ATE111636T1 - Behälter für halbleiterplättchen. - Google Patents

Behälter für halbleiterplättchen.

Info

Publication number
ATE111636T1
ATE111636T1 AT91420184T AT91420184T ATE111636T1 AT E111636 T1 ATE111636 T1 AT E111636T1 AT 91420184 T AT91420184 T AT 91420184T AT 91420184 T AT91420184 T AT 91420184T AT E111636 T1 ATE111636 T1 AT E111636T1
Authority
AT
Austria
Prior art keywords
containers
central axis
respect
forming
disc
Prior art date
Application number
AT91420184T
Other languages
English (en)
Inventor
Gilles Skoura
Original Assignee
Sgs Thomson Microelectronics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sgs Thomson Microelectronics filed Critical Sgs Thomson Microelectronics
Application granted granted Critical
Publication of ATE111636T1 publication Critical patent/ATE111636T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1921—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1922—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by the construction of the closed carrier

Landscapes

  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
  • Closures For Containers (AREA)
  • Stackable Containers (AREA)
AT91420184T 1990-06-12 1991-06-07 Behälter für halbleiterplättchen. ATE111636T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9007542A FR2663003B1 (fr) 1990-06-12 1990-06-12 Conteneur pour plaquette semiconductrice.

Publications (1)

Publication Number Publication Date
ATE111636T1 true ATE111636T1 (de) 1994-09-15

Family

ID=9397694

Family Applications (1)

Application Number Title Priority Date Filing Date
AT91420184T ATE111636T1 (de) 1990-06-12 1991-06-07 Behälter für halbleiterplättchen.

Country Status (6)

Country Link
US (1) US5211717A (de)
EP (1) EP0462030B1 (de)
JP (1) JP3213968B2 (de)
AT (1) ATE111636T1 (de)
DE (1) DE69103970T2 (de)
FR (1) FR2663003B1 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2704693B1 (fr) * 1993-04-27 1995-07-13 Sagem Panier de gravure.
DE69529403D1 (de) * 1995-06-06 2003-02-20 Agfa Gevaert Nv Abtastgerät für PSL Radiographie mit Abtastschlitten und Riemen
US6003674A (en) * 1996-05-13 1999-12-21 Brooks; Ray Gene Method and apparatus for packing contaminant-sensitive articles and resulting package
JP2882377B2 (ja) * 1996-08-23 1999-04-12 日本電気株式会社 金属の回収容器及び金属の回収方法
US6341695B1 (en) 1998-05-07 2002-01-29 Texas Instruments Incorporated Containment device for retaining semiconductor wafers
US6193068B1 (en) * 1998-05-07 2001-02-27 Texas Instruments Incorporated Containment device for retaining semiconductor wafers
FR2785257B1 (fr) 1998-10-28 2001-01-19 St Microelectronics Sa Caisse pour plaquettes semiconductrices
US6234316B1 (en) * 1999-12-28 2001-05-22 United Microelectronics Corp. Wafer protective container
US6550619B2 (en) 2000-05-09 2003-04-22 Entergris, Inc. Shock resistant variable load tolerant wafer shipper
US7040487B2 (en) * 2001-07-14 2006-05-09 Entegris, Inc. Protective shipper
CN100494011C (zh) * 2003-11-06 2009-06-03 夏普株式会社 搬运基板用托盘
US20060000731A1 (en) * 2004-06-30 2006-01-05 Hayne Cheryl A Abrasive article packaging and method of making same
US20060000747A1 (en) * 2004-06-30 2006-01-05 3M Innovative Properties Company Shipping container for integrated circuit wafers
JP4973501B2 (ja) 2005-12-06 2012-07-11 富士通セミコンダクター株式会社 半導体ウェハの収納ケース及び半導体ウェハの収納方法
US7922000B2 (en) * 2006-02-15 2011-04-12 Miraial Co., Ltd. Thin plate container with a stack of removable loading trays
DE112007001758T5 (de) * 2006-07-25 2009-09-17 Miraial Co., Ltd. Wafer-Behälter mit Polsterfolien
US20080289988A1 (en) * 2007-05-21 2008-11-27 Sorensen Joseph A Elastomeric foam for object storage
KR101617275B1 (ko) * 2013-05-28 2016-05-02 코닝정밀소재 주식회사 기판 반송용 박스
US20180099780A1 (en) * 2016-10-07 2018-04-12 John Lee Stackable Sawblade Containment Assembly
EP3806138B1 (de) * 2019-10-09 2022-11-30 Infineon Technologies AG Transportsystem
CN116022444B (zh) * 2022-11-04 2025-03-21 江西舜源电子科技有限公司 一种具有防护装置的半导体芯片封装盒
JP7578340B1 (ja) * 2024-02-14 2024-11-06 シノン電気産業株式会社 ラージサイズ半導体集積回路用のトレー

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3208589A (en) * 1961-03-31 1965-09-28 Illinois Tool Works Apparatus for handling and transporting articles
FR1362872A (fr) * 1963-07-05 1964-06-05 Réceptacle pour disques
DE1427772A1 (de) * 1965-11-23 1968-12-12 Telefunken Patent Verfahren zum Zerlegen einer Halbleiterscheibe in einzelne Halbleiterplaettchen
US3552548A (en) * 1968-08-05 1971-01-05 Fluroware Inc Wafer storage and shipping container
US3534146A (en) * 1968-10-24 1970-10-13 Teletype Corp Double shielded rfi enclosure
DE6913118U (de) * 1969-04-01 1969-08-07 Wacker Chemie Gmbh Verpackung fuer epitaktisch beschichtete halbleiterscheiben
US3661253A (en) * 1969-12-04 1972-05-09 Monsanto Co Retaining trays for semiconductor wafers and the like
US3695424A (en) * 1970-10-28 1972-10-03 Eastman Kodak Co Package for fragile articles
US3664538A (en) * 1970-12-21 1972-05-23 Donald W Fioretti Nestable receptacle and container
US3719273A (en) * 1971-01-11 1973-03-06 Chisso Corp Packing vessel for thin sheet materials
GB1479741A (en) * 1973-10-02 1977-07-13 Hefendehl H Containers having wall portions push fitted together
US4013296A (en) * 1975-12-08 1977-03-22 Keeney Malcolm S Phonograph record storage and protection apparatus
FR2397334A1 (fr) * 1977-07-12 1979-02-09 Vibac Boite d'emballage et d'expedition
US4470508A (en) * 1983-08-19 1984-09-11 Micro Lithography, Inc. Dustfree packaging container and method
IT209910Z2 (it) * 1987-02-06 1988-11-04 Sgs Microelettronica Spa Contenitore porta-wafer o fretta di slicio, utilizzato perl'immagazzinamento e/o spedizione sotto vuoto degli stessi.

Also Published As

Publication number Publication date
JPH0685046A (ja) 1994-03-25
EP0462030B1 (de) 1994-09-14
FR2663003A1 (fr) 1991-12-13
DE69103970T2 (de) 1995-11-02
DE69103970D1 (de) 1994-10-20
US5211717A (en) 1993-05-18
JP3213968B2 (ja) 2001-10-02
FR2663003B1 (fr) 1992-09-11
EP0462030A1 (de) 1991-12-18

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties