Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P50/00—Etching of wafers, substrates or parts of devices
  • H10P50/60—Wet etching
  • H10P50/66—Wet etching of conductive or resistive materials
  • H10P50/663—Wet etching of conductive or resistive materials by chemical means only
  • H10P50/667—Wet etching of conductive or resistive materials by chemical means only by liquid etching only
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
  • C23F1/00—Etching metallic material by chemical means
  • C23F1/10—Etching compositions
  • C23F1/14—Aqueous compositions
  • C23F1/32—Alkaline compositions
  • C23F1/36—Alkaline compositions for etching aluminium or alloys thereof
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

• Chemical & Material Sciences (AREA)
• Chemical Kinetics & Catalysis (AREA)
• General Chemical & Material Sciences (AREA)
• Engineering & Computer Science (AREA)
• Materials Engineering (AREA)
• Mechanical Engineering (AREA)
• Metallurgy (AREA)
• Organic Chemistry (AREA)
• ing And Chemical Polishing (AREA)

Applications Claiming Priority (1)

Publications (2)

Family

ID=19822017

Family Applications (1)

Country Status (11)

Families Citing this family (2)

• 1974
  • 1974-09-03 NL NL7411645A patent/NL7411645A/xx not_active Application Discontinuation
• 1975
  • 1975-08-21 DE DE19752537154 patent/DE2537154A1/de not_active Withdrawn
  • 1975-08-29 IT IT26749/75A patent/IT1042185B/it active
  • 1975-08-29 CA CA234,469A patent/CA1055823A/en not_active Expired
  • 1975-08-29 GB GB35733/75A patent/GB1499037A/en not_active Expired
  • 1975-08-30 JP JP50105568A patent/JPS5150834A/ja active Pending
  • 1975-09-01 BE BE159656A patent/BE832966A/xx unknown
  • 1975-09-01 SE SE7509691A patent/SE7509691L/xx not_active Application Discontinuation
  • 1975-09-01 CH CH1127575A patent/CH616708A5/de not_active IP Right Cessation
  • 1975-09-01 AT AT672375A patent/AT336974B/de active
  • 1975-09-02 FR FR7526841A patent/FR2283943A1/fr active Granted

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