AT526918A5 - Ultraschallbondanlage - Google Patents
Ultraschallbondanlage Download PDFInfo
- Publication number
- AT526918A5 AT526918A5 ATA9273/2021A AT92732021A AT526918A5 AT 526918 A5 AT526918 A5 AT 526918A5 AT 92732021 A AT92732021 A AT 92732021A AT 526918 A5 AT526918 A5 AT 526918A5
- Authority
- AT
- Austria
- Prior art keywords
- contact electrode
- welding
- welding tool
- holder
- ultrasonic
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
- B23K37/02—Carriages for supporting the welding or cutting element
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07531—Techniques
- H10W72/07532—Compression bonding, e.g. thermocompression bonding
- H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Wire Bonding (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
Die Ultraschallbondanlage enthält ein Gehäuse mit einem U-förmigen Grundrahmen (1), die auf ei- ner Grundplatte (2) montiert ist. Der Schweißkopf (3) umfasst eine Halterung eines Ultraschall- wandlers mit einem darin befestigten Schweißwerkzeug (5) und einen zweiarmigen Hebel (6), der mittig koaxial zueinander installiert ist. Die Anlage enthält einen Mechanismus für vertikale (11) und horizontale (13) Bewegung, eine Drahtklemmanordnung mit Spannaufnahmen, einen optischen Kopf, eine Vorrichtung zum Bewegen des geschweißten Geräts, einen beheizten Montagetisch (16), einen Ultraschallgenerator und eine Stromquelle. Neben dem Schweißwerkzeug ist eine in einer Halterung (21) fixierte Kontaktelektrode (22) installiert. Das Arbeitsende der Kontaktelektrode (22) ist von dem Arbeitsende des Schweißwerkzeugs (5) entlang der Z-Achse um einen Wert getrennt, der nicht kleiner als der Stauchweg des Leiters während des Schweißens ist. Die Kontaktelektrode (22) kann sich in Bezug auf Schweißwerkzeug (5) entlang der X-, Y-, Z-Achse bewegen und wäh- rend des Schweißens einen einstellbaren statischen Druck auf den Leiter einzustellen. Die Halte- rung (21) der Kontaktelektrode (22) ist an einem zusätzlichen zweiarmigen Hebel befestigt und elektrisch vom Anlagegehäuse getrennt. Die Halter des Ultraschallwandlers und der Kontaktelekt- rode (22) sind elektrisch mit den Stromquellenausgängen verbunden.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| RU2020129362A RU2742635C1 (ru) | 2020-09-04 | 2020-09-04 | Установка ультразвуковой микросварки |
| PCT/RU2021/050271 WO2022050874A1 (ru) | 2020-09-04 | 2021-08-20 | Установка ультразвуковой микросварки |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| AT526918A5 true AT526918A5 (de) | 2024-07-15 |
| AT526918B1 AT526918B1 (de) | 2025-04-15 |
Family
ID=74554807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ATA9273/2021A AT526918B1 (de) | 2020-09-04 | 2021-08-20 | Ultraschallbondanlage |
Country Status (4)
| Country | Link |
|---|---|
| AT (1) | AT526918B1 (de) |
| CH (1) | CH719170B1 (de) |
| RU (1) | RU2742635C1 (de) |
| WO (1) | WO2022050874A1 (de) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2759103C1 (ru) * | 2021-05-13 | 2021-11-09 | Александр Владимирович Подувальцев | Установка для микросварки проволочных проводников |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3570318A1 (de) * | 2018-05-15 | 2019-11-20 | Infineon Technologies AG | Verfahren zur verbindung eines elektrisch leitenden elements mit einem verbindungspartner |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2400986A1 (fr) * | 1977-08-26 | 1979-03-23 | Motorola Automobile | Perfectionnement au procede de soudage par ultrason d'un fil metallique sur une piece metallique |
| SU1540986A1 (ru) * | 1988-01-13 | 1990-02-07 | Предприятие П/Я Р-6668 | Установка дл ультразвуковой микросварки и контрол соединени |
| SU1673347A1 (ru) * | 1989-09-04 | 1991-08-30 | Конструкторское бюро точного электронного машиностроения | Устройство дл ультразвуковой сварки |
| RU15970U1 (ru) * | 2000-06-02 | 2000-11-27 | Сизов Вячеслав Геннадьевич | Установка для микросварки |
| JP2003126967A (ja) * | 2001-10-16 | 2003-05-08 | Yazaki Corp | 超音波溶着装置 |
| DE112011102493B4 (de) * | 2010-07-26 | 2021-11-04 | Pukyong National University Business Incubator Center | Vorrichtung zum Vibro-Punktschweißen |
| RU2525962C1 (ru) * | 2013-02-13 | 2014-08-20 | Открытое акционерное общество "Научно-исследовательский институт электронной техники" | Способ приварки вывода в полупроводниковом приборе |
-
2020
- 2020-09-04 RU RU2020129362A patent/RU2742635C1/ru active
-
2021
- 2021-08-20 AT ATA9273/2021A patent/AT526918B1/de active
- 2021-08-20 CH CH000228/2023A patent/CH719170B1/de unknown
- 2021-08-20 WO PCT/RU2021/050271 patent/WO2022050874A1/ru not_active Ceased
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3570318A1 (de) * | 2018-05-15 | 2019-11-20 | Infineon Technologies AG | Verfahren zur verbindung eines elektrisch leitenden elements mit einem verbindungspartner |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022050874A1 (ru) | 2022-03-10 |
| AT526918B1 (de) | 2025-04-15 |
| RU2742635C1 (ru) | 2021-02-09 |
| CH719170B1 (de) | 2025-02-28 |
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