WO2024169630A1 - 液冷模组、液冷模件及电子设备 - Google Patents
液冷模组、液冷模件及电子设备 Download PDFInfo
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- WO2024169630A1 WO2024169630A1 PCT/CN2024/075186 CN2024075186W WO2024169630A1 WO 2024169630 A1 WO2024169630 A1 WO 2024169630A1 CN 2024075186 W CN2024075186 W CN 2024075186W WO 2024169630 A1 WO2024169630 A1 WO 2024169630A1
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- WIPO (PCT)
- Prior art keywords
- liquid cooling
- liquid
- rigid substrate
- flexible film
- pump
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20281—Thermal management, e.g. liquid flow control
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B43/00—Machines, pumps, or pumping installations having flexible working members
- F04B43/02—Machines, pumps, or pumping installations having flexible working members having plate-like flexible members, e.g. diaphragms
- F04B43/04—Pumps having electric drive
- F04B43/043—Micropumps
- F04B43/046—Micropumps with piezoelectric drive
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B53/00—Component parts, details or accessories not provided for in, or of interest apart from, groups F04B1/00 - F04B23/00 or F04B39/00 - F04B47/00
- F04B53/16—Casings; Cylinders; Cylinder liners or heads; Fluid connections
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
- G06F1/1641—Details related to the display arrangement, including those related to the mounting of the display in the housing the display being formed by a plurality of foldable display components
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
- G06F1/1652—Details related to the display arrangement, including those related to the mounting of the display in the housing the display being flexible, e.g. mimicking a sheet of paper, or rollable
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1675—Miscellaneous details related to the relative movement between the different enclosures or enclosure parts
- G06F1/1681—Details related solely to hinges
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
- H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/203—Heat conductive hinge
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Definitions
- the present application relates to the technical field of electronic equipment, and in particular to a liquid cooling module, a liquid cooling module and an electronic equipment.
- TIM thermal interface materials
- Artificial graphite film graphene film
- copper film and other heat-dissipating materials
- heat pipes VC heat pipes
- micro fans heat pipes
- Folding mobile phones and folding PCs are a new type of mobile terminals that have emerged recently, are growing rapidly and are widely welcomed by users.
- the hinge is required to pass the reliability test of ⁇ 100,000 bends, while most of the current heat dissipation devices and materials, such as artificial graphite, copper film, heat pipes, VC, etc., cannot pass the reliability test requirements.
- CN114340305B provides a through-axis pump-driven liquid cooling and flexible heat dissipation solution that can be applied to PCs or mobile phones and watches. Compared with traditional liquid cooling systems, it is a relatively simplified liquid cooling system without a liquid collection tank, a liquid filling device, and an exhaust valve. However, the system includes ⁇ 3 connecting hoses (made of bending-resistant PTFE metal-plated to prevent evaporation), 2 cold plates (made of stainless steel composite plates), 2 water nozzles connected to the cold plates (3D printed stainless steel), 1 mechanical pump (precision injection molding, containing 3 sealing rings, requiring multiple bolt connections to provide pre-tightening force), 1 four-way valve (to meet the needs of testing, debugging, testing and maintenance), etc.
- the system has a total of ⁇ 12 sealing interfaces.
- the sealed pipe joints cannot be fully automatically assembled. After the incoming materials from different suppliers are inspected, they are assembled, filled with liquid and sealed for testing in the system factory; the system generally uses metal material pipelines, and O-ring sealing systems with pre-tightening force are used in many places.
- the sealing effect of the interface is closely related to the resilience of the interface material itself, the contact pressure, the swelling amount of the sealing material to the liquid cooling medium, the assembly accuracy of the assembly parts, etc., involving materials from multiple suppliers and assembly of production lines. It is impossible to fully automate the production in engineering, and quality control is difficult and costly. For consumer products, the application scenarios are complex and changeable.
- liquid cooling modules are formed by flow channels of membrane materials such as polymer PET, PP, and PPS. Small molecules such as water will penetrate the diaphragm made of polymer materials, and this amount increases exponentially with evaporation and temperature.
- adhesive sealing can be used between the pump and the liquid cooling module, and inside the liquid cooling module.
- Microbubbles are likely to form between the layers during bonding, and long-term temperature and weather resistance is very limited. It is especially not resistant to high temperature and humidity, and is prone to creep or moisture absorption. The adhesive strength of the glue layer decreases and fails, and it cannot be reliably sealed for a long time. Glue is basically not used for sealing liquid cooling systems in engineering. In summary, leakage and evaporation problems are the biggest bottlenecks for the application of traditional liquid cooling systems in massive mobile terminal consumer electronic products; for folding machines, wearables and other products, an innovative flexible liquid cooling system sealing and heat dissipation solution is required.
- the present application provides a liquid cooling module, a liquid cooling module and an electronic device.
- the liquid cooling module includes a pump and a liquid cooling module.
- the pump is used to provide power for the cooling medium in the liquid cooling module, and the pump includes a pump base and a piezoelectric component.
- the pump base is provided with a pump inlet and a pump outlet.
- the liquid cooling module includes a liquid cooling outlet and a liquid cooling inlet, the liquid cooling outlet is used to communicate with the pump inlet, and the liquid cooling inlet is used to communicate with the pump outlet.
- the part of the liquid cooling module around the liquid cooling outlet is the same or similar to the part of the pump base around the pump inlet, and is an integrated sealed welding structure without solder paste or other third materials.
- the part of the liquid cooling module around the liquid cooling inlet is the same or similar to the part of the pump base around the pump outlet, and is an integrated sealed welding structure without solder paste or other third materials.
- the liquid cooling module is composed of a first flexible film, a second flexible film, a first rigid base, a second rigid base, a third rigid base, etc.
- the first rigid substrate and the second rigid substrate are made of the same or similar materials as the first flexible membrane and the second flexible membrane, and the seal therebetween adopts an integrated sealing welding structure without solder paste or other third materials.
- the stacking design, material selection and integrated welding of the pump and the liquid cooling membrane are adopted to realize the integrated sealing of the flexible system without pre-tightening force, and the system can dynamically adapt to bending and use, and the system can be easily sealed. It can effectively reduce the fluctuation of system pressure and volume, greatly simplify the design and manufacturing, and has no assembly leakage. It is suitable for mobile electronic devices such as candy-bar phones, folding phones, folding PCs, wearables, accessories, etc.
- the present application provides a liquid cooling module, the liquid cooling module comprising a pump and a liquid cooling module, the pump comprising a pump base and a piezoelectric component fixed to the pump base, the pump base being provided with a pump inlet and a pump outlet.
- the liquid cooling module comprises a liquid cooling outlet and a liquid cooling inlet, the liquid cooling outlet is used to communicate with the pump inlet, the liquid cooling inlet is used to communicate with the pump outlet, the portion of the liquid cooling module around the liquid cooling outlet and the portion of the pump base around the pump inlet are an integrated sealing structure, the portion of the liquid cooling module around the liquid cooling inlet and the portion of the pump base around the pump outlet are an integrated sealing structure.
- the pump as the power source of the liquid cooling module, can provide the power for the flow and circulation of the cooling medium in the liquid cooling module, realize active liquid cooling, and thus achieve the effect of long-lasting heat dissipation.
- active liquid cooling can adjust the speed of the pump as needed to achieve the best heat dissipation effect, while passive liquid cooling can only passively follow the changes in device temperature to dissipate heat, so active liquid cooling has better adjustability.
- the liquid cooling outlet is used to connect with the pump inlet, which does not mean that the liquid cooling outlet and the pump inlet are always connected, but only indicates that under certain conditions, the cooling medium can flow from the liquid cooling outlet into the pump inlet.
- the relationship between the liquid cooling inlet and the pump outlet is similar.
- the piezoelectric component uses the inverse piezoelectric effect of piezoelectric materials.
- Piezoelectric materials refer to crystalline materials that will produce voltage between the two end faces when subjected to pressure.
- the inverse piezoelectric effect refers to the mechanical deformation or mechanical pressure of the piezoelectric component in a certain direction after an electric field is applied to the piezoelectric component. When the external electric field is removed, these deformations or stresses disappear.
- the use of piezoelectric components in pumps has the characteristics of small size, high energy density and no electromagnetic interference, and can realize the precise delivery and control of cooling media.
- the piezoelectric component includes piezoelectric ceramics, a metal substrate and a plastic partition (to prevent liquid working fluid from corroding the metal substrate).
- part of the liquid cooling module on the side around the liquid cooling outlet and part of the pump base on the side around the pump inlet are an integrated sealing structure
- part of the liquid cooling module on the side around the liquid cooling inlet and part of the pump base on the side around the pump outlet are an integrated sealing structure.
- the formation of an integrated sealing structure means that there is no continuous interface between the two due to mutual fusion and penetration, and the side around the liquid cooling outlet refers to the adjacent area around the liquid cooling outlet.
- the fixing method using screw connection is not convenient for quality control because the tightness of the screw connection (i.e., the sealing effect) is limited by many factors such as assembly accuracy and the material's own resilience. In actual use, it may cause leakage of the cooling medium, thereby affecting the heat dissipation efficiency of the cooling medium and damaging the internal components. It is usually necessary to set a base in the pump, and the screws pass through the base and the liquid cooling module in turn to achieve fixation.
- the integrated sealing structure in this application integrates part of the liquid cooling module on the side of the liquid cooling outlet with part of the pump base on the side of the pump inlet, and the connection relationship is tighter, which is conducive to improving the sealing effect of the pump base and the liquid cooling module.
- the liquid cooling module provided in the present application can be applied to electronic equipment.
- the electronic equipment is subjected to external force (such as falling to the ground and colliding with the ground)
- the use of screw fixation may cause the connection between the pump base and the liquid cooling module to loosen, or the O-ring to shift and the local seal to be loose.
- the integrated sealing structure makes it difficult for relative displacement to occur between the pump base and the liquid cooling module, which is beneficial to improving the stability of the overall structure of the liquid cooling module and increasing the service life of the electronic equipment.
- a pump is used to provide power for the flow and circulation of the cooling medium to achieve active heat dissipation in the liquid cooling module. Compared with passive liquid cooling, it can more effectively reduce the temperature of the device and improve the heat dissipation efficiency.
- the area around the liquid cooling outlet in the liquid cooling module and the area around the pump inlet in the pump base are an integrated sealing structure.
- the area around the liquid cooling inlet in the liquid cooling module and the area around the pump outlet in the pump base are an integrated sealing structure.
- the integrated sealing structure has a better sealing effect and can prevent leakage of the cooling medium, thereby avoiding reducing the heat dissipation efficiency of the cooling medium and protecting the device from damage.
- the centers of the liquid cooling outlet and the pump inlet are aligned in the thickness direction of the liquid cooling module, and the projections of the areas surrounded by the peripheral walls of the liquid cooling outlet and the pump inlet in the thickness direction overlap.
- the centers of the liquid cooling inlet and the pump outlet are aligned in the thickness direction of the liquid cooling module, and the projections of the areas surrounded by the peripheral walls of the liquid cooling inlet and the pump outlet along the thickness direction overlap.
- At least a portion of the liquid cooling module around the liquid cooling outlet and at least a portion of the pump base around the pump inlet are continuously fused together along the circumference of the liquid cooling outlet to form an integrated sealing structure.
- the integrated sealing structure in order to ensure the sealing effect between the pump base and the liquid cooling module, the integrated sealing structure needs to be continuously fused into an integrated sealing structure along the circumference of the liquid cooling outlet.
- the integrated sealing structure can be an ellipse, a square, a triangle, or an irregular shape.
- the circumference of the liquid cooling outlet forms an integrated sealing structure in the radial direction.
- a part of the liquid-cooling module on the peripheral side of the liquid-cooling outlet and a part of the pump base on the peripheral side of the pump inlet may have a discontinuous interface, and the spacing between the interfaces is not limited, wherein the position without the interface is an integrated sealing structure.
- no interface is formed between a part of the liquid-cooling module on the peripheral side of the liquid-cooling outlet and a part of the pump base on the peripheral side of the pump inlet, which is a preferred processing technology with the best sealing effect.
- the radial and circumferential directions are determined based on the liquid cooling outlet being circular.
- the radial direction can be understood as the direction from the center of the liquid cooling outlet to a certain position on the circumferential side.
- At least part of the liquid cooling module on the side of the liquid cooling inlet and at least part of the pump base on the side of the pump outlet are continuously fused into one along the circumference of the liquid cooling inlet to form an integrated sealing structure.
- the integrated sealing structure on the side of the liquid cooling inlet is continuously fused into one along the circumference of the liquid cooling inlet.
- the pump base includes a pump bottom wall, and the pump bottom wall, the piezoelectric component, and a portion of the pump base therebetween form a pump cavity, the pump inlet and the pump outlet are arranged on the pump bottom wall and connected to the pump cavity, and the pump bottom wall and a portion of the liquid cooling module on the side surrounding the liquid cooling outlet and the side surrounding the liquid cooling inlet are an integrated sealing structure.
- connection relationship between the pump inlet and the pump cavity is similar to the connection relationship between the liquid cooling outlet and the pump inlet, that is, the pump inlet and the pump cavity are not always connected, but under the drive of the piezoelectric component, the cooling medium enters the pump cavity through the liquid cooling outlet and the pump inlet.
- the connection relationship between the pump outlet and the pump cavity is similar.
- the pump inlet and the pump outlet are both arranged on the bottom wall of the pump, and part of the pump bottom wall and part of the liquid cooling module located on the periphery of the pump inlet and the pump outlet are an integrated sealing structure, that is, there is no need to add a base to the pump.
- the base and the liquid cooling module can only be fixed by screws, and the sealing effect is poor, which is easy to cause leakage of the cooling medium.
- the liquid cooling module includes two parallel pumps, and the two pumps in parallel can achieve a larger flow rate.
- the liquid cooling module includes two series pumps, and the two pumps in series can achieve a larger driving pressure.
- the liquid cooling module may include multiple pumps, and the multiple pumps may be distributed in different positions in the liquid cooling module, which can be specifically set according to needs.
- the pump further comprises an inlet valve membrane and an outlet valve membrane fixed to the bottom wall of the pump, the inlet valve membrane is used to close or open the pump inlet, and the outlet valve membrane is used to close or open the pump outlet.
- the piezoelectric component in the liquid inlet scenario, is used to receive an electrical signal and then deform, the volume of the pump cavity increases, the inlet valve membrane is driven to open and the outlet valve membrane is driven to close, and power is provided for the cooling medium in the liquid cooling module, so that the cooling medium enters the pump cavity from the liquid cooling outlet and the pump inlet in turn.
- the piezoelectric component in the liquid outlet scenario, is used to receive an electrical signal and then deform, the volume of the pump cavity decreases, the inlet valve membrane is driven to close and the outlet valve membrane is driven to open, and power is provided for the cooling medium in the liquid cooling module, so that the cooling medium enters the liquid cooling module from the pump outlet and the liquid cooling inlet in turn.
- the inlet valve membrane is located on the side of the pump inlet away from the liquid cooling outlet along the thickness direction, and the outlet valve membrane is located between the pump outlet and the liquid cooling inlet along the thickness direction.
- the inlet valve membrane is located between the pump inlet and the pump cavity along the thickness direction, and the outlet valve membrane is located on the side of the liquid cooling inlet away from the pump outlet along the thickness direction.
- the liquid cooling module in this implementation method can not only cool the components of the electronic equipment, but also optimize the performance of the pump contained in the liquid cooling module itself.
- the pump base also includes a pump side wall located between the pump bottom wall and the piezoelectric component, and the pump side wall is an integrated sealing structure.
- the pump side wall extends along the thickness direction of the liquid cooling module. Since the pump side wall, the pump bottom wall, and the piezoelectric component together enclose a pump cavity, the pump side wall is set as an integrated sealing structure in this solution, which can effectively prevent the cooling medium from leaking from the pump side wall and improve the sealing performance of the pump base.
- the pump base includes a pump chamber layer, a first flow channel layer, a valve sheet layer and a second flow channel layer stacked along the thickness direction, a cavity hole is provided in the pump chamber layer, the first flow channel layer is provided with the pump outlet and a first guide channel corresponding to the pump inlet, the first flow channel layer is connected with the cavity hole in the pump chamber layer, the valve sheet layer is provided with the inlet valve membrane and the outlet valve membrane that can be opened and closed, the second flow channel layer is provided with the pump inlet and a second guide channel corresponding to the pump outlet, the second flow channel layer is connected with the liquid cooling module, and the pump chamber layer, the first flow channel layer, the valve sheet layer and the second flow channel layer are formed into an integrated sealing structure by hot pressing.
- the pump inlet, the inlet valve membrane and the first guide channel are correspondingly arranged in the thickness direction of the liquid cooling module
- the pump outlet, the outlet valve membrane and the second guide channel are correspondingly arranged in the thickness direction of the liquid cooling module.
- the projection area of the area enclosed by the peripheral wall of the first guide channel along the thickness direction is larger than the projection area of the area enclosed by the peripheral wall of the pump inlet along the thickness direction, which is advantageous
- the projected area of the area surrounded by the peripheral wall of the second flow guide channel along the thickness direction is larger than the projected area of the area surrounded by the peripheral wall of the pump outlet along the thickness direction, which is beneficial to prevent the cooling medium from flowing back to the pump inlet and outlet, and to give full play to the guiding effect of the second flow guide channel on the cooling medium.
- the edges of the pump cavity layer, the first flow channel layer, the valve sheet layer and the second flow channel layer are hot pressed to form the pump side wall, so that each layer is sealed, thereby improving the sealing effect of the pump base.
- the liquid cooling module includes a first flexible membrane, the liquid cooling outlet and the liquid cooling inlet are arranged on the first flexible membrane, and the pump bottom wall and the periphery of the liquid cooling outlet and a part of the first flexible membrane around the liquid cooling inlet are an integrated sealing structure.
- the fixed connection between the liquid cooling module and the pump is actually the fixed connection between the first flexible membrane and the bottom wall of the pump.
- the first flexible membrane which is located around the liquid cooling outlet and the liquid cooling inlet, forms an integrated sealing structure with the bottom wall of the pump. Since the first flexible membrane and the bottom wall of the pump are made of the same or similar materials, the difficulty of hot pressing is relatively small, which is conducive to forming an integrated sealing structure.
- first flexible membrane there is a discontinuous interface between the first flexible membrane and the bottom wall of the pump.
- at least part of the first flexible membrane and the bottom wall of the pump are continuously fused into one to form an integrated sealing structure.
- the first flexible membrane is an integrated sealing structure with the bottom wall of the pump except for the liquid cooling outlet and the liquid cooling inlet, and there is no interface between the two.
- This sealing interface is a preferred sealing interface, which has stronger flexibility, sealing and impact resistance.
- adhesive sealing may be used at the location where the pump is connected to the liquid cooling module 200 to improve sealing and reliability.
- the difference between the glass transition temperature of the material of the pump bottom wall and the glass transition temperature of the material of the first flexible film is less than or equal to 20° C.
- the difference between the glass transition temperatures of the material of the pump bottom wall and the material of the first flexible film is set to be small, which is conducive to sealing the pump bottom wall and the first flexible film into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.
- the difference between the melting temperature of the material of the pump bottom wall and the melting temperature of the material of the first flexible film is less than or equal to 20° C.
- the difference between the melting temperatures of the material of the pump bottom wall and the material of the first flexible film is set to be small, which is conducive to sealing the pump bottom wall and the first flexible film into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.
- the material of the portion of the liquid-cooling module around the liquid-cooling outlet is the same as the material of the portion of the pump base around the pump inlet
- the material of the portion of the liquid-cooling module around the liquid-cooling inlet is the same as the material of the portion of the pump base around the pump outlet.
- the material of the pump bottom wall is selected from a flexible heat-resistant polymer material with a breaking elongation greater than 10%, and the material of the pump bottom wall is selected from at least one of polyethylene terephthalate copolymer, polyethylene naphthalate, polyethylene 2,5-furandicarboxylate, polyimide, polyetheretherketone, and biaxially stretched polypropylene.
- the material of the first flexible film is selected from a flexible heat-resistant polymer material with a breaking elongation greater than 10%, and the material of the first flexible film is selected from at least one of polyethylene terephthalate copolymer, polyethylene naphthalate, polyethylene 2,5-furandicarboxylate, polyimide, polyetheretherketone, and biaxially stretched polypropylene.
- the material selected for the pump bottom wall and the first flexible film is conducive to the hot pressing between the pump bottom wall and the first flexible film to form an integrated sealing structure, wherein the pump bottom wall and the first flexible film can be made of different materials, as long as an integrated sealing structure can be formed between the pump bottom wall and the first flexible film.
- the monomers of the polyethylene terephthalate copolymer include terephthalic acid, ethylene glycol and a hard segment molecular structure, and the mass percentage of the hard segment molecular structure in the polyethylene terephthalate copolymer is greater than or equal to 20% and less than or equal to 80%.
- This solution introduces a hard segment molecular structure into the structure of polyethylene terephthalate, which can increase the glass transition temperature of the polyethylene terephthalate copolymer.
- the liquid cooling module can be applied to medium and high temperature applications.
- the hard segment molecular structure is set to the above-mentioned ratio, which can improve the structural strength of the polyethylene terephthalate copolymer.
- the polyethylene terephthalate copolymer is used in a liquid cooling module, it can improve the impact resistance and drop resistance of the liquid cooling module, and effectively protect other devices inside the electronic device.
- the hard segment molecular structure is selected from at least one of 2,5-furandicarboxylic acid, dimethyl carbonate and 2,6-naphthalene dicarboxylic acid.
- the above materials are used as the hard segment molecular structure, which can improve the structural strength of the polyethylene terephthalate copolymer.
- other hard segment molecular structures except dimethyl carbonate are used, the evaporation problem of the first flexible film and the second flexible film can also be alleviated, and the water permeability and air permeability can be reduced.
- the liquid-cooling module further includes a second flexible film and a first rigid substrate located between the first flexible film and the second flexible film, wherein the first flexible film, the second flexible film and the first rigid substrate enclose an inner cavity of the liquid-cooling module. Both ends of the first rigid substrate are respectively integrated with the first flexible film and the second flexible film to form a sealing structure.
- the sealing welding interface materials between the first rigid substrate and the first flexible film and the second flexible film are the same or similar, and the sealing and reliability between the first rigid substrate and the first flexible film and the second flexible film can be improved by adopting the welding methods without solder paste or other third materials such as thermocompression bonding sealing welding, hot melt welding, ultrasonic welding, and ultra-frequency welding. If the sealing between the first rigid substrate and the first flexible film and the second flexible film leaks, the system performance will drop rapidly and fail quickly.
- the first flexible membrane and the second flexible membrane are flexible and have good bending performance, and are suitable for situations where the liquid-cooled module needs to be bent.
- a first rigid substrate is arranged between the first flexible membrane and the second flexible membrane, and the two ends of the first rigid substrate are used to support the first flexible membrane and the second flexible membrane, which is beneficial to improving the overall strength of the liquid-cooled module in the thickness direction.
- the cooling medium flows in the inner cavity surrounded by the first flexible membrane, the second flexible membrane and the first rigid substrate.
- the two ends of the first rigid substrate are arranged to form an integrated sealing structure with the first flexible membrane and the second flexible membrane, respectively, which can improve the sealing of the inner cavity and prevent leakage of the cooling medium in the inner cavity.
- the two ends of the first rigid substrate are respectively discontinuous interfaces with the first flexible film and the second flexible film.
- the two ends of the first rigid substrate and at least part of the first flexible film and the second flexible film are continuously fused into one, so as to form an integrated sealing structure.
- the two ends of the first rigid substrate and the first flexible film and the second flexible film are all continuously fused into an integrated sealing structure, and there is no interface between the two ends of the first rigid substrate and the first flexible film, and there is no interface between the two ends of the first rigid substrate and the second flexible film, which is conducive to further improving the sealing effect.
- the first rigid substrate is arranged around the edges of the first flexible membrane and the second flexible membrane. This solution is conducive to improving the strength of the edge of the liquid cooling module in the thickness direction, and the integrated sealing structure can effectively prevent the cooling medium from leaking at the edge of the liquid cooling module.
- the thickness of the first flexible film and the second flexible film is less than the length and width of the liquid cooling module.
- the ratio of the thickness of the first flexible film and the second flexible film to the length of the liquid cooling module is less than or equal to 0.2
- the ratio of the thickness of the first flexible film and the second flexible film to the width of the liquid cooling module is less than or equal to 0.2.
- the first flexible membrane and the second flexible membrane are made of a material with a breaking elongation higher than 10% to adapt to system pressure fluctuations and bending.
- the first flexible membrane and the second flexible membrane are made of a material with a breaking elongation higher than 50%.
- the surfaces of the first flexible membrane and the second flexible membrane are treated with an anti-evaporation coating, such as coating a flexible inorganic oxide film on the surface of a polymer film to isolate water vapor.
- the difference between the glass transition temperature of the material of the first rigid substrate and the glass transition temperature of the first flexible film is less than or equal to 20° C.
- the difference between the glass transition temperatures of the material of the first rigid substrate and the material of the first flexible film is set to be small, which is conducive to sealing the first rigid substrate and the first flexible film into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.
- the difference between the glass transition temperature of the material of the first rigid substrate and the glass transition temperature of the second flexible film is less than or equal to 20° C.
- the difference between the glass transition temperatures of the material of the first rigid substrate and the material of the second flexible film is set to be relatively small, which is conducive to sealing the first rigid substrate and the second flexible film into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.
- the difference between the melting temperature of the material of the first rigid substrate and the melting temperature of the material of the first flexible film is less than or equal to 20° C. Setting the difference between the melting temperatures of the material of the first rigid substrate and the material of the first flexible film to be relatively small is conducive to sealing the first rigid substrate and the first flexible film into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.
- the difference between the melting temperature of the material of the first rigid substrate and the melting temperature of the material of the second flexible film is less than or equal to 20° C. Setting the difference between the melting temperatures of the material of the first rigid substrate and the material of the second flexible film to be relatively small is conducive to sealing the first rigid substrate and the second flexible film into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.
- At least one of the first flexible film and the second flexible film includes two sub-flexible film layers and an anti-evaporation layer located between the two sub-flexible film layers, and the anti-evaporation layer includes at least one of a polyimide layer, a polyvinylidene chloride layer, or a metal film layer.
- the material of the sub-flexible film layer can be selected from any one of the materials of the first flexible film or the second flexible film mentioned above.
- the material of the sub-flexible film layer can be selected from the polyethylene terephthalate copolymer mentioned above, referred to as PET copolymer.
- the first flexible film and the second flexible film adopts a multi-layer film process, that is, the first flexible film and the second flexible film are set to a sandwich structure of "PET copolymer-X-PET copolymer", where the X layer refers to an anti-evaporation layer.
- Polyimide, polyvinylidene chloride and metal film are materials with low water vapor permeability.
- the anti-evaporation layer adopts the above materials to reduce the evaporation of water vapor in the first flexible film and the second flexible film.
- a multi-layer co-extrusion technology or a multi-layer film pressing technology is used to realize a multi-layer film structure in the first flexible film and the second flexible film.
- the metal film layer may be a copper film, a nickel film, an aluminum film or a metal-plastic composite film material, and the thickness is less than or equal to 10
- this solution is conducive to ensuring that the first flexible film and the second flexible film meet the requirements of 100,000 to 400,000 bending tests at different bending angles.
- At least one of the first flexible film and the second flexible film is provided with an inorganic oxide film on a surface away from the inner cavity.
- the surfaces of the first flexible film and the second flexible film away from the inner cavity are not in direct contact with the cooling medium, they are both interfaces that the cooling medium must pass through when evaporating to the outside.
- the provision of the inorganic oxide film is conducive to isolating water vapor and alleviating the evaporation problem of the cooling medium.
- the liquid-cooling module also includes a second rigid substrate, which divides the inner cavity of the liquid-cooling module into a liquid inlet channel and a liquid outlet channel, the liquid cooling inlet is connected to the liquid inlet channel, the liquid cooling outlet is connected to the liquid outlet channel, and the two ends of the second rigid substrate are respectively integrated with the first flexible membrane and the second flexible membrane to form a sealing structure.
- the two ends of the second rigid substrate respectively adopt an integrated sealing structure with the first flexible membrane and the second flexible membrane to improve the sealing performance and reliability. If the segmentation and sealing between the second rigid substrate and the first flexible membrane and the second flexible membrane leaks, the performance of the liquid cooling system will be greatly reduced and gradually fail.
- the second rigid substrate is used to separate the flow channel of the inner cavity into an inlet channel and an outlet channel, and the inlet channel and the outlet channel are formed by the second rigid substrate and the first rigid substrate, the first flexible membrane and the second flexible membrane.
- the inlet channel is connected to the liquid cooling inlet
- the outlet channel is connected to the liquid cooling outlet.
- the inlet channel and the outlet channel are separated by the second rigid substrate, which helps to avoid mixing of the cooling medium in the inlet channel and the outlet channel, thereby reducing the cooling efficiency.
- Both ends of the second rigid substrate are integrated with the first flexible membrane and the second flexible membrane by hot pressing and sealing, which helps to improve the isolation effect between the inlet channel and the outlet channel, and can further improve the structural strength of the liquid cooling module.
- liquid inlet channel and the liquid outlet channel are not two completely isolated parts.
- the second rigid base only separates the liquid inlet channel and the liquid outlet channel adjacent to the pump.
- the liquid inlet channel and the liquid outlet channel are connected in an area far away from the pump.
- the two ends of the second rigid substrate are respectively discontinuous interfaces with the first flexible film and the second flexible film.
- the two ends of the second rigid substrate and at least part of the first flexible film and the second flexible film are continuously fused into one, so as to form an integrated sealing structure.
- the two ends of the second rigid substrate are completely continuously fused with the first flexible film and the second flexible film to form an integrated sealing structure, and there is no interface between the two ends of the second rigid substrate and the first flexible film, and there is no interface between the two ends of the second rigid substrate and the second flexible film, which is conducive to further improving the sealing effect.
- the second rigid matrix includes a first sub-rigid matrix located below the pump and a second sub-rigid matrix located outside the pump, and the orthographic projection of the first sub-rigid matrix on the second flexible membrane does not overlap with the orthographic projection of the area enclosed by the edges of the liquid-cooling inlet and the liquid-cooling outlet on the second flexible membrane.
- below the pump refers to the side of the pump close to the liquid cooling module along the thickness direction.
- the orthographic projection of the first sub-rigid matrix on the second flexible membrane does not overlap with the orthographic projection of the area enclosed by the edges of the pump inlet and the pump outlet on the second flexible membrane.
- the first sub-rigid matrix can be extended to a point outside the pump.
- the second rigid substrate mainly serves to separate the liquid inlet and outlet channels, but the second rigid substrate cannot cause any obstruction to the cooling medium entering and exiting the pump chamber. Therefore, this scheme reduces the flow resistance of the cooling medium when passing through the liquid cooling inlet and the liquid cooling outlet by arranging the orthographic projection of the first sub-rigid substrate on the second flexible membrane and the area enclosed by the edges of the liquid cooling inlet and the liquid cooling outlet not overlapping with each other.
- the first sub-rigid substrate is made of the same material as the first rigid substrate.
- the first sub-rigid substrate is located below the pump. When the pump is working, the cooling liquid pumped out by the pump will exert impact pressure on the first sub-rigid substrate when it enters and exits the liquid cooling inlet and the liquid cooling outlet, which will cause the system performance to drop rapidly and fail quickly.
- the first sub-rigid substrate is made of the same material as the first rigid substrate, so that the sealing effect and structural strength between the first sub-rigid substrate and the first flexible membrane and the second flexible membrane are the same as the sealing effect and structural strength between the first rigid substrate and the first flexible membrane and the second flexible membrane, effectively improving the sealing effect and structural strength between the first sub-rigid substrate and the first flexible membrane and the second flexible membrane, and preventing the liquid near the pump from impacting the first sub-rigid substrate and affecting the sealing effect.
- the first sub-rigid substrate and the first rigid substrate are an integrated structure, which improves the sealing and reliability between the first sub-rigid substrate and the first rigid substrate.
- the first sub-rigid substrate and the second sub-rigid substrate are an integrated structure, which improves the sealing and reliability between the first sub-rigid substrate and the second sub-rigid substrate.
- the first rigid sub-base is simultaneously heat-pressed and welded with the first rigid base and the first flexible film or the second flexible film. This solution can improve the sealing effect and structural strength between the first rigid sub-base and the first flexible film or the second flexible film.
- the second rigid substrate is in a strip shape as a whole. This solution can reduce processing costs, and the more regular shape of the second rigid substrate is conducive to reducing the flow resistance of the second rigid substrate to the cooling medium.
- the first flexible membrane corresponding to the second rigid substrate in the thickness direction is an integrated sealing structure with the pump bottom wall. This solution can further ensure that the cooling medium in the liquid inlet flow channel and the liquid outlet flow channel does not short-circuit and mix.
- the liquid cooling module further includes a third rigid substrate, which is distributed in the liquid inlet channel and the liquid outlet channel, and the two ends of the third rigid substrate are respectively integrated with the first flexible membrane and the second flexible membrane to form a sealing structure. If the segmentation and sealing between the third rigid substrate and the first flexible membrane and the second flexible membrane leaks, the performance of the liquid cooling system will be slightly reduced, but the entire liquid cooling system will not fail.
- a plurality of third rigid substrates divide the liquid inlet flow channel into a plurality of interconnected liquid inlet sub-flow channels, and divide the liquid outlet flow channel into a plurality of interconnected liquid outlet sub-flow channels.
- the third rigid substrate plays a role of guiding flow in the liquid inlet flow channel and the liquid outlet flow channel, respectively, reducing flow resistance and avoiding eddy current loss, which is conducive to enhancing the heat exchange effect of the cooling medium.
- the third rigid substrate can be in a strip shape or a cylindrical shape as a whole.
- the third rigid substrate in a strip shape is conducive to guiding the flow of the cooling medium, and the third rigid substrate in a cylindrical shape is conducive to enhancing the mixing of the cooling medium.
- the third rigid substrate plays the role of both guiding and mixing flow
- the third rigid substrate can be set in the area where the width of the liquid inlet or outlet channel suddenly changes, the area where the cooling medium flow direction suddenly changes, and the area adjacent to the liquid cooling inlet.
- the two ends of the third rigid substrate are respectively discontinuous interfaces with the first flexible film and the second flexible film.
- the two ends of the third rigid substrate and at least part of the first flexible film and the second flexible film are continuously fused into one, so as to form an integrated sealing structure.
- the two ends of the third rigid substrate and the first flexible film and the second flexible film are all continuously fused into an integrated sealing structure, and there is no interface between the two ends of the third rigid substrate and the first flexible film, and there is no interface between the two ends of the second rigid substrate and the second flexible film, which can further improve the sealing effect.
- the thickness of the first rigid substrate, the second rigid substrate, and the third rigid substrate are all less than the width of the liquid cooling module. Specifically, the ratio range of the thickness of the first rigid substrate, the second rigid substrate, and the third rigid substrate to the width of the liquid cooling module is greater than or equal to 0.1 and less than or equal to 0.2. The thickness of the first rigid substrate, the second rigid substrate, and the third rigid substrate are all less than the length of the liquid cooling module. Specifically, the ratio range of the thickness of the first rigid substrate, the second rigid substrate, and the third rigid substrate to the length of the liquid cooling module is greater than or equal to 10-5 and less than or equal to 0.2. This solution is conducive to ensuring the high strength of the liquid cooling module in the thickness direction and the flexibility of the liquid cooling module in the length and width directions.
- the thicknesses of the first rigid substrate, the second rigid substrate, and the third rigid substrate are not equal.
- the thickness refers to the dimension in the thickness direction.
- the three rigid substrates are designed with unequal thicknesses.
- the first flexible membrane or the second flexible membrane may also be provided with a liquid injection port and an air extraction port, etc.
- the liquid injection port and the air extraction port are an integrated sealing structure with at least one of the three rigid substrates and the first flexible membrane or the second flexible membrane.
- the liquid injection port is used to inject cooling medium into the inner cavity before cooling
- the air extraction port is used to extract the gas in the inner cavity to avoid negative effects on the heat dissipation effect.
- the liquid injection port and the air extraction port are integrally sealed and connected with at least one of the first rigid substrate, the second rigid substrate and the third rigid substrate, and the first flexible membrane or the second flexible membrane, which is conducive to avoiding leakage of the cooling medium in the liquid injection port and the air extraction port.
- the liquid injection port, the air extraction port and the liquid cooling module are in the same plane, that is, between the first flexible membrane and the second flexible membrane.
- the liquid-cooling module includes a liquid-cooling film bending zone, the liquid-cooling module is folded through the liquid-cooling film bending zone, at least one of the first rigid substrate, the second rigid substrate and the third rigid substrate is provided with a flexibility-enhancing structure, the flexibility-enhancing structure is located in the liquid-cooling film bending zone, and the flexibility-enhancing structure is used to improve the flexibility of the liquid-cooling film bending zone.
- the first rigid substrate, the second rigid substrate and the third rigid substrate can enhance the strength of the liquid cooling module in the thickness direction due to their rigidity.
- the bending portion of the liquid cooling module needs to have a certain flexibility. Therefore, this solution sets a flexibility enhancement structure in the bending area of the liquid cooling film of the liquid cooling module, which can reduce the resistance of the bending portion of the liquid cooling module when bending, and meet the folding requirements of the electronic device.
- the flexibility enhancement structure may be at least one of a groove, a through hole, a through hole, and an opening.
- the liquid cooling module further comprises a first liquid cooling film static area and a second liquid cooling film static area located on both sides of the liquid cooling film bending area.
- first liquid cooling film static area and the second liquid cooling film static area do not deform.
- the flexibility enhancement structure of the first rigid substrate includes a groove located on a side wall of the first rigid substrate, and the groove is located in a bending area of the liquid-cooling film.
- the first rigid substrate is arranged around the edge of the liquid cooling module, and is a barrier between the cooling medium and the external environment. Therefore, the first rigid substrate needs to have a high structural strength to ensure the sealing effect, so that the cooling medium does not leak to the outside of the liquid cooling module.
- the first rigid substrate located in the bending area of the liquid cooling film needs to take into account both structural strength and a certain degree of flexibility. Therefore, the flexibility enhancement structure arranged on the first rigid substrate is preferably a groove. If a through hole, through hole or opening is set on the first rigid substrate, there will be a risk of cooling medium leakage.
- the flexibility enhancement structure of the second rigid substrate includes a through hole penetrating the second rigid substrate along a first direction, the through hole is located in the bending area of the liquid cooling film, and the first direction is the arrangement direction of the first flexible film and the second flexible film.
- a through hole is provided in the second rigid substrate, which can improve the flexibility of the bent portion of the second rigid substrate. Since the two sides of the second rigid substrate are the liquid inlet channel and the liquid outlet channel respectively, the opening on the second rigid substrate cannot connect the cooling medium on both sides to avoid affecting the cooling effect due to mixed flow. Among them, the first direction A is also the thickness direction of the liquid cooling module.
- the liquid-cooling module is provided with a through hole penetrating the second rigid substrate, the first flexible membrane and the second flexible membrane along the first direction, and the through hole is located in a bending area of the liquid-cooling membrane.
- a through hole is provided in the second rigid substrate, which can improve the flexibility of the bending part of the second rigid substrate and reduce the rebound force and friction force of the bending area of the liquid cooling module when bending.
- the first direction is the thickness direction of the liquid cooling module.
- the through hole penetrates the second rigid substrate along the first direction without causing short circuit and mixed flow of the cooling medium in the liquid inlet and outlet channels.
- the third rigid substrate can be opened to reduce the rebound force of the bending area of the liquid cooling module and the friction force with the screen and the middle frame when bending, and will not cause short circuit of the cooling medium flow.
- the flexibility structure of the second rigid substrate includes through holes and through holes, or the flexibility structure of the second rigid substrate includes any one of through holes and through holes.
- through holes and through holes can be flexibly arranged in the second rigid substrate according to actual conditions, thereby improving the practicality of the second rigid substrate in different application environments.
- the flexibility enhancement structure of the third rigid substrate includes an opening located in the third rigid substrate, and the opening is connected to flow channels on both sides of the third rigid substrate.
- this solution is set to set an opening in the third rigid substrate, which is equivalent to partially disconnecting the third rigid substrate at the position of the opening, inducing bending deformation at the designed position, and effectively reducing the stress generated during bending.
- Part of the third rigid substrate is distributed in the liquid inlet channel, and part of the third rigid substrate is distributed in the liquid outlet channel, that is, the channels on both sides of the third rigid substrate belong to the same liquid inlet channel or the same liquid outlet channel, so the opening connects the two sides of the third rigid substrate without affecting the heat dissipation efficiency, and can increase the mixing effect of the cooling medium in the same flow direction in the liquid inlet channel or the liquid outlet channel, thereby improving the cooling effect.
- the flexibility enhancement structure may extend along the flow direction of the cooling medium. In another embodiment, the flexibility enhancement structure may extend along the folding direction of the folding device. Setting the size of the flexibility enhancement structure in the extension direction to be larger can effectively improve the flexibility of the bending area of the liquid cooling film, reduce the rebound force of the bending area of the liquid cooling module and the friction force with the screen and the middle frame when bending, and thus improve the user experience of the folding device.
- a lubricating material layer is applied on the surface of the first flexible film and the second flexible film away from the inner cavity, and the lubricating material layer is located in the bending area of the liquid-cooled film.
- a lubricating material layer can also be provided on the outer surface of the first flexible film and the second flexible film to reduce the friction of the bending area of the liquid-cooled film when bending, so that the bending process can be carried out more smoothly.
- the lubricating material layer includes, but is not limited to, solid, liquid or paste lubricating materials such as Teflon film, graphite film, graphene film or grease.
- the lubricating material layer can be arranged only in the bending area of the liquid-cooled film, or it can be arranged simultaneously in at least one of the first liquid-cooled film static area and the second liquid-cooled film static area and the liquid-cooled film bending area.
- the lubricating material layer can also enhance the heat dissipation effect and reduce the overall temperature of the cooling medium, thereby reducing the startup time and frequency of the pump.
- the present application provides a liquid-cooling module, comprising a first flexible film, a second flexible film, and a first rigid substrate located between the first flexible film and the second flexible film, the first flexible film, the second flexible film, and the first rigid substrate enclose an inner cavity of the liquid-cooling module, and the difference between the glass transition temperature of the first rigid substrate and the glass transition temperature of the material of the first flexible film is less than or equal to 20°C.
- the first flexible film and the second flexible film can reduce the difficulty of bending the electronic device.
- the first rigid substrate is used to enhance the structural strength of the liquid cooling module in the thickness direction.
- the first flexible film, the second flexible film and the first rigid substrate enclose an inner cavity, and the cooling medium flows in the inner cavity.
- the two ends of the first rigid substrate and the first flexible film and the second flexible film form an integrated sealing structure, which is conducive to improving the sealing performance of the first rigid substrate and avoiding leakage of the cooling medium.
- the difference in glass transition temperature between the material of the first rigid substrate and the material of the first flexible film is set to be small, which is conducive to sealing the first rigid substrate and the first flexible film into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.
- the difference between the melting temperature of the material of the first rigid substrate and the melting temperature of the material of the first flexible film is less than or equal to 20° C. In this embodiment, the difference between the melting temperatures of the material of the first rigid substrate and the material of the first flexible film is set to be small, which is conducive to sealing the first rigid substrate and the first flexible film into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.
- the present application provides a liquid-cooling module, the liquid-cooling module comprising a first flexible film, a second flexible film and a first rigid substrate located between the first flexible film and the second flexible film, the first flexible film, the second flexible film and the first rigid substrate enclose an inner cavity of the liquid-cooling module, the material of the first flexible film, the second flexible film and the first rigid substrate is selected from a flexible temperature-resistant polymer material with a breaking elongation greater than 10%, and the materials of the first flexible film, the second flexible film and the first rigid substrate are independently selected from polyethylene terephthalate copolymer, polyethylene naphthalate, polyethylene 2,5-furandicarboxylate, polyimide, poly At least one of ether ether ketone and biaxially stretched polypropylene.
- the first flexible film and the second flexible film can reduce the difficulty of bending the electronic device.
- the first rigid substrate is used to enhance the structural strength of the liquid cooling module in the thickness direction.
- the first flexible film, the second flexible film and the first rigid substrate enclose an inner cavity, and the cooling medium flows in the inner cavity.
- the two ends of the first rigid substrate and the first flexible film and the second flexible film form an integrated sealing structure, which is conducive to improving the sealing performance of the first rigid substrate and avoiding leakage of the cooling medium.
- the materials selected for the first rigid substrate and the first flexible film or the second flexible film are conducive to the first rigid substrate and the first flexible film or the second flexible film being hot pressed to form an integrated sealing structure.
- the first rigid substrate and the first flexible film or the second flexible film can be made of different materials as long as an integrated sealing structure can be formed between the first rigid substrate and the first flexible film or the second flexible film.
- the present application provides a liquid cooling module, the liquid cooling module comprising a first flexible film, a second flexible film and a rigid substrate located between the first flexible film and the second flexible film.
- the liquid cooling module comprises a liquid cooling film bending area, the liquid cooling module is folded through the liquid cooling film bending area, the rigid substrate is provided with a flexibility enhancement structure, the flexibility enhancement structure is located in the liquid cooling film bending area, and the flexibility enhancement structure is used to improve the flexibility of the liquid cooling film bending area.
- the two ends of the rigid substrate are used to support the first flexible membrane and the second flexible membrane.
- the provision of the rigid substrate in the liquid-cooling module is beneficial to improving the structural strength of the liquid-cooling module in the thickness direction.
- the flexibility enhancement structure may be at least one of a groove, a through hole, a through hole, and an opening.
- the rigid substrate may include a first rigid substrate, a second rigid substrate, and a third rigid substrate.
- the present application provides an electronic device, the electronic device comprising the liquid cooling module as described in any one of the implementations of the first aspect, the liquid cooling module being located in the electronic device. In one implementation, the liquid cooling module is located in an accessory of the electronic device. In one implementation, the electronic device comprises the liquid cooling module as described in any one of the second, third, and fourth aspects, the liquid cooling module being located in the electronic device. In one implementation, the liquid cooling module is located in an accessory of the electronic device.
- the electronic device includes a first non-folding portion, a folding portion, and a second non-folding portion, the second non-folding portion can be folded toward the first non-folding portion through the folding portion
- the liquid-cooling module includes a liquid-cooling film bending zone, and when the electronic device is folded, the liquid-cooling module is folded through the liquid-cooling film bending zone, and at least one of the first rigid substrate, the second rigid substrate, and the third rigid substrate is provided with a flexibility-enhancing structure, and the flexibility-enhancing structure is located in the liquid-cooling film bending zone, and the flexibility-enhancing structure is used to improve the flexibility of the liquid-cooling film bending zone.
- the beneficial effects of the present application are as follows: On foldable electronic devices, the equivalent thermal conductivity of the liquid cooling film group can reach more than 5000W/m-K, which is more than 100% higher than the heat dissipation capacity of cross-axis/through-axis graphite heat dissipation materials; the liquid cooling system can be extremely simplified in processing and manufacturing, with no assembly leakage and high flexibility.
- FIG. 1a is a schematic structural diagram of a liquid cooling module provided in a first embodiment of the present application
- FIG1b is a partial enlarged view of portion P in FIG1a;
- FIG. 1c is a physical schematic diagram of the pump portion of the liquid cooling module provided in the first embodiment of the present application.
- FIG2 is a cross-sectional view of a liquid cooling module provided in the first embodiment of the present application.
- FIG3 is a cross-sectional view of a liquid cooling module provided in the first embodiment of the present application.
- FIG4 is a top view of a liquid cooling module provided in the first embodiment of the present application.
- FIG5 is a cross-sectional view of a liquid cooling module provided in the first embodiment of the present application.
- FIG6 is a cross-sectional view of a liquid cooling module provided in the first embodiment of the present application.
- FIG7 is an exploded view of a stacked structure of a pump portion provided in the first embodiment of the present application.
- FIG8 is a cross-sectional view of a liquid cooling module provided in the first embodiment of the present application.
- FIG9 is a cross-sectional view of a liquid cooling module provided in the first embodiment of the present application.
- FIG10 is a side view of the pump and the second rigid substrate provided in the first embodiment of the present application.
- FIG11 is a cross-sectional view of a liquid cooling module provided in the first embodiment of the present application.
- FIG12 is a cross-sectional view of a liquid cooling module provided in the first embodiment of the present application.
- FIG13 is a cross-sectional view of a first flexible film provided in the first embodiment of the present application.
- FIG14 is a cross-sectional view of a liquid cooling module provided in the first embodiment of the present application.
- FIG15 is a partial enlarged view of the liquid cooling module shown in FIG1a;
- FIG16 is a cross-sectional view of a liquid cooling module provided in the first embodiment of the present application.
- FIG17 is a cross-sectional view of a liquid cooling module provided in the first embodiment of the present application.
- FIG18 is a cross-sectional view of a liquid cooling module provided in the first embodiment of the present application.
- FIG19 is a cross-sectional view of a liquid cooling module provided in the first embodiment of the present application.
- FIG20 is a schematic diagram of the structure of an electronic device provided in the first embodiment of the present application.
- FIG21 is a schematic diagram of the structure of an electronic device provided in a second embodiment of the present application.
- FIG22 is a schematic diagram of the structure of an electronic device provided in a second embodiment of the present application.
- FIG23 is a schematic diagram of the structure of an electronic device provided in a third embodiment of the present application.
- FIG24 is a schematic diagram of a partial structure of a liquid cooling module provided in a third embodiment of the present application.
- FIG25 is a schematic diagram of the structure of a liquid cooling module and a flexible circuit board provided in a third embodiment of the present application.
- FIG26 is a schematic structural diagram of a liquid cooling module provided in a fourth embodiment of the present application.
- FIG27 is a schematic diagram of the structure of an electronic device provided by an embodiment of the present application.
- FIG28 is a schematic structural diagram of an electronic device provided in a fifth embodiment of the present application.
- FIG. 29 is a schematic diagram of a liquid cooling module provided in an embodiment of the present application.
- PET polyethylene terephthalate
- Glass transition temperature refers to the temperature corresponding to the transition from glass state to highly elastic state. A high glass transition temperature indicates that the material has good heat resistance.
- the embodiment of the present application provides a liquid cooling module, which includes a pump and a liquid cooling module.
- the pump is used to provide power for the cooling medium in the liquid cooling module.
- the pump includes a pump base and a piezoelectric component.
- the pump base is provided with a pump inlet and a pump outlet.
- the liquid cooling module includes a liquid cooling outlet and a liquid cooling inlet.
- the liquid cooling outlet is connected to the pump inlet.
- the liquid cooling inlet is connected to the pump outlet.
- Part of the liquid cooling module around the liquid cooling outlet is made of the same or similar material as part of the pump base around the pump inlet, which is an integrated sealed welding structure without solder paste or other third materials.
- Part of the liquid cooling module around the liquid cooling inlet is made of the same or similar material as part of the pump base around the pump outlet, which is an integrated sealed welding structure without solder paste or other third materials.
- This integrated sealed welding method includes welding methods without solder paste or other third materials such as hot pressing bonding sealing welding, hot melt welding, ultrasonic welding, and ultra-frequency welding.
- the liquid cooling module is composed of a first flexible film (elongation at break>10%), a second flexible film (elongation at break>10%), a first rigid substrate, a second rigid substrate, a third rigid substrate, etc.
- the first rigid substrate and the second rigid substrate are made of the same or similar materials as the first flexible film and the second flexible film, and the seal therebetween adopts an integrated sealing welding structure without solder paste or other third materials.
- This integrated sealing welding includes welding methods such as hot compression bonding sealing welding, hot melt welding, ultrasonic welding, and ultra-frequency welding without solder paste or other third materials.
- the integrated welding seal between the pump and the liquid cooling module and the liquid cooling module has no assembly leakage, is resistant to bending and impact, adapts to changes in system pressure and volume, greatly simplifies design and manufacturing, and can avoid leakage of cooling medium due to sealing problems, thereby improving the stability of the overall structure of the liquid cooling module and the safety performance of electronic equipment.
- liquid cooling module provided in the embodiments of the present application will be described in detail below.
- Figure 1a is a structural schematic diagram of the liquid cooling module 10 provided in the first embodiment of the present application
- Figure 1b is a local enlarged diagram of part P in Figure 1a
- Figure 1c is a physical schematic diagram of the pump part of the liquid cooling module provided in the first embodiment of the present application
- Figure 2 is a cross-sectional view of the liquid cooling module 10 provided in the first embodiment of the present application.
- the liquid cooling module 10 includes a pump 200 and a liquid cooling module 100 (as shown in FIG. 1a and FIG. 2 ).
- the pump 200 includes a pump base 210 and a piezoelectric component 220, etc.
- the pump base 210 is provided with a pump inlet 211 and a pump outlet 212 (as shown in FIG. 2 ).
- the liquid cooling module 100 includes a liquid cooling outlet 111 and a liquid cooling inlet 112 (as shown in FIG. 2 ).
- the liquid cooling outlet 111 is used to communicate with the pump inlet 211.
- the liquid cooling inlet 112 is used to communicate with the pump outlet 212.
- Part of the liquid cooling module 100 around the liquid cooling outlet 111 and part of the pump base 210 around the pump inlet 211 are an integrated sealing structure (as shown in FIG. 2 ). Part of the liquid cooling module 100 around the liquid cooling inlet 112 and part of the pump base 210 around the pump outlet 212 are sealed.
- the pump base 210 on the side is an integrated sealing structure (as shown in FIG. 2 ). The pump and the liquid cooling module can assist in dispensing glue to strengthen the structural positioning and strength, but it is not a sealed welding surface.
- the pump 200 as the power source of the liquid cooling module 10, can provide the power for the cooling medium in the liquid cooling module 100 to flow and circulate, realize active liquid cooling, and thus achieve the effect of long-lasting heat dissipation.
- active liquid cooling can adjust the speed of the pump 200 as needed to achieve the best heat dissipation effect, while passive liquid cooling can only passively follow the change of device temperature to dissipate heat, so active liquid cooling has better adjustability.
- liquid cooling outlet 111 is used to communicate with the pump inlet 211, which does not mean that the liquid cooling outlet 111 and the pump inlet 211 are always connected, but only indicates that under certain conditions, the cooling medium can flow from the liquid cooling outlet 111 into the pump inlet 211.
- the relationship between the liquid cooling inlet 112 and the pump outlet 212 is similar.
- part of the liquid cooling module 100 around the liquid cooling outlet 111 and part of the pump base 210 around the pump inlet 211 are an integrated sealing structure
- part of the liquid cooling module 100 around the liquid cooling inlet 112 and part of the pump base 210 around the pump outlet 212 are an integrated sealing structure.
- forming an integrated sealing structure means that there is no continuous interface between the two due to mutual fusion and penetration, and the surrounding side of the liquid cooling outlet 111 refers to the adjacent area around the liquid cooling outlet 111.
- the fixing method of screw connection is not convenient for quality control because the tightness of the screw connection (i.e., the sealing effect) is limited by various factors such as assembly accuracy and the resilience of the material itself. In actual use, it may cause leakage of the cooling medium, thereby affecting the heat dissipation efficiency of the cooling medium and damaging the internal components. It is usually necessary to set a base in the pump 200, and the screws pass through the base and the liquid cooling module 100 in turn to achieve fixation.
- the integrated sealing structure in the embodiment of the present application integrates part of the liquid cooling module 100 on the side of the liquid cooling outlet 111 and part of the pump base 210 on the side of the pump inlet 211 into one, and the connection relationship is tighter, which is conducive to improving the sealing effect of the pump base 210 and the liquid cooling module 100, and there is no need to add an additional base, simplifying the structure of the liquid cooling module 10, reducing costs and processing difficulty, and achieving an ultra-thin design.
- the liquid cooling module 10 provided in the embodiment of the present application can be applied to electronic equipment.
- the use of screw fixation may cause the connection between the pump base 210 and the liquid cooling module 100 to loosen, or the O-ring to shift and the local seal to be loose.
- the integrated sealing structure makes it difficult for relative displacement to occur between the pump base 210 and the liquid cooling module 100, which is beneficial to improving the stability of the overall structure of the liquid cooling module 10 and increasing the service life of the electronic equipment.
- the pump 200 is used to provide power for the flow and circulation of the cooling medium, and active heat dissipation is achieved in the liquid cooling module 10.
- active heat dissipation is achieved in the liquid cooling module 10.
- passive liquid cooling it can more effectively reduce the temperature of the device and improve the heat dissipation efficiency.
- the area around the liquid cooling outlet 111 in the liquid cooling module 100 and the area around the pump inlet 211 in the pump base 210 are an integrated sealing structure
- the area around the liquid cooling inlet 112 in the liquid cooling module 100 and the area around the pump outlet 212 in the pump base 210 are an integrated sealing structure.
- the integrated sealing structure has a better sealing effect and can prevent leakage of the cooling medium, thereby avoiding reducing the heat dissipation efficiency of the cooling medium and protecting the device from damage.
- the centers of the liquid cooling outlet 111 and the pump inlet 211 are aligned in the thickness direction A of the liquid cooling module 10, and the projections of the areas surrounded by the peripheral walls of the liquid cooling outlet 111 and the pump inlet 211 along the thickness direction A overlap.
- the centers of the liquid cooling inlet 112 and the pump outlet 212 are aligned in the thickness direction A of the liquid cooling module 10, and the projections of the areas surrounded by the peripheral walls of the liquid cooling inlet 112 and the pump outlet 212 along the thickness direction A overlap.
- This solution is conducive to reducing the flow resistance of the cooling medium when passing through the liquid cooling inlet 112 and the pump outlet 212, thereby improving the cooling efficiency.
- Figure 3 is a cross-sectional view of the liquid cooling module 10 provided in the first embodiment of the present application
- Figure 4 is a top view of the liquid cooling module 10 provided in the first embodiment of the present application.
- at least a portion of the liquid cooling module 100 on the side of the liquid cooling outlet 111 and at least a portion of the pump base 210 on the side of the pump inlet 211 are continuously fused into one along the circumferential direction D of the liquid cooling outlet 111 (as shown in combination with Figures 3 and 4) to form an integrated sealing structure.
- the integrated sealing structure needs to be continuously fused along the circumference of the liquid-cooling outlet 111 to form an integrated sealing structure M, as shown in the annular shaded area in Figure 4.
- M can be an ellipse, a square, a triangle, or an irregular shape.
- the circumference of the liquid-cooling outlet 111 forms an integrated sealing structure along the radial direction E. It should be noted that continuous fusion can be set only at one or several positions on the circumference of the liquid-cooling outlet 111 along the circumferential direction D, and there is no integrated sealing welding structure of a third material.
- FIG. 5 is a cross-sectional view of the liquid cooling module 10 provided in the first embodiment of the present application
- FIG. 6 is a cross-sectional view of the liquid cooling module 10 provided in the first embodiment of the present application.
- a portion of the liquid cooling module 100 on the side of the liquid cooling outlet 111 and a portion of the pump base 210 on the side of the pump inlet 211 may have a discontinuous interface, and the interface The spacing between them is not limited (as shown in FIG. 3 and FIG. 5 ), wherein the position without interface is an integrated sealing structure.
- no interface is formed between the part of the liquid-cooling module 100 on the side of the liquid-cooling outlet 111 and the part of the pump base 210 on the side of the pump inlet 211 (as shown in FIG. 6 ), which is the preferred processing technology with the best sealing effect.
- the radial direction E and the circumferential direction D are determined based on the liquid cooling outlet 111 being circular.
- the radial direction E can be understood as the direction from the center of the liquid cooling outlet 111 to a certain position on the circumferential side.
- At least a portion of the liquid cooling module 100 on the side of the liquid cooling inlet 112 and at least a portion of the pump base 210 on the side of the pump outlet 212 are continuously fused together along the circumference of the liquid cooling inlet 112 to form an integrated sealing structure.
- the integrated sealing structure on the side of the liquid cooling inlet 112 is continuously fused together along the circumference of the liquid cooling inlet 112.
- the pump 200 also includes a piezoelectric component 220, which is fixed to the pump base 210.
- the pump base 210 includes a pump bottom wall 213.
- the pump bottom wall 213, the piezoelectric component 220, and a portion of the pump base 210 therebetween form a pump cavity 214.
- the pump inlet 211 and the pump outlet 212 are disposed on the pump bottom wall 213 and are connected to the pump cavity 214.
- the pump bottom wall 213 and a portion of the liquid cooling module 100 on the side surrounding the liquid cooling outlet 111 and the side surrounding the liquid cooling inlet 112 form an integrated sealing structure.
- the piezoelectric component 220 utilizes the inverse piezoelectric effect of piezoelectric materials.
- Piezoelectric materials refer to crystalline materials that will produce voltage between the two end faces when subjected to pressure.
- the inverse piezoelectric effect refers to the mechanical deformation or mechanical pressure of the piezoelectric component 220 in a certain direction after an electric field is applied to the piezoelectric component 220. When the external electric field is removed, these deformations or stresses also disappear.
- the piezoelectric component 220 used in the pump 200 has the characteristics of small size, high energy density and no electromagnetic interference, and can realize the precise delivery and control of the cooling medium.
- the piezoelectric component 220 includes piezoelectric ceramics, a metal substrate and a plastic partition (to prevent the metal substrate from being corroded by the liquid working medium).
- connection relationship between the pump inlet 211 and the pump cavity 214 is similar to the connection relationship between the liquid cooling outlet 111 and the pump inlet 211, that is, the pump inlet 211 and the pump cavity 214 are not always connected, but under the drive of the piezoelectric component 220, the cooling medium enters the pump cavity 214 through the liquid cooling outlet 111 and the pump inlet 211.
- the connection relationship between the pump outlet 212 and the pump cavity 214 is similar.
- the pump inlet 211 and the pump outlet 212 are both arranged on the pump bottom wall 213, and the part of the pump bottom wall 213 and the part of the liquid cooling module 100 located on the periphery of the pump inlet 211 and the pump outlet 212 are an integrated sealing structure, that is, there is no need to add an additional base to the pump 200. If a base is provided in the pump 200, on the one hand, the base can only be fixed to the liquid cooling module 100 by screws, which has a poor sealing effect and is prone to leakage of the cooling medium. On the other hand, it is usually necessary to provide the pump liquid inlet 211 and the pump liquid outlet 212 on the outside of the base, which lengthens the flow path of the cooling medium and reduces the heat dissipation efficiency of the cooling medium.
- the liquid cooling module 10 includes two pumps 200 connected in parallel.
- the two pumps 200 connected in parallel can achieve a larger flow rate.
- the liquid cooling module 10 includes two pumps 200 connected in series.
- the two pumps 200 connected in series can achieve a larger driving pressure.
- the liquid cooling module 10 may include multiple pumps 200, and the multiple pumps 200 may be distributed in different positions in the liquid cooling module 10, which can be specifically set according to needs.
- the pump 200 further includes a liquid inlet valve membrane 230 and a liquid outlet valve membrane 240 fixed to the pump bottom wall 213.
- the liquid inlet valve membrane 230 is used to close or open the pump liquid inlet 211
- the liquid outlet valve membrane 240 is used to close or open the pump liquid outlet 212.
- the piezoelectric component 220 is used to deform after receiving an electrical signal, and the volume of the pump cavity 214 increases, driving the liquid inlet valve membrane 230 to open and the liquid outlet valve membrane 240 to close, providing power for the cooling medium in the liquid cooling module 100, so that the cooling medium enters the pump cavity 214 from the liquid cooling outlet 111 and the pump liquid inlet 211 in turn.
- the piezoelectric component 220 is used to generate deformation after receiving the electrical signal, and the volume of the pump chamber 214 becomes smaller, driving the liquid inlet valve membrane 230 to close and the liquid outlet valve membrane 240 to open, providing power for the cooling medium in the liquid cooling module 100, so that the cooling medium enters the liquid cooling module 100 from the pump outlet 212 and the liquid cooling inlet 112 in turn.
- the inlet valve membrane 230 is located along the thickness direction A on the side of the pump inlet 211 away from the liquid cooling outlet 111, and the outlet valve membrane 240 is located along the thickness direction A between the pump outlet 212 and the liquid cooling inlet 112.
- the inlet valve membrane 230 is located along the thickness direction A between the pump inlet 211 and the pump chamber 214, and the outlet valve membrane 240 is located along the thickness direction A on the side of the liquid cooling inlet 112 away from the pump outlet 212.
- the liquid cooling module 10 in the embodiment of the present application can not only cool the components of the electronic device, but also optimize the performance of the pump 200 contained in the liquid cooling module 10 itself.
- the pump base 210 also includes a pump side wall 215 located between the pump bottom wall 213 and the piezoelectric component 220, and the pump side wall 215 is an integrated sealing structure.
- the pump side wall 215 extends along the thickness direction A of the liquid cooling module 10. Since the pump side wall 215, the pump bottom wall 213, and the piezoelectric component 220 together enclose the pump cavity 214, the present solution sets the pump side wall 215 as an integrated sealing structure, which can effectively prevent the cooling medium from leaking from the pump side wall 215 and improve the sealing performance of the pump base 210.
- the pump side wall 215 forms an integrated sealing structure by hot pressing. Hot pressing can be a welding method without solder paste or other third materials such as hot pressing bonding sealing welding, hot melt welding, ultrasonic welding, and ultra-high frequency welding.
- FIG 7 is an exploded view of the pump stacking structure provided in the first embodiment of the present application.
- the layers of the pump base body are sealed and welded by thermocompression bonding, hot melt welding, ultrasonic welding, ultra-frequency welding, etc. without solder paste or other third materials.
- the pump base 210 includes a pump chamber layer 216, a first flow channel layer 217, a valve sheet layer 218 and a second flow channel layer 219 which are stacked along a thickness direction A, a cavity hole 2161 is provided in the pump chamber layer 216, a pump outlet 212 and a first guide channel 2171 corresponding to the pump inlet 211 are provided in the first flow channel layer 217, the first flow channel layer 217 is communicated with the cavity hole 2161 in the pump chamber layer 216, an openable and closable inlet valve membrane 230 and an outlet valve membrane 240 are provided in the valve sheet layer 218, a pump inlet 211 and a second guide channel 2191 corresponding to the pump outlet 212 are provided in the second flow channel layer 219, the second flow channel layer 219 is communicated with the liquid cooling module 100, and the pump chamber layer 216, the first flow channel layer 217, the valve sheet layer 218 and the second flow channel layer 219 are formed into an integrated sealing structure by hot pressing.
- the pump inlet 211, the inlet valve membrane 230 and the first guide channel 2171 are correspondingly arranged in the thickness direction A of the liquid cooling module 10
- the pump outlet 212, the outlet valve membrane 240 and the second guide channel 2191 are correspondingly arranged in the thickness direction A of the liquid cooling module 10.
- the cooling medium enters the pump cavity 214 from the pump inlet 211 through the inlet valve membrane 230 and the first guide channel 2171 in sequence, and when the outlet valve membrane 240 is opened and the inlet valve membrane 230 is closed, the cooling medium enters the liquid cooling module 100 from the pump outlet 212 through the outlet valve membrane 240 and the second guide channel 2191 in sequence.
- the projection area of the area surrounded by the peripheral wall of the first guide channel 2171 along the thickness direction A is larger than the projection area of the area surrounded by the peripheral wall of the pump inlet 211 along the thickness direction A, which is conducive to preventing the cooling medium from flowing back to the pump inlet 211, and exerting the guiding effect of the first guide channel 2171 on the cooling medium.
- the projection area of the area surrounded by the peripheral wall of the second guide channel 2191 along the thickness direction A is larger than the projection area of the area surrounded by the peripheral wall of the pump outlet 212 along the thickness direction A, which is conducive to preventing the cooling medium from flowing back to the pump 200 inlet and outlet, and exerting the guiding effect of the second guide channel 2191 on the cooling medium.
- the edges of the pump chamber layer 216, the first flow channel layer 217, the valve sheet layer 218 and the second flow channel layer 219 are hot pressed to form the pump side wall 215 (as shown in combination with Figures 2 and 7), so that each layer is sealed, thereby improving the sealing effect of the pump base 210.
- the liquid cooling module 100 includes a first flexible membrane 110, a liquid cooling outlet 111 and a liquid cooling inlet 112 are arranged on the first flexible membrane 110, and the pump bottom wall 213 and a portion of the first flexible membrane 110 around the liquid cooling outlet 111 and the liquid cooling inlet 112 are an integrated sealing structure.
- the fixed connection between the liquid cooling module 100 and the pump 200 is actually the fixed connection between the first flexible membrane 110 and the pump bottom wall 213.
- the first flexible membrane 110 which is located around the liquid cooling outlet 111 and the liquid cooling inlet 112, forms an integrated sealing structure with the pump bottom wall 213. Since the first flexible membrane 110 and the pump bottom wall 213 are made of the same or similar materials, the difficulty of hot pressing is relatively small, which is conducive to forming an integrated sealing structure.
- the first flexible membrane 110 is an integrated sealing structure with the pump bottom wall 213 except for the liquid cooling outlet 111 and the liquid cooling inlet 112, and there is no interface between the two.
- This sealing interface is a preferred sealing interface with stronger flexibility, sealing and impact resistance.
- it is difficult to achieve perfect processing in engineering, and it is more of a partially continuous fusion interface, and there is a micro air gap or a non-welding area of discontinuous contact between the interfaces.
- adhesive sealing may be used at the connection position between the pump 200 and the liquid cooling module 100 to improve the sealing performance and reliability.
- the liquid cooling module 100 further includes a second flexible film 120 and a first rigid substrate 130 located between the first flexible film 110 and the second flexible film 120.
- the first flexible film 110, the second flexible film 120 and the first rigid substrate 130 enclose an inner cavity 140 of the liquid cooling module 100.
- the two ends of the first rigid substrate 130 are respectively integrated with the first flexible film 110 and the second flexible film 120 to form a sealing structure.
- the two interface materials of the sealing welding between the first rigid substrate 130 and the first flexible film 110 and the second flexible film 120 are the same or similar.
- the welding method without solder paste or other third materials such as thermal compression bonding sealing welding, hot melt welding, ultrasonic welding, and ultra-frequency welding can improve the sealing and reliability between the first rigid substrate 130 and the first flexible film 110 and the second flexible film 120.
- the first flexible film 110 and the second flexible film 120 are flexible and have good bending performance, and are suitable for the case where the liquid cooling module 100 needs to be bent.
- a first rigid substrate 130 is arranged between the first flexible film 110 and the second flexible film 120, and the two ends of the first rigid substrate 130 are used to support the first flexible film 110 and the second flexible film 120, which is conducive to improving the overall strength of the liquid cooling module 100 in the thickness direction A.
- the cooling medium flows in the inner cavity 140 surrounded by the first flexible film 110, the second flexible film 120 and the first rigid substrate 130.
- the two ends of the first rigid substrate 130 are respectively integrated with the first flexible film 110 and the second flexible film 120 to form a sealing structure, which can improve the sealing of the inner cavity 140 and prevent the cooling medium in the inner cavity 140 from leaking.
- the two ends of the first rigid substrate 130 are respectively formed as discontinuous interfaces with the first flexible film 110 and the second flexible film 120.
- the two ends of the first rigid substrate 130 and at least part of the first flexible film 110 and the second flexible film 120 are continuously fused into one body to form an integrated sealing structure.
- the two ends of the first rigid substrate 130 and the first flexible film 110 and the second flexible film 120 are all continuously fused into an integrated sealing structure, and there is no interface between the two ends of the first rigid substrate 130 and the first flexible film 110, and there is no interface between the two ends of the first rigid substrate 130 and the second flexible film 120.
- the first rigid substrate 130 is disposed around the edges of the first flexible membrane 110 and the second flexible membrane 120 (as shown in FIG. 1a ). This solution is conducive to improving the strength of the edge of the liquid cooling module 100 in the thickness direction A, and the integrated sealing structure can effectively prevent the cooling medium from leaking at the edge of the liquid cooling module 100.
- the thickness of the first flexible film 110 and the second flexible film 120 is less than the length and width of the liquid cooling module 10. Specifically, the ratio of the thickness of the first flexible film 110 and the second flexible film 120 to the length of the liquid cooling module 10 is less than or equal to 0.2, and the ratio of the thickness of the first flexible film 110 and the second flexible film 120 to the width of the liquid cooling module 10 is less than or equal to 0.2.
- this solution can ensure the flexibility of the first flexible film 110 and the second flexible film 120 in the bending direction, reducing the difficulty of bending the device.
- the material of the first flexible film 110 and the second flexible film 120 is a material with an elongation at break higher than 10%, such as polymer PET, PP, PPS, PEN or modified film materials thereof, so as to adapt to system pressure fluctuations and bending.
- the material of the first flexible film 110 and the second flexible film 120 is a material with an elongation at break higher than 50%.
- the surface of the first flexible film 110 and the second flexible film 120 is treated with an anti-evaporation coating, such as coating a flexible inorganic oxide film on the surface of the polymer film to isolate water vapor.
- the specific coating method can be physical vapor deposition (PVD), chemical vapor deposition (CVD), atomic layer deposition (ALD) and other process means.
- the liquid cooling module 100 also includes a second rigid substrate 150.
- the second rigid substrate 150 divides the inner cavity 140 of the liquid cooling module 100 into a liquid inlet channel 142 and a liquid outlet channel 141.
- the liquid cooling inlet 112 is connected to the liquid inlet channel 142
- the liquid cooling outlet 111 is connected to the liquid outlet channel 141.
- the two ends of the second rigid substrate 150 are respectively integrated with the first flexible membrane 110 and the second flexible membrane 120 to form an integrated sealing structure. If the division and sealing between the second rigid substrate 150 and the first flexible membrane 110 and the second flexible membrane 120 leak, the performance of the liquid cooling system will be greatly reduced and gradually fail.
- the two ends of the second rigid substrate 150 are respectively integrated with the first flexible membrane 110 and the second flexible membrane 120 to improve the sealing performance and reliability.
- the second rigid substrate 150 is used to separate the flow channel of the inner cavity 140 into an inlet channel 142 and an outlet channel 141, and the inlet channel 142 and the outlet channel 141 are formed by the second rigid substrate 150, the first rigid substrate 130, the first flexible membrane 110 and the second flexible membrane 120.
- the inlet channel 142 is connected to the liquid cooling inlet 112
- the outlet channel 141 is connected to the liquid cooling outlet 111.
- the inlet channel 142 and the outlet channel 141 are separated by the second rigid substrate 150, which is conducive to preventing the cooling medium in the inlet channel 142 and the outlet channel 141 from mixing and thus reducing the cooling efficiency.
- Both ends of the second rigid substrate 150 are integrally heat-pressed and sealed with the first flexible membrane 110 and the second flexible membrane 120 , which is beneficial to improving the isolation effect between the liquid inlet channel 142 and the liquid outlet channel 141 and can further improve the structural strength of the liquid cooling module 100 .
- the liquid inlet channel 142 and the liquid outlet channel 141 are not two completely isolated parts.
- the second rigid base 150 only separates the liquid inlet channel 142 and the liquid outlet channel 141 adjacent to the pump 200.
- the liquid inlet channel 142 and the liquid outlet channel 141 are connected in an area away from the pump 200.
- the liquid inlet channel 142 and the liquid outlet channel 141 are connected in a relatively narrow end area.
- the two ends of the second rigid substrate 150 are respectively formed as discontinuous interfaces with the first flexible film 110 and the second flexible film 120.
- the two ends of the second rigid substrate 150 and at least part of the first flexible film 110 and the second flexible film 120 are continuously fused into one body to form an integrated sealing structure.
- the two ends of the second rigid substrate 150 and the first flexible film 110 and the second flexible film 120 are all continuously fused into an integrated sealing structure, and there is no interface between the two ends of the second rigid substrate 150 and the first flexible film 110, and there is no interface between the two ends of the second rigid substrate 150 and the second flexible film 120.
- FIG. 10 is a side view of the pump 200 and the second rigid substrate 150 provided in the first embodiment of the present application.
- the second rigid substrate 150 includes a first sub-rigid substrate 151 located below the pump 200 and a second sub-rigid substrate 152 located outside the pump 200 (as shown in FIG. 10).
- the orthographic projection of the first sub-rigid substrate 151 on the second flexible film 120 does not overlap with the orthographic projection of the area enclosed by the edges of the liquid-cooling inlet 112 and the liquid-cooling outlet 111 on the second flexible film 120 (as shown in FIG. 2).
- the bottom of the pump 200 refers to the side of the pump 200 close to the liquid-cooling module 100 along the thickness direction A.
- the orthographic projection of the first sub-rigid substrate 151 on the second flexible film 120 does not overlap with the orthographic projection of the area enclosed by the edges of the pump inlet 211 and the pump outlet 212 on the second flexible film 120.
- the first sub-rigid matrix 151 can be extended to a point outside the pump 200, as shown in FIG. 1a, and the length of the first sub-rigid matrix 151 along the left-right direction in FIG. 1a is greater than the length of the pump 200 along the left-right direction.
- the first sub-rigid substrate 151 is made of the same material as the first rigid substrate 130 (as shown in FIG. 1a and FIG. 1b ).
- a sub-rigid substrate 151 is located below the pump 200. When the cooling liquid pumped out by the pump 200 enters and exits the liquid cooling inlet 112 and the liquid cooling outlet 111 during operation, it will exert impact pressure on the first sub-rigid substrate 151, which will cause the system performance to drop rapidly and fail rapidly.
- the first sub-rigid substrate 151 is made of the same material as the first rigid substrate 130, so that the sealing effect and structural strength between the first sub-rigid substrate 151 and the first flexible membrane 110 and the second flexible membrane 120 are the same as the sealing effect and structural strength between the first rigid substrate 130 and the first flexible membrane 110 and the second flexible membrane 120, effectively improving the sealing effect and structural strength between the first sub-rigid substrate 151 and the first flexible membrane 110 and the second flexible membrane 120, and preventing the liquid near the pump 200 from impacting the first sub-rigid substrate 151 and affecting the sealing effect.
- the first sub-rigid substrate 151 and the first rigid substrate 130 are an integrated structure, as shown in FIG1a , which improves the sealing and reliability between the first sub-rigid substrate 151 and the first rigid substrate 130.
- the first sub-rigid substrate 151 and the second sub-rigid substrate 152 are an integrated structure, which improves the sealing and reliability between the first sub-rigid substrate 151 and the second sub-rigid substrate 152.
- first rigid sub-base 151 and the first rigid base 130 are simultaneously heat-pressed welded with the first flexible film 110 or the second flexible film 120 to improve the sealing effect and structural strength between the first rigid sub-base 151 and the first flexible film 110 or the second flexible film 120 .
- the second rigid substrate 150 is in a strip shape as a whole. This solution can reduce the processing cost, and the relatively regular shape of the second rigid substrate 150 is conducive to reducing the flow resistance of the second rigid substrate 150 to the cooling medium.
- an integrated sealing structure is formed between the first flexible membrane 110 and the pump bottom wall 213 which are arranged corresponding to the second rigid substrate 150 in the thickness direction A. This solution can further ensure that the cooling medium in the liquid inlet channel 142 and the liquid outlet channel 141 does not short-circuit or mix.
- the liquid cooling module 100 further includes a third rigid substrate 160, which is distributed in the liquid inlet channel 142 and the liquid outlet channel 141.
- the two ends of the third rigid substrate 160 are respectively integrated with the first flexible membrane 110 and the second flexible membrane 120 to form a sealed structure. If leakage occurs in the segmentation and sealing between the third rigid substrate 160 and the first flexible membrane 110 and the second flexible membrane 120, the performance of the liquid cooling system will be slightly reduced, but it will not cause the entire liquid cooling system to fail.
- the plurality of third rigid substrates 160 divide the liquid inlet channel 142 into a plurality of liquid inlet sub-channels connected to each other, and divide the liquid outlet channel 141 into a plurality of liquid outlet sub-channels connected to each other.
- the third rigid substrate 160 plays a role of guiding flow in the liquid inlet channel 142 and the liquid outlet channel 141, respectively, reducing flow resistance and avoiding eddy current loss, which is conducive to enhancing the heat exchange effect of the cooling medium.
- the third rigid substrate 160 can be strip-shaped or cylindrical in shape. The strip-shaped third rigid substrate 160 is conducive to guiding the flow of the cooling medium, and the cylindrical third rigid substrate 160 is conducive to enhancing the mixing of the cooling medium.
- the third rigid substrate 160 plays the role of both guiding and mixing flow, the third rigid substrate 160 can be set in the area where the width of the liquid inlet channel 142 or the liquid outlet channel 141 suddenly changes, the area where the cooling medium flow direction suddenly changes, and the area adjacent to the liquid cooling inlet 112.
- the two ends of the third rigid substrate 160 are respectively formed as discontinuous interfaces with the first flexible film 110 and the second flexible film 120.
- the two ends of the third rigid substrate 160 and at least part of the first flexible film 110 and the second flexible film 120 are continuously fused into one body to form an integrated sealing structure.
- the two ends of the third rigid substrate 160 and the first flexible film 110 and the second flexible film 120 are all continuously fused into an integrated sealing structure, and there is no interface between the two ends of the third rigid substrate 160 and the first flexible film 110, and there is no interface between the two ends of the second rigid substrate 150 and the second flexible film 120.
- the thickness of the first rigid substrate 130, the second rigid substrate 150 and the third rigid substrate 160 is less than the width of the liquid cooling module 10. Specifically, the ratio of the thickness of the first rigid substrate 130, the second rigid substrate 150 and the third rigid substrate 160 to the width of the liquid cooling module 10 is greater than or equal to 0.1 and less than or equal to 0.2. The thickness of the first rigid substrate 130, the second rigid substrate 150 and the third rigid substrate 160 is less than the length of the liquid cooling module 10. Specifically, the ratio of the thickness of the first rigid substrate 130, the second rigid substrate 150 and the third rigid substrate 160 to the length of the liquid cooling module 10 is greater than or equal to 10-5 and less than or equal to 0.2. This solution is conducive to ensuring the high strength of the liquid cooling module 10 in the thickness direction and the flexibility of the liquid cooling module 10 in the length direction and the width direction.
- the sum of the cross-sectional areas of the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 is smaller than the area of the first flexible film 110 or the second flexible film 120.
- the area of the first flexible film 110 refers to the area of the surface facing the rigid substrate
- the area of the second flexible film 120 refers to the area of the surface facing the rigid substrate.
- the width of the first rigid substrate 130 is greater than or equal to 1 mm and less than or equal to 10 mm.
- the width direction of the first rigid substrate 130 intersects with the thickness direction A and the extension direction of the first rigid substrate 130 .
- the width of the second rigid substrate 150 is greater than or equal to 1 mm and less than or equal to 10 mm.
- the width direction of the second rigid substrate 150 intersects with the thickness direction A and the extension direction of the second rigid substrate 150 .
- the width of the third rigid substrate 160 is greater than or equal to 1 mm and less than or equal to 10 mm.
- the width direction of the third rigid substrate 160 intersects with the thickness direction A and the extension direction of the third rigid substrate 160 .
- the thickness of the first flexible film 110 is greater than or equal to 5 ⁇ m and less than or equal to 500 ⁇ m.
- the thickness of the first flexible film 110 is 40 ⁇ m.
- the thickness of the second flexible film 120 is greater than or equal to 5 ⁇ m and less than or equal to 500 ⁇ m.
- the thickness of the second flexible film 120 is 40 ⁇ m.
- the thickness of the first rigid substrate 130, the second rigid substrate 150 and the third rigid substrate 160 is greater than or equal to 0.1 mm and less than or equal to 1 mm.
- the thickness of the first rigid substrate 130, the second rigid substrate 150 and the third rigid substrate 160 is 0.12 mm.
- FIG. 11 is a cross-sectional view of a liquid cooling module 100 provided in the first embodiment of the present application.
- the thicknesses of the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 are not equal.
- the thickness refers to the dimension in the thickness direction A.
- the three rigid substrates are designed with unequal thicknesses.
- FIG. 12 is a cross-sectional view of the liquid cooling module 100 provided in the first embodiment of the present application.
- the first flexible film 110 or the second flexible film 120 may also be provided with a liquid injection port 113 and an air extraction port 114, etc.
- the liquid injection port 113 and the air extraction port 114 are integrated with at least one of the three rigid substrates and the first flexible film 110 or the second flexible film 120 to form an integrated sealing structure.
- the liquid injection port 113 is used to inject cooling medium into the inner cavity 140 before cooling
- the air extraction port 114 is used to extract the gas in the inner cavity 140 to avoid negative effects on the heat dissipation effect.
- the liquid injection port 113 and the air extraction port 114 are integrally sealed and connected with at least one of the first rigid substrate 130, the second rigid substrate 150 and the third rigid substrate 160, the first flexible film 110 or the second flexible film 120, which is conducive to avoiding leakage of cooling medium in the liquid injection port 113 and the air extraction port 114.
- the liquid injection port 113, the air extraction port 114 and the liquid cooling module 100 are in the same plane, that is, between the first flexible film 110 and the second flexible film 120.
- the liquid injection port 113, the air extraction port 114 and the liquid cooling module 100 can be assisted with glue to enhance the structural positioning and strength, but it is not a sealed welding surface.
- the difference between the glass transition temperature of the material of the pump bottom wall 213 and the glass transition temperature of the material of the first flexible film 110 is less than or equal to 20°C; if they are the same material, the difference is zero.
- the glass transition temperature refers to the temperature corresponding to the transition from a glassy state to a highly elastic state. A high glass transition temperature indicates that the material has good heat resistance.
- the difference between the glass transition temperatures of the material of the pump bottom wall 213 and the material of the first flexible film 110 is set to be small, which is conducive to sealing the pump bottom wall 213 and the first flexible film 110 into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.
- the difference between the glass transition temperature of the material of the first rigid substrate 130 and the glass transition temperature of the material of the first flexible film 110 or the second flexible film 120 is less than or equal to 20° C. Setting the difference between the glass transition temperatures of the material of the first rigid substrate 130 and the material of the first flexible film 110 or the second flexible film 120 to be relatively small is conducive to sealing the first rigid substrate 130 and the first flexible film 110 or the second flexible film 120 into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.
- the difference between the glass transition temperature of the material of the second rigid substrate 150 and the glass transition temperature of the material of the first flexible film 110 or the second flexible film 120 is less than or equal to 20° C. Setting the difference between the glass transition temperature of the material of the second rigid substrate 150 and the material of the first flexible film 110 or the second flexible film 120 to be relatively small is conducive to sealing the second rigid substrate 150 and the first flexible film 110 or the second flexible film 120 into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.
- the difference between the glass transition temperature of the material of the third rigid substrate 160 and the glass transition temperature of the material of the first flexible film 110 or the second flexible film 120 is less than or equal to 20° C. Setting the difference between the glass transition temperatures of the material of the third rigid substrate 160 and the material of the first flexible film 110 or the second flexible film 120 to be relatively small is conducive to sealing the third rigid substrate 160 and the first flexible film 110 or the second flexible film 120 into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.
- the difference between the glass transition temperature of the material of the pump base 210 and the glass transition temperature of the material of the liquid cooling module 100 is less than or equal to 20° C.; if they are made of the same material, the difference is zero.
- the glass transition temperature of the material of the pump bottom wall 213 is greater than or equal to 69° C. and less than or equal to 243° C.
- the glass transition temperature of the material of the first flexible film 110 is greater than or equal to 69° C. and less than or equal to 243° C.
- the glass transition temperature of the material of the second flexible film 120 is greater than or equal to 69° C. and less than or equal to 243° C.
- the glass transition temperature of the material of the first rigid substrate 130 is greater than or equal to 69° C. and less than or equal to 243° C.
- the glass transition temperature of the material of the second rigid substrate 150 is greater than or equal to 69° C. and less than or equal to 243° C.
- the glass transition temperature of the material of the third rigid substrate 160 is greater than or equal to 69° C. and less than or equal to At 243°C.
- the glass transition temperatures of the materials of the pump bottom wall 213, the first flexible membrane 110, the second flexible membrane 120, the first rigid substrate 130, the second rigid substrate 150 and the third rigid substrate 160 overlap in value ranges, in actual situations, it is not necessary for the glass transition temperatures of the materials of the pump bottom wall 213, the first flexible membrane 110, the second flexible membrane 120, the first rigid substrate 130, the second rigid substrate 150 and the third rigid substrate 160 to be completely equal, and it is only necessary to satisfy the condition that the difference is less than or equal to 20°C.
- the difference between the melting temperature of the material of the pump bottom wall 213 and the melting temperature of the material of the first flexible film 110 is less than or equal to 20° C. In this embodiment, the difference between the melting temperatures of the material of the pump bottom wall 213 and the material of the first flexible film 110 is set to be small, which is conducive to sealing the pump bottom wall 213 and the first flexible film 110 into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.
- the difference between the melting temperature of the material of the first rigid substrate 130 and the melting temperature of the material of the first flexible film 110 or the second flexible film 120 is less than or equal to 20° C. Setting the difference between the melting temperatures of the material of the first rigid substrate 130 and the material of the first flexible film 110 or the second flexible film 120 to be relatively small is conducive to sealing the first rigid substrate 130 and the first flexible film 110 or the second flexible film 120 into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.
- the difference between the melting temperature of the material of the second rigid substrate 150 and the melting temperature of the material of the first flexible film 110 or the second flexible film 120 is less than or equal to 20° C. Setting the difference between the melting temperatures of the material of the second rigid substrate 150 and the material of the first flexible film 110 or the second flexible film 120 to be relatively small is conducive to sealing the second rigid substrate 150 and the first flexible film 110 or the second flexible film 120 into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.
- the difference between the melting temperature of the material of the third rigid substrate 160 and the melting temperature of the material of the first flexible film 110 or the second flexible film 120 is less than or equal to 20° C. Setting the difference between the melting temperatures of the material of the third rigid substrate 160 and the material of the first flexible film 110 or the second flexible film 120 to be relatively small is conducive to sealing the third rigid substrate 160 and the first flexible film 110 or the second flexible film 120 into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.
- the melting temperature of the material of the pump bottom wall 213 is greater than or equal to 195° C. and less than or equal to 343° C.
- the melting temperature of the material of the first flexible film 110 is greater than or equal to 195° C. and less than or equal to 343° C.
- the melting temperature of the material of the second flexible film 120 is greater than or equal to 195° C. and less than or equal to 343° C.
- the melting temperature of the material of the first rigid substrate 130 is greater than or equal to 195° C. and less than or equal to 343° C.
- the melting temperature of the material of the second rigid substrate 150 is greater than or equal to 195° C. and less than or equal to 343° C.
- the melting temperature of the material of the third rigid substrate 160 is greater than or equal to 195° C. and less than or equal to 343° C.
- the difference between the melting temperature of the material of the pump base 210 and the melting temperature of the material of the first flexible film 110 is less than or equal to 20°C.
- the melting temperatures of the materials of the above-mentioned pump bottom wall 213, the first flexible membrane 110, the second flexible membrane 120, the first rigid matrix 130, the second rigid matrix 150 and the third rigid matrix 160 overlap in value ranges, in actual situations, it is not necessary for the melting temperatures of the materials of the pump bottom wall 213, the first flexible membrane 110, the second flexible membrane 120, the first rigid matrix 130, the second rigid matrix 150 and the third rigid matrix 160 to be completely equal, and it is only necessary to meet the condition that the difference is less than or equal to 20°C.
- the pump base 210 and the pump bottom wall 213 are made of a flexible, heat-resistant polymer material with a breaking elongation greater than 10%. In one embodiment, the pump base 210 and the pump bottom wall 213 are made of a flexible, heat-resistant polymer material with a breaking elongation greater than 50%.
- the material of the pump base 210 and the pump bottom wall 213 is independently selected from at least one of polyethylene terephthalate copolymer, polyethylene naphthalate, polyethylene 2,5-furandicarboxylate, polyimide, polyetheretherketone, and biaxially stretched polypropylene.
- the materials of the first flexible film 110, the second flexible film 120, the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 are each independently selected from a flexible heat-resistant polymer material having a breaking elongation greater than 10%. In one embodiment, the materials of the first flexible film 110, the second flexible film 120, the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 are each independently selected from a flexible heat-resistant polymer material having a breaking elongation greater than 50%.
- the material of the first flexible film 110 is at least one selected from the group consisting of polyethylene terephthalate copolymer, polyethylene naphthalate, polyethylene 2,5-furandicarboxylate, polyimide, polyetheretherketone, and biaxially stretched polypropylene.
- the material of the first rigid substrate 130 is selected from at least one of polyethylene terephthalate copolymer, polyethylene naphthalate, polyethylene 2,5-furandicarboxylate, polyimide, polyetheretherketone, and biaxially stretched polypropylene.
- the material of the second flexible film 120 is at least one selected from the group consisting of polyethylene terephthalate copolymer, polyethylene naphthalate, polyethylene 2,5-furandicarboxylate, polyimide, polyetheretherketone, and biaxially stretched polypropylene.
- the material of the second rigid substrate 150 is at least one selected from polyethylene terephthalate copolymer, polyethylene naphthalate, polyethylene 2,5-furandicarboxylate, polyimide, polyetheretherketone, and biaxially stretched polypropylene.
- the material of the third rigid substrate 160 is selected from at least one of polyethylene terephthalate copolymer, polyethylene naphthalate, polyethylene 2,5-furandicarboxylate, polyimide, polyetheretherketone, and biaxially stretched polypropylene.
- polyethylene terephthalate copolymer polyethylene naphthalate, polyethylene 2,5-furandicarboxylate, polyimide and polyetheretherketone all contain rigid segments and have high glass transition temperatures.
- the material selected for the pump bottom wall 213 and the first flexible film 110 is conducive to the hot pressing of the pump bottom wall 213 and the first flexible film 110 to form an integrated sealing structure.
- the material selected for the first rigid substrate 130 and the first flexible film 110 or the second flexible film 120 is conducive to the hot pressing of the first rigid substrate 130 and the first flexible film 110 or the second flexible film 120 to form an integrated sealing structure.
- the material selected for the second rigid substrate 150 and the first flexible film 110 or the second flexible film 120 is conducive to the hot pressing of the second rigid substrate 150 and the first flexible film 110 or the second flexible film 120 to form an integrated sealing structure.
- the material selected for the third rigid substrate 160 and the first flexible film 110 or the second flexible film 120 is conducive to the hot pressing of the third rigid substrate 160 and the first flexible film 110 or the second flexible film 120 to form an integrated sealing structure.
- Hot pressing is a sealing welding method without solder paste or other third materials, such as hot pressing bonding sealing welding of polymer film materials, hot melt welding, ultrasonic welding, and ultra-frequency welding.
- the use of the above-mentioned materials for the first flexible film 110 and the second flexible film 120 is beneficial to improving the elongation at break, facilitating the release of stress of the electronic device when it is bent, and absorbing volume changes such as pressure fluctuations of the liquid cooling system and thermal expansion and contraction.
- the pump bottom wall 213 is made of the same material as the first flexible membrane 110.
- the first rigid base 130 is made of the same material as the first flexible membrane 110 or the second flexible membrane 120.
- the second rigid base 150 is made of the same material as the first flexible membrane 110 or the second flexible membrane 120.
- the third rigid base 160 is made of the same material as the first flexible membrane 110 or the second flexible membrane 120.
- the material of the pump base 210 is the same as the material of the liquid cooling module 100.
- Traditional liquid cooling modules are formed by flow channels of membrane materials such as polymer PET, PP, and PPS. Small molecules such as water will penetrate the membrane made of polymer materials, and this amount increases exponentially with evaporation and temperature.
- the material of the first flexible film 110 and the second flexible film 120 is selected from at least one of polyethylene terephthalate copolymer, polyethylene naphthalate, polyethylene 2,5-furandicarboxylate, polyimide, polyetheretherketone, and biaxially oriented polypropylene. Since the water vapor permeability of the above materials is low, the use of the above materials for the first flexible film 110 and the second flexible film 120 is also conducive to alleviating the evaporation problem of the cooling medium in the first flexible film 110 and the second flexible film 120.
- the first flexible film 110 and the second flexible film 120 use conventional PET materials, since the PET material has an extremely high polar ester group and has a strong absorption effect on water molecules, when the cooling medium flows in the inner cavity 140 of the liquid cooling module 100, it may evaporate and pass through the first flexible film 110 and the second flexible film 120, resulting in a reduction in the utilization rate of the cooling medium. In the process of the cooling medium evaporating outward, the small molecules of gas in the air will be replaced by the first flexible film 110 and the second flexible film 120 and dissolved in the cooling medium. When dissolved to saturation, air will exist in the circulation of the cooling medium in the form of bubbles.
- the first flexible film 110 and the second flexible film 120 are set to the above materials, which is conducive to avoiding a series of hazards caused by the evaporation of the cooling medium.
- the evaporation level of the first flexible membrane 110 and the second flexible membrane 120 is reduced by more than one order of magnitude, so as to meet the evaporation requirements of different working fluids such as water and fluorinated liquid at different application temperatures.
- the first flexible film 110, the second flexible film 120 and the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 can be made of the same material.
- the flexible film and the rigid substrate have different requirements for flexibility. At this time, different flexibility can be achieved by adjusting the thickness of the flexible film and the rigid substrate.
- the glass transition temperature of polyethylene terephthalate copolymer is greater than or equal to 69°C and less than or equal to 77°C, and the melting temperature is greater than or equal to 250°C and less than or equal to 255°C.
- the glass transition temperature of polyethylene naphthalate is 122.4°C and the melting temperature is 211.6°C.
- the glass transition temperature of polyethylene 2,5-furandicarboxylate is 87.2°C, and the melting temperature is greater than or equal to 195°C and less than or equal to 265°C.
- the glass transition temperature of polyimide is 243°C and the melting temperature is 334°C.
- the glass transition temperature of polyetheretherketone is greater than or equal to 143°C and less than or equal to 150°C, and the melting temperature is 343°C. It should be noted that the glass transition temperature and melting temperature mentioned above are experimental values, which are affected by various factors such as experimental conditions, instruments and equipment, and experimental operations. When the above influencing factors change, the glass transition temperature and melting temperature of the above materials may also change accordingly.
- the present application does not make an absolute limitation on the specific values of the glass transition temperature and melting temperature of the pump bottom wall 213, the pump base 210, the first flexible film 110, the second flexible film 120, the first rigid base 130, the second rigid base 150 and the third rigid base 160.
- the monomers of the polyethylene terephthalate copolymer include terephthalic acid, ethylene glycol and a hard segment molecular structure, and the mass percentage of the hard segment molecular structure in the polyethylene terephthalate copolymer is greater than or equal to 20% and less than or equal to 80%.
- polyethylene terephthalate copolymer refers to a copolymer formed by the block copolymerization of PET (polyethylene terephthalate) monomer and another monomer, wherein PET is polymerized from terephthalic acid and ethylene glycol. Due to the presence of -CH2-CH2- molecular chain segments in the structure of PET, the glass transition temperature of PET itself is relatively low, and it is easy to undergo glass transition in medium and high temperature application environments, which poses a risk of dimensional stability. This solution introduces a hard segment molecular structure into the structure of PET, which can increase the glass transition temperature of polyethylene terephthalate copolymer. When polyethylene terephthalate copolymer is used in the liquid cooling module 10, the liquid cooling module 10 can be suitable for medium and high temperature application scenarios.
- the hard segment molecular structure is set to the above-mentioned ratio, which can improve the structural strength of the polyethylene terephthalate copolymer.
- the impact resistance and drop resistance of the liquid cooling module 10 can be improved, and other devices inside the electronic device can be effectively protected.
- the hard segment molecular structure is selected from at least one of 2,5-furandicarboxylic acid, dimethyl carbonate and 2,6-naphthalene dicarboxylic acid.
- 2,5-furandicarboxylic acid, dimethyl carbonate and 2,6-naphthalene dicarboxylic acid are monomers of polyethylene 2,5-furandicarboxylate, polycarbonate and polyethylene naphthalate, respectively.
- the use of the above materials as hard segment molecular structures can improve the structural strength of polyethylene terephthalate copolymers.
- the evaporation problem of the first flexible film 110 and the second flexible film 120 can also be alleviated, and the water permeability and air permeability can be reduced.
- the molecular structure G of part of the hard segment is shown in Table 3.
- Figure 13 is a cross-sectional view of the first flexible film 110 provided in the first embodiment of the present application.
- at least one of the first flexible film 110 and the second flexible film 120 includes two sub-flexible film layers 115 and an anti-evaporation layer 116 located between the two sub-flexible film layers 115, and the anti-evaporation layer 116 includes at least one of a polyimide layer, a polyvinylidene chloride layer, or a metal film layer.
- the material of the sub-flexible film layer 115 can be selected from any of the materials of the first flexible film 110 or the second flexible film 120. In one embodiment, the material of the sub-flexible film layer 115 can be selected from the polyethylene terephthalate copolymer, PET copolymer, mentioned above.
- the first flexible film 110 and the second flexible film 120 adopts a multi-layer film process, that is, the first flexible film 110 and the second flexible film 120 are arranged in a sandwich structure of "PET copolymer-X-PET copolymer", wherein the X layer refers to the anti-evaporation layer 116.
- Polyimide, polyvinylidene chloride and metal film are materials with low water vapor permeability, and the anti-evaporation layer 116 adopts the above materials, which can reduce the evaporation of water vapor in the first flexible film 110 and the second flexible film 120.
- a multi-layer co-extrusion technology or a multi-layer film pressing technology is used to realize a multi-layer film structure in the first flexible film 110 and the second flexible film 120.
- the metal film layer can be a copper film, a nickel film, an aluminum film or a metal-plastic composite film material, and the thickness is less than or equal to 10 microns.
- this solution is conducive to ensuring that the first flexible film 110 and the second flexible film 120 meet the requirements of 100,000 to 400,000 times of bending tests at different bending angles.
- Figure 14 is a cross-sectional view of the liquid cooling module 100 provided in the first embodiment of the present application.
- at least one of the first flexible membrane 110 and the second flexible membrane 120 is provided with an inorganic oxide film 117 on a surface away from the inner cavity 140.
- the surfaces of the first flexible film 110 and the second flexible film 120 away from the inner cavity 140 are not in direct contact with the cooling medium, they are interfaces that the cooling medium must pass through when evaporating to the outside.
- the inorganic oxide film 117 is provided to isolate water vapor and alleviate the evaporation problem of the cooling medium.
- the coating method of the inorganic oxide film 117 can be any one of physical vapor deposition, chemical vapor deposition and atomic layer deposition.
- Figure 15 is a partial enlarged view of the liquid cooling module 10 shown in Figure 1a.
- the liquid cooling module 100 includes a liquid cooling film bending zone 170 (as shown in Figure 1a).
- the liquid cooling module 100 is folded through the liquid cooling film bending zone 170.
- At least one of the first rigid substrate 130, the second rigid substrate 150 and the third rigid substrate 160 is provided with a flexibility enhancing structure 131 (as shown in Figure 1a and Figure 15).
- the flexibility enhancing structure 131 is located in the liquid cooling film bending zone 170.
- the flexibility enhancing structure 131 is used to improve the flexibility of the liquid cooling film bending zone 170.
- the first rigid substrate 130, the second rigid substrate 150 and the third rigid substrate 160 can enhance the strength of the liquid cooling module 100 in the thickness direction A due to their rigidity.
- the bending portion of the liquid cooling module 100 needs to have a certain flexibility. Therefore, this solution sets a flexibility enhancement structure 131 in the liquid cooling film bending area 170 of the liquid cooling module 100, which can reduce the resistance of the bending portion of the liquid cooling module 100 when bending, and meet the folding requirements of the electronic device.
- the flexibility enhancement structure 131 may be at least one of a groove, a through hole, a through hole, and an opening.
- the liquid cooling module 100 further includes a first liquid cooling film static area 180 and a second liquid cooling film static area 190 (as shown in FIG. 1a ) located on both sides of the liquid cooling film bending area 170.
- a first liquid cooling film static area 180 and a second liquid cooling film static area 190 located on both sides of the liquid cooling film bending area 170.
- the flexibility enhancement structure 131 of the first rigid substrate 130 includes a groove 1311 located on the side wall of the first rigid substrate 130, and the groove 1311 is located in the liquid cooling film bending area 170 (as shown in Figure 1a and Figure 15).
- the first rigid substrate 130 is arranged around the edge of the liquid cooling module 10 and is a barrier between the cooling medium and the external environment. Therefore, the first rigid substrate 130 needs to have a high structural strength to ensure the sealing effect so that the cooling medium does not leak to the outside of the liquid cooling module 10.
- the first rigid substrate 130 located in the bending area 170 of the liquid cooling film needs to take into account both structural strength and certain flexibility. Therefore, the flexibility enhancement structure 131 arranged on the first rigid substrate 130 is preferably a groove 1311. If a through hole, through hole or opening is set on the first rigid substrate 130, there will be a risk of cooling medium leakage.
- Figure 16 is a cross-sectional view of the liquid cooling module 100 provided in the first embodiment of the present application.
- the flexibility structure 131 of the second rigid substrate 150 includes a through hole 1313 that penetrates the second rigid substrate 150 along a first direction A.
- the through hole 1313 is located in the bending area 170 of the liquid cooling film.
- the first direction A is the arrangement direction of the first flexible film 110 and the second flexible film 120.
- the through hole 1313 is provided in the second rigid substrate 150, which can improve the flexibility of the bending portion of the second rigid substrate 150. Since the two sides of the second rigid substrate 150 are the liquid inlet channel 142 and the liquid outlet channel 141, the opening 1314 on the second rigid substrate 150 cannot connect the cooling medium on both sides to avoid affecting the cooling effect due to mixed flow. Among them, the first direction A is also the thickness direction of the liquid cooling module 100.
- Figure 17 is a cross-sectional view of the liquid cooling module 100 provided in the first embodiment of the present application.
- the liquid cooling module 100 is provided with a through hole 1312 that penetrates the second rigid substrate 150, the first flexible membrane 110 and the second flexible membrane 120 along the first direction, and the through hole 1312 is located in the bending area 170 of the liquid cooling membrane.
- a through hole 1312 is provided in the second rigid substrate 150, which can improve the flexibility of the bending portion of the second rigid substrate 150 and reduce the rebound force and friction force of the bending area 170 of the liquid cooling film when bending.
- the first direction is the thickness direction A of the liquid cooling module 10.
- the through hole 1312 penetrates the second rigid substrate 150 along the first direction without causing short circuit and mixed flow of the cooling medium in the liquid inlet channel 142 and the liquid outlet channel 141.
- the third rigid substrate 160 can be opened with a hole 1314 to reduce the rebound force of the bending area 170 of the liquid cooling film and the friction force with the screen and the middle frame when bending, and will not cause a short circuit of the cooling medium flow.
- the flexibility structure 131 of the second rigid substrate 150 includes a through hole 1313 and a through hole 1312, or the flexibility structure 131 of the second rigid substrate 150 includes any one of the through hole 1313 and the through hole 1312.
- the through hole 1313 and the through hole 1312 can be flexibly arranged in the second rigid substrate 150 according to actual conditions, thereby improving the practicality of the second rigid substrate 150 in different application environments.
- the flexibility enhancement structure 131 on the second rigid substrate 150 may also be a groove 1311 .
- the flexibility enhancement structure 131 of the third rigid substrate 160 includes an opening 1314 located in the third rigid substrate 160 .
- the opening 1314 connects the flow channels on both sides of the third rigid substrate 160 .
- this solution is set to set an opening 1314 in the third rigid substrate 160, which is equivalent to partially disconnecting the third rigid substrate 160 at the position of the opening 1314, inducing bending deformation at the designed position, and effectively reducing the stress generated during bending.
- Part of the third rigid substrate 160 is distributed in the liquid inlet channel 142, and part of the third rigid substrate 160 is distributed in the liquid outlet channel 141, that is, the channels on both sides of the third rigid substrate 160 belong to the liquid inlet channel 142 or the liquid outlet channel 141, so the opening 1314 connects the two sides of the third rigid substrate 160 without affecting the heat dissipation efficiency, and can increase the mixing effect of the cooling medium in the same flow direction in the liquid inlet channel 142 or the liquid outlet channel 141, thereby improving the cooling effect.
- the flexibility enhancement structure 131 may extend along the flow direction of the cooling medium. In another embodiment, the flexibility enhancement structure 131 may extend along the folding direction of the folding device. Setting the size of the flexibility enhancement structure 131 in its extension direction to be larger can effectively improve the flexibility of the liquid cooling film bending area 170, reduce the rebound force of the liquid cooling film bending area 170 and the friction force with the screen and the middle frame when bending, thereby improving the user experience of the folding device.
- FIG. 18 is a cross-sectional view of the liquid-cooling module 100 provided in the first embodiment of the present application.
- a lubricating material layer 118 is applied to the surface of the first flexible film 110 and the second flexible film 120 away from the inner cavity 140, and the lubricating material layer 118 is located in the bending area of the liquid-cooling film.
- a lubricating material layer 118 can also be provided on the outer surface of the first flexible film 110 and the second flexible film 120 to reduce the friction force of the bending area of the liquid-cooling film when bending, so that the bending process can be carried out more smoothly.
- the lubricating material layer 118 includes, but is not limited to, solid, liquid or paste lubricating materials such as Teflon film, graphite film, graphene film or grease.
- the lubricating material layer 118 When the lubricating material layer 118 is a graphite film or a graphene film, the lubricating material layer 118 can be arranged only in the bending area of the liquid cooling film, or can be arranged at the same time. At least one of the first liquid-cooled film static zone and the second liquid-cooled film static zone and the liquid-cooled film bending zone. At this time, the lubricating material layer 118 not only plays a role in lubricating and reducing friction in the liquid-cooled film static zone, but also can enhance the heat dissipation effect and reduce the overall temperature of the cooling medium, thereby reducing the startup time and frequency of the pump because graphite and graphene themselves have a high thermal conductivity.
- the liquid-cooling module 100 includes a first flexible film 110, a second flexible film 120 and a first rigid substrate 130 located between the first flexible film 110 and the second flexible film 120.
- the first flexible film 110, the second flexible film 120 and the first rigid substrate 130 enclose an inner cavity 140 of the liquid-cooling module 100, and the difference between the glass transition temperature of the first rigid substrate 130 and the glass transition temperature of the material of the first flexible film 110 is less than or equal to 20°C.
- the first flexible film 110 and the second flexible film 120 can reduce the difficulty of bending the electronic device.
- the first rigid substrate 130 is used to enhance the structural strength of the liquid cooling module 100 in the thickness direction A.
- the first flexible film 110, the second flexible film 120 and the first rigid substrate 130 enclose an inner cavity 140, and the cooling medium flows in the inner cavity 140.
- the two ends of the first rigid substrate 130 and the first flexible film 110 and the second flexible film 120 are an integrated sealing structure, which is conducive to improving the sealing performance of the first rigid substrate 130 and avoiding leakage of the cooling medium.
- the difference in glass transition temperature between the material of the first rigid substrate 130 and the material of the first flexible film 110 is set to be small, which is conducive to sealing the first rigid substrate 130 and the first flexible film 110 into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.
- the difference between the melting temperature of the material of the first rigid substrate 130 and the melting temperature of the material of the first flexible film 110 is less than or equal to 20° C. In this embodiment, the difference between the melting temperatures of the material of the first rigid substrate 130 and the material of the first flexible film 110 is set to be small, which is conducive to the first rigid substrate 130 and the first flexible film 110 being sealed into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.
- the achievable manner, size, positional relationship, and structural description of the first flexible film 110, the second flexible film 120, the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 in the foregoing are applicable to the achievable manner, size, positional relationship, and structural description of the first flexible film 110, the second flexible film 120, the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 in this embodiment, and will not be repeated here.
- the liquid-cooling module 100 includes a first flexible film 110, a second flexible film 120 and a first rigid substrate 130 located between the first flexible film 110 and the second flexible film 120.
- the first flexible film 110, the second flexible film 120 and the first rigid substrate 130 enclose an inner cavity 140 of the liquid-cooling module 100.
- the materials of the first flexible film 110, the second flexible film 120 and the first rigid substrate 130 are selected from flexible temperature-resistant polymer materials with a breaking elongation greater than 10%.
- the materials of the first flexible film 110, the second flexible film 120 and the first rigid substrate 130 are independently selected from at least one of polyethylene terephthalate copolymer, polyethylene naphthalate, polyethylene 2,5-furandicarboxylate, polyimide, polyetheretherketone, and biaxially stretched polypropylene.
- the first flexible film 110 and the second flexible film 120 can reduce the difficulty of bending the electronic device.
- the first rigid substrate 130 is used to enhance the structural strength of the liquid cooling module 100 in the thickness direction A.
- the first flexible film 110, the second flexible film 120 and the first rigid substrate 130 enclose an inner cavity 140, and the cooling medium flows in the inner cavity 140.
- the two ends of the first rigid substrate 130 and the first flexible film 110 and the second flexible film 120 are an integrated sealing structure, which is conducive to improving the sealing performance of the first rigid substrate 130 and avoiding leakage of the cooling medium.
- the materials selected for the first rigid substrate 130 and the first flexible film 110 or the second flexible film 120 are conducive to hot pressing the first rigid substrate 130 and the first flexible film 110 or the second flexible film 120 to form an integrated sealing structure.
- the first rigid substrate 130 and the first flexible film 110 or the second flexible film 120 can be made of different materials as long as an integrated sealing structure can be formed between the first rigid substrate 130 and the first flexible film 110 or the second flexible film 120.
- the achievable manner, size, positional relationship, and structural description of the first flexible film 110, the second flexible film 120, the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 in the foregoing are applicable to the achievable manner, size, positional relationship, and structural description of the first flexible film 110, the second flexible film 120, the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 in this embodiment, and will not be repeated here.
- the liquid cooling module 100 includes a first flexible film 110, a second flexible film 120, and a rigid substrate 101 located between the first flexible film 110 and the second flexible film 120.
- the liquid cooling module 100 includes a liquid cooling film bending area 170.
- the liquid cooling module 100 is folded through the liquid cooling film bending area 170.
- the rigid substrate 101 is provided with a flexibility enhancement structure 131.
- the flexibility enhancement structure 131 is located in the liquid cooling film bending area 170.
- the flexibility enhancement structure 131 is used to improve the flexibility of the liquid cooling film bending area 170 and reduce the rebound force of the liquid cooling film bending area 170 and the friction force with the screen and the middle frame when bending.
- both ends of the rigid substrate 101 are used to support the first flexible film 110 and the second flexible film 120.
- the rigid substrate 101 is provided in the liquid cooling module 100 to improve the structural strength of the liquid cooling module 100 in the thickness direction A.
- a flexibility enhancement structure 131 is required to be provided on the rigid substrate 101 located in the liquid cooling film bending area 170 to enhance the flexibility of the liquid cooling film bending area 170.
- the flexibility enhancement structure 131 may be at least one of a groove 1311, a through hole 1312, a through hole 1313 and an opening 1314.
- the rigid substrate 101 may include a first rigid substrate 130, a second rigid substrate 1314, and a through hole 1315.
- a flexible matrix 150 and a third rigid matrix 160 are used to support the first flexible film 110 and the second flexible film 120.
- the achievable methods, sizes, positional relationships, and structural descriptions of the first flexible film 110, the second flexible film 120, the first rigid substrate 130, the second rigid substrate 150, the third rigid substrate 160, and the flexibility enhancement structure 131 in the foregoing text are applicable to the achievable methods, sizes, positional relationships, and structural descriptions of the first flexible film 110, the second flexible film 120, the first rigid substrate 130, the second rigid substrate 150, the third rigid substrate 160, and the flexibility enhancement structure 131 in this embodiment, and are not repeated here.
- the liquid cooling module 10 provided in the embodiment of the present application can be applied to electronic devices.
- the electronic device 1 includes a housing 20, an electronic functional component 30 located in the housing 20, and a liquid cooling module 10, and the liquid cooling module 10 is located outside the housing 20.
- the electronic device 1 can be an electronic product such as a mobile phone, a tablet computer, a laptop computer, and a wearable device.
- the electronic functional components 30 in the electronic device 1 include but are not limited to a processor, an internal memory, a charging management module, a power management module, a battery, an antenna, a communication module, a camera, an audio module, a speaker, a receiver, a microphone, a sensor module, a motor, and an indicator.
- the electronic device 1 may have more or fewer electronic functional components 30 than described above.
- Various electronic functional components 30 can be implemented in hardware, software, or a combination of hardware and software including one or more signal processing and/or application-specific integrated circuits.
- the electronic functional component 30 releases heat when it is in working state.
- the temperature inside the electronic device 1 is too high, it will affect the working efficiency of the electronic functional component 30 and the service life of the electronic device 1, so it is necessary to set a liquid cooling module 10 to control the temperature rise of the electronic functional component 30.
- the liquid cooling module 10 is located between the housing 20 and the electronic functional component 30 .
- the electronic device 1 is a foldable device having a flattened state and a folded state.
- the electronic device 1 comprises a first non-folding portion 11, a folding portion 12, and a second non-folding portion 13, wherein the second non-folding portion 13 can be folded toward the first non-folding portion 11 through the folding portion 12.
- the liquid cooling module 10 can be divided into a first liquid cooling film static area 180, a liquid cooling film bending area 170, and a second liquid cooling film static area 190 in sequence along the length direction B.
- the liquid cooling module 100 is folded through the liquid cooling film bending area 170, the liquid cooling film bending area 170 is bent, and the first liquid cooling film static area 180 and the second liquid cooling film static area 190 are not deformed.
- the folding machine has three or more N folding screens, there can be a maximum of three or N liquid cooling modules, 2 or N-1 bending areas; at least 2 liquid cooling films, 1 bending area, where N is an integer greater than 2. If it is a straight-plate machine, there may be no bending area, and there may be one or more liquid cooling films.
- one or more liquid pumps may be provided, which may be connected in parallel, in series or in mixed connection, and may be arranged adjacent to or not adjacent to each other, such as being arranged near the motherboards of different screens.
- the pump may have pressure fluctuations, slight vibrations of 2-50um and certain noise during operation.
- Flexible liquid cooling modules help absorb pressure fluctuations, volume changes and less vibration and noise.
- the first rigid substrate 130 surrounds the edges of the first liquid-cooled film static area 180, the liquid-cooled film bending area 170 and the second liquid-cooled film static area 190 in a closed arrangement.
- the pump 200 is located in the second liquid-cooled film static area 190 and is arranged close to the first rigid substrate 130 along the width direction C, and the third rigid substrate 160 is provided on both sides of the pump 200 along the length direction B, wherein the third rigid substrates 160 on both sides of the pump 200 along the length direction B are columnar and strip-shaped, respectively.
- the pump 200 and the adjacent first flexible film 110, the second flexible film 120 and other structural parts in the electronic device 1 are usually spaced or additionally provided with damping materials, wherein the damping material can be bonded to the first flexible film 110, the second flexible film 120 or the structural part.
- the structural part can be at least one of a display screen, a housing 20, a battery, and a camera.
- the pump 200 is provided with a second rigid substrate 150 on one side away from the first rigid substrate 130 along the width direction C.
- the second rigid substrate 150 separates the inner cavity 140 of the second liquid-cooled film static zone 190, the liquid-cooled film bending zone 170 and part of the first liquid-cooled film static zone 180 into a liquid inlet channel 142 and a liquid outlet channel 141.
- part of the second rigid substrate 150 extends along the width direction C, and part of the second rigid substrate 150 extends along the length direction B, wherein the second rigid substrate 150 extending along the length direction B separates the inner cavity 140 located on both sides along the width direction C into a liquid inlet channel 142 and a liquid outlet channel 141, and the second rigid substrate 150 extending along the width direction C is used to guide the flow of the cooling medium flowing out of the pump 200 together with the third rigid substrate 160.
- the third rigid substrate 160 may be in a strip shape or a column shape, wherein the strip-shaped third rigid substrate 160 extends along the width direction C, and a column-shaped third rigid substrate 160 is provided on both sides of the strip-shaped third rigid substrate 160 along the width direction C.
- the third rigid substrate 160 is in a strip shape and extends along the length direction B.
- the area enclosed by the first rigid substrate 130 of the second liquid-cooled film static zone 190 is substantially rectangular or square.
- the second rigid substrate 150 extends along the length direction B, and the second rigid substrate 150 divides the inner cavity 140 located on both sides of the second rigid substrate 150 along the width direction C into a liquid inlet channel 142 and a liquid outlet channel 141, wherein the third rigid substrate 160 in the liquid inlet channel 142 and the liquid outlet channel 141 are both strip-shaped and extend along the length direction B.
- the area enclosed by the first rigid substrate 130 of the liquid-cooling film bending zone 170 is basically strip-shaped.
- the liquid-cooling module 10 in the liquid-cooling film bending zone 170 adopts a cross-axis setting, that is, the liquid-cooling module 10 spans the main axis of the liquid-cooling film bending zone 170.
- part of the second rigid substrate 150 is in an "inverted C-shape", and part of the second rigid substrate 150 is in a strip shape and extends along the width direction C.
- the "inverted C-shape" second rigid substrate 150 divides the inner cavity 140 into a liquid inlet channel 142 and a liquid outlet channel 141, forming an "inverted
- the third rigid substrates 160 on both sides of the second rigid substrate 150 of "C-shape” are also "inverted C-shape”.
- a columnar third rigid substrate 160 is provided on one side along the width direction C at the end of the strip-shaped second rigid substrate 150, and the liquid inlet channel 142 and the liquid outlet channel 141 are connected in the third rigid substrate 160 to form a cooling cycle.
- the thicknesses of the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 are not equal, and the thickness of any one of the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 may be 0.1 mm to 1 mm.
- This solution is conducive to meeting the architectural space requirements of the liquid cooling module 10 in different application environments.
- the thickness of any one of the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 may be 0.15 mm to 0.3 mm.
- the density of the first flexible film 110 and the second flexible film 120 is less than or equal to 2 g/ml. This solution is conducive to reducing the overall weight of the liquid cooling module 10, while allowing the first flexible film 110 and the second flexible film 120 to be more flexibly adapted to different architectural environments.
- FIG. 21 is a schematic diagram of the structure of the electronic device 1 provided in the second embodiment of the present application.
- the liquid cooling module 10 may present a shape different from that of the first embodiment.
- the first rigid substrate 130 is arranged around the edge of the liquid cooling module 10
- the second rigid substrate 150 is in the shape of two "cross" shapes connected end to end
- one of the "cross"-shaped second rigid substrates 150 is arranged in a curved shape at both ends along the width direction C, so that the inner cavity 140 finally presents a shape of multiple "C" shapes connected end to end with different openings.
- the pump 200 is located at one end of the second liquid cooling film static zone 190 along the width direction C, and the third rigid substrate 160 in the second liquid cooling film static zone 190 is columnar.
- One end of the second rigid substrate 150 with two curved ends is arranged adjacent to the pump 200, and the inner cavity 140 is divided into a liquid inlet channel 142 and a liquid outlet channel 141.
- the liquid-cooling module 10 is in an elongated strip shape as a whole, wherein the second rigid substrate 150 is arranged in a strip shape and extends along the length direction B, and the third rigid substrate 160 located on both sides of the second rigid substrate 150 along the width direction C is arranged in a strip shape and extends along the length direction B.
- the liquid-cooling module 10 is in an elongated strip shape as a whole, wherein the second rigid substrate 150 is arranged in a strip shape and extends along the length direction B, and the third rigid substrate 160 located on both sides of the second rigid substrate 150 along the width direction C is arranged in a strip shape and extends along the length direction B, and the liquid inlet channel 142 and the liquid outlet channel 141 are connected in the first liquid-cooling film static area 180 to form a cooling cycle.
- FIG. 22 is a schematic diagram of the structure of the electronic device 1 provided in the second embodiment of the present application.
- the first rigid substrate 130 is arranged around the edge of the liquid-cooling module 10
- the pump 200 is located in the second liquid-cooling film static zone 190 and is arranged close to the first rigid substrate 130 along the length direction B and the width direction C
- the second rigid substrate 150 first extends along the length direction B, then extends along the width direction C, and then extends along the length direction B to the liquid-cooling film
- the bending area 170 wherein the second rigid substrate 150 is far away from the liquid cooling film bending area 170 and is arranged near the pump 200 at one end extending along the length direction B
- the inner cavity 140 is divided into a liquid inlet channel 142 and a liquid outlet channel 141.
- the third rigid substrate 160 is not arranged in the liquid inlet channel 142.
- the third rigid substrate 160 extends along the length direction B and is arranged at staggered intervals, so that the liquid outlet channel 141 finally presents a "C" shape with multiple openings in different directions connected end to end.
- the second rigid substrate 150 is arranged in a strip shape and extends along the length direction B.
- the liquid inlet channel 142 and the liquid outlet channel 141 are connected to form a cooling cycle, wherein the shape and distribution characteristics of the third rigid substrate 160 in the first liquid-cooled film static zone 180 and the third rigid substrate 160 in the second liquid-cooled film static zone 190 are similar, and are not repeated here.
- the feasible manner, size, positional relationship, and structural description of the pump 200, the first flexible membrane 110, the second flexible membrane 120, the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 in the first embodiment are applicable to the feasible manner, size, positional relationship, and structural description of the pump 200, the first flexible membrane 110, the second flexible membrane 120, the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 in the second embodiment, and will not be repeated here.
- the VC cover plate or heat pipe is made of copper alloy or stainless steel with a density of 8.9g/ml and 7.8g/mL. It cannot pass the 100,000-200,000 bending test (R ⁇ 1.5mm), and cannot achieve through-axis or cross-axis heat dissipation.
- the equivalent thermal conductivity is ⁇ 2000W/m ⁇ K.
- the equivalent thermal conductivity can also reach 5000W/m ⁇ K, and the thickness can be locally designed, and the thickness of 0.15mm can be achieved locally to meet the requirements of chip and architecture space.
- the liquid cooling membrane material is modified PET, etc., with a density of ⁇ 2g/mL, which can achieve a more flexible architecture design, and the heat dissipation capacity is increased by more than 50% compared to graphite.
- the liquid cooling membrane group provided in the embodiment of the present application has a heat dissipation capacity that is more than 50% higher than that of cross-axis/through-axis graphite.
- FIG. 23 is a schematic diagram of the structure of the electronic device 1 provided in the third embodiment of the present application.
- FIG. 24 is a schematic diagram of the partial structure of the liquid cooling module 10 provided in the third embodiment of the present application.
- the liquid cooling module 10 in the liquid cooling film bending area 170 is arranged by a through-axis.
- the liquid cooling module 10 includes a first surface 300 and a second surface 400 arranged opposite to each other along the thickness direction A.
- the liquid cooling module 10 located in the liquid cooling film bending area 170 is provided with two spaced curved portions 310.
- the area of the liquid cooling module 10 other than the curved portions 310 is a base 320.
- the first surfaces 300 and the second surfaces 400 of the two curved portions 310 are curved toward the second surface 400 of the base 320 in the thickness direction A away from the first surface 300.
- the two curved portions 310 and the base 320 located between the two curved portions 310 are arranged in a corrugated shape.
- the area enclosed by the two curved portions 310 and the base 320 between the two curved portions 310 is used to penetrate the main axis.
- the electronic device also includes a flexible circuit board 40, and the flexible circuit board 40 is used to be electrically connected to the electronic functional components, wherein the flexible circuit board 40 and the liquid cooling module 10 are jointly arranged in a through-axis configuration.
- the liquid cooling module 10 located in the bending area 170 of the liquid cooling film is arranged in a close fit, and the flexible circuit board 40 and the liquid cooling module 10 are both corrugated and share the through-axis space, which is conducive to reducing the friction, collision and abnormal noise between the liquid cooling module 10 and the flexible circuit board 40.
- the flexible circuit board 40 can be kept in a corrugated shape by a plastic deformation method.
- an air gap is partially or completely provided between the flexible circuit board 40 and the liquid cooling module 10.
- the feasible methods, dimensions, positional relationships, and structural descriptions of the pump 200, the first flexible membrane 110, the second flexible membrane 120, the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 in the first embodiment are applicable to the feasible methods, dimensions, positional relationships, and structural descriptions of the pump 200, the first flexible membrane 110, the second flexible membrane 120, the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 in the third embodiment, and will not be repeated here.
- Figure 26 is a schematic diagram of the structure of the liquid cooling module 10 provided in the fourth embodiment of the present application
- Figure 27 is a schematic diagram of the structure of the electronic device provided in the first embodiment of the present application. Different from the first embodiment, in the fourth embodiment, the liquid cooling module 10 is an external accessory relative to the electronic device 1.
- the liquid cooling module 10 includes a first liquid cooling film static area 180, a liquid cooling film bending area 170 and a second liquid cooling film static area 190, wherein the liquid cooling film bending area 170 includes two first bending portions 171 and a second bending portion 172, the second bending portion 172 is located between the two first bending portions 171, and the bending degree of the second bending portion 172 is greater than the first bending portion 171.
- the deformed part of the electronic device moves to the accommodation space formed by the surface of the second bending portion 172, and the first bending portion 171 deforms with the electronic device.
- This solution decouples the liquid cooling module 10 from sensitive devices such as a display screen and a battery of the electronic device by configuring the liquid cooling module 10 as an external accessory, thereby making the design of the liquid cooling module 10 flexible and the replacement more convenient.
- the feasible manner, size, positional relationship, and structural description of the pump 200, the first flexible membrane 110, the second flexible membrane 120, the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 in the first embodiment are applicable to the feasible manner, size, positional relationship, and structural description of the pump 200, the first flexible membrane 110, the second flexible membrane 120, the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 in the fourth embodiment, and will not be repeated here.
- FIG. 28 is a schematic diagram of the structure of the electronic device 1 provided in the fifth embodiment of the present application.
- the electronic device 1 is a non-foldable device, and the electronic device 1 has no folding state.
- the liquid cooling module 100 includes a first flexible film, a second flexible film, a first rigid substrate 130 and a second rigid substrate 150, and the first rigid substrate 130 is arranged in a closed manner around the edge of the liquid cooling module 10.
- the pump is arranged near the first rigid substrate 130 along the length direction B.
- the second rigid substrate 150 is provided on the side of the pump 200 away from the first rigid substrate 130 along the length direction B, and the second rigid substrate 150 extends along the length direction B.
- the inner cavity 140 located on both sides of the second rigid substrate 150 along the width direction C is divided into a liquid inlet channel 142 and a liquid outlet channel 141.
- the liquid inlet channel 142 and the liquid outlet channel 141 are connected on the side of the second rigid substrate 150 away from the pump 200 along the length direction B to form a cooling cycle.
- FIG28 illustrates the flow direction of the liquid working medium.
- the two pumps are designed in parallel to form a circulating flow.
- the thickness of the first rigid substrate 130 and the second rigid substrate 150 are not equal, and the thickness of any one of the first rigid substrate 130 and the second rigid substrate 150 may be 0.1 mm to 1 mm. This solution is conducive to meeting the architectural space requirements of the liquid cooling module 10 in different application environments. Preferably, the thickness of any one of the first rigid substrate 130 and the second rigid substrate 150 may be 0.15 mm to 0.3 mm.
- the density of the first flexible film 110 and the second flexible film 120 is less than or equal to 2 g/ml. This solution is conducive to reducing the overall weight of the liquid cooling module 10, while allowing the first flexible film 110 and the second flexible film 120 to be more flexibly adapted to different architectural environments.
- the feasible manner, positional relationship and structural description of the pump 200, the first flexible membrane 110, the second flexible membrane 120, the first rigid substrate 130 and the second rigid substrate 150 in the first embodiment are applicable to the feasible manner, positional relationship and structural description of the pump 200, the first flexible membrane 110, the second flexible membrane 120, the first rigid substrate 130 and the second rigid substrate 150 in the fifth embodiment, and will not be repeated here.
- VC/HP refers to a variable electrical conductivity heat pipe with an equivalent thermal conductivity of 5000W/m ⁇ K, equal thickness design, and a thickness ⁇ 0.25mm.
- the VC cover or heat pipe is made of copper alloy or stainless steel with a density of 8.9g/ml or 7.8g/mL.
- a flexible liquid cooling film solution is adopted, and the equivalent thermal conductivity can also reach 5000W/m ⁇ K. It can be locally designed with no thickness, and the thickness of 0.15mm can be achieved locally to meet the requirements of chip and architecture space.
- the material of the liquid cooling module is modified PET, etc., with a density of ⁇ 2g/mL, which can achieve a more flexible architecture design, lighter and higher heat dissipation capacity.
- VC single-body heat dissipation capacity
- it can be designed with unequal thickness, and the weight reduction is >50%.
- FIG. 29 is a schematic diagram of a liquid cooling module provided by an embodiment of the present application.
- the cooling medium in the liquid cooling module 100 can be a single-phase cooling medium, or two or more colors of cooling medium that are incompatible with each other, so that the cooling medium can flow freely. Enhanced visualization and improved user experience.
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Abstract
Description
Claims (24)
- 一种液冷模组(10),其特征在于,所述液冷模组(10)包括:泵(200),所述泵(200)包括泵基体(210)和固定于所述泵基体(210)的压电组件(220),所述泵基体(210)设有泵进液口(211)和泵出液口(212);液冷模件(100),所述液冷模件(100)包括液冷出液口(111)和液冷进液口(112),所述液冷出液口(111)用于与所述泵进液口(211)连通,所述液冷进液口(112)用于与所述泵出液口(212)连通,所述液冷出液口(111)周侧的部分所述液冷模件(100)与所述泵进液口(211)周侧的部分所述泵基体(210)为一体化密封结构,所述液冷进液口(112)周侧的部分所述液冷模件(100)与所述泵出液口(212)周侧的部分所述泵基体(210)为一体化密封结构。
- 根据权利要求1所述的液冷模组(10),其特征在于,所述液冷出液口(111)周侧的部分所述液冷模件(100)中的至少部分与所述泵进液口(211)周侧的部分所述泵基体(210)的至少部分沿所述液冷出液口(111)的周向(D)连续融合为一体,以形成一体化密封结构。
- 根据权利要求1所述的液冷模组(10),其特征在于,所述泵基体(210)包括泵底壁(213),所述泵底壁(213)与所述压电组件(220)以及两者之间的部分泵基体(210)围设构成泵腔(214),所述泵进液口(211)和所述泵出液口(212)设于所述泵底壁(213)且与所述泵腔(214)连通,所述泵底壁(213)与所述液冷出液口(111)周侧以及所述液冷进液口(112)周侧的部分所述液冷模件(100)为一体化密封结构。
- 根据权利要求1所述的液冷模组(10),其特征在于,所述泵基体(210)还包括位于所述泵底壁(213)与所述压电组件(220)之间的泵侧壁(215),所述泵侧壁(215)为一体化密封结构。
- 根据权利要求3所述的液冷模组(10),其特征在于,所述液冷模件(100)包括第一柔性膜(110),所述液冷出液口(111)和所述液冷进液口(112)设置于所述第一柔性膜(110),所述泵底壁(213)与所述液冷出液口(111)周侧以及所述液冷进液口(112)周侧的部分所述第一柔性膜(110)为一体化密封结构。
- 根据权利要求3所述的液冷模组(10),其特征在于,所述泵底壁(213)的材质的玻璃化转变温度与所述第一柔性膜(110)的材质的玻璃化转变温度的差值小于或者等于20℃;或者所述泵底壁(213)的材质的熔融温度与所述第一柔性膜(110)的材质的熔融温度的差值小于或者等于20℃;或者所述液冷出液口(111)周侧的部分所述液冷模件(100)的材质与所述泵进液口(211)周侧的部分所述泵基体(210)的材质相同,所述液冷进液口(112)周侧的部分所述液冷模件(100)的材质与所述泵出液口(212)周侧的部分所述泵基体(210)的材质相同。
- 根据权利要求3所述的液冷模组(10),其特征在于,所述泵底壁(213)的材质选自断裂伸长率大于10%的柔性耐温聚合物材料,所述泵底壁(213)的材质选自聚对苯二甲酸乙二醇酯共聚物、聚萘二甲酸乙二醇酯、聚2,5-呋喃二甲酸乙二醇酯、聚酰亚胺、聚醚醚酮、双轴拉伸聚丙烯中的至少一种;所述第一柔性膜(110)的材质选自断裂伸长率大于10%的柔性耐温聚合物材料,所述第一柔性膜(110)的材质选自聚对苯二甲酸乙二醇酯共聚物、聚萘二甲酸乙二醇酯、聚2,5-呋喃二甲酸乙二醇酯、聚酰亚胺、聚醚醚酮、双轴拉伸聚丙烯中的至少一种。
- 根据权利要求7所述的液冷模组(10),其特征在于,所述聚对苯二甲酸乙二醇酯共聚物的单体包括对苯二甲酸、乙二醇和硬段分子结构,所述硬段分子结构占所述聚对苯二甲酸乙二醇酯共聚物的质量百分数的取值大于或者等于20%、且小于或者等于80%。
- 根据权利要求8所述的液冷模组(10),其特征在于,所述硬段分子结构选自2,5-呋喃二甲酸、碳酸二甲酯和2,6-萘二甲酸中的至少一种。
- 根据权利要求5所述的液冷模组(10),其特征在于,所述液冷模件(100)还包括第二柔性膜(120)和位于所述第一柔性膜(110)和所述第二柔性膜(120)之间的第一刚性基体(130),所述第一柔性膜(110)、所述第二柔性膜(120)和所述第一刚性基体(130)围合构成所述液冷模件(100)的内腔(140),所述第一刚性基体(130)的两端分别与所述第一柔性膜(110)和所述第二柔性膜(120)为一体化密封结构。
- 根据权利要求10所述的液冷模组(10),其特征在于,所述第一刚性基体(130)的材质的玻璃化转变温度与所述第一柔性膜(110)或者所述第二柔性膜(120)的材质的玻璃化转变温度的差值小于或者等于20℃;或者所述第一刚性基体(130)的材质的熔融温度与所述第一柔性膜(110)或者所述第二柔性膜(120)的材质的熔融温度的差值小于或者等于20℃。
- 根据权利要求10所述的液冷模组(10),其特征在于,所述第一柔性膜(110)和所述第二柔性膜(120)中的至少一个包括两层子柔性膜层(115)和位于所述两层子柔性膜层(115)之间的防蒸散层(116),所述防蒸散层(116)包括聚酰亚胺层、聚偏二氯乙烯层或者金属薄膜层中的至少一个。
- 根据权利要求10所述的液冷模组(10),其特征在于,所述第一柔性膜(110)和所述第二柔性膜(120)中的至少一个远离所述内腔(140)的表面设有无机氧化薄膜(117)。
- 根据权利要求10所述的液冷模组(10),其特征在于,所述液冷模件(100)还包括第二刚性基体(150),所述第二刚性基体(150)将所述液冷模件(100)的内腔(140)分隔为进液流道(142)和出液流道(141),所述液冷进液口(112)与所述进液流道(142)连通,所述液冷出液口(111)与所述出液流道(141)连通,所述第二刚性基体(150)的两端分别与所述第一柔性膜(110)和所述第二柔性膜(120)为一体化密封结构。
- 根据权利要求14所述的液冷模组(10),其特征在于,所述液冷模件(100)还包括第三刚性基体(160),所述第三刚性基体(160)分布于所述进液流道(142)和所述出液流道(141)内,所述第三刚性基体(160)的两端分别与所述第一柔性膜(110)和所述第二柔性膜(120)为一体化密封结构。
- 根据权利要求15所述的液冷模组(10),其特征在于,所述液冷模件(100)包括液冷膜弯折区(170),所述液冷模件(100)通过所述液冷膜弯折区(170)折叠,所述第一刚性基体(130)、所述第二刚性基体(150)和所述第三刚性基体(160)中的至少一个设有增柔结构(131),所述增柔结构(131)位于所述液冷膜弯折区(170),所述增柔结构(131)用于提升所述液冷膜弯折区(170)的柔韧性。
- 根据权利要求16所述的液冷模组(10),其特征在于,所述第一刚性基体(130)的增柔结构(131)包括位于所述第一刚性基体(130)的侧壁上的凹槽(1311),所述凹槽(1311)位于所述液冷膜弯折区(170)。
- 根据权利要求16所述的液冷模组(10),其特征在于,所述第二刚性基体(150)的增柔结构(131)包括沿第一方向(A)贯穿所述第二刚性基体(150)的通孔(1313),所述通孔(1313)位于所述液冷膜弯折区(170)内,所述第一方向(A)为所述第一柔性膜(110)和所述第二柔性膜(120)的排列方向;或者所述液冷模件(100)设有沿所述第一方向(A)贯穿所述第二刚性基体(150)、所述第一柔性膜(110)和所述第二柔性膜(120)的贯穿孔(1312),所述贯穿孔(1312)位于所述液冷膜弯折区(170)内。
- 根据权利要求16所述的液冷模组(10),其特征在于,所述第三刚性基体(160)的增柔结构(131)包括位于所述第三刚性基体(160)的开孔(1314),所述开孔(1314)连通所述第三刚性基体(160)两侧的流道。
- 一种液冷模件(100),其特征在于,所述液冷模件(100)包括第一柔性膜(110)、第二柔性膜(120) 和位于所述第一柔性膜(110)和所述第二柔性膜(120)之间的第一刚性基体(130),所述第一柔性膜(110)、所述第二柔性膜(120)和所述第一刚性基体(130)围合构成所述液冷模件(100)的内腔(140),所述第一刚性基体(130)的玻璃化转变温度与所述第一柔性膜(110)的材质的玻璃化转变温度的差值小于或者等于20℃;或者所述第一刚性基体(130)的材质的熔融温度与所述第一柔性膜(110)的材质的熔融温度的差值小于或者等于20℃。
- 一种液冷模件(100),其特征在于,所述液冷模件(100)包括第一柔性膜(110)、第二柔性膜(120)和位于所述第一柔性膜(110)和所述第二柔性膜(120)之间的第一刚性基体(130),所述第一柔性膜(110)、所述第二柔性膜(120)和所述第一刚性基体(130)围合构成所述液冷模件(100)的内腔(140),所述第一柔性膜(110)、所述第二柔性膜(120)和所述第一刚性基体(130)的材质选自断裂伸长率大于10%的柔性耐温聚合物材料,所述第一柔性膜(110)、所述第二柔性膜(120)和所述第一刚性基体(130)的材质各自独立地选自聚对苯二甲酸乙二醇酯共聚物、聚萘二甲酸乙二醇酯、聚2,5-呋喃二甲酸乙二醇酯、聚酰亚胺、聚醚醚酮、双轴拉伸聚丙烯中的至少一种。
- 一种液冷模件(100),其特征在于,所述液冷模件(100)包括第一柔性膜(110)、第二柔性膜(120)和位于所述第一柔性膜(110)和所述第二柔性膜(120)之间的刚性基体(101);所述液冷模件(100)包括液冷膜弯折区(170),所述液冷模件(100)通过所述液冷膜弯折区(170)折叠,所述刚性基体(101)设有增柔结构(131),所述增柔结构(131)位于所述液冷膜弯折区(170),所述增柔结构(131)用于提升所述液冷膜弯折区(170)的柔韧性。
- 一种电子设备(1),其特征在于,包括如权利要求1-19任一项所述的液冷模组(10),所述液冷模组(10)位于所述电子设备(1)内,或位于所述电子设备(1)的配件内;或者包括如权利要求20-22任一项所述的液冷模件(100),所述液冷模件(100)位于所述电子设备(1)内,或位于所述电子设备(1)的配件内。
- 如权利要求1所述的电子设备(1),其特征在于,所述电子设备(1)包括第一非折叠部(11)、折叠部(12)和第二非折叠部(13),所述第二非折叠部(13)通过所述折叠部(12)能够向所述第一非折叠部(11)折叠,所述液冷模件(100)包括液冷膜弯折区(170),所述电子设备(1)折叠时,所述液冷模件(100)通过所述液冷膜弯折区(170)折叠,所述第一刚性基体(130)、所述第二刚性基体(150)和所述第三刚性基体(160)中的至少一个设有增柔结构(131),所述增柔结构(131)位于所述液冷膜弯折区(170),所述增柔结构(131)用于提升所述液冷膜弯折区(170)的柔韧性。
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| EP24756004.8A EP4557904A4 (en) | 2023-02-17 | 2024-02-01 | LIQUID COOLING MODULE, MODULAR LIQUID COOLING UNIT AND ELECTRONIC DEVICE |
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| CN202310462273.7A CN116614991B (zh) | 2023-02-17 | 2023-04-20 | 液冷模组、液冷模件及电子设备 |
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| CN118804570A (zh) * | 2024-09-13 | 2024-10-18 | 歌尔股份有限公司 | 散热模组和应用装置 |
| CN119414602A (zh) * | 2024-11-25 | 2025-02-11 | 歌尔光学科技有限公司 | Ar眼镜 |
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| CN116614991B (zh) * | 2023-02-17 | 2025-05-13 | 华为技术有限公司 | 液冷模组、液冷模件及电子设备 |
| CN116792301A (zh) * | 2023-06-01 | 2023-09-22 | 华为技术有限公司 | 驱动泵、液冷模组、电子设备及振子制备方法 |
| WO2026044462A1 (zh) * | 2024-08-26 | 2026-03-05 | 宁德时代新能源科技股份有限公司 | 换热组件、电池装置、用电设备以及储能设备 |
| CN119855117A (zh) * | 2025-03-05 | 2025-04-18 | Oppo广东移动通信有限公司 | 显示屏组件及电子设备 |
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| EP4557904A1 (en) | 2025-05-21 |
| CN116614991B (zh) | 2025-05-13 |
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