ATA2442001A - METHOD FOR MOUNTING, HOLDING OR REMOVING A WAFER AND DEVICE FOR CARRYING OUT THE METHOD - Google Patents

METHOD FOR MOUNTING, HOLDING OR REMOVING A WAFER AND DEVICE FOR CARRYING OUT THE METHOD

Info

Publication number
ATA2442001A
ATA2442001A AT0024401A AT2442001A ATA2442001A AT A2442001 A ATA2442001 A AT A2442001A AT 0024401 A AT0024401 A AT 0024401A AT 2442001 A AT2442001 A AT 2442001A AT A2442001 A ATA2442001 A AT A2442001A
Authority
AT
Austria
Prior art keywords
wafer
holding
mounting
carrying
Prior art date
Application number
AT0024401A
Other languages
German (de)
Other versions
AT411197B (en
Inventor
Wolfgang Reinert
Original Assignee
Datacon Semiconductor Equip
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Datacon Semiconductor Equip filed Critical Datacon Semiconductor Equip
Priority to AT0024401A priority Critical patent/AT411197B/en
Publication of ATA2442001A publication Critical patent/ATA2442001A/en
Application granted granted Critical
Publication of AT411197B publication Critical patent/AT411197B/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
AT0024401A 2001-02-16 2001-02-16 METHOD FOR MOUNTING, HOLDING OR REMOVING A WAFER AND DEVICE FOR CARRYING OUT THE METHOD AT411197B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT0024401A AT411197B (en) 2001-02-16 2001-02-16 METHOD FOR MOUNTING, HOLDING OR REMOVING A WAFER AND DEVICE FOR CARRYING OUT THE METHOD

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AT0024401A AT411197B (en) 2001-02-16 2001-02-16 METHOD FOR MOUNTING, HOLDING OR REMOVING A WAFER AND DEVICE FOR CARRYING OUT THE METHOD

Publications (2)

Publication Number Publication Date
ATA2442001A true ATA2442001A (en) 2003-03-15
AT411197B AT411197B (en) 2003-10-27

Family

ID=3670084

Family Applications (1)

Application Number Title Priority Date Filing Date
AT0024401A AT411197B (en) 2001-02-16 2001-02-16 METHOD FOR MOUNTING, HOLDING OR REMOVING A WAFER AND DEVICE FOR CARRYING OUT THE METHOD

Country Status (1)

Country Link
AT (1) AT411197B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2857504B1 (en) * 2003-07-08 2006-01-06 Atmel Grenoble Sa LARGE IMAGE SENSOR AND METHOD OF MANUFACTURE

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2414297C3 (en) * 1974-03-25 1980-01-17 Siemens Ag, 1000 Berlin Und 8000 Muenchen Process for the semi-automatic production of intermediate carriers for semiconductor components
US4185814A (en) * 1977-12-12 1980-01-29 International Business Machines Corporation Pick up and placement head for green sheet and spacer
JPS57206046A (en) * 1981-06-15 1982-12-17 Hitachi Ltd Wafer conveying device
EP0719458A1 (en) * 1993-09-16 1996-07-03 Blue Planet Ag Solar module with perforated plate
JP3666512B2 (en) * 1994-06-16 2005-06-29 ローム株式会社 Thin plate substrate transfer device

Also Published As

Publication number Publication date
AT411197B (en) 2003-10-27

Similar Documents

Publication Publication Date Title
DE60333533D1 (en) METHOD AND DEVICE FOR SPLITTING A SEMICONDUCTOR WAFER
DE60045636D1 (en) METHOD FOR TREATING A SEMICONDUCTOR SUBSTRATE
DE60039857D1 (en) METHOD AND DEVICE FOR PROCESSING A WAFER
DE60325669D1 (en) Method for transferring an object and method for producing a semiconductor device
DE60014994D1 (en) Method and device for polishing semiconductor wafers
DE60040723D1 (en) Method and apparatus for controlling a semiconductor element
DE60102410D1 (en) Method and device for cutting a semiconductor wafer
DE60220865D1 (en) Method for OFDM reception and device
DE69702272D1 (en) Method for exposing the edge areas of a semiconductor wafer, and device for carrying out the method
DE602004025480D1 (en) DEVICE AND METHOD FOR REMOVING A SEMICONDUCTOR CHIP
DE69934271D1 (en) A process for recovering a separated wafer and recovering used silicon wafers
DE60239809D1 (en) DEVICE AND METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE AND METHOD FOR CLEANING A SEMICONDUCTOR MANUFACTURING DEVICE
DE60322144D1 (en) Method and apparatus for chemical mechanical polishing
DE60103701D1 (en) Method and device for grinding semiconductor wafers
DE60128338D1 (en) METHOD AND DEVICE FOR PREPARING WAFER
DE60219540D1 (en) Method and device for planarizing a semiconductor wafer
DE50206593D1 (en) METHOD AND DEVICE FOR SEPARATING, IN PARTICULAR, CRYSTALLINE LAYERS, IN PARTICULAR CRYSTALLINE SUBSTRATES
TWI365994B (en) Method and apparatus for evaluating a semiconductor wafer
DE60034274D1 (en) Method and apparatus for etching silicon
DE60021149D1 (en) Method and device for polishing
DE50201595D1 (en) Method and device for producing a single crystal from silicon
DE50115216D1 (en) SEMICONDUCTOR COMPONENT AND METHOD FOR IDENTIFYING A SEMICONDUCTOR COMPONENT
DE60229325D1 (en) Method and device for carburizing
DE60114085D1 (en) Method for securing a vessel for the thermal treatment in a protective atmosphere
DE50208521D1 (en) Method for forming a silicon semiconductor body

Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee