AT503848A3 - Handhabungsvorrichtung sowie handhabungsverfahren fur wafer - Google Patents

Handhabungsvorrichtung sowie handhabungsverfahren fur wafer Download PDF

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Publication number
AT503848A3
AT503848A3 AT0093907A AT9392007A AT503848A3 AT 503848 A3 AT503848 A3 AT 503848A3 AT 0093907 A AT0093907 A AT 0093907A AT 9392007 A AT9392007 A AT 9392007A AT 503848 A3 AT503848 A3 AT 503848A3
Authority
AT
Austria
Prior art keywords
handling
wafer
handling device
handling method
Prior art date
Application number
AT0093907A
Other languages
English (en)
Other versions
AT503848B1 (de
AT503848A2 (de
Original Assignee
Thallner Erich
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thallner Erich filed Critical Thallner Erich
Publication of AT503848A2 publication Critical patent/AT503848A2/de
Publication of AT503848A3 publication Critical patent/AT503848A3/de
Application granted granted Critical
Publication of AT503848B1 publication Critical patent/AT503848B1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
AT0093907A 2006-07-07 2007-06-18 Handhabungsvorrichtung sowie handhabungsverfahren für wafer AT503848B1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102006031434.4A DE102006031434B4 (de) 2006-07-07 2006-07-07 Handhabungsvorrichtung sowie Handhabungsverfahren für Wafer

Publications (3)

Publication Number Publication Date
AT503848A2 AT503848A2 (de) 2008-01-15
AT503848A3 true AT503848A3 (de) 2009-04-15
AT503848B1 AT503848B1 (de) 2010-08-15

Family

ID=38825091

Family Applications (1)

Application Number Title Priority Date Filing Date
AT0093907A AT503848B1 (de) 2006-07-07 2007-06-18 Handhabungsvorrichtung sowie handhabungsverfahren für wafer

Country Status (4)

Country Link
US (3) US7909374B2 (de)
JP (2) JP2008013372A (de)
AT (1) AT503848B1 (de)
DE (1) DE102006031434B4 (de)

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* Cited by examiner, † Cited by third party
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DE102006026331B4 (de) * 2006-06-02 2019-09-26 Erich Thallner Transportable Einheit zum Transport von Wafern und Verwendung einer Gelfolie in einer transportablen Einheit
JP5033886B2 (ja) * 2008-02-06 2012-09-26 株式会社アルバック 基板搬送用のロボットハンド
US8950459B2 (en) 2009-04-16 2015-02-10 Suss Microtec Lithography Gmbh Debonding temporarily bonded semiconductor wafers
US8764026B2 (en) 2009-04-16 2014-07-01 Suss Microtec Lithography, Gmbh Device for centering wafers
DE102009018156B4 (de) 2009-04-21 2024-08-29 Ev Group Gmbh Vorrichtung und Verfahren zum Trennen eines Substrats von einem Trägersubstrat
TWI395281B (zh) * 2009-07-23 2013-05-01 晶元光電股份有限公司 晶粒分類裝置
KR101135622B1 (ko) * 2009-10-26 2012-04-17 강원대학교산학협력단 접착력 제어가 가능한 이송 스탬퍼
US8295944B2 (en) * 2009-11-30 2012-10-23 Boston Scientific Neuromodulation Corporation Electrode array with electrodes having cutout portions and methods of making the same
US9064686B2 (en) 2010-04-15 2015-06-23 Suss Microtec Lithography, Gmbh Method and apparatus for temporary bonding of ultra thin wafers
US9859141B2 (en) 2010-04-15 2018-01-02 Suss Microtec Lithography Gmbh Apparatus and method for aligning and centering wafers
US9837295B2 (en) 2010-04-15 2017-12-05 Suss Microtec Lithography Gmbh Apparatus and method for semiconductor wafer leveling, force balancing and contact sensing
KR20130132732A (ko) * 2010-07-23 2013-12-05 에베 그룹 게엠베하 웨이퍼를 핸들링하기 위한 핸들링장치
JP2012204709A (ja) * 2011-03-28 2012-10-22 Okamoto Machine Tool Works Ltd 半導体基板保持用のパッドおよびそれを用いて半導体基板を搬送する方法
KR101801264B1 (ko) * 2011-06-13 2017-11-27 삼성전자주식회사 반도체 제조 장치 및 이를 이용한 반도체 패키지 방법
JP6196123B2 (ja) 2013-10-18 2017-09-13 東芝メモリ株式会社 チャッククリーナ及びクリーニング方法
JP6032234B2 (ja) * 2014-03-19 2016-11-24 信越半導体株式会社 ワーク保持装置
TWI521082B (zh) * 2014-04-15 2016-02-11 友達光電股份有限公司 操作裝置及其操作方法
JP6398301B2 (ja) * 2014-05-09 2018-10-03 藤倉化成株式会社 吸着離脱装置
DE102015109256A1 (de) 2015-06-11 2016-12-15 Aixacct Systems Gmbh Verfahren und Vorrichtung zur Bestimmung dehnungsabhängiger Größen
NL2018244B1 (en) * 2017-01-27 2018-08-07 Suss Microtec Lithography Gmbh Endeffektor
US10724572B2 (en) 2017-08-23 2020-07-28 Todd H. Becker Electronically-releasable suction cup assembly secured to an appliance
GB201800863D0 (en) * 2018-01-19 2018-03-07 Ocado Innovation Ltd A grasping affordance for use in a robot system
IL318821A (en) * 2018-12-28 2025-04-01 Asml Holding Nv Method and device for cleaning a support structure in a lithographic system
CN113788318A (zh) * 2021-11-09 2021-12-14 苏州物远网络科技有限公司 一种工业生产用薄板搬运装置
US20230378125A1 (en) * 2022-05-19 2023-11-23 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor bonding tool and method of operating the same
CN121002640A (zh) * 2023-04-27 2025-11-21 创意科技股份有限公司 工件保持装置

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US4778326A (en) * 1983-05-24 1988-10-18 Vichem Corporation Method and means for handling semiconductor and similar electronic devices
US4921564A (en) * 1988-05-23 1990-05-01 Semiconductor Equipment Corp. Method and apparatus for removing circuit chips from wafer handling tape
US5423716A (en) * 1994-01-05 1995-06-13 Strasbaugh; Alan Wafer-handling apparatus having a resilient membrane which holds wafer when a vacuum is applied
JPH09108983A (ja) * 1995-10-17 1997-04-28 Koganei Corp ワーク搬送装置
JP3771320B2 (ja) * 1996-03-29 2006-04-26 コマツ電子金属株式会社 半導体ウェハの貼付方法及び貼付装置
JP3469999B2 (ja) * 1996-10-30 2003-11-25 京セラ株式会社 吸着盤の製造方法
US5916015A (en) * 1997-07-25 1999-06-29 Speedfam Corporation Wafer carrier for semiconductor wafer polishing machine
US6383606B2 (en) * 1999-02-02 2002-05-07 Michelle Broyles Semiconductor wafer diaphragm
KR20010030213A (ko) * 1999-09-02 2001-04-16 아끼모토 유미 연마 헤드, 이것을 이용한 연마 장치, 및 연마 상태 검출방법
US6541989B1 (en) * 2000-09-29 2003-04-01 Motorola, Inc. Testing device for semiconductor components and a method of using the device
US6716084B2 (en) * 2001-01-11 2004-04-06 Nutool, Inc. Carrier head for holding a wafer and allowing processing on a front face thereof to occur
JP2002265040A (ja) * 2001-03-06 2002-09-18 Sharp Corp 基板搬送用治具及びそれを用いた液晶表示素子の製造方法
US20020151260A1 (en) * 2001-04-12 2002-10-17 Crevasse Annette Margaret Carrier head for a chemical mechanical polishing apparatus
JP3892703B2 (ja) * 2001-10-19 2007-03-14 富士通株式会社 半導体基板用治具及びこれを用いた半導体装置の製造方法
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JP2004079613A (ja) * 2002-08-12 2004-03-11 Disco Abrasive Syst Ltd 半導体ウェーハ移し替え装置
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JP2005093938A (ja) * 2003-09-19 2005-04-07 Shin Etsu Polymer Co Ltd 基板保持具
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JP3882004B2 (ja) * 2004-04-09 2007-02-14 信越エンジニアリング株式会社 粘着チャック装置
JP4268091B2 (ja) * 2004-05-12 2009-05-27 信越ポリマー株式会社 部品保持具
JP4440005B2 (ja) * 2004-06-15 2010-03-24 信越ポリマー株式会社 部品保持具
US8010263B2 (en) * 2006-03-22 2011-08-30 GM Global Technology Operations LLC Method and apparatus for multivariate active driveline damping

Also Published As

Publication number Publication date
US8087708B2 (en) 2012-01-03
US20110133500A1 (en) 2011-06-09
JP5528509B2 (ja) 2014-06-25
DE102006031434A1 (de) 2008-01-17
JP2008013372A (ja) 2008-01-24
US20080008565A1 (en) 2008-01-10
AT503848B1 (de) 2010-08-15
US8157307B2 (en) 2012-04-17
JP2012195609A (ja) 2012-10-11
AT503848A2 (de) 2008-01-15
DE102006031434B4 (de) 2019-11-14
US7909374B2 (en) 2011-03-22
US20110127785A1 (en) 2011-06-02

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