AT261711B - Mikroverbindung für mikrominiaturisierte Schaltungselemente und Verfahren zu ihrer Herstellung - Google Patents

Mikroverbindung für mikrominiaturisierte Schaltungselemente und Verfahren zu ihrer Herstellung

Info

Publication number
AT261711B
AT261711B AT1065264A AT1065264A AT261711B AT 261711 B AT261711 B AT 261711B AT 1065264 A AT1065264 A AT 1065264A AT 1065264 A AT1065264 A AT 1065264A AT 261711 B AT261711 B AT 261711B
Authority
AT
Austria
Prior art keywords
micro
production
connection
circuit elements
miniaturized circuit
Prior art date
Application number
AT1065264A
Other languages
English (en)
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Application granted granted Critical
Publication of AT261711B publication Critical patent/AT261711B/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3478—Application of solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10234—Metallic balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10992—Using different connection materials, e.g. different solders, for the same connection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
AT1065264A 1963-12-27 1964-12-16 Mikroverbindung für mikrominiaturisierte Schaltungselemente und Verfahren zu ihrer Herstellung AT261711B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US333863A US3303393A (en) 1963-12-27 1963-12-27 Terminals for microminiaturized devices and methods of connecting same to circuit panels

Publications (1)

Publication Number Publication Date
AT261711B true AT261711B (de) 1968-05-10

Family

ID=23304578

Family Applications (1)

Application Number Title Priority Date Filing Date
AT1065264A AT261711B (de) 1963-12-27 1964-12-16 Mikroverbindung für mikrominiaturisierte Schaltungselemente und Verfahren zu ihrer Herstellung

Country Status (6)

Country Link
US (1) US3303393A (de)
AT (1) AT261711B (de)
CA (1) CA976663A (de)
CH (1) CH439433A (de)
GB (1) GB1089878A (de)
NL (1) NL6411284A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1051265A4 (de) * 1998-01-30 2004-04-07 Henkel Loctite Corp Verfahren zum aufbringen einer beschichtung auf eine nicht-wahlfreie monolage von partikeln

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3456159A (en) * 1963-08-08 1969-07-15 Ibm Connections for microminiature functional components
US3381081A (en) * 1965-04-16 1968-04-30 Cts Corp Electrical connection and method of making the same
US3429040A (en) * 1965-06-18 1969-02-25 Ibm Method of joining a component to a substrate
US3373481A (en) * 1965-06-22 1968-03-19 Sperry Rand Corp Method of electrically interconnecting conductors
FR1483574A (de) * 1965-06-24 1967-09-06
US3436818A (en) * 1965-12-13 1969-04-08 Ibm Method of fabricating a bonded joint
US3458925A (en) * 1966-01-20 1969-08-05 Ibm Method of forming solder mounds on substrates
US3539882A (en) * 1967-05-22 1970-11-10 Solitron Devices Flip chip thick film device
DE2044494B2 (de) * 1970-09-08 1972-01-13 Siemens AG, 1000 Berlin u 8000 München Anschlussflaechen zum anloeten von halbleiterbausteinen in flip chip technik
US3698073A (en) * 1970-10-13 1972-10-17 Motorola Inc Contact bonding and packaging of integrated circuits
JPS5535238B2 (de) * 1975-01-24 1980-09-12
JPS55126983A (en) * 1979-03-26 1980-10-01 Hitachi Ltd Discharge gap
US4439813A (en) * 1981-07-21 1984-03-27 Ibm Corporation Thin film discrete decoupling capacitor
US4661192A (en) * 1985-08-22 1987-04-28 Motorola, Inc. Low cost integrated circuit bonding process
US4788767A (en) * 1987-03-11 1988-12-06 International Business Machines Corporation Method for mounting a flexible film semiconductor chip carrier on a circuitized substrate
US5159535A (en) * 1987-03-11 1992-10-27 International Business Machines Corporation Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate
US5170931A (en) * 1987-03-11 1992-12-15 International Business Machines Corporation Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate
US4831494A (en) * 1988-06-27 1989-05-16 International Business Machines Corporation Multilayer capacitor
US5068714A (en) * 1989-04-05 1991-11-26 Robert Bosch Gmbh Method of electrically and mechanically connecting a semiconductor to a substrate using an electrically conductive tacky adhesive and the device so made
US4979664A (en) * 1989-11-15 1990-12-25 At&T Bell Laboratories Method for manufacturing a soldered article
US5076485A (en) * 1990-04-24 1991-12-31 Microelectronics And Computer Technology Corporation Bonding electrical leads to pads with particles
US5866951A (en) * 1990-10-12 1999-02-02 Robert Bosch Gmbh Hybrid circuit with an electrically conductive adhesive
JP2562661Y2 (ja) * 1992-10-13 1998-02-16 株式会社村田製作所 圧電素子の実装構造
JP3360179B2 (ja) * 1994-09-06 2002-12-24 ザ ウィタカー コーポレーション ボールグリッドアレーソケット
US5542174A (en) * 1994-09-15 1996-08-06 Intel Corporation Method and apparatus for forming solder balls and solder columns
US5547740A (en) * 1995-03-23 1996-08-20 Delco Electronics Corporation Solderable contacts for flip chip integrated circuit devices
US5801446A (en) * 1995-03-28 1998-09-01 Tessera, Inc. Microelectronic connections with solid core joining units
JPH0982760A (ja) * 1995-07-07 1997-03-28 Toshiba Corp 半導体装置、半導体素子およびその半田接続部検査方法
US6162661A (en) * 1997-05-30 2000-12-19 Tessera, Inc. Spacer plate solder ball placement fixture and methods therefor
US6002168A (en) 1997-11-25 1999-12-14 Tessera, Inc. Microelectronic component with rigid interposer
US6573609B2 (en) 1997-11-25 2003-06-03 Tessera, Inc. Microelectronic component with rigid interposer
US6621168B2 (en) * 2000-12-28 2003-09-16 Intel Corporation Interconnected circuit board assembly and system
US7053491B2 (en) 2002-02-04 2006-05-30 Intel Corporation Electronic assembly having composite electronic contacts for attaching a package substrate to a printed circuit board
JP2012028513A (ja) * 2010-07-22 2012-02-09 Elpida Memory Inc 半導体装置及びその製造方法
USD673963S1 (en) * 2011-10-19 2013-01-08 MIMOCO, Inc. USB drive
USD673962S1 (en) * 2011-10-24 2013-01-08 MIMOCO, Inc. USB drive and card reader with body
CN109788643B (zh) * 2017-11-10 2024-07-30 泰连公司 铝基可焊接的触头
KR102952543B1 (ko) * 2021-07-08 2026-04-14 삼성전자주식회사 솔더볼과 탄성체를 기반으로 연결되는 기판 구조

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3148310A (en) * 1964-09-08 Methods of making same
US3143787A (en) * 1960-10-03 1964-08-11 Air Logistics Corp Printed circuit board and method of making the same
US3193789A (en) * 1962-08-01 1965-07-06 Sperry Rand Corp Electrical circuitry

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1051265A4 (de) * 1998-01-30 2004-04-07 Henkel Loctite Corp Verfahren zum aufbringen einer beschichtung auf eine nicht-wahlfreie monolage von partikeln

Also Published As

Publication number Publication date
CA976663A (en) 1975-10-21
CH439433A (de) 1967-07-15
NL6411284A (de) 1965-06-28
GB1089878A (en) 1967-11-08
US3303393A (en) 1967-02-07

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