AT318736B - Method for manufacturing a trough-shaped lower part of an insulating housing for a semiconductor device - Google Patents

Method for manufacturing a trough-shaped lower part of an insulating housing for a semiconductor device

Info

Publication number
AT318736B
AT318736B AT810870A AT810870A AT318736B AT 318736 B AT318736 B AT 318736B AT 810870 A AT810870 A AT 810870A AT 810870 A AT810870 A AT 810870A AT 318736 B AT318736 B AT 318736B
Authority
AT
Austria
Prior art keywords
trough
manufacturing
semiconductor device
insulating housing
shaped lower
Prior art date
Application number
AT810870A
Other languages
German (de)
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19691945455 external-priority patent/DE1945455C3/en
Application filed by Siemens Ag filed Critical Siemens Ag
Application granted granted Critical
Publication of AT318736B publication Critical patent/AT318736B/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
AT810870A 1969-09-08 1970-09-07 Method for manufacturing a trough-shaped lower part of an insulating housing for a semiconductor device AT318736B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19691945455 DE1945455C3 (en) 1969-09-08 Method for producing a housing for a semiconductor device

Publications (1)

Publication Number Publication Date
AT318736B true AT318736B (en) 1974-11-11

Family

ID=5744903

Family Applications (1)

Application Number Title Priority Date Filing Date
AT810870A AT318736B (en) 1969-09-08 1970-09-07 Method for manufacturing a trough-shaped lower part of an insulating housing for a semiconductor device

Country Status (7)

Country Link
JP (1) JPS5139073B1 (en)
AT (1) AT318736B (en)
CH (1) CH514933A (en)
FR (1) FR2060986A5 (en)
GB (1) GB1301139A (en)
NL (1) NL7010468A (en)
SE (1) SE365653B (en)

Also Published As

Publication number Publication date
JPS5139073B1 (en) 1976-10-26
GB1301139A (en) 1972-12-29
SE365653B (en) 1974-03-25
CH514933A (en) 1971-10-31
DE1945455B2 (en) 1976-09-23
DE1945455A1 (en) 1971-03-11
FR2060986A5 (en) 1971-06-18
NL7010468A (en) 1971-03-10

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