ATA845775A - METHOD FOR HOLE WALL METALIZATION - Google Patents

METHOD FOR HOLE WALL METALIZATION

Info

Publication number
ATA845775A
ATA845775A AT845775A AT845775A ATA845775A AT A845775 A ATA845775 A AT A845775A AT 845775 A AT845775 A AT 845775A AT 845775 A AT845775 A AT 845775A AT A845775 A ATA845775 A AT A845775A
Authority
AT
Austria
Prior art keywords
metalization
hole wall
hole
wall
wall metalization
Prior art date
Application number
AT845775A
Other languages
German (de)
Other versions
AT346957B (en
Original Assignee
Kollmorgen Photocircuits
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Photocircuits filed Critical Kollmorgen Photocircuits
Publication of ATA845775A publication Critical patent/ATA845775A/en
Application granted granted Critical
Publication of AT346957B publication Critical patent/AT346957B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Chemically Coating (AREA)
AT845775A 1974-11-07 1975-11-06 METHOD FOR HOLE WALL METALIZATION AT346957B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US52189074A 1974-11-07 1974-11-07

Publications (2)

Publication Number Publication Date
ATA845775A true ATA845775A (en) 1978-04-15
AT346957B AT346957B (en) 1978-12-11

Family

ID=24078571

Family Applications (1)

Application Number Title Priority Date Filing Date
AT845775A AT346957B (en) 1974-11-07 1975-11-06 METHOD FOR HOLE WALL METALIZATION

Country Status (13)

Country Link
JP (1) JPS595616B2 (en)
AT (1) AT346957B (en)
AU (1) AU500570B2 (en)
CH (1) CH619823A5 (en)
DE (1) DE2550598C3 (en)
DK (1) DK154600C (en)
ES (1) ES442440A1 (en)
FR (1) FR2290822A1 (en)
GB (1) GB1479556A (en)
IT (1) IT1052168B (en)
NL (1) NL180684C (en)
SE (1) SE447045B (en)
ZA (1) ZA756783B (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3110415C2 (en) * 1981-03-18 1983-08-18 Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern Process for the manufacture of printed circuit boards
US4525247A (en) * 1982-07-12 1985-06-25 Rogers Corporation Microwave circuit boards and method of manufacture thereof
US4425380A (en) 1982-11-19 1984-01-10 Kollmorgen Technologies Corporation Hole cleaning process for printed circuit boards using permanganate and caustic treating solutions
US4515829A (en) * 1983-10-14 1985-05-07 Shipley Company Inc. Through-hole plating
JPS60154416U (en) * 1984-03-23 1985-10-15 三国　慶耿 Snowplow snow chute
US4948630A (en) * 1984-06-07 1990-08-14 Enthone, Inc. Three step process for treating plastics with alkaline permanganate solutions
US4820548A (en) * 1984-06-07 1989-04-11 Enthone, Incorporated Three step process for treating plastics with alkaline permanganate solutions
US4601784A (en) * 1985-05-31 1986-07-22 Morton Thiokol, Inc. Sodium permanganate etch baths containing a co-ion for permanganate and their use in desmearing and/or etching printed circuit boards
US4601783A (en) * 1985-05-31 1986-07-22 Morton Thiokol, Inc. High concentration sodium permanganate etch batch and its use in desmearing and/or etching printed circuit boards
DE3806884C1 (en) * 1988-03-03 1989-09-21 Blasberg-Oberflaechentechnik Gmbh, 5650 Solingen, De Through-plated contact printed circuit and method for fabricating it
US5032427A (en) * 1988-04-25 1991-07-16 Macdermid, Incorporated Process for preparation printed circuit through-holes for metallization
US5213840A (en) * 1990-05-01 1993-05-25 Macdermid, Incorporated Method for improving adhesion to polymide surfaces
AT1147U1 (en) * 1996-01-10 1996-11-25 Grundmann Schliesstechnik LOCKING CYLINDER AND OR FLAT KEY
WO1999011847A1 (en) 1997-09-01 1999-03-11 Maschinenfabrik Rieter Ag Regulated drawing frame
JP5330474B2 (en) * 2011-09-22 2013-10-30 上村工業株式会社 Desmear liquid and desmear treatment method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3276927A (en) * 1963-07-01 1966-10-04 North American Aviation Inc Smoothing of mechanically drilled holes
US3276106A (en) * 1963-07-01 1966-10-04 North American Aviation Inc Preparation of multilayer boards for electrical connections between layers
US3652351A (en) * 1970-05-13 1972-03-28 Carus Corp Processes for etching synthetic polymer resins with alkaline alkali metal manganate solutions
GB1401600A (en) * 1972-12-13 1975-07-16 Kollmorgen Corp Composition and process for the activation of resinous bodies for adherent metallization
DE2316720A1 (en) * 1973-04-04 1974-10-31 Licentia Gmbh Removal of colophony residues from electrical appts. - by agent contg. alcohols, hydrocarbon and wetting agent

Also Published As

Publication number Publication date
NL180684B (en) 1986-11-03
CH619823A5 (en) 1980-10-15
AU8632875A (en) 1977-05-12
NL7512992A (en) 1976-05-11
JPS595616B2 (en) 1984-02-06
IT1052168B (en) 1981-06-20
JPS5170268A (en) 1976-06-17
SE447045B (en) 1986-10-20
AT346957B (en) 1978-12-11
DE2550598B2 (en) 1978-07-13
AU500570B2 (en) 1979-05-24
FR2290822B1 (en) 1978-05-12
FR2290822A1 (en) 1976-06-04
SE7512335L (en) 1976-05-10
NL180684C (en) 1987-04-01
DK154600C (en) 1989-04-17
DK485175A (en) 1976-05-08
DK154600B (en) 1988-11-28
DE2550598C3 (en) 1979-03-08
DE2550598A1 (en) 1976-05-13
ES442440A1 (en) 1977-04-01
GB1479556A (en) 1977-07-13
ZA756783B (en) 1976-10-27

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Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee