AT526918A5 - Ultraschallbondanlage - Google Patents

Ultraschallbondanlage Download PDF

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Publication number
AT526918A5
AT526918A5 ATA9273/2021A AT92732021A AT526918A5 AT 526918 A5 AT526918 A5 AT 526918A5 AT 92732021 A AT92732021 A AT 92732021A AT 526918 A5 AT526918 A5 AT 526918A5
Authority
AT
Austria
Prior art keywords
contact electrode
welding
welding tool
holder
ultrasonic
Prior art date
Application number
ATA9273/2021A
Other languages
English (en)
Other versions
AT526918B1 (de
Inventor
Aleksandrovich Poduvaltsev Aleksei
Original Assignee
Aleksandrovich Poduvaltsev Aleksei
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aleksandrovich Poduvaltsev Aleksei filed Critical Aleksandrovich Poduvaltsev Aleksei
Publication of AT526918A5 publication Critical patent/AT526918A5/de
Application granted granted Critical
Publication of AT526918B1 publication Critical patent/AT526918B1/de

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004Wire welding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/02Carriages for supporting the welding or cutting element
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/0711Apparatus therefor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/075Connecting or disconnecting of bond wires
    • H10W72/07531Techniques
    • H10W72/07532Compression bonding, e.g. thermocompression bonding
    • H10W72/07533Ultrasonic bonding, e.g. thermosonic bonding
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/075Connecting or disconnecting of bond wires
    • H10W72/07551Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/551Materials of bond wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Wire Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

Die Ultraschallbondanlage enthält ein Gehäuse mit einem U-förmigen Grundrahmen (1), die auf ei- ner Grundplatte (2) montiert ist. Der Schweißkopf (3) umfasst eine Halterung eines Ultraschall- wandlers mit einem darin befestigten Schweißwerkzeug (5) und einen zweiarmigen Hebel (6), der mittig koaxial zueinander installiert ist. Die Anlage enthält einen Mechanismus für vertikale (11) und horizontale (13) Bewegung, eine Drahtklemmanordnung mit Spannaufnahmen, einen optischen Kopf, eine Vorrichtung zum Bewegen des geschweißten Geräts, einen beheizten Montagetisch (16), einen Ultraschallgenerator und eine Stromquelle. Neben dem Schweißwerkzeug ist eine in einer Halterung (21) fixierte Kontaktelektrode (22) installiert. Das Arbeitsende der Kontaktelektrode (22) ist von dem Arbeitsende des Schweißwerkzeugs (5) entlang der Z-Achse um einen Wert getrennt, der nicht kleiner als der Stauchweg des Leiters während des Schweißens ist. Die Kontaktelektrode (22) kann sich in Bezug auf Schweißwerkzeug (5) entlang der X-, Y-, Z-Achse bewegen und wäh- rend des Schweißens einen einstellbaren statischen Druck auf den Leiter einzustellen. Die Halte- rung (21) der Kontaktelektrode (22) ist an einem zusätzlichen zweiarmigen Hebel befestigt und elektrisch vom Anlagegehäuse getrennt. Die Halter des Ultraschallwandlers und der Kontaktelekt- rode (22) sind elektrisch mit den Stromquellenausgängen verbunden.
ATA9273/2021A 2020-09-04 2021-08-20 Ultraschallbondanlage AT526918B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
RU2020129362A RU2742635C1 (ru) 2020-09-04 2020-09-04 Установка ультразвуковой микросварки
PCT/RU2021/050271 WO2022050874A1 (ru) 2020-09-04 2021-08-20 Установка ультразвуковой микросварки

Publications (2)

Publication Number Publication Date
AT526918A5 true AT526918A5 (de) 2024-07-15
AT526918B1 AT526918B1 (de) 2025-04-15

Family

ID=74554807

Family Applications (1)

Application Number Title Priority Date Filing Date
ATA9273/2021A AT526918B1 (de) 2020-09-04 2021-08-20 Ultraschallbondanlage

Country Status (4)

Country Link
AT (1) AT526918B1 (de)
CH (1) CH719170B1 (de)
RU (1) RU2742635C1 (de)
WO (1) WO2022050874A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2759103C1 (ru) * 2021-05-13 2021-11-09 Александр Владимирович Подувальцев Установка для микросварки проволочных проводников

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3570318A1 (de) * 2018-05-15 2019-11-20 Infineon Technologies AG Verfahren zur verbindung eines elektrisch leitenden elements mit einem verbindungspartner

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2400986A1 (fr) * 1977-08-26 1979-03-23 Motorola Automobile Perfectionnement au procede de soudage par ultrason d'un fil metallique sur une piece metallique
SU1540986A1 (ru) * 1988-01-13 1990-02-07 Предприятие П/Я Р-6668 Установка дл ультразвуковой микросварки и контрол соединени
SU1673347A1 (ru) * 1989-09-04 1991-08-30 Конструкторское бюро точного электронного машиностроения Устройство дл ультразвуковой сварки
RU15970U1 (ru) * 2000-06-02 2000-11-27 Сизов Вячеслав Геннадьевич Установка для микросварки
JP2003126967A (ja) * 2001-10-16 2003-05-08 Yazaki Corp 超音波溶着装置
DE112011102493B4 (de) * 2010-07-26 2021-11-04 Pukyong National University Business Incubator Center Vorrichtung zum Vibro-Punktschweißen
RU2525962C1 (ru) * 2013-02-13 2014-08-20 Открытое акционерное общество "Научно-исследовательский институт электронной техники" Способ приварки вывода в полупроводниковом приборе

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3570318A1 (de) * 2018-05-15 2019-11-20 Infineon Technologies AG Verfahren zur verbindung eines elektrisch leitenden elements mit einem verbindungspartner

Also Published As

Publication number Publication date
WO2022050874A1 (ru) 2022-03-10
AT526918B1 (de) 2025-04-15
RU2742635C1 (ru) 2021-02-09
CH719170B1 (de) 2025-02-28

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