AT322859B - HOT-CURING MIXTURES ON THE BASIS OF EPOXY RESIN AND THE PRODUCTION OF MOLDED BODIES - Google Patents
HOT-CURING MIXTURES ON THE BASIS OF EPOXY RESIN AND THE PRODUCTION OF MOLDED BODIESInfo
- Publication number
- AT322859B AT322859B AT953072A AT953072A AT322859B AT 322859 B AT322859 B AT 322859B AT 953072 A AT953072 A AT 953072A AT 953072 A AT953072 A AT 953072A AT 322859 B AT322859 B AT 322859B
- Authority
- AT
- Austria
- Prior art keywords
- hot
- basis
- production
- epoxy resin
- molded bodies
- Prior art date
Links
- 239000003822 epoxy resin Substances 0.000 title 1
- 239000000203 mixture Substances 0.000 title 1
- 229920000647 polyepoxide Polymers 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH1632371A CH550218A (en) | 1971-11-10 | 1971-11-10 | HEAT-CURABLE EPOXY RESIN-BASED MIXTURES. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AT322859B true AT322859B (en) | 1975-06-10 |
Family
ID=4416308
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT953072A AT322859B (en) | 1971-11-10 | 1972-11-09 | HOT-CURING MIXTURES ON THE BASIS OF EPOXY RESIN AND THE PRODUCTION OF MOLDED BODIES |
Country Status (14)
| Country | Link |
|---|---|
| JP (1) | JPS5543007B2 (en) |
| AR (1) | AR195884A1 (en) |
| AT (1) | AT322859B (en) |
| AU (1) | AU467620B2 (en) |
| BE (1) | BE791129A (en) |
| CA (1) | CA985843A (en) |
| CH (1) | CH550218A (en) |
| DE (1) | DE2254487C2 (en) |
| ES (1) | ES408401A1 (en) |
| FR (1) | FR2159404B1 (en) |
| GB (1) | GB1383357A (en) |
| IT (1) | IT970334B (en) |
| NL (1) | NL174948C (en) |
| ZA (1) | ZA727936B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5829968B2 (en) * | 1976-09-13 | 1983-06-25 | 松下電器産業株式会社 | Epoxy prepreg sheet |
| DE3016103A1 (en) * | 1980-04-25 | 1981-10-29 | Siemens AG, 1000 Berlin und 8000 München | METHOD FOR PRODUCING TRANSPARENT GOAT RESINS |
| DE3016097A1 (en) * | 1980-04-25 | 1981-10-29 | Siemens AG, 1000 Berlin und 8000 München | QUICK-HARDING EPOXY RESINS |
| JPH0660232B2 (en) * | 1989-09-29 | 1994-08-10 | 信越化学工業株式会社 | Liquid epoxy resin composition |
| GB9226500D0 (en) * | 1992-12-19 | 1993-02-10 | Ciba Geigy Ag | Curable compositions |
| WO2010150524A1 (en) * | 2009-06-22 | 2010-12-29 | 日本化薬株式会社 | Polyvalent carboxylic acid, composition thereof, curable resin composition, cured product, and method for manufacturing a polyvalent carboxylic acid |
| JP2015199904A (en) * | 2014-04-03 | 2015-11-12 | 日本化薬株式会社 | Curing agent for thermosetting resin, thermosetting resin composition using the same and photo-semiconductor device using the thermosetting resin composition as encapsulating material or reflector |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS505759A (en) * | 1973-05-21 | 1975-01-21 |
-
0
- BE BE791129D patent/BE791129A/en not_active IP Right Cessation
-
1971
- 1971-11-10 CH CH1632371A patent/CH550218A/en not_active IP Right Cessation
-
1972
- 1972-09-19 CA CA152,037A patent/CA985843A/en not_active Expired
- 1972-09-20 AU AU46907/72A patent/AU467620B2/en not_active Expired
- 1972-10-30 GB GB4713572A patent/GB1383357A/en not_active Expired
- 1972-10-31 NL NLAANVRAGE7214726,A patent/NL174948C/en not_active IP Right Cessation
- 1972-11-07 JP JP11157072A patent/JPS5543007B2/ja not_active Expired
- 1972-11-07 DE DE2254487A patent/DE2254487C2/en not_active Expired
- 1972-11-08 AR AR245022A patent/AR195884A1/en active
- 1972-11-09 ES ES408401A patent/ES408401A1/en not_active Expired
- 1972-11-09 FR FR7239683A patent/FR2159404B1/fr not_active Expired
- 1972-11-09 ZA ZA727936A patent/ZA727936B/en unknown
- 1972-11-09 AT AT953072A patent/AT322859B/en not_active IP Right Cessation
- 1972-11-09 IT IT31450/72A patent/IT970334B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| NL174948C (en) | 1986-07-16 |
| GB1383357A (en) | 1974-02-12 |
| AU467620B2 (en) | 1975-12-04 |
| JPS5543007B2 (en) | 1980-11-04 |
| ES408401A1 (en) | 1976-02-16 |
| AU4690772A (en) | 1974-03-28 |
| FR2159404B1 (en) | 1976-08-20 |
| CA985843A (en) | 1976-03-16 |
| ZA727936B (en) | 1973-07-25 |
| CH550218A (en) | 1974-06-14 |
| AR195884A1 (en) | 1973-11-15 |
| DE2254487A1 (en) | 1973-05-17 |
| JPS4858099A (en) | 1973-08-15 |
| BE791129A (en) | 1973-05-09 |
| FR2159404A1 (en) | 1973-06-22 |
| IT970334B (en) | 1974-04-10 |
| NL7214726A (en) | 1973-05-14 |
| DE2254487C2 (en) | 1982-07-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ELA | Expired due to lapse of time |