AT514134A3 - Flip-Chip-Kontaktierungsvorrichtung und -verfahren - Google Patents

Flip-Chip-Kontaktierungsvorrichtung und -verfahren

Info

Publication number
AT514134A3
AT514134A3 ATA50223/2014A AT502232014A AT514134A3 AT 514134 A3 AT514134 A3 AT 514134A3 AT 502232014 A AT502232014 A AT 502232014A AT 514134 A3 AT514134 A3 AT 514134A3
Authority
AT
Austria
Prior art keywords
flux
semiconductor chip
imager
unit
contacting
Prior art date
Application number
ATA50223/2014A
Other languages
English (en)
Other versions
AT514134A2 (de
Original Assignee
Hanmi Semiconductor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hanmi Semiconductor Co Ltd filed Critical Hanmi Semiconductor Co Ltd
Publication of AT514134A2 publication Critical patent/AT514134A2/de
Publication of AT514134A3 publication Critical patent/AT514134A3/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0112—Apparatus for manufacturing bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass

Landscapes

  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

Flip-Chip-Kontaktierungsvorrichtung die enthält: eine Aufnahmeeinheit zum Aufnehmen eines Halbleiterchips, einen Kontaktierungskopf enthaltend eine Kontaktierungs-Bestückungsvorrichtung zum Aufnehmen des Halbleiterchips und zum Befestigen des Halbleiterchips auf einer Platte und eine Plattenabbildungsvorrichtung, eine Eintaucheinheit zum Aufnehmen eines Flussmittels, eine aufwärtssehende Abbildungsvorrichtung zum Prüfen der Unterseite des Halbleiterchips, eine Flussmittel-Abbildungsvorrichtung, eine Antriebseinheit zum Bewegen des Kontaktierungskopfes und der Flussmittel-Abbildungsvorrichtung, und einen Kontaktierungstisch, auf dem sich die Platte befindet, wobei die Plattenabbildungsvorrichtung die Eintaucheinheit prüft, um einen Zustand des Flussmittels zu prüfen, bevor der Halbleiterchip eingetaucht wird, während die Kontaktierungs-Bestückungsvorrichtung den Halbleiterchip von der Aufnahmeeinheit aufnimmt, und die Flussmittel-Abbildungsvorrichtung die Eintaucheinheit prüft, um einen Zustand des Flussmittels zu prüfen, nachdem der Halbleiterchip eingetaucht wurde, während die aufwärtssehende Abbildungsvorrichtung den von der Kontaktierungs-Bestückungsvorrichtung aufgenommenen und in das Flussmittel eingetauchten Halbleiterchip prüft.
ATA50223/2014A 2013-03-28 2014-03-27 Flip-Chip-Kontaktierungsvorrichtung und -verfahren AT514134A3 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020130033522A KR101425613B1 (ko) 2013-03-28 2013-03-28 플립칩 본딩장치 및 플립칩 본딩방법

Publications (2)

Publication Number Publication Date
AT514134A2 AT514134A2 (de) 2014-10-15
AT514134A3 true AT514134A3 (de) 2017-05-15

Family

ID=51599560

Family Applications (1)

Application Number Title Priority Date Filing Date
ATA50223/2014A AT514134A3 (de) 2013-03-28 2014-03-27 Flip-Chip-Kontaktierungsvorrichtung und -verfahren

Country Status (4)

Country Link
KR (1) KR101425613B1 (de)
CN (1) CN104078373B (de)
AT (1) AT514134A3 (de)
TW (1) TWI620255B (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102217426B1 (ko) * 2015-02-11 2021-02-22 (주)테크윙 전자부품 이송장치
CN107134419B (zh) * 2016-02-29 2020-04-10 上海微电子装备（集团）股份有限公司 倒装芯片键合装置及其键合方法
CN107134423B (zh) * 2016-02-29 2020-11-20 上海微电子装备（集团）股份有限公司 倒装芯片键合装置及其键合方法
CN107134422A (zh) * 2016-02-29 2017-09-05 上海微电子装备（集团）股份有限公司 芯片键合装置及方法
CN107134418B (zh) * 2016-02-29 2020-02-18 上海微电子装备（集团）股份有限公司 倒装芯片键合装置及键合方法
CN107134446B (zh) * 2016-02-29 2019-05-31 上海微电子装备（集团）股份有限公司 一种芯片键合装置及键合方法
CN107452644B (zh) * 2016-05-31 2020-11-20 上海微电子装备（集团）股份有限公司 分体式芯片载板搬运键合装置
JP7090066B2 (ja) 2016-07-13 2022-06-23 ユニバーサル インスツルメンツ コーポレーション モジュール式ダイ取扱いシステム
KR102602512B1 (ko) * 2017-01-06 2023-11-14 한화정밀기계 주식회사 플립 칩의 플럭스 젖음 검출 장치
CN109390249A (zh) * 2017-08-10 2019-02-26 上海微电子装备（集团）股份有限公司 半导体制造装置
CN108470700A (zh) * 2018-04-17 2018-08-31 通富微电子股份有限公司 一种检测倒贴装设备姿态的方法
KR102458050B1 (ko) 2018-05-31 2022-10-24 한미반도체 주식회사 마이크로 led 소자용 본딩장치 및 마이크로 led 소자용 본딩 방법
CN111261572B (zh) * 2018-11-30 2023-03-31 成都辰显光电有限公司 转移装置以及微元件的转移方法
CN111752314B (zh) * 2019-03-29 2021-10-01 上海微电子装备（集团）股份有限公司 键合头压力控制装置及控制方法、键合设备
KR20200128325A (ko) 2019-05-03 2020-11-12 한미반도체 주식회사 마이크로 led 소자용 본딩장치 및 마이크로 led 소자용 본딩 방법
KR102732384B1 (ko) * 2020-03-02 2024-11-20 한미반도체 주식회사 본딩 장치
JP7498630B2 (ja) * 2020-09-11 2024-06-12 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
KR102451494B1 (ko) * 2021-02-10 2022-10-07 (주)테크윙 전자부품의 안착상태를 확인하기 위한 장치
CN114068363B (zh) * 2021-10-26 2025-06-13 北京工业大学 一种高精密芯片装片方法及设备
KR102537573B1 (ko) * 2023-01-27 2023-05-30 주식회사 엠아이이큅먼트코리아 플립 칩 레이저 본딩장치의 본딩 툴
KR102843835B1 (ko) * 2023-04-05 2025-08-07 한미반도체 주식회사 열압착 본딩장치
CN117497434B (zh) * 2023-12-29 2024-04-09 砺铸智能设备(天津)有限公司 一种芯片倒装设备及其方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5839187A (en) * 1995-08-24 1998-11-24 Matsushita Electric Industrial Co., Ltd. Apparatus and method for mounting a chip
US20030177633A1 (en) * 2002-03-25 2003-09-25 Matsushita Electric Industrial Co., Ltd Electronic component mounting apparatus and electronic component mounting method
WO2005008726A2 (en) * 2003-07-09 2005-01-27 Newport Corporation Flip chip device assembly machine
WO2008098861A1 (de) * 2007-02-14 2008-08-21 Oerlikon Assembly Equipment Ag, Steinhausen Verfahren und montageautomat fuer die montage von halbleiterchips als flipchip auf einem substrat
WO2012166052A1 (en) * 2011-06-03 2012-12-06 Orion Systems Integration Pte Ltd Method and systems for semiconductor chip pick & transfer and bonding
AT512859A2 (de) * 2012-05-11 2013-11-15 Hanmi Semiconductor Co Ltd Halbleiterchip Wende- und Befestigungseinrichtung

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000022395A (ja) 1998-04-30 2000-01-21 Toshiba Corp 電子部品の実装方法および実装装置
SG104292A1 (en) * 2002-01-07 2004-06-21 Advance Systems Automation Ltd Flip chip bonder and method therefor
JP2010114338A (ja) 2008-11-10 2010-05-20 Panasonic Corp 部品実装機及び部品実装方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5839187A (en) * 1995-08-24 1998-11-24 Matsushita Electric Industrial Co., Ltd. Apparatus and method for mounting a chip
US20030177633A1 (en) * 2002-03-25 2003-09-25 Matsushita Electric Industrial Co., Ltd Electronic component mounting apparatus and electronic component mounting method
WO2005008726A2 (en) * 2003-07-09 2005-01-27 Newport Corporation Flip chip device assembly machine
WO2008098861A1 (de) * 2007-02-14 2008-08-21 Oerlikon Assembly Equipment Ag, Steinhausen Verfahren und montageautomat fuer die montage von halbleiterchips als flipchip auf einem substrat
WO2012166052A1 (en) * 2011-06-03 2012-12-06 Orion Systems Integration Pte Ltd Method and systems for semiconductor chip pick & transfer and bonding
AT512859A2 (de) * 2012-05-11 2013-11-15 Hanmi Semiconductor Co Ltd Halbleiterchip Wende- und Befestigungseinrichtung

Also Published As

Publication number Publication date
TW201438121A (zh) 2014-10-01
CN104078373A (zh) 2014-10-01
AT514134A2 (de) 2014-10-15
TWI620255B (zh) 2018-04-01
KR101425613B1 (ko) 2014-08-01
CN104078373B (zh) 2018-02-02

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REJ Rejection

Effective date: 20171115