ATE100616T1 - Herstellung von tragbaren elektronischen karten. - Google Patents
Herstellung von tragbaren elektronischen karten.Info
- Publication number
- ATE100616T1 ATE100616T1 AT89306256T AT89306256T ATE100616T1 AT E100616 T1 ATE100616 T1 AT E100616T1 AT 89306256 T AT89306256 T AT 89306256T AT 89306256 T AT89306256 T AT 89306256T AT E100616 T1 ATE100616 T1 AT E100616T1
- Authority
- AT
- Austria
- Prior art keywords
- portable electronic
- manufacture
- electronic cards
- token
- mould
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
- B32B37/22—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of both discrete and continuous layers
- B32B37/223—One or more of the layers being plastic
- B32B37/226—Laminating sheets, panels or inserts between two continuous plastic layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/34—Moulds or cores; Details thereof or accessories therefor movable, e.g. to or from the moulding station
- B29C33/36—Moulds or cores; Details thereof or accessories therefor movable, e.g. to or from the moulding station continuously movable in one direction, e.g. in a closed circuit
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
- B29C33/68—Release sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
- B29C70/70—Completely encapsulating inserts
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
- B29C67/24—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 characterised by the choice of material
- B29C67/246—Moulding high reactive monomers or prepolymers, e.g. by reaction injection moulding [RIM], liquid injection moulding [LIM]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Credit Cards Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Pinball Game Machines (AREA)
- Moulding By Coating Moulds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB8814664A GB2219960B (en) | 1988-06-21 | 1988-06-21 | Manufacture of electronic tokens |
| GB898901189A GB8901189D0 (en) | 1989-01-19 | 1989-01-19 | Portable electronic token |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE100616T1 true ATE100616T1 (de) | 1994-02-15 |
Family
ID=26294056
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT89306256T ATE100616T1 (de) | 1988-06-21 | 1989-06-21 | Herstellung von tragbaren elektronischen karten. |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP0350179B1 (de) |
| JP (1) | JPH03500033A (de) |
| KR (1) | KR900702481A (de) |
| AT (1) | ATE100616T1 (de) |
| DE (1) | DE68912426T2 (de) |
| WO (1) | WO1989012871A1 (de) |
Families Citing this family (58)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2659157B2 (fr) * | 1989-05-26 | 1994-09-30 | Lemaire Gerard | Procede de fabrication d'une carte dite carte a puce, et carte obtenue par ce procede. |
| DE4038126C2 (de) * | 1990-11-27 | 1993-12-16 | Mannesmann Ag | Verfahren und Vorrichtung zur Herstellung einer dekorierten Chip-Karte |
| DE4142408A1 (de) * | 1991-12-20 | 1993-06-24 | Gao Ges Automation Org | Ausweiskarte sowie verfahren und vorrichtung zur herstellung derselben |
| FR2691563B1 (fr) * | 1992-05-19 | 1996-05-31 | Francois Droz | Carte comprenant au moins un element electronique et procede de fabrication d'une telle carte. |
| FR2702067B1 (fr) * | 1993-02-23 | 1995-04-14 | Schlumberger Ind Sa | Procédé et dispositif de fabrication de cartes à mémoire. |
| KR100308801B1 (ko) * | 1993-03-18 | 2001-12-15 | 쿠델스키 안드레, 드로즈 프랑소와 | 전자요소를포함하는카드의제조방법및이에따라제조된카드 |
| NL9400119A (nl) * | 1994-01-27 | 1995-09-01 | 3P Licensing Bv | Werkwijze voor het met een hardende kunststof omhullen van een electronische component, electronische componenten met kunststofomhulling verkregen door middel van deze werkwijze en matrijs voor het uitvoeren der werkwijze. |
| EP0730937B1 (de) * | 1994-11-21 | 1998-02-18 | Apic Yamada Corporation | Harzformmaschine mit Trennfolie |
| US5955021A (en) * | 1997-05-19 | 1999-09-21 | Cardxx, Llc | Method of making smart cards |
| DE19721058A1 (de) * | 1997-05-20 | 1998-11-26 | Giesecke & Devrient Gmbh | Spritzgußkarte mit Dekorschicht |
| US6025054A (en) * | 1997-09-08 | 2000-02-15 | Cardxx, Inc. | Smart cards having glue-positioned electronic components |
| US6256873B1 (en) | 1998-03-17 | 2001-07-10 | Cardxx, Inc. | Method for making smart cards using isotropic thermoset adhesive materials |
| FR2793577B1 (fr) * | 1999-05-12 | 2001-11-02 | Gemplus Card Int | Procede de fabrication d'une carte sans contact |
| FR2805067B1 (fr) | 2000-02-15 | 2003-09-12 | Bourgogne Grasset | Jeton a puce electronique et procedes de fabrication d'un tel jeton |
| JP3534042B2 (ja) * | 2000-06-21 | 2004-06-07 | オムロン株式会社 | コイン形icタグおよびその製造方法 |
| WO2002015264A2 (de) | 2000-08-18 | 2002-02-21 | Siemens Aktiengesellschaft | Verkapseltes organisch-elektronisches bauteil, verfahren zu seiner herstellung und seine verwendung |
| DE10061299A1 (de) | 2000-12-08 | 2002-06-27 | Siemens Ag | Vorrichtung zur Feststellung und/oder Weiterleitung zumindest eines Umwelteinflusses, Herstellungsverfahren und Verwendung dazu |
| DE10061297C2 (de) | 2000-12-08 | 2003-05-28 | Siemens Ag | Verfahren zur Sturkturierung eines OFETs |
| DE10105914C1 (de) | 2001-02-09 | 2002-10-10 | Siemens Ag | Organischer Feldeffekt-Transistor mit fotostrukturiertem Gate-Dielektrikum und ein Verfahren zu dessen Erzeugung |
| DE10151036A1 (de) | 2001-10-16 | 2003-05-08 | Siemens Ag | Isolator für ein organisches Elektronikbauteil |
| DE10151440C1 (de) | 2001-10-18 | 2003-02-06 | Siemens Ag | Organisches Elektronikbauteil, Verfahren zu seiner Herstellung und seine Verwendung |
| DE10160732A1 (de) | 2001-12-11 | 2003-06-26 | Siemens Ag | Organischer Feld-Effekt-Transistor mit verschobener Schwellwertspannung und Verwendung dazu |
| DE10212640B4 (de) | 2002-03-21 | 2004-02-05 | Siemens Ag | Logische Bauteile aus organischen Feldeffekttransistoren |
| DE10226370B4 (de) | 2002-06-13 | 2008-12-11 | Polyic Gmbh & Co. Kg | Substrat für ein elektronisches Bauteil, Verwendung des Substrates, Verfahren zur Erhöhung der Ladungsträgermobilität und Organischer Feld-Effekt Transistor (OFET) |
| WO2004017439A2 (de) | 2002-07-29 | 2004-02-26 | Siemens Aktiengesellschaft | Elektronisches bauteil mit vorwiegend organischen funktionsmaterialien und herstellungsverfahren dazu |
| DE50306683D1 (de) | 2002-08-23 | 2007-04-12 | Polyic Gmbh & Co Kg | Organisches bauelement zum überspannungsschutz und dazugehörige schaltung |
| DE10253154A1 (de) | 2002-11-14 | 2004-05-27 | Siemens Ag | Messgerät zur Bestimmung eines Analyten in einer Flüssigkeitsprobe |
| ES2282708T3 (es) | 2002-11-19 | 2007-10-16 | POLYIC GMBH & CO. KG | Componente electronico organico con capa funcional semiconductora estructurada y metodo para producir el mismo. |
| DE112004000012B4 (de) * | 2003-01-21 | 2012-06-14 | Polyic Gmbh & Co. Kg | Kunststoffprodukt mit integriertem organischen elektronischen Bauteil, Verfahren zur Herstellung dazu |
| DE10302149A1 (de) | 2003-01-21 | 2005-08-25 | Siemens Ag | Verwendung leitfähiger Carbon-black/Graphit-Mischungen für die Herstellung von low-cost Elektronik |
| DE10339036A1 (de) | 2003-08-25 | 2005-03-31 | Siemens Ag | Organisches elektronisches Bauteil mit hochaufgelöster Strukturierung und Herstellungsverfahren dazu |
| DE10340643B4 (de) | 2003-09-03 | 2009-04-16 | Polyic Gmbh & Co. Kg | Druckverfahren zur Herstellung einer Doppelschicht für Polymerelektronik-Schaltungen, sowie dadurch hergestelltes elektronisches Bauelement mit Doppelschicht |
| DE10340644B4 (de) | 2003-09-03 | 2010-10-07 | Polyic Gmbh & Co. Kg | Mechanische Steuerelemente für organische Polymerelektronik |
| DE102004040831A1 (de) | 2004-08-23 | 2006-03-09 | Polyic Gmbh & Co. Kg | Funketikettfähige Umverpackung |
| US7573048B2 (en) | 2004-10-08 | 2009-08-11 | Patel Gordhanbhai N | Tamper resistant self indicating instant alert radiation dosimeter |
| DE102004059465A1 (de) | 2004-12-10 | 2006-06-14 | Polyic Gmbh & Co. Kg | Erkennungssystem |
| DE102004059464A1 (de) | 2004-12-10 | 2006-06-29 | Polyic Gmbh & Co. Kg | Elektronikbauteil mit Modulator |
| US7432808B2 (en) * | 2004-12-15 | 2008-10-07 | Intel Corporation | Wireless module enabled component carrier for parts inventory and tracking |
| DE102004063435A1 (de) | 2004-12-23 | 2006-07-27 | Polyic Gmbh & Co. Kg | Organischer Gleichrichter |
| DE102005009820A1 (de) | 2005-03-01 | 2006-09-07 | Polyic Gmbh & Co. Kg | Elektronikbaugruppe mit organischen Logik-Schaltelementen |
| DE102005009819A1 (de) | 2005-03-01 | 2006-09-07 | Polyic Gmbh & Co. Kg | Elektronikbaugruppe |
| JP2008537215A (ja) | 2005-03-23 | 2008-09-11 | カードエックスエックス インコーポレイテッド | 高品質外面を有する等方性熱硬化接着材料を使用して集積電子機器を備えた最新スマートカードを製造する方法。 |
| US7237724B2 (en) | 2005-04-06 | 2007-07-03 | Robert Singleton | Smart card and method for manufacturing a smart card |
| DE102005017655B4 (de) | 2005-04-15 | 2008-12-11 | Polyic Gmbh & Co. Kg | Mehrschichtiger Verbundkörper mit elektronischer Funktion |
| DE102005031448A1 (de) | 2005-07-04 | 2007-01-11 | Polyic Gmbh & Co. Kg | Aktivierbare optische Schicht |
| US7607249B2 (en) | 2005-07-15 | 2009-10-27 | Innovatier Inc. | RFID bracelet and method for manufacturing a RFID bracelet |
| DE102005035589A1 (de) | 2005-07-29 | 2007-02-01 | Polyic Gmbh & Co. Kg | Verfahren zur Herstellung eines elektronischen Bauelements |
| DE102005044306A1 (de) | 2005-09-16 | 2007-03-22 | Polyic Gmbh & Co. Kg | Elektronische Schaltung und Verfahren zur Herstellung einer solchen |
| WO2007126748A2 (en) | 2006-04-10 | 2007-11-08 | Innovatier, Inc. | An electronic inlay module for electronic cards and tags, electronic card and methods for manufacturing such electronic inlay modules and cards |
| US8690064B2 (en) | 2009-04-30 | 2014-04-08 | Abnote Usa, Inc. | Transaction card assembly and methods of manufacture |
| PL2556732T3 (pl) | 2010-04-05 | 2019-10-31 | Innovatier Inc | Rdzeń dla wstępnego laminowania oraz sposób wytwarzania rdzenia dla wstępnego laminowania dla elektronicznych kart oraz etykiet |
| CN102039262B (zh) * | 2010-12-31 | 2014-04-02 | 上海众人网络安全技术有限公司 | 一种灌胶的电子口令牌及灌胶工艺方法 |
| US9122968B2 (en) | 2012-04-03 | 2015-09-01 | X-Card Holdings, Llc | Information carrying card comprising a cross-linked polymer composition, and method of making the same |
| US9594999B2 (en) | 2012-04-03 | 2017-03-14 | X-Card Holdings, Llc | Information carrying card comprising crosslinked polymer composition, and method of making the same |
| CN105190651B (zh) | 2013-03-15 | 2019-06-04 | X卡控股有限公司 | 用于制作信息携带卡的芯层的方法以及结果产品 |
| US11361204B2 (en) | 2018-03-07 | 2022-06-14 | X-Card Holdings, Llc | Metal card |
| US12220897B2 (en) | 2022-10-20 | 2025-02-11 | X-Card Holdings, Llc | Core layer for information carrying card, resulting information carrying card, and methods of making the same |
| US12528279B2 (en) | 2022-10-20 | 2026-01-20 | X-Card Holdings, Llc | Core layer for information carrying card, resulting information carrying card, and methods of making the same |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE461217A (de) * | 1943-12-17 | |||
| US4214936A (en) * | 1978-10-24 | 1980-07-29 | E. I. Du Pont De Nemours And Company | Lamination process |
| US4378264A (en) * | 1980-05-27 | 1983-03-29 | E. I. Du Pont De Nemours And Company | Integrated laminating process |
| DE3029667A1 (de) * | 1980-08-05 | 1982-03-11 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Traegerelement fuer einen ic-baustein |
| DE3130206A1 (de) * | 1981-07-30 | 1983-02-17 | Siemens AG, 1000 Berlin und 8000 München | Tragbare karte zur informationsverarbeitung |
| DE3373289D1 (en) * | 1983-07-01 | 1987-10-08 | Roland Melzer | Method of producing plastic cards |
| JPH074995B2 (ja) * | 1986-05-20 | 1995-01-25 | 株式会社東芝 | Icカ−ド及びその製造方法 |
-
1989
- 1989-06-21 JP JP1507039A patent/JPH03500033A/ja active Pending
- 1989-06-21 KR KR1019900700341A patent/KR900702481A/ko not_active Withdrawn
- 1989-06-21 WO PCT/GB1989/000693 patent/WO1989012871A1/en not_active Ceased
- 1989-06-21 AT AT89306256T patent/ATE100616T1/de not_active IP Right Cessation
- 1989-06-21 EP EP89306256A patent/EP0350179B1/de not_active Expired - Lifetime
- 1989-06-21 DE DE89306256T patent/DE68912426T2/de not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03500033A (ja) | 1991-01-10 |
| EP0350179B1 (de) | 1994-01-19 |
| KR900702481A (ko) | 1990-12-07 |
| DE68912426T2 (de) | 1994-05-11 |
| DE68912426D1 (de) | 1994-03-03 |
| WO1989012871A1 (en) | 1989-12-28 |
| EP0350179A1 (de) | 1990-01-10 |
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| UEP | Publication of translation of european patent specification | ||
| REN | Ceased due to non-payment of the annual fee |