ATE116790T1 - Elektronischer baugruppenträger mit niedrigem thermischem widerstand. - Google Patents

Elektronischer baugruppenträger mit niedrigem thermischem widerstand.

Info

Publication number
ATE116790T1
ATE116790T1 AT92420375T AT92420375T ATE116790T1 AT E116790 T1 ATE116790 T1 AT E116790T1 AT 92420375 T AT92420375 T AT 92420375T AT 92420375 T AT92420375 T AT 92420375T AT E116790 T1 ATE116790 T1 AT E116790T1
Authority
AT
Austria
Prior art keywords
mount
thermal resistance
low thermal
electronic
support
Prior art date
Application number
AT92420375T
Other languages
English (en)
Inventor
Michel Lebailly
Jean-Claude Taverdet
Original Assignee
Transcal
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Transcal filed Critical Transcal
Application granted granted Critical
Publication of ATE116790T1 publication Critical patent/ATE116790T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20309—Evaporators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Thermistors And Varistors (AREA)
  • Laminated Bodies (AREA)
  • Credit Cards Or The Like (AREA)
AT92420375T 1991-10-24 1992-10-22 Elektronischer baugruppenträger mit niedrigem thermischem widerstand. ATE116790T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9113361A FR2683115A1 (fr) 1991-10-24 1991-10-24 Support de carte de composants electroniques a faible resistance thermique.

Publications (1)

Publication Number Publication Date
ATE116790T1 true ATE116790T1 (de) 1995-01-15

Family

ID=9418438

Family Applications (1)

Application Number Title Priority Date Filing Date
AT92420375T ATE116790T1 (de) 1991-10-24 1992-10-22 Elektronischer baugruppenträger mit niedrigem thermischem widerstand.

Country Status (6)

Country Link
EP (1) EP0541456B1 (de)
JP (1) JPH05218672A (de)
AT (1) ATE116790T1 (de)
DE (1) DE69201126T2 (de)
DK (1) DK0541456T3 (de)
FR (1) FR2683115A1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5560423A (en) * 1994-07-28 1996-10-01 Aavid Laboratories, Inc. Flexible heat pipe for integrated circuit cooling apparatus
EP0732743A3 (de) 1995-03-17 1998-05-13 Texas Instruments Incorporated Wärmesenken
US7069975B1 (en) 1999-09-16 2006-07-04 Raytheon Company Method and apparatus for cooling with a phase change material and heat pipes

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4847731A (en) * 1988-07-05 1989-07-11 The United States Of America As Represented By The Secretary Of The Navy Liquid cooled high density packaging for high speed circuits
DE3913161A1 (de) * 1989-04-21 1990-10-31 Schulz Harder Juergen Aus kupfer- und keramikschichten bestehendes mehrschichtiges substrat fuer leiterplatten elektrischer schaltungen

Also Published As

Publication number Publication date
JPH05218672A (ja) 1993-08-27
DE69201126D1 (de) 1995-02-16
EP0541456A1 (de) 1993-05-12
FR2683115A1 (fr) 1993-04-30
DE69201126T2 (de) 1995-05-24
EP0541456B1 (de) 1995-01-04
DK0541456T3 (da) 1995-03-13

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