ATA67089A - FLUX FOR SOLDERING TINNED PCB - Google Patents

FLUX FOR SOLDERING TINNED PCB

Info

Publication number
ATA67089A
ATA67089A AT67089A AT67089A ATA67089A AT A67089 A ATA67089 A AT A67089A AT 67089 A AT67089 A AT 67089A AT 67089 A AT67089 A AT 67089A AT A67089 A ATA67089 A AT A67089A
Authority
AT
Austria
Prior art keywords
tinned
pcb
soldering
flux
tinned pcb
Prior art date
Application number
AT67089A
Other languages
German (de)
Other versions
AT392231B (en
Inventor
Hans Plescher
Original Assignee
Alcatel Austria Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel Austria Ag filed Critical Alcatel Austria Ag
Priority to AT67089A priority Critical patent/AT392231B/en
Publication of ATA67089A publication Critical patent/ATA67089A/en
Application granted granted Critical
Publication of AT392231B publication Critical patent/AT392231B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618—Carboxylic acids or salts

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
AT67089A 1989-03-22 1989-03-22 Flux for soldering tinned printed circuit boards AT392231B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT67089A AT392231B (en) 1989-03-22 1989-03-22 Flux for soldering tinned printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AT67089A AT392231B (en) 1989-03-22 1989-03-22 Flux for soldering tinned printed circuit boards

Publications (2)

Publication Number Publication Date
ATA67089A true ATA67089A (en) 1990-08-15
AT392231B AT392231B (en) 1991-02-25

Family

ID=3496722

Family Applications (1)

Application Number Title Priority Date Filing Date
AT67089A AT392231B (en) 1989-03-22 1989-03-22 Flux for soldering tinned printed circuit boards

Country Status (1)

Country Link
AT (1) AT392231B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114749828A (en) * 2022-05-13 2022-07-15 深圳市兴鸿泰锡业有限公司 Soldering flux for wave soldering and manufacturing method thereof
CN115152007A (en) * 2019-12-27 2022-10-04 昭和电工材料株式会社 Solder bump forming member, method for manufacturing solder bump forming member, and method for manufacturing solder bump-attached electrode substrate

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9307341D0 (en) * 1993-04-07 1993-06-02 Multicore Solders Ltd Soldering flux and its use in inert gas wave soldering
JP5782338B2 (en) * 2011-09-01 2015-09-24 株式会社不二製作所 End processing method for plate material and blasting apparatus
TWI784839B (en) * 2021-12-15 2022-11-21 廣化科技股份有限公司 Processing method of formic acid welding

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2630718B2 (en) * 1992-10-13 1997-07-16 三島製紙株式会社 Method for producing concave-shaped mesh roll for dandy roll and mold used therefor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115152007A (en) * 2019-12-27 2022-10-04 昭和电工材料株式会社 Solder bump forming member, method for manufacturing solder bump forming member, and method for manufacturing solder bump-attached electrode substrate
CN114749828A (en) * 2022-05-13 2022-07-15 深圳市兴鸿泰锡业有限公司 Soldering flux for wave soldering and manufacturing method thereof

Also Published As

Publication number Publication date
AT392231B (en) 1991-02-25

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Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee
ELJ Ceased due to non-payment of the annual fee