ATA149098A - Metall-matrix-composite- (mmc-) bauteil - Google Patents

Metall-matrix-composite- (mmc-) bauteil

Info

Publication number
ATA149098A
ATA149098A AT0149098A AT149098A ATA149098A AT A149098 A ATA149098 A AT A149098A AT 0149098 A AT0149098 A AT 0149098A AT 149098 A AT149098 A AT 149098A AT A149098 A ATA149098 A AT A149098A
Authority
AT
Austria
Prior art keywords
mmc
component
matrix composite
metal matrix
composite
Prior art date
Application number
AT0149098A
Other languages
English (en)
Other versions
AT408153B (de
Inventor
Theodore Dr Schmitt
Original Assignee
Electrovac
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electrovac filed Critical Electrovac
Priority to AT0149098A priority Critical patent/AT408153B/de
Priority to US09/148,450 priority patent/US6186768B1/en
Priority to JP11003003A priority patent/JP2000077584A/ja
Priority to DE19938308A priority patent/DE19938308A1/de
Priority to GB9919069A priority patent/GB2342926B/en
Priority to FR9910777A priority patent/FR2782735B1/fr
Priority to IT1999MI001840A priority patent/IT1313336B1/it
Publication of ATA149098A publication Critical patent/ATA149098A/de
Application granted granted Critical
Publication of AT408153B publication Critical patent/AT408153B/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/257—Arrangements for cooling characterised by their materials having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/254—Diamond
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C2204/00—End product comprising different layers, coatings or parts of cermet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
    • Y10T428/12049—Nonmetal component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12479—Porous [e.g., foamed, spongy, cracked, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249967—Inorganic matrix in void-containing component
    • Y10T428/249969—Of silicon-containing material [e.g., glass, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249987—With nonvoid component of specified composition
    • Y10T428/24999—Inorganic
AT0149098A 1998-09-02 1998-09-02 Metall-matrix-composite- (mmc-) bauteil AT408153B (de)

Priority Applications (7)

Application Number Priority Date Filing Date Title
AT0149098A AT408153B (de) 1998-09-02 1998-09-02 Metall-matrix-composite- (mmc-) bauteil
US09/148,450 US6186768B1 (en) 1998-09-02 1998-09-04 Metal matrix composite (MMC) body
JP11003003A JP2000077584A (ja) 1998-09-02 1999-01-08 金属マトリックスコンポジットボデ―
DE19938308A DE19938308A1 (de) 1998-09-02 1999-08-12 Metall-Matrix-Composite-(MMC-)Bauteil
GB9919069A GB2342926B (en) 1998-09-02 1999-08-12 Metal matrix composite (MMC) body
FR9910777A FR2782735B1 (fr) 1998-09-02 1999-08-25 Element en coposite a matrice metallique (mmc)
IT1999MI001840A IT1313336B1 (it) 1998-09-02 1999-08-26 Elemento composito a matrice metallica mmc

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AT0149098A AT408153B (de) 1998-09-02 1998-09-02 Metall-matrix-composite- (mmc-) bauteil

Publications (2)

Publication Number Publication Date
ATA149098A true ATA149098A (de) 2001-01-15
AT408153B AT408153B (de) 2001-09-25

Family

ID=3515027

Family Applications (1)

Application Number Title Priority Date Filing Date
AT0149098A AT408153B (de) 1998-09-02 1998-09-02 Metall-matrix-composite- (mmc-) bauteil

Country Status (7)

Country Link
US (1) US6186768B1 (de)
JP (1) JP2000077584A (de)
AT (1) AT408153B (de)
DE (1) DE19938308A1 (de)
FR (1) FR2782735B1 (de)
GB (1) GB2342926B (de)
IT (1) IT1313336B1 (de)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5962103A (en) * 1997-01-13 1999-10-05 General Electric Company Silicon carbide-silicon composite having improved oxidation resistance and method of making
US6533554B1 (en) * 1999-11-01 2003-03-18 University Of Southern California Thermal transpiration pump
US6596139B2 (en) * 2000-05-31 2003-07-22 Honeywell International Inc. Discontinuous high-modulus fiber metal matrix composite for physical vapor deposition target backing plates and other thermal management applications
US6582812B1 (en) * 2000-11-08 2003-06-24 General Electric Company Article made of a ceramic foam joined to a metallic nonfoam, and its preparation
US6635357B2 (en) * 2002-02-28 2003-10-21 Vladimir S. Moxson Bulletproof lightweight metal matrix macrocomposites with controlled structure and manufacture the same
DE10245266A1 (de) * 2002-09-27 2004-04-15 Robert Bosch Gmbh Vorrichtung zur Kühlung von elektronischen Bauelementen
AT412265B (de) * 2002-11-12 2004-12-27 Electrovac Bauteil zur wärmeableitung
US8220489B2 (en) 2002-12-18 2012-07-17 Vapor Technologies Inc. Faucet with wear-resistant valve component
US7866343B2 (en) * 2002-12-18 2011-01-11 Masco Corporation Of Indiana Faucet
US7866342B2 (en) * 2002-12-18 2011-01-11 Vapor Technologies, Inc. Valve component for faucet
US8555921B2 (en) * 2002-12-18 2013-10-15 Vapor Technologies Inc. Faucet component with coating
US6904935B2 (en) * 2002-12-18 2005-06-14 Masco Corporation Of Indiana Valve component with multiple surface layers
DE10260851B4 (de) * 2002-12-23 2013-07-18 Robert Bosch Gmbh Verfahren zur Herstellung einer Kühlvorrichtung für Leistungsbauelemente, Kühlvorrichtung und elektronisches Steuergerät
US20040222090A1 (en) * 2003-05-07 2004-11-11 Tim Scott Carbon fiber and copper support for physical vapor deposition target assemblies
US20050092478A1 (en) * 2003-10-30 2005-05-05 Visteon Global Technologies, Inc. Metal foam heat sink
DE102004022118A1 (de) * 2004-05-05 2005-11-24 Conti Temic Microelectronic Gmbh Anordnung zur Kühlung einer Elektronikeinheit sowie Herstellung einer solchen Anordnung
US7329948B2 (en) * 2004-10-15 2008-02-12 International Business Machines Corporation Microelectronic devices and methods
US20070026205A1 (en) * 2005-08-01 2007-02-01 Vapor Technologies Inc. Article having patterned decorative coating
US20080166492A1 (en) * 2007-01-09 2008-07-10 International Business Machines Corporation Metal-graphite foam composite and a cooling apparatus for using the same
FR2925896B1 (fr) * 2007-12-28 2010-02-05 Messier Dowty Sa Procede de fabrication d'une piece metallique renforcee de fibres ceramiques
EP2332674B1 (de) * 2008-10-03 2019-11-27 Sumitomo Electric Industries, Ltd. Verbundelement
US20100239880A1 (en) * 2009-03-17 2010-09-23 Gm Global Technology Operations, Inc. Metal matrix composites and metallic composite foams with in-situ generated carbonaceous fibrous reinforcements
KR20120055602A (ko) * 2009-08-04 2012-05-31 나오히로 요시다 히트싱크 및 그 제조방법
TW201111734A (en) * 2009-09-16 2011-04-01 Chenming Mold Ind Corp Heat dissipation module and manufacturing method thereof
JP5303414B2 (ja) 2009-09-25 2013-10-02 富士フイルム株式会社 撮像装置及び内視鏡
US9556501B2 (en) * 2010-04-02 2017-01-31 Sumitomo Electric Industries, Ltd. Magnesium-based composite member, heat radiation member, and semiconductor device
WO2012071353A1 (en) * 2010-11-22 2012-05-31 Saint-Gobain Ceramics & Plastics, Inc. Infiltrated silicon carbide bodies and methods of making
DE102011080299B4 (de) * 2011-08-02 2016-02-11 Infineon Technologies Ag Verfahren, mit dem ein Schaltungsträger hergestellt wird, und Verfahren zur Herstellung einer Halbleiteranordnung
CN102504769A (zh) * 2011-09-30 2012-06-20 东南大学 弹性复合金属热界面材料及其制备方法
WO2013102175A1 (en) * 2011-12-30 2013-07-04 Saint-Gobain Ceramics & Plastics, Inc. Construction articles and methods of forming same
WO2014151094A1 (en) 2013-03-15 2014-09-25 Rolls-Royce Corporation Melt infiltration wick attachment
US9573853B2 (en) * 2013-03-15 2017-02-21 Rolls-Royce North American Technologies Inc. Melt infiltration apparatus and method for molten metal control
CN104451238A (zh) * 2014-12-02 2015-03-25 常熟市东涛金属复合材料有限公司 一种电子封装用新型高导热率金属复合材料的制备方法
CN106024124B (zh) * 2016-07-14 2017-08-29 安徽樵森电气科技股份有限公司 抗氧化防漏电铝芯导线
CN111312673A (zh) * 2019-08-23 2020-06-19 北京绿能芯创电子科技有限公司 埋入式陶瓷板与金属合金压铸成型的散热装置及制造方法
CN110923493B (zh) * 2019-10-16 2021-04-30 蚌埠学院 一种孔结构SiC/Al复合材料的制备工艺
US12289865B2 (en) * 2022-11-04 2025-04-29 Amulaire Thermal Technology, Inc. Two-phase immersion-cooling heat-dissipation composite structure having high-porosity solid structure and high-thermal-conductivity fins

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3465965A (en) * 1966-04-20 1969-09-09 Kanthal Ab Tail-pipe nozzle for rocket motors
JPS60224752A (ja) * 1984-04-20 1985-11-09 Ube Ind Ltd 無機繊維強化金属複合材料
DE3430470C2 (de) * 1984-08-18 1986-12-04 Ludwig Riedhammer GmbH, 8500 Nürnberg Deckenelement für einen Industrieofen
JPS61279645A (ja) * 1985-06-04 1986-12-10 Toyota Motor Corp 炭化ケイ素短繊維強化アルミニウム合金
US5002905A (en) * 1986-08-22 1991-03-26 Stemcor Corporation Hexagonal silicon carbide platelets and preforms and methods for making and using same
US4761134B1 (en) * 1987-03-30 1993-11-16 Silicon carbide diffusion furnace components with an impervious coating thereon
JPH0768066B2 (ja) * 1987-12-25 1995-07-26 イビデン株式会社 耐熱性複合体及びその製造方法
DE3804124A1 (de) * 1988-02-11 1989-08-17 Htk Ges Fuer Hochtemperaturker Verfahren zum herstellen eines gegenstands aus siliziumkarbid-keramik
JPH0570823A (ja) * 1991-03-15 1993-03-23 Ngk Insulators Ltd ローラーハースキルン用のローラー
US5616421A (en) * 1991-04-08 1997-04-01 Aluminum Company Of America Metal matrix composites containing electrical insulators
US5775403A (en) * 1991-04-08 1998-07-07 Aluminum Company Of America Incorporating partially sintered preforms in metal matrix composites
US5353498A (en) * 1993-02-08 1994-10-11 General Electric Company Method for fabricating an integrated circuit module
JP3498989B2 (ja) * 1994-02-03 2004-02-23 東海カーボン株式会社 炭化珪素系複合材料とその製造方法
CZ321196A3 (en) * 1995-03-01 1997-04-16 Saint Gobain Norton Ind Cerami Novel artificial lamella of silicon carbide
US5616886A (en) * 1995-06-05 1997-04-01 Motorola Wirebondless module package
JPH09208319A (ja) * 1996-02-06 1997-08-12 Tokai Konetsu Kogyo Co Ltd ＳｉＣ質耐火物の製造方法
AT411070B (de) * 1996-03-25 2003-09-25 Electrovac Verfahren zur herstellung eines substrates mit einer polykristallinen diamantschicht
US5702997A (en) * 1996-10-04 1997-12-30 Saint-Gobain/Norton Industrial Ceramics Corp. Process for making crack-free silicon carbide diffusion components
US5770324A (en) * 1997-03-03 1998-06-23 Saint-Gobain Industrial Ceramics, Inc. Method of using a hot pressed silicon carbide dummy wafer

Also Published As

Publication number Publication date
FR2782735A1 (fr) 2000-03-03
US6186768B1 (en) 2001-02-13
JP2000077584A (ja) 2000-03-14
GB9919069D0 (en) 1999-10-13
GB2342926B (en) 2001-11-14
ITMI991840A1 (it) 2001-02-26
GB2342926A (en) 2000-04-26
DE19938308A1 (de) 2000-03-09
FR2782735B1 (fr) 2002-05-24
AT408153B (de) 2001-09-25
IT1313336B1 (it) 2002-07-17
ITMI991840A0 (it) 1999-08-26

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Legal Events

Date Code Title Description
REN Ceased due to non-payment of the annual fee
ELJ Ceased due to non-payment of the annual fee