AT527530A5 - Prüfsystem - Google Patents

Prüfsystem Download PDF

Info

Publication number
AT527530A5
AT527530A5 ATA9431/2017A AT94312017A AT527530A5 AT 527530 A5 AT527530 A5 AT 527530A5 AT 94312017 A AT94312017 A AT 94312017A AT 527530 A5 AT527530 A5 AT 527530A5
Authority
AT
Austria
Prior art keywords
test
probe
electrode
device under
holder
Prior art date
Application number
ATA9431/2017A
Other languages
English (en)
Other versions
AT527530A2 (de
AT527530B1 (de
Inventor
Hamada Takayuki
Sakamoto Yoichi
Original Assignee
Sintokogio Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sintokogio Ltd filed Critical Sintokogio Ltd
Publication of AT527530A2 publication Critical patent/AT527530A2/de
Publication of AT527530A5 publication Critical patent/AT527530A5/de
Application granted granted Critical
Publication of AT527530B1 publication Critical patent/AT527530B1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Iron Core Of Rotating Electric Machines (AREA)
  • Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
  • Lubricants (AREA)

Abstract

Bereitgestellt wird ein Prüfsystem, das eingerichtet ist, eine Prüfung der elektrischen Eigenschaften an einem Prüfling vorzunehmen, wobei das System aufweist: eine Halterung, an der der Prüfling montiert werden soll; einen Fördermechanismus, der eingerichtet ist, die Halterung zu befördern; einen Prüfkopf, der eine Messschaltung zum Durchführen der Prüfung der elektrischen Eigenschaften aufweist; einen Messfühler, der eingerichtet ist, eine Elektrode des Prüflings mit der Messschaltung zu verbinden; einen Anhebe/Absenk-Mechanismus, der eingerichtet ist, die Halterung entlang einer ersten Richtung derart zu bewegen, dass die Elektrode und der Messfühler in Kontakt miteinander oder voneinander beabstandet sind; und einen Ausrichtungsmechanismus, der an dem Prüfkopf vorgesehen ist, wobei der Ausrichtungsmechanismus eingerichtet ist, den Messfühler in einer Ebene zu bewegen, die die erste Richtung schneidet, um ein Ausrichten des Messfühlers an der Elektrode in der Ebene durchzuführen.
ATA9431/2017A 2017-02-22 2017-12-19 Prüfsystem AT527530B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017031180 2017-02-22
PCT/JP2017/045546 WO2018154941A1 (ja) 2017-02-22 2017-12-19 テストシステム

Publications (3)

Publication Number Publication Date
AT527530A2 AT527530A2 (de) 2025-02-15
AT527530A5 true AT527530A5 (de) 2025-02-15
AT527530B1 AT527530B1 (de) 2025-04-15

Family

ID=63254342

Family Applications (1)

Application Number Title Priority Date Filing Date
ATA9431/2017A AT527530B1 (de) 2017-02-22 2017-12-19 Prüfsystem

Country Status (7)

Country Link
US (1) US11125814B2 (de)
JP (1) JP6885456B2 (de)
CN (1) CN110023773B (de)
AT (1) AT527530B1 (de)
DE (1) DE112017007108T5 (de)
TW (1) TWI772347B (de)
WO (1) WO2018154941A1 (de)

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TWI676031B (zh) * 2018-09-06 2019-11-01 致茂電子股份有限公司 滑移式電子元件測試裝置
US11001078B2 (en) 2018-09-28 2021-05-11 Rohinni, LLC Interchangeable guide head for transfer mechanism
US11232968B2 (en) 2018-09-28 2022-01-25 Rohinni, LLC Variable pitch multi-needle head for transfer of semiconductor devices
JP7128415B2 (ja) * 2018-10-29 2022-08-31 澁谷工業株式会社 半導体素子検査装置
US11217471B2 (en) 2019-03-06 2022-01-04 Rohinni, LLC Multi-axis movement for transfer of semiconductor devices
CN110888034A (zh) * 2019-12-06 2020-03-17 苏州苏汀达自动化科技有限公司 一种雪崩光电二极管雪崩偏压查找的装置
KR102141535B1 (ko) * 2020-03-03 2020-08-05 장용철 멀티 플라잉 프로브 테스터
KR102291194B1 (ko) * 2020-03-09 2021-08-20 에이엠티 주식회사 미세 피치를 갖는 디바이스의 얼라인장치 및 그 방법
TWI881139B (zh) * 2020-06-30 2025-04-21 日商東京威力科創股份有限公司 檢查裝置及檢查方法
EP4184653A4 (de) * 2020-08-28 2024-08-14 Hirata Corporation Testverfahren und herstellungsverfahren
JP7435536B2 (ja) * 2021-04-28 2024-02-21 株式会社村田製作所 電子部品の生産装置
TWI815281B (zh) * 2022-01-20 2023-09-11 致茂電子股份有限公司 雙迴道檢測裝置及其檢測方法
JP2023167818A (ja) * 2022-05-13 2023-11-24 株式会社アドバンテスト 電子部品ハンドリング装置、及び、電子部品試験装置
US20240219481A1 (en) * 2022-12-30 2024-07-04 Schneider Electric USA, Inc. Apparatuses, systems, and methods for screening electronic components
JP2025034867A (ja) * 2023-08-31 2025-03-13 株式会社アドバンテスト 半導体デバイスハンドリング装置及び半導体デバイス試験装置
WO2026099309A1 (en) * 2024-11-05 2026-05-15 Universität Basel Method, measurement system and software for performing high-throughput electrical measurements, particularly at cryogenic temperatures
KR102961179B1 (ko) 2025-05-20 2026-05-07 에이엠티 주식회사 미세 피치를 갖는 디바이스의 얼라인장치 및 그 방법

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US20040100297A1 (en) * 2002-10-29 2004-05-27 Nec Corporation Semiconductor device inspection apparatus and inspection method
US20080100321A1 (en) * 2006-01-18 2008-05-01 Uday Nayak Methods and apparatuses for improved stabilization in a probing system

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Publication number Priority date Publication date Assignee Title
US5644245A (en) * 1993-11-24 1997-07-01 Tokyo Electron Limited Probe apparatus for inspecting electrical characteristics of a microelectronic element
US20040100297A1 (en) * 2002-10-29 2004-05-27 Nec Corporation Semiconductor device inspection apparatus and inspection method
US20080100321A1 (en) * 2006-01-18 2008-05-01 Uday Nayak Methods and apparatuses for improved stabilization in a probing system

Also Published As

Publication number Publication date
AT527530A2 (de) 2025-02-15
JP6885456B2 (ja) 2021-06-16
WO2018154941A1 (ja) 2018-08-30
AT527530B1 (de) 2025-04-15
US20190353701A1 (en) 2019-11-21
CN110023773A (zh) 2019-07-16
TW201831915A (zh) 2018-09-01
CN110023773B (zh) 2022-03-01
DE112017007108T5 (de) 2019-11-21
US11125814B2 (en) 2021-09-21
JPWO2018154941A1 (ja) 2019-12-12
TWI772347B (zh) 2022-08-01

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