AT510345A3 - Struktur-herstellungsverfahren und struktur - Google Patents

Struktur-herstellungsverfahren und struktur Download PDF

Info

Publication number
AT510345A3
AT510345A3 ATA1144/2011A AT11442011A AT510345A3 AT 510345 A3 AT510345 A3 AT 510345A3 AT 11442011 A AT11442011 A AT 11442011A AT 510345 A3 AT510345 A3 AT 510345A3
Authority
AT
Austria
Prior art keywords
thin film
pattern
base material
manufacturing
laminating
Prior art date
Application number
ATA1144/2011A
Other languages
English (en)
Other versions
AT510345A2 (de
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of AT510345A2 publication Critical patent/AT510345A2/de
Publication of AT510345A3 publication Critical patent/AT510345A3/de

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0037—Production of three-dimensional images
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/34—Imagewise removal by selective transfer, e.g. peeling away
    • G03F7/343—Lamination or delamination methods or apparatus for photolitographic photosensitive material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/08—Dimensions, e.g. volume
    • B32B2309/10—Dimensions, e.g. volume linear, e.g. length, distance, width
    • B32B2309/105—Thickness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
    • B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
    • B32B2310/0831—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

Ein Struktur-Herstellungsverfahren weist das Laminieren einer ersten Dünnschicht auf einem Basismaterial, das gezielte Bestrahlen der ersten Dünnschicht mit einer Energiestrahlung in Abhängigkeit von einer Stelle einer Oberfläche der ersten Dünnschicht auf dem Basismaterial, um ein verborgenes Bild eines Musters auf der ersten Dünnschicht auszubilden, das Laminieren einer zweiten Dünnschicht auf der Oberfläche der ersten Dünnschicht, sowie zweiten Dünnschicht und das das Zuführen eines Entwicklers zur Entfernen eines gezielt zu entfernenden Teils der ersten Dünnschicht auf, der zusammen mit der zweiten Dünnschicht gezielt entfernt werden soll, um dadurch das Muster zu entwickeln.
ATA1144/2011A 2010-08-25 2011-08-09 Struktur-herstellungsverfahren und struktur AT510345A3 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010188272A JP5672854B2 (ja) 2010-08-25 2010-08-25 構造体の製造方法

Publications (2)

Publication Number Publication Date
AT510345A2 AT510345A2 (de) 2012-03-15
AT510345A3 true AT510345A3 (de) 2015-01-15

Family

ID=45697638

Family Applications (1)

Application Number Title Priority Date Filing Date
ATA1144/2011A AT510345A3 (de) 2010-08-25 2011-08-09 Struktur-herstellungsverfahren und struktur

Country Status (4)

Country Link
US (1) US20120052260A1 (de)
JP (1) JP5672854B2 (de)
CN (1) CN102555217A (de)
AT (1) AT510345A3 (de)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030215753A1 (en) * 2002-05-17 2003-11-20 Fan-Gang Tseng Fabrication method of a three-dimensional microstructure
US20040101783A1 (en) * 2002-11-25 2004-05-27 International Business Machines Corporation Electrodeposited photoresist and dry film photoresist photolithography process for printed circuit board patterning
US20050153567A1 (en) * 2004-01-13 2005-07-14 Fuji Photo Film Co., Ltd. Method of forming patterns
WO2006003757A1 (en) * 2004-06-30 2006-01-12 Tokyo Ohka Kogyo Co., Ltd. Method of forming plated product using negative photoresist composition and photosensitive composition used therein

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6275438A (ja) * 1985-09-28 1987-04-07 Nitto Electric Ind Co Ltd 画像形成材料
DE4400315C1 (de) * 1994-01-07 1995-01-12 Kernforschungsz Karlsruhe Verfahren zum stufenweisen Aufbau von Mikrostrukturkörpern und damit hergestellter Mikrostrukturkörper
JPH1080954A (ja) * 1996-09-10 1998-03-31 Sony Corp ドライフィルム化した光硬化性樹脂または光分離性樹脂を用いた光造形装置と方法
JP2004085781A (ja) * 2002-08-26 2004-03-18 Toagosei Co Ltd 架橋硬化型樹脂組成物
US6966960B2 (en) * 2003-05-07 2005-11-22 Hewlett-Packard Development Company, L.P. Fusible water-soluble films for fabricating three-dimensional objects
JP2006049837A (ja) * 2004-06-30 2006-02-16 Canon Inc 厚膜部材パターンの製造方法
WO2006051769A1 (ja) * 2004-11-15 2006-05-18 Tokyo Ohka Kogyo Co., Ltd. レジストパターンの形成方法
US7358035B2 (en) * 2005-06-23 2008-04-15 International Business Machines Corporation Topcoat compositions and methods of use thereof
KR101318517B1 (ko) * 2008-05-30 2013-10-16 코오롱인더스트리 주식회사 필름형 광분해성 전사재료
US8623458B2 (en) * 2009-12-18 2014-01-07 International Business Machines Corporation Methods of directed self-assembly, and layered structures formed therefrom

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030215753A1 (en) * 2002-05-17 2003-11-20 Fan-Gang Tseng Fabrication method of a three-dimensional microstructure
US20040101783A1 (en) * 2002-11-25 2004-05-27 International Business Machines Corporation Electrodeposited photoresist and dry film photoresist photolithography process for printed circuit board patterning
US20050153567A1 (en) * 2004-01-13 2005-07-14 Fuji Photo Film Co., Ltd. Method of forming patterns
WO2006003757A1 (en) * 2004-06-30 2006-01-12 Tokyo Ohka Kogyo Co., Ltd. Method of forming plated product using negative photoresist composition and photosensitive composition used therein

Also Published As

Publication number Publication date
US20120052260A1 (en) 2012-03-01
JP5672854B2 (ja) 2015-02-18
CN102555217A (zh) 2012-07-11
JP2012045759A (ja) 2012-03-08
AT510345A2 (de) 2012-03-15

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Effective date: 20220815