ATA14152000A - METHOD AND DEVICE FOR FIXING ELECTRONIC CIRCUITS - Google Patents

METHOD AND DEVICE FOR FIXING ELECTRONIC CIRCUITS

Info

Publication number
ATA14152000A
ATA14152000A AT0141500A AT14152000A ATA14152000A AT A14152000 A ATA14152000 A AT A14152000A AT 0141500 A AT0141500 A AT 0141500A AT 14152000 A AT14152000 A AT 14152000A AT A14152000 A ATA14152000 A AT A14152000A
Authority
AT
Austria
Prior art keywords
electronic circuits
fixing electronic
fixing
circuits
electronic
Prior art date
Application number
AT0141500A
Other languages
German (de)
Other versions
AT410882B (en
Inventor
Hugo Dipl Ing Dr Pristauz
Original Assignee
Datacon Semiconductor Equip
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Datacon Semiconductor Equip filed Critical Datacon Semiconductor Equip
Priority to AT0141500A priority Critical patent/AT410882B/en
Priority to PCT/AT2001/000268 priority patent/WO2002015659A1/en
Priority to AU2001281570A priority patent/AU2001281570A1/en
Publication of ATA14152000A publication Critical patent/ATA14152000A/en
Application granted granted Critical
Publication of AT410882B publication Critical patent/AT410882B/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Die Bonding (AREA)
AT0141500A 2000-08-17 2000-08-17 METHOD AND DEVICE FOR FIXING ELECTRONIC CIRCUITS AT410882B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
AT0141500A AT410882B (en) 2000-08-17 2000-08-17 METHOD AND DEVICE FOR FIXING ELECTRONIC CIRCUITS
PCT/AT2001/000268 WO2002015659A1 (en) 2000-08-17 2001-08-14 Method and device for the fixing of electronic circuits
AU2001281570A AU2001281570A1 (en) 2000-08-17 2001-08-14 Method and device for the fixing of electronic circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AT0141500A AT410882B (en) 2000-08-17 2000-08-17 METHOD AND DEVICE FOR FIXING ELECTRONIC CIRCUITS

Publications (2)

Publication Number Publication Date
ATA14152000A true ATA14152000A (en) 2002-12-15
AT410882B AT410882B (en) 2003-08-25

Family

ID=3688206

Family Applications (1)

Application Number Title Priority Date Filing Date
AT0141500A AT410882B (en) 2000-08-17 2000-08-17 METHOD AND DEVICE FOR FIXING ELECTRONIC CIRCUITS

Country Status (3)

Country Link
AT (1) AT410882B (en)
AU (1) AU2001281570A1 (en)
WO (1) WO2002015659A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006051607B4 (en) * 2006-11-02 2008-11-20 Mühlbauer Ag Method and device for the standard application and mounting of electronic components on substrates

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4618392A (en) * 1982-03-05 1986-10-21 Tokyo Electric Co., Ltd. Label adhering apparatus
DE3623031A1 (en) * 1986-07-09 1988-01-14 Raetz Klaus Mounting device for electronics printed circuit boards in microelectronics
CA1278876C (en) * 1986-12-25 1991-01-08 Sho Masujima Adhesive mounted electronic circuit element
JPH0787277B2 (en) * 1987-03-25 1995-09-20 ティーディーケイ株式会社 Board mounting method for surface mount components
DE4015941A1 (en) * 1990-05-18 1991-11-21 Gustav Flier Increased contrast, auto visual controlled chip mounting - using fluorescent liquid on chip legs to enable camera to accurately control positioning of chips on high density circuit board
JP2833184B2 (en) * 1990-09-20 1998-12-09 富士通株式会社 Chip bonding apparatus and method
JPH0715123A (en) * 1993-06-24 1995-01-17 Matsushita Electric Ind Co Ltd Electronic component mounting method
JPH07321452A (en) * 1994-05-24 1995-12-08 Sony Corp Flux attachment method and apparatus
DE69809787T2 (en) * 1997-10-02 2003-09-18 Matsushita Electric Industrial Co., Ltd. ASSEMBLY METHOD FOR SEMICONDUCTOR COMPONENTS ON A PCB

Also Published As

Publication number Publication date
AU2001281570A1 (en) 2002-02-25
AT410882B (en) 2003-08-25
WO2002015659A1 (en) 2002-02-21

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