ATA17652000A - METHOD FOR PRODUCING AN ADHESIVE CONNECTION FROM A DISC-SHAPED SEMICONDUCTOR SUBSTRATE TO A FLEXIBLE ADHESIVE TRANSPORT CARRIER, AND DEVICE FOR CARRYING OUT THIS METHOD - Google Patents

METHOD FOR PRODUCING AN ADHESIVE CONNECTION FROM A DISC-SHAPED SEMICONDUCTOR SUBSTRATE TO A FLEXIBLE ADHESIVE TRANSPORT CARRIER, AND DEVICE FOR CARRYING OUT THIS METHOD

Info

Publication number
ATA17652000A
ATA17652000A AT0176500A AT17652000A ATA17652000A AT A17652000 A ATA17652000 A AT A17652000A AT 0176500 A AT0176500 A AT 0176500A AT 17652000 A AT17652000 A AT 17652000A AT A17652000 A ATA17652000 A AT A17652000A
Authority
AT
Austria
Prior art keywords
disc
producing
carrying
semiconductor substrate
shaped semiconductor
Prior art date
Application number
AT0176500A
Other languages
German (de)
Other versions
AT411856B (en
Inventor
Hugo Dipl Ing Dr Pristauz
Frowald Ing Angerer
Original Assignee
Datacon Semiconductor Equip
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Datacon Semiconductor Equip filed Critical Datacon Semiconductor Equip
Priority to AT0176500A priority Critical patent/AT411856B/en
Publication of ATA17652000A publication Critical patent/ATA17652000A/en
Application granted granted Critical
Publication of AT411856B publication Critical patent/AT411856B/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
AT0176500A 2000-10-16 2000-10-16 METHOD FOR PRODUCING AN ADHESIVE CONNECTION FROM A DISC-SHAPED SEMICONDUCTOR SUBSTRATE TO A FLEXIBLE ADHESIVE TRANSPORT CARRIER, AND DEVICE FOR CARRYING OUT THIS METHOD AT411856B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT0176500A AT411856B (en) 2000-10-16 2000-10-16 METHOD FOR PRODUCING AN ADHESIVE CONNECTION FROM A DISC-SHAPED SEMICONDUCTOR SUBSTRATE TO A FLEXIBLE ADHESIVE TRANSPORT CARRIER, AND DEVICE FOR CARRYING OUT THIS METHOD

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AT0176500A AT411856B (en) 2000-10-16 2000-10-16 METHOD FOR PRODUCING AN ADHESIVE CONNECTION FROM A DISC-SHAPED SEMICONDUCTOR SUBSTRATE TO A FLEXIBLE ADHESIVE TRANSPORT CARRIER, AND DEVICE FOR CARRYING OUT THIS METHOD

Publications (2)

Publication Number Publication Date
ATA17652000A true ATA17652000A (en) 2003-11-15
AT411856B AT411856B (en) 2004-06-25

Family

ID=29274640

Family Applications (1)

Application Number Title Priority Date Filing Date
AT0176500A AT411856B (en) 2000-10-16 2000-10-16 METHOD FOR PRODUCING AN ADHESIVE CONNECTION FROM A DISC-SHAPED SEMICONDUCTOR SUBSTRATE TO A FLEXIBLE ADHESIVE TRANSPORT CARRIER, AND DEVICE FOR CARRYING OUT THIS METHOD

Country Status (1)

Country Link
AT (1) AT411856B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008041250A1 (en) * 2008-08-13 2010-02-25 Ers Electronic Gmbh Method and device for the thermal processing of plastic discs, in particular mold wafers

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4603466A (en) * 1984-02-17 1986-08-05 Gca Corporation Wafer chuck
JPS60226124A (en) * 1984-04-25 1985-11-11 Toshiba Corp Resist coating apparatus
JPH0651251B2 (en) * 1987-11-18 1994-07-06 三菱化成株式会社 Wafer manufacturing method and manufacturing apparatus therefor
JPH01321655A (en) * 1988-06-24 1989-12-27 Oki Electric Ind Co Ltd Device for bonding adhesive tape on semiconductor wafer
JPH02137352A (en) * 1988-11-18 1990-05-25 Nec Corp Picking-up of semiconductor element
US5131968A (en) * 1990-07-31 1992-07-21 Motorola, Inc. Gradient chuck method for wafer bonding employing a convex pressure
US5273615A (en) * 1992-04-06 1993-12-28 Motorola, Inc. Apparatus and method for handling fragile semiconductor wafers
GB9618620D0 (en) * 1996-09-06 1996-10-16 Electrotech Equipments Ltd A method of forming a layer
US5809987A (en) * 1996-11-26 1998-09-22 Micron Technology,Inc. Apparatus for reducing damage to wafer cutting blades during wafer dicing
US6080263A (en) * 1997-05-30 2000-06-27 Lintec Corporation Method and apparatus for applying a protecting film to a semiconductor wafer
EP0979852B1 (en) * 1998-08-10 2004-01-28 LINTEC Corporation A dicing tape and a method of dicing a semiconductor wafer

Also Published As

Publication number Publication date
AT411856B (en) 2004-06-25

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