WO2025001336A1 - 固态加工方法及固态加工装置 - Google Patents

固态加工方法及固态加工装置 Download PDF

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Publication number
WO2025001336A1
WO2025001336A1 PCT/CN2024/082799 CN2024082799W WO2025001336A1 WO 2025001336 A1 WO2025001336 A1 WO 2025001336A1 CN 2024082799 W CN2024082799 W CN 2024082799W WO 2025001336 A1 WO2025001336 A1 WO 2025001336A1
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WO
WIPO (PCT)
Prior art keywords
solid
state
cooling
temperature
spindle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2024/082799
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English (en)
French (fr)
Inventor
郭达伟
乔乾
汪虎
林慧怡
周敏
李文晓
朱志雄
杨国舜
郭志达
谭立武
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aerospace Engineering Equipment (suzhou) Co Ltd
Idq Science And Technology Development Guangdong Hengqin Co Ltd
Institute For Development And Quality Macau
Original Assignee
Aerospace Engineering Equipment (suzhou) Co Ltd
Idq Science And Technology Development Guangdong Hengqin Co Ltd
Institute For Development And Quality Macau
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aerospace Engineering Equipment (suzhou) Co Ltd, Idq Science And Technology Development Guangdong Hengqin Co Ltd, Institute For Development And Quality Macau filed Critical Aerospace Engineering Equipment (suzhou) Co Ltd
Priority to EP24829989.3A priority Critical patent/EP4592014A4/en
Publication of WO2025001336A1 publication Critical patent/WO2025001336A1/zh
Priority to US19/021,936 priority patent/US20250162064A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/12—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding
    • B23K20/122—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding using a non-consumable tool, e.g. friction stir welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/12—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding
    • B23K20/122—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding using a non-consumable tool, e.g. friction stir welding
    • B23K20/123—Controlling or monitoring the welding process
    • B23K20/1235—Controlling or monitoring the welding process with temperature control during joining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/12—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding
    • B23K20/1215—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding for other purposes than joining, e.g. built-up welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/12—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding
    • B23K20/122—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding using a non-consumable tool, e.g. friction stir welding
    • B23K20/123—Controlling or monitoring the welding process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/12—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding
    • B23K20/122—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding using a non-consumable tool, e.g. friction stir welding
    • B23K20/1245—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding using a non-consumable tool, e.g. friction stir welding characterised by the apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/12—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding
    • B23K20/129—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding specially adapted for particular articles or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/25—Process efficiency

Definitions

  • the present invention relates to the field of solid-state processing technology, and in particular to a solid-state processing method and a solid-state processing device.
  • the range is limited once the installation is completed.
  • the operation is complicated, and the cost of the sensor itself is relatively high; at the same time, the temperature of the force and torque monitoring position of the stirring tool will affect the final monitoring results, and there is currently no effective means to monitor the temperature.
  • the temperature measurement of the tip of the solid-state machining tool during solid-state machining was usually carried out in the following three ways, which were not accurate enough or costly.
  • One method is to use an infrared imager to detect the temperature of solid-state processing tools and processing positions.
  • thermocouple to detect the temperature of the heat-affected zone near the processing position.
  • the surface roughness, adaptation space and sliding speed of the workpiece under actual working conditions limit the temperature measurement accuracy of the sliding contact thermocouple, and the temperature measurement is not accurate enough.
  • Another method is to place the thermocouple wire near the solid-state processing position through a pre-processed hole or groove. When the solid-state processing is completed, the tip of the thermocouple will form a metallurgical bond with the material near the solid-state processing position and cannot be used a second time, which is costly.
  • the present invention provides a solid-state processing method, the solid-state processing method comprising the steps of:
  • the deformation of the deformation detection area on the transition spindle is measured by a strain gauge to monitor the pressure and/or torque of the transition spindle;
  • the temperature of the deformation detection area is monitored by a second temperature monitoring component.
  • the steps of measuring the deformation of the deformation detection zone on the transition spindle by means of a strain gauge to monitor the pressure and/or torque of the transition spindle; monitoring the temperature of the solid-state machining tool by means of a first temperature monitoring component; and monitoring the temperature on the deformation detection zone by means of a second temperature monitoring component include:
  • a control device is provided on the outer side of the transition spindle, and wireless signals of the strain gauge, the first temperature monitoring component and the second temperature monitoring component are sent and received through the control device during the solid-state machining process.
  • a control device is provided on the outer side of the transition spindle, and the steps of sending and receiving wireless signals of the strain gauge, the first temperature monitoring component and the second temperature monitoring component through the control device during the solid-state machining process include:
  • strain gauges are attached to the deformation detection area on the transition spindle to calibrate the pressure and/or torque measurement.
  • the step of attaching strain gauges to the deformation detection area on the transition spindle to calibrate the pressure and/or torque measurement includes:
  • the torque calibration method is as follows: the transition spindle is placed on a designated mold with its bottom fixed, a torque of known magnitude is applied from its top, and the torque is increased sequentially, and the torque signal is received by a control device and the displayed torque signal is calibrated.
  • a first temperature monitoring component extends into a cavity inside the solid-state processing tool close to one end of the processing end of the solid-state processing tool; thereby, during the solid-state processing process, the temperature of the processing end of the solid-state processing tool is monitored in real time through the monitoring end of the first temperature monitoring component.
  • the solid state heating is monitored by setting a thermocouple in one of the vertical section and the inclined section of the chamber.
  • the processing end temperature of the working tool is measured, and a positioning piece is provided at the other of the vertical section and the inclined section of the cavity to position the thermocouple.
  • a cooling device is provided on the outer side of the transition spindle, and the cooling device faces one side of the solid-state machining tool, and the step of cooling the heat transferred from the solid-state machining tool to the transition spindle by the cooling device to avoid the excessive temperature of the transition spindle includes:
  • the cooling device is a self-cooling component fixedly connected to the outside of the transition spindle.
  • the self-cooling component rotates synchronously with the transition spindle; or it is a cooling sleeve rotatably connected to the outside of the transition spindle.
  • the cooling sleeve has a cooling module to cool the transition spindle.
  • the transition spindle rotates relative to the cooling sleeve, and the cooling sleeve does not rotate.
  • the self-cooling component is a semiconductor refrigeration sheet and/or a fan.
  • the transition spindle is cooled by the semiconductor refrigeration sheet and/or the fan; and the semiconductor refrigeration sheet and/or the fan are evenly distributed on the outside of the transition spindle to maintain the weight balance of various parts of the transition spindle.
  • the cooling device includes a cooling sleeve rotatably connected to the outside of the transition spindle, and the cooling sleeve has a cooling module to cool the transition spindle.
  • the step in which the transition spindle rotates relative to the cooling sleeve and the cooling sleeve does not rotate includes:
  • the cooling module is a cooling chamber opened in the cooling sleeve.
  • the purpose of controlling the cooling efficiency is achieved by controlling the temperature or flow rate of the fluid entering the cooling chamber.
  • the heating module may heat the location.
  • the cooling efficiency of the cooling device can be increased to reduce the heat conducted from the solid state machining tool to the transition spindle.
  • different temperatures are calibrated before the solid-state processing process begins to obtain the offset value pattern of the strain gauge measurement data at each temperature, so as to form an error correction curve corresponding to these temperature values and input it into the control device.
  • the correct strain gauge measurement value can be obtained by referring to the curve.
  • an annular heat insulation assembly is installed between the transition spindle and the solid-state machining tool to reduce the conduction of heat generated by the solid-state machining tool to the transition spindle during the machining process.
  • the present invention provides a solid-state processing device, which is a solid-state processing device for implementing the above method.
  • the strain gauge is used to measure the deformation of the deformation detection area on the transition spindle to monitor the pressure and/or torque of the transition spindle; the strain gauge is small in size, light in weight, simple in structure, and fast in measurement speed. It has little effect on the working state and stress distribution of the measured object during measurement, and is suitable for dynamic machining.
  • the temperature of the deformation detection area can be understood in real time, which is convenient for the user to make targeted adjustments according to the obtained temperature information, so as to prevent the temperature of the deformation detection area from being too high or too low, thereby affecting the measurement accuracy.
  • FIG1 is a schematic flow diagram of a solid-state processing method according to the present invention.
  • FIG2 is a schematic diagram of the overall use of an embodiment of the present invention.
  • FIG3 is a schematic diagram of solid-state processing on a substrate according to the present invention.
  • FIG4 is a schematic structural diagram of an embodiment of a wireless shaft handle of the present invention.
  • FIG5 is a schematic structural diagram of another embodiment of the wireless shaft handle of the present invention.
  • FIG6 is a schematic diagram of the front view structure of the present invention.
  • FIG7 is a perspective structural schematic diagram of the present invention.
  • FIG8 is a schematic diagram of the top view of the structure of FIG6;
  • FIG9 is a schematic cross-sectional view of the structure taken along the A-A section line in FIG8 ;
  • FIG10 is an enlarged schematic diagram of the structure at D in FIG9 ;
  • FIG11 is a schematic cross-sectional view of the structure along the B-B section line in FIG8 ;
  • FIG12 is an embodiment of a connection assembly of the present invention.
  • FIG13 is an enlarged schematic diagram of the structure at E in FIG12 ;
  • FIG14 is another embodiment of the connection assembly of the present invention.
  • FIG15 is an enlarged schematic diagram of the structure at F in FIG14;
  • FIG16 is a schematic diagram of the main structure of the wireless smart shaft handle
  • FIG17 is a schematic cross-sectional view of the structure along the C-C section line in FIG16;
  • FIG18 is a perspective structural diagram of a wireless smart shaft handle
  • FIG19 is a schematic diagram of the connection structure between the transition spindle and the strain measurement assembly
  • FIG20 is a schematic diagram of the segmented structure of the transition spindle
  • FIG. 21 is a schematic diagram of the structure of the cooling section on the transition spindle.
  • transition spindle 100, transition spindle; 200, processing unit; 300, control device; 400, cooling device; 500, first temperature monitoring component; 510, second temperature monitoring component; 600, positioning member; 700, Heating module; 800, connecting component; 900, strain measurement component; 1000, connecting frame; 110, support area; 120, deformation detection area; 130, mounting hole; 140, threaded through hole; 150, Heat sink; 210, cavity; 211, inclined section; 212, vertical section; 212a, groove; 220, thread structure; 310, protective sleeve; 320, integrated circuit board assembly; 321, wireless transceiver module; 322, temperature control panel; 330, power supply assembly; 410, cooling sleeve; 420, cooling chamber; 430, self-cooling component; 440, cold air gun; 810, magnetic attraction member; 820, fixing buckle; 830, first threaded hole; a. Base material; b. Weld seam.
  • S100 Connecting a solid-state machining tool to the transition spindle 100 to be driven by a machine head; installing the solid-state machining tool on one side of the transition spindle 100, and driving the transition spindle 100 by the machine head to drive the solid-state machining tool to rotate;
  • the solid-state processing device is started and the solid-state processing tool is used to perform mobile processing along a predetermined processing route; the solid-state processing device is started to drive the machine head, the transition spindle 100 and the solid-state processing tool to perform mobile solid-state processing along the solid-state processing route on the substrate a;
  • the deformation of the deformation detection area 120 on the transition spindle 100 is measured by a strain gauge to monitor the pressure and/or torque of the transition spindle 100; a plurality of sets of strain gauges are attached to the outer side of the transition spindle 100, wherein at least one set is used to measure the downward pressure of the transition spindle 100, and at least one set is used to measure the torque of the transition spindle 100;
  • the temperature of the solid-state processing tool is monitored by the first temperature monitoring component 500; the temperature of the solid-state processing tool is monitored in real time by the first temperature monitoring component 500 to obtain real-time parameters, so as to facilitate feedback adjustment by the user;
  • the temperature of the deformation detection area 120 is monitored by the second temperature monitoring component 510; the second temperature monitoring component 510 is set at the deformation detection area 120 of the transition spindle 100, and the temperature of the deformation detection area 120 is monitored in real time by the second temperature monitoring component 510.
  • the temperature of the strain gauge can prevent the strain gauge from being in a higher or lower temperature area without the user knowing the information, resulting in inaccurate measurement results and the user having no way of knowing it.
  • the solid-state processing method may be a friction stir welding method or a solid-state additive manufacturing method.
  • the solid-state processing method is a friction stir welding method
  • the solid-state processing tool is a friction stir welding tool
  • the solid-state processing method is a solid-state additive manufacturing method
  • the solid-state processing tool is a hollow stirring tool.
  • a control device 300 is provided on the outer side of the transition spindle 100.
  • the control device 300 receives and sends wireless signals of the strain gauge, the first temperature monitoring component 500 and the second temperature monitoring component 510.
  • the control device 300 converts the wireless signals into numerical values displayed on the terminal, so that the user can intuitively understand various processing parameter information.
  • the integrated circuit board component 320 in the control device 300 receives and sends wireless signals of the strain gauge, the first temperature monitoring component 500 and the second temperature monitoring component 510, and displays the corresponding signals on the terminal.
  • the power supply component 330 in the control device 300 supplies power to the integrated circuit board component 320.
  • the strain gauge, the first temperature monitoring component 500 and the second temperature monitoring component 510 can all be connected to the integrated circuit board component 320. Since the control device 300 moves with the three, the signal transmission will be more stable, and the data finally monitored will be more accurate. According to the detected spindle torque, pressure and stirring tool temperature, it is judged whether the solid-state processing or processing parameters are appropriate, and then fed back to the control device, and then a response is made to adjust the parameters in real time.
  • a strain gauge is attached to the deformation detection area 120 on the transition spindle 100, and mechanical data to be measured by the strain gauge, such as pressure, torque, etc., are calibrated in advance.
  • S111 The specific method for calibrating the pressure is to place the transition spindle 100 on the specified mold, fix its bottom, and apply a force of known magnitude from the top, gradually increasing the applied force, and controlling the device to adjust the pressure.
  • Device 300 receives the pressure signal and calibrates the displayed pressure signal.
  • the torque calibration method is specifically as follows: placing the transition spindle 100 on a designated mold with its bottom fixed, applying a torque of known magnitude from its top, increasing it sequentially, receiving the torque signal through the control device 300 and calibrating the displayed torque signal.
  • the first temperature monitoring component 500 extends into the cavity 210 inside the solid-state processing tool close to one end of the processing end of the solid-state processing tool; thereby, during the solid-state processing, the temperature of the processing end of the solid-state processing tool is monitored in real time through the monitoring end of the first temperature monitoring component 500 to prevent heat from being consumed during the conduction process, resulting in the inability to obtain accurate temperature information.
  • thermocouple is set in one of the vertical section 212 and the inclined section 211 of the cavity 210 to monitor the temperature of the processing end of the solid-state processing tool, and a positioning member 600 is set in the other of the vertical section 212 and the inclined section 211 of the cavity 210 to position the thermocouple to prevent the thermocouple from displacement or collision during high-speed rotation.
  • a cooling device 400 is provided on the outer side of the transition spindle 100, and the cooling device 400 faces one side of the solid-state machining tool, and the heat transferred from the solid-state machining tool to the transition spindle 100 is cooled by the cooling device 400 to avoid the transition spindle 100 from overheating.
  • the transition spindle 100 is provided with electrical components such as the control device 300 and strain gauges, excessively high temperatures can easily cause these electrical components to become inaccurate or fail, and therefore it is necessary to cool the heat transferred from the solid-state machining tool to the transition spindle 100.
  • heat insulation can also be performed by a heat insulation component provided between the transition spindle 100 and the solid-state machining tool.
  • Both cooling methods for the transition spindle 100 can be used. Preferably, the two cooling methods are used simultaneously. After field use, if one of the two cooling methods is cancelled, a higher temperature will appear at the transition spindle 100, resulting in inaccurate measurement results.
  • the cooling device 400 includes a rotating connection
  • the cooling sleeve 410 is connected to the outside of the transition spindle 100, and a cooling module is provided inside the cooling sleeve 410 to cool the transition spindle 100.
  • the transition spindle 100 rotates relative to the cooling sleeve 410, and the cooling sleeve 410 does not rotate.
  • This method of setting up the cooling device is relatively stable and reliable, that is, the cooling sleeve must be fixedly connected to the frame and cannot rotate with the transition spindle 100. It can be called a "wired type".
  • the cooling module is to open a cooling cavity 420 in the cooling sleeve 410.
  • the purpose of controlling the cooling efficiency is achieved by controlling the temperature or flow rate of the fluid entering the cooling cavity 420; for example, when a faster cooling rate is required, the fluid temperature can be lower and the fluid flow rate can be faster; when a slower cooling rate is required, the opposite measures can be taken.
  • cooling device 400 is a self-cooling component 430 fixedly connected to the outside of the transition spindle 100.
  • the self-cooling component 430 rotates synchronously with the transition spindle 100; this method makes the overall structure small in size, light in weight, and more convenient to use.
  • the self-cooling component 430 is a semiconductor cooling sheet and/or a fan.
  • the semiconductor cooling sheet and/or the fan are used to dissipate heat from the transition spindle 100.
  • the semiconductor cooling sheet is small and lightweight, and is suitable for rotating with the transition spindle 100.
  • the fan has the characteristics of low cost and simple installation.
  • the semiconductor cooling sheet and/or the fan will be evenly distributed on the outside of the transition spindle 100 during installation to maintain the weight balance of the transition spindle 100 and prevent the transition spindle 100 from losing balance during high-speed rotation.
  • a cold air gun 440 can be used to assist in more efficient cooling. rate of refrigeration.
  • the cooling efficiency of the cooling device 400 can be improved to reduce the heat conducted from the solid processing tool to the transition spindle 100;
  • the preset temperature range can be selected according to the actual needs, such as 10°C-20°C, 20°C-30°C, 30°C-40°C, etc.; of course, the range value of the preset temperature can also be selected, and the previous only writes the range of 10°C, it can also be any value, such as the range of 5°C, 6°C: 10°C-15°C, 20°C-25°C, 10°C-16°C, 20°C-26°C, etc.
  • the preset temperature range can be changed accordingly according to the change of the situation; preferably, the preset temperature range fluctuates within the room temperature range.
  • the heating part will work; if the measured temperature in the transition zone is higher than this temperature, the cooling part will work to keep the temperature in the transition zone from deviating greatly, thereby ensuring the measurement accuracy of the strain gauge.
  • temperature control methods such as not using a heating module and only changing the temperature of the fluid entering the cooling chamber.
  • the cooling chamber will play a heating role and replace the heating module, and the temperature control purpose can also be achieved.
  • the deformation detection area 120 can be freely heated or cooled, but before that, it is calibrated at different temperatures.
  • the temperature can be selected according to the actual situation. When the temperature is low, it can be calibrated at -30°C, -20°C, -10°C, etc., or it can be 0°C, 15°C, 20°C, 30°C, 40°C, 50°C, etc.
  • the temperature should be understood as a temperature range, such as -50°C-100°C, etc., to obtain the offset value law of the strain measurement data at each temperature, and input the error correction curve corresponding to this temperature into the receiving end.
  • the heating or cooling module can be used during the test.
  • the correct strain gauge value pressure and torque
  • the present invention can also cooperate with the use of UI interface to read the input analog signal, read the machine tool coordinates and XYZ running speed values in PLC, realize PLC path control, motion control, such as automatic tool setting, planning the starting point and end point, setting the spindle speed and Z pressing speed, XY moving speed; realize data recording, monitoring and closed-loop adjustment of temperature, torque and pressure in the solid-state machining process; record solid-state machining parameters (such as speed, tool moving speed, penetration) in the process of solid-state machining
  • the data are collected by the process database after the corresponding material type is entered.
  • the software controls the PLC to adjust the solid-state processing parameters to achieve closed-loop control. Distributed control is performed for the solid-state processing process, that is, in the initial stage, the temperature, force and torque are identified and matched to know the material type, and then the process parameters are matched from the process library for solid-state processing.
  • the present application also proposes a solid-state processing device, which is a solid-state processing device for implementing the above method.
  • the invention comprises a smart shaft handle and a processing part 200 detachably connected to the smart shaft handle, wherein the processing part 200 is a solid processing tool; wherein the smart shaft handle comprises a transition spindle 100, wherein the first end of the transition spindle 100 is connected to the driving spindle, and the second end of the transition spindle 100 is used to connect to the processing part 200; a control device 300 and a cooling device 400 are installed on the outer side of the transition spindle 100, wherein the cooling device 400 is located between the control device 300 and the processing part 200; the transition spindle 100 plays a role of supporting and installing the control device 300, the cooling device 400 and the monitoring device; and the cooling device 400 is provided with Between the processing part 200 and the control device 300, the heat conducted from the processing part 200 to the control device 300 can be effectively reduced, thereby protecting the control device 300; the smart shaft handle also includes a monitoring device, which is connected to the control device 300.
  • the monitoring device is used to monitor the real-time parameters of the smart shaft handle and transmit the parameters to the control device 300, so as to adjust the solid-state processing parameters through the obtained data, thereby optimizing the indicators at the processing position and extending the life of the solid-state processing tool;
  • the parameters may include but are not limited to temperature, pressure, torque, spindle speed, solid-state processing speed, pressing depth and other data.
  • the monitoring device includes a first temperature monitoring component 500 and a strain measurement component 900 .
  • the first temperature monitoring component 500 is used to monitor the temperature of the processing part 200 ;
  • the strain measurement component 900 is used to measure the downward force and/or torque of the spindle.
  • the cooling device 400 includes a cooling sleeve 410 rotatably connected to the outside of the transition spindle 100.
  • the rotatable connection can be a bearing connection; the cooling sleeve 410 is fixedly connected to the frame through the connecting frame 1000, and a cooling module is arranged in the cooling sleeve 410.
  • the cooling sleeve 410 can support and protect the cooling module therein; optionally, the cooling module includes a cooling cavity 420 arranged inside the cooling sleeve 410, and the cooling cavity 420 is provided with an inlet end and an outlet end.
  • the cooling fluid enters the cooling cavity 420 from the inlet end and flows out from the outlet end to take away the heat of the transition spindle 100.
  • the cooling fluid includes liquid cooling and air cooling; liquid cooling can use conventional water cooling; air cooling can use compressed air, rare gas, carbon dioxide and other gases for forced convection.
  • the above cooling sleeve 410 is fixedly connected to the frame via the connecting frame 1000.
  • the connecting frame 1000 drives the cooling device 400 to follow the frame for multi-axis movement.
  • the transition spindle 100 can drive the control device 300 and the monitoring device to rotate together. For ease of understanding, a more detailed explanation is given as follows: In this embodiment, the cooling device 400 does not rotate with the transition spindle 100.
  • the following method can be used to realize the rotation of the transition spindle 100 relative to the cooling device 400.
  • a skeleton oil seal is placed at the top of the cavity, the outer side cooperates with the cavity, and the inner side cooperates with the spindle extension sleeve to close the top of the cavity.
  • the rotation seal of the spindle sleeve can be realized.
  • Another skeleton oil seal is placed under the support ring to close the lower part of the cavity.
  • a tightening sleeve (ring) is provided at the bottom of the cooling sleeve 410.
  • the protruding position on the upper side of the tightening sleeve (ring) cooperates with the skeleton oil seal, and is connected to the cooling sleeve 410 through four screws, providing axial tightening for the skeleton oil seal and the positioning ring to prevent the skeleton oil seal and the support ring from rotating together with the transition spindle 100.
  • There are two threaded holes in the middle of the cooling sleeve 410 which are connected to the cooling cavity 420 and are used to connect the water pipe for supplying and discharging cooling water.
  • the hollow position of the support ring should correspond to the cooling water inlet/outlet
  • the cooling device 400 also has a wireless usage, that is, the cooling device 400 includes a self-cooling component 430 fixedly arranged on the outside of the transition main shaft 100 and a fixed component.
  • the self-cooling component 430 rotates with the transition main shaft 100.
  • the self-cooling component 430 can be a semiconductor cooling plate and/or a fan, and the semiconductor cooling plate and/or the fan are connected to the control device 300; preferably, the semiconductor cooling plates or fans can be arranged in multiple groups and evenly distributed on the outside of the transition main shaft 100 to facilitate uniform weight distribution.
  • a heating module 700 for heating the transition spindle 100 is also provided on the outside of the transition spindle 100.
  • the heating module 700 is connected to the control device 300.
  • the control device 300 may include a control panel to facilitate the regulation of the temperature required for heating.
  • the heating module 700 may be a hot air gun, which may be mounted on the connecting frame 1000 and does not rotate with the tool handle body. When the smart tool handle is working in cold weather, it is used to spray hot air flow to heat the tool handle and adjust the temperature of the measurement area.
  • the heating module 700 may also be a heating element with a smaller volume and weight, such as a resistance heating plate, and may be used regardless of whether the cooling device 400 is fixed or rotates with the transition spindle 100 .
  • the control device 300 includes an integrated circuit board component 320 and a power supply component 330.
  • the integrated circuit board component 320 is connected to the power supply component 330.
  • the integrated circuit board component 320 includes a wireless transceiver module 321 (the wireless transceiver module includes a wireless signal acquisition module and a wireless signal transmission module) and a temperature control panel 322.
  • the wireless transceiver module 321 is connected to the monitoring device, the cooling device 400, and the heating module 700.
  • the temperature control panel 322 is connected to the monitoring device, the cooling device 400, and the heating module 700.
  • a cavity 210 is opened inside the processing part 200, and the first end of the cavity 210 extends from the inside of the processing part 200 to the processing end close to the processing part 200, and the first temperature monitoring component 500 is arranged in the first end of the cavity 210 to monitor the temperature of the processing part 200 close to the processing end in real time; this design can avoid a large amount of heat loss during the conduction process, so as to collect more accurate temperature information, which is convenient for users to monitor the temperature in real time; preferably, the first temperature monitoring component 500 can be a thermocouple, which has a wide measurement range, high measurement accuracy, and is deformable, and is suitable for use in the present application; of course, other feasible temperature sensors that can enter the cavity 210, such as thermal resistors, can also be selected according to actual needs.
  • the cavity 210 includes an inclined section 211 opened inside the processing part 200 and a vertical section 212 connected to the inclined section 211.
  • One of the inclined section 211 and the vertical section 212 is used to insert the first temperature monitoring component 500
  • the other of the inclined section 211 and the vertical section 212 is used to install a positioning member 600 to position the first temperature monitoring component 500 to prevent the first temperature monitoring component 500 from shifting and/or colliding during the process of following the high-speed rotation of the shaft handle and the processing part 200.
  • the positioning member 600 is a positioning rod, the first end of which is used to position the first temperature monitoring component 500, and the second end of which is fixed by a connecting assembly 800; it is understandable that the positioning member 600 in the present application is not limited to the embodiment of the positioning rod, and any positioning member 600 can be used as long as it can position or fix the first temperature monitoring component 500 similar to the positioning rod, such as a snap clamping and fixing method, etc.; at the same time, there are many ways to fix the positioning rod by the connecting assembly 800, which are not particularly limited. The following are several examples to facilitate understanding of the technical solutions:
  • connection assembly 800 includes a threaded structure provided at one end of the positioning rod and on the processing portion 200 .
  • the threaded structure on the positioning rod and the threaded structure on the processing portion 200 can be threadedly connected.
  • the threaded connection method is low in cost. And it is convenient to disassemble and assemble;
  • the connecting component 800 is a magnetic fixing component, which is adsorbed and arranged on the side of the processing portion 200 facing the transition spindle 100, and the positioning member 600 passes through the magnetic fixing component to fix the positioning member 600 through the magnetic fixing component; a groove 212a is provided at the inlet end of the vertical section 212, and a magnetic member 810 is adsorbed on the inner wall of the groove 212a, and a fixing buckle 8 is adsorbed on one side of the magnetic member 810. 20.
  • Through holes are provided on the fixing buckle 820 and the magnetic component 810 along the axial direction of the transition main shaft 100.
  • the positioning rod (positioning component 600) passes through the through hole and is inserted into the vertical section 212.
  • the positioning rod is a magnetic metal, so that the positioning rod and the magnetic component 810 are adsorbed and connected.
  • a first threaded hole 830 can also be provided radially from the fixing buckle 820, and a screw is passed through the first threaded hole 830 to fix the positioning rod and the magnetic fixing component.
  • the first end of the thermocouple is connected to the control device 300 (as for the connection method between the thermocouple and the control device 300, the thermocouple can be directly connected to the control device 300; or the thermocouple can be electrically connected to the control device 300 by wireless means).
  • the first end of the thermocouple is also connected to the integrated circuit board assembly 320 included in the control device 300, and the temperature of the processing part 200 and the pressure, torque and other information of the spindle are simultaneously transmitted through the integrated circuit board assembly 320.
  • the second end of the thermocouple abuts against the first end of the cavity 210, and the thermocouple is electrically connected to the control device 300 by wireless means.
  • thermocouple includes the following two settings. First, as shown in the figure, the first end of the thermocouple is connected to the control device 300 (same as above), and the second end of the thermocouple passes through the interior of the transition spindle 100 and then enters the vertical section 212 and is close to the processing end of the processing part 200; a channel is opened inside the transition spindle to communicate with the cavity 210, and then the thermocouple is passed through the channel inside the transition spindle 100 and the cavity 210 inside the processing part 200 in turn.
  • thermocouple is relatively stable and reliable, and it is not easy for the thermocouple to shift, and it can also minimize the interference of external factors on the thermocouple.
  • the first end of the thermocouple is still connected to the control device 300, and the second end of the thermocouple is arranged along the outer wall of the transition spindle 100 and enters from the inclined section 211 to approach the processing end of the processing part 200; the thermocouple and the transition spindle 100, and the thermocouple and the processing part 200 can be fixed by connecting with a strap and/or a buckle; this method of designing the thermocouple on the outside of the transition spindle 100 does not require opening a hole in the transition spindle 100, and the use cost is relatively low.
  • the strain measurement component 900 is used to measure the downward pressure and/or torque of the driving spindle; by detecting the deformation of the extended transition spindle 100, the pressure and torque in the solid-state machining process are detected in real time, so that the solid-state machining parameters can be adjusted according to the obtained data, so as to achieve the optimization of the indicators at the machining position and the extension of the life of the solid-state machining tool.
  • the strain measurement assembly 900 includes one or more groups of strain gauges connected to the outside of the transition spindle 100.
  • the strain gauges are fixed to the outside of the transition spindle 100 by bonding; when there is only one group of strain gauges, the strain gauges are used to measure the pressure under the drive spindle or measure the torque of the drive spindle; when there are multiple groups of strain gauges, at least one group is used to measure the pressure under the drive spindle, and at least one group is used to measure the torque of the drive spindle; the strain gauges are half-bridge strain gauges or full-bridge strain gauges; at the same time, in order to ensure that the weight on the transition spindle 100 is evenly distributed, the strain gauges are evenly distributed on the outside of the transition spindle 100; optionally, the strain measurement assembly 900 can also adopt a method of setting a pressure sensor and/or a torque sensor on the outside of the transition spindle 100.
  • the transition main shaft 100 can be divided into multiple sections along its axial direction, including a deformation detection area 120 and support areas 110 located on both sides of the deformation detection area 120, wherein the support area 110 is used to install the protective sleeve 310, and the deformation detection area 120 is used to install the strain measurement component 900; the protective sleeve 310 and the transition main shaft 100 are connected to each other.
  • a cavity is formed between the main shafts 100, and the strain measurement component 900 (strain gauge) installed outside the deformation detection area 120 is located in the cavity; an installation groove is opened in the protective sleeve 310, and an integrated circuit board component 320 is installed in the installation groove.
  • a power supply component 330 is also installed in the cavity or the installation groove.
  • the power supply component 330 and the strain measurement component 900 are both connected to the integrated circuit board component 320, and the integrated circuit board component 320 is powered by the power supply component 330.
  • the integrated circuit board component 320 includes at least a wireless signal acquisition module and a wireless signal transmission module to send and receive measurement signals of the strain measurement component 900; the above protective sleeve 310 structural design plays the following roles: first, the protective sleeve 310 can protect the strain measurement component 900; second, the cavity structure design of the protective sleeve 310 can reduce weight; third, the cavity can also accommodate the integrated circuit board component 320 and the power supply component 330.
  • the protective sleeve 310 is made of a polymer material such as nylon that does not block wireless signal transmission. Furthermore, the protective sleeve 310 is additively manufactured.
  • the protective sleeve 310 is fixed to the outside of the transition spindle by multiple screws. Similarly, in order to ensure that the weight on the transition spindle 100 is evenly distributed, the multiple screws are preferably evenly arranged in the circumferential direction of the transition spindle 100.
  • the diameter of the deformation detection position (the position for sticking strain gauges) can be reduced accordingly, and its structure, material, etc.
  • the diameter of the transition spindle 100 corresponding to the deformation detection area 120 can be made smaller than the diameter of the transition spindle 100 corresponding to the support area 110; preferably, the deformation detection area 120 and the support area 110 have a smooth transition, so that the downward pressure and torque of the driving spindle can be transmitted to the strain measurement component 900 on the deformation detection area 120 without hindrance.
  • a second temperature monitoring component 510 is provided at the deformation detection area 120.
  • the component 510 is located in the cavity.
  • the second temperature monitoring component 510 can be a temperature measuring element such as a thermocouple or a thermistor. Taking a thermocouple as an example, one end of the thermocouple is connected to the integrated circuit board component 320, and the other end of the thermocouple is used to measure the temperature of the deformation detection area 120 in real time.
  • a rubber ring or similar accessory for increasing friction may be provided at the supporting position of the supporting area 110 to prevent the protective sleeve 310 from slipping axially along the transition main shaft 100 .
  • the transition spindle 100 may not only include the above-mentioned support area 110 and deformation detection area 120, but also include a cooling section; preferably, the cooling section is located on the side of the protective sleeve 310 facing the processing part 200 to prevent excessive heat from being conducted from the processing part 200 to the integrated circuit board assembly 320 and the power supply assembly 330; a cooling device 400 is arranged on the outside of the cooling section to quickly cool the heat conducted to the cooling section, so as to effectively protect the integrated circuit board assembly 320 and the power supply assembly 330 from damage; preferably, a heat dissipation groove 150 is opened on the outside of the cooling section.
  • an annular heat insulation component is arranged between the deformation detection area 120 of the transition spindle 100 and the processing part 200; the position of the annular heat insulation component can be selectively installed according to the shaft handle structure; the setting of the annular heat insulation component must also meet the requirements of both conducting the downward pressure of the driving spindle and isolating or reducing the heat conducted from the processing part 200 to the deformation detection area 120; further, the material of the annular heat insulation component is mica, high-temperature resistant carbon fiber synthetic stone plate and other high-temperature resistant and pressure-resistant materials; as for the shape, size and quantity of the heat insulation component, they can be selected according to actual needs
  • the first end of the transition spindle 100 is connected to the driving spindle, and the second end of the transition spindle 100 is provided with a mounting hole 130 coaxial with the solid processing tool, and the solid processing tool is inserted into the mounting hole 130 and fixedly connected to the transition spindle 100; optionally, as shown in FIG. 9 , one or more threaded through holes 140 are provided on the side wall of the mounting hole 130, so that a threaded member can pass through the threaded through hole 140 to fix the mounting tool.
  • the solid processing tool in the hole 130 is fixed; the design of inserting a section of the solid processing tool into the mounting hole 130 makes the contact surface between the solid processing tool head and the inner wall of the mounting hole 130 larger, which is more conducive to the fixation of the solid processing tool.
  • the transition spindle 100 can also be connected to the solid processing tool in other ways, such as designing a threaded structure on both the transition spindle 100 and the solid processing tool; it can be understood that the above two means are only for the purpose of facilitating the understanding of the content of this application, and do not constitute a limitation thereto.

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Abstract

一种固态加工方法，固态加工方法步骤包括：将固态加工工具连接至过渡主轴（100）以通过机头驱动；启动固态加工设备并通过固态加工工具沿预定加工路线进行移动加工；固态加工过程中，通过应变片测量过渡主轴（100）上形变探测区（120）的形变以监测过渡主轴（100）的压力和/或扭矩；通过第一温度监测组件（500）监测固态加工工具的温度；通过第二温度监测组件（510）监测形变探测区（120）上的温度。

Description

固态加工方法及固态加工装置 技术领域
本发明涉及固态加工技术领域，尤其是涉及一种固态加工方法及固态加工装置。
背景技术
目前，一方面，由于固态加工过程中搅拌工具受力和扭矩情况往往通过置于主轴内的压力传感器及扭矩传感器进行监测，一旦安装完成便限定了量程，进行维修或者更换不同量程传感器时，操作复杂，且传感器本身成本较高；同时，搅拌工具受力和扭矩监测位置的温度会对最终的监测结果造成影响，而目前没有有效的手段去进行温度的监测。另一方面，以往针对固态加工过程中固态加工工具尖端的温度测量，通常采取以下三种方式，不够精确或成本较高。一种是用红外成像仪探测固态加工工具及加工位置温度，这种方法由于不同材质物体表面氧化情况以及温度均对比辐射系数造成影响，因此测温不够准确；还有一种方法是通过滑动接式热电偶探测加工位置附近热影响区温度，实际工况的工件表面粗糙度、适配空间和滑动速度对滑动式接触热电偶测温精度有限制，测温不够准确；还有一种是将热电偶丝通过预先加工的孔或槽放置于固态加工位置附近，当固态加工完成后，热电偶尖端会与固态加工位置附近材料形成冶金结合，无法二次使用，成本较大。
发明内容
本发明提供一种固态加工方法及固态加工装置，以解决现有技术中的问题。
本发明所解决的技术问题采用以下技术方案来实现：
第一方面，本发明提供了一种固态加工方法，所述固态加工方法步骤包括：
将固态加工工具连接至过渡主轴以通过机头驱动；
启动固态加工设备并通过所述固态加工工具沿预定加工路线进行移动加工；
固态加工过程中，通过应变片测量所述过渡主轴上形变探测区的形变以监测所述过渡主轴的压力和/或扭矩；
通过第一温度监测组件监测所述固态加工工具的温度；
通过第二温度监测组件监测所述形变探测区上的温度。
在一些实施例中，所述固态加工方法为搅拌摩擦焊焊接方法或固态增材制造方法。
进一步地，在固态加工过程中，通过应变片测量所述过渡主轴上形变探测区的形变以监测所述过渡主轴的压力和/或扭矩；通过第一温度监测组件监测所述固态加工工具的温度；通过第二温度监测组件监测所述形变探测区上的温度的步骤包括：
所述过渡主轴的外侧具有控制装置，在固态加工过程中通过控制装置收发应变片、第一温度监测组件以及第二温度监测组件的无线信号。
在一些实施例中，所述过渡主轴的外侧具有控制装置，在固态加工过程中通过控制装置收发应变片、第一温度监测组件以及第二温度监测组件的无线信号的步骤包括：
在固态加工过程中，控制装置内的集成电路板组件收发应变片、第一温度监测组件以及第二温度监测组件的无线信号，并将对应信号在终端上进行 显示，控制装置内的供电组件对集成电路板组件进行供电。
在一些实施例中，在固态加工过程开始前，将应变片黏贴在所述过渡主轴上的形变探测区，以对压力和/或扭矩测量进行标定。
在一些实施例中，在固态加工过程开始前，将应变片黏贴在所述过渡主轴上的形变探测区，以对压力和/或扭矩测量进行标定的步骤包括：
对压力的标定方法，将所述过渡主轴置于指定模具上，其底部固定，并从顶部施加已知大小的力，依次增大所施加的力，通过控制装置接收压力信号并对显示的压力信号进行标定。
在一些实施例中，在固态加工过程开始前，将应变片黏贴在所述过渡主轴上的形变探测区，以对压力和/或扭矩测量进行标定的步骤包括：
对扭矩的标定方法，将所述过渡主轴置于指定模具上，其底部固定，从其顶部施加已知大小的扭矩，依次增加，通过控制装置接收扭矩信号并对显示的扭矩信号进行标定。
在一些实施例中，在固态加工过程开始前，第一温度监测组件伸入所述固态加工工具内部的腔道靠近所述固态加工工具加工端的一端；从而使得固态加工过程中，通过所述第一温度监测组件的监测端实时监测所述固态加工工具的加工端温度。
在一些实施例中，在固态加工过程开始前，第一温度监测组件伸入所述固态加工工具内部的腔道靠近所述固态加工工具加工端的一端；从而使得固态加工过程中，通过所述第一温度监测组件的监测端实时监测所述固态加工工具的加工端温度的步骤包括：
通过在腔道的竖直段和倾斜段的其中之一设置热电偶以监测所述固态加 工工具的加工端温度，在腔道的竖直段和倾斜段的其中另一设置定位件以定位所述热电偶。
在一些实施例中，固态加工过程中，所述过渡主轴的外侧具有冷却装置，且所述冷却装置朝向所述固态加工工具的一侧，通过所述冷却装置将固态加工工具向所述过渡主轴传递的热量进行冷却以避免所述过渡主轴温度过高。
在一些实施例中，固态加工过程中，所述过渡主轴的外侧具有冷却装置，且所述冷却装置朝向所述固态加工工具的一侧，通过所述冷却装置将固态加工工具向所述过渡主轴传递的热量进行冷却以避免所述过渡主轴温度过高的步骤包括：
所述冷却装置为固定连接在所述过渡主轴外侧的自冷却组件，在固态加工过程中，所述自冷却组件跟随所述过渡主轴同步旋转；或为转动连接在所述过渡主轴外侧的冷却套筒，所述冷却套筒内具有冷却模块以对所述过渡主轴进行冷却，在固态加工过程中，其中所述过渡主轴相对冷却套筒进行转动，冷却套筒不旋转。
在一些实施例中，所述冷却装置为固定连接在所述过渡主轴外侧的自冷却组件，在固态加工过程中，所述自冷却组件跟随所述过渡主轴同步旋转的步骤包括：
所述自冷却组件为半导体制冷片和/或风扇，在固态加工过程中，通过半导体制冷片和/或风扇对所述过渡主轴进行散热；且半导体制冷片和/或风扇均布在所述过渡主轴外侧，以维持所述过渡主轴的各处重量平衡。
在一些实施例中，所述冷却装置包括转动连接在所述过渡主轴外侧的冷却套筒，所述冷却套筒内具有冷却模块以对所述过渡主轴进行冷却，在固态 加工过程中，其中所述过渡主轴相对冷却套筒进行转动，冷却套筒不旋转的步骤包括：
所述冷却模块为在冷却套筒内开设冷却腔，固态加工过程中，通过控制进入冷却腔内的流体温度或者流量从而达到控制冷却效率的目的。
在一些实施例中，当第二温度监测组件监测到形变探测区处的温度低于预设温度范围的最小值时，可通过加热模块对该位置进行加热。
在一些实施例中，当第二温度监测组件监测到形变探测区的温度高于预设温度范围的最大值时，可通过提高冷却装置的冷却效率以减少从所述固态加工工具传导至所述过渡主轴的热量。
在一些实施例中，为实现对形变探测区的恒温控制，在固态加工过程开始前，对不同温度进行标定，得到各个温度下应变片测量数据的偏移值规律，以形成与这些温度值对应的误差矫正曲线并输入至控制装置，通过参考曲线即可得出正确应变片测量数值。
在一些实施例中，在固态加工过程开始前，在所述过渡主轴和固态加工工具之间安装环形隔热组件以减少加工过程中固态加工工具产生的热量向过渡主轴进行传导。
第二方面，本发明提供了一种固态加工装置，所述固态加工装置为实施上述方法的固态加工装置。
本发明具有的有益效果是：
固态加工过程中，通过应变片测量所述过渡主轴上形变探测区的形变以监测所述过渡主轴的压力和/或扭矩；应变片尺寸小，重量轻，结构简单，测量速度快，测量时对被测件的工作状态和应力分布基本无影响，适用于动 态测量；通过第一温度监测组件监测所述固态加工工具的温度，可得到固态加工工具的工作实时温度，便于根据得到的温度信息对固态加工工具的工作参数进行调节；通过第二温度监测组件监测所述形变探测区上的温度，实时了解形变探测区的温度，便于用户根据得到的温度信息进行针对性调整，防止形变探测区温度过高或过低，进而影响测量准确性。
附图说明
为了更清楚地说明本发明实施方案或现有技术中的技术方案，下面将对实施方案或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施方案，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1是本发明中固态加工方法的流程示意图；
图2是本发明的一种实施例的整体使用示意图；
图3是本发明在基材上进行固态加工的示意图；
图4是本发明无线式轴柄的一种实施例的结构示意图；
图5是本发明无线式轴柄的另一种实施例的结构示意图；
图6是本发明的主视结构示意图；
图7是本发明的斜视结构示意图；
图8是图6的俯视结构示意图；
图9是沿图8中A-A剖线所作出的剖视结构示意图；
图10是图9的D处的放大结构示意图；
图11是图8中沿B-B剖线所作出的剖视结构示意图；
图12是本发明的关于连接组件的一种实施例；
图13是图12的E处的放大结构示意图；
图14是本发明的关于连接组件的另一种实施例；
图15是图14的F处的放大结构示意图；
图16是无线智慧轴柄的主视结构示意图；
图17是图16中沿C-C剖线所作出的剖视结构示意图；
图18是无线智慧轴柄的斜视结构示意图；
图19是过渡主轴与应变测量组件的连接结构示意图；
图20是过渡主轴的分段结构示意图；
图21是过渡主轴上关于冷却段的结构示意图。
附图标记说明：
100、过渡主轴；200、加工部；300、控制装置；400、冷却装置；
500、第一温度监测组件；510、第二温度监测组件；600、定位件；700、
加热模块；800、连接组件；900、应变测量组件；1000、连接架；
110、支撑区；120、形变探测区；130、安装孔；140、螺纹通孔；150、
散热槽；
210、腔道；211、倾斜段；212、竖直段；212a、凹槽；220、螺纹构造；
310、保护套筒；320、集成电路板组件；321、无线收发模块；322、温
度控制面板；330、供电组件；
410、冷却套筒；420、冷却腔；430、自冷却组件；440、冷风枪；
810、磁吸件；820、固定卡扣；830、第一螺纹孔；
a、基材；b、焊缝。
具体实施方式
为了使本发明实现的技术手段、创作特征、达成目的与功效易于明白了解，下面结合具体图示，进一步阐述本发明。
为了解决上述技术问题，请参考附图进行理解，本申请的第一方面提出了一种固态加工方法，其步骤包括：
S100：将固态加工工具连接至过渡主轴100以通过机头驱动；在过渡主轴100的一侧安装固态加工工具，通过机头驱动过渡主轴100从而驱动固态加工工具进行旋转工作；
S200：如图3所示，启动固态加工设备并通过所述固态加工工具沿预定加工路线进行移动加工；启动固态加工设备从而带动机头、过渡主轴100、固态加工工具沿着基材a上的固态加工路线进行移动固态加工；
S300：在固态加工过程中，通过应变片测量所述过渡主轴100上形变探测区120的形变以监测所述过渡主轴100的压力和/或扭矩；在过渡主轴100的外侧黏贴多组应变片，其中至少有一组用于测量过渡主轴100的下压力，至少有一组用于测量过渡主轴100的扭矩；
S400:在固态加工过程中，通过第一温度监测组件500监测所述固态加工工具的温度；通过第一温度监测组件500实时监测固态加工工具的温度，得到实时参数，从而便于用户进行反馈调节；
S500：在固态加工过程中，通过第二温度监测组件510监测所述形变探测区120上的温度；在过渡主轴100的形变探测区120处设置第二温度监测组件510，通过第二温度监测组件510实时监测形变探测区120的温度，也可 以为应变片的温度，防止应变片处于较高或者较低的温度区域而用户不能得知该信息，从而导致及时测量结果不精准用户也无从知晓。
其中固态加工方法可以为搅拌摩擦焊焊接方法，也可以为固态增材制造方法，当固态加工方法为搅拌摩擦焊焊接方法时，固态加工工具为搅拌摩擦焊工具；当固态加工方法为固态增材制造方法时，固态加工工具为中空的搅拌工具。
在过渡主轴100的外侧具有控制装置300，在固态加工过程中通过控制装置300收发应变片、第一温度监测组件500以及第二温度监测组件510的无线信号；通过控制装置300将无线信号转化为在终端显示的数值，便于用户直观了解各种加工参数信息。在固态加工过程中，控制装置300内的集成电路板组件320收发应变片、第一温度监测组件500以及第二温度监测组件510的无线信号，并将对应信号在终端上进行显示，控制装置300内的供电组件330对集成电路板组件320进行供电；应变片、第一温度监测组件500、第二温度监测组件510都可以与集成电路板组件320进行连接，由于控制装置300与三者一起移动，因此信号的传输会更加稳定，也会使最终监测到的数据更加精准。根据探测到的主轴扭矩，压力和搅拌工具温度，来判断固态加工或加工参数是否合适，然后反馈给控制装置，之后做出响应，实时调整参数。
S110：在固态加工过程开始前，将应变片黏贴在过渡主轴100上的形变探测区120，并预先对应变片将要进行测量的力学数据例如压力、扭矩等进行标定。
S111：对压力的标定方法具体为，将过渡主轴100置于指定模具上，其底部固定，并从顶部施加已知大小的力，依次增大所施加的力，通过控制装 置300接收压力信号并对显示的压力信号进行标定。
S112：对扭矩的标定方法具体为，将过渡主轴100置于指定模具上，其底部固定，从其顶部施加已知大小的扭矩，依次增加，通过控制装置300接收扭矩信号并对显示的扭矩信号进行标定。
S113：在固态加工过程开始前，第一温度监测组件500伸入固态加工工具内部的腔道210靠近固态加工工具加工端的一端；从而使得固态加工过程中，通过第一温度监测组件500监测端实时监测所述固态加工工具的加工端温度，以免热量在传导的过程中被消耗，导致无法获取精准的温度信息。
S1131:通过在腔道210的竖直段212和倾斜段211的其中之一设置热电偶以监测所述固态加工工具的加工端温度，在腔道210的竖直段212和倾斜段211的其中另一设置定位件600以定位所述热电偶，防止热电偶在高速旋转的过程中发生移位或碰撞等现象。
S310:固态加工过程中，过渡主轴100的外侧具有冷却装置400，且冷却装置400朝向固态加工工具的一侧，通过所述冷却装置400将固态加工工具向所述过渡主轴100传递的热量进行冷却以避免过渡主轴100温度过高；由于过渡主轴100上设置控制装置300和应变片等电学元件，过高的温度容易使这些电学元件失准或失效，因此有必要将固态加工工具向过渡主轴100传导的热量进行冷却；同时，还可以通过设置在过渡主轴100和固态加工工具之间的隔热组件进行隔热；两种对过渡主轴100的冷却手段都可以进行使用；优选地，两种冷却手段同时使用，经现场使用，取消两者之一，过渡主轴100处会出现温度较高的情况，导致测量结果失准。
S311：冷却装置有多种实施例，其中有一种是冷却装置400包括转动连 接在过渡主轴100外侧的冷却套筒410，冷却套筒410内具有冷却模块以对过渡主轴100进行冷却，在固态加工过程中，其中过渡主轴100相对冷却套筒410进行转动，冷却套筒410不旋转，这种冷却装置设置的方法较为稳定可靠，就是冷却套筒要与机架固定连接，不能随过渡主轴100一起转动，可以称之为“有线式”。
S3111:冷却模块为在冷却套筒410内开设冷却腔420，固态加工过程中，通过控制进入冷却腔420内的流体温度或者流量从而达到控制冷却效率的目的；例如当需要冷却速率快一些时，可使流体温度更低，流体流速更快；当需要冷却速率慢一些则采取相反的措施即可。
S312:冷却装置的另一种为“无线式”冷却，即冷却装置400为固定连接在过渡主轴100外侧的自冷却组件430，在固态加工过程中，自冷却组件430跟随过渡主轴100同步旋转；该种方式使得整体结构体积小，重量轻，使用起来较为便利。
当然也会有其它的冷却方式可以使用，现只是举出几种可实施的方式便于理解。
S3121：自冷却组件430为半导体制冷片和/或风扇，在固态加工过程中，通过半导体制冷片和/或风扇对过渡主轴100进行散热；半导体制冷片具有小巧，轻便的效果，适用于跟随过渡主轴100进行旋转工作；而风扇则是具有本身成本低，安装简单等特点。同时不管是半导体还是风扇在安装的时候，都会将半导体制冷片和/或风扇均布在所述过渡主轴100外侧，以维持所述过渡主轴100的各处重量平衡，防止过渡主轴100在高速旋转中失衡；同时为进一步提高冷却效果，如图2所示，可通过冷风枪440辅助以进行更高效 率的制冷。
S510：当第二温度监测组件510监测到形变探测区120处的温度低于预设温度范围的最小值时，可通过控制加热模块700对该位置进行加热；预设温度范围可以根据实际需要进行相应数值的选取，例如10℃-20℃、20℃-30℃、30℃-40℃等等；当然预设温度的范围值也是可以选择的，前面只是写了10℃的范围区间，也可以是任意值，例如5℃、6℃的范围区间：10℃-15℃、20℃-25℃，10℃-16℃，20℃-26℃等等，具体地预设温度范围区间可根据情况的改变进行相应的改变；优选地，预设温度范围在室温范围内波动。
S520：当第二温度监测组件510监测到形变探测区120的温度高于预设温度范围的最大值时，可通过提高冷却装置400的冷却效率以减少从所述固态加工工具传导至所述过渡主轴100的热量；预设温度范围可以根据实际需要进行相应数值的选取，例如10℃-20℃、20℃-30℃、30℃-40℃等等；当然预设温度的范围值也是可以选择的，前面只是写了10℃的范围区间，也可以是任意值，例如5℃、6℃的范围区间：10℃-15℃、20℃-25℃，10℃-16℃，20℃-26℃等等，具体地预设温度范围区间可根据情况的改变进行相应的改变；优选地，预设温度范围在室温范围内波动。
通过S510以及S520两个步骤的结合，由于过渡主轴100的两端，一端是加热模块700，而靠近固态加工工具的一端是冷却装置400，中间是形变探测区120，也是应变片粘接的位置；如此可使得测力区域以上和以下一个加温一个降温从而动态控制，因为测力区域同步有温度被读取，这样，不论冬天夏天、刀柄是否工作发热，根据测力区域的温度值和上下加热散热就形成恒温控制，保障测试精度；也可以为根据第二温度监测组件510监测形变探测 区120温度，这个温度应该保持在固定温度附近(比如室温或校准时候的环境温度)，如果发现过渡区域实测温度低于此温度，加热部分工作，如果发现过渡区域实测温度高于此温度，冷却部分工作，保持过渡区域温度不发生很大偏移从而确保应变片的测量精度。
可选地，还有其他的控温方式，例如不需要使用加热模块，只改变进入冷却腔中的流体温度，例如进入冷却腔中的流体温度较高，此时的冷却腔就起到了加热作用，取代了加热模块，也可实现控温目的，这里只是对可能的实现方式进行描述，不应被视为对本案的限定。
关于形变探测区120处的温度对应变片测量的影响，也可以通过其他方式来进行取消，例如形变探测区120可自由升温或降温，但是在这之前先在不同温度下进行标定，温度可根据实际情况进行选择，温度较低时可以如-30℃、-20℃、-10℃标定等，也可以为0℃，15℃，20℃，30℃，40℃，50℃等，同时该温度应理解为温度范围，例如-50℃—100℃等，得到各个温度下应变测量数据的偏移值规律，将这个温度对应的误差矫正曲线输入在接收端里面，这样测试时候，也可不使用加热或冷却模块，初始温度很低(冬天)及之后搅拌头热量传上来温度过高时候，就可根据温度和接收到的信号，参考校准曲线得出正确的应变片数值(压力及扭矩)。
为实现智能化控制，本发明也可以配合使用UI界面，读取输入的模拟信号，读取PLC中关于机床坐标、XYZ运行速度数值，实现PLC路径控制，运动控制，如自动对刀、规划起点终点，设置主轴转速及Z下压速度、XY移动速度；实现针对固态加工过程中温度、扭矩、压力的数据记录，监控和闭环调整；在固态加工的过程中记录固态加工参数(如转速，工具移速，扎入 量)、特征曲线(温度、扭矩、压力)和视频，在录入对应材料种类后，汇总至工艺数据库中；结合AI人工智能，当固态加工过程中曲线出现异常后，软件控制PLC，从而对固态加工参数进行调整，实现闭环控制。针对固态加工过程进行分布控制，即在初始阶段，进行温度、力和扭矩的识别匹配，从而知道材料类别，之后从工艺库匹配工艺参数进行固态加工。
另一方面，本申请还提出了一种固态加工装置，固态加工装置为实施上述方法的固态加工装置。
包括应智慧轴柄以及与智慧轴柄可拆卸连接的加工部200，加工部200为固态加工工具；其中智慧轴柄，包括过渡主轴100，过渡主轴100的第一端连接驱动主轴，过渡主轴100的第二端用于连接加工部200；过渡主轴100的外侧安装控制装置300以及冷却装置400，冷却装置400位于控制装置300与加工部200之间；通过过渡主轴100对控制装置300、冷却装置400以及监测装置的部分起到承载供安装的作用；且冷却装置400设置在加工部200与控制装置300之间，能够有效降低从加工部200向控制装置300处传导的热量，从而对控制装置300进行保护；智慧轴柄还包括监测装置，监测装置与控制装置300相连，监测装置用于监测智慧轴柄的实时参数，并将参数传输给控制装置300，以便通过得到的数据对固态加工参数进行调整，实现加工位置处指标的优化和固态加工工具寿命的延长；其中参数可以包括但不限于温度、压力、扭矩、主轴转速，固态加工速度，下压深度等等数据。
如图9所示，监测装置包括第一温度监测组件500以及应变测量组件900，第一温度监测组件500用于监测加工部200的温度；应变测量组件900用于测量主轴的下压力和/或扭矩。
如图6-7以及图11所示，冷却装置400包括转动连接在过渡主轴100外侧的冷却套筒410，进一步地，转动连接可以为轴承连接；冷却套筒410通过连接架1000与机架固定连接，冷却套筒410内设置冷却模块。通过冷却套筒410可对其内的冷却模块起到支撑承载以及保护的作用；可选地，冷却模块包括设置在冷却套筒410内部的冷却腔420，冷却腔420开设有进口端以及出口端，冷却流体从进口端进入冷却腔420并从出口端流出从而带走过渡主轴100的热量，冷却流体包括液冷和气冷；液冷可以选用常规的水冷；气冷可用压缩空气、稀有气体、二氧化碳等气体进行强制对流。以上的冷却套筒410通过连接架1000与机架固定连接，连接架1000带动冷却装置400跟随机架进行多轴移动，过渡主轴100可带动控制装置300与监测装置一起转动，为了便于理解，作出更详细的解释如下：该种实施例中冷却装置400是不随过渡主轴100进行旋转的。
具体的，可采用例如以下的方式来实现过渡主轴100相对于冷却装置400进行转动，首先，冷却套筒410的内壁与过渡主轴100的外壁之间具有间隙以形成腔体，一支骨架油封置于腔体顶部，外侧与腔体配合，内侧与主轴延长套筒配合，封闭腔体顶部，在涂抹合成脂后可实现主轴套筒的转动密封。骨架油封下部有支撑环，其外径与腔体内径配合，支撑环下放置另一骨架油封，封闭腔体下部。最后，设置有紧定套筒(环)位于冷却套筒410的底部，紧定套筒(环)上边突出位置与骨架油封配合，并经四个螺丝与冷却套筒410连接，对骨架油封及定位环提供轴向的紧定，防止骨架油封和支撑环同过渡主轴100一起旋转。冷却套筒410的中部位置有两个螺纹孔，连接冷却腔420，用于连接水管进行冷却水的供给和排出。支撑环中空位置应对应冷却水入/出 口位置。以上这种方案只是若干种能实现冷却流体冷却过渡主轴100的方案之一，旨在便于理解技术方案，不应理解为起限定作用。
冷却装置400还有一种无线式用法，即冷却装置400包括固定设置在过渡主轴100外侧的自冷却组件430以及固定组件，自冷却组件430随过渡主轴100一起转动，自冷却组件430可以为半导体制冷片和/或风扇，半导体制冷片和/或风扇与控制装置300相连；优选地，半导体制冷片或风扇均可设置为多组，且均布在过渡主轴100的外侧，便于重量均匀分布。
如图2和/或图12所示，过渡主轴100外侧还设置有用于加热过渡主轴100的加热模块700，加热模块700与控制装置300相连，控制装置300可以包括控制面板，便于对需要加热的温度进行调控。可选地，如图2所示，加热模块700可以为热风枪，热风枪可以安装在连接架1000上，不随刀柄主体进行转动，当智慧刀柄在寒冷天气工作时，用于喷射热气流加热刀柄，调节测量区温度。
可选地，加热模块700也可以为电阻发热片等体积、重量较小的加热件，不管是冷却装置400固定不动还是冷却装置400随过渡主轴100一起转动都可以使用。
如图17，控制装置300包括集成电路板组件320以及供电组件330，集成电路板组件320与供电组件330相连，集成电路板组件320包括无线收发模块321(无线收发模块包括无线信号采集模块以及无线信号发射模块)以及温度控制面板322，无线收发模块321与监测装置、冷却装置400、加热模块700均相连，温度控制面板322与监测装置、冷却装置400、加热模块700均相连。
其中，第一温度监测组件500相关连接关系及配合使用过程详细描写如下，加工部200的内部开设腔道210，腔道210的第一端在加工部200的内部延伸至靠近加工部200的加工端，且腔道210的第一端内设置有第一温度监测组件500以实时监测加工部200的靠近加工端的温度；通过该设计能够避免热量在传导过程中大量损耗，从而采集更精准的温度信息，便于用户对温度进行实时监控；优选的，第一温度监测组件500可以为热电偶，热电偶测量范围广，测量精度高，可变形，适于用在本申请中；当然其他能够进入腔道210的可行的温度传感器例如热电阻也是可以根据实际需要进行选择的。
如图10，腔道210包括开设在加工部200内部的倾斜段211以及与倾斜段211连通的竖直段212，倾斜段211与竖直段212的其中之一用于插入第一温度监测组件500，倾斜段211与竖直段212两者中的另一用于安装定位件600以定位第一温度监测组件500，防止第一温度监测组件500在跟随轴柄以及加工部200高速转动的过程中发生移位和/或碰撞。
如图9-10、图12-15所示，定位件600为定位棒，定位棒的第一端用于定位第一温度监测组件500，定位棒的第二端通过连接组件800固定；可以理解的是，本申请中的定位件600并不局限于定位棒这一种实施例，只要能够类似于定位棒一般对第一温度监测组件500起到定位或固定作用的都可，例如卡扣夹持固定的方式等等；同时通过连接组件800对定位棒固定的方式也有多种，并不作特殊限定，以下举出几种便于理解技术方案：
在一种可选的实施方式中，如图9-10、图12-13所示，连接组件800包括开设在定位棒一端以及加工部200上的螺纹构造，定位棒上的螺纹构造与加工部200上的螺纹构造能够螺纹配合连接，采取螺纹连接的方式成本低， 且拆装较为方便；
在另一种可选的实施方式中，如图14-15所示，所述连接组件800为磁吸固定组件，所述磁吸固定组件吸附设置于所述加工部200朝向所述过渡主轴100的一侧，所述定位件600穿过所述磁吸固定组件以通过所述磁吸固定组件对所述定位件600进行固定；竖直段212进口端开设凹槽212a，凹槽212a内壁吸附有磁吸件810，磁吸件810的一侧吸附有固定卡扣820，固定卡扣820与磁吸件810沿过渡主轴100的轴向均开设通孔，定位棒(定位件600)穿过通孔后插入竖直段212中；定位棒与磁吸固定组件之间具备多种连接方式，例如定位棒为带磁性的金属，从而使得定位棒与磁吸件810之间吸附连接；也可从固定卡扣820的径向开设第一螺纹孔830，通过螺钉件穿过第一螺纹孔830从而将定位棒与磁吸固定组件固定连接。
请参阅图12，热电偶的第一端连接控制装置300(至于热电偶与控制装置300的连接方式，可以为热电偶直接接入控制装置300中；也可以为热电偶通过无线方式与控制装置300电连接)；具体地，热电偶的第一端同样连接的是控制装置300所包括的集成电路板组件320，通过集成电路板组件320同时传输加工部200的温度以及主轴的压力、扭矩等信息；热电偶的第二端抵接腔道210的第一端端部位置，通过热电偶的测量端尽量靠近加工部200的加工端，从而便于精准的测出加工端的实时温度；可选地，热电偶包括了以下两种设置方式，其一，如图所示，热电偶的第一端连接控制装置300(同上)，热电偶的第二端穿过过渡主轴100的内部后进入竖直段212并靠近加工部200的加工端；在过渡主轴的内部开设通道与腔道210连通，然后使热电偶先后穿过过渡主轴100内部的通道以及加工部200内部的腔道210，该种 热电偶的布置方式较为稳定可靠，不易使热电偶发生移位，也能够尽量减少外界因素对热电偶的干扰。其二，如图所示，热电偶的第一端还是连接控制装置300，热电偶的第二端则是沿过渡主轴100的外壁设置并从倾斜段211进入以靠近加工部200的加工端；热电偶和过渡主轴100、热电偶和加工部200之间均可以通过绑带和/或卡扣的连接方式固定；该种把热电偶设计在过渡主轴100外侧的方法，不需要在过渡主轴100内进行开孔，使用成本较小。
应变测量组件900的连接关系以及配合使用过程详细描述如下：应变测量组件900用于测量驱动主轴的下压力和/或扭矩；通过探测延长的过渡主轴100的形变从而实时探测固态加工过程中的压力、扭矩，以便通过得到的数据对固态加工参数进行调整，实现加工位置处指标的优化和固态加工工具寿命的延长。
优选地，如图5所示，应变测量组件900包括连接在过渡主轴100外侧的一组或多组应变片，可选地，应变片采取粘接的方式固定在过渡主轴100的外侧；当应变片只有一组时，应变片用来测量驱动主轴下压力或者测量驱动主轴的扭矩；当应变片为多组时，其中至少有一组是用来测量驱动主轴下压力，至少有一组用来测量驱动主轴的扭矩；应变片选用半桥应变片或者全桥应变片；同时为了保证过渡主轴100上的重量均匀分布，应变片在过渡主轴100的外侧均匀分布；可选地，应变测量组件900也可以采用在过渡主轴100外侧设置压力传感器和/或扭矩传感器的方式。
如图9所示，过渡主轴100延其轴向可分为多段，包括形变探测区120以及位于形变探测区120两侧的支撑区110，其中支撑区110用于安装保护套筒310，形变探测区120则用于安装应变测量组件900；保护套筒310与过渡 主轴100之间形成空腔，形变探测区120外侧安装的应变测量组件900(应变片)位于空腔内；保护套筒310内开设安装槽，安装槽内安装集成电路板组件320，同时，空腔或者安装槽内还安装有供电组件330，供电组件330以及应变测量组件900均与所述集成电路板组件320相连，通过供电组件330为集成电路板组件320供电，集成电路板组件320则至少包括了无线信号采集模块、无线信号发射模块，以对应变测量组件900的测量信号进行收发；以上保护套筒310结构设计起到的作用，其一，保护套筒310可对应变测量组件900起到保护作用；其二，保护套筒310的空腔结构设计可以减重；其三，空腔内还可容纳集成电路板组件320以及供电组件330等。优选地，保护套筒310采用尼龙等不会阻挡无线信号传输的高分子材料制成，进一步地，保护套筒310为增材制造；可选地，保护套筒310通过多个螺丝固定在过渡主轴外侧；同样，为了保证过渡主轴100上的重量均匀分布，多个螺丝最好也是在过渡主轴100的周向上均匀设置。
可选地，为了实现固态加工不同材料时控制对固态加工主轴压力和扭矩量程的变化，如需要量程更小精度更高的力学测量，即过渡主轴100在进行固态加工接时的形变量需要更大，因此形变探测位置(用于黏贴应变片位置)直径可以相应缩小，其结构、材料等均可作出相应调整；具体而言，可以使形变探测区120对应部分的过渡主轴100的直径小于支撑区110对应部分的过渡主轴100的直径；优选地，形变探测区120与支撑区110之间平滑过渡，便于驱动主轴的下压力和扭矩都能够无阻碍的传输到形变探测区120上的应变测量组件900。
优选地，在形变探测区120处设置第二温度监测组件510，第二温度监测 组件510位于空腔内，第二温度监测组件510可以为热电偶或热电阻等温度测量元件，以热电偶举例，热电偶的一端连接集成电路板组件320，热电偶的另一端用于实时测量形变探测区120的温度。
可选地，支撑区110的支撑位置上可设有橡胶圈这种类似增加摩擦力的配件，以防止保护套筒310出现沿过渡主轴100轴向打滑的现象。
如图20所示，过渡主轴100不但可以包括以上的支撑区110以及形变探测区120，还可以包括冷却段；优选地，冷却段位于保护套筒310朝向加工部200的一侧，以防止过高的热量从加工部200向集成电路板组件320以及供电组件330处传导；冷却段的外侧设置冷却装置400对传导至冷却段处的热量进行快速冷却，以有效保护集成电路板组件320以及供电组件330不受损；优选地，冷却段的外侧开设散热槽150。
在实际使用中发现加工部200的热量还是会传导至过渡主轴上的形变探测区120处，引起测量的数据不准确；因此，优选地，在过渡主轴100的形变探测区120与加工部200之间设置环形隔热组件；环形隔热组件的位置可根据轴柄结构进行选择性安装；环形隔热组件的设置还需满足既可以传导驱动主轴下压力，又可以隔绝或减少加工部200传导至形变探测区120的热量；进一步地，环形隔热组件的材质为云母、耐高温碳纤维合成石板等耐高温抗压材料；至于隔热组件的形状、尺寸、数量可以根据实际需求进行选用
优选地，过渡主轴100的第一端连接驱动主轴，过渡主轴100的第二端开设有与固态加工工具同轴的安装孔130，固态加工工具插入安装孔130中并与过渡主轴100固定连接；可选地，如图9所示，在安装孔130的侧壁开设有一个或多个螺纹通孔140，以便于通过螺纹件穿过螺纹通孔140从而对安装 孔130内的固态加工工具进行固定；该种将固态加工工具的一段插入安装孔130内的设计，使得固态加工工具头与安装孔130的内壁接触面大，更加有利于对固态加工工具的固定。当然过渡主轴100也可以通过其他方式与固态加工工具连接，例如在过渡主轴100和固态加工工具上都设计有螺纹构造等手段；可以理解的是，以上两种手段只是为了便于理解本申请内容所作出的阐述，并不对其构成限定。
本实施例的附图中相同或相似的标号对应相同或相似的部件；在本申请的描述中，需要理解的是，若有术语“上”、“下”、“左”、“右”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此附图中描述位置关系的用语仅用于示例性说明，不能理解为对本专利的限制，对于本领域的普通技术人员而言，可以根据具体情况理解上述术语的具体含义。
以上显示和描述了本发明的基本原理和主要特征和本发明的优点。本行业的技术人员应该了解，本发明不受上述实施例的限制，上述实施例和说明书中描述的只是说明本发明的原理，在不脱离本发明精神和范围的前提下，本发明还会有各种变化和改进，这些变化和改进都落入要求保护的本发明范围内。本发明要求保护范围由所附的权利要求书及其等效物界定。

Claims (18)

  1. 一种固态加工方法，其特征在于，所述固态加工方法步骤包括：
    将固态加工工具连接至过渡主轴(100)以通过机头驱动；
    启动固态加工设备并通过所述固态加工工具沿预定加工路线进行移动加工；
    固态加工过程中，通过应变片测量所述过渡主轴(100)上形变探测区(120)的形变以监测所述过渡主轴(100)的压力和/或扭矩；
    通过第一温度监测组件(500)监测所述固态加工工具的温度；
    通过第二温度监测组件(510)监测所述形变探测区(120)上的温度。
  2. 如权利要求1所述的固态加工方法，其特征在于，所述固态加工方法为搅拌摩擦焊焊接方法或固态增材制造方法。
  3. 如权利要求1所述的固态加工方法，其特征在于，固态加工过程中，通过应变片测量所述过渡主轴(100)上形变探测区(120)的形变以监测所述过渡主轴(100)的压力和/或扭矩；通过第一温度监测组件(500)监测所述固态加工工具的温度；通过第二温度监测组件(510)监测所述形变探测区(120)上的温度的步骤包括：
    所述过渡主轴(100)的外侧具有控制装置(300)，在固态加工过程中通过控制装置(300)采集与发射应变片、第一温度监测组件(500)以及第二温度监测组件(510)的无线信号。
  4. 如权利要求3所述的固态加工方法，其特征在于，所述过渡主轴(100)的外侧具有控制装置(300)，在固态加工过程中通过控制装置(300)收发应变片、第一温度监测组件(500)以及第二温度监测组件(510)的无线信号的步骤包括：
    在固态加工过程中，控制装置(300)内的集成电路板组件(320)收发应变片、第一温度监测组件(500)以及第二温度监测组件(510)的无线信号，并将对应信号在终端上进行显示，控制装置(300)内的供电组件(330)对集成电路板组件(320)进行供电。
  5. 如权利要求1所述的固态加工方法，其特征在于，在固态加工过程开始前，将应变片黏贴在所述过渡主轴(100)上的形变探测区(120)，以对压力和/或扭矩测量进行标定。
  6. 如权利要求5所述的固态加工方法，其特征在于，在固态加工过程开始前，将应变片黏贴在所述过渡主轴(100)上的形变探测区(120)，以对压力和/或扭矩测量进行标定的步骤包括：
    对压力的标定方法，将所述过渡主轴(100)置于指定模具上，其底部固定，并从顶部施加已知大小的力，依次增大所施加的力，通过控制装置(300)接收压力信号并对显示的压力信号进行标定。
  7. 如权利要求5所述的固态加工方法，其特征在于，在固态加工过程开始前，将应变片黏贴在所述过渡主轴(100)上的形变探测区(120)，以对压力和/或扭矩测量进行标定的步骤包括：
    对扭矩的标定方法，将所述过渡主轴(100)置于指定模具上，其底部固定，从其顶部施加已知大小的扭矩，依次增加，通过控制装置(300)接收扭矩信号并对显示的扭矩信号进行标定。
  8. 如权利要求1所述的固态加工方法，其特征在于，
    在固态加工过程开始前，第一温度监测组件(500)伸入所述固态加工工具内部的腔道(210)靠近所述固态加工工具加工端的一端；从而使得固态加 工过程中，通过所述第一温度监测组件(500)的监测端实时监测所述固态加工工具的加工端温度。
  9. 如权利要求8所述的固态加工方法，其特征在于，在固态加工过程开始前，第一温度监测组件(500)伸入所述固态加工工具内部的腔道(210)靠近所述固态加工工具加工端的一端；从而使得固态加工过程中，通过所述第一温度监测组件(500)的监测端实时监测所述固态加工工具的加工端温度的步骤包括：
    通过在腔道(210)的竖直段(212)和倾斜段(211)的其中之一设置热电偶以监测所述固态加工工具的加工端温度，在腔道(210)的竖直段(212)和倾斜段(211)的其中另一设置定位件(600)以定位所述热电偶。
  10. 如权利要求2-9任一项所述的固态加工方法，其特征在于，固态加工过程中，所述过渡主轴(100)的外侧具有冷却装置(400)，通过所述冷却装置(400)将固态加工工具向所述过渡主轴(100)传递的热量进行冷却以避免所述过渡主轴(100)温度过高。
  11. 如权利要求10所述的固态加工方法，其特征在于，固态加工过程中，所述过渡主轴(100)的外侧具有冷却装置(400)，且所述冷却装置(400)朝向所述固态加工工具的一侧，通过所述冷却装置(400)将固态加工工具向所述过渡主轴(100)传递的热量进行冷却以避免所述过渡主轴(100)温度过高的步骤包括：
    所述冷却装置(400)为固定连接在所述过渡主轴(100)外侧的自冷却组件(430)，在固态加工过程中，所述自冷却组件(430)跟随所述过渡主轴(100)同步旋转；或为转动连接在所述过渡主轴(100)外侧的冷却套筒 (410)，所述冷却套筒(410)内具有冷却模块以对所述过渡主轴(100)进行冷却，在固态加工过程中，其中所述过渡主轴(100)相对冷却套筒(410)进行转动，冷却套筒(410)不旋转。
  12. 如权利要求11所述的固态加工方法，其特征在于，所述冷却装置(400)为固定连接在所述过渡主轴(100)外侧的自冷却组件(430)，在固态加工过程中，所述自冷却组件(430)跟随所述过渡主轴(100)同步旋转的步骤包括：
    所述自冷却组件(430)为半导体制冷片和/或风扇，在固态加工过程中，通过半导体制冷片和/或风扇对所述过渡主轴(100)进行散热；且半导体制冷片和/或风扇均布在所述过渡主轴(100)外侧，以维持所述过渡主轴(100)的各处重量平衡。
  13. 如权利要求11所述的固态加工方法，其特征在于，所述冷却装置(400)包括转动连接在所述过渡主轴(100)外侧的冷却套筒(410)，所述冷却套筒(410)内具有冷却模块以对所述过渡主轴(100)进行冷却，在固态加工过程中，其中所述过渡主轴(100)相对冷却套筒(410)进行转动，冷却套筒(410)不旋转的步骤包括：
    所述冷却套筒(410)内开设冷却腔(420)，固态加工过程中，通过控制进入冷却腔(420)内的流体温度或者流量从而达到控制冷却效率的目的。
  14. 如权利要求1-9任一项所述的固态加工方法，其特征在于，当第二温度监测组件(510)监测到形变探测区(120)处的温度低于预设温度范围的最小值时，可通过加热模块(700)对该位置进行加热。
  15. 如权利要求10所述的固态加工方法，其特征在于，当第二温度监测 组件(510)监测到形变探测区(120)的温度高于预设温度范围的最大值时，可通过提高冷却装置(400)的冷却效率以减少从所述固态加工工具传导至所述过渡主轴(100)的热量。
  16. 根据权利要求2-9任一项所述的固态加工方法，其特征在于，为实现对形变探测区(120)的恒温控制，在固态加工过程开始前，对不同温度进行标定，得到各个温度下应变片测量数据的偏移值规律，以形成与这些温度值对应的误差矫正曲线并输入至控制装置(300)，通过参考曲线即可得出正确应变片测量数值。
  17. 如权利要求1-9任一项所述的固态加工方法，其特征在于，在固态加工过程开始前，在所述过渡主轴(100)和固态加工工具之间安装环形隔热组件以减少加工过程中固态加工工具产生的热量向过渡主轴(100)进行传导。
  18. 固态加工装置，其特征在于，所述固态加工装置为实施权利要求1-17中任一项所述方法的固态加工装置。
PCT/CN2024/082799 2023-06-27 2024-03-20 固态加工方法及固态加工装置 Ceased WO2025001336A1 (zh)

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