ATE115454T1 - Lötverbindungssystem. - Google Patents

Lötverbindungssystem.

Info

Publication number
ATE115454T1
ATE115454T1 AT90306451T AT90306451T ATE115454T1 AT E115454 T1 ATE115454 T1 AT E115454T1 AT 90306451 T AT90306451 T AT 90306451T AT 90306451 T AT90306451 T AT 90306451T AT E115454 T1 ATE115454 T1 AT E115454T1
Authority
AT
Austria
Prior art keywords
solder joint
joint system
function
peak power
plot
Prior art date
Application number
AT90306451T
Other languages
English (en)
Inventor
Mark J Cowell
James C Swift
Thomas H Mcgaffigan
Original Assignee
Metcal Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Metcal Inc filed Critical Metcal Inc
Application granted granted Critical
Publication of ATE115454T1 publication Critical patent/ATE115454T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/02—Soldering irons; Bits
    • B23K3/03—Soldering irons; Bits electrically heated
    • B23K3/033—Soldering irons; Bits electrically heated comprising means for controlling or selecting the temperature or power

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
AT90306451T 1989-06-13 1990-06-13 Lötverbindungssystem. ATE115454T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US36530089A 1989-06-13 1989-06-13

Publications (1)

Publication Number Publication Date
ATE115454T1 true ATE115454T1 (de) 1994-12-15

Family

ID=23438301

Family Applications (1)

Application Number Title Priority Date Filing Date
AT90306451T ATE115454T1 (de) 1989-06-13 1990-06-13 Lötverbindungssystem.

Country Status (5)

Country Link
EP (1) EP0403260B1 (de)
JP (1) JP2999223B2 (de)
AT (1) ATE115454T1 (de)
CA (1) CA2018561C (de)
DE (1) DE69015009T2 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10220297A1 (de) * 2002-05-07 2003-11-27 Innotronic Gmbh Verfahren zur Überwachung der Lötspitzentemperatur eines Lötkolbens
US7259356B2 (en) * 2003-11-07 2007-08-21 Delaware Capital Formation, Inc. Temperature self-regulating soldering iron with removable tip
US10688578B2 (en) 2014-08-04 2020-06-23 OK International, Inc Variable temperature controlled soldering iron
US9516762B2 (en) 2014-08-04 2016-12-06 Ok International Inc. Soldering iron with automatic soldering connection validation
US10716220B2 (en) 2014-08-04 2020-07-14 Ok International, Inc. Variable temperature controlled soldering iron
CA2915654C (en) * 2015-07-08 2018-05-01 Delaware Capital Formation, Inc. An intelligent soldering cartridge for automatic soldering connection validation
US10974335B2 (en) * 2018-07-10 2021-04-13 Hakko Corporation Composite soldering, de-soldering station load detection

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4256945A (en) * 1979-08-31 1981-03-17 Iris Associates Alternating current electrically resistive heating element having intrinsic temperature control
US4839501A (en) * 1984-12-21 1989-06-13 Metcal, Inc. Cartridge soldering iron
JPS6245469A (ja) * 1985-08-26 1987-02-27 Nippei Toyama Corp レ−ザ半田付け装置の制御方法
JPS6444277A (en) * 1987-08-11 1989-02-16 Nippon Kokan Kk Temperature control method

Also Published As

Publication number Publication date
CA2018561A1 (en) 1990-12-13
DE69015009T2 (de) 1995-04-20
DE69015009D1 (de) 1995-01-26
EP0403260A2 (de) 1990-12-19
CA2018561C (en) 1994-08-30
EP0403260A3 (de) 1991-02-06
JP2999223B2 (ja) 2000-01-17
JPH0327872A (ja) 1991-02-06
EP0403260B1 (de) 1994-12-14

Similar Documents

Publication Publication Date Title
DE3789430D1 (de) Homogenes fluortestverfahren mit abstoss des fluorzenten hintergrundes.
DE3683445D1 (de) An ein energie-niveau anpassbarer laserverstaerker.
FI906265A7 (fi) Menetelmä ja laite jota käytetään pariston tyypin määrittämiseen ja käyttöominaisuuksien muuttamiseen
DE3583969D1 (de) Abtastvorrichtung mit halbleiterlaser.
KR880701864A (ko) 레이저 탐침
DK24286D0 (da) Indretning til udbringningsmaskiner, der benyttes inden for landbruget
DE69014927D1 (de) Speiseschaltung und Brücken-Messanordnung mit einer Ausgangssignalausgleichsschaltung.
KR890700419A (ko) 온도조절가능 납땜인두
WO1988003455A1 (en) Soldering iron, especially adapted for soft soldering, silver soldering and the like
DE3582179D1 (de) Gaslaservorrichtung.
GB2003352B (en) Optically coupled bias circuit for complementary output circuit and method
DE59009578D1 (de) Stromversorgungseinrichtung mit Unsymmetrieüberwachungsschaltung.
ATE115454T1 (de) Lötverbindungssystem.
DE3685553D1 (de) Pin-dioden-daempfungsglieder.
BG28573A3 (bg) Метод за получаване на аминоалкоксифенилови производни
DE3579183D1 (de) Dampfkreislauf fuer dampfkraftanlagen.
FI871860L (fi) Juotos- ja kovajuotosmenetelmä ja -laite
EP0103548A3 (en) Light-weight welder particularly suited for soft- and silver soldering and the like
FR2466835B1 (fr) Circuit rapide d'anticipation
JPS5422552A (en) Reference voltage source circuit
DE3781266D1 (de) Hochfrequenz-energieversorgungs-vorrichtung.
DE3577235D1 (de) Rundblickfernrohr.
SU651912A1 (ru) Способ дозировани припо при пайке
DE3780699D1 (de) Loetverfahren.
BE879632A (fr) Dispositif de mesure de l'emission calorifique des corps de chauffe

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties