ATA70798A - DEVICE FOR COMPRESSING THE DISC-SHAPED ELEMENTS TO BE CONNECTED, THE WALK-UP WAFER IN THE PRODUCTION OF SEMICONDUCTOR COMPONENTS - Google Patents

DEVICE FOR COMPRESSING THE DISC-SHAPED ELEMENTS TO BE CONNECTED, THE WALK-UP WAFER IN THE PRODUCTION OF SEMICONDUCTOR COMPONENTS

Info

Publication number
ATA70798A
ATA70798A AT70798A AT70798A ATA70798A AT A70798 A ATA70798 A AT A70798A AT 70798 A AT70798 A AT 70798A AT 70798 A AT70798 A AT 70798A AT A70798 A ATA70798 A AT A70798A
Authority
AT
Austria
Prior art keywords
walk
compressing
wafer
disc
production
Prior art date
Application number
AT70798A
Other languages
German (de)
Other versions
AT405700B (en
Original Assignee
Thallner Erich
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thallner Erich filed Critical Thallner Erich
Priority to AT70798A priority Critical patent/AT405700B/en
Publication of ATA70798A publication Critical patent/ATA70798A/en
Application granted granted Critical
Publication of AT405700B publication Critical patent/AT405700B/en

Links

AT70798A 1998-04-28 1998-04-28 Apparatus for areally pressing together wafer-type (slice- type, disk-shaped) elements, so-called wafers, that are to be connected in the fabrication of semiconductor modules AT405700B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT70798A AT405700B (en) 1998-04-28 1998-04-28 Apparatus for areally pressing together wafer-type (slice- type, disk-shaped) elements, so-called wafers, that are to be connected in the fabrication of semiconductor modules

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AT70798A AT405700B (en) 1998-04-28 1998-04-28 Apparatus for areally pressing together wafer-type (slice- type, disk-shaped) elements, so-called wafers, that are to be connected in the fabrication of semiconductor modules

Publications (2)

Publication Number Publication Date
ATA70798A true ATA70798A (en) 1999-02-15
AT405700B AT405700B (en) 1999-10-25

Family

ID=3497689

Family Applications (1)

Application Number Title Priority Date Filing Date
AT70798A AT405700B (en) 1998-04-28 1998-04-28 Apparatus for areally pressing together wafer-type (slice- type, disk-shaped) elements, so-called wafers, that are to be connected in the fabrication of semiconductor modules

Country Status (1)

Country Link
AT (1) AT405700B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10200538B4 (en) * 2002-01-09 2004-01-08 Infineon Technologies Ag Device and method for the flat compression of disc-shaped elements to be connected
DE102004034421A1 (en) * 2004-07-15 2006-02-09 Pac Tech - Packaging Technologies Gmbh Method and device for mutual contacting of two wafers
DE102006058493B4 (en) 2006-12-12 2012-03-22 Erich Thallner Method and apparatus for bonding wafers

Also Published As

Publication number Publication date
AT405700B (en) 1999-10-25

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Legal Events

Date Code Title Description
REN Ceased due to non-payment of the annual fee
MK07 Expiry

Effective date: 20180428