ATA9832001A - POSITIONING DEVICE - Google Patents
POSITIONING DEVICEInfo
- Publication number
- ATA9832001A ATA9832001A AT0098301A AT9832001A ATA9832001A AT A9832001 A ATA9832001 A AT A9832001A AT 0098301 A AT0098301 A AT 0098301A AT 9832001 A AT9832001 A AT 9832001A AT A9832001 A ATA9832001 A AT A9832001A
- Authority
- AT
- Austria
- Prior art keywords
- positioning device
- positioning
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AT0098301A AT411855B (en) | 2001-06-26 | 2001-06-26 | POSITIONING DEVICE |
| PCT/AT2002/000183 WO2003001572A2 (en) | 2001-06-26 | 2002-06-25 | Positioning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AT0098301A AT411855B (en) | 2001-06-26 | 2001-06-26 | POSITIONING DEVICE |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| ATA9832001A true ATA9832001A (en) | 2003-11-15 |
| AT411855B AT411855B (en) | 2004-06-25 |
Family
ID=3683811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT0098301A AT411855B (en) | 2001-06-26 | 2001-06-26 | POSITIONING DEVICE |
Country Status (2)
| Country | Link |
|---|---|
| AT (1) | AT411855B (en) |
| WO (1) | WO2003001572A2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005025287A1 (en) * | 2003-09-05 | 2005-03-17 | Siemens Aktiengesellschaft | Placement unit for mounting electric components onto substrates |
| DE10345538A1 (en) * | 2003-09-30 | 2005-05-12 | Siemens Ag | Placement head with a gripper unit for equipping substrates with electrical components |
| FR2905883B1 (en) | 2006-09-14 | 2008-12-05 | Valeo Electronique Sys Liaison | METHOD FOR WELDING AN ORGAN ON A SUPPORT BY DELIVERING MATERIAL AND DEVICE FOR ARRANGING TWO ELEMENTS ON ONE ANOTHER |
| CN111987055B (en) * | 2020-07-16 | 2022-06-07 | 大同新成新材料股份有限公司 | Semiconductor refrigeration graphene chip |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3697837A (en) * | 1970-10-05 | 1972-10-10 | Gen Electric | Electromagnetic force system for integrated circuit fabrication |
| JPS5898937A (en) * | 1981-12-09 | 1983-06-13 | Fujitsu Ltd | Wire bonding device |
| JP2590252B2 (en) * | 1989-02-22 | 1997-03-12 | 株式会社東芝 | Die bonding equipment |
| JP3369877B2 (en) * | 1996-10-31 | 2003-01-20 | 三洋電機株式会社 | Bonding unit |
-
2001
- 2001-06-26 AT AT0098301A patent/AT411855B/en not_active IP Right Cessation
-
2002
- 2002-06-25 WO PCT/AT2002/000183 patent/WO2003001572A2/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| AT411855B (en) | 2004-06-25 |
| WO2003001572A3 (en) | 2003-09-12 |
| WO2003001572A2 (en) | 2003-01-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ELJ | Ceased due to non-payment of the annual fee |