AP2015008585A0 - Semiconductor device having features to prevent reverse engineering - Google Patents

Semiconductor device having features to prevent reverse engineering

Info

Publication number
AP2015008585A0
AP2015008585A0 AP2015008585A AP2015008585A AP2015008585A0 AP 2015008585 A0 AP2015008585 A0 AP 2015008585A0 AP 2015008585 A AP2015008585 A AP 2015008585A AP 2015008585 A AP2015008585 A AP 2015008585A AP 2015008585 A0 AP2015008585 A0 AP 2015008585A0
Authority
AP
ARIPO
Prior art keywords
features
semiconductor device
reverse engineering
prevent reverse
engineering
Prior art date
Application number
AP2015008585A
Other languages
English (en)
Inventor
Michael Clinton Hoke
Robert Francis Tenczar
William Eli Thacker
Original Assignee
Secure Silicon Layer Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/739,401 external-priority patent/US20130320491A1/en
Application filed by Secure Silicon Layer Inc filed Critical Secure Silicon Layer Inc
Publication of AP2015008585A0 publication Critical patent/AP2015008585A0/xx

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00Arrangements for protection of devices
    • H10W42/40Arrangements for protection of devices protecting against tampering, e.g. unauthorised inspection or reverse engineering
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
AP2015008585A 2013-01-11 2014-01-03 Semiconductor device having features to prevent reverse engineering AP2015008585A0 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/739,401 US20130320491A1 (en) 2011-06-07 2013-01-11 Semiconductor Device Having Features to Prevent Reverse Engineering
PCT/US2014/010185 WO2014109961A1 (fr) 2013-01-11 2014-01-03 Dispositif à semi-conducteur dotés de caractéristiques permettant d'empêcher l'ingénierie inverse

Publications (1)

Publication Number Publication Date
AP2015008585A0 true AP2015008585A0 (en) 2015-07-31

Family

ID=51167305

Family Applications (1)

Application Number Title Priority Date Filing Date
AP2015008585A AP2015008585A0 (en) 2013-01-11 2014-01-03 Semiconductor device having features to prevent reverse engineering

Country Status (7)

Country Link
EP (1) EP2943979A4 (fr)
CN (1) CN104969345B (fr)
AP (1) AP2015008585A0 (fr)
CA (1) CA2897082A1 (fr)
EA (1) EA201591224A1 (fr)
MX (2) MX374662B (fr)
WO (1) WO2014109961A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7109755B2 (ja) * 2018-02-15 2022-08-01 株式会社吉川システック 半導体装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4766516A (en) * 1987-09-24 1988-08-23 Hughes Aircraft Company Method and apparatus for securing integrated circuits from unauthorized copying and use
US4933898A (en) * 1989-01-12 1990-06-12 General Instrument Corporation Secure integrated circuit chip with conductive shield
US5783846A (en) * 1995-09-22 1998-07-21 Hughes Electronics Corporation Digital circuit with transistor geometry and channel stops providing camouflage against reverse engineering
US20020096744A1 (en) * 2001-01-24 2002-07-25 Hrl Laboratories, Llc Integrated circuits protected against reverse engineering and method for fabricating the same using etched passivation openings in integrated circuits
US7135734B2 (en) * 2001-08-30 2006-11-14 Micron Technology, Inc. Graded composition metal oxide tunnel barrier interpoly insulators
JP2010016164A (ja) 2008-07-03 2010-01-21 Nec Electronics Corp 半導体集積回路の設計方法、製造方法、回路設計プログラム、及び半導体集積回路
US20120313664A1 (en) * 2011-06-07 2012-12-13 Static Control Components, Inc. Semiconductor Device Having Features to Prevent Reverse Engineering

Also Published As

Publication number Publication date
WO2014109961A1 (fr) 2014-07-17
MX348002B (es) 2017-01-05
EA201591224A1 (ru) 2016-02-29
EP2943979A1 (fr) 2015-11-18
MX374662B (es) 2025-03-06
CA2897082A1 (fr) 2014-07-17
MX2015008948A (es) 2015-09-28
CN104969345B (zh) 2018-12-07
EP2943979A4 (fr) 2017-05-17
CN104969345A (zh) 2015-10-07

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