ATE111294T1 - Gedruckte schaltplatte mit metallisierten löchern und deren herstellung. - Google Patents

Gedruckte schaltplatte mit metallisierten löchern und deren herstellung.

Info

Publication number
ATE111294T1
ATE111294T1 AT89902779T AT89902779T ATE111294T1 AT E111294 T1 ATE111294 T1 AT E111294T1 AT 89902779 T AT89902779 T AT 89902779T AT 89902779 T AT89902779 T AT 89902779T AT E111294 T1 ATE111294 T1 AT E111294T1
Authority
AT
Austria
Prior art keywords
soln
printed circuit
layer
rinsing
treating
Prior art date
Application number
AT89902779T
Other languages
English (en)
Inventor
Juergen Hupe
Walter Kronenberg
Original Assignee
Blasberg Oberflaechentech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19883806884 external-priority patent/DE3806884C1/de
Application filed by Blasberg Oberflaechentech filed Critical Blasberg Oberflaechentech
Application granted granted Critical
Publication of ATE111294T1 publication Critical patent/ATE111294T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
    • C08G61/122—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides
    • C08G61/123—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides derived from five-membered heterocyclic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31—Surface property or characteristic of web, sheet or block
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Chemically Coating (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Burglar Alarm Systems (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Nitrogen And Oxygen Or Sulfur-Condensed Heterocyclic Ring Systems (AREA)
AT89902779T 1988-03-03 1989-03-01 Gedruckte schaltplatte mit metallisierten löchern und deren herstellung. ATE111294T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19883806884 DE3806884C1 (en) 1988-03-03 1988-03-03 Through-plated contact printed circuit and method for fabricating it
DE3832507 1988-09-24

Publications (1)

Publication Number Publication Date
ATE111294T1 true ATE111294T1 (de) 1994-09-15

Family

ID=25865472

Family Applications (1)

Application Number Title Priority Date Filing Date
AT89902779T ATE111294T1 (de) 1988-03-03 1989-03-01 Gedruckte schaltplatte mit metallisierten löchern und deren herstellung.

Country Status (13)

Country Link
US (1) US5194313A (de)
EP (1) EP0402381B1 (de)
JP (1) JP2657423B2 (de)
KR (1) KR960014476B1 (de)
AT (1) ATE111294T1 (de)
AU (1) AU622650B2 (de)
BG (1) BG51470A3 (de)
CA (1) CA1315417C (de)
DE (1) DE68918085T2 (de)
DK (1) DK170690B1 (de)
FI (1) FI111509B (de)
RU (1) RU1816344C (de)
WO (1) WO1989008375A1 (de)

Families Citing this family (49)

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US5300208A (en) * 1989-08-14 1994-04-05 International Business Machines Corporation Fabrication of printed circuit boards using conducting polymer
AU644602B2 (en) * 1989-08-31 1993-12-16 Blasberg-Oberflachentechnik Gmbh Plated-through printed circuit board with resist and process for producing it
DE3928832C2 (de) * 1989-08-31 1995-04-20 Blasberg Oberflaechentech Verfahren zur Herstellung von durchkontaktierten Leiterplatten und Leiterplatten-Halbzeug
US5693209A (en) * 1989-09-14 1997-12-02 Atotech Deutschland Gmbh Process for metallization of a nonconductor surface
KR100216328B1 (ko) * 1989-09-14 1999-08-16 그레고루 후렝크, 디터 베크베르트 회로판의 직접 금속화 방법
DE3931003A1 (de) * 1989-09-14 1991-03-28 Schering Ag Verfahren zur direkten metallisierung von leiterplatten
DE3935831A1 (de) * 1989-10-27 1991-05-02 Hoellmueller Maschbau H Anlage zur herstellung von durchkontaktierten leiterplatten und multilayern
US5106537A (en) * 1990-04-12 1992-04-21 Olin Hunt Sub Iii Corp. Liquid dispersion for enhancing the electroplating of a non-conductive surface
GB2243838A (en) * 1990-05-09 1991-11-13 Learonal Process for metallising a through-hole printed circuit board by electroplating
DE4040226C2 (de) * 1990-12-15 1994-09-29 Hoellmueller Maschbau H Verfahren zur Herstellung von durchkontaktierten Leiterplatten oder Mehrlagenleiterplatten (Multilayern)
DE4202337A1 (de) * 1992-01-29 1993-08-05 Bayer Ag Verfahren zur durchkontaktierung von zweilagigen leiterplatten und multilayern
DE4227836C2 (de) * 1992-08-20 1997-09-25 Atotech Deutschland Gmbh Verfahren zur Metallisierung von Nichtleitern
US5262041A (en) * 1992-12-11 1993-11-16 Shipley Company Inc. Additive plating process
DE4314259C2 (de) * 1993-04-30 1997-04-10 Grundig Emv Verfahren zur Durchkontaktierung von Leiterplatten mittels leitfähiger Kunststoffe zur direkten Metallisierung
US5840363A (en) * 1993-04-30 1998-11-24 Grundig Ag Process for throughplating printed circuit boards using conductive plastics
US5532025A (en) * 1993-07-23 1996-07-02 Kinlen; Patrick J. Corrosion inhibiting compositions
US5415762A (en) * 1993-08-18 1995-05-16 Shipley Company Inc. Electroplating process and composition
DE4436391A1 (de) * 1994-10-12 1996-04-18 Bayer Ag Verfahren zur direkten galvanischen Durchkontaktierung von zweilagigen Leiterplatten und Multilayern
EP0731192B2 (de) † 1995-03-10 2003-01-02 Shipley Company LLC Verfahren und Zusammenstellung zur Elektroplattierung
FR2737507B1 (fr) 1995-08-04 1997-09-26 Scps Structures poreuses complexes metallisees ou metalliques, premetallisees par depot d'un polymere conducteur
DE19637018A1 (de) * 1996-09-12 1998-03-19 Bayer Ag Verfahren zur Herstellung von starren und flexiblen Schaltungen
EP0905285B1 (de) * 1997-02-03 2000-12-27 Okuno Chemical Industries Co., Ltd. Verfahren zum elektrobeschichten nichtleitender materialien
US6117554A (en) * 1997-05-30 2000-09-12 Poly-Med, Inc. Modulated molecularly bonded inherently conductive polymers on substrates with conjugated multiple lamellae and shaped articles thereof
US6303500B1 (en) * 1999-02-24 2001-10-16 Micron Technology, Inc. Method and apparatus for electroless plating a contact pad
US6805816B1 (en) 1999-05-20 2004-10-19 Bayer Aktiengesellschaft Method of producing π-conjugated polymers
US20050045851A1 (en) * 2003-08-15 2005-03-03 Konarka Technologies, Inc. Polymer catalyst for photovoltaic cell
JP2002151845A (ja) * 2000-11-16 2002-05-24 Hitachi Chem Co Ltd めっき前処理方法
DE10124631C1 (de) 2001-05-18 2002-11-21 Atotech Deutschland Gmbh Verfahren zum direkten elektrolytischen Metallisieren von elektrisch nichtleiteitenden Substratoberflächen
WO2003007687A2 (en) * 2001-07-20 2003-01-30 The Research Foundation Of State University Of New York Polymer-matrix materials and methods for making same
US20060147616A1 (en) * 2004-12-20 2006-07-06 Russell Gaudiana Polymer catalyst for photovoltaic cell
EP1870491B1 (de) * 2006-06-22 2015-05-27 Enthone, Inc. Verbessertes Verfahren zur Direktmetallisierung von elektrisch nicht leitfähigen Substratoberflächen, insbesondere Polyimidoberflächen
EP1897974B1 (de) * 2006-09-07 2012-08-01 Enthone Inc. Abscheidung eines leitfähigen Polymers und Metallisierung eines nicht-leitenden Substrats
EP1897975B1 (de) * 2006-09-07 2012-03-14 Enthone, Inc. Abscheidung eines leitfähigen Polymers und Metallisierung eines nicht-leitenden Substrats
JP5236648B2 (ja) * 2006-09-07 2013-07-17 エンソン インコーポレイテッド 電解めっき銅金属配線で絶縁性基板の表面を金属配線するための方法
ES2395736T3 (es) 2007-05-03 2013-02-14 Atotech Deutschland Gmbh Procedimiento para aplicar un revestimiento metálico a un substrato no conductor
EP2305856A1 (de) 2009-09-28 2011-04-06 ATOTECH Deutschland GmbH Verfahren zum Aufbringen einer Metallbeschichtung auf ein nichtleitfähiges Substrat
ES2662039T3 (es) 2010-10-29 2018-04-05 Macdermid Enthone Inc. Composición y método para la deposición de polímeros conductores en sustratos dieléctricos
EP2602357A1 (de) 2011-12-05 2013-06-12 Atotech Deutschland GmbH Neuartiges Haftmittel zur Metallisierung von Substratoberflächen
EP2644744A1 (de) 2012-03-29 2013-10-02 Atotech Deutschland GmbH Verfahren zur Förderung der Haftung zwischen dielektrischen Substraten und Metallschichten
CN104204294B (zh) * 2012-03-29 2018-12-07 德国艾托特克公司 促进介电衬底与金属层之间粘着度的方法
CN104018196A (zh) * 2013-02-28 2014-09-03 武汉孟鼎电化学技术有限公司 印制线路板无化学镀直接电镀方法
BR112017015625A2 (pt) 2015-01-20 2019-11-12 Macdermid Enthone Inc composições incluindo um ácido com alto peso molecular adequado para formação de polímero condutivo em substratos dielétricos
US10151035B2 (en) * 2016-05-26 2018-12-11 Rohm And Haas Electronic Materials Llc Electroless metallization of through-holes and vias of substrates with tin-free ionic silver containing catalysts
CN107723764A (zh) * 2017-10-31 2018-02-23 电子科技大学 一种在绝缘基材上直接电镀的方法
JP6540843B1 (ja) * 2018-03-06 2019-07-10 栗田工業株式会社 ポリプロピレン樹脂の親水化処理方法
JP6566064B1 (ja) * 2018-03-06 2019-08-28 栗田工業株式会社 ポリフェニレンサルファイド樹脂表面の処理方法
WO2022153995A1 (ja) * 2021-01-14 2022-07-21 長野県 酸化還元反応により導電性を示す下地導電層用材料並びにそれを用いた製造プロセス、デバイス、めっき品、めっき品の製造方法及びコーティング液
CN115613019B (zh) * 2022-09-29 2024-08-09 南京科润工业介质股份有限公司 一种适用于全自动称量包装机分装的工件用余热发黑液
CN119815722A (zh) * 2024-12-30 2025-04-11 厦门柔性电子研究院有限公司 一种高频高速多层柔性电路板的孔金属化方法

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EP0206133B1 (de) * 1985-06-12 1991-07-31 BASF Aktiengesellschaft Verwendung von Polypyrrol zur Abscheidung von metallischem Kupfer auf elektrisch nichtleitende Materialen
DE3520980A1 (de) * 1985-06-12 1986-12-18 Basf Ag, 6700 Ludwigshafen Verfahren zum aufbringen einer schicht aus elektrisch leitfaehigen polymeren auf andere werkstoffe
JPS6223195A (ja) * 1985-07-23 1987-01-31 日本写真印刷株式会社 導電性回路基板とその製造法
JPS62136709A (ja) * 1985-12-09 1987-06-19 三井東圧化学株式会社 導電性パタ−ンの形成方法
IL82764A0 (en) * 1986-06-06 1987-12-20 Advanced Plating Technology Ap Selective plating process for the electrolytic coating of circuit boards

Also Published As

Publication number Publication date
EP0402381B1 (de) 1994-09-07
AU3189189A (en) 1989-09-22
DK196090D0 (da) 1990-08-16
DE68918085D1 (de) 1994-10-13
RU1816344C (ru) 1993-05-15
AU622650B2 (en) 1992-04-16
FI111509B (fi) 2003-07-31
WO1989008375A1 (en) 1989-09-08
DK196090A (da) 1990-08-16
DE68918085T2 (de) 1995-01-26
JPH05506125A (ja) 1993-09-02
KR900701145A (ko) 1990-08-17
FI904312A0 (fi) 1990-08-31
DK170690B1 (da) 1995-12-04
BG51470A3 (en) 1993-05-14
KR960014476B1 (ko) 1996-10-15
EP0402381A1 (de) 1990-12-19
JP2657423B2 (ja) 1997-09-24
CA1315417C (en) 1993-03-30
US5194313A (en) 1993-03-16

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Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
EELA Cancelled due to lapse of time