ATE112652T1 - Verfahren zur einkapselung von vorrichtungen. - Google Patents

Verfahren zur einkapselung von vorrichtungen.

Info

Publication number
ATE112652T1
ATE112652T1 AT90305044T AT90305044T ATE112652T1 AT E112652 T1 ATE112652 T1 AT E112652T1 AT 90305044 T AT90305044 T AT 90305044T AT 90305044 T AT90305044 T AT 90305044T AT E112652 T1 ATE112652 T1 AT E112652T1
Authority
AT
Austria
Prior art keywords
encapsulation
devices
encapsulated
regions
uncovered
Prior art date
Application number
AT90305044T
Other languages
English (en)
Inventor
Peter David Whalley
Stephen Daniel Evans
John Edward Andrew Shaw
Original Assignee
Emi Plc Thorn
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Emi Plc Thorn filed Critical Emi Plc Thorn
Application granted granted Critical
Publication of ATE112652T1 publication Critical patent/ATE112652T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/403—Cells and electrode assemblies
    • G01N27/414—Ion-sensitive or chemical field-effect transistors, i.e. ISFETS or CHEMFETS
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Containers And Plastic Fillers For Packaging (AREA)
  • Glass Compositions (AREA)
  • Executing Machine-Instructions (AREA)
AT90305044T 1989-05-19 1990-05-10 Verfahren zur einkapselung von vorrichtungen. ATE112652T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB898911607A GB8911607D0 (en) 1989-05-19 1989-05-19 A method of encapsulation for electronic devices and devices so encapsulated

Publications (1)

Publication Number Publication Date
ATE112652T1 true ATE112652T1 (de) 1994-10-15

Family

ID=10657067

Family Applications (1)

Application Number Title Priority Date Filing Date
AT90305044T ATE112652T1 (de) 1989-05-19 1990-05-10 Verfahren zur einkapselung von vorrichtungen.

Country Status (5)

Country Link
US (1) US5037779A (de)
EP (1) EP0398587B1 (de)
AT (1) ATE112652T1 (de)
DE (1) DE69013056T2 (de)
GB (1) GB8911607D0 (de)

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US6359335B1 (en) 1994-05-19 2002-03-19 Tessera, Inc. Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures
US5929517A (en) 1994-12-29 1999-07-27 Tessera, Inc. Compliant integrated circuit package and method of fabricating the same
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US5627112A (en) * 1995-11-13 1997-05-06 Rockwell International Corporation Method of making suspended microstructures
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US6111323A (en) * 1997-12-30 2000-08-29 International Business Machines Corporation Reworkable thermoplastic encapsulant
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US6395584B2 (en) 1998-12-22 2002-05-28 Ficta Technology Inc. Method for improving the liquid dispensing of IC packages
US6214640B1 (en) 1999-02-10 2001-04-10 Tessera, Inc. Method of manufacturing a plurality of semiconductor packages
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US6384472B1 (en) * 2000-03-24 2002-05-07 Siliconware Precision Industries Co., Ltd Leadless image sensor package structure and method for making the same
DE10016135A1 (de) 2000-03-31 2001-10-18 Infineon Technologies Ag Gehäusebaugruppe für ein elektronisches Bauteil
AU2002216352A1 (en) * 2000-12-21 2002-07-01 Shellcase Ltd. Packaged integrated circuits and methods of producing thereof
US6420201B1 (en) * 2001-01-03 2002-07-16 Amkor Technology, Inc. Method for forming a bond wire pressure sensor die package
US6432737B1 (en) 2001-01-03 2002-08-13 Amkor Technology, Inc. Method for forming a flip chip pressure sensor die package
US6441503B1 (en) 2001-01-03 2002-08-27 Amkor Technology, Inc. Bond wire pressure sensor die package
DE10109327A1 (de) * 2001-02-27 2002-09-12 Infineon Technologies Ag Halbleiterchip und Herstellungsverfahren für ein Gehäuse
US6661080B1 (en) 2001-06-28 2003-12-09 Amkor Technology, Inc. Structure for backside saw cavity protection
US6586824B1 (en) 2001-07-26 2003-07-01 Amkor Technology, Inc. Reduced thickness packaged electronic device
US7518223B2 (en) * 2001-08-24 2009-04-14 Micron Technology, Inc. Semiconductor devices and semiconductor device assemblies including a nonconfluent spacer layer
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US7335995B2 (en) * 2001-10-09 2008-02-26 Tessera, Inc. Microelectronic assembly having array including passive elements and interconnects
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US7033664B2 (en) * 2002-10-22 2006-04-25 Tessera Technologies Hungary Kft Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby
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US7344915B2 (en) * 2005-03-14 2008-03-18 Advanced Semiconductor Engineering, Inc. Method for manufacturing a semiconductor package with a laminated chip cavity
DE102005014427B4 (de) * 2005-03-24 2008-05-15 Infineon Technologies Ag Verfahren zum Verkapseln eines Halbleiterbauelements
US7566853B2 (en) * 2005-08-12 2009-07-28 Tessera, Inc. Image sensor employing a plurality of photodetector arrays and/or rear-illuminated architecture
US7691675B2 (en) * 2005-10-24 2010-04-06 Hewlett-Packard Development Company, L.P. Encapsulating electrical connections
JP3940423B1 (ja) * 2006-03-02 2007-07-04 ソニーケミカル＆インフォメーションデバイス株式会社 機能素子実装モジュール及びその製造方法
US9142695B2 (en) * 2013-06-03 2015-09-22 Optiz, Inc. Sensor package with exposed sensor array and method of making same
US9996725B2 (en) 2016-11-03 2018-06-12 Optiz, Inc. Under screen sensor assembly
US11525967B1 (en) 2018-09-28 2022-12-13 Apple Inc. Photonics integrated circuit architecture
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CN116134356A (zh) * 2020-07-20 2023-05-16 苹果公司 具有受控塌陷芯片连接的光子集成电路
US12111210B2 (en) 2021-07-08 2024-10-08 Apple Inc. Light source modules for noise mitigation
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GB8717036D0 (en) * 1987-07-18 1987-08-26 Emi Plc Thorn Sensor arrangements

Also Published As

Publication number Publication date
DE69013056D1 (de) 1994-11-10
US5037779A (en) 1991-08-06
EP0398587A3 (de) 1991-01-02
GB8911607D0 (en) 1989-07-05
DE69013056T2 (de) 1995-05-11
EP0398587B1 (de) 1994-10-05
EP0398587A2 (de) 1990-11-22

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