AT278464B - Additive for copper electroplating baths and bath for electroplating with copper - Google Patents

Additive for copper electroplating baths and bath for electroplating with copper

Info

Publication number
AT278464B
AT278464B AT505968A AT505968A AT278464B AT 278464 B AT278464 B AT 278464B AT 505968 A AT505968 A AT 505968A AT 505968 A AT505968 A AT 505968A AT 278464 B AT278464 B AT 278464B
Authority
AT
Austria
Prior art keywords
copper
electroplating
bath
additive
baths
Prior art date
Application number
AT505968A
Other languages
German (de)
Inventor
Charles N Abbott
Original Assignee
Dayton Bright Copper Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dayton Bright Copper Company filed Critical Dayton Bright Copper Company
Application granted granted Critical
Publication of AT278464B publication Critical patent/AT278464B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
AT505968A 1967-06-05 1968-05-27 Additive for copper electroplating baths and bath for electroplating with copper AT278464B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US643405A US3373095A (en) 1967-06-05 1967-06-05 Electroplating of copper

Publications (1)

Publication Number Publication Date
AT278464B true AT278464B (en) 1970-02-10

Family

ID=24580675

Family Applications (1)

Application Number Title Priority Date Filing Date
AT505968A AT278464B (en) 1967-06-05 1968-05-27 Additive for copper electroplating baths and bath for electroplating with copper

Country Status (10)

Country Link
US (1) US3373095A (en)
AT (1) AT278464B (en)
BE (1) BE716104A (en)
DE (1) DE1771447C2 (en)
ES (1) ES354519A1 (en)
FR (1) FR1569546A (en)
LU (1) LU56200A1 (en)
NL (1) NL6807883A (en)
NO (1) NO120960B (en)
SE (1) SE345879B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4009087A (en) * 1974-11-21 1977-02-22 M&T Chemicals Inc. Electrodeposition of copper
CN111593375A (en) * 2020-05-15 2020-08-28 电子科技大学 Leveling agent for electronic circuit copper electroplating pore filling and copper electroplating bath

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2424887A (en) * 1941-10-11 1947-07-29 Houdaille Hershey Corp Method and electrolyte for the electrodeposition of metals
US2805194A (en) * 1955-07-18 1957-09-03 Dayton Bright Copper Company Bright copper plating
US2931760A (en) * 1957-09-25 1960-04-05 Leon R Westbrook Acid copper plating
DE1133610B (en) * 1959-06-06 1962-07-19 Dehydag Gmbh Acid galvanic copper baths
NL291575A (en) * 1962-04-16
US3252987A (en) * 1964-03-09 1966-05-24 Eastman Kodak Co Tetrazolium compound electroplating leveling agent and method of preparation

Also Published As

Publication number Publication date
LU56200A1 (en) 1968-09-16
US3373095A (en) 1968-03-12
NO120960B (en) 1970-12-28
NL6807883A (en) 1968-12-06
ES354519A1 (en) 1970-01-01
DE1771447C2 (en) 1974-08-22
DE1771447B1 (en) 1972-05-04
SE345879B (en) 1972-06-12
BE716104A (en) 1968-11-04
FR1569546A (en) 1969-05-30

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Legal Events

Date Code Title Description
EIH Change in the person of patent owner
ELJ Ceased due to non-payment of the annual fee