ATA87478A - SEMICONDUCTOR ARRANGEMENT AND METHOD FOR COVERING THE SEMICONDUCTOR ARRANGEMENT - Google Patents

SEMICONDUCTOR ARRANGEMENT AND METHOD FOR COVERING THE SEMICONDUCTOR ARRANGEMENT

Info

Publication number
ATA87478A
ATA87478A AT0087478A AT87478A ATA87478A AT A87478 A ATA87478 A AT A87478A AT 0087478 A AT0087478 A AT 0087478A AT 87478 A AT87478 A AT 87478A AT A87478 A ATA87478 A AT A87478A
Authority
AT
Austria
Prior art keywords
semiconductor arrangement
covering
semiconductor
arrangement
Prior art date
Application number
AT0087478A
Other languages
German (de)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from NL7701283A external-priority patent/NL7701283A/en
Priority claimed from NL7701284A external-priority patent/NL7701284A/en
Application filed by Philips Nv filed Critical Philips Nv
Publication of ATA87478A publication Critical patent/ATA87478A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/03—Injection moulding apparatus
    • B29C45/04—Injection moulding apparatus using movable moulds or mould halves
    • B29C45/0408—Injection moulding apparatus using movable moulds or mould halves involving at least a linear movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/04—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
    • C08J9/06—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent
    • C08J9/10—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent developing nitrogen, the blowing agent being a compound containing a nitrogen-to-nitrogen bond
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/03—Injection moulding apparatus
    • B29C45/04—Injection moulding apparatus using movable moulds or mould halves
    • B29C2045/0475—Injection moulding apparatus using movable moulds or mould halves continuously movable moulds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2381/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen, or carbon only; Polysulfones; Derivatives of such polymers
    • C08J2381/04—Polysulfides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Molding Of Porous Articles (AREA)
AT0087478A 1977-02-08 1978-02-08 SEMICONDUCTOR ARRANGEMENT AND METHOD FOR COVERING THE SEMICONDUCTOR ARRANGEMENT ATA87478A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL7701283A NL7701283A (en) 1977-02-08 1977-02-08 PROCESS FOR THE MANUFACTURE OF WHOLLY OR PARTLY OF FOAMED THERMOPLASTIC MATERIALS, OBJECTS MANUFACTURED IN ACCORDANCE WITH THIS PROCEDURE AND DEVICE FOR PERFORMING THE PROCEDURE.
NL7701284A NL7701284A (en) 1977-02-08 1977-02-08 SEMI-GUIDE DEVICE.

Publications (1)

Publication Number Publication Date
ATA87478A true ATA87478A (en) 1982-07-15

Family

ID=26645284

Family Applications (1)

Application Number Title Priority Date Filing Date
AT0087478A ATA87478A (en) 1977-02-08 1978-02-08 SEMICONDUCTOR ARRANGEMENT AND METHOD FOR COVERING THE SEMICONDUCTOR ARRANGEMENT

Country Status (12)

Country Link
JP (1) JPS53112063A (en)
AR (1) AR214553A1 (en)
AT (1) ATA87478A (en)
AU (1) AU513092B2 (en)
BR (1) BR7800732A (en)
CA (1) CA1093704A (en)
DE (1) DE2804956A1 (en)
ES (1) ES466679A1 (en)
FR (1) FR2379910A1 (en)
GB (1) GB1594892A (en)
IT (1) IT1092425B (en)
SE (1) SE7801325L (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2930760A1 (en) * 1979-07-28 1981-02-12 Itt Ind Gmbh Deutsche METHOD FOR COATING SEMICONDUCTOR COMPONENTS BY INJECTION MOLDING
DE3019239A1 (en) * 1980-05-20 1981-11-26 SIEMENS AG AAAAA, 1000 Berlin und 8000 München Semiconductor encapsulation with layers of differing hardness layer fo - has semiconductor embedded in second layer of soft material for protection against external effects and degradation
US4460537A (en) * 1982-07-26 1984-07-17 Motorola, Inc. Slot transfer molding apparatus and methods
JPS63112923U (en) * 1987-01-16 1988-07-20
DE3922038A1 (en) * 1989-07-05 1991-01-17 Bayer Ag USE OF POLYARYL SULFIDES FOR PRODUCING A HIGH-TEMPERATURE-RESISTANT TSG FOAM, METHOD FOR PRODUCING THIS FOAM AND MOLDING OBTAIN THEREFORE AVAILABLE
JP2774906B2 (en) * 1992-09-17 1998-07-09 三菱電機株式会社 Thin semiconductor device and method of manufacturing the same
US6046076A (en) * 1994-12-29 2000-04-04 Tessera, Inc. Vacuum dispense method for dispensing an encapsulant and machine therefor

Also Published As

Publication number Publication date
IT1092425B (en) 1985-07-12
JPS5722420B2 (en) 1982-05-13
JPS53112063A (en) 1978-09-30
AR214553A1 (en) 1979-06-29
IT7819995A0 (en) 1978-02-03
FR2379910B1 (en) 1984-05-04
AU513092B2 (en) 1980-11-13
SE7801325L (en) 1978-08-09
BR7800732A (en) 1978-10-10
CA1093704A (en) 1981-01-13
ES466679A1 (en) 1979-07-01
DE2804956A1 (en) 1978-08-10
AU3303878A (en) 1979-08-16
FR2379910A1 (en) 1978-09-01
GB1594892A (en) 1981-08-05

Similar Documents

Publication Publication Date Title
AT383488B (en) LANCETTE DEVICE FOR POINTING THE SKIN
AT360420B (en) DEVICE FOR THE OPTIONAL IMPLEMENTATION OF PARTS
DD137193A5 (en) METHOD AND DEVICE FOR CONTINUOUS DRYING
DD136090A5 (en) METHOD AND DEVICE FOR CONNECTING BALLS
DD136050A5 (en) LANDUNGSBRUECKE AND METHOD FOR OPERATING THE SAME
AT362030B (en) DEVICE FOR COVERING THE INTERIOR OF TUBE BODIES
LU79354A1 (en) MESSONDE ZUM BESTIMMEN DER IONENKONZENTRATION IN FLUESSIGKEITEN
IT7851680A0 (en) METHOD AND APPARATUS FOR PREPARING MIXTURES
DK469777A (en) METHOD AND MACHINE FOR APPLYING CIGARDA
AT363277B (en) PREPARATORY APPLICATION AND METHOD FOR PRODUCING THE SAME
AT375602B (en) DEVICE FOR SECURING LOADS
ATA87478A (en) SEMICONDUCTOR ARRANGEMENT AND METHOD FOR COVERING THE SEMICONDUCTOR ARRANGEMENT
ATA327179A (en) METHOD AND DEVICE FOR CHANGING THE DEVICE
AT343061B (en) METHOD AND EQUIPMENT FOR DISINICIATING WATER
DD131864A5 (en) METHOD AND DEVICE FOR HOSING FABRIC OR THE LIKE
AT357944B (en) COLLECTOR AND METHOD FOR ATTACHING THE SAME
PL209746A1 (en) METHOD AND DEVICE FOR SEPARATING THE SEMICONDUCTOR MATERIAL
AT364496B (en) LIGHTWEIGHT HALL AND METHOD FOR BUILDING THE SAME
AT351520B (en) METHOD FOR OBTAINING THE VERBENON AND MYRTENAL TERPENS
AT361213B (en) DEVICE FOR CONNECTING EQUIPMENT ELEMENTS
AT350869B (en) METHOD FOR PROTECTING CHROME-PLATED SURFACES
DE2621086B2 (en) METHOD AND ARRANGEMENT FOR THE VIBRATOR CONTROL
SE426432B (en) SPREADING MACHINE AND EQUIPMENT
DD132197A1 (en) DEVICE FOR LOADING SCHOTTERBETTUNGSRUECKSTAENEN AND THE SAME
DD137881A1 (en) DEVICE FOR RETRACTING THE RAENDER OF FLAT PARTS

Legal Events

Date Code Title Description
A1J Withdrawal paragraph 166 lit. 6
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties