AT301666B - Flexible insulating film on which a pattern of conductor tracks is attached - Google Patents

Flexible insulating film on which a pattern of conductor tracks is attached

Info

Publication number
AT301666B
AT301666B AT1153769A AT1153769A AT301666B AT 301666 B AT301666 B AT 301666B AT 1153769 A AT1153769 A AT 1153769A AT 1153769 A AT1153769 A AT 1153769A AT 301666 B AT301666 B AT 301666B
Authority
AT
Austria
Prior art keywords
pattern
attached
insulating film
conductor tracks
flexible insulating
Prior art date
Application number
AT1153769A
Other languages
German (de)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Application granted granted Critical
Publication of AT301666B publication Critical patent/AT301666B/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H05K3/242—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
AT1153769A 1968-12-14 1969-12-11 Flexible insulating film on which a pattern of conductor tracks is attached AT301666B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6818017A NL6818017A (en) 1968-12-14 1968-12-14

Publications (1)

Publication Number Publication Date
AT301666B true AT301666B (en) 1972-09-11

Family

ID=19805406

Family Applications (1)

Application Number Title Priority Date Filing Date
AT1153769A AT301666B (en) 1968-12-14 1969-12-11 Flexible insulating film on which a pattern of conductor tracks is attached

Country Status (10)

Country Link
AT (1) AT301666B (en)
BE (1) BE743089A (en)
BR (1) BR6915013D0 (en)
CH (1) CH506230A (en)
DE (1) DE1958811A1 (en)
DK (1) DK121806B (en)
ES (1) ES374491A1 (en)
FR (1) FR2026186A1 (en)
GB (1) GB1303650A (en)
NL (1) NL6818017A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2633434C2 (en) * 1976-07-24 1981-04-30 Diehl GmbH & Co, 8500 Nürnberg Lost stopper
JPS566498A (en) * 1979-06-26 1981-01-23 Hitachi Chemical Co Ltd Method of manufacturing flexible printed circuit board
JPS60206639A (en) * 1984-03-31 1985-10-18 日東電工株式会社 Manufacture of polyimide-metallic foil composite film

Also Published As

Publication number Publication date
BE743089A (en) 1970-06-12
ES374491A1 (en) 1972-01-01
NL6818017A (en) 1970-06-16
DE1958811A1 (en) 1970-07-02
CH506230A (en) 1971-04-15
GB1303650A (en) 1973-01-17
BR6915013D0 (en) 1973-01-02
DK121806B (en) 1971-12-06
FR2026186A1 (en) 1970-09-11

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Legal Events

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