AT138568B - Copper-aluminum-beryllium alloys. - Google Patents
Copper-aluminum-beryllium alloys.Info
- Publication number
- AT138568B AT138568B AT138568DA AT138568B AT 138568 B AT138568 B AT 138568B AT 138568D A AT138568D A AT 138568DA AT 138568 B AT138568 B AT 138568B
- Authority
- AT
- Austria
- Prior art keywords
- copper
- aluminum
- beryllium
- alloys
- beryllium alloys
- Prior art date
Links
- 229910000952 Be alloy Inorganic materials 0.000 title description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 7
- 239000000956 alloy Substances 0.000 claims description 7
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 2
- 229910052750 molybdenum Inorganic materials 0.000 claims description 2
- 239000011733 molybdenum Substances 0.000 claims description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 2
- 229910052721 tungsten Inorganic materials 0.000 claims description 2
- 239000010937 tungsten Substances 0.000 claims description 2
- 229910052720 vanadium Inorganic materials 0.000 claims description 2
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052790 beryllium Inorganic materials 0.000 description 5
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 238000005496 tempering Methods 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052793 cadmium Inorganic materials 0.000 description 2
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 238000010791 quenching Methods 0.000 description 2
- 230000000171 quenching effect Effects 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- -1 witan Chemical compound 0.000 description 1
Landscapes
- Refinement Of Pig-Iron, Manufacture Of Cast Iron, And Steel Manufacture Other Than In Revolving Furnaces (AREA)
Description
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Kupfer- Aluminium- Beryllium-Legierungen.
Kupfer-Aluminium-Beryllium-Legierungen mit mindestens 50% Kupfer, die gegebenenfalls eines oder mehrere der Elemente Eisen, Nickel, Chrom, Mangan, Magnesium, Witan, Zink, Zinn, Cadmium und Phosphor enthalten, sind bereits anderweitig patentiert. Derartige Legierungen sind vergütbar durch Erhitzung auf 500-800 C, einen Absehreckprozess und eine neue Erhitzung auf 250-500 C während längerer Zeit.
Die Erfindung bezieht sich auf Kupfer-Aluminium-Beryllium-Legierungen der erwähnten Art.
Gemäss der Erfindung wird in solchen Legierungen ein Beryllium-und ein Siliziumgehalt von je 0'l-5 % angewendet. Gewünschtenfalls kann man noch einen geringen Zusatz von Wolfram, Molybdän und (oder) Vanadium verwenden. Die erfindungsgemässen Legierungen zeichnen sich durch gute technische Eigenschaften, insbesondere hohe Härte und Festigkeit aus, hauptsächlich wenn sie einer thermischen Vergütungsbehandlung nach Art der oben angegebenen unterworfen worden sind.
Ausführungsbeispiele :
1. Eine Legierung, welche 6 % Aluminium, 3 % Mangan, 1 % Silizium, 1'5 % Beryllium, Rest Kupfer enthielt, zeigte nach Abschrecken in Flüssigkeit oder hinreichend schneller Abkühlung an der Luft von 8500 C eine Härte von 217 Brinell. Durch etwa zehnstündiges Anlassen auf 350 C liess sich die Härte auf 311 Brinell steigern.
2. Eine Legierung, welche 9 % Aluminium, 3 % Silizium, 1 % Beryllium, 0'05 % Phosphor, Rest Kupfer enthielt, hatte nach Abschrecken von etwa 800 C eine Härte von 239 Brinell, die sich durch etwa halbstündiges Anlassen auf 380 C auf 404 Brinell steigern liess.
Ausser der Härte wird durch die thermische Vergütung auch die Zerreissfestigkeit verbessert. Von den gegebenenfalls zur Anwendung gelangenden Zusätzen kommen meist nur geringe Mengen von etwa 0'1 bis höchstens etwa 12 % in Betracht. Jedoch können auch von manchen Zusätzen, insbesondere von Nickel, bis zu etwa 45 % in den neuen Legierungen anwesend sein. Der Kupfergehalt beträgt in allen Fällen mindestens 50 %, und die Gehalte an Beryllium und an Silizium liegen stets zwischen 0'1-5 %.
PATENT-ANSPRÜCHE :
1. Kupfer-Aluminium-Beryllium-Legierungen mit mindestens 50% Kupfer, die gegebenenfalls eines oder mehrere der Elemente Eisen, Nickel, Chrom, Mangan, Magnesium, Titan, Zink, Zinn, Cadmium und Phosphor enthält, dadurch gekennzeichnet, dass der Beryllium-und der Siliziumgehalt je 0'1-5 % betragen.
**WARNUNG** Ende DESC Feld kannt Anfang CLMS uberlappen**.
<Desc / Clms Page number 1>
Copper-aluminum-beryllium alloys.
Copper-aluminum-beryllium alloys with at least 50% copper, which may contain one or more of the elements iron, nickel, chromium, manganese, magnesium, witan, zinc, tin, cadmium and phosphorus, have already been patented elsewhere. Such alloys can be hardened and tempered by heating to 500-800 C, a reticulation process and heating to 250-500 C for a longer period of time.
The invention relates to copper-aluminum-beryllium alloys of the type mentioned.
According to the invention, a beryllium and a silicon content of 0.1-5% each are used in such alloys. If desired, a small addition of tungsten, molybdenum and (or) vanadium can also be used. The alloys according to the invention are distinguished by good technical properties, in particular high hardness and strength, mainly when they have been subjected to a thermal tempering treatment of the type indicated above.
Embodiments:
1. An alloy which contained 6% aluminum, 3% manganese, 1% silicon, 1'5% beryllium, the remainder copper, showed a hardness of 217 Brinell after quenching in liquid or sufficiently rapid cooling in air at 8500 C. Tempering at 350 C for about ten hours increased the hardness to 311 Brinell.
2. An alloy which contained 9% aluminum, 3% silicon, 1% beryllium, 0'05% phosphorus, the remainder copper, had a hardness of 239 Brinell after quenching at approx. 800 C, which was hardened to 380 C for about half an hour to 404 Brinell.
In addition to the hardness, the thermal tempering also improves the tensile strength. Of the additives that may be used, only small amounts of about 0.1 to a maximum of about 12% are usually considered. However, up to about 45% of some additives, particularly nickel, can also be present in the new alloys. The copper content is at least 50% in all cases, and the beryllium and silicon contents are always between 0.1-5%.
PATENT CLAIMS:
1. Copper-aluminum-beryllium alloys with at least 50% copper, which optionally contains one or more of the elements iron, nickel, chromium, manganese, magnesium, titanium, zinc, tin, cadmium and phosphorus, characterized in that the beryllium and the silicon content each be 0.1-5%.
** WARNING ** End of DESC field may overlap beginning of CLMS **.
Claims (1)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE138568X | 1931-10-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AT138568B true AT138568B (en) | 1934-08-25 |
Family
ID=5667359
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT138568D AT138568B (en) | 1931-10-17 | 1932-10-15 | Copper-aluminum-beryllium alloys. |
Country Status (1)
| Country | Link |
|---|---|
| AT (1) | AT138568B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3753696A (en) * | 1970-09-02 | 1973-08-21 | Ngk Insulators Ltd | High strength copper alloy having an excellent formability and process for producing the same |
| US3830644A (en) * | 1969-09-19 | 1974-08-20 | Hitachi Shipbuilding Eng Co | Copper alloy for plastic-working molds |
-
1932
- 1932-10-15 AT AT138568D patent/AT138568B/en active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3830644A (en) * | 1969-09-19 | 1974-08-20 | Hitachi Shipbuilding Eng Co | Copper alloy for plastic-working molds |
| US3753696A (en) * | 1970-09-02 | 1973-08-21 | Ngk Insulators Ltd | High strength copper alloy having an excellent formability and process for producing the same |
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