the pump base 210 and the pump bottom wall 213 is independently selected from at least one of polyethylene terephthalate copolymer, polyethylene naphthalate, polyethylene 2,5-furandicarboxylate, polyimide, polyetheretherketone, and biaxially stretched polypropylene.
  • the materials of the first flexible film 110, the second flexible film 120, the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 are each independently selected from a flexible heat-resistant polymer material having a breaking elongation greater than 10%. In one embodiment, the materials of the first flexible film 110, the second flexible film 120, the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 are each independently selected from a flexible heat-resistant polymer material having a breaking elongation greater than 50%.
  • the material of the first flexible film 110 is at least one selected from the group consisting of polyethylene terephthalate copolymer, polyethylene naphthalate, polyethylene 2,5-furandicarboxylate, polyimide, polyetheretherketone, and biaxially stretched polypropylene.
  • the material of the first rigid substrate 130 is selected from at least one of polyethylene terephthalate copolymer, polyethylene naphthalate, polyethylene 2,5-furandicarboxylate, polyimide, polyetheretherketone, and biaxially stretched polypropylene.
  • the material of the second flexible film 120 is at least one selected from the group consisting of polyethylene terephthalate copolymer, polyethylene naphthalate, polyethylene 2,5-furandicarboxylate, polyimide, polyetheretherketone, and biaxially stretched polypropylene.
  • the material of the second rigid substrate 150 is at least one selected from polyethylene terephthalate copolymer, polyethylene naphthalate, polyethylene 2,5-furandicarboxylate, polyimide, polyetheretherketone, and biaxially stretched polypropylene.
  • the material of the third rigid substrate 160 is selected from at least one of polyethylene terephthalate copolymer, polyethylene naphthalate, polyethylene 2,5-furandicarboxylate, polyimide, polyetheretherketone, and biaxially stretched polypropylene.
  • polyethylene terephthalate copolymer polyethylene naphthalate, polyethylene 2,5-furandicarboxylate, polyimide and polyetheretherketone all contain rigid segments and have high glass transition temperatures.
  • the material selected for the pump bottom wall 213 and the first flexible film 110 is conducive to the hot pressing of the pump bottom wall 213 and the first flexible film 110 to form an integrated sealing structure.
  • the material selected for the first rigid substrate 130 and the first flexible film 110 or the second flexible film 120 is conducive to the hot pressing of the first rigid substrate 130 and the first flexible film 110 or the second flexible film 120 to form an integrated sealing structure.
  • the material selected for the second rigid substrate 150 and the first flexible film 110 or the second flexible film 120 is conducive to the hot pressing of the second rigid substrate 150 and the first flexible film 110 or the second flexible film 120 to form an integrated sealing structure.
  • the material selected for the third rigid substrate 160 and the first flexible film 110 or the second flexible film 120 is conducive to the hot pressing of the third rigid substrate 160 and the first flexible film 110 or the second flexible film 120 to form an integrated sealing structure.
  • Hot pressing is a sealing welding method without solder paste or other third materials, such as hot pressing bonding sealing welding of polymer film materials, hot melt welding, ultrasonic welding, and ultra-frequency welding.
  • the use of the above-mentioned materials for the first flexible film 110 and the second flexible film 120 is beneficial to improving the elongation at break, facilitating the release of stress of the electronic device when it is bent, and absorbing volume changes such as pressure fluctuations of the liquid cooling system and thermal expansion and contraction.
  • the pump bottom wall 213 is made of the same material as the first flexible membrane 110.
  • the first rigid base 130 is made of the same material as the first flexible membrane 110 or the second flexible membrane 120.
  • the second rigid base 150 is made of the same material as the first flexible membrane 110 or the second flexible membrane 120.
  • the third rigid base 160 is made of the same material as the first flexible membrane 110 or the second flexible membrane 120.
  • the material of the pump base 210 is the same as the material of the liquid cooling module 100.
  • Traditional liquid cooling modules are formed by flow channels of membrane materials such as polymer PET, PP, and PPS. Small molecules such as water will penetrate the membrane made of polymer materials, and this amount increases exponentially with evaporation and temperature.
  • the material of the first flexible film 110 and the second flexible film 120 is selected from at least one of polyethylene terephthalate copolymer, polyethylene naphthalate, polyethylene 2,5-furandicarboxylate, polyimide, polyetheretherketone, and biaxially oriented polypropylene. Since the water vapor permeability of the above materials is low, the use of the above materials for the first flexible film 110 and the second flexible film 120 is also conducive to alleviating the evaporation problem of the cooling medium in the first flexible film 110 and the second flexible film 120.
  • the first flexible film 110 and the second flexible film 120 use conventional PET materials, since the PET material has an extremely high polar ester group and has a strong absorption effect on water molecules, when the cooling medium flows in the inner cavity 140 of the liquid cooling module 100, it may evaporate and pass through the first flexible film 110 and the second flexible film 120, resulting in a reduction in the utilization rate of the cooling medium. In the process of the cooling medium evaporating outward, the small molecules of gas in the air will be replaced by the first flexible film 110 and the second flexible film 120 and dissolved in the cooling medium. When dissolved to saturation, air will exist in the circulation of the cooling medium in the form of bubbles.
  • the first flexible film 110 and the second flexible film 120 are set to the above materials, which is conducive to avoiding a series of hazards caused by the evaporation of the cooling medium.
  • the evaporation level of the first flexible membrane 110 and the second flexible membrane 120 is reduced by more than one order of magnitude, so as to meet the evaporation requirements of different working fluids such as water and fluorinated liquid at different application temperatures.
  • the first flexible film 110, the second flexible film 120 and the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 can be made of the same material.
  • the flexible film and the rigid substrate have different requirements for flexibility. At this time, different flexibility can be achieved by adjusting the thickness of the flexible film and the rigid substrate.
  • the glass transition temperature of polyethylene terephthalate copolymer is greater than or equal to 69°C and less than or equal to 77°C, and the melting temperature is greater than or equal to 250°C and less than or equal to 255°C.
  • the glass transition temperature of polyethylene naphthalate is 122.4°C and the melting temperature is 211.6°C.
  • the glass transition temperature of polyethylene 2,5-furandicarboxylate is 87.2°C, and the melting temperature is greater than or equal to 195°C and less than or equal to 265°C.
  • the glass transition temperature of polyimide is 243°C and the melting temperature is 334°C.
  • the glass transition temperature of polyetheretherketone is greater than or equal to 143°C and less than or equal to 150°C, and the melting temperature is 343°C. It should be noted that the glass transition temperature and melting temperature mentioned above are experimental values, which are affected by various factors such as experimental conditions, instruments and equipment, and experimental operations. When the above influencing factors change, the glass transition temperature and melting temperature of the above materials may also change accordingly.
  • the present application does not make an absolute limitation on the specific values of the glass transition temperature and melting temperature of the pump bottom wall 213, the pump base 210, the first flexible film 110, the second flexible film 120, the first rigid base 130, the second rigid base 150 and the third rigid base 160.
  • the monomers of the polyethylene terephthalate copolymer include terephthalic acid, ethylene glycol and a hard segment molecular structure, and the mass percentage of the hard segment molecular structure in the polyethylene terephthalate copolymer is greater than or equal to 20% and less than or equal to 80%.
  • polyethylene terephthalate copolymer refers to a copolymer formed by the block copolymerization of PET (polyethylene terephthalate) monomer and another monomer, wherein PET is polymerized from terephthalic acid and ethylene glycol. Due to the presence of -CH2-CH2- molecular chain segments in the structure of PET, the glass transition temperature of PET itself is relatively low, and it is easy to undergo glass transition in medium and high temperature application environments, which poses a risk of dimensional stability. This solution introduces a hard segment molecular structure into the structure of PET, which can increase the glass transition temperature of polyethylene terephthalate copolymer. When polyethylene terephthalate copolymer is used in the liquid cooling module 10, the liquid cooling module 10 can be suitable for medium and high temperature application scenarios.
  • the hard segment molecular structure is set to the above-mentioned ratio, which can improve the structural strength of the polyethylene terephthalate copolymer.
  • the impact resistance and drop resistance of the liquid cooling module 10 can be improved, and other devices inside the electronic device can be effectively protected.
  • the hard segment molecular structure is selected from at least one of 2,5-furandicarboxylic acid, dimethyl carbonate and 2,6-naphthalene dicarboxylic acid.
  • 2,5-furandicarboxylic acid, dimethyl carbonate and 2,6-naphthalene dicarboxylic acid are monomers of polyethylene 2,5-furandicarboxylate, polycarbonate and polyethylene naphthalate, respectively.
  • the use of the above materials as hard segment molecular structures can improve the structural strength of polyethylene terephthalate copolymers.
  • the evaporation problem of the first flexible film 110 and the second flexible film 120 can also be alleviated, and the water permeability and air permeability can be reduced.
  • the molecular structure G of part of the hard segment is shown in Table 3.
  • Figure 13 is a cross-sectional view of the first flexible film 110 provided in the first embodiment of the present application.
  • at least one of the first flexible film 110 and the second flexible film 120 includes two sub-flexible film layers 115 and an anti-evaporation layer 116 located between the two sub-flexible film layers 115, and the anti-evaporation layer 116 includes at least one of a polyimide layer, a polyvinylidene chloride layer, or a metal film layer.
  • the material of the sub-flexible film layer 115 can be selected from any of the materials of the first flexible film 110 or the second flexible film 120. In one embodiment, the material of the sub-flexible film layer 115 can be selected from the polyethylene terephthalate copolymer, PET copolymer, mentioned above.
  • the first flexible film 110 and the second flexible film 120 adopts a multi-layer film process, that is, the first flexible film 110 and the second flexible film 120 are arranged in a sandwich structure of "PET copolymer-X-PET copolymer", wherein the X layer refers to the anti-evaporation layer 116.
  • Polyimide, polyvinylidene chloride and metal film are materials with low water vapor permeability, and the anti-evaporation layer 116 adopts the above materials, which can reduce the evaporation of water vapor in the first flexible film 110 and the second flexible film 120.
  • a multi-layer co-extrusion technology or a multi-layer film pressing technology is used to realize a multi-layer film structure in the first flexible film 110 and the second flexible film 120.
  • the metal film layer can be a copper film, a nickel film, an aluminum film or a metal-plastic composite film material, and the thickness is less than or equal to 10 microns.
  • this solution is conducive to ensuring that the first flexible film 110 and the second flexible film 120 meet the requirements of 100,000 to 400,000 times of bending tests at different bending angles.
  • Figure 14 is a cross-sectional view of the liquid cooling module 100 provided in the first embodiment of the present application.
  • at least one of the first flexible membrane 110 and the second flexible membrane 120 is provided with an inorganic oxide film 117 on a surface away from the inner cavity 140.
  • the surfaces of the first flexible film 110 and the second flexible film 120 away from the inner cavity 140 are not in direct contact with the cooling medium, they are interfaces that the cooling medium must pass through when evaporating to the outside.
  • the inorganic oxide film 117 is provided to isolate water vapor and alleviate the evaporation problem of the cooling medium.
  • the coating method of the inorganic oxide film 117 can be any one of physical vapor deposition, chemical vapor deposition and atomic layer deposition.
  • Figure 15 is a partial enlarged view of the liquid cooling module 10 shown in Figure 1a.
  • the liquid cooling module 100 includes a liquid cooling film bending zone 170 (as shown in Figure 1a).
  • the liquid cooling module 100 is folded through the liquid cooling film bending zone 170.
  • At least one of the first rigid substrate 130, the second rigid substrate 150 and the third rigid substrate 160 is provided with a flexibility enhancing structure 131 (as shown in Figure 1a and Figure 15).
  • the flexibility enhancing structure 131 is located in the liquid cooling film bending zone 170.
  • the flexibility enhancing structure 131 is used to improve the flexibility of the liquid cooling film bending zone 170.
  • the first rigid substrate 130, the second rigid substrate 150 and the third rigid substrate 160 can enhance the strength of the liquid cooling module 100 in the thickness direction A due to their rigidity.
  • the bending portion of the liquid cooling module 100 needs to have a certain flexibility. Therefore, this solution sets a flexibility enhancement structure 131 in the liquid cooling film bending area 170 of the liquid cooling module 100, which can reduce the resistance of the bending portion of the liquid cooling module 100 when bending, and meet the folding requirements of the electronic device.
  • the flexibility enhancement structure 131 may be at least one of a groove, a through hole, a through hole, and an opening.
  • the liquid cooling module 100 further includes a first liquid cooling film static area 180 and a second liquid cooling film static area 190 (as shown in FIG. 1a ) located on both sides of the liquid cooling film bending area 170.
  • a first liquid cooling film static area 180 and a second liquid cooling film static area 190 located on both sides of the liquid cooling film bending area 170.
  • the flexibility enhancement structure 131 of the first rigid substrate 130 includes a groove 1311 located on the side wall of the first rigid substrate 130, and the groove 1311 is located in the liquid cooling film bending area 170 (as shown in Figure 1a and Figure 15).
  • the first rigid substrate 130 is arranged around the edge of the liquid cooling module 10 and is a barrier between the cooling medium and the external environment. Therefore, the first rigid substrate 130 needs to have a high structural strength to ensure the sealing effect so that the cooling medium does not leak to the outside of the liquid cooling module 10.
  • the first rigid substrate 130 located in the bending area 170 of the liquid cooling film needs to take into account both structural strength and certain flexibility. Therefore, the flexibility enhancement structure 131 arranged on the first rigid substrate 130 is preferably a groove 1311. If a through hole, through hole or opening is set on the first rigid substrate 130, there will be a risk of cooling medium leakage.
  • Figure 16 is a cross-sectional view of the liquid cooling module 100 provided in the first embodiment of the present application.
  • the flexibility structure 131 of the second rigid substrate 150 includes a through hole 1313 that penetrates the second rigid substrate 150 along a first direction A.
  • the through hole 1313 is located in the bending area 170 of the liquid cooling film.
  • the first direction A is the arrangement direction of the first flexible film 110 and the second flexible film 120.
  • the through hole 1313 is provided in the second rigid substrate 150, which can improve the flexibility of the bending portion of the second rigid substrate 150. Since the two sides of the second rigid substrate 150 are the liquid inlet channel 142 and the liquid outlet channel 141, the opening 1314 on the second rigid substrate 150 cannot connect the cooling medium on both sides to avoid affecting the cooling effect due to mixed flow. Among them, the first direction A is also the thickness direction of the liquid cooling module 100.
  • Figure 17 is a cross-sectional view of the liquid cooling module 100 provided in the first embodiment of the present application.
  • the liquid cooling module 100 is provided with a through hole 1312 that penetrates the second rigid substrate 150, the first flexible membrane 110 and the second flexible membrane 120 along the first direction, and the through hole 1312 is located in the bending area 170 of the liquid cooling membrane.
  • a through hole 1312 is provided in the second rigid substrate 150, which can improve the flexibility of the bending portion of the second rigid substrate 150 and reduce the rebound force and friction force of the bending area 170 of the liquid cooling film when bending.
  • the first direction is the thickness direction A of the liquid cooling module 10.
  • the through hole 1312 penetrates the second rigid substrate 150 along the first direction without causing short circuit and mixed flow of the cooling medium in the liquid inlet channel 142 and the liquid outlet channel 141.
  • the third rigid substrate 160 can be opened with a hole 1314 to reduce the rebound force of the bending area 170 of the liquid cooling film and the friction force with the screen and the middle frame when bending, and will not cause a short circuit of the cooling medium flow.
  • the flexibility structure 131 of the second rigid substrate 150 includes a through hole 1313 and a through hole 1312, or the flexibility structure 131 of the second rigid substrate 150 includes any one of the through hole 1313 and the through hole 1312.
  • the through hole 1313 and the through hole 1312 can be flexibly arranged in the second rigid substrate 150 according to actual conditions, thereby improving the practicality of the second rigid substrate 150 in different application environments.
  • the flexibility enhancement structure 131 on the second rigid substrate 150 may also be a groove 1311 .
  • the flexibility enhancement structure 131 of the third rigid substrate 160 includes an opening 1314 located in the third rigid substrate 160 .
  • the opening 1314 connects the flow channels on both sides of the third rigid substrate 160 .
  • this solution is set to set an opening 1314 in the third rigid substrate 160, which is equivalent to partially disconnecting the third rigid substrate 160 at the position of the opening 1314, inducing bending deformation at the designed position, and effectively reducing the stress generated during bending.
  • Part of the third rigid substrate 160 is distributed in the liquid inlet channel 142, and part of the third rigid substrate 160 is distributed in the liquid outlet channel 141, that is, the channels on both sides of the third rigid substrate 160 belong to the liquid inlet channel 142 or the liquid outlet channel 141, so the opening 1314 connects the two sides of the third rigid substrate 160 without affecting the heat dissipation efficiency, and can increase the mixing effect of the cooling medium in the same flow direction in the liquid inlet channel 142 or the liquid outlet channel 141, thereby improving the cooling effect.
  • the flexibility enhancement structure 131 may extend along the flow direction of the cooling medium. In another embodiment, the flexibility enhancement structure 131 may extend along the folding direction of the folding device. Setting the size of the flexibility enhancement structure 131 in its extension direction to be larger can effectively improve the flexibility of the liquid cooling film bending area 170, reduce the rebound force of the liquid cooling film bending area 170 and the friction force with the screen and the middle frame when bending, thereby improving the user experience of the folding device.
  • FIG. 18 is a cross-sectional view of the liquid-cooling module 100 provided in the first embodiment of the present application.
  • a lubricating material layer 118 is applied to the surface of the first flexible film 110 and the second flexible film 120 away from the inner cavity 140, and the lubricating material layer 118 is located in the bending area of the liquid-cooling film.
  • a lubricating material layer 118 can also be provided on the outer surface of the first flexible film 110 and the second flexible film 120 to reduce the friction force of the bending area of the liquid-cooling film when bending, so that the bending process can be carried out more smoothly.
  • the lubricating material layer 118 includes, but is not limited to, solid, liquid or paste lubricating materials such as Teflon film, graphite film, graphene film or grease.
  • the lubricating material layer 118 When the lubricating material layer 118 is a graphite film or a graphene film, the lubricating material layer 118 can be arranged only in the bending area of the liquid cooling film, or can be arranged at the same time. At least one of the first liquid-cooled film static zone and the second liquid-cooled film static zone and the liquid-cooled film bending zone. At this time, the lubricating material layer 118 not only plays a role in lubricating and reducing friction in the liquid-cooled film static zone, but also can enhance the heat dissipation effect and reduce the overall temperature of the cooling medium, thereby reducing the startup time and frequency of the pump because graphite and graphene themselves have a high thermal conductivity.
  • the liquid-cooling module 100 includes a first flexible film 110, a second flexible film 120 and a first rigid substrate 130 located between the first flexible film 110 and the second flexible film 120.
  • the first flexible film 110, the second flexible film 120 and the first rigid substrate 130 enclose an inner cavity 140 of the liquid-cooling module 100, and the difference between the glass transition temperature of the first rigid substrate 130 and the glass transition temperature of the material of the first flexible film 110 is less than or equal to 20°C.
  • the first flexible film 110 and the second flexible film 120 can reduce the difficulty of bending the electronic device.
  • the first rigid substrate 130 is used to enhance the structural strength of the liquid cooling module 100 in the thickness direction A.
  • the first flexible film 110, the second flexible film 120 and the first rigid substrate 130 enclose an inner cavity 140, and the cooling medium flows in the inner cavity 140.
  • the two ends of the first rigid substrate 130 and the first flexible film 110 and the second flexible film 120 are an integrated sealing structure, which is conducive to improving the sealing performance of the first rigid substrate 130 and avoiding leakage of the cooling medium.
  • the difference in glass transition temperature between the material of the first rigid substrate 130 and the material of the first flexible film 110 is set to be small, which is conducive to sealing the first rigid substrate 130 and the first flexible film 110 into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.
  • the difference between the melting temperature of the material of the first rigid substrate 130 and the melting temperature of the material of the first flexible film 110 is less than or equal to 20° C. In this embodiment, the difference between the melting temperatures of the material of the first rigid substrate 130 and the material of the first flexible film 110 is set to be small, which is conducive to the first rigid substrate 130 and the first flexible film 110 being sealed into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.
  • the achievable manner, size, positional relationship, and structural description of the first flexible film 110, the second flexible film 120, the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 in the foregoing are applicable to the achievable manner, size, positional relationship, and structural description of the first flexible film 110, the second flexible film 120, the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 in this embodiment, and will not be repeated here.
  • the liquid-cooling module 100 includes a first flexible film 110, a second flexible film 120 and a first rigid substrate 130 located between the first flexible film 110 and the second flexible film 120.
  • the first flexible film 110, the second flexible film 120 and the first rigid substrate 130 enclose an inner cavity 140 of the liquid-cooling module 100.
  • the materials of the first flexible film 110, the second flexible film 120 and the first rigid substrate 130 are selected from flexible temperature-resistant polymer materials with a breaking elongation greater than 10%.
  • the materials of the first flexible film 110, the second flexible film 120 and the first rigid substrate 130 are independently selected from at least one of polyethylene terephthalate copolymer, polyethylene naphthalate, polyethylene 2,5-furandicarboxylate, polyimide, polyetheretherketone, and biaxially stretched polypropylene.
  • the first flexible film 110 and the second flexible film 120 can reduce the difficulty of bending the electronic device.
  • the first rigid substrate 130 is used to enhance the structural strength of the liquid cooling module 100 in the thickness direction A.
  • the first flexible film 110, the second flexible film 120 and the first rigid substrate 130 enclose an inner cavity 140, and the cooling medium flows in the inner cavity 140.
  • the two ends of the first rigid substrate 130 and the first flexible film 110 and the second flexible film 120 are an integrated sealing structure, which is conducive to improving the sealing performance of the first rigid substrate 130 and avoiding leakage of the cooling medium.
  • the materials selected for the first rigid substrate 130 and the first flexible film 110 or the second flexible film 120 are conducive to hot pressing the first rigid substrate 130 and the first flexible film 110 or the second flexible film 120 to form an integrated sealing structure.
  • the first rigid substrate 130 and the first flexible film 110 or the second flexible film 120 can be made of different materials as long as an integrated sealing structure can be formed between the first rigid substrate 130 and the first flexible film 110 or the second flexible film 120.
  • the achievable manner, size, positional relationship, and structural description of the first flexible film 110, the second flexible film 120, the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 in the foregoing are applicable to the achievable manner, size, positional relationship, and structural description of the first flexible film 110, the second flexible film 120, the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 in this embodiment, and will not be repeated here.
  • the liquid cooling module 100 includes a first flexible film 110, a second flexible film 120, and a rigid substrate 101 located between the first flexible film 110 and the second flexible film 120.
  • the liquid cooling module 100 includes a liquid cooling film bending area 170.
  • the liquid cooling module 100 is folded through the liquid cooling film bending area 170.
  • the rigid substrate 101 is provided with a flexibility enhancement structure 131.
  • the flexibility enhancement structure 131 is located in the liquid cooling film bending area 170.
  • the flexibility enhancement structure 131 is used to improve the flexibility of the liquid cooling film bending area 170 and reduce the rebound force of the liquid cooling film bending area 170 and the friction force with the screen and the middle frame when bending.
  • both ends of the rigid substrate 101 are used to support the first flexible film 110 and the second flexible film 120.
  • the rigid substrate 101 is provided in the liquid cooling module 100 to improve the structural strength of the liquid cooling module 100 in the thickness direction A.
  • a flexibility enhancement structure 131 is required to be provided on the rigid substrate 101 located in the liquid cooling film bending area 170 to enhance the flexibility of the liquid cooling film bending area 170.
  • the flexibility enhancement structure 131 may be at least one of a groove 1311, a through hole 1312, a through hole 1313 and an opening 1314.
  • the rigid substrate 101 may include a first rigid substrate 130, a second rigid substrate 1314, and a through hole 1315.
  • a flexible matrix 150 and a third rigid matrix 160 are used to support the first flexible film 110 and the second flexible film 120.
  • the achievable methods, sizes, positional relationships, and structural descriptions of the first flexible film 110, the second flexible film 120, the first rigid substrate 130, the second rigid substrate 150, the third rigid substrate 160, and the flexibility enhancement structure 131 in the foregoing text are applicable to the achievable methods, sizes, positional relationships, and structural descriptions of the first flexible film 110, the second flexible film 120, the first rigid substrate 130, the second rigid substrate 150, the third rigid substrate 160, and the flexibility enhancement structure 131 in this embodiment, and are not repeated here.
  • the liquid cooling module 10 provided in the embodiment of the present application can be applied to electronic devices.
  • the electronic device 1 includes a housing 20, an electronic functional component 30 located in the housing 20, and a liquid cooling module 10, and the liquid cooling module 10 is located outside the housing 20.
  • the electronic device 1 can be an electronic product such as a mobile phone, a tablet computer, a laptop computer, and a wearable device.
  • the electronic functional components 30 in the electronic device 1 include but are not limited to a processor, an internal memory, a charging management module, a power management module, a battery, an antenna, a communication module, a camera, an audio module, a speaker, a receiver, a microphone, a sensor module, a motor, and an indicator.
  • the electronic device 1 may have more or fewer electronic functional components 30 than described above.
  • Various electronic functional components 30 can be implemented in hardware, software, or a combination of hardware and software including one or more signal processing and/or application-specific integrated circuits.
  • the electronic functional component 30 releases heat when it is in working state.
  • the temperature inside the electronic device 1 is too high, it will affect the working efficiency of the electronic functional component 30 and the service life of the electronic device 1, so it is necessary to set a liquid cooling module 10 to control the temperature rise of the electronic functional component 30.
  • the liquid cooling module 10 is located between the housing 20 and the electronic functional component 30 .
  • the electronic device 1 is a foldable device having a flattened state and a folded state.
  • the electronic device 1 comprises a first non-folding portion 11, a folding portion 12, and a second non-folding portion 13, wherein the second non-folding portion 13 can be folded toward the first non-folding portion 11 through the folding portion 12.
  • the liquid cooling module 10 can be divided into a first liquid cooling film static area 180, a liquid cooling film bending area 170, and a second liquid cooling film static area 190 in sequence along the length direction B.
  • the liquid cooling module 100 is folded through the liquid cooling film bending area 170, the liquid cooling film bending area 170 is bent, and the first liquid cooling film static area 180 and the second liquid cooling film static area 190 are not deformed.
  • the folding machine has three or more N folding screens, there can be a maximum of three or N liquid cooling modules, 2 or N-1 bending areas; at least 2 liquid cooling films, 1 bending area, where N is an integer greater than 2. If it is a straight-plate machine, there may be no bending area, and there may be one or more liquid cooling films.
  • one or more liquid pumps may be provided, which may be connected in parallel, in series or in mixed connection, and may be arranged adjacent to or not adjacent to each other, such as being arranged near the motherboards of different screens.
  • the pump may have pressure fluctuations, slight vibrations of 2-50um and certain noise during operation.
  • Flexible liquid cooling modules help absorb pressure fluctuations, volume changes and less vibration and noise.
  • the first rigid substrate 130 surrounds the edges of the first liquid-cooled film static area 180, the liquid-cooled film bending area 170 and the second liquid-cooled film static area 190 in a closed arrangement.
  • the pump 200 is located in the second liquid-cooled film static area 190 and is arranged close to the first rigid substrate 130 along the width direction C, and the third rigid substrate 160 is provided on both sides of the pump 200 along the length direction B, wherein the third rigid substrates 160 on both sides of the pump 200 along the length direction B are columnar and strip-shaped, respectively.
  • the pump 200 and the adjacent first flexible film 110, the second flexible film 120 and other structural parts in the electronic device 1 are usually spaced or additionally provided with damping materials, wherein the damping material can be bonded to the first flexible film 110, the second flexible film 120 or the structural part.
  • the structural part can be at least one of a display screen, a housing 20, a battery, and a camera.
  • the pump 200 is provided with a second rigid substrate 150 on one side away from the first rigid substrate 130 along the width direction C.
  • the second rigid substrate 150 separates the inner cavity 140 of the second liquid-cooled film static zone 190, the liquid-cooled film bending zone 170 and part of the first liquid-cooled film static zone 180 into a liquid inlet channel 142 and a liquid outlet channel 141.
  • part of the second rigid substrate 150 extends along the width direction C, and part of the second rigid substrate 150 extends along the length direction B, wherein the second rigid substrate 150 extending along the length direction B separates the inner cavity 140 located on both sides along the width direction C into a liquid inlet channel 142 and a liquid outlet channel 141, and the second rigid substrate 150 extending along the width direction C is used to guide the flow of the cooling medium flowing out of the pump 200 together with the third rigid substrate 160.
  • the third rigid substrate 160 may be in a strip shape or a column shape, wherein the strip-shaped third rigid substrate 160 extends along the width direction C, and a column-shaped third rigid substrate 160 is provided on both sides of the strip-shaped third rigid substrate 160 along the width direction C.
  • the third rigid substrate 160 is in a strip shape and extends along the length direction B.
  • the area enclosed by the first rigid substrate 130 of the second liquid-cooled film static zone 190 is substantially rectangular or square.
  • the second rigid substrate 150 extends along the length direction B, and the second rigid substrate 150 divides the inner cavity 140 located on both sides of the second rigid substrate 150 along the width direction C into a liquid inlet channel 142 and a liquid outlet channel 141, wherein the third rigid substrate 160 in the liquid inlet channel 142 and the liquid outlet channel 141 are both strip-shaped and extend along the length direction B.
  • the area enclosed by the first rigid substrate 130 of the liquid-cooling film bending zone 170 is basically strip-shaped.
  • the liquid-cooling module 10 in the liquid-cooling film bending zone 170 adopts a cross-axis setting, that is, the liquid-cooling module 10 spans the main axis of the liquid-cooling film bending zone 170.
  • part of the second rigid substrate 150 is in an "inverted C-shape", and part of the second rigid substrate 150 is in a strip shape and extends along the width direction C.
  • the "inverted C-shape" second rigid substrate 150 divides the inner cavity 140 into a liquid inlet channel 142 and a liquid outlet channel 141, forming an "inverted
  • the third rigid substrates 160 on both sides of the second rigid substrate 150 of "C-shape” are also "inverted C-shape”.
  • a columnar third rigid substrate 160 is provided on one side along the width direction C at the end of the strip-shaped second rigid substrate 150, and the liquid inlet channel 142 and the liquid outlet channel 141 are connected in the third rigid substrate 160 to form a cooling cycle.
  • the thicknesses of the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 are not equal, and the thickness of any one of the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 may be 0.1 mm to 1 mm.
  • This solution is conducive to meeting the architectural space requirements of the liquid cooling module 10 in different application environments.
  • the thickness of any one of the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 may be 0.15 mm to 0.3 mm.
  • the density of the first flexible film 110 and the second flexible film 120 is less than or equal to 2 g/ml. This solution is conducive to reducing the overall weight of the liquid cooling module 10, while allowing the first flexible film 110 and the second flexible film 120 to be more flexibly adapted to different architectural environments.
  • FIG. 21 is a schematic diagram of the structure of the electronic device 1 provided in the second embodiment of the present application.
  • the liquid cooling module 10 may present a shape different from that of the first embodiment.
  • the first rigid substrate 130 is arranged around the edge of the liquid cooling module 10
  • the second rigid substrate 150 is in the shape of two "cross" shapes connected end to end
  • one of the "cross"-shaped second rigid substrates 150 is arranged in a curved shape at both ends along the width direction C, so that the inner cavity 140 finally presents a shape of multiple "C" shapes connected end to end with different openings.
  • the pump 200 is located at one end of the second liquid cooling film static zone 190 along the width direction C, and the third rigid substrate 160 in the second liquid cooling film static zone 190 is columnar.
  • One end of the second rigid substrate 150 with two curved ends is arranged adjacent to the pump 200, and the inner cavity 140 is divided into a liquid inlet channel 142 and a liquid outlet channel 141.
  • the liquid-cooling module 10 is in an elongated strip shape as a whole, wherein the second rigid substrate 150 is arranged in a strip shape and extends along the length direction B, and the third rigid substrate 160 located on both sides of the second rigid substrate 150 along the width direction C is arranged in a strip shape and extends along the length direction B.
  • the liquid-cooling module 10 is in an elongated strip shape as a whole, wherein the second rigid substrate 150 is arranged in a strip shape and extends along the length direction B, and the third rigid substrate 160 located on both sides of the second rigid substrate 150 along the width direction C is arranged in a strip shape and extends along the length direction B, and the liquid inlet channel 142 and the liquid outlet channel 141 are connected in the first liquid-cooling film static area 180 to form a cooling cycle.
  • FIG. 22 is a schematic diagram of the structure of the electronic device 1 provided in the second embodiment of the present application.
  • the first rigid substrate 130 is arranged around the edge of the liquid-cooling module 10
  • the pump 200 is located in the second liquid-cooling film static zone 190 and is arranged close to the first rigid substrate 130 along the length direction B and the width direction C
  • the second rigid substrate 150 first extends along the length direction B, then extends along the width direction C, and then extends along the length direction B to the liquid-cooling film
  • the bending area 170 wherein the second rigid substrate 150 is far away from the liquid cooling film bending area 170 and is arranged near the pump 200 at one end extending along the length direction B
  • the inner cavity 140 is divided into a liquid inlet channel 142 and a liquid outlet channel 141.
  • the third rigid substrate 160 is not arranged in the liquid inlet channel 142.
  • the third rigid substrate 160 extends along the length direction B and is arranged at staggered intervals, so that the liquid outlet channel 141 finally presents a "C" shape with multiple openings in different directions connected end to end.
  • the second rigid substrate 150 is arranged in a strip shape and extends along the length direction B.
  • the liquid inlet channel 142 and the liquid outlet channel 141 are connected to form a cooling cycle, wherein the shape and distribution characteristics of the third rigid substrate 160 in the first liquid-cooled film static zone 180 and the third rigid substrate 160 in the second liquid-cooled film static zone 190 are similar, and are not repeated here.
  • the feasible manner, size, positional relationship, and structural description of the pump 200, the first flexible membrane 110, the second flexible membrane 120, the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 in the first embodiment are applicable to the feasible manner, size, positional relationship, and structural description of the pump 200, the first flexible membrane 110, the second flexible membrane 120, the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 in the second embodiment, and will not be repeated here.
  • the VC cover plate or heat pipe is made of copper alloy or stainless steel with a density of 8.9g/ml and 7.8g/mL. It cannot pass the 100,000-200,000 bending test (R ⁇ 1.5mm), and cannot achieve through-axis or cross-axis heat dissipation.
  • the equivalent thermal conductivity is ⁇ 2000W/m ⁇ K.
  • the equivalent thermal conductivity can also reach 5000W/m ⁇ K, and the thickness can be locally designed, and the thickness of 0.15mm can be achieved locally to meet the requirements of chip and architecture space.
  • the liquid cooling membrane material is modified PET, etc., with a density of ⁇ 2g/mL, which can achieve a more flexible architecture design, and the heat dissipation capacity is increased by more than 50% compared to graphite.
  • the liquid cooling membrane group provided in the embodiment of the present application has a heat dissipation capacity that is more than 50% higher than that of cross-axis/through-axis graphite.
  • FIG. 23 is a schematic diagram of the structure of the electronic device 1 provided in the third embodiment of the present application.
  • FIG. 24 is a schematic diagram of the partial structure of the liquid cooling module 10 provided in the third embodiment of the present application.
  • the liquid cooling module 10 in the liquid cooling film bending area 170 is arranged by a through-axis.
  • the liquid cooling module 10 includes a first surface 300 and a second surface 400 arranged opposite to each other along the thickness direction A.
  • the liquid cooling module 10 located in the liquid cooling film bending area 170 is provided with two spaced curved portions 310.
  • the area of the liquid cooling module 10 other than the curved portions 310 is a base 320.
  • the first surfaces 300 and the second surfaces 400 of the two curved portions 310 are curved toward the second surface 400 of the base 320 in the thickness direction A away from the first surface 300.
  • the two curved portions 310 and the base 320 located between the two curved portions 310 are arranged in a corrugated shape.
  • the area enclosed by the two curved portions 310 and the base 320 between the two curved portions 310 is used to penetrate the main axis.
  • the electronic device also includes a flexible circuit board 40, and the flexible circuit board 40 is used to be electrically connected to the electronic functional components, wherein the flexible circuit board 40 and the liquid cooling module 10 are jointly arranged in a through-axis configuration.
  • the liquid cooling module 10 located in the bending area 170 of the liquid cooling film is arranged in a close fit, and the flexible circuit board 40 and the liquid cooling module 10 are both corrugated and share the through-axis space, which is conducive to reducing the friction, collision and abnormal noise between the liquid cooling module 10 and the flexible circuit board 40.
  • the flexible circuit board 40 can be kept in a corrugated shape by a plastic deformation method.
  • an air gap is partially or completely provided between the flexible circuit board 40 and the liquid cooling module 10.
  • the feasible methods, dimensions, positional relationships, and structural descriptions of the pump 200, the first flexible membrane 110, the second flexible membrane 120, the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 in the first embodiment are applicable to the feasible methods, dimensions, positional relationships, and structural descriptions of the pump 200, the first flexible membrane 110, the second flexible membrane 120, the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 in the third embodiment, and will not be repeated here.
  • Figure 26 is a schematic diagram of the structure of the liquid cooling module 10 provided in the fourth embodiment of the present application
  • Figure 27 is a schematic diagram of the structure of the electronic device provided in the first embodiment of the present application. Different from the first embodiment, in the fourth embodiment, the liquid cooling module 10 is an external accessory relative to the electronic device 1.
  • the liquid cooling module 10 includes a first liquid cooling film static area 180, a liquid cooling film bending area 170 and a second liquid cooling film static area 190, wherein the liquid cooling film bending area 170 includes two first bending portions 171 and a second bending portion 172, the second bending portion 172 is located between the two first bending portions 171, and the bending degree of the second bending portion 172 is greater than the first bending portion 171.
  • the deformed part of the electronic device moves to the accommodation space formed by the surface of the second bending portion 172, and the first bending portion 171 deforms with the electronic device.
  • This solution decouples the liquid cooling module 10 from sensitive devices such as a display screen and a battery of the electronic device by configuring the liquid cooling module 10 as an external accessory, thereby making the design of the liquid cooling module 10 flexible and the replacement more convenient.
  • the feasible manner, size, positional relationship, and structural description of the pump 200, the first flexible membrane 110, the second flexible membrane 120, the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 in the first embodiment are applicable to the feasible manner, size, positional relationship, and structural description of the pump 200, the first flexible membrane 110, the second flexible membrane 120, the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 in the fourth embodiment, and will not be repeated here.
  • FIG. 28 is a schematic diagram of the structure of the electronic device 1 provided in the fifth embodiment of the present application.
  • the electronic device 1 is a non-foldable device, and the electronic device 1 has no folding state.
  • the liquid cooling module 100 includes a first flexible film, a second flexible film, a first rigid substrate 130 and a second rigid substrate 150, and the first rigid substrate 130 is arranged in a closed manner around the edge of the liquid cooling module 10.
  • the pump is arranged near the first rigid substrate 130 along the length direction B.
  • the second rigid substrate 150 is provided on the side of the pump 200 away from the first rigid substrate 130 along the length direction B, and the second rigid substrate 150 extends along the length direction B.
  • the inner cavity 140 located on both sides of the second rigid substrate 150 along the width direction C is divided into a liquid inlet channel 142 and a liquid outlet channel 141.
  • the liquid inlet channel 142 and the liquid outlet channel 141 are connected on the side of the second rigid substrate 150 away from the pump 200 along the length direction B to form a cooling cycle.
  • FIG28 illustrates the flow direction of the liquid working medium.
  • the two pumps are designed in parallel to form a circulating flow.
  • the thickness of the first rigid substrate 130 and the second rigid substrate 150 are not equal, and the thickness of any one of the first rigid substrate 130 and the second rigid substrate 150 may be 0.1 mm to 1 mm. This solution is conducive to meeting the architectural space requirements of the liquid cooling module 10 in different application environments. Preferably, the thickness of any one of the first rigid substrate 130 and the second rigid substrate 150 may be 0.15 mm to 0.3 mm.
  • the density of the first flexible film 110 and the second flexible film 120 is less than or equal to 2 g/ml. This solution is conducive to reducing the overall weight of the liquid cooling module 10, while allowing the first flexible film 110 and the second flexible film 120 to be more flexibly adapted to different architectural environments.
  • the feasible manner, positional relationship and structural description of the pump 200, the first flexible membrane 110, the second flexible membrane 120, the first rigid substrate 130 and the second rigid substrate 150 in the first embodiment are applicable to the feasible manner, positional relationship and structural description of the pump 200, the first flexible membrane 110, the second flexible membrane 120, the first rigid substrate 130 and the second rigid substrate 150 in the fifth embodiment, and will not be repeated here.
  • VC/HP refers to a variable electrical conductivity heat pipe with an equivalent thermal conductivity of 5000W/m ⁇ K, equal thickness design, and a thickness ⁇ 0.25mm.
  • the VC cover or heat pipe is made of copper alloy or stainless steel with a density of 8.9g/ml or 7.8g/mL.
  • a flexible liquid cooling film solution is adopted, and the equivalent thermal conductivity can also reach 5000W/m ⁇ K. It can be locally designed with no thickness, and the thickness of 0.15mm can be achieved locally to meet the requirements of chip and architecture space.
  • the material of the liquid cooling module is modified PET, etc., with a density of ⁇ 2g/mL, which can achieve a more flexible architecture design, lighter and higher heat dissipation capacity.
  • VC single-body heat dissipation capacity
  • it can be designed with unequal thickness, and the weight reduction is >50%.
  • FIG. 29 is a schematic diagram of a liquid cooling module provided by an embodiment of the present application.
  • the cooling medium in the liquid cooling module 100 can be a single-phase cooling medium, or two or more colors of cooling medium that are incompatible with each other, so that the cooling medium can flow freely. Enhanced visualization and improved user experience.

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Abstract

本申请提供一种液冷模组、液冷模件及电子设备,液冷模组包括泵和液冷模件。泵基体与液冷模件一体化密封连接。液冷模件包括柔性膜和刚性基体。泵基体和液冷模件材质的断裂伸长率大于10%,包括聚对苯二甲酸乙二醇酯共聚物、聚萘二甲酸乙二醇酯、聚2,5-呋喃二甲酸乙二醇酯、聚酰亚胺、聚醚醚酮、双轴拉伸聚丙烯等材料;聚对苯二甲酸乙二醇酯共聚物的单体包括对苯二甲酸、乙二醇和硬段分子结构。本申请液冷模组通过泵和液冷模件堆叠、材料选择和一体化焊接成型,无需预紧力实现柔性系统一体化密封,无装配泄露,可动态适应弯折使用、系统压力和体积的变化波动,更高耐受温度,适用于直板机、折叠手机、折叠PC、穿戴、配件等移动电子设备。

Description

液冷模组、液冷模件及电子设备
本申请要求在2023年2月17日提交中国国家知识产权局、申请号为202310188740.1的中国专利申请的优先权,发明名称为“一种散热结构”的中国专利申请的优先权,本申请要求在2023年4月20日提交中国国家知识产权局、申请号为202310462273.7的中国专利申请的优先权,发明名称为“液冷模组、液冷模件及电子设备”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电子设备技术领域,特别涉及一种液冷模组、液冷模件及电子设备。
背景技术
移动终端,如手机、手表、平板电脑、穿戴设备等,受限于体积和超薄需求,目前主要散热手段是热界面材料(TIM)、人工石墨膜、石墨烯膜、铜膜等均热材料、热管VC和微型风扇等。折叠手机、折叠PC是近期崛起、高速增长和广受用户欢迎的一种新型移动终端。但对折叠手机等,转轴要求能通过≥10万次弯折的可靠性测试,而目前大部分散热器件和材料,如人工石墨、铜膜、热管、VC等,无法通过可靠性测试要求。这导致转轴将两个或三个屏隔开,发热器件SOC/CPU/GPU、充电芯片等集中在其中一屏的主板上,热量难以传递到其它屏和单板区域,屏间温差可达到10℃以上。主发热器件SOC/CPU/GPU、充电芯片等散热能力不足,热量集中,限制了性能发挥,影响用户热体验。在手表、手环也有类似问题,表盘发热无法扩展至表带内,缺乏柔性散热解决方案。
CN114340305B提供一种可应用于PC或手机手表的穿轴泵驱液冷散柔性散热解决方案。相比传统液冷系统,是一种无集液罐、充液装置、排气阀的相对简化液冷系统。但系统包含≥3连接软管(材质为耐弯折PTFE镀金属防蒸散)、2冷板(材质为不锈钢复合板)、2连接冷板的水嘴(3D打印不锈钢)、1机械泵(精密注塑件,内含3密封圈,需多螺栓连接提供预紧力)、1四通阀(满足检测调试检测和维修需求)等,系统共有≥12密封接口。密封管路接头无法全自动化组装,不同供应商来料检验后在系统厂组装灌液和密封检测;系统总体采用金属材料管路,多处采用带预紧力的O型圈密封系统。工程上,接口密封效果与接口材料自身回弹力、接触压力、密封材料对液冷工质的溶胀量、装配件的装配精度等密切相关,涉及多家供应商来料和产线组装,工程上无法全自动化生产,质量管控困难成本高。对消费类产品,应用场景复杂多变,尤其手机日常使用经常跌落受力,或反复弯折使用,无法保证多接口的预紧力和密封的长期可靠。同时传统液冷模组,采用高分子PET、PP、PPS等膜材流道成型,水等小分子会穿透高分子材料制成的膜片,并且这个量随蒸散随温度指数上升。理论上泵和液冷模件间、液冷模件内部可采用胶粘接密封。虽然具有超薄和易加工优点,但胶水粘接,作为两密封层间的第三种不同性材质,难以精确可靠控制,粘接时层间易有微气泡,长期耐温耐候性非常受限,尤其不耐高温高湿,容易发生蠕变或吸收水分,胶层粘接力下降和失效,无法长期可靠密封,工程上基本不采用胶进行液冷系统密封。综上,泄露和蒸散问题,是传统液冷散热系统应用于海量移动终端消费电子产品的最大瓶颈;对折叠机、穿戴等产品,需提供一种创新的柔性液冷系统密封散热解决方案。
发明内容
本申请提供一种液冷模组、液冷模件及电子设备。液冷模组包括泵和液冷模件。泵用于为液冷模件中的冷却介质提供动力,泵包括泵基体和压电组件。泵基体设有泵进液口和泵出液口。液冷模件包括液冷出液口和液冷进液口,液冷出液口用于与泵进液口连通,液冷进液口用于与泵出液口连通。液冷出液口周侧的部分液冷模件与泵进液口周侧的部分泵基体材料相同或相近,为一体化无焊膏或其它第三材质的密封焊接结构。液冷进液口周侧的部分液冷模件与泵出液口周侧的部分泵基体材料相同或相近,为一体化无焊膏或其它第三材质的密封焊接结构。液冷模件由第一柔性膜、第二柔性膜,第一刚性基体、第二刚性基体、第三刚性基体等组成。第一刚性基体、第二刚性基体与第一柔性膜、第二柔性膜材料相同或相近,其间的密封采用一体化无焊膏或其它第三材质的密封焊接结构。在本申请提供的液冷模组中,通过泵和液冷膜的堆叠设计、材料选择和一体化焊接成型,无需预紧力实现柔性系统一体化密封,可动态适应弯折使用、系 统压力和体积的变化波动,极简化设计和制造,无装配泄露,适用于直板机、折叠手机、折叠PC、穿戴、配件等移动电子设备。
第一方面,本申请提供一种液冷模组,所述液冷模组包括泵和液冷模件,所述泵包括泵基体和固定于所述泵基体的压电组件,所述泵基体设有泵进液口和泵出液口。所述液冷模件包括液冷出液口和液冷进液口,所述液冷出液口用于与所述泵进液口连通,所述液冷进液口用于与所述泵出液口连通,所述液冷出液口周侧的部分所述液冷模件与所述泵进液口周侧的部分所述泵基体为一体化密封结构,所述液冷进液口周侧的部分所述液冷模件与所述泵出液口周侧的部分所述泵基体为一体化密封结构。
其中,泵作为液冷模组的动力源,能够为液冷模件中的冷却介质提供流动和循环的动力,实现主动液冷,从而达到持久散热的效果。主动液冷与被动液冷相比,主动液冷能够根据需要调节泵的速度以达到最佳散热效果,而被动液冷则只能被动地跟随器件温度的变化进行散热,故主动液冷的调节性更佳。需要说明的是,液冷出液口用于与泵进液口连通,不表示液冷出液口与泵进液口时刻保持连通的状态,只是表明在一定条件下,冷却介质能够从液冷出液口流入泵进液口。液冷进液口与泵出液口之间的关系同理。
其中,压电组件利用压电材料的逆压电效应,压电材料是指受到压力作用时会在两端面间出现电压的晶体材料,逆压电效应是指对压电组件施加电场后,压电组件在一定方向上产生机械变形或机械压力,当外加电场撤去时,这些变形或应力也随之消失。在泵中采用压电组件,具有体积小、能量密度大和无电磁干扰等特点,可实现冷却介质的精密输送及控制。在一实施方式中,压电组件包括压电陶瓷、金属基板和塑料隔板(防液体工质腐蚀金属基板)等。
在本实施方式中,液冷出液口周侧的部分液冷模件与泵进液口周侧的部分泵基体为一体化密封结构,液冷进液口周侧的部分液冷模件与泵出液口周侧的部分泵基体为一体化密封结构。其中,形成一体化密封结构是指二者之间由于相互融合渗透而没有连续的界面,液冷出液口的周侧是指液冷出液口周围一圈的邻近区域。若采用螺钉连接的方式将液冷模件与泵基体进行固定,由于在这种情况下液冷模件与泵基体是分体的器件,故二者之间的界限是连续的。与螺钉固定相比,本申请中的一体化密封结构除非施加外力破坏,否则一般情况下无法分离,而采用螺钉连接,只需将螺钉取出,即可将泵基体与液冷模件分离。
采用螺钉连接的固定方式,由于螺钉连接的紧密程度(即密封效果)受限于装配精度和材料自身的回弹力等多种因素,不便于质量管控,进而在实际使用时可能会造成冷却介质泄露,从而影响冷却介质的散热效率,并损坏内部器件,且通常需要在泵中设置底座,螺钉依次穿过底座和液冷模件实现固定。而本申请中的一体化密封结构使得液冷出液口周侧的部分液冷模件与泵进液口周侧的部分泵基体融合为一体,连接关系更加紧密,有利于提升泵基体与液冷模件的密封效果,且无需额外增设底座,简化液冷模组的结构,降低成本和加工难度,并可达到超薄设计。此外,本申请提供的液冷模组可应用于电子设备,当电子设备受到外力作用时(比如跌落至地面,与地面发生碰撞),采用螺钉固定的方式可能会造成泵基体与液冷模件之间连接松动,或O型圈偏移而局部密封不紧密,而一体化密封结构则使得泵基体与液冷模件之间不易发生相对位移,从而有利于提升液冷模组整体结构的稳定性,提高电子设备的使用寿命。
在本申请中,通过液冷模组的设置:第一,利用泵为冷却介质的流动和循环提供动力,在液冷模组中实现主动散热,相比于被动液冷,能够更有效地降低器件的温度,提高散热效率。
第二,液冷模件中位于液冷出液口周侧的区域与泵基体中位于泵进液口周侧的区域为一体化密封结构,液冷模件中位于液冷进液口周侧的区域与泵基体中位于泵出液口周侧的区域为一体化密封结构,相比于采用螺钉固定,一体化密封结构的密封效果更好,能够防止冷却介质泄露,从而避免降低冷却介质的散热效率,保护器件不受损害。
在一实施方式中,液冷出液口、泵进液口的中心在液冷模组的厚度方向对齐,液冷出液口、泵进液口的周壁围设的区域沿厚度方向的投影重叠。本方案有利于降低冷却介质在通过液冷出液口、泵进液口时的流阻,提升冷却效率。
在一实施方式中,液冷进液口、泵出液口的中心在液冷模组的厚度方向对齐,液冷进液口、泵出液口的周壁围设的区域沿厚度方向的投影重叠。本方案有利于降低冷却介质在通过液冷进液口、泵出液口时的流阻,提升冷却效率。
在一种实现方式中,所述液冷出液口周侧的部分所述液冷模件中的至少部分与所述泵进液口周侧的部分所述泵基体的至少部分沿所述液冷出液口的周向连续融合为一体,以形成一体化密封结构。
在本实施方式中,为保证泵基体与液冷模件之间的密封效果,需要一体化密封结构沿液冷出液口的周向连续融合为一体化密封结构。在一实施方式中,一体化密封结构可以为椭圆形、方形、三角形、不规则图形。在一实施方式中,液冷出液口周侧沿径向全部形成一体化密封结构。
在一实施方式中,在液冷出液口的径向上,液冷出液口周侧的部分液冷模件与泵进液口周侧的部分泵基体之间可具有不连续的界面,且界面之间的间距不限,其中,没有界面的位置为一体化密封结构。在一优选的实施方式中,在液冷出液口的径向上,液冷出液口周侧的部分液冷模件与泵进液口周侧的部分泵基体之间不形成界面,为优选密封效果最好的加工工艺。
可以理解的,在本实现方式中,径向和周向是基于液冷出液口为圆形来确定的,当液冷出液口为其他形状时,径向可理解为从液冷出液口的中心指向周侧某一个位置的方向。
在一实施方式中,液冷进液口周侧的部分液冷模件中的至少部分与泵出液口周侧的部分泵基体的至少部分沿所述液冷进液口的周向连续融合为一体,以形成一体化密封结构。在本方案中,液冷进液口周侧的一体化密封结构沿液冷进液口的周向连续融合为一体。
在一种实现方式中,所述泵基体包括泵底壁,所述泵底壁与所述压电组件以及两者之间的部分泵基体围设构成泵腔,所述泵进液口和所述泵出液口设于所述泵底壁且与所述泵腔连通,所述泵底壁与所述液冷出液口周侧以及所述液冷进液口周侧的部分所述液冷模件为一体化密封结构。
在本实施方式中,泵进液口和泵腔的连通关系与液冷出液口和泵进液口的连通关系类似,即泵进液口与泵腔之间并非时刻保持连通,而是在压电组件的驱动下,冷却介质通过液冷出液口和泵进液口进入泵腔内。泵出液口和泵腔的连通关系同理。在本实施方式中,泵进液口和泵出液口均设置在泵底壁,且位于泵进液口和泵出液口周侧的部分泵底壁与部分液冷模件为一体化密封结构,即无需额外在泵中增设底座。若在泵中设置底座,一方面,只能通过螺钉将底座与液冷模件固定,密封效果不佳,容易造成冷却介质泄露,另一方面,通常需要将泵进液口和泵出液口设置在底座外侧,延长了冷却介质的流通路径,降低冷却介质的散热效率。
在本实施方式中,液冷模组包括两个并联的泵,两个泵并联能够实现更大的流量。在另一实施方式中,液冷模组包括两个串联的泵,两个泵串联能够实现更大的驱动压力。在另一实施方式中,液冷模组可包括多个泵,多个泵可分布在液冷模组中的不同位置,具体可根据需要来设置。
在一种实施方式中,所述泵还包括固定于所述泵底壁的进液阀膜和出液阀膜,所述进液阀膜用于闭合或者打开所述泵进液口,所述出液阀膜用于闭合或者打开所述泵出液口。
在本实施方式中,在进液场景下,压电组件用于接收电信号后产生形变,泵腔体积变大,驱动进液阀膜打开和出液阀膜闭合,为液冷模件中的冷却介质提供动力,使得冷却介质依次从液冷出液口、泵进液口进入泵腔内。在出液场景下,压电组件用于接收电信号后产生形变,泵腔体积变小,驱动进液阀膜闭合和出液阀膜打开,为液冷模件中的冷却介质提供动力,使得冷却介质依次从泵出液口、液冷进液口进入液冷模件。
在本实施方式中,进液阀膜沿厚度方向位于泵进液口远离液冷出液口的一侧,出液阀膜沿厚度方向位于泵出液口与液冷进液口之间。在另一实施方式中,进液阀膜沿厚度方向位于泵进液口与泵腔之间,出液阀膜沿厚度方向位于液冷进液口远离泵出液口的一侧。
值得一提的是,如果压电组件长期处于高温状态将会老化,导致性能衰减,故本实现方式中的液冷模组除了对电子设备的器件进行冷却以外,还能对液冷模组自身所包含的泵进行性能优化。
在一种实现方式中,所述泵基体还包括位于所述泵底壁与所述压电组件之间的泵侧壁,所述泵侧壁为一体化密封结构。在本实施方式中,泵侧壁沿液冷模组的厚度方向延伸,由于泵侧壁与泵底壁、压电组件共同围合成泵腔,故本方案设置泵侧壁为一体化密封结构,能够有效防止冷却介质从泵侧壁泄露,提升泵基体的密封性能。
在一种实施方式中,所述泵基体包括沿所述厚度方向层叠设置的泵腔层、第一流道层、阀片层和第二流道层,在所述泵腔层中设有腔体孔,所述第一流道层中设有所述泵出液口以及与所述泵进液口对应的第一导流通道,所述第一流道层与所述泵腔层中的所述腔体孔连通,所述阀片层中设有可打开和闭合的所述进液阀膜和所述出液阀膜,所述第二流道层中设有所述泵进液口以及与所述泵出液口对应的第二导流通道,所述第二流道层与所述液冷模件连通,所述泵腔层、所述第一流道层、所述阀片层和所述第二流道层通过热压形成一体化密封结构。
在本实施方式中,泵进液口、进液阀膜以及第一导流通道在液冷模组的厚度方向上对应设置,泵出液口、出液阀膜以及第二导流通道在液冷模组的厚度方向上对应设置。在本实施方式中,当进液阀膜打开而出液阀膜闭合时,冷却介质从泵进液口依次经过进液阀膜和第一导流通道进入泵腔,当出液阀膜打开而进液阀膜闭合时,冷却介质从泵出液口依次经过出液阀膜和第二导流通道进入液冷模件。其中,第一导流通道的周壁围设的区域沿厚度方向的投影面积大于泵进液口的周壁围设的区域沿厚度方向的投影面积,有利 于避免冷却介质回流至泵进液口,发挥第一导流通道对于冷却介质的导流效果。第二导流通道的周壁围设的区域沿厚度方向的投影面积大于泵出液口的周壁围设的区域沿厚度方向的投影面积,有利于避免冷却介质回流至泵进液出,发挥第二导流通道对于冷却介质的导流效果。
在本实施方式中,泵腔层、第一流道层、阀片层和第二流道层的边缘热压形成泵侧壁,使得每层之间密封,提升泵基体的密封效果。
在一种实现方式中,所述液冷模件包括第一柔性膜,所述液冷出液口和所述液冷进液口设置于所述第一柔性膜,所述泵底壁与所述液冷出液口周侧以及所述液冷进液口周侧的部分所述第一柔性膜为一体化密封结构。
在本实施方式中,液冷模件与泵的固定连接实际上是第一柔性膜与泵底壁之间的固定连接。第一柔性膜中位于液冷出液口周侧以及液冷进液口周侧的部分与泵底壁为一体化密封结构,由于第一柔性膜与泵底壁材料相同或相近,热压成型的难度较小,故有利于形成一体化密封结构。
在本实施方式中,第一柔性膜和泵底壁之间为不连续界面。在一实施方式中,第一柔性膜和泵底壁的至少部分连续融合为一体,以形成一体化密封结构。在另一实施方式中,第一柔性膜除液冷出液口和液冷进液口以外的部分与泵底壁之间为一体化密封结构,二者之间没有界面。这种密封界面为优选密封界面,具有更强柔韧性、密封性和抗冲击力。但工程上难以完美加工实现,更多为部分连续融合界面,界面间存在微空气间隙或不连续接触的非焊接区。
在一些实施方式中,为了辅助泵与液冷模件之间的连接稳定性,还可在泵与液冷模件200连接的位置采用胶粘接密封,提升密封性和可靠性。
在一种实现方式中,所述泵底壁的材质的玻璃化转变温度与所述第一柔性膜的材质的玻璃化转变温度的差值小于或者等于20℃。在本实施方式中,将泵底壁的材质与第一柔性膜的材质的玻璃化转变温度的差值设置较小,有利于泵底壁与第一柔性膜通过热压键合密封为一体结构,提升两者的密封效果。
在一实现方式中,所述泵底壁的材质的熔融温度与所述第一柔性膜的材质的熔融温度的差值小于或者等于20℃。在本实施方式中,将泵底壁的材质与第一柔性膜的材质的熔融温度的差值设置较小,有利于泵底壁与第一柔性膜通过热压键合密封为一体结构,提升两者的密封效果。
在一实现方式中,所述液冷出液口周侧的部分所述液冷模件的材质与所述泵进液口周侧的部分所述泵基体的材质相同,所述液冷进液口周侧的部分所述液冷模件的材质与所述泵出液口周侧的部分所述泵基体的材质相同。本方案有利于促使液冷出液口周侧的部分液冷模件与部分泵基体之间形成一体化密封结构,液冷进液口周侧的部分液冷模件与部分泵基体之间形成一体化密封结构,有利于避免冷却介质泄露。
在一种实现方式中,所述泵底壁的材质选自断裂伸长率大于10%的柔性耐温聚合物材料,所述泵底壁的材质选自聚对苯二甲酸乙二醇酯共聚物、聚萘二甲酸乙二醇酯、聚2,5-呋喃二甲酸乙二醇酯、聚酰亚胺、聚醚醚酮、双轴拉伸聚丙烯中的至少一种。所述第一柔性膜的材质选自断裂伸长率大于10%的柔性耐温聚合物材料,所述第一柔性膜的材质选自聚对苯二甲酸乙二醇酯共聚物、聚萘二甲酸乙二醇酯、聚2,5-呋喃二甲酸乙二醇酯、聚酰亚胺、聚醚醚酮、双轴拉伸聚丙烯中的至少一种。在本实现方式中,泵底壁与第一柔性膜选用的材质有利于泵底壁与第一柔性膜之间热压形成一体化密封结构,其中,泵底壁与第一柔性膜可为不同的材质,只要保证泵底壁与第一柔性膜之间能形成一体化密封结构即可。
在一种实现方式中,所述聚对苯二甲酸乙二醇酯共聚物的单体包括对苯二甲酸、乙二醇和硬段分子结构,所述硬段分子结构占所述聚对苯二甲酸乙二醇酯共聚物的质量百分数的取值大于或者等于20%、且小于或者等于80%。本方案在聚对苯二甲酸乙二醇酯的结构中引入硬段分子结构,能够提升聚对苯二甲酸乙二醇酯共聚物的玻璃化转变温度,当聚对苯二甲酸乙二醇酯共聚物被应用于液冷模组中时,能够使得液冷模组适用于中高温的应用场景。
在本实施方式中,将硬段分子结构设置为上述比值,可提升聚对苯二甲酸乙二醇酯共聚物的结构强度,当聚对苯二甲酸乙二醇酯共聚物被应用于液冷模组中时,能够提升液冷模组的抗冲击和抗跌落性能,有效保护电子设备内部的其他器件。
在一种实现方式中,所述硬段分子结构选自2,5-呋喃二甲酸、碳酸二甲酯和2,6-萘二甲酸中的至少一种。在本实现方式中,采用上述材料作为硬段分子结构,能够提升聚对苯二甲酸乙二醇酯共聚物的结构强度。当采用除碳酸二甲酯以外的其他硬段分子结构时,还能缓解第一柔性膜和第二柔性膜的蒸散问题,降低透水性和透气性。
在一种实现方式中,所述液冷模件还包括第二柔性膜和位于所述第一柔性膜和所述第二柔性膜之间的第一刚性基体,所述第一柔性膜、所述第二柔性膜和所述第一刚性基体围合构成所述液冷模件的内腔,所 述第一刚性基体的两端分别与所述第一柔性膜和所述第二柔性膜为一体化密封结构。
在本实施方式中,第一刚性基体与第一柔性膜和第二柔性膜之间的密封焊接的两界面材料相同或相近,采用热压键合密封焊、热熔焊、超声波焊、超周波焊等无焊膏或其它第三材质的焊接方式,可提升第一刚性基体与第一柔性膜和第二柔性膜之间的的密封性和可靠性。如果第一刚性基体与第一柔性膜、第二柔性膜之间密封出现泄露,将导致系统性能快速下降并快速失效。
在本实施方式中,第一柔性膜和第二柔性膜具有柔性,弯折性能好,适用于液冷模件需要弯折的情况。在第一柔性膜和第二柔性膜之间设置第一刚性基体,第一刚性基体的两端用于支撑第一柔性膜和第二柔性膜,有利于提高液冷模件在厚度方向上的整体强度。冷却介质在第一柔性膜、第二柔性膜和第一刚性基体围合成的内腔中流动,本方案设置第一刚性基体的两端分别与第一柔性膜和第二柔性膜为一体化密封结构,能够提升内腔的密封性,避免内腔中的冷却介质泄漏。
在本实施方式中,第一刚性基体的两端分别与第一柔性膜和第二柔性膜之间为不连续界面。在一实施方式中,第一刚性基体的两端和第一柔性膜和第二柔性膜的至少部分连续融合为一体,以形成一体化密封结构。在另一实施方式中,第一刚性基体的两端与第一柔性膜和第二柔性膜全部连续融合为一体化密封结构,第一刚性基体的两端与第一柔性膜之间没有界面,第一刚性基体的两端与第二柔性膜之间没有界面,有利于进一步提升密封效果。
在一实施方式中,第一刚性基体环绕第一柔性膜和第二柔性膜的边缘设置。本方案有利于提升液冷模件的边缘在厚度方向上的强度,同时一体化密封结构能够有效避免冷却介质在液冷模件的边缘处发生泄露。
在一实施方式中,第一柔性膜、第二柔性膜的厚度小于液冷模组的长度和宽度。具体地,第一柔性膜与第二柔性膜的厚度与液冷模组的长度的比值均小于或者等于0.2,第一柔性膜与第二柔性膜的厚度与液冷模组的宽度的比值均小于或者等于0.2。当液冷模组应用于折叠设备时,本方案能够保证第一柔性膜和第二柔性膜在弯折方向上的柔性,降低设备的弯折难度。
在一实施方式中,第一柔性膜、第二柔性膜的材质为断裂伸长率高于10%的材质,以适应系统压力波动和弯折使用。优选的,第一柔性膜、第二柔性膜的材质为断裂伸长率高于50%的材质。在一实施方式中,第一柔性膜、第二柔性膜表面做防蒸散镀层处理,如在聚合物薄膜表面镀一次柔性无机氧化薄膜对水气进行隔绝。
在一种实现方式中,所述第一刚性基体的材质的玻璃化转变温度与所述第一柔性膜的玻璃化转变温度的差值小于或者等于20℃。在本实施方式中,将第一刚性基体的材质与第一柔性膜的材质的玻璃化转变温度的差值设置较小,有利于第一刚性基体与第一柔性膜通过热压键合密封为一体结构,提升两者的密封效果。
在一实现方式中,所述第一刚性基体的材质的玻璃化转变温度与所述第二柔性膜的玻璃化转变温度的差值小于或者等于20℃。在本实施方式中,将第一刚性基体的材质与第二柔性膜的材质的玻璃化转变温度的差值设置较小,有利于第一刚性基体与第二柔性膜通过热压键合密封为一体结构,提升两者的密封效果。
在一种实现方式中,所述第一刚性基体的材质的熔融温度与所述第一柔性膜的材质的熔融温度的差值小于或者等于20℃。将第一刚性基体的材质与第一柔性膜的材质的熔融温度的差值设置较小,有利于第一刚性基体与第一柔性膜通过热压键合密封为一体结构,提升两者的密封效果。
在一实现方式中,所述第一刚性基体的材质的熔融温度与所述第二柔性膜的材质的熔融温度的差值小于或者等于20℃。将第一刚性基体的材质与第二柔性膜的材质的熔融温度的差值设置较小,有利于第一刚性基体与第二柔性膜通过热压键合密封为一体结构,提升两者的密封效果。
在一种实现方式中,所述第一柔性膜和所述第二柔性膜中的至少一个包括两层子柔性膜层和位于所述两层子柔性膜层之间的防蒸散层,所述防蒸散层包括聚酰亚胺层、聚偏二氯乙烯层或者金属薄膜层中的至少一个。
在本实施方式中,子柔性膜层的材质可选自前文中第一柔性膜或者第二柔性膜的材质中的任一种。在一种实施方式中,子柔性膜层的材质可选自前文所述的聚对苯二甲酸乙二醇酯共聚物,简称PET共聚物。
在本实施方式中,在第一柔性膜和第二柔性膜中的至少一个采用多层膜工艺,即将第一柔性膜和第二柔性膜设置成“PET共聚物-X-PET共聚物”的三明治式的结构,其中X层是指防蒸散层。聚酰亚胺、聚偏二氯乙烯和金属薄膜是低水气透过率的材料,防蒸散层采用上述材料,能够减少水气在第一柔性膜和第二柔性膜的蒸散。在一实施方式中,采用多层共挤出技术或者多层膜压技术在第一柔性膜和第二柔性膜中实现多层膜结构。
在一实施方式中,金属薄膜层可为铜膜、镍膜、铝膜或金属塑料复合膜材,且厚度小于或者等于10 微米。在本实施方式中,当液冷模组应用于折叠设备时,本方案有利于保证第一柔性膜和第二柔性膜满足10-40万次不同弯折角的弯折测试的要求。
在一种实现方式中,所述第一柔性膜和所述第二柔性膜中的至少一个远离所述内腔的表面设有无机氧化薄膜。在本实施方式中,第一柔性膜和第二柔性膜远离内腔的表面虽然不与冷却介质直接接触,但均是冷却介质在蒸散至外界时必须经过的界面,设置无机氧化薄膜,有利于对水气进行隔绝,缓解冷却介质的蒸散问题。
在一种实现方式中,所述液冷模件还包括第二刚性基体,所述第二刚性基体将所述液冷模件的内腔分隔为进液流道和出液流道,所述液冷进液口与所述进液流道连通,所述液冷出液口与所述出液流道连通,所述第二刚性基体的两端分别与所述第一柔性膜和所述第二柔性膜为一体化密封结构。
在本实施方式中,第二刚性基体的两端分别与第一柔性膜和第二柔性膜采用一体化密封结构,提升密封性和可靠性。如果第二刚性基体与第一柔性膜、第二柔性膜间的分割和密封出现泄露,将导致液冷系统性能大幅下降并逐渐失效。
在本实施方式中,第二刚性基体用于将内腔的流道分隔为进液流道和出液流道,进液流道和出液流道均由第二刚性基体与第一刚性基体、第一柔性膜和第二柔性膜围合形成。进液流道与液冷进液口保持连通的状态,出液流道与液冷出液口保持连通的状态。进液流道和出液流道通过第二刚性基体分隔开,有利于避免进液流道和出液流道中的冷却介质发生混流进而降低冷却效率。第二刚性基体的两端均与第一柔性膜和第二柔性膜之间一体化热压密封,有利于提升进液流道和出液流道之间的隔绝效果,且能够进一步提升液冷模件的结构强度。
可以理解的,进液流道和出液流道并不是完全隔离的两部分,第二刚性基体仅仅是将与泵邻近的进液流道和出液流道分隔开,而为了使冷却介质在液冷模件中形成循环,进液流道和出液流道在远离泵的区域连通。
在本实施方式中,第二刚性基体的两端分别与第一柔性膜和第二柔性膜之间为不连续界面。在一实施方式中,第二刚性基体的两端和第一柔性膜和第二柔性膜的至少部分连续融合为一体,以形成一体化密封结构。在另一实施方式中,第二刚性基体的两端与第一柔性膜和第二柔性膜全部连续融合为一体化密封结构,第二刚性基体的两端与第一柔性膜之间没有界面,第二刚性基体的两端与第二柔性膜之间没有界面,有利于进一步提升密封效果。
在一种实施方式中,所述第二刚性基体包括位于所述泵下方的第一子刚性基体和位于所述泵外侧的第二子刚性基体,所述第一子刚性基体在所述第二柔性膜的正投影与所述液冷进液口和所述液冷出液口的边缘所围设的区域在所述第二柔性膜的正投影不重叠。其中,泵的下方是指泵沿厚度方向靠近液冷模件的一侧。在一实施方式中,第一子刚性基体在第二柔性膜的正投影与泵进液口和泵出液口的边缘所围设的区域在第二柔性膜的正投影不重叠。在一实施方式中,为了加工方便或者为了第一子刚性基体更够更好的分割泵两侧的流道,可第一子刚性基体可延伸至泵的外侧一点。第二刚性基体主要起到分隔进液流道和出液流道的作用,但是第二刚性基体不能对冷却介质出入泵腔造成阻碍,故本方案通过设置第一子刚性基体在第二柔性膜的正投影与液冷进液口和液冷出液口的边缘所围设的区域在第二柔性膜的正投影不重叠,能够减小冷却介质在通过液冷进液口和液冷出液口时的流阻。
在一实施方式中,第一子刚性基体与第一刚性基体的材质相同。第一子刚性基体位于泵下方,泵在工作时泵出的冷却液体从液冷进液口和液冷出液口进出时会对第一子刚性基体具有冲击压力,将导致系统性能快速下降并快速失效。将第一子刚性基体与第一刚性基体的材质设置相同,使得第一子刚性基体和第一柔性膜、第二柔性膜之间的密封效果、结构强度与第一刚性基体和第一柔性膜、第二柔性膜之间的密封效果、结构强度相同,有效提升第一子刚性基体与第一柔性膜、第二柔性膜之间的密封效果和结构强度,避免泵附近的液体冲击第一子刚性基体而影响密封效果。
在一实施方式中,第一子刚性基体与第一刚性基体为一体化结构,提升第一子刚性基体与第一刚性基体之间的密封性和可靠性。在一实施方式中,第一子刚性基体与第二子刚性基体为一体化结构。提升第一子刚性基体与第二子刚性基体之间的密封性和可靠性。
在一实施方式中,第一子刚性基体与第一刚性基体、第一柔性膜或者第二柔性膜同时热压焊接。本方案能够提升第一子刚性基体与第一柔性膜或者第二柔性膜之间的密封效果和结构强度。
在一实施方式中,第二刚性基体整体呈条状。本方案能够降低加工成本,同时第二刚性基体较为规则的形状有利于减小第二刚性基体对冷却介质的产生的流动阻力。
在一实施方式中,与第二刚性基体在厚度方向上对应设置的第一柔性膜与泵底壁之间为一体化密封结 构。本方案能够进一步保证进液流道和出液流道中的冷却介质不发生短路和混流。
在一种实现方式中,所述液冷模件还包括第三刚性基体,所述第三刚性基体分布于所述进液流道和所述出液流道内,所述第三刚性基体的两端分别与所述第一柔性膜和所述第二柔性膜为一体化密封结构。如果第三刚性基体与第一柔性膜和第二柔性膜间的分割和密封如出现泄露,将导致液冷系统性能小幅下降,但并不会导致整个液冷系统失效。
在本实施方式中,多个第三刚性基体将进液流道分隔为多个彼此连通的进液子流道,将出液流道分隔为多个彼此连通的出液子流道,第三刚性基体在进液流道和出液流道中分别起到了导流的作用,减少流动阻力和避免涡流损耗,有利于增强冷却介质的换热效果。第三刚性基体整体可呈条状和圆柱状,第三刚性基体呈条状有利于引导冷却介质的流动,第三刚性基体呈圆柱状有利于加强冷却介质的混合。
在一实施方式中,由于第三刚性基体同时起到导流和混流的作用,故可将第三刚性基体设置在进液流道或出液流道宽度突变的区域、冷却介质流动方向突变的区域以及与液冷进液口邻近的区域。
在本实施方式中,第三刚性基体的两端分别与第一柔性膜和第二柔性膜之间为不连续界面。在一实施方式中,第三刚性基体的两端和第一柔性膜和第二柔性膜的至少部分连续融合为一体,以形成一体化密封结构。在另一实施方式中,第三刚性基体的两端与第一柔性膜和第二柔性膜全部连续融合为一体化密封结构,第三刚性基体的两端与第一柔性膜之间没有界面,第二刚性基体的两端与第二柔性膜之间没有界面,能够进一步提升密封效果。
在一实施方式中,第一刚性基体、第二刚性基体和第三刚性基体的厚度均小于液冷模组的宽度,具体地,第一刚性基体、第二刚性基体和第三刚性基体的厚度与液冷模组的宽度的比值范围均为大于或者等于0.1,且小于或者等于0.2。第一刚性基体、第二刚性基体和第三刚性基体的厚度均小于液冷模组的长度,具体地,第一刚性基体、第二刚性基体和第三刚性基体的厚度与液冷模组的长度的比值范围均为大于或者等于10-5,且小于或者等于0.2。本方案有利于保证液冷模组在厚度方向上的高强度以及液冷模组在长度方向和宽度方向上的柔性。
在一实施方式中,第一刚性基体、第二刚性基体和第三刚性基体的厚度不相等。其中,厚度是指在厚度方向上的尺寸。在本实施方式中,三种刚性基体为不等厚设计,当液冷模组应用于折叠设备时,有利于充分利用折叠设备内的空间,避让设备内的其他器件,优化布局。
在一实施方式中,第一柔性膜或者第二柔性膜还可设置有注液口和抽气口等,注液口和抽气口与三种刚性基体的至少一种以及第一柔性膜或者第二柔性膜为一体化密封结构。在本实施方式中,注液口用于在冷却之前向内腔中注入冷却介质,抽气口用于抽出内腔中的气体,避免散热效果受到负面影响。注液口和抽气口与第一刚性基体、第二刚性基体和第三刚性基体中的至少一个、第一柔性膜或者第二柔性膜一体密封连接,有利于避免在注液口和抽气口中发生冷却介质的泄露。为实现超薄效果,注液口、抽气口与液冷模件在同一面内,即在第一柔性膜、第二柔性膜之间。
在一种实现方式中,所述液冷模件包括液冷膜弯折区,所述液冷模件通过所述液冷膜弯折区折叠,所述第一刚性基体、所述第二刚性基体和所述第三刚性基体中的至少一个设有增柔结构,所述增柔结构位于所述液冷膜弯折区,所述增柔结构用于提升所述液冷膜弯折区的柔韧性。
在本实施方式中,第一刚性基体、第二刚性基体和第三刚性基体由于具有刚性而能够增强液冷模件在厚度方向上的强度。当液冷模件应用于折叠设备时,又需要液冷模件的弯折部分具有一定的柔性,故本方案在液冷模件的液冷膜弯折区设置增柔结构,能够减小液冷模件的弯折部分在弯折时受到的阻力,满足电子设备的折叠要求。
在一实施方式中,增柔结构可为凹槽、贯穿孔、通孔、开孔中的至少一种。
在一实施方式中,液冷模件还包括位于液冷膜弯折区两侧的第一液冷膜静止区和第二液冷膜静止区。在液冷膜弯折区进行弯折的时候,第一液冷膜静止区和第二液冷膜静止区不发生形变。
在一种实现方式中,所述第一刚性基体的增柔结构包括位于所述第一刚性基体的侧壁上的凹槽,所述凹槽位于所述液冷膜弯折区。
在本实施方式中,第一刚性基体环绕液冷模组的边缘设置,是冷却介质与外界环境之间的屏障,故第一刚性基体需要具有较高的结构强度,以确保密封效果,使得冷却介质始终不泄露至液冷模组的外侧。而位于液冷膜弯折区的第一刚性基体需要兼顾结构强度和一定的柔韧性,故设置在第一刚性基体上的增柔结构优选为凹槽。若在第一刚性基体上设置贯穿孔、通孔或者开孔,将面临冷却介质泄露的风险。
在一种实现方式中,所述第二刚性基体的增柔结构包括沿第一方向贯穿所述第二刚性基体的通孔,所述通孔位于所述液冷膜弯折区内,所述第一方向为所述第一柔性膜和所述第二柔性膜的排列方向。
在本实施方式中,在第二刚性基体中设置通孔,能够提升第二刚性基体的弯折部分的柔韧性。由于第二刚性基体两侧分别为进液流道和出液流道,故第二刚性基体上的开孔不能将两侧的冷却介质连通,以避免因混流而影响冷却效果。其中,第一方向A也为液冷模件的厚度方向。
在一实现方式中,所述液冷模件设有沿所述第一方向贯穿所述第二刚性基体、所述第一柔性膜和所述第二柔性膜的贯穿孔,所述贯穿孔位于所述液冷膜弯折区内。
在本实施方式中,在第二刚性基体中设置贯穿孔,能够提升第二刚性基体的弯折部分的柔韧性,减少弯折时液冷模件弯折区的反弹力和摩檫力。其中,第一方向即为液冷模组的厚度方向。贯穿孔沿第一方向贯穿第二刚性基体不会导致进液流道和出液流道中的冷却介质流动短路和混流。第三刚性基体可开孔,减少弯折时液冷模件弯折区的反弹力和与屏、中框的摩檫力,不会引起冷却介质流动短路。
在一实施方式中,第二刚性基体的增柔结构包括通孔和贯穿孔,或者第二刚性基体的增柔结构包括通孔和贯穿孔的任意一种。本方案在第二刚性基体中可根据实际情况灵活设置通孔和贯穿孔,提升第二刚性基体的在不同应用环境中的实用性。
在一种实现方式中,所述第三刚性基体的增柔结构包括位于所述第三刚性基体的开孔,所述开孔连通所述第三刚性基体两侧的流道。
在本实施方式中,由于液冷膜弯折区在弯折时产生的形变较大,本方案设置在第三刚性基体中设置开孔,相当于第三刚性基体在开孔的位置局部断开,诱导在设计位置弯折变形,有效减小弯折时产生的应力。部分第三刚性基体分布在进液流道,部分第三刚性基体分布在出液流道中,即第三刚性基体两侧的流道同属于进液流道或者同属于出液流道,故开孔将第三刚性基体的两侧连通不会影响散热效率,且可以增加进液流道内或者出液流道内相同流动方向的冷却介质的混流作用,提升冷却效果。
在一实施方式中,增柔结构可沿冷却介质的流动方向延伸。在另一实施方式中,增柔结构可沿折叠设备的折叠方向延伸。将增柔结构在其延伸方向上的尺寸设置较大,能够有效提升液冷膜弯折区的柔韧性,减少弯折时液冷模件弯折区的反弹力和与屏、中框的摩檫力,进而改善用户对于折叠设备的使用体验。
在一种实施方式中,第一柔性膜和第二柔性膜的远离内腔的表面敷设有润滑材料层,润滑材料层位于液冷膜弯折区内。在本实施方式中,为了提升液冷膜弯折区的柔韧性,除了在第一刚性基体、第二刚性基体和第三刚性基体上设置增柔结构以外,还可在第一柔性膜和第二柔性膜的外表面设置润滑材料层,减小液冷膜弯折区在弯折时的摩擦力,使得弯折过程能够更加顺利进行。示例性的,润滑材料层包括但不限于铁氟龙膜、石墨膜、石墨烯膜或润滑脂等固态、液态或膏状等润滑材料。其中,当润滑材料层采用石墨膜或者石墨烯膜,润滑材料层可仅布置在液冷膜弯折区,也可同时布置在第一液冷膜静止区和第二液冷膜静止区中的至少一个以及液冷膜弯折区,此时润滑材料层除对液冷膜静止区发挥润滑减摩的作用外,由于石墨和石墨烯本身具备较高的导热系数,故润滑材料层还能够增强散热效果,降低冷却介质整体的温度,从而减少泵的启动时间和频次。
第二方面,本申请提供一种液冷模件,所述液冷模件包括第一柔性膜、第二柔性膜和位于所述第一柔性膜和所述第二柔性膜之间的第一刚性基体,所述第一柔性膜、所述第二柔性膜和所述第一刚性基体围合构成所述液冷模件的内腔,所述第一刚性基体的玻璃化转变温度与所述第一柔性膜的材质的玻璃化转变温度的差值小于或者等于20℃。
在本实施方式中,第一柔性膜和第二柔性膜能够降低电子设备的弯折难度。第一刚性基体用于增强液冷模件在厚度方向上的结构强度。第一柔性膜、第二柔性膜和第一刚性基体围合成内腔,冷却介质在内腔中流动,第一刚性基体的两端与第一柔性膜和第二柔性膜为一体化密封结构,有利于提升第一刚性基体的密封性能,避免冷却介质的泄露。
在本实施方式中,将第一刚性基体的材质与第一柔性膜的材质的玻璃化转变温度的差值设置较小,有利于第一刚性基体与第一柔性膜通过热压键合密封为一体结构,提升两者的密封效果。
在一实施方式中,第一刚性基体的材质的熔融温度与第一柔性膜的材质的熔融温度的差值小于或者等于20℃。在本实施方式中,将第一刚性基体的材质与第一柔性膜的材质的熔融温度的差值设置较小,有利于第一刚性基体与第一柔性膜通过热压键合密封为一体结构,提升两者的密封效果。
第三方面,本申请提供一种液冷模件,所述液冷模件包括第一柔性膜、第二柔性膜和位于所述第一柔性膜和所述第二柔性膜之间的第一刚性基体,所述第一柔性膜、所述第二柔性膜和所述第一刚性基体围合构成所述液冷模件的内腔,所述第一柔性膜、所述第二柔性膜和所述第一刚性基体的材质选自断裂伸长率大于10%的柔性耐温聚合物材料,所述第一柔性膜、所述第二柔性膜和所述第一刚性基体的材质各自独立地选自聚对苯二甲酸乙二醇酯共聚物、聚萘二甲酸乙二醇酯、聚2,5-呋喃二甲酸乙二醇酯、聚酰亚胺、聚 醚醚酮、双轴拉伸聚丙烯中的至少一种。
在本实施方式中,第一柔性膜和第二柔性膜能够降低电子设备的弯折难度。第一刚性基体用于增强液冷模件在厚度方向上的结构强度。第一柔性膜、第二柔性膜和第一刚性基体围合成内腔,冷却介质在内腔中流动,第一刚性基体的两端与第一柔性膜和第二柔性膜为一体化密封结构,有利于提升第一刚性基体的密封性能,避免冷却介质的泄露。
在本实施方式中,第一刚性基体与第一柔性膜或者第二柔性膜所选用的材质有利于第一刚性基体与第一柔性膜或者第二柔性膜热压形成一体化密封结构。其中,第一刚性基体与第一柔性膜或者第二柔性膜可为不同的材质,只要保证第一刚性基体与第一柔性膜或者第二柔性膜之间能形成一体化密封结构即可。
第四方面,本申请提供一种液冷模件,所述液冷模件包括第一柔性膜、第二柔性膜和位于所述第一柔性膜和所述第二柔性膜之间的刚性基体。所述液冷模件包括液冷膜弯折区,所述液冷模件通过所述液冷膜弯折区折叠,所述刚性基体设有增柔结构,所述增柔结构位于所述液冷膜弯折区,所述增柔结构用于提升所述液冷膜弯折区的柔韧性。
在本实施方式中,刚性基体的两端用于支撑第一柔性膜和第二柔性膜,在液冷模件中设置刚性基体有利于提升液冷模件在厚度方向上的结构强度。在电子设备弯折时,液冷模件中的液冷膜弯折区产生较大的形变,故在位于液冷膜弯折区的刚性基体上需要设置增柔结构,以增强液冷膜弯折区的柔韧性。在一实施方式中,增柔结构可为凹槽、贯穿孔、通孔和开孔中的至少一种。在一实施方式中,刚性基体可包括第一刚性基体、第二刚性基体和第三刚性基体。
第五方面,本申请提供一种电子设备,所述电子设备包括如第一方面任意一种实现方式所述的液冷模组,所述液冷模组位于所述电子设备内。在一实现方式中,所述液冷模组位于所述电子设备的配件内。在一实现方式中,所述电子设备包括如第二方面、第三方面和第四方面中任一方面所述的液冷模件,所述液冷模件位于所述电子设备内。在一实现方式中,所述液冷模组位于所述电子设备的配件内。
在一种实现方式中,所述电子设备包括第一非折叠部、折叠部和第二非折叠部,所述第二非折叠部通过所述折叠部能够向所述第一非折叠部折叠,所述液冷模件包括液冷膜弯折区,所述电子设备折叠时,所述液冷模件通过所述液冷膜弯折区折叠,所述第一刚性基体、所述第二刚性基体和所述第三刚性基体中的至少一个设有增柔结构,所述增柔结构位于所述液冷膜弯折区,所述增柔结构用于提升所述液冷膜弯折区的柔韧性。
本申请的有益效果:在折叠电子设备上,液冷膜组等效导热系数可达5000W/m-K以上,较跨轴/穿轴石墨类散热材料散热能力提升100%以上;实现液冷系统极简化加工制造、无装配泄露,高柔韧性。
附图说明
为了更清楚地说明本申请实施例中的技术方案,下面将对本申请实施例中所需要使用的附图进行说明。
图1a是本申请第一实施例提供的液冷模组的结构示意图;
图1b是图1a中P部分的局部放大图;
图1c是本申请第一实施例提供的液冷模组的泵部分的实物示意图;
图2是本申请第一实施例提供的液冷模组的剖面图;
图3是本申请第一实施例提供的液冷模组的剖面图;
图4是本申请第一实施例提供的液冷模组的俯视图;
图5是本申请第一实施例提供的液冷模组的剖面图;
图6是本申请第一实施例提供的液冷模组的剖面图;
图7是本申请第一实施例提供的泵部分层叠结构爆炸图;
图8是本申请第一实施例提供的液冷模组的剖面图;
图9是本申请第一实施例提供的液冷模组的剖面图;
图10是本申请第一实施例提供的泵与第二刚性基体的侧视图;
图11是本申请第一实施例提供的液冷模件的剖面图;
图12是本申请第一实施例提供的液冷模件的剖面图;
图13是本申请第一实施例提供的第一柔性膜的剖面图;
图14是本申请第一实施例提供的液冷模件的剖面图;
图15是图1a所示的液冷模组的局部放大图;
图16是本申请第一实施例提供的液冷模件的剖面图;
图17是本申请第一实施例提供的液冷模件的剖面图;
图18是本申请第一实施例提供的液冷模件的剖面图;
图19是本申请第一实施例提供的液冷模件的剖面图;
图20是本申请第一实施例提供的电子设备的结构示意图;
图21是本申请第二实施例提供的电子设备的结构示意图;
图22是本申请第二实施例提供的电子设备的结构示意图;
图23是本申请第三实施例提供的电子设备的结构示意图;
图24是本申请第三实施例提供的液冷模组的局部结构示意图;
图25是本申请第三实施例提供的液冷模组与柔性电路板的结构示意图;
图26是本申请第四实施例提供的液冷模组的结构示意图;
图27为本申请一实施例提供的电子设备的结构示意图;
图28是本申请第五实施例提供的电子设备的结构示意图;
图29为本申请一实施例提供的液冷模组的示意图。
具体实施方式
下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行描述,显然,所描述的实施例仅仅是本申请一部分实施例,而不是全部的实施例。
本文中,术语“第一”、“第二”等仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中,除非另有说明,“多个”的含义是两个或两个以上。
此外,本文中,“上”、“下”等方位术语是相对于附图中的结构示意置放的方位来定义的,应当理解到,这些方向性术语是相对的概念,它们用于相对于的描述和澄清,其可以根据结构所放置的方位的变化而相应地发生变化。
为方便理解,下面先对本申请实施例所涉及的英文简写和有关技术术语进行解释和描述。
PET:polyethylene terephthalate,聚对苯二甲酸乙二醇酯。
玻璃化转变温度:是指由玻璃态转变为高弹态所对应的温度。玻璃化转变温度高,表明材料的耐热性能好。
本申请实施例提供一种液冷模组,液冷模组包括泵和液冷模件,泵用于为液冷模件中的冷却介质提供动力,泵包括泵基体和压电组件,泵基体设有泵进液口和泵出液口。液冷模件包括液冷出液口和液冷进液口,液冷出液口与泵进液口连通,液冷进液口与泵出液口连通,液冷出液口周侧的部分液冷模件与泵进液口周侧的部分泵基体材料相同或相近,为一体化无焊膏或其它第三材质的密封焊接结构,液冷进液口周侧的部分液冷模件与泵出液口周侧的部分泵基体材料相同或相近,为一体化无焊膏或其它第三材质的密封焊接结构。此一体化密封焊接方式包括热压键合密封焊、热熔焊、超声波焊、超周波焊等无焊膏或其它第三材质的焊接方式。液冷模件由第一柔性膜(断裂伸长率>10%)、第二柔性膜(断裂伸长率>10%),第一刚性基体、第二刚性基体、第三刚性基体等组成。第一刚性基体、第二刚性基体与第一柔性膜、第二柔性膜材料相同或相近,其间的密封采用一体化无焊膏或其它第三材质的密封焊接结构。此一体化密封焊接,包括热压键合密封焊、热熔焊、超声波焊、超周波焊等无焊膏或其它第三材质的焊接方式。在本申请实施例提供的液冷模组中,泵与液冷模件及液冷模件内的一体化焊接密封,无装配泄露,耐弯折和冲击,适应系统压力和体积的变化波动,极简化设计和制造,能够避免因密封问题而导致冷却介质泄露,从而提升液冷模组整体结构的稳定性以及电子设备的安全性能。
下面将详细介绍本申请实施例提供的液冷模组。
请参阅图1a、图1b、图1c和图2,图1a为本申请第一实施例提供的液冷模组10的结构示意图,图1b是图1a中P部分的局部放大图;图1c是本申请第一实施例提供的液冷模组的泵部分的实物示意图;图2为本申请第一实施例提供的液冷模组10的剖面图。
在一种实施方式中,液冷模组10包括泵200和液冷模件100(如图1a和图2所示),泵200包括泵基体210和压电组件220等,泵基体210设有泵进液口211和泵出液口212(如图2所示)。液冷模件100包括液冷出液口111和液冷进液口112(如图2所示),液冷出液口111用于与泵进液口211连通,液冷进液口112用于与泵出液口212连通,液冷出液口111周侧的部分液冷模件100与泵进液口211周侧的部分泵基体210为一体化密封结构(如图2所示),液冷进液口112周侧的部分液冷模件100与泵出液口212周 侧的部分泵基体210为一体化密封结构(如图2所示)。工程上泵与液冷模件可辅助点胶,强化结构定位和强度,但非密封焊接面。
其中,泵200作为液冷模组10的动力源,能够为液冷模件100中的冷却介质提供流动和循环的动力,实现主动液冷,从而达到持久散热的效果。主动液冷与被动液冷相比,主动液冷能够根据需要调节泵200的速度以达到最佳散热效果,而被动液冷则只能被动地跟随器件温度的变化进行散热,故主动液冷的调节性更佳。需要说明的是,液冷出液口111用于与泵进液口211连通,不表示液冷出液口111与泵进液口211时刻保持连通的状态,只是表明在一定条件下,冷却介质能够从液冷出液口111流入泵进液口211。液冷进液口112与泵出液口212之间的关系同理。
在本实施方式中,液冷出液口111周侧的部分液冷模件100与泵进液口211周侧的部分泵基体210为一体化密封结构,液冷进液口112周侧的部分液冷模件100与泵出液口212周侧的部分泵基体210为一体化密封结构。其中,形成一体化密封结构是指二者之间由于相互融合渗透而没有连续的界面,液冷出液口111的周侧是指液冷出液口111周围一圈的邻近区域。若采用螺钉连接的方式将液冷模件100与泵基体210进行固定,由于在这种情况下液冷模件100与泵基体210是分体的器件,故二者之间的界限是连续的。与螺钉固定相比,本申请实施例中的一体化密封结构除非施加外力破坏,否则一般情况下无法分离,而采用螺钉连接,只需将螺钉取出,即可将泵基体210与液冷模件100分离。
采用螺钉连接的固定方式,由于螺钉连接的紧密程度(即密封效果)受限于装配精度和材料自身的回弹力等多种因素,不便于质量管控,进而在实际使用时可能会造成冷却介质泄露,从而影响冷却介质的散热效率,并损坏内部器件,且通常需要在泵200中设置底座,螺钉依次穿过底座和液冷模件100实现固定。而本申请实施例中的一体化密封结构使得液冷出液口111周侧的部分液冷模件100与泵进液口211周侧的部分泵基体210融合为一体,连接关系更加紧密,有利于提升泵基体210与液冷模件100的密封效果,且无需额外增设底座,简化液冷模组10的结构,降低成本和加工难度,并可达到超薄设计。此外,本申请实施例提供的液冷模组10可应用于电子设备,当电子设备受到外力作用时(比如跌落至地面,与地面发生碰撞),采用螺钉固定的方式可能会造成泵基体210与液冷模件100之间连接松动,或O型圈偏移而局部密封不紧密,而一体化密封结构则使得泵基体210与液冷模件100之间不易发生相对位移,从而有利于提升液冷模组10整体结构的稳定性,提高电子设备的使用寿命。
在本申请中,通过液冷模组10的设置:第一,利用泵200为冷却介质的流动和循环提供动力,在液冷模组10中实现主动散热,相比于被动液冷,能够更有效地降低器件的温度,提高散热效率。
第二,液冷模件100中位于液冷出液口111周侧的区域与泵基体210中位于泵进液口211周侧的区域为一体化密封结构,液冷模件100中位于液冷进液口112周侧的区域与泵基体210中位于泵出液口212周侧的区域为一体化密封结构,相比于采用螺钉固定,一体化密封结构的密封效果更好,能够防止冷却介质泄露,从而避免降低冷却介质的散热效率,保护器件不受损害。
在一实施方式中,液冷出液口111、泵进液口211的中心在液冷模组10的厚度方向A对齐,液冷出液口111、泵进液口211的周壁围设的区域沿厚度方向A的投影重叠。本方案有利于降低冷却介质在通过液冷出液口111、泵进液口211时的流阻,提升冷却效率。
在一实施方式中,液冷进液口112、泵出液口212的中心在液冷模组10的厚度方向A对齐,液冷进液口112、泵出液口212的周壁围设的区域沿厚度方向A的投影重叠。本方案有利于降低冷却介质在通过液冷进液口112、泵出液口212时的流阻,提升冷却效率。
请参阅图3和图4,图3为本申请第一实施例提供的液冷模组10的剖面图,图4为本申请第一实施例提供的液冷模组10的俯视图,在一种实施方式中,液冷出液口111周侧的部分液冷模件100中的至少部分与泵进液口211周侧的部分泵基体210的至少部分沿所述液冷出液口111的周向D连续融合为一体(结合图3和图4所示),以形成一体化密封结构。
在本实施方式中,为保证泵基体210与液冷模件100之间的密封效果,需要一体化密封结构沿液冷出液口111的周向连续融合为一体化密封结构M,如图4中的环形阴影区域。在一实施方式中,M可以为椭圆形、方形、三角形、不规则图形。在一实施方式中,液冷出液口111周侧沿径向E全部形成一体化密封结构。需要说明的是,可只在液冷出液口111周侧的某个或者某几个位置沿周向D设置连续融合,无第三材质的一体化密封焊接结构。
请结合参阅图3、图5和图6,图5为本申请第一实施例提供的液冷模组10的剖面图,图6为本申请第一实施例提供的液冷模组10的剖面图,在一实施方式中,在液冷出液口111的径向E上,液冷出液口111周侧的部分液冷模件100与泵进液口211周侧的部分泵基体210之间可具有不连续的界面,且界面之 间的间距不限(如图3和图5所示),其中,没有界面的位置为一体化密封结构。在一优选的实施方式中,在液冷出液口111的径向E上,液冷出液口111周侧的部分液冷模件100与泵进液口211周侧的部分泵基体210之间不形成界面(如图6所示),为优选密封效果最好的加工工艺。
可以理解的,在图3至图6所示的液冷模组10中,径向E和周向D是基于液冷出液口111为圆形来确定的,当液冷出液口111为其他形状时,径向E可理解为从液冷出液口111的中心指向周侧某一个位置的方向。
在一实施方式中,液冷进液口112周侧的部分液冷模件100中的至少部分与泵出液口212周侧的部分泵基体210的至少部分沿所述液冷进液口112的周向连续融合为一体,以形成一体化密封结构。在本方案中,液冷进液口112周侧的一体化密封结构沿液冷进液口112的周向连续融合为一体。
请继续参阅图2,在一种实施方式中,泵200还包括压电组件220,压电组件220固定于泵基体210,泵基体210包括泵底壁213,泵底壁213与压电组件220以及两者之间的部分泵基体210围设构成泵腔214,泵进液口211和泵出液口212设于泵底壁213且与泵腔214连通,泵底壁213与液冷出液口111周侧以及液冷进液口112周侧的部分液冷模件100为一体化密封结构。
其中,压电组件220利用压电材料的逆压电效应,压电材料是指受到压力作用时会在两端面间出现电压的晶体材料,逆压电效应是指对压电组件220施加电场后,压电组件220在一定方向上产生机械变形或机械压力,当外加电场撤去时,这些变形或应力也随之消失。在泵200中采用压电组件220,具有体积小、能量密度大和无电磁干扰等特点,可实现冷却介质的精密输送及控制。在一实施方式中,压电组件220包括压电陶瓷、金属基板和塑料隔板(防液体工质腐蚀金属基板)等。
在本实施方式中,泵进液口211和泵腔214的连通关系与液冷出液口111和泵进液口211的连通关系类似,即泵进液口211与泵腔214之间并非时刻保持连通,而是在压电组件220的驱动下,冷却介质通过液冷出液口111和泵进液口211进入泵腔214内。泵出液口212和泵腔214的连通关系同理。在本实施方式中,泵进液口211和泵出液口212均设置在泵底壁213,且位于泵进液口211和泵出液口212周侧的部分泵底壁213与部分液冷模件100为一体化密封结构,即无需额外在泵200中增设底座。若在泵200中设置底座,一方面,只能通过螺钉将底座与液冷模件100固定,密封效果不佳,容易造成冷却介质泄露,另一方面,通常需要将泵进液口211和泵出液口212设置在底座外侧,延长了冷却介质的流通路径,降低冷却介质的散热效率。
请继续参阅图1a,在本实施方式中,液冷模组10包括两个并联的泵200,两个泵200并联能够实现更大的流量。在另一实施方式中,液冷模组10包括两个串联的泵200,两个泵200串联能够实现更大的驱动压力。在另一实施方式中,液冷模组10可包括多个泵200,多个泵200可分布在液冷模组10中的不同位置,具体可根据需要来设置。
请继续参阅图2,在一种实施方式中,泵200还包括固定于泵底壁213的进液阀膜230和出液阀膜240,进液阀膜230用于闭合或者打开泵进液口211,出液阀膜240用于闭合或者打开泵出液口212。在本实施方式中,在进液场景下,压电组件220用于接收电信号后产生形变,泵腔214体积变大,驱动进液阀膜230打开和出液阀膜240闭合,为液冷模件100中的冷却介质提供动力,使得冷却介质依次从液冷出液口111、泵进液口211进入泵腔214内。在出液场景下,压电组件220用于接收电信号后产生形变,泵腔214体积变小,驱动进液阀膜230闭合和出液阀膜240打开,为液冷模件100中的冷却介质提供动力,使得冷却介质依次从泵出液口212、液冷进液口112进入液冷模件100。
在图2所示的实施方式中,进液阀膜230沿厚度方向A位于泵进液口211远离液冷出液口111的一侧,出液阀膜240沿厚度方向A位于泵出液口212与液冷进液口112之间。在另一实施方式中,进液阀膜230沿厚度方向A位于泵进液口211与泵腔214之间,出液阀膜240沿厚度方向A位于液冷进液口112远离泵出液口212的一侧。
值得一提的是,如果压电组件220长期处于高温状态将会老化,导致性能衰减,故本申请实施例中的液冷模组10除了对电子设备的器件进行冷却以外,还能对液冷模组10自身所包含的泵200进行性能优化。
请继续参阅图2,在一种实施方式中,泵基体210还包括位于泵底壁213与压电组件220之间的泵侧壁215,泵侧壁215为一体化密封结构。在本实施方式中,泵侧壁215沿液冷模组10的厚度方向A延伸,由于泵侧壁215与泵底壁213、压电组件220共同围合成泵腔214,故本方案设置泵侧壁215为一体化密封结构,能够有效防止冷却介质从泵侧壁215泄露,提升泵基体210的密封性能。示例性的,泵侧壁215通过热压形成一体化密封结构。热压可为热压键合密封焊、热熔焊、超声波焊、超周波焊等无焊膏或其它第三材质的焊接方式。
请参阅图7,图7为本申请第一实施例提供的泵部分层叠结构爆炸图。泵基体的各层间,采用热压键合密封焊、热熔焊、超声波焊、超周波焊等无焊膏或其它第三材质的密封焊接方式。在一种实施方式中,泵基体210包括沿厚度方向A层叠设置的泵腔层216、第一流道层217、阀片层218和第二流道层219,在泵腔层216中设有腔体孔2161,第一流道层217中设有泵出液口212以及与泵进液口211对应的第一导流通道2171,第一流道层217与泵腔层216中的腔体孔2161连通,阀片层218中设有可打开和闭合的进液阀膜230和出液阀膜240,第二流道层219中设有泵进液口211以及与泵出液口212对应的第二导流通道2191,第二流道层219与液冷模件100连通,泵腔层216、第一流道层217、阀片层218和第二流道层219通过热压形成一体化密封结构。
在本实施方式中,泵进液口211、进液阀膜230以及第一导流通道2171在液冷模组10的厚度方向A上对应设置,泵出液口212、出液阀膜240以及第二导流通道2191在液冷模组10的厚度方向A上对应设置。在图7所示的实施方式中,当进液阀膜230打开而出液阀膜240闭合时,冷却介质从泵进液口211依次经过进液阀膜230和第一导流通道2171进入泵腔214,当出液阀膜240打开而进液阀膜230闭合时,冷却介质从泵出液口212依次经过出液阀膜240和第二导流通道2191进入液冷模件100。其中,第一导流通道2171的周壁围设的区域沿厚度方向A的投影面积大于泵进液口211的周壁围设的区域沿厚度方向A的投影面积,有利于避免冷却介质回流至泵进液口211,发挥第一导流通道2171对于冷却介质的导流效果。第二导流通道2191的周壁围设的区域沿厚度方向A的投影面积大于泵出液口212的周壁围设的区域沿厚度方向A的投影面积,有利于避免冷却介质回流至泵200进液出,发挥第二导流通道2191对于冷却介质的导流效果。
在本实施方式中,泵腔层216、第一流道层217、阀片层218和第二流道层219的边缘热压形成泵侧壁215(结合图2和图7所示),使得每层之间密封,提升泵基体210的密封效果。
请继续参阅图2,在一种实施方式中,液冷模件100包括第一柔性膜110,液冷出液口111和液冷进液口112设置于第一柔性膜110,泵底壁213与液冷出液口111周侧以及液冷进液口112周侧的部分第一柔性膜110为一体化密封结构。
在本实施方式中,液冷模件100与泵200的固定连接实际上是第一柔性膜110与泵底壁213之间的固定连接。第一柔性膜110中位于液冷出液口111周侧以及液冷进液口112周侧的部分与泵底壁213为一体化密封结构,由于第一柔性膜110与泵底壁213材料相同或相近,热压成型的难度较小,故有利于形成一体化密封结构。
在本实施方式中,第一柔性膜110和泵底壁213之间为不连续界面。请参阅图8,图8为本申请第一实施例提供的液冷模组10的剖面图,在一实施方式中,第一柔性膜110和泵底壁213的至少部分连续融合为一体,以形成一体化密封结构。请参阅图9,图9为本申请第一实施例提供的液冷模组10的剖面图,在另一实施方式中,第一柔性膜110除液冷出液口111和液冷进液口112以外的部分与泵底壁213之间为一体化密封结构,二者之间没有界面。这种密封界面为优选密封界面,具有更强柔韧性、密封性和抗冲击力。但工程上难以完美加工实现,更多为部分连续融合界面,界面间存在微空气间隙或不连续接触的非焊接区。
在一些实施方式中,为了辅助泵200与液冷模件100之间的连接稳定性,还可在泵200与液冷模件100连接的位置采用胶粘接密封,提升密封性和可靠性。
请继续参阅图2,在一种实施方式中,液冷模件100还包括第二柔性膜120和位于第一柔性膜110和第二柔性膜120之间的第一刚性基体130,第一柔性膜110、第二柔性膜120和第一刚性基体130围合构成液冷模件100的内腔140,第一刚性基体130的两端分别与第一柔性膜110和第二柔性膜120为一体化密封结构。在一实施方式中,第一刚性基体130与第一柔性膜110和第二柔性膜120密封如出现泄露,将导致系统性能快速下降并快速失效,第一刚性基体130与第一柔性膜110和第二柔性膜120之间的密封焊接的两界面材料相同或相近,采用热压键合密封焊、热熔焊、超声波焊、超周波焊等无焊膏或其它第三材质的焊接方式,可提升第一刚性基体130与第一柔性膜110和第二柔性膜120之间的的密封性和可靠性。
在本实施方式中,第一柔性膜110和第二柔性膜120具有柔性,弯折性能好,适用于液冷模件100需要弯折的情况。在第一柔性膜110和第二柔性膜120之间设置第一刚性基体130,第一刚性基体130的两端用于支撑第一柔性膜110和第二柔性膜120,有利于提高液冷模件100在厚度方向A上的整体强度。冷却介质在第一柔性膜110、第二柔性膜120和第一刚性基体130围合成的内腔140中流动,本方案设置第一刚性基体130的两端分别与第一柔性膜110和第二柔性膜120为一体化密封结构,能够提升内腔140的密封性,避免内腔140中的冷却介质泄漏。
在本实施方式中,第一刚性基体130的两端分别与第一柔性膜110和第二柔性膜120之间为不连续界面。在一实施方式中,第一刚性基体130的两端和第一柔性膜110和第二柔性膜120的至少部分连续融合为一体,以形成一体化密封结构。在另一实施方式中,第一刚性基体130的两端与第一柔性膜110和第二柔性膜120全部连续融合为一体化密封结构,第一刚性基体130的两端与第一柔性膜110之间没有界面,第一刚性基体130的两端与第二柔性膜120之间没有界面。
在一实施方式中,第一刚性基体130环绕第一柔性膜110和第二柔性膜120的边缘设置(如图1a所示)。本方案有利于提升液冷模件100的边缘在厚度方向A上的强度,同时一体化密封结构能够有效避免冷却介质在液冷模件100的边缘处发生泄露。
在一实施方式中,第一柔性膜110、第二柔性膜120的厚度小于液冷模组10的长度和宽度。具体地,第一柔性膜110与第二柔性膜120的厚度与液冷模组10的长度的比值均小于或者等于0.2,第一柔性膜110与第二柔性膜120的厚度与液冷模组10的宽度的比值均小于或者等于0.2。当液冷模组10应用于折叠设备时,本方案能够保证第一柔性膜110和第二柔性膜120在弯折方向上的柔性,降低设备的弯折难度。
在一实施方式中,第一柔性膜110、第二柔性膜120的材质为断裂伸长率高于10%的材质,如高分子PET、PP、PPS、PEN或其改性膜材等,以适应系统压力波动和弯折使用。优选的,第一柔性膜110、第二柔性膜120的材质为断裂伸长率高于50%的材质。在一实施方式中,第一柔性膜110、第二柔性膜120表面做防蒸散镀层处理,如在聚合物薄膜表面镀一次柔性无机氧化薄膜对水气进行隔绝。具体镀层的方式可为物理气相沉积(PVD)、化学气相沉积(CVD)、原子层沉积(ALD)等工艺手段。
请继续参阅图2,在一种实施方式中,液冷模件100还包括第二刚性基体150,第二刚性基体150将液冷模件100的内腔140分隔为进液流道142和出液流道141,液冷进液口112与进液流道142连通,液冷出液口111与出液流道141连通,第二刚性基体150的两端分别与第一柔性膜110和第二柔性膜120为一体化密封结构。第二刚性基体150与第一柔性膜110和第二柔性膜120间的分割和密封如出现泄露,将导致液冷系统性能大幅下降并逐渐失效。在本实施方式中,第二刚性基体150的两端分别与第一柔性膜110和第二柔性膜120采用一体化密封结构,提升密封性和可靠性。
在本实施方式中,第二刚性基体150用于将内腔140的流道分隔为进液流道142和出液流道141,进液流道142和出液流道141均由第二刚性基体150与第一刚性基体130、第一柔性膜110和第二柔性膜120围合形成。进液流道142与液冷进液口112保持连通的状态,出液流道141与液冷出液口111保持连通的状态。进液流道142和出液流道141通过第二刚性基体150分隔开,有利于避免进液流道142和出液流道141中的冷却介质发生混流进而降低冷却效率。第二刚性基体150的两端均与第一柔性膜110和第二柔性膜120之间一体化热压密封,有利于提升进液流道142和出液流道141之间的隔绝效果,且能够进一步提升液冷模件100的结构强度。
可以理解的,进液流道142和出液流道141并不是完全隔离的两部分,第二刚性基体150仅仅是将与泵200邻近的进液流道142和出液流道141分隔开,而为了使冷却介质在液冷模件100中形成循环,进液流道142和出液流道141在远离泵200的区域连通,示例性的,在图1a所示的液冷模组10中,进液流道142和出液流道141在相对狭窄的端部区域连通。
在本实施方式中,第二刚性基体150的两端分别与第一柔性膜110和第二柔性膜120之间为不连续界面。在一实施方式中,第二刚性基体150的两端和第一柔性膜110和第二柔性膜120的至少部分连续融合为一体,以形成一体化密封结构。在另一实施方式中,第二刚性基体150的两端与第一柔性膜110和第二柔性膜120全部连续融合为一体化密封结构,第二刚性基体150的两端与第一柔性膜110之间没有界面,第二刚性基体150的两端与第二柔性膜120之间没有界面。
请结合参阅图2和图10,图10为本申请第一实施例提供的泵200与第二刚性基体150的侧视图,在一实施方式中,第二刚性基体150包括位于泵200下方的第一子刚性基体151和位于泵200外侧的第二子刚性基体152(如图10所示)。第一子刚性基体151在第二柔性膜120的正投影与液冷进液口112和液冷出液口111的边缘所围设的区域在第二柔性膜120的正投影不重叠(如图2所示)。其中,泵200的下方是指泵200沿厚度方向A靠近液冷模件100的一侧。在一实施方式中,第一子刚性基体151在第二柔性膜120的正投影与泵进液口211和泵出液口212的边缘所围设的区域在第二柔性膜120的正投影不重叠。在一实施方式中,为了加工方便或者为了第一子刚性基体151更够更好的分割泵200两侧的流道,可第一子刚性基体151可延伸至泵200的外侧一点,如图1a所示,第一子刚性基体151在图1a中沿左右方向的长度大于泵200沿左右方向的长度。
在一实施方式中,第一子刚性基体151与第一刚性基体130的材质相同(如图1a和图1b所示)。第 一子刚性基体151位于泵200下方,泵200在工作时泵出的冷却液体从液冷进液口112和液冷出液口111进出时会对第一子刚性基体151具有冲击压力,将导致系统性能快速下降并快速失效。将第一子刚性基体151与第一刚性基体130的材质相同,使得第一子刚性基体151和第一柔性膜110、第二柔性膜120之间的密封效果、结构强度与第一刚性基体130和第一柔性膜110、第二柔性膜120之间的密封效果、结构强度相同,有效提升第一子刚性基体151与第一柔性膜110、第二柔性膜120之间的密封效果和结构强度,避免泵200附近的液体冲击第一子刚性基体151而影响密封效果。
在一实施方式中,第一子刚性基体151与第一刚性基体130为一体化结构,如图1a所示,提升第一子刚性基体151与第一刚性基体130之间的密封性和可靠性。在一实施方式中,第一子刚性基体151与第二子刚性基体152为一体化结构。提升第一子刚性基体151与第二子刚性基体152之间的密封性和可靠性。
在一实施方式中,第一子刚性基体151与第一刚性基体130与第一柔性膜110或者第二柔性膜120同时热压焊接,提升第一子刚性基体151与第一柔性膜110或者第二柔性膜120之间的密封效果和结构强度。
在一实施方式中,第二刚性基体150整体呈条状。本方案能够降低加工成本,同时第二刚性基体150较为规则的形状有利于减小第二刚性基体150对冷却介质的产生的流动阻力。
在一实施方式中,与第二刚性基体150在厚度方向A上对应设置的第一柔性膜110与泵底壁213之间为一体化密封结构。本方案能够进一步保证进液流道142和出液流道141中的冷却介质不发生短路和混流。
请继续参阅图2,在一种实施方式中,液冷模件100还包括第三刚性基体160,第三刚性基体160分布于进液流道142和出液流道141内,第三刚性基体160的两端分别与第一柔性膜110和第二柔性膜120为一体化密封结构。第三刚性基体160与第一柔性膜110和第二柔性膜120间的分割和密封如出现泄露,将导致液冷系统性能小幅下降,但并不会导致整个液冷系统失效。
在本实施方式中,多个第三刚性基体160将进液流道142分隔为多个彼此连通的进液子流道,将出液流道141分隔为多个彼此连通的出液子流道,第三刚性基体160在进液流道142和出液流道141中分别起到了导流的作用,减少流动阻力和避免涡流损耗,有利于增强冷却介质的换热效果。第三刚性基体160整体可呈条状和圆柱状,第三刚性基体160呈条状有利于引导冷却介质的流动,第三刚性基体160呈圆柱状有利于加强冷却介质的混合。
请继续参阅图1a,在一实施方式中,由于第三刚性基体160同时起到导流和混流的作用,故可将第三刚性基体160设置在进液流道142或出液流道141宽度突变的区域、冷却介质流动方向突变的区域以及与液冷进液口112邻近的区域。
在本实施方式中,第三刚性基体160的两端分别与第一柔性膜110和第二柔性膜120之间为不连续界面。在一实施方式中,第三刚性基体160的两端和第一柔性膜110和第二柔性膜120的至少部分连续融合为一体,以形成一体化密封结构。在另一实施方式中,第三刚性基体160的两端与第一柔性膜110和第二柔性膜120全部连续融合为一体化密封结构,第三刚性基体160的两端与第一柔性膜110之间没有界面,第二刚性基体150的两端与第二柔性膜120之间没有界面。
在一实施方式中,第一刚性基体130、第二刚性基体150和第三刚性基体160的厚度均小于液冷模组10的宽度,具体地,第一刚性基体130、第二刚性基体150和第三刚性基体160的厚度与液冷模组10的宽度的比值范围均为大于或者等于0.1,且小于或者等于0.2。第一刚性基体130、第二刚性基体150和第三刚性基体160的厚度均小于液冷模组10的长度,具体地,第一刚性基体130、第二刚性基体150和第三刚性基体160的厚度与液冷模组10的长度的比值范围均为大于或者等于10-5,且小于或者等于0.2。本方案有利于保证液冷模组10在厚度方向上的高强度以及液冷模组10在长度方向和宽度方向上的柔性。
在一实施方式中,第一刚性基体130、第二刚性基体150和第三刚性基体160的横截面积的总和小于第一柔性膜110或者第二柔性膜120的面积。第一柔性膜110的面积是指朝向刚性基体的表面的面积,第二柔性膜120的面积是指朝向刚性基体的表面的面积。
在一实施方式中,第一刚性基体130的宽度的取值大于或者等于1mm,且小于或者等于10mm。其中第一刚性基体130的宽度方向与厚度方向A、第一刚性基体130延伸方向均相交。
在一实施方式中,第二刚性基体150的宽度的取值大于或者等于1mm,且小于或者等于10mm。其中第二刚性基体150的宽度方向与厚度方向A、第二刚性基体150延伸方向均相交。
在一实施方式中,当第三刚性基体160为长条形时,第三刚性基体160的宽度的取值大于或者等于1mm,且小于或者等于10mm。其中第三刚性基体160的宽度方向与厚度方向A、第三刚性基体160延伸方向均相交。
在一实施方式中,第一柔性膜110的厚度的取值大于或者等于5μm,且小于或者等于500μm。示例性 的,第一柔性膜110的厚度的取值为40μm。
在一实施方式中,第二柔性膜120的厚度的取值大于或者等于5μm,且小于或者等于500μm。示例性的,第二柔性膜120的厚度的取值为40μm。
在一实施方式中,第一刚性基体130、第二刚性基体150和第三刚性基体160各自的厚度的取值大于或者等于0.1mm,且小于或者等于1mm。示例性的,第一刚性基体130、第二刚性基体150和第三刚性基体160各自的厚度的取值为0.12mm。
请参阅图11,图11为本申请第一实施例提供的液冷模件100的剖面图,在一实施方式中,第一刚性基体130、第二刚性基体150和第三刚性基体160的厚度不相等。其中,厚度是指在厚度方向A上的尺寸。在本实施方式中,三种刚性基体为不等厚设计,当液冷模组10应用于折叠设备时,有利于充分利用折叠设备内的空间,避让设备内的其他器件,优化布局。
请参阅图12,图12为本申请第一实施例提供的液冷模件100的剖面图,在一实施方式中,第一柔性膜110或者第二柔性膜120还可设置有注液口113和抽气口114等,注液口113和抽气口114与三种刚性基体的至少一种以及第一柔性膜110或者第二柔性膜120为一体化密封结构。在本实施方式中,注液口113用于在冷却之前向内腔140中注入冷却介质,抽气口114用于抽出内腔140中的气体,避免散热效果受到负面影响。注液口113和抽气口114与第一刚性基体130、第二刚性基体150和第三刚性基体160中的至少一个、第一柔性膜110或者第二柔性膜120一体密封连接,有利于避免在注液口113和抽气口114中发生冷却介质的泄露。为实现超薄效果,注液口113、抽气口114与液冷模件100在同一面内,即在第一柔性膜110、第二柔性膜120之间。工程上注液口113、抽气口114与液冷模件100间可辅助点胶,强化结构定位和强度,但非密封焊接面。
在一种实施方式中,泵底壁213的材质的玻璃化转变温度与第一柔性膜110的材质的玻璃化转变温度的差值小于或者等于20℃;如为相同材质,则差值为零。其中,玻璃化转变温度是指由玻璃态转变为高弹态所对应的温度。玻璃化转变温度高,表明材料的耐热性能好。在本实施方式中,将泵底壁213的材质与第一柔性膜110的材质的玻璃化转变温度的差值设置较小,有利于泵底壁213与第一柔性膜110通过热压键合密封为一体结构,提升两者的密封效果。
在一种实施方式中,第一刚性基体130的材质的玻璃化转变温度与第一柔性膜110或者第二柔性膜120的材质的玻璃化转变温度的差值小于或者等于20℃。将第一刚性基体130的材质与第一柔性膜110或者第二柔性膜120的材质的玻璃化转变温度的差值设置较小,有利于第一刚性基体130与第一柔性膜110或者第二柔性膜120通过热压键合密封为一体结构,提升两者的密封效果。
在一种实施方式中,第二刚性基体150的材质的玻璃化转变温度与第一柔性膜110或者第二柔性膜120的材质的玻璃化转变温度的差值小于或者等于20℃。将第二刚性基体150的材质与第一柔性膜110或者第二柔性膜120的材质的玻璃化转变温度的差值设置较小,有利于第二刚性基体150与第一柔性膜110或者第二柔性膜120通过热压键合密封为一体结构,提升两者的密封效果。
在一种实施方式中,第三刚性基体160的材质的玻璃化转变温度与第一柔性膜110或者第二柔性膜120的材质的玻璃化转变温度的差值小于或者等于20℃。将第三刚性基体160的材质与第一柔性膜110或者第二柔性膜120的材质的玻璃化转变温度的差值设置较小,有利于第三刚性基体160与第一柔性膜110或者第二柔性膜120通过热压键合密封为一体结构,提升两者的密封效果。
在一种实施方式中,泵基体210的材质的玻璃化转变温度与液冷模件100的材质的玻璃化转变温度的差值小于或者等于20℃;如为相同材质,则差值为零。
在一实施方式中,泵底壁213的材质的玻璃化转变温度的数值大于或者等于69℃且小于或者等于243℃。
在一实施方式中,第一柔性膜110的材质的玻璃化转变温度的数值大于或者等于69℃且小于或者等于243℃。
在一实施方式中,第二柔性膜120的材质的玻璃化转变温度的数值大于或者等于69℃且小于或者等于243℃。
在一实施方式中,第一刚性基体130的材质的玻璃化转变温度的数值大于或者等于69℃且小于或者等于243℃。
在一实施方式中,第二刚性基体150的材质的玻璃化转变温度的数值大于或者等于69℃且小于或者等于243℃。
在一实施方式中,第三刚性基体160的材质的玻璃化转变温度的数值大于或者等于69℃且小于或者等 于243℃。
在本实施方式中,需要说明的是,虽然上述泵底壁213、第一柔性膜110、第二柔性膜120、第一刚性基体130、第二刚性基体150和第三刚性基体160的材质的玻璃化转变温度的取值范围重叠,但是在实际情况中,并不需要泵底壁213、第一柔性膜110、第二柔性膜120、第一刚性基体130、第二刚性基体150和第三刚性基体160的材质的玻璃化转变温度完全相等,只需满足差值小于或者等于20℃的条件即可。
在一种实施方式中,泵底壁213的材质的熔融温度与第一柔性膜110的材质的熔融温度的差值小于或者等于20℃。在本实施方式中,将泵底壁213的材质与第一柔性膜110的材质的熔融温度的差值设置较小,有利于泵底壁213与第一柔性膜110通过热压键合密封为一体结构,提升两者的密封效果。
在一种实施方式中,第一刚性基体130的材质的熔融温度与第一柔性膜110或者第二柔性膜120的材质的熔融温度的差值小于或者等于20℃。将第一刚性基体130的材质与第一柔性膜110或者第二柔性膜120的材质的熔融温度的差值设置较小,有利于第一刚性基体130与第一柔性膜110或者第二柔性膜120通过热压键合密封为一体结构,提升两者的密封效果。
在一种实施方式中,第二刚性基体150的材质的熔融温度与第一柔性膜110或者第二柔性膜120的材质的熔融温度的差值小于或者等于20℃。将第二刚性基体150的材质与第一柔性膜110或者第二柔性膜120的材质的熔融温度的差值设置较小,有利于第二刚性基体150与第一柔性膜110或者第二柔性膜120通过热压键合密封为一体结构,提升两者的密封效果。
在一种实施方式中,第三刚性基体160的材质的熔融温度与第一柔性膜110或者第二柔性膜120的材质的熔融温度的差值小于或者等于20℃。将第三刚性基体160的材质与第一柔性膜110或者第二柔性膜120的材质的熔融温度的差值设置较小,有利于第三刚性基体160与第一柔性膜110或者第二柔性膜120通过热压键合密封为一体结构,提升两者的密封效果。
在一实施方式中,泵底壁213的材质的熔融温度的数值大于或者等于195℃且小于或者等于343℃。
在一实施方式中,第一柔性膜110的材质的熔融温度的数值大于或者等于195℃且小于或者等于343℃。
在一实施方式中,第二柔性膜120的材质的熔融温度的数值大于或者等于195℃且小于或者等于343℃。
在一实施方式中,第一刚性基体130的材质的熔融温度的数值大于或者等于195℃且小于或者等于343℃。
在一实施方式中,第二刚性基体150的材质的熔融温度的数值大于或者等于195℃且小于或者等于343℃。
在一实施方式中,第三刚性基体160的材质的熔融温度的数值大于或者等于195℃且小于或者等于343℃。
在一种实施方式中,泵基体210的材质的熔融温度与第一柔性膜110的材质的熔融温度的差值小于或者等于20℃。
在本实施方式中,需要说明的是,虽然上述泵底壁213、第一柔性膜110、第二柔性膜120、第一刚性基体130、第二刚性基体150和第三刚性基体160的材质的熔融温度的取值范围重叠,但是在实际情况中,并不需要泵底壁213、第一柔性膜110、第二柔性膜120、第一刚性基体130、第二刚性基体150和第三刚性基体160的材质的熔融温度完全相等,只需满足差值小于或者等于20℃的条件即可。
在一种实施方式中,泵基体210、泵底壁213的材质选自断裂伸长率大于10%的柔性耐温聚合物材料。在一实施方式中,泵基体210、泵底壁213的材质选自断裂伸长率大于50%的柔性耐温聚合物材料。
在一实施方式中,泵基体210、泵底壁213的材质独立地选自聚对苯二甲酸乙二醇酯共聚物、聚萘二甲酸乙二醇酯、聚2,5-呋喃二甲酸乙二醇酯、聚酰亚胺、聚醚醚酮、双轴拉伸聚丙烯中的至少一种。
在一种实施方式中,第一柔性膜110、第二柔性膜120、第一刚性基体130、第二刚性基体150、第三刚性基体160的材质各自独立地选自断裂伸长率大于10%的柔性耐温聚合物材料。在一种实施方式中,第一柔性膜110、第二柔性膜120、第一刚性基体130、第二刚性基体150、第三刚性基体160的材质各自独立地选自断裂伸长率大于50%的柔性耐温聚合物材料。
在一实施方式中,第一柔性膜110的材质选自聚对苯二甲酸乙二醇酯共聚物、聚萘二甲酸乙二醇酯、聚2,5-呋喃二甲酸乙二醇酯、聚酰亚胺、聚醚醚酮、双轴拉伸聚丙烯中的至少一种。
在一实施方式中,第一刚性基体130的材质选自聚对苯二甲酸乙二醇酯共聚物、聚萘二甲酸乙二醇酯、聚2,5-呋喃二甲酸乙二醇酯、聚酰亚胺、聚醚醚酮、双轴拉伸聚丙烯中的至少一种。
在一实施方式中,第二柔性膜120的材质选自聚对苯二甲酸乙二醇酯共聚物、聚萘二甲酸乙二醇酯、聚2,5-呋喃二甲酸乙二醇酯、聚酰亚胺、聚醚醚酮、双轴拉伸聚丙烯中的至少一种。
在一实施方式中,第二刚性基体150的材质选自聚对苯二甲酸乙二醇酯共聚物、聚萘二甲酸乙二醇酯、聚2,5-呋喃二甲酸乙二醇酯、聚酰亚胺、聚醚醚酮、双轴拉伸聚丙烯中的至少一种。
在一实施方式中,第三刚性基体160的材质选自聚对苯二甲酸乙二醇酯共聚物、聚萘二甲酸乙二醇酯、聚2,5-呋喃二甲酸乙二醇酯、聚酰亚胺、聚醚醚酮、双轴拉伸聚丙烯中的至少一种。
其中,聚对苯二甲酸乙二醇酯共聚物、聚萘二甲酸乙二醇酯、聚2,5-呋喃二甲酸乙二醇酯、聚酰亚胺和聚醚醚酮均含有刚性链段,玻璃化转变温度较高。
在本实施方式中,泵底壁213与第一柔性膜110所选用的材质有利于泵底壁213与第一柔性膜110热压形成一体化密封结构。第一刚性基体130与第一柔性膜110或者第二柔性膜120所选用的材质有利于第一刚性基体130与第一柔性膜110或者第二柔性膜120热压形成一体化密封结构。第二刚性基体150与第一柔性膜110或者第二柔性膜120所选用的材质有利于第二刚性基体150与第一柔性膜110或者第二柔性膜120热压形成一体化密封结构。第三刚性基体160与第一柔性膜110或者第二柔性膜120所选用的材质有利于第三刚性基体160与第一柔性膜110或者第二柔性膜120热压形成一体化密封结构。热压为高分子膜材热压键合密封焊、热熔焊、超声波焊、超周波焊等无焊膏或其它第三材质的密封焊接方式。第一柔性膜110和第二柔性膜120采用上述材料有利于提高断裂伸长率,便于释放电子设备在弯折时的应力,吸收液冷系统压力波动、热胀冷缩等体积变化。
示例性的,泵底壁213与第一柔性膜110所选用的材质相同。第一刚性基体130与第一柔性膜110或者第二柔性膜120所选用的材质相同。第二刚性基体150与第一柔性膜110或者第二柔性膜120所选用的材质相同。第三刚性基体160与第一柔性膜110或者第二柔性膜120所选用的材质相同。示例性的,泵基体210的材质与液冷模件100的材质相同。
传统液冷模组,如表1所示,采用高分子PET、PP、PPS等膜材流道成型,水等小分子会穿透高分子材料制成的膜片,并且这个量随蒸散随温度指数上升。
表1:高分子膜膜片蒸散量随时间-温度变化(工质为水,分子量18)
在本实施方式中,第一柔性膜110和第二柔性膜120的材质选自聚对苯二甲酸乙二醇酯共聚物、聚萘二甲酸乙二醇酯、聚2,5-呋喃二甲酸乙二醇酯、聚酰亚胺、聚醚醚酮、双轴拉伸聚丙烯中的至少一种,由于上述材料的水气透过率较低,故第一柔性膜110和第二柔性膜120采用上述材料还有利于缓解冷却介质在第一柔性膜110和第二柔性膜120的蒸散问题。若在第一柔性膜110和第二柔性膜120采用常规的PET材料,由于PET材料带有极性极高的酯基,对水分子有较强的吸收作用,故冷却介质在液冷模件100的内腔140中流动时,可能会发生蒸散而透过第一柔性膜110和第二柔性膜120,导致冷却介质的利用率降低。在冷却介质向外蒸散的过程中,空气中小分子的气体将经由第一柔性膜110和第二柔性膜120置换而溶解于冷却介质中。当溶解饱和后,空气将以气泡的方式存在于冷却介质的循环中。这些气泡除了干扰液冷循环而影响散热效能外,还有可能被吸进泵200中,不仅影响泵200的效能,还会让泵200在旋转时产生噪音,甚至造成泵200的损坏。故本方案将第一柔性膜110和第二柔性膜120设置呈上述材料,有利于避免因冷却介质蒸散而带来的一系列危害。
在一实施方式中,第一柔性膜110和第二柔性膜120的蒸散量级降低一个数量级以上。满足水、氟化液等不同工质不同应用温度下蒸散要求。
值得一提的是,为实现两种柔性膜与三种刚性基体之间热压形成一体化密封结构,第一柔性膜110、第二柔性膜120与第一刚性基体130、第二刚性基体150、第三刚性基体160可选用相同材质,而柔性膜与刚性基体对于柔韧性的要求不同,此时可以通过调整柔性膜与刚性基体的厚度,来实现不同的柔韧性。
在一实施方式中,聚对苯二甲酸乙二醇酯共聚物的玻璃化转变温度大于或者等于69℃且小于或者等于77℃,熔融温度大于或者等于250℃且小于或者等于255℃。聚萘二甲酸乙二醇酯的玻璃化转变温度为122.4℃,熔融温度为211.6℃。聚2,5-呋喃二甲酸乙二醇酯的玻璃化转变温度为87.2℃,熔融温度大于或者等于195℃且小于或者等于265℃。聚酰亚胺的玻璃化转变温度为243℃,熔融温度为334℃。聚醚醚酮的玻璃化转变温度大于或者等于143℃且小于或者等于150℃,熔融温度为343℃。需要说明的是,上述提到的玻璃化转变温度和熔融温度均为实验数值,受实验条件、仪器设备和实验操作等多种因素的影响,在上述影响因素发生改变时,上述材料的玻璃化转变温度和熔融温度可能也会随之发生改变,作为本领域技 术人员应当理解到这种偏差是很难避免的。在本申请实施例中,只要保证需要形成一体化密封结构的两种部件之间的玻璃化转变温度或者熔融温度的差值小于或者等于20℃即可,本申请不对泵底壁213、泵基体210、第一柔性膜110、第二柔性膜120、第一刚性基体130、第二刚性基体150和第三刚性基体160的玻璃化转变温度和熔融温度的具体数值作绝对的限定。
在一种实施方式中,聚对苯二甲酸乙二醇酯共聚物的单体包括对苯二甲酸、乙二醇和硬段分子结构,硬段分子结构占聚对苯二甲酸乙二醇酯共聚物的质量百分数的取值大于或者等于20%、且小于或者等于80%。
其中,聚对苯二甲酸乙二醇酯共聚物是指PET(polyethylene terephthalate,聚对苯二甲酸乙二醇酯)的单体与另一种单体嵌段共聚形成的共聚物,其中PET由对苯二甲酸和乙二醇聚合而成。由于PET的结构中存在-CH2-CH2-的分子链段,导致PET自身的玻璃化转变温度偏低,在中高温的应用环境下容易发生玻璃化转变,存在尺寸稳定性风险,本方案在PET的结构中引入硬段分子结构,能够提升聚对苯二甲酸乙二醇酯共聚物的玻璃化转变温度,当聚对苯二甲酸乙二醇酯共聚物被应用于液冷模组10中时,能够使得液冷模组10适用于中高温的应用场景。
在本实施方式中,将硬段分子结构设置为上述比值,可提升聚对苯二甲酸乙二醇酯共聚物的结构强度,当聚对苯二甲酸乙二醇酯共聚物被应用于液冷模组10中时,能够提升液冷模组10的抗冲击和抗跌落性能,有效保护电子设备内部的其他器件。
在一种实施方式中,硬段分子结构选自2,5-呋喃二甲酸、碳酸二甲酯和2,6-萘二甲酸中的至少一种。在本实施方式中,2,5-呋喃二甲酸、碳酸二甲酯和2,6-萘二甲酸分别为聚2,5-呋喃二甲酸乙二醇酯、聚碳酸酯和聚萘二甲酸乙二醇酯的单体,采用上述材料作为硬段分子结构,能够提升聚对苯二甲酸乙二醇酯共聚物的结构强度。当采用除碳酸二甲酯以外的其他硬段分子结构时,还能缓解第一柔性膜110和第二柔性膜120的蒸散问题,降低透水性和透气性。
在上述实施方式中,部分聚合物的分子结构如表2所示。
表2部分聚合物材料的结构
在上述实施方式中,部分硬段分子结构G如表3所示。
表3硬段分子结构
请参阅图13,图13为本申请第一实施例提供的第一柔性膜110的剖面图,在一种实施方式中,第一柔性膜110和第二柔性膜120中的至少一个包括两层子柔性膜层115和位于两层子柔性膜层115之间的防蒸散层116,防蒸散层116包括聚酰亚胺层、聚偏二氯乙烯层或者金属薄膜层中的至少一个。
在本实施方式中,子柔性膜层115的材质可选自前文中第一柔性膜110或者第二柔性膜120的材质中的任一种。在一种实施方式中,子柔性膜层115的材质可选自前文所述的聚对苯二甲酸乙二醇酯共聚物,简称PET共聚物。
在本实施方式中,在第一柔性膜110和第二柔性膜120中的至少一个采用多层膜工艺,即将第一柔性膜110和第二柔性膜120设置成“PET共聚物-X-PET共聚物”的三明治式的结构,其中X层是指防蒸散层116。聚酰亚胺、聚偏二氯乙烯和金属薄膜是低水气透过率的材料,防蒸散层116采用上述材料,能够减少水气在第一柔性膜110和第二柔性膜120的蒸散。在一实施方式中,采用多层共挤出技术或者多层膜压技术在第一柔性膜110和第二柔性膜120中实现多层膜结构。
在一实施方式中,金属薄膜层可为铜膜、镍膜、铝膜或金属塑料复合膜材,且厚度小于或者等于10微米。在本实施方式中,当液冷模组10应用于折叠设备时,本方案有利于保证第一柔性膜110和第二柔性膜120满足10-40万次不同弯折角的弯折测试的要求。
请参阅图14,图14为本申请第一实施例提供的液冷模件100的剖面图,在一种实施方式中,第一柔性膜110和第二柔性膜120中的至少一个远离内腔140的表面设有无机氧化薄膜117。
在本实施方式中,第一柔性膜110和第二柔性膜120远离内腔140的表面虽然不与冷却介质直接接触,但均是冷却介质在蒸散至外界时必须经过的界面,设置无机氧化薄膜117,有利于对水气进行隔绝,缓解冷却介质的蒸散问题。示例性的,无机氧化薄膜117的镀层方式可采用物理气相沉积、化学气相沉积和原子层沉积中的任意一种。
请结合参阅图1a和图15,图15为图1a所示的液冷模组10的局部放大图,在一种实施方式中,液冷模件100包括液冷膜弯折区170(如图1a所示),液冷模件100通过液冷膜弯折区170折叠,第一刚性基体130、第二刚性基体150和第三刚性基体160中的至少一个设有增柔结构131(如图1a和图15所示),增柔结构131位于液冷膜弯折区170,增柔结构131用于提升液冷膜弯折区170的柔韧性。
在本实施方式中,第一刚性基体130、第二刚性基体150和第三刚性基体160由于具有刚性而能够增强液冷模件100在厚度方向A上的强度。当液冷模件100应用于折叠设备时,又需要液冷模件100的弯折部分具有一定的柔性,故本方案在液冷模件100的液冷膜弯折区170设置增柔结构131,能够减小液冷模件100的弯折部分在弯折时受到的阻力,满足电子设备的折叠要求。
在一实施方式中,增柔结构131可为凹槽、贯穿孔、通孔、开孔中的至少一种。
在一实施方式中,液冷模件100还包括位于液冷膜弯折区170两侧的第一液冷膜静止区180和第二液冷膜静止区190(如图1a所示)。在液冷膜弯折区170进行弯折的时候,第一液冷膜静止区180和第二液冷膜静止区190不发生形变。
请继续结合参阅图1a和图15,在一种实施方式中,第一刚性基体130的增柔结构131包括位于第一刚性基体130的侧壁上的凹槽1311,凹槽1311位于液冷膜弯折区170(结合图1a和图15所示)。
在本实施方式中,第一刚性基体130环绕液冷模组10的边缘设置,是冷却介质与外界环境之间的屏障,故第一刚性基体130需要具有较高的结构强度,以确保密封效果,使得冷却介质始终不泄露至液冷模组10的外侧。而位于液冷膜弯折区170的第一刚性基体130需要兼顾结构强度和一定的柔韧性,故设置在第一刚性基体130上的增柔结构131优选为凹槽1311。若在第一刚性基体130上设置贯穿孔、通孔或者开孔,将面临冷却介质泄露的风险。
请结合参阅图15和图16,图16为本申请第一实施例提供的液冷模件100的剖面图,在一种实施方式中,第二刚性基体150的增柔结构131包括沿第一方向A贯穿第二刚性基体150的通孔1313,通孔1313位于液冷膜弯折区170内,第一方向A为第一柔性膜110和第二柔性膜120的排列方向。
在本实施方式中,在第二刚性基体150中设置通孔1313,能够提升第二刚性基体150的弯折部分的柔韧性。由于第二刚性基体150两侧分别为进液流道142和出液流道141,故第二刚性基体150上的开孔1314不能将两侧的冷却介质连通,以避免因混流而影响冷却效果。其中,第一方向A也为液冷模件100的厚度方向。
请结合参阅图15和图17,图17为本申请第一实施例提供的液冷模件100的剖面图,在一实施方式中,液冷模件100设有沿第一方向贯穿第二刚性基体150、第一柔性膜110和第二柔性膜120的贯穿孔1312,贯穿孔1312位于液冷膜弯折区170内。
在本实施方式中,在第二刚性基体150中设置贯穿孔1312,能够提升第二刚性基体150的弯折部分的柔韧性,减少弯折时液冷膜弯折区170的反弹力和摩檫力。其中,第一方向即为液冷模组10的厚度方向A。贯穿孔1312沿第一方向贯穿第二刚性基体150不会导致进液流道142和出液流道141中的冷却介质流动短路和混流。第三刚性基体160可开孔1314,减少弯折时液冷膜弯折区170的反弹力和与屏、中框的摩檫力,不会引起冷却介质流动短路。
在一实施方式中,第二刚性基体150的增柔结构131包括通孔1313和贯穿孔1312,或者第二刚性基体150的增柔结构131包括通孔1313和贯穿孔1312的任意一种。本方案在第二刚性基体150中可根据实际情况灵活设置通孔1313和贯穿孔1312,提升第二刚性基体150的在不同应用环境中的实用性。
在一实施方式中,第二刚性基体150上的增柔结构131也可以为凹槽1311。
请继续参阅图15,在一种实施方式中,第三刚性基体160的增柔结构131包括位于第三刚性基体160的开孔1314,开孔1314连通第三刚性基体160两侧的流道。
在本实施方式中,由于液冷膜弯折区170在弯折时产生的形变较大,本方案设置在第三刚性基体160中设置开孔1314,相当于第三刚性基体160在开孔1314的位置局部断开,诱导在设计位置弯折变形,有效减小弯折时产生的应力。部分第三刚性基体160分布在进液流道142,部分第三刚性基体160分布在出液流道141中,即第三刚性基体160两侧的流道同属于进液流道142或者同属于出液流道141,故开孔1314将第三刚性基体160的两侧连通不会影响散热效率,且可以增加进液流道142内或者出液流道141内相同流动方向的冷却介质的混流作用,提升冷却效果。
在一实施方式中,增柔结构131可沿冷却介质的流动方向延伸。在另一实施方式中,增柔结构131可沿折叠设备的折叠方向延伸。将增柔结构131在其延伸方向上的尺寸设置较大,能够有效提升液冷膜弯折区170的柔韧性,减少弯折时液冷膜弯折区170的反弹力和与屏、中框的摩檫力,进而改善用户对于折叠设备的使用体验。
请参阅图18,图18为本申请第一实施例提供的液冷模件100的剖面图,在一种实施方式中,第一柔性膜110和第二柔性膜120的远离内腔140的表面敷设有润滑材料层118,润滑材料层118位于液冷膜弯折区内。在本实施方式中,为了提升液冷膜弯折区的柔韧性,除了在第一刚性基体130、第二刚性基体150和第三刚性基体160上设置增柔结构131以外,还可在第一柔性膜110和第二柔性膜120的外表面设置润滑材料层118,减小液冷膜弯折区在弯折时的摩擦力,使得弯折过程能够更加顺利进行。示例性的,润滑材料层118包括但不限于铁氟龙膜、石墨膜、石墨烯膜或润滑脂等固态、液态或膏状等润滑材料。其中,当润滑材料层118采用石墨膜或者石墨烯膜,润滑材料层118可仅布置在液冷膜弯折区,也可同时布置在 第一液冷膜静止区和第二液冷膜静止区中的至少一个以及液冷膜弯折区,此时润滑材料层118除对液冷膜静止区发挥润滑减摩的作用外,由于石墨和石墨烯本身具备较高的导热系数,故润滑材料层118还能够增强散热效果,降低冷却介质整体的温度,从而减少泵的启动时间和频次。
请参阅图19,图19为本申请第一实施例提供的液冷模件100的剖面图,在一种实施方式中,液冷模件100包括第一柔性膜110、第二柔性膜120和位于第一柔性膜110和第二柔性膜120之间的第一刚性基体130,第一柔性膜110、第二柔性膜120和第一刚性基体130围合构成液冷模件100的内腔140,第一刚性基体130的玻璃化转变温度与第一柔性膜110的材质的玻璃化转变温度的差值小于或者等于20℃。
在本实施方式中,第一柔性膜110和第二柔性膜120能够降低电子设备的弯折难度。第一刚性基体130用于增强液冷模件100在厚度方向A上的结构强度。第一柔性膜110、第二柔性膜120和第一刚性基体130围合成内腔140,冷却介质在内腔140中流动,第一刚性基体130的两端与第一柔性膜110和第二柔性膜120为一体化密封结构,有利于提升第一刚性基体130的密封性能,避免冷却介质的泄露。
在本实施方式中,将第一刚性基体130的材质与第一柔性膜110的材质的玻璃化转变温度的差值设置较小,有利于第一刚性基体130与第一柔性膜110通过热压键合密封为一体结构,提升两者的密封效果。
在一实施方式中,第一刚性基体130的材质的熔融温度与第一柔性膜110的材质的熔融温度的差值小于或者等于20℃。在本实施方式中,将第一刚性基体130的材质与第一柔性膜110的材质的熔融温度的差值设置较小,有利于第一刚性基体130与第一柔性膜110通过热压键合密封为一体结构,提升两者的密封效果。
需要说明的是,前文中的第一柔性膜110、第二柔性膜120、第一刚性基体130、第二刚性基体150和第三刚性基体160的可实现方式、尺寸、位置关系、结构描述适用于本实施例中第一柔性膜110、第二柔性膜120、第一刚性基体130、第二刚性基体150和第三刚性基体160的可实现方式、尺寸、位置关系和结构描述,此处不再赘述。
请继续参阅图19,在一种实施方式中,液冷模件100包括第一柔性膜110、第二柔性膜120和位于第一柔性膜110和第二柔性膜120之间的第一刚性基体130,第一柔性膜110、第二柔性膜120和第一刚性基体130围合构成液冷模件100的内腔140,所述第一柔性膜110、所述第二柔性膜120和所述第一刚性基体130的材质选自断裂伸长率大于10%的柔性耐温聚合物材料,第一柔性膜110、第二柔性膜120和第一刚性基体130的材质各自独立地选自聚对苯二甲酸乙二醇酯共聚物、聚萘二甲酸乙二醇酯、聚2,5-呋喃二甲酸乙二醇酯、聚酰亚胺、聚醚醚酮、双轴拉伸聚丙烯中的至少一种。
在本实施方式中,第一柔性膜110和第二柔性膜120能够降低电子设备的弯折难度。第一刚性基体130用于增强液冷模件100在厚度方向A上的结构强度。第一柔性膜110、第二柔性膜120和第一刚性基体130围合成内腔140,冷却介质在内腔140中流动,第一刚性基体130的两端与第一柔性膜110和第二柔性膜120为一体化密封结构,有利于提升第一刚性基体130的密封性能,避免冷却介质的泄露。
在本实施方式中,第一刚性基体130与第一柔性膜110或者第二柔性膜120所选用的材质有利于第一刚性基体130与第一柔性膜110或者第二柔性膜120热压形成一体化密封结构。其中,第一刚性基体130与第一柔性膜110或者第二柔性膜120可为不同的材质,只要保证第一刚性基体130与第一柔性膜110或者第二柔性膜120之间能形成一体化密封结构即可。
需要说明的是,前文中的第一柔性膜110、第二柔性膜120、第一刚性基体130、第二刚性基体150和第三刚性基体160的可实现方式、尺寸、位置关系、结构描述适用于本实施例中第一柔性膜110、第二柔性膜120、第一刚性基体130、第二刚性基体150和第三刚性基体160的可实现方式、尺寸、位置关系和结构描述,此处不再赘述。
请继续参阅图1a,在一种实施方式中,液冷模件100包括第一柔性膜110、第二柔性膜120和位于第一柔性膜110和第二柔性膜120之间的刚性基体101。液冷模件100包括液冷膜弯折区170,液冷模件100通过液冷膜弯折区170折叠,刚性基体101设有增柔结构131,增柔结构131位于液冷膜弯折区170,增柔结构131用于提升液冷膜弯折区170的柔韧性,减少弯折时液冷膜弯折区170的反弹力和与屏、中框的摩檫力。
在本实施方式中,刚性基体101的两端用于支撑第一柔性膜110和第二柔性膜120,在液冷模件100中设置刚性基体101有利于提升液冷模件100在厚度方向A上的结构强度。在电子设备弯折时,液冷模件100中的液冷膜弯折区170产生较大的形变,故在位于液冷膜弯折区170的刚性基体101上需要设置增柔结构131,以增强液冷膜弯折区170的柔韧性。在一实施方式中,增柔结构131可为凹槽1311、贯穿孔1312、通孔1313和开孔1314中的至少一种。在一实施方式中,刚性基体101可包括第一刚性基体130、第二刚 性基体150和第三刚性基体160。
需要说明的是,前文中的第一柔性膜110、第二柔性膜120、第一刚性基体130、第二刚性基体150、第三刚性基体160和增柔结构131的可实现方式、尺寸、位置关系、结构描述适用于本实施例中第一柔性膜110、第二柔性膜120、第一刚性基体130、第二刚性基体150、第三刚性基体160和增柔结构131的可实现方式、尺寸、位置关系和结构描述,此处不再赘述。
本申请实施例提供的液冷模组10可应用于电子设备中。
请参阅图20,图20为本申请第一实施例提供的电子设备1的结构示意图。在一种实施方式中,电子设备1包括壳体20和位于壳体20内的电子功能组件30和液冷模组10,液冷模组10位于壳体20的外侧。
在本实施方式中,示例性的,电子设备1可以是手机、平板电脑、笔记本电脑和可穿戴设备等电子产品。电子设备1中的电子功能组件30包括但不限于处理器、内部存储器、充电管理模块、电源管理模块、电池、天线、通信模块、摄像头、音频模块、扬声器、受话器、麦克风、传感器模块、马达以及指示器等。其中,电子设备1可以具有比上文描述的更多的或者更少的电子功能组件30。各种电子功能组件30可以在包括一个或多个信号处理和/或专用集成电路在内的硬件、软件、或硬件和软件的组合中实现。电子功能组件30在处于工作状态时会释放热量,当电子设备1内部的温度过高时,将影响电子功能组件30的工作效率以及电子设备1的使用寿命,故需要设置液冷模组10,以针对电子功能组件30进行温升控制。
在一实施方式中,液冷模组10位于壳体20与电子功能组件30之间。
在图20所示的第一实施例中,电子设备1为可折叠的设备,具有展平状态和折叠状态。所述电子设备1包括第一非折叠部11、折叠部12和第二非折叠部13,所述第二非折叠部13通过所述折叠部12能够向所述第一非折叠部11折叠。其中,液冷模组10沿长度方向B可依次划分为第一液冷膜静止区180、液冷膜弯折区170和第二液冷膜静止区190,在电子设备1处于折叠状态时,液冷模件100通过液冷膜弯折区170折叠,液冷膜弯折区170发生弯折,第一液冷膜静止区180和第二液冷膜静止区190不发生形变。如果折叠机有三个或更多N个折叠屏,对应最多可有三个或N个液冷模件,2个或N-1个弯折区;最少2个液冷膜,1个弯折区,其中N为大于2的整数。如为直板机,可无弯折区,有1个或多个液冷膜。根据液冷系统性能需要,可设1个或多个液泵,可以并联、串联或混联,可以相邻设置或不相领设置,如设置在不同屏的主板附近。泵在运行中可有压力波动,2-50um微幅振动和一定噪音。柔性液冷模件有助于吸收压力波动、体积变化和较少振动噪声影响。
第一刚性基体130环绕第一液冷膜静止区180、液冷膜弯折区170和第二液冷膜静止区190的边缘呈闭合设置。泵200位于第二液冷膜静止区190且沿宽度方向C靠近第一刚性基体130设置,且泵200沿长度方向B的两侧均设有第三刚性基体160,其中,泵200沿长度方向B两侧的第三刚性基体160分别呈柱状和条状。在本实施方式中,泵200以及邻近的第一柔性膜110、第二柔性膜120与电子设备1内的其他结构件之间通常间隔设置或者增设阻尼材料,其中,阻尼材料可粘合在第一柔性膜110、第二柔性膜120或者结构件上。示例性的,结构件可为显示屏、壳体20、电池、摄像头中的至少一种。
泵200沿宽度方向C远离第一刚性基体130的一侧设有第二刚性基体150,第二刚性基体150将第二液冷膜静止区190、液冷膜弯折区170以及部分第一液冷膜静止区180的内腔140分隔成进液流道142和出液流道141。具体地,在第二液冷膜静止区190中,部分第二刚性基体150沿宽度方向C延伸,部分第二刚性基体150沿长度方向B延伸,其中,沿长度方向B延伸的第二刚性基体150将位于沿宽度方向C两侧的内腔140分隔成进液流道142和出液流道141,沿宽度方向C延伸的第二刚性基体150用于与第三刚性基体160共同引导从泵200流出的冷却介质的流动。在第二液冷膜静止区190的进液流道142中,第三刚性基体160可呈条状和柱状,其中,呈条状的第三刚性基体160沿宽度方向C延伸,且呈条状的第三刚性基体160沿宽度方向C的两侧均设有呈柱状的第三刚性基体160。在第二液冷膜静止区190的出液流道141中,第三刚性基体160呈条状且沿长度方向B延伸。第二液冷膜静止区190的第一刚性基体130围设的区域基本呈矩形或者正方形。
在液冷膜弯折区170中,第二刚性基体150沿长度方向B延伸,第二刚性基体150将位于第二刚性基体150沿宽度方向C的两侧的内腔140分隔成进液流道142和出液流道141,其中进液流道142和出液流道141中的第三刚性基体160均呈条状且沿长度方向B延伸。液冷膜弯折区170的第一刚性基体130围设的区域基本呈条形。在本实施例中,液冷膜弯折区170内的液冷模组10采用跨轴设置,即液冷模组10跨越液冷膜弯折区170的主轴。
在第一液冷膜静止区180中,部分第二刚性基体150呈“倒C型”,部分第二刚性基体150呈条状且沿宽度方向C延伸。呈“倒C型”的第二刚性基体150将内腔140分隔成进液流道142和出液流道141,呈“倒 C型”的第二刚性基体150两侧的第三刚性基体160也呈“倒C型”。呈条状的第二刚性基体150的末端沿宽度方向C的一侧设有呈柱状的第三刚性基体160,且进液流道142和出液流道141在第三刚性基体160连通,以形成冷却循环。
在一实施方式中,第一刚性基体130、第二刚性基体150和第三刚性基体160的厚度不相等,第一刚性基体130、第二刚性基体150和第三刚性基体160中的任意一个的厚度可为0.1mm至1mm。本方案有利于满足液冷模组10在不同应用环境下的架构空间需求。优选的,第一刚性基体130、第二刚性基体150和第三刚性基体160中的任意一个的厚度可为0.15mm至0.3mm。
在一实施方式中,第一柔性膜110和第二柔性膜120的密度小于或者等于2g/ml。本方案有利于减轻液冷模组10的整体重量,同时使得第一柔性膜110和第二柔性膜120能够更加灵活地适应不同的架构环境。
请参阅图21,图21为本申请第二实施例提供的电子设备1的结构示意图,与第一实施例不同的是,在第二实施例中,液冷模组10可呈现出与第一实施例不同的形状。在一实施方式中,在第二液冷膜静止区190内,第一刚性基体130环绕液冷模组10的边缘设置,第二刚性基体150为两个“十”字型首尾相接的形状,且其中一个“十”字型的第二刚性基体150沿宽度方向C的两端呈弯曲状设置,最终使得内腔140呈现多个开口朝向不同的“C”字型首尾相接的形状。泵200位于第二液冷膜静止区190沿宽度方向C的一端,第二液冷膜静止区190中的第三刚性基体160均呈柱状,两端呈弯曲状设置的第二刚性基体150的其中一端与泵200相邻设置,且将内腔140分隔成进液流道142和出液流道141。在液冷膜弯折区170内,液冷模组10整体呈长条形,其中,第二刚性基体150呈条状设置且沿长度方向B延伸,位于第二刚性基体150沿宽度方向C两侧的第三刚性基体160呈条状设置且沿长度方向B延伸。在第一液冷膜静止区180内,液冷模组10整体呈长条形,其中,第二刚性基体150呈条状设置且沿长度方向B延伸,位于第二刚性基体150沿宽度方向C两侧的第三刚性基体160呈条状设置且沿长度方向B延伸,进液流道142和出液流道141在第一液冷膜静止区180内连通,以形成冷却循环。
请参阅图22,图22为本申请第二实施例提供的电子设备1的结构示意图,在另一实施方式中,在第二液冷膜静止区190内,第一刚性基体130环绕液冷模组10的边缘设置,泵200位于第二液冷膜静止区190内且沿长度方向B和宽度方向C靠近第一刚性基体130设置,第二刚性基体150先沿长度方向B延伸,然后沿宽度方向C延伸,再沿长度方向B延伸至液冷膜弯折区170,其中,第二刚性基体150远离液冷膜弯折区170且沿长度方向B延伸的一端靠近泵200设置,将内腔140分隔成进液流道142和出液流道141,在进液流道142中没有设置第三刚性基体160,在出液流道141中,第三刚性基体160沿长度方向B延伸且交错间隔设置,最终使得出液流道141呈现多个开口朝向不同的“C”字型首尾相接的形状。在液冷膜弯折区170内,第二刚性基体150呈条状设置且沿长度方向B延伸。在第一液冷膜静止区180内,进液流道142和出液流道141连通,以形成冷却循环,其中第一液冷膜静止区180内的第三刚性基体160与第二液冷膜静止区190内的第三刚性基体160的形状及分布特点均类似,此处不再赘述。
需要说明的是,第一实施例中泵200、第一柔性膜110、第二柔性膜120、第一刚性基体130、第二刚性基体150和第三刚性基体160的可实现方式、尺寸、位置关系、结构描述适用于第二实施例中泵200、第一柔性膜110、第二柔性膜120、第一刚性基体130、第二刚性基体150和第三刚性基体160的可实现方式、尺寸、位置关系和结构描述,此处不再赘述。
现有手机的VC/HP设计方案,VC盖板或热管管材为铜合金、不锈钢,密度为8.9g/ml,7.8g/mL,无法通过10-20万弯折测试(R~1.5mm),无法实现穿轴或跨轴散热。使用跨轴/穿轴石墨材料散热,等效导热系数≤2000W/m·K。采用本申请实施例的柔性液冷膜组方案,等效导热系数也可达成5000W/m·K,可局部不厚度设计,局部可实现0.15mm厚度,适应芯片和架构空间需求。液冷膜膜材为改性PET等,密度≤2g/mL,可以实现更灵活架构设计,相比石墨散热能力提升50%以上。本申请实施例提供的液冷膜组比跨轴/穿轴石墨散热能力提升50%以上。
请参阅图23和图24,图23为本申请第三实施例提供的电子设备1的结构示意图,图24为本申请第三实施例提供的液冷模组10的局部结构示意图,与第一实施例不同的是,在第三实施例中,液冷膜弯折区170内的液冷模组10采用穿轴设置。在本实施例中,液冷模组10包括沿厚度方向A相对设置的第一表面300和第二表面400,位于液冷膜弯折区170内的液冷模组10设有两个间隔分布的弯曲部310,液冷模组10除弯曲部310以外的区域为基部320,两个弯曲部310的第一表面300和第二表面400朝基部320的第二表面400沿厚度方向A远离第一表面300的方向弯曲,两个弯曲部310与位于两个弯曲部310之间的基部320呈波纹状设置,两个弯曲部310与两个弯曲部310之间的基部320围合的区域用于穿设主轴。在 电子设备1在折叠和展开的过程中,本方案能够减小液冷膜弯折区170在变形时产生的应力,从而提升用户体验。实际产品设计,可有多个弯曲部310、基部320,并可不对称设计。
请参阅图25,图25为本申请第三实施例提供的液冷模组10与柔性电路板40的结构示意图,在一种实施方式中,电子设备还包括柔性电路板40,柔性电路板40用于与电子功能组件电连接,其中,柔性电路板40和液冷模组10共同采用穿轴设置。在本实施方式中,位于液冷膜弯折区170内的液冷模组10贴合设置,柔性电路板40与液冷模组10均呈波纹状,共用穿轴空间,有利于减少液冷模组10与柔性电路板40之间的摩擦、碰撞和异响。在一实施方式中,可采用塑性变形的方法使柔性电路板40保持波纹形状。
在一实施方式中,柔性电路板40和液冷模组10之间部分或者全部设有气隙。本方案设置气隙能够有效避免弯折反弹力的问题。
需要说明的是,第一实施例中泵200、第一柔性膜110、第二柔性膜120、第一刚性基体130、第二刚性基体150和第三刚性基体160的可实现方式、尺寸、位置关系、结构描述适用于第三实施例中泵200、第一柔性膜110、第二柔性膜120、第一刚性基体130、第二刚性基体150和第三刚性基体160的可实现方式、尺寸、位置关系和结构描述,此处不再赘述。
请参阅图26和图27,图26为本申请第四实施例提供的液冷模组10的结构示意图,图27为本申请一实施例提供的电子设备的结构示意图。与第一实施例不同的是,在第四实施例中,液冷模组10相对于电子设备1是一个外部配件。在本实施例中,液冷模组10包括第一液冷膜静止区180、液冷膜弯折区170和第二液冷膜静止区190,其中液冷膜弯折区170包括两个第一弯折部171和一个第二弯折部172,第二弯折部172位于两个第一弯折部171之间,第二弯折部172的弯折程度大于第一弯折部171。当电子设备折叠时,电子设备产生形变的部分移动至第二弯折部172的表面形成的容纳空间,而第一弯折部171跟随电子设备产生形变。本方案通过将液冷模组10设置为外部配件,实现液冷模组10与电子设备的显示屏和电池等敏感器件之间解耦,使得液冷模组10的设计灵活,且更换更加便捷。
需要说明的是,第一实施例中泵200、第一柔性膜110、第二柔性膜120、第一刚性基体130、第二刚性基体150和第三刚性基体160的可实现方式、尺寸、位置关系、结构描述适用于第四实施例中泵200、第一柔性膜110、第二柔性膜120、第一刚性基体130、第二刚性基体150和第三刚性基体160的可实现方式、尺寸、位置关系和结构描述,此处不再赘述。
请参阅图28,图28为本申请第五实施例提供的电子设备1的结构示意图,与第一实施例不同的是,在第二实施例中,电子设备1为不可折叠的设备,电子设备1没有折叠状态。在本实施例中,液冷模件100包括第一柔性膜、第二柔性膜、第一刚性基体130和第二刚性基体150,第一刚性基体130环绕液冷模组10的边缘呈闭合设置。泵沿长度方向B靠近第一刚性基体130设置。泵200沿长度方向B远离第一刚性基体130的一侧设有第二刚性基体150,第二刚性基体150沿长度方向B延伸,位于第二刚性基体150沿宽度方向C两侧的内腔140被分隔为进液流道142和出液流道141。进液流道142和出液流道141在第二刚性基体150沿长度方向B远离泵200的一侧连通,以形成冷却循环。图28中示意了液体工质流动方向,两泵为并联设计,形成循环流动。
在一实施方式中,第一刚性基体130和第二刚性基体150的厚度不相等,第一刚性基体130和第二刚性基体150中的任意一个的厚度可为0.1mm至1mm。本方案有利于满足液冷模组10在不同应用环境下的架构空间需求。优选的,第一刚性基体130和第二刚性基体150中的任意一个的厚度可为0.15mm至0.3mm。
在一实施方式中,第一柔性膜110和第二柔性膜120的密度小于或者等于2g/ml。本方案有利于减轻液冷模组10的整体重量,同时使得第一柔性膜110和第二柔性膜120能够更加灵活地适应不同的架构环境。
需要说明的是,第一实施例中泵200、第一柔性膜110、第二柔性膜120、第一刚性基体130和第二刚性基体150的可实现方式、位置关系和结构描述适用于第五实施例中泵200、第一柔性膜110、第二柔性膜120、第一刚性基体130和第二刚性基体150的可实现方式、位置关系和结构描述,此处不再赘述。
现有直板机多采用VC/HP设计方案,VC/HP是指可变电导热管,等效导热系数5000W/m·K,等厚设计,厚度≥0.25mm。VC盖板或热管管材为铜合金、不锈钢,密度为8.9g/ml,7.8g/mL。在本申请实施例中采用柔性液冷膜方案,等效导热系数也可达成5000W/m·K,可局部不厚度设计,局部可实现0.15mm厚度,适应芯片和架构空间需求。液冷模件的材质为改性PET等,密度≤2g/mL,可以实现更灵活架构设计,更轻更高散热能力。也就是说与VC同样单体散热能力下,可不等厚设计,减重>50%。
请参阅图29,图29为本申请一实施例提供的液冷模组的示意图。在一实施方式中,液冷模件100中的冷却介质可以为单相冷却介质,或者为两种或多种颜色且互不相容的冷却介质,使得冷却介质流动的可 视化更强,提升用户体验。
以上对本申请实施例所提供的液冷模组、液冷模件及电子设备进行了详细介绍,本文中应用了具体个例对本申请的原理及实施例进行了阐述,以上实施例的说明只是用于帮助理解本申请的方法及其核心思想;同时,对于本领域的一般技术人员,依据本申请的思想,在具体实施例及应用范围上均会有改变之处,综上所述,本说明书内容不应理解为对本申请的限制。

Claims (24)

  1. 一种液冷模组(10),其特征在于,所述液冷模组(10)包括:
    泵(200),所述泵(200)包括泵基体(210)和固定于所述泵基体(210)的压电组件(220),所述泵基体(210)设有泵进液口(211)和泵出液口(212);
    液冷模件(100),所述液冷模件(100)包括液冷出液口(111)和液冷进液口(112),所述液冷出液口(111)用于与所述泵进液口(211)连通,所述液冷进液口(112)用于与所述泵出液口(212)连通,所述液冷出液口(111)周侧的部分所述液冷模件(100)与所述泵进液口(211)周侧的部分所述泵基体(210)为一体化密封结构,所述液冷进液口(112)周侧的部分所述液冷模件(100)与所述泵出液口(212)周侧的部分所述泵基体(210)为一体化密封结构。
  2. 根据权利要求1所述的液冷模组(10),其特征在于,所述液冷出液口(111)周侧的部分所述液冷模件(100)中的至少部分与所述泵进液口(211)周侧的部分所述泵基体(210)的至少部分沿所述液冷出液口(111)的周向(D)连续融合为一体,以形成一体化密封结构。
  3. 根据权利要求1所述的液冷模组(10),其特征在于,所述泵基体(210)包括泵底壁(213),所述泵底壁(213)与所述压电组件(220)以及两者之间的部分泵基体(210)围设构成泵腔(214),所述泵进液口(211)和所述泵出液口(212)设于所述泵底壁(213)且与所述泵腔(214)连通,所述泵底壁(213)与所述液冷出液口(111)周侧以及所述液冷进液口(112)周侧的部分所述液冷模件(100)为一体化密封结构。
  4. 根据权利要求1所述的液冷模组(10),其特征在于,所述泵基体(210)还包括位于所述泵底壁(213)与所述压电组件(220)之间的泵侧壁(215),所述泵侧壁(215)为一体化密封结构。
  5. 根据权利要求3所述的液冷模组(10),其特征在于,所述液冷模件(100)包括第一柔性膜(110),所述液冷出液口(111)和所述液冷进液口(112)设置于所述第一柔性膜(110),所述泵底壁(213)与所述液冷出液口(111)周侧以及所述液冷进液口(112)周侧的部分所述第一柔性膜(110)为一体化密封结构。
  6. 根据权利要求3所述的液冷模组(10),其特征在于,所述泵底壁(213)的材质的玻璃化转变温度与所述第一柔性膜(110)的材质的玻璃化转变温度的差值小于或者等于20℃;或者
    所述泵底壁(213)的材质的熔融温度与所述第一柔性膜(110)的材质的熔融温度的差值小于或者等于20℃;或者
    所述液冷出液口(111)周侧的部分所述液冷模件(100)的材质与所述泵进液口(211)周侧的部分所述泵基体(210)的材质相同,所述液冷进液口(112)周侧的部分所述液冷模件(100)的材质与所述泵出液口(212)周侧的部分所述泵基体(210)的材质相同。
  7. 根据权利要求3所述的液冷模组(10),其特征在于,所述泵底壁(213)的材质选自断裂伸长率大于10%的柔性耐温聚合物材料,所述泵底壁(213)的材质选自聚对苯二甲酸乙二醇酯共聚物、聚萘二甲酸乙二醇酯、聚2,5-呋喃二甲酸乙二醇酯、聚酰亚胺、聚醚醚酮、双轴拉伸聚丙烯中的至少一种;
    所述第一柔性膜(110)的材质选自断裂伸长率大于10%的柔性耐温聚合物材料,所述第一柔性膜(110)的材质选自聚对苯二甲酸乙二醇酯共聚物、聚萘二甲酸乙二醇酯、聚2,5-呋喃二甲酸乙二醇酯、聚酰亚胺、聚醚醚酮、双轴拉伸聚丙烯中的至少一种。
  8. 根据权利要求7所述的液冷模组(10),其特征在于,所述聚对苯二甲酸乙二醇酯共聚物的单体包括对苯二甲酸、乙二醇和硬段分子结构,所述硬段分子结构占所述聚对苯二甲酸乙二醇酯共聚物的质量百分数的取值大于或者等于20%、且小于或者等于80%。
  9. 根据权利要求8所述的液冷模组(10),其特征在于,所述硬段分子结构选自2,5-呋喃二甲酸、碳酸二甲酯和2,6-萘二甲酸中的至少一种。
  10. 根据权利要求5所述的液冷模组(10),其特征在于,所述液冷模件(100)还包括第二柔性膜(120)和位于所述第一柔性膜(110)和所述第二柔性膜(120)之间的第一刚性基体(130),所述第一柔性膜(110)、所述第二柔性膜(120)和所述第一刚性基体(130)围合构成所述液冷模件(100)的内腔(140),所述第一刚性基体(130)的两端分别与所述第一柔性膜(110)和所述第二柔性膜(120)为一体化密封结构。
  11. 根据权利要求10所述的液冷模组(10),其特征在于,所述第一刚性基体(130)的材质的玻璃化转变温度与所述第一柔性膜(110)或者所述第二柔性膜(120)的材质的玻璃化转变温度的差值小于或者等于20℃;或者
    所述第一刚性基体(130)的材质的熔融温度与所述第一柔性膜(110)或者所述第二柔性膜(120)的材质的熔融温度的差值小于或者等于20℃。
  12. 根据权利要求10所述的液冷模组(10),其特征在于,所述第一柔性膜(110)和所述第二柔性膜(120)中的至少一个包括两层子柔性膜层(115)和位于所述两层子柔性膜层(115)之间的防蒸散层(116),所述防蒸散层(116)包括聚酰亚胺层、聚偏二氯乙烯层或者金属薄膜层中的至少一个。
  13. 根据权利要求10所述的液冷模组(10),其特征在于,所述第一柔性膜(110)和所述第二柔性膜(120)中的至少一个远离所述内腔(140)的表面设有无机氧化薄膜(117)。
  14. 根据权利要求10所述的液冷模组(10),其特征在于,所述液冷模件(100)还包括第二刚性基体(150),所述第二刚性基体(150)将所述液冷模件(100)的内腔(140)分隔为进液流道(142)和出液流道(141),所述液冷进液口(112)与所述进液流道(142)连通,所述液冷出液口(111)与所述出液流道(141)连通,所述第二刚性基体(150)的两端分别与所述第一柔性膜(110)和所述第二柔性膜(120)为一体化密封结构。
  15. 根据权利要求14所述的液冷模组(10),其特征在于,所述液冷模件(100)还包括第三刚性基体(160),所述第三刚性基体(160)分布于所述进液流道(142)和所述出液流道(141)内,所述第三刚性基体(160)的两端分别与所述第一柔性膜(110)和所述第二柔性膜(120)为一体化密封结构。
  16. 根据权利要求15所述的液冷模组(10),其特征在于,所述液冷模件(100)包括液冷膜弯折区(170),所述液冷模件(100)通过所述液冷膜弯折区(170)折叠,所述第一刚性基体(130)、所述第二刚性基体(150)和所述第三刚性基体(160)中的至少一个设有增柔结构(131),所述增柔结构(131)位于所述液冷膜弯折区(170),所述增柔结构(131)用于提升所述液冷膜弯折区(170)的柔韧性。
  17. 根据权利要求16所述的液冷模组(10),其特征在于,所述第一刚性基体(130)的增柔结构(131)包括位于所述第一刚性基体(130)的侧壁上的凹槽(1311),所述凹槽(1311)位于所述液冷膜弯折区(170)。
  18. 根据权利要求16所述的液冷模组(10),其特征在于,所述第二刚性基体(150)的增柔结构(131)包括沿第一方向(A)贯穿所述第二刚性基体(150)的通孔(1313),所述通孔(1313)位于所述液冷膜弯折区(170)内,所述第一方向(A)为所述第一柔性膜(110)和所述第二柔性膜(120)的排列方向;或者
    所述液冷模件(100)设有沿所述第一方向(A)贯穿所述第二刚性基体(150)、所述第一柔性膜(110)和所述第二柔性膜(120)的贯穿孔(1312),所述贯穿孔(1312)位于所述液冷膜弯折区(170)内。
  19. 根据权利要求16所述的液冷模组(10),其特征在于,所述第三刚性基体(160)的增柔结构(131)包括位于所述第三刚性基体(160)的开孔(1314),所述开孔(1314)连通所述第三刚性基体(160)两侧的流道。
  20. 一种液冷模件(100),其特征在于,所述液冷模件(100)包括第一柔性膜(110)、第二柔性膜(120) 和位于所述第一柔性膜(110)和所述第二柔性膜(120)之间的第一刚性基体(130),所述第一柔性膜(110)、所述第二柔性膜(120)和所述第一刚性基体(130)围合构成所述液冷模件(100)的内腔(140),所述第一刚性基体(130)的玻璃化转变温度与所述第一柔性膜(110)的材质的玻璃化转变温度的差值小于或者等于20℃;或者
    所述第一刚性基体(130)的材质的熔融温度与所述第一柔性膜(110)的材质的熔融温度的差值小于或者等于20℃。
  21. 一种液冷模件(100),其特征在于,所述液冷模件(100)包括第一柔性膜(110)、第二柔性膜(120)和位于所述第一柔性膜(110)和所述第二柔性膜(120)之间的第一刚性基体(130),所述第一柔性膜(110)、所述第二柔性膜(120)和所述第一刚性基体(130)围合构成所述液冷模件(100)的内腔(140),所述第一柔性膜(110)、所述第二柔性膜(120)和所述第一刚性基体(130)的材质选自断裂伸长率大于10%的柔性耐温聚合物材料,所述第一柔性膜(110)、所述第二柔性膜(120)和所述第一刚性基体(130)的材质各自独立地选自聚对苯二甲酸乙二醇酯共聚物、聚萘二甲酸乙二醇酯、聚2,5-呋喃二甲酸乙二醇酯、聚酰亚胺、聚醚醚酮、双轴拉伸聚丙烯中的至少一种。
  22. 一种液冷模件(100),其特征在于,所述液冷模件(100)包括第一柔性膜(110)、第二柔性膜(120)和位于所述第一柔性膜(110)和所述第二柔性膜(120)之间的刚性基体(101);所述液冷模件(100)包括液冷膜弯折区(170),所述液冷模件(100)通过所述液冷膜弯折区(170)折叠,所述刚性基体(101)设有增柔结构(131),所述增柔结构(131)位于所述液冷膜弯折区(170),所述增柔结构(131)用于提升所述液冷膜弯折区(170)的柔韧性。
  23. 一种电子设备(1),其特征在于,包括如权利要求1-19任一项所述的液冷模组(10),所述液冷模组(10)位于所述电子设备(1)内,或位于所述电子设备(1)的配件内;或者
    包括如权利要求20-22任一项所述的液冷模件(100),所述液冷模件(100)位于所述电子设备(1)内,或位于所述电子设备(1)的配件内。
  24. 如权利要求1所述的电子设备(1),其特征在于,所述电子设备(1)包括第一非折叠部(11)、折叠部(12)和第二非折叠部(13),所述第二非折叠部(13)通过所述折叠部(12)能够向所述第一非折叠部(11)折叠,所述液冷模件(100)包括液冷膜弯折区(170),所述电子设备(1)折叠时,所述液冷模件(100)通过所述液冷膜弯折区(170)折叠,所述第一刚性基体(130)、所述第二刚性基体(150)和所述第三刚性基体(160)中的至少一个设有增柔结构(131),所述增柔结构(131)位于所述液冷膜弯折区(170),所述增柔结构(131)用于提升所述液冷膜弯折区(170)的柔韧性。
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CN119096711A (zh) 2024-12-06
EP4557904A1 (en) 2025-05-21
CN116614991B (zh) 2025-05-13

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