ATE120433T1 - Polierbreie aus silika mit geringem gehalt an natrium und an metallen. - Google Patents
Polierbreie aus silika mit geringem gehalt an natrium und an metallen.Info
- Publication number
- ATE120433T1 ATE120433T1 AT91306014T AT91306014T ATE120433T1 AT E120433 T1 ATE120433 T1 AT E120433T1 AT 91306014 T AT91306014 T AT 91306014T AT 91306014 T AT91306014 T AT 91306014T AT E120433 T1 ATE120433 T1 AT E120433T1
- Authority
- AT
- Austria
- Prior art keywords
- sio2
- present
- ppm
- amount less
- range
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
- C01B33/146—After-treatment of sols
- C01B33/148—Concentration; Drying; Dehydration; Stabilisation; Purification
- C01B33/1485—Stabilisation, e.g. prevention of gelling; Purification
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
- C01B33/141—Preparation of hydrosols or aqueous dispersions
- C01B33/142—Preparation of hydrosols or aqueous dispersions by acidic treatment of silicates
- C01B33/143—Preparation of hydrosols or aqueous dispersions by acidic treatment of silicates of aqueous solutions of silicates
- C01B33/1435—Preparation of hydrosols or aqueous dispersions by acidic treatment of silicates of aqueous solutions of silicates using ion exchangers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Catalysts (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Silicon Compounds (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Agricultural Chemicals And Associated Chemicals (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US70632191A | 1991-05-28 | 1991-05-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE120433T1 true ATE120433T1 (de) | 1995-04-15 |
Family
ID=24837077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT91306014T ATE120433T1 (de) | 1991-05-28 | 1991-07-02 | Polierbreie aus silika mit geringem gehalt an natrium und an metallen. |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP0520109B1 (de) |
| KR (1) | KR0184010B1 (de) |
| AT (1) | ATE120433T1 (de) |
| DE (1) | DE69108546T2 (de) |
| FI (1) | FI914594A7 (de) |
| MY (1) | MY108609A (de) |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2738291B2 (ja) * | 1994-02-14 | 1998-04-08 | 日本電気株式会社 | 機械・化学研磨方法および研磨装置 |
| JP2894208B2 (ja) * | 1994-06-02 | 1999-05-24 | 信越半導体株式会社 | シリコンウェーハ研磨用研磨剤及び研磨方法 |
| SG54606A1 (en) * | 1996-12-05 | 1998-11-16 | Fujimi Inc | Polishing composition |
| KR19990023544A (ko) * | 1997-08-19 | 1999-03-25 | 마쯔모또 에이찌 | 무기 입자의 수성 분산체와 그의 제조 방법 |
| WO1999032570A1 (en) * | 1997-12-23 | 1999-07-01 | Akzo Nobel N.V. | A composition for chemical mechanical polishing |
| KR20000019872A (ko) * | 1998-09-16 | 2000-04-15 | 유현식 | 웨이퍼 절연층 연마용 슬러리의 제조방법 |
| JP2000160139A (ja) * | 1998-12-01 | 2000-06-13 | Fujimi Inc | 研磨用組成物およびそれを用いた研磨方法 |
| FR2789998B1 (fr) * | 1999-02-18 | 2005-10-07 | Clariant France Sa | Nouvelle composition de polissage mecano-chimique d'une couche en un materiau conducteur d'aluminium ou d'alliage d'aluminium |
| KR20010004982A (ko) * | 1999-06-30 | 2001-01-15 | 김영환 | 반도체 소자의 산화막 연마용 슬러리 제조 방법 |
| EP1242308B1 (de) * | 1999-12-20 | 2005-11-16 | Akzo Nobel N.V. | Sole auf der basis von kieselsäure |
| KR100396881B1 (ko) * | 2000-10-16 | 2003-09-02 | 삼성전자주식회사 | 웨이퍼 연마에 이용되는 슬러리 및 이를 이용한 화학기계적 연마 방법 |
| TWI228538B (en) * | 2000-10-23 | 2005-03-01 | Kao Corp | Polishing composition |
| DE10063488A1 (de) * | 2000-12-20 | 2002-06-27 | Bayer Ag | Polierslurry für das chemisch-mechanische Polieren von Siliciumdioxid-Filmen |
| KR100445499B1 (ko) * | 2001-07-23 | 2004-08-21 | 제일모직주식회사 | 반도체 디바이스의 산화막 연마용 cmp 슬러리 |
| KR100474539B1 (ko) * | 2002-07-15 | 2005-03-10 | 주식회사 하이닉스반도체 | 반도체 소자의 제조 방법 |
| DE10247202A1 (de) * | 2002-10-10 | 2003-10-30 | Wacker Siltronic Halbleitermat | Verfahren zur Herstellung einer polierten Siliciumscheibe mit niedrigem Kupfergehalt |
| US7192886B2 (en) * | 2002-10-25 | 2007-03-20 | Intersurface Dynamics, Inc. | Method for using additives in the caustic etching of silicon for obtaining improved surface characteristics |
| US7005382B2 (en) * | 2002-10-31 | 2006-02-28 | Jsr Corporation | Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing process, production process of semiconductor device and material for preparing an aqueous dispersion for chemical mechanical polishing |
| GB0328530D0 (en) * | 2003-12-09 | 2004-01-14 | Syngenta Ltd | Agrochemical composition |
| JP2005268667A (ja) * | 2004-03-19 | 2005-09-29 | Fujimi Inc | 研磨用組成物 |
| US8017524B2 (en) | 2008-05-23 | 2011-09-13 | Cabot Microelectronics Corporation | Stable, high rate silicon slurry |
| US8697576B2 (en) | 2009-09-16 | 2014-04-15 | Cabot Microelectronics Corporation | Composition and method for polishing polysilicon |
| US8815110B2 (en) * | 2009-09-16 | 2014-08-26 | Cabot Microelectronics Corporation | Composition and method for polishing bulk silicon |
| US8883034B2 (en) | 2009-09-16 | 2014-11-11 | Brian Reiss | Composition and method for polishing bulk silicon |
| MY195756A (en) | 2012-09-17 | 2023-02-09 | Grace W R & Co | Functionalized Particulate Support Material and Methods of Making and Using the Same |
| IN2015DN02055A (de) | 2012-09-17 | 2015-08-14 | Grace W R & Co | |
| EP3094390B1 (de) | 2014-01-16 | 2021-07-07 | W.R. Grace & CO. - CONN. | Affinitätschromatographiemedien und chromatographievorrichtungen |
| EP3137209B1 (de) | 2014-05-02 | 2022-10-05 | W.R. Grace & CO. - CONN. | Funktionalisiertes trägermaterial und verfahren zur herstellung und verwendung eines funktionalisierten trägermaterials |
| CN107109136A (zh) * | 2015-01-12 | 2017-08-29 | 弗萨姆材料美国有限责任公司 | 用于化学机械平面化组合物的复合磨料颗粒及其使用方法 |
| SG10201911134QA (en) | 2015-06-05 | 2020-01-30 | Grace W R & Co | Adsorbent bioprocessing clarification agents and methods of making and using the same |
| KR102864048B1 (ko) * | 2023-01-04 | 2025-09-23 | 에스케이엔펄스 주식회사 | 반도체 공정용 연마 조성물 및 연마 조성물을 적용한 기판의 연마방법 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3816330A (en) * | 1970-10-05 | 1974-06-11 | Du Pont | Method of protecting colloidal silica aquasols from bacterial degradation |
| US4462188A (en) * | 1982-06-21 | 1984-07-31 | Nalco Chemical Company | Silica sol compositions for polishing silicon wafers |
| JPS60127216A (ja) * | 1983-12-10 | 1985-07-06 | Nitto Chem Ind Co Ltd | 低アルカリ低アルミナ含量の水性シリカゾルの製造法 |
| US4588421A (en) * | 1984-10-15 | 1986-05-13 | Nalco Chemical Company | Aqueous silica compositions for polishing silicon wafers |
| JP2714411B2 (ja) * | 1988-12-12 | 1998-02-16 | イー・アイ・デュポン・ドゥ・ヌムール・アンド・カンパニー | ウェハーのファイン研摩用組成物 |
-
1991
- 1991-07-02 AT AT91306014T patent/ATE120433T1/de not_active IP Right Cessation
- 1991-07-02 DE DE69108546T patent/DE69108546T2/de not_active Expired - Fee Related
- 1991-07-02 EP EP91306014A patent/EP0520109B1/de not_active Expired - Lifetime
- 1991-09-09 MY MYPI91001625A patent/MY108609A/en unknown
- 1991-09-30 FI FI914594A patent/FI914594A7/fi not_active Application Discontinuation
- 1991-10-01 KR KR1019910017185A patent/KR0184010B1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| FI914594L (fi) | 1992-11-29 |
| MY108609A (en) | 1996-10-31 |
| KR920021685A (ko) | 1992-12-18 |
| EP0520109A1 (de) | 1992-12-30 |
| DE69108546T2 (de) | 1995-11-30 |
| EP0520109B1 (de) | 1995-03-29 |
| DE69108546D1 (de) | 1995-05-04 |
| FI914594A7 (fi) | 1992-11-29 |
| KR0184010B1 (ko) | 1999-04-01 |
| FI914594A0 (fi) | 1991-09-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |