ATA18722002A - Halbleiter-bauelement mit einer kühlplatte - Google Patents

Halbleiter-bauelement mit einer kühlplatte

Info

Publication number
ATA18722002A
ATA18722002A AT0187202A AT18722002A ATA18722002A AT A18722002 A ATA18722002 A AT A18722002A AT 0187202 A AT0187202 A AT 0187202A AT 18722002 A AT18722002 A AT 18722002A AT A18722002 A ATA18722002 A AT A18722002A
Authority
AT
Austria
Prior art keywords
cooling plate
construction element
semiconductor construction
semiconductor
cooling
Prior art date
Application number
AT0187202A
Other languages
English (en)
Other versions
AT413171B (de
Inventor
Gerald Dipl Ing Dr Eckl
Original Assignee
Siemens Ag Oesterreich
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag Oesterreich filed Critical Siemens Ag Oesterreich
Priority to AT0187202A priority Critical patent/AT413171B/de
Priority to DE10352653A priority patent/DE10352653A1/de
Priority to IT000245A priority patent/ITUD20030245A1/it
Publication of ATA18722002A publication Critical patent/ATA18722002A/de
Application granted granted Critical
Publication of AT413171B publication Critical patent/AT413171B/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed inductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233—Filters, inductors or a magnetic substance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09263—Meander
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dc-Dc Converters (AREA)
  • Semiconductor Integrated Circuits (AREA)
AT0187202A 2002-12-16 2002-12-16 Halbleiter-bauelement mit einer kühlplatte AT413171B (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
AT0187202A AT413171B (de) 2002-12-16 2002-12-16 Halbleiter-bauelement mit einer kühlplatte
DE10352653A DE10352653A1 (de) 2002-12-16 2003-11-12 Halbleiter-Bauelement mit einer Kühlplatte
IT000245A ITUD20030245A1 (it) 2002-12-16 2003-12-12 Modulo semiconduttore con una piasta refrigerante.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AT0187202A AT413171B (de) 2002-12-16 2002-12-16 Halbleiter-bauelement mit einer kühlplatte

Publications (2)

Publication Number Publication Date
ATA18722002A true ATA18722002A (de) 2005-04-15
AT413171B AT413171B (de) 2005-11-15

Family

ID=32476055

Family Applications (1)

Application Number Title Priority Date Filing Date
AT0187202A AT413171B (de) 2002-12-16 2002-12-16 Halbleiter-bauelement mit einer kühlplatte

Country Status (3)

Country Link
AT (1) AT413171B (de)
DE (1) DE10352653A1 (de)
IT (1) ITUD20030245A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015003920A1 (de) 2014-09-25 2016-03-31 Dürr Systems GmbH Brennerkopf eines Brenners und Gasturbine mit einem solchen Brenner
DE102016003151A1 (de) 2016-03-16 2017-09-21 Andreas Stihl Ag & Co. Kg Elektromechanische Funktionseinheit für ein akkubetriebenes, handgeführtes Arbeitsgerät
DE102016003255A1 (de) 2016-03-16 2017-09-21 Andreas Stihl Ag & Co. Kg Elektronische Steuereinheit zum Betrieb eines Elektromotors mit einem Bremswiderstand
CN208138927U (zh) * 2018-05-28 2018-11-23 苏州欧普照明有限公司 一种光源和驱动一体化的灯具基板、模组和灯具

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2649578B1 (fr) * 1989-07-10 1991-09-20 Alcatel Business Systems Dispositif de dissipation thermique pour composant de type cms monte sur plaque de circuit imprime
EP0419709A1 (de) * 1989-09-28 1991-04-03 Siemens Aktiengesellschaft Gehäuse für Mikrowellen-Bauelement
US5557144A (en) * 1993-01-29 1996-09-17 Anadigics, Inc. Plastic packages for microwave frequency applications
US6175727B1 (en) * 1998-01-09 2001-01-16 Texas Instruments Israel Ltd. Suspended printed inductor and LC-type filter constructed therefrom

Also Published As

Publication number Publication date
ITUD20030245A1 (it) 2004-06-17
AT413171B (de) 2005-11-15
DE10352653A1 (de) 2004-07-08

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Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee