AT512859A3 - Halbleiterchip Wende- und Befestigungseinrichtung - Google Patents

Halbleiterchip Wende- und Befestigungseinrichtung Download PDF

Info

Publication number
AT512859A3
AT512859A3 AT3822013A AT3822013A AT512859A3 AT 512859 A3 AT512859 A3 AT 512859A3 AT 3822013 A AT3822013 A AT 3822013A AT 3822013 A AT3822013 A AT 3822013A AT 512859 A3 AT512859 A3 AT 512859A3
Authority
AT
Austria
Prior art keywords
transfer
bonding head
flip
bonding
semiconductor chip
Prior art date
Application number
AT3822013A
Other languages
English (en)
Other versions
AT512859B1 (de
AT512859A2 (de
Original Assignee
Hanmi Semiconductor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020120050068A external-priority patent/KR101275133B1/ko
Priority claimed from KR1020120108058A external-priority patent/KR101360007B1/ko
Application filed by Hanmi Semiconductor Co Ltd filed Critical Hanmi Semiconductor Co Ltd
Publication of AT512859A2 publication Critical patent/AT512859A2/de
Publication of AT512859A3 publication Critical patent/AT512859A3/de
Application granted granted Critical
Publication of AT512859B1 publication Critical patent/AT512859B1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts

Landscapes

  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Die vorliegende Erfindung betrifft eine Flip-Chip-Bond­ vorrichtung, welche die Genauigkeit und Zuverlässigkeit eines Überführungsprozesses zum Überführen eines bei einem Flip­ Chip-Bondprozess verwendeten Bondkopfs zu einer vorgegebenen Position auf der xy-Ebene verbessern kann, die Überführungsoperation von Überführungsstrecken für das Überführen jedes Bondkopfs minimieren kann und das Problem des durch Wärme erzeugten Positionsfehlers abmildern kann. Insbesondere betrifft die vorliegende Erfindung eine Flip­ Chip-Bondvorrichtung, welche die Anzahl der Bewegungen und den Bewegungsabstand eines Bondkopfs in einer spezifischen Achsenrichtung verringern kann, die thermische Ausdehnung und Vibrationen infolge der Überführung des Bondkopfs verringern kann und den UPH-Wert der Vorrichtung verbessern kann, während eine ausreichende Zeit für das Abflachen des Flussmittels sichergestellt wird.
ATA382/2013A 2012-05-11 2013-05-07 Halbleiterchip Wende- und Befestigungseinrichtung AT512859B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020120050068A KR101275133B1 (ko) 2012-05-11 2012-05-11 플립칩 본딩장치
KR1020120108058A KR101360007B1 (ko) 2012-09-27 2012-09-27 플립칩 본딩장치

Publications (3)

Publication Number Publication Date
AT512859A2 AT512859A2 (de) 2013-11-15
AT512859A3 true AT512859A3 (de) 2015-05-15
AT512859B1 AT512859B1 (de) 2018-06-15

Family

ID=49549922

Family Applications (1)

Application Number Title Priority Date Filing Date
ATA382/2013A AT512859B1 (de) 2012-05-11 2013-05-07 Halbleiterchip Wende- und Befestigungseinrichtung

Country Status (3)

Country Link
CN (1) CN103560093B (de)
AT (1) AT512859B1 (de)
TW (1) TWI506749B (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101425613B1 (ko) * 2013-03-28 2014-08-01 한미반도체 주식회사 플립칩 본딩장치 및 플립칩 본딩방법
CN104148865A (zh) * 2014-08-27 2014-11-19 昆山元崧电子科技有限公司 感应器的焊接辅助装置
CN105171308B (zh) * 2015-08-30 2016-10-12 深圳英飞自动化设备有限公司 半导体芯片自动焊接固定装置
KR102514598B1 (ko) * 2015-12-21 2023-03-27 (주)제이티 플립칩 실장장치
KR102121467B1 (ko) 2016-01-22 2020-06-10 캡콘 리미티드 부품 패키징 장치 및 그 방법
KR102281279B1 (ko) * 2016-03-14 2021-07-23 캡콘 리미티드 칩 패키징 장치 및 그 방법
KR102579224B1 (ko) * 2016-09-02 2023-09-15 (주)제이티 플립소자 핸들러
JP6705727B2 (ja) * 2016-09-26 2020-06-03 ファスフォードテクノロジ株式会社 フリップチップボンダおよび半導体装置の製造方法
CN106298596A (zh) * 2016-10-15 2017-01-04 广州明森科技股份有限公司 一种智能卡芯片带输送装置
DE102016123362B3 (de) * 2016-12-02 2018-03-08 Asm Assembly Systems Gmbh & Co. Kg Bestückmaschine mit einer Verschiebevorrichtung zum Verschieben einer Aufnahmevorrichtung für einen Träger mit Bestückmedium und ein Verfahren zum Bestücken
JP6626027B2 (ja) * 2017-03-16 2019-12-25 Ｔｏｗａ株式会社 製造装置および電子部品の製造方法
CN108172532B (zh) * 2017-12-25 2020-12-25 北京中电科电子装备有限公司 一种倒装芯片键合装置
TWI745710B (zh) * 2018-07-06 2021-11-11 日商新川股份有限公司 半導體晶粒的拾取系統
CN109060307B (zh) * 2018-09-18 2021-02-09 罗昕明 一种倒装led芯片检测装置
KR102598578B1 (ko) * 2020-08-10 2023-11-03 세메스 주식회사 본딩 장치 및 본딩 방법
US11605610B2 (en) * 2021-09-28 2023-03-14 Google Llc Depth-adaptive mechanism for ball grid array dipping
CN115863244B (zh) * 2022-11-01 2026-08-11 西北电子装备技术研究所(中国电子科技集团公司第二研究所) 一种用于深腔器件的芯片间引线键合工艺设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5839187A (en) * 1995-08-24 1998-11-24 Matsushita Electric Industrial Co., Ltd. Apparatus and method for mounting a chip
US20030110623A1 (en) * 2001-12-18 2003-06-19 Matsushita Electric Industrial Co., Ltd. Electronic component mounting apparatus and electronic component mounting method
US20030177633A1 (en) * 2002-03-25 2003-09-25 Matsushita Electric Industrial Co., Ltd Electronic component mounting apparatus and electronic component mounting method
US20070145102A1 (en) * 2005-12-22 2007-06-28 Unaxis International Trading Ltd. Method for mounting a flip chip on a substrate

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4334892B2 (ja) * 2003-03-20 2009-09-30 パナソニック株式会社 部品実装方法
JP4057457B2 (ja) * 2003-04-15 2008-03-05 株式会社ディスコ フリップチップボンダー
JP5077936B2 (ja) * 2006-08-31 2012-11-21 ボンドテック株式会社 実装装置および実装方法
JP4361572B2 (ja) * 2007-02-28 2009-11-11 株式会社新川 ボンディング装置及び方法
KR101082827B1 (ko) * 2010-03-19 2011-11-11 아메스산업(주) 비전카메라 일체형 픽업유닛을 구비하는 플립칩 장착 장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5839187A (en) * 1995-08-24 1998-11-24 Matsushita Electric Industrial Co., Ltd. Apparatus and method for mounting a chip
US20030110623A1 (en) * 2001-12-18 2003-06-19 Matsushita Electric Industrial Co., Ltd. Electronic component mounting apparatus and electronic component mounting method
US20030177633A1 (en) * 2002-03-25 2003-09-25 Matsushita Electric Industrial Co., Ltd Electronic component mounting apparatus and electronic component mounting method
US20070145102A1 (en) * 2005-12-22 2007-06-28 Unaxis International Trading Ltd. Method for mounting a flip chip on a substrate

Also Published As

Publication number Publication date
AT512859B1 (de) 2018-06-15
TW201405747A (zh) 2014-02-01
CN103560093A (zh) 2014-02-05
TWI506749B (zh) 2015-11-01
AT512859A2 (de) 2013-11-15
CN103560093B (zh) 2016-07-06

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